KR20160086509A - Method for manufacturing elastic contactor - Google Patents

Abstract

A method for manufacturing an elastic contactor according to an embodiment of the present invention comprises: (i) forming a first metal layer on a bottom surface of a container for manufacture, (ii) aligning a plurality of contactors to be spaced apart by a predetermined distance in the vertical direction on the first metal layer, (iii) bonding the contact portion of the first metal layer and the contactors, (iv) covering with a cap which covers the container for manufacture, (v) forming a hole on one side of the cap, (vi) injecting an insulating elastic material into the container for manufacture through the hole, (vii) hardening the injected insulating elastic material, (viii) removing the container for manufacture and the cap and (ix) coupling a tip to the exposed top of the contactor.

Description

[0001] METHOD FOR MANUFACTURING ELASTIC CONTACTOR [0002]

The present invention relates to a contactor manufacturing method, and more particularly, to a contactor manufacturing method capable of reducing wear of an inspection apparatus pad during semiconductor device testing and capable of stroke adjustment to compensate for deviation of a semiconductor device contact ball.

Generally manufactured electronic components are subjected to various tests to confirm the reliability of the products after they are manufactured. The test connects all the input and output terminals of the electronic parts with the test signal generating circuit to check the normal operation and disconnection and connect the input and output terminals of the electronic parts such as the power input terminal to the test signal generating circuit. There is a burn-in test in which stress is applied by high temperature, voltage and current to check the lifetime of electronic parts and whether a defect is generated.

Such a test is conducted in an electrically contacted state by mounting an electronic component on a conductive contactor. The conductive contactor is basically determined in accordance with the shape of the electronic component, and serves as an intermediary for connecting the electrodes to be inspected of the electronic component and the electrodes of the test apparatus by mechanical contact.

Particularly, in the case of a ball grid array (BGA) package using a solder ball as an electrode to be inspected among electronic components, a pad (PCB PAD) of a printed circuit board for inspection installed in an inspection apparatus and a contact A socket is used to electrically connect the ball. Conventionally, a rubber type socket made of a POGO type socket and a rubber material was used as the socket.

In the case of the pogo type, the force received by the contactor from the semiconductor device must be applied perpendicularly to the inspection device pad. As the pogo pin is used, the force applied to the pogo is increased There is a problem in that it causes abrasion on the inspection device pad (PCB PAD).

In addition, although pogo pins are required to be finer in accordance with the thinning and shortening of electronic parts, there are difficulties in inspecting semiconductor packages in which high-density fine pitch electrodes are arranged due to technical limitations and price competitiveness of processing pogo pins.

In the case of the rubber type, repetitive contact to the contact ball damages the rubber appearance and loses its restoring force, which makes it difficult to maintain a constant contact with the contact ball. In addition, there is a risk of falling off of the Au powder in the case of the rubber type, and it is difficult to make the entire contact in the inspection when the stroke of the semiconductor package contact balls is varied due to the small amount of strokes. In addition, in the case of the rubber type, it is difficult to deform the end of the contactor, so that there is a limit in realizing structurally efficient electrical contact.

Disclosure of Invention Technical Problem [8] Accordingly, the present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a method and apparatus for a high density fine pitch, a disadvantage of a pogo type socket, It is an object of the present invention to provide a contactor for semiconductor inspection which can compensate for the vulnerability, has uniformly and precisely arranged pins, and can realize a reliable stroke amount of the conventional rubber type, thereby performing reliable semiconductor package inspection.

According to another aspect of the present invention, there is provided a method for manufacturing a contactor for a semiconductor test socket, the method comprising the steps of: (i) forming a first metal layer on a bottom surface of a manufacturing container; (Iii) bonding a contact portion of the first metal layer and the contactor to each other, (iv) bonding the contact portion of the contactor to the first metal layer, (Vi) forming a hole at one side of the cap, (vi) injecting an insulating elastic material into the preparation container through the hole, (iii) inserting the injected insulating elastic material (Iii) removing the manufacturing container and the cap, and (iii) bonding the tip to the exposed top of the contactor.

