WO2005083453A1

WO2005083453A1 - Circuit substrate inspection device and circuit substrate inspection method

Info

Publication number: WO2005083453A1
Application number: PCT/JP2005/003448
Authority: WO
Inventors: Kiyoshi Kimura; Sugiro Shimoda; Satoshi Suzuki
Original assignee: Jsr Corporation
Priority date: 2004-03-02
Filing date: 2005-03-02
Publication date: 2005-09-09
Also published as: KR20070007124A; TW200530602A; CN1926437B; CN1926437A

Abstract

There is provided a circuit substrate inspection device capable of performing electrical inspection of a circuit substrate with a high reliability even when the circuit substrate to be inspected has small electrodes of a small pitch. The circuit substrate inspection device includes a first inspection jig and a second inspection jig, between which a circuit substrate to be inspected is arranged with a sandwiching pressure for performing electric inspection. As a first anisotropic conductive sheet arranged at the side of the circuit substrate to be inspected for a pitch conversion substrate, there is used an anisotropic conductive sheet having conductive particles arranged in the thickness direction and uniformly dispersed in the surface direction. Moreover, a connection electrode of the pitch conversion substrate is formed by a current terminal electrode and a voltage terminal electrode which are electrically connected to respective inspection electrodes of the circuit substrate to be inspected. On the connector substrate, there are arranged a current pin side electrode and a voltage pin side electrode to be electrically connected respectively to the current terminal electrode and the voltage terminal electrode of the pitch conversion substrate. Moreover, an intermediate holding plate is arranged between a first insulation plate and a second insulation plate in a relay pin unit and between them, support pints are arranged at abutment support positions different from the front and the rear surfaces.

Description

Specification

Circuit board inspection apparatus and circuit board inspection method

Technical field

[0001] The present invention provides a circuit board to be subjected to an electrical inspection (hereinafter referred to as a "circuit board to be inspected") which is pressed by an upper inspection jig and a lower inspection jig from both sides. The present invention relates to a circuit board inspection apparatus and a circuit board inspection method for inspecting electrical characteristics of a circuit board to be inspected while electrodes formed on both surfaces of the circuit board to be inspected are electrically connected to a tester.

Background art

[0002] A printed circuit board on which an integrated circuit or the like is mounted is inspected for electrical characteristics before mounting the integrated circuit or the like in order to confirm that a wiring pattern of the circuit board has predetermined performance.

In this electrical inspection, for example, an inspection head is incorporated into an inspection tester provided with a circuit board transport mechanism, and different circuit boards are inspected by replacing the inspection head part.

[0003] For example, as disclosed in Patent Document 1 (Japanese Patent Application Laid-Open No. 6-94768), a metal inspection pin that is in electrical contact with an electrode to be inspected on a circuit substrate to be inspected is planted on the substrate. A method using an inspection jig with the installed structure has been proposed! RU

Further, as disclosed in Patent Document 2 (JP-A-5-159821), an inspection head having conductive pins, a circuit board for pitch conversion called off-grid adapter, and an anisotropic conductive sheet are used. A method using a combined inspection jig is known.

[0004] Meanwhile, in the method using an inspection jig for directly contacting a metal inspection pin with an electrode to be inspected on a circuit board to be inspected as disclosed in Patent Document 1, a method for contacting a conductive pin which is a metal force is used. The electrodes of the circuit board to be inspected may be more damaged.

In particular, in recent years, circuits on circuit boards have become finer and higher in density, and when such printed circuit boards are inspected, it is necessary to simultaneously conduct a large number of conductive pins to the electrodes to be inspected on the circuit boards to be inspected. Needs to press the inspection jig with high pressure, The electrode to be inspected is easily damaged.

With such inspection jigs for inspecting printed circuit boards that have been miniaturized and densified, it is becoming technically difficult to implant a large number of metal pins at high density on the substrate. . In addition, the manufacturing cost is high, and when some metal pins are damaged, it is difficult to repair or replace them.

On the other hand, in an inspection jig using an anisotropic conductive sheet as disclosed in Patent Document 2, an electrode to be inspected on a circuit board to be inspected is an electrode of a pitch conversion substrate via an anisotropic conductive sheet. Therefore, there is an advantage that the electrode to be inspected on the circuit board to be inspected is hardly damaged. In addition, since a board that performs pitch conversion is used, the inspection pins to be implanted on the board can be implanted at a pitch wider than the pitch of the electrodes to be inspected on the circuit board to be inspected. It is possible to reduce the cost of manufacturing inspection jigs without the need to plant inspection pins at the pitch.

However, in this inspection jig, it is necessary to prepare a pitch conversion board and an inspection jig for implanting inspection pins for each circuit board to be inspected. The same number of inspection jigs as the printed circuit board which is the inspection circuit board is required.

[0006] Therefore, when a plurality of printed circuit boards are produced, there is a problem that a plurality of inspection jigs must be held correspondingly. In particular, in recent years, the product cycle of electronic equipment has been shortened, and the production period of printed circuit boards used for products has been shortened.However, this has made it impossible to use inspection jigs for a long time, A problem has arisen that inspection jigs must be produced each time the production of printed circuit boards is switched.

[0007] As a countermeasure against such a problem, for example, relaying such as disclosed in Patent Document 3-5 (Japanese Patent Application Laid-Open No. 7-248350, Japanese Patent Application Laid-Open No. 8-271569, Japanese Patent Application Laid-Open No. 8-338858) is used. There has been proposed an inspection apparatus using a V-shaped, so-called universal type inspection jig using a pin cut.

FIG. 31 is a cross-sectional view of an inspection apparatus using such a universal type inspection jig.

This inspection apparatus has an upper inspection jig 11 la and a lower inspection jig 11 lb. 查 The jig includes circuit board side connectors 121a and 121b, relay pin units 131a and 131b, and tester side connectors 141a and 141b.

The circuit board side connectors 121a and 121b include pitch conversion boards 123a and 123b, and anisotropic conductive sheets 122a, 122b, 126a and 126b disposed on both sides thereof.

[0009] The relay pin units 131a and 131b are composed of conductive pins 132a and 132b arranged at a fixed pitch (for example, 2.54 mm pitch) on a lattice point (for example, 5000 pins), and the conductive pins 132a and 132b are vertically moved. It comprises a pair of insulating plates 134a, 134b and 135a, 135b movably supported.

[0010] The tester-side connectors 141a and 141b include connector boards 143a and 143a for electrically connecting the tester and the conductive pins 132a and 132b when the circuit board 101 to be inspected is clamped by the inspection jigs 11la and 111b. 143b, anisotropic conductive sheets 142a and 142b placed on conductive pins 132a and 132bftlJ of connector boards 143a and 143b, and base plates 146a and 146b.

In the inspection jig using this relay pin unit, when inspecting a printed circuit board to be inspected differently, the circuit board side connectors 121a and 121b are replaced with ones corresponding to the circuit board 101 to be inspected. The relay pin units 13 la, 13 lb and the tester-side connectors 141a, 141b can be used in common.

[0012] In the conventional universal type inspection jig, a plurality of conductive paths extending in the thickness direction are formed as anisotropic conductive sheets 122a and 122b constituting the circuit board side connectors 121a and 121b. Part and an insulating part that insulates these conductive path forming parts from each other. The conductive particles are contained only in the conductive path forming part and are unevenly dispersed in the surface direction. The unevenly distributed anisotropic conductive sheets 122a and 122b having protruding portions are used.

[0013] The unevenly distributed anisotropic conductive sheets 122a and 122b cause problems such as rapid deterioration of the conductive path forming portion due to repeated use in the inspection, and an increase in the resistance value when the conductive path forming portion is deteriorated. . When replacing the deteriorated anisotropic conductive sheets 122a and 122b, each time the replacement is performed, the alignment between the anisotropic conductive sheets 122a and 122b and the pitch conversion boards 123a and 123b, and the circuit board side connectors 121a and 122b are performed. Alignment between 121b and relay pin units 131a and 131b is required, and replacement work is complicated, replacement frequency is high, and inspection efficiency is reduced. When the electrode to be inspected of the circuit substrate 101 to be inspected has a minute pitch of, for example, 200 μm or less, the unevenly distributed anisotropic conductive sheets 122a and 122b as described above are used. This makes it difficult to align the anisotropic conductive sheets 122a and 122b with the pitch conversion boards 123a and 123b, and furthermore, when a plurality of circuit boards 101 to be inspected are continuously inspected, Repeated contact with 101 makes it easy for the anisotropic conductive sheets 122a and 122b to be misaligned.

[0015] As a result, the conductive path forming portions of the anisotropic conductive sheets 122a and 122b do not match the electrode positions of the circuit board 101 to be inspected, and good electrical connection cannot be obtained. The resistance value is measured, and the printed circuit board, which should be judged to be good, is likely to be erroneously judged to be defective.

[0016] On the other hand, for example, when a connector in which an anisotropic conductive sheet and a pitch conversion substrate are used as described in Patent Document 6 (Japanese Patent Application Laid-Open No. 6-82531) is used. Is easy to align, but when the anisotropic conductive sheet part deteriorates, the entire pitch conversion board must be replaced, which requires a large number of pitch conversion boards and increases the inspection cost.

On the other hand, the printed wiring board, which is the circuit board 101 to be inspected, has been multi-layered and has a high density. Actually, the electrodes to be inspected 102, 103 such as a solder ball electrode such as a BGA are used in the thickness direction. Variations in height and warpage of the substrate itself have occurred. Therefore, in order to achieve electrical connection to the electrodes to be inspected 102 and 103, which are inspection points on the circuit board 101 to be inspected, the upper inspection jig 11la and the lower inspection jig 11lb are applied with high pressure. It is necessary to apply pressure to deform the circuit board 101 to be inspected flat.Furthermore, the upper inspection jig 11 la and the lower inspection jig 11 lb It is necessary to follow the height of the electrodes 102 and 103 to be inspected.

In such a conventional universal type inspection jig, the force that follows the height variation of the electrodes to be inspected 102 and 103 by moving the conductive pins 132a and 132b in the axial direction is used. Since there is a limit in the amount of movement of the electrode 132b in the axial direction, there is a case where the followability with respect to the height variation of the electrodes to be inspected 102 and 103 is not good, and a conduction failure occurs and accurate inspection cannot be performed. Will be. [0019] In such a universal type inspection jig, the pressing pressure when the circuit board 101 to be inspected is clamped by the upper inspection jig 11la and the lower inspection jig 111b is different from the upper and lower parts. Absorbed by the conductive sheets 122a, 122b, 126a, 126b, 142a, 142b. Therefore, in such a universal type inspection jig, the conductive pins 132a and 132b need to be arranged at regular intervals in order to support the pitch conversion substrates 123a and 123b and distribute the pressing pressure.

[0020] In the conventional universal type inspection jig, since the pressing pressure is received by the conductive pins 132a and 132b, it is necessary to arrange a large number of conductive pins 132a and 132b at regular intervals.

Therefore, for example, when forming the insulating plates 134a and 134b having a through hole of 10,000 or more at 0.75 mm pitch in accordance with the miniaturization of the electrodes of the circuit board 101 to be inspected, the insulating plates 134a and 134b When the thickness of the substrates 135a and 135b is thin, the strength becomes low and the substrate may be broken when bent. Therefore, it is necessary to make the insulating plates 134a and 134b and 135a and 135b thick. Patent Document 1: JP-A-6-94768

Patent Document 2: JP-A-5-159821

Patent Document 3: JP-A-7-248350

Patent Document 4: JP-A-8-271569

Patent Document 5: JP-A-8-338858

Patent Document 6: JP-A-6-82531

Disclosure of the invention

Problems to be solved by the invention

[0021] In view of the above situation, the present invention can perform a highly reliable electrical inspection even when a circuit substrate to be inspected has minute electrodes arranged at a fine pitch. It is an object of the present invention to provide a circuit board inspection apparatus and a circuit board inspection method that can be performed.

[0022] The present invention also provides a circuit board inspection apparatus with high inspection efficiency, in which the frequency of replacement due to deterioration of an anisotropic conductive sheet is low when a circuit board to be inspected is repeatedly and continuously inspected. And a method for inspecting a circuit board. Further, according to the present invention, when a circuit board to be inspected is repeatedly subjected to a continuous inspection, the workability of the inspection is excellent because it is less necessary to correct the positional deviation of the anisotropic conductive sheet. An object of the present invention is to provide a circuit board inspection apparatus and a circuit board inspection method.

[0024] Further, the present invention provides a circuit board inspection apparatus which can easily replace an anisotropic conductive sheet when the anisotropic conductive sheet is deteriorated in a repeated continuous inspection of a circuit board to be inspected as an inspection object. An object of the present invention is to provide a circuit board inspection method.

Further, in the present invention, even if the circuit board to be inspected to be inspected is changed, all that is required is to change the circuit board for inspection without separately manufacturing the entire inspection apparatus (entire inspection jig). An object of the present invention is to provide a circuit board inspection apparatus and a circuit board inspection method capable of performing inspection on a circuit board to be inspected.

[0026] Further, the present invention has a good follow-up property with respect to variations in the height of electrodes to be inspected of a circuit board to be inspected, and does not cause a conduction failure, and can perform an accurate inspection. An object of the present invention is to provide a circuit board inspection apparatus and a circuit board inspection method.

Means for solving the problem

The circuit board inspection apparatus of the present invention uses a pair of a first inspection jig and a second inspection jig to perform an inspection between both inspection jigs on both sides of a circuit board to be inspected. A circuit board inspection device for performing an electrical inspection by clamping

The first inspection jig and the second inspection jig are each

A pitch conversion substrate for converting an electrode pitch between one surface side and the other surface side of the substrate; a first anisotropic conductive sheet disposed on the circuit board to be inspected side of the pitch conversion substrate;

A second anisotropic conductive sheet disposed on the opposite side of the pitch conversion board from the circuit board to be inspected;

A circuit board side connector having

A plurality of conductive pins arranged at a predetermined pitch,

A pair of spaced first and second insulating plates that support the conductive pins movably in the axial direction,

With «I-pin unit and A connector board for electrically connecting the tester to the relay pin unit; a third anisotropic conductive sheet disposed on the relay pin unit side of the connector board; and an opposite side of the connector board to the relay pin unit And a tester Tsukuda j connector provided with:

The first anisotropic conductive sheet is characterized in that the first anisotropic conductive sheet is an anisotropic conductive sheet in which conductive particles are arranged in a thickness direction and uniformly dispersed in a surface direction.

[0028] Further, a circuit board inspection method of the present invention is a circuit board inspection method using the above-described circuit board inspection apparatus,

A pair of the first inspection jig and the second inspection jig sandwiches both surfaces of the circuit board to be inspected between the two inspection jigs to perform an electrical inspection.

[0029] In the above invention, the thickness W of the first anisotropically conductive sheet is 0.03-0.5m.

1

m, the number average particle diameter of the conductive particles D is 50 μm, the thickness W and the number average particles

1 1

The ratio W / Ό to the diameter D is 1.1 to 10, which is the ratio of the insulating elastomer constituting the sheet base material.

1 1 1

The durometer hardness is preferably 30-90.

According to the circuit board inspection apparatus of the present invention, the conductive particles are used as the first anisotropic conductive sheet disposed between the circuit board to be inspected and the pitch conversion board. Are arranged in the thickness direction and are uniformly dispersed in the plane direction.

For this reason, when the circuit board to be inspected is repeatedly and continuously inspected, the frequency of replacement due to deterioration of the anisotropic conductive sheet is small, and the inspection efficiency is high.

[0031] Further, even if a circuit board to be inspected is provided with minute electrodes arranged at a fine pitch of 200 μm or less and having an electrode width of 100 μm or less, for example, Electrical connection between the electrode to be inspected and the inspection electrode of the connector on the circuit board side can be achieved while maintaining the insulation state between the electrodes. Further, since there is no conductive path forming portion separated by the insulating portion, even when the anisotropic conductive sheet is displaced in the horizontal direction during the repeated inspection of the circuit board to be inspected, the circuit board to be inspected is always maintained. Since electrical connection between the electrode under test and the test electrode of the connector on the circuit board side is achieved, a good circuit board under test is erroneously determined to be defective due to the displacement of the anisotropic conductive sheet. Can be controlled it can.

[0032] Further, since the first anisotropic conductive sheet is separate from the circuit board for inspection, if the first anisotropic conductive sheet is deteriorated, the first anisotropic conductive sheet is degraded. Replacement is easy because only the conductive sheet needs to be replaced. Since the inspection circuit board does not need to be replaced when the first anisotropic conductive sheet is replaced and can be reused, the inspection cost of the circuit board to be inspected can be reduced.

As described above, according to the circuit board inspection apparatus of the present invention, even if the circuit board to be inspected has minute electrodes arranged at a fine pitch, a highly reliable electric circuit can be obtained. Mental examination can be performed.

[0034] In the circuit board inspection apparatus of the present invention, the first anisotropic conductive sheet has a surface roughness of 0.5 to 5 m on a surface in contact with the circuit board to be inspected, and the pitch conversion is performed. Surface roughness on the side in contact with the substrate for use is 0.3 m or less,

The pitch conversion substrate is characterized in that the surface roughness of the insulating portion on the surface in contact with the first anisotropic conductive sheet is 0.2 m or less.

As described above, since the contact surface of the first anisotropic conductive sheet to the circuit board to be inspected is a rough surface having a specific surface roughness, the pressure applied to the circuit board to be inspected is released. In this case, the contact area force between the circuit board to be inspected and the first anisotropic conductive sheet is reduced. Therefore, the adhesiveness of the insulating elastomer, which is the sheet substrate, is suppressed, and the circuit board to be inspected can be prevented or suppressed from adhering to the first anisotropic conductive sheet.

[0036] Furthermore, the contact surface of the first anisotropic conductive sheet with the pitch conversion substrate is a flat surface with small surface roughness, and the surface roughness of the insulating portion on the surface of the pitch conversion substrate is reduced. Therefore, the contact area between the pitch conversion substrate and the first anisotropic conductive sheet increases. Therefore, even after the pressurization of the circuit board to be inspected is released, the first anisotropic conductive sheet changes its pitch due to the adhesive property of the insulating elastomer, which is a sheet base material having high adhesion between the two. It is securely held on the replacement substrate. For this reason, it is possible to prevent the first anisotropic conductive sheet from being detached by the pitch converting substrate force, and to perform the inspection work even when a large number of circuit boards to be inspected are continuously subjected to electrical inspection. Can be performed smoothly.

[0037] In the circuit board inspection device of the present invention, the second anisotropic conductive sheet extends in a thickness direction. A plurality of conductive path forming portions, and an insulating portion that insulates the conductive path forming portions from each other. The conductive particles are contained only in the conductive path forming portions, so that the conductive particles do not extend in the surface direction. It is characterized by being uniformly dispersed and having a conductive path forming portion protruding on one side of the sheet.

In the above invention, the thickness W of the conductive path forming portion in the second anisotropic conductive sheet is 0.1 to 2 mm, and the number average particle diameter D of the conductive particles is 200 μm. , Thickness

twenty two

The ratio W ZD of W to the number average particle diameter D is 1.1 to 10,

2 2 2 2

It is preferable that the durometer hardness of the edge elastomer is 15-60! / ,.

[0039] In the circuit board inspection device of the present invention, the third anisotropic conductive sheet includes a plurality of conductive path forming portions extending in a thickness direction, and an insulating portion that insulates the conductive path forming portions from each other. And the conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are unevenly dispersed in the surface direction, and the conductive path forming portion protrudes on one side of the sheet. Features.

As described above, the second anisotropic conductive sheet and the third anisotropic conductive sheet each include the conductive path forming portion and the insulating portion, and the conductive particles are contained only in the conductive path forming portion. By using an unevenly distributed anisotropic conductive sheet that is unevenly distributed in the surface direction and the conductive path forming portion protrudes on one side of the sheet, the pressing force and impact due to the pressing of the inspection jig can be used for these sheets. Thus, deterioration of the first anisotropic conductive sheet can be suppressed. That is, since the unevenly distributed anisotropic conductive sheet has high elasticity, it absorbs the pressing force of the inspection jig at the time of inspection and has excellent impact relaxation ability, so that the elasticity is relatively low. It alleviates pressure concentration and impact on the first anisotropically conductive sheet and suppresses deterioration of the first anisotropically conductive sheet. Therefore, the service life of the first anisotropically conductive sheet for repeated inspection is prolonged, and as a result, the number of times of replacement of the first anisotropically conductive sheet in the electrical inspection of the circuit board to be inspected can be reduced. Inspection efficiency is improved.

In the circuit board inspection apparatus of the present invention, the pitch conversion board is provided with a connection electrode including a pair of a current terminal electrode and a voltage terminal electrode, and the connection electrode is provided on the circuit board to be inspected. The pair of current terminal electrodes and voltage terminal electrodes are arranged on the pitch conversion substrate so as to be electrically connected to each of the electrodes to be inspected, A current pin-side electrode and a voltage pin-side electrode are arranged on the connector board so as to be electrically connected to the current terminal electrode and the voltage terminal electrode of the pitch conversion board, respectively. It is characterized by the following.

[0042] With this configuration, when the electrical inspection is performed by pressing both sides of the circuit board to be inspected between the first inspection jig and the second inspection jig, Both the current terminal electrode and the voltage terminal electrode of the connection electrode of the pitch conversion board are electrically connected to each of the electrodes to be inspected on the circuit board via the first anisotropic conductive sheet. . Then, through the second anisotropic conductive sheet, the conductive pins of the relay pin unit, and the third anisotropic conductive sheet, the current terminal electrode of the pitch conversion board is connected to the current pin side electrode of the connector board. While being electrically connected, the voltage terminal electrode of the pitch conversion board is now electrically connected to the voltage terminal electrode of the connector board! / Puru.

[0043] Thus, a current supply path is formed for each of the electrodes to be inspected on the circuit board to be inspected via the current terminal electrodes of the upper and lower pitch conversion substrates. A voltage measurement path is formed for each of the electrodes to be inspected on the circuit board via the voltage terminal electrodes of the upper and lower pitch conversion boards.

Therefore, for each of the electrodes to be inspected on the circuit board to be inspected, the current is fixed to the current supply path via the current terminal electrodes of the upper and lower pitch conversion boards, for example, using a constant current supply device. The voltage from each of the electrodes to be inspected on the circuit board to be inspected is measured by a voltmeter through the voltage measuring electrodes via the voltage terminal electrodes of the upper and lower pitch conversion boards while supplying the current of It is possible to perform a test for confirming whether or not the wiring pattern of the inspection circuit board has a predetermined performance on electrical characteristics.

