JP2002076571A - Manufacturing method for circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for a circuit conductor where a prescribed conductor pattern is provided with no dislocation of the circuit conductor while arrangement density of the circuit conductor is improved. SOLUTION: There are provided an etching process where a mask in which a prescribed circuit pattern is formed is placed on one surface of a copper plate 1 to form a circuit pattern on one surface of the copper plate (figure 1 (b)), a process where, after the etching process, a base body 2 is formed on a circuit pattern formation surface side 1b of the copper plate 1 and the copper plate 1 is fixed to a base body 2 for integration (figure 1 (c)), and a process where a circuit pattern non-formed surface side 1c of the copper plate 1 fixed to the base body 1 is etched and a circuit conductor 1e constituting the circuit pattern is separated for forming a prescribed circuit pattern (figure 1 (d)).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a circuit board suitable for manufacturing a circuit board such as a large current circuit board using a relatively thick metal plate for a circuit conductor.

[0002]

2. Description of the Related Art When a relatively thick conductor such as a large current circuit board or a power supply circuit is required, for example, Japanese Unexamined Patent Publication No.
As proposed in 181417, there is a circuit board in which a circuit conductor punched from a copper plate by punching and an insulating substrate are laminated and integrated. This Japanese Patent Laid-Open No. 8-1814
17 will be described with reference to FIGS. As shown in FIG. 5, a circuit conductor 101 forming a predetermined circuit pattern is formed by punching a copper plate 100. In order to keep the positional relationship of the circuit conductors 101 constant, each circuit conductor 101 is
02 or adjacent circuit conductor 101 and thin bridge 10
3 fixed.

Further, in order to integrate the circuit conductor 101 shown in FIG. 5 with an insulating substrate to form a circuit substrate, the circuit conductor 101 is embedded in a thermosetting molding resin and integrated.
That is, as shown in FIG. 6, the copper plate 100 is set on the inner surface of the movable mold 110, the mold is closed, and the molding resin is fixed to the fixed mold 11.
1 is filled through the resin injection hole 111a. As a result, the molding resin passes over the circuit conductor 101 through the groove 111b of the fixed mold 111 and the cavity 112 (the fixed mold 1).
The gap formed between the movable mold 11 and the movable mold 110) is entirely filled. That is, the space 112a other than the circuit conductor 101 is also filled.

After that, as shown in FIG. 7, a through hole 104 is drilled at the position of the bridge 103 on the circuit board 120 by integrating the circuit conductor 101 and the insulating substrate, and the bridge 103 is cut. The conductor 101 is made electrically independent. After the bridge 103 is cut and subjected to surface treatment such as degreasing or roughening, a double-sided circuit board is manufactured using a molding die shown in FIG. That is, the fixed mold 114 of the molding die and the inner surfaces 114a, 1
The two circuit boards 120 are held by pins 113b and 114b between 13a so that the circuit conductors 101 face each other. Then, the resin injection hole 114c provided in the fixed mold 113 is formed.
More molding resin is injected and filled between the fixed mold 114 and the movable mold 113. After the molding resin cools or cures, the circuit board 120 is taken out, and unnecessary portions of the edge frame conductor 102 are cut off to obtain a double-sided circuit board in which the circuit conductors 101 are embedded on both sides of the resin molding.

[0005]

As described above, in the conventional method of manufacturing a circuit board, a method of embedding and integrating a circuit conductor to be a circuit using a resin molding means is used. Therefore, although the circuit conductor is fixed by the bridge, the bridge is deformed by the injection pressure at the time of injecting the resin into the molding die, the circuit conductor is displaced, and a predetermined conductor pattern cannot be obtained. There were challenges.

In the conventional method of manufacturing a circuit board, a circuit conductor and an insulating substrate are integrated, and then a bridge is cut to make each circuit conductor electrically independent. Therefore, the remaining portion 103a of the bridge 103 remains in the circuit conductor 101 as shown in FIG. The distance between the remaining portions 103a must be at least a distance that does not cause a short circuit. The distance between the remaining portions 103a is the circuit conductor 1
03, which is shorter than the distance between
Thus, there is a technical problem that the arrangement density of the circuit conductors 103 is reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned technical problems, and can provide a predetermined conductor pattern without causing a positional displacement of a circuit conductor, and can improve the arrangement density of circuit conductors. It is an object of the present invention to provide a method of manufacturing a circuit conductor which can be performed.

[0008]

SUMMARY OF THE INVENTION The present invention has been made to achieve the above-mentioned object, and a method of manufacturing a circuit board according to the present invention is directed to a mask having a predetermined circuit pattern formed on one surface of a copper plate. Is placed, a step of performing an etching to form a circuit pattern on one surface of the copper plate, and after the etching step, a substrate is formed on the circuit pattern forming surface side of the copper plate,
A step of fixing and integrating the copper plate to a base, and a step of etching a circuit pattern non-formed surface side of the copper plate fixed to the base to separate circuit conductors constituting the circuit pattern and form a predetermined circuit pattern And is characterized by including.

As described above, etching for forming a circuit pattern on one surface of the copper plate is performed, and after the etching step,
A substrate is formed on the circuit pattern forming surface side of the copper plate, the copper plate is fixed to and integrated with the substrate, and the circuit conductors forming the circuit pattern are separated by etching. Therefore, when the base is formed, the circuit conductors are not separated and constitute a copper plate, so that the positional displacement of the circuit conductors can be prevented. Further, since a bridge is not provided unlike the related art, the arrangement density of circuit conductors can be improved.

Here, in the step of forming a base on the circuit pattern forming surface side of the copper plate and fixing and integrating the copper plate on the base, a prepreg is arranged so as to face the circuit pattern forming surface and heated by hot pressing. It is desirable to form a base by pressurizing the prepreg and to fix and integrate the copper plate with the base. As described above, by using the prepreg, the copper plate can be easily fixed to and integrated with the base.

In the step of forming a base on the circuit pattern forming surface side of the copper plate and fixing and integrating the copper plate with the base, the copper plate is accommodated in a mold, and the base is formed of a molding resin. Alternatively, the copper plate may be fixed to and integrated with the base.

Further, the present invention has been made to achieve the above object, and a method of manufacturing a circuit board according to the present invention comprises mounting a mask having a predetermined circuit pattern on one surface of a copper plate. A step of performing an etching to form a circuit pattern on one surface of a copper plate, and arranging a prepreg facing the circuit pattern forming surface, and arranging a copper foil on a prepreg surface opposite to the surface facing the circuit pattern forming surface. Heating and pressurizing with a hot press, forming a substrate with the prepreg, fixing the copper plate and copper foil to the substrate, and integrating the same, and the circuit pattern non-formation surface side of the copper plate fixed to the substrate. Etching, separating circuit conductors constituting the circuit pattern, forming a predetermined circuit pattern, and etching the copper foil, forming a predetermined circuit pattern It is characterized in that it comprises a. Thereby, it is possible to obtain a circuit board provided with at least a circuit pattern formed of a copper plate and a circuit pattern formed of a copper foil.

Further, the present invention has been made to achieve the above object, and a method of manufacturing a circuit board according to the present invention comprises mounting a mask having a predetermined circuit pattern on one surface of a copper plate. A step of performing an etching to form a circuit pattern on one surface of a copper plate, and arranging a prepreg facing the circuit pattern forming surface, and arranging a copper foil on a prepreg surface opposite to the surface facing the circuit pattern forming surface. Heating and pressurizing with a hot press, forming a substrate with the prepreg, fixing the copper plate and copper foil to the substrate, and integrating the same, and the circuit pattern non-formation surface side of the copper plate fixed to the substrate. Etching, separating circuit conductors constituting a circuit pattern, forming a predetermined circuit pattern, arranging a prepreg on the circuit conductor, further arranging copper foil, Press and heat to fix and integrate the circuit conductor and the copper foil on the substrate, punch a hole in the substrate and form a copper layer on the surface, and etch a part of the copper layer And forming a predetermined circuit pattern with a copper layer. Thereby, it is possible to obtain a circuit board including at least a circuit pattern formed of a copper plate and a circuit pattern formed of a copper foil and having a through hole for electrically connecting both circuit patterns.

Further, the present invention has been made to achieve the above object, and a method of manufacturing a circuit board according to the present invention comprises mounting a mask having a predetermined circuit pattern on one surface of two copper plates. And a step of performing an etching to form a circuit pattern on one surface of each copper plate, and after the etching, by arranging the prepreg between the circuit pattern forming surfaces of the two copper plates, and heating and pressing by a hot press. The base is composed of prepreg,
Fixing and integrating the two copper plates on the base, etching the non-circuit-pattern-formed side of the copper plate fixed to the base, separating circuit conductors constituting the circuit pattern, and forming a predetermined circuit pattern And a step. Thus, a circuit board having at least two circuit patterns made of a copper plate can be obtained.

The present invention has been made to achieve the above object, and a method of manufacturing a circuit board according to the present invention comprises mounting a mask having a predetermined circuit pattern on one surface of two copper plates. And a step of performing an etching to form a circuit pattern on one surface of each copper plate, and after the etching, by arranging the prepreg between the circuit pattern forming surfaces of the two copper plates, and heating and pressing by a hot press. The base is composed of prepreg,
A step of fixing and integrating two copper plates to the base, a plating step of perforating the base and forming a copper layer on the surface, and etching a part of the copper layer and the copper plate to form a circuit pattern Separating the conductor and forming a predetermined circuit pattern. This makes it possible to obtain a circuit board including two circuit patterns made of a copper plate and a through hole that electrically connects the two circuit patterns.

Further, the present invention has been made to achieve the above object, and a method of manufacturing a circuit board according to the present invention comprises mounting a mask having a predetermined circuit pattern formed on one surface of two copper plates. Placing, performing a step of etching to form a circuit pattern on one surface of each copper plate, and after the etching, placing a prepreg facing the circuit pattern forming surface of the two copper plates, heating and pressing by hot press, A step of forming a base with a prepreg, fixing and integrating the two copper plates with the base, and etching a circuit pattern non-formation surface side of the two copper plates fixed to the base to form a circuit conductor forming a circuit pattern Forming a predetermined circuit pattern, and further arranging a prepreg on the predetermined circuit pattern formed on the upper and lower surfaces of the base, Arrangement and fixing said copper foil by heating and pressing by the hot pressing to the substrate, a step of integrating,
It is characterized by including a plating step of forming a copper layer on the surface while piercing the base, and a step of forming a predetermined circuit pattern by the copper layer by etching a part of the copper layer.

Thus, a circuit board having two circuit patterns formed of a copper plate, two circuit patterns formed of a copper foil, and a through hole for electrically connecting the circuit patterns is obtained. Can be.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of a circuit board according to the present invention will be described with reference to FIG. As shown in FIG. 1A, first, a reference hole 1a is formed at a predetermined position of a copper plate 1 using a drilling means such as a drill. As the copper plate 1, 1
Those having a size of 50 μm to 500 μm are used. 150 μm
In the following copper plate 1, it is not preferable as a current circuit conductor or a power supply circuit conductor. In a copper plate 1 having a thickness exceeding 500 μm,
This is because it takes a long time for etching described later, which is not preferable. In the following description, the copper plate 1
Is referred to as an A surface, and the other surface is referred to as a B surface.

Next, as shown in FIG. 1B, the B side 1b of the copper plate 1 is etched. At this time, the reference hole 1a of the copper plate 1 is inserted into a predetermined pin, and using this as a reference, a mask on which a predetermined circuit pattern is formed is placed on the B surface 1b, and etching is performed. The etching amount at this time is preferably about half the thickness of the copper plate 1. In the figure, a portion denoted by reference numeral 1d indicates an etched portion. This allows
A predetermined circuit pattern (circuit conductor 1e) is formed on the B surface 1b of the copper plate 1 (the circuit conductor 1e is connected to the A surface 1c of the copper plate 1).

After the etching, the base 2 is formed on the copper plate 1 by hot pressing. That is, as shown in FIG. 1C, the B side 1b of the etched copper plate 1 is disposed so as to face an adhesive layer such as a prepreg. Next, the whole is united by heating and pressing by a hot press (not shown). Thus, the copper plate 1 on which the predetermined circuit pattern (circuit conductor) is formed is fixed and integrated with the base 2 made of an adhesive layer such as a prepreg. Then, FIG.
As shown in (d), the A side 1c of the copper plate 1 is etched, the circuit conductor 1e is separated, and a predetermined circuit pattern is formed.

As described above, etching for forming a circuit pattern on one surface of the copper plate is performed, and after the etching step,
A substrate is formed on the circuit pattern forming surface side of the copper plate, the copper plate is fixed to and integrated with the substrate, and the circuit conductors forming the circuit pattern are separated by etching. Therefore, when the base is formed, the circuit conductors are not separated and constitute a copper plate, so that the positional displacement of the circuit conductors can be prevented. Further, since a bridge is not provided unlike the related art, the arrangement density of circuit conductors can be improved. Furthermore, since a part of the circuit conductor is embedded in the base, the circuit conductor can be firmly fixed to the base as compared with a case where the circuit conductor is simply bonded to the surface of the base.

A second embodiment of the circuit board according to the present invention will be described with reference to FIG. As shown in FIG.
First, a reference hole 1a is formed at a predetermined position of the copper plate 1 using a drilling means such as a drill. As the copper plate 1, one having a thickness of 150 μm to 500 μm is used as in the first embodiment. Then, as shown in FIG. 2B, the B surface 1b of the copper plate 1 is etched. At this time, the reference hole 1a of the copper plate 1 is inserted into a predetermined pin, and a mask (not shown) on which a predetermined circuit pattern is
It is placed on the surface 1b and is etched. The etching amount at this time is preferably about half the thickness of the copper plate 1. Thereby, a predetermined circuit pattern is formed on the B surface 1b of the copper plate 1 (the circuit conductor 1e is connected on the A surface 1c of the copper plate 1).

Thereafter, the base 2 is formed on the copper plate 1 by hot pressing, and the copper foil 3 is formed on the surface of the base 2 opposite to the surface on the copper plate side. That is, as shown in FIG. 2C, the B side 1b of the etched copper plate 1 is arranged so as to face an adhesive layer such as a prepreg. Further, the copper foil 3 is disposed on the surface of the adhesive layer such as the prepreg opposite to the surface on the copper plate side.
Next, the whole is integrated by heating and pressing by a hot press (not shown). Thus, the copper plate 1 on which the predetermined circuit pattern is formed is fixed and integrated with the base 2 made of an adhesive layer such as a prepreg. The copper foil 3 is fixed and integrated on the opposite surface of the base 2. Thereafter, as shown in FIG. 2D, the A side 1c of the copper plate 1 is etched to separate the circuit conductor 1e, and a predetermined circuit pattern is formed.

Further, an adhesive layer such as a prepreg is disposed on the side A 1c of the copper plate 1, and a copper foil 4 is disposed on the adhesive layer. Then, it is heated and pressed by a hot press (not shown) to integrate the whole. Thereby, a circuit conductor 1e forming a predetermined circuit pattern is formed inside, and
A circuit board provided with copper foils 3 and 4 on the upper and lower surfaces of the base 2 is formed.

Next, a predetermined circuit pattern is formed on the copper foils 3 and 4 formed on the upper and lower surfaces of the circuit board. For the formation of this circuit pattern, a conventionally known method can be adopted. First, as shown in FIG. 2F, a hole is formed in a predetermined position of the base 2 using a means such as a drill to form a through hole 2a. Then, as shown in FIG.
Copper plating is applied to both surfaces of the base 2 and the inner surface of the through hole 2a (a copper plating layer 5 is formed). Further, as shown in FIG. 2 (h), a mask on which a predetermined circuit pattern is formed is placed on both sides of the base, and etching is performed to form a predetermined circuit pattern on both sides of the base 2.

Thus, a circuit board having through holes 6 for electrically connecting both surfaces of the base 2 is formed. The circuit pattern formed inside and the circuit pattern formed on the surface of the base 2 may be electrically connected by the through hole 6. The circuit conductor provided inside the circuit board has a large thickness and is suitable for a power supply circuit, a large current circuit, and the like.The circuit conductor provided on the upper and lower surfaces of the circuit board has a small thickness. It is suitable for signal circuits and the like.

A third embodiment of the circuit board according to the present invention will be described with reference to FIG. As shown in FIG.
First, a copper plate 10 and a copper plate 11 are prepared.
0. Reference holes 10a and 11a are formed at predetermined positions of the copper plate 11 using a drilling means such as a drill. Each of the copper plates 10 and 11 has a thickness of 150 μm, as in the first embodiment.
〜500 μm is used.

Next, as shown in FIG. 3B, the B side 10b of the copper plate 10 is etched. At this time, the copper plate 10
The reference hole 10a is inserted into a predetermined pin, and a mask (not shown) on which a predetermined circuit pattern is formed is placed on the B surface 10b with reference to the reference hole 10a, and etching is performed. The etching amount at this time is preferably about half the thickness of the copper plate 10. Similarly, the A surface 11c of the copper plate 11 is etched. At this time, the reference hole 11a of the copper plate 11 is inserted into a predetermined pin, and a mask (not shown) on which a predetermined circuit pattern is formed is placed on the A surface 11c based on the reference hole 11a.
Perform etching. The etching amount at this time is the copper plate 11.
Is preferably about half of the plate thickness. Thereby, a predetermined circuit pattern is formed on the B surface 10b of the copper plate 10 and the A surface 11c of the copper plate 11 (circuit conductors are connected on the A surface 10c side of the copper plate 10 and on the B surface 11b side of the copper plate 11). Circuit conductors are connected).

The copper plates 10 and 11 thus configured are opposed to each other with the adhesive layer 2 such as a prepreg interposed therebetween. That is, the B surface 10b of the copper plate 10 and the A surface 11c of the copper plate 11 face each other. Thereafter, as shown in FIG. 3C, the whole is integrated by heating and pressing by a hot press (not shown).

Thereafter, as shown in FIG.
Then, a predetermined position of No. 2 is pierced to form a through hole 12a. Thereafter, as shown in FIG. 3E, copper plating is applied to both surfaces of the base 12 and the through holes 12a (a copper layer 15 is formed).
Further, as shown in FIG. 2 (f), a mask on which a predetermined circuit pattern is formed is placed on both surfaces of the substrate 12, and etching is performed to form a predetermined circuit pattern on both surfaces of the substrate 2. . As a result, a circuit board having through holes 16 for electrically connecting circuit patterns formed on both surfaces of the base is formed. Further, since a part of the circuit conductor is embedded in the base, the circuit conductor can be firmly fixed to the base as compared with a case where the circuit conductor is simply bonded to the surface of the base. The circuit conductors provided on the upper and lower surfaces of the circuit board are suitable for power supply circuits, large current circuits, and the like because of their large thickness.

A fourth embodiment of the circuit board according to the present invention will be described with reference to FIG. As shown in FIG.
First, a copper plate 10 and a copper plate 11 are prepared.
0. Reference holes 10a and 11a are formed at predetermined positions of the copper plate 11 using a drilling means such as a drill. Each of the copper plates 10 and 11 has a thickness of 150 μm, as in the first embodiment.
〜500 μm is used.

Next, as shown in FIG. 4B, the B side 10b of the copper plate 10 is etched. At this time, the copper plate 10
The reference hole 10a is inserted into a predetermined pin, and a mask (not shown) on which a predetermined circuit pattern is formed is placed on the B surface 10b with reference to the reference hole 10a, and etching is performed. The etching amount at this time is preferably about half the thickness of the copper plate 10. Similarly, the A surface 11c of the copper plate 11 is etched. At this time, the reference hole 11a of the copper plate 11 is inserted into a predetermined pin, and a mask (not shown) on which a predetermined circuit pattern is formed is placed on the A surface 11c based on the reference hole 11a.
Perform etching. The etching amount at this time is the copper plate 11.
Is preferably about half of the plate thickness.

Thus, a predetermined circuit pattern is formed on the B surface 10b of the copper plate 10 and the A surface 11c of the copper plate 11 (circuit conductors are connected on the A surface 10c side of the copper plate 10, and the B surface of the copper plate 11 is formed). The circuit conductor is connected on the 11b side).

The copper plates 10 and 11 configured as described above are opposed to each other with the adhesive layer 2 such as a prepreg interposed therebetween. That is, the B surface 10b of the copper plate 10 and the A surface 11c of the copper plate 11 face each other. Thereafter, as shown in FIG. 4C, the whole is integrated by heating and pressing by a hot press (not shown). Thereafter, as shown in FIG. 4D, the A side 10c of the copper plate 10 and the B side 11b of the copper plate 11 are etched to separate the circuit conductors 10e and 11e, thereby forming a predetermined circuit pattern.

Further, an adhesive layer such as a prepreg is disposed on the side A 10c of the copper plate 10 and the side B 11b of the copper plate 11, and copper foils 13 and 14 are further disposed thereon. Then, it is heated and pressed by a hot press (not shown) to integrate the whole. As a result, the circuit conductors 10e and 11e constituting the predetermined circuit pattern are formed inside, and the circuit board having the copper foils 13 and 14 provided on the upper and lower surfaces of the base is formed.

Next, predetermined circuit patterns are formed on the copper foils 13 and 14 formed on the upper and lower surfaces of the circuit board. For the formation of this circuit pattern, a conventionally known method can be adopted. First, as shown in FIG. 4F, a predetermined position of the base 12 is perforated to form a through hole 12a.
Thereafter, as shown in FIG. 4 (g), copper plating is applied to both surfaces of the base and the through holes (a copper plating layer 15 is formed). Further, as shown in FIG. 4H, a mask on which a predetermined circuit pattern is formed is placed on both surfaces of the substrate 12, and etching is performed to form a predetermined circuit pattern on both surfaces of the substrate 12. .

As a result, a circuit board having the through holes 16 for electrically connecting both sides of the circuit substrate is formed. Two-layer circuit conductor 1 provided inside this circuit board
Oe and 11e are suitable for a power supply circuit, a large current circuit and the like because of their large thickness, and the circuit conductors provided on the upper and lower surfaces of the circuit board are suitable for a signal circuit and the like because of their small thickness.

In the above-described embodiment, an adhesive layer such as a prepreg is disposed in order to form a base on the etched copper plate or to integrate the etched copper plates with each other. ) To heat and pressurize to integrate the whole. However, the manufacturing method according to the present invention is not particularly limited to the case where an adhesive layer such as a prepreg is used.The etched copper plate is accommodated in a mold, and the etched copper plate and the molding resin are used. The two half-etched copper plates may be housed in a mold and integrated with the molding resin. At this time, since the circuit conductor is formed by so-called half etching (etching of about half the plate thickness) (because it is not connected by a bridge as in the conventional case), the circuit conductor is positioned by the molding resin flowing in the mold. A predetermined circuit pattern can be obtained without causing a shift.

The surface treatment of the circuit conductor 11 includes:
In addition to blackening treatment, degreasing and roughening, coupling agent treatment,
Means for improving the adhesiveness with the molding resin, such as application of an adhesive, may be provided. Further, as the molding resin, a thermoplastic resin such as polyethylene terephthalate, polyphenylene sulfide, polyetherimide or a thermosetting resin such as epoxy, unsaturated polyester, diallyl terephthalate, and a resin having good heat resistance at a soldering temperature. preferable.

Further, in the above embodiment, it has been described that the etching amount of the copper plate is desirably about half the thickness of the copper plate. However, the present invention is not particularly limited to this, and the etching amount of the copper plate is adjusted as necessary. can do.

Further, in the second and fourth embodiments, the circuit pattern is formed by forming copper foils on the upper and lower surfaces of the base. However, without providing this circuit pattern, a copper plate is formed via a prepreg or a molding resin. A circuit pattern may be formed to achieve a multilayer circuit board.

[0042]

As described above, according to the method for manufacturing a circuit conductor according to the present invention, it is possible to obtain a predetermined circuit pattern without causing a positional displacement of the circuit conductor, thereby improving the arrangement density of the circuit conductor. be able to.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining a first embodiment of a method for manufacturing a circuit board according to the present invention.

FIG. 2 is a diagram for explaining a circuit board manufacturing method according to a second embodiment of the present invention.

FIG. 3 is a diagram for explaining a third embodiment of the method for manufacturing a circuit board according to the present invention.

FIG. 4 is a diagram for explaining a fourth embodiment of the method for manufacturing a circuit board according to the present invention.

FIG. 5 is a plan view showing a conventional circuit conductor.

FIG. 6 is a diagram illustrating a process of forming a conventional circuit board.

FIG. 7 is a diagram illustrating a process of cutting a bridge portion of a conventional circuit conductor.

FIG. 8 is a diagram illustrating a process of manufacturing a double-sided board using a conventional circuit conductor.

[Explanation of symbols]

 Reference Signs List 1 Copper plate 1a Reference hole 1b B surface 1c A surface 1d Etched portion 1e Circuit conductor 2 Base 2a Through hole 3 Copper foil 4 Copper foil 5 Copper layer (copper plated layer) 6 Through hole 10 Copper plate 10a Reference hole 10e Circuit conductor 11 Copper plate 11a Reference hole 11e Circuit conductor 12 Base 12a Through hole 13 Copper foil 14 Copper foil 15 Copper layer (copper plating layer) 16 Through hole

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/46 H05K 3/46 NF term (Reference) 5E317 AA24 BB01 BB12 CC31 CC53 CD25 CD31 CD32 GG14 5E339 AB02 AB05 AD03 AD05 AE01 BC02 BD03 BD06 BD11 BE11 EE10 GG10 5E346 AA06 AA12 AA15 AA32 AA42 BB02 BB03 BB04 BB07 BB15 CC02 CC08 CC32 DD02 DD12 DD32 EE02 EE06 EE09 EE13 EE15 FF04 GG15 GG17 HGG22GG

Claims (8)

[Claims] 1. A step of placing a mask having a predetermined circuit pattern on one surface of a copper plate and performing etching to form a circuit pattern on one surface of the copper plate; and forming a circuit pattern on the copper plate after the etching step. Forming a base on the surface side, fixing the copper plate to the base, a step of integrating, and etching the circuit pattern non-formed side of the copper plate fixed to the base, separating circuit conductors constituting the circuit pattern, Forming a predetermined circuit pattern. 2. A step of forming a substrate on the circuit pattern forming surface side of the copper plate, fixing and integrating the copper plate on the substrate, arranging a prepreg facing the circuit pattern forming surface, and heating by a hot press. The method for manufacturing a circuit board according to claim 1, wherein the substrate is formed by pressing the prepreg, and the copper plate is fixed to and integrated with the substrate. 3. A step of forming a substrate on the circuit pattern forming surface side of the copper plate, fixing and integrating the copper plate with the substrate, accommodating the copper plate in a mold, forming the substrate with a molding resin, 2. The method for manufacturing a circuit board according to claim 1, wherein the copper plate is fixed to and integrated with a base. 4. A step of placing a mask on which a predetermined circuit pattern is formed on one surface of a copper plate and performing etching for forming a circuit pattern on one surface of the copper plate, and disposing a prepreg facing the circuit pattern formation surface. At the same time, a copper foil is placed on the surface of the prepreg opposite to the surface facing the circuit pattern formation surface, heated and pressed by hot pressing, and the base is formed by the prepreg, and the copper plate and the copper foil are used as the base. A step of fixing and integrating; a step of etching a circuit pattern non-formation surface side of the copper plate fixed to the base to separate circuit conductors constituting the circuit pattern and forming a predetermined circuit pattern; Etching to form a predetermined circuit pattern. 5. A step of mounting a mask on which a predetermined circuit pattern is formed on one surface of a copper plate and performing etching for forming a circuit pattern on one surface of the copper plate, and disposing a prepreg facing the circuit pattern formation surface. At the same time, a copper foil is placed on the surface of the prepreg opposite to the surface facing the circuit pattern formation surface, heated and pressed by hot pressing, and the base is formed by the prepreg, and the copper plate and the copper foil are used as the base. A step of fixing and integrating; a step of etching a circuit pattern non-formation surface side of the copper plate fixed to the base to separate circuit conductors constituting the circuit pattern and forming a predetermined circuit pattern; Place a prepreg on top, further place a copper foil, heat and press by hot press, the circuit conductor,
A step of fixing and integrating a copper foil on a substrate; a step of perforating the substrate and a plating step of forming a copper layer on the surface; and etching a part of the copper layer to form a predetermined circuit pattern with the copper layer. And a method of manufacturing a circuit board. 6. A step of placing a mask on which a predetermined circuit pattern is formed on one surface of two copper plates and performing etching for forming a circuit pattern on one surface of each copper plate; A step of arranging the prepreg with the circuit pattern forming surface of the copper plate so as to sandwich the prepreg, forming a base by prepreg by heating and pressing with a hot press, and fixing and integrating the two copper plates with the base; Etching the surface of the fixed copper plate on which the circuit pattern is not formed, separating circuit conductors forming the circuit pattern, and forming a predetermined circuit pattern. 7. A step of mounting a mask on which a predetermined circuit pattern is formed on one surface of two copper plates, and performing an etching for forming a circuit pattern on one surface of each copper plate; A step of arranging the prepreg with the circuit pattern forming surface of the copper plate so as to sandwich the prepreg, forming a base by prepreg by heating and pressing with a hot press, and fixing and integrating the two copper plates with the base; A hole forming step, a plating step of forming a copper layer on the surface, a step of etching a part of the copper layer and the copper plate, separating circuit conductors forming a circuit pattern, and forming a predetermined circuit pattern. A method for manufacturing a circuit board. 8. A step of placing a mask on which a predetermined circuit pattern is formed on one surface of two copper plates and performing etching for forming a circuit pattern on one surface of each copper plate; A step of arranging a prepreg facing the circuit pattern forming surface of the copper plate, heating and pressing with a hot press to form a base with the prepreg, and fixing and integrating the two copper plates with the base; fixing to the base; Etching the two sides of the two copper plates on which the circuit pattern is not formed, separating circuit conductors constituting the circuit pattern, and forming a predetermined circuit pattern; and a predetermined circuit pattern formed on the upper and lower surfaces of the base. Further arranging a prepreg thereon and arranging a copper foil, heating and pressing with a hot press to fix and integrate the copper foil with the base, Method with the plating step of forming a copper layer on the surface, etching a portion of the copper layer, the circuit board, characterized by comprising a step of forming a predetermined circuit pattern with a copper layer produced is perforated.