JP3360679B2 - Circuit board inspection adapter device, circuit board inspection method and inspection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adapter device for inspecting a circuit board having an anisotropic conductive connector layer, a method and an apparatus for inspecting a circuit board.

[0002]

2. Description of the Related Art Generally, in a circuit board such as a printed circuit board, as shown in FIG. 19, a functional element region 91 in which functional elements are formed with a high degree of integration is provided at the center of a circuit board 90. The functional element region 9
A lead electrode region 93 in which a large number of lead electrodes 92 for one are arranged is formed. At present, with the increase in the degree of integration of the functional element region 91, the number of lead electrodes in the lead electrode region 93 tends to increase and the density tends to increase.

In order to achieve electrical connection between such lead electrodes of a circuit board and other circuit terminals to be connected thereto, conventionally, an anisotropic conductive sheet is interposed on each lead electrode region. Let it be done. The anisotropic conductive sheet has conductivity only in the thickness direction, or has a large number of pressurized conductive portions that show conductivity only in the thickness direction when pressed. Are disclosed, for example, in JP-B-56-48951 and JP-A-51-481.
No. 93393, JP-A-53-147772,
This is known from JP-A-54-146873 and the like.

However, the above-described anisotropic conductive sheet is manufactured as a single product itself and is handled independently, and has a specific positional relationship with respect to a circuit board in an electrical connection operation. It is necessary to hold and fix.

[0005]

However, in the means for achieving the electrical connection of the circuit board using the independent anisotropic conductive sheet, the arrangement pitch of the lead electrodes on the circuit board to be inspected (hereinafter referred to as "the pitch of the lead electrodes"). In other words, there is a problem that the positioning and holding and fixing of the anisotropic conductive sheet become more difficult as the distance between the centers of the adjacent lead electrodes becomes smaller.

[0006] Even if the desired alignment and holding and fixing have been realized, the degree of stress due to thermal expansion and thermal shrinkage is the circuit to be inspected if a thermal history due to a temperature change is received. Since there is a difference between the material forming the substrate and the material forming the anisotropic conductive sheet, there is a problem that the electrical connection state changes and a stable connection state is not maintained.

Further, even if a stable connection state can be maintained with respect to a circuit board to be inspected, a circuit having a complicated and fine pattern of electrodes to be inspected, such as a printed circuit board having a high mounting density, is used. Since it is difficult to reliably achieve electrical connection with each of the electrodes to be inspected on the substrate, there is a problem that required inspection cannot be performed sufficiently.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide an inspection target electrode such as a lead electrode on a circuit board to be inspected having a fine electrode pitch and a fine electrode pitch. Even when the circuit board has a high-density and complicated pattern, the required electrical connection can be reliably achieved for the circuit board, and the circuit board has good resistance to environmental changes such as heat history due to temperature changes. An object of the present invention is to provide a circuit board inspection adapter device in which an electrical connection state is stably maintained, and thus connection reliability is high. Another object of the present invention is to provide a method and an apparatus for inspecting a circuit board using the adapter device.

[0009]

SUMMARY OF THE INVENTION A circuit board inspection adapter device according to the present invention is provided between a circuit board to be inspected and an electrical inspection device to electrically connect electrodes of the circuit board. Adapter device and the material is dimension
An adapter body having a substrate that is a heat-resistant material having high legal stability and a wiring layer portion provided on the upper surface of the substrate, and is integrally adhered to a surface of the wiring layer portion of the adapter body.
Or insulating elastic polymer formed in close contact
Conductive part that is filled with conductive particles and extends in the thickness direction
Formed on the surface of the wiring layer portion of the adapter body, a connection electrode arranged corresponding to the electrode to be inspected of the circuit board to be inspected is formed, Terminal electrodes arranged on lattice points are formed on the lower surface of the substrate, and two or more in-layer wiring portions for electrically connecting the connection electrodes and the terminal electrodes are formed in the wiring layer portion. It is characterized by having.

In the above, the conductive portion of the anisotropic conductive connector layer is disposed on the connection electrode formed at the position corresponding to the electrode to be inspected on the circuit board to be inspected on the surface of the wiring layer portion of the adapter body. Is preferred. Further, it is preferable that the conductive portion forms a protruding portion protruding from the surface of the insulating portion on the outer surface of the anisotropic conductive connector layer.

According to a method for inspecting a circuit board of the present invention, the above-mentioned adapter device for circuit board inspection is used to electrically inspect an electrode to be inspected on a circuit board to be inspected through a conductive portion of an anisotropic conductive connector layer. The circuit board is inspected by achieving electrical connection with the device. Further, a circuit board inspection apparatus according to the present invention includes the above-described circuit board inspection adapter apparatus.

[0012]

According to the adapter device for circuit board inspection of the present invention, connection electrodes arranged corresponding to the electrodes to be inspected of the circuit board to be inspected are formed on the surface of the wiring layer portion of the adapter body. On the lower surface of the substrate, terminal electrodes arranged at lattice points and connected to an electrical inspection device are formed, and a wiring layer portion is used to electrically connect the connection electrodes and the terminal electrodes. And an anisotropic conductive connector layer is integrally provided on the surface of the wiring layer portion of the adapter body, and the anisotropic conductive connector layer Since the conductive part is formed by aligning the conductive particles in the insulating elastic polymer material in the thickness direction, the electrodes to be inspected on the circuit board to be inspected have a small electrode pitch. With fine, high-density Even in the case of a pattern having a simple pattern, the electrode is electrically tested with the electrode to be inspected of the circuit board through the conductive portion extending in the thickness direction in the anisotropic conductive connector layer by being compressed in the thickness direction. The required electrical connection with the device can be reliably achieved. Also,
Since the anisotropic conductive connector layer is provided integrally with the adapter body, a good electrical connection state is stably maintained against environmental changes such as heat history due to temperature changes, and therefore high connection reliability Can be obtained. According to the circuit board inspection method and the circuit board inspection apparatus described above, the required inspection of the circuit board can be performed with high reliability by using the circuit board inspection adapter device having the above configuration.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below. FIGS. 1 and 2 are an explanatory sectional view showing a configuration of an adapter device 10 for inspecting a circuit board according to an embodiment of the present invention and an explanatory sectional view of an adapter body 12, respectively. FIG. 4 is an explanatory plan view showing an arrangement state of each part of FIG. 10, and FIG. 4 is an enlarged enlarged sectional view of a connector layer 15 portion. As shown in FIG. 1, the adapter device 10 includes an adapter body 12 having a plate shape as a whole, and an anisotropic conductive connector layer (hereinafter simply referred to as a “connector layer”) 15 provided on an upper surface thereof. I have.

The adapter body 12 includes an insulating substrate 20
And a wiring layer portion 21 provided on the substrate 20. The wiring layer portion 21 includes a first insulating layer 23 formed on the upper surface of the substrate 20 and a first insulating layer 23 provided on the first insulating layer 23. It is composed of a laminate with two insulating layers 25. The material of the substrate 20 is preferably a heat-resistant material having high dimensional stability, and various resins can be used. In particular, a glass fiber reinforced epoxy resin is most suitable. Further, both the first insulating layer 23 and the second insulating layer 25 are formed of a radiation curable resin.

On the lower surface of the substrate 20, there are provided terminal electrodes 30 electrically connected to the tester for testing by appropriate means arranged on lattice points, and on the upper surface of the substrate 20, a third pattern of an appropriate pattern is provided. One wiring portion 33 is formed, and the terminal electrode 30 and the first wiring portion 33 are electrically connected by a short-circuit portion 32 extending through the substrate 20 in the thickness direction. The distance between the lattice points of the terminal electrode 30, that is, the electrode pitch of the terminal electrode 30 is not particularly limited, and may be an appropriate size according to inspection conditions. 0.8 mm.

A first insulating layer 23 is formed on the upper surface of the substrate 20 including the first wiring section 33. This first insulating layer 23
A second wiring portion 35 having an appropriate pattern is formed on the upper surface of the second wiring portion 35. The short-circuit portion 34 extending through the first insulating layer 23 in the thickness direction thereof and extending therethrough forms a second wiring portion 35 and a first wiring portion 33. And are electrically connected.

Further, the first insulating layer 2 including the second wiring portion 35
The second insulating layer 25 is formed on the upper surface of 3. On the upper surface of the second insulating layer 25, the connection electrode 40 is formed at a position corresponding to the pattern of the electrode to be inspected (not shown) on the circuit board to be inspected so as to protrude from the upper surface. . The connection electrode 40 and the second electrode are connected to each other by the short-circuit portion 36 extending through the second insulating layer 25 in the thickness direction.
The wiring section 35 is electrically connected. Note that the first wiring portion 33 and the second wiring portion 35 can be formed so as to extend in a direction intersecting the paper surface in FIG. 1 or FIG. 2, and such a state is shown in FIG. It is shown.

As described above, in the adapter body 12, each of the connection electrodes 40 is connected to the terminal electrode 30 via the short-circuit portion 36, the second wiring portion 35, the short-circuit portion 34, the first wiring portion 33, and the short-circuit portion 32. Is electrically connected to

In an actual configuration, the electrical connection between the connection electrode 40 and the terminal electrode 30 may be achieved in a manner suitable for the purpose of inspecting the circuit board. Therefore, it is not always necessary to connect all the connection electrodes 40 and the terminal electrodes 30 in a one-to-one correspondence, and the terminal electrodes 30 and the first wiring portions 3 are not necessarily connected.
3. Various required connection states of the second wiring portion 35 and the connection electrode 40 can be realized. For example, connecting the connection electrodes 40 using the first wiring portion 33 or the second wiring portion 35,
0 is commonly connected to one first wiring portion 33 or second wiring portion 35, one connection electrode 40 is simultaneously connected to a plurality of first wiring portions 33 or second wiring portions 35,
Others are possible.

Further, the connection electrode 40 and the first wiring portion 33 and the second wiring portion are connected via a directly continuous short-circuit portion without passing through the second wiring portion 35 or the first wiring portion 33 extending in the plane direction. It is also possible to electrically connect the part 35 and the terminal electrode 30 or the connection electrode 40 and the terminal electrode 30.

On the surface of the adapter body 12 as described above, a connector layer 15 is formed in a state of being integrally adhered or adhered. As shown in FIG. 4, the connector layer 15 is made of conductive particles P in an insulating elastic polymer material E.
Of the connection electrodes 4 are densely filled with the conductive portions 17.
In this state, the conductive portions 17 are located on the zero and the adjacent conductive portions 17 are insulated from each other by the insulating portion 18. In each conductive portion 17, the conductive particles P are oriented so as to be arranged in the thickness direction, and a conductive path extending in the thickness direction is formed. The conductive portion 17 may be a pressurized conductive portion in which a conductive path is formed by reducing a resistance value when compressed in a thickness direction and compressed. On the other hand, the insulating portion 18 does not form a conductive path in the thickness direction even when pressed.

In the conductive portion 17 of the connector layer 15, the filling rate of the conductive particles P is 10% by volume or more, particularly 1%.
It is preferably at least 5% by volume. In the case where the conductive portion is a pressurized conductive portion, when the filling rate of the conductive particles is high, it is preferable in that the intended electrical connection can be reliably achieved even when the pressing force is small. However, when the electrode pitch of the connection electrode 40 is small, sufficient insulation between adjacent conductive portions may not be ensured,
For this reason, the filling rate of the conductive particles P in the conductive portion 17 is preferably 40% by volume or less.

In the circuit board inspection adapter device having such a configuration, the connector layer 15 is integrally formed on the upper surface of the wiring layer portion 21 and the wiring layer portion 2 is formed.
The conductive portion 17 of the connector layer 15 on the first connection electrode 40
Are arranged, it is not necessary to perform positioning and holding and fixing of the connector layer 15 at the time of the electrical connection operation. Therefore, even when the electrode pitch of the lead electrode area is minute, the required electrical connection is required. Can be reliably achieved.

Further, since the connector layer 15 is integrated with the adapter main body 12, a good electrical connection state is stably maintained even when the environment changes such as a heat history due to a temperature change, and therefore the connection reliability is always high. Sex can be obtained.

In the example shown in the drawing, on the outer surface of the connector layer 15, the conductive portion 17 forms a projecting portion projecting from the surface of the insulating portion 18. According to such an example, since the degree of compression due to pressurization is greater in the conductive portion 17 than in the insulating portion 18, a conductive path having a sufficiently low resistance value is reliably formed in the conductive portion 17, whereby the pressing force is reduced. It is possible to reduce the change in the resistance value with respect to the change or the fluctuation. As a result, even if the pressing force applied to the connector layer 15 is not uniform, it is possible to prevent the occurrence of the conductive variation between the conductive portions 17. Can be prevented.

When the conductive portion 17 forms a protrusion as described above, the protrusion height h of the protrusion is determined by the connector layer 1.
5 is preferably 8% or more of the total thickness t (t = h + d, where d is the thickness of the insulating portion 18). The total thickness t of the connector layer 15 is preferably 300% or less of the electrode pitch p defined as the distance between the centers of the connection electrodes 40, that is, t ≦ 3p. By satisfying such a condition, even when the pressure applied to the connector layer 15 changes, the change in the conductivity of the conductive portion 17 due to the change is sufficiently small.

When the conductive portion 17 forms a projecting portion, it is not always necessary that the entire surface of the projecting portion has conductivity. A road non-forming portion may be present. Further, it is preferable that the minimum value of the separation distance r between the adjacent conductive portions 17 is 10% or more of the width R of the conductive portion 17. By satisfying such a condition, it is possible to sufficiently avoid the possibility that the adjacent conductive portions 17 are electrically contacted with each other due to lateral displacement when the protrusion is deformed by being pressed. Can be. In the above example, the planar shape of the conductive portion 17 can be a rectangular shape having the same width as the connection electrode 40, but can be a circular shape having a necessary area or any other appropriate shape.

The conductive particles of the conductive portion 17 include, for example, magnetic metal particles such as nickel, iron and cobalt or particles of alloys thereof, or gold,
Those plated with silver, palladium, rhodium, etc.
Inorganic particles such as non-magnetic metal particles or glass beads or polymer particles plated with a conductive magnetic material such as nickel or cobalt can be used.

In the method described below, nickel, iron,
Alternatively, conductive magnetic particles made of an alloy thereof or the like are used, and gold-plated particles can be preferably used in terms of electrical characteristics such as low contact resistance. Further, particles composed of a conductive superparamagnetic material can be preferably used because they do not show magnetic hysteresis.

The particle size of the conductive particles is preferably 3 to 200 μm so that the conductive portion 17 can be easily deformed under pressure and sufficient electrical contact can be obtained between the conductive particles in the conductive portion 17. Preferably, it is particularly preferably 10 to 100 μm.

As the insulating and elastic polymer constituting the conductive portion 17, a polymer having a crosslinked structure is preferable. Examples of curable polymer materials that can be used to obtain a crosslinked polymer include silicone rubber, polybutadiene, natural rubber, polyisoprene, styrene-butadiene copolymer rubber, and acrylonitrile-butadiene copolymer rubber. , Ethylene-propylene copolymer rubber, urethane rubber, polyester rubber, chloroprene rubber, epichlorohydrin rubber, and soft liquid epoxy resin.

Specifically, it is in a liquid state before the curing treatment, and after the curing treatment, the wiring layer portion 21 of the adapter body 12 is formed.
It is preferable to use a material for a polymer substance which is integrated with a state in which it is in close contact with or adhered to the material. From such a viewpoint, examples of the material for a polymer substance suitable for the present invention include liquid silicone rubber, liquid urethane rubber, and soft liquid epoxy resin. An additive such as a silane coupling agent or a titanium coupling agent can be added to the polymer substance material in order to improve the adhesion of the adapter body 12 to the wiring layer portion 21.

The material constituting the insulating portion 18 may be the same as or different from the polymer material constituting the conductive portion 17. An adapter that maintains the close contact state or the adhered state and is integrated with the adapter body 12 is used.

By forming such an insulating portion,
Since the integrity of the connector layer itself and the integrity of the connector layer with respect to the adapter main body are reliably increased, the strength of the entire adapter device is increased, and therefore, excellent durability against repeated compression can be obtained.

In the adapter device configured as described above, the circuit board to be inspected is arranged on the upper surface, the electrode to be inspected on the circuit board is brought into contact with the connection electrode 40, and the terminal electrode 30 on the lower surface is connected to the connection electrode 40. It is connected to a tester via appropriate connection means, and is further pressurized to compress the whole in the thickness direction. In this state, the conductive portion 17 of the connector layer 15 of the adapter device is in a conductive state, whereby required electrical connection between the electrode to be inspected and the tester is achieved.

Next, a method for manufacturing the adapter device for circuit board inspection according to the present invention will be described. This method basically includes a first process for forming an adapter body and a second process for integrally providing an anisotropic conductive connector layer on a surface of the adapter body.

The first process includes the following first to third steps. First Step This first step is a step of forming a terminal electrode on the lower surface of the substrate and forming a first wiring portion electrically connected to the terminal electrode on the upper surface. Specifically, as shown in FIG. 5, thin metal layers 30A and 33A made of, for example, copper or the like.
Is prepared by laminating on both surfaces a flat substrate 20 made of a hard resin, and through holes 20H are formed in the substrate 20 by, for example, a numerically controlled drilling device as shown in FIG. The pitch of the through holes 20H is, for example, 2.54 mm, and the hole diameter is, for example, 0.5 mm.
It is.

Next, as shown in FIG. 7, a short-circuit portion 32 extending through the substrate 20 by plating the inside of the through hole 20H with the electroless copper plating method or the electrolytic copper plating method is provided on the substrate 20 as shown in FIG. It is formed. Further, the metal thin layer 30A on the lower surface of the substrate 20 is subjected to a photo-etching process to form the terminal electrodes 30 arranged on the lattice points. The electrode pitch of the terminal electrode 30 is the same as that of the through hole 20H, for example, 2.54 mm. Further, the thin metal layer 33A on the upper surface of the substrate 20 is subjected to a photo-etching process to form the first wiring portion 33 having a pattern according to a mode to be finally obtained.

Second Step In this second step, a first insulating layer made of a radiation-curable resin is formed on the upper surface of the substrate 20, and the first insulating layer located on the upper surface of the first insulating layer is penetrated. And forming a second wiring portion electrically connected to the first wiring portion. Specifically, as shown in FIG. 8, a curable resin layer 23A which is cured by irradiation with radiation is formed on the upper surface of the substrate 20.
Is formed, for example, by integrally coating such a resin sheet by a vacuum lamination method. Then, the curable resin layer 2 is applied to the curable resin layer 23A.
By performing a photolithography method including irradiation of radiation sensitive to 3A, as shown in FIG. 9, a first insulating layer 23 made of a cured resin having via holes 23H is formed.

Next, as shown in FIG. 10, the inside of the via hole 23H is copper-plated by electroless copper plating or electrolytic copper plating, and the short-circuit portion 3 extending through the first insulating layer 23 is formed.
4 are formed. Via hole 23H is through hole 2
When it is located immediately above 0H, the short-circuit portion 34 continuously extends on the short-circuit portion 32. Then, a thin metal layer 35A formed by copper plating is further formed on the upper surface of the first insulating layer 23.
After the photoplating process, as shown in FIG. 11, a part of the thin metal layer 35A is removed by an etching process to form a second wiring portion 35 having a required pattern.

Third Step This third step comprises the steps of: forming a second insulating layer made of a radiation curable resin on the upper surface of the first insulating layer 23; and forming the second insulating layer on the upper surface of the second insulating layer. And forming a connection electrode that is electrically connected to the second wiring portion through the substrate. Specifically, as shown in FIG.
Is applied to the upper surface of the first insulating layer 23 containing the curable resin liquid, thereby forming the curable resin layer 25A. Then, the curable resin layer 25
A is subjected to a photolithography method including irradiation of radiation to which the curable resin layer 25A is sensitive, so that the second insulating layer 25 made of the cured resin in which the via holes 25H are formed is formed as shown in FIG. It is formed.

Next, as shown in FIG. 14, the inside of the via hole 25H is copper-plated by a photoplating method or an electroless plating method, and the short-circuit portion 3 extending through the second insulating layer 25 is formed.
6 are formed. Via hole 25H is Via hole 2
When it is located immediately above 3H, the short-circuit portion 36 extends continuously on the short-circuit portion 34. Then, a thin metal layer formed by copper plating is further formed on the upper surface of the second insulating layer 25. After the photo plating process, a part of the thin metal layer is removed by etching, and as shown in FIG.
The connection electrodes 40 having a pattern corresponding to the electrodes to be inspected of the circuit board to be inspected are formed, and thus the adapter body 12 is manufactured.

In the above first process, the means for providing the curable resin layer for forming the first insulating layer 23 or the second insulating layer 25 is not particularly limited, and the curable resin sheet may be formed by a vacuum laminating method. Means formed by
Means for applying the curable resin liquid using an application method such as screen printing technology, and other means can be used.

However, in practice, the thickness of the first insulating layer 23 on the lower surface side in contact with the substrate 20 is different from that of the second insulating layer 25 on the upper surface side.
Is preferably greater than the thickness of In this case, since the thickness of the second insulating layer 25 on the upper surface side is relatively small, so-called resolution is good when patterning for forming the second insulating layer 25 is performed by photolithography. High-density connection electrode 40
High-density conductive paths sufficiently corresponding to the above-mentioned pattern can be formed in a state where each of them is insulated reliably. Further, since the thickness of the first insulating layer 23 on the lower surface side is relatively large, insulation between the first wiring portion 33 and the second wiring portion 35 can be easily secured. Although the resolution when the patterning for forming the first insulating layer 23 is performed by photolithography is relatively poor, since the electrode pitch of the terminal electrodes 30 formed on the substrate 20 is not so high, the The resolution does not matter.

From the above viewpoint, the thickness of the first insulating layer 23 is, for example, 50 to 100 μm, and the thickness of the second insulating layer 25 is
Is preferably, for example, 40 to 60 μm.
Then, as in the formation of the first insulating layer 23, the thickness is 50 μm.
When a curable resin layer having a thickness of m or more is provided, it is advantageous to provide such a curable resin sheet by a vacuum lamination method in that high production efficiency can be obtained. This is because, when a layer having such a thickness is formed by a coating method, it is necessary to perform recoating many times, and it is not easy to form a uniform layer. On the other hand, the second insulating layer 2
In the case where a curable resin layer having a thickness of 50 μm or less is provided as in the case of No. 5, a liquid of such a curable resin can be advantageously provided by a coating method.

To increase the thickness of the metal layer forming the first wiring section 33, the second wiring section 35 or the connection electrode 40, a photoresist film having a thickness corresponding to the required thickness is formed and patterned. Is performed, a hole is formed in a portion where the metal layer is to be formed, a metal is filled in the hole by plating or the like, and then the photoresist film is removed. By such a method, the connection electrode 40 projecting from the surface can be easily formed.

When forming a short-circuit portion in the via hole 23H or 25H formed in the insulating layer, it is preferable to perform sandblasting prior to plating, thereby ensuring that the bottom surface of the via hole is exposed. And electrical connection by the short-circuit portion can be reliably achieved. In addition, when a metal layer is formed on the upper surface of the insulating layer, the adhesion of the metal layer can be improved by sandblasting the surface of the insulating layer.

The connector layer 15 is applied to the adapter body 12 obtained as described above by the second process.
Is provided. In the second process, the conductive magnetic particles are dispersed in a polymer material that becomes an insulating elastic polymer material by curing treatment to prepare a connector material made of a fluid mixture. As shown in FIG. 5, the connector material is applied to the upper surface of the adapter body 12 to form a connector material layer 50, which is arranged in the mold cavity.

This mold is an upper mold 5 that constitutes an electromagnet.
1 and a lower mold 52, and the upper mold 51 has a connection electrode 4
A magnetic pole plate 53 having a flat lower surface is provided which is composed of a ferromagnetic portion M (shown by oblique lines) having a pattern corresponding to 0 and a non-magnetic portion N other than the ferromagnetic portion. The flat lower surface of the plate 53 is separated from the surface of the connector material layer 50 so that the gap G is formed. In addition,
16 and 17, details of the adapter main body 12 are omitted except for the connection electrode 40.

In this state, the electromagnets of the upper die 51 and the lower die 52 are operated, whereby a parallel magnetic field in the thickness direction of the adapter body 12 is applied. As a result, in the portion of the connector material layer 50 located on the connection electrode 40, a stronger parallel magnetic field is applied in the thickness direction than in the other portions. As shown in (1), the conductive magnetic material particles in the connector material layer 50 are gathered in a portion located on the connection electrode 40 by the magnetic force of the ferromagnetic material portion M and further oriented in the thickness direction.

However, at this time, the connector material layer 5
Since the gap G is present on the surface side of the polymer material 0, the polymer material also moves by the moving and gathering of the conductive magnetic particles. Are raised, and a protruding conductive portion 17 is formed. Therefore, the thickness t ₁ of the formed insulating portion 18 is smaller than the initial thickness t ₀ of the connector material layer 50. Then, while the parallel magnetic field is applied or after the parallel magnetic field is removed, the connector layer 15 including the conductive portion 17 and the insulating portion 18 forming the protrusion is integrally formed on the adapter body 12 by performing a curing process. The adapter device is manufactured.

As shown in FIG. 18, the upper mold 51 is composed of a ferromagnetic portion M having a pattern corresponding to the connection electrode 40 and a non-magnetic material portion N, as shown in FIG. It is also possible to use the pole plate 55 in a state where the ferromagnetic portion M protrudes below the non-magnetic portion N on the lower surface. Furthermore, a pole plate made entirely of a ferromagnetic material,
It is also possible to use a magnetic pole plate in which a portion of the pattern corresponding to the connection electrode 40 protrudes below other portions. Also in these cases, a stronger parallel magnetic field is applied to the connector material layer 50 in the region of the connection electrode 40.

Further, the upper mold 5 is kept under the parallel magnetic field.
A mold having a variable distance between the lower mold 1 and the lower mold 52 is used.
1 is disposed immediately above the connector material layer 50, and the gap between the upper mold 51 and the lower mold 52 is gradually widened while applying a parallel magnetic field, thereby causing the connector material layer 50 to protrude and then hardened. Processing can also be performed.

In the present invention, it is not essential that the conductive portion 17 of the connector layer 15 protrudes from the insulating portion 18, but the conductive portion 17 may have a flat surface. In such a case, the processing may be performed without forming the gap G by using, for example, a mold having the configuration shown in FIG.

The thickness of the connector material layer 50 is, for example, 0.1 to 3 mm. This connector material layer 50
In order to facilitate the movement of the conductive magnetic particles, the material for a polymer substance has a viscosity at 25 ° C. of 10 ⁴ to 10 under the condition of a strain rate of 10 ¹ sec ^-1.
It is preferably about ⁷ centipoise. The curing treatment of the connector material layer 50 is preferably performed while the parallel magnetic field is applied, but may be performed after the operation of the parallel magnetic field is stopped.

The ferromagnetic portions M of the pole plates 53 and 55
Can be formed of a ferromagnetic material such as iron or nickel, and the nonmagnetic portion N can be formed of a nonmagnetic metal such as copper, a heat-resistant resin such as polyimide, or an air layer. The intensity of the parallel magnetic field applied to the connector material layer 50 is
It is preferred that the mold cavity has an average size of 200 to 20,000 gauss.

The curing treatment is appropriately selected depending on the material used, but is usually carried out by heat treatment. The specific heating temperature and heating time are determined by the connector material layer 50.
The material is appropriately selected in consideration of the type of the polymer material, the time required for the movement of the conductive magnetic particles, and the like. For example, when the material for a polymer substance is a room-temperature-curable silicone rubber, the curing treatment is performed at room temperature for about 24 hours, at 40 ° C. for about 2 hours, and at 80 ° C. for about 30 minutes.

Embodiments Embodiments of the present invention will be described below, but the present invention is not limited to these embodiments.

Example 1 (A) First Process First Step Each of the copper metal thin layers (30A, 33A) having a thickness of 35 μm
Is prepared by laminating on both sides of a substrate (20) made of glass fiber reinforced epoxy resin having a thickness of 0.5 mm,
This is cut into a rectangular shape of 330 mm length and 610 mm width,
Each of the inner diameters is set to 0.5 mm using a biaxial drilling device “ND-2J-18” (manufactured by Hitachi Seiko Co., Ltd.) so as to be arranged on a lattice point having a pitch of 2.45 mm.
(FIG. 5 and FIG. 6).
reference).

Thereafter, a short-circuit portion is formed in the through-hole by copper plating, and a thin metal layer on both surfaces of the substrate is subjected to a photo-etching process, thereby forming a terminal electrode (30) on the lower surface and forming a terminal electrode (30) on the lower surface. A first wiring portion (33) electrically connected to the first wiring portion via a short-circuit portion (32) was formed (see FIG. 7).

Second Step A 75 μm-thick ultraviolet curable resin sheet is laminated on the surface of the substrate including the first wiring portion by vacuum lamination to form a curable resin layer (23A). Was exposed with an energy of 245 mJ / cm ² through a pattern film mask using an exposure apparatus for printed circuit boards (manufactured by Hi-Tech Corporation), and spray-developed with a 30% aqueous sodium hydrogen carbonate solution at a temperature of 30 ° C. And the first insulating layer (2
3) was formed.

Thereafter, metal copper is filled in the via holes (23H) formed in the first insulating layer by electrolytic copper plating to form short-circuit portions (34), and the entire upper surface of the first insulating layer is formed. A thin metal layer (35
A), a wiring portion is formed by a photoplating method, and then the thin metal layer is subjected to an etching process, whereby the second wiring portion electrically connected to the first wiring portion via the short-circuit portion. (35) was formed (see FIGS. 8 to 11). Thereafter, the cured resin layer is exposed to light at an energy of 2000 mJ / cm ² using a conveyor-type ultraviolet exposure apparatus (manufactured by Oak Manufacturing Co., Ltd.), and heated at 150 ° C. using a hot air drier.
Heat treatment was performed for 30 minutes.

Third Step The adapter body material obtained in the second step is
On the upper surface of the first insulating layer including the second wiring portion, a two-part ultraviolet curable resin “NPR-60-5P” (manufactured by Nippon Polytech) is screen-printed by “MELODY-MARKII”.
Using MR-60, a process of applying three times at a squeegee speed of 10 mm / sec through a screen printing plate with a polyester clean mesh and drying it in a hot air dryer oven at a temperature of 80 ° C. for 15 minutes is performed twice. repetition,
Thereby, a curable resin layer (25A) having a thickness of 40 μm was formed. Otherwise, the same processing as in the second step is performed to form the second insulating layer (25) of the cured resin layer, and the short-circuit portion (3) electrically connected to the second wiring portion.
6) was formed (see FIGS. 12 to 14).

Further, a patterned copper plating layer is formed on the upper surface of the second insulating layer, and a photoresist film having a thickness of 50 μm is provided. Is removed according to a pattern corresponding to the pattern, and the hole thus formed is filled with metallic copper by a copper plating method, and then the photoresist film is peeled off to form a connection electrode (4) having a protrusion height of 50 μm.
0) was formed, and the electrodes to be inspected of each connection electrode were plated with gold having a thickness of 2 μm to manufacture an adapter body.

The connection electrodes of the adapter body obtained here were an electrode group in which the dimensions of each electrode were 0.15 mm square and the electrode pitch was 0.25 mm, and the dimensions of each electrode were 0.2 mm in width.
An electrode group having a rectangular shape with a length of 0.5 mm and an electrode pitch of 0.6 mm, and a dimension of each electrode of 1 mm square and an electrode pitch of 2 mm
Electrode group.

Second Process A connector material was prepared by mixing room-temperature-curable urethane rubber with conductive magnetic particles of nickel having an average particle size of 26 μm at a ratio of 15% by volume, and this was mixed with the adapter body described above. 18 is basically applied to the surface of FIG.
The method was performed according to the method using the mold shown in FIG. That is, a magnetic pole plate 55 in which the ferromagnetic portion M protrudes 0.1 mm from the non-magnetic portion N on the lower surface is used.
A gap of 0.03 mm is formed between the lower surface of the connector material layer and the connector material layer, and a parallel magnetic field is applied to raise the connector material layer. In this state, the connector material layer is left standing at room temperature for 24 hours to be cured. The thickness t of the conductive part is 0.3 mm, the thickness d of the insulating part is 0.27 mm, and the protrusion ratio of the conductive part (t−d)
A connector layer having a / t of 10% was formed, and an adapter device for circuit board inspection was manufactured.

EXPERIMENTAL EXAMPLE 1 With respect to the above-mentioned adapter device, a common conductive plate was arranged on the lower surface side of the substrate by using a resistance measuring device "Milliohm High Tester" (manufactured by Hioki Electric Co., Ltd.), and all terminal electrodes were short-circuited. The electrical resistance between the conductive plate and each connection electrode was measured using a probe pin. As a result, it was confirmed that the electric resistance value of all the connection electrodes was as very small as 33 mΩ or less, and that the electric connection between the terminal electrode to be connected and the connection electrode was sufficiently achieved. Was.

Experimental Example 2 With respect to the adapter device, the electric resistance between adjacent connecting electrodes to be insulated from each other was measured using a probe pin, using the same resistance measuring device as described above. In addition, the electric resistance value was as very large as 2 MΩ or more, and it was confirmed that a sufficient insulating state was achieved.

[0069]

According to the adapter device for circuit board inspection of the present invention, connection electrodes arranged corresponding to the electrodes to be inspected of the circuit board to be inspected are formed on the surface of the wiring layer portion of the adapter body. On the lower surface of the substrate, terminal electrodes arranged at grid points and connected to an electrical inspection device are formed, and the connection electrodes and the terminal electrodes are electrically connected to the wiring layer portion. In addition, two or more in-layer wiring portions are formed for the connection, and an anisotropic conductive connector layer is integrally provided on the surface of the wiring layer portion of the adapter body. In the connector layer, the conductive particles are arranged in the insulating elastic polymer material so that the conductive particles are aligned in the thickness direction to form the conductive part. Small, fine and dense Even when those complex patterns of, by being compressed in the thickness direction, via the conductive portion extending in the thickness direction in the anisotropically conductive connector layer, electrical inspection and the electrodes to be inspected of the circuit board The required electrical connection with the device can be reliably achieved. Also,
Since the anisotropic conductive connector layer is provided integrally with the adapter body, a good electrical connection state is stably maintained against environmental changes such as heat history due to temperature changes, and therefore high connection reliability Can be obtained.

According to the circuit board inspection method and the circuit board inspection apparatus of the present invention, the required inspection of the circuit board can be performed with high reliability by using the circuit board inspection adapter device having the above-described configuration. it can.

[Brief description of the drawings]

FIG. 1 is an explanatory sectional view showing a configuration of an adapter device for circuit board inspection according to one embodiment of the present invention.

FIG. 2 is a sectional view for explaining an adapter body of the adapter device in FIG. 1;

FIG. 3 is an explanatory plan view showing an arrangement state of each part in the adapter device according to one embodiment of the present invention.

FIG. 4 is an enlarged sectional view for explaining a connector layer portion in the adapter device according to the embodiment of the present invention.

FIG. 5 is a cross-sectional view for explaining a substrate material used in the method for manufacturing a circuit board inspection adapter device according to one embodiment of the present invention.

FIG. 6 is an explanatory cross-sectional view showing a state in which a through hole is formed in a substrate material.

FIG. 7 is an explanatory cross-sectional view showing a state where a short-circuit portion and a first wiring portion according to a substrate material are formed.

FIG. 8 is an explanatory cross-sectional view showing a state where a curable resin layer for a first insulating layer is formed.

FIG. 9 is a cross-sectional view for explaining a state in which a via hole is formed in a first insulating layer.

FIG. 10 is a cross-sectional view for explaining a state where a thin metal layer for a short-circuit portion and a second wiring portion according to a first insulating layer is formed.

FIG. 11 is a cross-sectional view illustrating a state where a second wiring portion is formed.

FIG. 12 is an explanatory cross-sectional view showing a state where a curable resin layer for a second insulating layer is formed.

FIG. 13 is a cross-sectional view for explaining a state in which a via hole is formed in a second insulating layer.

FIG. 14 is an explanatory cross-sectional view illustrating a state where a short-circuit portion according to a second insulating layer is formed.

FIG. 15 is an explanatory cross-sectional view of an adapter body completed by forming connection electrodes.

FIG. 16 is an explanatory cross-sectional view showing a state in which the adapter body on which the connector material layer is formed is set in a mold.

FIG. 17 is an explanatory sectional view showing a state where a parallel magnetic field is applied in FIG. 16;

FIG. 18 is an explanatory cross-sectional view showing another example of a mold used for forming a connector layer.

FIG. 19 is an explanatory diagram showing an arrangement of an example of a printed circuit board.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Adapter apparatus 12 Adapter main body 15 Anisotropic conductive connector layer 17 Conductive part 18 Insulating part 20 Insulating board 21 Wiring layer part 23 1st insulating layer 25 2nd insulating layer 30 Terminal electrode 32 Short circuit part 33 First wiring part 34 Short circuit Part 35 second wiring part 36 short-circuit part 40 connection electrode E elastic polymer substance P conductive particle 30A thin metal layer 33A thin metal layer 20H through hole 23A curable resin layer 23H via hole 35A thin metal layer 25A curable resin layer 25H Via hole 50 Connector material layer 51 Upper die 52 Lower die M Ferromagnetic part N Non-magnetic part 53 Magnetic pole plate G Gap 55 Magnetic pole plate 90 Circuit board 91 Functional element area 92 Lead electrode 93 Lead electrode area

────────────────────────────────────────────────── ─── Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI H05K 3/00 H01R 23/68 303E (72) Inventor Kazuo Inoue 2-11-24 Tsukiji, Chuo-ku, Tokyo Japan Synthetic Rubber Co., Ltd. (56) References JP-A-3-183974 (JP, A) JP-A-2-2944 (JP, A) JP-A-4-151564 (JP, A) JP-A-5-218150 (JP, A) JP-A-4-89579 (JP, A) JP-A-63-243768 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01R 11/01 H01R 12/16

Claims (5)

(57) [Claims] 1. A circuit board inspection adapter device interposed between a circuit board to be inspected and an electrical inspection device for electrically connecting electrodes of the circuit board, wherein the adapter device is made of a material having high dimensional stability and high heat resistance. An adapter body having a substrate that is a conductive material and a wiring layer portion provided on the upper surface of the substrate; and an insulating elastic material formed integrally with or adhered to the surface of the wiring layer portion of the adapter body.
Polymer particles are filled with conductive particles and extend in the thickness direction
That the conductive portion is formed becomes more anisotropically conductive connector layer, the surface of the wiring layer portion of the adapter body, connecting electrodes arranged to correspond to test electrodes of the test object circuit board is formed And terminal electrodes arranged on lattice points on the lower surface of the substrate, and two or more in-layer wiring portions for electrically connecting the connection electrodes and the terminal electrodes to the wiring layer portion. An adapter device for inspecting a circuit board, wherein an adapter device is formed. 2. A method according to claim 1, wherein the conductive portion of the anisotropic conductive connector layer is disposed on a connection electrode formed at a position corresponding to the electrode to be inspected on the circuit board to be inspected on the surface of the wiring layer portion of the adapter body. The adapter device for circuit board inspection according to claim 1, wherein 3. The circuit board inspection according to claim 1, wherein the conductive portion has a protruding portion protruding from the surface of the insulating portion on the outer surface of the anisotropic conductive connector layer. Adapter device. 4. An electrode for inspection of a circuit board to be inspected, using the adapter for circuit board inspection according to claim 1 through a conductive portion of an anisotropic conductive connector layer. A method for inspecting a circuit board, wherein the circuit board is inspected by achieving an electrical connection with an electrical inspection apparatus. 5. An apparatus for inspecting a circuit board, comprising the adapter apparatus for circuit board inspection according to claim 1. Description: