KR200311802Y1 - Semiconductor package test socket - Google Patents

Abstract

The present invention relates to a semiconductor package test socket, comprising: a frame composed of an insulator fixed to a socket board and having a hardness; a conductor contactor installed to surround the frame at a position corresponding to a lead of the semiconductor package; And a silicon bar interposed between the frame and the contactor and installed at a portion subjected to a force when the semiconductor package is mounted. According to the present invention, it is possible to provide a semiconductor package test socket which can reduce the cost and maintain the socket strength to some extent by using only the minimum amount of silicon rubber required.

Description

Semiconductor package test socket {Semiconductor package test socket}

The present invention relates to a semiconductor package test socket. More specifically, the present invention relates to a semiconductor package test socket which can reduce the cost and maintain the socket strength to some extent by using only the minimum amount of silicon required.

The semiconductor package test socket is a connecting device that connects a completed semiconductor package completed to the packaging process and connects it to the test equipment. The semiconductor package test socket transfers electrical signals from the test equipment to the semiconductor package and transfers the return signal of the semiconductor package to the test equipment. It is a device for passing back and testing whether the semiconductor package performs normal operation.

In light of the recent trend of miniaturized and multi-pinned semiconductor package leads, testing of semiconductor package leads and test socket socket pins ensures reliable contact, miniaturization of test sockets, and high-frequency semiconductor packages. Important considerations when manufacturing the socket. It is also important to ensure that the socket pins of the test sockets are strong enough to withstand the testing of the semiconductor packages from tens of thousands to hundreds of thousands of times.

FIG. 1 shows an example of a conventional TSOP or QPN type semiconductor package test socket, wherein the lead 3 of the semiconductor package 1 and the conductive socket pin 8 of the test socket 7 are in contact with each other. The socket pin 8 is supported and protected by a housing 5 made of epoxy resin or the like, the lower part of which extends to the PCB substrate 9.

In the test socket 7 according to the related art, in order to increase the contact force between the lead 3 and the socket pin 8, the socket pin 8 is curved or spiraled as shown in FIG. However, the curved or helical shape of the socket pin 8 is not only difficult to apply to semiconductors with a narrow lead spacing due to the increase in the volume of the test socket 7, but also to increase the length of the socket pin 8. There is a disadvantage in the test of the semiconductor package for.

In order to solve such a problem in the conventional test socket, the present applicant has developed a utility model registration (Registration No .: 0265544, 0281252) by developing a "semiconductor package test socket using a silicon rubber". Figure 2a and Figure 2b is a view for explaining the applicant's registration utility model. Briefly described as follows.

The semiconductor package test socket using a silicon rubber, which is a registered utility model, is a socket for semiconductor package test installed on a socket board to make electrical contact with a lead of a semiconductor package, and includes a support frame 30 fixed to the socket board 40. And a silicon rubber 20 supported by the support frame 30 and a conductive portion 23 formed at a portion corresponding to the lead of the semiconductor package on the silicon rubber 20. Silicone rubber (Silicone rubber, 20) is a polymer material mainly composed of silicon and is a kind of silicone resin and has elasticity like rubber. The conductive portion 23 is formed on the surface of the silicon rubber 20. The conductive portion 23 is formed at a position corresponding to the lead 13 of the semiconductor package 10 and is electrically connected to the conductive layer 43 formed on the socket board 40. The socket board 40 is connected to test equipment (not shown) to test the semiconductor package 10 while transmitting and receiving electrical signals.

According to the above-mentioned registered utility model, the test socket can be miniaturized by utilizing the elastic force of the silicon rubber to cope with the trend of narrowing the lead spacing, and it can be used to test high frequency semiconductor packages. There are also disadvantages in that the production cost increases due to the high quantity, and the softness of the silicon rubber causes the socket to be deformed and thus does not properly support the semiconductor package under test.

The present invention was devised to solve the problems in the semiconductor package test socket, which is the applicant's registered utility model as described above, to reduce the cost by using only the minimum amount of silicon and the strength of the socket. The aim is to provide a semiconductor package test socket that can be maintained for more than that.

Another object of the present invention is to provide a semiconductor package test socket capable of maintaining low contact resistance despite repeated tests of tens of thousands of times by forming irregularities on the ends of the socket contactor and plating the gold thereon.

