JP5006162B2 - Electrical connection member - Google Patents
Electrical connection member Download PDFInfo
- Publication number
- JP5006162B2 JP5006162B2 JP2007291669A JP2007291669A JP5006162B2 JP 5006162 B2 JP5006162 B2 JP 5006162B2 JP 2007291669 A JP2007291669 A JP 2007291669A JP 2007291669 A JP2007291669 A JP 2007291669A JP 5006162 B2 JP5006162 B2 JP 5006162B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- sheet member
- hole
- elastic
- elastic member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Description
本発明は、電子部品と基板の間或いは基板と基板の間に挟持されて、それぞれの電極の間を電気的に導通させる両面接点を有する被挟持型電気接続部材の技術分野に属する。 The present invention belongs to the technical field of a sandwiched electrical connection member having a double-sided contact that is sandwiched between an electronic component and a substrate or between a substrate and a substrate and electrically connects the respective electrodes.
図4は従来の電気接続シートの断面図である。
ゴム弾性シート体20にワイヤ19が斜めに埋め込まれており、ワイヤの両端部分に球面状の接点部17、18が設けられている。
この電気接続シートは、下側に回路基板を置き、上面に半導体パッケージを置き接点部17、18がそれぞれ回路基板や半導体パッケージの電極に当接するようにして上下方向に所定の加圧を行って、電気接続を得るようにしているものである(例えば、特許文献1参照)。
A wire 19 is obliquely embedded in the rubber elastic sheet body 20, and spherical contact portions 17 and 18 are provided at both ends of the wire.
In this electrical connection sheet, a circuit board is placed on the lower side, a semiconductor package is placed on the upper surface, and a predetermined pressure is applied in the vertical direction so that the contact portions 17 and 18 are in contact with the electrodes of the circuit board and the semiconductor package, respectively. The electric connection is obtained (see, for example, Patent Document 1).
しかし、このような球面状の接点部では回路基板の電極や半導体パッケージのパッドに接した場合それは点接触にならざるを得ず、必然的に接触抵抗が高いという問題がある。
また、被接続体が、ソルダレジストを有していてパッドが奥まった凹んだ位置にあるような場合には、ワイヤや接点部がゴム弾性シート体と密着しているため凹みに充分対応できずに、接触抵抗が更に高くなるという問題があった。
However, in such a spherical contact portion, when it comes into contact with an electrode of a circuit board or a pad of a semiconductor package, it must be point contact, and there is a problem that contact resistance is inevitably high.
Also, if the connected body has a solder resist and the pad is in a recessed position where the pad is recessed, the wire and the contact portion are in close contact with the rubber elastic sheet body, so that it cannot sufficiently cope with the recess. In addition, there is a problem that the contact resistance is further increased.
本発明の課題は、上記従来技術の問題点に鑑みて、回路基板の電極や、半導体パッケージのパッドへの接触は面接触するようにし、更にソルダレジストを有することによりパッド等が凹んだ位置にあってもこれに充分面接触が可能な接触部を有する電気接続部材を実現することにある。 In view of the above-mentioned problems of the prior art, the object of the present invention is to make contact with the electrodes of the circuit board and the pads of the semiconductor package in surface contact, and further, by having a solder resist, the pads etc. are in a recessed position. Even if it exists, it exists in implement | achieving the electrical connection member which has a contact part which can carry out surface contact sufficiently.
本発明は、上記の課題を解決するために以下の手段構成を有する。
本発明の第1の構成は、下記(イ)および(ロ)の部材を(ハ)のように重ねた構造であることを特徴とする電気接続部材である。
(イ) 弾性材からなり、板状基部の片面に、予め定めた間隔を置いて2個で1組の突起が1組以上整列して形成され、各組の突起のうち一方側の突起には基部をも貫く貫通孔を有し、該貫通孔には導体が両端で弾性材の表面と面一になるように充填された弾性部材。
(ロ) 薄膜樹脂の一面側に、前記1組2個の突起にかけ渡る長さおよび幅の一方の導体箔が前記弾性部材の突起の配置に合わせて配設され、導体箔の一方端寄りには薄膜樹脂を貫く貫通孔を有し、この貫通孔を通して反対面側の他面側に形成された他方の導体箔との導通が可能なシート部材。
(ハ) (イ)の弾性部材2個を突起のない方の面を向い合わせ、互いに導体の貫通している突起の位置と貫通していない突起の位置同士を位置合わせし、その間に(ロ)のシート部材を挟み、シート部材の他面側の弾性部材の導体にはシート部材の貫通孔を合わせ、シート部材の一面側の弾性部材の導体には該導体箔部分を合わせ、弾性部材の突起がある側の各面には、シート部材の一面側を表側にして、その貫通孔を弾性部材の導体に位置合わせして、上記5層の部材を重ね密着させた重ね構造。
The present invention has the following means in order to solve the above problems.
A first configuration of the present invention is an electrical connection member characterized in that the following members (a) and (b) are stacked as shown in (c).
(A) It is made of an elastic material, and one set of protrusions is formed in a line on the one side of the plate-like base portion at a predetermined interval. Is an elastic member that has a through-hole penetrating through the base portion, and the through-hole is filled so that the conductor is flush with the surface of the elastic material at both ends.
(B) On one side of the thin film resin, one conductor foil having a length and a width extending over the two protrusions in one set is arranged in accordance with the arrangement of the protrusions of the elastic member, and close to one end of the conductor foil. Is a sheet member having a through-hole penetrating through the thin-film resin, and being able to conduct with the other conductor foil formed on the other side of the opposite surface through the through-hole.
(C) The two elastic members in (a) are faced to the surface without projections, and the positions of the projections through which the conductor penetrates and the positions of the projections that do not penetrate each other are aligned. ), The through hole of the sheet member is aligned with the conductor of the elastic member on the other side of the sheet member, the conductor foil portion is aligned with the conductor of the elastic member on the one side of the sheet member, A stacked structure in which the above-mentioned five layers of members are placed in close contact with each other on the side where the protrusions are located, with one side of the sheet member being the front side and the through-holes being aligned with the conductors of the elastic member.
本発明の第2の構成は、前記第1の構成において、シート部材の貫通孔のない方の端部寄りの一方の導体箔の周囲に沿って薄膜樹脂に切り目が入っていることを特徴とする電気接続部材である。 The second configuration of the present invention is characterized in that, in the first configuration, the thin film resin has a cut along the periphery of one conductor foil near the end of the sheet member that does not have a through hole. It is an electrical connection member.
前記課題解決手段の(イ)の弾性部材と(ロ)のシート部材を(ハ)のように重ね合わせた電気接続部材に対し、上面側においては、パッドを有する基板(上基板とする)のパッドをシート部材面に向けて導体の充填されていない突起の位置に合わせて配置し、下面側においてもパッドを有する基板(下基板とする)のパッドをシート部材面に向けて導体の充填されていない突起の位置に合わせて配置し、上下の基板を電気接続部材に向けて加圧すると、シート部材の導体箔が導体の突起に押されて、基板のパッドに押し付けられパッドと導体箔が接触し電気的接続が得られるがこのとき、真中のシート部材を挟んで反対側の弾性部材の突起に充填された導体が反対側の基板面からの圧力を受け、パッドの位置に対応する突起を背面から押し付けることになり、パッドとシートの導体箔の接触が一層加圧されパッドと導体箔の面接触となり接触が確実になる。 In contrast to the electrical connection member obtained by superimposing the elastic member (A) and the sheet member (B) of the problem solving means as shown in (C), on the upper surface side, a substrate having a pad (referred to as an upper substrate) is provided. The pad is arranged to face the surface of the sheet member in accordance with the position of the protrusion not filled with the conductor, and the pad of the substrate having the pad on the lower surface side (hereinafter referred to as the lower substrate) is filled with the conductor toward the sheet member surface. If the upper and lower boards are pressed toward the electrical connection member and the upper and lower boards are pressed against the electrical connection members, the conductor foil of the sheet member is pushed by the bumps of the conductor and pressed against the pads of the board. Contact is made and electrical connection is obtained, but at this time, the conductor filled in the protrusion of the elastic member on the opposite side across the sheet member in the middle receives the pressure from the opposite substrate surface, and the protrusion corresponding to the position of the pad Press from the back Will kick, the contact of the conductor foil pad and the sheet is ensured contact becomes more pressurized surface contact pad and the conductive foil.