Conversely, each of the electrodes to be inspected on the circuit board to be inspected is connected to the voltage measurement path via the voltage terminal electrodes of the upper and lower pitch conversion substrates, for example, using a constant voltage supply device. While applying a constant voltage, measure the current from each electrode to be inspected on the circuit board to be inspected with an ammeter through the current supply path via the current terminal electrodes of the upper and lower pitch conversion boards. Accordingly, it is also possible to perform a test for confirming electrical characteristics as to whether or not the wiring pattern of the circuit board to be inspected has a predetermined performance.

As described above, for each of the electrodes to be inspected on the circuit board to be inspected, a separate voltage measurement path, Since the voltage and current can be measured separately via the current supply path, it is possible to accurately determine whether or not the wiring pattern of the circuit board to be inspected has a predetermined performance and the electrical characteristics. Confirmation test can be performed, and the confirmation test can be performed in a short time.

[0047] In the circuit board inspection device of the present invention, the relay pin unit may include:

An intermediate holding plate disposed between the first insulating plate and the second insulating plate,

A first support pin disposed between the first insulating plate and the intermediate holding plate, and a second support pin disposed between the second insulating plate and the intermediate holding plate,

A first contact support position of the first support pin with respect to the intermediate holding plate and a second contact support position of the second support pin with respect to the intermediate holding plate are in the thickness direction of the intermediate holding plate. It is characterized by being arranged at a different position on the projected intermediate holding plate projection plane.

[0048] With this configuration, when the electrical inspection is performed by pressing both sides of the circuit board to be inspected between the first inspection jig and the second inspection jig, In the initial stage, the conductive pins of the relay pin unit are moved, and the rubber elastic compression of the first anisotropic conductive sheet, the second anisotropic conductive sheet, and the third anisotropic conductive sheet is performed. Thus, it is possible to absorb the variation in height of the electrodes to be inspected on the circuit board to be inspected to some extent.

[0049] Then, the first contact support position of the first support pin with the intermediate holding plate and the second contact support position of the second support pin with the intermediate holding plate are different from each other. Since the intermediate holding plate projected in the thickness direction is arranged at different positions on the projection plane, the circuit board to be inspected, which is the inspection object, is further pressed between the first inspection jig and the second inspection jig. In addition to the rubber elastic compression of the first anisotropic conductive sheet, the second anisotropic conductive sheet, and the third anisotropic conductive sheet, the first insulating plate of the relay pin unit Due to the panel elasticity of the second insulating plate and the intermediate holding plate disposed between the first insulating plate and the second insulating plate, the height variation of the electrode to be inspected on the circuit board to be inspected, for example, the solder ball electrode With respect to the height variation, the pressure concentration can be dispersed to avoid local stress concentration.

[0050] Thereby, stable electrical contact with each of the electrodes to be inspected of the circuit board to be inspected having a variation in height is ensured. Furthermore, stress concentration on the first anisotropic conductive sheet Since this is reduced, local breakage of the first anisotropic conductive sheet is suppressed. As a result, the repeated use durability of the first anisotropic conductive sheet is improved, so that the number of times of replacement of the first anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

[0051] Further, since it is not necessary to arrange the conductive pins at regular intervals, the number of through holes formed in the insulating plate can be reduced. Therefore, the thickness of the insulating plate can be reduced. Further, it is possible to reduce the cost required for manufacturing an inspection apparatus in which drilling of a through hole in an insulating plate holding conductive pins by drilling is small.

[0052] The circuit board inspection apparatus of the present invention includes a pair of first and second inspection jigs, which are used to inspect both sides of a circuit board to be inspected, which is an inspection object, between the two inspection jigs. When the pressure is applied, the intermediate holding plate is bent in the direction of the second insulating plate around the first contact support position of the first support pin with respect to the intermediate holding plate,

The intermediate holding plate is characterized in that it is configured so as to extend in the direction of the first insulating plate around a second contact support position of the second support pin with respect to the intermediate holding plate.

[0053] With this configuration, since the intermediate holding plate bends in opposite directions about the first contact support position and the second contact support position, the first inspection is performed. When the circuit board to be inspected is further pressurized between the jig and the second inspection jig, the panel elasticity of the intermediate holding plate is further exerted, and the circuit board to be inspected is exposed. With respect to the height variation of the inspection electrode, pressure concentration can be dispersed to avoid local stress concentration, and local damage of the first anisotropic conductive sheet can be suppressed. As a result, the durability of repeated use of the first anisotropic conductive sheet is improved, so that the number of times of replacement of the first anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

[0054] In the circuit board inspection device of the present invention, the first contact support position of the first support pin with respect to the intermediate holding plate is arranged in a grid on the intermediate holding plate projection plane,

A second contact support position of the second support pin with respect to the intermediate holding plate is arranged in a grid on the intermediate holding plate projection plane,

On the intermediate holding plate projection plane, one second contact support position is arranged in a unit lattice area where four adjacent first contact support position forces are also provided, In the intermediate holding plate projection plane, one first contact support position is arranged in a unit lattice region where four adjacent second contact support position forces are also provided. Features.

[0055] With such a configuration, the first contact support position and the second contact support position are arranged in a lattice, and the first contact support position and the second contact support position are arranged in a lattice. It will be arranged in the position where all shifted.

[0056] Therefore, the intermediate holding plate is deflected in directions opposite to each other with the first contact support position and the second contact support position as centers, and the first inspection jig and the second inspection jig and the second inspection jig and the second inspection jig. When the circuit board to be inspected is pressurized between the inspection jigs, the panel elasticity of the intermediate holding plate is further exerted, and the height of the electrodes to be inspected on the circuit board to be inspected is increased. By dispersing the pressure concentration with respect to the variation, local stress concentration can be further avoided, and local damage of the first anisotropic conductive sheet is suppressed. As a result, the repeated use durability of the first anisotropic conductive sheet is improved, so that the number of times of replacement of the first anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

[0057] In the circuit board inspection device of the present invention, the relay pin unit may include:

A plurality of intermediate holding plates disposed at predetermined intervals between the first insulating plate and the second insulating plate;

Holding plate support pins arranged between adjacent intermediate holding plates,

With

In at least one intermediate holding plate, a holding support position of the holding plate support pin abutting against the intermediate holding plate from one surface side, and a second holding position abutting against the intermediate holding plate from the other surface side. The contact support position of the first support pin, the second support pin, or the support plate support pin with respect to the intermediate support plate corresponds to the intermediate support plate projection surface projected in the thickness direction of the intermediate support plate. At different positions.

With this configuration, panel elasticity is further exhibited by the plurality of intermediate holding plates, and pressure concentration is reduced with respect to variations in the height of electrodes to be inspected on the circuit board to be inspected. By dispersing, local stress concentration can be further avoided, and local damage of the first anisotropic conductive sheet is suppressed. As a result, the first anisotropic conductive sheet Since the durability of repeated use of the conductive sheet is improved, the number of times of replacement of the anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

[0059] In the circuit board inspection apparatus of the present invention, in all of the intermediate holding plates, the holding plate support pins that are in contact with the one-side force on the intermediate holding plate have contact support positions with respect to the intermediate holding plate; The contact support position of the first support pin, the second support pin, or the holding plate support pin with respect to the intermediate holding plate, which is in contact with the intermediate holding plate on the other surface, is in the thickness direction of the intermediate holding plate. The intermediate holding plate is projected at a different position from the projection surface of the intermediate holding plate.

[0060] As a result, in all the intermediate holding plates, the supporting pin positions on the front and back sides of the plurality of intermediate holding plates are located at positions shifted from each other. The pressure concentration is dispersed against the height variation of the electrode to be inspected on the circuit board to be inspected, so that local stress concentration can be further avoided. Local damage of the conductive sheet is suppressed. As a result, the durability of repeated use of the first anisotropic conductive sheet is improved, so that the number of times of replacement of the first anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

The invention's effect

[0061] According to the present invention, a highly reliable electrical inspection can be performed even when a circuit board to be inspected has minute electrodes arranged at a fine pitch.

Brief Description of Drawings

FIG. 1 is a cross-sectional view showing one embodiment of a circuit board inspection device of the present invention.

FIG. 2 is a cross-sectional view showing a stacked state at the time of inspection of the inspection device of FIG. 1.

FIG. 3 is a view showing a surface of a board for pitch conversion on a circuit board to be inspected side.

FIG. 4 is a diagram showing a surface of a pitch conversion board on a relay pin unit side.

FIG. 5 is a partial cross-sectional view of a first anisotropic conductive sheet.

FIG. 6 is a partial cross-sectional view of a second anisotropic conductive sheet.

FIG. 7 is a cross-sectional view showing a state where a first anisotropic conductive sheet is laminated on a pitch conversion substrate. [FIG. 8] FIG. 8 (a) FIG. 8 is a partial cross-sectional view of a first anisotropic conductive sheet having one surface roughened, and FIG. 8 (b) shows a pitch of the first anisotropic conductive sheet. FIG. 4 is a cross-sectional view showing a state in which the layers are stacked on a conversion substrate.

[9] FIG. 9 is a diagram for explaining a manufacturing process of the first anisotropic conductive sheet.

FIG. 10 is a view showing a distribution state of conductive particles inside a molded member.

{11} FIG. 11 is a diagram illustrating a process for manufacturing the first anisotropic conductive sheet.

FIG. 12 is a diagram showing a distribution state of conductive particles after applying a magnetic field.

FIG. 13 is a cross-sectional view showing a conductive pin of a relay pin unit and a part of an insulating plate.

FIG. 14 is a cross-sectional view showing another embodiment of the circuit board inspection device of the present invention.

[FIG. 15] FIG. 15 is a cross-sectional view showing a stacked state at the time of inspection by the inspection device of FIG. 14. [16] FIG. 16 is a diagram showing a surface of a pitch conversion substrate on the side of a circuit board to be inspected. is there.

FIG. 17 is a diagram showing the surface of the pitch conversion board on the relay pin unit side. [18] FIG. 18 is a cross-sectional view showing a state where the first anisotropic conductive sheet is laminated on the pitch conversion substrate.

FIG. 19 is a partially enlarged cross-sectional view illustrating a state of use of the inspection device of FIG. 14.

FIG. 20 is a cross-sectional view showing another embodiment of the circuit board inspection apparatus of the present invention.

[FIG. 21] FIG. 21 is a cross-sectional view showing a stacked state at the time of inspection of the inspection device of FIG.

FIG. 22 is a cross-sectional view showing a conductive pin of a relay pin unit and a part of an insulating plate.

FIG. 23 is a partially enlarged view of an intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate.

FIG. 24 is a partially enlarged cross-sectional view of the inspection device in FIG. 20.

FIG. 25 is a partially enlarged cross-sectional view illustrating a use state of the inspection device of FIG. 20. so is there.

FIG. 26 is a partially enlarged cross-sectional view of a relay pin unit in the inspection device of FIG. 20.

FIG. 27 is a partially enlarged cross-sectional view illustrating a use state of the inspection device in FIG. 20.

FIG. 28 is a partially enlarged cross-sectional view similar to FIG. 24, showing another embodiment of the inspection apparatus of the present invention.

FIG. 29 is a partially enlarged cross-sectional view of a relay pin unit in the inspection device of FIG. 28.

FIG. 30 is a partially enlarged cross-sectional view showing a use state of an inspection device according to another embodiment of the present invention.

FIG. 31 is a cross-sectional view of a conventional circuit board inspection apparatus.

Explanation of symbols

1 Inspection circuit board

2 Test electrode

3 Test electrode

11a First inspection jig

l ib Second inspection jig

21a, 21b Circuit board connector

22a, 22b First anisotropic conductive sheet

23a, 23b Pitch conversion board

24 terminal electrode

25 Connection electrode

26a,, 26b 2nd anisotropic conductive sheet

27a,, 27b Current terminal electrode

28a,, 28b Voltage terminal electrode

31a,, 31b Relay pin unit

32a,, 32b conductive pin

a3a,, 33b 1st support pin (support pin) a, 34b 1st insulation board

a, 35b Second insulating plate

a Intermediate holding plate

a, 37b Second support pin

A First contact support position

B Second contact support position a, 39b Holding plate support pin

A Contact support position

a, 41b Tester side connector a, 42b Third anisotropic conductive sheet a, 43b Connector, connector board

a, 44b Tester side electrode a, 45b Pin side electrode

a, 46b Base plate

a, 47b Current pin side electrode a, 48b Voltage pin side electrode a, 49b Support pin

Insulating substrate

Wiring

Internal wiring

Insulating layer

Sheet base material

Conductive particles

Surface

Back

Insulation

Conductive path forming part 73 Projection

81a, 81b end

82 Center

83 Through hole

91 Pressure roll

92 Support roll

93a, b molded parts

94 Susa

95 Molding material

96 Top surface

97 Lower surface

98a, b electromagnet

99a recess

99b convex

101 Circuit board to be inspected

102 Test electrode

103 Test electrode

111a Upper inspection jig

11 1b Lower inspection jig

121a, 121b Circuit board side connector

122a, 122b Anisotropic conductive sheet

123a, 123b Pitch conversion board

126a, 126b Anisotropic conductive sheet

131a, 131b Relay pin unit

132a, 132b conductive pin

133a, 133b Support pin

34a, 134b First insulating plate 135a, 135b Second insulating plate

141a, 141b Tester side connector

142a, 142b Anisotropic conductive sheet

143a, 143b connector board

144a, 144b Tester side electrode

145a, 145b Pin side electrode

146a, 146b Base plate

A Intermediate holding plate projection surface

L1 distance

L2 distance

Q1 Diagonal line

Q2 Diagonal

R1 unit cell area

R2 unit cell area

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, a pair of identical components in the first inspection jig and the second inspection jig (for example, the circuit board side connector 21a and the circuit board side connector 21b, the first anisotropic conductive sheet 22a and the first anisotropic conductive sheet 22b), the symbols “a” and “b” may be omitted (for example, the first anisotropic conductive sheet 22a and the first anisotropic conductive sheet 22b). The anisotropic conductive sheet 22b may be collectively referred to as "first anisotropic conductive sheet 22").

FIG. 1 is a cross-sectional view illustrating an inspection apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view illustrating a stacked state of the inspection apparatus in FIG. 1 at the time of inspection, and FIG. FIG. 4 is a diagram illustrating a surface of the circuit board for inspection on the side of the circuit board to be inspected, and FIG. 4 is a diagram illustrating a surface of the substrate for pitch conversion on the side of the relay pin unit.

The inspection apparatus of the present embodiment measures the electric resistance between the electrodes to be inspected on the circuit board 1 to be inspected such as a printed circuit board for mounting an integrated circuit or the like by measuring the electric resistance between the electrodes to be inspected. An electrical inspection is performed. As shown in FIGS. 1 and 2, this inspection apparatus includes a first inspection jig 11a disposed on the upper surface side of the circuit board 1 to be inspected, and a second inspection jig disposed on the lower surface side. lib are arranged so as to face each other up and down.

The first inspection jig 11a includes a circuit board side connector 21a, a relay pin unit 31a, and a tester one side connector 41a. The circuit board side connector 21a is composed of a pitch conversion board 23a, a first anisotropic conductive sheet 22a and a second anisotropic conductive sheet 26a arranged on both sides thereof. The tester-side connector 41a includes a third anisotropic conductive sheet 42a disposed on the relay pin unit 31a side, a connector board 43a, and a base plate 46a.

[0068] The second inspection jig lib is configured similarly to the first inspection jig 11a, and includes a circuit board side connector 21b, a relay pin unit 31b, and a tester side connector 41b. The circuit board side connector 21b includes a pitch conversion board 23b, and a first anisotropic conductive sheet 22b and a second anisotropic conductive sheet 26b arranged on both sides thereof. The tester-side connector 41b includes a third anisotropic conductive sheet 42b, a connector board 43b, and a base plate 46b, which are arranged on the relay pin unit 31b side.

An electrode 2 to be inspected is formed on the upper surface of the circuit board 1 to be inspected, and an electrode 3 to be inspected is also formed on the lower surface thereof. These are electrically connected to each other! You.

(1) Connector on Circuit Board Side

The circuit board side connectors 21a and 21b include pitch conversion boards 23a and 23b, and first anisotropic conductive sheets 22a and 22b and second anisotropic conductive sheets 26a and 26b disposed on both sides thereof. I have.

[0070] (li) Pitch conversion substrate

FIG. 3 is a diagram showing a surface of the pitch conversion board 23 on the circuit board under test 1 side, and FIG. 4 is a diagram showing a surface of the pitch conversion board 23 on the relay pin unit 31 side.

As shown in FIG. 3, on one surface of the pitch conversion board 23, that is, on the side of the circuit board under test 1, there are a plurality of connections electrically connected to the electrodes 2 and 3 of the circuit board 1 under test. electrode

25 are formed. These connection electrodes 25 are arranged so as to correspond to the patterns of the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected. On the other hand, on the other surface of the pitch conversion board 23, that is, on the opposite side of the circuit board 1 to be inspected, as shown in FIG. 4, the conductive pins 32 a and 32 b of the relay pin unit 31 are electrically connected. A plurality of terminal electrodes 24 to be connected are formed. These terminal electrodes 24 are, for example, pitchers 54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0.2 mm. They are arranged on grid points at regular intervals, and their pitch is the same as the arrangement pitch of the conductive pins 32a and 32b of the relay pin unit. Each connection electrode 25 in FIG. 3 is electrically connected to the corresponding terminal electrode 24 in FIG. 4 by a wiring 52 and an internal wiring 53 penetrating in the thickness direction of the insulating substrate 51 in FIG.

The insulating portion on the surface of the pitch conversion substrate 23 is formed of, for example, an insulating layer 54 formed on the surface of the insulating substrate 51 so that the respective connection electrodes 25 are exposed, as shown in FIG. The thickness of the insulating layer 54 is preferably 5 to 100 m, more preferably 10 to 60 m. If the thickness is too small, it may be difficult to form an insulating layer having a small surface roughness. On the other hand, if the thickness is excessive, electrical connection between the connection electrode 25 and the first anisotropic conductive sheet 22 may be difficult.

As a material for forming the insulating substrate 51 of the pitch conversion substrate, a material generally used as a substrate of a printed circuit board can be used. Specific examples include polyimide resin, glass fiber reinforced polyimide resin, glass fiber reinforced epoxy resin, and glass fiber reinforced bismaleimide triazine resin.

As a material for forming the insulating layers 54 and 55 in FIG. 7, a polymer material that can be formed into a thin film can be used. Specifically, for example, epoxy resin, acrylic resin, phenol resin, polyimide resin Fats, polyamide resins, mixtures thereof, resist materials and the like.

[0074] The pitch conversion substrate 23 can be manufactured, for example, as follows. First, a laminated material in which thin metal layers are laminated on both sides of a flat insulating substrate is prepared, and the laminated material is penetrated in the thickness direction of the laminated material in accordance with the pattern corresponding to the terminal electrode to be formed. A plurality of through holes to be formed are formed by a numerically controlled drilling device, a photo-etching process, a laser processing process, or the like. Next, by applying electroless plating and electrolytic plating to the through-holes formed in the laminated material, no holes connected to the thin metal layers on both surfaces of the substrate are formed. Thereafter, the metal thin layer is subjected to a photo-etching process to form a wiring pattern and a connection electrode on the surface of the insulating substrate and to form a terminal electrode on the opposite surface.

Then, as shown in FIG. 7, an insulating layer 54 is formed on the surface of the insulating substrate 51 so that each connection electrode 25 is exposed, and each terminal electrode 2 is formed on the opposite surface. By forming insulating layer 55 so that 4 is exposed, substrate 23 for pitch conversion can be obtained. The thickness of insulating layer 55 is preferably 5 to 100 m, more preferably 10 to 60 m.

[0077] (1b) First anisotropic conductive sheet

As shown in FIG. 5, the first anisotropic conductive sheet 22 which constitutes the circuit board side connector 21 and is laminated on the pitch conversion circuit board 23 is a sheet base material 61 having an insulating elastic polymer force as shown in FIG. Many conductive particles 62 are dispersed in the plane direction and contained in a state arranged in the thickness direction.

[0078] The thickness of the first anisotropic conductive sheet 22 is preferably 0.03-0.5 mm, more preferably 0.05-0.2 mm. In addition, as shown in FIG. 8, when the surface 63 of the first anisotropic conductive sheet 22 is a rough surface, the "thickness of the first anisotropic conductive sheet 22" This is the thickness (minimum thickness) from the recessed surface 63 to the rear surface 64 (flat surface).

When the thickness of the first anisotropic conductive sheet 22 is less than 0.03 mm, the required durability is obtained because the mechanical strength of the first anisotropic conductive sheet 22 is easily reduced. May not be possible. On the other hand, when the thickness of the first anisotropic conductive sheet 22 exceeds 0.5 mm, the electrical resistance in the thickness direction tends to increase, and when the pitch of the electrodes to be connected is small, the additional resistance increases. The required insulation cannot be obtained between the conductive paths formed by the pressure, and an electrical short circuit may occur between the electrodes under test, making it difficult to perform an electrical test on the circuit board under test.

[0080] The elastic polymer material constituting the sheet substrate 61 of the first anisotropic conductive sheet 22 preferably has a durometer hardness of 30 to 90, more preferably 35 to 80, and still more preferably. 4 0—70. In this specification, “durometer hardness” refers to a value measured by a type A durometer based on a durometer hardness test of JIS K6253. If the durometer hardness of the elastic polymer material is less than 30, compression and deformation of the anisotropically conductive sheet will be large when pressed in the thickness direction. The sheet deteriorates prematurely, making it difficult to use for inspection, and the durability tends to be low.

On the other hand, when the durometer hardness of the elastic polymer substance exceeds 90, the amount of deformation in the thickness direction becomes insufficient when the anisotropic conductive sheet is pressed in the thickness direction. Good connection reliability cannot be obtained, and connection failures are likely to occur.

[0082] As the conductive particles 62 of the first anisotropic conductive sheet 22, magnetic conductive particles are usually used. The number average particle diameter D of the magnetic conductive particles is preferably 3 to 50 m, more preferably

1

Is 5 to 30 μm, more preferably 8 to 20 μm.

In the present specification, the “number average particle size of the magnetic conductive particles” is a value measured by a laser diffraction scattering method.