1 is a cross-sectional view of a semiconductor test socket according to the prior art.

Figure 2a is a cross-sectional view of a semiconductor test socket of the applicant's registered utility model

Figure 2b is a plan view of a semiconductor test socket of the applicant's registered utility model

Figure 3 is a cross-sectional view of one embodiment of a semiconductor test socket according to the present invention

4A to 4C show another embodiment of a semiconductor test socket according to the present invention.

5 is another embodiment of a semiconductor test socket according to the present invention

6A and 6B are detailed views of the contactor end of one embodiment according to the present invention.

<Description of Major Reference Drawings>

1, 10, 59, 69 semiconductor packages, 3, 13, 58, 68 leads, 5 housings, 7, 60 test sockets, 8 socket pins, 9 PCB substrates, 20, 71 silicon rubber, 23 conductive parts, 30 support frames, 33 screws, 40, 67, 73 socket board, 43 conductive layer, 51, 61 frame, 53, 63 contactor, 54, 64 silicon bar, 65 support

Overview of the devise

The semiconductor package test socket according to the present invention is a socket for a semiconductor package test installed on a socket board and making electrical contact with a lead of the semiconductor package.

A frame fixed to the socket board and composed of an insulator having hardness,

A conductor contactor installed to surround the frame at a position corresponding to a lead of the semiconductor package,

And a silicon bar interposed between the frame and the contactor and installed at a portion of the semiconductor package when the semiconductor package is mounted.

The silicon bar is preferably installed on the side and bottom of the frame, it may further include a silicon rubber between the frame and the socket board. It is preferable that the support is fixed to the side of the frame to support the contactor. In addition, elasticity may be imparted to the contactor by separating the contactor from the upper surface of the frame by a predetermined distance.

Example

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the test socket and its operation according to the present invention. 3 is a cross-sectional view of one embodiment of a test socket according to the present invention.

In this embodiment, a frame 51 made of an insulator having a hardness of a certain degree or more is fixed to a socket board 57, and silicon bars 54 are installed on the upper and lower portions of the frame 51, and around the frame 51. The conductor contactor 53 is brought into close contact with each other. In this embodiment, the contactor 53 serves as a socket pin of a conventional test socket, and is formed by adhering a Be-Cu plate in a band shape.

The present embodiment differs from the applicant's registration utility model shown in Figs. 2A and 2B in that the entirety of the silicon rubber (part 20 in Fig. 2A) serving as the frame 51 of this embodiment is used in the registration utility model. In this embodiment, however, the frame 51 is a hard insulator, and silicon bars 54 are provided only on a portion of the upper and lower surfaces of the frame 51. The silicon bar can also be installed on the side of the frame 51. The frame 51 is preferably made of an insulator having a hardness of about a certain degree, such as hard plastics. In this way, by providing an elastic silicon bar in the portion subjected to the force during the test of the semiconductor package while maintaining the strength of the socket to some extent, the life of the socket can be extended, and the silicon can be saved.

4A is a cross-sectional view of another embodiment of the present invention, and FIGS. 4B and 4C are modifications thereof. The frame 61, which is an insulator, is fixed on the socket board 67, and a contactor 63, which is a conductor, is installed around the frame 61 as if the frame 61 is wrapped. The support part 65 is installed on the side of the contactor 31 to fix the contactor 63. The contactor 63 is installed at a position corresponding to the lead 68 of the semiconductor package 69. A silicon bar 64 is interposed between the frame 61 and the contactor 63. In this embodiment, the silicon bar 64 is positioned on the side and the bottom surface of the frame 61. The position and the number of silicon bars 64 are not limited to that of this embodiment. Since the role of the silicon bar 64 may correspond to the test of the semiconductor package repeated tens of thousands or more times by its elastic force, and thus to extend the life of the test socket, the position of the silicon bar 64 is determined by the semiconductor package 69. It will be a lot of energy when it is mounted.

In this embodiment, the upper portion of the contactor 63 is spaced apart from the frame 61 by a predetermined distance, but a configuration in which a silicon bar is installed on the upper portion of the frame 61 and the contactor 63 is fixed to the silicon bar may be considered.

The support part 65 and the frame 61 should have a certain degree or more of strength because they must be loaded when the contactor 63 and the silicon bar 64 are fixed and the semiconductor package 69 is mounted. Hard plastics are preferred because they must be insulators.