また、以上のような接触構造であるので、基板にソルダレジストが設けられていて、パッドがソルダレジスト面より引っ込んだ(奥まった)位置にある場合でも、シート部材の薄膜樹脂および導体箔は柔軟であるので、パッドが表面より奥まった位置にあっても、この窪みに順応して確実な面接触が得られるという効果がある。 Further, since the contact structure is as described above, the thin film resin and the conductive foil of the sheet member are flexible even when the solder resist is provided on the substrate and the pad is in a position where the pad is retracted (recessed) from the solder resist surface. Therefore, even if the pad is in a position deeper than the surface, there is an effect that reliable surface contact can be obtained by adapting to the depression.
弾性部材の突起の貫通孔に充填されている導体は、はんだ等の高導電性かつ高剛性の導電体が最良である。
この場合はんだボール、あるいははんだペーストを一度溶融させた後、硬化させたものでよい。この際には、貫通孔の中に導電体がむら無く配設されるように、予めめっき等で貫通孔の内周面に金属薄膜を生成しておくのが最良である。
The conductor filled in the through hole of the protrusion of the elastic member is best a highly conductive and rigid conductor such as solder.
In this case, the solder ball or solder paste may be once melted and then cured. In this case, it is best to previously form a metal thin film on the inner peripheral surface of the through hole by plating or the like so that the conductor is uniformly disposed in the through hole.
以下、本発明の電気接続部材の実施例を図面を参照して説明する。
図1は、本発明の電気接続部材の断面図である。
(a)は5層の、弾性部材とシート部材を接着する前の状態であり、図(b)は接着した状態である。
図2は、図1の弾性部材1を突起のある側から見た平面図(図2の(a))およびその断面図(同じく(b))とシート部材10を一面側から見た平面図である。
Hereinafter, embodiments of the electrical connection member of the present invention will be described with reference to the drawings.
FIG. 1 is a cross-sectional view of an electrical connection member of the present invention.
(A) is a state before bonding an elastic member and a sheet member of five layers, and FIG. (B) is a bonded state.
2 is a plan view of the elastic member 1 of FIG. 1 as viewed from the side with the protrusions (FIG. 2A), a cross-sectional view thereof (same as FIG. 2B), and a plan view of the sheet member 10 as viewed from one side. It is.
弾性部材1は、例えばシロキサン系のシリコンゴム等の弾性材2で形成したもので弾性を有し、板状基部の片面に、予め定めた間隔例えば接続対象基板の電極パッドの間隔に合わせて、第1の突起3と第2の突起6とを行列状に有しており、第1の突起3には貫通孔4が設けられその中に弾性材2より剛性のあるはんだ等の導体5が充填されている。一方、第2の突起6は弾性材のみの突起となっている。突起のない側の面は平面となっている。
The elastic member 1 is made of, for example, an elastic material 2 such as siloxane-based silicon rubber, and has elasticity. The elastic member 1 has a predetermined interval on one surface of the plate-like base portion, for example, according to the interval between the electrode pads on the connection target substrate. The first protrusion 3 and the second protrusion 6 are arranged in a matrix, and the first protrusion 3 is provided with a through-hole 4 in which a
シート部材10は、厚さ10μm以下のアラミド等のフィルムからなり、所定のピッチで行列状に貫通孔8が設けられており、シート部材10の一面に、この貫通孔を含んで、弾性部材1の1組の第1の突起3と第2の突起6の配置位置をカバーする一方の導体箔9が蒸着等によって設けられている。
また、反対面である他面に導体5と接続する他方の導体箔9′が蒸着等によって、貫通孔8を介して設けられ、一方の導体箔9と他方の導体箔9′とが接続している。
そして、一方の導体箔9の、貫通孔8から延びた部分の周囲には一方の導体箔9が薄膜樹脂とともに撓むことができるように切り欠き11が設けられている。
The sheet member 10 is made of a film such as aramid having a thickness of 10 μm or less, and through
In addition, the other conductor foil 9 'connected to the
A notch 11 is provided around the portion of one conductor foil 9 extending from the through
そして、シート部材10の他方の導体箔9′が形成された他面側の面を弾性部材1の第1の突起3の導体5に当接させると導体5とシート部材10の一面に形成された一方の導体箔9とが接続されるようになっている。
Then, when the other surface side of the sheet member 10 on which the other conductor foil 9 ′ is formed is brought into contact with the