According to the contactor manufacturing method of the present invention, since the contactor is formed in a structure in which the upper end portion and the lower end portion protrude from the vertical line and are symmetrical to each other, the contactor is made elastic so that the force generated in the vertical direction is transmitted only in the Z- , Wear of the testing device pad can be reduced, and contactor pins can have a uniform pin force, so that a uniform contact can be made in the semiconductor device contact ball. Further, by controlling the thickness and the hardness of the silicon constituting the insulating portion, it is possible to adjust the stroke, so that the height deviation of the semiconductor device contact ball can be compensated. In addition, the contactor and the insulating portion are integrally formed with elasticity so that the force generated by the contact acts on the contactor and the insulating portion at the same time, so that the life time of the conventional rubber type test socket can be improved.

1 is a flow chart for explaining a manufacturing process of a contactor for a test socket according to the present invention;
2 to 7 are cross-sectional views showing a manufacturing process of a contactor for a test socket according to the present invention.
8 is a sectional view showing the structure of a contactor according to the present invention.

For a better understanding of the present invention, a preferred embodiment of the present invention will be described with reference to the accompanying drawings. The embodiments of the present invention may be modified into various forms, and the scope of the present invention should not be construed as being limited to the embodiments described in detail below. The present embodiments are provided to enable those skilled in the art to more fully understand the present invention. Therefore, the shapes and the like of the elements in the drawings can be exaggeratedly expressed to emphasize a clearer description. It should be noted that in the drawings, the same members are denoted by the same reference numerals. Further, detailed descriptions of well-known functions and configurations that may be unnecessarily obscured by the gist of the present invention are omitted.

Hereinafter, a method of manufacturing the contactor of the present invention will be described in detail with reference to the preferred embodiments of the present invention with reference to the accompanying drawings.

1 is a flow chart for explaining a manufacturing process of a contactor for a test socket according to the present invention.

Referring to FIG. 1, a method of manufacturing a contactor for a semiconductor device test socket according to the present invention includes a first step of forming a first metal layer on a bottom surface of a manufacturing container, a second step of forming a plurality of contactors on the first metal layer, A third step of bonding the contact portion of the first metal layer and the contactor to each other, a fourth step of covering the cap covering the manufacturing container, A sixth step of injecting an insulating elastic material into the manufacturing container through the hole, a seventh step of curing the injected insulating elastic material, a fifth step of removing the manufacturing container and the cap, An eighth step and a ninth step of bonding the tip to the exposed upper portion of the contactor.

2 to 7 are sectional views illustrating a process of manufacturing a contactor for a semiconductor device test socket according to the present invention, and FIG. 8 is a cross-sectional view illustrating the structure of a contactor according to the present invention.

As shown in Fig. 2, first, a manufacturing container 10 in which a trench is formed is provided. The manufacturing container 10 is provided in a form divided into several zones for manufacturing a plurality of contactor sets. For example, in FIG. 2, the manufacturing container 10 is made of a first set 11, a second set 12, and a third set 13, and the first through third set parts 11, 12 and 13 may be separated by a partition 15 formed from the bottom surface of the manufacturing container 10. The height of the partition 15 is formed to be lower than the height of the wall 14 around the outer periphery of the manufacturing container 10 by a predetermined length. That is, the partition 15 has a gap 16 of a predetermined length as compared with the wall 14 around the outer periphery. It is apparent that the number of separate sets of the manufacturing container 10 and the number of the contactors mounted thereon can be set according to the manufacturer's intention.

The first metal layer 100 is formed on the bottom surface of the manufacturing container 10 by sputtering, deposition, or the like. Here, the first metal layer 100 may be formed of copper (Cu), silver (Ag), nickel (Ni), titanium (Ti), chromium (Cr)

3, a plurality of contactors 200 are arranged in the respective set portions 11, 12, 13 at a predetermined interval above the first metal layer 100, To be mounted on a vertical line. For example, the lower portion of the contactor 200 contacting the first metal layer 100 can be bonded by laser irradiation. The alignment of the contactor 200 is set to correspond to the position at which the contactor 200 is in contact with the electrode (not shown) of the test apparatus when the semiconductor test socket is subsequently driven.

8, the contactor 200 is formed so that the upper end 230 and the lower end 240 of the contactor 200 protrude from a vertical line respectively and the upper end 230 and the lower end 240 contact each other And are formed symmetrically with respect to each other on the X, Y, and Z axes as center points. The protruding structure of the upper portion 230 and the lower portion 240 may be formed in a polygonal or curved structure, for example, a semicircular structure, a triangular structure, a rectangular structure, a semi-hexagonal structure, a semi-octagonal structure, or the like. The contactor 200 is made of an alloy of at least one of nickel, iron, cobalt, beryllium, gold, silver, palladium and rhodium and is manufactured by a MEMS process.

 Next, as shown in Fig. 4, a cap Cap 20 is formed to cover the upper surface of the manufacturing container 10. As shown in Fig. The cap 20 has a structure in which a corresponding trench is formed on the upper portion of the contactor 200 so that the upper portion of the contactor 200 can be inserted. A hole 24 is formed at one side of the cap 20 so that the insulative elastic material can be injected into the manufacturing container 10.

As shown in FIG. 5, the insulating elastic material is injected through the holes 24, and the injected insulating elastic material fills the inside of the manufacturing container 10. When the insulating elastic material is injected through the hole 24, the insulating elastic material is filled into the third set portion 13 by the height of the partition 15, The portion 12 and the first set portion 11 are sequentially filled and then filled up to the height of the outer peripheral wall 14 of the manufacturing container 10. [

Here, for example, liquid silicone or the like is used as the insulating elastic material.

Thereafter, heat is applied to the manufacturing container 10 through a baking device or the like to cure the insulating elastic material injected into the manufacturing container 10. [

Next, as shown in FIG. 6, when the insulating elastic material in the manufacturing container 10 is cured, the cap 20 including the manufacturing container 10 is removed. At this time, the bonding portion of the lower portion of the contactor 200 and the first metal layer 100 may be dropped through an etching process using a chemical component capable of melting the first metal layer 100.

Accordingly, the contactor 200 and the contactor 200 are integrally formed with the insulation part 300. As described above, the insulating part 300 formed of the liquid silicone hardened integrally with the contactor 200 can realize the double elastic function together with the contactor 200 having elasticity. Therefore, the force generated by the physical contact at the time of the semiconductor test will be simultaneously absorbed by the contactor 200 and the insulating portion 300, thereby preventing breakage of the component and improving the durability of the socket compared to the conventional rubber type .

In addition, the amount of test strokes can be secured by adjusting the hardness or the thickness of the liquid silicon constituting the insulating portion 300, and the force (PIN Force) of the contactor 200 can be adjusted. Thereby providing a stroke amount for compensating for the height deviation of the semiconductor device contact ball.

Meanwhile, a step of polishing the exposed upper and lower portions of the contactor 200 shown in FIG. 6 through a chemical mechanical polishing (CMP) process may be added.

Next, as shown in FIG. 7, a crown tip 220 is mounted on the exposed top of the contactor 200. The crown tip 220 may be provided in a crown shape having a plurality of concavo-convex structures to increase the contact force between the semiconductor device contact ball (not shown) and the contactor 200. The crown tip 220 is fabricated by a MEMS process and may be made from an alloy of at least one of nickel, iron, cobalt, beryllium, gold, silver, palladium, and rhodium.

The force to be applied to the contactor 200 of the present invention during the semiconductor test is the same as the force applied to the contactor 200 due to the structure having elasticity of the contactor 200 and the dual structure of the contactor 200 by the insulating portion 300 integrally formed by using elastic material. By being absorbed by the elastic function, wear of the test socket can be reduced and lifetime can be improved.

In addition, the contactor 200 of the present invention can test not only one-to-one contacts in the vertical direction with the semiconductor device contact ball but also semiconductor devices having different positions of the upper and lower contact surfaces. Since the contactors 200 are integrally formed, the contact noise can be minimized even under repeated contact and high frequency test conditions, and the characteristics of the product can be maintained.

The contactor for a test socket according to the present invention reduces the loop inductance of the conventional rubber type to reduce the current path so that it can be used not only for existing semiconductor devices but also for high speed devices do.

As described above, the socket for testing a semiconductor device having the contactor of the present invention has a resilient structure in which the contactor itself is formed, and the force generated in the vertical direction is transmitted in the Z-axis direction, And the contactor pins have a uniform pin force, so that a uniform contact can be made in the semiconductor device contact ball.

In addition, when the insulating portion is formed, the stroke can be adjusted by controlling the thickness and hardness of the silicon, so that the height deviation of the semiconductor device contact ball can be compensated.

In addition, the contactor and the insulating portion are integrally formed with elasticity so that the force generated by the contact acts on the contactor and the insulating portion at the same time, so that the life time of the conventional rubber type test socket can be improved.

And the contactor and the crown tip can be manufactured through the MEMS process, thereby making it easy to manufacture a socket having a high density fine pitch.

It will be apparent to those skilled in the art that various modifications and variations may be made in the present invention without departing from the spirit or scope of the invention. . Therefore, it is to be understood that the present invention is not limited to the above-described embodiments. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims. It is also to be understood that the invention includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

10: Manufacturing container 11, 12, 13: First to third set parts
14: outer peripheral wall 15: partition
20: cap 24: hole
100: first metal layer 200: contactor
220: Crown tip 230: Contactor top
240: contactor lower end portion 300: insulating portion

Claims (10)

A method of manufacturing a contactor of a semiconductor test socket,
(I) forming a first metal layer on a bottom surface of the manufacturing container;
(Ii) aligning a plurality of contactors on the first metal layer in a vertical direction with a predetermined spacing therebetween;
(Iii) bonding the contact portion of the first metal layer and the contactor;
(Iv) covering the cap for covering the manufacturing container;
(V) forming a hole on one side of the cap;
(Vi) injecting an insulating elastic material into the manufacturing container through the hole;
(Iii) curing the injected insulative elastic material;
(Iii) removing the manufacturing container and the cap; And
(E) bonding the tip to the exposed top of the contactor. ≪ Desc / Clms Page number 14 > The method according to claim 1,
Wherein the manufacturing container is divided into a plurality of sets by a partition having a gap lower than the height of the outer peripheral wall. The method according to claim 1,
Further comprising the step of polishing the exposed upper and lower portions of the contactor through a chemical mechanical polishing (CMP) process after removing the manufacturing container and the cap. The method according to claim 1,
The contactor is formed of an upper end portion protruding from one side of a vertical line and a lower end portion protruding to the other side symmetrically with respect to the upper end portion. The upper end portion and the lower end portion are formed symmetrically with each other on X, Y, Wherein the semiconductor test socket is formed of a semiconductor material. 5. The method of claim 4,
Wherein the upper and lower ends of the contactor are formed in a curved or polygonal structure. The method according to claim 1,
Wherein the tip for coupling to the upper portion of the contactor is a crown tip formed in the form of a plurality of projections with a top portion of the contactor contacting the semiconductor device contact ball. The method according to claim 1,
Characterized in that liquid silicone is used as the insulating elastic material and is hardened to the aligned contactor so as to be integrated with the contactor. 8. The method of claim 7,
Wherein adjusting the test stroke through adjustment of the hardness or thickness of the liquid silicone compensates for height deviations of the semiconductor device contact ball. 8. The method of claim 7,
And adjusting the contact force of the contactor by controlling the hardness of the liquid silicon. The method according to claim 1,
Wherein the contactor and the tip are manufactured by a MEMS process and are made of an alloy of at least one of nickel, iron, cobalt, beryllium, gold, silver, palladium, and rhodium.

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