JP4631621B2 - Circuit board inspection apparatus and circuit board inspection method - Google Patents

Description

  According to the present invention, a circuit board (hereinafter referred to as “circuit board to be inspected”) to be inspected for electrical inspection is clamped from both sides by a pair of first inspection jig and second inspection jig. The present invention relates to a circuit board inspection apparatus and a circuit board inspection method for inspecting the electrical characteristics of a circuit board to be inspected in a state where electrodes formed on both surfaces of the circuit board to be inspected are electrically connected to a tester.

  A printed circuit board for mounting an integrated circuit or the like is inspected for electrical characteristics in order to confirm that the wiring pattern of the circuit board has a predetermined performance before mounting the integrated circuit or the like.

In this electrical inspection, for example, an inspection head is incorporated into an inspection tester having a circuit board transport mechanism, and different circuit boards are inspected by exchanging the inspection head portion.
For example, as disclosed in Patent Document 1, a method using an inspection jig having a structure in which a metal inspection pin that is in electrical contact with an inspection target electrode of a circuit board to be inspected is implanted on the substrate is proposed. ing.

  In addition, as disclosed in Patent Document 2, there is a method using an inspection jig in which an inspection head having a conductive pin, a circuit board for pitch conversion called an off-grid adapter, and an anisotropic conductive sheet are combined. Are known.

  However, in the method using an inspection jig in which a metal inspection pin is brought into direct contact with an inspected electrode of a circuit board to be inspected as in Patent Document 1, the electrode of the inspected circuit board is damaged by contact with a conductive pin made of metal. there's a possibility that.

  In particular, in recent years, circuit circuit boards have been miniaturized and densified, and when inspecting such a printed circuit board, in order to bring a large number of conductive pins into conductive contact simultaneously with the electrodes to be inspected of the circuit board to be inspected. It is necessary to press the inspection jig with a high pressure, and the electrode to be inspected is easily damaged.

  In such an inspection jig for inspecting a miniaturized and high-density printed circuit board, it is becoming technically difficult to implant a large number of high-density metal pins on the board. In addition, the manufacturing cost is expensive, and it is difficult to repair or replace some of the metal pins when they are damaged.

  On the other hand, as in Patent Document 2, in an inspection jig using an anisotropic conductive sheet, the electrode to be inspected of the circuit board to be inspected is in contact with the electrode of the substrate for pitch conversion through the anisotropic conductive sheet. Therefore, there is an advantage that the electrode to be inspected of the circuit board to be inspected is hardly damaged. In addition, since a substrate that performs pitch conversion is used, inspection pins to be implanted on the substrate can be implanted at a pitch wider than the pitch of the electrode to be inspected on the circuit substrate to be inspected, so that inspection is performed at a fine pitch. There is an advantage that the manufacturing cost of the inspection jig can be saved without having to plant pins.

  However, in this inspection jig, since it is necessary to create a pitch conversion board and an inspection jig in which an inspection pin is implanted for each circuit board to be inspected, the circuit board to be inspected The same number of inspection jigs as the printed circuit board is required.

For this reason, in the case where a plurality of printed circuit boards are produced, there is a problem that a plurality of inspection jigs must be held correspondingly. In particular, in recent years, the product cycle of electronic devices has been shortened, and the production period of printed circuit boards used in products has been shortened. With this, inspection jigs cannot be used for a long time, There is a problem that an inspection jig must be produced each time the production of a printed circuit board is switched.

As a countermeasure against such a problem, for example, as in Patent Documents 3 to 5, an inspection apparatus using a so-called universal type inspection jig using a relay pin unit has been proposed.
FIG. 51 is a sectional view of an inspection apparatus using such a universal type inspection jig. The inspection apparatus includes a pair of a first inspection jig 111a and a second inspection jig 111b, which include circuit board side connectors 121a and 121b, relay pin units 131a and 131b, Tester side connectors 141a and 141b are provided.

  The circuit board side connectors 121a and 121b have pitch conversion boards 123a and 123b and anisotropically conductive elastomer sheets 122a, 122b, 126a and 126b arranged on both sides thereof.

  The relay pin units 131a and 131b have a large number of conductive pins 132a and 132b (for example, 5000 pins) arranged on lattice points at a constant pitch (for example, 2.54 mm pitch), and the conductive pins 132a and 132b can be moved up and down. It has a pair of insulating plates 134a and 134b to support.

  The tester-side connectors 141a and 141b include connector boards 143a and 143b that electrically connect the tester and the conductive pins 132a and 132b when the circuit board 101 to be inspected is clamped by the inspection jigs 111a and 111b. 143a, 143b has anisotropic conductive elastomer sheets 142a, 142b arranged on the conductive pins 132a, 132b side, and base plates 146a, 146b.

  The inspection jig using the relay pin unit only needs to replace the circuit board side connectors 121a and 121b with those corresponding to the circuit board 101 to be inspected when inspecting a printed circuit board which is a different object to be inspected. The relay pin units 131a and 131b and the tester side connectors 141a and 141b can be used in common.

  By the way, in recent years, circuit boards constituting LSI packages such as BGA and CSP, and circuit boards on which these semiconductor devices are mounted, in response to demands for speeding up signal transmission in electronic components and electronic devices incorporating them. There is a demand for low electrical resistance between the electrodes. Therefore, in such an electrical inspection of a circuit board, it is extremely important to measure the electrical resistance of the wiring between the electrodes with high accuracy.

  Conventionally, in measuring the electrical resistance of a circuit board, a current supply electrode and a voltage measurement electrode are pressed against each of two test electrodes 102 and 103 electrically connected to each other on a circuit board 101 to be tested. In this state, a current is supplied from the power supply device between the current supply electrodes, and the voltage signal detected by the voltage measurement electrode at this time is processed in the electric signal processing device, whereby the inspected A four-terminal method for obtaining the magnitude of the electrical resistance between the electrodes 103 and 103 is employed.

Conventionally, as an apparatus for measuring electric resistance by a four-terminal method, an electric resistance measuring apparatus in which a connecting member that contacts an electrode to be inspected is made of a conductive elastomer has been proposed.
For example, (i) Patent Document 6 discloses an electrical resistance measurement in which an elastic connection member made of conductive rubber having conductive particles bound by an elastomer is individually arranged for a current supply electrode and a voltage measurement electrode. An apparatus is disclosed, and (ii) Patent Document 7 discloses anisotropic conductivity provided so as to be in contact with both surfaces of a current supply electrode and a voltage measurement electrode that are electrically connected to the same electrode to be inspected. An electrical resistance measuring device having a common elastic connecting member made of an elastomer is disclosed. (Iii) Patent Document 8 discloses a circuit board for inspection in which a plurality of inspection electrodes are formed on the surface, and a circuit board for the inspection. An elastic connection member made of a conductive elastomer provided on the surface, and two of the test electrodes in a state where the electrode to be tested is electrically connected to the plurality of test electrodes through the connection member Select One was the current supply electrodes, the electrical resistance measuring device for measuring the electrical resistance is disclosed and the other as an electrode for voltage measurement.

  According to such an electrical resistance measurement device, the current supply electrode and the voltage measurement electrode are brought into contact with the electrode to be inspected of the circuit board to be inspected via the elastic connection member, thereby making electrical connection. Thus, the electrical resistance can be measured without damaging the electrode to be inspected.

However, when measuring the electrical resistance between the electrodes by the electrical resistance measuring device having the configuration of (i) and (ii), there are the following problems.
In recent years, in a circuit board, in order to obtain a high degree of integration, the size and pitch of electrodes or the distance between electrodes tend to be small. Thus, in the electrical resistance measuring apparatus having the configurations of (i) and (ii), a current is supplied to each of the electrodes to be inspected on the circuit board to be inspected whose electrical resistance is to be measured via the elastic connection member. Both the electrode for voltage and the electrode for voltage measurement need to be electrically connected simultaneously. Therefore, in the electrical resistance measuring device for measuring the electrical resistance of the circuit board to be inspected in which the small size inspected electrodes are arranged at high density, Forming the current supply electrode and the voltage measurement electrode in a state of being separated from each other in a region having an area equal to or smaller than the region occupied by the electrode to be inspected, that is, supplying a current having a size smaller than that of the electrode to be inspected. It is necessary to form the working electrode and the voltage measuring electrode in a state of being separated by a very small distance.

  In addition, as a method for manufacturing a circuit board, in order to improve productivity, a circuit board connected body in which a plurality of circuit boards are connected with one board material is manufactured, and in that state, the circuit board connected body A method of manufacturing a plurality of separated circuit boards by collectively performing electrical inspection on each circuit board and then cutting the circuit board connector is adopted.

  However, the circuit board assembly to be inspected has a considerably large area and the number of electrodes to be inspected is extremely large. In particular, when manufacturing a multilayer circuit board, the number of steps in the manufacturing process is large. In many cases, the thermal history due to the heat treatment is frequently received, and thus the electrode to be inspected is often formed in a state of being displaced from the intended arrangement position. As described above, the circuit board to be inspected having a large area, a large number of electrodes to be inspected, and the electrodes to be inspected formed in a state shifted from the intended arrangement position is the above (i) and (ii) When measuring the electrical resistance with the electrical resistance measuring device having the configuration of), it is extremely difficult to electrically connect both the current supply electrode and the voltage measurement electrode to each of the electrodes to be inspected simultaneously. .

  To explain with a specific example, as shown in FIG. 52, when measuring the electrical resistance of the electrode T to be inspected having a diameter L of 300 μm, the current electrically connected to the electrode T to be inspected The separation distance D between the supply electrode A and the voltage measurement electrode V is about 150 μm. However, as shown in FIGS. 53 (a) and (b), in the alignment of the circuit board to be inspected, the current supply electrode A and When the position of the electrode T to be inspected with respect to the voltage measuring electrode V deviates by 75 μm from the intended position shown in FIG. 52 in the direction in which the current supplying electrode A and the voltage measuring electrode V are arranged, the current supplying electrode A and the voltage The electrical connection between any one of the measurement electrodes V and the electrode T to be inspected is not achieved, and the required electrical resistance measurement cannot be performed.

  As a means for solving such a problem, it is conceivable to reduce the distance D between the current supply electrode A and the voltage measurement electrode V, for example, 100 μm or less. This is extremely difficult in practice.

On the other hand, according to the electrical resistance measuring device of (iii) above, it is not necessary to form a current supply electrode and a voltage measurement electrode corresponding to each of the electrodes to be inspected. Even if the circuit board to be inspected has a large area, a large number of electrodes to be inspected, and a small size of the electrodes to be inspected arranged at high density, the positional deviation from the circuit board to be inspected And the electrical resistance measuring device can be easily manufactured.

  However, since such an electric resistance measuring device is a measuring device based on a pseudo four-terminal method, it has a large measurement error range. Therefore, the measurement of the electric resistance of a circuit board having a low electric resistance between the electrodes is performed. Is difficult to perform with high accuracy.

  In order to solve such problems, an electrical resistance measurement connector is proposed in which a plurality of connection electrode pairs including a core electrode and a ring electrode provided so as to surround the core electrode are formed on the surface of the insulating substrate. (See Patent Document 9).

  According to such an electrical resistance measurement connector, when alignment is performed so that at least a part of the core electrode is positioned on the electrode to be inspected on the circuit board on which the electrical resistance is to be measured, on the electrode to be inspected. In this case, at least a part of the ring electrode is positioned. Therefore, even if the circuit board has a large number of small electrodes to be inspected with a large area, electrical connection of both the core electrode and the ring electrode to the electrode to be inspected can be reliably achieved. Further, by using one of the ring-shaped electrodes as a current supply electrode and the other as a voltage measuring electrode, the electrical resistance of the circuit board can be reliably measured with high accuracy.

However, the electrical resistance measuring connector has a problem that the whole structure is complicated and it is difficult to manufacture the connector with a high yield.
In addition, a printed wiring board, which is one of the circuit boards 101 to be inspected by an inspection apparatus as shown in FIG. 51, has become multi-layered, and actually, in the thickness direction, for example, solder such as BGA. There are height variations and warpage of the substrate itself due to the electrodes 102 and 103 such as ball electrodes. Therefore, in order to achieve electrical connection to the electrodes 102 and 103 to be inspected, which are inspection points on the circuit board 101 to be inspected, the first inspection jig 111a and the second inspection jig 111b are moved at a high pressure. It is necessary to deform the circuit board 101 to be inspected flatly by applying pressure. In addition, for the height variations of the electrodes 102 and 103 to be inspected, it is necessary to follow the heights of the electrodes 102 and 103 to be inspected by the first inspection jig 111a and the second inspection jig 111b.

  In such a conventional universal type inspection jig, in order to ensure followability with respect to the height of the electrodes 102 and 103 to be inspected, the conductive pins 132a and 132b are followed by movement in the axial direction. Since the amount of movement in the axial direction of 132a and 132b is also limited, the following ability to the height of the electrodes 102 and 103 to be inspected may not be good, and a continuity failure occurs and accurate inspection cannot be performed. Become.

  Further, in such a universal type inspection jig, the press pressure when the circuit board 101 to be inspected is clamped by the first inspection jig 111a and the second inspection jig 111b is different in the upper and lower directions. The conductive sheet 122a, 122b, 126a, 126b, 142a, 142b absorbs.

Therefore, in such a universal type inspection jig, the pitch conversion substrate 123a is used.
In order to support 123b and disperse the press pressure, it is necessary to dispose the conductive pins 132a and 132b at regular intervals.

  Further, in the conventional universal type inspection jig, the press pressure is received by the conductive pins 132a and 132b, so that it is necessary to arrange a large number of conductive pins 132a and 132b at regular intervals.

  For this reason, in response to the miniaturization of the electrodes of the circuit board 101 to be inspected, for example, when forming the insulating plates 134a and 134b having 10,000 or more through holes at a pitch of 0.75 mm, the substrates of the insulating plates 134a and 134b If the thickness of the insulating plate 134 is thin, the strength becomes low, and it may crack when bent. Therefore, it is necessary to make the insulating plates 134a and 134b thicker.

  However, when the diameter of the through hole to be formed becomes as fine as, for example, about 0.5 mm, and the thickness of the insulating plates 134a and 134b is 5 mm or more, when trying to form the through hole by one drilling process, Due to the strength of the drill blade, there are many cases where the drill blade is broken or broken and fails to process the insulating plate.

For this reason, the insulating plate is processed by drilling from one side of the insulating plate to about half the thickness, and further forming the through hole by drilling the same part from the other side. There is a problem that a drilling operation twice as many as the number of through holes formed in the insulating plate is required, and the processing step becomes complicated.
JP-A-6-94768 Japanese Patent Laid-Open No. 5-159821 JP 7-248350 A Japanese Patent Application Laid-Open No. 8-271469 JP-A-8-338858 JP-A-9-26446 JP 2000-74965 A JP 2000-241485 A JP 2003-322665 A

  The present invention ensures the required electrical connection to the circuit board to be inspected even if the circuit board to be inspected has a large area and a large number of small electrodes to be inspected. An object of the present invention is to provide a circuit board inspection apparatus that can achieve the desired electrical resistance measurement with high accuracy and can manufacture an inspection apparatus at low cost. .

  The present invention provides a circuit board inspection apparatus that has good followability with respect to the height variation of the inspection target electrode of the circuit board to be inspected, does not cause poor conduction, and can perform an accurate inspection. The purpose is to provide.