[0083] By the number-average particle size 0 ₁ of the magnetic conductive particles is 3 mu m or more, deform under pressure of the portion where the magnetic conductive particles in the anisotropically conductive sheet obtained is contained is facilitated Also, when the magnetic conductive particles are oriented by a magnetic field orientation treatment in the manufacturing process, the orientation of the magnetic conductive particles is easily facilitated, so that the obtained anisotropic conductive sheet is highly anisotropic. The resolution of the anisotropically conductive sheet (the anisotropy of the anisotropically conductive sheet is calopressed to achieve electrical continuity between the electrodes facing each other in the thickness direction, while maintaining the electrical insulation between the horizontally adjacent electrodes) Ability).

On the other hand, when the number average particle diameter D of the magnetic conductive particles is 50 μm or less, it is obtained.

1

The anisotropic conductive sheet has good elasticity and is easy to deform under pressure, and has good resolution even for fine and fine pitch electrodes.

The thickness W (μm) of the first anisotropic conductive sheet 22 and the number average particle size of the magnetic conductive particles

1

Diameter D m) and the ratio W ZD is 1.1

It is preferably 1 1 to 10.

1

[0085] When the ratio W ZD is less than 1.1, the diameter of the magnetic conductive particles is

1 1

Since the thickness of the anisotropic conductive sheet is equal to or larger than the thickness of the sheet, the elasticity of the anisotropic conductive sheet decreases, and therefore, the sheet faces the electrode to be inspected of the circuit board 1 to be inspected such as a printed wiring board. When the anisotropic conductive sheet is arranged and pressure is applied to achieve the contact conduction state, the circuit substrate 1 to be inspected is easily damaged.

On the other hand, if the ratio W ZD exceeds 10, the circuit

1 1

When an anisotropic conductive sheet is arranged facing the electrode to be inspected of the plate 1 and a pressure is applied to achieve a contact conduction state, a large number of sheets are placed between the circuit board 1 to be inspected and the pitch conversion substrate 23. The conductive particles are arranged to form a chain. Therefore, there are many contacts between the conductive particles, and the electrical resistance value tends to be high, which makes it difficult to use for electrical inspection.

In one embodiment of the present invention, preferably, as shown in FIGS. 8A and 8B, the surface 63 of the anisotropic conductive sheet 22 that is in contact with the circuit board 1 to be inspected has It has a rough surface with irregularities. On the other hand, the back surface 64 on the side in contact with the pitch conversion substrate 23 is a flat surface. The chain formed by the conductive particles 62 is formed in a state of being dispersed in the surface direction of the sheet 22 irrespective of the positions of the convex portions and the concave portions of the rough surface on the surface 63 side of the anisotropic conductive sheet 22. .

The surface roughness of the surface 63 (rough surface) on the side that comes into contact with the circuit board 1 to be inspected is preferably 0.5-5 / ζπι, and more preferably 11. In this specification, “surface roughness” refers to the center line roughness Ra according to JIS B0601. If the surface roughness is too small, it is difficult to sufficiently suppress the adhesiveness on this surface, and the anisotropic conductive sheet 22 may be displaced by being dragged by the circuit board 1 to be inspected during the inspection, The anisotropic conductive sheet 22 may adhere to the circuit board 1 to be inspected and may be separated from the pitch conversion board 23. On the other hand, if the surface roughness is excessive, it is difficult to make a stable electrical connection to the circuit board 1 to be inspected.

The surface roughness of the back surface 64 on the side in contact with the pitch conversion substrate 23 is preferably 0.3 m or less, more preferably 0.005 to 0.2 m, and still more preferably 0.01 to 0. 1 m. The surface roughness of the insulating portion 54 (FIGS. 3 and 7) on the surface of the pitch conversion substrate 23 on the side in contact with the anisotropic conductive sheet 22 is preferably 0.2 m or less, more preferably 0.001. — 0.1 m, more preferably 0.01-1. 03 / zm. If the surface roughness on these surfaces is excessive, the adhesion between the anisotropic conductive sheet 22 and the pitch conversion substrate 23 may be insufficient. Therefore, it is difficult to prevent the anisotropic conductive sheet 22 from detaching from the pitch conversion substrate 23 during the electrical inspection.

[0089] The elastic polymer material constituting the base material of the first anisotropic conductive sheet 22 is not particularly limited as long as it is within the above range of the durometer hardness. From the viewpoint of electrical characteristics, it is preferable to use silicone rubber.

In addition, as the curable polymer material preferably used for obtaining the elastic polymer material constituting the base material of the first anisotropic conductive sheet 22, for example, polybutadiene rubber, natural rubber, polyisoprene Conjugated rubbers such as rubber, styrene-butadiene copolymer rubber, acrylonitrile-tagene copolymer rubber, and hydrogenated products thereof, and block copolymers such as styrene-butadiene block copolymer rubber and styrene-isoprene block copolymer Examples of the rubber include a combined rubber and a hydrogenated product thereof, chloroprene rubber, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene propylene copolymer rubber, and ethylene propylene gen copolymer rubber.

[0090] When weather resistance is required for the anisotropic conductive sheet, it is preferable to use a material other than the conjugated-gen-based rubber. It is preferable to use rubber rubber. As the silicone rubber, those obtained by crosslinking or condensing a liquid silicone rubber are preferable. The liquid silicone rubber may be any of a condensation type, an addition type, and a type containing a butyl group and a hydroxyl group, which preferably have a viscosity of 10 ⁵ poise or less at a strain rate of ^10_1 sec. May be. Specifically, for example, dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, methyl phenol silicone raw rubber and the like can be mentioned.

[0091] Among these, the liquid silicone rubber containing a bullet group (polydimethylsiloxane containing a bullet group) includes, for example, dimethyldichlorosilane or dimethyldialkoxysilane, and the presence of dimethylvinylchlorosilane or dimethylvinylalkoxysilane. It is obtained by performing hydrolysis and condensation reaction below! And then performing fractionation by repeated dissolution and precipitation.

[0092] A liquid silicone rubber containing a bull group at both ends can be used as a polymerization terminator by polymerizing a cyclic siloxane such as otatamethylcyclotetrasiloxane in the presence of a catalyst. For example, it can be obtained by using dimethyldibutylsiloxane and appropriately adjusting other reaction conditions (for example, the amount of cyclic siloxane and the amount of polymerization terminator). Here, as a catalyst for the a-one polymerization, alkalis such as hydroxymethyltetramethylammonium and hydroxybutylbutylphosphonium or a silanolate solution thereof can be used. Is, for example, 80-130 ° C.

[0093] Liquid silicone rubbers containing hydroxyl groups (hydroxyl group-containing polydimethylsiloxane) include, for example, dimethinoresichlorosilane or dimethinoresinolecoxysilane, and the presence of dimethylhydrochlorosilane or dimethylhydroalkoxysilane. It can be obtained by carrying out water splitting and condensation reaction of squid under the following conditions, and then performing fractionation by repeating dissolution and precipitation. Further, cyclic siloxane is polymerized in the presence of a catalyst in the presence of a catalyst, and as a polymerization terminator, for example, dimethinoaldehyde, chlorosilane, methinoresid, chlorosilane or dimethynolehide, loanoreoxysilane, or the like is used, and other reaction conditions (for example, cyclic siloxane And the amount of the polymerization terminator) are appropriately adjusted. Here, as a catalyst for the a-one polymerization, alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or a silanolate solution thereof can be used. 0—130. C.

[0094] As the liquid silicone rubber, one having a compression set of 150% or less at 150 ° C of the cured product should be used, so that the durability when repeatedly compressed in the thickness direction of the anisotropic conductive sheet is good. This compression set is more preferably not more than 20%.

In addition, the use of liquid silicone rubber with a tear strength of the cured product of 7 kNZm or more at 23 ° C is preferred because it gives good durability when repeatedly compressed in the thickness direction of the anisotropic conductive sheet. This tear strength is more preferably 10 OkNZm or more.

Here, the compression set and tear strength of the liquid silicone rubber cured product can be measured by a method based on JIS K 6249.

[0095] When silicone rubber is used as the base material of the anisotropic conductive sheet 22, its molecular weight Mw

(Mean weight average molecular weight in terms of standard polystyrene) is preferably 10,000 to 40,000. Good. Further, from the viewpoint of heat resistance, the molecular weight distribution index (referred to as the value of the ratio MwZMn between the weight average molecular weight Mw in terms of standard polystyrene and the number average molecular weight Mn in terms of standard polystyrene) is preferably 2 or less.

[0096] The polymer material for obtaining the elastic polymer material serving as the base material of the anisotropic conductive sheet 22 may contain a curing catalyst for curing the same. Examples of such a curing catalyst include an organic peroxide, a fatty acid azo compound, and a hydrosilylide catalyst.

[0097] Examples of the organic peroxide used as a curing catalyst include benzoyl peroxide, bisdicyclobenzoyl peroxide, dicumyl peroxide, and di-tert-butyl peroxide.

Examples of the fatty acid azo compound used as a curing catalyst include, for example, azobisisobutyl nitrile.

[0098] Examples of the catalyst that can be used as a catalyst for the hydrosilylation reaction include chloroplatinic acid and salts thereof, a siloxane complex containing a platinum unsaturated group, a complex of butylsiloxane and platinum, and a mixture of platinum and 1,3-dibutyl. Examples include a complex with tetramethyldisiloxane, a complex of triorganophosphine or phosphite with platinum, a chelate of acetylacetate platinum, and a complex of cyclic gen and platinum.

[0099] The amount of the curing catalyst used is appropriately selected in consideration of the type of the polymer material to be added, the type of the curing catalyst, and other curing conditions. 3-15 parts by weight.

[0100] The polymer material for obtaining the elastic polymer material serving as the base material of the anisotropic conductive sheet 22 may include, if necessary, an ordinary inorganic powder such as silica powder, colloidal silica, air port gel silica, and alumina. A filler can be included. By including such an inorganic filler, the thixotropic property of the polymer material (forming material) for obtaining the anisotropic conductive sheet 22 is ensured, and the viscosity thereof is increased. Further, the dispersion stability of the conductive particles is improved, and the strength of the obtained anisotropic conductive sheet is increased.

[0101] The amount of the inorganic filler to be used is not particularly limited. However, when used in a large amount, it is not preferable because the magnetic particles cannot sufficiently orient the conductive particles. Further, the viscosity of the sheet forming material is preferably in the range of 100,000-100,000 cp at a temperature of 25 ° C.

[0102] The conductive particles contained in the base material of the anisotropic conductive sheet 22 can be easily aligned in the thickness direction of the sheet by applying a magnetic field. Conductive particles exhibiting magnetism are used. As the magnetic conductive particles, the magnetic conductive particles can be easily moved by the action of a magnetic field in a sheet forming material for forming an anisotropic conductive sheet by a manufacturing method described below. Those having a saturation magnetization of at least 0.1 Wb / m ² are preferred, more preferably at least 0.3 Wb / m ² , and particularly preferably at least 0.5 WbZm ² .

[0103] When the saturation magnetization is 0.1 lWbZm ² or more, the magnetic conductive particles can be surely moved by the action of a magnetic field in the manufacturing process to obtain a desired orientation state. When used, chains of magnetic conductive particles can be formed.

Specific examples of the magnetic conductive particles include particles of a metal exhibiting magnetism such as iron, nickel, and cobalt, particles of an alloy thereof, particles containing these metals, or particles containing these metals as core particles. Composite particles having a highly conductive metal coated on the surface of the particles, or inorganic material particles such as nonmagnetic metal particles or glass beads or polymer particles are used as core particles, and the surface of the core particles is coated with a highly conductive metal. Examples include composite particles subjected to plating, or composite particles in which core particles are coated with both a conductive magnetic material such as ferrite and an intermetallic compound and a highly conductive metal.

Here, “highly conductive metal” refers to a metal having a conductivity of 5 × 10 ⁶ Ω— ¹ !!! — ¹ or more at 0 ° C.

As such a highly conductive metal, specifically, gold, silver, rhodium, platinum, chromium, and the like can be used. Among these, gold is chemically stable and has high conductivity. Preferably, it is used.

[0105] Among the above-mentioned magnetic conductive particles, composite particles or the like in which nickel particles are used as core particles and the surface thereof is plated with a highly conductive metal such as gold or silver are preferably used.

Means for coating the surface of the core particles with a highly conductive metal is not particularly limited. However, for example, an electroless plating method can be used.

The magnetic conductive particles preferably have a coefficient of variation of the number average particle diameter of 50% or less, more preferably 40% or less, still more preferably 30% or less, and particularly preferably 20% or less. is there.

Here, the “variation coefficient of the number average particle diameter” is represented by the formula: (σ ZDn) X 100 (where σ indicates the value of the standard deviation of the particle diameter, and Dn indicates the number average particle diameter of the particles. ).

[0106] When the variation coefficient of the number average particle diameter of the magnetic conductive particles is 50% or less, the degree of irregularity of the particle diameter is reduced, and thus the partial conductivity of the obtained anisotropic conductive sheet is reduced. Variation can be reduced.

Such magnetic conductive particles can be obtained by converting a metal material into particles by an ordinary method, or by preparing commercially available metal particles and performing a classification treatment on the particles.

[0107] The particle classification process can be performed by a classifier such as an air classifier or a sonic sieve.

The specific conditions of the classification process are appropriately set according to the number average particle diameter of the target conductive metal particles, the type of the classification device, and the like.

In the case where a core particle having a surface coated with a highly conductive metal is used as the magnetic conductive particles, the coverage of the highly conductive metal on the particle surface (based on the surface area of the core particle) The ratio of the area covered by the conductive metal) is preferably 40% or more, more preferably 45% or more, and even more preferably 47 to 95%.

[0108] The coating amount of the highly conductive metal is preferably 0.5 to 50% by weight based on the core particles, more preferably 1 to 30% by weight, still more preferably 3 to 25% by weight, particularly preferably 3 to 25% by weight. Preferably it is 4-1 20% by weight. When the highly conductive metal to be coated is gold, the coating amount is preferably 2 to 30% by weight of the core particles, more preferably 3 to 20% by weight, and still more preferably 3. 5-17% by weight.

[0109] The specific shape of the magnetic conductive particles is not particularly limited, but is easily included in the polymer material for forming the elastic polymer material that is the base material of the anisotropic conductive sheet 22. Secondary particles in which spherical, star-shaped, or primary particles aggregate because they can be dispersed It is preferred that they are massive.

[0110] As the magnetic conductive particles, particles whose surfaces have been treated with a coupling agent such as a silane coupling agent may be used. By treating the surface of the magnetic conductive particles with the coupling agent, the adhesion between the magnetic conductive particles and the elastic polymer base material is increased, and as a result, the resulting anisotropic conductive sheet 22 is used repeatedly. Endurance is increased.

[0111] The anisotropic conductive sheet 22 can contain an antistatic agent as long as the insulating property of the elastic polymer material is not impaired. By including an antistatic agent in the anisotropic conductive sheet 22, the accumulation of electric charges on the sheet surface is prevented or suppressed, so that during the electrical inspection of the circuit board 1 to be inspected, the anisotropic conductive sheet 22 is used. In addition, it is possible to prevent problems caused by discharge of electric charges from the substrate, and to obtain good conductivity with a smaller pressing force.

[0112] The anisotropic conductive sheet 22 can be manufactured, for example, as follows. First, a fluid molding material is prepared in which magnetic conductive particles are dispersed in a liquid polymer material that is cured to become an elastic polymer material. Further, as shown in FIG. 9, a pair of forming members 93a and 93b made of a non-magnetic sheet are prepared. A frame-shaped spacer having an opening having a shape conforming to the planar shape of the target anisotropic conductive sheet 22 on the molding surface of one molding member 93b, and having a thickness corresponding to the thickness. Place 94. The prepared molding material 95 is applied to the opening of the spacer 94, and the other molding member 93 a is arranged on the molding material 95 such that the molding surface thereof is in contact with the molding material 95.

[0113] As the non-magnetic sheet used as the molded members 93a and 93b, a strong resin sheet such as polyimide resin, polyester resin, or acrylic resin can be used.

When manufacturing a sheet having a surface roughened on one side of the anisotropic conductive sheet 22 as shown in FIGS. 8 (a) and 8 (b), as shown in FIG. The molding surface is subjected to a surface roughening treatment according to the surface roughness of the surface 63 of the target anisotropic conductive sheet 22. For example, the concave portions 99a and the convex portions 99b are formed on the molding surface by a method such as a sand blast method or an etching method. The other molding member 93b has a molding surface that is a flat surface.

[0114] The sheet thickness of the molded members 93a and 93b is preferably 50 to 500 µm, more preferably 75 to 500 µm. 300 / zm. If the thickness is less than 50 m, the strength required for a molded member may not be obtained. If the thickness exceeds 500 m, it may be difficult to apply a magnetic field of a desired strength to the molding material when arranging the conductive particles.

Next, as shown in FIG. 9, the molding material 93a, 93b sandwiching the molding material 95 is sandwiched by the pressure roll 91 and the support roll 92, so that the molding material has a predetermined thickness. In this state, the conductive particles 62 are uniformly dispersed inside the molding material 95 as shown in FIG.

Next, as shown in FIG. 11, for example, a pair of electromagnets 98a and 98b are arranged on the back side of the molding members 93a and 93b, and a parallel magnetic field is applied in the thickness direction of the molding material 95. As a result, as shown in FIG. 12, the conductive particles 62 dispersed in the molding material are oriented so as to be arranged in the thickness direction while maintaining the state of being dispersed in the plane direction, and a plurality of particles extending in the thickness direction are maintained. The chains formed by the conductive particles 62 are dispersed in the plane direction.

[0117] By curing the molding material in this state, the conductive particles are oriented in the elastic polymer base material so as to line up in the thickness direction and are dispersed in the plane direction. Sheet 22 is manufactured.

The curing treatment of the molding material may be performed while the parallel magnetic field is applied, or may be performed after stopping the operation of the parallel magnetic field. The strength of the parallel magnetic field applied to the molding material is preferably such that the average is 0.02-1.5 Tesla.

[0118] As means for applying a parallel magnetic field to the molding material, a permanent magnet may be used instead of an electromagnet. As the permanent magnet, a magnetic material such as alnico (Fe—A1-Ni—Co alloy) or ferrite is preferable because a parallel magnetic field strength in the above range can be obtained.

The curing treatment of the molding material is usually carried out by a heat treatment, depending on the material used. The specific heating temperature and heating time are appropriately set in consideration of the type of the polymer material and the like, the time required for the movement of the conductive particles, and the like.

[0119] According to the method described above, an anisotropic conductive sheet which does not need to be subjected to surface roughening treatment on the cured anisotropic conductive sheet itself can be manufactured in a simple process, and further, post-treatment is performed. This can avoid adverse effects on the anisotropic conductive sheet.

[0120] Also, using a non-magnetic material sheet having a roughened molding surface as a molding member! In addition, a magnetic field having a uniform strength can be applied to the molding material in the plane direction. In other words, since a magnetic field having a higher intensity than the position of the concave portion is not formed at the position of the convex portion of the roughened molding surface, the chain of conductive particles is selectively formed at the position of the convex portion. The chain of conductive particles that cannot be formed on the anisotropic conductive sheet is formed in a state of being dispersed in the surface direction of the anisotropic conductive sheet. Will be formed. Therefore, even when only the convex portions on the rough surface of the anisotropic conductive sheet are pressed, conductivity can be obtained in the thickness direction. Therefore, an anisotropic conductive sheet showing high conductivity with a small pressing force can be obtained. In addition, by using a non-magnetic sheet such as a resin sheet as a molding member, manufacturing costs can be reduced as compared with a case where an expensive molding member such as a mold is used.

[0121] (1c) Second anisotropic conductive sheet

As shown in FIG. 6, the second anisotropic conductive sheet 26 arranged on the relay pin unit 31 side of the pitch conversion board 23 has a large number of conductive particles 62 in an insulating elastic polymer material. Are formed of conductive path forming portions 72 arranged in the thickness direction and insulating portions 71 separating the conductive path forming portions 72 from each other. Thus, the conductive particles 62 are non-uniformly dispersed only in the conductive path forming portion 72 in the plane direction.

[0122] The thickness W of the conductive path forming portion 72 is preferably 0.1 to 2 mm, more preferably 0.2 to 1.5.

2

mm. If this thickness W is less than 0.1 mm, the absorption in the thickness direction

2

At the time of inspection with low capability, the absorption of the pressing force by the inspection jig is reduced, and the effect of alleviating the impact on the circuit board side connector 21 is reduced. Therefore, the deterioration of the first anisotropic conductive sheet 22 is suppressed, and as a result, the number of times of replacement of the first anisotropic conductive sheet 22 in the repeated inspection of the circuit board 1 to be inspected is increased! ] And the efficiency of the inspection is reduced. On the other hand, if the thickness W exceeds 2 mm, the electrical resistance in the thickness direction tends to increase,

2

Inspection can be difficult.

The thickness of the insulating portion 71 is preferably substantially the same as the thickness of the conductive path forming portion 72, and is preferably smaller than that. As shown in FIG. 6, the thickness of the insulating portion 71 is made smaller than the thickness of the conductive path forming portion 72 so that the conductive path forming portion 72 forms a protruding portion 73 protruding from the insulating portion 71. The conductive path forming part 72 is easily deformed by pressure in the direction and absorbs the pressing force. Since the capacity is increased, the pressure of the inspection jig can be absorbed at the time of inspection, and the impact of 21 to the connector on the circuit board side can be reduced.

When magnetic conductive particles are used for the conductive particles 62 constituting the second anisotropic conductive sheet 26, the number average particle diameter is preferably 5 to 200 μm, more preferably 5 to 150 μm. μm, more preferably 10-100 / zm. Here, the “number average particle size of the magnetic conductive particles” refers to a value measured by a laser diffraction scattering method. When the number average particle diameter of the magnetic conductive particles is 5 μm or more, the pressurized deformation of the conductive path forming portion of the anisotropic conductive sheet becomes easy. When the magnetic conductive particles are oriented by a magnetic field orientation treatment in the manufacturing process, the orientation of the magnetic conductive particles is easy. When the number average particle diameter of the magnetic conductive particles is 200 m or less, the elasticity of the conductive path forming portion 72 of the anisotropic conductive sheet is good, and the pressure deformation becomes easy.

