CN1926437A - Circuit board inspecting device and circuit board inspection method - Google Patents

Abstract

There is provided a circuit substrate inspection device capable of performing electrical inspection of a circuit substrate with a high reliability even when the circuit substrate to be inspected has small electrodes of a small pitch. The circuit substrate inspection device includes a first inspection jig and a second inspection jig, between which a circuit substrate to be inspected is arranged with a sandwiching pressure for performing electric inspection. As a first anisotropic conductive sheet arranged at the side of the circuit substrate to be inspected for a pitch conversion substrate, there is used an anisotropic conductive sheet having conductive particles arranged in the thickness direction and uniformly dispersed in the surface direction. Moreover, a connection electrode of the pitch conversion substrate is formed by a current terminal electrode and a voltage terminal electrode which are electrically connected to respective inspection electrodes of the circuit substrate to be inspected. On the connector substrate, there are arranged a current pin side electrode and a voltage pin side electrode to be electrically connected respectively to the current terminal electrode and the voltage terminal electrode of the pitch conversion substrate. Moreover, an intermediate holding plate is arranged between a first insulation plate and a second insulation plate in a relay pin unit and between them, support pints are arranged at abutment support positions different from the front and the rear surfaces.

Description

The testing fixture of circuit substrate and the inspection method of circuit substrate

Technical field

The present invention relates to becomes state that the electrode that will form on the two sides that is examined circuit substrate is electrically connected with tester and is examined the testing fixture of circuit substrate of electrical characteristics of circuit substrate and the inspection method of circuit substrate with inspection by clamping from the two sides with upside gauging fixture and downside gauging fixture as carrying out the circuit substrate (hereinafter referred to as " being examined circuit substrate ") of galvanoscopic inspection object and pressurizeing.

Background technology

Before integrated circuit etc. is installed,, check the electrical characteristics of the tellite that is used to install integrated circuit etc. for the wiring pattern of confirming circuit substrate has the performance of regulation.

In this electric-examination is looked into, for example, check head part by changing at the inspection of the conveyer that the possesses circuit substrate inspection head of packing in tester, carried out the inspection of different circuit substrates.

For example, as disclosing in the patent documentation 1 (spy opens flat 6-94768 communique), proposed to use the electrode that is examined that on substrate, embeds with being examined circuit substrate to contact method with the gauging fixture of the structure of the inspection pin of the metal that conducts.

In addition, as disclosing in the patent documentation 2 (spy opens flat 5-159821 communique), known use made up inspection head with conduction pin, be called as the method for the gauging fixture of circuit substrate that the spacing conversion of オ Off グ リ ッ ト adapter uses and anisotropic conductive sheet.

But, as patent documentation 1, use the metal inspection pin directly with the method that is examined the gauging fixture that electrode contacts that is examined circuit substrate in, owing to the possibility that exists the electrode that is examined circuit substrate to sustain damage with contacting of the conduction pin that constitutes by metal.

Particularly miniaturization, the densification of the circuit in the circuit substrate have obtained progress in recent years, under the situation of checking such tellite, for a plurality of conduction pins are contacted with the electrode conduction that is examined that is examined circuit substrate simultaneously, must gauging fixture be pressurizeed with high pressure, be examined electrode and damage easily.

And, be used for checking such miniaturization, densification the gauging fixture of tellite, on substrate, embed a plurality of pins difficulty that more and more becomes technically with high density.In addition, its manufacturing cost is also high, and under the situation that the metal pin of a part has damaged, to repair, change be difficult.

On the other hand, as patent documentation 2, using in the gauging fixture of anisotropic conductive sheet, the electrode that is examined that is used to be examined circuit substrate contacts with the electrode of spacing conversion with substrate through the anisotropic conductive sheet, so have the advantage that electrode is difficult to damage that is examined that is examined circuit substrate.In addition, owing to used the substrate that carries out the spacing conversion, because can be to be embedded in the inspection pin that embeds on the substrate than the wide spacing of the spacing that is examined electrode that is examined circuit substrate, so there is no need to embed the inspection pin, also have the advantage of the manufacturing cost that can save gauging fixture with minuteness space.

But, in this gauging fixture, owing to be necessary each is made the spacing conversion with substrate with embed the gauging fixture of checking pin as the circuit substrate that is examined of checking object, so and be necessary as the same number of gauging fixture of being checked of the tellite that is examined circuit substrate.

Therefore, under the situation of having produced a plurality of tellites, exist with it and must possess the problem of a plurality of gauging fixtures accordingly.Particularly the goods of electronic installation circulation is in recent years shortened, has been obtained progress in the shorteningization of the production period of the employed tellite of goods, but follow in this, can not in long-time, use gauging fixture, produce the problem that when changing the production of tellite, must produce gauging fixture.

As countermeasure, for example proposed to adopt the testing fixture of gauging fixture of the so-called universal class of the such use relaying pin unit of patent documentation 3～5 for example (spy open flat 7-248350 communique, spy are opened flat 8-271569 communique, the spy opens flat 8-338858 communique) to such problem.

Figure 31 is the sectional view of testing fixture that has adopted the gauging fixture of such universal class.

This testing fixture possesses upside gauging fixture 111a and downside gauging fixture 111b, and these gauging fixtures possess circuit substrate side- connector 121a, 121b, relaying pin unit 131a, 131b and tester side- connector 141a, 141b.

Circuit substrate side- connector 121a, 121b possess the spacing conversion with substrate 123a, 123b and the anisotropic conductive sheet 122a, 122b, 126a, the 126b that dispose on its two sides.

Relaying pin unit 131a, 131b possess a pair of insulcrete 134a, 134b and 135a, the 135b that has disposed conduction pin 132a, the 132b of a plurality of (for example 5000 pins) and support this conduction pin 132a, 132b and it can be moved up and down on grid point with certain spacing (for example 2.54mm spacing).

Tester side- connector 141a, 141b possess clamping with gauging fixture 111a, 111b and are examined circuit substrate 101 and are electrically connected tester with connector base board 143a, the 143b of conduction pin 132a, 132b, at the conduction pin 132a of connector base board 143a, 143b, anisotropic conductive sheet 142a, 142b and base plate 146a, the 146b of 132b one side configuration when it is pressurizeed.

The gauging fixture that has used this relaying pin unit is when the tellite of checking as different inspected objects, as long as, can jointly use relaying pin unit 131a, 131b and tester side- connector 141a, 141b with circuit substrate side- connector 121a, 121b the is replaced by circuit substrate side-connector corresponding with being examined circuit substrate 101.

But, in the gauging fixture of former such universal class, used by form the insulation division that these conduction roads of portion and mutual insulating form portion on a plurality of conductions road of extending on the thickness direction to constitute, only form and contain electroconductive particle in the portion, on the face direction, disperse this electroconductive particle and conduction road to form portion unevenly at anisotropic conductive sheet 122a, the 122b of the type of the outstanding secundly of a face of sheet anisotropic conductive sheet 122a, 122b as forming circuit substrate- side connector 121a, 121b on the conduction road.

If the mis-behave of the conduction road formation portion that the repeated use because of in inspection of anisotropic conductive sheet 122a, the 122b of the type of secundly causes is fast, produces the mis-behave of the conduction road formation portion problem of resistance value rising etc. then.Change mis-behave anisotropic conductive sheet 122a, 122b the time, when changing, must carry out that anisotropic conductive sheet 122a, 122b and spacing conversion overlap with the position of substrate 123a, 123b and circuit substrate side- connector 121a, 121b overlap with the position of relaying pin unit 131a, 131b, it is numerous and diverse changing operation, replacing frequency height, checking efficiency has descended.

In addition, if being examined the electrode that is examined of circuit substrate 101 for example is smaller or equal to the such fine pitch of 200 μ m, then state the anisotropic conductive sheet 122a of the type of such secundly in the use, under the situation of 122b, anisotropic conductive sheet 122a, 122b and spacing conversion substrate 123a, the position of 123b overlaps the difficulty that becomes, moreover, be examined under the situation that circuit substrate 101 checks continuously for a plurality of, because of be examined circuit substrate 101 repeat contact, be easy to generate anisotropic conductive sheet 122a, the offset of 122b.

Thus, because the conduction road formation portion of anisotropic conductive sheet 122a, 122b becomes inconsistent with the electrode position that is examined circuit substrate 101, can not obtain good electrical connection, so measured excessive resistance value, the tellite that will should be judged as certified products easily originally is judged as unacceptable product mistakenly.

On the other hand, for example in having used patent documentation 6 (spy opens flat 6-82531 communique) such anisotropic conductive sheet and the spacing conversion of record usefulness substrate integrated the situation of connector under, though it is easy that the position overlaps, but at the mis-behave of anisotropic conductive sheet part the time, must change each spacing conversion substrate, a plurality of spacing conversion necessitate with substrate, check that cost has increased.

On the other hand, tend to multi-layered high-densityization gradually as the tellite that is examined circuit substrate 101, what for example in fact produced solder ball electrode because of BGA etc. etc. on thickness direction is examined the height tolerance that electrode 102,103 causes or the warpage of substrate itself.Therefore, for with reach and be electrically connected as the electrode 102,103 that is examined that is examined checkpoint on the circuit substrate 101, be necessary upside gauging fixture 111a and downside gauging fixture 111b to be pressurizeed with high pressure, make and be examined circuit substrate 101 and flatly be out of shape, moreover, be necessary the height that is examined electrode 102,103 of upside gauging fixture 111a and downside gauging fixture 111b one side to be adjusted for the height tolerance that is examined electrode 102,103.

In the gauging fixture of former such universal class, move for the direction of principal axis of the height tolerance utilization conduction pin 132a, the 132b that are examined electrode 102,103 and to adjust, but in the direction of principal axis amount of movement of this conduction pin 132a, 132b, also there is limit, so the adjustment for such height tolerance that is examined electrode 102,103 is not good sometimes, poor flow takes place, and can not check accurately.

In addition, in the gauging fixture of such universal class, clamp with gauging fixture 111a, 111b and to be examined circuit substrate 101 and moulding pressure when it is pressurizeed has been absorbed by its anisotropic conductive sheet 122a, 122b, 126a, 126b, 142a, 142b up and down.

Therefore, in the gauging fixture of such universal class, because the support interval conversion disperses moulding pressure with substrate 123a, 123b, so be necessary with certain arranged spaced conduction pin 132a, 132b.

In addition, in the gauging fixture of former universal class,, be necessary with a plurality of conduction pin of certain arranged spaced 132a, 132b in order to accept moulding pressure with conduction pin 132a, 132b.

Therefore, form accordingly under the situation about for example having in miniaturization more than or equal to insulcrete 134a, the 134b of 10,000 through hole with the 0.75mm spacing with the electrode that is examined circuit substrate 101, if the thin thickness of the substrate of insulcrete 134a, 134b and 135a, 135b, then because the intensity reduction, sometimes when bending, rupture, so be necessary to thicken insulcrete 134a, 134b and 135a, 135b.

Patent documentation 1: the spy opens flat 6-94768 communique

Patent documentation 2: the spy opens flat 5-159821 communique

Patent documentation 3: the spy opens flat 7-248350 communique

Patent documentation 4: the spy opens flat 8-271569 communique

Patent documentation 5: the spy opens flat 8-338858 communique

Patent documentation 6: the spy opens flat 6-82531 communique

Summary of the invention

The objective of the invention is to, in view of such present situation, have microelectrode with the minuteness space configuration and also can carry out the testing fixture of galvanoscopic circuit substrate of the high circuit substrate of reliability and the inspection method of circuit substrate even provide as the circuit substrate that is examined of checking object.

In addition, the object of the present invention is to provide for the testing fixture of the circuit substrate that the replacing frequency is few, checking efficiency is high that causes because of the mis-behave of anisotropic conductive sheet when checking being examined circuit substrate and carrying out repetition continuous review of object and the inspection method of circuit substrate.

In addition, the object of the present invention is to provide the testing fixture of the circuit substrate that the replacing frequency is few, checking efficiency is high that causes at the good mis-behave of operation and the inspection method of circuit substrate because of the anisotropic conductive sheet for the necessity that reduces the offset of proofreading and correct the anisotropic conductive sheet when checking being examined circuit substrate and carrying out repetition continuous review of object, inspection.

The replacing operation of anisotropic conductive sheet is easy to the testing fixture of circuit substrate and the inspection method of circuit substrate when the object of the present invention is to provide in as the repetition continuous review that is examined circuit substrate of checking object at the mis-behave of anisotropic conductive sheet in addition.

In addition, even the object of the present invention is to provide change to be examined as what check object that circuit substrate is not made testing fixture integral body (gauging fixture integral body) in addition yet, only checking by change just can be for the testing fixture of all circuit substrates that are examined the correspondence that circuit substrate checks and the inspection method of circuit substrate with circuit substrate.

In addition, the object of the present invention is to provide adjustment inspection method good, that poor flow, the testing fixture that can implement to check accurately and circuit substrate do not take place for the height tolerance that is examined circuit substrate of checking object.

The testing fixture of circuit substrate of the present invention is to utilize a pair of the 1st gauging fixture and the 2nd gauging fixture to clamp as the two sides that is examined circuit substrate of checking object between two gauging fixtures and pressurize to carry out the testing fixture of galvanoscopic circuit substrate, it is characterized in that:

Above-mentioned the 1st gauging fixture and the 2nd gauging fixture possess circuit substrate side-connector, relaying pin unit and tester side-connector respectively,

Foregoing circuit substrate-side connector possesses:

Spacing conversion substrate, conversion electrode separation between a face of substrate and another face;

The 1st anisotropic conductive sheet is configured in above-mentioned spacing conversion and is examined circuit substrate one side with substrate; And

The 2nd anisotropic conductive sheet is configured in the be examined circuit substrate opposite side of above-mentioned spacing conversion with substrate,

Above-mentioned relaying pin unit possesses:

A plurality of conduction pins dispose with the spacing of stipulating; And

The 1st insulcrete of pair of separated and the 2nd insulcrete support above-mentioned conduction pin in a movable manner on direction of principal axis,

Above-mentioned tester side-connector possesses:

Connector base board is electrically connected tester and above-mentioned relaying pin unit;

The 3rd anisotropic conductive sheet is configured in relaying pin unit one side of above-mentioned connector base board; And

Base plate is configured in the side opposite with relaying pin unit of above-mentioned connector base board,

Above-mentioned the 1st anisotropic conductive sheet is that electroconductive particle is being arranged on the thickness direction and dispersed equably anisotropic conductive sheet on the face direction.

In addition, the inspection method of circuit substrate of the present invention has been to use the inspection method of circuit substrate of the testing fixture of foregoing circuit substrate, it is characterized in that:

Utilize a pair of the 1st gauging fixture and the 2nd gauging fixture between two gauging fixtures, to clamp as the two sides that is examined circuit substrate of checking object and pressurize and look into to carry out electric-examination.

In foregoing invention, comparatively it is desirable to the thickness W of above-mentioned the 1st anisotropic conductive sheet ₁Be 0.03～0.5mm, the number mean particle diameter D of electroconductive particle ₁Be 3～50 μ m, thickness W ₁With number mean particle diameter D ₁Ratio W ₁/ D ₁Be 1.1～10, the elastomeric Du sieve's hardness of insulativity that constitutes the sheet matrix material is 30～90.

According to the testing fixture of circuit substrate of the present invention, used electroconductive particle arrange on the thickness direction and at dispersed equably anisotropic conductive sheet on the face direction as the 1st anisotropic conductive sheet that circuit substrate and spacing conversion are disposed between with substrate that is examined of checking object.

Therefore, few at the replacing frequency that causes because of the mis-behave of anisotropic conductive sheet when being examined circuit substrate and carrying out repetition continuous review, checking efficiency is high.

In addition, even for example possess with smaller or equal to the minuteness space configuration of 200 μ m, electrode width is smaller or equal to the circuit substrate that is examined of the small electrode of 100 μ m, while also can keep being examined respectively being examined state of insulation between the electrode, reaching being electrically connected of the inspection electrode that is examined electrode and circuit substrate side-connector of circuit substrate.And, because the conduction road formation portion that separates of the portion of being insulated not, so when the rechecking that is examined circuit substrate, even also can reach being electrically connected of the inspection electrode that is examined electrode and circuit substrate side-connector that is examined circuit substrate always, so can suppress to result from be examined the situation that circuit substrate mistakenly be judged to be unacceptable product of the offset of anisotropic conductive sheet with certified products owing to produce the offset towards transverse direction of anisotropic conductive sheet.

In addition, because the 1st anisotropic conductive sheet is what to separate with the circuit substrate of checking usefulness, so produced under the situation of mis-behave in the 1st anisotropic conductive sheet, getting final product owing to only change the 1st anisotropic conductive sheet, is easy so change.Owing to check that the circuit substrate of usefulness there is no need to change when the replacing of the 1st anisotropic conductive sheet, can reuse, so can reduce the inspection cost that is examined circuit substrate.

Like this, according to the testing fixture of circuit substrate of the present invention, even have microelectrode with the minuteness space configuration and also can carry out the high electric-examination of reliability and look into as the circuit substrate that is examined of checking object.

The testing fixture of circuit substrate of the present invention is characterised in that: the surfaceness with the surface that is examined the side that circuit substrate contacts of above-mentioned the 1st anisotropic conductive sheet is 0.5～5 μ m, with the spacing conversion with the surfaceness on the surface of a side of substrate contacts smaller or equal to 0.3 μ m

The surfaceness of the insulation division in the surface of a side that contacts with the 1st anisotropic conductive sheet of above-mentioned spacing conversion usefulness substrate is smaller or equal to 0.2 μ m.

Like this, because the surface of contact towards being examined circuit substrate of above-mentioned the 1st anisotropic conductive sheet has been made the uneven surface with specific surfaceness, so the contact area that is examined circuit substrate and the 1st anisotropic conductive sheet when having removed for the pressurization that is examined circuit substrate reduces.Thereby, can suppress as the elastomeric cementability of the insulativity of sheet matrix material, can prevent from or suppress to be examined circuit substrate to bond on the 1st anisotropic conductive sheet.

Moreover, because above-mentioned the 1st anisotropic conductive sheet made the little tabular surface of surfaceness towards the spacing conversion with the surface of contact of substrate, reduced the spacing conversion with the surfaceness in the insulation division on the surface of substrate, so the spacing conversion is big with the contact area change of substrate and the 1st anisotropic conductive sheet.Thereby even after having removed for the pressurization that is examined circuit substrate, both connecting airtight property are also high, utilize as the elastomeric cementability of the insulativity of sheet matrix material, can reliably the 1st anisotropic conductive sheet be remained on the spacing conversion with on the substrate.Therefore, the disengaging from spacing conversion usefulness substrate of the 1st anisotropic conductive sheet can be prevented,, also operation can be checked reposefully even carry out a plurality of galvanoscopic situations that are examined circuit substrate continuously.

Testing fixture of the present invention is characterised in that: above-mentioned the 2nd anisotropic conductive sheet forms the insulation division that these conduction roads of portion and mutual insulating form portion by a plurality of conductions road of extending and constitutes on thickness direction, only in the formation portion of conduction road, contain electroconductive particle, thus, on the face direction, disperse this electroconductive particle unevenly, and conduction road formation portion is outstanding at a face of sheet.

In above-mentioned invention, comparatively it is desirable to the thickness W of the conduction road formation portion in above-mentioned the 2nd anisotropic conductive sheet ₂Be 0.1～2mm, the number mean particle diameter D of electroconductive particle ₂Be 5～200 μ m, thickness W ₂With number mean particle diameter D ₂Ratio W ₂/ D ₂Be 1.1～10, the elastomeric Du sieve's hardness of insulativity that constitutes the sheet matrix material is 15～60.

Testing fixture of the present invention is characterised in that: above-mentioned the 3rd anisotropic conductive sheet forms the insulation division that these conduction roads of portion and mutual insulating form portion by a plurality of conductions road of extending and constitutes on thickness direction, only in the formation portion of conduction road, contain electroconductive particle, thus, on the face direction, disperse this electroconductive particle unevenly, and conduction road formation portion is outstanding at a face of sheet.

Like this, by use by the conduction road form portion and insulation division constitutes, only form on the conduction road contain electroconductive particle in the portion, on the face direction, disperse this electroconductive particle unevenly, the conduction road form portion at the anisotropic conductive sheet of the type of the outstanding secundly of a face of sheet as the 2nd anisotropic conductive sheet and the 3rd anisotropic conductive sheet, available these sheets absorb because of exerting pressure of causing of pushing of gauging fixture or impact, and can suppress the mis-behave of the 1st anisotropic conductive sheet thus.Promptly, because the elastic force of the anisotropic conductive sheet of the type of this secundly is big, because exerting pressure of the gauging fixture when absorbing inspection, good aspect impact mitigation ability, so can relax the pressure of the 1st smaller anisotropic conductive sheet of elastic force is concentrated or impact, suppressed the mis-behave of the 1st anisotropic conductive sheet.Thereby, for having prolonged in serviceable life of the 1st anisotropic conductive sheet of rechecking, as a result of, in looking into, the electric-examination that is examined circuit substrate can reduce the replacing number of times of the 1st anisotropic conductive sheet, and checking efficiency has improved.

Testing fixture of the present invention is characterised in that: be provided with the connection electrode that is made of with terminal electrode with terminal electrode and voltage a pair of electric current in above-mentioned spacing conversion on substrate, disposed this connection electrode in the spacing conversion on substrate, so that be electrically connected above-mentioned a pair of electric current with terminal electrode and voltage terminal electrode for the electrode that respectively is examined that is examined circuit substrate

On above-mentioned connector base board, disposed electric current with pin side electrode and voltage pin side electrode, it is electrically connected with terminal electrode with terminal electrode and voltage with the electric current of above-mentioned spacing conversion with substrate respectively.

By constituting like this, between the 1st gauging fixture and the 2nd gauging fixture, clamp as the two sides that is examined circuit substrate of checking object and pressurize when carrying out electric-examination and look into, for be examined circuit substrate respectively be examined electrode respectively through the 1st anisotropic conductive sheet be electrically connected the spacing conversion with the electric current of the connection electrode of substrate with terminal electrode and voltage with terminal electrode the two.

And, conduction pin and the 3rd anisotropic conductive sheet through the 2nd anisotropic conductive sheet, relaying pin unit are electrically connected the electric current of spacing conversion with substrate with the electric current of connector base board with terminal electrode with the pin side electrode, simultaneously the voltage of spacing conversion with substrate is electrically connected with terminal electrode with the voltage of connector base board with terminal electrode.

Thus, use the electric current of substrate to constitute the current supply path through spacing conversion up and down respectively for being examined respectively being examined of circuit substrate with terminal electrode with electrode.On the other hand, constitute voltage detection path with the voltage of substrate with terminal electrode through up and down spacing conversion respectively for being examined respectively being examined of circuit substrate with electrode.

Thereby, on one side for example use steady current feedway to current supply path supply constant electric current with the electric current of substrate with terminal electrode through spacing conversion up and down for being examined respectively being examined of circuit substrate with electrode, on one side respectively be examined the voltage of using electrode with the voltage instrumentation is fixed from what be examined circuit substrate by utilizing voltage detection path with terminal electrode with the voltage of substrate, can carry out whether having the affirmation of electrical characteristics of the performance of regulation and test about the wiring pattern that is examined circuit substrate through spacing conversion up and down.

On the contrary, on one side for be examined circuit substrate respectively be examined with electrode through about the spacing conversion for example use the constant voltage feedway that voltage detection path is applied constant voltage with the voltage of substrate with terminal electrode, on one side respectively be examined electric current with electrode with terminal electrode by utilizing the current supply path to measure from what be examined circuit substrate with the electric current of substrate, also can carry out whether having the affirmation of electrical characteristics of the performance of regulation and test about the wiring pattern that is examined circuit substrate with galvanometer through spacing conversion up and down.

Like this, owing to can measure voltage and current dividually for being examined respectively being examined of circuit substrate with voltage detection path, the current supply path of electrode through separating, can carry out validation test accurately so whether have the electrical characteristics of the performance of regulation about the wiring pattern that is examined circuit substrate, and, can implement validation test at short notice.

Testing fixture of the present invention is characterised in that: above-mentioned relaying pin unit possesses:

Middle holding plate is configured between above-mentioned the 1st insulcrete and the 2nd insulcrete;

The 1st support pin is configured between above-mentioned the 1st insulcrete and the middle holding plate; And

The 2nd support pin is configured between above-mentioned the 2nd insulcrete and the middle holding plate,

Simultaneously, the 2nd contact plate for middle holding plate for the 1st contact plate of middle holding plate and above-mentioned the 2nd support pin of above-mentioned the 1st support pin is configured in along on the diverse location on the middle holding plate projecting plane of the thickness direction projection of middle holding plate.

By constituting like this, between the 1st gauging fixture and the 2nd gauging fixture, clamp as the two sides that is examined circuit substrate of checking object and pressurize when carrying out electric-examination and look into, in the starting stage of pressurization, utilize the caoutchouc elasticity compression absorption pressure of the moving of conduction pin, the 1st anisotropic conductive sheet, the 2nd anisotropic conductive sheet and the 3rd anisotropic conductive sheet of relaying pin unit, can absorb the height tolerance that is examined electrode that is examined circuit substrate to a certain extent.