SUMMARY OF THE INVENTION An object of the present invention is to provide a circuit board inspection apparatus that absorbs a level difference caused by an electrode to be inspected on a circuit board to be inspected and has high repeated use durability.
According to the present invention, there is no need to arrange the conductive pins at regular intervals. Therefore, there is little drilling work by drilling through holes in the insulating plate holding the conductive pins, and the cost of the circuit board can be reduced. An object is to provide an inspection device.

The present invention ensures the required electrical connection to the circuit board to be inspected even if the circuit board to be inspected has a large area and a large number of small electrodes to be inspected. Another object of the present invention is to provide a method for inspecting a circuit board that can be achieved and that can reliably perform a desired measurement of electric resistance with high accuracy.

An object of the present invention is to provide a method for inspecting a circuit board that absorbs a level difference caused by an electrode to be inspected on the circuit board to be inspected and has high durability for repeated use.
The present invention provides a circuit board inspection method that has good followability with respect to the height variation of the inspected electrode of the circuit board to be inspected, does not cause poor conduction, and can perform an accurate inspection. The purpose is to provide.

The circuit board inspection apparatus of the present invention performs electrical inspection by sandwiching both surfaces of the circuit board to be inspected between the two inspection jigs by a pair of first inspection jig and second inspection jig. A circuit board inspection apparatus for performing
The first inspection jig and the second inspection jig are respectively
(i) A flexible insulating sheet in which a plurality of through holes are formed in accordance with a pattern of electrodes to be inspected on a circuit board to be inspected, and a plurality of ring electrodes formed so as to surround the through holes on the surface of the insulating sheet A relay electrode formed on the back surface of the insulating sheet and electrically connected to the ring-shaped electrode, and an electrode sheet,
A first anisotropic conductive elastomer sheet disposed on the surface of the electrode sheet, in which conductive particles are arranged in the thickness direction and uniformly dispersed in the plane direction;
A second anisotropic conductive elastomer disposed on the back surface of the electrode sheet, wherein a plurality of through holes are formed according to the pattern of the electrode to be inspected, and conductive particles are arranged in the thickness direction and uniformly dispersed in the surface direction. Sheet,
The plurality of through-holes disposed on the back surface of the second anisotropically conductive elastomer sheet and formed in the substrate are composed of an insulating portion made of an elastic polymer material and an elastic polymer material containing conductive particles. A plurality of conductive path forming portions penetrating the insulating portion in the thickness direction, wherein the conductive path forming portions are a plurality of conductive path forming portions for inspection arranged according to a pattern of the electrode to be inspected, and the electrode sheet A plurality of connection conductive path forming portions arranged according to the pattern of the relay electrode in the relay board,
A pitch conversion substrate that is disposed on the back surface of the relay substrate and converts the electrode pitch between the one surface side and the other surface side of the substrate;
A third anisotropically conductive elastomer sheet disposed on the back surface of the pitch conversion substrate;
A circuit board-side connector with
(ii) a plurality of conductive pins arranged at a predetermined pitch;
A pair of spaced apart first and second insulating plates for supporting the conductive pins movably in the axial direction;
A relay pin unit with
(iii) a connector board for electrically connecting the tester and the relay pin unit;
A fourth anisotropic conductive elastomer sheet disposed on the relay pin unit side of the connector board;
A base plate disposed on the side opposite to the relay pin unit of the connector board;
A tester side connector with
It is characterized by providing.

  In the above invention, the inspection conductive path forming portion enters the through hole of the second anisotropic conductive elastomer sheet and the through hole of the insulating sheet in the electrode sheet, and the first anisotropic conductive elastomer. It is electrically connected to the electrode to be inspected through a sheet.

In a preferred aspect of the invention described above, the pitch conversion substrate includes a plurality of a pair of electrode pairs in which one electrode protrudes in the thickness direction from the other electrode on the surface on the relay substrate side,
The protruding one electrode is arranged according to the pattern of the inspection conductive path forming portion, and the other electrode is arranged according to the pattern of the connecting conductive path forming portion,
Forming the inspection conductive path of the relay substrate pressed by the ring-shaped electrode of the electrode sheet and the protruding one electrode of the pitch conversion substrate on each of the electrodes to be inspected in the circuit substrate to be inspected Are electrically connected to each other at the same time to enable measurement,
In this measurable state, one of the protruding electrode and the other electrode on the pitch conversion substrate is used as a current supply electrode, and the other electrode is used as a voltage measurement electrode. As a result, the electrical resistance of one designated electrode to be inspected is measured.

  According to the above invention, the insulating sheet in the electrode sheet is formed with a through hole into which the inspection conductive path forming portion in the relay substrate enters, and a ring is formed around the through hole so as to surround the through hole. If the alignment is made so that at least a part of the conductive path forming portion for inspection is positioned on the electrode to be inspected on the circuit board whose electrical resistance is to be measured, At least a part of the ring-shaped electrode is positioned on the surface.

  Therefore, even if the circuit board has a large area and a large number of small electrodes to be inspected, it is possible to reliably achieve the electrical connection of both the inspection conductive path forming portion and the ring electrode to the electrodes to be inspected. Can do.

  Moreover, since the conductive path forming part for inspection and the conductive path forming part for connection electrically connected to the ring electrode via the relay electrode are electrically independent from each other, Of the electrically connected conductive path forming portion for inspection and the conductive path forming portion for connection, one is electrically connected to the current supply electrode on the pitch conversion substrate, and the other is electrically connected to the voltage measuring electrode. By connecting, the electrical resistance of the circuit board to be inspected can be measured with high accuracy.

  Moreover, since the electrode sheet and the relay board have simple structures, the circuit board-side connector can be manufactured at low cost. Therefore, it is possible to reduce the inspection cost in measuring the electric resistance of the circuit board.

  In the circuit board inspection apparatus of the present invention, a contact member is provided on an end surface of the relay substrate on the side of the circuit board to be inspected of the inspection conductive path formation portion and the connection conductive path formation portion. Is preferred.

  By doing in this way, the favorable electrical connection of the electrically conductive path formation part for a test | inspection and a 1st anisotropically conductive elastomer sheet, and the electrically conductive path formation part for a connection and a 2nd anisotropically conductive elastomer sheet is ensured. The

It is preferable that a side portion of the contact member is fixed to the insulating portion and held on end surfaces of the inspection conductive path forming portion and the connection conductive path forming portion.
By doing in this way, peeling of the metal film due to repeated inspection can be sufficiently suppressed, and high repeated use durability can be obtained.

In the circuit board inspection apparatus of the present invention, the relay pin unit is
An intermediate holding plate disposed between the first insulating plate and the second insulating plate;
A first support pin disposed between the first insulating plate and the intermediate holding plate;
A second support pin disposed between the second insulating plate and the intermediate holding plate;
With
A first abutment support position of the first support pin with respect to the intermediate holding plate and a second abutment support position of the second support pin with respect to the intermediate holding plate are projected in the thickness direction of the intermediate holding plate. The intermediate holding plate is disposed at different positions on the projection plane.

  With this configuration, when electrical inspection is performed by sandwiching both surfaces of the circuit board to be inspected between the first inspection jig and the second inspection jig, initial pressure is applied. In the stage, the relay pin unit is moved in the thickness direction by the conductive pins, the elastic portion of the relay board, the first and second anisotropic conductive elastomer sheets, the third anisotropic conductive elastomer sheet, The pressure is absorbed by the rubber elastic compression of the anisotropic conductive elastomer sheet 4, and the height variation of the inspected electrode of the inspected circuit board can be absorbed to some extent.

  The first contact support position of the first support pin with respect to the intermediate holding plate and the second contact support position of the second support pin with respect to the intermediate support plate are in the thickness direction of the intermediate support plate. Since it is arranged at different positions on the projected intermediate holding plate projection surface, when the circuit board to be inspected is further pressurized between the first inspection jig and the second inspection jig, In addition to the elastic elastic compression of the relay substrate, the first and second anisotropic conductive elastomer sheets, the third anisotropic conductive elastomer sheet, and the fourth anisotropic conductive elastomer sheet, the relay Due to the spring elasticity of the first insulating plate, the second insulating plate, and the intermediate holding plate disposed between the first insulating plate and the second insulating plate of the pin unit, the height of the electrode to be inspected of the circuit board to be inspected is increased. Variation, for example, solder ball electrode height variation In contrast, by dispersing pressure concentration, it can be avoided local stress concentration.

  As a result, stable electrical contact is ensured for each of the electrodes to be inspected on the circuit board to be inspected having a height variation, and stress concentration is further reduced. Local breakage of the conductive elastomer sheet and the elastic portion of the relay substrate is suppressed. As a result, since the repeated use durability of the first and second anisotropic conductive elastomer sheets and the relay substrate is improved, the number of times of replacement is reduced, and the inspection work efficiency is improved.

Moreover, since there is no need to arrange the conductive pins at regular intervals, there is little drilling work by drilling through holes in the insulating plate holding the conductive pins, and the cost can be reduced.
The circuit board inspection apparatus according to the present invention includes:
When the both sides of the circuit board to be inspected are clamped between the two inspection jigs by the pair of the first inspection jig and the second inspection jig,
The intermediate holding plate bends in the direction of the second insulating plate around the first contact support position of the first support pin with respect to the intermediate holding plate, and
The intermediate holding plate bends in the direction of the first insulating plate around the second contact support position of the second support pin with respect to the intermediate holding plate.

  By configuring in this way, the intermediate holding plate bends in opposite directions with the first contact support position and the second contact support position as the center, so the first inspection jig and the second inspection plate When the circuit board to be inspected is further pressed between the inspection jigs, the spring elastic force of the intermediate holding plate is further exerted, and the height of the electrode to be inspected of the circuit board to be inspected The pressure concentration can be dispersed and the local stress concentration can be avoided against the variation, and the local breakage of the elastic portions of the first and second anisotropic conductive elastomer sheets and the relay substrate is suppressed. . As a result, since the repeated use durability of the first and second anisotropic conductive elastomer sheets and the relay substrate is improved, the number of times of replacement is reduced, and the inspection work efficiency is improved.

In the circuit board inspection apparatus of the present invention, the first contact support positions of the first support pins with respect to the intermediate holding plate are arranged in a grid pattern on the intermediate holding plate projection surface,
Second contact support positions of the second support pins with respect to the intermediate holding plate are arranged in a grid pattern on the intermediate holding plate projection surface,
In the intermediate holding plate projection surface, one second abutment support position is disposed in a unit lattice region composed of four adjacent first abutment support positions, and
In the intermediate holding plate projection surface, one first abutment support position is arranged in a unit cell region composed of four adjacent second abutment support positions.

  With this configuration, the first abutment support position and the second abutment support position are arranged in a grid pattern, and the grid points of the first abutment support position and the second abutment support position are arranged. The positions are all arranged at positions shifted.

  Accordingly, the intermediate holding plate bends in opposite directions around the first contact support position and the second contact support position, and the first inspection jig and the second inspection jig. When the circuit board to be inspected is pressed between the two, the spring elastic force of the intermediate holding plate is further exerted, and the pressure against the height variation of the electrode to be inspected of the circuit board to be inspected The concentration can be distributed to further avoid local stress concentrations. Therefore, local breakage of the elastic portions of the first and second anisotropic conductive elastomer sheets and the relay substrate is suppressed, and as a result, the first and second anisotropic conductive elastomer sheets and the relay substrate are repeatedly used. Since durability is improved, the number of times of replacement is reduced and inspection work efficiency is improved.

In the circuit board inspection apparatus of the present invention, the relay pin unit is
A plurality of intermediate holding plates disposed at a predetermined interval between the first insulating plate and the second insulating plate;
A first support pin disposed between the first insulating plate and the intermediate holding plate;
A second support pin disposed between the second insulating plate and the intermediate holding plate;
Holding plate support pins arranged between adjacent intermediate holding plates;
With
In at least one intermediate holding plate, a holding support position of the holding plate support pin that contacts the intermediate holding plate from one surface side with respect to the intermediate holding plate, and a first surface that contacts the intermediate holding plate from the other surface side. The support support position of the first support pin, the second support pin, or the holding plate support pin with respect to the intermediate holding plate is arranged at a different position on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate. It is characterized by being.

  With this configuration, the spring elasticity is further exhibited by the plurality of intermediate holding plates, and the pressure concentration is dispersed with respect to the height variation of the inspected electrode of the inspected circuit board. Local stress concentration can be further avoided, and local damage to the elastic portions of the first and second anisotropic conductive elastomer sheets and the relay substrate is suppressed. As a result, since the repeated use durability of the first and second anisotropic conductive elastomer sheets and the relay substrate is improved, the number of times of replacement is reduced, and the inspection work efficiency is improved.

  Further, the circuit board inspection apparatus according to the present invention includes a contact support position of the support plate support pin that contacts the intermediate support plate from one surface side with respect to the intermediate support plate, and the intermediate support plate. A contact support position of the first support pin, the second support pin, or the holding plate support pin that contacts the holding plate from the other surface side with respect to the intermediate holding plate is in the thickness direction of the intermediate holding plate. It is arranged at different positions on the projected intermediate holding plate projection surface.

As a result, the abutting support position of the holding plate support pin with the intermediate holding plate is shifted between the adjacent intermediate holding plates, so that the spring elasticity of the plurality of intermediate holding plates is further exhibited. Therefore, the first and second anisotropic conductive elastomers can further avoid the local stress concentration by distributing the pressure concentration with respect to the height variation of the electrodes to be inspected of the circuit board to be inspected. Local breakage of the elastic portions of the sheet and the relay substrate is suppressed. As a result, since the repeated use durability of the first and second anisotropic conductive elastomer sheets and the relay substrate is improved, the number of times of replacement is reduced, and the inspection work efficiency is improved.

  In the circuit board inspection apparatus according to the present invention, the third anisotropic conductive elastomer sheet includes a plurality of conductive path forming portions extending in a thickness direction, and an insulating portion that insulates the conductive path forming portions from each other. The conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are dispersed non-uniformly in the surface direction, and the conductive path forming portion protrudes on one side of the sheet. To do.

  In the circuit board inspection apparatus according to the present invention, the fourth anisotropic conductive elastomer sheet includes a plurality of conductive path forming portions extending in a thickness direction, and an insulating portion that insulates the conductive path forming portions from each other. The conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are dispersed non-uniformly in the surface direction, and the conductive path forming portion protrudes on one side of the sheet. To do.

  As described above, the third anisotropic conductive elastomer sheet and the fourth anisotropic conductive elastomer sheet are composed of the conductive path forming portion and the insulating portion, and the conductive particles are contained only in the conductive path forming portion. By using unevenly distributed anisotropic conductive sheets that are unevenly distributed in the surface direction and the conductive path forming part protrudes on one side of the sheet, these sheets absorb pressure and impact due to the pressing of the inspection jig. This suppresses deterioration of the elastic portions of the first and second anisotropic conductive elastomer sheets and the relay substrate.

In one aspect of the present invention, the plurality of conductive pins are formed on a rod-shaped central portion that is shorter than the distance between the first insulating plate and the second insulating plate, and on both ends of the central portion. It consists of a pair of end portions having a smaller diameter than the central portion,
The pair of end portions are respectively inserted through through-holes having a diameter smaller than that of the central portion formed in the first insulating plate and the second insulating plate and larger than that of the pair of end portions. Thus, the conductive pin is supported so as to be movable in the axial direction.