[0125] The thickness Wm of the conductive path forming portion 72 and the number average particle diameter D (μm) of the magnetic conductive particles

The ratio W ZD to 22 is preferably 1.1 to 10.

twenty two

If the ratio W ZD is less than 1.1, the magnetic conductive

twenty two

Since the diameter of the conductive particles is equal to or larger than the diameter, the elasticity of the conductive path forming portion 72 decreases, and the ability to absorb the pressing force in the thickness direction decreases. For this reason, the effect of alleviating the impact on the circuit board side connector 21 at the time of inspection is reduced, so that the deterioration of the first anisotropic conductive sheet 22 is suppressed. At the time of repeated inspection, the number of times of replacement of the first anisotropic conductive sheet 22 increases!], And the efficiency of the inspection tends to decrease.

[0126] On the other hand, when the ratio W ZD exceeds 10, a large number of conductive particles are formed in the conductive path forming portion 72.

twenty two

Since the chains are arranged to form a chain, and a large number of contact points between the conductive particles are present, the electrical resistance value tends to increase.

The elastic polymer substance as the base material of the conductive path forming section 72 preferably has a durometer hardness of 15 to 60, more preferably 20 to 50, still more preferably 25 to 25 as measured by a type A durometer. — 45.

[0127] If the durometer hardness of the elastic polymer material is smaller than 15, the sheet shape changes early due to the large permanent strain that occurs when the sheet is compressed and deformed when pressed in the thickness direction. It tends to be difficult to make electrical connection during inspection. If the durometer hardness of the elastic polymer material is greater than 60, the deformation force when pressed in the thickness direction is reduced, and the ability to absorb the pressing force in the thickness direction is reduced. For this reason, it is difficult to suppress the deterioration of the first anisotropic conductive sheet 22, and as a result, the number of times of replacement of the first anisotropic conductive sheet 22 increases during the repeated inspection of the circuit board 1 to be inspected. As a result, the efficiency of inspection tends to decrease.

[0128] The elastic polymer material serving as the base material of the conductive path forming portion 72 is not particularly limited as long as it exhibits the above durometer hardness, but from the viewpoint of processability and electrical characteristics, silicone rubber is preferably used. Is preferred,.

[0129] The insulating portion 71 of the second anisotropic conductive sheet 26 is formed of an insulating material that does not substantially contain conductive particles. As the insulating material, for example, an insulating polymer material, an inorganic material, a metal material whose surface has been subjected to insulating treatment, and the like can be used, and the same material as the elastic polymer used for the conductive path forming portion can be used. It is easy to produce when used. When an elastic polymer material is used as a material for the insulating portion, it is preferable to use one having a durometer hardness within the above range.

[0130] As the magnetic conductive particles, the magnetic conductive particles used in the first anisotropic conductive sheet 22 described above can be used.

The second anisotropic conductive sheet 26 can be manufactured, for example, by a method according to the method shown in FIGS. First, the entire shape is substantially flat, and the upper and lower dies correspond to each other.A magnetic field acts on the material layer filled in the molding space between the upper and lower dies. Meanwhile, an anisotropic conductive sheet molding die having a configuration capable of heating and curing the material layer is prepared.

[0131] In this anisotropic conductive sheet molding die, in order to form a conductive portion at an appropriate position by applying a magnetic field to the material layer, both the upper die and the lower die are made of iron, On a substrate made of a ferromagnetic material such as nickel, a ferromagnetic portion made of iron, nickel, or the like for generating an intensity distribution in a magnetic field in a mold, and a nonmagnetic metal made of a nonmagnetic metal such as copper or resin. The structure has a mosaic-like layer in which magnetic parts are alternately arranged so as to be adjacent to each other, and the ferromagnetic parts are arranged according to a pattern corresponding to a pattern of a conductive path forming part to be formed. Have been. [0132] Here, the molding surface of the upper die is flat, and the molding surface of the lower die has slight irregularities corresponding to the conductive path forming portions of the anisotropic conductive sheet to be formed.

A molding material containing conductive particles exhibiting magnetism in a polymer material that is cured to become an elastic polymer material is injected into the molding space of the anisotropic conductive sheet molding die, thereby forming a molding material layer. To form

[0133] Next, a magnetic field having an intensity distribution in the surface direction is applied to the formed molding material layer by using the ferromagnetic portion and the nonmagnetic portion in each of the upper mold and the lower mold. By the action of the magnetic force, the conductive particles are gathered between the ferromagnetic part in the upper die and the ferromagnetic part in the lower die located immediately below, so that the conductive particles are arranged in the thickness direction. Orientation. Then, by curing the molding material layer in that state, an anisotropic conductive sheet having a configuration in which the plurality of columnar conductive path forming portions are insulated from each other by the insulating portion is manufactured.

[0134] (2) Relay pin unit

As shown in FIGS. 1 and 2, the relay pin units 31a and 31b are provided with a large number of conductive pins 32a and 32b provided at a predetermined pitch in parallel so as to face up and down. In addition, the relay pin units 31a and 31b are provided at both ends of the conductive pins 32a and 32b, and the insulating plates 34a and 31b are disposed on the side of the circuit board under test 1 that supports the conductive pins 32a and 32b. 34b, and two (a pair of) insulating plates, that is, insulating plates 35a and 35b arranged on the side opposite to the circuit board 1 to be inspected.

[0135] For example, as shown in FIG. 13, the conductive pin 32 also has a central portion 82 having a large diameter and ends la and 8 lb having a smaller diameter.

The pair of insulating plates 34 and 35 have through holes 83 into which the ends 81a and 81b of the conductive pins 32 are inserted. Then, the diameter of the through hole 83 is formed to be larger than the diameter of the end portion 81 of the conductive pin 32 and smaller than the diameter of the central portion 82, whereby the conductive pin 32 is held so as not to fall off. RU

[0136] The two insulating plates 34 and 35 are fixed by the support pins 33 so that their interval is longer than the length of the central portion 82 of the conductive pins 32, so that the conductive pins 32 can move up and down. Is held. The length of the end portion 81 of the conductive pin 32 is formed to be longer than the thickness of the insulating plates 34, 35, so that the conductive pin 32 projects at least one force of the insulating plates 34, 35. I'm wearing

[0137] The relay pin unit has a large number of conductive pins with a constant pitch, for example, 2.54mm, 1.8mm, 1.27mm, 1.06mm, 0.8mm, 0.5mm, 0.5mm, 0.45mm , 0.3 mm and 7 mm are arranged on grid points with a pitch of 0.2 mm.

By making the arrangement pitch of the conductive pins 32 of the relay pin unit 31 and the arrangement pitch of the terminal electrodes 24 provided on the pitch conversion board 23 the same, the pitch conversion board 23 is connected to the tester via the conductive pins 32. Side to be electrically connected.

[0138] The distance between insulating plate 34 and insulating plate 35 is not particularly limited, but is desirably 20 mm or more, preferably 40 mm or more. In addition, the thickness of each of the insulating plate 34 and the insulating plate 35 is appropriately selected according to the type of a material constituting the insulating plate 34 and the insulating plate 35, and is preferably, for example, 110 mm.

[0139] Specific examples of the material of the insulating plate 34, 35, resistivity 1 X ¹⁰ 10 Ω 'cm or more insulating materials, such as polyimide榭脂, polyester榭脂, polyamides榭脂, phenol榭脂, polyacetal Resin, polybutylene terephthalate resin, polyethylene terephthalate resin, syndiotactic polystyrene resin, polyphenylene sulfide resin, polyether ethyl ketone resin, fluorine resin, polyether-tolyl resin, polyether sulfo Resin materials with high mechanical strength such as resin, polyarylate resin, polyamideimide resin, glass fiber reinforced epoxy resin, glass fiber reinforced polyester resin, glass fiber reinforced polyimide resin, glass Glass fiber composite resin materials such as fiber reinforced phenol resin and glass fiber reinforced fluorine resin, carbon fiber Carbon fiber composite resin, epoxy such as strong epoxy resin, carbon fiber reinforced polyester resin, carbon fiber reinforced polyimide resin, carbon fiber reinforced phenol resin, carbon fiber reinforced fluorine resin, etc. Examples thereof include a composite resin material in which an inorganic material such as silica, alumina, and boron nitride is filled in a fat or phenol resin, or a composite resin material in which a mesh is included in an epoxy resin or a phenol resin. Further, a composite plate material formed by laminating a plurality of plate materials made of these materials may be used. [0140] (3) Tester side connector

The tester-side connectors 41a and 41b include third anisotropic conductive sheets 42a and 42b, connector boards 43a and 43b, and base plates 46a and 46b, as shown in FIGS. Puru. As the third anisotropic conductive sheets 42a and 42b, those similar to the above-described second anisotropic conductive sheet 26 are used, and as shown in FIG. A conductive path forming portion formed by arranging the conductive particles in the thickness direction, and an insulating portion separating the conductive path forming portions.

[0141] The connector substrates 43a and 43b are formed using an insulating substrate as a base material, and the pin-side electrodes 45a and 45b are formed on the surface of the connector substrate 43 on the side of the relay pin unit 31 as shown in FIGS. 1 and 2. . These pin Tsukuda J electrodes 45a and 45b have a constant pitch, f rows: 2.45mm, 1.8mm, 1.27mm, 1.Oomm, 0.8mm, 0.5mm, 0.5mm, 0.45mm, They are arranged on grid points with a constant pitch of 0. dmm to 7 and f to 0.2 mm, and the arrangement pitch is the same as the arrangement pitch of the conductive pins of the relay pin unit.

The pin-side electrodes 45a and 45b are electrically connected to the tester-side electrodes 44a and 44b by a wiring pattern formed on the surface of the insulating substrate and an internal wiring formed therein.

In the inspection apparatus of the present embodiment described above, as shown in FIG. 2, the electrodes 2 and 3 of the circuit board 1 to be inspected are the first anisotropic conductive sheets 22a and 22b, Outermost via conversion substrates 23a and 23b, second anisotropic conductive sheets 26a and 26b, conductive pins 32a and 32b, third anisotropic conductive sheets 42a and 42b, and connector boards 43a and 43b. By pressing the base plates 46a and 46b arranged on the tester with a specified pressure by the tester pressing mechanism, it is electrically connected to one tester (not shown), and the electric resistance between the electrodes of the circuit board 1 to be measured is measured. Electrical inspection such as is performed.

The pressure for pressing the circuit board 1 to be inspected by the upper first inspection jig 11a and the lower second inspection jig lib is, for example, 100 to 250 kgf.

FIG. 14 is a cross-sectional view showing another embodiment of the inspection apparatus of the present invention, FIG. 15 is a cross-sectional view showing a stacked state of the inspection apparatus of FIG. 14 at the time of inspection, and FIG. FIG. 17 shows the surface of the conversion board on the side of the circuit board to be inspected. FIG. Note that components corresponding to the components in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

The configuration of the inspection apparatus of this embodiment is basically the same as that of the above-described embodiment, but is more suitable for performing current measurement and voltage measurement on the electrode to be inspected. Specifically, as shown in FIG. 16, FIG. 18, and FIG. 19, the pitch conversion substrates 23a and 23b, the current terminal electrodes 27a and 27b, and the voltage terminal electrodes 28a and 28b The connection electrodes 25a, 25b are arranged, and the current pin side electrodes 47a, 47b and the voltage pin side electrodes 48a, 48b are arranged on the connector boards 43a, 43b.

The connection electrode 25a of the pitch conversion board 23a is electrically connected to the pair of current terminal electrodes 27a and the voltage terminal electrodes 28a with respect to each of the electrodes 2 to be inspected of the circuit board 1 to be inspected. They are arranged to connect. The connection electrodes 25b of the pitch conversion board 23b are arranged so that a pair of current terminal electrodes 27b and voltage terminal electrodes 28b are electrically connected to each of the electrodes 3 to be inspected of the circuit board 1 to be inspected. Being done.

[0146] The current pin-side electrode 47a of the connector board 43a is arranged so as to be electrically connected to the current terminal electrode 27a of the pitch conversion board 23a, and the voltage pin-side electrode 48a is connected to the pitch conversion board. It is arranged so as to be electrically connected to the voltage terminal electrode 28a of the substrate 23a. The current pin electrode 47b of the connector board 43b is arranged so as to be electrically connected to the current terminal electrode 27b of the pitch conversion board 23b, and the voltage pin electrode 48b is connected to the pitch conversion board 23b. It is arranged so as to be electrically connected to the voltage terminal electrode 28b.

[0147] On one surface of the pitch conversion board 23, that is, on the side of the circuit board 1 to be inspected, as shown in FIG. 16, the electrode 2 to be inspected (electrode 3 to be inspected) of the circuit board 1 to be inspected is provided. A plurality of connection electrodes 25 that are electrically connected are formed. These connection electrodes 25 are arranged so as to correspond to the pattern of the electrode 2 to be inspected (the electrode 3 to be inspected) of the circuit board 1 to be inspected.

Further, as shown in FIGS. 16, 18, and 19, the connection electrode 25 is connected to a pair of mutual electrodes with respect to the electrode 2 to be inspected (the electrode 3 to be inspected) of the circuit board 1 to be inspected. It comprises a current terminal electrode 27 and a voltage terminal electrode 28 separated by a predetermined distance.

The shapes of the current terminal electrode 27 and the voltage terminal electrode 28 can be various shapes such as a rectangular shape, a circular shape, and a triangular shape. Also, these pair of current terminal electrodes 27 and the voltage It is desirable that the area occupied by the terminal electrodes 28 be arranged in substantially the same area as the area occupied by the electrodes 2 to be inspected (electrodes 3 to be inspected) of the circuit board 1 to be inspected, in order to reduce measurement errors. No.

[0149] In the pitch conversion substrate 23, the distance between the current terminal electrode 27 and the voltage terminal electrode 28 is preferably 10 m or more. If the separation distance is smaller than 10 m, the current flowing between the current terminal electrode 27 and the voltage terminal electrode 28 via the first anisotropic conductive sheets 22a and 22b becomes large, so that high accuracy is achieved. In some cases, it may be difficult to measure the electrical resistance, and it may not be possible to perform an accurate electrical characteristic test.

On the other hand, the upper limit of the separation distance between the current terminal electrode 27 and the voltage terminal electrode 28 depends on the dimensions and pitch of the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected, and the current terminal. It is determined by the dimensions of the electrode 27 and the voltage terminal electrode 28 and is not particularly limited, but is usually 500 m or less. If this separation distance is too large, both the current terminal electrode 27 and the voltage terminal electrode 28 should be properly connected to the electrode 2 to be inspected (electrode 3 to be inspected) of the circuit board 1 to be inspected having a small size. It becomes difficult to arrange.

On the other hand, on the other surface of the pitch conversion board 23, that is, on the side opposite to the circuit board 1 to be inspected, as shown in FIG. 17, the conductive pins 32 of the relay pin unit 31 are electrically connected. A plurality of terminal electrodes 24 are formed. These terminal electrodes 24 have, for example, a pitch of 2.54 mm, 1.8 mm, 1.27 mm, top.06 mm, 0.8 mm, 0.omm, 0.omm, 0.45 mm, 0.3 mm or 0.3 mm. The relay pins are arranged on grid points having a constant pitch of 2 mm, and the pitch is the same as the arrangement pitch of the conductive pins 32 of the relay pin unit 31.

As shown in FIG. 18, each connection electrode 25 in FIG. 16, that is, the current terminal electrode 27 and the voltage terminal electrode 28 penetrate in the thickness direction of the separate wiring 52 and the insulating substrate 51, respectively. The internal wiring 53 is electrically connected to the corresponding terminal electrode 24 of FIG.

On the other hand, on the connector board 43 of the tester-side connector 41, a pin-side electrode 45 is formed on the surface of the connector board 43 on the side of the relay pin unit 31, as shown in FIG. 14, FIG. 15, and FIG. These pin-side electrodes 45 are connected to the connection electrodes 25 of the pitch conversion substrate 23, as shown in FIG. In other words, the current pin electrode 27 and the voltage pin electrode 48 are configured so as to be electrically connected to the current terminal electrode 27 and the voltage terminal electrode 28, respectively. It is arranged at a position corresponding to the conductive pin 32.

In this case, these pin-side electrodes 45 are arranged at a constant pitch, for example, 2.54 mm, 1.8 mm, 1.2 / mm, 1. Oomm, 0.8 mm, 0.5 mm, 0.5 mm, 0 mm They are arranged on grid points having a constant pitch of 45 mm, 7 mm or 0.2 mm, and 0.2 mm, and the arrangement pitch is the same as the arrangement pitch of the conductive pins 32 of the relay pin cut 31.

Each pin-side electrode 45 is electrically connected to the tester-side electrode 44 by a wiring pattern formed on the surface of the insulating substrate and an internal wiring formed therein.

In this embodiment, the shape of the pin-side electrode 45 is not limited to the pin shape, and various modifications are possible, such as a flat electrode. is there.

In the inspection apparatus 10 of the present embodiment configured as described above, as shown in FIG. 14, the electrodes 2 and 3 of the circuit board 1 to be inspected are the first anisotropic conductive sheets 22a and 22b, Substrates 23a and 23b, second anisotropic conductive sheets 26a and 26b, conductive pins 32a and 32b, third anisotropic conductive sheets 42a and 42b, and connector boards 43a and 43b. The base plates 46a and 46b are pressed by a tester's pressing mechanism at a specified pressure to be electrically connected to a tester (not shown), thereby measuring electrical resistance between electrodes of the circuit board 1 to be inspected. An electrical test is performed.

In this case, as shown in FIG. 19, the electrode 2 to be inspected (electrode 3 to be inspected) of the circuit board 1 to be inspected is subjected to pitch conversion via the first anisotropic conductive sheet 22. A pair of current terminal electrodes 27 and voltage terminal electrodes 28 on the circuit under test substrate 1 side of the substrate 23 are electrically connected.

Then, from the pair of current terminal electrodes 27 and voltage terminal electrodes 28 on the side of the circuit board under test 1 of the pitch conversion board 23, the terminal electrodes 24 of the pitch conversion board 23 on the side opposite to the circuit board 1 under test, Through the second anisotropic conductive sheet 26, the conductive pins 32 of the relay pin unit 31, and the third anisotropic conductive sheet 42, the current terminal electrodes 27 of the pitch conversion board 23 So that the voltage terminal electrode 28 of the pitch conversion board 23 is electrically connected to the voltage terminal electrode 48 of the connector board 43, while being electrically connected to the current pin side electrode 47 of the connector board 43. Has become.

As a result, as shown in FIG. 19, the electrodes 2 and 3 to be inspected of the circuit board 1 to be inspected are connected via the current terminal electrodes 27a and 27b of the pitch conversion boards 23a and 23b. Thus, the current measurement path I is configured.On the other hand, the voltage terminal electrodes 28a and 28b of the pitch conversion boards 23a and 23b are connected to the electrodes 2 and 3 of the circuit board 1 to be inspected. Thus, the voltage measurement path V is configured.

Accordingly, a voltage is applied to the voltage measurement path V to each of the electrodes 2 and 3 of the circuit board 1 to be inspected via the voltage terminal electrodes 28a and 28b of the pitch conversion boards 23a and 23b. While the voltage is being applied, the current flows through each of the electrodes 2 and 3 of the circuit board 1 to be inspected via the current measuring path I through the current terminal electrodes 27a and 27b of the pitch conversion boards 23 and 23b. By measuring the current, it is possible to perform a test for confirming the electrical characteristics of the circuit pattern under test 1 based on whether or not the wiring pattern has a predetermined performance.

[0159] Conversely, a current is applied to the current measurement path I to the electrodes 2 and 3 of the circuit board 1 to be inspected via the current terminal electrodes 27a and 27b of the pitch conversion boards 23a and 23b. While supplying, the voltage is measured for each of the electrodes 2 and 3 of the circuit board 1 to be inspected by the voltage measurement path V via the voltage terminal electrodes 28a and 28b of the pitch conversion boards 23a and 23b. Thus, it is possible to perform a confirmation test of the electrical characteristics based on whether the wiring pattern of the circuit board under test 1 has a predetermined performance.

As described above, it is possible to separately measure the voltage and the current for each of the electrodes 2 and 3 of the circuit board 1 to be inspected through the separate voltage measurement path V and the current measurement path I. It is possible to conduct an accurate confirmation test on the electrical characteristics of whether or not the wiring pattern of the inspection circuit board has a predetermined performance, and the verification test should be performed in a short time. Can be.

In addition, since the voltage can be measured while supplying a current to the circuit to be inspected on the circuit to be inspected 1, the circuit to be inspected can be measured at a setting voltage lower than the setting voltage for determining whether the conduction resistance is good or not in the conventional inspection apparatus. Measure the conduction resistance of the circuit under test on board 1 stably. You can do it.

[0161] That is, the power required to judge the quality of a circuit at a low set voltage as a requirement for high-precision inspection. According to the inspection apparatus of the present embodiment, a circuit board to be inspected having a potential electrical defect can be removed. Since it can be judged and removed as a defective product with a high probability, it is possible to conduct a highly reliable circuit board confirmation test.

Note that the electrodes 2 and 3 to be inspected of the circuit board 1 to be inspected are subjected to voltage measurement using, for example, a constant voltage device via the voltage terminal electrodes 28a and 28b of the pitch conversion substrates 23a and 23b. While applying a constant voltage to the path V, a current is supplied to the current measurement path I via the current terminal electrodes 27a and 27b of the pitch conversion boards 23a and 23b, and each test target circuit board 1 is tested. By measuring the current from the electrodes 2 and 3 with an ammeter, a test for confirming electrical characteristics as to whether or not the wiring pattern of the circuit board 1 to be inspected has predetermined performance is performed.

FIG. 20 is a cross-sectional view showing another embodiment of the circuit board inspection apparatus of the present invention, and FIG. 21 is a cross-sectional view showing a stacked state at the time of inspection of the inspection apparatus of FIG. Note that components corresponding to the components in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

The configuration of the inspection apparatus of this embodiment is basically the same as that of the above-described embodiment, except that the relay pin unit is more stable with respect to the electrode to be inspected of the circuit board to be inspected having a height variation. The structure is such that a secure electrical contact can be ensured.

As shown in FIG. 20, FIG. 21, and FIG. 22, the relay pin unit 31 according to the present embodiment includes a large number of conductive pins 32a, It has 3 2b. The relay pin units 31 are provided on both ends of the conductive pins 32a and 32b, and are disposed on the side of the circuit board under test 1 that supports the conductive pins 32a and 32b. And two insulating plates, second insulating plates 35a and 35b, disposed on the side opposite to the circuit board 1 to be inspected.

