KR20070007124A - Circuit substrate inspection device and circuit substrate inspection method - Google Patents

Abstract

There is provided a circuit substrate inspection device capable of performing electrical inspection of a circuit substrate with a high reliability even when the circuit substrate to be inspected has small electrodes of a small pitch. The circuit substrate inspection device includes a first inspection jig and a second inspection jig, between which a circuit substrate to be inspected is arranged with a sandwiching pressure for performing electric inspection. As a first anisotropic conductive sheet arranged at the side of the circuit substrate to be inspected for a pitch conversion substrate, there is used an anisotropic conductive sheet having conductive particles arranged in the thickness direction and uniformly dispersed in the surface direction. Moreover, a connection electrode of the pitch conversion substrate is formed by a current terminal electrode and a voltage terminal electrode which are electrically connected to respective inspection electrodes of the circuit substrate to be inspected. On the connector substrate, there are arranged a current pin side electrode and a voltage pin side electrode to be electrically connected respectively to the current terminal electrode and the voltage terminal electrode of the pitch conversion substrate. Moreover, an intermediate holding plate is arranged between a first insulation plate and a second insulation plate in a relay pin unit and between them, support pints are arranged at abutment support positions different from the front and the rear surfaces. ® KIPO & WIPO 2007

Description

Circuit Board Inspection System and Circuit Board Inspection Method {CIRCUIT SUBSTRATE INSPECTION DEVICE AND CIRCUIT SUBSTRATE INSPECTION METHOD}

The present invention is formed on both sides of a circuit board under test by pinching a circuit board (hereinafter referred to as a "test circuit board") to be inspected for electrical inspection from both sides with an upper inspection jig and a lower inspection jig. An inspection apparatus for a circuit board and an inspection method for a circuit board, which inspect the electrical characteristics of the circuit board under test with the electrode electrically connected to the tester.

A printed circuit board for mounting an integrated circuit or the like checks electrical characteristics to confirm that the wiring pattern of the circuit board has a predetermined performance before mounting the integrated circuit or the like.

In this electrical inspection, a test head is put into the test | inspection tester provided with the conveyance mechanism of a circuit board, for example, and a test of a different circuit board is carried out by replacing a test head part.

For example, as disclosed in Patent Document 1 (Japanese Patent Laid-Open No. Hei 6-94768), a test pin of a metal which is electrically connected to a test electrode of a circuit board to be inspected and electrically conductive is installed on the board. A method using the inspection jig of a structure is proposed.

In addition, as disclosed in Patent Document 2 (Japanese Patent Laid-Open No. Hei 5-159821), an inspection head having a conductive pin, a circuit board for pitch conversion called an off-grid adapter, and an anisotropic conductive sheet are combined. The method of using an inspection jig is known.

However, as in Patent Document 1, in the method of using a test jig in which a metal test pin is brought into direct contact with a test electrode of a test circuit board, the electrode of the test circuit board may be damaged by contact with a conductive pin made of metal. There is a possibility.

Particularly, in recent years, miniaturization and densification of circuits have progressed in circuit boards. In the case of inspecting such a printed circuit board, in order to simultaneously conduct conductive contact of a plurality of conductive pins with a test electrode of a circuit board under test, a test is performed at high pressure. It is necessary to pressurize the jig, and the electrode to be inspected is easily damaged.

In the inspection jig for inspecting such a miniaturized and densified printed circuit board, it is technically difficult to plant and install a large number of metal pins on the substrate at high density. Moreover, the manufacturing cost also becomes expensive, and when some metal pin is damaged, it is difficult to repair and replace.

On the other hand, as in Patent Document 2, in an inspection jig using an anisotropic conductive sheet, the inspected electrode of the circuit board under test comes into contact with the electrode of the substrate for pitch conversion through the anisotropic conductive sheet, so that the inspected circuit board There is an advantage that the electrode under test is hard to be damaged. In addition, since a substrate for converting pitches is used, the inspection pins planted on the substrate can be planted and installed at a pitch wider than the pitch of the electrodes to be inspected on the circuit board. There is no need, and there is an advantage that the manufacturing cost of the inspection jig can be saved.

However, in this inspection jig, it is necessary to create an inspection jig for planting and installing a pitch conversion substrate and an inspection pin for each inspection circuit board to be inspected, so that the same test jig as the printed circuit board as the inspection circuit board to be inspected. Is needed.

For this reason, when producing a some printed circuit board, there exists a problem that a some inspection jig should be hold | maintained correspondingly. In particular, in recent years, the product cycle of electronic devices has been shortened, and the production period of printed circuit boards used in products has been shortened. However, the inspection jig cannot be used for a long time, and the production of printed circuit boards is switched. There was a problem that the inspection jig should be produced.

As a countermeasure against such a problem, for example, relays such as Patent Documents 3 to 5 (Japanese Patent Laid-Open No. 7-248350, Japanese Patent Laid-Open No. 8-271569, and Japanese Patent Laid-Open No. 8-338858) An inspection apparatus using a so-called universal type inspection jig using a pin unit has been proposed.

Fig. 31 is a sectional view of an inspection apparatus using such a universal type jig.

The inspection apparatus includes an upper inspection jig 111a and a lower inspection jig 111b, and these inspection jig includes circuit board side connectors 121a and 121b, relay pin units 131a and 131b, and tester side connectors 141a, 141b).

The circuit board side connectors 121a and 121b are provided with the pitch conversion boards 123a and 123b and the anisotropic conductive sheets 122a, 122b, 126a and 126b disposed on both sides thereof.

The relay pin units 131a and 131b include a plurality of conductive pins 132a and 132b arranged on a grid point at a predetermined pitch (for example, 2.54 mm pitch) and the conductive pins 132a and 132b. A pair of insulating plates 134a, 134b, and 135a, 135b for supporting the 132b so as to be movable up and down is provided.

The tester side connectors 141a and 141b electrically connect the tester and the conductive pins 132a and 132b when the circuit board 101 is pinched by the test jigs 111a and 111b. And anisotropic conductive sheets 142a and 142b and base plates 146a and 146b disposed on the conductive pins 132a and 132b side of the connector boards 143a and 143b.

The inspection jig using this relay pin unit is enough to replace the circuit board side connectors 121a and 121b with those corresponding to the inspection circuit board 101 when inspecting a printed circuit board that is a different inspection target. The pin units 131a and 131b and the tester side connectors 141a and 141b can be used in common.

However, in such a conventional type of inspection jig, a plurality of conductive path forming portions extending in the thickness direction as the anisotropic conductive sheets 122a and 122b constituting the circuit board side connectors 121a and 121b and these conductive path forming portions The anisotropic conductive sheets 122a and 122b of the uneven type which consist of an insulating part which insulate each other, and which electroconductive particle is contained only in a conductive path forming part and are disperse | distributed unevenly to a surface direction, and the conductive path forming part protruded on one side of a sheet | seat are provided. I use it.

The anisotropic conductive sheets 122a and 122b of the ubiquitous type have a problem that the deterioration of the conductive path forming portion is rapid due to repeated use in inspection, and the resistance value increases when the conductive path forming portion deteriorates. When the deteriorated anisotropic conductive sheets 122a and 122b are replaced, the alignment and circuit board side connectors 121a and 121b of the anisotropic conductive sheets 122a and 122b and the pitch conversion boards 123a and 123b are replaced each time they are replaced. And relay pin units 131a and 131b need to be aligned, replacement work is complicated, replacement frequency is high, and inspection efficiency is lowered.

In addition, when the electrode under test of the circuit board 101 to be tested has a small pitch such as 200 µm or less, in the case of using the above-described anisotropic conductive sheets 122a and 122b, the anisotropic conductive sheet is used. When the alignment between the 122a and 122b and the pitch conversion substrates 123a and 123b becomes difficult and the inspection is continuously performed on the plurality of inspected circuit boards 101, the inspected circuit board 101 and By repeating contact, position shift of the anisotropic conductive sheets 122a and 122b easily occurs.

As a result, the conductive path forming portions of the anisotropic conductive sheets 122a and 122b and the electrode positions of the circuit board 101 to be inspected do not coincide with each other, so that a good electrical connection cannot be obtained. Originally, a printed circuit board, which should be judged as a good product, is likely to be misjudged as a defective product.

On the other hand, when using the connector which integrated the anisotropically conductive sheet | seat and the pitch conversion board | substrate as described, for example in patent document 6 (Unexamined-Japanese-Patent No. 6-82531), although an alignment is easy, it is an anisotropically conductive sheet part When it deteriorates, it must replace every pitch conversion board | substrate, and a large number of pitch conversion board | substrates are needed, and inspection cost increases.

On the other hand, the printed wiring board which is the circuit board 101 to be inspected has a high density of multilayers, and in actuality, the height variation caused by the inspected electrodes 102 and 103 such as solder ball electrodes such as BGA, Warping of the substrate itself occurred. Therefore, in order to achieve electrical connection to the inspection electrodes 102 and 103 which are inspection points on the circuit board 101 to be tested, the upper inspection jig 111a and the lower inspection jig 111b are pressurized with a high pressure, It is necessary to deform the circuit board 101 to be inspected evenly, and the inspection electrode (on the inspection jig 111a and the inspection jig 111b side) with respect to the height deviation of the inspection electrodes 102 and 103. It is necessary to follow the height of 102 and 103).

In the conventional inspection jig of such a universal type, the height deviation of the electrodes 102 and 103 to be inspected is followed by the axial movement of the conductive pins 132a and 132b. However, the axes of the conductive pins 132a and 132b are tracked. Since there is a limit in the amount of directional movement, there is a case where the followability with respect to the height deviation of the inspected electrodes 102 and 103 is not good, so that poor conduction occurs and accurate inspection cannot be performed.

Moreover, in this universal type test jig, the press pressure at the time of pinching the test circuit board 101 by the upper test jig 111a and the lower test jig 111b is the upper and lower anisotropic conductive sheets 122a, 122b, 126a, 126b, 142a, and 142b).

Therefore, in such a universal type inspection jig, it is necessary to arrange the conductive pins 132a and 132b at regular intervals in order to support the substrates 123a and 123b for pitch conversion and to disperse the press pressure.

Moreover, in the conventional universal type jig, since the press pressure is received by the conductive pins 132a and 132b, it is necessary to arrange a plurality of conductive pins 132a and 132b at regular intervals.

For this reason, when the insulating plates 134a and 134b having 10,000 or more through holes are formed, for example, at a pitch of 0.75 mm, corresponding to the miniaturization of the electrodes of the circuit board 101 under test, the insulating plates 134a, 134b and 135a. When the thickness of the substrate of 135b is thin, the strength decreases and may break when bent. Therefore, it is necessary to thicken the insulating plates 134a, 134b, and 135a, 135b.

Patent Document 1: Japanese Patent Laid-Open No. 6-94768

Patent Document 2: Japanese Patent Laid-Open No. 5-159821

Patent Document 3: Japanese Patent Laid-Open No. 7-248350

Patent Document 4: Japanese Patent Application Laid-Open No. 8-271569

Patent Document 5: Japanese Patent Application Laid-Open No. 8-338858

Patent Document 6: Japanese Patent Application Laid-Open No. 6-82531

<Start of invention>

Problems to be Solved by the Invention

The present invention provides a circuit board inspection apparatus and a circuit board inspection method capable of performing highly reliable electrical inspection even when the inspected circuit board to be inspected has a microelectrode arranged at a fine pitch in view of such a phenomenon. For the purpose of

Moreover, this invention provides the test | inspection apparatus of the circuit board and the test method of a circuit board which have a high frequency and the inspection efficiency with little replacement frequency by the deterioration of an anisotropic conductive sheet, when repeating continuous test | inspection is carried out with respect to the circuit board to be tested. For the purpose of

In addition, the present invention is a circuit board inspection apparatus and a circuit board inspection method which require less correction of positional deviation of an anisotropic conductive sheet and have good workability when inspection is repeatedly performed on a circuit board to be inspected. The purpose is to provide.

In addition, the present invention provides a circuit board inspection apparatus and a circuit board inspection method in which an anisotropic conductive sheet is easily replaced when an anisotropic conductive sheet deteriorates in a repetitive continuous inspection of a circuit board under test. The purpose.

In addition, according to the present invention, even if the circuit to be inspected is changed, the inspection circuit can be applied to all inspected circuit boards simply by changing the circuit board for inspection without separately manufacturing the entire inspection apparatus (the entire inspection jig). It is an object of the present invention to provide an inspection apparatus for a circuit board and a method for inspecting the circuit board as much as possible.

Moreover, this invention provides the test | inspection apparatus of the circuit board and the test method of a circuit board which can perform accurate test | inspection without generating a conduction defect because the followability with respect to the height deviation of the to-be-tested electrode of the circuit board under test is good. It aims to do it.

Means for solving the problem

The inspection apparatus of the circuit board of this invention is a circuit board which clamps both surfaces of the to-be-tested circuit board test object between a pair of 1st test jig and a 2nd test jig, and performs an electric test. As an inspection device of

The first inspection jig and the second inspection jig, respectively,

A pitch conversion substrate for converting an electrode pitch between one surface side and the other surface side of the substrate,

A first anisotropic conductive sheet disposed on an inspection circuit board side of the pitch conversion substrate;

A circuit board side connector having a second anisotropic conductive sheet disposed on a side opposite to the circuit board under test of the pitch conversion substrate;

A plurality of conductive pins arranged at a predetermined pitch,

A relay pin unit having a pair of spaced apart first insulating plates and a second insulating plate to axially move the conductive pins;

A connector board electrically connecting the tester and the relay pin unit;

A third anisotropic conductive sheet disposed on the relay pin unit side of the connector board;

A tester side connector having a base plate disposed on the opposite side of the relay pin unit of the connector board,

The first anisotropic conductive sheet is an anisotropic conductive sheet in which the conductive particles are arranged in the thickness direction and uniformly dispersed in the surface direction.

Moreover, the test method of the circuit board of this invention is a test method of the circuit board which used the test apparatus of said circuit board,

The pair of first inspection jig and the second inspection jig clamp the both sides of the circuit board to be inspected between the two inspection jigs and perform electrical inspection.

In the above invention, the thickness W ₁ of the first anisotropic conductive sheet is 0.03 to 0.5 mm, the number average particle diameter D ₁ of the conductive particles is 3 to 50 μm, the thickness W ₁ and the number average particle diameter D ₁ the ratio of W ₁ / D ₁ is 1.1 to 10 and preferably a durometer hardness of the elastomer constituting the insulating sheet base of 30 to 90.

According to the inspection apparatus of the circuit board of this invention, it is a 1st anisotropically conductive sheet arrange | positioned between the circuit board to be tested and the board | substrate for pitch conversion, Comprising: Electroconductive particle arrange | positions in thickness direction and is uniform to surface direction. The dispersed anisotropic conductive sheet is used.

For this reason, when performing repeated continuous test | inspection with respect to a test | inspection circuit board, the exchange frequency by deterioration of an anisotropic conductive sheet is small and inspection efficiency is high.

Moreover, even if it is a test board | substrate with a microelectrode arrange | positioned with the fine pitch of 200 micrometers or less, and an electrode width is 100 micrometers or less, even if it maintains the insulation state between each inspected electrode of a circuit board under test, Electrical connection between the electrode and the test electrode of the circuit board side connector can be achieved. And since it does not have a conductive path formation part blocked by the insulated part, even if the position shift of the anisotropic conductive sheet to the horizontal direction arises at the time of the repetitive test of a circuit under test, the test | inspection electrode of a circuit under test and a circuit board always Since electrical connection of the test electrode of the side connector is achieved, it is possible to suppress the misjudgement of the inspected circuit board of the good product due to the positional shift of the anisotropic conductive sheet.

In addition, since the first anisotropic conductive sheet is separate from the circuit board for inspection, when deterioration occurs in the first anisotropic conductive sheet, only the first anisotropic conductive sheet needs to be replaced. Since the inspection circuit board can be reused without having to replace the first anisotropic conductive sheet at the time of replacement, the inspection cost of the inspection circuit board can be reduced.

As described above, according to the inspection apparatus of the circuit board of the present invention, even if the circuit board to be inspected has a microelectrode arranged at a fine pitch, reliable electrical inspection can be performed.

In the inspection apparatus for a circuit board of the present invention, the first anisotropic conductive sheet has a surface roughness of 0.5 to 5 μm on the surface of the side in contact with the circuit board under test, and is provided on the surface of the side in contact with the substrate for pitch conversion. The surface roughness in 0.3 micrometers or less, and the said pitch conversion board | substrate are the surface roughness of the insulating part in the surface of the side which contact | connects a 1st anisotropically conductive sheet, It is characterized by the above-mentioned.

Thus, since the contact surface of the 1st anisotropically conductive sheet | seat to the to-be-tested circuit board was made into the rough surface which has a specific surface roughness, the to-be-tested circuit board and 1st anisotropy when pressurization with respect to a to-be-tested circuit board are released. The contact area with an electroconductive sheet becomes small. Therefore, the adhesiveness of the insulating elastomer which is a sheet | seat base material can be suppressed, and it can prevent or suppress that a circuit board to be tested adheres to a 1st anisotropic conductive sheet.

In addition, since the contact surface of the first anisotropic conductive sheet to the substrate for pitch conversion was a flat surface having a small surface roughness, and the surface roughness at the insulation portion of the surface of the substrate for pitch conversion was reduced, The contact area of the anisotropic conductive sheet of 1 becomes large. Therefore, even after the pressurization to the circuit board under test is released, the adhesion between them is high, and the first anisotropic conductive sheet is reliably held on the substrate for pitch conversion by the adhesiveness of the insulating elastomer, which is a sheet substrate. For this reason, the detachment of the first anisotropic conductive sheet from the pitch conversion substrate can be prevented, and the inspection operation can be smoothly performed even when the electrical inspection of a plurality of inspected circuit boards is performed continuously.

The inspection apparatus of the circuit board of the present invention comprises a plurality of conductive path forming portions in which the second anisotropic conductive sheet extends in the thickness direction and an insulating portion insulating the conductive path forming portions from each other, wherein the conductive particles form conductive path forming portions. It is contained only inside, and this electroconductive particle is disperse | distributed nonuniformly in a surface direction, and the electrically conductive path formation part protrudes in the sheet surface side. It is characterized by the above-mentioned.

In the above invention, the thickness W ₂ of the conductive path forming portion in the second anisotropic conductive sheet is 0.1 to 2 mm, the number average particle diameter D ₂ of the conductive particles is 5 to 200 μm, and the thickness W ₂ and is a number average particle size of D ₂ ratio W ₂ / D ₂ of a and 1.1 to 10, and the durometer hardness of the insulating elastomer material constituting the sheet group 15 to 60 is preferred.

The inspection apparatus of the circuit board of this invention consists of the some electrically-conductive path formation part by which the said 3rd anisotropic conductive sheet extends in the thickness direction, and the insulating part which insulates these electrically conductive path formation parts mutually, and electroconductive particle is a conductive path formation part It is contained only inside, and this electroconductive particle is disperse | distributed nonuniformly in a surface direction, and the electrically conductive path formation part protrudes in the sheet surface side. It is characterized by the above-mentioned.

Thus, the 2nd anisotropically conductive sheet and the 3rd anisotropically conductive sheet consisted of an electrically conductive path formation part and an insulation part, and electroconductive particle is contained only in an electrically conductive path formation part, and is disperse | distributed unevenly to the surface direction, and the sheet side surface side By using the anisotropic conductive sheet of the uneven type in which the conductive path forming portion protrudes, the pressing force and the impact caused by the pressure of the inspection jig are absorbed into these sheets, whereby the deterioration of the first anisotropic conductive sheet can be suppressed. That is, since the ubiquitous anisotropic conductive sheet has high elasticity, it absorbs the pressing force of the inspection jig at the time of inspection and has excellent impact relieving ability, so that pressure concentration and impact on the first anisotropic conductive sheet having relatively low elasticity can be prevented. It relaxes and suppresses deterioration of a 1st anisotropically conductive sheet | seat. Therefore, the service life of a 1st anisotropically conductive sheet with respect to a repetitive test | inspection becomes long, As a result, the replacement | exchange frequency of a 1st anisotropically conductive sheet can be reduced in the electrical inspection of a circuit board under test, and inspection efficiency improves.

In the inspection apparatus of the circuit board of this invention, the said connection electrode which consists of a pair of current terminal electrode and voltage terminal electrode is provided in the said pitch conversion board | substrate, The said connection electrode is each to-be-tested electrode of a circuit board under test. A pair of current terminal electrodes and a voltage terminal electrode are electrically connected to each other so as to electrically connect the pair of current terminal electrodes to the connector substrate, respectively, to the current terminal electrode and the voltage terminal electrode of the pitch conversion substrate. A current pin side electrode and a voltage pin side electrode are disposed so as to be electrically connected.

With this arrangement, when the electric inspection is performed by pressing both surfaces of the inspection target circuit board to be inspected between the first inspection jig and the second inspection jig, each of the electrodes to be inspected of the circuit board to be inspected is respectively first. Both of the current terminal electrode and the voltage terminal electrode of the connection electrode of the substrate for pitch conversion are electrically connected via the anisotropic conductive sheet of (C).

The terminal terminal for current of the pitch conversion substrate is electrically connected to the current pin side electrode of the connector substrate via the second anisotropic conductive sheet, the conductive pin of the relay pin unit, and the third anisotropic conductive sheet. The voltage terminal electrode of the pitch conversion substrate is electrically connected to the voltage terminal electrode of the connector substrate.

As a result, a current supply path is formed for each of the electrodes to be inspected of the circuit board under test via the current terminal electrodes of the upper and lower pitch conversion substrates, respectively, and for each electrode to be inspected of the circuit board to be inspected, respectively. The voltage measurement path is formed through the voltage terminal electrodes of the upper and lower pitch conversion substrates.

Therefore, each of the electrodes to be inspected of the circuit board under test is interposed with current terminals electrodes of the upper and lower pitch conversion substrates, for example, by using a constant current supply device to supply a constant current to the current supply path. Whether the wiring pattern of the circuit board under test has a predetermined performance by interposing a voltage terminal electrode of the substrate for pitch conversion and measuring the voltage from each electrode for inspection of the circuit board under test by a voltmeter through a voltage measurement path. Confirmation tests of the electrical properties for

On the contrary, each of the electrodes to be inspected on the circuit board under test is interposed with the voltage terminal electrodes of the upper and lower pitch conversion substrates, and a constant voltage is applied to the voltage measurement path using, for example, a constant voltage supply device. Whether the wiring pattern of the circuit board under test has a predetermined performance by measuring the current from each electrode under test on the circuit board under test by an ammeter through a current supply path through the current terminal electrode of the pitch conversion substrate. Confirmation tests of the electrical properties of whether or not may be performed.

As described above, since the voltage and the current can be measured separately for each electrode for inspection of the circuit board under test through a separate voltage measurement path and a current supply path, the wiring pattern of the circuit board under test has a predetermined performance. Accurate confirmation tests can be carried out on the electrical properties of whether or not there is a detection test, and confirmation tests can be conducted in a short time.

The inspection apparatus of the circuit board of this invention is the said relay pin unit,

An intermediate holding plate disposed between the first insulating plate and the second insulating plate;

A first support pin disposed between the first insulating plate and the intermediate holding plate;

With a second support pin disposed between the second insulating plate and the intermediate holding plate,

A first abutment support position with respect to the intermediate holding plate of the first support pin and a second abutment support position with respect to the intermediate holding plate of the second support pin, the intermediate being projected in the thickness direction of the intermediate holding plate It is arrange | positioned in a different position in a holding plate projection surface. It is characterized by the above-mentioned.

In such a configuration, when the electrical inspection is performed by pressing both surfaces of the circuit board to be inspected between the first inspection jig and the second inspection jig and performing the electrical inspection, the movement of the conductive pins of the relay pin unit and The pressure is absorbed by the rubber elastic compression of the first anisotropically conductive sheet, the second anisotropically conductive sheet, and the third anisotropically conductive sheet, and the height deviation of the inspected electrode of the circuit board under test can be absorbed to some extent.