With such a configuration, the conductive pin can be held between the first insulating plate and the second insulating plate so as to be movable in the axial direction and not to drop off.
In another aspect of the present invention, the conductive pin is inserted between the first insulating plate and the intermediate holding plate, between the second insulating plate and the intermediate holding plate, or between the intermediate holding plates. A bent holding plate in which a through hole is formed is provided,
The plurality of conductive pins are pressed laterally in opposite directions from each other with a through hole formed in the first and second insulating plates and a through hole formed in the bent holding plate as fulcrums. It is bent at the position of the through hole of the holding plate, and thereby the conductive pin is supported so as to be movable in the axial direction.

  With such a configuration, the conductive pin can be held between the first insulating plate and the second insulating plate so as to be movable in the axial direction and not to drop off. Furthermore, since the pin having a simple structure having a cylindrical shape can be used as the conductive pin, the cost of the conductive pin and the member holding the conductive pin as a whole can be suppressed.

The circuit board inspection method of the present invention is a circuit board inspection method using the circuit board inspection apparatus described above,
The electrical inspection is performed by sandwiching both surfaces of the circuit board to be inspected between the two inspection jigs by the pair of the first inspection jig and the second inspection jig.

  According to the circuit board inspection apparatus of the present invention, even if the circuit board to be measured whose electrical resistance is to be measured has a large area and a large number of small electrodes to be tested, The required electrical connection can be reliably achieved, the intended electrical resistance can be measured with high accuracy and the inspection device can be manufactured at low cost.

  The circuit board inspection apparatus of the present invention has good followability with respect to the height variation of the inspected electrode of the inspected circuit board to be inspected, does not cause poor conduction, and can perform an accurate inspection. is there.

The circuit board inspection apparatus according to the present invention absorbs a level difference caused by an electrode to be inspected on a circuit board to be inspected, and has high durability for repeated use.
According to the circuit board inspection apparatus of the present invention, there is no need to arrange the conductive pins at regular intervals, and therefore, there is little drilling work by drilling through holes in the insulating plate holding the conductive pins, and the cost is reduced. Is possible.

  According to the circuit board inspection method of the present invention, even if the circuit board to be inspected whose electrical resistance is to be measured has a large area and a large number of small electrodes to be inspected, the circuit board is inspected. The required electrical connection can be reliably achieved, and the intended electrical resistance can be reliably measured with high accuracy.

According to the method for inspecting a circuit board of the present invention, it is possible to satisfactorily absorb a step due to the inspected electrode of the inspected circuit board and perform electrical inspection with high repeated use durability.
According to the method for inspecting a circuit board of the present invention, it is possible to carry out an accurate inspection with good followability with respect to the height variation of the inspected electrode of the inspected circuit board to be inspected, without causing poor conduction. Is possible.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, a pair of identical components in the first inspection jig and the second inspection jig (for example, the circuit board side connector 21a and the circuit board side connector 21b, the first anisotropic conductive elastomer sheet) 22a and the first anisotropic conductive elastomer sheet 22b, etc., may be omitted (for example, the first anisotropic conductive elastomer sheet 22a and the first anisotropic conductive elastomer sheet 22a and the first anisotropic conductive elastomer sheet 22b). The first anisotropic conductive elastomer sheet 22b may be collectively referred to as “first anisotropic conductive elastomer sheet 22”).

FIG. 1 is a cross-sectional view showing an embodiment of the inspection apparatus of the present invention, and FIG. 2 is a cross-sectional view showing a laminated state when the inspection apparatus of FIG. 1 is used for inspection.
This inspection apparatus performs an electrical inspection of a circuit board to be inspected by measuring an electrical resistance between electrodes to be inspected in a circuit board 1 to be inspected such as a printed circuit board for mounting an integrated circuit or the like. Is.

  In this inspection apparatus, as shown in FIGS. 1 and 2, the first inspection jig 11a disposed on the upper surface side of the circuit board 1 to be inspected and the second inspection jig disposed on the lower surface side. The jig 11b is disposed so as to face each other vertically.

The first inspection jig 11a includes a circuit board side connector 21a, a relay pin unit 31a, and a tester side connector 41a.
The circuit board connector 21a includes a first anisotropic conductive elastomer sheet 22a, an electrode sheet 88a, a second anisotropic conductive elastomer sheet 58a, a relay board 29a, a pitch conversion board 23a, and a third Of anisotropic conductive elastomer sheet 26a, and these are laminated in order.

  The relay pin unit 31a includes a plurality of conductive pins 32a arranged at a predetermined pitch, and these conductive pins 32a are separated by a pair of first and second insulating plates 34a and 35a. It is supported so as to be movable in the axial direction.

  The tester-side connector 41a includes a fourth anisotropic conductive elastomer sheet 42a disposed on the relay pin unit 31a side, a connector substrate 43a, and a base plate 46a, which are laminated in order. .

The second inspection jig 11b is also configured in the same manner as the first inspection jig 11a, and includes a circuit board side connector 21b, a relay pin unit 31b, and a tester side connector 41b.
The circuit board connector 21b includes a first anisotropic conductive elastomer sheet 22b, an electrode sheet 88b, a second anisotropic conductive elastomer sheet 58b, a relay board 29b, a pitch conversion board 23b, and a third Anisotropic conductive sheet 26b, and these are laminated in order.

  The relay pin unit 31b includes a plurality of conductive pins 32b arranged at a predetermined pitch, and these conductive pins 32b are separated by a pair of first and second insulating plates 34b and 35b. It is supported so as to be movable in the axial direction.

  The tester-side connector 41b includes a fourth anisotropic conductive elastomer sheet 42b disposed on the relay pin unit 31b side, a connector substrate 43b, and a base plate 46b.

An inspected electrode 2 is formed on the upper surface of the circuit board 1 to be inspected, and an inspected electrode 3 is also formed on the lower surface thereof, and these are electrically connected to each other. In the present embodiment, the electrodes 2 and 3 to be inspected are hemispherical solder ball electrodes.
<Pitch conversion board>
3 is a diagram showing the surface of the pitch conversion substrate on the circuit board side, FIG. 4 is a diagram showing the pin side surface, and FIG. 5 is a partial sectional view thereof.

  On one surface of the pitch converting substrate 23, that is, on the circuit board 1 side to be inspected, a plurality of electrodes electrically connected to the electrodes 2 and 3 to be inspected of the circuit board 1 to be inspected as shown in FIG. A connection electrode 25 is formed. These connection electrodes 25 are composed of a current supply electrode 27 and a voltage measurement electrode 28 in a four-terminal test, and a pair of current supplies to one test electrode 2 and 3 in the circuit board 1 to be tested. The electrode 27 for voltage and the electrode 28 for voltage measurement are electrically connected.

  On the other hand, on the other surface of the pitch conversion substrate 23, that is, on the side opposite to the circuit board 1 to be inspected, as shown in FIG. A terminal electrode 24 is formed. These terminal electrodes 24 are, for example, 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0.2 mm. They are arranged on lattice points with a constant pitch, and the pitch is the same as the arrangement pitch of the conductive pins 32 of the relay pin unit.

  Each connection electrode 25 in FIG. 3 is electrically connected to the corresponding terminal electrode 24 in FIG. 4 by a wiring 52 and an internal wiring 53 (see FIG. 5) penetrating in the thickness direction of the insulating substrate 51.

  For example, as shown in FIG. 5, the insulating portion on the surface of the pitch conversion substrate 23 includes an insulating layer 54 formed on the surface of the insulating substrate 51 so that the connection electrodes 25 are exposed. The thickness of the insulating layer 54 is preferably 5 to 100 μm, more preferably 10 to 60 μm.

  As a material for forming the insulating substrate 51 of the pitch conversion substrate, a material generally used as a base material of a printed circuit board can be used. Specific examples include polyimide resins, glass fiber reinforced polyimide resins, glass fiber reinforced epoxy resins, glass fiber reinforced bismaleimide triazine resins, and the like.

  As a material for forming the insulating layers 54 and 55 in FIG. 5, a polymer material that can be formed into a thin film can be used. Specific examples thereof include an epoxy resin, an acrylic resin, a phenol resin, a polyimide resin, a polyamide resin, a mixture thereof, and a resist material.

  The pitch conversion substrate 23 can be manufactured, for example, as follows. First, a laminated material in which a thin metal layer is laminated on both sides of a flat insulating substrate is prepared, and a plurality of layers that penetrates in the thickness direction of the laminated material corresponding to the pattern of terminal electrodes to be formed with respect to this laminated material. The through hole is formed by a numerically controlled drilling apparatus, a photo etching process, a laser processing process, or the like.

  Next, electroless plating and electrolytic plating are performed in the through holes formed in the laminated material to form via holes connected to the thin metal layers on both sides of the substrate. Thereafter, a photoetching process is performed on the thin metal layer to form a wiring pattern and connection electrodes on the surface of the insulating substrate, and to form terminal electrodes on the opposite surface.

  Then, as shown in FIG. 5, the insulating layer 54 is formed on the surface of the insulating substrate 51 so that the connection electrodes 25 are exposed, and the terminal electrodes 24 are exposed on the opposite surface. The pitch conversion substrate 23 is obtained by forming the insulating layer 55 on the substrate. The thickness of the insulating layer 55 is preferably 5 to 100 μm, more preferably 10 to 60 μm.

  In the present embodiment, as shown in FIG. 5, the voltage measuring electrode 28 protrudes from the substrate surface. As a result, as will be described later with reference to FIG. 35 and the like, the circuit substrate 1 to be inspected and the pitch conversion substrate 23 are connected to the first anisotropic conductive elastomer sheet 22, the electrode sheet 88, and the second anisotropic conductivity at the time of electrical inspection. The current supply electrode 27 and the voltage measurement electrode 28 can be electrically connected to the electrode to be inspected of the circuit board 1 to be inspected when being pressed through the conductive elastomer sheet 58 and the relay substrate 29. It has become.

  In order to allow each of the current supply electrode 27 and the voltage measurement electrode 28 to be electrically connected to the test electrode of the circuit board 1 to be tested, the current supply electrode 27 and the voltage measurement electrode Any one of 28 may protrude from the substrate surface, and the current supply electrode 27 may protrude from the substrate surface. The protruding height of either one of the current supply electrode 27 and the voltage measuring electrode 28 with respect to the upper end of the other electrode (the protruding height h of the voltage measuring electrode 28 in FIG. 5) is: Preferably it is 0-30 micrometers.

Between the circuit board 1 to be inspected and the substrate 23 for pitch conversion, the first anisotropic conductive elastomer sheet 22, the electrode sheet 88, the second anisotropic conductive elastomer sheet 58, and the relay substrate 29 are arranged in this order. Is done. FIG. 6 shows a first anisotropic conductive elastomer sheet, an electrode sheet,
It is the fragmentary sectional view which showed the state which laminated | stacked the 2nd anisotropically conductive elastomer sheet and the relay substrate.

  The first anisotropic conductive elastomer sheet 22 is a dispersion type anisotropic conductive elastomer sheet. As shown in FIG. 13, a large number of conductive materials are contained in a sheet base material made of an insulating elastic polymer material. The particles P are contained in a state of being dispersed in the plane direction and arranged in the thickness direction.

  The electrode sheet 88 includes a flexible insulating sheet 89 in which a plurality of through holes 90 are formed according to the pattern of the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected. A plurality of ring-shaped electrodes 91 are formed so as to surround the relay sheet 92, and a relay electrode 92 electrically connected to the ring-shaped electrode 91 via the wiring portion 94 and the short-circuit portion 93 is formed on the back surface of the insulating sheet 89. Is formed.

  The second anisotropic conductive elastomer sheet 58 is a dispersive anisotropic conductive elastomer sheet similar to the first anisotropic conductive elastomer sheet 22, and has a plurality of through holes according to the pattern of the electrodes 2 and 3 to be inspected. 59 is formed.

The relay substrate 29 includes a substrate 73 in which a plurality of through holes are formed. The through holes include an insulating portion 62 made of an elastic polymer material and an elastic polymer material containing conductive particles. A plurality of conductive path forming portions 61 penetrating the insulating portion 62 in the thickness direction are formed. The conductive path forming part 61 includes a test conductive path forming part 61e arranged according to the pattern of the electrodes to be inspected 2 and 3, a connection conductive path forming part 61f arranged according to the pattern of the relay electrode 92 in the electrode sheet 88, It is composed of
<Electrode sheet>
FIG. 7 is a partial plan view of the electrode sheet, and FIG. 8 is a partial cross-sectional view of the electrode sheet. The electrode sheet 88 includes a flexible insulating sheet 89 in which a plurality of through holes 90 are formed according to the pattern of the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected.

A plurality of ring-shaped electrodes 91 are formed on the surface of the insulating sheet 89 so as to surround each of the through holes 90 of the insulating sheet 89.
A plurality of relay electrodes 92 are formed on the back surface of the insulating sheet 89 according to an appropriate pattern. In the illustrated example, each of the relay electrodes 92 is disposed at an intermediate position between the through holes 90 of the insulating sheet 89. Each of the relay electrodes 92 is electrically connected to the ring-shaped electrode 91 via a short-circuit portion 93 extending through the insulating sheet 89 in the thickness direction and a wiring portion 94 formed on the surface of the insulating sheet 89. Has been.

As a material constituting the insulating sheet 89, it is preferable to use a resin material having a high mechanical strength, and specific examples thereof include a liquid crystal polymer and polyimide.
Examples of the material constituting the ring-shaped electrode 91, the relay electrode 92, the short-circuit portion 93, and the wiring portion 94 include copper, nickel, gold, or a laminate of these metals.

Although the thickness of the insulating sheet 89 will not be specifically limited if the insulating sheet 89 has a softness | flexibility, Preferably it is 5-50 micrometers, More preferably, it is 8-25 micrometers.
The diameter of the through hole 90 of the insulating sheet 89 may be a size that allows the inspection conductive path forming portion 61e of the relay substrate 29 to be inserted, and preferably 1.05 to the diameter of the inspection conductive path forming portion 61e. It is 2 times, more preferably 1.1 to 1.7 times.

The outer diameter of the ring-shaped electrode 91 is set according to the diameter of the electrodes 2 and 3 to be inspected electrically connected to the ring-shaped electrode 91, and the electrical connection to the electrodes to be inspected 2 and 3 is reliably achieved Therefore, it is preferably 50 to 110% of the diameter of the electrodes 2 and 3 to be inspected, more preferably 70 to 1%.
00%.

  The inner diameter of the ring-shaped electrode 91 is preferably 1.1 to 2 times the diameter of the inspection core electrode 25 from the viewpoint of ensuring insulation with the conductive path forming portion 61e of the relay substrate 29. Preferably it is 1.2 to 1.7 times.

Such an electrode sheet 88 can be manufactured as follows, for example.
First, as shown in FIG. 9, a laminated material 88A in which a metal layer 94A is formed on the surface of an insulating sheet 89 is prepared. In this laminated material 88A, as shown in FIG. 10, a plurality of through holes 88H penetrating each of the insulating sheet 89 and the metal layer 94A in the thickness direction are formed according to the pattern of the short-circuit portion 93 of the electrode sheet 88 to be formed. To do.

  Next, by performing photolithography and plating on the laminated material 88A in which the through holes 88H are formed, a relay electrode 92 is formed on the back surface of the insulating sheet 89 as shown in FIG. A short-circuit portion 93 extending in the thickness direction of the insulating sheet 89 that electrically connects the metal layer 94A is formed.

Thereafter, the metal layer 94A is subjected to photolithography and etching to remove a part thereof, thereby forming a ring-shaped electrode 91 and a wiring portion 94 on the surface of the insulating sheet 89 as shown in FIG. Then, laser processing is performed on the insulating sheet 91 using the ring-shaped electrode 91 as a mask, so that the through-hole 90 is formed in the insulating sheet 91, thereby obtaining the electrode sheet 88.
<First anisotropic conductive elastomer sheet>
FIG. 13 is a partial cross-sectional view of the first anisotropic conductive elastomer sheet. This first anisotropic conductive elastomer sheet 22 is in a state in which conductive particles P exhibiting magnetism are aligned in the thickness direction to form a chain in an insulating elastic polymer material, and The chain | strand by the said electroconductive particle P is contained in the state disperse | distributed to the surface direction.

  As the elastic polymer material forming the first anisotropic conductive elastomer sheet 22, a polymer material having a crosslinked structure is preferable. Various materials can be used as the curable polymer substance-forming material that can be used to obtain such an elastic polymer substance. Specific examples thereof include polybutadiene rubber, natural rubber, and polyisoprene rubber. , Conjugated diene rubbers such as styrene-butadiene copolymer rubber and acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, blocks such as styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer, etc. Examples include copolymer rubber and hydrogenated products thereof, chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, and ethylene-propylene-diene copolymer rubber. Among these, silicone rubber is preferable from the viewpoint of durability, moldability, and electrical characteristics.

As the silicone rubber, those obtained by crosslinking or condensing liquid silicone rubber are preferable. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and may be any of a condensation type, an addition type, a vinyl group or a hydroxyl group. Good. Specific examples thereof include dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, methyl phenyl vinyl silicone raw rubber, and the like.

The silicone rubber preferably has a molecular weight Mw (referred to as a standard polystyrene-converted weight average molecular weight; the same shall apply hereinafter) of 10,000 to 40,000. In addition, since the resulting anisotropic conductive elastomer sheet has good heat resistance, the molecular weight distribution index (standard polystyrene equivalent weight average molecular weight Mw and standard polystyrene equivalent number average molecular weight Mn
The ratio Mw / Mn. same as below. ) Is preferably 2 or less.

  As the conductive particles P contained in the first anisotropic conductive elastomer sheet 22, the particles can be easily aligned in the thickness direction by a method described later, and therefore, conductive particles exhibiting magnetism are used. It is done. Specific examples of such conductive particles include particles of metal having magnetism such as iron, cobalt, nickel, particles of these alloys, particles containing these metals, or these particles as core particles, The core particles are formed by plating the surface of the core particles with a metal having good conductivity such as gold, silver, palladium, rhodium, or non-magnetic metal particles or inorganic particles such as glass beads or polymer particles. The surface of the particles may be plated with a conductive magnetic metal such as nickel or cobalt.

Of these, nickel particles are used as core particles, and the surface thereof is plated with gold having good conductivity.
The means for coating the surface of the core particles with the conductive metal is not particularly limited, and examples thereof include chemical plating or electrolytic plating, sputtering, and vapor deposition.

  In the case where a conductive particle P having a core metal surface coated with a conductive metal is used, good conductivity can be obtained. Therefore, the conductive metal coverage on the particle surface (with respect to the surface area of the core particle) The ratio of the conductive metal coating area) is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.

  The coating amount of the conductive metal is preferably 0.5 to 50% by mass of the core particles, more preferably 2 to 30% by mass, further preferably 3 to 25% by mass, and particularly preferably 4 to 20% by mass. It is. When the conductive metal to be coated is gold, the coating amount is preferably 0.5 to 30% by mass of the core particles, more preferably 2 to 20% by mass, and further preferably 3 to 15%. % By mass.

  The number average particle diameter of the conductive particles P is preferably 3 to 20 μm, more preferably 5 to 15 μm. When this number average particle diameter is too small, it may be difficult to orient the conductive particles P in the thickness direction in the production method described later. On the other hand, when the number average particle diameter is excessive, it may be difficult to obtain an anisotropic conductive elastomer sheet with high resolution.

  The particle size distribution (Dw / Dn) of the conductive particles P is preferably 1 to 10, more preferably 1.01 to 7, still more preferably 1.05 to 5, particularly preferably 1.1 to 4. It is.

  The shape of the conductive particles P is not particularly limited, but spherical particles, star-shaped particles, or secondary particles in which these particles are aggregated in that they can be easily dispersed in the polymer material-forming material. It is preferable that

  Further, as the conductive particles P, those whose surfaces are treated with a coupling agent such as a silane coupling agent or a lubricant can be appropriately used. By treating the particle surface with a coupling agent or a lubricant, the durability of the resulting anisotropic conductive elastomer sheet is improved.

Such conductive particles P are preferably contained in the anisotropic conductive elastomer sheet at a volume fraction of 10 to 40%, particularly 15 to 35%. When this ratio is too small, an anisotropic conductive elastomer sheet having sufficiently high conductivity in the thickness direction may not be obtained. On the other hand, if this ratio is excessive, the resulting anisotropic conductive elastomer sheet tends to be fragile, and the elasticity necessary for the anisotropic conductive elastomer sheet may not be obtained.

  Moreover, it is preferable that the thickness of the 1st anisotropically conductive elastomer sheet 22 is 20-100 micrometers, More preferably, it is 25-70 micrometers. When this thickness is too small, sufficient unevenness absorbing ability may not be obtained. On the other hand, if this thickness is excessive, high resolution may not be obtained.

The first anisotropic conductive elastomer sheet 22 can be manufactured as follows.
First, as shown in FIG. 14, each of the sheet-like one-side molding member 151 and the other-side molding member 152 and an opening 153K having a shape that matches the planar shape of the target first anisotropic conductive elastomer sheet 22. And a frame-shaped spacer 153 having a thickness corresponding to the thickness of the first anisotropic conductive elastomer sheet 22, and in a liquid polymer material forming material that is cured to become an elastic polymer material A conductive elastomer material containing conductive particles is prepared.

  Then, as shown in FIG. 15, a spacer 153 is arranged on the molding surface (upper surface in FIG. 15) of the other surface side molding member 152, and in the opening 153 </ b> K of the spacer 153 on the molding surface of the other surface side molding member 152. Then, the prepared conductive elastomer material 22A is applied, and then the one surface side molded member 151 is arranged on the conductive elastomer material 22A so that the molding surface (the lower surface in FIG. 15) is in contact with the conductive elastomer material 22A. To do.

  In the above, as the one side molding member 151 and the other side molding member 152, resin sheets made of polyimide resin, polyester resin, acrylic resin, or the like can be used.

  Moreover, it is preferable that the thickness of the resin sheet which comprises the one surface side molded member 151 and the other surface side molded member 152 is 50-500 micrometers, More preferably, it is 75-300 micrometers. If this thickness is less than 50 μm, the strength required for the molded member may not be obtained. On the other hand, when the thickness exceeds 500 μm, it may be difficult to apply a magnetic field having a required strength to the conductive elastomer material layer described later.

  Next, as shown in FIG. 16, using the pressure roll device 156 including the pressure roll 155 and the support roll 156, the conductive elastomer material 22 </ b> A is clamped by the one-side molding member 151 and the other-side molding member 152. Thus, the conductive elastomer material layer 22 </ b> B having a required thickness is formed between the one surface side molding member 151 and the other surface side molding member 152. In the conductive elastomer material layer 22B, as shown in an enlarged view in FIG. 17, the conductive particles P are contained in a uniformly dispersed state.

  Thereafter, for example, a pair of electromagnets are arranged on the back surface of the one-surface-side molded member 151 and the back surface of the other-surface-side molded member 152, and the electromagnets are operated to generate a parallel magnetic field in the thickness direction of the conductive elastomer material layer 22B. Make it work. As a result, in the conductive elastomer material layer 22B, the thickness of the conductive particles P dispersed in the conductive elastomer material layer 22B is maintained while being dispersed in the plane direction as shown in FIG. A chain of a plurality of conductive particles P, which are aligned in the direction and extend in the thickness direction, is formed in a state of being dispersed in the plane direction.

In this state, the conductive elastomer material layer 22B is cured so that the conductive particles P are aligned in the thickness direction in the elastic polymer substance, and
A first anisotropic conductive elastomer sheet 22 containing a chain of conductive particles P dispersed in the plane direction is manufactured.

In the above, the curing process of the conductive elastomer material layer 22B can be performed with the parallel magnetic field applied, but may be performed after the parallel magnetic field is stopped.
The intensity of the parallel magnetic field applied to the conductive elastomer material layer 22B is preferably 0.02 to 2.5 Tesla on average.

The curing treatment of the conductive elastomer material layer 22B is appropriately selected depending on the material to be used, but is usually performed by heat treatment. The specific heating temperature and heating time are appropriately selected in consideration of the type of polymer material constituting the conductive elastomer material layer 22B, the time required to move the conductive particles P, and the like.
<Second anisotropic conductive elastomer sheet>
FIG. 19 is a partial cross-sectional view of a second anisotropic conductive elastomer sheet. The second anisotropic conductive elastomer sheet 58 is in a state in which conductive particles P exhibiting magnetism are aligned in the thickness direction to form a chain in an insulating elastic polymer material, and The first anisotropic conductive elastomer sheet, except that the chain of conductive particles P is contained in a state dispersed in the plane direction, and a plurality of through holes 59 penetrating in the thickness direction are formed. 22 is basically the same configuration. The through holes 59 of the second anisotropically conductive elastomer sheet 58 are formed according to the pattern of the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected.

  The diameter of the through hole 59 of the second anisotropic conductive elastomer sheet 58 may be a size that allows the inspection conductive path forming portion 61e of the relay substrate 29 to be movably inserted, and preferably forms a conductive path for inspection. The diameter is 1.1 to 2 times, more preferably 1.2 to 1.7 times the diameter of the portion 61e.

Such a second anisotropically conductive elastomer sheet 58 is produced by a method similar to that of the first anisotropically conductive elastomer sheet 22, and then the anisotropically conductive elastomer sheet is formed into the anisotropically conductive elastomer sheet. For example, it is obtained by forming the through hole 59 by performing laser processing.
<Relay board>
FIG. 33 is a partial cross-sectional view of the relay board. The relay substrate 29 includes a substrate 73 in which a plurality of through holes 75 are formed. The through holes 75 include an insulating portion 62 made of an elastic polymer material and an elastic polymer containing conductive particles. A plurality of conductive path forming portions 61 made of a material and penetrating the insulating portion 62 in the thickness direction are formed.

  The conductive path forming part 61 includes a test conductive path forming part 61e arranged according to the pattern of the electrodes to be inspected 2 and 3, a connection conductive path forming part 61f arranged according to the pattern of the relay electrode 92 in the electrode sheet 88, It is composed of

  A contact member 64 is provided on the end surface of the inspection circuit board 1 side of the inspection conductive path forming portion 61e and the formation connecting conductive path portion 61f. By providing the contact member 64, good electrical connection with the first anisotropic conductive elastomer sheet 22 is ensured. Specific examples of the material of the contact member 64 include nickel, cobalt, copper, gold, silver, palladium, rhodium, ruthenium, iridium, platinum, tungsten, chromium, and alloys thereof.

  Further, the contact member 64 may be composed of two or more different metal layers. Even when the contact member 64 is constituted by two or more different metal layers, each metal layer can be formed of the above-described metal or alloy.

  A part of the contact member 64 is embedded in an insulating portion 62 made of silicone or the like. That is, the side part 64a of the contact member 64 is fixed to the insulating part 62, and is thereby held on the end surface of the inspection conductive path forming part 61e and the forming connection conductive path part 61f.

In this way, by fixing and holding the contact member 64 to the insulating portion 62, peeling of the contact member 64 due to repeated use for electrical inspection is sufficiently suppressed.
Specific examples of the material constituting the substrate 73 of the relay substrate include composite resin materials such as glass fiber reinforced polyimide resin, glass fiber reinforced epoxy resin, glass fiber reinforced bismaleimide triazine resin, polyimide resin, polyester resin, and polyaramid. Resin, polyamide resin, bismaleimide / triazine resin, resin material with high mechanical strength such as liquid crystal polymer, metal material such as stainless steel, fluororesin fiber, aramid fiber, polyethylene fiber, polyarylate fiber, nylon fiber, polyester fiber, liquid crystal Mention may be made of meshes made of organic fibers such as polymer fibers, non-woven fabrics, metal meshes and the like. The thickness of the substrate 73 is preferably 20 to 200 μm, more preferably 30 to 100 μm, although it depends on the forming material.

  In each of the large number of through holes 75 formed in the substrate 73, a pair of conductive path forming portions 61 corresponding to the voltage supply electrode 27 and the voltage measurement electrode 28 of the pitch conversion substrate 23, that is, a pair of test conductives. At least one or more path forming part 61e and connecting conductive path forming part 61f are arranged. The number of the pair of conductive path forming portions 61e for inspection and the conductive path forming portions 61f for connection arranged in one through hole is not particularly limited, but is preferably 1 to 4, and each through hole 75 of the substrate 73 is formed. The number may be different for each.

  In addition, as shown in the figure, the contact path member 64 protrudes from the surface of the insulating part 62 on the surface of the relay substrate 29 and the conductive path forming part 61 protrudes from the surface of the insulating part 62 on the back surface side. 61 is sufficiently compressed by pressurization, and a conductive path having a sufficiently low resistance value is reliably formed in the conductive path forming portion 61, so that a change in resistance value with respect to a change in pressure can be reduced. As a result, even if the pressure applied to each conductive path forming portion 61 of the relay substrate 29 is not uniform, it is possible to prevent variation in conductivity between the conductive path forming portions 61.

  As the elastic polymer material constituting the conductive path forming portion 61 and the insulating portion 62, a polymer material having a crosslinked structure is preferable. Specific examples of the curable polymer substance-forming material that can be used to obtain such an elastic polymer substance include polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, and acrylonitrile-butadiene. Conjugated diene rubber such as copolymer rubber and hydrogenated products thereof, block copolymer rubber such as styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer and hydrogenated products thereof, chloroprene , Urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, and the like.

Among these, it is preferable to use silicone rubber. As silicone rubber, what was demonstrated in the 1st anisotropically conductive elastomer sheet 22 mentioned above is preferable.
As the electroconductive particle P contained in the electroconductive path formation part 61, the electroconductive particle which shows magnetism is used, It is preferable to use what was demonstrated in the 1st anisotropically conductive elastomer sheet 22 mentioned above.

The number average particle diameter of the conductive particles P is preferably 1 to 100 μm, more preferably 2 to 50 μm, still more preferably 3 to 30 μm, and particularly preferably 4 to 20 μm. The particle size distribution (Dw / Dn) of the conductive particles P is preferably 1 to 10, more preferably 1.01 to 7, still more preferably 1.05 to 5, particularly preferably 1.1. ~ 4
It is.

  Such conductive particles P are contained in the conductive path forming part 61 in a volume fraction of preferably 15 to 45%, more preferably 20 to 40%. If this ratio is too small, the conductive path forming part 61 having a sufficiently small electric resistance value may not be obtained. On the other hand, when this ratio is excessive, the obtained conductive path forming part 61 is likely to be fragile, and the elasticity required for the conductive path forming part 61 may not be obtained.

  The thickness of the conductive path forming part 61 is preferably 20 to 250 μm, more preferably 30 to 200 μm. When this thickness is too small, the absorption capability with respect to the pressurization of the thickness direction becomes low. On the other hand, when the thickness is excessive, good conductivity may not be obtained.

  The protruding height of the metal film 64 on the front surface side of the insulating part 62 and the conductive path forming part 61 on the back surface side is preferably 5 to 70% of the total thickness of the conductive path forming part 61 and the metal film 64, more Preferably it is 10 to 60%.

Below, an example of the manufacturing method of the relay substrate 29 is demonstrated.
1. Formation of Composite Film As shown in FIG. 20, a resist layer 67 in which a plurality of openings 67A are formed on a thin metal layer 66 for a plating electrode by a photolithography technique according to a pattern of a conductive path forming portion to be formed. Form.

  Thereafter, as shown in FIG. 21, by using the metal thin layer 66 as a plating electrode, a portion of the metal thin layer 66 exposed from the opening 67A of the resist layer 67 is subjected to electrolytic plating, thereby forming the inside of the opening 67A of the resist layer 67. A metal mask 68 is formed on the substrate. Thereby, the composite film 69 is obtained.

  Here, as the thin metal layer 66, a metal foil, a metal plate, or the like can be used. Further, a metal foil integrated with a resin film, a thin metal layer formed on the resin film by an electroless plating method, a sputtering method, or the like can be used.

As a material of the metal thin layer 66, copper, gold, aluminum, rhodium, or the like can be used.
The thickness of the metal thin layer 66 is preferably 0.05 to 2 μm, more preferably 0.1 to 1 μm. When this thickness is too small, a uniform thin layer is not formed, which may be inappropriate as a plating electrode. On the other hand, if this thickness is excessive, it may be difficult to remove by laser processing.

The thickness of the resist layer 67 is set according to the thickness of the metal mask 68 to be formed.
As a material constituting the metal mask 68, a metal exhibiting magnetism is used. Specific examples thereof include nickel, cobalt, and alloys thereof.

The thickness of the metal mask 68 is preferably 2 μm or more, more preferably 5 to 20 μm. If this thickness is too small, it may be unsuitable as a mask for the laser.
2. Formation of Conductive Elastomer Layer As shown in FIG. 22, two composite films 69 are prepared and placed above and below the through hole 75 of the substrate 73. The through-hole 75 of the substrate 73 can be formed by a numerically controlled drilling apparatus, a photo etching process, a laser processing process, or the like.

  On the other hand, a conductive elastomer material is prepared in which conductive particles exhibiting magnetism are dispersed in a liquid elastomer material which is cured to become an elastic polymer substance. Then, as shown in FIG. 23, a conductive elastomer material is applied in the through hole 75 of the substrate 73 on which the composite film 69 is overlapped, and the pair of upper and lower composite film 69 and the through hole 75 of the substrate 73 are used. The formed space is filled with the conductive elastomer material layer 61A. Here, the conductive elastomer material layer 61 </ b> A contains conductive particles P exhibiting magnetism in a randomly dispersed state.

  Thereafter, by applying a magnetic field in the thickness direction to the conductive elastomer material layer 61A, as shown in FIG. 24, the dispersed conductive particles P are converted into a metal mask 68 made of a metal exhibiting magnetism. And are aligned so as to be aligned in the thickness direction. Due to the action of the metal mask 68 made of a metal exhibiting magnetism, the strength of the magnetic field in the region of the metal mask 68 is increased, so that the conductive particles P are oriented while concentrating on the metal mask 68 portion. Thereby, in the conductive elastomer material layer 61A, the density of the conductive particles P in the portion of the metal mask 68 is high, and the density of the conductive particles is low in the portion where the metal mask 68 is not formed.

  Then, while continuing the action of the magnetic field on the conductive elastomer material layer 61A or after stopping the action of the magnetic field, the curing process of the conductive elastomer material layer 61A is performed, as shown in FIG. Thus, the conductive elastomer layer 61B is formed which is contained in the elastic polymer material in a state in which the conductive particles P are aligned in the thickness direction.

As a method for applying the conductive elastomer material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.
The thickness of the conductive elastomer material layer 61A is set according to the thickness of the conductive path forming portion to be formed.

As means for applying a magnetic field to the conductive elastomer material layer 61A, an electromagnet, a permanent magnet, or the like can be used.
The strength of the magnetic field applied to the conductive elastomer material layer 61A is preferably 0.2 to 2.5 Tesla.

  The curing process of the conductive elastomer material layer 61A is usually performed by a heating process. The specific heating temperature and heating time are appropriately set in consideration of the type of elastomer material constituting the conductive elastomer material layer 61A, the time required to move the conductive particles, and the like.

A plurality of conductive path forming portions 61 are formed from the conductive elastomer layer 61B according to a pattern corresponding to the connection electrode 25 of the pitch conversion substrate 23.
3. Formation of Conductive Path Forming Section As shown in FIG. 26, the composite film 69 on the upper surface side is peeled off to expose one surface of the conductive elastomer layer 61B. Next, the conductive elastomer layer 61B around the conductive path forming portion 61 to be formed is removed by performing laser processing on the conductive elastomer layer 61B. Thereby, the some conductive path formation part 61 arrange | positioned according to a predetermined pattern is formed in the state hold | maintained on the composite film 69 of the lower surface side.

  Thereafter, if necessary, the conductive elastomer layer 61B other than the conductive path forming portion 61 is peeled off to leave only the conductive path forming portion 61 on the composite film 69 as shown in FIG. As shown in FIG. 27, the conductive elastomer layer 61B is left in a region within a predetermined range from the side surface of the through hole 75 of the substrate 73.

  The conductive path forming part 61 can also be formed by the method shown in FIGS. That is, by performing laser processing on the conductive elastomer layer 61B using the metal mask 68 as a laser shielding mask while leaving the upper composite film 69 as it is, as shown in FIG. The peripheral resist layer 67, the metal thin layer 66, and the conductive elastomer layer 61B are removed. As a result, a plurality of conductive path forming portions 61 arranged according to a predetermined pattern are formed while being held on the lower composite film 69.

  Thereafter, if necessary, the conductive elastomer layer 61B other than the conductive path forming portion 61 is peeled and removed to leave only the conductive path forming portion 61 on the composite film 69. Then, as shown in FIG. 29, the metal thin layer 66 and the metal mask 68 remaining from the surface of the conductive path forming portion 61 are peeled off.

In the above, the laser processing is preferably performed by a carbon dioxide laser or an ultraviolet laser, whereby the conductive path forming portion 61 having a desired form can be reliably formed.
4). Formation of Insulating Portion and Fixing of Contact Member Using the composite body obtained as described above, in which a plurality of conductive path forming portions 61 are held on the composite film 69 in the through hole 75 of the substrate 73, the following The relay substrate 29 is obtained by the process. First, as shown in FIG. 30, a film 65 in which the contact member 64 is arranged in the pattern of the conductive path forming portion 61 is prepared on the thin metal layer 63. The film 65 can be obtained by the same method as the composite film 69, and can be produced by removing the resist after obtaining the same metal-resist composite film as the composite film 69.

  A liquid insulating material layer 62A is formed on the surface of the film 65 on the side where the contact member 64 is disposed by a printing method or the like. The insulating portion material layer 62 </ b> A is integrally formed between the plurality of contact members 64.

  On the other hand, as shown in FIG. 30, the plurality of conductive path forming portions 61 are insulated in the through holes 75 of the substrate 73 with respect to the composite held on the composite film 69 in the through holes 75 of the substrate 73. The part material is applied to form the insulating part material layer 62A. The insulating portion material layer 62A is integrally formed between the plurality of conductive path forming portions 61 and the conductive elastomer layer 61B fixed to the inner surface of the through hole 75.

  Next, as shown in FIG. 31, the film 65 in which the insulating portion material layer 62 </ b> A is formed is overlaid on the substrate 73 in which the insulating portion material layer 62 </ b> A is formed in the through hole 75. At this time, the contact member 64 of the film 65 and the corresponding conductive path forming portion 61 are pressed in the vertical direction so as to overlap each other, and the insulating material layer 62A on the film 65 side and the through hole 75 of the substrate 73 are inside. The insulating part material layer 62A is integrated. Further, by applying pressure in the vertical direction, the insulating portion material is extended in the surface direction, and the insulating portion for the insulating portion 61a is formed from the upper surface of the conductive elastomer layer 61B fixed to the through hole 75 of the substrate 73 to the substrate upper surface portion 73a. The material layer 62A is formed. At this time, the conductive path forming portion 61 is contracted in the vertical direction by pressurization.

  The insulating part 62 is formed as shown in FIG. 32 by curing the insulating part material layer 62A while maintaining the pressurized state of FIG. The curing process of the insulating part material layer 62A is usually performed by a heating process. The specific heating temperature and heating time are appropriately set in consideration of the type of elastomer material constituting the insulating portion material layer 62A. After the curing process, the applied pressure is released, and the thin metal layer 63 on the upper surface side and the composite film 69 on the lower surface side are peeled off to form the upper end portion of the conductive path forming portion 61 as shown in FIG. The lower end portions of the contact member 64 and the conductive path forming portion 61 are protruded from both surfaces of the insulating portion 62.

  The insulating portion 62 is fixed to the side portion 64 a of the contact member 64, whereby the contact member 64 is held at the position on the upper surface of the conductive path forming portion 61. By doing in this way, durability is high also with respect to a repeated electrical test | inspection, and it can suppress that the contact member 64 peels from the conductive path formation part 61. FIG.

  FIG. 34 shows a state in which the pitch conversion substrate, the relay substrate, the second anisotropic conductive elastomer sheet, the electrode sheet, and the first anisotropic conductive elastomer sheet are arranged on one surface of the circuit board to be inspected. FIG. 35 is a partial cross-sectional view, and FIG. 35 shows a circuit to be inspected when a pitch conversion substrate, a relay substrate, a second anisotropic conductive elastomer sheet, an electrode sheet, and a first anisotropic conductive elastomer sheet are used during electrical inspection. It is the fragmentary sectional view which showed the state which pressed the board | substrate.

  At the time of electrical inspection, as shown in FIG. 35, each of the inspection conductive path forming portions 61e on one surface of the circuit board 1 to be inspected is disposed on the electrode 2 to be inspected of the circuit board 1 to be inspected. It is pressed by appropriate means.

  As shown in FIG. 35, each of the ring electrodes 91 in the electrode sheet 88 is electrically connected to each of the electrodes 2 to be inspected on the circuit board 1 to be inspected via the first anisotropic conductive elastomer sheet 22. Connected to.

  Further, each of the inspection conductive path forming portions 61e in the relay substrate 29 enters the through hole 59 of the second anisotropic conductive elastomer sheet 58 and the through hole 90 of the electrode sheet 88, and the first anisotropic conductive material. The elastomer sheet 22 is electrically connected to each of the electrodes 2 to be inspected of the circuit board 1 to be inspected. The inspection conductive path forming portion 61e is pushed into the through holes 59 and 90 by the voltage measuring electrode 28 protruding from the surface of the pitch converting substrate 23, whereby the inspection conductive path forming portion 61e and the connection conductive path are formed. In the formation portion 61f, electrical connection to the electrode 2 to be inspected of each circuit board 1 to be inspected is ensured in a state in which these have a step.

In addition, each of the connection conductive path forming portions 61 f of the relay substrate 29 is electrically connected to the relay electrode 92 in the electrode sheet 88 through the second anisotropic conductive elastomer sheet 58.
At this time, since the ring-shaped electrode 91 in the electrode sheet 88 is formed so as to surround the through-hole 90 of the insulating sheet 89, as shown in FIG. Even when the center position of the path forming portion 61e is deviated from the center position of the electrode 2 to be inspected, the ring-shaped electrode 91 can be used as long as the inspection conductive path forming portion 61e is electrically connected to the electrode 2 to be inspected. Are always electrically connected to the electrode 2 to be inspected.

  Although not shown in the figure, the same electrical connection is also made to the electrode 3 to be inspected on the opposite side of the electrode 2 to be inspected in the circuit board 1 to be inspected. One of the electrodes 2 and 3 is designated, and the current is supplied from the current supply electrode 27 electrically connected to the designated electrodes 2 and 3 for voltage measurement. By measuring the voltage at the electrode 28, the electrical resistance is measured for the designated electrode 2 to be inspected.

According to the above configuration, the insulating sheet 89 in the electrode sheet 88 is formed with the through hole 90 into which the inspection conductive path forming portion 61e of the relay substrate 29 enters, and the through hole 90 is formed around the through hole 90. Since the ring-shaped electrode 91 is formed so as to surround it, if alignment is performed so that at least a part of the conductive path forming portion 61e for inspection is positioned on the electrode 2 to be inspected in the circuit board 1 to be inspected, At least a part of the ring-shaped electrode 91 comes to be positioned on the inspection electrode 2, and therefore the circuit board 1 to be inspected has a large area and a small number of electrodes 2 to be inspected. The electrical connection of both the inspection conductive path forming portion 61e and the ring electrode 91 to the electrode 2 to be inspected can be reliably achieved.

  In addition, the conductive path forming part 61e for inspection and the conductive path forming part 61f for connection electrically connected to the ring electrode 91 via the relay electrode 92 are electrically independent from each other. The inspection conductive path forming portion 61e electrically connected to the electrode to be inspected 2 is electrically connected to the voltage measuring electrode 28 in the pitch conversion substrate 23, and the connection conductive path formation portion 61f is connected to the pitch conversion substrate 23. By electrically connecting to the current supply electrode 27, the electrical resistance of the circuit board 1 to be inspected can be measured with high accuracy.

Further, since the electrode sheet 88 and the relay substrate 29 have simple structures, the circuit board connector 21 can be manufactured at low cost. Therefore, it is possible to reduce the inspection cost in measuring the electric resistance of the circuit board.
<Third anisotropic conductive elastomer sheet>
As shown in FIG. 37, the third anisotropic conductive elastomer sheet 26 arranged on the pitch conversion substrate 23 on the relay pin unit 31 side has a large number of conductive particles P in an insulating elastic polymer material. Are formed of conductive path forming portions 71 that are arranged in the thickness direction and insulating portions 72 that separate the respective conductive path forming portions 71. As described above, the conductive particles P are non-uniformly dispersed in the surface direction only in the conductive path forming portion 71.

  The thickness of the conductive path forming portion 71 is preferably 0.1 to 2 mm, more preferably 0.2 to 1.5 mm. When this thickness is too small, the absorption capacity for pressurization in the thickness direction is low, absorption of the applied pressure by the inspection jig during inspection is reduced, and the effect of reducing the impact on the circuit board side connector 21 is reduced. For this reason, it becomes difficult to suppress the deterioration of the elastic portion in the relay substrate 29. As a result, the number of replacements of the relay substrate 29 during the repeated inspection of the circuit board 1 to be inspected increases, and the inspection efficiency decreases. On the other hand, if this thickness is excessive, the electrical resistance in the thickness direction tends to increase and electrical inspection may be difficult.

  The thickness of the insulating part 72 is preferably substantially the same as or smaller than the thickness of the conductive path forming part 71. As shown in FIG. 37, the thickness of the insulating part 72 is made smaller than the thickness of the conductive path forming part 71, and the conductive path forming part 71 forms a projecting part 71a protruding from the insulating part 72. Since the conductive path forming portion 72 is easily deformed by pressurization and the pressure absorption capacity is increased, the pressure applied by the inspection jig is absorbed during the inspection, and the impact of the circuit board connector 21 is reduced. can do.

  When magnetic conductive particles are used for the conductive particles P of the third anisotropic conductive elastomer sheet 26, the number average particle diameter is preferably 5 to 200 μm, more preferably 5 to 150 μm, and still more preferably 10 to 10 μm. 100 μm. Here, the “number average particle diameter of the magnetic conductive particles” means that measured by a laser diffraction scattering method. When the number average particle diameter of the magnetic conductive particles is 5 μm or more, the pressure deformation of the conductive path forming portion 71 is facilitated. Further, when the magnetic conductive particles are oriented by a magnetic field orientation process in the manufacturing process, the magnetic conductive particles are easily oriented. When the number average particle diameter of the magnetic conductive particles is 200 μm or less, the conductivity of the conductive path forming portion 71 is good and pressure deformation is easy.

The ratio W ₂ / D ₂ between the thickness W ₂ (μm) of the conductive path forming portion 71 and the number average particle diameter D ₂ (μm) of the magnetic conductive particles is preferably 1.1-10.
When the ratio W ₂ / D ₂ is less than 1.1, the diameter of the magnetic conductive particles is equal to or larger than the thickness of the conductive path forming portion 71, and therefore the elasticity of the conductive path forming portion 71 is low. Thus, the ability to absorb the pressure in the thickness direction is reduced. Since the absorption of the pressurizing pressure of the inspection jig during inspection is reduced and the effect of reducing the impact on the circuit board side connector 21 is reduced, the elasticity of the first and second anisotropic conductive elastomer sheets and the relay substrate is reduced. As a result, the number of times of replacement increases during the repeated inspection of the circuit board 1 to be inspected, and the inspection efficiency tends to decrease.

On the other hand, when the ratio W ₂ / D ₂ exceeds 10, a large number of conductive particles are arranged in the conductive path forming portion 71 to form a chain, and there are a large number of contacts between the conductive particles. The electrical resistance value tends to be high.

  The elastic polymer substance that is the base material of the conductive path forming portion 71 preferably has a durometer hardness measured by a type A durometer of 15 to 60, more preferably 20 to 50, and even more preferably 25 to 45.

  When the durometer hardness of the elastic polymer is less than 15, the compression and deformation of the sheet when pressed in the thickness direction is large, and a large permanent distortion occurs. Tends to be difficult. When the durometer hardness of the elastic polymer is larger than 60, the deformation when pressed in the thickness direction becomes small, so the ability to absorb pressure in the thickness direction becomes small. For this reason, it becomes difficult to suppress the deterioration of the elastic portion in the first and second anisotropic conductive elastomer sheets and the relay substrate, and as a result, the number of times of replacement increases during the repeated inspection of the circuit board 1 to be inspected. , Inspection efficiency tends to decrease.

  The elastic polymer serving as the base material of the conductive path forming portion 71 is not particularly limited as long as it exhibits the durometer hardness described above, but it is preferable to use silicone rubber from the viewpoint of workability and electrical characteristics.

  The insulating portion 72 of the third anisotropically conductive elastomer sheet 26 is formed of an insulating material that does not substantially contain conductive particles. As the insulating material, for example, an insulating polymer material, an inorganic material, a metal material with an insulating surface can be used, and the same material as the elastic polymer used for the conductive path forming portion is used. Easy to produce. When an elastic polymer is used as the material for the insulating portion, it is preferable to use a material having a durometer hardness in the above range.

As the magnetic conductive particles, the conductive particles used in the conductive path forming portion of the relay substrate 29 described above can be used.
The third anisotropic conductive elastomer sheet 26 can be manufactured, for example, as follows. First, each of the overall shapes is substantially flat, and consists of an upper mold and a lower mold that correspond to each other, while applying a magnetic field to the material layer filled in the molding space between the upper mold and the lower mold. An anisotropic conductive elastomer sheet molding die having a configuration capable of heat-curing the material layer is prepared.

  In this anisotropic conductive elastomer sheet molding die, a magnetic field is applied to the material layer to form a portion having conductivity at an appropriate position. Therefore, both the upper die and the lower die are made of iron, nickel, etc. On a substrate made of a ferromagnetic material, there are a ferromagnetic part made of iron, nickel or the like for generating an intensity distribution in the magnetic field in the mold, and a non-magnetic part made of nonmagnetic metal or resin such as copper. The structure has mosaic layers alternately arranged so as to be adjacent to each other, and the ferromagnetic portions are arranged according to a pattern corresponding to the conductive path forming portion to be formed.

Here, the molding surface of the upper mold is flat, and the molding surface of the lower mold has slight irregularities corresponding to the conductive path forming portion of the anisotropic conductive sheet to be formed.
And the 3rd anisotropically conductive elastomer sheet 26 is manufactured as follows using said anisotropically conductive elastomer sheet shaping die. First, a molding material in which conductive particles exhibiting magnetism are contained in a polymer material that is cured to become an elastic polymer material is injected into a molding space of an anisotropic conductive elastomer sheet molding die. A molding material layer is formed.

Next, by using a ferromagnetic part and a non-magnetic part in each of the upper mold and the lower mold, a magnetic field having an intensity distribution in the thickness direction is applied to the formed molding material layer to thereby obtain the magnetic force. As a result, the conductive particles are gathered between the ferromagnetic part in the upper mold and the ferromagnetic part in the lower mold located immediately below it, and the conductive particles are aligned in the thickness direction. Let Then, by curing the molding material layer in this state, the third anisotropic conductive elastomer sheet 26 having a configuration in which the plurality of columnar conductive path forming portions are insulated from each other by the insulating portion is manufactured. .
<Tester side connector>
On the other hand, as shown in FIG. 1, the tester side connectors 41a and 41b include fourth anisotropic conductive elastomer sheets 42a and 42b, connector boards 43a and 43b, and base plates 46a and 46b. . As the fourth anisotropic conductive elastomer sheet 42a, 42b, the same material as the third anisotropic conductive elastomer sheet 26 described above is used. That is, as shown in FIG. 37, a conductive path forming portion formed by arranging a large number of conductive particles in an insulating elastic polymer material in the thickness direction, and an insulation that separates each conductive path forming portion. An anisotropic conductive elastomer sheet composed of a portion is used.

The connector substrates 43a and 43b include an insulating substrate, and pin-side electrodes 45a and 45b are formed on the surface thereof on the relay pin unit 31 side as shown in FIGS.
These pin side electrodes 45 are, for example, 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0.2 mm. It is arranged on lattice points with a constant pitch, and the arrangement pitch is the same as the arrangement pitch of the conductive pins 32 of the relay pin unit 31.

Each pin-side electrode 45 is electrically connected to the tester-side electrodes 44a and 44b by a wiring pattern formed on the surface of the insulating substrate and an internal wiring formed therein.
<Relay pin unit>
1, 2 and 38 (FIG. 38 shows the relay pin unit 31a for convenience of description) and FIGS. 44 to 47, so that the relay pin unit 31 faces in the vertical direction. Are provided with a plurality of conductive pins 32a and 32b provided at a predetermined pitch. Further, the relay pin unit 31 is provided on both ends of the conductive pins 32a and 32b, and is provided with first insulating plates 34a and 34b disposed on the circuit board 1 side to be inspected for inserting and supporting the conductive pins 32a and 32b. The second insulating plates 35a and 35b are provided on the opposite side of the circuit board 1 to be inspected.

  For example, as shown in FIG. 39, the conductive pin 32 includes a central portion 82 having a large diameter and end portions 81a and 81b having a smaller diameter. The first insulating plate 34 and the second insulating plate 35 are formed with through holes 83 into which the end portions 81 of the conductive pins 32 are inserted. The diameter of the through hole 83 is formed larger than the diameter of the end portions 81a and 81b of the conductive pin 32 and smaller than the diameter of the central portion 82, thereby holding the conductive pin 32 so as not to drop off. .

  The distance between the first insulating plate 34 and the second insulating plate 35 is longer than the length of the central portion 82 of the conductive pin 32 by the first support pin 33 and the second support pin 37 of FIG. Thus, the conductive pin 32 is held so as to be movable up and down. The length of the end portion 81 of the conductive pin 32 is formed to be longer than the thickness of the insulating plate 34, so that the conductive pin 32 protrudes from at least one of the insulating plates 34.

  The relay pin unit has a large number of conductive pins, for example, 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0. It is arranged on a grid point with a pitch of 2 mm.

  By making the arrangement pitch of the conductive pins 32 of the relay pin unit 31 the same as the arrangement pitch of the terminal electrodes 24 provided on the pitch conversion board 23, the pitch conversion board 23 is connected to the tester side via the conductive pins 32. It is designed to be connected electrically.

  As shown in FIGS. 1 and 38, the relay pin unit 31 includes intermediate holding plates 36a and 36b between the first insulating plates 34a and 34b and the second insulating plates 35a and 35b. Has been placed.

  The first support pins 33a and 33b are arranged between the first insulating plates 34a and 34b and the intermediate holding plates 36a and 36b, whereby the first insulating plates 34a and 34b and the intermediate holding plate are arranged. The space between 36a and 36b is fixed.

  Similarly, second support pins 37a and 37b are disposed between the second insulating plates 35a and 35b and the intermediate holding plates 36a and 36b, whereby the second insulating plates 35a and 35b and the intermediate holding plates 36a and 36b are intermediately held. The space between the plates 36a and 36b is fixed.

As a material of the first support pin 33 and the second support pin 37, for example, a metal such as brass or stainless steel is used.
In FIG. 38, the distance L1 between the first insulating plate 34 and the intermediate holding plate 36 and the distance L2 between the second insulating plate 35 and the intermediate holding plate 36 are not particularly limited. However, as will be described later, the height variation of the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected due to the elasticity of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 is absorbed. In consideration, 2 mm or more is preferable, and 2.5 mm or more is more preferable.

  As shown in FIGS. 38 and 43, the first contact support position 38A of the first support pin 33 with respect to the intermediate holding plate 36 and the second support pin 37 of the second support pin 37 with respect to the intermediate holding plate 36 are second. The contact support position 38B is arranged at a different position on the intermediate holding plate projection surface A obtained by projecting the inspection apparatus in the thickness direction of the intermediate holding plate (from the upper side to the lower side in FIG. 1).

  In this case, the different positions are not particularly limited, but the first abutting support position 38A and the second abutting support position 38B are, as shown in FIG. It is preferably formed on the lattice on A.

  Specifically, as shown in FIG. 43, on the intermediate holding plate projection surface A, one second contact is formed in the unit lattice region R1 composed of four adjacent first contact support positions 38A. The contact support position 38B is arranged. Further, on the intermediate holding plate projection surface A, one first contact support position 38A is arranged in a unit lattice region R2 composed of four adjacent second contact support positions 38B. In FIG. 43, the first contact support position 38A is indicated by a black circle, and the second contact support position group 38B is indicated by a white circle.

Here, one second abutment support position 38B is disposed at the center of the diagonal line Q1 of the unit lattice region R1 of the first abutment support position 38A, and the second abutment support position 38B. One first abutment support position 38A is arranged at the center of the diagonal line Q2 of the unit lattice region R2. However, these relative positions are not particularly limited, and are arranged at different positions on the intermediate holding plate projection plane A obtained by projecting the inspection apparatus in the thickness direction of the intermediate holding plate as described above. Just do it. That is, when not arranged in a grid pattern, it is not constrained by such a relative positional relationship, and as described above, on the intermediate holding plate projection surface A obtained by projecting the inspection device in the thickness direction of the intermediate holding plate. As long as they are arranged at different positions.

  In this case, the separation distance between the first contact support positions 38A adjacent to each other and the separation distance between the second contact support positions 38B are preferably 10 to 100 mm, more preferably 12 to 70 mm, Especially preferably, it is 15-50 mm.

  As the forming material of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35, a flexible material is used. The flexibility of these plates is 50 kgf from above when both ends of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 are horizontally arranged with 10 cm intervals. The deflection caused by pressurizing at a pressure of 0.02% or less of the width of these insulating plates is such that destruction and permanent deformation do not occur even when pressurizing at a pressure of 200 kgf from above. preferable.

Specifically, the material of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 is an insulating material having a specific resistance of 1 × 10 ¹⁰ Ω · cm or more, such as a polyimide resin or a polyester resin. , Polyamide resin, phenol resin, polyacetal resin, polybutylene terephthalate resin, polyethylene terephthalate resin, syndiotactic polystyrene resin, polyphenylene sulfide resin, polyether ethyl ketone resin, fluorine resin, polyether nitrile resin, polyether sulfone resin Resin materials with high mechanical strength such as polyarylate resin and polyamide-imide resin, glass fiber reinforced epoxy resin, glass fiber reinforced polyester resin, glass fiber reinforced polyimide resin, glass fiber reinforced phenolic resin, glass fiber reinforced fluorine resin Glass fiber type composite resin material, carbon fiber reinforced epoxy resin, carbon fiber reinforced polyester resin, carbon fiber reinforced polyimide resin, carbon fiber reinforced phenol resin, carbon fiber reinforced fluorocarbon resin, etc., Examples thereof include a composite resin material in which an inorganic material such as silica, alumina, or boron nitride is filled in an epoxy resin or a phenol resin, or a composite resin material in which a mesh is contained in an epoxy resin or a phenol resin. Moreover, the composite board material etc. which were comprised by laminating | stacking two or more board | plate materials which consist of these materials can also be used.

  The thicknesses of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 are in accordance with the types of materials constituting the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35. Although it selects suitably, Preferably it is 1-10 mm. For example, a glass fiber reinforced epoxy resin having a thickness of 2 to 5 mm can be used.

  As a method of movably supporting the conductive pin 32 on the first insulating plate 34 and the second insulating plate 35, the method shown in FIGS. 40 to 42 can be cited in addition to the method shown in FIG. it can. In this example, as illustrated as the conductive pins 32, in this example, a bent holding plate 84 is provided between the first insulating plate 34 and the second insulating plate 35.

In addition, a cylindrical metal pin is used as the conductive pin 32.
As shown in FIG. 40, the bent holding plate 84 is formed with a through hole 85 through which the conductive pin 32 is inserted. The conductive pin 32 has a through hole 83a formed in the first insulating plate 34, a through hole 83b formed in the second insulating plate 35, and a through hole 85 formed in the bent holding plate 84 as fulcrums. They are pressed laterally in opposite directions and bent at the position of the through hole 85 of the bending holding plate 84, whereby the conductive pin 32 is supported so as to be movable in the axial direction.

The intermediate holding plate 36 is formed with a through hole 86 having a diameter large enough not to contact the conductive pin 32, and the conductive pin 32 is inserted into the through hole 86.
The conductive pin 32 is supported by the first insulating plate 34 and the second insulating plate 35 in the procedure shown in FIGS. 41 (a) to 41 (c). As shown in FIG. 41A, the through hole 83a of the first insulating plate 34 and the through hole 83b formed in the second insulating plate 35 and the through hole 85 of the bent holding plate 84 are in the axial direction. The bending holding plate 84 is disposed at the aligned position.

  Next, as shown in FIG. 41 (b), the conductive pin 32 extends from the through hole 83 a of the first insulating plate 34 to the through hole 83 b of the second insulating plate 35 through the through hole 85 of the bent holding plate 84. insert.

  Next, as shown in FIG. 41 (c), the bending holding plate 84 is moved in the lateral direction (horizontal direction) perpendicular to the axial direction of the conductive pins 32, and the position of the bending holding plate 84 is adjusted by an appropriate means. Fix it. As a result, the conductive pins 32 are opposite to each other with the through hole 83 b formed in the first insulating plate 34 and the second insulating plate 35 and the through hole 85 of the bent holding plate 84 as fulcrums. It is pressed in the lateral direction and bent at the position of the through hole 85 of the bent holding plate 84, whereby the conductive pin 32 is supported so as to be movable in the axial direction.

  By being configured in this way, the conductive pin 32 can be held between the first insulating plate 34 and the second insulating plate 35 so as to be movable in the axial direction and not to fall off, Since the pin having a simple structure having a cylindrical shape can be used as the conductive pin 32, the cost of the conductive pin 32 and the member holding it can be suppressed as a whole.

The position where the bent holding plate 84 is disposed may be between the first insulating plate 34 and the intermediate holding plate 36.
In the inspection apparatus of the present embodiment configured as described above, as shown in FIG. 2, the electrode 2 and the electrode 3 of the circuit board 1 to be inspected are the first anisotropic conductive elastomer sheets 22a and 22b, the electrode sheet. 88a, 88b, second anisotropic conductive elastomer sheets 58a, 58b, relay boards 29a, 29b, pitch conversion boards 23a, 23b, third anisotropic conductive elastomer sheets 26a, 26b, conductive pins 32a, 32b, By pressing the base plates 46a and 46b arranged on the outermost side with a specified pressure by a tester pressurizing mechanism via the fourth anisotropic conductive elastomer sheets 42a and 42b and the connector boards 43a and 43b, the tester ( Electrical inspection such as measurement of electrical resistance between the electrodes of the circuit board 1 to be inspected is performed.

The pressure pressed from the upper and lower first inspection jigs 11a and 11b to the circuit board 1 to be inspected at the time of measurement is, for example, 100 to 250 kgf.
Hereinafter, the circuit board to be inspected between the first inspection jig 11a and the second inspection jig 11b with reference to FIGS. 44 to 47 (for convenience, only the second inspection jig 11b is shown). A pressure absorbing action and a pressure dispersing action when both surfaces of 1 are clamped will be described.

  As shown in FIG. 44, when electrical inspection is performed by sandwiching both surfaces of the circuit board 1 to be inspected between the first inspection jig 11a and the second inspection jig 11b. In the initial stage of pressure, the relay pin unit 31 moves in the thickness direction of the conductive pin 32, the elastic portion of the relay substrate 29, the third anisotropic conductive elastomer sheet 26, and the third anisotropic conductive elastomer. The pressure is absorbed by the rubber elastic compression of the sheet 42, and the height variation of the electrode 3 to be inspected of the circuit board 1 to be inspected can be absorbed to some extent.

A first contact support position between the first support pin and the intermediate holding plate and a second contact support position between the second support pin and the intermediate holding plate are in the thickness direction of the intermediate holding plate. Since they are arranged at different positions on the projected intermediate holding plate projection surface, a force acts in the vertical direction as shown by the arrows in FIG. 46, and as shown in FIG. 47, the first inspection jig 11a. When the circuit board 1 to be inspected is further pressed between the first and second inspection jigs 11b, the elasticity of the first and second anisotropic conductive elastomer sheets 22 and 58 and the relay substrate 29 is increased. In addition to the rubber elastic compression of the portion, the third anisotropic conductive elastomer sheet 26, and the fourth anisotropic conductive elastomer sheet 42, the first insulating plate 34 of the relay pin unit 31 and the second insulation Disposed between the plate 35 and the first insulating plate 34 and the second insulating plate 35. Further, due to the spring elasticity of the intermediate holding plate 36, the pressure concentration is dispersed to the height variation of the inspected electrode 3 of the circuit board 1 to be inspected, for example, the height variation of the solder ball electrode, and the local stress concentration is distributed. Can be avoided.

  That is, as shown in FIG. 46 and FIG. 47, the intermediate holding plate 36 is attached to the second insulating plate 35 around the first contact support position 38 </ b> A with respect to the first support pin 33 and the intermediate holding plate 36. The intermediate holding plate 36 is bent around the second contact support position 38B between the second support pin 37 and the intermediate holding plate 36, as shown in FIG. It bends in the direction of the first insulating plate 34 (see the portion D surrounded by the one-dot chain line in FIG. 47). Here, “bend” and “bend direction” refer to the bend so that the intermediate holding plate 36 protrudes in a convex direction and the protruding direction thereof.

  As described above, the intermediate holding plate 36 bends in the opposite directions around the first contact support position 38A and the second contact support position 38B, so that the first inspection jig 11a and the second inspection jig 11a When the circuit board 1 to be inspected is further pressurized with the inspection jig 11b, the spring elastic force of the intermediate holding plate 36 is exerted.

  47, the height of the conductive pin 32b is absorbed by the compression of the protruding portion of the conductive path forming portion of the third anisotropic conductive elastomer sheet 26, as indicated by the B portion surrounded by the one-dot chain line in FIG. However, a pressure that cannot be absorbed by the compression of the protruding portion is applied to the first insulating plate 34b.

  Therefore, as shown by a portion C surrounded by a one-dot chain line in FIG. 47, the first insulating plate 34 and the second insulating plate 35 are also brought into contact with the first support pin 33 and the second support pin 37, respectively. When the circuit board 1 to be inspected is further pressed between the first inspection jig 11a and the second inspection jig 11b, the first and second inspection jigs 11b are bent. The spring elastic force of the insulating plate 34 and the second insulating plate 35 is exhibited.

  As a result, stable electrical contact is ensured with respect to each of the electrodes to be inspected 3 of the circuit board 1 to be inspected having a height variation, and further, stress concentration is reduced. Local breakage of the elastic portions of the conductive elastomer sheets 22 and 58 and the relay substrate 29 is suppressed. As a result, since the repeated use durability of the relay substrate 29 is improved, the number of times of replacement is reduced, and the inspection work efficiency is improved.

  48 is a sectional view similar to FIG. 44 for explaining another embodiment of the inspection apparatus of the present invention (only the second inspection jig is shown for convenience), and FIG. 49 is an enlarged view of the relay pin unit. It is sectional drawing. This inspection apparatus has basically the same configuration as the inspection apparatus shown in FIG. 1, and the same reference numerals are assigned to the same components. In this inspection apparatus, as shown in FIGS. 48 and 49, a plurality (three in this embodiment) of intermediate holding plates 36 are provided between the first insulating plate 34 and the second insulating plate 35. The holding plate support pins 39 are arranged between the adjacent intermediate holding plates 36 while being spaced apart from each other by a predetermined distance.

In this case, in at least one intermediate holding plate 36b, the holding support position of the holding plate support pin 39b that comes into contact with the intermediate holding plate 36b from one surface side with respect to the intermediate holding plate 36b, and the other surface with respect to the intermediate holding plate 36b. The intermediate support projected from the contact position of the first support pin 33b, the second support pin 37b, or the holding plate support pin 39b with respect to the intermediate holding plate 36b in the thickness direction of the intermediate holding plate 36b. It is necessary that they are arranged at different positions on the plate projection surface.

  Most preferably, in all of the intermediate holding plates 36b, the holding plate support pins 39b that come into contact with the intermediate holding plate 36b from one surface side are in contact with the intermediate holding plate 36b, and the other surface with respect to the intermediate holding plate 36b. The intermediate support projected from the contact position of the first support pin 33b, the second support pin 37b, or the holding plate support pin 39b with respect to the intermediate holding plate 36b in the thickness direction of the intermediate holding plate 36b. They are arranged at different positions on the plate projection plane.

  In this case, although not described in detail, the “different positions” means the first contact support position 38A between the first support pin 33 and the intermediate holding plate 36 and the second support pin 37 in the above-described embodiment. And the relative position described with respect to the relationship between the intermediate holding plate 36 and the second contact support position 38B.

  In the present embodiment, in the upper intermediate holding plate 36b among the three intermediate holding plates 36b, the holding support position 39A of the holding plate support pin 39b that comes into contact with the intermediate holding plate 36b from the one surface side with respect to the intermediate holding plate 36b; The intermediate support plate projection surface projected from the contact support position 38A of the first support pin 33b that contacts the intermediate support plate 36b from the other side with respect to the intermediate support plate 36b in the thickness direction of the intermediate support plate 36b. Are arranged at different positions.

  Further, in the middle intermediate holding plate 36b among the three intermediate holding plates 36b, the holding support position 39A of the holding plate support pin 39b that comes into contact with the intermediate holding plate 36b from one side and the intermediate holding plate 36b, and the intermediate holding plate The holding support position 39A of the holding plate support pin 39b that is in contact with the plate 36b from the other surface side with respect to the intermediate holding plate 36b is at a different position on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate 36b. Has been placed.

  Further, in the lower intermediate holding plate 36b among the three intermediate holding plates 36b, the holding support position 39A of the holding plate support pin 39b that comes into contact with the intermediate holding plate 36b from one surface side with respect to the intermediate holding plate 36b, The contact support position 38B of the second support pin 37b that contacts the holding plate 36b from the other surface side with respect to the intermediate holding plate 36b is different on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate 36b. Placed in position.

  With this configuration, the spring elasticity is further exhibited by the plurality of intermediate holding plates 36, and the pressure concentration is distributed with respect to the height variation of the electrodes to be inspected of the circuit board 1 to be inspected. Thus, local stress concentration can be further avoided, and local breakage of the elastic portions of the first and second anisotropic conductive elastomer sheets 22 and 58 and the relay substrate 29 is suppressed. Since the repeated use durability of the relay substrate 29 is improved, the number of times of replacement is reduced, and the inspection work efficiency is improved.

The number of intermediate holding plates 36 is not particularly limited as long as it is plural.
As mentioned above, although embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range which does not deviate from the summary.

  For example, the circuit board 1 to be inspected may be a semiconductor integrated circuit device such as a package IC, MCM, or CSP, or a circuit device formed on a wafer, in addition to a printed circuit board. Further, the printed circuit board may be a single-sided printed circuit board as well as a double-sided printed circuit board.

The first inspection jig 11a and the second inspection jig 11b are not necessarily the same in materials used, member structures, and the like, and they may be different.
The tester-side connector may be configured by laminating a plurality of circuit boards such as connector boards and anisotropic conductive elastomer sheets.

  In the above embodiment, as the third anisotropically conductive elastomer sheet 26 and the third anisotropically conductive elastomer sheet 42, a plurality of conductive path forming portions extending in the thickness direction and these conductive path forming portions are insulated from each other. And the conductive particles are contained only in the conductive path forming part, whereby the conductive particles are dispersed unevenly in the surface direction, and the conductive path forming part protrudes on one side of the sheet. Although what was used was used, it is not necessarily limited to this.

  Further, as shown in FIGS. 1, 2, 44, 45, 47, and 48, support pins 49 may be arranged between the connector board 43 and the base plate 46 in the tester side connector 41. Good. These support pins 49 have the same action as the first support pin 33 and the second support pin 37 (the first support pin 33, the second support pin 37, and the holding plate support pin 39 in FIG. 40). Thus, it is possible to provide an effect of dispersing the surface pressure. In order to give this surface pressure dispersion action, it is preferable to arrange these so that the position of the support pin 49 and the position of the second support pin 37 are different from each other in the surface direction.

  Further, as shown in FIG. 50, as the relay pin unit 23, a plurality of conductive pins 32 arranged at a constant pitch and a pair of spaced apart first pins that support the conductive pins 32 so as to be movable in the axial direction. What comprises the insulating plate 34 and the second insulating plate 35 may be used. The mechanism for supporting the conductive pins 32 in the relay pin unit 23 so as to be movable in the axial direction is the same as that shown in FIG.

FIG. 1 is a cross-sectional view showing an embodiment of the inspection apparatus of the present invention. FIG. 2 is a cross-sectional view showing a stacked state when the inspection apparatus of FIG. 1 is used for inspection. FIG. 3 is a diagram showing the surface of the pitch conversion board on the circuit board side. FIG. 4 is a diagram showing the pin side surface of the pitch conversion substrate. FIG. 5 is a partial cross-sectional view of the pitch conversion substrate. FIG. 6 is a partial cross-sectional view showing a state in which a first anisotropic conductive elastomer sheet, an electrode sheet, a second anisotropic conductive elastomer sheet, and a relay substrate are stacked. FIG. 7 is a partial plan view of the electrode sheet. FIG. 8 is a partial cross-sectional view of the electrode sheet. FIG. 9 is a partial cross-sectional view showing a laminated material for obtaining an electrode sheet. FIG. 10 is a partial cross-sectional view showing a state in which a through hole is formed in the laminated material. FIG. 11 is a cross-sectional view illustrating a state in which the relay electrode and the short-circuit portion are formed on the insulating sheet in the laminated material. FIG. 12 is a cross-sectional view showing a state in which ring-shaped electrodes and wiring portions are formed on an insulating sheet in a laminated material. FIG. 13 is a partial cross-sectional view of the first anisotropic conductive elastomer sheet. FIG. 14 is a cross-sectional view showing one side molding member, the other side molding member and a spacer for producing the first anisotropic conductive elastomer sheet. FIG. 15 is a cross-sectional view showing a state in which a conductive elastomer material is applied to the surface of the other surface side molded member. FIG. 16 is a cross-sectional view showing a state in which a conductive elastomer material layer is formed between the one-surface-side molded member and the other-surface-side molded member. FIG. 17 is an enlarged cross-sectional view of the conductive elastomer material layer of FIG. 18 is an enlarged cross-sectional view showing a state in which a magnetic field is applied in the thickness direction to the conductive elastomer material layer of FIG. FIG. 19 is a partial cross-sectional view of a second anisotropic conductive elastomer sheet. FIG. 20 is a partial cross-sectional view showing a stacked body in which a resist layer having openings formed thereon is stacked on a thin metal layer. FIG. 21 is a partial cross-sectional view of a composite film in which a metal mask is formed in the opening of the resist layer in FIG. FIG. 22 is a partial cross-sectional view showing a pair of composite films and a substrate for a relay board arranged between them. FIG. 23 is a cross-sectional view showing a state in which a conductive elastomer material layer is formed in the through hole of the relay substrate. FIG. 24 is a cross-sectional view showing a state after a magnetic field is applied in the thickness direction to the conductive elastomer material layer. FIG. 25 is a cross-sectional view showing a state where a conductive elastomer layer is formed in a through hole of a substrate for a relay substrate. FIG. 26 is a cross-sectional view showing a state where the composite film on the laser irradiation side is peeled off. FIG. 27 is a cross-sectional view showing a process of forming a conductive path forming portion by laser processing. FIG. 28 is a cross-sectional view showing a process of forming a conductive path forming portion by laser processing. FIG. 29 is a cross-sectional view showing a state where the composite film is peeled after laser processing. FIG. 30 shows a film in which an insulating part material is applied between metal films on a thin metal layer, and a laminate in which an insulating part material is applied between conductive path forming parts in a through hole of a substrate for a relay board. It is the fragmentary sectional view which showed. FIG. 31 is a cross-sectional view showing a state in which the film and the laminate of FIG. 30 are overlapped. FIG. 32 is a cross-sectional view showing a state in which the insulating portion is formed by curing the insulating portion material from the state of FIG. FIG. 33 is a partial cross-sectional view of the relay board. FIG. 34 shows a state in which the pitch conversion substrate, the relay substrate, the second anisotropic conductive elastomer sheet, the electrode sheet, and the first anisotropic conductive elastomer sheet are arranged on one surface of the circuit board to be inspected. FIG. FIG. 35 shows a state in which the circuit board to be inspected is pressed by the pitch converting substrate, the relay substrate, the second anisotropic conductive elastomer sheet, the electrode sheet, and the first anisotropic conductive elastomer sheet during the electrical inspection. It is the fragmentary sectional view which showed. FIG. 36 is a plan view showing a state in which a positional deviation has occurred between the electrode to be inspected and the connection electrode pair. FIG. 37 is a cross-sectional view of a third anisotropically conductive elastomer sheet. FIG. 38 is a cross-sectional view of the relay pin unit. FIG. 39 is a cross-sectional view showing a part of the conductive pin, intermediate holding plate, and insulating plate of the relay pin unit. FIG. 40 is a cross-sectional view similar to FIG. 39 showing another example of the relay pin unit. FIG. 41 is a cross-sectional view showing a process until a conductive pin is arranged between the first insulating plate and the second insulating plate in the configuration of FIG. FIG. 42 is a cross-sectional view of a relay pin unit in which a bent holding plate is arranged. FIG. 43 is a partially enlarged view of the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate of the relay pin unit. FIG. 44 is a partial cross-sectional view showing an embodiment of the inspection apparatus of the present invention. FIG. 45 is a cross-sectional view for explaining a use state of the inspection apparatus of the present invention. FIG. 46 is a cross-sectional view illustrating a usage state of the relay pin unit in the inspection apparatus of the present invention. FIG. 47 is a cross-sectional view for explaining the use state of the inspection apparatus of the present invention. FIG. 48 is a partial cross-sectional view similar to FIG. 44 illustrating another embodiment of the inspection apparatus of the present invention. 49 is a cross-sectional view of the relay pin unit in the embodiment of FIG. FIG. 50 is a sectional view of a circuit board inspection apparatus according to another embodiment of the present invention. FIG. 51 is a cross-sectional view of a conventional circuit board inspection apparatus. FIG. 52 is a diagram showing a state in which a current supply electrode and a voltage measurement electrode are properly arranged on an electrode to be inspected in a conventional circuit board electrical resistance measurement apparatus. FIG. 53 is a diagram showing a state in which the current supply electrode and the voltage measurement electrode are arranged on the electrode to be inspected in a state where they are shifted in a conventional circuit board electrical resistance measurement apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit board to be inspected 2 Electrode to be inspected 3 Electrode to be inspected 11a First inspection jig 11b Second inspection jigs 21a and 21b Circuit board side connectors 22a and 22b First anisotropic conductive elastomer sheet 22A Conductive elastomer Material 22B Conductive Elastomer Material Layers 23a, 23b Pitch Conversion Substrates 24a, 24b Terminal Electrodes 25a, 25b Connection Electrodes 26a, 26b Third Anisotropic Conductive Elastomer Sheets 27a, 28b Current Supply Electrodes 28a, 28b Voltage Measurement electrodes 29a, 29b Relay boards 31a, 31b Relay pin units 32a, 32b Conductive pins 33a, 33b First support pins 34a, 34b First insulating plates 35a, 35b Second insulating plates 36a, 36b Intermediate holding plate 37a 37b Second support pin 38A First contact support position 38B Second contact support Holding position 39 Holding plate support pin 39A Contact support position 41a, 41b Tester side connectors 42a, 42b Fourth anisotropic conductive elastomer sheets 43a, 43b Connector substrates 44a, 44b Tester side electrodes 45a, 45b Pin side electrodes 46a, 46b Base plate 49a, 49b Support pin 51 Insulating substrate 52 Wiring 53 Internal wiring 54 Insulating layer 55 Insulating layer 58a, 58b Second anisotropic conductive elastomer sheet 59 Through hole 61 Conducting path forming part 61a Protruding part 61e Conducting path for inspection Portion 61f Connecting conductive path forming portion 61A Conductive elastomer material layer 61B Conductive elastomer layer 62 Insulating portion 62A Insulating portion material layer 63 Metal thin layer 64 Contact member 64a Side portion 65 Film 66 Metal thin layer 67 Resist layer 67A Opening 68 Metal mask 69 Composite film 71 Conduction path formation 71a Protruding part 72 Insulating part 73 Substrate 73a Upper surface part 75 Through hole 81a, 81b End part 82 Central part 83, 83a, 83b Through hole 84 Bending holding plate 85 Through hole 86 Through hole 88a, 88b Electrode sheet 88A Laminating material 88H Through hole 89 Insulating sheet 90 Through-hole 91 Ring-shaped electrode 92 Relay electrode 93 Short-circuit portion 94 Wiring portion 94A Metal layer 101 Inspected circuit board 102 Inspected electrode 103 Inspected electrode 111a First inspection jig 111b Second inspection jig 121a 121b Circuit board side connectors 122a, 122b First anisotropic conductive elastomer sheets 123a, 123b Pitch conversion boards 124a, 124b Terminal electrodes 125a, 125b Connection electrodes 126a, 126b Second anisotropic conductive elastomer sheets 131a, 131b Relay pin unit 132a, 1 32b Conductive pins 133a, 133b Support pins 134a, 134b Insulating plates 141a, 141b Tester side connectors 142a, 142b Third anisotropic conductive elastomer sheets 143a, 143b Connector substrates 144a, 144b Tester side electrodes 145a, 145b Pin side electrodes 146a, 146b Base plate 151 One side molding member 152 Other side molding member 153 Spacer 153K Opening 154 Pressure roll 155 Support roll 156 Pressure roll device A Intermediate holding plate projection surface P Conductive particle L1 Distance L2 Distance Q1 Diagonal Q2 Diagonal R1 Unit Lattice region R2 Unit lattice region T Inspected electrode L Diameter A Current supply electrode V Voltage measurement electrode D Separation distance

Claims (16)

A circuit board inspection apparatus that performs electrical inspection by sandwiching both surfaces of a circuit board to be inspected between a pair of first inspection jigs and a second inspection jig between the inspection jigs. ,
The first inspection jig and the second inspection jig are respectively
(i) A flexible insulating sheet in which a plurality of through holes are formed in accordance with a pattern of electrodes to be inspected on a circuit board to be inspected, and a plurality of ring electrodes formed so as to surround the through holes on the surface of the insulating sheet A relay electrode formed on the back surface of the insulating sheet and electrically connected to the ring-shaped electrode, and an electrode sheet,
A first anisotropic conductive elastomer sheet disposed on the surface of the electrode sheet, in which conductive particles are arranged in the thickness direction and uniformly dispersed in the plane direction;
A second anisotropic conductive elastomer disposed on the back surface of the electrode sheet, wherein a plurality of through holes are formed according to the pattern of the electrode to be inspected, and conductive particles are arranged in the thickness direction and uniformly dispersed in the surface direction. Sheet,
The plurality of through-holes disposed on the back surface of the second anisotropically conductive elastomer sheet and formed in the substrate are composed of an insulating portion made of an elastic polymer material and an elastic polymer material containing conductive particles. A plurality of conductive path forming portions penetrating the insulating portion in the thickness direction, wherein the conductive path forming portions are a plurality of conductive path forming portions for inspection arranged according to a pattern of the electrode to be inspected, and the electrode sheet A plurality of connection conductive path forming portions arranged according to the pattern of the relay electrode in the relay board,
A pitch conversion substrate that is disposed on the back surface of the relay substrate and converts the electrode pitch between the one surface side and the other surface side of the substrate;
A third anisotropically conductive elastomer sheet disposed on the back surface of the pitch conversion substrate;
A circuit board-side connector with
(ii) a plurality of conductive pins arranged at a predetermined pitch;
A pair of spaced apart first and second insulating plates for supporting the conductive pins movably in the axial direction;
A relay pin unit with
(iii) a connector board for electrically connecting the tester and the relay pin unit;
A fourth anisotropic conductive elastomer sheet disposed on the relay pin unit side of the connector board;
A base plate disposed on the side opposite to the relay pin unit of the connector board;
A tester side connector with
A circuit board inspection apparatus comprising:   The inspection conductive path forming portion enters the through hole of the second anisotropic conductive elastomer sheet and the through hole of the insulating sheet in the electrode sheet, and the first anisotropic conductive elastomer sheet is interposed through the first anisotropic conductive elastomer sheet. The circuit board inspection apparatus according to claim 1, wherein the circuit board inspection apparatus is electrically connected to an electrode to be inspected. The pitch conversion substrate includes a plurality of a pair of electrode pairs in which one electrode protrudes in the thickness direction from the other electrode on the surface on the relay substrate side,
The protruding one electrode is arranged according to the pattern of the inspection conductive path forming portion, and the other electrode is arranged according to the pattern of the connecting conductive path forming portion,
Forming the inspection conductive path of the relay substrate pressed by the ring-shaped electrode of the electrode sheet and the protruding one electrode of the pitch conversion substrate on each of the electrodes to be inspected in the circuit substrate to be inspected Are electrically connected to each other at the same time to enable measurement,
In this measurable state, one of the protruding electrode and the other electrode on the pitch conversion substrate is used as a current supply electrode, and the other electrode is used as a voltage measurement electrode. The circuit board inspection apparatus according to claim 1, wherein the electrical resistance of the specified one electrode to be inspected is measured by the above.   The contact member is provided in the edge part surface by the side of the said to-be-inspected circuit board of the said conductive path formation part for a test | inspection in the said relay substrate, and the said conductive path formation part for a connection, The contact member is provided. The circuit board inspection apparatus according to any one of the above.   5. The contact member according to claim 4, wherein a side portion of the contact member is fixed to the insulating portion and held on end surfaces of the inspection conductive path formation portion and the connection conductive path formation portion. Circuit board inspection equipment. The relay pin unit is
An intermediate holding plate disposed between the first insulating plate and the second insulating plate;
A first support pin disposed between the first insulating plate and the intermediate holding plate;
A second support pin disposed between the second insulating plate and the intermediate holding plate;
With
A first abutment support position of the first support pin with respect to the intermediate holding plate and a second abutment support position of the second support pin with respect to the intermediate holding plate are projected in the thickness direction of the intermediate holding plate. The circuit board inspection apparatus according to claim 1, wherein the circuit board inspection apparatus is disposed at different positions on the intermediate holding plate projection surface. When the both sides of the circuit board to be inspected are clamped between the two inspection jigs by the pair of the first inspection jig and the second inspection jig,
The intermediate holding plate bends in the direction of the second insulating plate around the first contact support position of the first support pin with respect to the intermediate holding plate, and
The intermediate holding plate bends in the direction of the first insulating plate around the second contact support position of the second support pin with respect to the intermediate holding plate. Circuit board inspection equipment. A first contact support position of the first support pin with respect to the intermediate holding plate is arranged in a lattice shape on the intermediate holding plate projection surface;
Second contact support positions of the second support pins with respect to the intermediate holding plate are arranged in a grid pattern on the intermediate holding plate projection surface,
In the intermediate holding plate projection surface, one second abutment support position is disposed in a unit lattice region composed of four adjacent first abutment support positions, and
7. One first abutment support position is arranged in a unit lattice area composed of four adjacent second abutment support positions on the intermediate holding plate projection surface. Or the circuit board inspection apparatus according to 7. The relay pin unit is
A plurality of intermediate holding plates disposed at a predetermined interval between the first insulating plate and the second insulating plate;
A first support pin disposed between the first insulating plate and the intermediate holding plate;
A second support pin disposed between the second insulating plate and the intermediate holding plate;
Holding plate support pins arranged between adjacent intermediate holding plates;
With
In at least one intermediate holding plate, a holding support position of the holding plate support pin that comes into contact with the intermediate holding plate from one surface side with respect to the intermediate holding plate, and a first surface that makes contact with the intermediate holding plate from the other surface side. The support support position of the first support pin, the second support pin, or the holding plate support pin with respect to the intermediate holding plate is arranged at a different position on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate. The circuit board inspection apparatus according to claim 1, wherein the circuit board inspection apparatus is provided.   In all of the intermediate holding plates, the holding plate supporting pins that come into contact with the intermediate holding plate from one surface side are in contact with and supported by the intermediate holding plate, and the intermediate holding plate comes into contact with the intermediate holding plate from the other surface side. The support support position of the first support pin, the second support pin, or the holding plate support pin with respect to the intermediate holding plate is arranged at a different position on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate. The circuit board inspection apparatus according to claim 9, wherein the circuit board inspection apparatus is provided.   The third anisotropically conductive elastomer sheet is composed of a plurality of conductive path forming portions extending in the thickness direction and insulating portions that insulate these conductive path forming portions from each other, and the conductive particles are in the conductive path forming portions. The conductive particles are contained in a non-uniform manner in the surface direction, and the conductive path forming portion protrudes on one side of the sheet. Circuit board inspection equipment.   The fourth anisotropic conductive elastomer sheet is composed of a plurality of conductive path forming portions extending in the thickness direction and insulating portions that insulate these conductive path forming portions from each other, and the conductive particles are in the conductive path forming portions. The conductive particles are contained in a non-uniform manner in the plane direction, and the conductive path forming portion protrudes on one side of the sheet. Circuit board inspection equipment. The plurality of conductive pins are formed in a bar-shaped central portion that is shorter than the distance between the first insulating plate and the second insulating plate, and are formed on both ends of the central portion, and have a smaller diameter than the central portion. Consisting of a pair of ends,
The pair of end portions are respectively inserted through through-holes having a diameter smaller than that of the central portion formed in the first insulating plate and the second insulating plate and larger than that of the pair of end portions. The circuit board inspection apparatus according to claim 6, wherein the conductive pin is supported by the movably in the axial direction. A through hole through which the conductive pin is inserted is formed between the first insulating plate and the intermediate holding plate, between the second insulating plate and the intermediate holding plate, or between the intermediate holding plates. A bent holding plate is provided,
The plurality of conductive pins are pressed laterally in opposite directions from each other with a through hole formed in the first and second insulating plates and a through hole formed in the bent holding plate as fulcrums. 13. The circuit board inspection apparatus according to claim 6, wherein the conductive pin is bent at a position of a through-hole of the holding plate, whereby the conductive pin is supported so as to be movable in the axial direction.   15. The circuit board inspection apparatus according to claim 1, wherein the electrodes to be inspected on both surfaces of the circuit board to be inspected are solder ball electrodes. A circuit board inspection method using the circuit board inspection apparatus according to claim 1,
A circuit board comprising: a pair of a first inspection jig and a second inspection jig, wherein both sides of the circuit board to be inspected are clamped between the inspection jigs to perform an electrical inspection. Inspection method.

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