And, because the 2nd contact plate for middle holding plate for the 1st contact plate of middle holding plate and above-mentioned the 2nd support pin of above-mentioned the 1st support pin is configured in along on the diverse location on the middle holding plate projecting plane of the thickness direction projection of middle holding plate, so between the 1st gauging fixture and the 2nd gauging fixture further to as the carrying out that is examined circuit substrate of checking object during pressurization, except the 1st anisotropic conductive sheet, outside the caoutchouc elasticity compression of the 2nd anisotropic conductive sheet and the 3rd anisotropic conductive sheet, utilize the 1st insulcrete of relaying pin unit, the caoutchouc elasticity of the 2nd insulcrete and the middle holding plate that between the 1st insulcrete and the 2nd insulcrete, disposes, for the height tolerance that is examined electrode that is examined circuit substrate, the height tolerance of solder ball electrode for example, pressure is concentrated disperseed, can avoid local stress concentration.

Thus, be examined being examined electrode and can guaranteeing stable electrically contacting of circuit substrate for what have a height tolerance respectively.Moreover, concentrate owing to can reduce, so can suppress the breakage of the part of the 1st anisotropic conductive sheet towards the stress of the 1st anisotropic conductive sheet.Its result because the repeated use permanance of the 1st anisotropic conductive sheet improves, so reduce the replacing number of times of the 1st anisotropic conductive sheet, checks that operating efficiency has improved.

In addition, owing to there is no need with certain arranged spaced conduction pin, so can reduce the number of the through hole that on insulcrete, forms.Thereby, but the attenuate insulcrete.Moreover, by the boring processing to the through hole of the insulcrete that keeps the conduction pin cause to penetrate operation few, can reduce the cost that in the making of testing fixture, needs.

Testing fixture of the present invention is characterised in that: utilizing a pair of the 1st gauging fixture and the 2nd gauging fixture to clamp as the two sides that is examined circuit substrate of checking object between two gauging fixtures and when pressurizeing, the 1st contact plate for middle holding plate that constitutes with above-mentioned the 1st support pin is the center, holding plate deflection on above-mentioned the 2nd insulcrete direction in the middle of above-mentioned, the 2nd contact plate for middle holding plate with above-mentioned the 2nd support pin is the center simultaneously, the deflection on above-mentioned the 1st insulcrete direction of above-mentioned middle holding plate.

By constituting like this, because middle holding plate is the center with the 1st contact plate, the 2nd contact plate, deflection on opposite directions, so between the 1st gauging fixture and the 2nd gauging fixture further to as the carrying out that is examined circuit substrate of checking object during pressurization, the spring power of holding plate in the middle of further bringing into play, for the height tolerance that is examined electrode that is examined circuit substrate, pressure is concentrated to be disperseed, local stress concentration can be avoided, the breakage of the part of the 1st anisotropic conductive sheet can be suppressed.Its result because the repeated use permanance of the 1st anisotropic conductive sheet improves, so reduce the replacing number of times of the 1st anisotropic conductive sheet, checks that operating efficiency has improved.

Testing fixture of the present invention is characterised in that: constitutes in above-mentioned middle holding plate projecting plane, is the 1st contact plate that clathrate has disposed above-mentioned the 1st support pin for middle holding plate,

In the middle of above-mentioned, in the holding plate projecting plane, be the 2nd contact plate that clathrate has disposed above-mentioned the 2nd support pin for middle holding plate,

In above-mentioned middle holding plate projecting plane, 1 the 2nd contact plate of configuration in the unit lattice zone that constitutes by 4 the 1st adjacent contact plates, in the middle of above-mentioned, in the holding plate projecting plane, in the unit lattice zone that constitutes by 4 the 2nd adjacent contact plates, dispose 1 the 1st contact plate simultaneously.

By constituting like this, be clathrate and dispose the 1st contact plate and the 2nd contact plate, be configuration the 1st contact plate and the 2nd contact plate on the position that clathrate all has been offset.

Thereby, middle holding plate is the center with the 1st contact plate, the 2nd contact plate, deflection on opposite directions, between the 1st gauging fixture and the 2nd gauging fixture further to as the carrying out that is examined circuit substrate of checking object during pressurization, the spring power of holding plate in the middle of further bringing into play, for the height tolerance that is examined electrode that is examined circuit substrate, pressure is concentrated to be disperseed, local stress concentration can be further avoided, the breakage of the part of the 1st anisotropic conductive sheet can be suppressed.Its result because the repeated use permanance of the 1st anisotropic conductive sheet improves, so reduce the replacing number of times of the 1st anisotropic conductive sheet, checks that operating efficiency has improved.

Testing fixture of the present invention is characterised in that:

Above-mentioned relaying pin unit possesses:

Holding plate in the middle of a plurality of is configured between above-mentioned the 1st insulcrete and the 2nd insulcrete discretely with predetermined distance; And

The holding plate support pin, it is mutual to be configured in adjacent middle holding plate,

Simultaneously, in the middle of at least 1 in the holding plate, the contact plate for this centre holding plate for the contact plate of this centre holding plate and the 1st support pin, the 2nd support pin or the holding plate support pin that contact this centre holding plate from another face that contacts the holding plate support pin of this centre holding plate from a face is configured in along on the diverse location on the middle holding plate projecting plane of the thickness direction projection of middle holding plate.

By constituting like this, utilize these a plurality of middle holding plates further to bring into play spring,, pressure is concentrated disperseed for the height tolerance that is examined electrode that is examined circuit substrate, local stress concentration can be further avoided, the breakage of the part of the 1st anisotropic conductive sheet can be suppressed.Its result because the repeated use permanance of the 1st anisotropic conductive sheet improves, so reduce the replacing number of times of the 1st anisotropic conductive sheet, checks that operating efficiency has improved.

Testing fixture of the present invention is characterised in that: will be configured at the contact plate for this centre holding plate for the contact plate of this centre holding plate and the 1st support pin that contacts from another face for this centre holding plate, the 2nd support pin or holding plate support pin of whole holding plate support pin that contact from a face for this centre holding plate in the holding plate in the middle of above-mentioned along on the diverse location on the middle holding plate perspective plane of the thickness direction projection of middle holding plate.

Thus, because in whole middle holding plates, configuration is from the contact plate of the support pin of its surperficial back side one side on the position that has been offset mutually, so further bring into play the spring of these a plurality of middle holding plates, for the height tolerance that is examined electrode that is examined circuit substrate, pressure is concentrated disperseed, can further avoid local stress concentration, can suppress the breakage of the part of the 1st anisotropic conductive sheet.Its result because the repeated use permanance of the 1st anisotropic conductive sheet improves, so reduce the replacing number of times of the 1st anisotropic conductive sheet, checks that operating efficiency has improved.

According to the present invention,, also can carry out the high electric-examination of reliability and look into even have the microelectrode that has disposed with minuteness space as the circuit substrate that is examined of checking object.

Description of drawings

Fig. 1 shows the sectional view of the example in the testing fixture of circuit substrate of the present invention.

The sectional view of the stacked state when Fig. 2 shows the inspection of testing fixture of Fig. 1.

Fig. 3 shows the figure of spacing conversion with the surface that is examined circuit substrate one side of substrate.

Fig. 4 shows the figure of spacing conversion with the surface of relaying pin unit one side of substrate.

Fig. 5 is the fragmentary cross-sectional view of the 1st anisotropic conductive sheet.

Fig. 6 is the fragmentary cross-sectional view of the 2nd anisotropic conductive sheet.

Fig. 7 shows the sectional view at spacing conversion state of stacked the 1st anisotropic conductive sheet on substrate.

Fig. 8 (a) is the fragmentary cross-sectional view that single face has been made the 1st anisotropic conductive sheet of uneven surface, and Fig. 8 (b) shows the sectional view at spacing conversion state of stacked the 1st anisotropic conductive sheet on substrate.

Fig. 9 be explanation the 1st anisotropic conductive sheet the figure of production process.

Figure 10 shows the figure of distribution of the electroconductive particle of formed parts inside.

Figure 11 be explanation the 1st anisotropic conductive sheet the figure of production process.

Figure 12 shows the figure of the distribution that has acted on the electroconductive particle behind the magnetic field.

Figure 13 shows the sectional view of the part of the conduction pin of relaying pin unit and insulcrete.

Figure 14 shows the sectional view of another example in the testing fixture of circuit substrate of the present invention.

The sectional view of the stacked state when Figure 15 shows the inspection of testing fixture of Figure 14.

Figure 16 shows the figure of spacing conversion with the surface that is examined circuit substrate one side of substrate.

Figure 17 shows the figure of spacing conversion with the surface of relaying pin unit one side of substrate.

Figure 18 shows the sectional view at spacing conversion state of stacked the 1st anisotropic conductive sheet on substrate.

Figure 19 is the part amplification profile of user mode of the testing fixture of explanation Figure 14.

Figure 20 shows the sectional view of the another example in the testing fixture of circuit substrate of the present invention.

The sectional view of the stacked state when Figure 21 shows the inspection of testing fixture of Figure 20.

Figure 22 shows the sectional view of the part of the conduction pin of relaying pin unit and insulcrete.

Figure 23 is the part enlarged drawing along the middle holding plate projecting plane of the thickness direction projection of middle holding plate.

Figure 24 is the part amplification profile of the testing fixture of Figure 20.

Figure 25 is the part amplification profile of user mode of the testing fixture of explanation Figure 20.

Figure 26 is the part amplification profile of the relaying pin unit in the testing fixture of Figure 20.

Figure 27 is the part amplification profile of user mode of the testing fixture of explanation Figure 20.

Figure 28 is the part amplification profile same with the Figure 24 that shows the another example in the testing fixture of the present invention.

Figure 29 is the part amplification profile of the relaying pin unit in the testing fixture of Figure 28.

Figure 30 is the part amplification profile of the user mode of the testing fixture in the explanation another example of the present invention.

Figure 31 is the sectional view of the testing fixture of former circuit substrate.

The explanation of symbol

1 is examined circuit substrate

2 are examined electrode

3 are examined electrode

11a the 1st gauging fixture

11b the 2nd gauging fixture

21a, 21b circuit substrate side-connector

22a, 22b the 1st anisotropic conductive sheet

23a, 23b spacing conversion substrate

24 terminal electrodes

25 connection electrode

26a, 26b the 2nd anisotropic conductive sheet

27a, 27b electric current terminal electrode

28a, 28b voltage terminal electrode

31a, 31b relaying pin unit

32a, 32b conduct electricity pin

33a, 33b the 1st support pin (support pin)

34a, 34b the 1st insulcrete

35a, 35b the 2nd insulcrete

Holding plate in the middle of the 36a

37a, 37b the 2nd support pin

38A the 1st contact plate

38B the 2nd contact plate

39a, 39b holding plate support pin

The 39A contact plate

41a, 41b tester side-connector

42a, 42b the 3rd anisotropic conductive sheet

43a, 43b connector base board

44a, 44b tester lateral electrode

45a, 45b pin side electrode

46a, 46b base plate

47a, 47b electric current pin side electrode

48a, 48b voltage pin side electrode

49a, 49b support pin

51 insulated substrates

52 wirings

53 internal wirings

54 insulation courses

55 insulation courses

61 sheet matrix materials

62 electroconductive particles

63 surfaces

64 back sides

71 insulation divisions

72 conduction road formation portions

73 teats

81a, 81b end

82 central portions

83 through holes

91 pressing rollers

92 back-up rollers

93a, b formed parts

94 liners

95 moulding materials

96 upper faces

97 lower surface

98a, b electromagnet

The 99a recess

The 99b protuberance

101 are examined circuit substrate

102 are examined electrode

103 are examined electrode

111a upside gauging fixture

111b downside gauging fixture

121a, 121b circuit substrate side-connector

121a, 121b circuit substrate side-connector

122a, 122b anisotropic conductive sheet

123a, 123b spacing conversion substrate

126a, 126b anisotropic conductive sheet

131a, 131b relaying pin unit

132a, 132b conduct electricity pin

133a, 133b support pin

134a, 134b the 1st insulcrete

135a, 135b the 2nd insulcrete

141a, 141b tester side-connector

142a, 142b anisotropic conductive sheet

143a, 143b connector base board

144a, 144b tester lateral electrode

145a, 145b pin side electrode

146a, 146b base plate

Holding plate projecting plane in the middle of the A

The L1 distance

The L2 distance

The Q1 diagonal line

The Q2 diagonal line

R1 unit lattice zone

R2 unit lattice zone

Embodiment

Below, on one side with reference to accompanying drawing, example of the present invention is described on one side.Have again, in the record afterwards, (for example to a pair of same inscape in the 1st gauging fixture and the 2nd gauging fixture, circuit substrate side-connector 21a and circuit substrate side-connector 21b, the 1st anisotropic conductive sheet 22a and the 1st anisotropic conductive sheet 22b etc.) carry out under the situation of general name, sometimes (for example omit mark " a ", " b ", sometimes the 1st anisotropic conductive sheet 22a and the 1st anisotropic conductive sheet 22b are carried out general name, recording and narrating sometimes is " the 1st anisotropic conductive sheet 22 ").

Fig. 1 shows the sectional view of the testing fixture in the example of the present invention, the sectional view of the stacked state when Fig. 2 shows the inspection of testing fixture of Fig. 1, Fig. 3 shows the figure of spacing conversion with the surface that is examined circuit substrate one side of substrate, and Fig. 4 shows the figure of spacing conversion with the surface of relaying pin unit one side of substrate.

The testing fixture of this example is examined circuit substrate 1 for what object was checked in the conduct of the tellite that is used to install integrated circuit etc. etc., is examined interelectrode resistance by mensuration and carries out electric-examination and look into.

This testing fixture, as shown in Fig. 1 and Fig. 2, be configured to make the 1st gauging fixture 11a of on be examined circuit substrate 1 side configuration and below the 2nd gauging fixture 11b that disposes of a side up and down opposite one another.

The 1st gauging fixture 11a possesses circuit substrate side-connector 21a, relaying pin unit 31a and tester side-connector 41a.The 1st anisotropic conductive sheet 22a and the 2nd anisotropic conductive sheet 26a that circuit substrate side-connector 21a has been disposed with substrate 23a, in its both sides by the spacing conversion constitute.Tester side-connector 41a is made of the 3rd anisotropic conductive sheet 242a, the connector base board 43a and the base plate 46a that have disposed in relaying pin unit 31a one side.

The 2nd gauging fixture 11b also similarly constitutes with the 1st gauging fixture 11a, possesses circuit substrate side-connector 21b, relaying pin unit 31b and tester side-connector 41b.The 1st anisotropic conductive sheet 22b and the 2nd anisotropic conductive sheet 26b that circuit substrate side-connector 21b has been disposed with substrate 23b, in its both sides by the spacing conversion constitute.Tester side-connector 41b is made of the 3rd anisotropic conductive sheet 242b, the connector base board 43b and the base plate 46b that have disposed in relaying pin unit 31b one side.

On be examined circuit substrate 1, form the electrode 2 that is examined usefulness, also formed the electrode 3 that is examined usefulness in its lower section, be electrically connected these electrodes mutually.

(1) circuit substrate side-connector

The 1st anisotropic conductive sheet 22a, 22b and the 2nd anisotropic conductive sheet 26a, 26b that circuit substrate side- connector 21a, 21b possess spacing conversion substrate 23a, 23b, dispose in its both sides.

(1-a) spacing conversion substrate

Fig. 3 shows the figure of spacing conversion with the surface that is examined circuit substrate 1 one sides of substrate 23, and Fig. 4 shows the figure on the surface of its relaying pin unit 31 1 sides.

With a surface of substrate 23, promptly be examined circuit substrate 1 one sides, as shown in Figure 3, a plurality of connection electrode 25 that are electrically connected with the electrode 2,3 that is examined circuit substrate 1 have been formed in the spacing conversion.These connection electrode 25 are configured to corresponding with the pattern that is examined electrode 2,3 that is examined circuit substrate 1.

, as shown in Figure 4, formed and the conduction pin 32a of relaying pin unit 31, a plurality of terminal electrodes 24 that 32b is electrically connected with another surface of substrate 23, promptly be examined the opposite side of circuit substrate 1 in the spacing conversion.For example disposed these terminal electrodes 24 on spacing is the grid point of a determining deviation of 2.54mm, 1.8mm, 1.27mm, 1.06mm, 0.8mm, 0.75mm, 0.5mm, 0.45mm, 0.3mm or 0.2mm, these spacings are identical with the conduction pin 32a of relaying pin unit, the disposition interval of 32b.

The internal wiring 53 that utilizes wiring 52 and connect on the thickness direction of insulated substrate 51 in Fig. 7 is with terminal electrode 24 electrical connections with corresponding Fig. 4 of the connection electrode separately 25 of Fig. 3.

The insulation division of spacing conversion in the surface of substrate 23, for example as shown in Figure 7, the insulation course 54 that has been formed by the mode exposed with connection electrode 25 separately on the surface of insulated substrate 51 constitutes, the thickness of this insulation course 54 comparatively it is desirable to 5～100 μ m, and that even more ideal is 10～60 μ m.Under the too small situation of this thickness, be difficult to form the little insulation course of surfaceness sometimes.On the other hand, under the excessive situation of this thickness, connection electrode 25 becomes difficult with being electrically connected of the 1st anisotropic conductive sheet 22 sometimes.

As forming the material of spacing conversion, generally can use material as the matrix material use of tellite with the insulated substrate 51 of substrate.Specifically, for example can enumerate polyimide resin, glass-fiber reinforced polyimide resin, glass-fiber reinforced epoxy resin, glass-fiber reinforced dimerization maleimide three azine resins etc.

Formation material as the insulation course 54,55 of Fig. 7, can use the macromolecular material that can be configured as film like, specifically, for example can enumerate the potpourri, anticorrosive additive material etc. of epoxy resin, acryl resin, phenolics, polyimide resin, polyamide, above-mentioned resin.

For example, as following, can make spacing conversion substrate 23.At first, preparation is the stacked stacking material of thin metal layer on the two sides of flat insulated substrate, for this stacking material, utilize Numerical Control type drilling equipment, photoetching treatment, Laser Processing processing etc., the pattern corresponding with the terminal electrode that should form is formed on a plurality of through holes that connect on the thickness direction of stacking material accordingly.

Secondly, by carrying out electroless plating or metallide in the through hole that on stacking material, has formed, form the via hole that the thin metal layer with the substrate two sides links., by thin metal layer carried out photoetching treatment, on insulated substrate form wiring pattern and connection electrode, on the surface of an opposite side, form terminal electrode simultaneously thereafter.

Then, as shown in Figure 7, form insulation course 54 by the mode of exposing with connection electrode 25 separately on the surface of insulated substrate 51, simultaneously the mode of exposing with separately terminal electrode 24 on the surface of an opposite side forms insulation course 55, can obtain the spacing conversion with substrate 23.Have, the thickness of insulation course 55 comparatively it is desirable to 5～100 μ m again, and that even more ideal is 10～60 μ m.

(1-b) the 1st anisotropic conductive sheet

Forming circuit substrate-side connector 21 and with the spacing conversion with the 1st stacked anisotropic conductive sheet 22 of substrate 23, as shown in Figure 5, in the sheet matrix material 61 that the elasticity macromolecule by insulativity constitutes, on the face direction, disperse a plurality of electroconductive particles 62, under the state of having arranged on the thickness direction, contain these electroconductive particles simultaneously.

The thickness of the 1st anisotropic conductive sheet 22 comparatively it is desirable to 0.03～0.5mm, and that even more ideal is 0.05～0.2mm.Have again, as shown in Figure 8, made on surface under the situation of uneven surface the 1st anisotropic conductive sheet 22, so-called " thickness of the 1st anisotropic conductive sheet 22 ", be recess from the surface 63 that made uneven surface to the back side thickness (minimum thickness) of 64 (tabular surfaces).

Under the situation of thickness less than 0.03mm of the 1st anisotropic conductive sheet 22, the physical strength of the 1st anisotropic conductive sheet 22 reduces easily, can not obtain necessary permanance sometimes.On the other hand, thickness at the 1st anisotropic conductive sheet 22 has surpassed under the situation of 0.5mm, it is big that the resistance of thickness direction becomes easily, in addition, under the closely spaced situation of the electrode that should connect, can not obtain needed insulativity between the conduction road separately that utilizes pressurization to form, produce electrical short between electrode being examined, the electric-examination that is difficult to be examined circuit substrate is sometimes looked into.

Du sieve's hardness of elastomer that constitutes the sheet matrix material 61 of the 1st anisotropic conductive sheet 22 comparatively it is desirable to 30～90, and even more ideal is 35～80, and even more ideal again is 40～70.

In this manual, so-called " Du sieve hardness " refers to the hardness of having measured according to Du sieve's hardness test use pattern A Du sieve meter of JIS K6253.Du sieve's hardness of elastomer less than 30 situation under, when on thickness direction, being pressed, because the compression of anisotropic conductive sheet, distortion are greatly, produce big permanent strain, so the performance of anisotropic conductive sheet worsens in early days, check and use the difficulty that becomes, permanance reduces easily.

On the other hand, Du sieve's hardness at elastomer has surpassed under 90 the situation, when having pushed the anisotropic conductive sheet on thickness direction, owing to become insufficient at the deflection of thickness direction, so can not obtain good connection reliability, bad connection takes place easily.

Usually use the electroconductive particle 62 of magnetic conductive particle as the 1st anisotropic conductive sheet 22.The number mean particle diameter D of magnetic conductive particle ₁Comparatively it is desirable to 3～50 μ m, that even more ideal is 5～30 μ m, and that even more ideal again is 8～20 μ m.

In this manual, so-called " the number mean particle diameter of magnetic conductive particle " refers to the particle diameter that utilizes laser instrument diffraction scattering method to measure.

By making the number mean particle diameter D of magnetic conductive particle ₁More than or equal to 3 μ m, the pressurizing and deformation of the part that contains the magnetic conductive particle in the resulting anisotropic conductive sheet becomes easy, in addition, utilizing magnetic field orientating to handle in its manufacturing process makes under the situation of magnetic conductive particle orientation, it is easy that the orientation of magnetic conductive particle becomes, therefore, resulting anisotropic conductive sheet becomes the high anisotropic conductive sheet of anisotropy, and the resolution of anisotropic conductive sheet (is pressurizeed to the anisotropic conductive sheet, both reached and opposed interelectrode the conducting of thickness direction, remain on the ability of interelectrode electrical isolation adjacent on the transverse direction again) become good.

On the other hand, by making the number mean particle diameter D of magnetic conductive particle ₁Smaller or equal to 50 μ m, resulting anisotropic conductive sheet becomes the good and easy anisotropic conductive sheet of pressurizing and deformation of its elasticity, even become for the also good anisotropic conductive sheet of its resolution of electrode of fine and fine pitch.

Thickness W in the 1st anisotropic conductive sheet 22 ₁The number mean particle diameter D of (μ m) and magnetic conductive particle ₁The ratio W of (μ m) ₁/ D ₁Preferably 1.1～10.

At ratio W ₁/ D ₁Under 1.1 situation, because the diameter of magnetic conductive particle is equal or bigger than it with the thickness of anisotropic conductive sheet, so the elasticity of anisotropic conductive sheet reduces, therefore, in the face of printed circuit board etc. be examined being examined electrode configuration anisotropic conductive sheet and pressurizeing when reaching the contact conducting state of circuit substrate 1, be examined circuit substrate 1 and sustain damage easily.

On the other hand, at ratio W ₁/ D ₁Surpassed under 10 the situation, be examined being examined electrode configuration anisotropic conductive sheet and pressurizeing when reaching the contact conducting state of circuit substrate 1 in the face of printed circuit board etc., being examined circuit substrate 1 and spacing conversion, form chain with arranging a plurality of electroconductive particles between the substrate 23.Therefore, have the mutual contact of a plurality of electroconductive particles, resistance value uprises easily, is used in electric-examination and looks into the difficulty that becomes easily.

In the comparatively desirable in the present invention form, as shown in Fig. 8 (a), Fig. 8 (b), the surface 63 with being examined the side that circuit substrate 1 contacts in the anisotropic conductive sheet 22 made have concavo-convex uneven surface.On the other hand, the surface 64 of a side that will contact with substrate 23 with this spacing conversion makes tabular surface.Have again, irrelevant with the protuberance and the recess of the uneven surface of surface 63 1 sides of anisotropic conductive sheet 22, under dispersed state on the face direction of anisotropic conductive sheet 22, formed the chain of electroconductive particle 62.

Comparatively it is desirable to 0.5～5 μ m with the surfaceness in the surface 63 (uneven surface) that is examined the side that circuit substrate 1 contacts, that even more ideal is 1～2 μ m.Have, so-called " surfaceness " refers to the center line roughness Ra that obtains according to JIS B0601 in this manual again.Under the too small situation of this surfaceness, the cementability that suppresses fully in this face becomes difficult, sometimes when checking, guide into and be examined circuit substrate 1, skew has taken place in the position of anisotropic conductive sheet 22, or anisotropic conductive sheet 22 sticks on and is examined on the circuit substrate 1, broken away from substrate 23 from the spacing conversion.On the other hand, under the excessive situation of this surfaceness, to be examined circuit substrate 1 carry out stable electrical connection become the difficulty.

Surfaceness in the surface 64 of a side that contacts with substrate 23 with the spacing conversion comparatively it is desirable to smaller or equal to 0.3 μ m, and that even more ideal is 0.005～0.2 μ m, and that even more ideal again is 0.01～0.1 μ m.In addition, the spacing conversion comparatively it is desirable to smaller or equal to 0.2 μ m with the surfaceness of the insulation division 54 (Fig. 3, Fig. 7) in the surface of a side that contacts with anisotropic conductive sheet 22 of substrate 23, that even more ideal is 0.001～0.1 μ m, and that even more ideal again is 0.01～0.03 μ m.Under the excessive situation of surfaceness in these faces, because anisotropic conductive sheet 22 and spacing conversion are inadequate with the connecting airtight property of substrate 23, so when electric-examination is looked into, be difficult to prevent the disengaging of anisotropic conductive sheet 22 from spacing conversion usefulness substrate 23.

As the elastomer of the matrix material that constitutes the 1st anisotropic conductive sheet 22, so long as in the scope of above-mentioned Du sieve's hardness, just do not do special qualification, but, preferably use silicone rubber from the aspect of shaping processability and electrical characteristics.

In addition, as for the elastomer of the matrix material that obtains constituting the 1st anisotropic conductive sheet 22 and spendable comparatively ideally indurative macromolecular material, for example, can enumerate polybutadiene rubber, natural rubber, polyisoprene rubber, Styrene-Butadiene rubber, the conjugated diene rubber of acrylonitrile-butadiene copolymer rubber etc. and the hydrogen additive of these rubber, styrene-butadiene-diene block copolymer rubber, the block copolypeptide rubber of styrene-isoprene block copolypeptide etc. and the hydrogen additive of these rubber, chloroprene rubber, polyurethane rubber, polyesters rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber etc.

The anisotropic conductive sheet is being required under the situation of against weather, preferably using conjugated diene rubber material in addition, as mentioned above,, preferably using silicone rubber from the aspect of shaping processability and electrical characteristics.As silicone rubber, preferably aqueous silicone rubber has been carried out the material of bridge formation or condensation.The viscosity of aqueous silicone rubber is preferably in deformation velocity 10 ^-1During sec smaller or equal to 10 ⁵Pool, can be rubber, the additive type of condensed type rubber, contain the rubber of vinyl or hydroxyl.Specifically, for example can enumerate dimethyl silicone raw rubber, ethylene methacrylic silicone raw rubber, aminomethyl phenyl ethene silicone raw rubber etc.

Wherein, for example in the presence of dimethyl ethene chlorosilane or dimethyl alkoxy silane, make dimethyldichlorosilane or hydrolysis of dimethyl dialkoxy silicane and condensation reaction, thereafter, by the process of the repetition of dissolving-precipitating, can obtain containing the aqueous silicone rubber (dimethyl silicone polymer that contains vinyl) of vinyl.

In the presence of catalyzer, the annular siloxane such to octamethylcy-clotetrasiloxane carries out anionic polymerisation, as short-stopper, for example use dimethyl divinyl siloxane, reaction conditions by suitably regulating other (for example, the amount of annular siloxane and the amount of short-stopper), can obtain containing the aqueous silicone rubber of vinyl at two ends.At this, as the catalyzer of anionic polymerisation, can use tetramethyl ammonium hydroxide and hydroxide just-alkali of Ding Ji Phosphonium etc. or these silanol salt solusions etc., temperature of reaction for example is 80～130 ℃.

For example in the presence of dimethyl hydrogenation chlorosilane or dimethyl hydrogenation alkoxy silane, make dimethyldichlorosilane or hydrolysis of dimethyl dialkoxy silicane and condensation reaction, thereafter, by the process of the repetition of dissolving-precipitating, can obtain containing the aqueous silicone rubber (dimethyl silicone polymer that contains hydroxyl) of hydroxyl.In addition, in the presence of catalyzer, annular siloxane is carried out anionic polymerisation, as short-stopper, for example use dimethyl hydrogenation siloxane, methyl dihydro siloxane or dimethyl hydrogenation alkoxy silane etc., reaction conditions (for example, the amount of annular siloxane and the amount of short-stopper) by suitably regulating other also can obtain above-mentioned material.At this, as the catalyzer of anionic polymerisation, can use tetramethyl ammonium hydroxide and hydroxide just-alkali of Ding Ji Phosphonium etc. or these silanol salt solusions etc., temperature of reaction for example is 80～130 ℃.

Use compression set under 150 ℃ of its hardening thing smaller or equal to 35% material this point as aqueous silicone rubber, permanance when making its repeated compression from the thickness direction at the anisotropic conductive sheet is good this point, be comparatively desirable, this compression set is even more ideal smaller or equal to 20%.

In addition, use tear strength under 23 ℃ of its hardening thing more than or equal to the aqueous silicone rubber this point of 7kN/m, permanance when making its repeated compression from the thickness direction at the anisotropic conductive sheet is good this point, be comparatively desirable, this tear strength is even more ideal more than or equal to 7kN/m.

At this, utilize according to the method for JIS K6249, can measure the compression set of aqueous silicone rubber hardening thing.

Using under the situation of silicone rubber as the matrix material of anisotropic conductive sheet 22, its molecular weight Mw (referring to polystyrene standard converted weight mean molecular weight) preferably 10000～40000.In addition, from the thermotolerance aspect, molecular weight distributing index (refer to polystyrene standard converted weight average molecular weight Mw and count the ratio Mw/Mn of average molecular mass Mn with the polystyrene standard conversion) is preferably smaller or equal to 2.

At the macromolecular material of the elastomer of the matrix material that is used for obtaining becoming anisotropic conductive sheet 22, can contain and be useful on the hardening catalyst that makes its sclerosis.As such hardening catalyst, for example can enumerate organic peroxide, fatty acid azo-compound, hydrogenation silylanizing catalyzer etc.

As organic peroxide, for example can enumerate benzoyl peroxide base, peroxidating two-2 ring benzoyls, dicumyl peroxide, di-tert-butyl peroxide etc. as hardening catalyst.

As fatty acid azo-compound, for example can enumerate azoisobutyronitrile etc. as hardening catalyst.

As the catalyzer that can use as the hydrogenation silylation reactive, for example can enumerate the complex etc. of complex, acetacetate platinum chelate, cyclic diene and platinum of complex, three organic hydrogen phosphide or phosphide and platinum of complex, platinum and 1,3 divinyl tetramethyl disiloxane of siloxane complex, ethene siloxane and the platinum of chlorination platinic acid and salt thereof, platinum-contain unsaturated group.

Consider to add kind, other the cure process condition of kind, the hardening catalyst of the macromolecular material of hardening catalyst and suitably select the use amount of hardening catalyst, but, be 3～15 weight portions usually for the macromolecular material of 100 weight portions.

Macromolecular material at the elastomer of the matrix material that is used for obtaining becoming anisotropic conductive sheet 22 as required, can contain the inorganic filling material of common silica powder, cabosil, aerogel monox, aluminium oxide etc.By containing such inorganic filling material, guarantee to be used to obtain anisotropic conductive sheet 22 the thixotropism of macromolecular material (molding material), its viscosity has improved.In the dispersion stabilization that improves electroconductive particle, the intensity of resulting anisotropic conductive sheet has improved.

The use amount of such inorganic filling material is not done special qualification, if but the amount of using is more, then owing to not utilizing magnetic field that electroconductive particle is orientated fully, so be unfavorable.

In addition, the viscosity of sheet molding material is preferably in the scope of 100000～1000000cp under 25 ℃ of temperature.

As the electroconductive particle that in the matrix material of anisotropic conductive sheet 22, contains,, can use the electroconductive particle that demonstrates magnetic usually from can easily making it to be oriented on the thickness direction of sheet this point side by side by effect magnetic field.As the magnetic conductive particle, be used for utilizing manufacture method described later to form the sheet molding material of anisotropic conductive sheet, easily make the magnetic conductive particle move this point from the effect that can utilize magnetic field, its saturated magnetization is more than or equal to 0.1Wb/m ²Material be comparatively desirable, more than or equal to 0.3Wb/m ²Material then even more ideal, more than or equal to 0.5Wb/m ²Material then desirable especially.

By making saturated magnetization more than or equal to 0.1Wb/m ², owing in its manufacturing process, can utilize the reliable effect ground in magnetic field that the magnetic conductive particle is moved to become desirable state of orientation, so can form the chain of magnetic conductive particle when use anisotropic conductive sheet.

As the concrete example of magnetic conductive particle, can enumerate iron, nickel, the particle of the metal that demonstrates magnetic of cobalt etc. or the particle of these alloys or contain the particle of these metals, or be core particle and the composite particle that on the surface of this core particle, covers high-conductivity metal with these particles, or be core particle and the composite particle that on the surface of this core particle, carried out the plating of high-conductivity metal with the dead matter particle of nonmagnetic metal particle or beaded glass etc. or polymer particle, or on core particle, covered ferrite, the two composite particle etc. of the electric conductivity magnetic of intermetallic compound etc. and high-conductivity metal.

At this, so-called " high-conductivity metal " refers to conductance under 0 ℃ more than or equal to 5 * 10 ⁶Ω ^-1m ^-1Metal.

As such high-conductivity metal, specifically, can use gold, silver, rhodium, platinum, chromium etc., in these metals, from have stable and high conductance this point aspect chemical, it is comparatively desirable using gold.

In above-mentioned magnetic conductive particle, preferably use with nickel particles as core particle and carried out the composite particle etc. of plating of the high-conductivity metal of gold or silver etc. in its surface.

Method as cover high-conductivity metal on the surface of core particle is not particularly limited, but for example can uses non-electrolytic plating method.

The coefficient of alteration of the number mean particle diameter of magnetic conductive particle is comparatively desirable smaller or equal to 50%, and is even more ideal, even more ideal again, desirable especially smaller or equal to 20% smaller or equal to 30% smaller or equal to 40%.

At this, so-called " coefficient of alteration of number mean particle diameter " is to utilize formula: (the coefficient that σ/Dn) * 100 (wherein, σ represents the value of the standard deviation of particle diameter, and Dn represents the number mean particle diameter of particle) obtains.

The coefficient of alteration of the number mean particle diameter by making the magnetic conductive particle is smaller or equal to 50%, because the inconsistent degree of particle diameter reduced, so can reduce the deviation of the electric conductivity of the part in the resulting anisotropic conductive sheet.

The metallics that utilizes conventional method to make the metal material particlized or prepare to sell on the market is handled by this particle being carried out classification, can obtain such magnetic conductive particle.

For example utilize the grading plant of air stating device, sound wave screening plant etc., can carry out the classification of particle and handle.

In addition, according to suitably setting the concrete condition that classification is handled as the number mean particle diameter of the conductive metal particle of purpose, the kind of grading plant etc.

On the surface of using, covered under the situation of high-conductivity metal as the magnetic conductive particle at core particle, from obtaining the good electrical conductivity this point, the coverage rate of the high-conductivity metal in the particle surface (conductive metal is for the ratio of the area coverage of the surface area of core particle) is comparatively desirable more than or equal to 40%, and is even more ideal, even more ideal again more than or equal to 47～95% more than or equal to 45%.

The overlay capacity of high-conductivity metal is that 0.5～50 weight % is comparatively desirable for core particle, 1～30% even more ideal, 3～25% even more ideal again, 4～20% desirable especially.The high-conductivity metal that is covered is the gold situation under, its overlay capacity is that core particle is that 2～30 weight % are comparatively desirable, 3～20% even more ideal, 3.5～17% even more ideal again.

The concrete shape of magnetic conductive particle is not particularly limited, be used to form as this point the macromolecular material of the elastomer of the matrix material of anisotropic conductive sheet 22 from being dispersed in easily, preferably spherical, starriness or by the primary particle aggegation the bulk that forms of offspring.

As the magnetic conductive particle, can use with the coupling agent of silane coupling agent etc. and handle its surperficial particle.By the surface of handling the magnetic conductive particle with coupling agent, the cementability of magnetic conductive particle and elasticity macromolecule matrix material has improved, its result, and the permanance in the repeated use of resulting anisotropic conductive sheet 22 has improved.

In the scope of the insulativity of not damaging elastomer, in anisotropic conductive sheet 22, can contain charged preventor.By in anisotropic conductive sheet 22, containing charged preventor, owing to prevent or be suppressed on the sheet surface and accumulate electric charge, so when the electric-examination that is examined circuit substrate 1 is looked into, can prevent under littler exerting pressure, can obtain good electrical conductivity simultaneously because of emit the unfavorable condition of charge generation from anisotropic conductive sheet 22.

For example, as following, can make anisotropic conductive sheet 22.At first, be formulated in the moulding material that has disperseed the flowability of magnetic conductive particle in the aqueous macromolecular material that is become elastomer by sclerosis.In addition, as shown in Figure 9, prepare by non magnetic a pair of formed parts 93a, 93b that constitutes.Then, configuration has and is suitable for as the shaped aperture of the flat shape of the anisotropic conductive sheet 22 of purpose and has the liner 94 of the frame shape of the thickness corresponding with its thickness on the forming face of a side formed parts 93b.The moulding material 95 prepared of coating in the opening of liner 94 is configured to its forming face with the opposing party's formed parts 93a and contacts with moulding material 95 on this moulding material 95.

As using as formed parts 93a, 93b non magnetic can use the resin sheet that is made of polyimide resin, vibrin, acryl resin etc.

Under the situation of the material that has carried out the uneven surface processing on the single face that as Fig. 8 (a), Fig. 8 (b), is produced on anisotropic conductive sheet 22, as shown in Figure 10, to the forming face of a side formed parts 93a carry out with as the corresponding uneven surface processing of surfaceness in the surface 63 of the anisotropic conductive sheet 22 of purpose.For example, utilize the method for sand-blast, etching method etc., on forming face, form recess 99a and protuberance 99b.Can use its forming face is the formed parts 93b of the member of tabular surface as the opposing party.

The sheet thickness of formed parts 93a, 93b comparatively it is desirable to 50～500 μ m, and that even more ideal is 75～300 μ m.Under the situation of its thickness, can not obtain as the formed parts necessary strength sometimes less than 50 μ m.Surpassed at this thickness under the situation of 500 μ m, the magnetic field to the desirable intensity of moulding material effect becomes difficult when arranging electroconductive particle sometimes.

Secondly, as shown in Figure 9, clamped formed parts 93a, the 93b of moulding material 95 and it has been pressurizeed, made the thickness of moulding material become the thickness of regulation by utilizing pressing roller 91 and back-up roller 92.Under this state, as shown in Figure 10, in the inside of moulding material 95, electroconductive particle 62 has disperseed equably.

Secondly, as shown in Figure 11, at the configuration of the back side of formed parts 93a, 93b one side for example a pair of electromagnet 98a, 98b, moulding material 95 thickness direction on act on parallel magnetic field.Thus, dispersed electroconductive particle 62 in moulding material, as shown in Figure 12, maintain dispersed state on the face direction on one side, be oriented on one side on thickness direction side by side, under dispersed state on the face direction, form by a plurality of electroconductive particles 62 that on thickness direction, extend form chain.

By the moulding material that under this state, hardens, be manufactured on electroconductive particle in the elasticity macromolecule matrix material be oriented on the thickness direction side by side and under dispersed state on the face direction, contain the anisotropic conductive sheet 22 of electroconductive particle.

About the cure process of moulding material, can under original state of effect parallel magnetic field, carry out, also can after the effect that has stopped parallel magnetic field, carry out.To the intensity of the parallel magnetic field of the moulding material effect size of average out to 0.02～1.5 tesla preferably.

As method, can use permanent magnet to replace electromagnet to moulding material effect parallel magnetic field.As permanent magnet, see on the parallel magnetic field intensity this point of above-mentioned scope can obtaining, preferably the magnet that constitutes by aluminium cobalt-nickel alloy (Fe-Al-Ni-Co alloy), ferrite etc.

Decide the cure process of moulding material according to employed material, but utilize heat treated to carry out usually.Consider that time of needing in the moving of kind, electroconductive particle of macromolecular material etc. etc. suitably sets concrete heating-up temperature and heat time heating time.

According to the above method that has illustrated, there is no need the anisotropic conductive sheet itself that has carried out cure process is carried out the uneven surface processing, available easy operation is made the anisotropic conductive sheet, moreover, can avoid because of carrying out the harmful effect that aftertreatment produces the anisotropic conductive sheet.

In addition, owing to used forming face carried out non magnetic of uneven surface processing as formed parts, so can be to the magnetic field of moulding material intensity of even action on the face direction.Promptly, owing to can on the position of the protuberance of the forming face of having carried out the uneven surface processing, not form the magnetic field of the intensity bigger than the position of recess, so can on the position of protuberance, not form the chain of electroconductive particle selectively, but under dispersed state on the face direction of anisotropic conductive sheet, form the chain of electroconductive particle, thus, just form on the position of the protuberance in the uneven surface of anisotropic conductive sheet and also form the chain of electroconductive particle.Therefore, even the state of the protuberance in the uneven surface of the anisotropic conductive sheet that only pressurizeed also can obtain electric conductivity on its thickness direction.Thereby, can obtain demonstrating the anisotropic conductive sheet of high electric conductivity with little moulding pressure.In addition, by using non magnetic of resin sheet etc., compare, can reduce manufacturing cost with the situation of the formed parts of the high price of using metal pattern etc. as formed parts.

(1-c) the 2nd anisotropic conductive sheet

At the 2nd anisotropic conductive sheet 26 of spacing conversion with the relaying pin unit 31 1 sides configuration of substrate 23, as shown in Figure 6, arranging the conduction road that forms by a plurality of electroconductive particles 62 in the elasticity macromolecular material of insulativity on thickness direction forms portion 72 and separates the insulation division 71 that separately conduction road forms portion 72 and constitute.Like this, 62 of electroconductive particles have disperseed on the face direction in conduction road formation portion 72 unevenly.

The thickness W of conduction road formation portion 72 ₂Comparatively it is desirable to 0.1～2mm, that even more ideal is 0.2～1.5mm.At this thickness W ₂Under the situation less than 0.1mm, low for the receptivity of the pressurization of thickness direction, the absorption of exerting pressure that is applied by gauging fixture during inspection reduces, and the effect that relaxes the impact of circuit substrate side-connector has reduced.Therefore, be difficult to suppress the mis-behave of the 1st anisotropic conductive sheet 22, as a result of, the replacing number of times of the 1st anisotropic conductive sheet 22 when being examined the rechecking of circuit substrate 1 increases, the decrease in efficiency of inspection.On the other hand, at this thickness W ₂Surpassed under the situation of 2mm, it is big that the resistance of thickness direction becomes easily, and the difficulty that becomes is looked in electric-examination sometimes.

The thickness of the insulation division 71 preferably thickness with conduction road formation portion 72 is identical in fact or littler than it.As shown in Figure 6, thickness by making insulation division 71 forms the teat 73 that conduction road formation portion 72 gives prominence to from insulation division 71 than the thickness of conduction road formation portion 72 is little, because pressurization for thickness direction, the distortion of conduction road formation portion 72 becomes easy, the receptivity of exerting pressure increases, so when checking, can absorb exerting pressure of gauging fixture, can relax impact to circuit substrate side-connector 21.

Under the situation of using the magnetic conductive particle as the electroconductive particle 62 that constitutes the 2nd anisotropic conductive sheet 26, its number mean particle diameter comparatively it is desirable to 5～200 μ m, that even more ideal is 5～150 μ m, and that even more ideal again is 10～100 μ m.At this, so-called " the number mean particle diameter of magnetic conductive particle " refers to the particle diameter that utilizes laser instrument diffraction scattering method to measure.If the number mean particle diameter of magnetic conductive particle is more than or equal to 5 μ m, then the pressurizing and deformation of the conduction road formation portion of anisotropic conductive sheet becomes easy.In addition, utilize magnetic field orientating to handle in its manufacturing process and make under the situation of magnetic conductive particle orientation, the orientation of magnetic conductive particle is easy.If the number mean particle diameter of magnetic conductive particle is smaller or equal to 200 μ m, then the elasticity of the conduction road formation portion 72 of anisotropic conductive sheet is good, and it is easy that pressurizing and deformation becomes.

The thickness W of conduction road formation portion 72 ₂The number mean particle diameter D of (μ m) and magnetic conductive particle ₂The ratio W of (μ m) ₂/ D ₂Preferably 1.1～10.

At ratio W ₂/ D ₂Under 1.1 situation, because for the thickness of conduction road formation portion 72, the diameter of magnetic conductive particle be equal or big than it with it, so conduct electricity the elasticity reduction of road formation portion 72, the receptivity of exerting pressure of its thickness direction reduces.Therefore, owing to when checking, relax effect minimizing to the impact of circuit substrate side-connector 21, so be difficult to suppress the mis-behave of the 1st anisotropic conductive sheet 22, as a result of, the replacing number of times of the 1st anisotropic conductive sheet 22 when being examined the rechecking of circuit substrate 1 increases, and the efficient of inspection descends easily.

On the other hand, at ratio W ₂/ D ₂Surpassed under 10 the situation, formed chainly owing to arrange a plurality of electroconductive particles in conduction road formation portion 72, had the mutual contact of a plurality of electroconductive particles, resistance value uprises easily.

Du sieve's hardness of utilizing its type A Du sieve meter to measure as the elastomer of the matrix material of conduction road formation portion 72 comparatively it is desirable to 15～60, and even more ideal is 20～50, and even more ideal again is 25～45.

Under the little situation of Du sieve's hardness ratio 15 of elastomer, because compression, the distortion of the sheet when being pressed are big, produces big permanent strain on thickness direction, so plate shape is out of shape in early days, it is difficult that the electrical connection during inspection becomes easily.Under the big situation of Du sieve's hardness ratio 60 of elastomer, because the distortion when being pressed on thickness direction reduces, so the receptivity of exerting pressure of its thickness direction reduces.Therefore, owing to when checking, relax effect minimizing to the impact of circuit substrate side-connector 21, so be difficult to suppress the mis-behave of the 1st anisotropic conductive sheet 22, as a result of, the replacing number of times of the 1st anisotropic conductive sheet 22 when being examined the rechecking of circuit substrate 1 increases, and the efficient of inspection descends easily.

Elastomer as the matrix material that becomes conduction road formation portion 72 so long as demonstrate the material of above-mentioned Du sieve's hardness, then is not particularly limited, but from processability and electrical characteristics aspect, preferably uses silicone rubber.

The insulation division 71 of the 2nd anisotropic conductive sheet 26 is formed by the insulating material that does not contain electroconductive particle in fact.As insulating material, for example can use insulativity macromolecular material, inorganic material, metal material that insulating handles etc. has been carried out on the surface, if but use with the elasticity macromolecule that in the formation portion of conduction road, has used be same material, it is easy then producing.Using under the situation of elastomer as the material of insulation division, preferably using Du sieve hardness is the material of above-mentioned scope.

As the magnetic conductive particle, can use magnetic conductive particle as the 1st above-mentioned anisotropic conductive sheet 22.

For example use according to the method for the method shown in Fig. 9～Figure 12 and can make the 2nd anisotropic conductive sheet 26.At first, but prepare whole shape be respectively substantially planar, by in correspondence with each other upper die and lower die constitute, on one side can be to filling in the formingspace between patrix and counterdie the anisotropic conductive sheet metal mould for formation of structure of material layer effect magnetic field, this material layer of one side heat hardening.

About this anisotropic conductive sheet metal mould for formation, for material layer effect magnetic field is formed the part with electric conductivity to go up in position, the two has upper die and lower die by iron, alternately disposed on the substrate that the ferromagnetism body of nickel etc. constitutes by the iron that is used for the magnetic field generation intensity distributions in metal pattern, the ferromagnetism body portion of formations such as nickel and partly make the structure of the layer of its mosaic shape adjacent each other by the nonmagnetic material that the nonmagnetic metal or the resin of copper etc. constitutes, according to the arranged in patterns corresponding with the pattern of the conduction road formation portion that should form the ferromagnetism body portion.

At this, the forming face of patrix is smooth, and the forming face of counterdie has concavo-convex with the conduction road formation portion of the anisotropic conductive sheet that should form accordingly a little.

In the formingspace of this anisotropic conductive sheet metal mould for formation, inject and contain the moulding material that the polymer material that is become elastomer hardening demonstrates the electroconductive particle of magnetic, form the shaping material layer.

Secondly, utilize the ferromagnetism body portion separately and the nonmagnetic material part of upper die and lower die, by formed moulding material layer being acted on the magnetic field that has intensity distributions on its face direction, make electroconductive particle in patrix the ferromagnetism body portion and the ferromagnetism body portion in the counterdie under it between gather, electroconductive particle is oriented on thickness direction side by side.Then, by under this state, this moulding material layer being carried out cure process, make and have the anisotropic conductive sheet of structure of conduction road formation portion of a plurality of columns that utilized the insulation division mutual insulating.

(2) relaying pin unit

Relaying pin unit 31a, 31b as shown in Fig. 1, Fig. 2, possess a plurality of conduction pin 32a, 32b that one-tenth arranged side by side is provided with the spacing of stipulating towards above-below direction.Relaying pin unit 31a, 31b possess: be provided with at two ends of these conductions pin 32a, 32b, inserting logical insulcrete 34a, the 34b that circuit substrate 1 one sides have disposed that be examined that supports conduction pin 32a, 32b; And these 2 (a pair of) insulcretes of insulcrete 35a, 35b that disposed in a side opposite with being examined circuit substrate 1.

Conduction pin 32, for example as shown in Figure 13, central portion 82 and the diameter big by diameter constitute than its little end 81a, 81b.

On this a pair of insulcrete 34 and insulcrete 35, formed the through hole 83 of the end 81a, the 81b that insert conduction pin 32.And, form the diameter of through hole 83 bigger and littler than the diameter of central portion 82 than the diameter of the end 81 of conduction pin 32, thus, be held in conduction pin 32 and do not come off.

Length of central portion 82 than conduction pin 32 is long at interval to utilize support pin 33 that 2 insulcretes 34,35 are fixed into it, thus, is held in and conducts electricity pin 32 movable up and down.

Form the length of end 81 of conduction pin 32 longer than the thickness of insulcrete 34,35, thus, conduction pin 32 at least one side from insulcrete 34,35 give prominence to.

For relaying pin unit, a plurality of conduction pins have been disposed on the grid point with the spacing of certain spacing, for example 2.54mm, 1.8mm, 1.27mm, 1.06mm, 0.8mm, 0.75mm, 0.5mm, 0.45mm, 0.3mm or 0.2mm.

The disposition interval of the conduction pin 32 by making relaying pin unit 31 is identical with the disposition interval of the terminal electrode 24 that is provided with on the substrate 23 with the spacing conversion, is electrically connected the spacing conversion with substrate 23 through conduction pin 32 in tester one side.

Have, the distance as between insulcrete 34 and the insulcrete 35 is not particularly limited again, but hope is more than or equal to 20mm, comparatively it is desirable to more than or equal to 40mm.Suitably select the thickness separately of insulcrete 34 and insulcrete 35 according to the kind of the material that constitutes these insulcretes 34,35, but for example wish it is 1～10mm.

As the concrete example of insulcrete 34,35, can enumerate intrinsic resistance more than or equal to 1 * 10 ¹⁰The insulativity material of Ω cm, polyimide resin for example, vibrin, polyamide, phenolics, polyacetal resin, the polybutylene terephthalate, the tygon terephthalate, the syndiotactic polytyrene resin, the polyphenylene sulfide resin, polyethers ethyl ketone resin, fluororesin, polyethers nitrile resin, polyethersulfone resin, polyacrylic resin, polyene propyl group resin, the high resin material of physical strength of polyamide-imide resin etc., glass-fiber reinforced epoxy resin, glass-fiber reinforced vibrin, glass-fiber reinforced polyimide resin, glass-fiber reinforced phenolics, the glass-fiber reinforced composite resin material of glass-fiber reinforced fluororesin etc., high purity carbon fiberreinforced epoxy resin, high purity carbon fiberreinforced vibrin, high purity carbon fiberreinforced polyimide resin, high purity carbon fiberreinforced phenolics, the high purity carbon fiberreinforced compound resin of high purity carbon fiberreinforced fluororesin etc., at epoxy resin, in the phenolics etc. filling monox, aluminium oxide, the composite resin material of the inorganic material of boron nitride etc., at epoxy resin, contain the composite resin material of grid etc. in the phenolics etc.In addition, also can use composite board that stacked a plurality of sheet material that is made of these materials constitutes etc.

(3) tester side-connector

Tester side- connector 41a, 41b possess the 3rd anisotropic conductive sheet 42a, 42b, connector base board 43a, 43b and base plate 46a, 46b as shown in Fig. 1, Fig. 2.The 3rd anisotropic conductive sheet 42a, 42b can use and the same material of above-mentioned the 2nd anisotropic conductive sheet 26, as shown in Figure 6, arranging the conduction road that forms by a plurality of electroconductive particles in the elasticity macromolecular material of insulativity on thickness direction forms portion and separates the insulation division that separately conduction road forms portion and constitute.

Connector base board 43a, 43b constitute insulated substrate as matrix material, in its surperficial relaying pin unit 31 1 sides, as shown in Fig. 1, Fig. 2, formed pin side electrode 45a, 45b.For example disposed these pin side electrodes 45a, 45b on spacing is the grid point of a determining deviation of 2.54mm, 1.8mm, 1.27mm, 1.06mm, 0.8mm, 0.75mm, 0.5mm, 0.45mm, 0.3mm or 0.2mm, this disposition interval is identical with the disposition interval of the conduction pin of relaying pin unit.

Wiring pattern that utilization has formed on the surface of insulated substrate and the internal wiring that forms of portion within it are electrically connected separately pin side electrode 45a, 45b with tester lateral electrode 44a, 44b.

In the testing fixture of above this example that has illustrated, as shown in Figure 2, by by the pressing mechanism of tester with the pressure of regulation by being pressed in the base plate 46a that outermost has disposed, 46b, through the 1st anisotropic conductive sheet 22a, 22b, spacing conversion substrate 23a, 23b, the 2nd anisotropic conductive sheet 26a, 26b, conduction pin 32a, 32b, the 3rd anisotropic conductive sheet 42a, 42b, connector base board 43a, 43b, the electrode 2 and the electrode 3 that are examined circuit substrate 1 are electrically connected with tester (not shown), and the electric-examination that is examined the interelectrode resistance measurement etc. of circuit substrate 1 is looked into.

Utilizing the 2nd gauging fixture 11b of the 1st gauging fixture 11a of upside and downside to push the pressure that is examined circuit substrate 1 for example is 100～250kgf.

Figure 14 shows the sectional view of another example of testing fixture of the present invention, the sectional view of the stacked state when Figure 15 shows the inspection of testing fixture of Figure 14, Figure 16 shows the figure of spacing conversion with the surface that is examined circuit substrate one side of substrate, and Figure 17 shows the figure of spacing conversion with the surface of relaying pin unit one side of substrate.Have again, with prosign illustrate with above-mentioned example in the corresponding inscape of inscape, omit its detailed explanation.

The structure of the testing fixture of this example is same with above-mentioned example basically, carries out for being examined with the current detecting of electrode and voltage detecting aspect structure more suitably but become.Specifically, as shown in Figure 16, Figure 18 and Figure 19, disposed on substrate 23a, 23b by electric current with connection electrode 25a, 25b that terminal electrode 27a, 27b and voltage constitute with terminal electrode 28a, 28b in the spacing conversion, on connector base board 43a, 43b, disposed electric current with pin side electrode 47a, 47b and voltage with pin side electrode 48a, 48b.

Connection electrode 25a with substrate 23a is configured to be electrically connected electric current terminal electrode 27a and the voltage terminal electrode 28a of spacing conversion with substrate 23a for the electrode 2 that is examined that is examined circuit substrate 1 respectively with the spacing conversion.Connection electrode 25b with substrate 23b is configured to be electrically connected electric current terminal electrode 27b and voltage terminal electrode 28b for the electrode 2 that is examined that is examined circuit substrate 1 respectively with the spacing conversion.

The electric current of connector base board 43a is configured to be electrically connected with terminal electrode 27a with the electric current of spacing conversion with substrate 23a with pin side electrode 47a, voltage is configured to be electrically connected with terminal electrode 28a with the voltage of spacing conversion with substrate 23a with pin side electrode 48a.The electric current of connector base board 43b is configured to be electrically connected with terminal electrode 27b with the electric current of spacing conversion with substrate 23b with pin side electrode 47b, voltage is configured to be electrically connected with terminal electrode 28b with the voltage of spacing conversion with substrate 23b with pin side electrode 48b.

On the surface of spacing conversion, promptly be examined circuit substrate 1 one sides, as shown in Figure 16, formed and a plurality of connection electrode 25 that electrode 2 (being examined electrode 3) is electrically connected that are examined that are examined circuit substrate 1 with substrate 23.These connection electrode 25 are configured to corresponding with the pattern that is examined electrode 2 (being examined electrode 3) that is examined circuit substrate 1.

In addition, this connection electrode 25 as shown in Figure 16, Figure 18 and Figure 19, is examined electrode 2 (being examined electrode 3) for what be examined circuit substrate 1, is made of with terminal electrode 28 with terminal electrode 27 and voltage a pair of electric current that has separated with predetermined distance mutually.

Electric current can be decided to be different shapes such as rectangle, circle, triangle with terminal electrode 27 and voltage with the shape of terminal electrode 28.In addition, with this a pair of electric current of configuration that is examined in the shared regional roughly the same zone of electrode 2 (being examined electrode 3) that is examined circuit substrate 1 be desirable with terminal electrode 27 and voltage with the shared regional this point of terminal electrode 28 in order to reduce error at measurment.

In addition, in the spacing conversion with in the substrate 23, electric current with terminal electrode 27 and voltage with the separating distance between the terminal electrode 28 more preferably greater than equaling 10 μ m.This separating distance than the little situation of 10 μ m under, because it is big with the electrorheological that flows between the terminal electrode 28 at electric current with terminal electrode 27 and voltage through the 1st anisotropic conductive sheet 22a, 22b, so become difficult with high precision determination resistance sometimes, can not implement electrical characteristics inspection accurately sometimes.

On the other hand, decide electric current the upper limit with separating distance terminal electrode 27 and voltage usefulness terminal electrode 28 between with terminal electrode 27 and voltage with the size of terminal electrode 28 by the size of the electrode that is examined usefulness 2,3 that is examined circuit substrate 1 and spacing and electric current, though be not particularly limited, usually smaller or equal to 500 μ m.Under the excessive situation of this separating distance, for size little be examined circuit substrate 1 be examined electrode 2 (being examined electrode 3), be difficult to suitably dispose electric current with terminal electrode 27 and voltage with terminal electrode 28 the two.

On the other hand, on spacing conversion another surface, promptly be examined the opposite side of circuit substrate 1, as shown in Figure 17, a plurality of terminal electrodes 24 that are electrically connected with the conduction pin 32 of relaying pin unit 31 have been formed with substrate 23.For example disposed these terminal electrodes 24 on spacing is the grid point of a determining deviation of 2.54mm, 1.8mm, 1.27mm, 1.06mm, 0.8mm, 0.75mm, 0.5mm, 0.45mm, 0.3mm or 0.2mm, this spacing is identical with the disposition interval of the conduction pin 32 of relaying pin unit 31.

As shown in Figure 18, the connection electrode separately 25 of Figure 16, be that electric current utilizes wiring 52 separately with terminal electrode 27 and voltage respectively with terminal electrode 28 and the internal wiring 53 that connects on the thickness direction of insulated substrate 51 is electrically connected with the terminal electrode 24 of corresponding Figure 17.

On the other hand, on the connector base board 43 of tester side-connector 41,, as shown in Figure 14, Figure 15 and Figure 19, formed pin side electrode 45 in its surperficial relaying pin unit 31 1 sides.These pin side electrodes 45, as shown in Figure 19, constitute with pin side electrode 48 with pin side electrode 47 and voltage by electric current, so that respectively with the spacing conversion with the connection electrode 25 of substrate 23, be that electric current is electrically connected with terminal electrode 28 with terminal electrode 27 and voltage, be configured on the position corresponding with the conduction pin 32 of relaying pin unit 31.

In this case, with certain spacing, for example disposed these pin side electrodes 45 on the grid point of the determining deviation of 2.54mm, 1.8mm, 1.27mm, 1.06mm, 0.8mm, 0.75mm, 0.5mm, 0.45mm, 0.3mm or 0.2mm, this disposition interval is identical with the disposition interval of the conduction pin 32 of relaying pin unit 31.

Wiring pattern that utilization has formed on the surface of insulated substrate and the internal wiring that forms of portion within it are electrically connected separately pin side electrode 45 with tester lateral electrode 44.

Have again, in this example, pin side electrode 45 has been made the pin shape, but pin side electrode 45 is not limited to the pin shape, for example can make smooth various changes such as electrode.

In the testing fixture 10 of this example that constitutes like this, as shown in Figure 14, by by the pressing mechanism of tester with the pressure of regulation by being pressed in the base plate 46a that outermost has disposed, 46b, through the 1st anisotropic conductive sheet 22a, 22b, spacing conversion substrate 23a, 23b, the 2nd anisotropic conductive sheet 26a, 26b, conduction pin 32a, 32b, the 3rd anisotropic conductive sheet 42a, 42b, connector base board 43a, 43b, the electrode 2 and the electrode 3 that are examined circuit substrate 1 are electrically connected with tester (not shown), and the electric-examination that is examined the interelectrode resistance measurement etc. of circuit substrate 1 is looked into.

In this case, as shown in Figure 19, be examined electrode 2 (being examined electrode 3) for what be examined circuit substrate 1, through the 1st anisotropic conductive sheet 22 be electrically connected the spacing conversion with a pair of electric current that is examined circuit substrate 1 one sides of substrate 23 with terminal electrode 27 and voltage usefulness terminal electrode 28.

Then, from the spacing conversion with a pair of electric current that is examined circuit substrate 1 one sides of substrate 23 with terminal electrode 27 and voltage with terminal electrode 28 through be examined circuit substrate 1 terminal electrode 24 of an opposite side of spacing conversion with substrate 23, the 2nd anisotropic conductive sheet 26, the conduction pin 32 of relaying pin unit 31, the 3rd anisotropic conductive sheet 42, the electric current of spacing conversion with substrate 23 is electrically connected with pin side electrode 47 with the electric current of connector base board 43 with terminal electrode 27, simultaneously the voltage of spacing conversion with substrate 23 is electrically connected with pin side electrode 48 with the voltage of connector base board 43 with terminal electrode 28.

Thus, as shown in Figure 19, use electrode 2,3,, constitute galvanometer and detect path I through electric current terminal electrode 27a, the 27b of spacing conversion with substrate 23a, 23b for being examined respectively being examined of circuit substrate 1.On the other hand, use electrode 2,3,, constitute voltmeter and detect path V through voltage terminal electrode 28a, the 28b of spacing conversion with substrate 23a, 23b for being examined respectively being examined of circuit substrate 1.

Thereby, use electrode 2,3 for being examined respectively being examined of circuit substrate 1, on one side with terminal electrode 28a, 28b voltmeter detection path V is applied voltage with the voltage of substrate 23a, 23b through the spacing conversion, on one side through electric current terminal electrode 27a, the 27b of spacing conversion with substrate 23a, 23b, utilize galvanometer to detect path I mensuration and flow through the electric current that respectively is examined usefulness electrode 2,3 that is examined circuit substrate 1, thus, can carry out whether having the affirmation test of electrical characteristics of the performance of regulation about the wiring pattern that is examined circuit substrate 1.

On the contrary, use electrode 2,3 for being examined respectively being examined of circuit substrate 1, electric current through spacing conversion substrate 23a, 23b detects path I supplying electric current with terminal electrode 27a, 27b to galvanometer on one side, on one side through voltage terminal electrode 28a, the 28b of spacing conversion with substrate 23a, 23b, utilize voltmeter to detect path V and measure voltage for being examined respectively being examined of circuit substrate 1 with electrode 2,3, thus, can carry out whether having the affirmation test of electrical characteristics of the performance of regulation about the wiring pattern that is examined circuit substrate 1.

Like this, use electrode 2,3 for being examined respectively being examined of circuit substrate 1, because the voltmeter through separating detects path V, galvanometer detects path 1 and measures voltage and current dividually, so whether have the electrical characteristics of the performance of regulation about the wiring pattern that is examined circuit substrate, can carry out validation test accurately, and, can implement validation test at short notice.

In addition, for the circuit that is examined that is examined circuit substrate 1, because on one side supplying electric current be measured voltage on one side, thus can than before testing fixture in the low setting voltage of the setting voltage of whether qualified judgement of conduction resistance value under stably mensuration be examined the conduction resistance value that is examined circuit of circuit substrate 1.

Promptly, main points as high-precision inspection, must carry out the whether qualified judgement of the circuit under low setting voltage, but testing fixture according to this example, owing to can judge as unacceptable product and be removed with the circuit substrate that is examined that high probability will have a potential electric defective, test so can implement the affirmation of the high circuit substrate of reliability.

Have again, use electrode 2 for being examined respectively being examined of circuit substrate 1,3, on one side through spacing conversion substrate 23a, the voltage of 23b terminal electrode 28a, 28b, for example use the constant voltage device that voltmeter is detected path V and apply constant voltage, on one side through spacing conversion substrate 23a, the electric current of 23b terminal electrode 27a, 27b, galvanometer is detected path I supplying electric current, use electrode 2 by measuring from being examined respectively being examined of circuit substrate 1,3 electric current also can carry out whether having about the wiring pattern that is examined circuit substrate 1 the affirmation test of electrical characteristics of the performance of regulation.

Figure 20 shows the sectional view of the another example in the testing fixture of circuit substrate of the present invention, the sectional view of the stacked state when Figure 21 shows the inspection of testing fixture of Figure 20.Have again, with prosign illustrate with above-mentioned example in the corresponding inscape of inscape, omit its detailed explanation.

The structure of the testing fixture of this example is same with above-mentioned example basically, is examined being examined electrode and can guaranteeing the more stable structure that electrically contacts of circuit substrate but become relaying pin unit for what have a height tolerance.

Relaying pin unit 31 in this example as shown in Figure 20, Figure 21 and Figure 22, possesses a plurality of conduction pin 32a, 32b that one-tenth arranged side by side is provided with the spacing of stipulating towards above-below direction.In addition, relaying pin unit 31 possesses: be provided with at two ends of these conductions pin 32a, 32b, inserting logical the 1st insulcrete 34a, the 34b that circuit substrate 1 one sides have disposed that be examined that supports conduction pin 32a, 32b; And these 2 insulcretes of the 2nd insulcrete 35a, 35b that disposed in a side opposite with being examined circuit substrate 1.

Conduction pin 32, for example as shown in Figure 22, central portion 82 and the diameter big by diameter constitute than its little end 81a, 81b.

On the 1st insulcrete 34 and the 2nd insulcrete 35, formed the through hole 83 of the end 81 of inserting conduction pin 32.And, form the diameter of through hole 83 bigger and littler than the diameter of central portion 82 than the diameter of the end 81 of conduction pin 32, thus, be held in conduction pin 32 and do not come off.

Length than the central portion 82 of conduction pin 32 is long at interval to utilize the 1st support pin 33 and the 2nd support pin 37 that the 1st insulcrete 34 and the 2nd insulcrete 35 are fixed into it, thus, is held in and conducts electricity pin 32 movable up and down.

Form end 81a, the 81b of conduction pin 32 longer, thus, make conduction pin 32 at least one side from insulcrete 34,35 outstanding than the thickness of insulcrete 34,35.

With certain spacing, for example on the grid point of the determining deviation of 2.54mm, 1.8mm, 1.27mm, 1.06mm, 0.8mm, 0.75mm, 0.5mm, 0.45mm, 0.3mm or 0.2mm, disposed a plurality of conduction pins of relaying pin unit.

The disposition interval of the conduction pin 32 by making relaying pin unit 31 is identical with the disposition interval of the terminal electrode 24 that is provided with on substrate 23 in the spacing conversion, and the spacing conversion is electrically connected with tester one side through conduction pin 32 with substrate 23.

In addition, as shown in Figure 20～Figure 22, in relaying pin unit 31, between the 1st insulcrete 34a, 34b and the 2nd insulcrete 35a, 35b, middle holding plate 36a, 36b have been disposed.

And, between the 1st insulcrete 34a, 34b and middle holding plate 36a, 36b, disposed the 1st support pin 33a, 33b, thus, make between the 1st insulcrete 34a, 34b and middle holding plate 36a, the 36b fixing.

Equally, between the 2nd insulcrete 35a, 35b and middle holding plate 36a, 36b, disposed the 2nd support pin 37a, 37b, thus, made between the 2nd insulcrete 35a, 35b and middle holding plate 36a, the 36b fixing.

In this case, not being particularly limited as the material of the 1st support pin 33 and the 2nd support pin 37, for example is the metallic of brass, stainless steel etc.

Have again, be not particularly limited as the distance between the distance between the 1st insulcrete 34 and the middle holding plate 36 and the 2nd insulcrete 35 and the middle holding plate 36, if but consider to consider as described later the absorbability of the height tolerance that is examined electrode 2,3 that is examined circuit substrate 1 that the elasticity by the 1st insulcrete 34, middle holding plate 36 and the 2nd insulcrete 35 produces, then comparatively it is desirable to more than or equal to 2mm, even more ideal is more than or equal to 2.5mm.

Then, as shown in Figure 23, the 2nd contact plate 38B for middle holding plate 36 for the 1st contact plate 38A of middle holding plate 36 and the 2nd support pin 37 of the 1st support pin 33 is configured in testing fixture along the thickness direction of middle holding plate 36 (in Figure 20 from above towards below direction) the middle holding plate projecting plane A of projection on the different position.

In this case, the position as different is not particularly limited, but as shown in Figure 23, holding plate projecting plane A goes up and formed the 1st contact plate 38A and the 2nd contact plate 38B on grid in the middle of being preferably in.

Specifically, as shown in Figure 23, on middle holding plate projecting plane A, 1 the 2nd contact plate 38B of configuration in the unit lattice region R 1 that constitutes by 4 the 1st adjacent contact plate 38A.In addition, constitute on middle holding plate projecting plane A 1 the 1st contact plate 38A of configuration in the unit lattice region R 2 that constitutes by 4 the 2nd adjacent contact plate 38B.Have again, in Figure 23, show the 1st contact plate 38A, show the 2nd contact plate 38B with white circle with black circle.

Have again, in this example, 1 the 2nd contact plate 38B of central configuration at the diagonal line Q1 of the unit lattice region R 1 of the 1st contact plate 38A, while is at 1 the 1st contact plate 38A of central configuration of the diagonal line Q2 of the unit lattice region R 2 of the 2nd contact plate 38B, but these relative positions are not particularly limited, and are configured in testing fixture along getting final product on the positions different among the middle holding plate projecting plane A of the thickness direction projection of middle holding plate.That is, under the situation that is not the clathrate configuration, be not subjected to the constraint of such relative position, as mentioned above, be configured in testing fixture along getting final product on the positions different among the middle holding plate projecting plane A of the thickness direction projection of middle holding plate.

In addition, in this case, the separating distance between the 1st contact plate 38A adjacent each other, the separating distance between the 2nd contact plate 38B are not particularly limited, and comparatively it is desirable to 10～100mm, that even more ideal is 12～70mm, it is desirable to 15～50mm especially.

Have again,, can use to have flexual material as the 1st insulcrete 34, middle holding plate 36 and the 2nd insulcrete 35.The preferably following degree of flexual degree that the 1st insulcrete 34, middle holding plate 36 and the 2nd insulcrete 35 are required: under situation about flatly having disposed under the state at the both ends of having supported the 1st insulcrete 34, middle holding plate 36 and the 2nd insulcrete 35 respectively with 10mm at interval, by the deflection that produces with the exert pressure of 50kgf from the top smaller or equal to 0.02% of the width of these insulcretes, even and by also not producing destruction and permanent strain from the top with the exert pressure of 200kgf.

As the concrete material of the 1st insulcrete 34, middle holding plate 36 and the 2nd insulcrete 35, can use with above-mentioned example in the same material of insulcrete of relaying pin unit, for example preferably intrinsic resistance more than or equal to 1 * 10 ¹⁰The insulativity material of Ω cm.

Kind according to the material that constitutes the 1st insulcrete 34, middle holding plate 36 and the 2nd insulcrete 35 is suitably selected the 1st insulcrete 34, middle holding plate 36 and the 2nd insulcrete 35 thickness separately, but 1～10mm preferably.

In the testing fixture of this example that constitutes like this, as shown in Figure 21, by by the pressing mechanism of tester with the pressure of regulation by being pressed in the base plate 46a that outermost has disposed, 46b, through the 1st anisotropic conductive sheet 22a, 22b, spacing conversion substrate 23a, 23b, the 2nd anisotropic conductive sheet 26a, 26b, conduction pin 32a, 32b, the 3rd anisotropic conductive sheet 42a, 42b, connector base board 43a, 43b, the electrode 2 and the electrode 3 that are examined circuit substrate 1 are electrically connected with tester (not shown), and the electric-examination that is examined the interelectrode resistance measurement etc. of circuit substrate 1 is looked into.Below, on one side (for convenience's sake with reference to Figure 24～Figure 27, the 2nd gauging fixture 11b only is shown), on one side explanation between the 1st gauging fixture 11a and the 2nd gauging fixture 11b, clamp the two sides that is examined circuit substrate 1 and pressure absorption and pressure peptizaiton when it is pressurizeed.

Between the 1st gauging fixture 11a and the 2nd gauging fixture 11b, clamp as the two sides that is examined circuit substrate 1 of checking object and to it and pressurize when carrying out electric-examination and look into, during starting stage that stacked each inscape from the state of Figure 24 has begun to pressurize (Figure 25), utilize the moving of conduction pin 32b of relaying pin unit 31b, the 1st anisotropic conductive sheet 22b, the caoutchouc elasticity compression absorption pressure of the 2nd anisotropic conductive sheet 26b and the 3rd anisotropic conductive sheet 42b can absorb the height tolerance that is examined electrode that is examined circuit substrate 1 to a certain extent.

Then, because the 2nd contact plate 38B for middle holding plate 36b for the 1st contact plate 38A of middle holding plate 36b and the 2nd support pin 37b of the 1st support pin 33b is configured in along on the positions different among the middle holding plate projecting plane A of the thickness direction projection of middle holding plate 36, so as shown in the arrow of Figure 26, by acting force on above-below direction, as shown in Figure 27, between the 1st gauging fixture 11a and the 2nd gauging fixture 11b further to when checking being examined circuit substrate 1 and having carried out pressurization of object, except the 1st anisotropic conductive sheet 22b, outside the caoutchouc elasticity compression of the 2nd anisotropic conductive sheet 26b and the 3rd anisotropic conductive sheet 42b, utilize the 1st insulcrete 34b of relaying pin unit 31b, the 2nd insulcrete 35b, the spring of the middle holding plate 36b that between the 1st insulcrete 34b and the 2nd insulcrete 35b, has disposed, for the height tolerance that is examined electrode 3 that is examined circuit substrate 1, the height tolerance of solder ball for example, pressure is concentrated disperseed, can avoid local stress concentration.

Promptly, as shown in Figure 26 and Figure 27, with the 1st support pin 33b and the 1st contact plate 38A middle holding plate 36b is the center, middle holding plate 36b deflection on the direction of the 2nd insulcrete 35b (part of the E that has surrounded with reference to a dot-and-dash line) with Figure 27, simultaneously be the center with the 2nd support pin 37b and the 2nd contact plate 38B middle holding plate 36b, middle holding plate 36b deflection on the direction of the 1st insulcrete 34b (part of the D that has surrounded with reference to a dot-and-dash line) with Figure 27.Have again, below, so-called " deflection " and " deflection direction " in this manual refers to mode deflection outstanding on the direction that is convex at middle holding plate 36 and its projected direction.

Like this, because middle holding plate 36b is center deflection on opposite directions with the 1st contact plate 38A and the 2nd contact plate 38B, so between the 1st gauging fixture 11a and the 2nd gauging fixture 11b further to when checking being examined circuit substrate 1 and having carried out pressurization of object, the further spring power of holding plate 36b in the middle of the performance.

In addition, as shown in the part of the B that has surrounded as a dot-and-dash line with Figure 27, utilize the compression of teat of the conduction road formation portion of the 2nd anisotropic conductive sheet 26b to absorb the height of conduction pin 32b, but the 1st insulcrete 34b is applied not the stress that the compression by this teat has absorbed.

Thus, as shown in the part of the C that has surrounded as a dot-and-dash line with Figure 27, since the 1st insulcrete 34b and the 2nd insulcrete 35b also respectively to a certain extent with the contact position of the 1st support pin 33b, the 2nd support pin 37b on deflection on opposite directions, so between the 1st gauging fixture 11a and the 2nd gauging fixture 11b,, further bring into play the spring power of the 1st insulcrete 34b and the 2nd insulcrete 35b further to when checking being examined circuit substrate 1 and having carried out pressurization of object.

Thus, owing to guarantee stable electrically contacting for the electrode that is examined that is examined circuit substrate 1 respectively, further reduce stress and concentrate, so can suppress the breakage of the part of anisotropic conductive sheet with height tolerance.Its result because the repeated use permanance of anisotropic conductive sheet improves, so reduce the replacing number of times of the 1st anisotropic conductive sheet, checks that operating efficiency has improved.

Figure 28 is the sectional view (for convenience's sake, only show 2nd gauging fixture) same with the Figure 24 that shows the another example in the testing fixture of the present invention, and Figure 29 is the part amplification profile of its relaying pin unit.Have again, with prosign illustrate with above-mentioned example in the corresponding inscape of inscape, omit its detailed explanation.

In the testing fixture of this example, between the 1st insulcrete 34b and the 2nd insulcrete 35b with holding plate 36b in the middle of the configuration a plurality of (being 3 in this example) of regulation with being spaced apart, the while in these between holding plate 36b disposed holding plate support pin 39b each other.

In this case, must be in the middle of at least one among holding plate 36b, the contact plate for middle holding plate 36b of the 1st support pin 33b, the 2nd support pin 37b of holding plate 36b for the contact plate of middle holding plate 36b and in the middle of contact from another face of holding plate support pin 39b of holding plate 36b in the middle of the face contact or holding plate support pin 39b is configured in along on the diverse location on the middle holding plate projecting plane of the thickness direction projection of middle holding plate 36b.

Ideal is, will be in whole middle holding plate 36b be configured in along on the diverse location on the middle holding plate projecting plane of the thickness direction projection of middle holding plate 36b from the contact plate for middle holding plate 36b for the contact plate of middle holding plate 36b and the 1st support pin 33b that contacts from another face for middle holding plate 36b, the 2nd support pin 37b or holding plate support pin 39b of the holding plate support pin 39b of a face contact for middle holding plate 36b.

In this example, the contact plate 38A for middle holding plate 36b for the contact plate 39A of middle holding plate 36b and the 1st support pin 33b that contacts from another face for middle holding plate 36b of the holding plate support pin 39b that will be in the middle of 3 contacts from a face for middle holding plate 36b among middle the holding plate 36b of upside among the holding plate 36b is configured in along on the diverse location on the middle holding plate projecting plane of the thickness direction projection of middle holding plate 36b.

In addition, the contact plate 39A for middle holding plate 36b for the contact plate 39A of middle holding plate 36b and the holding plate support pin 39b that contacts from another face for middle holding plate 36b of the holding plate support pin 39b that will be in the middle of 3 contacts from a face for middle holding plate 36b among middle the holding plate 36b of central authorities among the holding plate 36b is configured in along on the diverse location on the middle holding plate projecting plane of the thickness direction projection of middle holding plate 36b.

In addition, the contact plate 38B for middle holding plate 36b for the contact plate 39A of middle holding plate 36b and the 2nd support pin 37b that contacts from another face for middle holding plate 36b of the holding plate support pin 39b that will be in the middle of 3 contacts from a face for middle holding plate 36b among middle the holding plate 36b of downside among the holding plate 36b is configured in along on the diverse location on the middle holding plate projecting plane of the thickness direction projection of middle holding plate 36b.

By constituting like this, utilize these a plurality of middle holding plate 36b further to bring into play spring,, pressure is concentrated disperseed for the height tolerance that is examined electrode 3 that is examined circuit substrate 1, local stress concentration can be avoided, the breakage of the part of the 1st anisotropic conductive sheet can be suppressed.Its result because the repeated use permanance of the 1st anisotropic conductive sheet improves, so reduce the replacing number of times of the 1st anisotropic conductive sheet, checks that operating efficiency has improved.

Have, the number of middle holding plate 36 can be a plurality of, is not particularly limited again.

In addition, in having disposed above-mentioned 2 examples of middle holding plate 36, as shown in Figure 20, Figure 21, Figure 24, Figure 25, Figure 27 and Figure 28, also can between connector base board in the tester side-connector 41 43 and base plate 46, dispose support pin 49.Utilize these support pin 49, same with the effect that the 1st support pin the 33, the 2nd support pin 37 (in Figure 28, being the 1st support pin the 33, the 2nd support pin 37 and holding plate support pin 39) provides, also can provide the effect that disperses surface pressure.

More than illustrated and used 2 examples of the relaying pin unit of holding plate in the middle of the configuration, about having used the testing fixture of the relaying pin unit that disposes this centre holding plate, also applicable to the structure of the example that in Figure 14～Figure 19, has illustrated, promptly be suitable for for being examined the structure that circuit substrate carries out current detecting and voltage detecting.The part amplification profile of such testing fixture shown in Figure 30.

Such as shown, be examined electrode 2 (being examined electrode 3) for what be examined circuit substrate 1, through the 1st anisotropic conductive sheet 22 be electrically connected the spacing conversion with a pair of electric current that is examined circuit substrate one side of substrate 23 with terminal electrode 27 and voltage usefulness terminal electrode 28.Have again, in Figure 30,, under the state that has omitted support pin 33,37, show drawing for the convenience that illustrates.

Then, from the spacing conversion with a pair of electric current that is examined circuit substrate 1 one sides of substrate 23 with terminal electrode 27 and voltage with terminal electrode 28 through be examined circuit substrate 1 terminal electrode 24 of an opposite side of spacing conversion with substrate 23, the 2nd anisotropic conductive sheet 26, the conduction pin 32 of relaying pin unit 31, the 3rd anisotropic conductive sheet 42 makes the spacing conversion be electrically connected with pin side electrode 47 with the electric current of connector base board 43 with terminal electrode 27 with the electric current of substrate 23, and the spacing conversion is electrically connected with pin side electrode 48 with the voltage of connector base board 43 with terminal electrode 28 with the voltage of substrate 23.

Thus, use electrode 2,3 for being examined respectively being examined of circuit substrate 1, through electric current terminal electrode 27a, the 27b formation current detecting path I of spacing conversion with substrate 23a, 23b, on the other hand, use electrode 2,3 for being examined respectively being examined of circuit substrate 1, through voltage terminal electrode 28a, the 28b formation voltage detection path V of spacing conversion with substrate 23a, 23b.

Thereby, use electrode 2,3 for being examined respectively being examined of circuit substrate 1, on one side with terminal electrode 28a, 28b voltage detection path V is applied voltage with the voltage of substrate 23a, 23b through the spacing conversion, on one side utilize I mensuration in current detecting path to flow through the electric current that respectively is examined usefulness electrode 2,3 that is examined circuit substrate 1 with the electric current of substrate 23a, 23b with terminal electrode 27a, 27b through the spacing conversion, thus, can carry out whether having the affirmation test of electrical characteristics of the performance of regulation about the wiring pattern that is examined circuit substrate 1.

On the contrary, use electrode 2,3 for being examined respectively being examined of circuit substrate 1, on one side through the spacing conversion with the electric current of substrate 23a, 23b with terminal electrode 27a, 27b to current detecting path I supplying electric current, on one side utilize voltage detection path V respectively to be examined usefulness electrode 2,3 mensuration voltages with the voltage of substrate 23a, 23b with terminal electrode 28a, 28b to what be examined circuit substrate 1 through the spacing conversion, thus, can carry out whether having the affirmation test of electrical characteristics of the performance of regulation about the wiring pattern that is examined circuit substrate 1.

Example of the present invention more than has been described, but the present invention is not limited to these examples, in the scope that does not break away from its main idea, can does various distortion, change and correction.

For example, being examined circuit substrate 1 except tellite, can be the SIC (semiconductor integrated circuit) of encapsulation IC, MCM, CSP etc., the circuit arrangement that forms on wafer.In addition, tellite can be the two-face printing circuit substrate, also can be the circuit substrate that is printed on one side.

It is identical that the 1st gauging fixture 11a not necessarily needs in materials used, element structure etc. with the 2nd gauging fixture 11b, and the 1st gauging fixture 11a can be different with the 2nd gauging fixture 11b.In addition, not necessarily need the 1st gauging fixture 11a and the 2nd gauging fixture 11b be configured in about.

In addition, can constitute the tester side-connector by such circuit substrate and the anisotropic conductive sheet of stacked multilayer connector base board.

Embodiment

Below, according to embodiment the present invention is described, but the present invention is not limited to these embodiment.

(embodiment 1)

(estimate and use circuit substrate)

Prepared the evaluation circuit substrate of following specification.

Size: 100mm (indulging) * 100mm (horizontal stroke) * 0.8mm (thickness)

Above the number that is examined electrode of a side: 7312

Above the diameter that is examined electrode of a side: 0.3mm

Above the minimal configuration spacing that is examined electrode of a side: 0.4mm

Below the number that is examined electrode of a side: 3784

Below the diameter that is examined electrode of a side: 0.3mm

Below the minimal configuration spacing that is examined electrode of a side: 0.4mm

Made and be suitable for track and transport type circuit substrate self-verifying machine (Nidec リ-De corporate system, the name of an article: being used to of inspection portion STARREC V5) checked the circuit board inspection apparatus (Figure 20) of above-mentioned evaluation with circuit substrate.

(1) the 1st anisotropic conductive sheet 22

Having made electroconductive particle is arranging on the thickness direction and dispersed equably the 1st anisotropic conductive sheet on the face direction.

Size: 110mm * 110mm, thickness 0.1mm

Electroconductive particle: material; Carried out gold-plated nickel particles, mean particle diameter; 20 μ m, containing ratio; 18 volume %

Elastomer: material; Silicone rubber, hardness; 40

(2) spacing conversion substrate 23

Stacking material (SUNX corporate system, the name of an article: utilize Numerical Control type drilling equipment to form the through hole of 7312 circles of total of the circle of the diameter 0.2mm that on the thickness direction of stacking material, connects respectively R-1766) of the thin metal layer that the copper by thickness 18 μ m constitutes on whole of the two sides of the insulated substrate that constitutes by glass-fiber reinforced epoxy resin, have been formed.

Secondly, handle by use the copper electroplating liquid of EDTA type to carry out electroless plating for the stacking material that has formed through hole, on the inwall of each through hole, form the copper electrodeposited coating, moreover, by using the copper sulphate electroplate liquid to carry out the cathode copper electroplating processes, in each through hole, formed the via hole cylindraceous of the about 10 μ m of thickness of each thin metal layer on mutual electric connection layer laminate materials surface.

Secondly, (system should be changed in Tokyo, the name of an article: FP-225) formed resist layer, the while has been disposed the protection sealant to the dry film photoresist of laminate thickness 25 μ m on the thin metal layer on stacking material surface on the thin metal layer of the another side of this stacking material.On this resist layer, disposed the photomask film,,, formed the resist pattern that etching is used by carrying out development treatment use directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for resist layer.Then, carry out etching processing by thin metal layer for the face that has formed the resist pattern, 7312 connection electrode that formed diameter 200 μ m on the surface of insulated substrate are the pattern wiring portion of 100 μ m with the live width that is electrically connected each connection electrode and via hole, secondly, removed the resist pattern.

(Hitachi changes into system to the dry film scolder resist of laminate thickness 25 μ m on the surface of the insulated substrate that has formed connection electrode and pattern wiring portion, the name of an article: SR-2300G) form insulation course, on this insulation course, disposed the photomask film, using directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for insulation course, by carrying out development treatment, 7312 openings of the diameter 200 μ m that expose connection electrode have separately been formed.Use the copper sulphate electroplate liquid, the thin metal layer of the another side of stacking material as common electrode, by carrying out the cathode copper electroplating processes for connection electrode separately, has been formed from 7312 outstanding connection electrode of the surface of insulation course.

Secondly, remove the protection sealant on the thin metal layer of another side of stacking material, (system should be changed in Tokyo to the dry film photoresist of laminate thickness 25 μ m, the name of an article: FP-225) formed resist layer on the thin metal layer of this face.Thereafter, on this resist layer, disposed the photomask film, use directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for resist layer,, formed the resist pattern that etching is used on the thin metal layer in stacking material by carrying out development treatment.Secondly,, on the back side of insulativity substrate, formed 7312 terminal electrodes and the pattern wiring portion that is electrically connected each terminal electrode and via hole, removed the resist pattern by carrying out etching processing.

Secondly, dry film scolder resist (ニ チ go-モ-ト Application system of laminate thickness 38 μ m on the back side of the insulated substrate that has formed terminal electrode and pattern wiring portion, the name of an article: コ Application Off オ マ ス Network 2015) form insulation course, on this insulation course, disposed the photomask film, secondly, use directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for insulation course,, 7312 openings of the diameter 0.4mm that exposes electrode have been formed by carrying out development treatment.

As mentioned above, made the spacing conversion substrate 23a that the 1st gauging fixture 11a uses.This spacing conversion is 120mm * 160mm with the size in length and breadth of substrate 23a, thickness is 0.5mm, the diameter of the part of exposing from surface of insulating layer of connection electrode is about 300 μ m, connection electrode be about 25 μ m from the surface of insulating layer projecting height, the minimal configuration spacing of connection electrode is 0.4mm, the diameter of terminal electrode is 0.4mm, and the disposition interval of terminal electrode is 0.75mm, and the surfaceness of insulation course that has formed face one side of connection electrode is 0.02 μ m.

In addition, with similarly above-mentioned, made and have 3784 connection electrode from the teeth outwards, have the spacing conversion substrate 23b that the 2nd gauging fixture 11b of 3784 terminal electrodes uses on overleaf.This spacing conversion is 120mm * 160mm with the size in length and breadth of substrate 23b, thickness is 0.5mm, the diameter of the part of exposing on surface of insulating layer in the connection electrode is about 300 μ m, connection electrode be about 25 μ m from the surface of insulating layer projecting height, the minimal configuration spacing of connection electrode is 0.4mm, the diameter of terminal electrode is 0.4mm, and the disposition interval of terminal electrode is 0.75mm, and the surfaceness of the insulation course of surface (having formed the face of connection electrode) side is 0.02 μ m.

(3) the circuit substrate side-connector 21

By use the 1st above-mentioned anisotropic conductive sheet 22 of surface one side configuration of substrate 23 in this spacing conversion, side configuration constitutes, forms the 2nd anisotropic conductive sheet 26 that the anisotropic conductive sheet of portion 72 type of outstanding secundly on a face constitutes by the conduction road by form the insulation division that these conduction roads of portion and mutual insulating form portion on a plurality of conductions road of extending on the thickness direction overleaf, has made circuit substrate side-connector 21.

Have, the 2nd anisotropic conductive sheet 26 of configuration is the shape shown in Fig. 6 between the spacing conversion is with substrate 23 and relaying pin unit 31 again, specifically, has used the anisotropic conductive sheet of following structure.

(the 2nd anisotropic conductive sheet 26)

Size: 110mm * 150mm

The thickness of conduction road formation portion: 0.6mm

The external diameter of conduction road formation portion: 0.35mm

The projecting height of conduction road formation portion: 0.05mm

Electroconductive particle: material; Carried out gold-plated nickel particles, mean particle diameter; 35 μ m, the containing ratio of the electroconductive particle in the conduction road formation portion 72; 30 volume %

Elastomer: material; Silicone rubber, hardness; 30

(W ₂/D ₂＝17)

(4) relaying pin unit 31

Material as the 1st insulcrete 34, middle holding plate the 36, the 2nd insulcrete 35 has used intrinsic resistance more than or equal to 1 * 10 ¹⁰The insulativity material of Ω cm is made of glass-fiber reinforced epoxy resin, and its thickness is 1.9mm.

Utilize the 1st support pin 33 (diameter 2mm, length 36.3mm) and the 2nd support pin 37 (diameter 2mm, length 3mm) carries out fixed support, make the distance L 1 between the 1st insulcrete 34 and the middle holding plate 36 be 36.3mm, distance L 2 between the 2nd insulcrete 35 and the middle holding plate 36 is 3mm, configuration through hole 83 (diameter 0.4mm) between the 1st insulcrete 34 and the 2nd insulcrete 35 makes the conduction pin 32 that is made of following structures freely move simultaneously, makes in this wise.

(conduction pin)

Material: carried out gold-plated brass

The size of leading section 81a: external diameter 0.35mm, total length 2.1mm

The size of central portion 82: external diameter 0.45mm, total length 41mm

The size of base end part 81b: external diameter 0.35mm, total length 2.1mm

Have again, as shown in Figure 23, be clathrate disposed the 1st support pin 33 for the 1st contact plate 38A of middle holding plate 36 and the 2nd contact plate 38B for middle holding plate 36 of the 2nd support pin 37.Have again, separating distance between the 1st contact plate 38A adjacent each other and the separating distance between the 2nd contact plate 38B are decided to be 17.5mm.

(5) the tester side-connector 41

As shown in Figure 20, constituted tester side-connector 41 by the 3rd anisotropic conductive sheet 42, connector base board 43, base plate 46.Have, the 3rd anisotropic conductive sheet 42 has used and the same material of above-mentioned the 2nd anisotropic conductive sheet 26 again.

(performance test)

1. the mensuration of minimum moulding pressure

The testing fixture of having made is placed on track to be transported in the inspection portion of type circuit substrate self-verifying machine (STARREC V5), place evaluation circuit substrate 1 for testing fixture, make moulding pressure that track transports type circuit substrate self-verifying machine (STARREC V5) in the scope of 100～210kgf with stepped variation, under each moulding pressure condition, respectively measured conduction resistance value when 10 times inspection having been applied 1 milliampere electric current with electrode for the electrode of estimating with circuit substrate 1 that is examined.

The conduction resistance value of being measured is judged to be poor flow for the checkpoint (hereinafter referred to as " NG checkpoint ") more than or equal to 100 Ω, calculate the ratio (hereinafter referred to as " NG checkpoint ratio ") of the NG checkpoint in the global checkpoint, NG checkpoint ratio is decided to be smaller or equal to 0.01% minimum moulding pressure.Minimum moulding pressure.

In the mensuration of this conduction resistance value, after the mensuration of a conduction resistance value is through with, discharge with this and measure relevant moulding pressure, testing fixture is turned back to not pressurized state, by acting on the moulding pressure of the size of regulation once more, carried out the mensuration of next conduction resistance value.

Specifically, because estimate be examined above the circuit substrate 1 number of electrodes be 7312 points, below to be examined number of electrodes be 3784 points, under each moulding pressure condition, carried out 10 times mensuration, so NG checkpoint ratio represents to utilize the ratio of NG checkpoint shared in 110960 the checkpoint of formula (7312+3784) * 10=110960 calculating.

In this case, so-called " minimum moulding pressure is little " means that the electric-examination that can be examined circuit substrate with low moulding pressure looks into.In testing fixture, if can set lowly by the moulding pressure when checking, then because can suppress not only that moulding pressure when checking produces be examined circuit substrate and anisotropic conductive sheet and check mis-behave with circuit substrate, but the low parts of useful life longevity intensity are as the member of formation of testing fixture, so the structure of testing fixture can be made little compact structure, its result, can reach the cost cutting of the manufacturing of the raising of permanance of testing fixture and testing fixture, so be comparatively desirable.

2. the mensuration of the permanance of anisotropic conductive sheet

The testing fixture that has made is placed on track to be transported in the inspection portion of type circuit substrate self-verifying machine (STARREC V5), place evaluation circuit substrate 1 for testing fixture, the moulding pressure that makes track transport type circuit substrate self-verifying machine (STARREC V5) is decided to be 130kgf, after the pressurization of the number of times that has carried out regulation, measure conduction resistance value when 10 times inspection having been applied 1 milliampere electric current with electrode for the electrode of estimating with circuit substrate 1 that is examined under the condition of moulding pressure 130kgf, the operation of 10 conduction resistance values is similarly measured in the pressurization that has repeated the number of times stipulated.

The conduction resistance value of being measured is judged to be poor flow for the checkpoint (NG checkpoint) more than or equal to 100 Ω, calculates the ratio (NG checkpoint ratio) of the NG checkpoint in the global checkpoint.

Secondly, the anisotropic conductive sheet of testing fixture is replaced by new anisotropic conductive sheet, except the moulding pressure condition is changed to the 150kgf, utilize with above-mentioned same condition and carry out the pressurization of stipulated number, except the moulding pressure condition is changed to the 150kgf, utilize with above-mentioned same method and calculated NG checkpoint ratio afterwards.

When measuring the conduction resistance value relevant with the permanance of this anisotropic conductive sheet, after the mensuration of a conduction resistance value is through with, discharge with this and measure relevant moulding pressure, testing fixture is turned back to not pressurized state, by acting on the moulding pressure of the size of stipulating, carried out the mensuration of next conduction resistance value once more.

In addition, specifically, because estimate be examined above the circuit substrate 1 number of electrodes be 7312 points, below to be examined number of electrodes be 3784 points, under each moulding pressure condition, carried out 10 times mensuration, so NG checkpoint ratio represents to utilize the ratio of NG checkpoint shared in 110960 the checkpoint of formula (7312+3784) * 10=110960 calculating.

In this case, in testing fixture, be necessary to make NG checkpoint ratio smaller or equal to 0.01% in the practicality, because surpassed under 0.01% the situation in NG checkpoint ratio, sometimes can obtain for the situation that circuit substrate is thought the check result of unacceptable product by mistake that is examined as certified products, existence can not be carried out the galvanoscopic danger of the high circuit substrate of reliability.

In the measurement result of minimum moulding pressure shown in the table 1, in the measurement result of the permanance of the sheet of anisotropic conductive shown in the table 2.

(embodiment 2)

Used relaying pin unit 31a, the 31b of Fig. 1 to replace above-mentioned relaying pin unit 31.Promptly, use makes it can be towards the relaying pin unit that the insulcrete 34a, the 34b that move up and down and 35a, 35b constitute by having disposed conduction pin 32a, the 32b of a plurality of (8000 pins) with certain spacing (2.54mm spacing) and support this conduction pin 32a, 32b on grid point, the testing fixture that made similarly to Example 1 structure fabrication in addition.

About this testing fixture, utilize method similarly to Example 1, measured the permanance of minimum moulding pressure and anisotropic conductive sheet.In the measurement result of minimum moulding pressure shown in the table 1, in the measurement result of the permanance of the sheet of anisotropic conductive shown in the table 2.

(table 1)

NG checkpoint ratio (%)							Minimum moulding pressure (kgf)
								Moulding pressure (kgf)	100	110	130	150	180	210
Embodiment 1	0.3	0.01	0	0	0	0									150
							Embodiment 2	2.8	2.2	0.2	0.02	0	0	180

(table 2)

		NG checkpoint ratio (%)
							Pressurization number of times (inferior)		1	1000	5000	10000	30000
Embodiment 1	Moulding pressure 130kgf	0	0	0	0	0.3
							Moulding pressure 150kgf	0	0	0	0.05	0.7
	Embodiment 2	Moulding pressure 130kgf	0	0	0.1	0.25							1.5
Moulding pressure 150kgf							0	0.06	0.14	0.38	2.3

(embodiment 3)

Below, surfaceness is to use the three-dimensional surface structure elucidation microscope " New View 200 " of ザ イ go corporate system to measure value according to the center average roughness Ra of JIS B0601 under the condition of cutoff 0.8mm, measured length 0.25mm.

(estimate and use circuit substrate)

Prepared the evaluation circuit substrate of following specification.

Size: 100mm (indulging) * 100mm (horizontal stroke) * 0.8mm (thickness)

Above the number that is examined electrode of a side: 7312

Above the diameter that is examined electrode of a side: 0.3mm

Above the minimal configuration spacing that is examined electrode of a side: 0.4mm

Below the number that is examined electrode of a side: 3784

Below the diameter that is examined electrode of a side: 0.3mm

Below the minimal configuration spacing that is examined electrode of a side: 0.4mm

Made and be suitable for track and transport type circuit substrate self-verifying machine (Nidec リ-De corporate system, the name of an article: being used to of inspection portion STARREC V5) checked the circuit board inspection apparatus (Fig. 1) of above-mentioned evaluation with circuit substrate.

(1) the 1st anisotropic conductive sheet 22

The A liquid and the B liquid that have mixed the additive type silicone rubber of two-liquid type with the ratio that becomes equivalent.In this compound of 100 weight portions, add 100 weight portions mean particle diameter 20 μ m electroconductive particle and carried out mixing after, handle by the deaeration of carrying out producing by decompression, prepared moulding material.

As the additive type silicone rubber, the viscosity of having used A liquid and B liquid be respectively 500P, its hardening thing be that tear strength (foundation the assay method of JIS K 6249) 6%, 23 ℃ under is the material of 25kN/m in the compression set under 150 ℃ (according to the assay method of JIS K 6249).

As electroconductive particle, used the electroconductive particle (average overlay capacity: be the amount of 5 weight % of the weight of core particle) that has carried out electroless gold plating with nickel particles as core particle, to this core particle.

After at the thickness of the opening that has disposed rectangle on the forming face of a formed parts being the liner of frame shape of 0.08mm with 120mm * 200mm, the moulding material that coating has been prepared in the opening of liner is configured to its forming face with another formed parts and contacts with moulding material on this moulding material.

In a formed parts, with thickness is vibrin sheet (the eastern レ corporate system of 0.1mm, the name of an article " マ Star ト Le ミ ラ-S10 ") non-glassy surface (surfaceness is 1 μ m) uses as forming face, in another formed parts, with thickness is that the glassy surface (surfaceness is 0.04 μ m) of the vibrin sheet (eastern レ corporate system, the name of an article " マ Star ト Le ミ ラ-S10 ") of 0.1mm uses as forming face.

Secondly, use the pressing roller device that constitutes by pressing roller and back-up roller, utilize these formed parts to clamp moulding material and it is pressurizeed, the thickness of moulding material is decided to be 0.08mm.

On the back side of each formed parts, dispose electromagnet, by moulding material is acted on the parallel magnetic field of 0.3T on one side on its thickness direction, form the cure process of material layer on one side under 120 ℃, 30 minutes condition, having made thickness is the anisotropic conductive sheet of the rectangle of 0.1mm.

Surfaceness in its one side of resulting anisotropic conductive sheet is 1.4 μ m, and the surfaceness in the another side is 0.12 μ m, and the ratio of electroconductive particle by volume branch rate is 12%.This anisotropic conductive elastomeric sheets is decided to be " anisotropic conductive sheet (a) ".

(2) spacing conversion substrate 23

Stacking material (SUNX corporate system, the name of an article: utilize Numerical Control type drilling equipment to form the through hole of 7312 circles of total of the circle of the diameter 0.2mm that on the thickness direction of stacking material, connects respectively R-1766) of the thin metal layer that the copper by thickness 18 μ m constitutes on whole of the two sides of the insulated substrate that constitutes by glass-fiber reinforced epoxy resin, have been formed.Secondly, handle by use the copper electroplating liquid of EDTA type to carry out electroless plating for the stacking material that has formed through hole, on the inwall of each through hole, form the copper electrodeposited coating, moreover, by using the copper sulphate electroplate liquid to carry out the cathode copper electroplating processes, in each through hole, formed the via hole cylindraceous of the about 10 μ m of thickness of each thin metal layer on mutual electric connection layer laminate materials surface.

Secondly, (system should be changed in Tokyo, the name of an article: FP-225) formed resist layer, the while has been disposed the protection sealant to the dry film photoresist of laminate thickness 25 μ m on the thin metal layer on stacking material surface on the thin metal layer of the another side of this stacking material.On this resist layer, disposed the photomask film,,, formed the resist pattern that etching is used by carrying out development treatment use directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for resist layer.Then, carry out etching processing by thin metal layer for the face that has formed the resist pattern, 7312 connection electrode that formed diameter 200 μ m on the surface of insulated substrate are the pattern wiring portion of 100 μ m with the live width that is electrically connected each connection electrode and via hole, secondly, removed the resist pattern.

(Hitachi changes into system to the dry film scolder resist of laminate thickness 25 μ m on the surface of the insulated substrate that has formed connection electrode and pattern wiring portion, the name of an article: SR-2300G) form insulation course, on this insulation course, disposed the photomask film, using directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for insulation course, by carrying out development treatment, 7312 openings of the diameter 200 μ m that expose connection electrode have separately been formed.Use the copper sulphate electroplate liquid, the thin metal layer of the another side of stacking material as common electrode, by carrying out the cathode copper electroplating processes for connection electrode separately, has been formed from 7312 outstanding connection electrode of the surface of insulation course.

Secondly, remove the protection sealant on the thin metal layer of another side of stacking material, (system should be changed in Tokyo to the dry film photoresist of laminate thickness 25 μ m, the name of an article: FP-225) formed resist layer on the thin metal layer of this face.Thereafter, on this resist layer, disposed the photomask film, use directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for resist layer,, formed the resist pattern that etching is used on the thin metal layer in stacking material by carrying out development treatment.Secondly,, on the back side of insulativity substrate, formed 7312 terminal electrodes and the pattern wiring portion that is electrically connected each terminal electrode and via hole, removed the resist pattern by carrying out etching processing.

Secondly, dry film scolder resist (ニ チ go-モ-ト Application system of laminate thickness 38 μ m on the back side of the insulated substrate that has formed terminal electrode and pattern wiring portion, the name of an article: コ Application Off オ マ ス Network 2015) form insulation course, on this insulation course, disposed the photomask film, secondly, use directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for insulation course,, 7312 openings of the diameter 0.4mm that exposes electrode have been formed by carrying out development treatment.

As mentioned above, made spacing conversion substrate 23a.This spacing conversion is 120mm * 160mm with the size in length and breadth of substrate 23a, thickness is 0.5mm, the diameter of the part of exposing from surface of insulating layer of connection electrode is about 300 μ m, connection electrode be about 25 μ m from the surface of insulating layer projecting height, the minimal configuration spacing of connection electrode is 0.4mm, the diameter of terminal electrode is 0.4mm, and the disposition interval of terminal electrode is 0.75mm, and the surfaceness of insulation course that has formed face one side of connection electrode is 0.02 μ m.

By use the above-mentioned anisotropic conductive sheet (a) of surface one side configuration of substrate in this spacing conversion, side configuration constitutes, conduct electricity the road form the anisotropic conductive sheet of the type of the secundly that portion 72 gives prominence on a face by form insulation division that these conduction roads of portion and mutual insulating form portion on a plurality of conductions road of extending on the thickness direction overleaf, has made circuit substrate side-connector 21a.

Have, the 2nd anisotropic conductive sheet 26 of configuration is the shape shown in Fig. 6 between the spacing conversion is with substrate 23 and relaying pin unit 31 again, specifically, has used the anisotropic conductive sheet of following structure.

(the 2nd anisotropic conductive sheet 26)

Size: 110mm * 150mm

The thickness of conduction road formation portion 72: 0.6mm

The external diameter of conduction road formation portion 72: 0.35mm

The projecting height of conduction road formation portion 72: 0.05mm

Electroconductive particle: material; Carried out gold-plated nickel particles, mean particle diameter; 35 μ m, the containing ratio of the electroconductive particle in the conduction road formation portion 72; 30 volume %

Elastomer: material; Silicone rubber, hardness; 30

(W ₂/D ₂＝17)

With above-mentioned same, made and have 3784 connection electrode from the teeth outwards, have the spacing conversion substrate 23b that the bottom one side gauging fixture of 3784 terminal electrodes is used on overleaf.This spacing conversion is 120mm * 160mm with the size in length and breadth of substrate 23b, thickness is 0.5mm, the diameter of the part of exposing on surface of insulating layer in the connection electrode is about 300 μ m, connection electrode be about 25 μ m from the surface of insulating layer projecting height, the minimal configuration spacing of connection electrode is 0.4mm, the diameter of terminal electrode is 0.4mm, and the disposition interval of terminal electrode is 0.75mm, and the surfaceness of the insulation course of surface (having formed the face of connection electrode) side is 0.02 μ m.

By use the above-mentioned anisotropic conductive sheet (a) of surface one side configuration of substrate in this spacing conversion, side configuration constitutes, conduct electricity the road form the anisotropic conductive sheet of the type of the secundly that portion 72 gives prominence on a face by form insulation division that these conduction roads of portion and mutual insulating form portion on a plurality of conductions road of extending on the thickness direction overleaf, has made the circuit substrate side-connector 21b of bottom one side.

By using circuit substrate side-connector 21a, the 21b of this top one side and bottom one side, dispose relaying pin unit 31a, 31b and tester side- connector 41a, 41b as shown in Figure 1 like that, constituted testing fixture.

(performance test)

Testing fixture is installed in track to be transported on the type circuit substrate self-verifying machine " STARRECV5 " (Nidec リ-De corporate system), utilize following method, carried out the disbonded test of connective stability test (mensuration of minimum moulding pressure) and anisotropic conductive sheet.

1. the mensuration of minimum moulding pressure

The testing fixture of having made is placed on track to be transported in the inspection portion of type circuit substrate self-verifying machine (STARREC V5), place evaluation circuit substrate 1 for testing fixture, make moulding pressure that track transports type circuit substrate self-verifying machine (STARREC V5) in the scope of 100～250kgf with stepped variation, under each moulding pressure condition, respectively measured conduction resistance value when 10 times inspection having been applied 1 milliampere electric current with electrode for the electrode of estimating with circuit substrate 1 that is examined.

The conduction resistance value of being measured is judged to be poor flow for the checkpoint (hereinafter referred to as " NG checkpoint ") more than or equal to 100 Ω, calculate the ratio (hereinafter referred to as " NG checkpoint ratio ") of the NG checkpoint in the global checkpoint, NG checkpoint ratio is decided to be smaller or equal to 0.01% minimum moulding pressure. minimum moulding pressure.

In the mensuration of this conduction resistance value, after the mensuration of a conduction resistance value is through with, discharge with this and measure relevant moulding pressure, testing fixture is turned back to not pressurized state, by acting on the moulding pressure of the size of regulation once more, carried out the mensuration of next conduction resistance value.

Specifically, because estimate be examined above the circuit substrate 1 number of electrodes be 7312 points, below to be examined number of electrodes be 3784 points, under each moulding pressure condition, carried out 10 times mensuration, so NG checkpoint ratio represents to utilize the ratio of NG checkpoint shared in 110960 the checkpoint of formula (7312+3784) * 10=110960 calculating.Measurement result has been shown in table 3.

2. fissility test

Make above-mentioned evaluation transport and be placed on circuit substrate on the testing fixture, pressurize with circuit substrate to estimating with the pressurization load of 150kgf.Under this state, secondly the resistance value when measuring the evaluation that the connection electrode with 2 connectors has been electrically connected and having applied 1 milliampere electric current with circuit substrate is removed for the pressurization of estimating with circuit substrate.After having carried out 10 these operations, transported the evaluation circuit substrate from the inspection area of testing fixture.

Carry out above-mentioned operation for 100 evaluations with circuit substrate, estimate when use circuit substrate having transported from the inspection area of testing fixture, measured anisotropic conductive sheet (a) from the spacing conversion with the substrate disengaging and bond to evaluation with the number of times on the circuit substrate (transporting errors number).Measurement result has been shown in table 3.

(embodiment 4)

In the testing fixture of in embodiment 3, having made, use following anisotropic conductive elastomeric sheets (b) to replace anisotropic conductive elastomeric sheets (a) to constitute testing fixture, carried out connective stability test and fissility test similarly to Example 3.Measurement result has been shown in table 3.

After at the opening that has disposed rectangle on the forming face of a formed parts, thickness being the liner of frame shape of 0.08mm with 120mm * 200mm, in the opening of liner, apply the moulding material of having prepared similarly to Example 1, on this moulding material, another formed parts is configured to its forming face and contacts with moulding material.

In both formed parts, be that the glassy surface (surfaceness is 0.04 μ m) of the vibrin sheet (eastern レ corporate system, the name of an article " マ ッ ト Le ミ ラ-S10 ") of 0.1mm uses as forming face with thickness.

Secondly, use the pressing roller device that is made of pressing roller and back-up roller, clamp moulding material and it is pressurizeed by utilizing these formed parts, having formed thickness is the moulding material layer of 0.08mm.On the back side of each formed parts, dispose electromagnet, by moulding material is acted on the parallel magnetic field of 0.3T on one side on its thickness direction, form the cure process of material layer on one side between 120 ℃, 30 minutes, having made thickness is the anisotropic conductive sheet of the rectangle of 0.1mm.

The surfaceness on a surface of resulting anisotropic conductive sheet (b) is 0.13 μ m, and another surperficial surfaceness is 0.12 μ m, and the ratio of electroconductive particle by volume branch rate is 12%.

(table 3)

	NG checkpoint ratio (%)						Minimum moulding pressure (kgf)	Transport errors number (inferior)
									Pressurization load (kgf)	110	130	150	180	200	250
Embodiment 3	2.2	0.2	0.02	0	0	0										180	0
							Embodiment 4	2.3	0.3	0.01	0	0	0	180	95

(embodiment 5)

Below, surfaceness is to use the three-dimensional surface structure elucidation microscope " New View 200 " of ザ イ go corporate system to measure value according to the center average roughness Ra of JIS B0601 under the condition of cutoff 0.8mm, measured length 0.25mm.

(estimate and use circuit substrate)

Prepared the evaluation circuit substrate of following specification.

Size: 100mm (indulging) * 100mm (horizontal stroke) * 0.8mm (thickness)

Above the number that is examined electrode of a side: 7312

Above the diameter that is examined electrode of a side: 0.3mm

Above the minimal configuration spacing that is examined electrode of a side: 0.4mm

Below the number that is examined electrode of a side: 3784

Below the diameter that is examined electrode of a side: 0.3mm

Below the minimal configuration spacing that is examined electrode of a side: 0.4mm

Made and be suitable for track and transport type circuit substrate self-verifying machine (Nidec リ-De corporate system, the name of an article: being used to of inspection portion STARREC V5) checked the circuit board inspection apparatus (Figure 20) of above-mentioned evaluation with circuit substrate.

(1) the 1st anisotropic conductive sheet 22

The A liquid and the B liquid that have mixed the additive type silicone rubber of two-liquid type with the ratio that becomes equivalent.In this compound of 100 weight portions, add 100 weight portions mean particle diameter 20 μ m electroconductive particle and carried out mixing after, handle by the deaeration of carrying out producing by decompression, prepared moulding material.

As the additive type silicone rubber, the viscosity of having used A liquid and B liquid be respectively 500P, its hardening thing be that tear strength (foundation the assay method of JIS K 6249) 6%, 23 ℃ under is the material of 25kN/m in the compression set under 150 ℃ (according to the assay method of JIS K 6249).

As electroconductive particle, used the electroconductive particle (average overlay capacity: be the amount of 5 weight % of the weight of core particle) that has carried out electroless gold plating with nickel particles as core particle, to this core particle.

After at the thickness of the opening that has disposed rectangle on the forming face of a formed parts being the liner of frame shape of 0.08mm with 120mm * 200mm, the moulding material that coating has been prepared in the opening of liner is configured to its forming face with another formed parts and contacts with moulding material on this moulding material.

In a formed parts, with thickness is vibrin sheet (the eastern レ corporate system of 0.1mm, the name of an article " マ Star ト Le ミ ラ-S10 ") non-glassy surface (surfaceness is 1 μ m) uses as forming face, in another formed parts, with thickness is that the glassy surface (surfaceness is 0.04 μ m) of the vibrin sheet (eastern レ corporate system, the name of an article " マ Star ト Le ミ ラ-S10 ") of 0.1mm uses as forming face.

Secondly, use the pressing roller device that constitutes by pressing roller and back-up roller, utilize these formed parts to clamp moulding material and it is pressurizeed, the thickness of moulding material is decided to be 0.08mm.

On the back side of each formed parts, dispose electromagnet, by moulding material is acted on the parallel magnetic field of 0.3T on one side on its thickness direction, form the cure process of material layer on one side between 120 ℃, 30 minutes, having made thickness is the anisotropic conductive sheet of the rectangle of 0.1mm.

Surfaceness in its one side of resulting anisotropic conductive sheet is 1.4 μ m, and the surfaceness in the another side is 0.12 μ m, and the ratio of electroconductive particle by volume branch rate is 12%.This anisotropic conductive elastomeric sheets is decided to be " anisotropic conductive sheet (a) ".

(2) spacing conversion substrate 23

Stacking material (SUNX corporate system, the name of an article: utilize Numerical Control type drilling equipment to form the through hole of 7312 circles of total of the circle of the diameter 0.2mm that on the thickness direction of stacking material, connects respectively R-1766) of the thin metal layer that the copper by thickness 18 μ m constitutes on whole of the two sides of the insulated substrate that constitutes by glass-fiber reinforced epoxy resin, have been formed.

Secondly, handle by use the copper electroplating liquid of EDTA type to carry out electroless plating for the stacking material that has formed through hole, on the inwall of each through hole, form the copper electrodeposited coating, moreover, by using the copper sulphate electroplate liquid to carry out the cathode copper electroplating processes, in each through hole, formed the via hole cylindraceous of the about 10 μ m of thickness of each thin metal layer on mutual electric connection layer laminate materials surface.

Secondly, (system should be changed in Tokyo, the name of an article: FP-225) formed resist layer, the while has been disposed the protection sealant to the dry film photoresist of laminate thickness 25 μ m on the thin metal layer on stacking material surface on the thin metal layer of the another side of this stacking material.On this resist layer, disposed the photomask film,,, formed the resist pattern that etching is used by carrying out development treatment use directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for resist layer.Then, carry out etching processing by thin metal layer for the face that has formed the resist pattern, 7312 connection electrode that formed diameter 200 μ m on the surface of insulated substrate are the pattern wiring portion of 100 μ m with the live width that is electrically connected each connection electrode and via hole, secondly, removed the resist pattern.

(Hitachi changes into system to the dry film scolder resist of laminate thickness 25 μ m on the surface of the insulated substrate that has formed connection electrode and pattern wiring portion, the name of an article: SR-2300G) form insulation course, on this insulation course, disposed the photomask film, using directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for insulation course, by carrying out development treatment, 7312 openings of the diameter 200 μ m that expose connection electrode have separately been formed.Use the copper sulphate electroplate liquid, the thin metal layer of the another side of stacking material as common electrode, by carrying out the cathode copper electroplating processes for connection electrode separately, has been formed from 7312 outstanding connection electrode of the surface of insulation course.

Secondly, remove the protection sealant on the thin metal layer of another side of stacking material, (system should be changed in Tokyo to the dry film photoresist of laminate thickness 25 μ m, the name of an article: FP-225) formed resist layer on the thin metal layer of this face.Thereafter, on this resist layer, disposed the photomask film, use directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for resist layer,, formed the resist pattern that etching is used on the thin metal layer in stacking material by carrying out development treatment.Secondly,, on the back side of insulativity substrate, formed 7312 terminal electrodes and the pattern wiring portion that is electrically connected each terminal electrode and via hole, removed the resist pattern by carrying out etching processing.

Secondly, dry film scolder resist (ニ チ go-モ-ト Application system of laminate thickness 38 μ m on the back side of the insulated substrate that has formed terminal electrode and pattern wiring portion, the name of an article: コ Application Off オ マ ス Network 2015) form insulation course, on this insulation course, disposed the photomask film, secondly, use directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for insulation course,, 7312 openings of the diameter 0.4mm that exposes electrode have been formed by carrying out development treatment.

As mentioned above, made the spacing conversion substrate 23a that the 1st gauging fixture 11a uses.This spacing conversion is 120mm * 160mm with the size in length and breadth of substrate 23a, thickness is 0.5mm, the diameter of the part of exposing from surface of insulating layer of connection electrode is about 300 μ m, connection electrode be about 25 μ m from the surface of insulating layer projecting height, the minimal configuration spacing of connection electrode is 0.4mm, the diameter of terminal electrode is 0.4mm, and the disposition interval of terminal electrode is 0.75mm, and the surfaceness of insulation course that has formed face one side of connection electrode is 0.02 μ m.

In addition, with similarly above-mentioned, made and have 3784 connection electrode from the teeth outwards, have the spacing conversion substrate 23b that the 2nd gauging fixture 11b of 3784 terminal electrodes uses on overleaf.This spacing conversion is 120mm * 160mm with the size in length and breadth of substrate 23b, thickness is 0.5mm, the diameter of the part of exposing on surface of insulating layer in the connection electrode is about 300 μ m, connection electrode be about 25 μ m from the surface of insulating layer projecting height, the minimal configuration spacing of connection electrode is 0.4mm, the diameter of terminal electrode is 0.4mm, and the disposition interval of terminal electrode is 0.75mm, and the surfaceness of the insulation course of surface (having formed the face of connection electrode) side is 0.02 μ m.

(3) the circuit substrate side-connector 21

By use the 1st above-mentioned anisotropic conductive sheet 22 of surface one side configuration of substrate 23 in this spacing conversion, side configuration constitutes, forms the 2nd anisotropic conductive sheet 26 that the anisotropic conductive sheet of portion 72 type of outstanding secundly on a face constitutes by the conduction road by form the insulation division that these conduction roads of portion and mutual insulating form portion on a plurality of conductions road of extending on the thickness direction overleaf, has made circuit substrate side-connector 21.

Have, the 2nd anisotropic conductive sheet 26 of configuration is the shape shown in Fig. 6 between the spacing conversion is with substrate 23 and relaying pin unit 31 again, specifically, has used the anisotropic conductive sheet of following structure.

(the 2nd anisotropic conductive sheet 26)

Size: 110mm * 150mm

The thickness of conduction road formation portion 72: 0.6mm

The external diameter of conduction road formation portion 72: 0.35mm

The projecting height of conduction road formation portion 72: 0.05mm

Electroconductive particle: material; Carried out gold-plated nickel particles, mean particle diameter; 35 μ m, the containing ratio of the electroconductive particle in the conduction road formation portion 72; 30 volume %

Elastomer: material; Silicone rubber, hardness; 30

(W ₂/D ₂＝17)

(4) relaying pin unit 31

Material as the 1st insulcrete 34, middle holding plate the 36, the 2nd insulcrete 35 has used intrinsic resistance more than or equal to 1 * 10 ¹⁰The insulativity material of Ω cm is made of glass-fiber reinforced epoxy resin, and its thickness is 1.9mm.

And, utilize the 1st support pin 33 (diameter 2mm, length 36.3mm) and the 2nd support pin 37 (diameter 2mm, length 3mm) carries out fixed support, make the distance L 1 between the 1st insulcrete 34 and the middle holding plate 36 be 36.3mm, distance L 2 between the 2nd insulcrete 35 and the middle holding plate 36 is 3mm, between the 1st insulcrete 34 and the 2nd insulcrete 35, dispose through hole 83 (diameter 0.4mm) simultaneously, make the conduction pin 32 that constitutes by following structures freely move, make in this wise.

(conduction pin)

Material: carried out gold-plated brass

The size of leading section 81a: external diameter 0.35mm, total length 2.1mm

The size of central portion 82: external diameter 0.45mm, total length 41mm

The size of base end part 81b: external diameter 0.35mm, total length 2.1mm

Have again, as shown in Figure 23, be clathrate disposed the 1st support pin 33 for the 1st contact plate 38A of middle holding plate 36 and the 2nd contact plate 38B for middle holding plate 36 of the 2nd support pin 37.Have again, separating distance between the 1st contact plate 38A adjacent each other and the separating distance between the 2nd contact plate 38B are decided to be 17.5mm.

(5) the tester side-connector 41

As shown in Figure 20, constituted tester side-connector 41 by the 3rd anisotropic conductive sheet 42, connector base board 43, base plate 46.Have, the 3rd anisotropic conductive sheet 42 has used and the same material of above-mentioned the 2nd anisotropic conductive sheet 26 again.

(performance test)

Testing fixture is installed in track to be transported on the type circuit substrate self-verifying machine " STARRECV5 " (Nidec リ-De corporate system), utilize following method, carried out the disbonded test of connective stability test (mensuration of minimum moulding pressure) and anisotropic conductive sheet.

1. the mensuration of minimum moulding pressure

The testing fixture of having made is placed on track to be transported in the inspection portion of type circuit substrate self-verifying machine (STARREC V5), place evaluation circuit substrate 1 for testing fixture, make moulding pressure that track transports type circuit substrate self-verifying machine (STARREC V5) in the scope of 100～210kgf with stepped variation, under each moulding pressure condition, respectively measured conduction resistance value when 10 times inspection having been applied 1 milliampere electric current with electrode for the electrode of estimating with circuit substrate 1 that is examined.

The conduction resistance value of being measured is judged to be poor flow for the checkpoint (hereinafter referred to as " NG checkpoint ") more than or equal to 100 Ω, calculate the ratio (hereinafter referred to as " NG checkpoint ratio ") of the NG checkpoint in the global checkpoint, NG checkpoint ratio is decided to be smaller or equal to 0.01% minimum moulding pressure. minimum moulding pressure.

In the mensuration of this conduction resistance value, after the mensuration of a conduction resistance value is through with, discharge with this and measure relevant moulding pressure, testing fixture is turned back to not pressurized state, by acting on the moulding pressure of the size of regulation once more, carried out the mensuration of next conduction resistance value.

Specifically, because estimate be examined above the circuit substrate 1 number of electrodes be 7312 points, below to be examined number of electrodes be 3784 points, under each moulding pressure condition, carried out 10 times mensuration, so NG checkpoint ratio represents to utilize the ratio of NG checkpoint shared in 110960 the checkpoint of formula (7312+3784) * 10=110960 calculating.Measurement result has been shown in table 4.

2. fissility test

Make above-mentioned evaluation transport and be placed on circuit substrate on the testing fixture, pressurize with circuit substrate to estimating with the pressurization load of 130kgf.Under this state, secondly the resistance value when measuring the evaluation that the connection electrode with 2 connectors has been electrically connected and having applied 1 milliampere electric current with circuit substrate is removed for the pressurization of estimating with circuit substrate.After having carried out 10 these operations, transported the evaluation circuit substrate from the inspection area of testing fixture.

Carry out above-mentioned operation for 100 evaluations with circuit substrate, estimate when use circuit substrate having transported from the inspection area of testing fixture, measured anisotropic conductive sheet (a) from the spacing conversion with the substrate disengaging and bond to evaluation with the number of times on the circuit substrate (transporting errors number).Measurement result has been shown in table 4.

(embodiment 6)

In the testing fixture of in embodiment 5, having made, use following anisotropic conductive elastomeric sheets (b) to replace anisotropic conductive elastomeric sheets (a) to constitute testing fixture, carried out connective stability test and fissility test similarly to Example 5.Measurement result has been shown in table 4.

After at the opening that has disposed rectangle on the forming face of a formed parts, thickness being the liner of frame shape of 0.08mm with 120mm * 200mm, in the opening of liner, apply the moulding material of having prepared similarly to Example 1, on this moulding material, another formed parts is configured to its forming face and contacts with moulding material.

In both formed parts, be that the glassy surface (surfaceness is 0.04 μ m) of the vibrin sheet (eastern レ corporate system, the name of an article " マ Star ト Le ミ ラ-S10 ") of 0.1mm uses as forming face with thickness.

Secondly, use the pressing roller device that is made of pressing roller and back-up roller, clamp moulding material and it is pressurizeed by utilizing these formed parts, having formed thickness is the moulding material layer of 0.08mm.On the back side of each formed parts, dispose electromagnet, by moulding material is acted on the parallel magnetic field of 0.3T on one side on its thickness direction, form the cure process of material layer on one side between 120 ℃, 30 minutes, having made thickness is the anisotropic conductive sheet of the rectangle of 0.1mm.

The surfaceness on a surface of resulting anisotropic conductive sheet (b) is 0.13 μ m, and another surperficial surfaceness is 0.12 μ m, and the ratio of electroconductive particle by volume branch rate is 12%.

(table 4)

	NG checkpoint ratio (%)						Minimum moulding pressure (kgf)	Transport errors number (inferior)
									Pressurization load (kgf)	100	110	130	150	180	210
Embodiment 5	2.1	0.02	0	0	0	0										130	0
							Embodiment 6	2.3	0.02	0	0	0	0	130	84

(embodiment 7)

(estimate and use circuit substrate)

Prepared the evaluation circuit substrate of following specification.

Size: 100mm (indulging) * 100mm (horizontal stroke) * 0.8mm (thickness)

Above the number that is examined electrode of a side: 3400

Above the diameter that is examined electrode of a side: 0.3mm

Above the minimal configuration spacing that is examined electrode of a side: 0.4mm

Below the number that is examined electrode of a side: 2500

Below the diameter that is examined electrode of a side: 0.3mm

Below the minimal configuration spacing that is examined electrode of a side: 0.4mm

Made and be suitable for track and transport type circuit substrate self-verifying machine (Nidec リ-De corporate system, the name of an article: being used to of inspection portion STARREC V5) checked the circuit board inspection apparatus (Figure 14) of above-mentioned evaluation with circuit substrate.

(1) the 1st anisotropic conductive sheet 22

Having made electroconductive particle is arranging on the thickness direction and dispersed equably the 1st anisotropic conductive sheet on the face direction.

Size: 110mm * 110mm, thickness 0.1mm

Electroconductive particle: material; Carried out gold-plated nickel particles, mean particle diameter; 20 μ m, containing ratio; 18 volume %

Elastomer: material; Silicone rubber, hardness; 40

(2) spacing conversion substrate 23

Stacking material (SUNX corporate system, the name of an article: utilize Numerical Control type drilling equipment to form the through hole of 6800 circles of total of the diameter 0.1mm that on the thickness direction of stacking material, connects respectively R-1766) of the thin metal layer that the copper by thickness 18 μ m constitutes on whole of the two sides of the insulated substrate of the 0.5mm that constitutes by glass-fiber reinforced epoxy resin, have been formed.

In this case, the formation of through hole is one group with 2, with estimate with circuit substrate above being examined on the position that electrode pair answers of a side form, the gap that 0.1mm is set has formed one group through hole and (that is, has meaned the gap that is set between through hole A=0.1mm and the through hole B=0.1mm=0.1mm).

Thereafter, handle by use the copper electroplating liquid of EDTA type to carry out electroless plating for the stacking material that has formed through hole, on the inwall of each through hole, form the copper electrodeposited coating, moreover, by using the copper sulphate electroplate liquid to carry out the cathode copper electroplating processes, in each through hole, formed the via hole cylindraceous of the about 10 μ m of thickness of each thin metal layer on mutual electric connection layer laminate materials surface.

Secondly, (system should be changed in Tokyo, the name of an article: FP-225) formed resist layer, the while has been disposed the protection sealant to the dry film photoresist of laminate thickness 25 μ m on the thin metal layer on stacking material surface on the thin metal layer of the another side of this stacking material.On this resist layer, disposed the photomask film,,, formed the resist pattern that etching is used by carrying out development treatment use directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for resist layer.Then, carry out etching processing by thin metal layer for the face that has formed the resist pattern, the live width that has formed 6800 connection electrode of horizontal 60 μ m, vertical 150 μ m and be electrically connected each connection electrode and via hole on the surface of insulated substrate is the pattern wiring portion of 100 μ m, secondly, removed the resist pattern.

Secondly, in the formation of stacking material on the face of one side of connection electrode and pattern wiring portion the dry film photoresist of laminate thickness 25 μ m (system should be changed in Tokyo, the name of an article: FP-225) formed resist layer, on this resist layer, disposed the photomask film, using directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for resist layer, by carrying out development treatment, 6800 openings of the rectangle of the horizontal stroke 60 μ m that expose connection electrode separately, vertical 150 μ m have been formed.

Then, use the copper sulphate electroplate liquid, the thin metal layer of the another side of stacking material as common electrode, by carrying out the cathode copper electroplating processes for connection electrode separately, has been formed from 6800 outstanding connection electrode of the surface of insulation course.Secondly, removed the resist pattern.

Secondly, remove the protection sealant on the thin metal layer of another side of stacking material, (system should be changed in Tokyo to the dry film photoresist of laminate thickness 25 μ m, the name of an article: FP-225) formed resist layer on the thin metal layer of this face.Thereafter, on this resist layer, disposed the photomask film, use directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for resist layer,, formed the resist pattern that etching is used on the thin metal layer in stacking material by carrying out development treatment.

Secondly; in the formation of stacking material after having applied the protection sealant on the face of one side of connection electrode; by carrying out etching processing, on the back side of insulativity substrate, formed 6800 terminal electrodes and the pattern wiring portion that is electrically connected each terminal electrode and via hole, removed the resist pattern.

Secondly, dry film scolder resist (ニ チ go-モ-ト Application system of laminate thickness 38 μ m on the back side of the insulated substrate that has formed terminal electrode and pattern wiring portion, the name of an article: コ Application Off オ マ ス Network 2015) form insulation course, on this insulation course, disposed the photomask film, secondly, use directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for insulation course,, 6800 openings of the diameter 0.4mm that exposes electrode have been formed by carrying out development treatment.

As mentioned above, made spacing conversion substrate 23a.This spacing conversion is 120mm * 160mm with the size in length and breadth of substrate 23a, thickness is 0.5mm, the size of the part of exposing from surface of insulating layer of connection electrode, the about 60 μ m of transverse direction, the about 150 μ m of longitudinal direction, connection electrode be about 60 μ m from the surface of insulating layer projecting height, the separating distance that constitutes 25 of right connection electrode is 100 μ m, the diameter of terminal electrode is 0.4mm, the disposition interval of terminal electrode is 0.75mm, and the surfaceness of insulation course that has formed face one side of connection electrode is 0.02 μ m.

In addition, with similarly above-mentioned, made and have 5000 connection electrode 25 from the teeth outwards, have the spacing conversion substrate 23b that the 2nd gauging fixture 11b of 5000 terminal electrodes 24 uses on overleaf.

This spacing conversion is 120mm * 160mm with the size in length and breadth of substrate 23b, thickness is 0.5mm, the about 60 μ m of the transverse direction of the part of on surface of insulating layer, exposing in the connection electrode, the about 150 μ m of longitudinal direction, connection electrode be about 60 μ m from the surface of insulating layer projecting height, the separating distance that constitutes 25 of right connection electrode is 100 μ m, the diameter of terminal electrode 24 is 0.4mm, the disposition interval of terminal electrode 24 is 0.75mm, and the surfaceness of the insulation course of surface (having formed the face of connection electrode) side is 0.02 μ m.

(3) the circuit substrate side-connector 21

By use the 1st above-mentioned anisotropic conductive sheet 22 of surface one side configuration of substrate 23 in this spacing conversion, side configuration constitutes, forms the 2nd anisotropic conductive sheet 26 that the anisotropic conductive sheet of portion 72 type of outstanding secundly on a face constitutes by the conduction road by form the insulation division that these conduction roads of portion and mutual insulating form portion on a plurality of conductions road of extending on the thickness direction overleaf, has made circuit substrate side-connector 21.

Have, the 2nd anisotropic conductive sheet 26 of configuration is the shape shown in Fig. 6 between the spacing conversion is with substrate 23 and relaying pin unit 31 again, specifically, has used the anisotropic conductive sheet of following structure.

(the 2nd anisotropic conductive sheet 26)

Size: 110mm * 150mm

The thickness of conduction road formation portion 72: 0.6mm

The external diameter of conduction road formation portion 72: 0.35mm

The projecting height of conduction road formation portion 72: 0.05mm

Electroconductive particle: material; Carried out gold-plated nickel particles, mean particle diameter; 35 μ m, the containing ratio of the electroconductive particle in the conduction road formation portion 72; 30 volume %

Elastomer: material; Silicone rubber, hardness; 30

(W ₂/D ₂＝17)

(4) relaying pin unit 31

Material as insulcrete 34,35 has used intrinsic resistance more than or equal to 1 * 10 ¹⁰The insulativity material of Ω cm is made of glass-fiber reinforced epoxy resin, and its thickness is 6mm.

Fitting insulating panels 34,35 on support pin 33, and making the distance between insulcrete 34 and the insulcrete 35 is 52mm, has disposed through hole 83, make the conduction pin 32 that is made of following structures freely move.

(conduction pin)

Material: carried out gold-plated brass

The size of leading section: external diameter 0.35mm, total length 6.7mm

The size of central portion: external diameter 0.45mm, total length 51mm

The size of base end part: external diameter 0.35mm, total length 6.7mm

(5) the tester side-connector 41

As shown in Figure 14, constituted tester side-connector 41 by the 3rd anisotropic conductive sheet 42, connector base board 43, base plate 46.Have, the 3rd anisotropic conductive sheet 42 has used and the same material of above-mentioned the 2nd anisotropic conductive sheet 26 again.

(performance test)

1. the mensuration of minimum moulding pressure

The testing fixture of having made is placed on track to be transported in the inspection portion of type circuit substrate self-verifying machine (STARREC V5), place evaluation circuit substrate 1 for testing fixture, make moulding pressure that track transports type circuit substrate self-verifying machine (STARREC V5) in the scope of 100～250kgf with stepped variation, under each moulding pressure condition, respectively measured the conduction resistance value when current supply has applied 1 milliampere electric current with the electrode pair inspection with electrode 10 times with the voltage determination electrode for the electrode of estimating with circuit substrate 1 that is examined.

The conduction resistance value of being measured is judged to be poor flow for the checkpoint (hereinafter referred to as " NG checkpoint ") more than or equal to 100 Ω, calculate the ratio (hereinafter referred to as " NG checkpoint ratio ") of the NG checkpoint in the global checkpoint, NG checkpoint ratio is decided to be minimum moulding pressure smaller or equal to 0.01% minimum moulding pressure.

In the mensuration of this conduction resistance value, after the mensuration of a conduction resistance value is through with, discharge with this and measure relevant moulding pressure, testing fixture is turned back to not pressurized state, by acting on the moulding pressure of the size of regulation once more, carried out the mensuration of next conduction resistance value.

Specifically, because estimate be examined above the circuit substrate 1 number of electrodes be 3400 points, below to be examined number of electrodes be 2500 points, under each moulding pressure condition, carried out 10 times mensuration, so NG checkpoint ratio represents to utilize the ratio of NG checkpoint shared in 59000 the checkpoint of formula (3400+2500) * 10=59000 calculating.In measurement result shown in the table 5.

2. the mensuration of the permanance of anisotropic conductive sheet

The testing fixture that has made is placed on track to be transported in the inspection portion of type circuit substrate self-verifying machine (STARREC V5), place the evaluation circuit substrate of having prepared 1 for testing fixture, the moulding pressure that makes track transport type circuit substrate self-verifying machine (STARREC V5) is decided to be 150kgf, after the pressurization of the number of times that has carried out regulation, under the condition of moulding pressure 150kgf, measured conduction resistance value when 10 times inspection having been applied 1 milliampere electric current with electrode for the electrode of estimating with circuit substrate 1 that is examined.

The conduction resistance value of being measured is judged to be poor flow for the checkpoint (NG checkpoint) more than or equal to 100 Ω, calculates the ratio (NG checkpoint ratio) of the NG checkpoint in the global checkpoint.

Secondly, the anisotropic conductive sheet of testing fixture is replaced by new anisotropic conductive sheet, except the moulding pressure condition is changed to the 180kgf, utilize the pressurization of the number of times of stipulating with above-mentioned same condition, thereafter, except the moulding pressure condition is decided to be the 180kgf, utilizes with above-mentioned same method and calculated NG checkpoint ratio.

When measuring the conduction resistance value relevant with the permanance of this anisotropic conductive sheet, after the mensuration of a conduction resistance value is through with, discharge with this and measure relevant moulding pressure, testing fixture is turned back to not pressurized state, by acting on the moulding pressure of the size of stipulating, carried out the mensuration of next conduction resistance value once more.

In addition, specifically, because estimate be examined above the circuit substrate 1 number of electrodes be 3400 points, below to be examined number of electrodes be 2500 points, under each moulding pressure condition, carried out 10 times mensuration, so NG checkpoint ratio represents to utilize the ratio of NG checkpoint shared in 59000 the checkpoint of formula (3400+2500) * 10=59000 calculating.

In this case, in testing fixture, be necessary to make NG checkpoint ratio smaller or equal to 0.01% in the practicality, because surpassed under 0.01% the situation in NG checkpoint ratio, sometimes can obtain for the situation that circuit substrate is thought the check result of unacceptable product by mistake that is examined as certified products, existence can not be carried out the galvanoscopic danger of the high circuit substrate of reliability.In measurement result shown in the table 6.

3. be examined the evaluation of the poor flow of circuit substrate

The testing fixture of having made is placed on track to be transported in the inspection portion of type circuit substrate self-verifying machine (STARREC V5), place the evaluation circuit substrate of having prepared 1 for testing fixture, the moulding pressure that makes track transport type circuit substrate self-verifying machine (STARREC V5) is decided to be 150kgf, for the electrode of estimating with circuit substrate 1 that is examined, under the condition of moulding pressure 150kgf with the voltage determination determination of electrode 10 conduction resistance values when current supply has been supplied with 1 milliampere electric current with the electrode pair inspection with electrode, the checkpoint of having detected more than or equal to the conduction resistance value of having set (100 Ω) is judged as the NG checkpoint, has calculated the ratio (NG checkpoint ratio) of the NG checkpoint in the global checkpoint.

Then, with circuit substrate 1, make the setting of the conduction resistance value that is judged as the NG checkpoint be changed to the resistance value lower, carried out estimating evaluation with circuit substrate 1 than 100 Ω for same evaluation.In measurement result shown in the table 7.

(embodiment 8)

In the testing fixture of embodiment 7, the spacing conversion is changed to following substrate with substrate.

Stacking material (SUNX corporate system, the name of an article: utilize Numerical Control type drilling equipment to form the through hole of 3400 circles of total of the diameter 0.2mm that on the thickness direction of stacking material, connects respectively R-1766) of the thin metal layer that the copper by thickness 18 μ m constitutes on whole of the two sides of the insulated substrate of the 0.5mm that constitutes by glass-fiber reinforced epoxy resin, have been formed.

Except the patterns of openings of the resist connection electrode used in the manufacture method of substrate in the spacing conversion of embodiment 7 is changed to the circle of diameter 200 μ m, similarly made the spacing conversion substrate 23a that upside is used.

The spacing conversion that resulting upside is used is 120mm * 160mm with the size in length and breadth of substrate 23a, thickness is 0.5mm, the about 250 μ m of diameter of the size of the part of exposing from surface of insulating layer of connection electrode 25, the projecting height from surface of insulating layer of connection electrode is about 60 μ m, dispose connection electrode 25 like this, make 1 connection electrode be examined electrode and be connected with one that is examined circuit substrate.The diameter of terminal electrode 24 is 0.4mm, and the disposition interval of terminal electrode 24 is 0.75mm, and the surfaceness of insulation course of a side that has formed the face of connection electrode 25 is 0.02 μ m.

In addition, have 2500 connection electrode 25 from the teeth outwards, have the spacing conversion substrate 23b that the downside of 2500 terminal electrodes 24 is used on overleaf with above-mentioned similarly having made.

The spacing conversion that this downside is used is 120mm * 160mm with the size in length and breadth of substrate 23b, thickness is 0.5mm, the about 250 μ m of the diameter of the part of on surface of insulating layer, exposing in the connection electrode 25, connection electrode 25 be about 60 μ m from the surface of insulating layer projecting height, dispose connection electrode 25 like this, make 1 connection electrode be examined electrode and be connected with one that is examined circuit substrate, the diameter of terminal electrode 24 is 0.4mm, the disposition interval of terminal electrode 24 is 0.75mm, and the surfaceness of the insulation course of surface (having formed the face of connection electrode) side is 0.02 μ m.

For the testing fixture of having made, utilize method similarly to Example 7, measure the permanance of minimum moulding pressure, anisotropic conductive sheet and be examined the evaluation of the poor flow of circuit substrate.In the measurement result of minimum moulding pressure shown in the table 5, in the measurement result of the permanance of the sheet of anisotropic conductive shown in the table 6, in the evaluation of the poor flow that is examined circuit substrate shown in the table 7.

(table 5)

NG checkpoint ratio (%)							Minimum moulding pressure (kgf)
								Moulding pressure (kgf)	100	110	130	150	180	210
Embodiment 7	3.9	2.0	0.17	0.01	0	0									180
							Embodiment 8	4.3	2.2	0.2	0.02	0	0	180

(table 6)

		NG checkpoint ratio (%)
							Pressurization number of times (inferior)		1	1000	5000	10000	30000
Embodiment 7	Moulding pressure 180kgf	0	0	0.09	0.22	1.4
							Moulding pressure 210kgf	0	0.02	0.13	0.25	2.1
	Embodiment 8	Moulding pressure 180kgf	0	0	0.12	0.24							1.5
Moulding pressure 210kgf							0	0.04	0.15	0.38	2.3

(table 7)

		NG checkpoint ratio (%)
									Set resistance value (Ω)		100	50	10	1	0.5	0.1	0.01
Embodiment 7	Moulding pressure 180kgf	0	0	0	0.01	0.02	4.3	9.5
									Moulding pressure 210kgf	0	0	0	0.01	0.03	4.5	9.2
	Embodiment 8	Moulding pressure 180kgf	0	0.6	4.1	Can not measure	Can not measure	Can not measure									Can not measure
Moulding pressure 210kgf									0	0.5	3.9	Can not measure	Can not measure	Can not measure	Can not measure

(embodiment 9)

(estimate and use circuit substrate)

Prepared the evaluation circuit substrate 1 of following specification.

Size: 100mm (indulging) * 100mm (horizontal stroke) * 0.8mm (thickness)

Above the number that is examined electrode of a side: 3600

Above the diameter that is examined electrode of a side: 0.3mm

Above the minimal configuration spacing that is examined electrode of a side: 0.4mm

Below the number that is examined electrode of a side: 2600

Below the diameter that is examined electrode of a side: 0.3mm

Below the minimal configuration spacing that is examined electrode of a side: 0.4mm

Made and be suitable for track and transport type circuit substrate self-verifying machine (Nidec リ-De corporate system, the name of an article: being used to of inspection portion STARREC V5) checked the circuit board inspection apparatus (Figure 30) of above-mentioned evaluation with circuit substrate.

(1) the 1st anisotropic conductive sheet 22

Having made electroconductive particle is arranging on the thickness direction and dispersed equably the 1st anisotropic conductive sheet on the face direction.

Size: 110mm * 110mm, thickness 0.1mm

Electroconductive particle: material; Carried out gold-plated nickel particles, mean particle diameter; 20 μ m, containing ratio; 18 volume %

Elastomer: material; Silicone rubber, hardness; 40

(2) spacing conversion substrate 23

Stacking material (SUNX corporate system, the name of an article: utilize Numerical Control type drilling equipment to form the through hole of 7200 circles of total of the diameter 0.1mm that on the thickness direction of stacking material, connects respectively R-1766) of the thin metal layer that the copper by thickness 18 μ m constitutes on whole of the two sides of the insulated substrate of the 0.5mm that constitutes by glass-fiber reinforced epoxy resin, have been formed.

In this case, the formation of through hole is one group with 2, with estimate with circuit substrate above being examined on the position that electrode pair answers of a side form, the gap that 0.1mm is set has formed one group through hole and (that is, has meaned the gap that is set between through hole A=0.1mm and the through hole B=0.1mm=0.1mm).

Thereafter, handle by use the copper electroplating liquid of EDTA type to carry out electroless plating for the stacking material that has formed through hole, on the inwall of each through hole, form the copper electrodeposited coating, moreover, by using the copper sulphate electroplate liquid to carry out the cathode copper electroplating processes, in each through hole, formed the via hole cylindraceous of the about 10 μ m of thickness of each thin metal layer on mutual electric connection layer laminate materials surface.

Secondly, (system should be changed in Tokyo, the name of an article: FP-225) form resist layer, the while has been disposed the protection sealant to the dry film photoresist of laminate thickness 25 μ m on the thin metal layer on stacking material surface on the thin metal layer of the another side of this stacking material.On this resist layer, disposed the photomask film,,, formed the resist pattern that etching is used by carrying out development treatment use directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for resist layer.Then, carry out etching processing by thin metal layer for the face that has formed the resist pattern, the live width that has formed 7200 connection electrode of horizontal 60 μ m, vertical 150 μ m and be electrically connected each connection electrode and via hole on the surface of insulated substrate is the pattern wiring portion of 100 μ m, secondly, removed the resist pattern.

Secondly, in the formation of stacking material on the face of one side of connection electrode and pattern wiring portion the dry film photoresist of laminate thickness 50 μ m (system should be changed in Tokyo, the name of an article: FP-225) formed resist layer, on this resist layer, disposed the photomask film, using directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for resist layer, by carrying out development treatment, 7200 openings of the rectangle of the transverse direction 60 μ m, the longitudinal direction 150 μ m that expose connection electrode have separately been formed.

Then, use the copper sulphate electroplate liquid, the thin metal layer of the another side of stacking material as common electrode, by carrying out the cathode copper electroplating processes for connection electrode separately, has been formed from 7200 outstanding connection electrode of the surface of insulation course.Secondly, removed the resist pattern.

Secondly, remove the protection sealant on the thin metal layer of another side of stacking material, (system should be changed in Tokyo to the dry film photoresist of laminate thickness 25 μ m, the name of an article: FP-225) formed resist layer on the thin metal layer of this face.Thereafter, on this resist layer, disposed the photomask film, use directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for resist layer,, formed the resist pattern that etching is used on the thin metal layer in stacking material by carrying out development treatment.

Secondly; in the formation of stacking material after having applied the protection sealant on the face of one side of connection electrode; by carrying out etching processing, on the back side of insulativity substrate, formed 7200 terminal electrodes and the pattern wiring portion that is electrically connected each terminal electrode and via hole, removed the resist pattern.

Secondly, dry film scolder resist (ニ チ go-モ-ト Application system of laminate thickness 38 μ m on the back side of the insulated substrate that has formed terminal electrode and pattern wiring portion, the name of an article: コ Application Off オ マ ス Network 2015) form insulation course, on this insulation course, disposed the photomask film, secondly, use directional light exposure machine (オ-Network is made made) to carry out after the exposure-processed for insulation course,, 7200 openings of the diameter 0.4mm that exposes electrode have been formed by carrying out development treatment.

As mentioned above, made spacing conversion substrate 23.This spacing conversion is 120mm * 160mm with the size in length and breadth of substrate 23, thickness is 0.5mm, the size of the part of exposing from surface of insulating layer of connection electrode, the about 60 μ m of transverse direction, the about 150 μ m of longitudinal direction, connection electrode be about 60 μ m from the surface of insulating layer projecting height, the separating distance that constitutes 25 of right connection electrode is 100 μ m, the diameter of terminal electrode is 0.4mm, the disposition interval of terminal electrode is 0.75mm, and the surfaceness of insulation course that has formed face one side of connection electrode is 0.02 μ m.

In addition, with similarly above-mentioned, made and have 5200 connection electrode 25 from the teeth outwards, have the spacing conversion substrate 23b that the 2nd gauging fixture 11b of 5200 terminal electrodes 24 uses on overleaf.

This spacing conversion is 120mm * 160mm with the size in length and breadth of substrate 23b, thickness is 0.5mm, the about 60 μ m of the transverse direction of the part of on surface of insulating layer, exposing in the connection electrode 25, the about 150 μ m of longitudinal direction, be about 60 μ m from the surface of insulating layer projecting height in the connection electrode 25, the separating distance that constitutes 25 of right connection electrode is 100 μ m, the diameter of terminal electrode 24 is 0.4mm, the disposition interval of terminal electrode 24 is 0.75mm, and the surfaceness of the insulation course of surface (having formed the face of connection electrode) side is 0.02 μ m.

(3) the circuit substrate side-connector 21

By use the 1st above-mentioned anisotropic conductive sheet 22 of surface one side configuration of substrate 23 in this spacing conversion, side configuration constitutes, forms the 2nd anisotropic conductive sheet 26 that the anisotropic conductive sheet of portion 72 type of outstanding secundly on a face constitutes by the conduction road by form the insulation division that these conduction roads of portion and mutual insulating form portion on a plurality of conductions road of extending on the thickness direction overleaf, has made circuit substrate side-connector 21.

Have, the 2nd anisotropic conductive sheet 26 of configuration is the shape shown in Fig. 6 between the spacing conversion is with substrate 23 and relaying pin unit 31 again, specifically, has used the anisotropic conductive sheet of following structure.

(the 2nd anisotropic conductive sheet 26)

Size: 110mm * 150mm

The thickness of conduction road formation portion 72: 0.6mm

The external diameter of conduction road formation portion 72: 0.35mm

The projecting height of conduction road formation portion 72: 0.05mm

Electroconductive particle: material; Carried out gold-plated nickel particles, mean particle diameter; 35 μ m, the containing ratio of the electroconductive particle in the conduction road formation portion 72; 30 volume %

Elastomer: material; Silicone rubber, hardness; 30

(W ₂/D ₂＝17)

(4) relaying pin unit 31

Material as the 1st insulcrete 34, middle holding plate the 36, the 2nd insulcrete 35 has used intrinsic resistance more than or equal to 1 * 10 ¹⁰The insulativity material of Ω cm is made of glass-fiber reinforced epoxy resin, and its thickness is 1.9mm.

Utilize the 1st support pin 33 (diameter 2mm, length 36.3mm) and the 2nd support pin 37 (diameter 2mm, length 3mm) carries out fixed support, make the distance L 1 between the 1st insulcrete 34 and the middle holding plate 36 be 36.3mm, distance L 2 between the 2nd insulcrete 35 and the middle holding plate 36 is 3mm, configuration through hole 83 (diameter 0.4mm) between the 1st insulcrete 34 and the 2nd insulcrete 35 makes the conduction pin 32 that is made of following structures freely move simultaneously, makes in this wise.

(conduction pin)

Material: carried out gold-plated brass

The 81a size of leading section: external diameter 0.35mm, total length 2.1mm

The size of central portion 82: external diameter 0.45mm, total length 41mm

The size of base end part 81b: external diameter 0.35mm, total length 2.1mm

Have again, be clathrate disposed the 1st support pin 33 for the 1st contact plate 38A of middle holding plate 36 and the 2nd contact plate 38B for middle holding plate 36 of the 2nd support pin 37.Have again, separating distance between the 1st contact plate 38A adjacent each other and the separating distance between the 2nd contact plate 38B are decided to be 17.5mm.

(5) the tester side-connector 41

Constituted tester side-connector 41 by the 3rd anisotropic conductive sheet 42, connector base board 43, base plate 46.Have, the 3rd anisotropic conductive sheet 42 has used and the same material of above-mentioned the 2nd anisotropic conductive sheet 26 again.

(performance test)

1. the mensuration of minimum moulding pressure

The testing fixture that has made is placed on track to be transported in the inspection portion of type circuit substrate self-verifying machine (STARREC V5), place evaluation circuit substrate 1 for testing fixture, make moulding pressure that track transports type circuit substrate self-verifying machine (STARREC V5) in the scope of 100～210kgf with stepped variation, under each moulding pressure condition, respectively measured the conduction resistance value when current supply has applied 1 milliampere electric current with the electrode pair inspection with electrode 10 times with the voltage determination electrode for the electrode of estimating with circuit substrate 1 that is examined.

The conduction resistance value of being measured is judged to be poor flow for the checkpoint (hereinafter referred to as " NG checkpoint ") more than or equal to 100 Ω, calculate the ratio (hereinafter referred to as " NG checkpoint ratio ") of the NG checkpoint in the global checkpoint, NG checkpoint ratio is decided to be minimum moulding pressure smaller or equal to 0.01% minimum moulding pressure.

In the mensuration of this conduction resistance value, after the mensuration of a conduction resistance value is through with, discharge with this and measure relevant moulding pressure, testing fixture is turned back to not pressurized state, by acting on the moulding pressure of the size of regulation once more, carried out the mensuration of next conduction resistance value.

Specifically, because estimate be examined above the circuit substrate 1 number of electrodes be 3600 points, below to be examined number of electrodes be 2600 points, under each moulding pressure condition, carried out 10 times mensuration, so NG checkpoint ratio represents to utilize the ratio of NG checkpoint shared in 62000 the checkpoint of formula (3600+2600) * 10=62000 calculating.In measurement result shown in the table 8.

2. the mensuration of the permanance of anisotropic conductive sheet

The testing fixture of having made is placed on track to be transported in the inspection portion of type circuit substrate self-verifying machine (STARREC V5), place the evaluation circuit substrate of having prepared 1 for testing fixture, the moulding pressure that makes track transport type circuit substrate self-verifying machine (STARREC V5) is decided to be 130kgf, after the pressurization of the number of times that has carried out regulation, measuring the conduction resistance value when current supply has applied 1 milliampere electric current with the electrode pair inspection with electrode under the condition of moulding pressure 130kgf 10 times for the electrode of estimating with circuit substrate 1 that is examined, the operation of voltage determination determination of electrode 10 times is similarly used in the pressurization that has repeated the number of times stipulated.

The conduction resistance value of being measured is judged to be poor flow for the checkpoint (NG checkpoint) more than or equal to 10 Ω, calculates the ratio (NG checkpoint ratio) of the NG checkpoint in the global checkpoint.

Secondly, the anisotropic conductive sheet of testing fixture is replaced by new anisotropic conductive sheet, except the moulding pressure condition is changed to the 150kgf, utilize the pressurization of the number of times of stipulating with above-mentioned same condition, thereafter, except the moulding pressure condition is decided to be the 150kgf, utilizes with above-mentioned same method and calculated NG checkpoint ratio.

When measuring the conduction resistance value relevant with the permanance of this anisotropic conductive sheet, after the mensuration of a conduction resistance value is through with, discharge with this and measure relevant moulding pressure, testing fixture is turned back to not pressurized state, by acting on the moulding pressure of the size of stipulating, carried out the mensuration of next conduction resistance value once more.

In addition, specifically, because estimate be examined above the circuit substrate 1 number of electrodes be 3600 points, below to be examined number of electrodes be 2600 points, under each moulding pressure condition, carried out 10 times mensuration, so NG checkpoint ratio represents to utilize the ratio of NG checkpoint shared in 62000 the checkpoint of formula (3600+2600) * 10=62000 calculating.

In this case, in testing fixture, be necessary to make NG checkpoint ratio smaller or equal to 0.01% in the practicality, because surpassed under 0.01% the situation in NG checkpoint ratio, sometimes can obtain for the situation that circuit substrate is thought the check result of unacceptable product by mistake that is examined as certified products, existence can not be carried out the galvanoscopic danger of the high circuit substrate of reliability.In measurement result shown in the table 9.

3. be examined the evaluation of the poor flow of circuit substrate

The testing fixture of having made is placed on track to be transported in the inspection portion of type circuit substrate self-verifying machine (STARREC V5), place the evaluation circuit substrate of having prepared 1 for testing fixture, the moulding pressure that makes track transport type circuit substrate self-verifying machine (STARREC V5) is decided to be 150kgf, for the electrode of estimating with circuit substrate 1 that is examined, under the condition of moulding pressure 150kgf with the voltage determination determination of electrode 10 conduction resistance values when current supply has been supplied with 1 milliampere electric current with the electrode pair inspection with electrode, the checkpoint of having detected more than or equal to the conduction resistance value of having set (100 Ω) is judged as the NG checkpoint, has calculated the ratio (NG checkpoint ratio) of the NG checkpoint in the global checkpoint.

Then, with circuit substrate 1, make the setting of the conduction resistance value that is judged as the NG checkpoint be changed to the resistance value lower, carried out estimating evaluation with circuit substrate 1 than 100 Ω for same evaluation.In measurement result shown in the table 10.

(embodiment 10)

The relaying pin unit 31 that has used the relaying pin unit 31a shown in Fig. 1,31b to replace embodiment 9.That is, used by on grid point, having disposed conduction pin 32a, the 32b of a plurality of (8000 pins) with certain spacing (2.54mm spacing) and having supported this conduction pin 32a, 32b and make it can be towards the relaying pin unit that the insulcrete 34a, the 34b that move up and down and 35a, 35b constitute.

About the testing fixture of having made, utilize method similarly to Example 9, measured the permanance of minimum moulding pressure and anisotropic conductive sheet.In the measurement result of minimum moulding pressure shown in the table 8, in the measurement result of the permanance of the sheet of anisotropic conductive shown in the table 9.

(embodiment 11)

In the testing fixture of embodiment 9, the spacing conversion is changed to following substrate with substrate.

Stacking material (SUNX corporate system, the name of an article: utilize Numerical Control type drilling equipment to form the through hole of 3600 circles of total of the diameter 0.2mm that on the thickness direction of stacking material, connects respectively R-1766) of the thin metal layer that the copper by thickness 18 μ m constitutes on whole of the two sides of the insulated substrate of the 0.5mm that constitutes by glass-fiber reinforced epoxy resin, have been formed.

Except the patterns of openings of the resist connection electrode used in the manufacture method of substrate in the spacing conversion of embodiment 9 is changed to the circle of diameter 200 μ m, made the spacing conversion substrate that upside is used similarly to Example 9.

The spacing conversion that resulting upside is used has 3600 connection electrode 25 from the teeth outwards with substrate, size in length and breadth is 120mm * 160mm, thickness is 0.5mm, the about 250 μ m of diameter of the size of the part of exposing from surface of insulating layer of connection electrode 25, the projecting height from surface of insulating layer of connection electrode is about 60 μ m, dispose connection electrode 25 like this, make 1 connection electrode be examined electrode and be connected with one that is examined circuit substrate.The diameter of terminal electrode 24 is 0.4mm, and the disposition interval of terminal electrode 24 is 0.75mm, and the surfaceness of insulation course of a side that has formed the face of connection electrode 25 is 0.02 μ m.

In addition, have 2600 connection electrode 25 from the teeth outwards, have the spacing conversion substrate that the downside of 2600 terminal electrodes 24 is used on overleaf with above-mentioned similarly having made.

The spacing conversion that this downside is used is 120mm * 160mm with the size in length and breadth of substrate, thickness is 0.5mm, the about 250 μ m of the diameter of the part of on surface of insulating layer, exposing in the connection electrode 25, be about 60 μ m from the surface of insulating layer projecting height in the connection electrode 25, dispose connection electrode 25 like this, make 1 connection electrode be examined electrode and be connected with one that is examined circuit substrate, the diameter of terminal electrode 24 is 0.4mm, the disposition interval of terminal electrode 24 is 0.75mm, and the surfaceness of the insulation course of surface (having formed the face of connection electrode) side is 0.02 μ m.

For the testing fixture of having made, utilize method similarly to Example 9, measured the permanance of minimum moulding pressure and anisotropic conductive sheet.In the measurement result of the permanance of the sheet of anisotropic conductive shown in the table 10, be changed to the result of the evaluation that the resistance value lower than 100 Ω carried out at the conduction resistance value that makes the NG checkpoint that is judged as the poor flow that is examined circuit substrate shown in the table 11.

Have again, under the situation of table 8 and table 9, owing to be the situation that 4 terminals are checked, so will set resistance is set at 10 Ω, under situation, owing to comprise the situation (embodiment 11) that 2 terminals are checked, be set at 100 Ω and test so will set resistance at table 10 and table 11.

(table 8)

NG checkpoint ratio (%)							Minimum moulding pressure (kgf)
								Moulding pressure (kgf)	100	110	130	150	180	210
Embodiment 9	0.2	0.03	0	0	0	0									130
							Embodiment 10	3.2	2.5	0.3	0.01	0	0	180

(table 9)

		NG checkpoint ratio (%)
							Pressurization number of times (inferior)		1	1000	5000	10000	30000
Embodiment 9	Moulding pressure 130kgf	0	0	0	0	0.2
							Moulding pressure 150kgf	0	0	0	0.04	0.5
	Embodiment 10	Moulding pressure 130kgf	0	0	0.15	0.3							1.8
Moulding pressure 150kgf							0	0.05	0.2	0.25	2.2

(table 10)

		NG checkpoint ratio (%)
							Pressurization number of times (inferior)		1	1000	5000	10000	30000
Embodiment 9	Moulding pressure 180kgf	0	0	0.08	0.25	1.5
							Moulding pressure 210kgf	0	0.02	0.13	0.27	2.0
	Embodiment 11	Moulding pressure 180kgf	0	0	0.13	0.25							1.6
Moulding pressure 210kgf							0	0.05	0.20	0.35	2.5

(table 11)

		NG checkpoint ratio (%)
									Set resistance value (Ω)		100	50	10	1	0.5	0.1	0.01
Embodiment 9	Moulding pressure 180kgf	0	0	0	0.01	0.03	4.2	8.5
									Moulding pressure 210kgf	0	0	0	0.02	0.02	3.8	9.0
	Embodiment 11	Moulding pressure 180kgf	0	0.5	4.2	Can not measure	Can not measure	Can not measure									Can not measure
Moulding pressure 210kgf									0	0.6	3.9	Can not measure	Can not measure	Can not measure	Can not measure

Claims (13)

1. the testing fixture of a circuit substrate utilizes a pair of the 1st gauging fixture and the 2nd gauging fixture to clamp as the two sides that is examined circuit substrate of checking object between two gauging fixtures and pressurize and look into to carry out electric-examination, it is characterized in that:

Above-mentioned the 1st gauging fixture and the 2nd gauging fixture possess circuit substrate side-connector, relaying pin unit and tester side-connector respectively,

Foregoing circuit substrate-side connector possesses:

Spacing conversion substrate, conversion electrode separation between a face of substrate and another face;

The 1st anisotropic conductive sheet is configured in above-mentioned spacing conversion and is examined circuit substrate one side with substrate; And

The 2nd anisotropic conductive sheet is configured in the be examined circuit substrate opposite side of above-mentioned spacing conversion with substrate,

Above-mentioned relaying pin unit possesses:

A plurality of conduction pins are with the spacing configuration of regulation; And

The 1st insulcrete of pair of separated and the 2nd insulcrete support above-mentioned conduction pin, and it can be moved on direction of principal axis,

Above-mentioned tester side-connector possesses:

Connector base board is electrically connected tester with above-mentioned relaying pin unit;

The 3rd anisotropic conductive sheet is configured in relaying pin unit one side of above-mentioned connector base board; And

Base plate is configured in the side opposite with relaying pin unit of above-mentioned connector base board,

Above-mentioned the 1st anisotropic conductive sheet is that electroconductive particle is being arranged on the thickness direction and dispersed equably anisotropic conductive sheet on the face direction.

2. the testing fixture of the circuit substrate described in claim 1 is characterized in that:

The thickness W of above-mentioned the 1st anisotropic conductive sheet ₁Be 0.03～0.5mm, the number mean particle diameter D of electroconductive particle ₁Be 3～50 μ m, thickness W ₁With number mean particle diameter D ₁Ratio W ₁/ D ₁Be 1.1～10, the elastomeric Du sieve's hardness of insulativity that constitutes the sheet matrix material is 30～90.

3. the testing fixture of the circuit substrate described in claim 1 or 2 is characterized in that:

The surfaceness with the surface that is examined the side that circuit substrate contacts of above-mentioned the 1st anisotropic conductive sheet is 0.5～5 μ m, with the spacing conversion with the surfaceness on the surface of a side of substrate contacts smaller or equal to 0.3 μ m,

The surfaceness of the insulation division in the surface of a side that contacts with the 1st anisotropic conductive sheet of above-mentioned spacing conversion usefulness substrate is smaller or equal to 0.2 μ m.

4. the testing fixture of the circuit substrate described in each of claim 1～3 is characterized in that:

The insulation division that above-mentioned the 2nd anisotropic conductive sheet is formed portion and these conduction roads are formed portion's mutual insulating by a plurality of conductions road of extending on thickness direction constitutes, only in the formation portion of conduction road, contain electroconductive particle, thus, on the face direction, disperse this electroconductive particle unevenly, and conduction road formation portion is outstanding at a face of sheet.

5. the testing fixture of the circuit substrate described in claim 4 is characterized in that:

The thickness W of the conduction road formation portion in above-mentioned the 2nd anisotropic conductive sheet ₂Be 0.1～2mm, the number mean particle diameter D of electroconductive particle ₂Be 5～200 μ m, thickness W ₂With number mean particle diameter D ₂Ratio W ₂/ D ₂Be 1.1～10, the elastomeric Du sieve's hardness of insulativity that constitutes the sheet matrix material is 15～60.

6. the testing fixture of the circuit substrate described in each of claim 1～5 is characterized in that:

The insulation division that above-mentioned the 3rd anisotropic conductive sheet is formed portion and these conduction roads are formed portion's mutual insulating by a plurality of conductions road of extending on thickness direction constitutes, only in the formation portion of conduction road, contain electroconductive particle, thus, on the face direction, disperse this electroconductive particle unevenly, and conduction road formation portion is outstanding at a face of sheet.

7. the testing fixture of the circuit substrate described in each of claim 1～6 is characterized in that:

Be provided with the connection electrode that constitutes with terminal electrode with terminal electrode and voltage by a pair of electric current in above-mentioned spacing conversion on substrate, this connection electrode is configured in spacing conversion with substrate on terminal electrode with the mode that electrode is electrically connected that respectively is examined that is examined circuit substrate with terminal electrode and voltage with above-mentioned a pair of electric current, and

On above-mentioned connector base board, disposed respectively the electric current that is electrically connected with terminal electrode with terminal electrode and voltage with the electric current of substrate with above-mentioned spacing conversion with pin side electrode and voltage pin side electrode.

8. the testing fixture of the circuit substrate described in each of claim 1～7 is characterized in that:

Above-mentioned relaying pin unit possesses:

Middle holding plate is configured between above-mentioned the 1st insulcrete and the 2nd insulcrete;

The 1st support pin is configured between above-mentioned the 1st insulcrete and the middle holding plate; And

The 2nd support pin is configured between above-mentioned the 2nd insulcrete and the middle holding plate,

And, above-mentioned the 1st support pin for the 1st contact plate of middle holding plate and above-mentioned the 2nd support pin for the 2nd contact plate of middle holding plate along different in the middle holding plate projecting plane of the thickness direction projection of middle holding plate.

9. the testing fixture of the circuit substrate described in claim 8 is characterized in that:

Between two gauging fixtures, clamp as the two sides that is examined circuit substrate of checking object and when pressurizeing utilizing a pair of the 1st gauging fixture and the 2nd gauging fixture, holding plate is center deflection on above-mentioned the 2nd insulcrete direction with the 1st contact plate for middle holding plate of above-mentioned the 1st support pin in the middle of above-mentioned, and holding plate is center deflection on above-mentioned the 1st insulcrete direction with the 2nd contact plate for middle holding plate of above-mentioned the 2nd support pin in the middle of above-mentioned.

10. the testing fixture of the circuit substrate described in claim 8 or 9 is characterized in that:

The 1st contact plate for middle holding plate of above-mentioned the 1st support pin is the clathrate configuration in the holding plate projecting plane in the middle of above-mentioned,

The 2nd contact plate for middle holding plate of above-mentioned the 2nd support pin is the clathrate configuration in the holding plate projecting plane in the middle of above-mentioned,

In above-mentioned middle holding plate projecting plane, 1 the 2nd contact plate of configuration in the unit lattice zone that constitutes by 4 the 1st adjacent contact plates, in the middle of above-mentioned, in the holding plate projecting plane, in the unit lattice zone that constitutes by 4 the 2nd adjacent contact plates, dispose 1 the 1st contact plate simultaneously.

11. the testing fixture of the circuit substrate described in each of claim 1～7 is characterized in that:

Above-mentioned relaying pin unit possesses:

Holding plate in the middle of a plurality of is configured between above-mentioned the 1st insulcrete and the 2nd insulcrete discretely with predetermined distance; And

The holding plate support pin is configured between the adjacent middle holding plate,

And, at least in the middle of 1 in the holding plate, from a face contact this centre holding plate the holding plate support pin for the contact plate of this centre holding plate and the 1st support pin, the 2nd support pin or the holding plate support pin that contact this centre holding plate from another face for the contact plate of this centre holding plate along difference the middle holding plate projecting plane of the thickness direction projection of this centre holding plate.

12. the testing fixture of the circuit substrate described in claim 11 is characterized in that:

All above-mentioned in the middle of in the holding plate, from a face contact this centre holding plate the holding plate support pin for the contact plate of this centre holding plate and the 1st support pin, the 2nd support pin or the holding plate support pin that contact this centre holding plate from another face for the contact plate of this centre holding plate along difference the middle holding plate projecting plane of the thickness direction projection of this centre holding plate.

13. the inspection method of the circuit substrate of a testing fixture that has used the circuit substrate described in the claim 1～12 is characterized in that:

Utilize a pair of the 1st gauging fixture and the 2nd gauging fixture between two gauging fixtures, to clamp as the two sides that is examined circuit substrate of checking object and pressurize and look into to carry out electric-examination.

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