4B and 4C are modifications of the present embodiment, and various modifications may be made without departing from the technical spirit of the present invention.

Referring to the operation of the embodiment of the semiconductor package test socket according to the present invention. The semiconductor package 69 is placed on the contactor 63 of the test socket 60, and predetermined pressure means (not shown) pressurizes the semiconductor package 69 to lead 68 of the semiconductor package 69. And the contactor 63 of the test socket are brought into close contact with each other and are electrically connected to each other. Since the silicon bar 64 has elasticity, it can cope with a test of a semiconductor package repeated tens of thousands or more times, thereby extending the life of a test socket, and compared to the applicant's registered utility model shown in FIGS. 2A and 2B. By placing the silicon bar only where it is needed, it not only saves silicon, but also maintains some strength of the test socket. The contactor 63 is connected to the conductive layer of the socket board 67 to exchange electrical signals with the test equipment (not shown).

5 is a cross-sectional view of another embodiment of a test socket according to the present invention.

In this embodiment, almost all the elements are the same as the above-described embodiment. However, the installation of the silicone rubber 71 on the socket board 73 is different. By installing the silicon rubber 71 between the frame 75 and the socket board 73, the life of the socket board 73 can be prevented from being damaged due to repeated tests.

6A and 6B are detailed views of the ends of the contactors 53 and 63 of the semiconductor package test socket according to the present invention. The ends of the contactors 53 and 63 are in direct contact with the leads of the semiconductor package under test, and are generally plated with gold to reduce their contact resistance. However, if the test is repeated more than tens of thousands of times, the frequent contact causes wear of the gold plating, which increases the contact resistance and consequently decreases the test efficiency. In this embodiment, in order to minimize the increase in contact resistance due to the wear of the gold plating, the concave-convex is formed on the surface of the contactors 53 and 63 in contact with the leads of the semiconductor package, and gold plating is applied thereon. The shape of the unevenness may be considered in various ways. 6A and 6B show examples thereof, in which (a) is a side view and (b) is a plan view. The shape of the unevenness is not limited thereto. In the contactor, irregularities are formed on the contact surface with the semiconductor package lead and gold plated thereon, so that the gold plated in the grooves of the unevenness continues to remain even though the gold plating of the contact occurs due to frequent contact, thereby maintaining a low contact resistance. Will be.

Embodiments of the semiconductor package test socket according to the present invention have been described above, but the technical scope of the present invention is not limited thereto. The present invention may be variously modified under the same technical concept, and the technical scope should be determined by the matters described in the utility model registration claims.

According to the semiconductor package test socket according to the present invention has the following effects.

First, manufacturing is simpler than conventional test sockets, and thus the price can be lowered.

Second, since the socket can be miniaturized, the lead gap of the semiconductor package can be narrowed.

Third, the silicon rubber consumption can be reduced, and the overall strength of the test socket can be maintained above a certain level.

Fourth, it is possible to provide a semiconductor package test socket capable of maintaining a low contact resistance despite the test repeated over tens of thousands of times by forming irregularities on the ends of the socket contactor and plating the gold thereon.

Claims (8)

A semiconductor package test socket installed on a socket board and in electrical contact with a lead of a semiconductor package. A frame fixed to the socket board and composed of an insulator having hardness, A conductor contactor installed to surround the frame at a position corresponding to a lead of the semiconductor package, And a silicon bar interposed between the frame and the contactor and installed at a portion under load when the semiconductor package is mounted. The method of claim 1, And a support fixed to the side of the frame to support the contactor. The method of claim 2, The silicon bar is a semiconductor package test socket, characterized in that installed on the side and bottom of the frame. The method according to any one of claims 1 to 3, And the contactor is spaced apart from the upper surface of the frame by a predetermined interval. The method according to any one of claims 1 to 3, And a silicon rubber between the frame and the socket board. The method of claim 4, wherein And a silicon rubber between the frame and the socket board. The method according to any one of claims 1 to 3, A semiconductor package test socket, wherein irregularities are formed in a portion of the contactor in contact with a lead of the semiconductor package and gold-plated thereon. The method of claim 4, wherein A semiconductor package test socket, wherein irregularities are formed in a portion of the contactor in contact with a lead of the semiconductor package and gold-plated thereon.