And the intermediate | middle in which the 1st contact support position with the intermediate holding plate of a 1st support pin and the 2nd contact support position with the intermediate holding plate of a 2nd support pin were projected in the thickness direction of an intermediate holding plate. Since it is arrange | positioned in a different position in a holding plate projection surface, when the to-be-tested circuit board which is a test object is further pressed between a 1st test jig and a 2nd test jig, a 1st anisotropically conductive sheet and a 2nd anisotropic conductivity are In addition to the rubber elastic compression of the sheet and the third anisotropic conductive sheet, the spring elasticity of the intermediate holding plate disposed between the first insulating plate and the second insulating plate and the first insulating plate and the second insulating plate of the relay pin unit. As a result, the pressure concentration can be dispersed against the height deviation of the inspected electrode of the circuit board under test, for example, the height variation of the solder ball electrode, thereby avoiding local stress concentration.

Thereby, stable electrical contact is ensured with respect to each of the inspected electrodes of the inspected circuit board having the height deviation. In addition, since stress concentration on the first anisotropic conductive sheet is reduced, local breakage of the first anisotropic conductive sheet is suppressed. As a result, since the repeated use durability of a 1st anisotropically conductive sheet improves, the replacement | exchange frequency of a 1st anisotropically conductive sheet reduces and inspection work efficiency improves.

In addition, since there is no need to arrange the conductive pins at regular intervals, the number of through holes formed in the insulating plate can be reduced. Therefore, the insulating plate can be made thin. In addition, there is less laying work by drilling the through-hole to the insulating plate holding the conductive pin, and the cost required for the production of the inspection apparatus can be reduced.

In the inspection apparatus of the circuit board of the present invention, when the both sides of the inspection target circuit board to be inspected are pinched by the pair of first inspection jig and the second inspection jig, the first supporting pin The second engagement plate with respect to the intermediate holding plate of the second support pin, with the intermediate holding plate bent in the direction of the second insulating plate about the first abutting support position with respect to the intermediate holding plate of The said intermediate | middle holding plate is comprised so that it may bend in the direction of the said 1st insulating plate centering on a contact support position. It is characterized by the above-mentioned.

With this configuration, the intermediate holding plate is bent in opposite directions with respect to the first butting contact position and the second butting support position, so that the intermediate holding plate is an inspection target between the first and second inspection jigs. When the circuit board under test is further pressed, the spring elastic force of the intermediate holding plate is further exerted, and the concentration of pressure can be dispersed against the height deviation of the electrode under test of the circuit board under test so that local stress concentration can be avoided. Local breakage of the first anisotropic conductive sheet is suppressed. As a result, since the repeated use durability of a 1st anisotropically conductive sheet improves, the replacement | exchange frequency of a 1st anisotropically conductive sheet reduces and inspection work efficiency improves.

In the inspection apparatus of the circuit board of this invention, the 1st contact support position with respect to the intermediate | middle holding plate of the said 1st support pin is arrange | positioned at grid shape in the said intermediate | middle holding plate projection surface, The unitary grating | lattice which the 2nd contact support position with respect to an intermediate holding plate is arrange | positioned at the grid | lattice form in the said intermediate | middle holding plate projection surface, and consists of four adjacent 1st contact supporting positions in the said intermediate holding plate projection surface. One first abutment support position is arranged in the region, and in the intermediate holding plate projection surface, one first abutment support position is formed in a unit lattice region composed of four adjacent second abutment support positions. Characterized in that is configured to be arranged.

By such a configuration, the first abutment support position and the second abutment support position are arranged in a lattice form, and the first abutment support position and the second abutment support position are all shifted in a lattice form. Will be deployed.

Therefore, the intermediate holding plate is bent in a direction opposite to each other about the first abutting support position and the second abutting support position, and is inspected as an inspection target between the first inspection jig and the second inspection jig. When the circuit board is pressurized, the spring elastic force of the intermediate holding plate is further exerted, and the pressure concentration can be dispersed against the height deviation of the inspected electrode of the circuit board under test so that local stress concentration can be further avoided. Local breakage of the anisotropic conductive sheet of is suppressed. As a result, since the repeated use durability of a 1st anisotropically conductive sheet improves, the replacement | exchange frequency of a 1st anisotropically conductive sheet reduces and inspection work efficiency improves.

In the inspection apparatus of the circuit board of this invention, the said relay pin unit is arrange | positioned between the several intermediate | middle holding plates arrange | positioned at predetermined intervals between the said 1st insulating plate and a 2nd insulating plate, and adjacent intermediate holding plates. The retaining plate support pins abutting from the one surface side with respect to the intermediate holding plate and the abutment supporting position with respect to the intermediate holding plate and the corresponding intermediate holding plate in at least one intermediate holding plate. In the intermediate holding plate projection surface on which the first supporting pin, the second supporting pin, or the holding plate supporting pin, which abuts from the other surface side, with respect to the intermediate holding plate is projected in the thickness direction of the intermediate holding plate. It is characterized by being arrange | positioned in a different position.

With this configuration, the spring elasticity is further exerted by the plurality of intermediate holding plates, and the pressure concentration can be dispersed against the height deviation of the inspected electrode of the circuit board under test, so that local stress concentration can be further avoided. Local breakage of the anisotropic conductive sheet of 1 is suppressed. As a result, since the repeated use durability of a 1st anisotropically conductive sheet improves, the replacement | exchange frequency of an anisotropically conductive sheet reduces and inspection work efficiency improves.

In all the said intermediate | middle holding plates, the test | inspection apparatus of the circuit board of this invention is abutting support position with respect to the said intermediate | middle holding plate of the holding plate support pin which abuts from one surface side with respect to the said intermediate | middle holding plate, and the said intermediate holding plate. In the intermediate holding plate projection surface on which the first supporting pin, the second supporting pin, or the holding plate supporting pin, which abuts from the other surface side, with respect to the intermediate holding plate is projected in the thickness direction of the intermediate holding plate. It is characterized by being arrange | positioned in a different position.

As a result, the contact support positions from the support pins on the front and back sides of the intermediate holding plates are disposed at positions shifted from each other, whereby the spring elasticity of the plurality of intermediate holding plates is further exerted. By dispersing the pressure concentration with respect to the height deviation of the electrode under test, local stress concentration can be further avoided, and local breakage of the first anisotropic conductive sheet is suppressed. As a result, since the repeated use durability of a 1st anisotropically conductive sheet improves, the replacement | exchange frequency of a 1st anisotropically conductive sheet reduces and inspection work efficiency improves.

Effect of the Invention

According to the present invention, highly reliable electrical inspection can be performed even when the circuit to be inspected has a microelectrode arranged at a fine pitch.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows one Embodiment in the inspection apparatus of the circuit board of this invention.

FIG. 2 is a cross-sectional view illustrating a lamination state at the time of inspection of the inspection apparatus of FIG. 1. FIG.

3 is a diagram showing the surface of the circuit board under test on the pitch conversion substrate.

It is a figure which shows the surface of the relay pin unit side of the board | substrate for pitch conversion.

5 is a partial cross-sectional view of the first anisotropic conductive sheet.

6 is a partial cross-sectional view of a second anisotropic conductive sheet.

7 is a cross-sectional view showing a state in which the first anisotropic conductive sheet is laminated on the substrate for pitch conversion.

FIG. 8 (a) is a partial cross-sectional view of the first anisotropic conductive sheet having one surface roughened, and FIG. 8 (b) is a cross-sectional view showing a state in which the first anisotropic conductive sheet is laminated on the substrate for pitch conversion.

It is a figure explaining the manufacturing process of a 1st anisotropically conductive sheet | seat.

It is a figure which shows the distribution state of the electroconductive particle inside a shaping | molding member.

It is a figure explaining the manufacturing process of a 1st anisotropically conductive sheet | seat.

It is a figure which shows the distribution state of the electroconductive particle after acting a magnetic field.

It is sectional drawing which shows the conductive pin of the relay pin unit, and a part of insulating plate.

It is sectional drawing which shows other embodiment in the inspection apparatus of the circuit board of this invention.

FIG. 15 is a cross-sectional view illustrating a lamination state at the time of inspection of the inspection apparatus of FIG. 14.

It is a figure which shows the surface of the circuit board side under test of a pitch conversion board | substrate.

It is a figure which shows the surface of the relay pin unit side of the board | substrate for pitch conversion.

It is sectional drawing which showed the state which laminated | stacked the 1st anisotropically conductive sheet | seat on the board | substrate for pitch conversion.

19 is a partially enlarged cross-sectional view illustrating a state of use of the inspection device of FIG. 14.

It is sectional drawing which shows other embodiment in the inspection apparatus of the circuit board of this invention.

FIG. 21 is a cross-sectional view illustrating a lamination state at the time of inspection of the inspection apparatus of FIG. 20. FIG.

22 is a cross-sectional view showing a part of the conductive pin and the insulating plate of the relay pin unit.

It is a partial enlarged view of the intermediate holding plate projection surface projected in the thickness direction of an intermediate holding plate.

24 is a partially enlarged cross-sectional view of the inspection device of FIG. 20.

25 is a partially enlarged cross-sectional view illustrating a state of use of the inspection device of FIG. 20. to be.

FIG. 26 is a partially enlarged cross-sectional view of the relay pin unit in the inspection apparatus of FIG. 20.

FIG. 27 is a partially enlarged cross-sectional view illustrating a state of use of the inspection device of FIG. 20.

FIG. 28 is a partially enlarged cross-sectional view similar to FIG. 24 showing another embodiment of the inspection apparatus of the present invention. FIG.

FIG. 29 is a partially enlarged cross-sectional view of the relay pin unit in the inspection device of FIG. 28.

30 is a partially enlarged cross-sectional view showing a state of use of the inspection apparatus in another embodiment of the present invention.

31 is a sectional view of a conventional circuit board inspection apparatus.

<Explanation of symbols for main parts of the drawings>

1: circuit board under test

2: electrode under test

3: electrode under test

11a: first inspection jig

11b: second inspection jig

21a, 21b: circuit board side connector

22a, 22b: first anisotropic conductive sheet

23a, 23b: substrate for pitch conversion

24: terminal electrode

25: connection electrode

26a, 26b: second anisotropic conductive sheet

27a, 27b: terminal electrode for current

28a, 28b: terminal electrode for voltage

31a, 31b: relay pin unit

32a, 32b: conductive pin

33a, 33b: first support pin (support pin)

34a, 34b: first insulating plate

35a, 35b: second insulating plate

36a: middle retaining plate

37a, 37b: second support pin

38A: First abutting support position

38B: second abutment support position

39a, 39b: retaining plate support pin

39A: abutment support position

41a, 41b: Tester side connector

42a, 42b: third anisotropic conductive sheet

43a, 43b: connector board

44a, 44b: Tester side electrode

45a, 45b: pin side electrode

46a, 46b: base plate

47a, 47b: pin side electrode for current

48a, 48b: pin-side electrodes for voltage

49a, 49b: support pin

51: insulated substrate

52: wiring

53: internal wiring

54: insulation layer

55: insulation layer

61: sheet material

62: conductive particles

63: surface

64: back side

71: insulation

72: conductive path forming unit

73: protrusion

81a, 81b: end

82: center part

83: through hole

91: pressure roll

92: support roll

93a, 93b: molded member

94: spacer

95: molding material

96: upper surface

97: lower surface

98a, b: electromagnet

99a: concave

99b: convex

101: circuit board under test

102: inspected electrode

103: inspected electrode

111a: upper inspection jig

111b: lower inspection jig

121a, 121b: circuit board side connectors

121a, 121b: circuit board side connectors

122a, 122b: anisotropic conductive sheet

123a and 123b: substrate for pitch conversion

126a and 126b: anisotropic conductive sheets

131a, 131b: relay pin unit

132a, 132b: conductive pins

133a, 133b: support pin

134a, 134b: first insulating plate

135a, 135b: second insulating plate

141a, 141b: tester side connector

142a and 142b: anisotropic conductive sheet

143a, 143b: connector board

144a and 144b: tester side electrodes

145a and 145b: pin side electrodes

146a, 146b: base plate

A: Intermediate Retention Plate Projection Surface

L1: distance

L2: distance

Q1: Diagonal

Q2: Diagonal

R1: unit grid area

R2: Unit Grid Area

<Best mode for carrying out the invention>

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described, referring drawings. In the following description, a pair of identical cost elements (for example, the circuit board side connector 21a and the circuit board side connector 21b, the first inspection jig and the second inspection jig) When the 1st anisotropically conductive sheet 22a, the 1st anisotropically conductive sheet 22b, etc. are named generically, the symbol "a" and "b" may be abbreviate | omitted (for example, 1st anisotropic conductivity) The sheet 22a and the first anisotropic conductive sheet 22b may be collectively described as "the first anisotropic conductive sheet 22".

1 is a cross-sectional view showing an inspection apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing a laminated state at the time of inspection of the inspection apparatus of FIG. 1, FIG. The figure which showed the surface of the side, FIG. 4 is a figure which shows the surface of the relay pin unit side of the board | substrate for pitch conversion.

The inspection apparatus of this embodiment performs electrical inspection by measuring the electrical resistance between electrodes under inspection for the inspection target circuit board 1 such as a printed circuit board for mounting an integrated circuit or the like.

1 and 2, the inspection apparatus has a first inspection jig 11a disposed on the upper surface side of the circuit board 1 to be inspected and a second inspection jig 11b disposed on the lower surface side. Are arranged to face each other.

The 1st inspection jig 11a is equipped with the circuit board side connector 21a, the relay pin unit 31a, and the tester side connector 41a. The circuit board side connector 21a is comprised from the board | substrate 23a for pitch conversion, the 1st anisotropically conductive sheet 22a and the 2nd anisotropically conductive sheet 26a arrange | positioned at both sides. The tester side connector 41a is comprised from the 3rd anisotropically conductive sheet 42a arrange | positioned at the relay pin unit 31a side, the connector board 43a, and the base board 46a.

The 2nd test jig 11b is comprised similarly to the 1st test jig 11a, and is equipped with the circuit board side connector 21b, the relay pin unit 31b, and the tester side connector 41b. The circuit board side connector 21b is comprised from the board | substrate 23b for pitch conversion, the 1st anisotropically conductive sheet 22b and the 2nd anisotropically conductive sheet 26b arrange | positioned at both sides. The tester side connector 41b is comprised from the 3rd anisotropically conductive sheet 42b arrange | positioned at the relay pin unit 31b side, the connector board 43b, and the base board 46b.

An electrode 2 for inspection is formed on the upper surface of the circuit board 1 to be inspected, and an electrode 3 for inspection is also formed on the lower surface thereof, and these are electrically connected to each other.

(1) circuit board side connector

The circuit board side connectors 21a and 21b are provided with the boards 23a and 23b for pitch conversion, the first anisotropic conductive sheets 22a and 22b and the second anisotropic conductive sheets 26a and 26b disposed on both sides thereof. have.

(1-a) pitch conversion substrate

FIG. 3 is a diagram showing the surface on the test circuit board 1 side of the pitch conversion substrate 23, and FIG. 4 is a diagram showing the surface on the relay pin unit 31 side.

On one surface of the substrate 23 for pitch conversion, that is, on the side of the circuit under test 1, a plurality of connection electrodes electrically connected to the electrodes 2 and 3 of the circuit under test 1 as shown in FIG. 3 ( 25) is formed. These connection electrodes 25 are arrange | positioned so that the patterns of the to-be-tested electrodes 2 and 3 of the circuit board 1 to be tested may be corresponded.

On the other hand, the other surface of the substrate 23 for pitch conversion, i.e., the opposite side of the circuit board 1 under test, is electrically connected to the conductive pins 32a and 32b of the relay pin unit 31 as shown in FIG. A plurality of terminal electrodes 24 are formed. These terminal electrodes 24 are disposed on grid points at regular intervals, for example, pitches of 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0.2 mm. The pitch is the same as the arrangement pitch of the conductive pins 32a and 32b of the relay pin unit.

Each connection electrode 25 of FIG. 3 is electrically connected to the terminal electrode 24 of FIG. 4 by the wiring 52 and the internal wiring 53 penetrating in the thickness direction of the insulating substrate 51 in FIG. Is connected.

The insulating portion on the surface of the pitch conversion substrate 23 is, for example, as an insulating layer 54 formed on the surface of the insulating substrate 51 so that each connection electrode 25 is exposed. It is comprised, The thickness of this insulating layer 54 becomes like this. Preferably it is 5-100 micrometers, More preferably, it is 10-60 micrometers. When this thickness is too small, it may become difficult to form the insulating layer with small surface roughness. On the other hand, when this thickness is excessive, electrical connection of the connection electrode 25 and the 1st anisotropically conductive sheet 22 may become difficult.

As a material which forms the insulated substrate 51 of the pitch conversion board | substrate, what is generally used as a base material of a printed circuit board can be used. Specifically, polyimide resin, glass fiber reinforced polyimide resin, glass fiber reinforced epoxy resin, glass fiber reinforced bismaleimide triazine resin, etc. are mentioned, for example.

As the material for forming the insulating layers 54 and 55 in FIG. 7, a polymer material that can be molded into a thin film can be used. Specifically, for example, an epoxy resin, an acrylic resin, a phenol resin, a polyimide resin, a polyamide resin, Mixtures thereof, resistor materials and the like.

The pitch conversion substrate 23 can be manufactured as follows, for example. First, a laminated material in which a metal foil layer is laminated on both surfaces of a flat insulating substrate is prepared, and a plurality of penetrations penetrating in the thickness direction of the laminated material corresponding to the pattern corresponding to the terminal electrode to be formed for this laminated material. The hole is formed by a numerically controlled drilling device, a photo etching process, a laser processing process or the like.

Subsequently, the via holes connected to the metal foil layers on both sides of the substrate are formed by electroless plating and electrolytic plating in the through holes formed in the laminated material. Thereafter, the photo-etching process is performed on the metal foil layer to form a wiring pattern and a connecting electrode on the surface of the insulated substrate, and to form a terminal electrode on the surface on the opposite side.

As shown in FIG. 7, the insulating layer 54 is formed to expose each connection electrode 25 on the surface of the insulating substrate 51, and the respective terminal electrodes 24 are exposed on the surface on the opposite side. By forming the insulating layer 55, the substrate 23 for pitch conversion can be obtained. Moreover, the thickness of the insulating layer 55 becomes like this. Preferably it is 5-100 micrometers, More preferably, it is 10-60 micrometers.

(1-b) First Anisotropic Conductive Sheet

As shown in FIG. 5, the first anisotropic conductive sheet 22 constituting the circuit board side connector 21 and laminated with the circuit board 23 for pitch conversion is included in the sheet base 61 made of an insulating elastic polymer. Many electroconductive particle 62 is disperse | distributed to surface direction, and is contained in the state arrange | positioned in the thickness direction.

The thickness of the first anisotropic conductive sheet 22 is preferably 0.03 to 0.5 mm, more preferably 0.05 to 0.2 mm. In addition, as shown in FIG. 8, when the surface 63 of the 1st anisotropically conductive sheet 22 is made into a rough surface, "the thickness of the 1st anisotropically conductive sheet 22" is a rough surface 63 It is the thickness (minimum thickness) from the recessed part of () to the back surface 64 (flat surface).

When the thickness of the first anisotropically conductive sheet 22 is less than 0.03 mm, the mechanical strength of the first anisotropically conductive sheet 22 tends to be low, and required durability may not be obtained. On the other hand, when the thickness of the first anisotropic conductive sheet 22 is more than 0.5 mm, the electrical resistance in the thickness direction tends to be large, and when the pitch of the electrode to be connected is small, each conductive formed by pressurization. In some cases, electrical insulation between the electrodes to be inspected may be difficult because electrical insulation between the electrodes to be inspected may not be obtained in the furnace.

The durometer hardness of the elastic polymer material constituting the sheet base 61 of the first anisotropic conductive sheet 22 is preferably 30 to 90, more preferably 35 to 80, still more preferably 40 to 70 to be.

In this specification, "durometer hardness" means the thing measured by the type A durometer based on the durometer hardness test of JISK6253. When the durometer hardness of the elastic polymer material is less than 30, when the pressure is pressed in the thickness direction, the anisotropic conductive sheet is largely compressed and deformed, and a large permanent distortion occurs. easy.

On the other hand, when the durometer hardness of the elastic polymer material is more than 90, when the anisotropic conductive sheet is pressed in the thickness direction, the deformation amount in the thickness direction is insufficient, so that good connection reliability is not obtained and connection failure is likely to occur.

Magnetic conductive particles are usually used for the conductive particles 62 of the first anisotropic conductive sheet 22. The number average particle diameter D ₁ of the magnetic conductive particles is preferably 3 to 50 µm, more preferably 5 to 30 µm, still more preferably 8 to 20 µm.

In this specification, "the number average particle diameter of magnetic electroconductive particle" means the thing measured by the laser diffraction scattering method.

Pressurized deformation of the portion containing the magnetic conductive particles in the anisotropic conductive sheet obtained when the number average particle diameter D ₁ of the magnetic conductive particles is 3 µm or more is facilitated, and the magnetic field orientation treatment in the manufacturing process makes the magnetic When oriented electroconductive particle, the orientation of a magnetic electroconductive particle becomes easy, and the anisotropic conductive sheet obtained becomes high in anisotropy, and the resolution of an anisotropic conductive sheet (presses an anisotropic conductive sheet and opposes in thickness direction between them) The ability to maintain electrical insulation between electrodes adjacent to the transverse direction while achieving electrical conduction).

On the other hand, when the number average particle diameter D ₁ of magnetic electroconductive particle is 50 micrometers or less, the obtained anisotropic conductive sheet will become favorable in elasticity and easy deformation | transformation, and will be good also about the fine and fine pitch electrode.

Ratio W ₁ / D ₁ of the thickness W ₁ of the anisotropically conductive sheet 22 of 1 (㎛) to the number of the magnetic conductive particles, the mean particle size D ₁ (㎛) is preferably from 1.1 to 10.

When the ratio W ₁ / D ₁ is less than 1.1, since the diameter of the magnetic conductive particles is equal to or larger than the thickness of the anisotropic conductive sheet, the elasticity of the anisotropic conductive sheet is lowered, and thus the inspection of the printed wiring board and the like. When the anisotropic conductive sheet is placed in contact with the inspected electrode of the circuit board 1 and pressurized to achieve a contact conduction state, the inspected circuit board 1 tends to be damaged.

On the other hand, when the ratio W ₁ / D ₁ exceeds 10, when the anisotropic conductive sheet is placed in contact with the inspected electrode of the inspected circuit board 11 plate 1 such as a printed wiring board and pressurized to achieve a contact conduction state. A large number of conductive particles are arranged between the circuit board 1 to be tested and the substrate 23 for pitch conversion to form a chain. Therefore, many contacts of electroconductive particle exist, electrical resistance value becomes high easily, and it becomes easy to use for electrical inspection.

According to one preferred type in the present invention, as shown in Figs. 8A and 8B, the surface 63 on the side contacting the circuit board 1 to be inspected in the anisotropic conductive sheet 22 is shown. It is rough surface with this unevenness. On the other hand, the back surface 64 on the side in contact with the substrate 23 for pitch conversion is a flat surface. In addition, the chain by electroconductive particle 62 is formed in the state disperse | distributed to the surface direction of the sheet | seat 22 irrespective of the position of the convex part and the recessed part of the rough surface in the surface 63 side of the anisotropically conductive sheet 22. It is.

The surface roughness on the surface 63 (rough surface) on the side in contact with the circuit board 1 to be inspected is preferably 0.5 to 5 µm, more preferably 1 to 2 µm. In addition, in this specification, "surface roughness" means centerline roughness Ra by JIS B0601. When this surface roughness is too small, it becomes difficult to fully suppress the adhesiveness in this surface, it is attracted to the circuit board 1 under test at the time of inspection, and the position of the anisotropic conductive sheet 22 shifts | deviates, or an anisotropic conductive sheet ( 22 may be attached to the circuit board 1 to be inspected and separated from the substrate 23 for pitch conversion. On the other hand, when surface roughness is excessive, it becomes difficult to make stable electrical connection with the circuit board 1 under test.

The surface roughness on the back surface 64 on the side in contact with the substrate 23 for pitch conversion is preferably 0.3 µm or less, more preferably 0.005 to 0.2 µm, still more preferably 0.01 to 0.1 µm. In addition, the surface roughness of the insulating portion 54 (FIGS. 3 and 7) on the surface of the substrate 23 for pitch conversion that is in contact with the anisotropic conductive sheet 22 is preferably 0.2 μm or less, more preferably. Is 0.001 to 0.1 µm, more preferably 0.01 to 0.03 µm. When the surface roughness in these surfaces is excessive, since the adhesiveness of the anisotropically conductive sheet 22 and the pitch conversion board | substrate 23 becomes inadequate, the anisotropic electroconductivity from the pitch conversion board | substrate 23 at the time of an electrical inspection is performed. It becomes difficult to prevent separation of the sheet 22.

Although it will not specifically limit, if it exists in the range of the said durometer hardness as an elastic polymer material which comprises the base material of the 1st anisotropically conductive sheet 22, It is preferable to use a silicone rubber from a viewpoint of molding processability and an electrical property.

In addition, as a curable high molecular material used preferably in order to obtain the elastic polymer material which comprises the base material of the 1st anisotropically conductive sheet 22, polybutadiene rubber, a natural rubber, a polyisoprene rubber, styrene, for example Conjugated diene rubbers such as butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber, hydrogenated products thereof, block copolymer rubbers such as styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer, and these Hydrogenated substance, chloroprene rubber, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, and the like.

When weather resistance is required for an anisotropic conductive sheet, it is preferable to use things other than conjugated diene rubber, and it is preferable to use a silicone rubber from a viewpoint of molding processability and electrical characteristics as mentioned above. As silicone rubber, what crosslinked or condensed a liquid silicone rubber is preferable. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a distortion velocity of 10 ⁻¹ sec, and may be any of a condensation type, an addition type, and a vinyl group or hydroxyl group. Specifically, dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, methylphenyl vinyl silicone raw rubber, etc. are mentioned, for example.

Among them, the liquid silicone rubber (vinyl group-containing polydimethylsiloxane) containing a vinyl group is subjected to hydrolysis and condensation reaction of, for example, dimethyldichlorosilane or dimethyldiakoxysilane in the presence of dimethylvinylchlorosilane or dimethylvinylalkoxysilane. Then, it can obtain by performing fractionation by repetition of dissolution-precipitation.

Liquid silicone rubbers containing vinyl groups at both ends are subjected to anionic polymerization of cyclic siloxanes such as octamethylcyclotetrasiloxane in the presence of a catalyst and use, for example, dimethyldivinylsiloxane as the polymerization terminator, and other reaction conditions (e.g., For example, the amount of the cyclic siloxane and the amount of the polymerization terminator) can be obtained by appropriately adjusting. Here, as a catalyst of anionic polymerization, alkali, such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide, these silanorate solutions, etc. can be used, and reaction temperature is 80-130 degreeC, for example.

Liquid silicone rubbers containing hydroxyl groups (hydroxyl group-containing polydimethylsiloxanes) are, for example, hydrolyzed and condensation reactions of dimethyldichlorosilane or dimethyldiakoxysilane in the presence of dimethylhydrochlorosilane or dimethylhydroalkoxysilane Then, it can obtain by performing fractionation by repetition of dissolution-precipitation. The cyclic siloxane is anionic polymerized in the presence of a catalyst, and other reaction conditions (for example, dimethylhydrochlorosilane, methyldihydrochlorosilane or dimethylhydroalkoxysilane) are used as the polymerization terminator. It can also be obtained by adjusting the amount of the cyclic siloxane and the amount of the polymerization terminator) appropriately. Here, as a catalyst of anionic polymerization, alkali, such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide, these silanorate solutions, etc. can be used, and reaction temperature is 80-130 degreeC, for example.

As liquid silicone rubber, it is preferable to use 35% or less of compression permanent distortion at 150 degreeC of the hardened | cured material from the point which the durability at the time of repeated compression in the thickness direction of an anisotropic conductive sheet becomes favorable, and this compression permanent distortion is, More preferably, it is 20% or less.

Moreover, it is preferable at the point that durability at the time of repeated compression in the thickness direction of an anisotropically conductive sheet uses the liquid silicone rubber whose bursting strength in 23 degreeC of the hardened | cured material is 7 kN / m or more, This bursting strength is preferable, More preferably, it is 10 kN / m or more.

Here, the compression set and the breaking strength of the liquid silicone rubber cured product can be measured according to the method according to JIS K6249.

When using a silicone rubber as a base material of the anisotropic conductive sheet 22, it is preferable that the molecular weight Mw (referring to the weight average molecular weight in conversion of standard polystyrene) is 10000-400000. Moreover, it is preferable that molecular weight distribution index (refers to the value of ratio Mw / Mn of standard polystyrene conversion weight average molecular weight Mw and standard polystyrene conversion number average molecular weight Mn) from a heat resistant point is 2 or less.

In the high molecular material for obtaining the elastic high molecular material used as the base material of the anisotropically conductive sheet | seat 22, the hardening catalyst for hardening this can be contained. As such a curing catalyst, an organic peroxide, a fatty acid azo compound, a hydrosilylation catalyst, etc. are mentioned, for example.

As an organic peroxide used as a hardening catalyst, benzoyl peroxide, bisdicyclobenzoyl peroxide, dicumyl peroxide, dibutyl butyl peroxide etc. are mentioned, for example.

As a fatty acid azo compound used as a hardening catalyst, azobisisobutylonitrile etc. are mentioned, for example.

As a catalyst which can be used as a catalyst of a hydrosilylation reaction, For example, a chloroplatinic acid and its salt, a platinum- unsaturated group containing siloxane complex, a complex of vinylsiloxane and platinum, of platinum and 1, 3- divinyl tetramethyldisiloxane Complexes, triorganophosphines or complexes of hoseites and platinum, acetylacetate platinum chelates, complexes of cyclic dienes and platinum, and the like.

The amount of the curing catalyst used is appropriately selected in consideration of the kind of the polymer material to which it is added, the kind of the curing catalyst, and other curing treatment conditions, and is usually 3 to 15 parts by weight based on 100 parts by weight of the polymer material.

In the polymeric material for obtaining the elastic polymer material used as the base material of the anisotropic conductive sheet 22, inorganic fillers, such as normal silica powder, colloidal silica, aerogel silica, and alumina, can be contained as needed. By containing such an inorganic filler, thixotropy of the high molecular material (molding material) for obtaining the anisotropic conductive sheet 22 is ensured, and the viscosity becomes high. Moreover, while the dispersion stability of electroconductive particle improves, the intensity | strength of the obtained anisotropic conductive sheet becomes high.

Although the usage-amount of such an inorganic filler is not specifically limited, It is unpreferable since it will not be enough to orientate electroconductive particle by a magnetic field when used in large quantities.

Moreover, it is preferable that the viscosity of the sheet molding material exists in the range of 100000-1000000cp in temperature 25 degreeC.

As electroconductive particle contained in the base material of the anisotropically conductive sheet | seat 22, electroconductive particle which shows a magnetism is normally used at the point which can be orientated so that it may be easily lined up in the thickness direction of a sheet | seat by acting a magnetic field. As the magnetic conductive particles, in the sheet forming material for forming the anisotropic conductive sheet by the manufacturing method described later, the magnetically conductive particles can be easily moved by the action of the magnetic field, so that the saturation magnetization is 0.1 Wb /. It is preferable that it is 2 m <2> or more, More preferably, it is 0.3 Wb / m <2> or more, Especially preferably, it is 0.5 Wb / m <2> or more.

Since the saturation magnetization is 0.1 Wb / m 2 or more, the magnetic conductive particles can be reliably moved by the action of the magnetic field in the manufacturing process so that the desired orientation can be achieved. Therefore, when the anisotropic conductive sheet is used, a chain of the magnetic conductive particles is formed. can do.

Specific examples of the magnetic conductive particles include particles of metals showing magnetic properties such as iron, nickel, and cobalt, particles of these alloys, particles containing these metals, or these particles as core particles, and highly conductive on the surface of the core particles. Composite particles coated with metal, inorganic particles or polymer particles such as non-magnetic metal particles or glass beads as core particles, and composite particles or core particles coated with a highly conductive metal on the surface of the core particles, The composite particle which coat | covered both conductive magnetic bodies, such as a ferrite and an intermetallic compound, and highly conductive metal, etc. are mentioned.

Here, "highly conductive metal" means a metal having a conductivity at 0 ° C of 5 × 10 ⁶ Ω ⁻¹ m ⁻¹ or more.

As such a highly conductive metal, specifically, gold, silver, rhodium, platinum, chromium, etc. can be used, and among these, it is preferable to use gold from the point which is chemically stable and has high electrical conductivity.

Among the magnetic conductive particles described above, composite particles in which nickel particles are used as core particles and plated with a highly conductive metal such as gold or silver are preferably used.

The means for coating the highly conductive metal on the surface of the core particle is not particularly limited, but for example, an electroless plating method can be used.

It is preferable that the coefficient of variation of the number average particle diameter of a magnetic electroconductive particle is 50% or less, More preferably, it is 40% or less, More preferably, it is 30% or less, Especially preferably, it is 20% or less.

Here, the "coefficient of variation of the number average particle diameter" is represented by the formula: (σ / Dn) × 100 (where σ represents the value of the standard deviation of the particle diameter, and Dn represents the number average particle diameter of the particles). You can get it.

Since the uneven degree of particle diameter becomes small because the coefficient of variation of the number average particle diameter of magnetic electroconductive particle is 50% or less, the variation of the partial electroconductivity in the obtained anisotropic conductive sheet can be made small.

Such magnetic conductive particles can be obtained by granulating a metal material by a conventional method, or preparing commercially available metal particles, and performing classification treatment on these particles.

The classification treatment of the particles can be performed by a classification device such as an air classification device or a sound wave device.

Moreover, the specific conditions of a classification process are suitably set according to the number average particle diameter of the target electroconductive metal particle, the kind of classification apparatus, etc.

In the case where a highly conductive metal is coated on the surface of the core particles as magnetic conductive particles, good conductivity can be obtained, so that the coverage of the highly conductive metal on the surface of the particles (coating of the conductive metal to the surface area of the core particles) is obtained. It is preferable that the ratio of area) is 40% or more, More preferably, it is 45% or more, More preferably, it is 47 to 95%.

The coating amount of the highly conductive metal is preferably 0.5 to 50% by weight with respect to the core particles, more preferably 1 to 30% by weight, still more preferably 3 to 25% by weight, particularly preferably 4 to 20% by weight. %to be. When the highly conductive metal to be coated is gold, the coating amount is preferably 2 to 30% by weight of the core particles, more preferably 3 to 20% by weight, still more preferably 3.5 to 17% by weight.

Although the specific shape of the magnetic conductive particles is not particularly limited, spherical, star-shaped, or primary particles may be easily dispersed in the polymer material for forming the elastic polymer material that is the base material of the anisotropic conductive sheet 22. It is preferable that it is a lump form by the aggregated secondary particle.

As magnetic electroconductive particle, you may use what surface was processed by coupling agents, such as a silane coupling agent. By treating the surface of the magnetic conductive particles with a coupling agent, the adhesion between the magnetic conductive particles and the elastic polymer substrate is increased, and the durability in repeated use of the resulting anisotropic conductive sheet 22 is increased.

The anisotropic conductive sheet 22 can contain an antistatic agent in the range which does not impair the insulation of an elastic polymer material. By containing the antistatic agent in the anisotropic conductive sheet 22, the accumulation of electric charges on the surface of the sheet is prevented or suppressed, so that the electric charge is released from the anisotropic conductive sheet 22 during the electrical inspection of the circuit board 1 under test. While the inconvenience can be prevented, good conductivity can be obtained at a smaller pressing force.

The anisotropic conductive sheet 22 can be manufactured as follows, for example. First, the flowable molding material which disperse | distributed magnetic electroconductive particle in the liquid high polymer material hardened | cured and used as an elastic polymer material is prepared. As shown in Fig. 9, a pair of molding members 93a and 93b made of a nonmagnetic sheet are prepared. Then, a frame-shaped spacer 94 having an opening having a shape suitable for the planar shape of the target anisotropic conductive sheet 22 on the molding surface of one of the molding members 93b and having a thickness corresponding to the thickness thereof is disposed. do. The prepared molding material 95 is applied in the opening of the spacer 94, and the other molding member 93a is disposed on the molding material 95 such that the molding surface thereof is in contact with the molding material 95.

As the nonmagnetic sheet used as the molding members 93a and 93b, a resin sheet made of polyimide resin, polyester resin, acrylic resin, or the like can be used.

In the case where a roughening treatment is performed on one surface of the anisotropic conductive sheet 22 as shown in Figs. 8A and 8B, as shown in Fig. 10, the molding surface of one of the molding members 93a is used for the purpose. The roughening process according to the surface roughness in the surface 63 of the anisotropically conductive sheet | seat 22 to be performed is performed. For example, the recessed part 99a and the convex part 99b are formed in a shaping | molding surface by methods, such as a sandblasting method and an etching method. As the other shaping | molding member 93b, that whose shaping | molding surface is a flat surface is used.

The sheet thickness of the molding members 93a and 93b becomes like this. Preferably it is 50-500 micrometers, More preferably, it is 75-300 micrometers. When this thickness is less than 50 micrometers, the strength required as a molded member may not be obtained. When this thickness exceeds 500 micrometers, when arrange | positioning electroconductive particle, it may become difficult to make a magnetic field of desired intensity | strength act on a molding material.

Next, as shown in FIG. 9, the shaping | molding material is made into predetermined thickness by pinching the shaping | molding members 93a and 93b which sandwiched the shaping | molding material 95 with the press roll 91 and the support roll 92. FIG. In this state, the electroconductive particle 62 is disperse | distributed uniformly in the inside of the shaping | molding material 95 as shown in FIG.

Next, as shown in FIG. 11, a pair of electromagnets 98a, 98b are arrange | positioned, for example on the back surface side of the shaping | molding member 93a, 93b, and a parallel magnetic field is acting in the thickness direction of the shaping | molding material 95. FIG. Let's do it. Thereby, the some electroconductive particle 62 disperse | distributed in molding material is orientated so that it may line up in the thickness direction, maintaining the state disperse | distributed to surface direction as shown in FIG. 12, and the some electroconductive particle 62 extended in the thickness direction ) Is formed in a state dispersed in the plane direction.

By hardening a molding material in this state, the anisotropically conductive sheet | seat 22 contained in the state which oriented so that electroconductive particle lined up in the thickness direction in the elastic polymer base material, and was disperse | distributed to the surface direction is manufactured.

The curing treatment of the molding material may be performed while the parallel magnetic field is applied, or after the action of the parallel magnetic field is stopped. The magnitude | size of the parallel magnetic field which acts on a shaping | molding material becomes 0.02 to 1.5 Tesla on average.

Permanent magnets may be used in place of the electromagnets as a means for exerting a parallel magnetic field on the molding material. As a permanent magnet, since the parallel magnetic field strength of the said range can be obtained, it is preferable to consist of alumino (Fe-Al-Ni-Co type alloy), a ferrite, etc.

Although the hardening process of a molding material depends on the material used, it is usually performed by heat processing. The specific heating temperature and heating time are appropriately set in consideration of the kind of the polymer material and the like, the time required for the movement of the conductive particles, and the like.

According to the method described above, the anisotropic conductive sheet can be manufactured in a simple and easy process without the need to apply a roughening treatment to the cured anisotropic conductive sheet itself, and adversely affects the anisotropic conductive sheet by applying post-treatment. Can be avoided.

Moreover, since the nonmagnetic sheet by which the shaping | molding surface was roughened was used as a shaping | molding member, the magnetic field of uniform intensity | strength can be made to act on a shaping | molding material in a surface direction. That is, since the magnetic field of intensity larger than the position of a recessed part is not formed in the position of the convex part of the roughening shaping | molding surface, the chain of electroconductive particle is not selectively formed in the position of a convex part, and the chain of electroconductive particle is not formed. Is formed in the state disperse | distributed to the surface direction of an anisotropic conductive sheet, and thereby chain | strand of electroconductive particle is formed also in the position of the convex part in the rough surface of an anisotropic conductive sheet. For this reason, even if only the convex part in the rough surface of an anisotropic conductive sheet is pressed state, electroconductivity can be obtained in the thickness direction. Therefore, the anisotropically conductive sheet which exhibits high electroconductivity by small pressing force can be obtained. Moreover, by using nonmagnetic sheets, such as a resin sheet, as a molding member, manufacturing cost can be reduced compared with the case of using expensive molding members, such as a metal mold | die.

(1-c) 2nd anisotropic conductive sheet

In the second anisotropic conductive sheet 26 disposed on the relay pin unit 31 side of the substrate 23 for pitch conversion, as shown in FIG. 6, a plurality of conductive particles 62 are formed in the insulating elastic polymer material in the thickness direction. It consists of the electrically-conductive path formation part 72 formed and arrange | positioned and the insulating part 71 spaced apart from each electrically-conductive path formation part 72. FIG. Thus, the electroconductive particle 62 is disperse | distributed nonuniformly in the surface direction only in the conductive path formation part 72. As shown in FIG.

The thickness W ₂ of the conductive path forming portion 72 is preferably 0.1 to 2 mm, more preferably 0.2 to 1.52 mm. When the thickness W ₂ is less than 0.1 mm, the absorption capacity against pressurization in the thickness direction is low, and the absorption of the pressing force by the inspection jig at the time of inspection is small, so that the effect of alleviating the impact on the circuit board side connector 21 is reduced. do. For this reason, it becomes difficult to suppress deterioration of the 1st anisotropically conductive sheet 22, and as a result, the frequency | count of replacement of the 1st anisotropically conductive sheet 22 at the time of the repetitive test of the circuit board 1 to test | inspection increases. The efficiency of inspection decreases. On the other hand, when this thickness W2 exceeds ₂ mm, the electrical resistance of the thickness direction will become large easily, and electrical inspection may become difficult.

The thickness of the insulating portion 71 is preferably substantially the same as or smaller than the thickness of the conductive path forming portion 72. As shown in FIG. 6, the thickness of the insulating portion 71 is smaller than the thickness of the conductive path forming portion 72 so that the conductive path forming portion 72 forms a protruding portion 73 which protrudes from the insulating portion 71. Since the deformation of the conductive path forming section 72 is easy and the absorbing force of the pressing force is increased with respect to the pressing in the direction, the pressing force of the inspection jig can be absorbed at the time of inspection, and the impact on the circuit board side connector 21 can be alleviated. have.

When magnetic electroconductive particle is used for the electroconductive particle 62 which comprises the 2nd anisotropically conductive sheet 26, the number average particle diameter becomes like this. Preferably it is 5-200 micrometers, More preferably, it is 5-150 micrometers, More preferably, it is 10-100 micrometers. Here, "the number average particle diameter of magnetic electroconductive particle" means the thing measured by the laser diffraction scattering method. When the number average particle diameter of the magnetic conductive particles is 5 µm or more, the pressure deformation of the conductive path forming portion of the anisotropic conductive sheet becomes easy. Moreover, in the manufacturing process, when orienting magnetic electroconductive particle by a magnetic field orientation process, the orientation of magnetic electroconductive particle is easy. If the number average particle diameter of magnetic electroconductive particle is 200 micrometers or less, the elasticity of the electrically conductive path forming part 72 of an anisotropically conductive sheet | seat will be favorable, and pressure deformation will become easy.

The thickness W ₂ of the forming unit 72, the conductive paths (㎛), and a ratio of the number of the magnetic conductive particles, the mean particle size _{D 2 (㎛) W 2 /} D 2 is preferably 1.1 to 10.

When the ratio W ₂ / D ₂ is less than 1.1, since the diameter of the magnetic conductive particles becomes equal to or larger than the thickness of the conductive path forming portion 72, the elasticity of the conductive path forming portion 72 is lowered and the thickness direction thereof. The absorption capacity of the pressing force is reduced. For this reason, since the effect of alleviating the impact to the circuit board side connector 21 at the time of inspection reduces, it becomes difficult to suppress deterioration of the 1st anisotropically conductive sheet 22, and as a result, the circuit board 1 to be tested. In the repetitive inspection of, the number of times of replacement of the first anisotropic conductive sheet 22 increases, and the efficiency of the inspection tends to decrease.

On the other hand, when the ratio W ₂ / D ₂ is greater than 10, a plurality of conductive particles are arranged in the conductive path forming unit 72 to form a chain, and since a large number of contacts between the conductive particles exist, the electrical resistance value is increased. It is easy to be high.

The elastic polymer material, which is the base material of the conductive path forming portion 72, preferably has a durometer hardness measured by the type A durometer, preferably 15 to 60, more preferably 20 to 50, still more preferably 25 to 45. to be.

When the durometer hardness of the elastic polymer material is smaller than 15, the sheet is deformed early and the permanent deformation is large due to the large compression and deformation of the sheet when pressed in the thickness direction, thereby making it difficult to make electrical connection during inspection. . When the durometer hardness of the elastic polymer material is larger than 60, the deformation at the time of being pressed in the thickness direction becomes small, so that the absorbing force of the pressing force in the thickness direction becomes small. For this reason, it becomes difficult to suppress deterioration of the 1st anisotropically conductive sheet 22, and as a result, the frequency | count of exchange of the 1st anisotropically conductive sheet 22 is repeated at the time of the repetitive test of the circuit board 1 to be tested. It becomes easy to increase and the efficiency of inspection falls.

Although it will not specifically limit, if the elastic polymer substance used as the base material of the electrically-conductive path formation part 72 shows the said durometer hardness, It is preferable to use a silicone rubber from a viewpoint of workability and electrical characteristics.

The insulating portion 71 of the second anisotropic conductive sheet 26 is formed of an insulating material that does not substantially contain conductive particles. As the insulating material, for example, an insulating polymer material, an inorganic material, a metal material insulated from the surface, and the like can be used. However, if the same material as the elastic polymer used in the conductive path forming portion is used, production is easy. When using an elastic polymer material as a material of an insulation part, it is preferable to use the thing whose durometer hardness is the said range.

As magnetic electroconductive particle, the magnetic electroconductive particle used for the above-mentioned 1st anisotropically conductive sheet 22 can be used.

The second anisotropic conductive sheet 26 can be produced by a method similar to that shown in FIGS. 9 to 12, for example. First of all, the shape of the entire shape is substantially flat and consists of upper and lower molds corresponding to each other, and is anisotropic in that the material layer can be heat-cured while applying a magnetic field to the material layer filled in the molding space between the upper and lower molds. The metal mold | die for electroconductive sheet molding is prepared.

In order to form a conductive part at an appropriate position by applying a magnetic field to the material layer, the anisotropic conductive sheet molding die has a strength distribution in the magnetic field in the mold on a substrate made of ferromagnetic materials such as iron and nickel. The ferromagnetic portion made of iron, nickel, etc. and the nonmagnetic portion made of nonmagnetic metal or resin, such as copper, have a mosaic layer arranged alternately adjacent to each other, and the ferromagnetic portion is a conductive path to be formed. It is arranged in accordance with the pattern corresponding to the pattern of the formation part.

Here, the upper mold surface is flat and the lower mold surface has some irregularities corresponding to the conductive path forming portion of the anisotropic conductive sheet to be formed.

A molding material containing conductive particles exhibiting magnetic properties is injected into the molding space of the die for forming the anisotropic conductive sheet, thereby forming a molding material layer.

Next, using the ferromagnetic portion and the non-magnetic portion in each of the upper mold and the lower mold, the magnetic particles having the intensity distribution in the plane direction are applied to the formed molding material layer, whereby the conductive particles are formed by the action of the magnetic force. It aggregates between the ferromagnetic body part in and the ferromagnetic body part in the lower mold located directly under it, and orients so that electroconductive particle may be lined up in the thickness direction. By hardening the said molding material layer in that state, the anisotropic conductive sheet which has the structure in which the some column-shaped conductive path formation part was insulated from each other by the insulated part is manufactured.

(2) relay pin unit

As shown in Figs. 1 and 2, the relay pin units 31a and 31b are provided with a plurality of conductive pins 32a and 32b provided in a predetermined pitch in parallel so as to face the vertical direction. In addition, the relay pin units 31a and 31b are provided on both end sides of the conductive pins 32a and 32b and are arranged on the side of the circuit board 1 to be inspected to insert and support the conductive pins 32a and 32b. , 34b) and two (pair) insulating plates of insulating plates 35a and 35b disposed on the side opposite to the circuit board 1 to be inspected.

For example, as shown in FIG. 13, the conductive pin 32 includes a central portion 82 having a larger diameter and end portions 81a and 81b having a smaller diameter than this.

The pair of insulating plates 34 and 35 are provided with through holes 83 into which end portions 81a and 81b of the conductive pins 32 are inserted. And the diameter of the through-hole 83 is formed larger than the diameter of the edge part 81 of the conductive pin 32, and smaller than the diameter of the center part 82, and this prevents the conductive pin 32 from falling out. Maintained.

The two insulating plates 34 and 35 are fixed by the supporting pins 33 so that these gaps are longer than the length of the center portion 82 of the conductive pins 32, whereby the conductive pins 32 move up and down. Is maintained.

The length of the end portion 81 of the conductive pin 32 is formed to be longer than the thickness of the insulating plates 34 and 35, whereby the conductive pin 32 protrudes from at least one of the insulating plates 34 and 35. .

The relay pin unit includes a grid of a plurality of conductive pins having a pitch of a constant pitch, for example, 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0.2 mm. It is placed on the point.

By equalizing the arrangement pitch of the conductive pins 32 of the relay pin unit 31 and the arrangement pitch of the terminal electrodes 24 provided on the substrate 23 for pitch conversion, the pitch is changed through the conductive pins 32. The substrate 23 is electrically connected to the tester side.

The distance between the insulating plate 34 and the insulating plate 35 is not particularly limited, but is preferably 20 mm or more, preferably 40 mm or more. Moreover, although the thickness of each of the insulating plate 34 and the insulating plate 35 is suitably selected according to the kind of material which comprises these, it is preferable that it is 1-10 mm, for example.

Specific examples of the material of the insulating plates 34 and 35 include insulating materials having a specific resistance of 1 × 10 ¹⁰ Ω · cm or more, for example, polyimide resins, polyester resins, polyamide resins, phenol resins, polyacetal resins, and polybutyls. Lenterephthalate resins, polyethylene terephthalate resins, cinchioctate polystyrene resins, polyphenylene sulfide resins, polyetherethyl ketone resins, fluorine resins, polyethernitrile resins, polyethersulfone resins, polyarylate resins, polyamides Glass materials, such as resin materials with high mechanical strength, such as a mid resin, glass fiber reinforced epoxy resin, glass fiber reinforced polyester resin, glass fiber reinforced polyimide resin, glass fiber reinforced phenol resin, and glass fiber reinforced fluorine resin Fibrous composite resin material, carbon fiber reinforced epoxy resin, carbon fiber reinforced polyester resin, car Carbon fiber composite resins such as the present fiber reinforced polyimide resin, carbon fiber reinforced phenolic resin, and carbon fiber reinforced fluorine resin, epoxy resins, and phenol resins are filled with inorganic materials such as silica, alumina and boronitelite. The resin material, an epoxy resin, a phenol resin, etc., the composite resin material which contained the mesh, etc. are mentioned. Moreover, you may use the composite board | plate material etc. which consisted of laminating | stacking the plate material which consists of these materials.

(3) Tester side connector

The tester side connectors 41a and 41b are provided with the third anisotropically conductive sheets 42a and 42b, the connector boards 43a and 43b, and the base plates 46a and 46b, as shown to FIG. 1 and FIG. . The same thing as the 2nd anisotropically conductive sheet 26 mentioned above is used for the 3rd anisotropically conductive sheets 42a and 42b, and as shown in FIG. 6, many electroconductive particles formed in the insulating elastic polymer arrange | positioned in the thickness direction, and are electrically conductive It consists of the insulation part spaced apart from the furnace formation part and each electrically conductive path formation part.

The connector boards 43a and 43b are constituted based on an insulated substrate, and the pin side electrodes 45a and 45b are formed on the relay pin unit 31 side of the surface thereof as shown in Figs. 1 and 2. These pin-side electrodes 45a and 45b have a constant pitch, for example, a constant interval of 2.45 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0.2 mm. It is arrange | positioned on the grid point of a pitch, and the arrangement pitch is the same as the arrangement pitch of the conductive pin of the relay pin unit.

Each of the pin side electrodes 45a and 45b is electrically connected to the tester side electrodes 44a and 44b by a wiring pattern formed on the surface of the insulating substrate and an internal wiring formed therein.

In the inspection apparatus of the present embodiment described above, as shown in FIG. 2, the electrodes 2 and the electrodes 3 of the circuit board 1 under test are the first anisotropic conductive sheets 22a and 22b and the substrate for pitch conversion. (23a, 23b), the second anisotropic conductive sheets 26a, 26b, the conductive pins 32a, 32b, the third anisotropic conductive sheets 42a, 42b, and the connector substrates 43a, 43b are interposed therebetween. The base plate 46a, 46b arrange | positioned at the outer side is electrically connected to the tester (not shown) by pressing to the prescribed pressure by the pressurizing mechanism of a tester, and the electrical resistance between the electrodes of the circuit board 1 under test is tested. Conduct an electrical inspection such as measurement.

The pressure which presses the to-be-tested circuit board 1 by the upper 1st inspection jig 11a and the lower 2nd inspection jig 11b is 100-250 kgf, for example.

14 is a sectional view showing another embodiment of the inspection apparatus of the present invention, FIG. 15 is a sectional view showing a lamination state at the time of inspection of the inspection apparatus in FIG. 14, and FIG. 17 is a diagram showing the surface of the relay pin unit side of the substrate for pitch conversion. In addition, the thing corresponding to the cost element in embodiment mentioned above is represented with the same code | symbol, and the detailed description is abbreviate | omitted.

The configuration of the inspection apparatus of the present embodiment is basically the same as that of the above-described embodiment, but is more suitably suitable for performing current measurement and voltage measurement on the inspection target electrode. Specifically, as shown in Figs. 16, 18 and 19, the connection electrodes 25a including the current terminal electrodes 27a and 27b and the voltage terminal electrodes 28a and 28b on the pitch conversion substrates 23a and 23b. And 25b are disposed, and the pin side electrodes 47a and 47b for current and the pin side electrodes 48a and 48b for voltage are disposed on the connector boards 43a and 43b.

The connection electrode 25a of the pitch conversion substrate 23a has a pair of current terminal electrodes 27a and voltage terminal electrodes 28a for each of the inspected electrodes 2 of the circuit under test 1. It is arrange | positioned so that it may electrically connect. The connection electrode 25b of the pitch conversion board 23b has a pair of current terminal electrodes 27b and voltage terminal electrodes 28b for each of the electrodes 3 under test of the circuit board 1 under test. It is arrange | positioned so that it may electrically connect.

The current pin side electrode 47a of the connector board 43a is arranged to be electrically connected to the current terminal electrode 27a of the pitch conversion board 23a, and the voltage pin side electrode 48a is a pitch conversion board ( It is arrange | positioned so that it may be electrically connected to the voltage terminal electrode 28a of 23a. The current pin side electrode 47b of the connector board 43b is arranged to be electrically connected to the current terminal electrode 27b of the pitch conversion board 23b, and the voltage pin side electrode 48b is a pitch conversion board ( It is arrange | positioned so that it may electrically connect with the voltage terminal electrode 28b of 23b).

On one surface of the substrate 23 for pitch conversion, that is, on the side of the circuit board 1 to be inspected, as shown in FIG. 16, the test electrode 2 (inspection electrode 3) of the circuit board 1 to be inspected is electrically connected. A plurality of connection electrodes 25 connected to each other are formed. These connection electrodes 25 are arrange | positioned so that the pattern of the test | inspection electrode 2 (inspection electrode 3) of the circuit board 1 under test may be corresponded.

Moreover, this connection electrode 25 is a pair of mutually with respect to the to-be-tested electrode 2 (inspection electrode 3) of the circuit board 1 under test, as shown to FIG. 16, FIG. 18, and FIG. It consists of the terminal electrode 27 for current and the terminal electrode 28 for voltage spaced at predetermined intervals.

The shape of the terminal electrode 27 for current and the terminal electrode 28 for voltage can be made into various shapes, such as rectangular shape, circular shape, and triangle shape. Moreover, the area | region occupied by these pair of electric current terminal electrode 27 and the voltage terminal electrode 28 occupies the to-be-tested electrode 2 (inspection electrode 3) of the circuit board 1 to be tested. It is desirable to be disposed in an area approximately equal to the area in order to reduce the measurement error.

In the pitch conversion substrate 23, the separation distance between the current terminal electrode 27 and the voltage terminal electrode 28 is preferably 10 µm or more. When this separation distance is smaller than 10 micrometers, since the electric current which flows between the current terminal electrode 27 and the voltage terminal electrode 28 through the 1st anisotropically conductive sheets 22a and 22b becomes large, it is high precision. It may become difficult to measure an electrical resistance, and an accurate electrical characteristic test may not be possible in some cases.

On the other hand, the upper limit of the separation distance between the current terminal electrode 27 and the voltage terminal electrode 28 is the size and pitch of the electrodes 2 and 3 for inspection of the circuit board 1 to be inspected, and the terminals for current. It is determined according to the dimensions of the electrode 27 and the terminal electrode 28 for voltage, and is not particularly limited, but is usually 500 µm or less. If the separation distance is too large, the current terminal electrode 27 and the voltage terminal electrode 28 with respect to the inspected electrode 2 (under-test electrode 3) of the small to-be-tested circuit board 1 are tested. It becomes difficult to arrange both of them appropriately.

On the other hand, on the other surface of the substrate 23 for pitch conversion, that is, on the opposite side of the circuit board 1 to be tested, a plurality of electrically connected to the conductive pins 32 of the relay pin unit 31 as shown in FIG. The terminal electrode 24 of is formed. These terminal electrodes 24 have, for example, a grid point having a constant pitch of 0.2 mm at a pitch of 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm and the like. It is arrange | positioned above and the pitch is the same as the arrangement pitch of the conductive pin 32 of the relay pin unit 31. As shown in FIG.

As shown in FIG. 18, each of the connecting electrodes 25 in FIG. 16, that is, the current terminal electrode 27 and the voltage terminal electrode 28, has the thicknesses of the other wiring 52 and the insulating substrate 51, respectively. It is electrically connected to the corresponding terminal electrode 24 of FIG. 17 by the internal wiring 53 penetrating in the direction.

On the other hand, in the connector board 43 of the tester side connector 41, the pin side electrode 45 is formed in the relay pin unit 31 side of the surface as shown to FIG. 14, FIG. 15, and FIG. These pin-side electrodes 45 are electrically connected separately to the connecting electrode 25 of the pitch conversion substrate 23, that is, the current terminal electrode 27 and the voltage terminal electrode 28, as shown in FIG. It is comprised by the electric pin side electrode 47 and the voltage pin side electrode 48 so that it may connect, and is arrange | positioned in the position corresponding to the electrically conductive pin 32 of the relay pin unit 31. As shown in FIG.

In this case, these pin side electrodes 45 have a constant pitch, for example, 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0.2 mm. It is arrange | positioned on the grid point, and the arrangement pitch is the same as the arrangement pitch of the conductive pin 32 of the relay pin unit 31. FIG.

Each pin-side electrode 45 is electrically connected to the tester side electrode 44 by a wiring pattern formed on the surface of the insulated substrate and internal wiring formed therein.

In addition, in this embodiment, although the pin side electrode 45 was made into pin shape, the shape of the pin side electrode 45 is not limited to a pin shape, For example, various changes are possible, such as making it a flat electrode.

In the inspection apparatus 10 of this embodiment comprised in this way, as shown in FIG. 14, the electrode 2 and the electrode 3 of the circuit board 1 to be tested are the first anisotropic conductive sheets 22a and 22b, The pitch conversion substrates 23a and 23b, the second anisotropic conductive sheets 26a and 26b, the conductive pins 32a and 32b, the third anisotropic conductive sheets 42a and 42b, and the connector substrates 43a and 43b. The base plates 46a and 46b disposed on the outermost side are pressed to a prescribed pressure by a pressurizing mechanism of the tester to be electrically connected to a tester (not shown), and between the electrodes of the circuit board 1 under test. Electrical inspection, such as electrical resistance measurement in it, is performed.

In this case, as shown in FIG. 19, the pitch conversion board | substrate 23 is interposed with the 1st anisotropically conductive sheet 22 with respect to the to-be-tested electrode 2 (inspection electrode 3) of the to-be-tested circuit board 1. The pair of current terminal electrodes 27 and the voltage terminal electrodes 28 on the side of the circuit board 1 to be inspected are electrically connected to each other.

And the circuit under test of the pitch conversion substrate 23 from the pair of current terminal electrodes 27 and the voltage terminal electrode 28 on the circuit under test 1 side of the substrate 23 for pitch conversion. The pitch is provided through the terminal electrode 24 on the opposite side to the substrate 1, the second anisotropic conductive sheet 26, the conductive pin 32 of the relay pin unit 31, and the third anisotropic conductive sheet 42. The current terminal electrode 27 of the conversion substrate 23 is electrically connected to the current pin side electrode 47 of the connector substrate 43, while the voltage terminal electrode 28 of the pitch conversion substrate 23 is It is electrically connected to the voltage terminal electrode 48 of the connector board 43.

As a result, as shown in FIG. 19, the terminal electrodes 27a and 27b for current of the substrates 23a and 23b for pitch conversion are interposed between the electrodes 2 and 3 for inspection of the circuit board 1 to be inspected. While the current measuring path I is configured, the voltage terminal electrodes 28a and 28b of the substrates 23a and 23b for pitch conversion with respect to the electrodes 2 and 3 for inspection of the circuit board 1 to be inspected. The voltage measuring path V is formed through the gap.

Therefore, the voltage measuring path V is connected to the electrodes 2 and 3 for inspection of the circuit board 1 through the voltage terminal electrodes 28a and 28b of the pitch conversion substrates 23a and 23b. Each of the electrodes under inspection 2 of the circuit under test 1 by the current measurement path I through the current terminal electrodes 27a and 27b of the pitch conversion substrates 23a and 23b while applying a voltage. , 3) and the current flowing through 3) can be measured, whereby a test for confirming the electrical characteristics as to whether or not the wiring pattern of the circuit board 1 under test has a predetermined performance can be performed.

On the contrary, the current measurement path I is provided through the current terminal electrodes 27a and 27b of the pitch converting substrates 23a and 23b with respect to the current inspection target electrodes 2 and 3 of the circuit under test 1. ), While the current is supplied to each of the inspected electrodes of the circuit under test 1 by the voltage measuring path V through the voltage terminal electrodes 28a and 28b of the substrate 23a and 23b for pitch conversion. Voltage is measured about 2, 3), and the confirmation test of the electrical characteristic about whether the wiring pattern of the circuit board 1 under test has a predetermined performance can be performed by this.

In this way, the voltage and current can be measured separately through the voltage measuring path V and the current measuring path I with respect to each of the electrodes 2 and 3 for inspection of the circuit under test 1. In addition, an accurate confirmation test can be performed on the electrical characteristics of whether or not the wiring pattern of the inspection circuit board has a predetermined performance, and the confirmation test can be performed in a short time.

In addition, since the voltage can be measured while supplying a current to the circuit under test 1 of the circuit under test 1, at a set voltage lower than the setting voltage for determining whether the conduction resistance value in a conventional inspection apparatus is acceptable, The conduction resistance value of the circuit under test of the circuit under test 1 can be measured stably.

In other words, as a requirement for high precision inspection, it is necessary to judge whether the circuit is at a low set voltage, but according to the inspection apparatus of the present embodiment, a circuit board having a potential electrical defect can be judged as a defective product with high probability and removed. Therefore, it is possible to perform the confirmation test of a highly reliable circuit board.

In addition, the electrodes 2 and 3 of the circuit board 1 to be inspected are interposed with the voltage terminal electrodes 28a and 28b of the pitch conversion boards 23a and 23b, for example, By applying a constant voltage to the voltage measuring path V, the current is supplied to the current measuring path I via the current terminal electrodes 27a and 27b of the pitch conversion substrates 23a and 23b. Confirmation of the electrical characteristics as to whether the wiring pattern of the circuit board 1 under test has a predetermined performance by measuring the current from each of the electrodes 2 and 3 for inspection of the circuit under test 1 with an ammeter. The test can be done.

20 is a cross-sectional view showing another embodiment of the inspection apparatus of the circuit board of the present invention, and FIG. 21 is a cross-sectional view showing a lamination state at the time of inspection of the inspection apparatus of FIG. In addition, the thing corresponding to the cost element in embodiment mentioned above is represented with the same code | symbol, and the detailed description is abbreviate | omitted.

The configuration of the inspection apparatus of the present embodiment is basically the same as the above-described embodiment, but the relay pin unit is configured to ensure more stable electrical contact with the inspected electrode of the inspected circuit board having the height deviation. have.

The relay pin unit 31 in the present embodiment has a plurality of conductive pins 32a and 32b provided in a predetermined pitch in parallel so as to face the vertical direction as shown in FIGS. 20, 21, and 22. . In addition, the relay pin unit 31 is provided at both ends of these conductive pins 32a and 32b, and is arranged on the side of the circuit board 1 to be inspected for inserting and supporting the conductive pins 32a and 32b. Two insulating plates, 34a and 34b and second insulating plates 35a and 35b disposed on the side opposite to the circuit board 1 side to be inspected, are provided.

For example, as shown in FIG. 22, the conductive pin 32 is provided with a central portion 82 having a larger diameter and end portions 81a and 81b having a smaller diameter than this.

In the first insulating plate 34 and the second insulating plate 35, a through hole 83 into which the end portion 81 of the conductive pin 32 is inserted is formed. Then, the diameter of the through hole 83 is formed larger than the diameter of the end portion 81 of the conductive pin 32 and smaller than the diameter of the central portion 82, thereby keeping the conductive pin 32 from falling off. It is.

The first insulating plate 34 and the second insulating plate 35 are formed by the first supporting pin 33 and the second supporting pin 37 so that the gaps thereof are the length of the center portion 82 of the conductive pin 32. It is fixed so that it may become longer, and it hold | maintains so that the conductive pin 32 may move up and down.

The lengths of the end portions 81a and 81b of the conductive pins 32 are formed to be longer than the thicknesses of the insulating plates 34 and 35 so that the conductive pins 32 protrude from at least one of the insulating plates 34 and 35. It is.

The relay pin unit includes a grid of a plurality of conductive pins having a pitch of a constant pitch, for example, 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0.2 mm. It is placed on the point.

By equalizing the arrangement pitch of the conductive pins 32 of the relay pin unit 31 and the arrangement pitch of the terminal electrodes 24 provided on the substrate 23 for pitch conversion, the substrate for pitch conversion via the conductive pins 32 is provided. 23 is electrically connected to the tester side.

20 to 22, the intermediate holding plates 36a and 36b are disposed in the relay pin unit 31 between the first insulating plates 34a and 34b and the second insulating plates 35a and 35b. It is.

Then, the first supporting pins 33a and 33b are disposed between the first insulating plates 34a and 34b and the intermediate holding plates 36a and 36b, whereby the first insulating plates 34a and 34b are disposed. The intermediate holding plates 36a and 36b are fixed.

Similarly, second supporting pins 37a and 37b are disposed between the second insulating plates 35a and 35b and the intermediate holding plates 36a and 36b, thereby providing the second insulating plates 35a and 35b. The intermediate holding plates 36a and 36b are fixed.

In this case, it does not specifically limit as a material of the 1st support pin 33 and the 2nd support pin 37, For example, it is made of metals, such as brass and stainless steel.

The distance between the first insulating plate 34 and the intermediate holding plate 36 and the distance between the second insulating plate 35 and the intermediate holding plate 36 are not particularly limited, but will be described later. Considering the absorbency of the height deviation of the inspected electrodes 2 and 3 of the circuit board 1 under test due to the elasticity of the insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 of Preferably it is 2 mm or more, More preferably, it is 2.5 mm or more.

And as shown in FIG. 23, the 1st contact support position 38A with respect to the intermediate holding plate 36 of the 1st support pin 33, and the intermediate holding plate 36 of the 2nd support pin 37 is shown. The second abutting support position 38B with respect to the intermediate holding plate projection surface A on which the inspection apparatus is projected in the thickness direction of the intermediate holding plate 36 (the direction from the upper side to the lower side in FIG. 20). It is arranged in different positions.

In this case, although it does not specifically limit as a different position, The 1st contact support position 38A and the 2nd contact support position 38B are on a grid | lattice on the intermediate holding plate projection surface A as shown in FIG. It is preferable that it is formed.

Specifically, as shown in FIG. 23, one second abutting support position is formed in the unit grid region R1 formed of four first abutting support positions 38A adjacent on the intermediate holding plate projection surface A. As shown in FIG. 38B is disposed. Moreover, in the intermediate | middle holding plate projection surface A, one 1st contact support position 38A is arrange | positioned in the unit grid area | region R2 which consists of four adjacent 2nd contact support positions 38B. Consists of. 23, the 1st contact support position 38A is shown with the black circle | round | yen, and the 2nd contact support position 38B is shown with the back circle.

In addition, in the present embodiment, one second abutting support position 38B is disposed at the center of the diagonal line Q1 of the unit lattice region R1 of the first abutting support position 38A, and Although one 1st contact support position 38A is arrange | positioned at the center of the diagonal line Q2 of the unit grid area | region R2 of 2 contact support positions 38B, these relative positions are specifically limited Instead, the inspection apparatus may be disposed at different positions on the intermediate holding plate projection surface A projected in the thickness direction of the intermediate holding plate. That is, when it is not arrange | positioned in a grid | lattice form, it is not restrained by such a relative position relationship, and as above, the inspection apparatus 10 is located in a different position on the intermediate holding plate projection surface A projected in the thickness direction of an intermediate holding plate. You just need to be arranged.

In this case, the separation distance between the first abutting support positions 38A adjacent to each other and the separation distance between the second abutting support positions 38B are not particularly limited, and are preferably 10 to 100 mm. More preferably, it is 12-70 mm, Especially preferably, it is 15-50 mm.

As the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35, those having flexibility are used. The degree of flexibility required for the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 includes the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate ( In the case where both ends of 35) are horizontally arranged in a state supported by 10 cm intervals, the warpage generated by pressurizing at a pressure of 50 kgf from above is 0.02% or less of the width of these insulating plates, and a pressure of 200 kgf from above. It is preferable that it does not generate | occur | produce a fracture and permanent deformation even if it presses on.

As a specific material of the 1st insulating plate 34, the intermediate holding plate 36, and the 2nd insulating plate 35, the thing similar to the insulating plate of the relay pin unit in embodiment mentioned above can be used, For example, a resistivity The insulating material which is 1 * 10 <^{10> (} ohm) * cm or more is preferable.

The thickness of each of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 is equal to that of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35. Although it selects suitably according to the kind of material to comprise, Preferably it is 1-10 mm.

In the inspection apparatus of the present embodiment configured as described above, as shown in FIG. 21, the electrodes 2 and the electrodes 3 of the circuit board 1 under test are subjected to the first anisotropic conductive sheets 22a and 22b for pitch conversion. Through board | substrates 23a and 23b, 2nd anisotropically conductive sheets 26a and 26b, conductive pins 32a and 32b, 3rd anisotropically conductive sheets 42a and 42b, and connector board | substrates 43a and 43b, The base plates 46a and 46b disposed at the outermost side are electrically connected to a tester (not shown) by pressing the tester at a prescribed pressure by a pressurizing mechanism of the tester, and the electric power between the electrodes of the circuit board 1 to be tested. Electrical inspection such as resistance measurement is performed. Hereinafter, with reference to FIGS. 24-27 (only the 2nd inspection jig 11b is shown conveniently), the to-be-tested circuit board between the 1st inspection jig 11a and the 2nd inspection jig 11b. The pressure absorption action and the pressure dispersion | action action at the time of pinching both surfaces of (1) are demonstrated.

When the electric inspection is performed by clamping both surfaces of the circuit board 1 to be inspected between the first inspection jig 11a and the second inspection jig 11b, each cost element is removed from the state shown in FIG. In the initial stage in which the pressurization is started by laminating (FIG. 25), the movement of the conductive pin 32b of the relay pin unit 31b, the first anisotropic conductive sheet 22b, the second anisotropic conductive sheet 26b, and the third The pressure can be absorbed by rubber elastic compression of the anisotropic conductive sheet 42b of the anisotropic conductive sheet 42b, and the height variation of the inspected electrode of the circuit board 1 to be inspected can be absorbed to some extent.

Then, the first abutting support position 38A with respect to the middle holding plate 36b of the first supporting pin 33b and the second holding plate 36b with the second supporting pin 37b are attached. Since the abutment support position 38B is arrange | positioned in a different position in the intermediate holding plate projection surface A projected in the thickness direction of the intermediate holding plate 36b, a force acts in an up-down direction as shown by the arrow of FIG. As shown in FIG. 27, when the test target circuit board 1 to be inspected is further pressed between the first test jig 11a and the second test jig 11b, the first anisotropic conductive sheet ( In addition to the rubber elastic compression of 22b, the second anisotropic conductive sheet 26b, and the third anisotropic conductive sheet 42b, the first insulating plate 34b and the second insulating plate (of the relay pin unit 31b) The circuit to be inspected by the spring elasticity of the intermediate holding plate 36b disposed between 35b) and the first insulating plate 34b and the second insulating plate 35b. It is possible to avoid local stress concentration by dispersing the pressure concentration with respect to the height deviation of the inspected electrode 3 of the substrate 1, for example, the height deviation of the solder ball electrode.

That is, as shown to FIG. 26 and FIG. 27, the intermediate holding plate 36b is centered around the 1st contact support position 38A with the intermediate holding plate 36b of the 1st support pin 33b. 2nd contact support position with the intermediate | middle holding plate 36b of the 2nd support pin 37b with curvature in the direction of the 2nd insulating plate 35b (refer to the E part enclosed by the dashed-dotted line of FIG. 27). The middle holding plate 36b is bent in the direction of the first insulating plate 34b with reference to 38B (see part D enclosed by the dashed-dotted line in FIG. 27). In addition, as used herein, the term &quot; curved &quot; and &quot; curved direction &quot; mean the bent and the protruding direction so that the intermediate holding plate 36 protrudes in a convex direction.

Thus, since the intermediate | middle holding plate 36b bends in a mutually opposite direction centering on the 1st contact support position 38A and the 2nd contact support position 38B, the 1st inspection jig 11a is carried out. And the spring elastic force of the intermediate | middle holding plate 36b are exhibited further when the to-be-tested circuit board 1 which is a test | inspection is further pressed between and 2nd test jig 11b.

In addition, as indicated by the portion B enclosed by the dashed-dotted line in FIG. 27, the height of the conductive pin 32b is absorbed by the compression of the protrusion of the conductive path forming portion of the second anisotropic conductive sheet 26b, but the compression of the protrusion Pressure not fully absorbed by the pressure is applied to the first insulating plate 34b.

Thereby, as shown by the C part enclosed by the dashed-dotted line of FIG. 27, the 1st insulating plate 34b and the 2nd insulating plate 35b are also the 1st support pin 33b and the 2nd support to some extent, respectively. When the pin 37b is bent in a direction opposite to each other at the contact position of the pin 37b, when the test circuit board 1 to be inspected is further pressed between the first test jig 11a and the second test jig 11b. The spring elastic force of the first insulating plate 34b and the second insulating plate 35b is further exerted.

As a result, stable electrical contact is secured to each of the electrodes to be inspected of the circuit board 1 having the height deviation, and stress concentration is further reduced, so that local breakage of the anisotropic conductive sheet is suppressed. As a result, since the repeated use durability of an anisotropic conductive sheet improves, the replacement | exchange frequency of an anisotropic conductive sheet reduces and inspection work efficiency improves.

FIG. 28 is a sectional view similar to FIG. 24 showing another embodiment of the inspection apparatus of the present invention (only the second inspection jig is shown for convenience), and FIG. 29 is an enlarged sectional view of the relay pin unit. In addition, the thing corresponding to the cost element in embodiment mentioned above is represented with the same code | symbol, and the detailed description is abbreviate | omitted.

In the inspection apparatus of the present embodiment, a plurality of intermediate holding plates 36b (three in this embodiment) are disposed between the first insulating plate 34b and the second insulating plate 35b at predetermined intervals, The holding plate support pin 39b is arrange | positioned between these adjacent intermediate holding plates 36b.

In this case, in the at least one intermediate holding plate 36b, the contact holding position and the intermediate holding | maintenance with respect to the intermediate holding plate 36b of the holding plate support pin 39b which abut against the intermediate holding plate 36b from one surface side. Abutting support position with respect to the intermediate holding plate 36b of the 1st support pin 33b, the 2nd support pin 37b, or the holding plate support pin 39b which abuts from the other surface side with respect to the board 36b. Is required to be disposed at a different position on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate 36b.

Most preferably, in all the intermediate holding plates 36b, the contact holding positions and the intermediate holding positions with respect to the intermediate holding plate 36b of the holding plate support pin 39b abutting from one surface side with respect to the intermediate holding plate 36b. The abutment support position with respect to the intermediate holding plate 36b of the 1st support pin 33b, the 2nd support pin 37b, or the retaining plate support pin 39b which abuts from the other surface side with respect to the board 36b is It is arrange | positioned in a different position in the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate 36b.

In this embodiment, in the upper middle holding plate 36b of the three middle holding plates 36b, the middle holding plate 36b of the holding plate supporting pin 39b which abuts against the middle holding plate 36b from one surface side. The abutment support position 39A with respect to) and the abutment support position 38A with respect to the intermediate holding plate 36b of the first support pin 33b abutting from the other surface side with respect to the intermediate holding plate 36b are intermediate. It is arrange | positioned in a different position in the intermediate holding plate projection surface projected in the thickness direction of the holding plate 36b.

Moreover, in the middle middle holding plate 36b of the three middle holding plates 36b, with respect to the middle holding plate 36b of the holding plate support pin 39b which abuts from the one surface side with respect to the middle holding plate 36b. The abutment support position 39A and the abutment support position 39A with respect to the intermediate holding plate 36b of the holding plate support pin 39b abutting from the other surface side with respect to the intermediate holding plate 36b are the intermediate holding plate ( It is arrange | positioned in a different position in the intermediate | middle holding plate projection surface projected in the thickness direction of 36b).

In the lower middle holding plate 36b of the three middle holding plates 36b, the middle holding plate 36b of the holding plate supporting pin 39b which abuts from the one surface side with respect to the middle holding plate 36b. The abutment support position 38B with respect to the abutment support position 39A and the intermediate holding plate 36b of the second support pin 37b which abuts from the other surface side with respect to the intermediate holding plate 36b is an intermediate holding plate ( It is arrange | positioned in a different position in the intermediate holding plate projection surface projected in the thickness direction of 36b).

By such a configuration, the spring elasticity is further exerted by the plurality of intermediate holding plates 36b, and the pressure concentration is dispersed and localized to the height deviation of the inspected electrode 3 of the circuit board 1 to be inspected. Concentration of phosphorus stress can be further avoided, and local breakage of the first anisotropic conductive sheet 22b is suppressed, and as a result, the repeated use durability of the first anisotropic conductive sheet 22b is improved, so that the first anisotropic conductive The number of replacements of the sheet 22b is reduced, and the inspection work efficiency is improved.

In addition, the number of the intermediate holding plates 36 may be multiple, and is not specifically limited.

In the above two embodiments in which the intermediate holding plate 36 is disposed, as shown in FIGS. 20, 21, 24, 25, 27, and 28, in the tester side connector 41. The support pin 49 may be disposed between the connector board 43 and the base plate 46. By these support pins 49, the first support pins 33 and the second support pins 37 (the first support pins 33, the second support pins 37 and the holding plate in Fig. 28). It is also possible to give the effect | action which distributes surface pressure similarly to the action which the support pin 39 gives.

Although two embodiments using the relay pin unit on which the intermediate holding plate is arranged have been described above, the inspection apparatus using the relay pin unit on which the intermediate holding plate is arranged is also the same as that of the embodiment described in FIGS. 14 to 19. A configuration, that is, a configuration that is very suitable for performing current measurement and voltage measurement on the circuit board under test can be applied. 30 is a partially enlarged sectional view of the inspection apparatus.

As shown, the pitch of the board | substrate 23 for pitch conversion is interposed through the 1st anisotropically conductive sheet 22 with respect to the to-be-tested electrode 2 (inspection electrode 3) of the to-be-tested circuit board 1. The pair of current terminal electrodes 27 and voltage terminal electrodes 28 on the inspection circuit board 1 side are electrically connected. In addition, in FIG. 30, the figure is shown in the state which abbreviate | omitted the support pins 33 and 37 for convenience of description.

And the circuit under test of the pitch conversion board | substrate 23 is carried out from a pair of electric current terminal electrode 27 and the voltage terminal electrode 28 on the side of the circuit under test 1 of the circuit board 23 for pitch conversion. The pitch is provided through the terminal electrode 24 on the opposite side to the substrate 1, the second anisotropic conductive sheet 26, the conductive pin 32 of the relay pin unit 31, and the third anisotropic conductive sheet 42. The current terminal electrode 27 of the conversion substrate 23 is electrically connected to the current pin side electrode 47 of the connector substrate 43, and the voltage terminal electrode 28 of the pitch conversion substrate 23 is provided. The connector terminal 43 is electrically connected to the voltage terminal electrode 48.

As a result, the current measurement paths (2, 3) of the test target circuit board 1 are interposed between the current terminal electrodes 27a, 27b of the pitch conversion boards 23a, 23b. While the I) is configured, the electrodes 2 and 3 for inspection of the circuit board 1 to be inspected are interposed between the voltage terminal electrodes 28a and 28b of the substrates 23a and 23b for pitch conversion. The voltage measuring path V is configured.

Therefore, the voltage measurement path V is applied to each of the electrodes 2 and 3 for inspection of the circuit board 1 through the voltage terminal electrodes 28a and 28b of the substrates 23a and 23b for pitch conversion. Each of the electrodes to be inspected 2 of the circuit under test 1 by the current measuring path I via the current measuring path I through the current terminal electrodes 27a and 27b of the pitch conversion substrates 23a and 23b while applying a voltage to the substrate. , 3) and the current flowing through 3) can be measured, whereby a test for confirming the electrical characteristics as to whether or not the wiring pattern of the circuit board 1 under test has a predetermined performance can be performed.

On the contrary, the current measurement path I is provided to each of the electrodes 2 and 3 for inspection of the circuit board 1 through the current terminal electrodes 27a and 27b of the pitch conversion substrates 23a and 23b. Each of the electrodes to be inspected 2 of the circuit under test 1 by the voltage measuring path V via the voltage measuring path V via the voltage terminal electrodes 28a and 28b of the pitch conversion substrates 23a and 23b. And 3), the voltage can be measured, and by this, the confirmation test of the electrical characteristic about whether the wiring pattern of the circuit board 1 under test has predetermined performance can be performed.

As mentioned above, although embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation, a change, and a correction are possible in the range which does not deviate from the summary.

For example, the circuit board 1 to be inspected may be a semiconductor integrated circuit device such as a package IC, an MCM, a CSP, or a circuit device formed on a wafer in addition to a printed circuit board. The printed circuit board may be a single-sided printed circuit board as well as a double-sided printed circuit board.

The 1st inspection jig 11a and the 2nd inspection jig 11b do not necessarily need to be the same in material, member structure, etc., and they may differ. In addition, the 1st inspection jig 11a and the 2nd inspection jig 11b do not necessarily need to arrange these up and down.

The tester-side connector may be formed by stacking a plurality of circuit boards such as a connector board and an anisotropic conductive sheet.

 Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples.

Example 1

Evaluation Circuit Board

The circuit board for evaluation of the following specification was prepared.

Dimensions: 100 mm (length) × 100 mm (width) × 0.8 mm (thickness)

Number of inspected electrodes on the upper side: 7312

Diameter of the inspected electrode on the upper surface side: 0.3 mm

Minimum placement pitch of the inspection target electrode on the upper surface side: 0.4 mm

Number of inspected electrodes on lower surface: 3784

Diameter of the inspected electrode on the lower surface side: 0.3 mm

Minimum placement pitch of the electrode under test on the lower surface side: 0.4 mm

The circuit board test | inspection apparatus (FIG. 20) for test | inspecting the said circuit board for evaluation suitable for the test | inspection part of the rail conveyance type circuit board automatic tester (made by Nippon Computer Co., Ltd., product name: STARREC V5) was produced.

(1) First Anisotropic Conductive Sheet 22

The electroconductive particle arrange | positioned in the thickness direction, and produced the following 1st anisotropic conductive sheet uniformly disperse | distributed to the surface direction.

Dimensions: 110 mm × 110 mm, thickness 0.1 mm

Conductive particles: material; Nickel particles with gold plating treatment, average particle diameter; 20 µm, content rate; 18% by volume

Elastomeric material: material; Silicone rubber, hardness; 40

(2) Pitch Conversion Substrate 23

To a laminated material (Matsushita Electric Works, product name: R-1766) which formed the metal foil layer which consists of copper of 18 micrometers in thickness on the both surfaces of the insulating substrate which consists of glass fiber reinforcement type epoxy resin, respectively, by a numerical control type drilling apparatus. In total, 7312 circular through-holes having a diameter of 0.2 mm penetrating in the thickness direction of the laminated material were formed.

Subsequently, the electroless plating treatment is performed on the laminated material having the through holes formed using an EDTA type copper plating solution, thereby forming a copper plating layer on the inner wall of each through hole, and further performing an electrolytic copper plating treatment using the copper sulfate plating solution. In each through hole, a cylindrical via hole having a thickness of about 10 µm was formed to electrically connect each metal foil layer on the surface of the laminated material to each other.

Subsequently, a dry film resistor (Tokyo Co., Ltd., product name: FP-225) having a thickness of 25 μm is laminated on the metal foil layer on the surface of the laminate material to form a resistor layer, and the metal foil layer on the other side of the laminate material. The protective seal was placed on top. The photomask film was arrange | positioned on this resist layer, and the resist pattern for etching was formed by performing an exposure process using a parallel light exposure machine (Oak Manufacturing Co., Ltd.), and developing. Then, the etching process is performed on the metal foil layer on the surface on which the resist pattern is formed, so that a pattern having a width of 100 μm on the surface of the insulating substrate is connected to 7312 connection electrodes having a diameter of 200 μm, and each connection electrode and the via hole are electrically connected to each other. The wiring portion was formed, and then the resist pattern was removed.

On the surface of the insulated substrate in which the connection electrode and the pattern wiring part were formed, a dry film solder resist (Hitachi Chemical Co., Ltd. name: SR-2300G) having a thickness of 25 µm was laminated to form an insulating layer, and a photomask film was formed on the insulating layer. It arrange | positioned and exposed to an insulation layer using the parallel light exposure machine (Oak Manufacturing Co., Ltd.), and then developed, and formed 7312 opening parts of the diameter of 200 micrometers which expose each connection electrode. By using a copper sulfate plating solution and electrolytic copper plating treatment on each connection electrode using a metal foil layer on the other side of the laminated material as a common electrode, 7312 connection electrodes protruding from the surface of the insulating layer were formed.

Subsequently, the protective seal on the metal foil layer on the other side of the laminated material was removed, and a dry film resist (TOKYO KOGYO CO., LTD.) Having a thickness of 25 µm on the metal foil layer on this side, product name: FP- 225) was laminated to form a resistor layer. Thereafter, a photomask film is placed on the resist layer, and the development process is performed after the exposure process is performed using a parallel light exposure machine (ORC SEISA KUSHO) to the resist layer, thereby producing a laminate material. A resist pattern for etching was formed on the metal foil layer. Subsequently, by etching, a 7312 terminal electrode, a pattern wiring portion for electrically connecting each terminal electrode and a via hole were formed on the back surface of the insulating substrate, and the resist pattern was removed.

Subsequently, a dry film solder resist (Nichigo-Morton Co., LTD., Manufactured by Nichigo-Morton Co., LTD.), Product name: Confomask 2015, having a thickness of 38 μm, was laminated on the back surface of the insulating substrate on which the terminal electrode and the pattern wiring part were formed, and the insulating layer After forming a photomask film on this insulating layer, and then performing an exposure process using a parallel light exposure machine (Oak Manufacturing Co., Ltd.) with respect to an insulating layer, it develops and exposes an electrode of diameter 0.4mm. 7312 openings were formed.

As described above, the substrate 23a for pitch conversion for the first inspection jig 11a was produced. The substrate 23a for pitch conversion has a length of 120 mm x 160 mm, a thickness of 0.5 mm, a diameter of a portion exposed from the surface of the insulating layer of the connecting electrode of about 300 µm, and a surface of the insulating layer of the connecting electrode. The protruding height is about 25 占 퐉, the minimum arrangement pitch of the connection electrode is 0.4 mm, the diameter of the terminal electrode is 0.4 mm, the arrangement pitch of the terminal electrode is 0.75 mm, and the surface roughness of the insulating layer on the surface side on which the connection electrode is formed is 0.02 占 퐉. It was.

Moreover, the pitch conversion board | substrate 23b for the 2nd test jig 11b which produced 3784 connection electrodes on the surface, and had 3784 terminal electrodes on the back surface similarly to the above was produced. The pitch-converting substrate 23b has a vertical and horizontal dimension of 120 mm × 160 mm, a thickness of 0.5 mm, and a diameter of a portion exposed to the surface of the insulating layer in the connection electrode of about 300 μm, in the connection electrode. The protruding height from the surface of the insulating layer is about 25 µm, the minimum arrangement pitch of the connection electrode is 0.4 mm, the diameter of the terminal electrode is 0.4 mm, and the arrangement pitch of the terminal electrode is 0.75 mm. The surface roughness of the insulating layer is 0.02 µm.

(3) circuit board side connector (21)

The first anisotropic conductive sheet 22 is disposed on the front surface side of the substrate 23 for pitch conversion, and a plurality of conductive path forming portions extending in the thickness direction on the rear surface side thereof and an insulating part insulating them from each other. The circuit board side connector 21 was comprised by arrange | positioning the 2nd anisotropically conductive sheet | seat 26 which consists of the uneven type anisotropically conductive sheet which the conductive path formation part protruded on one side.

In addition, the 2nd anisotropic conductive sheet 26 arrange | positioned between the pitch conversion board | substrate 23 and the relay pin unit 31 is a shape shown in FIG. 6, and the following structure was used specifically ,.

[2nd anisotropic conductive sheet 26]

Dimensions: 110 mm × 150 mm

Thickness of conductive path forming part: 0.6 mm

Outer diameter of conductive path forming section: 0.35 mm

Protruding height of conductive path forming portion: 0.05 mm

Conductive particles: material; Nickel particles with gold plating treatment, average particle diameter; 35 micrometers, content rate of electroconductive particle in a conductive path formation part; 30% by volume

Elastomeric material: material; Silicone rubber, hardness; 30

(W ₂ / D ₂ = 17)

(4) relay pin unit (31)

The material of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 is made of an insulating material having a specific resistance of 1 × 10 ¹⁰ Ω · cm or more, a glass fiber reinforced epoxy resin, A thickness of 1.9 mm was used.

The distance L1 between the first insulating plate 34 and the intermediate holding plate 36 is 36.3 mm, and the distance L2 between the second insulating plate 35 and the intermediate holding plate 36 is 3 mm. The first insulating plate is fixedly supported by the first support pin 33 (diameter 2 mm, length 36.3 mm) and the second support pin 37 (diameter 2 mm, length 3 mm). The conductive pin 32 which consists of the following structures between 34 and the 2nd insulating plate 35 was arrange | positioned in the through-hole 83 (diameter 0.4 mm) so that it may become a moving material, and it produced.

[Conduction pin]

Material: gold plated brass

Dimensions of the tip portion 81a: 0.35 mm outer diameter, 2.1 mm total length

Dimensions of the center portion 82: 0.45 mm outer diameter, 41 mm total length

Dimension of base end 81b: outer diameter 0.35 mm, total length 2.1 mm

Further, the first abutting support position 38A with respect to the intermediate holding plate 36 of the first support pin 33 and the second with respect to the intermediate holding plate 36 of the second support pin 37 are described. The contact support position 38B was arrange | positioned at grid form as shown in FIG. Moreover, the separation distance between the 1st contact support positions 38A adjacent to each other, and the separation distance between the 2nd contact support positions 38B was 17.5 mm.

(5) Tester side connector (41)

As shown in FIG. 20, the tester side connector 41 was comprised from the 3rd anisotropically conductive sheet 42, the connector board 43, and the base board 46. As shown in FIG. In addition, the 3rd anisotropically conductive sheet 42 used the thing similar to the 2nd anisotropically conductive sheet 26 mentioned above.

[Performance test]

1. Measurement of the lowest press pressure

The manufactured inspection device is set to the inspection unit of the rail conveyance type circuit board automatic inspection machine "STARREC V5", the evaluation circuit board 1 is set with respect to an inspection device, and the press pressure of the rail conveyance type circuit board automatic inspection machine "STARREC V5" is set. The conduction resistance when a current of 1 milliampere was applied to the inspection electrode to the inspection electrode of the circuit board 1 for evaluation by changing stepwise within the range of 100 to 210 kgf for each press pressure condition. The value was measured.

The inspection point (hereinafter referred to as "NG inspection point") whose measured conduction resistance value is 100 ohms or more is judged as poor conduction, and the ratio of the NG inspection point in the total inspection point (hereinafter, "NG inspection point ratio"). ), The lowest press pressure at which the NG checkpoint ratio was 0.01% or less was defined as the minimum press pressure.

In the measurement of the conduction resistance value, after completion of the measurement of one conduction resistance value, the press pressure according to the measurement is released to return the inspection device to the unpressurized state, and the measurement of the conduction resistance value of the next time is again a predetermined size. The press pressure of was performed by acting.

Specifically, the NG inspection point ratio is 7312 points on the upper surface of the circuit board 1 for evaluation and 3784 points on the lower surface of the evaluation circuit board. The ratio of NG checkpoints to 110960 checkpoints calculated by +3784) × 10 = 110960 is shown.

In this case, "the minimum press pressure is small" means that the electrical inspection of the circuit board under test can be performed at low press pressure. In the inspection apparatus, if the pressing force at the time of inspection can be set low, not only the deterioration of the circuit board and the anisotropic conductive sheet and the inspection circuit board due to the pressing force at the time of inspection can be suppressed, but also durability as a constituent member of the inspection apparatus. It is preferable that the structure of the inspection apparatus can be made small and compact in that it is possible to use a component having low strength, and as a result, improvement in durability of the inspection apparatus and cost reduction in the manufacture of the inspection apparatus are achieved.

2. Measurement of durability of anisotropic conductive sheet

The created inspection device is set to the inspection unit of the rail conveyance type circuit board automatic inspection machine "STARREC V5", the circuit board 1 for evaluation is set with respect to the said inspection apparatus, and the press pressure condition of the rail conveyance circuit board automatic inspection machine "STARREC V5" Is 130 kgf, and after a predetermined number of times of pressurization, the conduction resistance value when a current of 1 milliampere is applied to the test electrode under the press pressure of 130 kgf is applied to the test electrode of the circuit board 1 for evaluation. The measurement was performed once, and a predetermined number of times of pressurization were repeated to similarly repeat the operation of measuring the conduction resistance value 10 times.

The inspection point (NG inspection point) whose measured conduction resistance value became 100 ohms or more was judged as the conduction defect, and the ratio (NG inspection point ratio) of the NG inspection point in a total inspection point was computed.

Subsequently, except that the anisotropic conductive sheet of the inspection apparatus was replaced with a new one and the press pressure condition was changed to 150 kgf, a predetermined number of times of pressurization was carried out under the same conditions as described above, and then the press pressure condition was changed to 150 kgf. The NG check point ratio was calculated according to the same method as above.

In the measurement of the conduction resistance value related to the durability of such anisotropic conductive sheet, after the measurement of one conduction resistance value is completed, the press pressure according to the measurement is released, the inspection apparatus is returned to the unpressurized state, and the following conduction resistance The measurement of the value was again performed by applying a press pressure of a predetermined size.

Specifically, the NG inspection point ratio is 7312 points for the number of electrodes to be inspected on the upper surface of the circuit board 1 for evaluation, and 3784 points for the number of electrodes to be inspected on the lower surface. The ratio of NG checkpoints to 110960 checkpoints calculated by 7312 + 3784) × 10 = 110960 is shown.

In this case, in the inspection apparatus, it is necessary for the practical use that the NG inspection point ratio is 0.01% or less, and when the NG inspection point ratio exceeds 0.01%, an incorrect inspection result that the defective inspection target circuit board is defective. There is a possibility that the electrical inspection of a highly reliable circuit board may not be performed in some cases.

Table 1 shows the measurement results of the lowest presses, and Table 2 shows the measurement results of the durability of the anisotropic conductive sheet.

Example 2

Instead of the relay pin unit 31 described above, the relay pin units 31a and 31b of FIG. 1 were used. That is, a plurality of conductive pins 32a and 32b disposed on a grid point at a constant pitch (2.54 mm pitch) and insulating plates 34a and 34b for supporting the conductive pins 32a and 32b so as to be movable up and down. Using the relay pin unit consisting of 35a and 35b), the inspection apparatus was produced with the structure similar to Example 1 other than that.

About this test | inspection apparatus, the minimum press pressure and durability of the anisotropic conductive sheet were measured by the method similar to Example 1. Table 1 shows the measurement results of the lowest presses, and Table 2 shows the measurement results of the durability of the anisotropic conductive sheet.

NG Checkpoint Rate (%) Press pressure (kgf) Press pressure (kgf) 100 110 130 150 180 210 Example 1 0.3 0.01 0 0 0 0 150 Example 2 2.8 2.2 0.2 0.02 0 0 180

NG Checkpoint Rate (%) Press count (times) One 1000 5000 10000 30000 Example 1 Press pressure 130kgf 0 0 0 0 0.3 Press pressure 150kgf 0 0 0 0.05 0.7 Example 21 Press pressure 130kgf 0 0 0.1 0.25 1.5 Press pressure 150kgf 0 0.06 0.14 0.38 2.3

Example 3

 In the following, the surface roughness was the center average roughness Ra according to JIS B0601 using a 3-dimensional surface structure analysis microscope "New View 200" manufactured by Zygo Corporation, with a cutoff value of 0.8 mm and a measurement length of 0.25. It is the value measured on the conditions of mm.

Evaluation Circuit Board

The circuit board for evaluation of the following specification was prepared.

Dimensions: 100 mm (length) × 100 mm (width) × 0.8 mm (thickness)

Number of inspected electrodes on the upper side: 7312

Diameter of the inspected electrode on the upper surface side: 0.3 mm

Minimum placement pitch of the inspection target electrode on the upper surface side: 0.4 mm

Number of inspected electrodes on lower surface: 3784

Diameter of the inspected electrode on the lower surface side: 0.3 mm

Minimum placement pitch of the electrode under test on the lower surface side: 0.4 mm

The circuit board test | inspection apparatus (FIG. 1) for test | inspecting the said circuit board for evaluation suitable for the test | inspection part of the rail conveyance type circuit board automatic tester (made by Nippon Computer Co., Ltd., product name: STARREC V5) was produced.

(1) First Anisotropic Conductive Sheet 22

The liquid A and liquid B of the two-part addition liquid silicone rubber were mixed at a ratio equal to each other. To 100 parts by weight of this mixture, 100 parts by weight of conductive particles having an average particle diameter of 20 µm were added and mixed, and then a molding material was prepared by performing a degassing treatment under reduced pressure.

As the additive liquid silicone rubber, the viscosity of the liquid A and the liquid B is 500P, respectively, and the compression set at 150 ° C of the cured product (according to the measurement method in accordance with JIS K 6249) is 6% and burst at 23 ° C. The thing whose intensity | strength (according to the measuring method based on JISK6249) was 25 kN / m was used.

Nickel particles were used as core particles as electroconductive particles, and electroless plating was performed on the core particles (average coating amount: the amount of 5% by weight of the core particle weight).

After arranging a 0.08 mm-thick spacer having a rectangular opening of 120 mm x 200 mm on the molding surface of one of the molding members, the prepared molding material is coated in the opening of the spacer, The other molding member was arranged so that the molding surface was in contact with the molding material.

On one molding member, a polyester resin sheet (TORAY CO., LTD., Product name "Mattlemirror S10") of thickness 0.1mm was used for the non-gloss surface (surface roughness of 1 micrometer). Is used as the molding surface, and the other molding member has a polyester resin sheet (made by Toray Corporation, product name "Matt mirror S10") having a thickness of 0.1 mm, and the glossy surface (surface roughness of 0.04 µm) as the molding surface. Used.

Next, using the press roll device which consists of a press roll and a support roll, the molding material was pinched by these molding members, and the thickness of the molding material was 0.08 mm.

An electromagnet is disposed on the back surface of each molding member, and the curing process of the molding material is performed at 120 ° C. for 30 minutes while applying a 0.3T parallel magnetic field to the molding material in the thickness direction thereof. A rectangular anisotropic conductive sheet was produced.

The obtained anisotropic conductive sheet had a surface roughness of 1.4 µm on one surface thereof, a surface roughness of 0.12 µm on the other surface thereof, and a proportion of the conductive particles was 12% in volume fraction. Such an anisotropically conductive elastomer sheet is called "anisotropic conductive sheet (a)".

(2) substrates for pitch conversion (23)

A numerically controlled drilling device was applied to a laminated material (made by Matsushita Electric Works, product name: R-1766) in which a metal foil layer made of copper having a thickness of 18 µm was formed on both surfaces of both surfaces of the insulating substrate made of glass fiber reinforced epoxy resin. A total of 7312 circular through holes having a diameter of 0.2 mm penetrating in the thickness direction of the laminated material were formed. Subsequently, an electroless plating treatment is performed on the laminated material having the through holes formed by using an EDTA type copper plating solution to form a copper plating layer on the inner wall of each through hole, and an electrolytic copper plating treatment using a copper sulfate plating solution is used for each penetration. A cylindrical via hole having a thickness of about 10 μm was formed in the hole to electrically connect each metal foil layer of the laminated material surface to each other.

Subsequently, a dry film resist having a thickness of 25 µm (Tokyo Co., Ltd., product name: FP-225) is laminated on the metal foil layer on the surface of the laminate material to form a resistor layer, and on the metal foil layer on the other side of the laminate material. The protective seal was placed. The photomask film was arrange | positioned on this resist layer, and the resist pattern for etching was formed by performing an exposure process using a parallel light exposure machine (Oak Manufacturing Company) with respect to a resist layer, and developing. Then, by etching the metal foil layer on the surface on which the resist pattern is formed, the line width for electrically connecting 7312 connection electrodes having a diameter of 200 μm, each connection electrode and the via hole to the surface of the insulating substrate is 100 μm. The phosphorus pattern wiring part was formed, and then the resist pattern was removed.

A dry film solder resist (Hitachi Chemical Co., Ltd. name: SR-2300G) having a thickness of 25 µm is laminated on the surface of the insulating substrate on which the connection electrode and the pattern wiring portion are formed to form an insulating layer, and a photomask film is disposed on the insulating layer. Then, the exposure layer was subjected to an exposure process using a parallel light exposure machine (manufactured by Oak Manufacturing Company), and then developed, thereby forming 7312 openings each having a diameter of 200 µm that expose each connection electrode. By using a copper sulfate plating solution and using a metal foil layer on the other side of the laminated material as a common electrode, electrolytic copper plating was performed on each connection electrode, thereby forming 7312 connection electrodes protruding from the surface of the insulating layer. .

Subsequently, the protective seal on the metal foil layer on the other side of the laminated material was removed, and a dry film resist (Tokyo Co., Ltd., product name: FP-225) having a thickness of 25 µm was laminated on the metal foil layer on this side to form a resistor layer. It was. Thereafter, a photomask film is placed on the resist layer, and the resist layer is subjected to an exposure process using a parallel light exposure machine (Oak Manufacturing Co., Ltd.), followed by development, thereby etching on the metal foil layer in the laminated material. A resist pattern was formed. Subsequently, by etching, a 7312 terminal electrode, a pattern wiring portion for electrically connecting each terminal electrode and a via hole were formed on the back surface of the insulating substrate, and the resist pattern was removed.

Subsequently, a dry film solder resist (Nichigo Moton, product name: Confomask 2015) having a thickness of 38 μm was laminated on the back surface of the insulating substrate on which the terminal electrode and the pattern wiring part were formed, to form an insulating layer, and a photo mask on the insulating layer. The film was placed, and then exposed to an insulating layer using a parallel light exposure machine (Oak Manufacturing Co., Ltd.), and then developed to form 7312 openings having a diameter of 0.4 mm to expose the electrodes.

As mentioned above, the pitch conversion board | substrate 23a was produced. This pitch conversion substrate has a vertical and horizontal dimension of 120 mm x 160 mm, a thickness of 0.5 mm, a diameter of a portion exposed from the surface of the insulating layer of the connecting electrode of about 300 µm, and a height of the protrusion of the connecting electrode from the surface of the insulating layer. It was about 25 micrometers, the minimum arrangement pitch of the connection electrode was 0.4 mm, the diameter of the terminal electrode was 0.4 mm, the arrangement pitch of the terminal electrode was 0.75 mm, and the surface roughness of the insulating layer on the surface side on which the connection electrode was formed was 0.02 µm.

The anisotropic conductive sheet a is disposed on the front surface side of the substrate for pitch conversion, and is formed of a plurality of conductive path forming portions extending in the thickness direction on the back surface side and an insulating portion that insulates them from each other. The circuit board side connector 21a of the upper side was arrange | positioned by arrange | positioning the uneven type anisotropic conductive sheet which protruded the conductive path formation part.

In addition, the 2nd anisotropic conductive sheet 26 arrange | positioned between the pitch conversion board | substrate 23 and the relay pin unit 31 is a shape shown in FIG. 6, and the following structures were used specifically ,.

[2nd anisotropic conductive sheet 26]

Dimensions: 110 mm × 150 mm

Thickness of conductive path forming part: 0.6 mm

Outer diameter of conductive path forming section: 0.35 mm

Protruding height of conductive path forming portion: 0.05 mm

Conductive particles: material; Nickel particles with gold plating treatment, average particle diameter; 35 micrometers, content rate of electroconductive particle in a conductive path formation part; 30% by volume

Elastomeric material: material; Silicone rubber, hardness; 30

(W ₂ / D ₂ = 17)

In the same manner as described above, the pitch conversion substrate 23b for the lower side inspection jig having 3784 connection electrodes on the surface and 3784 terminal electrodes on the back surface was produced. This pitch conversion substrate has a dimension of 120 mm x 160 mm in length and width, 0.5 mm in thickness, a diameter of a portion exposed to the surface of the insulating layer of the connecting electrode of about 300 µm, and a height of protrusion from the surface of the insulating layer of the connecting electrode. The minimum arrangement pitch of 25 micrometers, the connection electrode was 0.4 mm, the diameter of the terminal electrode was 0.4 mm, and the arrangement pitch of the terminal electrode was 0.75 mm, and the surface roughness of the insulating layer on the surface side on which the connection electrode was formed was 0.02 µm.

The anisotropic conductive sheet a is disposed on the front surface side of the substrate for pitch conversion, and is formed of a plurality of conductive path forming portions extending in the thickness direction on the back surface side and an insulating portion that insulates them from each other. By arrange | positioning the uneven type anisotropic conductive sheet which protruded the furnace formation part, it was set as the circuit board side connector 21b of the lower side.

Using these circuit board side connectors 21a and 21b on the upper side, the inspection apparatus was constructed by arranging relay pin units 31a and 31b and tester side connectors 41a and 41b as shown in FIG.

[Performance test]

The inspection apparatus was attached to the rail conveyance type circuit board automatic tester "STARREC V5" (made by Nippon Computer Co., Ltd.), and the connection stability test (measurement of the minimum press pressure) and the peeling test of the anisotropic conductive sheet were performed by the following method. .

1. Measurement of the lowest press pressure

The produced inspection apparatus is set to the inspection part of the rail conveyance type circuit board automatic inspection machine "STARREC V5", the circuit board 1 for evaluation is set with respect to an inspection apparatus, and the press of the rail conveyance type circuit board automatic inspection machine "STARREC V5" is pressed. The conduction at the time of changing the pressure in steps within the range of 100 to 250 kgf and applying a current of 1 milliampere to the test electrode to the test electrode of the circuit board 1 for evaluation each time 10 times for each press pressure condition. The resistance value was measured.

The inspection point (hereinafter referred to as "NG inspection point") whose measured conduction resistance value became 100 ohms or more is judged as poor conduction, and the ratio of NG inspection point in the total inspection point (hereinafter, "NG inspection point ratio"). ), The lowest press pressure at which the NG checkpoint ratio was 0.01% or less was defined as the minimum press pressure.

In the measurement of the conduction resistance value, after completion of the measurement of one conduction resistance value, the press pressure according to the measurement is released to return the inspection device to the unpressurized state, and the measurement of the conduction resistance value of the next time is again a predetermined size. It was performed by acting a press pressure of.

Specifically, the NG inspection point ratio is 7312 points on the upper surface of the circuit board 1 for evaluation and 3784 points on the lower surface of the evaluation circuit board. The ratio of NG checkpoints to 110960 checkpoints calculated by 3784) × 10 = 110960 is shown. The measurement results are shown in Table 3.

2. Peelability Test

The circuit board for evaluation was conveyed and set to the inspection apparatus, and it pressed against the circuit board for evaluation by the press load of 150 kgf. In this state, the electrical resistance value at the time of applying a current of 1 mA to the evaluation circuit board electrically connected to the connection electrodes of the two connectors was measured, and then the pressure on the evaluation circuit board was released. After performing this operation 10 times, the circuit board for evaluation was conveyed from the test | inspection area of a test | inspection apparatus.

When the above process is performed for 100 circuit boards for evaluation and the circuit board for evaluation is conveyed from the inspection region of the inspection apparatus, the anisotropic conductive sheet a is separated from the substrate for pitch conversion and adhered to the circuit board for evaluation. The number of times of occurrence (number of return errors) was measured. The measurement results are shown in Table 3.

Example 4

In the inspection apparatus produced in Example 3, instead of the anisotropic conductive elastomer sheet (a), the inspection apparatus is configured using the following anisotropic conductive elastomer sheet (b), and the connection stability test and peelability are performed in the same manner as in Example 3. The test was done. The measurement results are shown in Table 3.

After arranging a frame-shaped spacer having a rectangular opening of 120 mm x 200 mm and a thickness of 0.08 mm on the molding surface of one of the molding members, a molding material prepared in the same manner as in Example 1 was applied to the spacer opening. On the molding material, the other molding member was disposed so that the molding surface was in contact with the molding material.

For both molding members, a polyester resin sheet (manufactured by Toray Co., Ltd., "Matter Mirror S10") having a thickness of 0.1 mm was used with the glossy surface (surface roughness of 0.04 µm) as the molding surface.

Next, the molding material layer of thickness 0.08mm was formed by pinching a molding material with each molding member using the press roll apparatus which consists of a press roll and a support roll. A rectangular anisotropic conductive material having a thickness of 0.1 mm is disposed by curing the molding material layer at 120 ° C. for 30 minutes while arranging an electromagnet on the back surface of each molding member and acting a parallel magnetic field of 0.3T in the thickness direction with respect to the molding material layer. The sheet was produced.

The obtained anisotropic conductive sheet (b) had a surface roughness of 0.13 µm and a surface roughness of 0.12 µm on the other surface, and the proportion of the conductive particles was 12% in the volume fraction.

NG Checkpoint Rate (%) Press pressure (kgf) Bounce errors Press load (kgf) 110 130 150 180 200 250 Example 3 2.2 0.2 0.02 0 0 0 180 0 Example 4 2.3 0.3 0.01 0 0 0 180 95

 Example 5

 In the following, surface roughness measured the center mean roughness Ra by JIS B0601 on condition of cut-off value 0.8mm and measurement length 0.25mm using the 3-dimensional surface structure analysis microscope "New View 200" made by Zhigo Co., Ltd. One value.

Evaluation Circuit Board

The circuit board for evaluation of the following specification was prepared.

Dimensions: 100 mm (length) × 100 mm (width) × 0.8 mm (thickness)

Number of inspected electrodes on the upper side: 7312

Diameter of the inspected electrode on the upper surface side: 0.3 mm

Minimum placement pitch of the inspection target electrode on the upper surface side: 0.4 mm

Number of inspected electrodes on lower surface: 3784

Diameter of the inspected electrode on the lower surface side: 0.3 mm

Minimum placement pitch of the electrode under test on the lower surface side: 0.4 mm

Circuit board inspection apparatus (FIG. 20) for inspecting said evaluation circuit board suitable for the inspection part of the rail conveyance type circuit board automatic tester (Nidec Read Corporation, product name: STARREC V5). Was produced.

(1) First Anisotropic Conductive Sheet 22

The liquid A and liquid B of the two-part addition liquid silicone rubber were mixed at a ratio equal to each other. To 100 parts by weight of this mixture, 100 parts by weight of conductive particles having an average particle diameter of 20 µm were added and mixed, and then a molding material was prepared by performing a degassing treatment under reduced pressure.

As the additive liquid silicone rubber, the viscosity of the liquid A and the liquid B is 500P, respectively, and the compression set at 150 ° C of the cured product (according to the measurement method in accordance with JIS K 6249) is 6% and burst at 23 ° C. The thing whose intensity | strength (according to the measuring method based on JISK6249) was 25 kN / m was used.

Nickel particles were used as core particles as electroconductive particles, and electroless plating was performed on the core particles (average coating amount: the amount of 5% by weight of the core particle weight).

After arranging a 0.08 mm-thick spacer having a rectangular opening of 120 mm x 200 mm on the molding surface of one of the molding members, a molding material prepared in the opening of the spacer is applied and the other is formed on the molding material. The side molding member was arrange | positioned so that the molding surface might contact the molding material.

For one molding member, a polyester resin sheet having a thickness of 0.1 mm (manufactured by Toray Corporation, product name "Matter Mirror S10") was used with the non-gloss surface (surface roughness of 1 µm) as the molding surface, and the other molding member For example, a 0.1 mm thick polyester resin sheet (manufactured by Toray Industries, product name "Matter Mirror S10") was used with the gloss surface (surface roughness of 0.04 µm) as the molding surface.

Next, using the press roll device which consists of a press roll and a support roll, the molding material was pinched by these molding members, and the thickness of the molding material was 0.08 mm.

A rectangle having a thickness of 0.1 mm by arranging the electromagnet on the back surface of each molding member and performing curing treatment of the molding material at 120 ° C. for 30 minutes while acting a 0.3T parallel magnetic field with respect to the molding material in the thickness direction thereof. An anisotropic conductive sheet was prepared.

The obtained anisotropic conductive sheet had a surface roughness of 1.4 µm on one surface thereof, a surface roughness of 0.12 µm on the other surface thereof, and a proportion of conductive particles was 12% in volume fraction. This anisotropically conductive elastomer sheet is called "anisotropically conductive sheet (a)".

(2) Pitch Conversion Substrate 23

The numerically controlled drilling apparatus on the laminated material (Matsushita Electric Co., product name: R-1766) which formed the metal foil layer which consists of steel of 18 micrometers in thickness on the both surfaces of the insulating substrate which consists of glass fiber reinforced epoxy resin, respectively, A total of 7312 circular through holes having a diameter of 0.2 mm penetrating in the thickness direction of the laminated material were formed.

Subsequently, electroless plating is performed on the laminated material having the through holes formed using an EDTA type copper plating solution, thereby forming a copper plating layer on the inner wall of each through hole, and electrolytic copper plating treatment using the copper sulfate plating solution. A cylindrical via hole having a thickness of about 10 μm was formed in the hole to electrically connect each metal foil layer on the surface of the laminated material to each other.

Subsequently, a dry film resistor (Tokyo Co., Ltd., product name: FP-225) having a thickness of 25 µm was laminated on the metal foil layer on the surface of the laminated material to form a resistor layer, and on the metal foil layer on the other side of the laminated material. The protective seal was placed. The photomask film was arrange | positioned on this resist layer, and the resist pattern for etching was formed by performing an exposure process using a parallel light exposure machine (Oak Manufacturing Company) with respect to a resist layer, and developing. Then, the etching process is performed on the metal foil layer on the surface on which the resist pattern is formed, so that a pattern having a width of 100 μm on the surface of the insulating substrate is connected to 7312 connection electrodes having a diameter of 200 μm, and each connection electrode and the via hole are electrically connected to each other. The wiring portion was formed, and then the resist pattern was removed.

A dry film solder resist (Hitachi Chemical Co., Ltd. name: SR-2300G) having a thickness of 25 µm is laminated on the surface of the insulating substrate on which the connection electrode and the pattern wiring portion are formed to form an insulating layer, and a photomask film is disposed on the insulating layer. Then, 7312 openings each having a diameter of 200 μm were formed by exposing each connection electrode by performing an exposure process using a parallel light exposure machine (Oak Manufacturing Co., Ltd.) with respect to the insulating layer. By using copper sulfate plating solution and using a metal foil layer on the other side of the laminated material as a common electrode, 7312 connection electrodes protruding from the surface of the insulating layer were formed by electrolytic copper plating treatment on each connection electrode.

Subsequently, the protective seal on the metal foil layer on the other side of the laminated material was removed, and a dry film resist (Tokyo Co., Ltd., product name: FP-225) having a thickness of 25 µm was laminated on the metal foil layer on this side to form a resistor layer. It was. Thereafter, a photo mask film is disposed on the resist layer, and the resist layer is subjected to an exposure process using a parallel light exposure machine (Oak Manufacturing Co., Ltd.), followed by development, thereby etching on the metal foil layer in the laminated material. The resist pattern of was formed. Subsequently, by etching, a 7312 terminal electrode, a pattern wiring portion for electrically connecting each terminal electrode and a via hole were formed on the back surface of the insulating substrate, and the resist pattern was removed.

Subsequently, a dry film solder resist (Nichigo Moton, product name: Confomask 2015) having a thickness of 38 µm was laminated on the back surface of the insulating substrate on which the terminal electrode and the pattern wiring part were formed, to form an insulating layer, and a photo mask on the insulating layer. The film was placed, and then exposed to an insulating layer using a parallel light exposure machine (Oak Manufacturing Co., Ltd.), and then developed to form 7312 openings having a diameter of 0.4 mm to expose the electrodes.

As described above, the substrate 23a for pitch conversion for the first inspection jig 11a was produced. The substrate 23a for pitch conversion has a length of 120 mm x 160 mm, a thickness of 0.5 mm, a diameter of a portion exposed from the surface of the insulating layer of the connecting electrode of about 300 µm, and a surface of the insulating layer of the connecting electrode. The protruding height is about 25 占 퐉, the minimum arrangement pitch of the connection electrode is 0.4 mm, the diameter of the terminal electrode is 0.4 mm, the arrangement pitch of the terminal electrode is 0.75 mm, and the surface roughness of the insulating layer on the surface side on which the connection electrode is formed is 0.02 占 퐉. It was.

Moreover, the pitch conversion board | substrate 23b for the 2nd test jig 11b which produced 3784 connection electrodes on the surface, and had 3784 terminal electrodes on the back surface was produced similarly to the above. The pitch-converting substrate 23b has a vertical and horizontal dimension of 120 mm × 160 mm, a thickness of 0.5 mm, and a diameter of a portion exposed to the surface of the insulating layer in the connection electrode of about 300 μm, in the connection electrode. The protruding height from the surface of the insulating layer is about 25 µm, the minimum arrangement pitch of the connection electrode is 0.4 mm, the diameter of the terminal electrode is 0.4 mm, and the arrangement pitch of the terminal electrode is 0.75 mm. The surface roughness of the insulating layer is 0.02 µm.

(3) circuit board side connector (21)

The first anisotropic conductive sheet 22 is disposed on the front surface side of the substrate 23 for pitch conversion, and a plurality of conductive path forming portions extending in the thickness direction on the rear surface side thereof and an insulating part insulating them from each other. The circuit board side connector 21 was made by arrange | positioning the 2nd anisotropically conductive sheet | seat 26 which consists of the uneven type anisotropically conductive sheet | seat which protruded the conductive path formation part on one side.

In addition, the 2nd anisotropic conductive sheet 26 arrange | positioned between the pitch conversion board | substrate 23 and the relay pin unit 31 is a shape shown in FIG. 6, and the following structures were used specifically ,.

[2nd anisotropic conductive sheet 26]

Dimensions: 110 mm × 150 mm

Thickness of conductive path forming part: 0.6 mm

Outer diameter of conductive path forming section: 0.35 mm

Protruding height of conductive path forming portion: 0.05 mm

Conductive particles: material; Nickel particles with gold plating treatment, average particle diameter; 35 micrometers, content rate of electroconductive particle in a conductive path formation part; 30% by volume

Elastomeric material: material; Silicone rubber, hardness; 30

(W ₂ / D ₂ = 17)

(4) relay pin unit (31)

The material of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 is made of an insulating material having a specific resistance of 1 × 10 ¹⁰ Ω · cm or more, a glass fiber reinforced epoxy resin, A thickness of 1.9 mm was used.

The distance L1 between the first insulating plate 34 and the intermediate holding plate 36 is 36.3 mm, and the distance L2 between the second insulating plate 35 and the intermediate holding plate 36 is 3 mm. The first insulating plate (1) is fixedly supported by the first support pin 33 (diameter 2 mm, length 36.3 mm) and the second support pin 37 (diameter 2 mm, length 3 mm). The conductive pin 32 which consists of the following structures between 34) and the 2nd insulating plate 35 was arrange | positioned in the through-hole 83 (diameter 0.4 mm) so that it may become a moving material, and it produced.

[Conduction pin]

Material: gold plated brass

Dimensions of the tip portion 81a: 0.35 mm outer diameter, 2.1 mm total length

Dimensions of the center portion 82: 0.45 mm outer diameter, 41 mm total length

Dimension of base end 81b: outer diameter 0.35 mm, total length 2.1 mm

Further, the second abutment of the first abutting support position 38A with the intermediate holding plate 36 of the first supporting pin 33 and the intermediate holding plate 36 of the second supporting pin 37 The contact support position 38B was arrange | positioned at grid form as shown in FIG. Moreover, the separation distance between the 1st contact support positions 38A which adjoined each other, and the separation distance between the 2nd contact support positions 38B was 17.5 mm.

(5) Tester side connector (41)

As shown in FIG. 20, the tester side connector 41 was comprised from the 3rd anisotropically conductive sheet 42, the connector board 43, and the base board 46. As shown in FIG. In addition, the 3rd anisotropically conductive sheet 42 used the thing similar to the 2nd anisotropically conductive sheet 26 mentioned above.

[Performance test]

The inspection apparatus was attached to the rail conveyance type circuit board automatic tester "STARREC V5" (made by Nippon Computer Co., Ltd.), and the connection stability test (measurement of the minimum press pressure) and the peeling test of the anisotropic conductive sheet were performed by the following method.

1.Measure the lowest press pressure

The created inspection apparatus is set to the inspection part of the rail conveyance type circuit board automatic inspection machine "STARREC V5", the circuit board 1 for evaluation is set with respect to an inspection apparatus, and the press pressure of the rail conveyance type circuit board automatic inspection machine "STARREC V5" Is changed in steps within the range of 100 to 210 kgf, and each time 10 times for each press pressure condition, a current of 1 milliampere is applied to the inspecting electrode to the inspected electrode of the circuit board 1 for evaluation. The conduction resistance value was measured.

The inspection point (hereinafter referred to as "NG inspection point") whose measured conduction resistance value is 100 ohms or more is judged as poor conduction, and the ratio of the NG inspection point in the total inspection point (hereinafter, "NG inspection point ratio"). ), The lowest press pressure at which the NG checkpoint ratio was 0.01% or less was defined as the minimum press pressure.

In the measurement of the conduction resistance value, after completion of the measurement of one conduction resistance value, the press pressure according to the measurement is released to return the inspection device to the unpressurized state, and the measurement of the conduction resistance value of the next time is again a predetermined size. It was performed by acting a press pressure of.

Specifically, the NG inspection point ratio is 7312 points on the upper surface of the circuit board 1 for evaluation and 3784 points on the lower surface of the evaluation circuit board. The ratio of NG checkpoints to 110960 checkpoints calculated by 3784) × 10 = 110960 is shown. The measurement results are shown in Table 4.

2. Peelability Test

The circuit board for evaluation was conveyed and set to the inspection apparatus, and it pressed against the circuit board for evaluation by the press load of 130 kgf. In this state, the electrical resistance value when a current of 1 milliampere was applied to the evaluation circuit board electrically connected to the connection electrodes of the two connectors was measured, and then the pressure on the evaluation circuit board was released. . After performing this operation 10 times, the circuit board for evaluation was conveyed from the test | inspection area of a test | inspection apparatus.

When the said process is performed with respect to 100 circuit boards for evaluation, and the circuit board for evaluation was conveyed from the test | inspection area | region of a test | inspection apparatus, the anisotropic conductive sheet (a) deviates from the pitch conversion board | substrate and adheres to the circuit board for evaluation. The number of times (the number of return errors) which was made was measured. The measurement results are shown in Table 4.

Example 6

In the inspection apparatus produced in Example 5, the inspection apparatus was configured using the following anisotropic conductive elastomer sheet (b) instead of the anisotropic conductive elastomer sheet (a), and the connection stability test and peelability were performed in the same manner as in Example 5. The test was done. The measurement results are shown in Table 4.

After arranging a spacer having a rectangular opening of 120 mm x 200 mm and having a thickness of 0.08 mm on the molding surface of one of the molding members, a molding material prepared in the same manner as in Example 1 was applied to the spacer opening. And the other molding member was arrange | positioned on this molding material so that the molding surface may contact the molding material.

For both molding members, a polyester resin sheet (manufactured by Toray Co., Ltd., "Matter Mirror S10") having a thickness of 0.1 mm was used with the glossy surface (surface roughness of 0.04 µm) as the molding surface.

Next, the molding material layer of thickness 0.08mm was formed by pinching a molding material with each molding member using the press roll apparatus which consists of a press roll and a support roll. Anisotropic magnets having a thickness of 0.1 mm are disposed by placing an electromagnet on the rear surface of each molding member and performing a curing treatment of the molding material layer at 120 ° C. for 30 minutes while acting a 0.3T parallel magnetic field with respect to the molding material layer. An electroconductive sheet was produced.

The obtained anisotropic conductive sheet (b) had a surface roughness of 0.13 µm and a surface roughness of 0.12 µm on the other surface, and the proportion of the conductive particles was 12% in the volume fraction.

NG Checkpoint Rate (%) Press pressure (kgf) Bounce errors Press load (kgf) 100 110 130 150 180 210 Example 5 2.1 0.02 0 0 0 0 130 0 Example 6 2.3 0.02 0 0 0 0 130 84

Example 7

Evaluation Circuit Board

The circuit board for evaluation of the following specification was prepared.

Dimensions: 100 mm (length) × 100 mm (width) × 0.8 mm (thickness)

Number of inspected electrodes on the upper side: 3400

Diameter of the inspected electrode on the upper surface side: 0.3 mm

Minimum placement pitch of the inspection target electrode on the upper surface side: 0.4 mm

Number of inspected electrodes on lower surface: 2500

Diameter of the inspected electrode on the lower surface side: 0.3 mm

Minimum placement pitch of the electrode under test on the lower surface side: 0.4 mm

The circuit board test | inspection apparatus (FIG. 14) for test | inspecting the said circuit board for evaluation suitable for the test | inspection part of the rail conveyance type circuit board automatic tester (product name: STARREC V5) was produced.

(1) First Anisotropic Conductive Sheet 22

The electroconductive particle arrange | positioned in the thickness direction, and produced the following 1st anisotropic conductive sheet uniformly disperse | distributed to the surface direction.

Dimensions: 110 mm × 110 mm, thickness 0.1 mm

Conductive particles: material; Nickel particles with gold plating treatment, average particle diameter; 20 µm, content rate; 18% by volume

Elastomeric material: material; Silicone rubber, hardness; 40

(2) Pitch Conversion Substrate 23

Numerically controlled drilling to a laminated material (Matsushita Electric Works, product name: R-1766) in which a metal foil layer made of copper having a thickness of 18 µm was formed on both surfaces of both surfaces of a 0.5 mm thick insulating substrate made of glass fiber reinforced epoxy resin. A total of 6800 circular through holes having a diameter of 0.1 mm were formed by the apparatus, respectively, penetrating in the thickness direction of the laminated material.

In this case, two through-holes were formed at one position corresponding to the inspection target electrode on the upper surface side of the evaluation circuit board, and one through-hole was formed by providing a gap of 0.1 mm (that is, Means that the gap between the through hole A = 0.1 mm and the through hole B = 0.1 mm is set to 0.1 mm).

Subsequently, the electroplated layer was formed on the inner wall of each through-hole by electroless plating with the EDTA type copper plating liquid, and the electrolytic copper plating process was performed using the copper sulfate plating liquid. In each through hole, a cylindrical via hole having a thickness of about 10 μm was formed to electrically connect the metal foil layers on the surface of the laminated material to each other.

Subsequently, a dry film resist having a thickness of 25 µm (Tokyo Co., Ltd., product name: FP-225) is laminated on the metal foil layer on the surface of the laminate material to form a resistor layer, and on the metal foil layer on the other side of the laminate material. The protective seal was placed. The photomask film was arrange | positioned on this resist layer, and the resist pattern for etching was formed by performing an exposure process using a parallel light exposure machine (Oak Manufacturing Company) with respect to a resist layer, and developing. Then, by etching the metal foil layer on the surface on which the resist pattern is formed, the line width for electrically connecting the 6800 connection electrodes 60 μm wide and 150 μm vertically, and each connection electrode and the via hole to the surface of the insulating substrate. The pattern wiring part which is this 100 micrometers was formed, and then the resist pattern was removed.

Next, a dry film resistor (Tokyo Co., Ltd., product name: FP-225) having a thickness of 50 µm was laminated on the surface on the side where the connecting electrode and the pattern wiring portion of the laminated material were formed to form a resistor layer. A photomask film is disposed, the exposure layer is subjected to an exposure process using a parallel light exposure machine (Oak Manufacturing Co., Ltd.), and then the development process is performed to expose each connection electrode. 6800 rectangular openings were formed.

6800 connection electrodes were formed by electrolytic copper plating treatment for each connection electrode using a copper sulfate plating solution and using a metal foil layer on the other side of the laminated material as a common electrode. The register pattern was then removed.

Subsequently, the protective seal on the metal foil layer on the other side of the laminated material was removed, and a dry film resistor (Tokyo Co., Ltd., product name: FP-225) having a thickness of 25 µm was laminated on the metal foil layer on this side to form a resistor layer. It was. Thereafter, a photo mask film is disposed on the resist layer, and the resist layer is subjected to an exposure process using a parallel light exposure machine (Oak Manufacturing Co., Ltd.), followed by development, thereby etching on the metal foil layer in the laminated material. The resist pattern of was formed.

Subsequently, a protective seal is applied to the surface of the side on which the connecting electrode of the laminated material is formed, followed by etching to form a pattern wiring portion for electrically connecting 6800 terminal electrodes, each terminal electrode, and a via hole to the back surface of the insulating substrate. Removed the register pattern.

Subsequently, a dry film solder resist (Nichigo Moton, product name: Confomask 2015) having a thickness of 38 µm is laminated on the back surface of the insulating substrate on which the terminal electrode and the pattern wiring portion are formed, to form an insulating layer, and a photo on the insulating layer. The mask film was arrange | positioned, and then, an exposure process was performed using the parallel light exposure machine (Oak Manufacturing Co., Ltd.) with respect to the insulating layer, and then developed, and 6800 opening parts with a diameter of 0.4 mm which expose an electrode were formed.

As mentioned above, the pitch conversion board | substrate 23a was produced. The substrate 23 for pitch conversion has a length of 120 mm x 160 mm, a thickness of 0.5 mm, and a dimension of the portion exposed from the surface of the insulating layer of the connection electrode 25 in a horizontal direction of about 60 µm, and in a longitudinal direction of about 60 µm. 150 µm, the height of the projection electrode 25 from the surface of the insulating layer is about 60 µm, the separation distance between the pair of connection electrodes 25 is 100 µm, the diameter of the terminal electrode 24 is 0.4 mm, and the terminal electrode ( The arrangement pitch of 24) was 0.75 mm, and the surface roughness of the insulating layer on the surface side where the connection electrode 24 was formed was 0.02 µm.

Further, in the same manner as described above, the substrate 23b for pitch conversion for the second inspection jig 11b, which has 5000 connection electrodes 25 on the front surface and 5000 terminal electrodes 24 on the back surface, is provided. Produced.

The pitch-converting substrate 23b has a horizontal and horizontal dimension of 120 mm x 160 mm, a thickness of 0.5 mm, and a horizontal direction of about 60 µm in a portion exposed to the surface of the insulating layer in the connecting electrode 25, and a longitudinal direction. About 150 micrometers, the protrusion height from the surface of the insulating layer in the connection electrode 25 is about 60 micrometers, The separation distance between paired connection electrodes is 100 micrometers, The diameter of the terminal electrode 24 is 0.4 mm, Terminal electrode The arrangement pitch of (24) is 0.75 mm, and the surface roughness of the insulating layer of the surface (surface in which the connection electrode was formed) was 0.02 micrometer.

(3) circuit board side connector (21)

The first anisotropic conductive sheet 22 is disposed on the front surface side of the substrate 23 for pitch conversion, and a plurality of conductive path forming portions extending in the thickness direction on the rear surface side thereof and an insulating part insulating them from each other. The circuit board side connector 21 was made by arrange | positioning the 2nd anisotropically conductive sheet | seat 26 which consists of the uneven type anisotropically conductive sheet which the conductive path formation part protruded in the one surface.

In addition, the 2nd anisotropic conductive sheet 26 arrange | positioned between the pitch conversion board | substrate 23 and the relay pin unit 31 is a shape shown in FIG. 6, and the following structure was used specifically ,.

[2nd anisotropic conductive sheet 26]

Dimensions: 110 mm × 150 mm

Thickness of conductive path forming part: 0.6 mm

Outer diameter of conductive path forming section: 0.35 mm

Protruding height of conductive path forming portion: 0.05 mm

Conductive particles: material; Nickel particles with gold plating treatment, average particle diameter; 35 micrometers, content rate of electroconductive particle in a conductive path formation part; 30% by volume

Elastomeric material: material; Silicone rubber, hardness; 30

(W ₂ / D ₂ = 17)

(4) relay pin unit (31)

As the material of the insulating plates 34 and 35, an insulating material having a specific resistance of 1 × 10 ¹⁰ Ω · cm or more and a glass fiber reinforced epoxy resin, and having a thickness of 6 mm were used.

Then, this is attached to the support pin 33 so that the distance between the insulating plate 34 and the insulating plate 35 is 52 mm, and the conductive pin 32 having the following structure is formed in the through hole 83 so as to be a moving material. Placed.

[Conduction pin]

Material: gold plated brass

Tip size: 0.35mm outer diameter, 6.7mm total length

Center part dimensions: outside diameter 0.45mm, total length 51mm

Base end dimensions: 0.35mm outer diameter, 6.7mm total length

Distance between adjacent inspection pins: 0.75 mm

(5) Tester side connector (41)

As shown in FIG. 14, the tester side connector 41 was comprised from the 3rd anisotropically conductive sheet 42, the connector board 43, and the base board 46. As shown in FIG. In addition, the same thing as the 2nd anisotropically conductive sheet 26 mentioned above was used for the 3rd anisotropically conductive sheet 42.

[Performance test]

1.Measure the lowest press pressure

The created inspection apparatus is set to the inspection part of the rail conveyance type circuit board automatic inspection machine "STARREC V5", the circuit board 1 for evaluation is set with respect to an inspection apparatus, and the press pressure of the rail conveyance type circuit board automatic inspection machine "STARREC V5" Is changed in steps within the range of 100 to 250 kgf, and for each electrode under test each press pressure condition, a current of 1 milliampere is applied to the electrode for inspection than the electrode for current supply with respect to the electrode for inspection of the circuit board 1 for evaluation. The conduction resistance value at the time of supplying was measured with the voltage measuring electrode.

The inspection point (hereinafter referred to as "NG inspection point") whose measured conduction resistance value is 100 ohms or more is judged as poor conduction, and the ratio of the NG inspection point in the total inspection point (hereinafter, "NG inspection point ratio"). ), The lowest press pressure at which the NG checkpoint ratio was 0.01% or less was defined as the minimum press pressure.

In the measurement of the conduction resistance value, after completion of the measurement of one conduction resistance value, the press pressure according to the measurement is released to return the inspection device to the unpressurized state, and the measurement of the conduction resistance value of the next time is again a predetermined size. It was performed by acting a press pressure of.

Specifically, the NG inspection point ratio is 3400 for the number of electrodes to be inspected on the upper surface of the circuit board 1 for evaluation, and 2500 for the number of electrodes to be inspected on the lower surface. The ratio of NG checkpoints to 59000 checkpoints calculated by +2500) × 10 = 59000 is shown. The measurement results are shown in Table 5.

2. Measurement of durability of anisotropic conductive sheet

The inspection device thus created is set to the inspection section of the rail conveyance type circuit board automatic inspection machine "STARREC V5", the circuit board 1 for evaluation prepared for the said inspection apparatus is set, and the rail conveyance type circuit board automatic inspection machine "STARREC V5" The press pressure condition is 150 kgf, and after pressurizing a predetermined number of times, the test electrode of the circuit board 1 for evaluation is subjected to 1 milliampere to the test electrode than the current supply electrode under the condition of press pressure 150 kgf. The conduction resistance value at the time of supply of electric current was measured 10 times with the voltage measuring electrode.

The inspection point (NG inspection point) whose measured conduction resistance value became 100 ohms or more was judged as the conduction defect, and the ratio (NG inspection point ratio) of the NG inspection point in a total inspection point was computed.

Subsequently, the anisotropic conductive sheet in the inspection apparatus was replaced with a new one, and pressurization was performed a predetermined number of times under the same conditions as described above except that the press pressure condition was changed to 180 kgf, and then the press pressure condition was changed to 180 kgf. Other than that, the NG test point ratio was computed according to the same method as the above.

In measuring the conduction resistance value related to the durability of this anisotropically conductive sheet, after the measurement of one conduction resistance value is complete | released, the press pressure according to the said measurement is opened, a test apparatus is returned to a pressurized state, and the following conduction resistance The measurement of the value was again performed by applying a press pressure of a predetermined size.

Specifically, the NG inspection point ratio is 3400 points on the upper surface of the electrode to be inspected and 2500 points on the lower surface of the circuit board 1 for evaluation. The ratio of NG checkpoints to 59000 checkpoints calculated by 3400 + 2500) × 10 = 59000 is shown.

In this case, in the inspection apparatus, it is necessary for practical use that the ratio of the NG inspection point is 0.01% or less, and when the ratio of the NG inspection point is more than 0.01%, an incorrect inspection result of a defective product is obtained with respect to a good inspection circuit board. In some cases, there is a fear that electrical inspection of a highly reliable circuit board cannot be performed. Table 6 shows the measurement results.

3.Evaluation of the conduction defect of the circuit board under test

The manufactured inspection apparatus is set to the inspection part of the rail conveyance type circuit board automatic inspection machine "STARREC V5", the evaluation circuit board 1 prepared for the said inspection apparatus is set, and the rail conveyance type circuit board automatic inspection machine "STARREC V5" Conduction when 1 milliampere of current was supplied to the electrode for inspection than the electrode for current supply under the conditions of press pressure 150 kgf with respect to the test | inspection electrode of the evaluation circuit board 1 as 150 kgf of press pressure conditions of the The resistance value is measured 10 times with a voltage measuring electrode, and the inspection point (NG inspection point ratio) at which the conduction resistance value of the set conduction resistance value (100?) Or more is detected is determined as the NG inspection point, and the NG at the total inspection point. The ratio of the checkpoints (NG checkpoint ratio) was calculated.

And evaluation of the circuit board 1 for evaluation was performed about the same evaluation circuit board 1 by changing the setting of the conduction resistance value judged as an NG test point to the resistance value lower than 100 ohms. Table 7 shows the measurement results.

Example 8

In the inspection apparatus of Example 7, the substrate for pitch conversion was changed to the following one.

Numerically controlled drilling to a laminated material (Matsushita Electric Works, product name: R-1766) in which a metal foil layer made of steel having a thickness of 18 µm is formed on both surfaces of both surfaces of a 0.5 mm thick insulating substrate made of glass fiber reinforced epoxy resin. A total of 3400 circular through holes each having a diameter of 0.2 mm penetrating in the thickness direction of the laminated material were formed by the apparatus.

In the manufacturing method of the pitch conversion board | substrate of Example 7, the pitch conversion board | substrate 23a for the upper side was similarly manufactured except having changed the opening pattern of the register for connection electrodes into the circular shape of 200 micrometers in diameter.

The obtained upper pitch conversion substrate 23a has a vertical and horizontal dimension of 120 mm × 160 mm, a thickness of 0.5 mm, and a dimension of a portion exposed from the insulating layer surface of the connection electrode 25 with a diameter of about 250 µm and a connection electrode. The connection electrode 25 is arrange | positioned so that the protrusion height from the insulating layer surface of 25 may be about 60 micrometers, and one of the connection electrodes may connect to one of the to-be-tested electrode of a circuit board under test, and the terminal electrode 24 is carried out. The diameter of the wafer was 0.4 mm, the arrangement pitch of the terminal electrodes 24 was 0.75 mm, and the surface roughness of the insulating layer on the surface side on which the connection electrode 24 was formed was 0.02 µm.

Moreover, in the same manner to the above, the lower pitch conversion board 23b which has 2500 connection electrodes 25 in the surface and 2500 terminal electrodes 24 in the back surface was created.

The lower pitch conversion substrate 23b has a vertical and horizontal dimension of 120 mm × 160 mm, a thickness of 0.5 mm, and a diameter of a portion exposed to the surface of the insulating layer in the connection electrode 25 of about 250 μm, The connection electrode 25 is arrange | positioned so that the protrusion height from the surface of the insulating layer in the connection electrode 25 may be about 60 micrometers, and one of the connection electrodes may connect to one of the to-be-tested electrode of a circuit board under test, The diameter of the terminal electrode 24 is 0.4 mm, the arrangement pitch of the terminal electrode 24 is 0.75 mm, and the surface roughness of the insulating layer on the surface (surface on which the connection electrode is formed) is 0.02 µm.

About the produced test | inspection apparatus, evaluation of the minimum press pressure, the durability of an anisotropic conductive sheet, and the conduction defect of the test circuit board was measured by the method similar to Example 7. In Table 5, the measurement result of the lowest press is shown in Table 5, the measurement result of the durability of an anisotropically conductive sheet is shown in Table 6, and evaluation of the conduction defect of the test circuit board is shown in Table 7.

NG Checkpoint Rate (%) Press pressure (kgf) Press pressure (kgf) 100 110 130 150 180 210 Example 7 3.9 2.0 0.17 0.01 0 0 180 Example 8 4.3 2.2 0.2 0.02 0 0 180

NG Checkpoint Rate (%) Press count (times) One 1000 5000 10000 30000 Example 7 Press pressure 180kgf 0 0 0.09 0.22 1.4 Press pressure 210kgf 0 0.02 0.13 0.25 2.1 Example 8 Press pressure 180kgf 0 0 0.12 0.24 1.5 Press pressure 210kgf 0 0.04 0.15 0.38 2.3

NG Checkpoint Rate (%) Set resistance value (Ω) 100 50 10 One 0.5 0.1 0.01 Example 7 Press pressure 180kgf 0 0 0 0.01 0.02 4.3 9.5 Press pressure 210kgf 0 0 0 0.01 0.03 4.5 9.2 Example 8 Press pressure 180kgf 0 0.6 4.1 Inmeasurement Inmeasurement Inmeasurement Inmeasurement Press pressure 210kgf 0 0.5 3.9 Inmeasurement Inmeasurement Inmeasurement Inmeasurement

 Example 9

Evaluation Circuit Board

The circuit board 1 for evaluation of the following specification was prepared.

Dimensions: 100 mm (length) × 100 mm (width) × 0.8 mm (thickness)

Number of inspected electrodes on the upper side: 3600

Diameter of the inspected electrode on the upper surface side: 0.3 mm

Minimum placement pitch of the inspection target electrode on the upper surface side: 0.4 mm

Number of inspected electrodes on the lower surface side: 2600

Diameter of the inspected electrode on the lower surface side: 0.3 mm

Minimum placement pitch of the electrode under test on the lower surface side: 0.4 mm

The circuit board test | inspection apparatus (FIG. 30) for inspecting said evaluation circuit board suitable for the test | inspection part of the rail conveyance type circuit board automatic tester (made by Nippon Computer Co., Ltd., product name: STARREC V5) was produced.

(1) First Anisotropic Conductive Sheet 22

The electroconductive particle arrange | positioned in the thickness direction, and produced the following 1st anisotropic conductive sheet uniformly disperse | distributed to the surface direction.

Dimensions: 110 mm × 110 mm, thickness 0.1 mm

Conductive particles: material; Nickel particles with gold plating treatment, average particle diameter; 20 µm, content rate; 18% by volume

Elastomeric material: material; Silicone rubber, hardness; 40

(2) Pitch Conversion Substrate 23

Numerically controlled drilling to a laminated material (Matsushita Electric Works, product name: R-1766) in which a metal foil layer made of steel having a thickness of 18 µm is formed on both surfaces of both surfaces of a 0.5 mm thick insulating substrate made of glass fiber reinforced epoxy resin. By the apparatus, a total of 7200 circular through holes each having a diameter of 0.1 mm penetrating in the thickness direction of the laminated material were formed.

In this case, two through-holes were formed in one pair, and were formed at positions corresponding to the inspection target electrode on the upper surface side of the circuit board for evaluation, and one set of through-holes was formed by providing a gap of 0.1 mm (that is, Means that the gap between the through hole A = 0.1 mm and the through hole B = 0.1 mm is set to 0.1 mm).

Thereafter, the electroless plating treatment is performed on the inner wall of each through-hole by electroless plating the laminated material on which the through-hole is formed by using an EDTA type copper plating solution, and the electrolytic copper plating treatment is performed using the copper sulfate plating solution. In each through hole, a cylindrical via hole having a thickness of about 10 μm was formed to electrically connect the metal foil layers on the surface of the laminated material to each other.

Subsequently, a dry film resistor (Tokyo Co., Ltd., product name: FP-225) having a thickness of 25 µm was laminated on the metal foil layer on the surface of the laminated material to form a resistor layer, and on the metal foil layer on the other side of the laminated material. The protective seal was placed. The photomask film was arrange | positioned on this resist layer, and the resist pattern for etching was formed by performing an exposure process using a parallel light exposure machine (Oak Manufacturing Company) with respect to a resist layer, and developing. Then, by etching the metal foil layer on the surface on which the resist pattern is formed, the line width for electrically connecting 7200 connection electrodes having a width of 60 µm and a length of 150 µm and the respective connection electrodes and the via hole to the surface of the insulating substrate is increased. The pattern wiring part which is 100 micrometers was formed, and then the resist pattern was removed.

Subsequently, a dry film resistor (Tokyo Co., Ltd., product name: FP-225) having a thickness of 50 µm was laminated on the surface on the side where the connection electrode and the pattern wiring portion of the laminated material were formed to form a resistor layer. A photomask film is disposed thereon, the exposure layer is subjected to an exposure process using a parallel light exposure machine (Oak Manufacturing Co., Ltd.), and then a development process is performed to expose each connection electrode. 7200 openings of a rectangular shape were formed.

And using the copper sulfate plating liquid, using the metal foil layer of the other side of a laminated material as a common electrode, 7200 connection electrodes were formed by electrolytic copper plating process about each connection electrode. The register pattern was then removed.

Subsequently, the protective seal on the metal foil layer on the other side of the laminated material was removed, and a dry film resist (Tokyo Co., Ltd., product name: FP-225) having a thickness of 25 µm was laminated on the metal foil layer on this side to form a resistor layer. Formed. Then, the photomask film is arrange | positioned on this resist layer, and it exposes on a metal foil layer in laminated materials by developing after performing an exposure process using a parallel light exposure machine (Oak Manufacturing Co., Ltd.) with respect to a resist layer. A register pattern for the dragon was formed.

Subsequently, after a protective seal is applied to the surface on which the connecting electrode of the laminated material is formed, an etching treatment is performed to form a pattern wiring portion for electrically connecting 7200 terminal electrodes, each terminal electrode and a via hole to the back surface of the insulating substrate. And the register pattern was removed.

Subsequently, a dry film soldering resist (manufactured by Nichigo Moton, product name: Confomask 2015) having a thickness of 38 µm is laminated on the back surface of the insulating substrate on which the terminal electrode and the pattern wiring portion are formed, to form an insulating layer, and a photo mask on the insulating layer. The film was arrange | positioned, and then, after performing exposure processing using a parallel light exposure machine (oak making company) with respect to an insulating layer, it developed by 7200 opening parts with a diameter of 0.4 mm which expose an electrode.

As mentioned above, the pitch conversion board | substrate 23 was produced. As for the pitch conversion board | substrate 23, the dimension of the horizontal and horizontal dimension is 120 mm x 160 mm, the thickness is 0.5 mm, and the dimension of the part exposed from the insulating layer surface of the connection electrode 25 is about 60 micrometers in a horizontal direction, Approximately 150 μm in the longitudinal direction, the protruding height from the surface of the insulating layer of the connection electrode 25 is about 60 μm, the separation distance of 25 between the paired connection electrodes is 100 μm, the diameter of the terminal electrode 24 is 0.4 mm, the terminal The arrangement pitch of the electrodes 24 was 0.75 mm, and the surface roughness of the insulating layer on the surface side on which the connection electrodes 24 were formed was 0.02 μm.

In the same manner as described above, the substrate 23b for pitch conversion for the second inspection jig 11b, which has 5200 connection electrodes 25 on the front surface and 5200 terminal electrodes 24 on the back surface, is provided. Produced.

The substrate 23b for pitch conversion has a longitudinal dimension of 120 mm × 160 mm, a thickness of 0.5 mm, and a horizontal direction of about 60 μm of a portion exposed to the surface of the insulating layer in the connection electrode 25. Direction about 150 micrometers, the protrusion height from the surface of the insulating layer in the connection electrode 25 is about 60 micrometers, the separation distance between paired connection electrodes is 100 micrometers, the diameter of the terminal electrode 24 is 0.4 mm, and a terminal The arrangement pitch of the electrodes 24 is 0.75 mm, and the surface roughness of the insulating layer on the surface (surface on which the connection electrode is formed) is 0.02 μm.

(3) circuit board side connector (21)

The first anisotropic conductive sheet 22 is disposed on the front surface side of the substrate 23 for pitch conversion, and a plurality of conductive path forming portions extending in the thickness direction on the rear surface side thereof and an insulating part insulating them from each other. The circuit board side connector 21 was made by arrange | positioning the 2nd anisotropically conductive sheet | seat 26 which consists of the uneven type anisotropically conductive sheet which the conductive path formation part protruded in the one surface.

In addition, the 2nd anisotropic conductive sheet 26 arrange | positioned between the pitch conversion board | substrate 23 and the relay pin unit 31 is a shape shown in FIG. 6, and the following structures were used specifically ,.

[2nd anisotropic conductive sheet 26]

Dimensions: 110 mm × 150 mm

Thickness of conductive path forming part: 0.6 mm

Outer diameter of conductive path forming section: 0.35 mm

Protruding height of conductive path forming portion: 0.05 mm

Conductive particles: material; Nickel particles with gold plating treatment, average particle diameter; 35 micrometers, content rate of electroconductive particle in a conductive path formation part; 30% by volume

Elastomeric material: material; Silicone rubber, hardness; 30

(W ₂ / D ₂ = 17)

(4) relay pin unit (31)

The material of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 has a resistivity of 1 × 10 ¹⁰ Ω. It consisted of an insulating material of cm or more, glass fiber reinforced epoxy resin, and used the thing whose thickness is 1.9 mm.

The distance L1 between the first insulating plate 34 and the intermediate holding plate 36 is 36.3 mm, and the distance L2 between the second insulating plate 35 and the intermediate holding plate 36 is 3 mm. The first insulating plate (1) is fixedly supported by the first support pin 33 (diameter 2 mm, length 36.3 mm) and the second support pin 37 (diameter 2 mm, length 3 mm). The conductive pin 32 which consists of the following structures between 34) and the 2nd insulating plate 35 was arrange | positioned in the through-hole 83 (diameter 0.4 mm) so that it may become a moving material, and it produced.

[Conduction pin]

Material: gold plated brass

Dimensions of the tip portion 81a: 0.35 mm outer diameter, 2.1 mm total length

Center part 32 dimension: outer diameter 0.45 mm, total length 41 mm

Dimension of base end 81b: outer diameter 0.35 mm, total length 2.1 mm

Further, the second abutment of the first abutting support position 38A with the intermediate holding plate 36 of the first supporting pin 33 and the intermediate holding plate 36 of the second supporting pin 37 The contact support position 38B was arrange | positioned at grid form. Moreover, the separation distance between the 1st contact support positions 38A adjacent to each other, and the separation distance between the 2nd contact support positions 38B was 17.5 mm.

(5) Tester side connector (41)

The tester side connector 41 was comprised from the 3rd anisotropically conductive sheet 42, the connector board 43, and the base board 46. As shown in FIG. In addition, the 3rd anisotropically conductive sheet 42 used the thing similar to the 2nd anisotropically conductive sheet 26 mentioned above.

[Performance test]

1. Measurement of the lowest press pressure

The created inspection apparatus is set to the inspection part of the rail conveyance type circuit board automatic inspection machine "STARREC V5", the circuit board 1 for evaluation prepared for the inspection apparatus is set, and the press of the rail conveyance type circuit board automatic inspection machine "STARREC V5" The pressure was changed in steps within the range of 100 to 210 kgf, and for each test pressure condition for each press 10 times, the test electrode of the circuit board 1 for evaluation was 1 milliampere to the test electrode than the current supply electrode. The conduction resistance value at the time of applying the electric current was measured by the voltage measuring electrode.

The inspection point (hereinafter referred to as "NG inspection point") whose measured conduction resistance value is 10 ohms or more is judged as a poor conduction, and the ratio of NG inspection point in the total inspection point (hereinafter, "NG inspection point ratio"). ), The lowest press pressure at which the NG checkpoint ratio was 0.01% or less was defined as the minimum press pressure.

In the measurement of the conduction resistance value, after completion of the measurement of one conduction resistance value, the press pressure according to the measurement is released to return the inspection device to the unpressurized state, and the measurement of the conduction resistance value of the next time is again a predetermined size. It was performed by acting a press pressure of.

Specifically, the NG inspection point ratio is 3600 points on the upper surface inspected electrode and 2600 points on the lower surface inspected electrode of the circuit board 1 for evaluation. The ratio of NG checkpoints to 62000 checkpoints calculated by 3600 + 2600) x10 = 62000 is shown. Table 8 shows the measurement results.

2. Measurement of durability of anisotropic conductive sheet

The manufactured inspection apparatus is set to the inspection part of the rail conveyance type circuit board automatic inspection machine "STARREC V5", the evaluation circuit board 1 prepared for the said inspection apparatus is set, and the rail conveyance type circuit board automatic inspection machine "STARREC V5" Press pressure condition of 130 kgf, and after a predetermined number of times of pressurization, the test electrode of the circuit board 1 for evaluation was subjected to 1 milliampere to the electrode for inspection than the electrode for current supply under the conditions of a press pressure of 130 kgf. The conduction resistance value at the time of applying the electric current was measured 10 times, and the operation | movement which measured the conduction resistance value 10 times with the voltage measuring electrode was similarly repeated by pressing the predetermined | prescribed number of times.

The inspection point (NG inspection point) in which the measured conduction resistance value was 10 ohms or more was judged as a poor conduction, and the ratio (NG inspection point ratio) of the NG inspection point in a total inspection point was computed.

Subsequently, the anisotropic conductive sheet in the inspection apparatus was replaced with a new one, and pressurization was performed a predetermined number of times under the same conditions as described above except that the press pressure condition was changed to 150 kgf, and then the press pressure condition was changed to 150 kgf. Other than that, the NG test point ratio was computed according to the same method as the above.

In measuring the conduction resistance value related to the durability of such anisotropic conductive sheet, after the measurement of one conduction resistance value is complete | released, the press pressure according to the said measurement is opened, a test apparatus is returned to a pressurized state, and the following conduction resistance The measurement of the value was again performed by applying a press pressure of a predetermined size.

Specifically, the NG inspection point ratio is 3600 points on the upper surface inspected electrode and 2600 points on the lower surface inspected electrode of the circuit board 1 for evaluation. The ratio of NG checkpoints to 62000 checkpoints calculated by 3600 + 2600) x10 = 62000 is shown.

In this case, in the inspection apparatus, it is necessary for the NG inspection point ratio to be 0.01% or less for practical use, and when the NG inspection point ratio exceeds 0.01%, an incorrect inspection result of a defective product for the inspected circuit board, which is a good product, is obtained. Since it may be obtained, there exists a possibility that the electrical inspection of a highly reliable circuit board may not be performed. Table 9 shows the measurement results.

3. Evaluation of conduction defect of the circuit board under test

The manufactured inspection apparatus is set to the inspection part of the rail conveyance type circuit board automatic inspection machine "STARREC V5", the evaluation circuit board 1 prepared for the said inspection apparatus is set, and the rail conveyance type circuit board automatic inspection machine "STARREC V5" Conduction resistance when 1 milliampere of current was supplied to the electrode for inspection than the current supply electrode under the press pressure of 150 kgf with respect to the test target of the circuit board 1 for evaluation, with a press pressure of 150 kgf. The value is measured 10 times with a voltage measuring electrode, and the inspection point (NG inspection point ratio) in which the conduction resistance value of the set conduction resistance value (100 Ω) or more is detected is determined as the NG inspection point, and the NG inspection at the total inspection point. The ratio of points (NG checkpoint ratio) was calculated.

And evaluation of the circuit board 1 for evaluation was performed about the same evaluation circuit board 1 by changing the setting of the conduction resistance value judged as an NG test point to the resistance value lower than 100 ohms. Table 10 shows the measurement results.

Example 10

Instead of the relay pin unit 31 of the ninth embodiment, the relay pin units 31a and 31b as shown in FIG. 1 were used. That is, a plurality of conductive pins 32a and 32b disposed on a grid point at a constant pitch (2.54 mm pitch) and insulating plates 34a and 34b for supporting the conductive pins 32a and 32b so as to be movable up and down. 35a, 35b) were used.

About the produced inspection apparatus, the minimum press pressure and durability of the anisotropic conductive sheet were measured by the method similar to Example 9. Table 8 shows the measurement results of the lowest press, and Table 9 shows the measurement results of the durability of the anisotropic conductive sheet.

Example 11

In the inspection apparatus of Example 9, the substrate for pitch conversion was changed to the following.

Numerically controlled drilling to a laminated material (Matsushita Electric Works, product name: R-1766) in which a metal foil layer made of steel having a thickness of 18 µm is formed on both surfaces of both surfaces of a 0.5 mm thick insulating substrate made of glass fiber reinforced epoxy resin. A total of 3600 circular through holes each having a diameter of 0.2 mm penetrating in the thickness direction of the laminated material were formed by the apparatus.

In the manufacturing method of the pitch conversion board | substrate of Example 9, the pitch conversion board | substrate for the upper side was produced like Example 9 except having changed the opening pattern of the resistor for connection electrodes into the circular shape of 200 micrometers in diameter.

The obtained upper pitch conversion substrate has 3600 connection electrodes 25 on the surface, and the horizontal and horizontal dimensions thereof are 120 mm x 160 mm, thickness 0.5 mm, and portions exposed from the insulating layer surface of the connection electrode 25. The connecting electrode 25 has a diameter of about 250 µm, a height of projecting from the insulating layer surface of the connecting electrode 25 of about 60 µm, and one of the connecting electrodes is connected to one of the inspected electrodes of the circuit board under test. The arrangement | positioning, the diameter of the terminal electrode 24 was 0.4 mm, the arrangement pitch of the terminal electrode 24 was 0.75 mm, and the surface roughness of the insulating layer of the surface side in which the connection electrode 24 was formed was 0.02 micrometer.

Moreover, in the same manner to the above, the pitch conversion board | substrate for the lower side which has 2600 connection electrodes 25 on the surface and has 2600 terminal electrodes 24 on the back surface was created.

This lower pitch conversion substrate has a vertical and horizontal dimension of 120 mm x 160 mm, a thickness of 0.5 mm, and a diameter of a portion exposed to the surface of the insulating layer in the connection electrode 25 of about 250 µm, and the connection electrode. The connection electrode 25 is arrange | positioned so that the protrusion height from the surface of the insulating layer in (25) may be about 60 micrometers, and one of the connection electrodes may connect to one of the to-be-tested electrode of a circuit board under test, and the terminal electrode ( The diameter of 24 is 0.4 mm, the arrangement pitch of the terminal electrodes 24 is 0.75 mm, and the surface roughness of the insulating layer on the surface (surface on which the connection electrode is formed) is 0.02 µm.

About the produced inspection apparatus, the minimum press pressure and durability of the anisotropic conductive sheet were measured by the method similar to Example 9. The measurement result of the durability of an anisotropic conductive sheet is shown in Table 10, and the result of evaluation which changed the conduction resistance value judged as the NG test point of the conduction defect of the circuit board under test to the resistance value lower than 100 ohms is shown in Table 11.

In addition, in the case of Table 8 and Table 9, since the 4-terminal test is set, the set voltage is set to 10Ω, and in the case of Table 10 and Table 11, the case of 2-terminal test (Example 11) is included. Is set to 100Ω.

NG Checkpoint Rate (%) Press pressure (kgf) Press pressure (kgf) 100 110 130 150 180 210 Example 9 0.2 0.03 0 0 0 0 130 Example 10 3.2 2.5 0.3 0.01 0 0 180

NG Checkpoint Rate (%) Press count (times) One 1000 5000 10000 30000 Example 9 Press pressure 130kgf 0 0 0 0 0.2 Press pressure 150kgf 0 0 0 0.04 0.5 Example 10 Press pressure 130kgf 0 0 0.15 0.3 1.8 Press pressure 150kgf 0 0.05 0.2 0.25 2.2

NG Checkpoint Rate (%) Press count (times) One 1000 5000 10000 30000 Example 9 Press pressure 180kgf 0 0 0.08 0.25 1.5 Press pressure 210kgf 0 0.02 0.13 0.27 2.0 Example 11 Press pressure 180kgf 0 0 0.13 0.25 1.6 Press pressure 210kgf 0 0.05 0.20 0.35 2.5

NG Checkpoint Rate (%) Set resistance value (Ω) 100 50 10 One 0.5 0.1 0.01 Example 9 Press pressure 180kgf 0 0 0 0.01 0.03 4.2 8.5 Press pressure 210kgf 0 0 0 0.02 0.02 3.8 9.0 Example 11 Press pressure 180kgf 0 0.5 4.2 Inmeasurement Inmeasurement Inmeasurement Inmeasurement Press pressure 210kgf 0 0.6 3.9 Inmeasurement Inmeasurement Inmeasurement Inmeasurement

Claims (13)

As an inspection apparatus of a circuit board which performs an electrical inspection by clamping both surfaces of the to-be-tested circuit board which are a test target between both test jig by a pair of 1st test jig and a 2nd test jig, The first inspection jig and the second inspection jig, respectively, A pitch conversion substrate for converting an electrode pitch between one surface side and the other surface side of the substrate, A first anisotropic conductive sheet disposed on an inspection circuit board side of the substrate for pitch conversion; A circuit board side connector having a second anisotropic conductive sheet disposed on a side opposite to the circuit board under test of the pitch conversion substrate; A plurality of conductive pins arranged at a predetermined pitch, A relay pin unit having a pair of spaced apart first insulating plates and a second insulating plate to axially move the conductive pins; A connector board electrically connecting the tester and the relay pin unit; A third anisotropic conductive sheet disposed on the relay pin unit side of the connector board; A tester side connector having a base plate disposed on the opposite side of the relay pin unit of the connector board, The first anisotropic conductive sheet is an anisotropic conductive sheet in which the conductive particles are uniformly dispersed in the surface direction while the conductive particles are arranged in the thickness direction. The thickness W ₁ of the first anisotropic conductive sheet is 0.03 to 0.5 mm, the number average particle diameter D ₁ of the conductive particles is 3 to 50 μm, the thickness W ₁ and the number average particle diameter D _1. The ratio W ₁ / D ₁ is 1.1 to 10, and the durometer hardness of the insulating elastomer constituting the sheet base material is 30 to 90, the inspection apparatus of the circuit board. The said 1st anisotropically conductive sheet is 0.5-5 micrometers in surface roughness in the surface of the side which contact | connects a to-be-tested circuit board, The surface of the side which contact | connects the board | substrate for pitch conversion of Claim 1 or 2 The surface roughness in is 0.3 micrometer or less, The said pitch conversion board | substrate has the surface roughness of the insulating part in the surface of the side which contact | connects a 1st anisotropically conductive sheet | seat, 0.2 micrometer or less, The inspection apparatus of the circuit board characterized by the above-mentioned. The said 2nd anisotropically conductive sheet consists of several conductive path forming parts extended in the thickness direction, and the insulating part which insulates these conductive path forming parts mutually, and is electroconductive in any one of Claims 1-3. Particles are contained only in the conductive path forming portion, whereby the conductive particles are uniformly dispersed in the surface direction, and the conductive path forming portion protrudes on one surface side of the sheet. The thickness W ₂ of the conductive path forming portion in the second anisotropic conductive sheet is 0.1 to 2 mm, the number average particle diameter D ₂ of the conductive particles is 5 to 200 μm, and the thickness W ₂ and the number average particle diameter D ₂ ratio W ₂ / D ₂ is 1.1 to 10 of the testing device of the circuit board, characterized in that the durometer hardness of the elastomer constituting the insulating sheet bases 15 to 60. The said 3rd anisotropically conductive sheet consists of a some electrically conductive path formation part extended in the thickness direction, and the insulating part which insulates these electrically conductive path formation parts mutually, and electroconductive particle of any one of Claims 1-5. It is contained only in a conductive path formation part, The electroconductive particle disperse | distributes nonuniformly to a surface direction by this, and an electroconductive path formation part protrudes on the one surface side of a sheet | seat, The inspection apparatus of the circuit board characterized by the above-mentioned. The said pitch conversion board | substrate is provided with the connection electrode which consists of a pair of current terminal electrode and voltage terminal electrode, The said connection electrode is an each of the circuit board to be tested. The pair of current terminal electrodes and the voltage terminal electrode are electrically connected to the electrode to be inspected, and are disposed on the pitch conversion substrate. And a pin side electrode for current and a pin side electrode for voltage are arranged on the connector substrate so as to be electrically connected to the current terminal electrode and the voltage terminal electrode of the pitch conversion substrate, respectively. The relay pin unit according to any one of claims 1 to 7, An intermediate holding plate disposed between the first insulating plate and the second insulating plate; A first support pin disposed between the first insulating plate and the intermediate holding plate; With a second support pin disposed between the second insulating plate and the intermediate holding plate, A first abutment support position with respect to the intermediate holding plate of the first support pin and a second abutment support position with respect to the intermediate holding plate of the second support pin are projected in the thickness direction of the intermediate holding plate. It is arrange | positioned at a different position in the intermediate | middle holding plate projection surface, The inspection apparatus of the circuit board characterized by the above-mentioned. The method according to claim 8, wherein when a pair of the first inspection jig and the second inspection jig are pressed together on both sides of the inspection circuit board to be inspected between the two inspection jigs, The middle holding plate is bent in the direction of the second insulating plate with the first abutting support position with respect to the middle holding plate of the first supporting pin, The intermediate holding plate is configured to bend in the direction of the first insulating plate centering on the second abutting support position with respect to the intermediate holding plate of the second supporting pin. . The first abutting support position with respect to the middle holding plate of the said 1st support pin is arrange | positioned at the grid | lattice form in the said middle holding plate projection surface, A second abutting support position with respect to the intermediate holding plate of the second supporting pin is arranged in a lattice shape on the intermediate holding plate projection surface, In the intermediate holding plate projection surface, one second abutment support position is arranged in a unit grid area composed of four adjacent first abutment support positions, The said intermediate | middle holding plate projection surface WHEREIN: It is comprised so that one 1st contact support position may be arrange | positioned in the unit grating area which consists of four adjacent 2nd contact support positions. The relay pin unit according to any one of claims 1 to 7, A plurality of intermediate holding plates arranged at a predetermined interval apart from the first insulating plate and the second insulating plate; With the holding plate support pin disposed between the adjacent intermediate holding plates, In at least one intermediate | middle holding plate, the contact support position with respect to the said intermediate | middle holding plate of the holding plate support pin which abuts from the one surface side with respect to the said intermediate | middle holding plate, and the 1st which abuts from the other surface side with respect to the said intermediate holding plate. Abutment support position of the support pin, the second support pin, or the retaining plate support pin with respect to the intermediate holding plate is arranged at a different position in the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate. A circuit board inspection apparatus. 12. The all-intermediate holding plate according to claim 11, wherein the abutment support position of the holding plate support pin, which abuts from one surface side with respect to the middle holding plate, with respect to the middle holding plate, and the other side with respect to the middle holding plate. Contact position of the first support pin, the second support pin, or the retaining plate support pin with respect to the corresponding intermediate retaining plate is different from the intermediate retaining plate projection surface projected in the thickness direction of the intermediate retaining plate. It is arrange | positioned, The inspection apparatus of the circuit board. A circuit board inspection method using the circuit board inspection apparatus according to any one of claims 1 to 12, wherein a pair of first inspection jig and a second inspection jig are used between both inspection jigs. An inspection method of a circuit board, characterized in that the electric inspection is performed by pressing both surfaces of the circuit board under test.

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