図2の(a)と(c)の位置関係は、(a)の導体5の位置と(c)の貫通孔8の位置を一致させ、(a)の第2の突起6と(c)の各一方の導体箔9の左斜め下方部とが一致するようになっている。
The positional relationship between (a) and (c) in FIG. 2 matches the position of the
図1の(a)は、このような弾性部材1とシート部材10を用い、1枚のシート部材10の片側の面(例えば上側の面)で弾性部材1の突起のない平らな面をシート部材10に向けて、第2の突起6の位置とシート部材10の貫通孔8の位置とが合うようにして向かい合わせ、反対側の面(例えば下側の面)では、別の弾性部材1の突起のない平らの面をシート部材10に向けて、第1の突起3の貫通孔4に充填されている導体5の位置とシート部材10の貫通孔8の位置とが合うようにして対向させている。
FIG. 1 (a) uses such an elastic member 1 and a sheet member 10, and a flat surface without projections of the elastic member 1 on one surface (for example, the upper surface) of one sheet member 10 is a sheet. The elastic member 1 faces the member 10 so that the position of the second protrusion 6 and the position of the through
そして、上側と下側の弾性部材1それぞれの外側面には別のシート部材10の一方の導体箔9が形成されている一面側を表側に向け、その貫通孔8と弾性部材1の導体5とが向き合うようにして対向させている。
このように対向させ、(b)のように互いに当接させた状態にすると、弾性部材1の導体5とシート部材10の一面に形成された一方の導体箔9とが導通するとともに弾性部材1とシート部材10からなる5層構造が構成される。
And the one surface side in which one conductor foil 9 of another sheet member 10 is formed in the outer surface of each of the upper and lower elastic members 1 faces the front side, and the through
When facing each other and contacting each other as shown in (b), the
図3は、図1から、第1の突起および第2の突起の1組部分を取り出して拡大するとともに、その上側面および下面側に接続対象である回路基板を配した図である。
上基板パッド14は、電気接続部材の上側の弾性部材1の第2の突起6の位置に対応するように配置され、下基板パッド15は、電気接続部材の下側の弾性部材1の第2の突起6の位置に対応するように配置される。
FIG. 3 is a diagram in which a set portion of the first protrusion and the second protrusion is taken out from FIG. 1 and enlarged, and a circuit board to be connected is arranged on the upper side surface and the lower surface side thereof.
The upper substrate pad 14 is disposed so as to correspond to the position of the second protrusion 6 of the elastic member 1 on the upper side of the electrical connection member, and the lower substrate pad 15 is the second of the elastic member 1 on the lower side of the electrical connection member. It arrange | positions so that it may respond | correspond to the position of protrusion 6 of this.
この状態で、(b)のように、図示されていない押さえ機構により上下の基板に電気接続部材を挟むような力が加わると、まず、上下のシート部材10が上下の各基板に当接する。それ以上に加圧していくと上下の弾性部材1の導体5がシート部材10の貫通孔8の部分を介して基板から反力を受け、この反力が真中のシート部材10を介して反対側の弾性部材1の第2の突起6を突起の底部分から突起先端へ向け押し付けることになる。
In this state, as shown in (b), when a force that sandwiches the electrical connection member is applied to the upper and lower substrates by a pressing mechanism (not shown), first, the upper and lower sheet members 10 come into contact with the upper and lower substrates. When the pressure is further increased, the
その結果、上下の弾性部材1の第2の突起6はシート部材10を上基板パッド14、下基板パッド15へ押し付けることになる。この押し付けられる部分には、貫通孔8の部分から連なる一方の導体箔9が設けられているので、この導体箔が、上基板パッド14、下基板パッド15に接触することになる。第2の突起が弾性を有するうえ、シート部材10の薄膜樹脂7および一方の導体箔9はいずれも薄く可撓性に富んでいるので、基板のパッドが、上基板パッド14、下基板パッド15のようにソルダレジストの存在によってパッド面が窪んでいてもこの窪みに応じて変形し、各パッドと一方の導体箔9とは面接触する。
一方の導体箔9の周囲に図2の(c)に示すような切り欠き11がある場合には、一層面接触し易くなるという効果がある。
As a result, the second protrusions 6 of the upper and lower elastic members 1 press the sheet member 10 against the upper substrate pad 14 and the lower substrate pad 15. Since the pressed portion is provided with one conductor foil 9 that continues from the portion of the through
When there is a notch 11 as shown in FIG. 2C around one conductor foil 9, there is an effect that the surface contact is further facilitated.
以上のようにして、上基板パッド14は、上側のシート部材10の一方の導体箔9に接し、貫通孔8部分を経て、上側の弾性部材1の導体5、それと接する真中のシート部材10の一方の導体箔9、その貫通孔8、下側の弾性部材1の導体5、下側のシート部材10の貫通孔8、その一方の導体箔9を経て下基板パッド15と電気的に接続されることになる。
As described above, the upper substrate pad 14 is in contact with one conductor foil 9 of the upper sheet member 10 and through the through-
本実施例では、弾性部材の第1の突起や第2の突起、およびシート部材の貫通孔や導体箔の配置を図2のようにしているが、これらの配置は、これらに限られるものではなく、むしろ、接続対象である回路基板の電極や半導体チップのパッドの配置に合わせて種々の配置を採り得るものである。
本実施例では、導体5をはんだ等により形成したが、導電粒子を含んだ樹脂等の導電部材や導電性接着材等を用いても良い。
In the present embodiment, the arrangement of the first protrusion and the second protrusion of the elastic member and the through holes and conductor foil of the sheet member is as shown in FIG. 2, but these arrangements are not limited to these. Rather, various arrangements can be adopted in accordance with the arrangement of the electrodes of the circuit board to be connected and the pads of the semiconductor chip.
In this embodiment, the
弾性部材およびシート部材で5層を積層した状態ではんだリフローにより、シート部材10の他方の導体箔9′と導体5の突起先端側、導体5の突起と反対側の端部とシート部材の一方の導体箔9とがはんだ付けされて電気接続部材として一体化しても良い。
One of the sheet member and the other conductor foil 9 ′ of the sheet member 10 and the protrusion tip side of the
1 弾性部材
2 弾性材
3 第1の突起
4 貫通孔
5 導体
6 第2の突起
7 薄膜樹脂
8 貫通孔
9 一方の導体箔
9′ 他方の導体箔
10 シート部材
11 切り欠き
12 上基板
13 下基板
14 上基板パッド
15 下基板パッド
16 ソルダレジスト
17 接点部
18 接点部
19 ワイヤ
20 ゴム弾性シート体
DESCRIPTION OF SYMBOLS 1 Elastic member 2 Elastic material 3 1st protrusion 4 Through-
Claims (2)
(イ) 弾性材からなり、板状基部の片面に、予め定めた間隔を置いて2個で1組の突起が1組以上整列して形成され、各組の突起のうち一方側の突起には基部をも貫く貫通孔を有し、該貫通孔には導体が両端で弾性材の表面と面一になるように充填された弾性部材。
(ロ) 薄膜樹脂の一面側に、前記1組2個の突起にかけ渡る長さおよび幅の一方の導体箔が前記弾性部材の突起の配置に合わせて配設され、導体箔の一方端寄りには薄膜樹脂を貫く貫通孔を有し、この貫通孔を通して反対面側の他面側に形成された他方の導体箔との導通が可能なシート部材。
(ハ) (イ)の弾性部材2個を突起のない方の面を向い合わせ、互いに導体の貫通している突起の位置と貫通していない突起の位置同士を位置合わせし、その間に(ロ)のシート部材を挟み、シート部材の他面側の弾性部材の導体にはシート部材の貫通孔を合わせ、シート部材の一面側の弾性部材の導体には該導体箔部分を合わせ、弾性部材の突起がある側の各面には、シート部材の一面側を表側にして、その貫通孔を弾性部材の導体に位置合わせして、上記5層の部材を重ね密着させた重ね構造。 An electrical connection member characterized by having a structure in which the following members (a) and (b) are stacked as shown in (c).
(A) It is made of an elastic material, and one set of protrusions is formed in a line on the one side of the plate-like base portion at a predetermined interval. Is an elastic member that has a through-hole penetrating through the base portion, and the through-hole is filled so that the conductor is flush with the surface of the elastic material at both ends.
(B) On one side of the thin film resin, one conductor foil having a length and a width extending over the two protrusions in one set is arranged in accordance with the arrangement of the protrusions of the elastic member, and close to one end of the conductor foil. Is a sheet member having a through-hole penetrating through the thin-film resin, and being able to conduct with the other conductor foil formed on the other side of the opposite surface through the through-hole.
(C) The two elastic members in (a) are faced to the surface without projections, and the positions of the projections through which the conductor penetrates and the positions of the projections that do not penetrate each other are aligned. ), The through hole of the sheet member is aligned with the conductor of the elastic member on the other side of the sheet member, the conductor foil portion is aligned with the conductor of the elastic member on the one side of the sheet member, A stacked structure in which the above-mentioned five layers of members are placed in close contact with each other on the side where the protrusions are located, with one side of the sheet member being the front side and the through-holes being aligned with the conductors of the elastic member.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007291669A JP5006162B2 (en) | 2007-11-09 | 2007-11-09 | Electrical connection member |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007291669A JP5006162B2 (en) | 2007-11-09 | 2007-11-09 | Electrical connection member |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009117745A JP2009117745A (en) | 2009-05-28 |
JP5006162B2 true JP5006162B2 (en) | 2012-08-22 |
Family
ID=40784503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007291669A Expired - Fee Related JP5006162B2 (en) | 2007-11-09 | 2007-11-09 | Electrical connection member |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5006162B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5325440B2 (en) * | 2008-03-26 | 2013-10-23 | 株式会社フジクラ | Electronic component mounting substrate, manufacturing method thereof, and electronic circuit component |
JP5462732B2 (en) * | 2010-06-29 | 2014-04-02 | モレックス インコーポレイテド | Sheet-like connector and manufacturing method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63152248U (en) * | 1987-03-25 | 1988-10-06 | ||
WO2004039135A1 (en) * | 2002-10-24 | 2004-05-06 | International Business Machines Corporation | Land grid array fabrication using elastomer core and conducting metal shell or mesh |
JP2007064935A (en) * | 2005-09-02 | 2007-03-15 | Jsr Corp | Relay substrate, its manufacturing method, inspection apparatus using relay substrate, and method for inspecting circuit board using the same |
JP4631621B2 (en) * | 2005-09-02 | 2011-02-16 | Jsr株式会社 | Circuit board inspection apparatus and circuit board inspection method |
-
2007
- 2007-11-09 JP JP2007291669A patent/JP5006162B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2009117745A (en) | 2009-05-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100386758B1 (en) | Anisotropic conductor film, semiconductor chip, and method of packaging | |
CN217721588U (en) | Laminated body | |
JP2007329431A (en) | Piezoelectric exciter | |
JP2003100371A (en) | Wiring board with terminal | |
WO2019131647A1 (en) | Substrate and substrate joining structure | |
JP5006162B2 (en) | Electrical connection member | |
US10559437B1 (en) | Membrane switch device and keyboard device | |
JP2011151103A (en) | Electronic component interconnecting structure and connecting method | |
JP2011253979A (en) | Connecting structure of printed wiring board, wiring board connector and electronic device | |
KR20070105982A (en) | Connection component, multilayer substrate | |
JP5679266B2 (en) | Printed wiring board connection structure, wiring board connector and electronic device | |
JPH0574512A (en) | Connector for electric connection | |
JP2001203229A (en) | Semiconductor device and manufacturing method thereof, and circuit substrate and electronic apparatus | |
US10188000B2 (en) | Component mounting board | |
JP4699089B2 (en) | Chip-on-film semiconductor device | |
JPWO2015118951A1 (en) | Resin multilayer board and component module | |
JP2005011859A (en) | Composite wiring board | |
JP2012227320A (en) | Semiconductor device | |
JP2014229631A (en) | Flexible printed wiring board | |
JP2011253926A (en) | Double-sided flexible printed wiring board, connection structure and electronic apparatus | |
JP2954559B2 (en) | Wiring board electrode structure | |
JP4085609B2 (en) | Wiring board with terminals | |
JP2020136303A (en) | Wiring structure and method for manufacturing wiring structure | |
JP4336617B2 (en) | Printed wiring board and manufacturing method thereof | |
JP4930712B2 (en) | Anisotropic conductive film |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20091111 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120518 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120524 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150601 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |