JPH1177190A - Press forming die having protrusion for pressing die and its production - Google Patents

Press forming die having protrusion for pressing die and its production

Info

Publication number
JPH1177190A
JPH1177190A JP23394697A JP23394697A JPH1177190A JP H1177190 A JPH1177190 A JP H1177190A JP 23394697 A JP23394697 A JP 23394697A JP 23394697 A JP23394697 A JP 23394697A JP H1177190 A JPH1177190 A JP H1177190A
Authority
JP
Japan
Prior art keywords
plating layer
forming
press
die
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23394697A
Other languages
Japanese (ja)
Inventor
Nobushi Suzuki
悦四 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaichi Electronics Co Ltd
Original Assignee
Yamaichi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaichi Electronics Co Ltd filed Critical Yamaichi Electronics Co Ltd
Priority to JP23394697A priority Critical patent/JPH1177190A/en
Publication of JPH1177190A publication Critical patent/JPH1177190A/en
Pending legal-status Critical Current

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  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain a forming die to press-form a protruded/bent part to a lead on a circuit board by providing a protrusion for pressing the die formed with plating growth on the surface of a base made of a metal plating layer. SOLUTION: A press forming die 1 formes a sheet like base 2 in a metal plating layer 3 and has many protrusions 4 for pressing the die which are protruded from one side surface of the plating layer 3. The protrusions 4 are formed with a part of the plating layer 3. Accordingly, the plating layer 3 and the protrusions 4 are formed with a same metal (a suitable one is nickel plating, etc.). By this plating method, the protrusions 4 are precisely and easily formed. By using this press forming die 1, a protruded/bent part for connection between the layers of a circuit board is formed in high precision to execute highly reliable connection between the layers. Further, even in the case that a lead forming a circuit is fine at a narrow pitch, the protruded/bent part is easily formed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本願発明は配線回路基板上の
リードに層間接続手段たる突曲部をプレス成形するため
等に用いるプレス成形型と、該プレス成形型の製法に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a press forming die used for press forming a bent portion as an interlayer connecting means on a lead on a printed circuit board, and a method of manufacturing the press forming die.

【0002】[0002]

【従来の技術】近年の電子機器の高機能、高性能化はめ
ざましく、これに伴ない、回路基板上のリード群の狭小
ピッチ化、微細化傾向が益々進行し、同時にコストダウ
ンが求められるようになっている。
2. Description of the Related Art In recent years, the high performance and high performance of electronic equipment have been remarkable, and with this, the pitch of leads on a circuit board has become narrower and finer, and the cost has been required to be reduced at the same time. It has become.

【0003】回路基板としてはリジット多層回路基板や
フレキシブル多層回路基板やこれらの複合であるリジッ
トフレキシブル多層回路基板が多く使われるようになっ
ており、このような多層回路基板は層間接続、即ち、回
路基板上の複層の回路を形成するリード間を多数箇所で
電気的に接続しなければならず、一般的にはスルーホー
ルを介しての層間接続法が採られている。
As a circuit board, a rigid multilayer circuit board, a flexible multilayer circuit board, or a rigid flexible multilayer circuit board which is a composite of these boards has been used in many cases. Such a multilayer circuit board has an interlayer connection, that is, a circuit. Leads forming a multilayer circuit on a substrate must be electrically connected at a number of places, and an interlayer connection method through through holes is generally employed.

【0004】このスルーホールによる層間接続法は、図
1Aに示すように絶縁シート3の両面に銅箔1,2を接
合した両面銅張積層板を形成し、この両面銅張積層板の
リードに相当する部位にドリル等で穿孔加工した後、図
1Bに示すように孔4の内壁面に銅箔1,2に接続せる
銅メッキ5を施す。次に図1Cに示すように、両面の銅
箔1,2を通常行なわれるホトエッチングプロセス法に
よりパターニングしリード1′,2′(電気回路)を形
成する。このプロセス例は両面回路基板の製造法である
が、多層回路基板においても同様で、上記穿孔加工と銅
メッキのプロセスが使われる。
In the interlayer connection method using the through holes, as shown in FIG. 1A, a double-sided copper-clad laminate in which copper foils 1 and 2 are bonded to both sides of an insulating sheet 3 is formed, and leads of the double-sided copper-clad laminate are formed. After drilling a corresponding portion with a drill or the like, copper plating 5 for connection to copper foils 1 and 2 is applied to the inner wall surface of hole 4 as shown in FIG. 1B. Next, as shown in FIG. 1C, the copper foils 1 and 2 on both sides are patterned by a usual photo-etching process to form leads 1 'and 2' (electric circuit). Although this process example is a method for manufacturing a double-sided circuit board, the same applies to a multilayer circuit board, and the above-described perforation process and copper plating process are used.

【0005】[0005]

【発明が解決しようとする課題】このような従来の製造
法では、電気回路を形成するリード群に数千点の孔をバ
リのない状態で穿孔加工しなければならない。更に、場
合によっては孔壁の表面処理(スミア処理)を行なわね
ばならず、層間接続に多大な工数がかかるため、コスト
アップの主要因となっている。更に、基板の表面にスル
ーホールが開口しており、その上に電子部品を実装でき
ないため、高密度実装の大きな障害になる。
In such a conventional manufacturing method, thousands of holes must be formed in a lead group forming an electric circuit without burrs. Further, in some cases, surface treatment (smear treatment) of the hole wall must be performed, and a great deal of man-hour is required for interlayer connection, which is a major factor in cost increase. Furthermore, since a through hole is opened in the surface of the substrate, and electronic components cannot be mounted thereon, it becomes a major obstacle to high-density mounting.

【0006】更に狭小ピッチの層間接続ができないた
め、電気回路を高密度に形成する技術を有効に活用し難
い問題点がある。
Further, since it is not possible to connect the layers at a narrow pitch, there is a problem that it is difficult to effectively utilize the technology for forming an electric circuit at a high density.

【0007】出願人は既に特願平8−91417号によ
り、配線回路基板上のリードに穿孔することなくリード
間の接続を達成できる層間接続構造を提案している。
The applicant has already proposed, in Japanese Patent Application No. Hei 8-91417, an interlayer connection structure that can achieve connection between leads without piercing the leads on the printed circuit board.

【0008】この先行発明は回線基板を形成する絶縁層
を間にして対向するリードの一方又は双方から絶縁層内
へ突入する突曲部を形成してリード間の接続を行なう層
間接続構造であり、スルーホールを介しての層間接続構
造に比べ、構造の簡素化、接続作業の省力化が図れ、大
巾なコストダウンが期待できる。
This prior invention is an interlayer connection structure in which a bent portion which protrudes into the insulating layer from one or both of the leads facing each other with an insulating layer forming a circuit board interposed therebetween to connect the leads. Compared with an interlayer connection structure via a through hole, the structure can be simplified, the connection work can be saved, and a large cost reduction can be expected.

【0009】加えて回路基板を形成する絶縁層上のリー
ドが微細で狭ピッチである場合にも適正に実施できる。
よって前記スルーホールによる層間接続構造の問題点を
一掃することができるものである。
In addition, the present invention can be properly implemented even when the leads on the insulating layer forming the circuit board are fine and have a narrow pitch.
Therefore, the problem of the interlayer connection structure by the through hole can be eliminated.

【0010】[0010]

【課題を解決するための手段】本願発明は回路基板上の
リード群(電気回路)に一時に多数の突曲部を容易に且
つ高精度にプレス成形できる。よって上記先行発明の利
点を有効に享受できる型押し用突起を持ったプレス成形
型と、該プレス成形型の製法を提供するものである。
SUMMARY OF THE INVENTION According to the present invention, a large number of bent portions can be easily and precisely press-formed on a lead group (electric circuit) on a circuit board at a time. Accordingly, it is an object of the present invention to provide a press mold having a stamping projection capable of effectively enjoying the advantages of the above-mentioned prior invention, and a method of manufacturing the press mold.

【0011】このプレス成形型は、金属メッキ層から成
るベースの表面に、該メッキ層の一部又はメッキ層とは
異なる硬質の金属でメッキ成長させた型押し用突起を有
する。
This press-molding die has, on the surface of a base made of a metal plating layer, embossing projections formed by plating a part of the plating layer or a hard metal different from the plating layer.

【0012】上記メッキ層の上記型押し用突起を形成し
た側とは反対側の表面にバックアップ材を貼り合せ強度
を付加する。
A back-up material is attached to the surface of the plating layer opposite to the surface on which the embossing projections are formed to add strength.

【0013】上記プレス成形型は、金属板の表面に多数
の凹所を形成する工程と、該凹所が開口せる上記金属板
の表面にメッキ層を形成すると同時に、該凹所により上
記メッキ層の一部で型押し用突起を成形する工程と、上
記メッキ層を型押し用突起と一緒に金属板から剥離する
工程を含む方法によって製造される。
[0013] The press forming die includes a step of forming a large number of recesses on the surface of the metal plate, a step of forming a plating layer on the surface of the metal plate where the recesses are opened, and the step of forming the plating layer by the recesses. It is manufactured by a method including a step of molding a projection for embossing at a part of the metal layer and a step of peeling the plating layer from the metal plate together with the projection for embossing.

【0014】[0014]

【発明の実施の形態】図2、図3は上記型押し用突起4
を多数付設したプレス成形型1を示している。このプレ
ス成形型は図2に示すように、金属メッキ層3にてシー
ト状のベース2を形成しており、このメッキ層3の一方
の表面から突出した多数の型押し用突起4を有してい
る。
2 and 3 show the embossing projection 4 described above.
Shows a press mold 1 provided with a large number of. As shown in FIG. 2, the press mold has a sheet-like base 2 formed of a metal plating layer 3 and has a large number of embossing projections 4 protruding from one surface of the plating layer 3. ing.

【0015】この型押し用突起4は金属メッキにより形
成する。一例として図2に示すように、ベース2を形成
するメッキ層3の表面に該メッキ層3の一部で上記型押
し用突起4を形成する。従ってこのメッキ層3と型押し
用突起4とは同一の金属、適材としてはニッケルメッキ
(ニッケル合金メッキ)で形成される。
The embossing projections 4 are formed by metal plating. As an example, as shown in FIG. 2, the embossing protrusions 4 are formed on a part of the plating layer 3 on the surface of the plating layer 3 forming the base 2. Therefore, the plating layer 3 and the embossing projection 4 are formed of the same metal, and nickel plating (nickel alloy plating) as a suitable material.

【0016】他例として図3に示すように、ベース2を
形成するメッキ層3の表面にメッキ層とは異なる硬質金
属で形成した型押し用突起4′を設ける。この型押し用
突起4′は例えばニッケル又はニッケル合金から成り、
メッキ層3は銅又は銅合金から成る。
As another example, as shown in FIG. 3, an embossing projection 4 'formed of a hard metal different from the plating layer is provided on the surface of the plating layer 3 forming the base 2. This embossing projection 4 'is made of, for example, nickel or a nickel alloy,
The plating layer 3 is made of copper or a copper alloy.

【0017】上記メッキ層3は複合メッキ層とすること
ができる。即ち、第1メッキ層の表面に第2メッキ層を
施し、複合メッキ層にすることができる。
The plating layer 3 can be a composite plating layer. That is, a second plating layer can be formed on the surface of the first plating layer to form a composite plating layer.

【0018】図4に示すように、上記図2、図3に示す
メッキ層3の上記型押し用突起を形成した側とは反対側
の表面にバックアップ材5を貼り合せることができる。
As shown in FIG. 4, a backup material 5 can be attached to the surface of the plating layer 3 shown in FIGS. 2 and 3 opposite to the surface on which the embossing projections are formed.

【0019】上記バックアップ材5はメッキ層3と型押
し用突起4,4′に強度を付与し、平面度を保有させる
機能を有する。このバックアップ材5の適材としてステ
ンレスを用いる。
The backup material 5 has a function of imparting strength to the plating layer 3 and the embossing projections 4 and 4 ′ to maintain flatness. Stainless steel is used as a suitable material for the backup material 5.

【0020】次に、上記型押し用突起4を有するプレス
成形型1の製法を、図5に基いて説明する。図5Aに示
すように、金属板6の表面にポンチ7を用いて凹所8を
形成する。金属板6はステンレス板が適材である。又ポ
ンチ7は先端に尖鋭端9を有する。このポンチ7の尖鋭
端9を金属板6の表面に垂直に打ち込み、尖鋭端9と同
形状の凹所8を形成する。
Next, a method for manufacturing the press-molding die 1 having the embossing projections 4 will be described with reference to FIG. As shown in FIG. 5A, a recess 8 is formed on the surface of the metal plate 6 using a punch 7. A suitable material for the metal plate 6 is a stainless steel plate. The punch 7 has a sharp end 9 at the tip. The sharp end 9 of the punch 7 is vertically driven into the surface of the metal plate 6 to form a recess 8 having the same shape as the sharp end 9.

【0021】次に図5Bに示すように、上記凹所8が開
口する上記金属板6の表面にメッキ層3を形成し、同時
にこのメッキ層3の一部を上記凹所8内に浸着させ型押
し用突起4を成形する。即ち、メッキ層3の一部を凹所
8内で成長させ、上記型押し用突起4を成形する。
Next, as shown in FIG. 5B, a plating layer 3 is formed on the surface of the metal plate 6 where the recess 8 opens, and at the same time, a part of the plating layer 3 is immersed in the recess 8. The embossing projections 4 are formed. That is, a part of the plating layer 3 is grown in the recess 8 to form the embossing projection 4.

【0022】次に図5Cに示すように、上記メッキ層3
を型押し用突起4と一緒に、金属板6の表面から剥離す
る。斯くして形成されたプレス成形型1は、図2に示し
たメッキ層3とメッキ成長された型押し用突起4とが同
一金属から成るプレス成形型である。
Next, as shown in FIG.
Together with the embossing projections 4 from the surface of the metal plate 6. The press forming die 1 thus formed is a press forming die in which the plating layer 3 and the stamped projections 4 formed by plating are made of the same metal as shown in FIG.

【0023】上記金属板6の表面に上記凹所を形成する
ポンチ7の尖鋭端9は円錐又は截頭円錐型を呈し、同形
状の凹所8を形成する。例えば尖鋭端9を截頭円錐型と
し、図7Aに示すようにこの尖鋭端9の先端面に微細な
凹凸10を形成する。
The sharp end 9 of the punch 7 forming the recess on the surface of the metal plate 6 has a conical or frusto-conical shape, and forms a recess 8 having the same shape. For example, the sharp end 9 has a truncated conical shape, and fine irregularities 10 are formed on the distal end surface of the sharp end 9 as shown in FIG. 7A.

【0024】この図7Aに示すポンチ7によって形成さ
れた凹所8は、その内底面に複数の微細な凹凸が成形さ
れ、この凹所8によってメッキ成形された型押し用突起
4はその先端面に複数の凹凸11を有し、この凹凸11
によってリード間を健全に接続することができる。
The recess 8 formed by the punch 7 shown in FIG. 7A has a plurality of fine irregularities formed on the inner bottom surface thereof. Has a plurality of irregularities 11, and the irregularities 11
Thus, the leads can be soundly connected.

【0025】又図7Bに示すように、上記ポンチ7の尖
鋭端9は尖った陵線12を有する三角柱形にすることが
できる。このポンチ7の使用により、型押し用突起4は
尖った陵線を持つ三角柱形に成形され、この尖った陵線
12を以ってリード間接続を果たすことができる。
As shown in FIG. 7B, the sharp end 9 of the punch 7 can be formed into a triangular prism having a sharp ridge 12. With the use of the punch 7, the embossing projection 4 is formed into a triangular prism shape having a sharp ridge, and the connection between the leads can be achieved by the sharp ridge 12.

【0026】図6は上記型押し用突起4を多数有するプ
レス成形型1を用いて、回路基板14に層間接続構造を
形成する方法を示している。
FIG. 6 shows a method of forming an interlayer connection structure on a circuit board 14 using the press mold 1 having a large number of the embossing projections 4.

【0027】回路基板14は絶縁層15の一方の表面と
他方の表面に微細で狭ピッチのリード20,21が密着
され、電気回路を形成している。
The circuit board 14 has fine and fine-pitch leads 20 and 21 adhered to one surface and the other surface of the insulating layer 15 to form an electric circuit.

【0028】図6Aに示すように、メッキ層3の表面に
型押し用突起4をメッキ成長させた前記プレス成形型1
を用い、絶縁層15の一方の表面に密着させた導電箔1
8を突起4により型押しして、該突起4を絶縁層15内
に突入させつつ導電箔18に同絶縁層内に突入せる突曲
部17を形成し、この突曲部17を他方の導電箔19に
接続する。よって層間接続構造を形成する。導電箔1
8,19の適材は銅箔である。
As shown in FIG. 6A, the press-forming die 1 in which the embossing projections 4 are formed by plating on the surface of the plating layer 3.
Using a conductive foil 1 adhered to one surface of the insulating layer 15
8 is embossed by the projection 4 to form a projecting portion 17 on the conductive foil 18 while projecting the projecting 4 into the insulating layer 15 and projecting into the insulating layer. Connect to foil 19. Therefore, an interlayer connection structure is formed. Conductive foil 1
The suitable material for 8, 19 is copper foil.

【0029】この場合、回路基板14を形成する絶縁層
15は熱可塑性樹脂シートを用い、プレス成形型1はヒ
ーターによって加熱しつつ、上記突起4による型押しを
行なう。これにより絶縁層15を突起5により軟化しつ
つ、導電箔18の局部を絶縁層15内へ突入させること
ができる。
In this case, the insulating layer 15 forming the circuit board 14 uses a thermoplastic resin sheet, and the press mold 1 is pressed by the projections 4 while being heated by a heater. This allows the local portion of the conductive foil 18 to protrude into the insulating layer 15 while the insulating layer 15 is softened by the protrusions 5.

【0030】次に図5Bに示すように、上記導電箔1
8,19をエッチングによりパターンニングし、電気回
路用のリード20,21を形成する。図6A,Bに示す
ように、上記突曲部17を介してリード20,21間を
電気的に接続する例として、導電箔19の絶縁層15に
対する接着面に導電ペースト22を予じめ設けて置き、
上記突曲部17の頂部が上記導電ペースト22を介して
導電箔19と接続する方法を採ることができる。この導
電ペースト22は突曲部17により加熱されて堅牢な接
続を果たす。
Next, as shown in FIG.
8 and 19 are patterned by etching to form leads 20 and 21 for electric circuits. As shown in FIGS. 6A and 6B, as an example of electrically connecting the leads 20 and 21 via the bent portions 17, a conductive paste 22 is previously provided on a bonding surface of the conductive foil 19 to the insulating layer 15. Place
A method in which the top of the bent portion 17 is connected to the conductive foil 19 via the conductive paste 22 can be adopted. The conductive paste 22 is heated by the bent portion 17 to achieve a robust connection.

【0031】図6Bに示す電気回路を形成した後に、該
電気回路を形成するリード20,21に上記突曲部17
を形成してリード20,21間を接続し、よって層間接
続構造を形成することができる。
After forming the electric circuit shown in FIG. 6B, the bent portions 17 are attached to the leads 20 and 21 forming the electric circuit.
Is formed to connect the leads 20 and 21, thereby forming an interlayer connection structure.

【0032】リード20,21は非常に微細で狭ピッチ
であり、これに応じ上記型押し用突起4は、高さ10〜
50μm、底辺20〜100μm、突起間ピッチが30
〜200μm程度の微細で狭ピッチであることが要求さ
れる。
The leads 20 and 21 are very fine and have a narrow pitch.
50 μm, base 20-100 μm, pitch between projections 30
It is required to have a fine pitch of about 200 μm and a narrow pitch.

【0033】前記特願平8−91417号は、その図2
に型押し用突起を持ったプレス成形型を示しているが、
微細で狭ピッチの型押し用突起を有効に形成する手段に
関しては未解決である。
The above-mentioned Japanese Patent Application No. Hei 8-91417 shows the configuration shown in FIG.
Shows a press mold with a stamping protrusion.
A means for effectively forming fine and narrow pitch embossing projections has not been solved.

【0034】本願発明はメッキ法によりプレス成形型1
のベース2と型押し用突起4を形成することにより、同
突起4を高精度且つ容易に形成することを可能にした。
ひいては層間接続用の突曲部17を高精度に形成して高
信頼の層間接続を果たすことができる。
The present invention relates to a press forming die 1 by a plating method.
By forming the base 2 and the embossing projections 4, the projections 4 can be formed easily with high precision.
As a result, the protruding portion 17 for interlayer connection can be formed with high precision to achieve highly reliable interlayer connection.

【0035】加えて上記突曲部17を電気回路を形成す
るリードが狭ピッチで微細である場合にも容易且つ適正
に形成することができ、電気回路の高密度化に有効に対
処でき、加えて層間接続構造の簡素化を達成し、コスト
ダウンを図ることができる。
In addition, the bent portion 17 can be easily and properly formed even when the leads forming the electric circuit are narrow and fine, and can effectively cope with the high density of the electric circuit. Thus, the simplification of the interlayer connection structure can be achieved, and the cost can be reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】A、B、Cは従来の回路基板における層間接続
構造の形成法を工程順に示す拡大断面図である。
FIGS. 1A, 1B and 1C are enlarged cross-sectional views showing a method of forming an interlayer connection structure on a conventional circuit board in the order of steps.

【図2】本発明に係る型押し用突起を持ったプレス成形
型の拡大断面図である。
FIG. 2 is an enlarged cross-sectional view of a press mold having a stamping protrusion according to the present invention.

【図3】上記プレス成形型の他例を示す拡大断面図であ
る。
FIG. 3 is an enlarged sectional view showing another example of the press mold.

【図4】上記プレス成形型の更に他例を示す拡大断面図
である。
FIG. 4 is an enlarged sectional view showing still another example of the press mold.

【図5】A、B、Cは上記プレス成形型の製法を工程順
に示す拡大断面図である。
FIGS. 5A, 5B, and 5C are enlarged cross-sectional views showing a method of manufacturing the press mold in the order of steps.

【図6】A、Bは上記プレス成形型を用いて回路基板の
層間接続法を、工程順に示す拡大断面図である。
FIGS. 6A and 6B are enlarged cross-sectional views showing a method of connecting layers between circuit boards using the press mold in the order of steps.

【図7】Aは上記図5のプレス成形型の製造に用いるポ
ンチの形状例を示す側面図とこれを用いて形成される型
押し用突起を示す拡大断面図、Bはポンチの他の形状例
を示す拡大斜視図とこれを用いて形成される型押し用突
起を示す拡大断面図である。
7A is a side view showing an example of a shape of a punch used for manufacturing the press mold shown in FIG. 5 and an enlarged sectional view showing a stamping protrusion formed using the punch. FIG. 7B is another shape of the punch. FIG. 2 is an enlarged perspective view showing an example and an enlarged sectional view showing an embossing projection formed using the example.

【符号の説明】[Explanation of symbols]

1 プレス成形型 2 ベース 3 メッキ層 4,4′ 型押し用突起 5 バックアップ材 6 金属板 7 ポンチ 8 凹所 9 尖鋭端 10,11 凹凸 13 陵線 14 回路基板 15 絶縁層 17 突曲部 18,19 導電箔 20,21 電気回路用のリード 22 導電ペースト DESCRIPTION OF SYMBOLS 1 Press molding die 2 Base 3 Plating layer 4, 4 'Embossing projection 5 Backup material 6 Metal plate 7 Punch 8 Concave 9 Sharp end 10, 11 Irregularity 13 Ridge 14 Circuit board 15 Insulating layer 17 Projection 18, 19 Conductive foil 20, 21 Electrical circuit leads 22 Conductive paste

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】メッキ層から成るベースの表面にメッキ成
長により形成された型押し用突起を有することを特徴と
するプレス成形型。
1. A press-molding die having a stamping projection formed on a surface of a base made of a plating layer by plating growth.
【請求項2】上記型押し用突起が上記ベースを形成する
メッキ層の一部で形成されていることを特徴とする請求
項1記載のプレス成形型。
2. The press-molding die according to claim 1, wherein said embossing projection is formed by a part of a plating layer forming said base.
【請求項3】上記メッキ層の上記型押し用突起を形成し
た側とは反対側の表面にバックアップ材を貼り合せたこ
とを特徴とする請求項1又は2記載のプレス成形型。
3. The press-molding die according to claim 1, wherein a backup material is bonded to a surface of the plating layer opposite to a surface on which the embossing projections are formed.
【請求項4】金属板の表面に多数の凹所を形成する工程
と、該凹所が開口せる上記金属板の表面にメッキ層を形
成すると同時に該凹所により上記メッキ層の一部で型押
し用突起を成形する工程と、上記メッキ層を型押し用突
起と一緒に金属板から剥離する工程を含む型押し用突起
を有するプレス成形型の製法。
4. A step of forming a plurality of recesses on a surface of a metal plate, forming a plating layer on a surface of the metal plate where the recesses are opened, and simultaneously forming a mold with a part of the plating layer by the recesses. A method for producing a press-molding die having a stamping projection, comprising a step of forming a stamping projection and a step of peeling the plating layer from the metal plate together with the stamping projection.
JP23394697A 1997-08-29 1997-08-29 Press forming die having protrusion for pressing die and its production Pending JPH1177190A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23394697A JPH1177190A (en) 1997-08-29 1997-08-29 Press forming die having protrusion for pressing die and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23394697A JPH1177190A (en) 1997-08-29 1997-08-29 Press forming die having protrusion for pressing die and its production

Publications (1)

Publication Number Publication Date
JPH1177190A true JPH1177190A (en) 1999-03-23

Family

ID=16963105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23394697A Pending JPH1177190A (en) 1997-08-29 1997-08-29 Press forming die having protrusion for pressing die and its production

Country Status (1)

Country Link
JP (1) JPH1177190A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113477803A (en) * 2021-07-01 2021-10-08 深圳市腾鑫精密电子芯材科技有限公司 Marking line processing die and technology of steel reinforcing sheet for 5G chip circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113477803A (en) * 2021-07-01 2021-10-08 深圳市腾鑫精密电子芯材科技有限公司 Marking line processing die and technology of steel reinforcing sheet for 5G chip circuit board

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