JP2007064934A - Relay substrate, its manufacturing method, inspection apparatus using relay substrate, and method for inspecting circuit board using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for inspecting circuit boards and capable of highly reliable electrical inspection even if circuit boards to be inspected have fine-pitch electrodes. <P>SOLUTION: A relay pin unit 31 is provided with an intermediate holding plate 36, a first supporting pin 33 arranged between a first insulating plate 34 and the intermediate holding plate 36, and a second supporting pin 37 arranged between a second insulating plate 35 and the intermediate holding plate 36. A first contact supporting position of the first supporting pin to the intermediate holding plate and a second contact supporting position of the second supporting pin to the intermediate holding plate are arranged at different positions in a plane of projection of the intermediate holding plate projected to the thickness direction of the intermediate holding plate. An insulating part 62 made of an elastic high molecular substance and electrically-conductive-path forming parts 61 made of an elastic high molecular substance containing electrically conductive particles to be passed through the thickness direction of the insulating part 62 are formed in a plurality of through holes formed in a substrate in a relay substrate 29. The relay substrate 29 is mounted to relay electrical connection between a substrate 23 for pitch conversion and a circuit board 1 to be inspected. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention provides a relay board that is arranged on both sides of a circuit board to be inspected for electrical inspection (hereinafter referred to as “circuit board to be inspected”) and guides the conduction of terminals of the circuit board to the outside, and the relay board. And an inspection apparatus using the relay substrate, and further, a circuit board inspection method using the inspection apparatus.

  A printed circuit board for mounting an integrated circuit or the like is inspected for electrical characteristics in order to confirm that the wiring pattern of the circuit board has a predetermined performance before mounting the integrated circuit or the like.

In this electrical inspection, for example, an inspection head is incorporated into an inspection tester having a circuit board transport mechanism, and different circuit boards are inspected by exchanging the inspection head portion.
For example, as disclosed in Patent Document 1, a method using an inspection jig having a structure in which a metal inspection pin that is in electrical contact with an inspection target electrode of a circuit board to be inspected is implanted on the substrate is proposed. ing.

  In addition, as disclosed in Patent Document 2, there is a method using an inspection jig in which an inspection head having a conductive pin, a circuit board for pitch conversion called an off-grid adapter, and an anisotropic conductive sheet are combined. Are known.

  However, in the method using an inspection jig in which a metal inspection pin is brought into direct contact with an inspected electrode of a circuit board to be inspected as in Patent Document 1, the electrode of the inspected circuit board is damaged by contact with a conductive pin made of metal. there's a possibility that.

  In particular, in recent years, circuit circuit boards have been miniaturized and densified, and when inspecting such a printed circuit board, in order to bring a large number of conductive pins into conductive contact simultaneously with the electrodes to be inspected of the circuit board to be inspected. It is necessary to press the inspection jig with a high pressure, and the electrode to be inspected is easily damaged.

  In such an inspection jig for inspecting a miniaturized and high-density printed circuit board, it is becoming technically difficult to implant a large number of high-density metal pins on the board. In addition, the manufacturing cost is expensive, and it is difficult to repair or replace some of the metal pins when they are damaged.

  On the other hand, as in Patent Document 2, in an inspection jig using an anisotropic conductive sheet, the electrode to be inspected of the circuit board to be inspected is in contact with the electrode of the substrate for pitch conversion through the anisotropic conductive sheet. Therefore, there is an advantage that the electrode to be inspected of the circuit board to be inspected is hardly damaged. In addition, since a substrate that performs pitch conversion is used, inspection pins to be implanted on the substrate can be implanted at a pitch wider than the pitch of the electrode to be inspected on the circuit substrate to be inspected, so that inspection is performed at a fine pitch. There is an advantage that the manufacturing cost of the inspection jig can be saved without having to plant pins.

  However, in this inspection jig, since it is necessary to create a pitch conversion board and an inspection jig in which an inspection pin is implanted for each circuit board to be inspected, the circuit board to be inspected The same number of inspection jigs as the printed circuit board is required.

  For this reason, in the case where a plurality of printed circuit boards are produced, there is a problem that a plurality of inspection jigs must be held correspondingly. In particular, in recent years, the product cycle of electronic devices has been shortened, and the production period of printed circuit boards used in products has been shortened. With this, inspection jigs cannot be used for a long time, There is a problem that an inspection jig must be produced each time the production of a printed circuit board is switched.

As a countermeasure against such a problem, for example, as in Patent Documents 3 to 5, an inspection apparatus using a so-called universal type inspection jig using a relay pin unit has been proposed.
FIG. 30 is a cross-sectional view of an inspection apparatus using such a universal type inspection jig. The inspection apparatus includes a pair of a first inspection jig 111a and a second inspection jig 111b, which include circuit board side connectors 121a and 121b, relay pin units 131a and 131b, Tester side connectors 141a and 141b are provided.

  Circuit board side connectors 121a and 121b include pitch conversion boards 123a and 123b, relay boards (first anisotropic conductive sheets) 122a and 122b arranged on both sides thereof, and second anisotropic conductive sheets. 126a, 126b.

  The relay pin units 131a and 131b have a large number of conductive pins 132a and 132b (for example, 5000 pins) arranged on lattice points at a constant pitch (for example, 2.54 mm pitch), and the conductive pins 132a and 132b can be moved up and down. It has a pair of insulating plates 134a and 134b to support.

  The tester-side connectors 141a and 141b include connector boards 143a and 143b that electrically connect the tester and the conductive pins 132a and 132b when the circuit board 101 to be inspected is clamped by the inspection jigs 111a and 111b. 143a and 143b have third anisotropic conductive sheets 142a and 142b arranged on the conductive pins 132a and 132b side, and base plates 146a and 146b.

  The inspection jig using the relay pin units 131a and 131b replaces the circuit board side connectors 121a and 121b with ones corresponding to the circuit board 101 to be inspected when inspecting printed circuit boards that are different objects to be inspected. The relay pin units 131a and 131b and the tester side connectors 141a and 141b can be used in common.

  By the way, the printed wiring board which is the circuit board 101 to be inspected has been multi-layered and densified. Actually, in the thickness direction, for example, the height variation due to the inspected electrodes 102 and 103 such as solder ball electrodes such as BGA, The substrate itself is warped. Therefore, in order to achieve electrical connection to the electrodes 102 and 103 to be inspected, which are inspection points on the circuit board 101 to be inspected, the first inspection jig 111a and the second inspection jig 111b are moved at a high pressure. It is necessary to deform the circuit board 101 to be inspected flatly by applying pressure. In addition, for the height variations of the electrodes 102 and 103 to be inspected, it is necessary to follow the heights of the electrodes 102 and 103 to be inspected by the first inspection jig 111a and the second inspection jig 111b.

  In such a conventional universal type inspection jig, in order to ensure followability with respect to the height of the electrodes 102 and 103 to be inspected, the conductive pins 132a and 132b are followed by movement in the axial direction. Since the amount of movement in the axial direction of 132a and 132b is also limited, the following ability to the height of the electrodes 102 and 103 to be inspected may not be good, and a continuity failure occurs and accurate inspection cannot be performed. Become.

In such a universal type inspection jig, the press pressure when the circuit board 101 to be inspected is clamped by the first inspection jig 111a and the second inspection jig 111b is the upper and lower relay boards. It is absorbed by 122a, 122b and anisotropic conductive sheets 126a, 126b, 142a, 142b.

  Therefore, in such a universal type inspection jig, it is necessary to arrange the conductive pins 132a and 132b at regular intervals in order to support the pitch conversion substrates 123a and 123b and disperse the press pressure.

  Further, in the conventional universal type inspection jig, the press pressure is received by the conductive pins 132a and 132b, so that it is necessary to arrange a large number of conductive pins 132a and 132b at regular intervals.

  For this reason, in response to the miniaturization of the electrodes of the circuit board 101 to be inspected, for example, when forming the insulating plates 134a and 134b having 10,000 or more through holes at a pitch of 0.75 mm, the substrates of the insulating plates 134a and 134b If the thickness of the insulating plate 134 is thin, the strength becomes low, and it may crack when bent. Therefore, it is necessary to make the insulating plates 134a and 134b thicker.

  However, when the diameter of the through hole to be formed becomes as fine as, for example, about 0.5 mm, and the thickness of the insulating plates 134a and 134b is 5 mm or more, when trying to form the through hole by one drilling process, Due to the strength of the drill blade, there are many cases where the drill blade is broken or broken and fails to process the insulating plate.

  For this reason, the insulating plate is processed by drilling from one side of the insulating plate to about half the thickness, and further forming the through hole by drilling the same part from the other side. There is a problem that a drilling operation twice as many as the number of through holes formed in the insulating plate is required, and the processing step becomes complicated.

  Further, in such a conventional universal type inspection jig, as the relay boards 122a and 122b constituting the circuit board side connector, a plurality of conductive path forming parts extending in the thickness direction and insulation for insulating these conductive path forming parts from each other. Using an unevenly distributed anisotropic conductive sheet in which conductive particles are contained only in the conductive path forming part and are dispersed unevenly in the plane direction, and the conductive path forming part protrudes on one side of the sheet. It was. This anisotropic conductive sheet deteriorates the resistance of the conductive path due to repeated use in inspection (increases in resistance value), and when replacing the anisotropic conductive sheet, the anisotropic conductive sheet and pitch conversion each time it is replaced Alignment with the substrate and alignment between the circuit board side connector and the relay pin unit are necessary, and this alignment operation is complicated and causes a reduction in inspection efficiency.

  On the other hand, as shown in FIG. 31, a relay substrate in which a plurality of conductive path forming portions 61 are formed in an insulating portion 62 made of an elastic polymer material disposed in the through hole of the support 73 is provided by the present applicant. (Patent Document 6). In the relay substrate of Patent Document 6 shown in FIG. 31, conductive particles exhibiting magnetism in the conductive path forming portion 61 are oriented in the thickness direction of the insulating portion 62. Further, the protruding portion 61 a of the conductive path forming portion 61 protrudes from the surface of the insulating portion 62, and the metal film 64 is provided on both end faces of the conductive path forming portion 61.

Thus, by providing the metal film 64 on the end face of the conductive path forming portion 61, the pressure deformation of the conductive path forming portion 61 is facilitated, and the conductive path forming portion 61 has sufficient space between the conductive particles. Electrical contact can be obtained.
JP-A-6-94768 Japanese Patent Laid-Open No. 5-159821 JP 7-248350 A Japanese Patent Application Laid-Open No. 8-271469 JP-A-8-338858 Japanese Patent Application No. 2005-205684

  However, as disclosed in Patent Document 6 of FIG. 31, the relay substrate in which the conductive path forming portion 61 protrudes from the insulating portion 62 and the metal film 64 is provided on the end surface of the protruding portion 61 a is a circuit board. When used in this inspection device, there were the following problems.

That is, in the inspection of the circuit board, the same pressing operation is repeated tens of thousands of times, so that the metal film 64 sometimes falls off the end face of the conductive path forming portion 61 in some cases.
Therefore, when such a dropout occurs, a new relay board is prepared, and the dropout of the metal film 64 is periodically checked, and when the dropout occurs, it is replaced with a new relay board. There was a problem that had to be done.

  In view of such circumstances, the present invention provides a relay board that prevents the metal film installed on the conductive path forming portion of the relay board from dropping as much as possible and can improve durability by repeated use. The purpose is that.

Another object of the present invention is to provide a method of manufacturing a relay board that can easily manufacture a relay board that can sufficiently improve durability.
Another object of the present invention is to provide a circuit board inspection apparatus suitable for inspecting a circuit board while improving durability by repeated use using such a relay board.

  Another object of the present invention is to provide a circuit board inspection method using such an inspection apparatus.

The relay board according to the present invention is
While relaying the electrical connection between the circuit board to be inspected and the pitch conversion board that converts the pitch of the electrodes between the one side and the other side,
A plurality of conductive path forming portions contained in the elastic polymer material in a state where the conductive particles exhibiting magnetism are oriented in the thickness direction are mutually connected through the insulating silicon film in the through holes formed in the support. In addition, a contact member made of metal is integrally provided at the thickness direction end portion of the conductive path forming portion, and the top portion of the contact member is formed from the insulating silicon film. It is characterized by being arranged to protrude outward in the direction.

With the relay board having such a configuration, the electrical connection between the circuit board to be inspected and the board for pitch conversion can be ensured.
Further, in the present invention, between the contact member and the conductive path forming portion,
When the liquid silicone rubber on the contact member side applied so as to surround the side peripheral surface of the contact member is heated and pressurized and cured, it is cured together with the liquid silicone rubber on the support side that has been previously applied to the support side. It is characterized by being integrated.

  According to the relay substrate having such a configuration, liquid silicon rubber is applied around the contact member, and when this liquid silicon rubber is cured, it is cured integrally with the liquid silicon rubber previously applied to the support side. Therefore, adhesion between the contact member, that is, the member corresponding to the metal film of Patent Document 6 and the conductive path forming portion is ensured.

  In the present invention, the liquid silicon rubber previously applied to the side peripheral surface of the contact member and the liquid silicon rubber previously applied to the support body side are formed through the support body by being pressurized. It is preferably extended to the outer region of the hole.

If it is such a structure, the adhesive force of a contact member can be improved as much as possible.
Furthermore, in the present invention, the liquid silicone rubber previously applied to the support side is applied such that the liquid level rises outward with respect to the surface of the support and the surface of the conductive path forming portion during application. It is preferable.

With such a configuration, the liquid silicone rubber is sufficiently secured, so that the adhesion effect is improved.
Further, in the present invention, the contact member presses the conductive path forming portion inward at the time of pressurization, and the liquid silicon is in a state in which a front end surface of the contact member enters the inside of the conductive path forming portion. The rubber is preferably cured.

  With such a configuration, the contact member is cured in a state where it presses the conductive portion forming portion and enters inward, so that the contact between the conductive path forming portion and the contact member is ensured. Thereby, the conduction | electrical_connection of test object can be made favorable.

Furthermore, in the method for manufacturing a relay substrate according to the present invention, the inside of the resist layer of the composite film of the metal layer and the resist layer is formed on the lower surface side of the support in which the through-hole to be coated with the conductive paste is formed in advance. A first composite film disposing step of disposing a composite film pre-plated with a magnetic metal having a thickness substantially the same as the thickness of the resist layer in a direction in which the metal layer side of the composite film faces the support side; ,
A conductive paste application step of applying a conductive paste into the through-hole formed in the support;
Another composite film having the same structure as that of the composite film used in the first composite film arranging step is formed on the upper surface side of the support on which the conductive paste is applied in the through hole. A second composite film arrangement step of arranging the layer side in a direction facing the support side;
By applying a magnetic field in the thickness direction of the conductive paste to the support in which the composite films are respectively disposed on both upper and lower surfaces of the support and the conductive paste is applied in the through holes, A magnetic field orientation step of orienting the magnetic particles in the conductive paste, thereby forming a conductive path forming portion by the magnetic particles;
A recess forming step for applying liquid silicon rubber to form a recess for applying liquid silicon rubber around the conductive path forming portion by performing laser processing on the magnetically oriented support.
A plating metal holder preparing step of preparing a plating metal holding plate for a metal contact in which a plating metal for a metal contact is provided on one surface of the metal layer in advance and liquid silicon rubber is applied around the plating metal; ,
A liquid silicon rubber application step of applying liquid silicon rubber into the support unit obtained in the recess formation step for applying liquid silicon rubber;
The plating metal holder obtained in the plating metal holder preparation step and the support unit obtained in the liquid silicon rubber coating step are pressed and overlapped so that the liquid silicon rubbers are in close contact with each other. Liquid silicon rubber curing step of curing the liquid silicon rubber in a state where the interface between the liquid silicon rubbers is eliminated by heating in a laminated state under pressure,
After the liquid silicon rubber is cured in the liquid silicon rubber curing step, by peeling the metal layers on both sides of the support unit, the plating metal is integrally provided on the top of the conductive path forming portion; It is characterized by having.

According to the method for manufacturing a relay board including such steps, the relay board can be manufactured.
Further, the circuit board inspection apparatus according to the present invention includes:
A circuit board inspection apparatus that performs electrical inspection by sandwiching both surfaces of a circuit board to be inspected between a pair of first inspection jigs and a second inspection jig between the inspection jigs. ,
The first inspection jig and the second inspection jig are respectively
A pitch conversion substrate for converting the electrode pitch between the one surface side and the other surface side; and
The insulating layer made of an elastic polymer material and an elastic polymer material containing conductive particles in a plurality of through holes formed in the substrate, which are arranged on the circuit board side to be inspected of the pitch conversion substrate. A conductive path forming portion that penetrates the portion in the thickness direction, and a relay substrate that relays electrical connection between the pitch conversion substrate and the circuit board to be inspected by the conductive path forming portion, and
A circuit board-side connector provided with a second anisotropic conductive sheet disposed on the opposite side of the pitch conversion board from the relay board;
A plurality of conductive pins arranged at a predetermined pitch; and
A relay pin unit comprising a pair of spaced apart first insulating plates and second insulating plates, which support the conductive pins movably in the axial direction;
A connector board for electrically connecting a tester and the relay pin unit; and
A third anisotropically conductive sheet disposed on the relay pin unit side of the connector board; and
A tester side connector provided with a base plate arranged on the opposite side of the relay pin unit of the connector board,
The relay pin unit is
An intermediate holding plate disposed between the first insulating plate and the second insulating plate; and
A first support pin disposed between the first insulating plate and the intermediate holding plate; and
A second support pin disposed between the second insulating plate and the intermediate holding plate,
A first abutting support position of the first support pin with respect to the intermediate holding plate and a second abutting support position of the second support pin with respect to the intermediate holding plate are projected in the thickness direction of the intermediate holding plate. It is arranged at different positions on the intermediate holding plate projection surface,
The relay board is
A plurality of conductive path forming portions contained in the elastic polymer material in a state where the conductive particles exhibiting magnetism are oriented in the thickness direction are mutually connected through the insulating silicon film in the through holes formed in the support. In addition, a contact member made of metal is integrally provided at the thickness direction end portion of the conductive path forming portion, and the top portion of the contact member is formed from the insulating silicon film. Arranged to protrude outward in the direction,
Between the contact member and the conductive path forming portion,
When the liquid silicon rubber on the contact member side applied so as to surround the side peripheral surface of the contact member is heated and pressurized and cured, it is cured together with the liquid silicon rubber applied in advance on the support side. It is characterized by being integrated by the adhesive force when the silicone rubber is cured without the interface.

  With this configuration, when electrical inspection is performed by sandwiching both surfaces of the circuit board to be inspected between the first inspection jig and the second inspection jig, initial pressure is applied. In the stage, the pressure is applied by rubber elastic compression of the relay pin unit in the thickness direction by the conductive pins, the elastic portion of the relay board, the second anisotropic conductive sheet, and the third anisotropic conductive sheet. It is possible to absorb to some extent the height variation of the electrodes to be inspected of the circuit board to be inspected.

The first contact support position of the first support pin with respect to the intermediate holding plate and the second contact support position of the second support pin with respect to the intermediate support plate are in the thickness direction of the intermediate support plate. Since it is arranged at different positions on the projected intermediate holding plate projection surface, when the circuit board to be inspected is further pressurized between the first inspection jig and the second inspection jig, In addition to elastic elastic compression of the relay board, the second anisotropic conductive sheet, and the third anisotropic conductive sheet, the first insulating plate of the relay pin unit, the second insulating plate, Due to the spring elasticity of the intermediate holding plate disposed between the first insulating plate and the second insulating plate, the height variation of the inspected electrode of the circuit board to be inspected, for example, the height variation of the solder ball electrode, The pressure concentration can be distributed to avoid local stress concentration.

  As a result, stable electrical contact is ensured for each of the electrodes to be inspected on the circuit board to be inspected having a height variation, and further, stress concentration is reduced. Damage is suppressed. As a result, since the repeated use durability of the relay board is improved, the number of times of replacement of the relay board is reduced, and the inspection work efficiency is improved.

Moreover, since there is no need to arrange the conductive pins at regular intervals, there is little drilling work by drilling through holes in the insulating plate holding the conductive pins, and the cost can be reduced.
Further, in the present invention, since the relay board provided with each of the plurality of through holes formed in the board by the elastic portion composed of the conductive path forming part and the surrounding insulating part is arranged, the pressing of the inspection jig The pressing force and impact due to the are absorbed by this elastic portion, and the electrodes of the circuit board to be inspected are not damaged or damaged.

  Furthermore, regardless of the arrangement pattern of the electrodes to be inspected on the circuit board to be inspected, the required electrical inspection can be reliably performed on the circuit board to be inspected. Even if the pitch is very small and densely arranged, the required electrical inspection can be reliably performed on the circuit board to be inspected.

The circuit board inspection apparatus according to the present invention includes:
When the both sides of the circuit board to be inspected are clamped between the two inspection jigs by the pair of the first inspection jig and the second inspection jig,
The intermediate holding plate bends in the direction of the second insulating plate around the first contact support position of the first support pin with respect to the intermediate holding plate, and
It is preferable that the intermediate holding plate bends in the direction of the first insulating plate around the second contact support position of the second support pin with respect to the intermediate holding plate.

  By configuring in this way, the intermediate holding plate bends in opposite directions with the first contact support position and the second contact support position as the center, so the first inspection jig and the second inspection plate When the circuit board to be inspected is further pressed between the inspection jigs, the spring elastic force of the intermediate holding plate is further exerted, and the height of the electrode to be inspected of the circuit board to be inspected With respect to the variation, the pressure concentration can be dispersed to avoid the local stress concentration, and the local breakage of the elastic portion of the relay board is suppressed. As a result, since the repeated use durability of the relay board is improved, the number of times of replacement of the relay board is reduced, and the inspection work efficiency is improved.

Furthermore, the circuit board inspection apparatus according to the present invention includes:
A first contact support position of the first support pin with respect to the intermediate holding plate is arranged in a lattice shape on the intermediate holding plate projection surface;
Second contact support positions of the second support pins with respect to the intermediate holding plate are arranged in a grid pattern on the intermediate holding plate projection surface,
In the intermediate holding plate projection surface, one second abutment support position is disposed in a unit lattice region composed of four adjacent first abutment support positions, and
In the intermediate holding plate projection surface, it is preferable that one first abutment support position is disposed in a unit lattice region composed of four adjacent second abutment support positions.

  With this configuration, the first abutment support position and the second abutment support position are arranged in a grid pattern, and the grid points of the first abutment support position and the second abutment support position are arranged. The positions are all arranged at positions shifted.

  Accordingly, the intermediate holding plate bends in opposite directions around the first contact support position and the second contact support position, and the first inspection jig and the second inspection jig. When the circuit board to be inspected is pressed between the two, the spring elastic force of the intermediate holding plate is further exerted, and the pressure against the height variation of the electrode to be inspected of the circuit board to be inspected The concentration can be distributed to further avoid local stress concentrations. Therefore, local breakage of the elastic portion of the relay board is suppressed, and as a result, the repeated use durability of the anisotropic conductive sheet is improved, so that the number of times of replacement of the relay board is reduced and the inspection work efficiency is improved.

Further, the circuit board inspection apparatus of the present invention comprises:
The relay pin unit is
A plurality of intermediate holding plates disposed at a predetermined interval between the first insulating plate and the second insulating plate;
Holding plate support pins arranged between adjacent intermediate holding plates;
With
In at least one intermediate holding plate, a holding support position of the holding plate support pin that contacts the intermediate holding plate from one surface side with respect to the intermediate holding plate, and a first surface that contacts the intermediate holding plate from the other surface side. The support support position of the first support pin, the second support pin, or the holding plate support pin with respect to the intermediate holding plate is arranged at a different position on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate. It is preferable that

  With this configuration, the spring elasticity is further exhibited by the plurality of intermediate holding plates, and the pressure concentration is dispersed with respect to the height variation of the inspected electrode of the inspected circuit board. Local stress concentration can be further avoided, and local breakage of the elastic portion of the relay board is suppressed. As a result, since the repeated use durability of the relay board is improved, the number of times of replacement of the relay board is reduced, and the inspection work efficiency is improved.

Further, the circuit board inspection apparatus of the present invention comprises:
In all of the intermediate holding plates, the holding plate supporting pins that come into contact with the intermediate holding plate from one surface side are in contact with and supported by the intermediate holding plate, and the intermediate holding plate comes into contact with the intermediate holding plate from the other surface side. The support support position of the first support pin, the second support pin, or the holding plate support pin with respect to the intermediate holding plate is arranged at a different position on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate. It is preferable that
As a result, the abutting support position of the holding plate support pin with the intermediate holding plate is shifted between the adjacent intermediate holding plates, so that the spring elasticity of the plurality of intermediate holding plates is further exhibited. As a result, the pressure concentration can be dispersed with respect to the height variation of the inspected electrode of the circuit board to be inspected, and the local stress concentration can be further avoided, and the elastic portion of the relay substrate is locally damaged. It is suppressed. As a result, since the repeated use durability of the relay board is improved, the number of times of replacement of the relay board is reduced, and the inspection work efficiency is improved.

Further, the circuit board inspection apparatus of the present invention comprises:
The second anisotropic conductive sheet includes a plurality of conductive path forming portions extending in the thickness direction and insulating portions that insulate the conductive path forming portions from each other, and the conductive particles are only in the conductive path forming portions. Thus, it is preferable that the conductive particles are dispersed non-uniformly in the surface direction, and the conductive path forming portion protrudes on the one side of the sheet.

Further, the circuit board inspection apparatus of the present invention comprises:
The third anisotropic conductive sheet is composed of a plurality of conductive path forming portions extending in the thickness direction and insulating portions that insulate these conductive path forming portions from each other, and the conductive particles are only in the conductive path forming portions. Thus, it is preferable that the conductive particles are dispersed non-uniformly in the surface direction, and the conductive path forming portion protrudes on the one side of the sheet.

  As described above, the second anisotropic conductive sheet and the third anisotropic conductive sheet are composed of the conductive path forming portion and the insulating portion, and the conductive particles are contained only in the conductive path forming portion and are in the plane direction. By using the unevenly anisotropic anisotropic conductive sheet that is unevenly distributed and the conductive path forming part protrudes on one side of the sheet, the pressure and impact due to the pressing of the inspection jig are absorbed by these sheets, Thereby, deterioration of the elastic part of the relay substrate is suppressed.

In one embodiment of the present invention,
The plurality of conductive pins are formed in a bar-shaped central portion that is shorter than the distance between the first insulating plate and the second insulating plate, and are formed on both ends of the central portion, and have a smaller diameter than the central portion. Consisting of a pair of ends,
The pair of end portions are respectively inserted through through-holes having a diameter smaller than that of the central portion formed in the first insulating plate and the second insulating plate and larger than that of the pair of end portions. Thus, the conductive pin is supported so as to be movable in the axial direction.

With such a configuration, the conductive pin can be held between the first insulating plate and the second insulating plate so as to be movable in the axial direction and not to drop off.
In another aspect of the present invention,
A through hole through which the conductive pin is inserted is formed between the first insulating plate and the intermediate holding plate, between the second insulating plate and the intermediate holding plate, or between the intermediate holding plates. A bent holding plate is provided,
The plurality of conductive pins are pressed laterally in opposite directions from each other with a through hole formed in the first and second insulating plates and a through hole formed in the bent holding plate as fulcrums. It is bent at the position of the through hole of the holding plate, and thereby the conductive pin is supported so as to be movable in the axial direction.

  With such a configuration, the conductive pin can be held between the first insulating plate and the second insulating plate so as to be movable in the axial direction and not to drop off. Furthermore, since the pin having a simple structure having a cylindrical shape can be used as the conductive pin, the cost of the conductive pin and the member holding the conductive pin as a whole can be suppressed.

The circuit board inspection method of the present invention is a circuit board inspection method using the circuit board inspection apparatus described above,
The electrical inspection is performed by sandwiching both surfaces of the circuit board to be inspected between the two inspection jigs by the pair of first inspection jig and the second inspection jig.

  According to the relay substrate according to the present invention, the contact member made of metal is integrated with the liquid silicon rubber applied to the conductive path forming part side by curing the liquid silicon rubber applied around the metal by heating. Thus, the adhesive force of the contact member to the conductive path forming portion can be strengthened. As a result, the relay substrate is prevented from falling off, and the durability can be improved repeatedly.

Furthermore, in the relay substrate according to the present invention, when the liquid silicon rubber is pressurized and extended to the outer region of the support, the adhesive force of the contact member can be further improved.
Further, in the relay substrate according to the present invention, if the liquid silicone rubber is cured with the metal contact member entering the inside of the conductive path forming portion, the adhesive force of the contact member can be further improved. it can.

  Further, according to the circuit board inspection apparatus of the present invention, the circuit board to be inspected has microelectrodes with a fine pitch such that the distance between the electrodes to be inspected is 50 μm or less, for example. However, it is possible to perform electrical inspection of a highly reliable circuit board.

  Further, according to the circuit board inspection apparatus of the present invention, the followability to the height variation of the inspected electrode of the inspected circuit board to be inspected is good, no conduction failure occurs, and an accurate inspection is performed. Is possible.

Moreover, since there is no need to arrange the conductive pins at regular intervals, there is little drilling work by drilling through holes in the insulating plate holding the conductive pins, and the cost can be reduced.
In addition, inspection can be performed with high resolution, and a step due to the inspection target electrode of the circuit substrate to be inspected can be absorbed well.

  Furthermore, according to the circuit board inspection method of the present invention, the circuit board can be repeatedly and satisfactorily tested.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, when referring to a pair of identical components (for example, the circuit board side connector 21a and the circuit board side connector 21b) in the first inspection jig and the second inspection jig, the symbol “ For example, the circuit board side connector 21a and the circuit board side connector 21b may be collectively referred to as “circuit board side connector 21”.

FIG. 1 is an exploded sectional view of an inspection apparatus according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a use state of the inspection apparatus shown in FIG. 1 during inspection.
This inspection apparatus performs an electrical inspection of a circuit board to be inspected by measuring an electrical resistance between electrodes to be inspected in a circuit board 1 to be inspected such as a printed circuit board for mounting an integrated circuit or the like. Is. This inspection apparatus incorporates relay boards 29a and 29b according to an embodiment of the present invention, and the relay boards 29a and 29b are shown in detail in FIG.

  In this inspection apparatus, as shown in FIGS. 1 and 2, the first inspection jig 11a disposed on the upper surface side of the circuit board 1 to be inspected and the second inspection jig disposed on the lower surface side. The jig 11b is disposed so as to face each other vertically.

  The first inspection jig 11a includes a circuit board side connector 21a including a relay board 29a and a second anisotropic conductive sheet 26a, which are main elements of the present invention, on both sides thereof, and a relay pin unit 31a. . The first inspection jig 11a includes a tester-side connector 41a including a connector substrate 43a on which the third anisotropic conductive sheet 42a is disposed on the relay pin unit 31a side and a base plate 46a. Yes.

  The second inspection jig 11b is configured in the same manner as the first inspection jig 11a, and includes a circuit board side connector 21b having a relay board 29b and a second anisotropic conductive sheet 26b on both sides thereof, and a relay pin. A unit 31b is provided. The second inspection jig 11b includes a tester-side connector 41b including a connector board 43b on which the third anisotropic conductive sheet 42b is disposed on the relay pin unit 31b side and a base plate 46b. Yes.

An electrode 2 to be inspected is formed on the upper surface of the circuit board 1 to be inspected, and an electrode 3 to be inspected is also formed on the lower surface thereof, and these are electrically connected to each other.
The circuit board-side connectors 21a and 21b include pitch conversion boards 23a and 23b, relay boards 29a and 29b arranged on one side thereof, and second anisotropic conductive sheets 26a arranged on the other side. 26b.

  3 is a diagram showing the surface of the pitch conversion substrate on the circuit board side to be inspected, FIG. 4 is a diagram showing the surface of the pitch conversion substrate on the relay pin unit side, FIG. 5 is a diagram showing the pitch conversion substrate, It is sectional drawing of the state which laminated | stacked the relay board | substrate and the to-be-inspected circuit board.

  On one surface of the pitch conversion substrate 23, that is, on the circuit board 1 side to be inspected, as shown in FIG. 3, a plurality of connection electrodes electrically connected to the electrodes 2 and 3 of the circuit board 1 to be inspected An electrode 25 is formed. These connection electrodes 25 are arranged so as to correspond to the patterns of the electrodes 2 and 3 to be inspected of the circuit board 1 to be inspected.

  On the other hand, the other surface of the pitch conversion board 23, that is, the side opposite to the circuit board 1 to be inspected, is electrically connected to the conductive pins 32a and 32b of the relay pin unit 31, as shown in FIG. A plurality of terminal electrodes 24 are formed. These terminal electrodes 24 are, for example, 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0.2 mm. They are arranged on lattice points having a constant pitch, and the pitch is the same as the arrangement pitch of the conductive pins 32a and 32b of the relay pin unit.

  Each connection electrode 25 in FIG. 3 is electrically connected to the corresponding terminal electrode 24 in FIG. 4 by a wiring 52 and an internal wiring 53 (see FIG. 5) penetrating in the thickness direction of the insulating substrate 51.

  For example, as shown in FIG. 5, the insulating portion on the surface of the pitch conversion substrate 23 includes an insulating layer 54 formed on the surface of the insulating substrate 51 so that the connection electrodes 25 are exposed. The thickness of the insulating layer 54 is preferably 5 to 100 μm, more preferably 10 to 60 μm. When this thickness is too small, it may be difficult to form an insulating layer having a small surface roughness. On the other hand, if this thickness is excessive, it may be difficult to electrically connect the connection electrode 25 and the conductive path forming portion of the relay substrate 29.

  As a material for forming the insulating substrate 51 of the pitch conversion substrate, a material generally used as a base material of a printed circuit board can be used. Specific examples include polyimide resins, glass fiber reinforced polyimide resins, glass fiber reinforced epoxy resins, and glass fiber reinforced bismaleimide / triazine resins.

  As a material for forming the insulating layers 54 and 55 in FIG. 5, a polymer material that can be formed into a thin film can be used. Specific examples thereof include an epoxy resin, an acrylic resin, a phenol resin, a polyimide resin, a polyamide resin, a mixture thereof, and a resist material.

  The pitch conversion substrate 23 can be manufactured, for example, as follows. First, a laminated material in which a thin metal layer is laminated on both sides of a flat insulating substrate is prepared, and a plurality of layers that penetrates in the thickness direction of the laminated material corresponding to the pattern of terminal electrodes to be formed with respect to this laminated material. The through hole is formed by a numerically controlled drilling apparatus, a photo etching process, a laser processing process, or the like.

  Next, electroless plating and electrolytic plating are performed in the through holes formed in the laminated material to form via holes connected to the thin metal layers on both sides of the substrate. Thereafter, a photoetching process is performed on the thin metal layer to form a wiring pattern and connection electrodes on the surface of the insulating substrate, and to form terminal electrodes on the opposite surface.

  Then, as shown in FIG. 5, the insulating layer 54 is formed on the surface of the insulating substrate 51 so that the connection electrodes 25 are exposed, and the terminal electrodes 24 are exposed on the opposite surface. The pitch conversion substrate 23 is obtained by forming the insulating layer 55 on the substrate. The thickness of the insulating layer 55 is preferably 5 to 100 μm, more preferably 10 to 60 μm.

  FIG. 6A is a cross-sectional view of the relay board of this embodiment, and FIG. 6B is a partially enlarged cross-sectional view thereof. A through hole 73 c in which the conductive path forming portion 61 is arranged according to the electrode pattern of the pitch conversion substrate 23 is formed in the support body 73 serving as a base material of the relay substrate 29. An insulating part 62 is formed in the through hole 73c by embedding an elastic polymer material, and the conductive path forming part 61 is disposed so as to be surrounded by the insulating part 62.

The conductive path forming portion 61 contains the conductive particles P exhibiting magnetism in the insulating elastic polymer material in an aligned state in the thickness direction.
As shown in FIG. 6B, the relay substrate 29 is formed of two types of silicon rubber. That is, the first cured silicon rubber constituting the insulating portion 62 made of an elastic polymer material located on the outermost side of the through hole 73c of the support 73, and the silicon rubber is applied in a separate process and then cured. Liquid silicon rubbers G and H. As shown in FIG. 6B, the liquid silicon rubber G is formed by forming a through hole 62c around the conductive path forming portion 61 by laser processing the first cured insulating portion 62, and the inside of the through hole 62c. It was applied to. Further, the liquid silicon rubber G is integrally cured with the liquid silicon rubber H applied to the contact member 15 side when the contact member 15 is later attached to the end face of the conductive path forming portion 61. In this embodiment, the liquid silicon rubbers G and H are integrally cured by heating, so that the metal contact member 15 is firmly bonded to the end face of the conductive path forming portion 61.

  In the conductive path forming portion 61 formed in the thickness direction in the through hole 73c of the support 73, the conductive particles P exhibiting magnetism in the insulating elastic polymer substance are oriented so as to be aligned in the thickness direction. Contained.

  On the other hand, the insulating portion 62 is formed of an elastic polymer material that does not contain conductive particles. The elastic polymer material constituting the conductive path forming portion 61 and the elastic polymer material constituting the insulating portion 62 may be of the same type or different types.

  Specific examples of the material for forming the support 73 of the relay substrate include composite resin materials such as glass fiber reinforced polyimide resin, glass fiber reinforced epoxy resin, glass fiber reinforced bismaleimide / triazine resin, and polyimide. Resin, polyester resin, polyaramid resin, polyamide resin, bismaleimide / triazine resin, resin material with high mechanical strength such as liquid crystal polymer, metal material such as stainless steel, fluorine resin fiber, aramid fiber, polyethylene fiber, polyarylate fiber, nylon Examples thereof include meshes made of organic fibers such as fibers, polyester fibers, and liquid crystal polymer fibers, nonwoven fabrics, and metal meshes. The thickness of the support 73 is preferably 20 to 200 μm, more preferably 30 to 100 μm, although it depends on the forming material.

  A conductive path forming portion 61 corresponding to the connection electrode 25 is disposed in each of a large number of through holes 73 c formed in the support body 73. That is, as shown in FIG. 5, for example, a pair of conductive path forming portions 61 corresponding to the voltage supply electrode 27 and the voltage measurement electrode 28 in the four-terminal inspection is arranged in each of the through holes. The number of conductive path forming portions 61 arranged in one through hole 73c is not particularly limited, but is preferably 1 to 4, and the support 73 corresponds to the connection electrode 25 of the pitch conversion substrate 23. The number of conductive path forming portions 61 may be different for each through hole.

  In the example of FIGS. 6A and 6B, the conductive path forming portion 61 is formed to protrude from the surface of the insulating portion 62 on the lower surface of the relay substrate 29, and the protruding portion 61a is formed here. On the upper surface side of the substrate 29, the liquid silicon rubbers G and H applied later are cured in a state where the lower surface side of the contact member 15 is pushed inward of the conductive path forming portion 61 if it is made of metal. Therefore, on the upper surface side of the relay substrate 29, the top of the contact member 15 corresponds to the protruding portion 61 a and protrudes outward from the surface of the insulating portion 62.

  As described above, in the relay substrate 29 of the present embodiment, the protrusion 61a is formed in the conductive path forming portion 61, and the metal contact member 15 is arranged on the upper surface side, thereby pressing the conductive path forming portion 61. Since the degree of compression due to this becomes larger than that for the insulating portion 62, a conductive path having a sufficiently low resistance value is surely formed in the conductive path forming portion 61, and the change in the resistance value with respect to the change in the applied pressure is reduced. Can do. As a result, even if the pressure applied to each conductive path forming portion 61 of the relay substrate 29 is not uniform, it is possible to prevent variation in conductivity between the conductive path forming portions 61.

  As the elastic polymer material constituting the conductive path forming portion 61 and the insulating portion 62, a polymer material having a crosslinked structure is preferable. Specific examples of the curable polymer substance-forming material that can be used to obtain such an elastic polymer substance include polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, and acrylonitrile-butadiene. Conjugated diene rubber such as copolymer rubber and hydrogenated products thereof, block copolymer rubber such as styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer and hydrogenated products thereof, chloroprene , Urethane rubber, polyester rubber, epichlorohydrin rubber, silicon rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, and the like.

When the weather resistance is required for the relay substrate 29, it is preferable to use a material other than the conjugated diene rubber, and it is particularly preferable to use silicon rubber from the viewpoint of moldability and electrical characteristics. As the silicon rubber, those obtained by crosslinking or condensing liquid silicon rubber are preferable. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and is any of a condensation type, an addition type, a vinyl group or a hydroxyl group. Also good. Specific examples include dimethyl silicon raw rubber, methyl vinyl silicon raw rubber, methyl phenyl vinyl silicon raw rubber, and the like.

  Moreover, it is preferable that the silicon rubber has a molecular weight Mw (referred to as a standard polystyrene equivalent weight average molecular weight) of 10,000 to 40,000. From the viewpoint of heat resistance, the molecular weight distribution index (referred to as the ratio Mw / Mn between the standard polystyrene equivalent weight average molecular weight Mw and the standard polystyrene equivalent number average molecular weight Mn) is preferably 2 or less.

  As the conductive particles P contained in the conductive path forming portion 61, conductive particles exhibiting magnetism are used because the conductive particles can be easily aligned in the thickness direction by a method described later.

  Specific examples of such conductive particles include magnetic metal particles such as iron, cobalt and nickel, alloy particles thereof, particles containing these metals, or particles containing these metals as core particles. The surface of the particles is plated with a metal having good conductivity such as gold, silver, palladium, rhodium, or non-magnetic metal particles or inorganic particles such as glass beads or polymer particles. Examples thereof include a surface plated with a conductive magnetic metal such as nickel or cobalt.

Among these, it is preferable to use nickel particles as core particles and the surfaces thereof plated with gold having good conductivity.
Examples of the method for coating the surface of the core particles with the conductive metal include chemical plating and electrolytic plating.

  When using a conductive particle coated with a conductive metal on the surface of the core particle, the conductive metal coverage on the particle surface (the conductive metal relative to the surface area of the core particle is obtained from the point that good conductivity is obtained. Is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.

  The coating amount of the conductive metal is preferably 0.5 to 50% by mass of the core particles, more preferably 2 to 30% by mass, further preferably 3 to 25% by mass, and particularly preferably 4 to 20% by mass. It is. When the conductive metal to be coated is gold, the coating amount is preferably 0.5 to 30% by mass of the core particles, more preferably 2 to 20% by mass, and further preferably 3 to 15%. % By mass.

The particle diameter of the conductive particles is preferably 1 to 100 μm, more preferably 2 to 50 μm, still more preferably 3 to 30 μm, and particularly preferably 4 to 20 μm.
The particle size distribution (Dw / Dn) of the conductive particles P is preferably 1 to 10, more preferably 1.01 to 7, still more preferably 1.05 to 5, particularly preferably 1.1 to 4. It is.

  By using the conductive particles P satisfying such conditions, the obtained conductive path forming part 61 can be easily deformed under pressure, and sufficient electric power can be generated between the conductive particles in the conductive path forming part 61. Contact is obtained.

  The shape of the conductive particles is not particularly limited, but spherical particles, star-shaped particles, or secondary particles in which these particles are aggregated in that they can be easily dispersed in the polymer substance-forming material. Preferably there is.

  Further, as the conductive particles, particles whose surfaces are treated with a coupling agent such as a silane coupling agent or a lubricant can be appropriately used. By treating the particle surface with a coupling agent or a lubricant, the durability of the anisotropic conductive sheet is improved.

  Such conductive particles are preferably contained in the conductive path forming part in a volume fraction of 15 to 45%, more preferably 20 to 40%. If this ratio is too small, the conductive path forming part 61 having a sufficiently small electric resistance value may not be obtained. On the other hand, when this ratio is excessive, the obtained conductive path forming part 61 is likely to be fragile, and the elasticity required for the conductive path forming part 61 may not be obtained.

  The thickness of the conductive path forming part 61 is preferably 20 to 250 μm, more preferably 30 to 200 μm. When this thickness is too small, the absorption capability with respect to the pressurization of the thickness direction becomes low. On the other hand, when the thickness is excessive, good conductivity may not be obtained.

The protruding height of the protruding portion 61a in the conductive path forming portion 61 is preferably 5 to 70% of the thickness of the conductive path forming portion 61, and more preferably 10 to 60%.
Below, an example of the manufacturing method of the relay board | substrate 29 which concerns on a present Example is demonstrated, referring FIGS. 7-14.

  According to the present embodiment, the method of manufacturing the relay substrate 29 includes a first composite film placement step, a conductive paste coating step, a second composite film placement step, a magnetic field orientation step, and a recess formation for applying liquid silicon rubber. A step, a plating metal holder preparation step, a liquid silicon rubber coating step, a liquid silicon rubber curing step, and a step of integrally providing a plating metal on the top of the conductive path forming portion.

First, a 1st composite film arrangement | positioning process is demonstrated.
As shown to Fig.7 (a), a pair of composite films 17 and 17 and the support body 73 are prepared in a 1st composite film arrangement | positioning process.

  The pair of composite films 17 and 17 have the same configuration, and are composed of a metal layer 19 and a resist layer 67. In the composite film 17, a plurality of openings 67a are formed on one surface of the metal layer 19 according to a predetermined pattern corresponding to the pattern of the conductive path forming portion to be formed, that is, the pattern of the electrode to be connected, by photolithography. A resist layer 67 is formed.

  In the composite film 17, the metal layer 19 is used as a plating electrode, and a portion of the metal layer 19 exposed from the opening 67 a of the resist layer 67 is subjected to an electrolytic plating process, whereby the magnetic metal plating 68 is formed in the opening 67 a of the resist layer 67. Is formed.

  After preparing a pair of composite films 17 and 17 composed of the metal layer 19 and the resist layer 67 in this way, one composite film is formed on the lower surface side of the support 73 as shown in FIG. 17 is arranged in such a direction that the metal layer 19 side of the composite film 17 faces the support 73. Thereby, a 1st composite film arrangement | positioning process is completed. Next, a conductive paste application process is performed.

  In the conductive paste application step, as shown in FIG. 8A, a conductive paste (conductive elastomer material layer) 61A is applied in the through hole 73c formed in the support 73. In the conductive paste 61A, conductive particles P exhibiting magnetism are contained in a randomly dispersed state. Next, as shown in FIG. 8B, the composite film 17 is also disposed on the upper surface side of the support 73. Thereby, a 2nd composite film arrangement | positioning process is completed. Then, it becomes a magnetic field orientation process.

  In the magnetic field orientation step, as shown in FIG. 9, by applying a magnetic field to the conductive paste 61A in the thickness direction, the conductive particles P dispersed in the conductive paste 61A are removed from the conductive paste 61A. Oriented so as to be aligned in the thickness direction of 61A. Then, the conductive particles 61 are cured in the elastic polymer substance by curing the conductive paste 61A while continuing the action of the magnetic field on the conductive paste 61A or after stopping the action of the magnetic field. The conductive elastomer layer 61 </ b> B contained in an aligned state in the thickness direction is supported by the support plate 73. In addition, as the support body 73, a metal, ceramics, resin, these composite materials, etc. can be used.

As a method of applying the conductive paste (conductive elastomer material layer) 61A shown in FIG. 8A, a printing method such as screen printing, a low coating method, a blade coating method, or the like can be used.

The thickness of the conductive elastomer material layer 61A is set according to the thickness of the conductive path forming portion to be formed.
As means for applying a magnetic field to the conductive elastomer material layer 61A, an electromagnet, a permanent magnet, or the like can be used.

The strength of the magnetic field applied to the conductive elastomer material layer 61A is preferably 0.2 to 2.5 Tesla.
The curing process of the conductive elastomer material layer 61A is usually performed by a heating process. The specific heating temperature and heating time are appropriately set in consideration of the type of elastomer material constituting the conductive elastomer material layer 61A, the time required to move the conductive particles, and the like.

  Next, the conductive path forming portion 61 is formed from the conductive elastomer layer 61B according to a pattern corresponding to the connection electrodes 25a and 25b of the pitch conversion substrates 23a and 23b as follows.

  That is, the upper composite film 17 is first peeled from the state shown in FIG. Then, as shown in FIG. 10, the conductive elastomer layer 61 </ b> B on the support 73 is subjected to laser processing from the state in which the composite film 17 on the upper surface side is peeled off, so that the periphery of the conductive path forming portion 61 is The elastomer layer 61B is removed. Thus, a recess 47 for applying liquid silicon rubber is formed around the periphery.

  Note that the order of laser processing is not limited to the above. For example, before removing the upper composite film 17, that is, as shown in FIGS. 11A and 11B, laser processing may be performed from a state in which the pair of composite films 17 and 17 are disposed on both sides. it can. In this case, as shown in FIG. 11A, the thickness of the metal layer 19 made of copper, gold, aluminum, rhodium or the like is removed because the metal layer 19 constituting the upper composite film 17 is directly removed by laser processing. Is preferably 0.05 to 2 μm, more preferably 0.1 to 1 μm. Further, the laser processing is preferably performed using a carbon dioxide laser or an ultraviolet laser. Then, laser processing may be performed from the state in which the composite films 17 on both sides are arranged, and then the upper one composite film 17 may be peeled off as shown in FIG.

In any case, the liquid silicon rubber application recess 47 is formed around the conductive path forming portion 61 in this manner. Thereby, the recess formation process for liquid silicone rubber application is completed.
While the recess 47 for applying such liquid silicon rubber is formed on the support 73 side, a plated metal holding plate 57 for metal contacts is prepared in advance as shown in FIG. The plated metal holding plate 57 is formed by forming a plated metal 77 for a metal contact on one surface of the metal layer 59, and the plated metal 77 is formed at a position corresponding to the conductive path forming portion 61.

  Then, in the plating metal holder preparation step shown in FIG. 12 performed following the liquid silicon rubber coating recess forming step, the liquid silicon rubber 79 is placed around the plating metal 77 on the plating metal holding plate 57 prepared in advance. Is applied. The liquid silicone rubber 79 is uncured at the application temperature.

Next, below the plated metal holding plate 57, the support unit 87 obtained in the liquid silicon rubber coating recess forming step shown in FIG. 10 or FIG. Then, the liquid silicon rubber 79 is applied in the liquid silicon rubber application recess 47 formed around the conductive path forming portion 61 of the support unit 87. The liquid silicone rubber 79 applied in the recess 47 is applied such that the liquid level rises outward from the surrounding surface.

Thereby, a liquid silicone rubber application process is completed.
Next, the plated metal holding plate 57 obtained in the plated metal holding body preparation step and the support unit 87 obtained in the liquid silicon rubber coating step face each other in the form shown in FIG. The silicon rubbers 79 are overlapped so that they are in close contact with each other. If they are overlapped with each other in this manner, the liquid silicon rubber 79 on the contact member 77 side and the liquid silicon rubber 79 on the support 73 side are mixed with each other without an interface, and a part of the liquid silicon is generated by the applied pressure. As shown in FIG. 13, the rubber 79 a extends to the outer region of the through hole 73 c of the support 73. The plated metal 77 as a contact member on the plated metal holding plate 57 side presses the conductive path forming portion 61 inward. As a result, the plated metal 77 enters the inside of the conductive path forming portion 61. When heated in this pressurized state, the uncured liquid silicone rubber 79, 79 is united and cured in the posture shown in FIG.

  Then, after the liquid silicon rubber 79 is cured as shown in FIG. 13, the upper metal layer 59 is peeled off as shown in FIG. Further, the lower composite film 17 is peeled off. Thereby, the plating metal 77 is integrally provided on the top of the conductive path forming portion 61. Note that, on the lower surface side, by peeling the composite film 17, the conductive path forming portion 61 that has been pressed inward so far is protruded outward. Thereby, the protrusion part 61a is formed below. The process of integrally providing the plated metal 77 is completed.

  When the step of integrally providing the plated metal 77 is completed in this manner, the conductive elastomer layer 61B (insulating portion 62) and the support in which the liquid silicon rubber 79 integrated with the interface removed is already cured. It is integrated with the surface of the plate 73. Thereby, the plating metal 77 is firmly fixed to the surface of the conductive path forming portion 61. That is, according to the present embodiment, the adhesion effect of the plated metal 77 is increased and fixed. At this time, the top of the plated metal 77 protrudes to the outside from the surface of the liquid silicon rubber 79 that has been pressurized and thinned and cured.

In this way, a plurality of conductive path forming portions 61 arranged according to a predetermined pattern are formed in a state of being supported on the support body 73.
According to the relay substrate manufacturing method described above, laser processing is performed on the conductive elastomer layer 61B dispersed in a state in which the conductive particles P are aligned in the thickness direction, and a part thereof is removed. Thus, the conductive path forming portion 61 having a desired shape is formed.

Therefore, it is possible to reliably obtain the relay substrate 29 filled with the required amount of the conductive particles P and having the conductive path forming portion 61 having the desired conductivity.
Further, by applying a magnetic field orientation method to the conductive elastomer material layer 61A using a magnetic metal plating 68 (metal mask) made of a metal exhibiting magnetism, the portion of the conductive layer where the metal mask is not formed is applied. The density of the conductive particles is reduced. Therefore, the formation of the conductive path forming portion by laser processing becomes easy. Furthermore, since the laser processing of the conductive elastomer layer 61B having a large thickness is facilitated, the conductive path forming portion 61 having a large thickness can be reliably obtained.

  Further, a plurality of conductive path forming portions 61 are formed according to a predetermined pattern corresponding to the connection electrodes 25 of the pitch conversion substrate 23, and an uncured liquid silicon rubber (elastomer) is formed between the conductive path forming portions 61. Material layer) 79 is formed and cured.

Thereby, an insulating part in which no conductive particles P exist can be arranged around the conductive path forming part 61.
Moreover, an expensive mold in which a large number of ferromagnetic parts are arranged is not required as in the prior art.

  Therefore, according to the relay substrate 29 obtained by such a method, the required electrical connection is reliably made to each of the electrodes to be inspected regardless of the arrangement pattern of the inspection electrodes of the circuit board 1 to be inspected. Can be achieved.

  Further, even when the electrodes to be inspected are arranged in a small pitch and at a high density, it is possible to reliably achieve the required electrical connection to each of the electrodes to be inspected, and to manufacture the electrodes. Costs can be reduced and higher durability can be obtained.

  FIG. 5 is a cross-sectional view showing a state in which the pitch conversion substrate 23, the relay substrate 29 according to this embodiment, and the circuit board 1 to be inspected are stacked. In the figure, an example in which a four-terminal inspection is performed is shown. As shown in the figure, a relay board 29 according to the present invention is arranged between the circuit board 1 to be inspected and the pitch conversion board 23.

  On the surface of the pitch conversion substrate 23, current supply electrodes 27 for current supply and voltage measurement electrodes 28 for voltage measurement, which are spaced apart from each other and electrically connected to the same electrode to be inspected, respectively. The connecting electrode 25 is formed.

  A pair of conductive path forming portions 61 are formed in one through hole of the relay substrate 29 corresponding to the current supply electrode 27 and the voltage measurement electrode 28 of the pitch conversion substrate 23. The pair of conductive path forming portions 61 and 61 are electrically connected to the current supply electrode 27 and the voltage measurement electrode 28 on one end side, and electrically connected to the test electrode 2 on the circuit board 1 to be tested on the other end side. The electrical inspection is performed in this state.

  A dispersive anisotropic conductive sheet may be disposed on one side or both sides of the relay substrate 29. In the present invention, since the relay substrate 29 is provided, local stress concentration due to the electrodes of the circuit board 1 to be inspected is sufficiently relieved even if a thin dispersed anisotropic conductive sheet that does not impair the resolution is used. FIG. 15 is a cross-sectional view showing an example in which a dispersive anisotropic conductive sheet is arranged. In FIG. 15A, the dispersive anisotropic conductive sheet is interposed between the pitch conversion substrate 23 and the relay substrate 29. The anisotropic conductive sheet 22 is disposed, the current supply electrode 27 and the voltage measurement electrode 28 of the pitch conversion substrate 23, and the pair of conductive path forming portions 61 and 61 of the relay substrate 29 are connected to the first conductive sheet 22. It is electrically connected via an anisotropic conductive sheet 22.

  In FIG. 15B, the anisotropic conductive sheets 22 and 22 which are dispersive anisotropic conductive sheets are arranged on both sides of the relay substrate 29, and the current supply electrode 27 and the voltage measurement electrode of the pitch conversion substrate 23 are arranged. The electrode 28 and the pair of conductive path forming portions 61 and 61 of the relay substrate 29 are electrically connected via the first anisotropic conductive sheet 22 and the electrode 2 to be inspected of the circuit board 1 to be inspected. The pair of conductive path forming portions 61 and 61 of the relay substrate 29 are electrically connected via the first anisotropic conductive sheet 22.

  The first anisotropic conductive sheet 22 constituting the circuit board side connector 21 and disposed adjacent to the relay board 29 is a sheet base material made of an insulating elastic polymer material as shown in FIG. 63 contains a large number of conductive particles P dispersed in the plane direction and arranged in the thickness direction.

The thickness of the first anisotropic conductive sheet 22 is preferably 20 to 200 μm, more preferably 30 to 100 μm. When the minimum thickness is less than 20 μm, the mechanical strength of the first anisotropic conductive sheet 22 tends to be low, and the required durability may not be obtained. On the other hand, when the thickness of the first anisotropic conductive sheet 22 exceeds 200 μm, the electric resistance in the thickness direction tends to increase, and when the pitch of electrodes to be connected is small, it is formed by pressurization. In some cases, the required insulation cannot be obtained between the conductive paths, and an electrical short circuit occurs between the electrodes to be inspected, making it difficult to electrically inspect the circuit board to be inspected.

The elastic polymer material constituting the sheet base 63 of the first anisotropic conductive sheet 22 preferably has a durometer hardness of 30 to 90, more preferably 35 to 80, and still more preferably 40 to 70. is there. Here, “durometer hardness” means that measured by a type A durometer based on the durometer hardness test of JIS K6253.

  When the durometer hardness of the elastic polymer material is less than 30, the anisotropic conductive sheet is compressed and deformed greatly when pressed in the thickness direction, and a large permanent distortion occurs. It becomes difficult to use for inspection due to deterioration and durability tends to be lowered.

  On the other hand, when the durometer hardness of the elastic polymer material is more than 90, when the anisotropic conductive sheet is pressed in the thickness direction, the deformation amount in the thickness direction becomes insufficient, so that good connection reliability is obtained. This is likely to cause a connection failure.

  The elastic polymer material constituting the base material of the first anisotropic conductive sheet 22 is not particularly limited as long as it exhibits the durometer hardness described above. From the viewpoint of forming processability and electrical characteristics, silicon rubber Is preferably used.

The first anisotropic conductive sheet 22 has a ratio W ₁ / D ₁ of 1.1 to ₁₀ between its thickness W ₁ (μm) and the number average particle diameter D ₁ (μm) of the magnetic conductive particles. It is preferable. Here, the “number average particle diameter of the magnetic conductive particles” means that measured by a laser diffraction scattering method. When the ratio W ₁ / D ₁ is less than 1.1, the diameter of the magnetic conductive particles is equal to or larger than the thickness of the anisotropic conductive sheet. For this reason, the circuit board to be inspected is easily damaged when the anisotropic conductive sheet is disposed on the circuit board to be inspected side.

On the other hand, when the ratio W ₁ / D ₁ exceeds 10, since a large number of conductive particles are arranged in the thickness direction to form a chain, there are contacts between the large number of conductive particles, and the electrical resistance The value tends to be high.

The magnetic conductive particles preferably have a saturation magnetization of 0. 0 because the magnetic conductive particles can be easily moved by the action of a magnetic field in the sheet molding material for forming the anisotropic conductive sheet. 1 Wb / m ² or more, more preferably 0.3Wb / m ² or more, and especially preferably 0.5 Wb / m ² or more.

Since the saturation magnetization is 0.1 Wb / m ² or more, the magnetic conductive particles can be reliably moved by the action of a magnetic field in the production process to obtain a desired orientation state. When used, a chain of magnetic conductive particles can be formed.

  Specific examples of magnetic conductive particles include particles of metals such as iron, nickel, cobalt, etc., particles of alloys thereof, particles containing these metals, or particles containing these metals as core particles. Composite particles with a highly conductive metal coated on the surface, or non-magnetic metal particles or inorganic substance particles such as glass beads or polymer particles were used as core particles, and the surface of the core particles was plated with a highly conductive metal. Examples include composite particles or composite particles in which core particles are coated with both a conductive magnetic material such as ferrite and an intermetallic compound and a highly conductive metal.

Here, the “high conductivity metal” refers to a metal having an electrical conductivity at 0 ° C. of 5 × 10 ⁶ Ω ⁻¹ m ⁻¹ or more. Specifically, gold, silver, rhodium, platinum, chromium, and the like can be used as such a highly conductive metal. Among these, gold is chemically stable and has high conductivity. Is preferably used.

Among the above magnetic conductive particles, composite particles in which nickel particles are used as core particles and the surfaces thereof are plated with a highly conductive metal such as gold or silver are preferable.
As a means for coating the surface of the core particles with a highly conductive metal, for example, an electroless plating method can be used.

  The magnetic conductive particles preferably have a coefficient of variation in number average particle diameter of 50% or less, more preferably 40% or less, still more preferably 30% or less, and particularly preferably 20% or less. Here, the “coefficient of variation of the number average particle diameter” is an expression: (σ / Dn) × 100 (where σ represents the value of the standard deviation of the particle diameter, and Dn represents the number average particle diameter of the particles. Is required).

  When the coefficient of variation of the number average particle diameter of the magnetic conductive particles is 50% or less, the degree of unevenness of the particle diameter is reduced, so that the partial conductivity variation in the anisotropically conductive sheet obtained is reduced. be able to.

  Such magnetic conductive particles can be obtained by making a metal material into particles by a conventional method, or preparing commercially available metal particles and subjecting the particles to a classification treatment. The particle classification treatment can be performed by, for example, a classification device such as an air classification device or a sonic sieving device. Specific conditions for the classification treatment are appropriately set according to the number average particle diameter of the target conductive metal particles, the type of the classification device, and the like.

Although the specific shape of the magnetic conductive particles is not particularly limited, for example, secondary particles in which a plurality of spherical primary particles are integrally connected are preferably used.
When using composite particles (conductive composite metal particles) in which the surface of the core particles is coated with a highly conductive metal as the magnetic conductive particles, good conductivity can be obtained. The coverage of the highly conductive metal (ratio of the coated area of the highly conductive metal to the surface area of the core particles) is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.

  The coating amount of the highly conductive metal is preferably 2.5 to 50% by mass, more preferably 3 to 45% by mass, still more preferably 3.5 to 40% by mass, particularly the weight of the core particles. Preferably it is 5-30 mass%.

  An anisotropic conductive sheet containing a large number of conductive particles dispersed in the surface direction and arranged in the thickness direction in such an insulating elastic polymer material is disclosed in, for example, JP-A-2003-77560. As shown, a fluid molding material containing conductive particles exhibiting magnetism is prepared in a polymer material that is cured to become an elastic polymer material, and a molding material layer made of this molding material is prepared. The molding material layer is formed between the one-surface-side molded member that contacts one surface of the molding material layer and the other-surface-side molding member that contacts the other surface of the molding material layer, and a magnetic field acts on the molding material layer in the thickness direction. And can be produced by a method of curing the molding material layer.

As shown in FIG. 17, the second anisotropic conductive sheet 26 disposed on the pitch conversion substrate 23 on the relay pin unit 31 side has a large number of conductive particles P in an insulating elastic polymer material. The conductive path forming portions 71 are arranged in the thickness direction, and the insulating portions 72 are provided to separate the conductive path forming portions 71 from each other. As described above, the conductive particles P are non-uniformly dispersed in the surface direction only in the conductive path forming portion 71.

  The thickness of the conductive path forming portion 71 is preferably 0.1 to 2 mm, more preferably 0.2 to 1.5 mm. When this thickness is too small, the absorption capacity for pressurization in the thickness direction is low, absorption of the applied pressure by the inspection jig during inspection is reduced, and the effect of reducing the impact on the circuit board side connector 21 is reduced. For this reason, it becomes difficult to suppress the deterioration of the elastic portion in the relay substrate 29. As a result, the number of replacements of the relay substrate 29 during the repeated inspection of the circuit board 1 to be inspected increases, and the inspection efficiency decreases. On the other hand, if this thickness is excessive, the electrical resistance in the thickness direction tends to increase and electrical inspection may be difficult.

  The thickness of the insulating part 72 is preferably substantially the same as or smaller than the thickness of the conductive path forming part 71. As shown in FIG. 17, the thickness of the insulating portion 72 is made smaller than the thickness of the conductive path forming portion 71, and the conductive path forming portion 71 forms a protruding portion 71a protruding from the insulating portion 72. Since the conductive path forming portion 72 is easily deformed by pressurization and the pressure absorption capacity is increased, the pressure applied by the inspection jig is absorbed during the inspection, and the impact of the circuit board connector 21 is reduced. can do.

  When magnetic conductive particles are used for the conductive particles P constituting the second anisotropic conductive sheet 26, the number average particle diameter is preferably 5 to 200 μm, more preferably 5 to 150 μm, and still more preferably 10 ˜100 μm. Here, the “number average particle diameter of the magnetic conductive particles” means that measured by a laser diffraction scattering method. When the number average particle diameter of the magnetic conductive particles is 5 μm or more, the pressure deformation of the conductive path forming portion of the anisotropic conductive sheet becomes easy. Further, when the magnetic conductive particles are oriented by a magnetic field orientation process in the manufacturing process, the magnetic conductive particles are easily oriented. When the number average particle diameter of the magnetic conductive particles is 200 μm or less, the elasticity of the conductive path forming portion 71 of the anisotropic conductive sheet is good and the pressure deformation is easy.

The ratio W ₂ / D ₂ between the thickness W ₂ (μm) of the conductive path forming portion 71 and the number average particle diameter D ₂ (μm) of the magnetic conductive particles P is preferably 1.1-10.
When the ratio W ₂ / D ₂ is less than 1.1, the diameter of the magnetic conductive particles is equal to or larger than the thickness of the conductive path forming portion 71, and therefore the elasticity of the conductive path forming portion 71 is low. Thus, the ability to absorb the pressure in the thickness direction is reduced. Since the absorption of the pressure applied by the inspection jig during inspection is reduced and the effect of mitigating the impact on the circuit board side connector 21 is reduced, it is difficult to suppress the deterioration of the elastic portion in the relay board 29. When the circuit board 1 to be inspected is repeatedly inspected, the number of times the relay substrate 29 is replaced increases, and the inspection efficiency tends to be lowered.

On the other hand, when the ratio W ₂ / D ₂ exceeds 10, a large number of conductive particles are arranged in the conductive path forming portion 71 to form a chain, and there are a large number of contacts between the conductive particles. The electrical resistance value tends to be high.

  The elastic polymer substance that is the base material of the conductive path forming portion 71 preferably has a durometer hardness measured by a type A durometer of 15 to 60, more preferably 20 to 50, and even more preferably 25 to 45.

When the durometer hardness of the elastic polymer is less than 15, the compression and deformation of the sheet when pressed in the thickness direction is large, and a large permanent distortion occurs. Tends to be difficult. When the durometer hardness of the elastic polymer is larger than 60, the deformation when pressed in the thickness direction becomes small, so the ability to absorb pressure in the thickness direction becomes small. For this reason, it becomes difficult to suppress the deterioration of the elastic part in the relay substrate 29. As a result, the number of times of replacement of the relay substrate 29 is increased during the repeated inspection of the circuit board 1 to be inspected, and the inspection efficiency tends to decrease.

  The elastic polymer serving as the base material of the conductive path forming portion 71 is not particularly limited as long as it exhibits the durometer hardness described above, but it is preferable to use silicon rubber from the viewpoint of workability and electrical characteristics.

  The insulating portion 72 of the second anisotropic conductive sheet 26 is formed of an insulating material that does not substantially contain conductive particles. As the insulating material, for example, an insulating polymer material, an inorganic material, a metal material with an insulating surface can be used, and the same material as the elastic polymer used for the conductive path forming portion is used. Easy to produce. When an elastic polymer is used as the material for the insulating portion, it is preferable to use a material having a durometer hardness in the above range.

As the magnetic conductive particles, the conductive particles used in the conductive path forming portion of the relay substrate 29 described above can be used.
The second anisotropic conductive sheet 26 can be manufactured, for example, as follows. First, each of the overall shapes is substantially flat, and consists of an upper mold and a lower mold that correspond to each other, while applying a magnetic field to the material layer filled in the molding space between the upper mold and the lower mold. An anisotropic conductive sheet molding die having a configuration capable of heat-curing the material layer is prepared.

  In this anisotropic conductive sheet molding die, a magnetic field is applied to the material layer to form a conductive portion at an appropriate position. Therefore, both the upper die and the lower die are made of strong iron or nickel. On a substrate made of a magnetic material, a ferromagnetic part made of iron, nickel or the like for generating an intensity distribution in the magnetic field in the mold and a nonmagnetic part made of nonmagnetic metal or resin such as copper are mutually connected. It has a structure having mosaic layers alternately arranged so as to be adjacent to each other, and the ferromagnetic portions are arranged according to a pattern corresponding to the conductive path forming portion to be formed.

Here, the molding surface of the upper mold is flat, and the molding surface of the lower mold has slight irregularities corresponding to the conductive path forming portion of the anisotropic conductive sheet to be formed.
And an anisotropic conductive sheet is manufactured as follows using said anisotropic conductive sheet shaping die. First, molding is performed by injecting a molding material containing conductive particles exhibiting magnetism into a polymer material that is cured and becomes an elastic polymer substance in the molding space of the anisotropic conductive sheet molding die. A material layer is formed.

  Next, by using a ferromagnetic part and a non-magnetic part in each of the upper mold and the lower mold, a magnetic field having an intensity distribution in the thickness direction is applied to the formed molding material layer to thereby obtain the magnetic force. As a result, the conductive particles are gathered between the ferromagnetic part in the upper mold and the ferromagnetic part in the lower mold located immediately below it, and the conductive particles are aligned in the thickness direction. Let And the anisotropically conductive sheet which has the structure by which a some columnar conductive path formation part is mutually insulated by the insulation part by hardening-processing a molding material layer in the state is manufactured.

  On the other hand, as shown in FIG. 1, the tester side connectors 41a and 41b include third anisotropic conductive sheets 42a and 42b, connector boards 43a and 43b, and base plates 46a and 46b. As the third anisotropic conductive sheet 42a, 42b, the same material as the second anisotropic conductive sheet 26 described above is used. That is, as shown in FIG. 17, a conductive path forming portion formed by arranging a large number of conductive particles in an insulating elastic polymer material in the thickness direction, and insulation that separates each conductive path forming portion. An anisotropic conductive sheet composed of a portion is used.

The connector substrates 43a and 43b include an insulating substrate, and pin-side electrodes 45a and 45b are formed on the surface thereof on the relay pin unit 31 side as shown in FIGS.
These pin side electrodes 45 are, for example, 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0.2 mm. It is arranged on lattice points with a constant pitch, and the arrangement pitch is the same as the arrangement pitch of the conductive pins 32 of the relay pin unit 31.

  Each pin-side electrode 45 is electrically connected to the tester-side electrodes 44a and 44b by a wiring pattern formed on the surface of the insulating substrate and an internal wiring formed therein.

  1, 2 and 18 (FIG. 18 shows the relay pin unit 31a for convenience of explanation) and FIGS. 24 to 27 so that the relay pin unit 31 faces in the vertical direction. Are provided with a plurality of conductive pins 32a and 32b provided at a predetermined pitch. Further, the relay pin unit 31 is provided on both ends of the conductive pins 32a and 32b, and is provided with first insulating plates 34a and 34b disposed on the circuit board 1 side to be inspected for inserting and supporting the conductive pins 32a and 32b. The second insulating plates 35a and 35b are provided on the opposite side of the circuit board 1 to be inspected.

  For example, as shown in FIG. 19, the conductive pin 32 includes a central portion 82 having a large diameter and end portions 81a and 81b having a smaller diameter. The first insulating plate 34 and the second insulating plate 35 are formed with through holes 83 into which the end portions 81 of the conductive pins 32 are inserted. The diameter of the through hole 83 is formed larger than the diameter of the end portions 81a and 81b of the conductive pin 32 and smaller than the diameter of the central portion 82, thereby holding the conductive pin 32 so as not to drop off. .

  The distance between the first insulating plate 34 and the second insulating plate 35 is longer than the length of the central portion 82 of the conductive pin 32 by the first support pin 33 and the second support pin 37 of FIG. Thus, the conductive pin 32 is held so as to be movable up and down. The length of the end portion 81 of the conductive pin 32 is formed to be longer than the thickness of the insulating plate 34, so that the conductive pin 32 protrudes from at least one of the insulating plates 34.

  The relay pin unit has a large number of conductive pins, for example, 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0. It is arranged on a grid point with a pitch of 2 mm.

  By making the arrangement pitch of the conductive pins 32 of the relay pin unit 31 the same as the arrangement pitch of the terminal electrodes 24 provided on the pitch conversion board 23, the pitch conversion board 23 is connected to the tester side via the conductive pins 32. It is designed to be connected electrically.

  As shown in FIGS. 1 and 18, the relay pin unit 31 includes intermediate holding plates 36a and 36b between the first insulating plates 34a and 34b and the second insulating plates 35a and 35b. Has been placed.

  The first support pins 33a and 33b are arranged between the first insulating plates 34a and 34b and the intermediate holding plates 36a and 36b, whereby the first insulating plates 34a and 34b and the intermediate holding plate are arranged. The space between 36a and 36b is fixed.

Similarly, second support pins 37a and 37b are disposed between the second insulating plates 35a and 35b and the intermediate holding plates 36a and 36b, whereby the second insulating plates 35a and 35b and the intermediate holding plates 36a and 36b are intermediately held. The space between the plates 36a and 36b is fixed.

As a material of the first support pin 33 and the second support pin 37, for example, a metal such as brass or stainless steel is used.
Note that the distance L1 between the first insulating plate 34 and the intermediate holding plate 36 and the distance L2 between the second insulating plate 35 and the intermediate holding plate 36 in FIG. 18 are not particularly limited. However, as will be described later, the height variation of the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected due to the elasticity of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 is absorbed. In consideration, 2 mm or more is preferable, and 2.5 mm or more is more preferable.

  Then, as shown in FIG. 18, the first contact support position 38 </ b> A of the first support pin 33 with respect to the intermediate holding plate 36 and the second contact support of the second support pin 37 with respect to the intermediate holding plate 36. The position 38B is arranged at a different position on the intermediate holding plate projection surface A obtained by projecting the inspection apparatus in the thickness direction of the intermediate holding plate (from the upper side to the lower side in FIG. 1).

  In this case, the different positions are not particularly limited, but the first abutting support position 38A and the second abutting support position 38B are, as shown in FIG. It is preferably formed on the lattice on A.

  Specifically, as shown in FIG. 23, on the intermediate holding plate projection surface A, one second contact is formed in the unit lattice region R1 including four adjacent first contact support positions 38A. The contact support position 38B is arranged. Further, on the intermediate holding plate projection surface A, one first contact support position 38A is arranged in a unit lattice region R2 composed of four adjacent second contact support positions 38B. In FIG. 23, the first contact support position 38A is indicated by a black circle, and the second contact support position group 38B is indicated by a white circle.

  Here, one second abutment support position 38B is disposed at the center of the diagonal line Q1 of the unit lattice region R1 of the first abutment support position 38A, and the second abutment support position 38B. One first abutment support position 38A is arranged at the center of the diagonal line Q2 of the unit lattice region R2. However, these relative positions are not particularly limited, and are arranged at different positions on the intermediate holding plate projection plane A obtained by projecting the inspection apparatus in the thickness direction of the intermediate holding plate as described above. Just do it. That is, when not arranged in a grid pattern, it is not constrained by such a relative positional relationship, and as described above, on the intermediate holding plate projection surface A obtained by projecting the inspection device in the thickness direction of the intermediate holding plate. As long as they are arranged at different positions.

  In this case, the separation distance between the first contact support positions 38A adjacent to each other and the separation distance between the second contact support positions 38B are preferably 10 to 100 mm, more preferably 12 to 70 mm, Especially preferably, it is 15-50 mm.

  As the forming material of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35, a flexible material is used. The flexibility of these plates is 50 kgf from above when both ends of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 are horizontally arranged with 10 cm intervals. The deflection caused by pressurizing at a pressure of 0.02% or less of the width of these insulating plates is such that destruction and permanent deformation do not occur even when pressurizing at a pressure of 200 kgf from above. preferable.

Specifically, the material of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 is an insulating material having a specific resistance of 1 × 10 ¹⁰ Ω · cm or more, such as a polyimide resin or a polyester resin. , Polyamide resin, phenol resin, polyacetal resin, polybutylene terephthalate resin, polyethylene terephthalate resin, syndiotactic polystyrene resin,
Resin materials with high mechanical strength such as polyphenylene sulfide resin, polyether ethyl ketone resin, fluorine resin, polyether nitrile resin, polyether sulfone resin, polyarylate resin, polyamide imide resin, glass fiber reinforced epoxy resin, glass fiber Reinforced polyester resin, glass fiber reinforced polyimide resin, glass fiber reinforced phenolic resin, glass fiber reinforced resin such as glass fiber reinforced fluororesin, carbon fiber reinforced epoxy resin, carbon fiber reinforced polyester resin, carbon fiber reinforced Type composite resin, carbon fiber reinforced phenolic resin, carbon fiber reinforced type fluororesin, etc., carbon fiber type composite resin, epoxy resin, phenol resin, etc. filled with inorganic materials such as silica, alumina, boron nitride, etc. Material, an epoxy resin, and a composite resin material containing mesh phenolic resins. Moreover, the composite board material etc. which were comprised by laminating | stacking two or more board | plate materials which consist of these materials can also be used.

  The thicknesses of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 are in accordance with the types of materials constituting the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35. Although it selects suitably, Preferably it is 1-10 mm. For example, a glass fiber reinforced epoxy resin having a thickness of 2 to 5 mm can be used.

  As a method for movably supporting the conductive pins 32 on the first insulating plate 34 and the second insulating plate 35, the methods shown in FIGS. 20 to 22 can be cited in addition to the method shown in FIG. it can. In this example, as illustrated as the conductive pins 32, in this example, a bent holding plate 84 is provided between the first insulating plate 34 and the second insulating plate 35.

In addition, a cylindrical metal pin is used as the conductive pin 32.
As shown in FIG. 20, the bent holding plate 84 is formed with a through hole 85 through which the conductive pin 32 is inserted. The conductive pin 32 has a through hole 83a formed in the first insulating plate 34, a through hole 83b formed in the second insulating plate 35, and a through hole 85 formed in the bent holding plate 84 as fulcrums. They are pressed laterally in opposite directions and bent at the position of the through hole 85 of the bending holding plate 84, whereby the conductive pin 32 is supported so as to be movable in the axial direction.

The intermediate holding plate 36 is formed with a through hole 86 having a diameter large enough not to contact the conductive pin 32, and the conductive pin 32 is inserted into the through hole 86.
The conductive pin 32 is supported by the first insulating plate 34 and the second insulating plate 35 in the procedure shown in FIGS. 21 (a) to 21 (c). As shown in FIG. 21A, the through hole 83a of the first insulating plate 34 and the through hole 83b formed in the second insulating plate 35 and the through hole 85 of the bent holding plate 84 are in the axial direction. The bending holding plate 84 is disposed at the aligned position.

  Next, as shown in FIG. 21 (b), the conductive pin 32 is passed from the through hole 83 a of the first insulating plate 34 to the through hole 83 b of the second insulating plate 35 through the through hole 85 of the bent holding plate 84. insert.

  Next, as shown in FIG. 21 (c), the bending holding plate 84 is moved in the lateral direction (horizontal direction) perpendicular to the axial direction of the conductive pin 32, and the position of the bending holding plate 84 is adjusted by an appropriate means. Fix it. As a result, the conductive pins 32 are opposite to each other with the through hole 83 b formed in the first insulating plate 34 and the second insulating plate 35 and the through hole 85 of the bent holding plate 84 as fulcrums. It is pressed in the lateral direction and bent at the position of the through hole 85 of the bent holding plate 84, whereby the conductive pin 32 is supported so as to be movable in the axial direction.

By being configured in this way, the conductive pin 32 can be held between the first insulating plate 34 and the second insulating plate 35 so as to be movable in the axial direction and not to fall off, Since the pin having a simple structure having a cylindrical shape can be used as the conductive pin 32, the cost of the conductive pin 32 and the member holding it can be suppressed as a whole.

The position where the bent holding plate 84 is disposed may be between the first insulating plate 34 and the intermediate holding plate 36.
In the inspection apparatus of the present embodiment configured as described above, as shown in FIG. 2, the electrodes 2 and 3 of the circuit board 1 to be inspected are connected to the relay boards 29a and 29b, the pitch conversion boards 23a and 23b, the first The base plates 46a and 46b arranged on the outermost side through the two anisotropic conductive sheets 26a and 26b, the conductive pins 32a and 32b, the third anisotropic conductive sheets 42a and 42b, and the connector boards 43a and 43b By pressing the tester with a predetermined pressure, the tester is electrically connected to a tester (not shown), and electrical inspection such as electrical resistance measurement between electrodes of the circuit board 1 to be inspected is performed.

The pressure pressed from the upper and lower first inspection jigs 11a and 11b against the circuit board to be inspected at the time of measurement is, for example, 100 to 250 kgf.
Hereinafter, the circuit board to be inspected between the first inspection jig 11a and the second inspection jig 11b with reference to FIGS. 24 to 27 (for convenience, only the second inspection jig 11b is shown). A pressure absorbing action and a pressure dispersing action when both surfaces of 1 are clamped will be described.

  As shown in FIG. 25, when electrical inspection is performed by sandwiching both surfaces of the circuit board 1 to be inspected between the first inspection jig 11a and the second inspection jig 11b. In the initial stage of pressure, the relay pin unit 31 moves in the thickness direction of the conductive pins 32, the elastic portion of the relay substrate 29, the second anisotropic conductive sheet 26, and the third anisotropic conductive sheet 42. The pressure can be absorbed by the rubber elastic compression, and the height variation of the inspected electrode of the inspected circuit board 1 can be absorbed to some extent.

  A first contact support position between the first support pin and the intermediate holding plate and a second contact support position between the second support pin and the intermediate holding plate are in the thickness direction of the intermediate holding plate. Since they are arranged at different positions on the projected intermediate holding plate projection surface, a force acts in the vertical direction as shown by the arrow in FIG. 26, and as shown in FIG. 27, the first inspection jig 11a. When the circuit board 1 to be inspected is further pressed between the second inspection jig 11b and the second inspection jig 11b, the elastic portion of the relay substrate 29, the second anisotropic conductive sheet 26, and the third In addition to the rubber elastic compression of the anisotropic conductive sheet 42, the first insulating plate 34, the second insulating plate 35, and between the first insulating plate 34 and the second insulating plate 35 of the relay pin unit 31. Variation of the electrodes to be inspected of the circuit board 1 to be inspected due to the spring elasticity of the intermediate holding plate 36 disposed in For example, it is possible to solder ball electrodes with respect to height variation, by dispersing pressure concentration, to avoid local stress concentration.

  That is, as shown in FIG. 26 and FIG. 27, the intermediate holding plate 36 is attached to the second insulating plate 35 around the first contact support position 38 </ b> A with respect to the first support pin 33 and the intermediate holding plate 36. The intermediate holding plate 36 is bent around the second abutting support position 38B between the second support pin 37 and the intermediate holding plate 36, as shown in FIG. It bends in the direction of the first insulating plate 34 (see the portion D surrounded by the one-dot chain line in FIG. 27). Here, “bend” and “bend direction” refer to the bend so that the intermediate holding plate 36 protrudes in a convex direction and the protruding direction thereof.

  As described above, the intermediate holding plate 36 bends in the opposite directions around the first contact support position 38A and the second contact support position 38B, so that the first inspection jig 11a and the second inspection jig 11a When the circuit board 1 to be inspected is further pressurized with the inspection jig 11b, the spring elastic force of the intermediate holding plate 36 is exerted.

Further, as shown by a portion B surrounded by a one-dot chain line in FIG. 27, the second anisotropic conductive sheet 26 is provided.
Although the height of the conductive pin 32b is absorbed by the compression of the protruding portion of the conductive path forming portion, pressure that cannot be absorbed by the compression of the protruding portion is applied to the first insulating plate 34b.

  Therefore, as shown by a portion C surrounded by a one-dot chain line in FIG. 27, the first insulating plate 34 and the second insulating plate 35 are also in contact with the first support pin 33 and the second support pin 37. When the circuit board 1 to be inspected is further pressed between the first inspection jig 11a and the second inspection jig 11b, the first and second inspection jigs 11b are bent. The spring elastic force of the insulating plate 34 and the second insulating plate 35 is exhibited.

  As a result, stable electrical contact is ensured with respect to each of the electrodes to be inspected of the circuit board 1 to be inspected having a height variation, and further, stress concentration is reduced, so that the elastic portion of the relay substrate 29 is locally localized. Damage is suppressed. As a result, since the repeated use durability of the relay substrate 29 is improved, the number of times of replacement is reduced, and the inspection work efficiency is improved.

  FIG. 28 is a sectional view similar to FIG. 24 for explaining another embodiment of the inspection apparatus of the present invention (only the second inspection jig is shown for convenience), and FIG. 29 is an enlarged view of the relay pin unit. It is sectional drawing. This inspection apparatus has basically the same configuration as the inspection apparatus shown in FIG. 1, and the same reference numerals are assigned to the same components. In this inspection apparatus, as shown in FIGS. 28 and 29, a plurality (three in this embodiment) of intermediate holding plates 36 are provided between the first insulating plate 34 and the second insulating plate 35. The holding plate support pins 39 are arranged between the adjacent intermediate holding plates 36 while being spaced apart from each other by a predetermined distance.

  In this case, in at least one intermediate holding plate 36b, the holding support position of the holding plate support pin 39b that comes into contact with the intermediate holding plate 36b from one surface side with respect to the intermediate holding plate 36b, and the other surface with respect to the intermediate holding plate 36b. The intermediate support projected from the contact position of the first support pin 33b, the second support pin 37b, or the holding plate support pin 39b with respect to the intermediate holding plate 36b in the thickness direction of the intermediate holding plate 36b. It is necessary that they are arranged at different positions on the plate projection surface.

  Most preferably, in all of the intermediate holding plates 36b, the holding plate support pins 39b that come into contact with the intermediate holding plate 36b from one surface side are in contact with the intermediate holding plate 36b, and the other surface with respect to the intermediate holding plate 36b. The intermediate support projected from the contact position of the first support pin 33b, the second support pin 37b, or the holding plate support pin 39b with respect to the intermediate holding plate 36b in the thickness direction of the intermediate holding plate 36b. They are arranged at different positions on the plate projection plane.

  In this case, although not described in detail, the “different positions” means the first contact support position 38A between the first support pin 33 and the intermediate holding plate 36 and the second support pin 37 in the above-described embodiment. And the relative position described with respect to the relationship between the intermediate holding plate 36 and the second contact support position 38B.

  In the present embodiment, in the upper intermediate holding plate 36b among the three intermediate holding plates 36b, the holding support position 39A of the holding plate support pin 39b that comes into contact with the intermediate holding plate 36b from the one surface side with respect to the intermediate holding plate 36b; The intermediate support plate projection surface projected from the contact support position 38A of the first support pin 33b that contacts the intermediate support plate 36b from the other side with respect to the intermediate support plate 36b in the thickness direction of the intermediate support plate 36b. Are arranged at different positions.

Further, in the middle intermediate holding plate 36b among the three intermediate holding plates 36b, the holding support position 39A of the holding plate support pin 39b that comes into contact with the intermediate holding plate 36b from one side and the intermediate holding plate 36b, and the intermediate holding plate The holding support position 39A of the holding plate support pin 39b that is in contact with the plate 36b from the other surface side with respect to the intermediate holding plate 36b is at a different position on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate 36b. Has been placed.

  Further, in the lower intermediate holding plate 36b among the three intermediate holding plates 36b, the holding support position 39A of the holding plate support pin 39b that comes into contact with the intermediate holding plate 36b from one surface side with respect to the intermediate holding plate 36b, The contact support position 38B of the second support pin 37b that contacts the holding plate 36b from the other surface side with respect to the intermediate holding plate 36b is different on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate 36b. Placed in position.

  With this configuration, the spring elasticity is further exhibited by the plurality of intermediate holding plates 36, and the pressure concentration is distributed with respect to the height variation of the electrodes to be inspected of the circuit board 1 to be inspected. Thus, local stress concentration can be further avoided, and local breakage of the elastic portion of the relay board 29 is suppressed. As a result, the repeated use durability of the relay board 29 is improved. The number of replacements is reduced and inspection work efficiency is improved.

The number of intermediate holding plates 36 is not particularly limited as long as it is plural.
As mentioned above, although embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range which does not deviate from the summary.

  For example, the circuit board 1 to be inspected may be a semiconductor integrated circuit device such as a package IC, MCM, or CSP, or a circuit device formed on a wafer, in addition to a printed circuit board. Further, the printed circuit board may be a single-sided printed circuit board as well as a double-sided printed circuit board.

The first inspection jig 11a and the second inspection jig 11b are not necessarily the same in materials used, member structures, and the like, and they may be different.
The tester-side connector may be configured by laminating a plurality of circuit boards such as connector boards and anisotropic conductive sheets.

  In the above embodiment, as the second anisotropic conductive sheet 26 and the third anisotropic conductive sheet 42, a plurality of conductive path forming portions extending in the thickness direction and insulation that insulates these conductive path forming portions from each other. And the conductive particles are contained only in the conductive path forming part, whereby the conductive particles are dispersed unevenly in the surface direction, and the conductive path forming part protrudes on one side of the sheet However, the present invention is not necessarily limited to this.

  Further, as shown in FIGS. 1, 2, 24, 25, 27, and 28, support pins 49 may be arranged between the connector board 43 and the base plate 46 in the tester side connector 41. Good. By these support pins 49, the first support pin 33 and the second support pin 37 (in FIG. 28, the first support pin 33, the second support pin 37, and the holding plate support pin 39) have the same effects. Thus, it is possible to provide an effect of dispersing the surface pressure. In order to give this surface pressure dispersion action, it is preferable to arrange these so that the position of the support pin 49 and the position of the second support pin 37 are different from each other in the surface direction.

  As described above, according to the circuit board inspection apparatus of the present invention, a highly reliable circuit board electrical inspection is performed between the first inspection jig 11a and the second inspection jig 11b. be able to. In addition, the followability to the variation of the inspected electrodes of the circuit board 1 to be inspected is good, and there is no conduction failure, and an accurate inspection can be performed.

In addition, since there is no need to arrange the conductive pins at regular intervals, there is little drilling work by drilling through holes in the insulating plate holding the conductive pins, and the cost can be reduced.
Further, inspection can be performed with high resolution, and a step due to the inspection target electrode of the inspection target circuit board can be satisfactorily absorbed. Moreover, since the adhesive force of the contact member used for the relay substrate is high, the contact member is prevented from falling off, and the durability is high.

FIG. 1 is an exploded sectional view of an inspection apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view illustrating a use state of the inspection apparatus illustrated in FIG. 1 during inspection. FIG. 3 is a view showing the surface of the circuit board side of the pitch conversion board incorporated in the inspection apparatus of FIG. FIG. 4 is a view showing the surface of the pitch conversion substrate shown in FIG. 3 on the relay pin unit side. FIG. 5 is a cross-sectional view of a state in which a pitch conversion board, a relay board, and a circuit board to be inspected that are incorporated in the inspection apparatus of FIG. 1 are stacked. 6A is a partial cross-sectional view of the relay board, and FIG. 6B is an enlarged view thereof. FIG. 7 shows a method of manufacturing a relay board according to an embodiment of the present invention. FIG. 7 (a) is an exploded cross-sectional view showing an assembly mode of a support and a composite film, and FIG. It is sectional drawing of the 1st composite film arrangement | positioning process in the manufacturing method. 8A and 8B show a method for manufacturing a relay substrate according to an embodiment of the present invention. FIG. 8A is a cross-sectional view of a conductive paste application process, and FIG. 8B is a second composite film arrangement process. It is sectional drawing which showed. FIG. 9 is a cross-sectional view illustrating a magnetic field orientation process according to a method for manufacturing a relay substrate according to an embodiment of the present invention. FIG. 10 is a cross-sectional view illustrating a recess forming process for applying liquid silicon rubber by a method for manufacturing a relay substrate according to an embodiment of the present invention. FIG. 11 shows a method of manufacturing a relay substrate according to an embodiment of the present invention. FIG. 11 (a) shows a case where laser processing is performed from the upper surface of a composite film as a preparatory step for forming a recess for applying liquid silicon rubber. FIG. 11B is a cross-sectional view showing a state in which the composite film is peeled off in the recess forming step for applying liquid silicon rubber. FIG. 12 is a cross-sectional view of a liquid silicon rubber coating process according to a relay substrate manufacturing method according to an embodiment of the present invention. FIG. 13 is a cross-sectional view of a liquid silicon rubber curing process according to a relay substrate manufacturing method according to an embodiment of the present invention. FIG. 14 is a cross-sectional view of a process of integrally providing a plated metal in the method for manufacturing a relay board according to an embodiment of the present invention. FIG. 15 is a partial cross-sectional view showing a state in which a pitch conversion substrate, a relay substrate, and a circuit board to be inspected are stacked via a first anisotropic conductive sheet. FIG. FIG. 15B is a partial cross-sectional view showing another example in which an anisotropic conductive sheet is interposed between the conversion substrate and FIG. 15B, between the relay substrate and the pitch conversion substrate, and between the relay substrate and the circuit to be inspected. It is a fragmentary sectional view when an anisotropic conductive sheet is interposed between each substrate. FIG. 16 is a partial cross-sectional view of the first anisotropic conductive sheet. FIG. 17 is a cross-sectional view of the second anisotropic conductive sheet. FIG. 18 is a cross-sectional view of the relay pin unit. FIG. 19 is a cross-sectional view showing a part of the conductive pin, the intermediate holding plate, and the insulating plate of the relay pin unit. FIG. 20 is a cross-sectional view similar to FIG. 19 showing another example of the relay pin unit. FIG. 21 is a cross-sectional view showing steps until a conductive pin is arranged between the first insulating plate and the second insulating plate in the configuration of FIG. FIG. 22 is a cross-sectional view of a relay pin unit in which a bent holding plate is arranged. FIG. 23 is a partially enlarged view of the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate of the relay pin unit. FIG. 24 is a partial cross-sectional view showing an embodiment of the inspection apparatus of the present invention. FIG. 25 is a cross-sectional view illustrating the usage state of the inspection apparatus of the present invention. FIG. 26 is a cross-sectional view illustrating a usage state of the relay pin unit in the inspection apparatus of the present invention. FIG. 27 is a cross-sectional view illustrating a use state of the inspection apparatus of the present invention. FIG. 28 is a partial cross-sectional view similar to FIG. 24, showing another embodiment of the inspection apparatus of the present invention. FIG. 29 is a cross-sectional view of the relay pin unit in the embodiment of FIG. FIG. 30 is a cross-sectional view of a conventional circuit board inspection apparatus. FIG. 31 is a cross-sectional view of a relay board used in Japanese Patent Application No. 2005-205684.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit board 2 to be inspected, 3 Electrode 11a First inspection jig 11b Second inspection jig 21a, 21b Circuit board side connectors 22a, 22b First anisotropic conductive sheets 23a, 23b Pitch conversion board 24 Terminal Electrode 25 Connection electrodes 26a, 26b Second anisotropic conductive sheets 29a, 29b Relay boards 31a, 31b Relay pin units 32a, 32b Conductive pins 33a, 33b First support pins 34a, 34b First insulating plate 35a, 35b Second insulating plates 36a, 36b Intermediate holding plates 37a, 37b Second support pin 38A First contact support position 38B Second contact support position 39 Holding plate support pin 39A Contact support positions 41a, 41b Tester Side connectors 42a, 42b Third anisotropic conductive sheets 43a, 43b Connector boards 44a, 44b Tester side electrodes 45a, 4 b Pin side electrodes 46a and 46b Base plate 47 Liquid silicon rubber coating recesses 49a and 49b Support pin 51 Insulating substrate 52 Wiring 53 Internal wiring 54 Insulating layer 55 Insulating layer 57 Plating metal holding plate 59 Metal layer 61 Conductive path forming part 61a Protruding portion 61A Conductive elastomer material layer 61B Conductive elastomer layer 62 Insulating portion 63 Sheet base material 64 Metal film 67 Resist layer 67a Opening 68 Magnetic metal plating 71 Conductive path forming portion 72 Insulating portion 72a Protruding portion 73 Support 73c Through hole 77 Contact members (plated metal)
79 Liquid silicon rubber 81a, 81b End portion 82 Central portion 83, 83a, 83b Through hole 84 Bending holding plate 85 Through hole 86 Through hole 101 Circuit board 102 Inspected electrode 103 Inspected electrode 111a First inspection jig 111b Second inspection jigs 121a and 121b Circuit board side connectors 122a and 122b First anisotropic conductive sheet (relay board)
123a, 123b Pitch conversion boards 126a, 126b Second anisotropic conductive sheets 131a, 131b Relay pin units 132a, 132b Conductive pins 134a, 134b Insulating plates 141a, 141b Tester side connectors 142a, 142b Third anisotropic conductive Sheets 143a and 143b Connector substrates 146a and 146b Base plate A Intermediate holding plate projection surface P Conductive particle L1 Distance L2 Distance Q1 Diagonal line Q2 Diagonal line R1 Unit lattice region R2 Unit lattice region

Claims (16)

While relaying the electrical connection between the circuit board to be inspected and the pitch conversion board that converts the pitch of the electrodes between the one side and the other side,
A plurality of conductive path forming portions contained in the elastic polymer material in a state where the conductive particles exhibiting magnetism are oriented in the thickness direction are mutually connected through the insulating silicon film in the through holes formed in the support. In addition, a contact member made of metal is integrally provided at the thickness direction end portion of the conductive path forming portion, and the top portion of the contact member is formed from the insulating silicon film. A relay board characterized by being projected outward in the direction. Between the contact member and the conductive path forming portion,
When the liquid silicone rubber on the contact member side applied so as to surround the side peripheral surface of the contact member is heated and pressurized and cured, it is cured together with the liquid silicone rubber on the support side that has been previously applied to the support side. The relay board according to claim 1, wherein the relay board is integrated.   The liquid silicone rubber preliminarily applied to the side peripheral surface of the contact member and the liquid silicone rubber preliminarily applied to the support side are applied to the outer region of the through-hole formed in the support body. The relay board according to claim 2, wherein the relay board is extended.   The liquid silicone rubber preliminarily applied to the support side is applied such that the liquid level rises outward with respect to the surface of the support and the surface of the conductive path forming portion during application. The relay board according to claim 2 or 3.   The contact member presses the conductive path forming portion inward during pressurization, and the liquid silicone rubber is cured in a state in which a front end surface of the contact member enters inward of the conductive path forming portion. The relay substrate according to claim 1, wherein A relay board manufacturing method for manufacturing the relay board according to claim 1,
A through hole in which conductive paste is to be applied is formed on the lower surface side of the support, on the lower surface side of the support, and in the resist layer of the composite film of the metal layer and the resist layer, the thickness of the resist layer is approximately the same as the thickness of the resist layer. A first composite film arrangement step of arranging a composite film pre-plated with metal in a direction in which the metal layer side of the composite film is opposed to the support side;
A conductive paste application step of applying a conductive paste into the through-hole formed in the support;
Another composite film having the same structure as that of the composite film used in the first composite film arranging step is formed on the upper surface side of the support on which the conductive paste is applied in the through hole. A second composite film arrangement step of arranging the layer side in a direction facing the support side;
By applying a magnetic field in the thickness direction of the conductive paste to the support in which the composite films are respectively disposed on both upper and lower surfaces of the support and the conductive paste is applied in the through holes, A magnetic field orientation step of orienting the magnetic particles in the conductive paste, thereby forming a conductive path forming portion by the magnetic particles;
A recess forming step for applying liquid silicon rubber to form a recess for applying liquid silicon rubber around the conductive path forming portion by performing laser processing on the magnetically oriented support.
A plating metal holder preparing step of preparing a plating metal holding plate for a metal contact in which a plating metal for a metal contact is provided on one surface of the metal layer in advance and liquid silicon rubber is applied around the plating metal; ,
A liquid silicon rubber application step of applying liquid silicon rubber into the support unit obtained in the recess formation step for applying liquid silicon rubber;
The plated metal holding plate obtained in the plated metal holding body preparation step and the support unit obtained in the liquid silicon rubber coating step are pressed and overlapped so that the liquid silicon rubbers are in close contact with each other. Liquid silicon rubber curing step of curing the liquid silicon rubber in a state where the interface between the liquid silicon rubbers is eliminated by heating in a laminated state under pressure,
After the liquid silicon rubber is cured in the liquid silicon rubber curing step, by peeling the metal layers on both sides of the support unit, the plating metal is integrally provided on the top of the conductive path forming portion; A method for manufacturing a relay board, comprising: A circuit board inspection apparatus that performs electrical inspection by sandwiching both surfaces of a circuit board to be inspected between a pair of first inspection jigs and a second inspection jig between the inspection jigs. ,
The first inspection jig and the second inspection jig are respectively
A pitch conversion substrate for converting the electrode pitch between the one surface side and the other surface side; and
The insulating layer made of an elastic polymer material and an elastic polymer material containing conductive particles in a plurality of through holes formed in the substrate, which are arranged on the circuit board side to be inspected of the pitch conversion substrate. A conductive path forming portion that penetrates the portion in the thickness direction, and a relay substrate that relays electrical connection between the pitch conversion substrate and the circuit board to be inspected by the conductive path forming portion, and
A circuit board-side connector provided with a second anisotropic conductive sheet disposed on the opposite side of the pitch conversion board from the relay board;
A plurality of conductive pins arranged at a predetermined pitch; and
A relay pin unit comprising a pair of spaced apart first insulating plates and second insulating plates, which support the conductive pins movably in the axial direction;
A connector board for electrically connecting a tester and the relay pin unit; and
A third anisotropically conductive sheet disposed on the relay pin unit side of the connector board; and
A tester side connector provided with a base plate arranged on the opposite side of the relay pin unit of the connector board,
The relay pin unit is
An intermediate holding plate disposed between the first insulating plate and the second insulating plate; and
A first support pin disposed between the first insulating plate and the intermediate holding plate; and
A second support pin disposed between the second insulating plate and the intermediate holding plate,
A first abutting support position of the first support pin with respect to the intermediate holding plate and a second abutting support position of the second support pin with respect to the intermediate holding plate are projected in the thickness direction of the intermediate holding plate. It is arranged at different positions on the intermediate holding plate projection surface,
The relay board is
A plurality of conductive path forming parts contained in the elastic polymer material in a state where the conductive particles exhibiting magnetism are oriented in the thickness direction are mutually connected through the insulating silicon film in the through holes formed in the support. Further, a contact member made of metal is integrally provided at an end portion in the thickness direction of the conductive path forming portion, and a top portion of the contact member is formed from the insulating silicon film. Arranged to protrude outward in the direction,
Between the contact member and the conductive path forming portion,
When the liquid silicon rubber on the contact member side applied so as to surround the side peripheral surface of the contact member is heated and pressurized and cured, it is cured together with the liquid silicon rubber applied in advance on the support side. An inspection apparatus for circuit boards, wherein silicon rubber is integrated by adhesive force when cured without an interface. When the both sides of the circuit board to be inspected are clamped between the two inspection jigs by the pair of the first inspection jig and the second inspection jig,
The intermediate holding plate bends in the direction of the second insulating plate around the first contact support position of the first support pin with respect to the intermediate holding plate, and
The intermediate holding plate bends in the direction of the first insulating plate, with the second contact support position of the second support pin with respect to the intermediate holding plate as a center. Circuit board inspection equipment. A first contact support position of the first support pin with respect to the intermediate holding plate is arranged in a lattice shape on the intermediate holding plate projection surface;
Second contact support positions of the second support pins with respect to the intermediate holding plate are arranged in a grid pattern on the intermediate holding plate projection surface,
In the intermediate holding plate projection surface, one second abutment support position is disposed in a unit lattice region composed of four adjacent first abutment support positions, and
8. One first abutment support position is arranged in a unit lattice area composed of four adjacent second abutment support positions on the intermediate holding plate projection surface. Or the circuit board inspection apparatus according to 8. The relay pin unit is
A plurality of intermediate holding plates disposed at a predetermined interval between the first insulating plate and the second insulating plate;
Holding plate support pins arranged between adjacent intermediate holding plates;
With
In at least one intermediate holding plate, a holding support position of the holding plate support pin that contacts the intermediate holding plate from one surface side with respect to the intermediate holding plate, and a first surface that contacts the intermediate holding plate from the other surface side. The support support position of the first support pin, the second support pin, or the holding plate support pin with respect to the intermediate holding plate is arranged at a different position on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate. The circuit board inspection apparatus according to claim 7, wherein the circuit board inspection apparatus is provided.   In all of the intermediate holding plates, the holding plate supporting pins that come into contact with the intermediate holding plate from one surface side are in contact with and supported by the intermediate holding plate, and the intermediate holding plate comes into contact with the intermediate holding plate from the other surface side. The support support position of the first support pin, the second support pin, or the holding plate support pin with respect to the intermediate holding plate is arranged at a different position on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate. The circuit board inspection apparatus according to claim 10, wherein the circuit board inspection apparatus is provided.   The second anisotropic conductive sheet includes a plurality of conductive path forming portions extending in the thickness direction and insulating portions that insulate the conductive path forming portions from each other, and the conductive particles are only in the conductive path forming portions. 12. The circuit according to claim 7, wherein the conductive particles are dispersed non-uniformly in a plane direction, and a conductive path forming portion protrudes on one side of the sheet. Board inspection equipment.   The third anisotropic conductive sheet is composed of a plurality of conductive path forming portions extending in the thickness direction and insulating portions that insulate these conductive path forming portions from each other, and the conductive particles are only in the conductive path forming portions. 13. The circuit according to claim 7, wherein the conductive particles are dispersed non-uniformly in a plane direction, and a conductive path forming portion protrudes on one side of the sheet. Board inspection equipment. The plurality of conductive pins are formed in a bar-shaped central portion that is shorter than the distance between the first insulating plate and the second insulating plate, and are formed on both ends of the central portion, and have a smaller diameter than the central portion. Consisting of a pair of ends,
The pair of end portions are respectively inserted through through-holes having a diameter smaller than that of the central portion formed in the first insulating plate and the second insulating plate and larger than that of the pair of end portions. The circuit board inspection apparatus according to claim 7, wherein the conductive pins are supported so as to be movable in an axial direction. A through hole through which the conductive pin is inserted is formed between the first insulating plate and the intermediate holding plate, between the second insulating plate and the intermediate holding plate, or between the intermediate holding plates. A bent holding plate is provided,
The plurality of conductive pins are pressed laterally in opposite directions from each other with a through hole formed in the first and second insulating plates and a through hole formed in the bent holding plate as fulcrums. 15. The circuit board inspection device according to claim 7, wherein the circuit board inspection device is bent at the position of the through hole of the holding plate, and thereby the conductive pin is supported so as to be movable in the axial direction. A circuit board inspection method using the circuit board inspection apparatus according to claim 7,
A circuit board comprising: a pair of a first inspection jig and a second inspection jig, wherein both sides of a circuit board to be inspected are sandwiched between the inspection jigs to perform an electrical inspection. Inspection method.

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