As shown in FIG. 22, for example, the conductive pin 32 is provided with a central portion 82 having a large diameter, and end portions 8 la and 8 lb having a smaller diameter than the central portion 82 and a force S.

The first insulating plate 34 and the second insulating plate 35 have through-holes into which the ends 81 of the conductive pins 32 are inserted. A hole 83 is formed. Then, the diameter of the through hole 83 is formed to be larger than the diameter of the end portion 81 of the conductive pin 32 and smaller than the diameter of the central portion 82, so that the conductive pin 32 is held so as not to fall off! RU

The distance between the first insulating plate 34 and the second insulating plate 35 is longer than the length of the central portion 82 of the conductive pin 32 by the first support pin 33 and the second support pin 37. Thus, the conductive pin 32 is held so as to move up and down.

The ends 81a and 81b of the conductive pins 32 are formed to be longer than the thicknesses of the insulating plates 34 and 35, whereby the conductive pins 32 protrude at least one of the forces of the insulating plates 34 and 35. It has become.

[0166] The relay pin unit has a large number of conductive pin forces at a constant pitch, for example, 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.5 mm, 0.5 mm, 0.45 mm , 0.3 mm and 7 mm are arranged on grid points with a pitch of 0.2 mm.

As shown in FIG. 20 to FIG. 22, the relay pin unit 31 has a space between the first insulating plates 34a and 34b and the second insulating plates 35a and 35b, Plates 36a and 36b are arranged. And, between the first insulating plates 34a, 34b and the intermediate holding plates 36a, 36b, first supporting pins 33a, 33b are arranged, whereby the first insulating plates 34a, 34b and The space between the intermediate holding plates 36a and 36b is fixed.

Similarly, between the second insulating plates 35a, 35b and the intermediate holding plates 36a, 36b, second supporting pins 37a, 37b are arranged, whereby the second insulating plates 35a, 35b are provided. And the intermediate holding plates 36a, 36b.

[0168] In this case, the material of the first support pin 33 and the second support pin 37 is not particularly limited, and is, for example, a metal such as brass or stainless steel.

The distance between the first insulating plate 34 and the intermediate holding plate 36 and the distance between the second insulating plate 35 and the intermediate holding plate 36 are not particularly limited, but will be described later. As a result, the circuit board under test is formed by the elasticity of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35. In consideration of the absorption of height variations of the electrodes 2 and 3 to be inspected on the plate 1, it is preferably 2 mm or more, more preferably 2.5 mm or more.

Then, as shown in FIG. 23, a first contact supporting position 38 A of the first support pin 33 with respect to the intermediate holding plate 36 and a second contacting position 38 A of the second support pin 37 with respect to the intermediate holding plate 36. The contact support position 38B is located at a different position on the intermediate holding plate projection plane A where the inspection apparatus is projected in the thickness direction of the intermediate holding plate 36 (in the direction from the upper side to the lower side in FIG. 20). ing.

In this case, the different positions are not particularly limited, but the first contact support position 38A and the second contact support position 38B are, as shown in FIG. Preferably, it is formed on the lattice and on the surface A.

[0170] Specifically, as shown in FIG. 23, on the intermediate holding plate projection plane A, one unit grid region R1 including four adjacent first contact support positions 38A is provided with one second The second contact support position 38B is arranged. Further, on the intermediate holding plate projection plane A, one first contact support position 38A is arranged in a unit lattice region R2 composed of four adjacent second contact support positions 38B. Have been. In FIG. 23, the first contact support position 38A is indicated by a black circle, and the second contact support position 38B is indicated by a white circle.

In the present embodiment, one second contact support position 38B is disposed at the center of the diagonal line Q1 of the unit lattice region R1 of the first contact support position 38A, and the second contact support position 38B Force at which one first contact support position 38A is arranged at the center of the diagonal Q2 of the unit lattice region R2 of the contact support position 38B.The relative positions of these are not particularly limited. It is sufficient that the inspection device is arranged at a different position on the intermediate holding plate projection plane A where the inspection device is projected in the thickness direction of the intermediate holding plate. In other words, if they are not arranged in a lattice, they are not restricted by such a relative positional relationship. As described above, the inspection device 10 projects the intermediate holding plate projection surface A in the thickness direction of the intermediate holding plate.ぉ on the top, are located in different locations! You only have to do it.

[0172] In this case, the distance between the first contact support positions 38A and the distance between the second contact support positions 38B that are adjacent to each other are not particularly limited. — 100 mm, more preferably 12-70 mm, particularly preferably 15-50 mm. As the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35, those having flexibility are used. The degree of flexibility required for the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 depends on both ends of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35. Are placed horizontally at a distance of 10 cm from each other, and the radial force generated by applying a pressure of 50 kgf from above is 0.02% or less of the width of these insulating plates and It is preferable that destruction and permanent deformation do not occur even by pressurizing at a pressure of from 200 kgf to 200 kgf.

[0173] As a specific material of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35, the same material as the insulating plate of the relay pin unit in the above-described embodiment can be used. for example, resistivity 1 X 1Ο ¹⁰ Ω 'cm or more insulating materials are preferred.

The thickness of each of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 depends on the type of the material forming the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35. The force is selected as appropriate, and is preferably 11 to 10 mm.

In the inspection apparatus of the present embodiment configured as described above, as shown in FIG. 21, the electrodes 2 and 3 of the circuit board 1 to be inspected are the first anisotropic conductive sheets 22a and 22b. Through the pitch conversion boards 23a and 23b, the second anisotropic conductive sheets 26a and 26b, the conductive pins 32a and 32b, the third anisotropic conductive sheets 42a and 42b, and the connector boards 43a and 43b. The base plates 46a and 46b arranged on the outside are electrically connected to a tester (not shown) by pressing the base plates 46a and 46b with a predetermined pressure by a pressing mechanism of the tester. An electrical test such as resistance measurement is performed. Hereinafter, while referring to FIGS. 24 to 27 (only the second inspection jig lib is shown for convenience), the inspection is performed between the first inspection jig 11a and the second inspection jig lib. The pressure absorbing action and the pressure dispersing action when both sides of the circuit board 1 are pressed will be described.

When the electrical inspection is performed by pressing both surfaces of the circuit board 1 to be inspected between the first inspection jig 11a and the second inspection jig l ib, the state force shown in FIG. In the initial stage when the components are stacked and pressurization is started (Fig. 25), the movement of the conductive pins 32b of the relay pin unit 31b, the first anisotropic conductive sheet 22b, and the second anisotropic conductive sheet 22b The pressure is absorbed by the rubber elastic compression of the conductive sheet 26b and the third anisotropic conductive sheet 42b, and the electrodes to be inspected of the circuit board 1 to be inspected. Can be absorbed to some extent.

[0176] Then, the first contact support position 38A of the first support pin 33b with respect to the intermediate holding plate 36b and the second contact support position 38B of the second support pin 37b with the intermediate holding plate 36b are: Since the intermediate holding plate 36b is arranged at a different position on the intermediate holding plate projection plane A projected in the thickness direction of the intermediate holding plate 36b, a force acts in the vertical direction as shown by the arrow in FIG. As shown in FIG. 27, when the circuit board 1 to be inspected is further pressurized between the first inspection jig 11a and the second inspection jig lib, the first In addition to the rubber elastic compression of the anisotropic conductive sheet 22b, the second anisotropic conductive sheet 26b, and the third anisotropic conductive sheet 42b, the first insulating plate 34b of the relay pin unit 31b, Due to the panel elasticity of the second insulating plate 35b and the intermediate holding plate 36b disposed between the first insulating plate 34b and the second insulating plate 35b, the circuit board 1 Variations in height of the test electrodes 3, for example, can be a solder ball electrodes with respect to height variation, by dispersing pressure concentration, to avoid local stress concentration.

[0177] That is, as shown in Figs. 26 and 27, the intermediate holding plate _36b is connected to the second supporting center _38a of the first support pin 33b with the intermediate holding plate 36b. While bending in the direction of the insulating plate 35b (see the portion E surrounded by the dashed line in FIG. 27), the second support pin 37b is held at the intermediate contact support position 38B with the intermediate holding plate 36b. The plate 36b is bent in the direction of the first insulating plate 34b (see a portion D surrounded by a dashed line in FIG. 27). Hereinafter, in the present specification, the “radius” and the “radial direction” refer to the radius of the intermediate holding plate 36 protruding in a direction in which the intermediate holding plate 36 becomes convex, and the protruding direction thereof.

[0178] As described above, since the intermediate holding plate 36b is deflected in opposite directions about the first contact support position 38A and the second contact support position 38B, the first inspection jig is provided. When the circuit board 1 to be inspected is further pressurized between 11a and the second inspection jig lib, the panel elasticity of the intermediate holding plate 36b is further exerted.

Further, as shown by a portion B surrounded by a dashed line in FIG. 27, the height of the conductive pin 32b is absorbed by the compression of the protrusion of the conductive path forming portion of the second anisotropic conductive sheet 26b. Is applied to the first insulating plate 34b, which cannot be absorbed by the compression of the protruding portion.As a result, as shown by the portion C surrounded by the dashed line in FIG. Plate 34b and the second The second insulating plate 35b also deflects in a direction opposite to each other to some extent at the contact position with the first support pin 33b and the second support pin 37b, so that the first inspection jig 11a and the second When the circuit board 1 to be inspected is further pressed between the inspection jigs 11b, the panel elasticity of the first insulating plate 34b and the second insulating plate 35b is further exerted. .

[0179] As a result, stable electrical contact is ensured with each of the electrodes to be inspected of the inspected circuit board 1 having variations in height, and stress concentration is further reduced. Local breakage of the sheet is suppressed. As a result, the durability of repeated use of the anisotropic conductive sheet is improved, so that the number of times of replacement of the anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

FIG. 28 is a cross-sectional view similar to FIG. 24 showing another embodiment of the inspection apparatus of the present invention (only the second inspection jig is shown for convenience), and FIG. It is an expanded sectional view of a unit. Note that components corresponding to the components in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0181] In the inspection device of the present embodiment, a plurality of (three in this embodiment) intermediate holding plates 36b are arranged between the first insulating plate 34b and the second insulating plate 35b with a predetermined interval therebetween. At the same time, holding plate support pins 39b are arranged between the adjacent intermediate holding plates 36b.

In this case, in at least one intermediate holding plate 36b, a contact supporting position of the holding plate support pin 39b that also contacts the one-side force against the intermediate holding plate 36b with the intermediate holding plate 36b, The contact support position of the first support pin 33b, the second support pin 37b, or the holding plate support pin 39b against the intermediate holding plate 36b, on which the other surface side abuts, is in the thickness direction of the intermediate holding plate 36b. It is necessary to be arranged at different positions on the projection plane of the intermediate holding plate projected on the surface.

[0183] Most preferably, in all the intermediate holding plates 36b, the holding plate support pins 39b that are in one-side contact with the intermediate holding plate 36b are in contact with the intermediate holding plate 36b. The contact support position of the first support pin 33b, the second support pin 37b, or the holding plate support pin 39b against the intermediate holding plate 36b in the thickness direction of the intermediate holding plate 36b. The projected intermediate holding plate is located at a different position on the projection plane. The

[0184] In the present embodiment, in the upper intermediate holding plate 36b of the three intermediate holding plates 36b, the holding plate support pins 39b that also come into contact with the one-side force against the intermediate holding plate 36b abut on the intermediate holding plate 36b. The support position 39A and the contact support position 38A of the first support pin 33b, which also abuts the other surface side force on the intermediate holding plate 36b, against the intermediate holding plate 36b are projected in the thickness direction of the intermediate holding plate 36b. It is arranged at a different position from the projection surface of the intermediate holding plate.

In the middle intermediate holding plate 36b of the three intermediate holding plates 36b, the holding support positions 39A of the holding plate support pins 39b abutting against the intermediate holding plate 36b from one side with respect to the intermediate holding plate 36b. And the supporting position 39A of the holding plate support pin 39b against the intermediate holding plate 36b, which also contacts the other surface side force against the intermediate holding plate 36b, projected in the thickness direction of the intermediate holding plate 36b. It is located at a different position from the surface.

[0186] Also, in the lower intermediate holding plate 36b of the three intermediate holding plates 36b, the contact supporting position of the holding plate support pin 39b that contacts the intermediate holding plate 36b from one side with respect to the intermediate holding plate 36b. The intermediate support projected on the intermediate support plate 36b in the thickness direction of the intermediate support plate 36b with the contact support position 38B of the second support pin 37b that abuts the intermediate support plate 36b from the other side with respect to the intermediate support plate 36b. They are arranged at different positions on the plate projection plane.

[0187] With this configuration, the plurality of intermediate holding plates 36b further exerts the spring property, and the height variation of the electrode 3 to be inspected of the circuit board 1 to be inspected is reduced. By dispersing the pressure concentration, the local stress concentration can be further avoided, the local damage of the first anisotropic conductive sheet 22b is suppressed, and as a result, the first anisotropic conductive sheet Since the durability of repeated use of 22b is improved, the number of times of replacement of the first anisotropic conductive sheet 22b is reduced, and the inspection work efficiency is improved.

The number of the intermediate holding plates 36 is not particularly limited as long as it is plural.

In the above two embodiments in which the intermediate holding plate 36 is arranged, as shown in FIGS. 20, 21, 24, 25, 27 and 28, the connector board in the tester side connector 41 is used. A support pin 49 may be arranged between 43 and the base plate 46. These support pins 49 have the same functions as the first support pins 33 and the second support pins 37 (the first support pins 33, the second support pins 37, and the holding plate support pins 39 in FIG. 28). And spread the surface pressure It is also possible to give the action to make it.

[0189] Although the two embodiments using the relay pin unit on which the intermediate holding plate is arranged have been described above, the inspection apparatus using the relay pin unit on which the intermediate holding plate is arranged is also described in FIGS. , That is, a configuration suitable for performing current measurement and voltage measurement on a circuit board to be inspected can be applied. FIG. 30 shows a partially enlarged cross-sectional view of such an inspection apparatus.

[0190] As shown in the figure, the circuit under test 2 on the circuit board 1 to be tested (electrode 3 under test) via the first anisotropic conductive sheet 22 with respect to the circuit under test 2 on the circuit under test 1 A pair of current terminal electrodes 27 and voltage terminal electrodes 28 on the substrate 1 side are electrically connected. Note that FIG. 30 shows the drawing with the support pins 33 and 37 omitted for convenience of explanation.

[0191] Then, a pair of terminals of the pitch conversion board 23 on the side opposite to the circuit board 1 to be inspected are obtained from a pair of the current terminal electrode 27 and the voltage terminal electrode 28 on the circuit board 1 to be inspected. Through the electrode 24, the second anisotropic conductive sheet 26, the conductive pin 32 of the relay pin unit 31, and the third anisotropic conductive sheet 42, the current terminal electrode 27 of the pitch conversion board 23 is connected to the connector. It is electrically connected to the current pin side electrode 47 of the board 43 and the voltage terminal electrode 28 of the pitch conversion board 23 is electrically connected to the voltage terminal electrode 48 of the connector board 43. It has become.

Thus, a current measurement path I is formed for each of the electrodes 2 and 3 of the circuit board 1 to be inspected via the current terminal electrodes 27a and 27b of the pitch conversion boards 23a and 23b. On the other hand, the voltage measurement path V is connected to each of the electrodes 2 and 3 of the circuit board 1 to be inspected via the voltage terminal electrodes 28a and 28b of the pitch conversion boards 23a and 23b. Will be composed.

Accordingly, a voltage is applied to the voltage measurement path V to each of the electrodes 2 and 3 of the circuit board 1 to be inspected via the voltage terminal electrodes 28a and 28b of the pitch conversion boards 23a and 23b. While the voltage is being applied, the current flows through each of the electrodes 2 and 3 of the circuit board 1 to be inspected via the current measuring path I through the current terminal electrodes 27a and 27b of the pitch conversion boards 23 and 23b. By measuring the current, it is possible to perform a test for confirming the electrical characteristics of the circuit pattern under test 1 based on whether or not the wiring pattern has a predetermined performance. [0194] Conversely, a current is applied to the current measurement path I to each of the electrodes 2 and 3 of the circuit board 1 to be inspected via the current terminal electrodes 27a and 27b of the pitch conversion boards 23a and 23b. While supplying, the voltage is measured for each of the electrodes 2 and 3 of the circuit board 1 to be inspected by the voltage measurement path V via the voltage terminal electrodes 28a and 28b of the pitch conversion boards 23a and 23b. Thus, it is possible to perform a confirmation test of the electrical characteristics based on whether the wiring pattern of the circuit board under test 1 has a predetermined performance.

[0195] Embodiments of the present invention have been described above. However, the present invention is not limited to these embodiments, and various modifications, changes, and modifications can be made without departing from the scope of the invention.

For example, the circuit substrate 1 to be inspected may be a semiconductor integrated circuit device such as a knock IC, MCM, or CSP, or a circuit device formed on a wafer, other than the printed circuit board. Further, the printed circuit board may be not only a double-sided printed circuit board but also a single-sided printed circuit board.

The first inspection jig 11a and the second inspection jig lib may be different as long as the materials used, the member structures, and the like do not necessarily need to be the same. Also, the first inspection jig 1 la and the second inspection jig 1 lb do not necessarily have to be arranged vertically. Further, the tester side connector may be configured by laminating a circuit board such as a connector board and a plurality of anisotropic conductive sheets.

[0196] Example

Hereinafter, the present invention will be described with reference to examples, but the present invention is not limited to these examples.

[Example 1]

(Evaluation circuit board)

An evaluation circuit board having the following specifications was prepared.

Dimensions: 100mm (length) X 100mm (width) X O. 8mm (thickness)

Number of electrodes to be inspected on the top side: 7312

Diameter of the electrode to be inspected on the top side: 0.3 mm

Minimum arrangement pitch of electrodes to be inspected on the top side: 0.4 mm Number of electrodes to be inspected on the lower side: 3784

Diameter of the electrode to be inspected on the bottom side: 0.3 mm

Minimum arrangement pitch of electrodes to be inspected on the lower surface side: 0.4 mm

A circuit board inspection device (Fig. 20) for inspecting the above-mentioned evaluation circuit board, which is compatible with the inspection section of the rail transport type circuit board automatic inspection machine (manufactured by Nidec-Read Corporation, product name: STARREC V5) did.

(1) First Anisotropic Conductive Sheet 22

The following first anisotropic conductive sheet was prepared in which conductive particles were arranged in the thickness direction and uniformly dispersed in the plane direction.

Dimensions: 110mm X I 10mm, thickness 0.1mm

Conductive particles: Material: nickel-plated nickel particles, average particle diameter: 20 m, content: 18% by volume

Elastic polymer material: Material; silicone rubber, hardness; 40

(2) Pitch Conversion Board 23

Numerically controlled drilling is performed on a laminated material (Matsushita Electric Works, product name: R-1766) in which a thin metal layer made of copper with a thickness of 18 m is formed on both sides of an insulating substrate made of glass fiber reinforced epoxy resin. The apparatus formed a total of 7312 circular through-holes each having a diameter of 0.2 mm penetrating in the thickness direction of the laminated material.

Next, a copper plating layer was formed on the inner wall of each through-hole by performing an electroless plating process on the laminated material in which the through-holes were formed using an EDTA-type copper plating solution. By performing electrolytic copper plating using a copper sulfate plating solution, a cylindrical via having a thickness of about 10 m is used to electrically connect the thin metal layers on the surface of the laminated material to each other in each through hole. A hole was formed.

[0200] Next, a 25 µm-thick dry film resist (manufactured by Tokyo Ohka, product name: FP-225) was laminated on the thin metal layer on the surface of the laminated material to form a resist layer. A protective seal was placed on the other side of the thin metal layer. A photomask film is placed on the resist layer, and the resist layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.) and then developed to obtain a resist pattern for etching. Was formed. Then, by etching the thin metal layer on the surface on which the resist pattern was formed, 7312 connection electrodes having a diameter of 200 m, and each connection electrode and via hole were electrically formed on the surface of the insulating substrate. A pattern wiring portion having a connecting line width of 100 μm was formed, and then the resist pattern was removed.

[0201] A 25 µm-thick dry film solder resist (manufactured by Hitachi Chemical, product name: SR-2300G) is laminated on the surface of the insulating substrate on which the connection electrodes and the pattern wiring section are formed to form an insulating layer. A photomask film is placed on the insulating layer, and the insulating layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), and then subjected to development processing. 7312 openings with a diameter of 200 m were formed to expose the electrodes. Using a copper sulphate plating solution, using the thin metal layer on the other side of the laminated material as a common electrode, and applying electrolytic copper plating to each connection electrode, 7312 protruding from the surface of the insulating layer Was formed.

[0202] Next, the protective seal on the thin metal layer on the other side of the laminated material was removed, and a 25 m thick dry film resist (manufactured by Tokyo Ohka, product name: FP — 225) was laminated to form a resist layer. After that, a photomask film is disposed on the resist layer, and the resist layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), and then subjected to a development treatment to obtain a laminated material. A resist pattern for etching was formed on the thin metal layer. Next, by performing an etching process, 7312 terminal electrodes and a pattern wiring portion for electrically connecting each terminal electrode to the via hole were formed on the back surface of the insulating substrate, and the resist pattern was removed.

[0203] Next, a 38 µm-thick dry film solder resist (-Tigo Morton, product name: ComfoMask 2015) was laminated on the back surface of the insulating substrate on which the terminal electrodes and the pattern wiring portions were formed. An insulating layer is formed, a photomask film is disposed on the insulating layer, and then the insulating layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.) and then developed. Then, 7312 openings of 0.4 mm in diameter were formed to expose the electrodes.

As described above, the pitch conversion substrate 23a for the first inspection jig 11a was manufactured. This pitch conversion substrate 23a has a vertical and horizontal dimension of 120 mm × 160 mm, a thickness of 0.5 mm, Surface of the insulation layer of the connection electrode The diameter of the exposed part is about 300 m, the height of the connection electrode protruding from the surface of the insulation layer is about 25 m, the minimum arrangement pitch of the connection electrodes is 0.4 mm, and the diameter of the terminal electrode is The arrangement pitch of the terminal electrodes was 0.4 mm, and the surface roughness of the insulating layer on the side where the connection electrodes were formed was 0.02 m.

[0204] Further, in the same manner as above, a pitch conversion substrate 23b for a second inspection jig lib having 3784 connection electrodes on the front surface and 3784 terminal electrodes on the back surface was produced. The pitch conversion substrate 23b has a vertical and horizontal dimension of 120 mm × 160 mm, a thickness of 0.5 mm, a diameter of a portion of the connection electrode exposed on the surface of the insulating layer is about 300 / ζπι, and a surface force of the insulating layer on the connection electrode. The projecting height is about 25 m, the minimum arrangement pitch of the connection electrodes is 0.4 mm, the diameter of the terminal electrodes is 0.4 mm, the arrangement pitch of the terminal electrodes is 0.75 mm, and the surface (the connection electrodes are formed) The surface roughness of the insulating layer on the (face) side is 0.02 m.

(3) Circuit board side connector 21

The first anisotropic conductive sheet 22 is disposed on the front side of the pitch conversion substrate 23, and on the back side, a large number of conductive path forming portions extending in the thickness direction and insulating portions for insulating these from each other. The circuit board side connector 21 was formed by disposing a second anisotropic conductive sheet 26 made of an unevenly distributed anisotropic conductive sheet having a conductive path forming portion protruding on one surface. The second anisotropic conductive sheet 26 disposed between the pitch conversion board 23 and the relay pin unit 31 has the shape shown in FIG. 6, and specifically has the following configuration. used.

[Second anisotropic conductive sheet 26]

Dimensions: 11 Omm X 150mm

Thickness of conductive path forming part: 0.6mm

Outer diameter of conductive path forming part: 0.35mm

Projection height of conductive path forming part: 0.05 mm

Conductive particles: Material: nickel-plated nickel particles, average particle size; 35; ζ ΐη, content of conductive particles in conductive path forming portion; 30% by volume

Elastic polymer material: Material; silicone rubber, hardness; 30

(W / Ό = 17) [0206] (4) Medium ϋ pin unit 31

The first insulating plate 34, the intermediate holding plate 36, as the material of the second insulating plate 35, resistivity IX 1Ο ¹⁰ Ω 'cm or more insulating material, made of glass fiber-reinforced epoxy榭脂, its thickness 1. A 9mm one was used.

Then, the distance L1 between the first insulating plate 34 and the intermediate holding plate 36 is 36.3 mm, and the distance L2 between the second insulating plate 35 and the intermediate holding plate 36 is 3 mm. The first support pin 33 (diameter 2 mm, length 36.3 mm) and the second support pin 37 (diameter 2 mm, length 3 mm) are fixed and supported, and the first insulating plate 34 and the The conductive pin 32 having the following constitutional force was arranged between the insulating plate 35 and the through-hole 83 (0.4 mm in diameter) so as to be movable.

[Conductive pin]

Material: Brass with gold plating

Tip 81a dimensions: 0.35mm outer diameter, 2.lmm overall length

Dimensions of central part 82: outer diameter 0.45mm, total length 41mm

Base end 8 lb dimensions: 0.35 mm outer diameter, 2.lmm overall length

FIG. 23 shows a first contact support position 38A of the first support pin 33 with respect to the intermediate holding plate 36 and a second contact support position 38B of the second support pin 37 with the intermediate holding plate 36. As shown in FIG. The distance between the adjacent first contact support positions 38A and the distance between the second contact support positions 38B were 17.5 mm.

[0207] (5) Tester side connector 41

As shown in FIG. 20, the tester side connector 41 was composed of a third anisotropic conductive sheet 42, a connector board 43, and a base plate 46. The third anisotropic conductive sheet 42 used was the same as the second anisotropic conductive sheet 26 described above.

[Performance test]

1. Measurement of minimum press pressure

The fabricated inspection device is set in the inspection section of the rSTARREC V5J rail transfer type circuit board automatic inspection machine, and the evaluation circuit board 1 is set in the inspection device, and the rail transfer type circuit board automatic inspection machine “STARREC V5J Press pressure within the range of 100-210kgf And stepwisely change the resistance value when a current of 1 mA is applied to the electrode under test of the circuit board for evaluation 1, 10 times for each press pressure condition. did.

[0209] Inspection points having a measured conduction resistance value of 100 Ω or more (hereinafter, referred to as "NG inspection points") are determined to have poor conduction, and the percentage of NG inspection points in the total inspection points (hereinafter, "NG inspection points"). Inspection point ratio ”) was calculated, and the lowest press pressure at which the NG inspection point ratio was 0.01% or less was determined as the lowest press pressure.

In the measurement of the conduction resistance value, after the measurement of one conduction resistance value is completed, the press pressure related to the measurement is released to return the inspection device to a non-pressurized state, and the next measurement of the conduction resistance value is performed as follows. Again, this was performed by applying a predetermined amount of press pressure.

[0210] Specifically, the number of NG test points was 7312 for the upper surface of the circuit board 1 for evaluation and 3784 for the lower surface of the circuit board 1 for evaluation, and the measurement was performed 10 times under each press pressure condition. The percentage of NG inspection points in the 110960 inspection points calculated by the formula (7312 + 3784) X 10 = 110960 is shown.

In this case, “the minimum press pressure is small” means that the circuit board to be inspected can be electrically inspected with a low press pressure. In inspection equipment, if the pressure during inspection can be set low, deterioration of the circuit board to be inspected, the anisotropic conductive sheet, and the inspection circuit board due to the pressure during inspection can be suppressed. Since it is possible to use components with low durability and strength as constituent members, the structure of the inspection device can be made small and compact, and as a result, the durability of the inspection device can be improved and the production of the inspection device can be improved. Preferred because the cost savings of construction are achieved.

[0211] 2. Measurement of durability of anisotropic conductive sheet

The created inspection device is set in the inspection section of the rail transport type automatic circuit board inspection machine rSTARREC V5J, and the evaluation circuit board 1 is set for the inspection device. The press pressure condition is set to 130 kgf and pressurized a predetermined number of times, and then a current of 1 mA is applied to the test electrode under the condition of a press pressure of 130 kgf for the test electrode of the evaluation circuit board 1. Measure the conduction resistance 10 times, pressurize it a predetermined number of times, and measure the conduction resistance 10 times in the same manner. Repeated.

[0212] Inspection points where the measured conduction resistance value was 100 Ω or more (NG inspection points) were determined to be poor conduction, and the percentage of NG inspection points in the total inspection points (NG inspection point ratio) was calculated.

Next, the anisotropic conductive sheet of the inspection device was replaced with a new one, and a predetermined number of pressurizations were performed under the same conditions as above except that the press pressure condition was changed to 150 kgf. The NG inspection point ratio was calculated by the same method as above, except that was changed to 150 kgf.

[0213] In the measurement of the conduction resistance value related to the durability of the anisotropic conductive sheet, after the measurement of one conduction resistance value is completed, the press pressure related to the measurement is released and the inspection device is not operated. The state was returned to the pressure state, and the next measurement of the conduction resistance was performed again by applying a predetermined magnitude of press pressure.

Specifically, the number of NG test points is 73 12 for the upper surface of the circuit board 1 to be inspected and 3784 for the lower surface of the circuit board 1 for evaluation. The percentage of the NG inspection points in the 110,960 inspection points calculated by the formula (7312 + 3784) X 10 = 110960 is shown.

[0214] In this case, the inspection apparatus requires that the percentage of NG inspection points be 0.01% or less for practical use. If the percentage of NG inspection points exceeds 0.01%, non-defective products In some cases, an erroneous inspection result indicating that the circuit board to be inspected is defective may be obtained, which may make it impossible to perform an electrical inspection of the circuit board with high reliability. Table 1 shows the measurement results of the minimum press, and Table 2 shows the measurement results of the durability of the anisotropic conductive sheet.

[0215] [Example 2]

The relay pin units 31a and 31b of FIG. 1 were used instead of the relay pin unit 31 described above. That is, a large number (8000 pins) of conductive pins 32a and 32b are arranged on a grid point at a constant pitch (2.54 mm pitch), and insulating plates 34a and 34b that support the conductive pins 32a and 32b so as to be movable up and down. An inspection apparatus was manufactured having the same configuration as that of Example 1 except that a relay pin unit composed of 35a and 35b was used.

With this inspection device, the minimum press pressure and anisotropic The durability of the conductive sheet was measured. Table 1 shows the measurement results of the minimum press, and Table 2 shows the measurement results of the durability of the anisotropic conductive sheet.

[0216] [Table 1]

[0217] [Table 2]

[Example 3]

In the following, the surface roughness was measured using a three-dimensional surface structure analysis microscope `` New View 200 '' manufactured by Zigo, and the center average roughness Ra according to JIS B0601 was cut off 0.8 mm, measurement length 0.25 mm This is a value measured under the conditions.

(Evaluation circuit board)

An evaluation circuit board having the following specifications was prepared.

Dimensions: 100mm (length) X 100mm (width) X O. 8mm (thickness)

Number of electrodes to be inspected on the top side: 7312

Diameter of the electrode to be inspected on the top side: 0.3 mm

Minimum arrangement pitch of electrodes to be inspected on the top side: 0.4 mm

Number of electrodes to be inspected on the lower side: 3784

Diameter of the electrode to be inspected on the bottom side: 0.3 mm

Circuit board inspection equipment for inspecting the above-mentioned circuit board for evaluation, which is compatible with the inspection section of the rail transfer type circuit board automatic inspection machine (manufactured by Nidec-Read Corporation, product name: STARREC V5) (Fig. 1).

(1) First Anisotropic Conductive Sheet 22

Liquid A and liquid B of the two-part addition type liquid silicone rubber were mixed in equal proportions. 100 parts by weight of conductive particles having an average particle diameter of 20 μm were added to 100 parts by weight of this mixture, mixed, and then subjected to defoaming treatment under reduced pressure to prepare a molding material.

[0220] As an addition-type liquid silicone rubber, the viscosity of liquid A and liquid B is 500P each, and the compression set of the cured product at 150 ° C (by the measuring method in accordance with JIS K 6249) is as follows.

6%, tear strength at 23 ° C (measured according to JIS K 6249) is 25k

The one of NZm was used.

As the conductive particles, nickel particles were used as core particles, and the core particles were subjected to electroless gold plating (average coating amount: amount of 5% by weight of the core particles).

[0221] One molding member has a rectangular opening of 120mm x 200mm on the molding surface, and the thickness is

After placing a 0.08 mm framed spacer, apply the prepared molding material into the opening of the spacer, and place the other molding member on this molding material so that the molding surface contacts the molding material. It was arranged as follows.

On one molded member, a 0.1 mm thick polyester resin sheet (made by Toray Industries, “Mattle Mirror S10”) was used, and its non-glossy surface (surface roughness: 1 m) was used as the molding surface. The other molded member was a polyester resin sheet with a thickness of 0.1 mm (manufactured by Toray Industries, Inc., product name: “Matsutorumirror S10”), and its glossy surface (surface roughness: 0.04 / zm) was molded. Used as

[0222] Next, using a pressure roll device composed of a pressure roll and a support roll, the molding material was pressed by these molding members, and the thickness of the molding material was set to 0.08 mm.

An electromagnet is placed on the back of each molded member, and a curing process is performed on the molding material at 120 ° C for 30 minutes while applying a 0.3T parallel magnetic field to the molding material in the thickness direction. Then, a rectangular anisotropic conductive sheet having a thickness of 0.1 mm was produced.

[0223] The obtained anisotropic conductive sheet had a surface roughness on one side of 1.4 µm and a surface roughness on the other side of 0.12 m, and the proportion of the conductive particles was a volume fraction. The rate was 12%. This anisotropic conductive elastomer sheet is referred to as “anisotropic conductive sheet (a)”.

[0224] (2) Pitch conversion board 23 Numerically controlled drilling is performed on a laminated material (Matsushita Electric Works, product name: R-1766) in which a thin metal layer made of copper with a thickness of 18 m is formed on both sides of an insulating substrate made of glass fiber reinforced epoxy resin. The apparatus formed a total of 7312 circular through-holes each having a diameter of 0.2 mm penetrating in the thickness direction of the laminated material. Next, an electroless plating process is performed on the laminated material in which the through holes are formed by using an EDTA type copper plating solution to form a copper plating layer on the inner wall of each through hole, and further, a copper sulfate plating solution is formed. By performing electrolytic copper plating using, a cylindrical via hole having a thickness of about 10 m was formed in each through hole to electrically connect the thin metal layers on the surface of the laminated material to each other.

[0225] Next, a 25 µm thick dry film resist (manufactured by Tokyo Ohka, product name: FP-225) was laminated on the thin metal layer on the surface of the laminated material to form a resist layer. A protective seal was placed on the other side of the thin metal layer. A photomask film is placed on this resist layer, and the resist layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), and then developed to form a resist pattern for etching. Formed. Then, by etching the thin metal layer on the surface on which the resist pattern was formed, 7312 connection electrodes having a diameter of 200 m, and each connection electrode and via hole were electrically formed on the surface of the insulating substrate. A pattern wiring portion having a connecting line width of 100 μm was formed, and then the resist pattern was removed.

[0226] A 25 µm-thick dry film solder resist (manufactured by Hitachi Chemical, product name: SR-2300G) was laminated on the surface of the insulating substrate on which the connection electrodes and the pattern wiring portion were formed to form an insulating layer. A photomask film is placed on the insulating layer, and the insulating layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), and then subjected to development processing. 7312 openings with a diameter of 200 m were formed to expose the electrodes. Using a copper sulphate plating solution, using the thin metal layer on the other side of the laminated material as a common electrode, and applying electrolytic copper plating to each connection electrode, 7312 protruding from the surface of the insulating layer Was formed.

[0227] Next, the protective seal on the thin metal layer on the other side of the laminated material was removed, and a 25 m thick dry film resist (manufactured by Tokyo Ohka, product name: FP — 225) was laminated to form a resist layer. After that, a photomask film is placed on this resist layer. The resist layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.) and then developed to form a resist pattern for etching on the thin metal layer of the laminated material. Formed. Next, by performing an etching process, 7312 terminal electrodes and a pattern wiring portion for electrically connecting each terminal electrode to the via hole were formed on the back surface of the insulating substrate, and the resist pattern was removed.

Next, a 38 μm-thick dry film solder resist (manufactured by Tigo Morton, product name: ConfoMask 2015) was laminated on the back surface of the insulating substrate on which the terminal electrodes and the pattern wiring portions were formed. An insulating layer is formed, a photomask film is disposed on the insulating layer, and then the insulating layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.) and then developed. Then, 7312 openings of 0.4 mm in diameter were formed to expose the electrodes.

[0229] As described above, the pitch conversion substrate 23a was manufactured. The pitch conversion board has a vertical and horizontal dimension of 120 mm x 160 mm, a thickness of 0.5 mm, a diameter of the portion of the connection electrode exposed from the insulating layer surface is about 300 μm, and a height of the connection electrode protruding from the insulating layer surface. Approximately 25 μm, the minimum arrangement pitch of the connection electrodes is 0.4 mm, the diameter of the terminal electrodes is 0.4 mm, the arrangement pitch of the terminal electrodes is 0.75 mm, and the insulating layer on the side where the connection electrodes are formed Had a surface roughness of 0.02 μm.

[0230] The anisotropic conductive sheet (a) described above is arranged on the front surface side of the pitch conversion substrate, and on the back surface side, a number of conductive path forming portions extending in the thickness direction, and an insulating portion for insulating these from each other. The circuit board side connector 21a on the upper side is formed by disposing an unevenly distributed anisotropic conductive sheet having a conductive path forming portion protruding on one surface.

The second anisotropic conductive sheet 26 disposed between the pitch conversion board 23 and the relay pin unit 31 has the shape shown in FIG. 6, and specifically has the following configuration. used.

[Second anisotropic conductive sheet 26]

Dimensions: 11 Omm X 150mm

Thickness of conductive path forming part: 0.6mm

Outer diameter of conductive path forming part: 0.35mm Projection height of conductive path forming part: 0.05 mm

Elastic polymer material: Material; silicone rubber, hardness; 30

(W / Ό = 17)

twenty two

[0231] In the same manner as above, a pitch conversion substrate 23b for a lower inspection jig having 3784 connection electrodes on the front surface and 3784 terminal electrodes on the back surface was manufactured. The pitch conversion board has a vertical and horizontal dimension of 120 mm x 160 mm, a thickness of 0.5 mm, a diameter of a portion of the connection electrode exposed on the insulating layer surface is about 300 m, and a height of the connection electrode protruding from the insulating layer surface. Is about 25 m, the minimum arrangement pitch of the connection electrodes is 0.4 mm, the diameter of the terminal electrodes is 0.4 mm, the arrangement pitch of the terminal electrodes is 0.75 mm, and the surface of the insulating layer on the side where the connection electrodes are formed The roughness was 0.02 m.

The anisotropic conductive sheet (a) is disposed on the front side of the pitch conversion substrate, and on the back side, a number of conductive path forming portions extending in the thickness direction and an insulating portion for insulating these from each other By placing an eccentrically-distributed anisotropic conductive sheet with a conductive path protruding part on one side, the lower circuit board side connector was 2 lb.

Using these upper and lower circuit board side connectors 21a and 21b, an inspection apparatus was configured by arranging the relay pin units 31a and 31b and the tester side connectors 41a and 41b as shown in FIG.

[Performance test]

Attach the inspection device to the rail transport type circuit board automatic inspection machine rSTARREC V5J (manufactured by Nidec Reed Co., Ltd.), and perform the connection stability test (measurement of minimum pressing pressure) and anisotropic conductive sheet by the following method. Was subjected to a peel test.

1. Measurement of minimum press pressure

The fabricated inspection device is set in the inspection section of the rail transport type circuit board automatic inspection machine rSTARREC V5J, and the evaluation circuit board 1 is set in the inspection device. The press pressure of the circuit board for evaluation 1 was changed stepwise within the range of 100-250 kgf, 10 times for each press pressure condition. With respect to the electrode to be inspected, the conduction resistance when a current of 1 mA was applied to the electrode for inspection was measured.

[0234] Inspection points having a measured conduction resistance value of 100 Ω or more (hereinafter, referred to as "NG inspection points") are determined to have poor conduction, and the percentage of NG inspection points in the total inspection points (hereinafter, "NG inspection points"). Inspection point ratio ”) was calculated, and the lowest press pressure at which the NG inspection point ratio was 0.01% or less was determined as the lowest press pressure.

[0235] Specifically, the number of NG test points was 7312 on the upper surface of the circuit board 1 for evaluation and 3784 on the lower surface of the circuit board 1 for evaluation, and the measurement was performed 10 times under each press pressure condition. The percentage of NG inspection points in the 110960 inspection points calculated by the formula (7312 + 3784) X 10 = 110960 is shown. Table 3 shows the measurement results.

[0236] 2. Peelability test

The above-described circuit board for evaluation was transported and set in an inspection apparatus, and pressed against the circuit board for evaluation with a press load of 150 kgf. In this state, the electric resistance was measured when a current of 1 mA was applied to the evaluation circuit board electrically connected to the connection electrodes of the two connectors, and then the pressure on the evaluation circuit board was released. . After performing this operation 10 times, the circuit board for evaluation was transported from the inspection area of the inspection apparatus.

[0237] The above process was performed for 100 evaluation circuit boards! When the evaluation circuit board was conveyed with the inspection area force of the inspection device, the anisotropic conductive sheet (a) The force of the conversion substrate was also released and adhered to the evaluation circuit board, and the number of times of transfer (the number of transfer errors) was measured. Table 3 shows the measurement results.

[Example 4]

In the inspection device manufactured in Example 3, an inspection device was configured using the following anisotropic conductive elastomer sheet (b) instead of the anisotropic conductive elastomer sheet Ha), and the same as in Example 3 was performed. A connection stability test and a peelability test were performed. Table 3 shows the measurement results. After forming a frame-shaped spacer having a rectangular opening of 120 mm x 200 mm and a thickness of 0.08 mm on the molding surface of one molded member, the same as in Example 1 in the opening of the spacer. The molding material prepared in the same manner was applied, and the other molding member was arranged on this molding material such that the molding surface was in contact with the molding material.

[0239] Both molded members were made of a 0.1 mm thick polyester resin sheet (made by Toray Sene Co., product name "Mattle Mirror S10"), and its glossy surface (surface roughness: 0.04 m) was molded. Next, a molding material layer having a thickness of 0.08 mm was formed by pressing the molding material between the molding members using a pressure roll device including a pressure roll and a support roll. An electromagnet is placed on the back side of each molded member, and the molding material layer is cured at 120 ° C for 30 minutes while applying a 0.3T parallel magnetic field to the molding material layer in the thickness direction. Then, a rectangular anisotropic conductive sheet having a thickness of 0.1 mm was produced.

[0240] The obtained anisotropic conductive sheet (b) had a surface roughness of 0.1 m on one surface and a surface roughness of 0.12 m on the other surface. The volume fraction was 12%.

[0241] [Table 3]

[Example 5]

(Evaluation circuit board)

An evaluation circuit board having the following specifications was prepared.

Dimensions: 100mm (length) X 100mm (width) X O. 8mm (thickness)

Number of electrodes to be inspected on the top side: 7312 Diameter of the electrode to be inspected on the top side: 0.3 mm

Minimum arrangement pitch of electrodes to be inspected on the top side: 0.4 mm

Number of electrodes to be inspected on the lower side: 3784

Diameter of the electrode to be inspected on the bottom side: 0.3 mm

[0243] (1) First anisotropic conductive sheet 22

As an addition-type liquid silicone rubber, the viscosity of liquid A and liquid B is 500P each, and the cured product has a compression set at 150 ° C (by the measuring method in accordance with JIS K 6249) of 6% and a tear at 23 ° C. The strength (measured according to JIS K 6249) was 25 kNZm.

[0244] As the conductive particles, nickel particles were used as core particles, and the core particles were subjected to electroless gold plating (average coating amount: amount of 5% by weight of the core particles).

After placing a 0.08 mm thick frame-shaped spacer having a rectangular opening of 120 mm x 200 mm on the molding surface of one molded member, the prepared molding material is placed in the opening of the spacer. It was applied, and the other molding member was arranged on this molding material so that its molding surface was in contact with the molding material.

[0245] On one molded member, a polyester resin sheet having a thickness of 0.1 mm (made by Toray Dentsu Co., Ltd., product name: "Mattle Mirror S10") was used with its non-glossy surface (surface roughness: 1 m) as the molding surface. The other molded member used was a polyester resin sheet with a thickness of 0.1 mm (manufactured by Toray Industries, Inc., product name: “Pantle Miller S10”) with a glossy surface (surface roughness of 0.04 / zm). Was used as the molding surface. Next, using a pressure roll device composed of a pressure roll and a support roll, the molding material was sandwiched between these molding members to make the thickness of the molding material 0.08 mm. [0246] An electromagnet is arranged on the back surface of each molding member, and the molding material is cured at 120 ° C for 30 minutes while applying a 0.3 T parallel magnetic field to the molding material in the thickness direction. Thus, a rectangular anisotropic conductive sheet having a thickness of 0.1 mm was produced.

The obtained anisotropic conductive sheet had a surface roughness on one side of 0.1, a surface roughness on the other side of 0.12 m, and a conductive particle ratio of 12% by volume. Was This anisotropic conductive elastomer sheet is referred to as “anisotropic conductive sheet (a)”.

[0247] (2) Pitch conversion board 23

Next, a copper plating layer was formed on the inner wall of each through-hole by performing an electroless plating process on the laminated material in which the through-hole was formed using an EDTA-type copper plating solution. By performing electrolytic copper plating using a copper sulfate plating solution, a cylindrical via having a thickness of about 10 m is used to electrically connect the thin metal layers on the surface of the laminated material to each other in each through hole. A hole was formed.

[0249] Next, a 25 µm-thick dry film resist (manufactured by Tokyo Ohka, product name: FP-225) was laminated on the thin metal layer on the surface of the laminated material to form a resist layer. A protective seal was placed on the other side of the thin metal layer. A photomask film is placed on this resist layer, and the resist layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), and then developed to form a resist pattern for etching. Formed. Then, by etching the thin metal layer on the surface on which the resist pattern was formed, 7312 connection electrodes having a diameter of 200 m, and each connection electrode and via hole were electrically formed on the surface of the insulating substrate. A pattern wiring portion having a connecting line width of 100 μm was formed, and then the resist pattern was removed.

[0250] A 25 µm-thick dry film solder resist (manufactured by Hitachi Chemical Co., Ltd., product name: SR-2300G) was laminated on the surface of the insulating substrate on which the connection electrodes and the pattern wiring portion were formed to form an insulating layer. A photomask film is disposed on the insulating layer, and is flat with respect to the insulating layer. Exposure treatment was performed using a line light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), and then development treatment was performed to form 7312 openings with a diameter of 200 m exposing each connection electrode. Using a copper sulphate plating solution, using the thin metal layer on the other side of the laminated material as a common electrode, and applying electrolytic copper plating to each connection electrode, 7312 protruding from the surface of the insulating layer Was formed.

[0251] Next, the protective seal on the metal thin layer on the other side of the laminated material was removed, and a 25 m thick dry film resist (manufactured by Tokyo Ohka, product name: FP-225) was placed on the metal thin layer on this surface. ) Was laminated to form a resist layer. After that, a photomask film is disposed on the resist layer, and the resist layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), and then subjected to a development treatment to obtain a laminated material. A resist pattern for etching was formed on the thin metal layer. Next, by performing an etching process, 7312 terminal electrodes and a pattern wiring portion for electrically connecting each terminal electrode to the via hole were formed on the back surface of the insulating substrate, and the resist pattern was removed.

[0253] As described above, the pitch conversion substrate 23a for the first inspection jig 11a was manufactured. The pitch conversion board 23a has a vertical and horizontal dimension of 120 mm x 160 mm, a thickness of 0.5 mm, the surface of the insulating layer of the connecting electrode has a diameter of about 300 m, and the connecting electrode protrudes from the surface of the insulating layer. The height is about 25 m, the minimum arrangement pitch of the connection electrodes is 0.4 mm, the diameter of the terminal electrodes is 0.4 mm, and the arrangement pitch of the terminal electrodes is 0.75 mm.The insulating layer on the side where the connection electrodes are formed Had a surface roughness of 0.02 m.

[0254] In the same manner as described above, a pitch conversion substrate 23b for a second inspection jig lib having 3784 connection electrodes on the front surface and 3784 terminal electrodes on the back surface was manufactured. The pitch conversion board 23b has a vertical and horizontal dimension of 120 mm X 160 mm and a thickness of 0.5 mm. The diameter of the part of the connection electrode exposed on the surface of the insulating layer is about 300 / ζπι, the surface strength of the insulating layer at the connection electrode is about 25 m, the minimum height of the connection electrodes is 0.4 mm, and the terminal is The electrode diameter is 0.4 mm, the arrangement pitch of the terminal electrodes is 0.75 mm, and the surface roughness of the insulating layer on the surface (the surface on which the connection electrodes are formed) is 0.02 m.

[0255] (3) Circuit board side connector 21

[Second anisotropic conductive sheet 26]

Dimensions: 11 Omm X 150mm

Thickness of conductive path forming part: 0.6mm

Outer diameter of conductive path forming part: 0.35mm

Projection height of conductive path forming part: 0.05 mm

Elastic polymer material: Material; silicone rubber, hardness; 30

(W / Ό = 17)

twenty two

[0256] (4) Relay pin unit 31

As a material of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35, the specific resistance is I X

10 ¹⁰ Ω'cm or more of insulating material, glass fiber reinforced epoxy resin

1. A 9mm one was used.

[0257] The distance L1 between the first insulating plate 34 and the intermediate holding plate 36 is 36.3 mm, and the distance L2 between the second insulating plate 35 and the intermediate holding plate 36 is 3 mm. The first support pin 33 (diameter 2 mm, length 36.3 mm) and the second support pin 37 (diameter 2 mm, length 3 mm) In addition to being fixedly supported, a conductive pin 32 having the following configuration is disposed in the through hole 83 (0.4 mm in diameter) between the first insulating plate 34 and the second insulating plate 35 so as to be movable. It was produced.

[Conductive pin]

Material: Brass with gold plating

Tip 81a dimensions: 0.35mm outer diameter, 2.lmm overall length

Central part 82 dimension outer diameter 0.45mm, total length 41mm

Base end 8 lb dimensions: 0.35 mm outer diameter, 2.lmm overall length

The first contact support position 38A of the first support pin 33 with the intermediate holding plate 36 and the second contact support position 38B of the second support pin 37 with the intermediate holding plate 36 are shown in FIG. As shown in the figure, they were arranged in a grid. Also, the separation distance between the adjacent first contact support positions 38A.

The distance between the second contact support positions 38B was 17.5 mm.

[5] (5) Tester side connector 41

[Performance test]

1. Measurement of minimum press pressure

The created inspection device is set in the inspection section of the rail transport type circuit board automatic inspection machine rSTARREC V5J, the evaluation circuit board 1 is set in the inspection device, and the rail transport type circuit board automatic inspection machine “STARREC V5J The press pressure of the test circuit was changed stepwise within the range of 100-210 kgf, and each test pressure condition was changed 10 times, and the test electrodes of the evaluation circuit board 1 and the test electrodes were 1 mA each. The conduction resistance when a current of? Was applied was measured.

[0260] Inspection point at which the measured conduction resistance value is 100 Ω or more (hereinafter, referred to as "NG inspection point") Is determined to be a conduction failure, and the ratio of NG inspection points in the total inspection points (hereinafter referred to as “NG inspection point ratio”) is calculated. The lowest press pressure at which the NG inspection point ratio becomes 0.01% or less is determined. The minimum press pressure was used.

[0261] Specifically, the ratio of NG inspection points is that the number of electrodes to be inspected on the upper surface of the evaluation circuit board 1 is 7312, and the number of electrodes to be inspected on the lower surface is 3784, and measurement is performed 10 times under each press pressure condition. The percentage of NG inspection points in the 110960 inspection points calculated by the formula (7312 + 3784) X 10 = 110960 is shown. Table 4 shows the measurement results.

[0262] 2. Peelability test

The above-described circuit board for evaluation was transported and set in an inspection device, and pressed against the circuit board for evaluation with a press load of 130 kgf. In this state, the electric resistance was measured when a current of 1 mA was applied to the evaluation circuit board electrically connected to the connection electrodes of the two connectors, and then the pressure on the evaluation circuit board was released. . After performing this operation 10 times, the circuit board for evaluation was transported from the inspection area of the inspection apparatus.

[0263] The above process was performed on 100 evaluation circuit boards. When the evaluation circuit board was also transported with the inspection area force of the inspection device, the anisotropic conductive sheet (a) pitched. The force of the conversion substrate was also released and adhered to the evaluation circuit board, and the number of times of transfer (the number of transfer errors) was measured. Table 4 shows the measurement results.

[Example 6]

In the inspection device manufactured in Example 5, an inspection device was configured using the following anisotropic conductive elastomer sheet (b) instead of the anisotropic conductive elastomer sheet Ha), and the same as in Example 5 was performed. A connection stability test and a peelability test were performed. The measurement results are shown in Table 4. A frame-shaped spacer having a rectangular opening of 120 mm x 200 mm and a thickness of 0.08 mm was placed on the molding surface of one molded member. The molding material prepared in the same manner as in Example 1 is applied to the opening, and the other molding member is molded on the molding material. The surface was arranged so as to be in contact with the molding material.

[0265] Both molded members were molded from a 0.1 mm thick polyester resin sheet (made by Toray Dentsu Co., Ltd., product name: "Mattle Mirror S10"), and its glossy surface (surface roughness: 0.04 m) was formed. Next, a molding material layer having a thickness of 0.08 mm was formed by sandwiching the molding material between the molding members using a pressure roll device comprising a pressure roll and a support roll. An electromagnet is placed on the back side of each molded member, and the molding material layer is cured at 120 ° C for 30 minutes while applying a 0.3T parallel magnetic field to the molding material layer in the thickness direction. Then, a rectangular anisotropic conductive sheet having a thickness of 0.1 mm was produced.

[0266] The obtained anisotropic conductive sheet (b) had a surface roughness of 0.1 m on one surface and a surface roughness of 0.12 m on the other surface, and the ratio of the conductive particles was The volume fraction was 12%.

[0267] [Table 4]

[Example 7]

(Evaluation circuit board)

An evaluation circuit board having the following specifications was prepared.

Dimensions: 100mm (length) X 100mm (width) X O. 8mm (thickness)

Number of electrodes to be inspected on the upper surface: 3400

Diameter of the electrode to be inspected on the top side: 0.3 mm

Minimum arrangement pitch of electrodes to be inspected on the top side: 0.4 mm

Number of electrodes to be inspected on the lower side: 2500

Diameter of the electrode to be inspected on the bottom side: 0.3 mm

Rail transport type circuit board automatic inspection machine (manufactured by Nidec-Read Corporation, product name: STARREC V5 A circuit board inspection device (Fig. 14) for testing the above-mentioned circuit board for evaluation, which is compatible with the inspection section of (1), was prepared.

[0269] (1) First anisotropic conductive sheet 22

Dimensions: 110mm X I 10mm, thickness 0.1mm

Elastic polymer material: Material; silicone rubber, hardness; 40

[0270] (2) Pitch conversion board 23

Laminated material in which a thin metal layer made of copper is formed on both sides of a 0.5 mm thick insulating substrate made of glass fiber reinforced epoxy resin (Matsushita Electric Works, product name: R-1766) Then, a total of 6,800 circular through-holes having a diameter of 0.1 mm and penetrating in the thickness direction of the laminated material were formed by a numerically controlled drilling device.

In this case, two through-holes were formed as a set at a position corresponding to the electrode to be inspected on the upper surface side of the evaluation circuit board, and a set of through-holes was formed with a gap of 0.1 mm (That is, it means that the gap between the through hole A = 0.1 mm and the through hole B = 0.1 mm is set to 0.1 mm.)

[0271] Thereafter, the laminated material in which the through-holes were formed was subjected to electroless plating using an EDTA-type copper plating solution to form a copper plating layer on the inner wall of each through-hole. By performing electrolytic copper plating using a copper plating solution, a cylindrical via hole with a thickness of about 10 m that electrically connects the thin metal layers on the surface of the laminated material to each other in each through hole. Formed.

[0272] Next, a 25 µm-thick dry film resist (manufactured by Tokyo Ohka, product name: FP-225) was laminated on the thin metal layer on the surface of the laminated material to form a resist layer. A protective seal was placed on the other side of the thin metal layer. A photomask film is placed on the resist layer, and the resist layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.) and then developed to obtain a resist pattern for etching. Was formed. Then, by etching the thin metal layer on the surface on which the resist pattern was formed, 6800 connection electrodes 60 m wide and 150 m long, and each connection electrode and via hole were formed on the surface of the insulating substrate. Then, a pattern wiring part having a line width of 100 m for electrically connecting the resist pattern was formed, and then the resist pattern was removed.

[0273] Next, a dry film resist (manufactured by Tokyo Ohka, product name: FP-225) having a thickness of 50 µm was laminated on the surface of the laminated material on the side where the connection electrodes and the pattern wiring portions were formed, and a resist layer was formed. After forming a photomask film on this resist layer, subjecting the resist layer to exposure processing using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), development processing is performed. 6,800 rectangular openings of 60 / ζπι in the horizontal direction and 150 / zm in the vertical direction were formed to expose the respective connection electrodes.

[0274] Then, using a copper sulfate plating solution, a thin metal layer on the other surface side of the laminated material was used as a common electrode V. Electrolytic copper plating was performed on each of the connection electrodes to make 6800 connection electrodes Was formed. Next, the resist pattern was removed.

Next, the protective seal on the thin metal layer on the other side of the laminated material was removed, and a 25 m thick dry film resist (manufactured by Tokyo Ohka, product name: FP-225) was laminated on the thin metal layer on this surface. To form a resist layer. After that, a photomask film is disposed on the resist layer, and the resist layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), and then subjected to a development treatment to obtain a laminated material. A resist pattern for etching was formed on the thin metal layer.

[0275] Next, after a protective seal was applied to the surface on the side on which the connection electrodes of the laminated material were formed, an etching process was performed, so that 6800 terminal electrodes were formed on the back surface of the insulating substrate, and each terminal electrode was formed. A pattern wiring portion for electrically connecting the pole and the via hole was formed, and the resist pattern was removed.

Next, a 38 μm-thick dry film solder resist (manufactured by Tigo Morton, product name: ConfoMask 20105) was laminated on the back surface of the insulating substrate on which the terminal electrodes and the pattern wiring portions were formed. An insulating layer is formed, a photomask film is disposed on the insulating layer, and then the insulating layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.) and then developed. 6800 apertures with 0.4mm diameter to expose electrodes Done.

[0277] As described above, the pitch conversion substrate 23a was manufactured. The pitch conversion substrate 23 has a vertical and horizontal dimension of 120 mm x 160 mm, a thickness of 0.5 mm, and a dimensional force of a portion of the connection electrode 25 exposed from the surface of the insulating layer. The protruding height of the insulating layer surface of the electrode 25 is about 60 m, the distance between the pair of connecting electrodes 25 is 100 m, the diameter of the terminal electrode 24 is 0.4 mm, and the arrangement pitch of the terminal electrodes 24 is 0. It was 75 mm, and the surface roughness of the insulating layer on the side where the connection electrode 24 was formed was 0.02 m.

In the same manner as described above, the pitch conversion substrate 23b for the second inspection jig l ib having 5000 connection electrodes 25 on the front surface and 5000 terminal electrodes 24 on the back surface is provided. It was made.

The pitch conversion substrate 23b has a vertical and horizontal dimension of 120 mm × 160 mm, a thickness of 0.5 mm, a width of about 60 / zm in a portion of the connection electrode 25 exposed on the surface of the insulating layer, and a length of about 150 / ζπι. The surface height of the insulating layer at the connection electrode 25 is about 60 m, the separation distance between the pair of connection electrodes is 100 m, the diameter of the terminal electrode 24 is 0.4 mm, and the arrangement pitch of the terminal electrodes 24 is 0. 75 mm, and the surface roughness of the insulating layer on the front surface (the surface on which the connection electrode is formed) is 0.02 m.

(3) Circuit board side connector 21

[Second anisotropic conductive sheet 26]

Dimensions: 11 Omm X 150mm

Thickness of conductive path forming part: 0.6mm

Elastic polymer material: Material; silicone rubber, hardness; 30

(W / Ό = 17)

twenty two

[0280] (4) Relay pin unit 31

As the material of the insulating plates 34 and 35, an insulating material having a specific resistance of 1 × 10 ¹⁰ Ω'cm or more and a glass fiber reinforced epoxy resin having a thickness of 6 mm were used.

Then, these are attached to the support pins 33 so that the distance between the insulating plate 34 and the insulating plate 35 is 52 mm, and the conductive pins 32 having the following constitutional force are arranged in the through holes 83 so as to be movable. did.

[Conductive pin]

Material: Brass with gold plating

Tip dimensions: 0.35mm outer diameter, 6.7mm overall length

0.45mm outside diameter, total length 5 lmm

Base end dimensions: 0.35mm outer diameter, 6.7mm overall length

Separation distance between adjacent test pins: 0.75mm

[0281] (5) Tester side connector 41

As shown in FIG. 14, the tester side connector 41 was composed of a third anisotropic conductive sheet 42, a connector board 43, and a base plate 46. The third anisotropic conductive sheet 42 used was the same as the second anisotropic conductive sheet 26 described above.

[Performance test]

1. Measurement of minimum press pressure

The created inspection device is set in the inspection section of the rail transport type circuit board automatic inspection machine rSTARREC V5J, the evaluation circuit board 1 is set in the inspection device, and the rail transport type circuit board automatic inspection machine “STARREC V5J Pressing pressure is changed stepwise within the range of 100-250 kgf, and the electrode to be inspected on the circuit board for evaluation 1 is changed from the electrode for current supply to the electrode for inspection by 10 times for each pressing pressure condition. Provides 1 mA of current The conduction resistance value when supplied was measured with a voltage measurement electrode.

Inspection points where the measured conduction resistance value is 100 Ω or more (hereinafter referred to as “NG inspection points”) are judged to be poor conduction, and the percentage of NG inspection points in the total inspection points (hereinafter “NG inspection point ratio”) The lowest press pressure at which the percentage of NG inspection points fell below 0.01% was taken as the lowest press pressure.

[0283] In the measurement of the conduction resistance value, after the measurement of one conduction resistance value is completed, the press pressure related to the measurement is released to return the inspection device to the non-pressurized state, and the next conduction resistance value is measured. The measurement was performed again by applying a predetermined magnitude of press pressure.

Specifically, the ratio of NG test points is that the number of electrodes to be inspected on the upper surface of the evaluation circuit board 1 is 3400, the number of electrodes to be inspected on the lower surface is 2500, and that the measurement was performed 10 times under each press pressure condition. This shows the percentage of NG inspection points in the inspection points of 59,000 points calculated by the formula (3400 + 2500) X 10 = 59000. Table 5 shows the measurement results.

[0284] 2. Measurement of durability of anisotropic conductive sheet

The created inspection device is set on the inspection part of rSTARREC V5J, a rail transport type circuit board automatic inspection machine, and the evaluation circuit board 1 prepared for the inspection device is set. After the press pressure condition of rSTARREC V5J is set to 150 kgf and pressurized a predetermined number of times, the electrodes to be inspected of the evaluation circuit board 1 are switched from the current supply electrodes to the test electrodes under the press pressure of 150 kgf. The conduction resistance when a current of 1 mA was supplied was measured 10 times with a voltage measurement electrode.

[0285] Inspection points (NG inspection points) where the measured conduction resistance value was 100 Ω or more were determined as poor conduction, and the ratio of NG inspection points to the total inspection points (NG inspection point ratio) was calculated.

Next, the anisotropic conductive sheet in the inspection device was replaced with a new one, and a predetermined number of pressurizations were performed under the same conditions as above except that the press pressure condition was changed to 180 kgf. The NG inspection point ratio was calculated by the same method as above except that the weight was 180 kgf.

[0286] In the measurement of the conduction resistance value relating to the durability of the anisotropic conductive sheet, after the measurement of one conduction resistance value is completed, the press pressure related to the measurement is released and the inspection device is not applied. Pressure state, and the next measurement of the conduction resistance again applies the predetermined pressure. It was done by letting.

Also, specifically, the number of NG test points is 3400 for the upper electrode to be inspected and 2500 for the lower electrode to be tested on the circuit board 1 for evaluation. The ratio of NG inspection points to the inspection points of 59000 points calculated by the formula (3400 + 2500) X 10 = 59000 is shown.

In this case, the inspection equipment is required to have the NG inspection point ratio of 0.01% or less for practical use, and if the NG inspection point ratio exceeds 0.01%, the inspection device is considered to be a non-defective product. Since an erroneous inspection result indicating that the inspection circuit board is defective may be obtained, there is a possibility that the electrical inspection of the circuit board cannot be performed with high reliability. Table 6 shows the measurement results.

[0287] 3. Evaluation of conduction failure of circuit board to be inspected

The fabricated inspection device is set in the inspection section of the rSTARREC V5J automatic circuit board inspection machine, and the evaluation circuit board 1 prepared for the inspection device is set. rSTARREC V5J was pressed at 150 kgf, and the test electrode on the circuit board for evaluation 1 was supplied with a current of 1 mA from the current supply electrode to the test electrode under the press pressure of 150 kgf. The resistance value is measured 10 times with the voltage measurement electrode, and the inspection point (NG inspection point ratio) where the conduction resistance value equal to or higher than the set conduction resistance value (100 Ω) is detected is judged as NG inspection point, and the total inspection point The percentage of NG inspection points at (NG inspection point ratio) was calculated.

Then, the evaluation circuit board 1 was evaluated by changing the setting of the conduction resistance value, which is determined as an NG inspection point, to a resistance value lower than 100 Ω for the same evaluation circuit board 1. Table 7 shows the measurement results.

[Example 8]

In the inspection device of Example 7, the substrate for pitch conversion was changed to the following.

Laminated material in which a thin metal layer made of copper is formed on both sides of a 0.5 mm thick insulating substrate made of glass fiber reinforced epoxy resin (Matsushita Electric Works, product name: R-1766) Then, a total of 3400 circular through-holes having a diameter of 0.2 mm penetrating in the thickness direction of the laminated material were formed by a numerically controlled drilling device. An upper pitch conversion substrate 23a was manufactured in the same manner as in the method of manufacturing the pitch conversion substrate of Example 7, except that the opening pattern of the connection electrode resist was changed to a circle having a diameter of 200 m. Manufactured.

The obtained pitch conversion board 23a for the upper side has a vertical and horizontal dimension of 120 mm × 160 mm, a thickness of 0.5 mm, a dimension of a portion of the connection electrode 25 exposed on the surface of the insulating layer of the connection electrode 25 having a diameter of about 250 m, and a connection electrode of about 250 m. The protruding height from the surface of the insulating layer is about 60 m, and one of the connecting electrodes is connected to one of the electrodes to be tested on the circuit board. The diameter of 24 was 0.4 mm, the arrangement pitch of the terminal electrodes 24 was 0.75 mm, and the surface roughness of the insulating layer on the side where the connection electrodes 24 were formed was 0.02 m.

[0290] Further, in the same manner as described above, a lower pitch conversion substrate 23b having 2500 connection electrodes 25 on the front surface and 2500 terminal electrodes 24 on the rear surface was prepared.

The pitch conversion board 23b for the lower side has a vertical and horizontal dimension of 120 mm X 160 mm, a thickness of 0.5 mm, and a diameter of a portion exposed on the surface of the insulating layer in the connection electrode 25 is about 250 / zm. The connection electrode 25 is arranged so that the protruding height of the surface force is about 60 / ζπι, and one of the connection electrodes is connected to one of the electrodes to be inspected on the circuit board to be inspected. Is 0.4 mm, the arrangement pitch of the terminal electrodes 24 is 0.75 mm, and the surface roughness of the insulating layer on the front surface (the surface on which the connection electrode is formed) is 0.02 m.

[0291] For the manufactured inspection device, the minimum press pressure, the durability of the anisotropic conductive sheet, and the evaluation of the conduction failure of the circuit board to be inspected were measured in the same manner as in Example 7. Table 5 shows the measurement results of the minimum press, Table 6 shows the measurement results of the durability of the anisotropic conductive sheet, and Table 7 shows the evaluation of the conduction failure of the circuit board to be inspected.

[0292] [Table 5]

[0293] [Table 6] NG inspection point ratio (%) Number of presses (times) 1 1000 5000 10000 30000 Example 7 T-less pressure ISOkgi '0 0 0.09 0.22 1.4

7'less pressure 210kgf 0 0.02 0.13 0.25 2.1 Example 8 r less pressure i80kgf 0 0 0.12 0.24 1.5

7 ° less pressure 210kgf 0 0.04 0.15 0.38 2.3

[Table 7]

[Example 9]

(Evaluation circuit board)

An evaluation circuit board 1 having the following specifications was prepared.

Dimensions: 100mm (length) X 100mm (width) X O. 8mm (thickness)

Number of electrodes to be inspected on the upper surface: 3600

Diameter of the electrode to be inspected on the top side: 0.3 mm

Minimum arrangement pitch of electrodes to be inspected on the top side: 0.4 mm

Number of electrodes to be inspected on the lower side: 2600

Diameter of the electrode to be inspected on the bottom side: 0.3 mm

Produced a circuit board inspection device (Fig. 30) for inspecting the above-mentioned evaluation circuit board, which is compatible with the inspection section of a rail transport type circuit board automatic inspection machine (manufactured by Nidec-Read Corporation, product name: STARREC V5). did.

(1) First Anisotropic Conductive Sheet 22

The following first anisotropic conductive sheet was prepared in which conductive particles were arranged in the thickness direction and uniformly dispersed in the plane direction. Dimensions: 110mm XI 10mm, thickness 0. lmm

Elastic polymer material: Material; silicone rubber, hardness; 40

(2) Pitch conversion board 23

Laminated material in which a thin metal layer made of copper is formed on both sides of a 0.5 mm thick insulating substrate made of glass fiber reinforced epoxy resin (Matsushita Electric Works, product name: R-1766) Then, using a numerically controlled drilling device, a total of 7,200 circular through-holes each having a diameter of 0.1 mm and penetrating in the thickness direction of the laminated material were formed.

[0298] Thereafter, the laminated material in which the through holes were formed was subjected to an electroless plating process using an EDTA type copper plating solution to form a copper plating layer on the inner wall of each through hole. By performing electrolytic copper plating using a copper plating solution, a cylindrical via hole with a thickness of about 10 m that electrically connects the thin metal layers on the surface of the laminated material to each other in each through hole. Formed.

Next, a 25 μm thick dry film resist (manufactured by Tokyo Ohka, product name: FP-225) is laminated on the thin metal layer on the surface of the laminated material to form a resist layer, and the other surface of the laminated material is formed. A protective seal was placed on the side thin metal layer. A photomask film is placed on this resist layer, and the resist layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), and then developed to form a resist pattern for etching. Formed. Then, by etching the thin metal layer on the surface on which the resist pattern was formed, 7200 connection electrodes of 60 / ζπι and 150 m in length and each connection electrode were formed on the surface of the insulating substrate. A pattern wiring portion having a line width of 100 m for electrically connecting the via hole and the via hole was formed, and then the resist pattern was removed.

[0299] Next, a 50 μm thick A dry film resist (Tokyo Ohka, product name: FP-225) is laminated to form a resist layer, a photomask film is placed on this resist layer, and a parallel light exposure machine ( (Oak Manufacturing Co., Ltd.), and then perform development processing, exposing each connection electrode to form 7200 rectangular 60 / ζπι and 150 / zm rectangular An opening was formed.

[0300] Then, using a copper sulfate plating solution, a thin metal layer on the other surface side of the laminated material was used as a common electrode, and each connection electrode was subjected to electrolytic copper plating treatment, whereby 7,200 connection electrodes were formed. Formed. Next, the resist pattern was removed.

[0301] Next, a protective seal was applied to the surface on the side where the connection electrodes of the laminated material were formed, and then an etching process was performed. A pattern wiring portion for electrically connecting the pole and the via hole was formed, and the resist pattern was removed.

Next, a 38 μm-thick dry film solder resist (manufactured by Tigo Morton, product name: ComfoMask 2015) is laminated on the back surface of the insulating substrate on which the terminal electrodes and the pattern wiring portion are formed to form an insulating layer. A photomask film is arranged on the insulating layer, and then the electrode is exposed by subjecting the insulating layer to an exposure process using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.) and then performing a development process. 7,200 openings with a diameter of 0.4 mm were formed.

[0302] As described above, the pitch conversion substrate 23 was manufactured. The pitch conversion substrate 23 has a vertical and horizontal dimension of 120 mm x 160 mm, a thickness of 0.5 mm, and a dimensional force of a portion of the connection electrode 25 exposed from the surface of the insulating layer. The surface height of the insulating layer of electrode 25 is about 60 m, and the distance between paired connecting electrodes 25 is 100. m, the diameter of the terminal electrode 24 was 0.4 mm, the arrangement pitch of the terminal electrodes 24 was 0.75 mm, and the surface roughness of the insulating layer on the side where the connection electrode 24 was formed was 0.02 m.

[0303] In the same manner as described above, the pitch conversion substrate 23b for the second inspection jig l ib having 5200 connection electrodes 25 on the front surface and 5200 terminal electrodes 24 on the back surface is provided. It was made.

[0304] (3) Circuit board side connector 21

[Second anisotropic conductive sheet 26]

Dimensions: 11 Omm X 150mm

Thickness of conductive path forming part: 0.6mm

Outer diameter of conductive path forming part: 0.35mm

Projection height of conductive path forming part: 0.05 mm

Elastic polymer material: Material; silicone rubber, hardness; 30

(W / Ό = 17) [0305] (4) Medium ϋ pin unit 31

Then, the distance L1 between the first insulating plate 34 and the intermediate holding plate 36 is 36.3 mm, and the distance L2 between the second insulating plate 35 and the intermediate holding plate 36 is 3 mm. The first support pin 33 (diameter 2 mm, length 36.3 mm) and the second support pin 37 (diameter 2 mm, length 3 mm) are fixed and supported, and the first insulation plate 34 and the second insulation The conductive pin 32 having the following configuration was disposed between the plate 35 and the through-hole 83 (0.4 mm in diameter) so as to be movable.

[Conductive pin]

Material: Brass with gold plating

Tip 81a dimensions: 0.35mm outer diameter, 2.lmm overall length

Dimension of central part 32 Outer diameter 0.45mm, total length 41mm

Base end 8 lb dimensions: 0.35 mm outer diameter, 2.lmm overall length

[0306] The first contact support position 38A of the first support pin 33 with the intermediate holding plate 36 and the second contact support position 38B of the second support pin 37 with the intermediate holding plate 36 are , Arranged in a grid. The distance between the adjacent first contact support positions 38A and the distance between the second contact support positions 38B were 17.5 mm.

(5) Tester side connector 41

The tester-side connector 41 is composed of a third anisotropic conductive sheet 42, a connector board 43, and a base plate 46. The third anisotropic conductive sheet 42 used was the same as the second anisotropic conductive sheet 26 described above.

〔performance test〕

1. Measurement of minimum press pressure

The created inspection device is set in the inspection section of the rSTARREC V5J automatic circuit board inspection machine, and the evaluation circuit board 1 prepared for the inspection device is set. STARREC V5J press pressure in the range of 100-210kgf Of the test electrode of the circuit board for evaluation 10 times for each press pressure condition, when a current of 1 mA was applied to the test electrode from the current supply electrode. The conduction resistance value was measured with a voltage measuring electrode.

[0308] Inspection points having a measured conduction resistance value of 10 Ω or more (hereinafter, referred to as "NG inspection points") are determined to be continuity failures, and the percentage of NG inspection points in the total inspection points (hereinafter, "NG inspection points"). Inspection point ratio ”) was calculated, and the lowest press pressure at which the NG inspection point ratio was 0.01% or less was determined as the minimum press pressure.

[0309] Specifically, the number of NG test points was 3600 on the upper surface of the circuit board 1 for evaluation and 2600 on the lower surface of the circuit board 1 for evaluation, and the measurement was performed 10 times under each press pressure condition. This shows the percentage of NG inspection points in the 62,000 inspection points calculated by the formula (3600 + 2600) X 10 = 62000. Table 8 shows the measurement results.

[0310] 2. Measurement of durability of anisotropic conductive sheet

The fabricated inspection device is set in the inspection section of the rSTARREC V5J automatic circuit board inspection machine, and the evaluation circuit board 1 prepared for the inspection device is set. After the press pressure condition of rSTARREC V5J is set to 130 kgf and pressurization is performed a predetermined number of times, the electrode to be inspected of the evaluation circuit board 1 is changed from the current supply electrode to the test electrode under the condition of the press pressure of 130 kgf. Conduction resistance was measured 10 times when a current of 1 mA was applied, and the operation of applying pressure a predetermined number of times and similarly measuring the conduction resistance 10 times with a voltage measurement electrode was repeated.

[0311] Inspection points where the measured conduction resistance value was 10 Ω or more (NG inspection points) were determined to be poor conduction, and the percentage of NG inspection points in the total inspection points (NG inspection point ratio) was calculated.

Next, the anisotropic conductive sheet in the inspection device was replaced with a new one, and a predetermined number of pressurizations were performed under the same conditions as above except that the press pressure condition was changed to 150 kgf. The NG inspection point ratio was calculated by the same method as above except that the weight was set to 150 kgf. [0312] In measuring the conduction resistance value related to the durability of the anisotropic conductive sheet, after the measurement of one conduction resistance value is completed, the press pressure related to the measurement is released and the inspection device is not operated. The state was returned to the pressurized state, and the next measurement of the conduction resistance was performed again by applying a predetermined magnitude of press pressure.

Specifically, the ratio of NG test points is that the number of electrodes to be inspected on the upper surface of the evaluation circuit board 1 is 3600, and the number of electrodes to be inspected on the lower surface is 2600. This shows the percentage of NG inspection points in the 62,000 inspection points calculated by the formula (3600 + 2600) X 10 = 62000.

[0313] In this case, the inspection device requires that the percentage of NG inspection points be 0.01% or less for practical use, and if the percentage of NG inspection points exceeds 0.01%, a non-defective product In some cases, an erroneous inspection result indicating that the circuit board to be inspected is defective may be obtained, which may make it impossible to perform an electrical inspection of the circuit board with high reliability. Table 9 shows the measurement results.

[0314] 3. Evaluation of conduction failure of circuit board to be inspected

Then, the evaluation circuit board 1 was evaluated by changing the setting of the conduction resistance value, which is determined as an NG inspection point, to a resistance value lower than 100 Ω for the same evaluation circuit board 1. Table 10 shows the measurement results.

[0315] [Example 10]

In place of the relay pin unit 31 of the ninth embodiment, relay pin units 31a and 31b as shown in FIG. 1 were used. That is, a large number (8000) at a fixed pitch (2.54 mm pitch) Pins) were used having conductive pins 32a, 32b arranged thereon and insulating plates 34a, 34b and 35a, 35b for supporting the conductive pins 32a, 32b movably up and down.

With respect to the manufactured inspection device, the minimum press pressure and the durability of the anisotropic conductive sheet were measured in the same manner as in Example 9. Table 8 shows the measurement results of the minimum press, and Table 9 shows the measurement results of the durability of the anisotropic conductive sheet.

[0316] [Example 11]

In the inspection device of Example 9, the substrate for pitch conversion was changed to the following.

Laminated material in which a thin metal layer made of copper is formed on both sides of a 0.5 mm thick insulating substrate made of glass fiber reinforced epoxy resin (Matsushita Electric Works, product name: R-1766) Then, a numerically controlled drilling device was used to form a total of 3600 circular through holes each having a diameter of 0.2 mm and penetrating in the thickness direction of the laminated material.

[0317] In the method of manufacturing the pitch conversion substrate of Example 9, the pitch conversion substrate for the upper side was manufactured in the same manner as in Example 9 except that the opening pattern of the resist for the connection electrode was changed to a circle having a diameter of 200 m. Was manufactured.

The obtained pitch conversion board for the upper side has 3600 connection electrodes 25 on the surface, the vertical and horizontal dimensions are 120 mm X 160 mm, the thickness is 0.5 mm, and the surface of the insulating layer of the connection electrodes 25 is also exposed. The dimensions of the connection electrode 25 are about 250 m, the surface of the insulation layer of the connection electrode 25 is protruding, and the height of the connection electrode is about 60 m. Are arranged, the diameter of the terminal electrode 24 is 0.4 mm, the arrangement pitch of the terminal electrodes 24 is 0.75 mm, and the surface roughness of the insulating layer on the side where the connection electrode 24 is formed is 0.02. m.

Also, in the same manner as above, a lower pitch conversion substrate having 2600 connection electrodes 25 on the front surface and 2600 terminal electrodes 24 on the rear surface was prepared.

The pitch conversion board for the lower side has a vertical and horizontal dimension of 120 mm x 160 mm, a thickness of 0.5 mm, a diameter of a portion of the connection electrode 25 exposed on the surface of the insulating layer of about 250 m, and an insulation of the connection electrode 25. The connection electrode 25 is arranged so that the protruding height of the surface force of the layer is about 60 m, and one of the connection electrodes is connected to one of the electrodes to be inspected on the circuit board to be inspected. 0.4 mm, the pitch of terminal electrodes 24 is 0.75 mm, The surface roughness of the insulating layer on the side where the connection electrode is formed is 0.02 m.

[0319] With respect to the produced inspection device, the minimum press pressure and the durability of the anisotropic conductive sheet were measured in the same manner as in Example 9. The measurement results of the durability of the anisotropic conductive sheet are shown in Table 10, and the evaluation was performed by changing the conduction resistance value, which is judged as the NG inspection point of the conduction failure of the circuit board to be inspected, to a resistance value lower than 100 Ω. Table 11 shows the results.

Note that in Tables 8 and 9, the four-terminal test was used, so the set voltage was set to 10 Ω, and in Tables 10 and 11, two-terminal test was used (Example 11). Therefore, the test was conducted with the set voltage set to 100 Ω.

[0320] [Table 8]

[0321] [Table 9]

[0322] [Table 10]

[0323] [Table 11] NG inspection point ratio (%)

Set resistance (Ω) 100 50 10 1 0.5 0.1 0.01 Example 9 Dulles pressure 180kgf 0 0 0 0.01 0.03 4.2 8.5 Pressure 210kgf 0 0 0 0.02 0.02 3.8 9.0 Example 1 1 1'less pressure 180kgf 0 0.5 4.2 Measurement Measurement Measurement Measurement impossible impossible impossible impossible impossible Freeze pressure 210 kgf 0 0.6 3.9 measurement measurement measurement measurement impossible impossible impossible impossible impossible

Claims

The scope of the claims

[1] A circuit board inspection apparatus that performs an electrical inspection by pressing both sides of a circuit board to be inspected between both inspection jigs with a pair of a first inspection jig and a second inspection jig. And

The first inspection jig and the second inspection jig are each

A circuit board side connector having

A plurality of conductive pins arranged at a predetermined pitch,

With «I-pin unit and

A connector board for electrically connecting the tester to the relay pin unit; a third anisotropic conductive sheet disposed on the relay pin unit side of the connector board; and an opposite side of the connector board to the relay pin unit And a tester Tsukuda j connector provided with:

A circuit board inspection apparatus, wherein the first anisotropic conductive sheet is an anisotropic conductive sheet in which conductive particles are arranged in a thickness direction and uniformly dispersed in a surface direction.

[2] The thickness W of the first anisotropic conductive sheet is 0.03 to 0.5 mm,

1

The number average particle diameter D force is 50 μm, and the ratio W / Ό between the thickness W and the number average particle diameter D is 1

1 1 1 1 1

2. The circuit board inspection apparatus according to claim 1, wherein the durometer hardness of the insulating elastomer constituting the sheet base material is 30 to 90.

[3] The first anisotropic conductive sheet has a surface roughness of 0.5 to 5 m on a surface in contact with the circuit board to be inspected, and a surface roughness on a surface in contact with the pitch conversion substrate. But

0.3 / z m or less,

3. The circuit according to claim 1, wherein the pitch conversion substrate has a surface roughness of 0.2 m or less at an insulating portion on a surface in contact with the first anisotropic conductive sheet. 4. Road board inspection equipment.

[4] The second anisotropic conductive sheet is composed of a plurality of conductive path forming portions extending in the thickness direction and an insulating portion for insulating these conductive path forming portions from each other, and the conductive particles are formed in the conductive path forming portion. 13. The conductive particles according to claim 13, wherein the conductive particles are non-uniformly dispersed in the plane direction, and the conductive path forming portions protrude on one side of the sheet. A circuit board inspection apparatus according to any one of the above.

[5] The thickness W of the conductive path forming portion in the second anisotropic conductive sheet is 0.1 to 2 mm.

2

The conductive particles have a number average particle diameter D of 5 200 μm, a thickness W and a number average particle diameter D.

The ratio W / D to 2 2 1 is 1.1-10, and the durometer of the insulating elastomer constituting the sheet base material

twenty two

The circuit board inspection device according to claim 4, wherein the meter hardness is 15-60.

[6] The third anisotropic conductive sheet includes a plurality of conductive path forming portions extending in the thickness direction, and an insulating portion that insulates the conductive path forming portions from each other. The conductive particles are non-uniformly dispersed in the surface direction, and the conductive path forming portion protrudes on one surface side of the sheet. A circuit board inspection apparatus according to any one of the above.

[7] The pitch conversion substrate is provided with a connection electrode composed of a pair of a current terminal electrode and a voltage terminal electrode, and the connection electrode is connected to each of the electrodes to be inspected of the circuit board to be inspected. Are arranged on the pitch conversion board so that the current terminal electrode and the voltage terminal electrode are electrically connected to each other.

A current pin-side electrode and a voltage pin-side electrode are arranged on the connector board so as to be electrically connected to the current terminal electrode and the voltage terminal electrode of the pitch conversion board, respectively. 17. The circuit board inspection apparatus according to claim 16, wherein the inspection apparatus is a circuit board inspection apparatus.

[8] The relay pin unit, An intermediate holding plate disposed between the first insulating plate and the second insulating plate,

A first support pin disposed between the first insulating plate and the intermediate holding plate,

A second support pin disposed between the second insulating plate and the intermediate holding plate,

With

A first contact support position of the first support pin with respect to the intermediate holding plate and a second contact support position of the second support pin with respect to the intermediate holding plate are in the thickness direction of the intermediate holding plate. 18. The circuit board inspection apparatus according to claim 17, wherein the apparatus is arranged at a different position on the projected intermediate holding plate projection plane.

When a pair of the first inspection jig and the second inspection jig sandwiches both sides of the circuit board to be inspected between the two inspection jigs,

The intermediate holding plate is bent in the direction of the second insulating plate around a first contact support position of the first support pin with respect to the intermediate holding plate,

The intermediate holding plate is configured so as to extend in the direction of the first insulating plate around a second contact support position of the second support pin with respect to the intermediate holding plate. Item 9. The circuit board inspection apparatus according to Item 8.

First contact support positions of the first support pins with respect to the intermediate holding plate are arranged in a grid on the intermediate holding plate projection plane,

On the intermediate holding plate projection plane, one second contact support position is arranged in a unit lattice area where four adjacent first contact support position forces are also provided,

In the intermediate holding plate projection plane, one first contact support position is arranged in a unit lattice region where four adjacent second contact support position forces are also provided. The circuit board inspection apparatus according to claim 8 or 9, wherein

The relay pin unit,

Holding plate support pins arranged between adjacent intermediate holding plates, With

In at least one intermediate holding plate, a holding support position of the holding plate support pin abutting against the intermediate holding plate from one surface side, and a second holding position abutting against the intermediate holding plate from the other surface side. The contact support position of the first support pin, the second support pin, or the support plate support pin with respect to the intermediate support plate is different on the intermediate support plate projection plane projected in the thickness direction of the intermediate support plate. The circuit board inspection apparatus according to any one of claims 17 to 17, wherein the circuit board inspection apparatus is arranged in a circuit board.

[12] In all of the intermediate holding plates, a holding support position of the holding plate support pin, which is in contact with the intermediate holding plate on one surface side, and the other surface side with respect to the intermediate holding plate. The contact support position of the first support pin, the second support pin, or the support plate support pin with which the force comes into contact with the intermediate support plate is defined on the intermediate support plate projection surface projected in the thickness direction of the intermediate support plate. The circuit board inspection apparatus according to claim 11, wherein the inspection apparatus is arranged at different positions.

[13] A method for inspecting a circuit board using the circuit board inspection apparatus according to claim 11,

A circuit board is characterized in that a pair of first and second inspection jigs presses both sides of a circuit board to be inspected between the two inspection jigs to perform an electrical inspection. Inspection methods.