WO2011092809A1 - Procédé de liaison par ultrasons et dispositif de liaison par ultrasons - Google Patents

Procédé de liaison par ultrasons et dispositif de liaison par ultrasons Download PDF

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Publication number
WO2011092809A1
WO2011092809A1 PCT/JP2010/051061 JP2010051061W WO2011092809A1 WO 2011092809 A1 WO2011092809 A1 WO 2011092809A1 JP 2010051061 W JP2010051061 W JP 2010051061W WO 2011092809 A1 WO2011092809 A1 WO 2011092809A1
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WO
WIPO (PCT)
Prior art keywords
fpc
pcb
ultrasonic horn
bonding
resin
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Application number
PCT/JP2010/051061
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English (en)
Japanese (ja)
Inventor
俊夫 八木原
誠 小玉
正康 戸来
Original Assignee
株式会社コグコフ
Ｅｓｂ株式会社
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Application filed by 株式会社コグコフ, Ｅｓｂ株式会社 filed Critical 株式会社コグコフ
Priority to PCT/JP2010/051061 priority Critical patent/WO2011092809A1/fr
Publication of WO2011092809A1 publication Critical patent/WO2011092809A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Definitions

  • the present invention relates to an ultrasonic bonding method and an ultrasonic bonding apparatus, and relates to a method for connecting electrodes of a printed circuit board (hereinafter referred to as FPC), at least one of which is flexible, using ultrasonic waves, and an apparatus using the same. Is.
  • FPC printed circuit board
  • Recent electronic devices are becoming lighter, thinner, and smaller, while the number of wires at the junction is increasing. For this reason, the existing bonding method between the FPC and the PCB has a limit for increasing the bonding density.
  • the above PCB is a substrate on the other side to which the FPC is bonded.
  • the substrate is, for example, an FPC, a rigid flexible printed circuit board (hereinafter referred to as RFC), a rigid printed circuit board (hereinafter referred to as RPC), a ceramic printed circuit board, a film liquid crystal substrate, a touch panel substrate, or a sheet. It is a switch board.
  • the pitch is not 0.3 mm or more, disconnection, misalignment, incorrect insertion, etc. occur during the process from manufacture to assembly, so the connector arrangement space is large compared to other methods. Necessary.
  • the thickness of the connector is about 1 mm. Therefore, in a portable electronic device, if a connector is used, the thickness of the final product cannot be reduced and the weight cannot be ignored.
  • the mounting of the connector requires a large number of processes before joining, and the mounting cost is high.
  • a method using an anisotropic conductive film (hereinafter referred to as ACF) or a non-conductive film (hereinafter referred to as NCF) for bonding is capable of a pitch of 0.3 mm or less, and has recently attracted attention rapidly.
  • ACF anisotropic conductive film
  • NCF non-conductive film
  • This method using ACF or NCF has advantages over solder in weight and thickness, and has the advantage that the arrangement area is about half, but the temperature, time, and stress for bonding are much larger than solder. For this reason, there are many restrictions on thermal design and substrate design, and the unit cost of NCF / NCP is high, so the place of use is limited.
  • a method has been devised in which FPC and RPC are bonded with high strength at a lower temperature and in a shorter time than heating methods and resin-free bonding.
  • the ease of resin discharge must be taken into consideration, and the electrode pitch, which is usually 1.5 to 2 times the electrode thickness, is 3 to 4 times. If it becomes necessary and the electrode pitch is narrowed in the future, the production management of the electrode becomes difficult.
  • the plating structure and shape of the electrode satisfy the current market demand as shown above, while electrical bonding ensures solid-phase bonding between the electrodes, mechanical bonding strength is a method using resin It is to provide a bonding method satisfying the same strength.
  • the tool for holding the electronic component is changed to hold the FPC instead of the electronic component, and the tip width is 0.001 to 0.5 mm.
  • a heating type ultrasonic horn characterized in that the tip shape is orthogonal to the vibration direction and the cross-sectional shape is a convex groove type blade shape perpendicular to the pressing surface is parallel to the bonding surface and with respect to the electrode direction.
  • the electrodes are arranged so that they are vibrated in a parallel direction, and the FPC and circuit electrodes are overlapped, a load is applied perpendicularly to the joint surface with a predetermined pressure, and then the electrodes are heated and vibrated. This is solved by bonding the FPC and the PCB using a resin.
  • the convex groove type blades according to claim 1 are arranged in a plurality of columns, one row, a plurality of rows, or a plurality of rows, and a plurality of rows on the electrode ⁇ 1 column, or 1 row ⁇ multiple columns, or a plurality of rows.
  • the joining positions are moved relative to each other, and joining is carried out at a position of a plurality of rows x one row, or one row x a plurality of rows, or a plurality of rows x a plurality of rows on the electrode.
  • it can be solved by obtaining a high bonding strength with a lower load.
  • the resin is preliminarily disposed in an area of about half of the joining area and the amount of the joining volume before joining, and the FPC and the circuit electrode are overlapped and then predetermined.
  • the metal bonding of the electrode where the resin was not placed and the resin was heated to melt between the electrodes By providing a time difference to flow and joining the metal, it is not necessary to discharge the resin from between the electrodes even if the resin is arranged in advance, so that the adhesion between the FPC and the PCB and the bonding between the electrodes can be compatible even at a low load. Solved.
  • a liquid UV curable resin is poured from the end face of the FPC or PCB after metal bonding between the electrodes, and further UV irradiation is performed to discharge the resin from between the electrodes. Since there is no need, both the adhesion of the FPC and the PCB and the bonding of the electrodes can be solved even with a low load.
  • the joining method of applying vibration from the transverse direction by longitudinal vibration while applying a load from the direction perpendicular to the pressing surface consists of the transition of the following four phases (hereinafter referred to as PHASE).
  • reference numeral 10a denotes a knurl-shaped (pyramid-shaped) ultrasonic horn.
  • Joining with the shape (pyramid shape) ultrasonic horn 10a has the result that the peel strength is lower than that of a convex groove type blade-shaped ultrasonic horn despite the presence of indentations on the FPC surface or PCB electrode surface. Obtained. From this, it was considered that “the relative motion between the PHASE 2 and the PHASE 3 is required on the surfaces of the ultrasonic horn and the FPC to increase the bonding strength”.
  • the area ⁇ increases when the biting amount ⁇ of the horn tip into the resin or metal electrode increases.
  • ⁇ ⁇ ⁇ ⁇ (1-Sin ⁇ )
  • the solid-phase bonding strength is “saturated” when there is no breakage in the electrode or substrate, and the bonding strength of the plating surface or the metal on the plating and plating base. It is known to saturate at the lower value of the bond strength of. As described above, in the present invention, even if the load is changed, the pressure receiving area does not change. Therefore, it is possible to provide a joining method in which the stress is proportional to the load.
  • the thickness dimension of the convex blade at the tip of the ultrasonic horn which is the most important in the present invention, cannot be defined unconditionally due to processing limitations due to the characteristics of the material.
  • the relationship between the cross-sectional shape of the tip, the amplitude of the ultrasonic horn and the stress applied to the metal electrode through the FPC substrate can be theoretically confirmed by a simplified model.
  • a theoretical model is used to summarize how the relationship between the shape and the amplitude of the ultrasonic horn is related to the thickness dimension of the tip.
  • Fig. 7 is a list of theoretical models that summarize the relationship between cross-sectional shape and amplitude.
  • 6 (a) and 6 (b) are legends excerpting 131a and 131b in FIG. 7.
  • the b series composed of 111b, 112b, 113b, and 135b is a “stress sum” graph obtained by adding the stress due to the load and the weight when the ultrasonic horn moves, and the horizontal scale indicates the amplitude of the ultrasonic horn.
  • the vertical scale is in units of stress with the downward direction being positive.
  • the one series composed of 111a, 111b, 121a, and 131b is composed of the two series composed of 111a, 111b, 121a,.
  • the part length is 1 times the amplitude of the ultrasonic horn
  • the three series consisting of 113a, 113b, 123a, 133b are 114a, 114b, 124a
  • the load part length is twice the amplitude of the ultrasonic horn.
  • the four series composed of 134b has a load section length of 5 of the amplitude of the ultrasonic horn. If it is double, it is a model list.
  • the cross-sectional shape of the ultrasonic horn of the 10 series composed of 111a, 111b, 112a, 115b is a triangle
  • the cross-sectional shape of the ultrasonic horn of the 20 series composed of 121a, 121b, 122a is a model list in the case where the cross-sectional shape of the ultrasonic horn is a square.
  • a thin solid line drawn in each figure of the a series indicates a position where the amplitude length has been moved.
  • Fig. 8 (a) is a comparison table of the maximum stresses of the b series in Fig. 7, and the unit is 100% for each one series.
  • FIG. 8B is a comparison table of the stress sums of the b series in FIG. 7, and the unit is 100% for each one series.
  • FIG. 8C is a comparison table of the maximum values of the rate of change of the stress sum, and the unit is 100% for each one series.
  • FIG. 8D is a comparison table of the minimum values of the rate of change of the sum of stress, and the unit is 100% for each one series.
  • the a series is an ideal stress distribution graph in a static state in which the ultrasonic horn is pressed against the FPC, and the load portion length is proportional to the pressurizing area if the length of the ultrasonic horn is the same. Furthermore, if the load is the same, the stress is considered to be the same in all models.
  • the b series is an ideal stress sum distribution graph in which the load from the position at which the ultrasonic horn is pressed against the FPC to the position at which the amplitude length is moved and the stress that has changed due to the pulling are added.
  • the area between the graph and the stress axis is the sum of the stress received when the ultrasonic horn is moved.
  • the slope of the graph represents the rate of change of the stress.
  • the cross-sectional shape is a quadrangle, that is, a cross-sectional shape perpendicular to the pressing surface, it is stable even if the amplitude changes. Therefore, the present invention can provide a joining method in which the joining force is stable even if the amplitude changes, because the sectional shape of the ultrasonic horn is a quadrangle, that is, a sectional shape perpendicular to the pressing surface.
  • the present invention provides a joining method in which the tip shape of an ultrasonic horn is formed into a convex groove type blade shape and arranged in a plurality of rows so that a joining strength several times that of one row can be obtained in a single joining process. it can.
  • the present invention can provide a bonding method and apparatus that can obtain a bonding strength several times that of a single bonding because the bonding position by the ultrasonic horn is relatively moved each time and bonded many times.
  • N times overlap length / ultrasonic amplitude
  • the tip shape of the ultrasonic horn is a convex-blade blade shape in the present invention, the bonding area does not change even if the ultrasonic horn bites into the resin that is the FPC base material.
  • the present invention can provide a bonding method and apparatus that reduce stress on the PCB and facilitates stress design and stress management of the PCB because the bonding stress is locally concentrated even at a low load.
  • the convex groove type blade shape, dimensions and arrangement of the heating ultrasonic horn according to the present invention have a stable pressure receiving area and a stable stress concentration.
  • the degree of concentration is increased, and the plastic deformation of the metal surface is accelerated at an accelerated rate by heating. Therefore, it was confirmed in the experiment that the electrode surface can be joined with other than gold (for example, silver, tin, and aluminum).
  • the FPC and the circuit electrodes are overlapped, and a load is applied perpendicularly to the bonding surface at a predetermined pressure, heating and vibration are applied. If the resin is not sufficiently heated, the resin is not discharged from between the electrodes, and the metal bonding of the electrodes is hindered, resulting in a case where the resistance is high or there is no conduction. Therefore, in this method of arranging in advance on the entire surface, the bonding time between the FPC and the PCB becomes longer and the load for bonding and adhesion becomes larger than in the case where only the electrodes are solid-phase bonded.
  • the resin is disposed in advance in an amount required to fill the gap portion of the joining portion with a length of about 30% to 50% of the joining length of the joining surface, and the FPC and circuit electrodes.
  • a load is applied perpendicularly to the bonding surface with a certain pressure after applying a certain amount of pressure, and then vibration and heating are performed, the metal bonding of the electrode where the resin has not been placed is completed first, and then the resin Is heated to melt and flow between the electrodes, so that it is possible to provide a joining method and apparatus for joining the FPC and the PCB with substantially the same time and load as the metal joining method.
  • the present invention can provide a bonding method having a lower bonding resistance than fusion bonding. Moreover, since the removal of the oxide film and oil film on the surface is mechanically performed by vibration from the lateral direction, the present invention can provide a bonding method and apparatus that do not require electrode cleaning. Furthermore, since solid-phase bonding by lateral vibration causes very little change in the shape of the electrode surface, in the present invention, even if the FPC once bonded is peeled off and bonded again, both bonding strength and bonding resistance deteriorate. Can provide no joining method.
  • the shape of the electrode is a simple shape as usual, it is not necessary to consider the resin flow, and it is possible to provide a joining method in which the PCB electrode pitch is narrow as usual.
  • the tip shape of the ultrasonic horn is simple, even if the ultrasonic horn is worn, it can be reused by simply polishing the joint surface. Therefore, this can provide a joining method with a low running cost of the ultrasonic horn. Further, in the present invention, even if the ultrasonic horn is worn, it is possible to polish the joining surface of the ultrasonic horn by polishing the ultrasonic horn while applying a polishing grindstone or the like. Accordingly, this makes it possible to provide a joining method and apparatus that facilitates removal of dirt and that has a low running cost of the ultrasonic horn.
  • Electrode plating structure and dimensions can be narrowed to meet current market requirements, and electrical bonding ensures solid-state bonding between electrodes, while mechanical bonding strength is the same as resin-based methods A bonding method satisfying the strength can be provided.
  • FIG. 1 It is a perspective view which shows the ultrasonic connection apparatus of FPC. It is a perspective view which shows how to overlap FPC and PCB, an electrode direction, a load direction, and a vibration direction. It is the perspective view which reversed the Naru form ultrasonic horn, the load direction, and the vibration direction from the lower surface.
  • A is the perspective view which reversed the convex blade shape 1 row ultrasonic horn from the lower surface
  • (b) is the perspective view which reversed the convex blade shape 3 row ultrasonic horn from the lower surface.
  • (c) is a perspective view of the convex blade-shaped single-row ultrasonic horn inverted from the lower surface
  • (d) is the convex blade-shaped single-row ultrasonic horn inverted from the lower surface. It is the perspective view seen
  • (e) is the perspective view which reversed the convex blade shape 3 row 1 row ultrasonic horn from the lower surface, and was seen.
  • (A) is the perspective view which reversed and saw the convex blade shape 3 row 3 row ultrasonic horn from the lower surface
  • (b) is the arrow X figure of figure (a)
  • (c) is a figure ( It is an arrow Y view of a).
  • (A) is a legend of the static stress distribution graph of FIG.
  • (b) is a legend of the stress sum distribution graph of FIG. It is a list of theoretical models that summarize the relationship between cross-sectional shape and amplitude.
  • (A) is the b series maximum stress comparison table of FIG. 7, and the unit is 100% for each one series.
  • B) is a comparison table of the stress sums of the b series in FIG. 7, and the unit is 100% for each one series.
  • C) is a comparison table of the maximum values of the rate of change of the stress sum, and the unit is 100% for each one series.
  • (D) is a comparison table of the minimum values of the rate of change of the stress sum, and the unit is 100% for each one series.
  • FIG. 6A is a side view showing a bonding position before the relative movement of the convex blade-shaped ultrasonic horn
  • FIG. 6B shows the relative movement of the convex blade-shaped ultrasonic horn. It is a side view which shows the position which has joined next.
  • (A) is a front view showing the state before joining, in which resin is arranged on the entire surface of the PCB
  • (b) is a front view showing the middle of joining and bonding, which is the next stage of (a)
  • (A) is the front view which shows the state before joining which arrange
  • (b) is the next step of (a), in the middle of joining and adhesion
  • C) is a front view showing a state after joining and bonding, which is the next stage of (b).
  • (A) is a front view showing the state before joining, in which a resin having an area of about half of the PCB is arranged near the center of the joint, and (b) is the next stage of (a), the first stage of joining / bonding It is a front view which shows the step of (b), (c) is a front view which shows the step in the middle of joining and adhesion
  • (A) is a front view showing a state before bonding, in which a resin having an area of about 1/3 is arranged in the vicinity of the PCB end surface on the PCB, and (b) is the next stage of (a), which is a bonding / adhesion step. It is a front view which shows the middle, (c) is a front view which shows the state after joining and adhesion
  • (A) is a front view showing a state before bonding, in which a resin having an area of about 1/3 is arranged in the vicinity of the PCB end surface on the PCB, and (b) is the next stage of (a), which is a bonding / adhesion step.
  • (c) is a front view which shows the stage in the middle of joining and adhesion
  • (c) is a front view which shows a certain last stage of joining and adhesion
  • FIG. 2 is a perspective view showing how the FPC and the PCB are overlapped, the electrode direction, the load direction, and the vibration direction.
  • 1 is an FPC
  • 1a is an FPC base material made of a resin such as polyimide (trade name) or pet (trade name)
  • 2 is a conductive metal such as gold, silver or copper, or soldered on the surface thereof.
  • FPC electrodes provided on the FPC 1 subjected to plating, tin plating, gold plating, etc. 3 is a PCB
  • 3a is a resin such as polyvinyl chloride, bakelite, fiber, polyimide (trade name), pet (trade name), PCB substrate made of ceramics and glass
  • 4 is a conductive metal such as gold, silver, copper, or PCB electrode provided on PCB 3 on which solder plating, tin plating, gold plating or the like is further applied
  • 6a, 7a Is an alignment mark provided for positioning described later.
  • FIG. 4 (a) is a perspective view of the convex blade-shaped single-row ultrasonic horn according to the present invention as seen from the lower surface showing the shape, load direction, vibration direction, and electrode direction.
  • Reference numeral 10b denotes a convex blade shape single row ultrasonic horn.
  • 10c shown in FIG. 4 (b) is a convex blade-shaped three-row ultrasonic horn.
  • 10d shown in FIG.4 (c) is a convex blade shape 1 row 1 row ultrasonic horn.
  • Reference numeral 10e shown in FIG. 4 (d) denotes a convex blade-shaped three-row single-row ultrasonic horn.
  • Reference numeral 10f shown in FIG. 4 (e) denotes a convex blade-shaped one-row, three-row ultrasonic horn.
  • 10g shown in FIG.4 (g) is a convex-blade shape 3 row
  • FIG. 5 (b) is a side view as seen from the direction of the arrow x in FIG. 5 (a), and is a side view arranged so that the load direction is from bottom to top.
  • Wy is the length of the portion of the ultrasonic horn where the convex blade is provided
  • B is the length of the convex blade of the ultrasonic horn
  • Py is the pitch distance when multiple convex blades are arranged.
  • FIG.5 (c) is the figure seen from the arrow y direction of Fig.5 (a), and is the front view arrange
  • Wx is the width of the portion of the ultrasonic horn where the convex blades are provided
  • T is the thickness of the convex blades of the ultrasonic horn
  • Px is the pitch distance when multiple rows of convex blades are arranged.
  • the minimum value of the thickness T at the tip of the ultrasonic horn is considered to be sufficient if it is one time the amplitude of the ultrasonic horn based on the above theoretical model.
  • the amplitude of the ultrasonic horn currently used in the experiment is 3 ⁇ m, it should be 0.003 mm.
  • the oscillation frequency will be increased, and on the contrary, the amplitude will be further reduced, and the FPC1 due to ultrasonic vibration will be reduced. Since it is planned that it is necessary to suppress damage to the PCB 3 and the components mounted on the surface and inside thereof, the minimum value of the thickness T at the tip of the ultrasonic horn is set to 0.001 mm.
  • the maximum value of the thickness T at the tip of the ultrasonic horn is sufficient to be one time the amplitude of the ultrasonic horn from the above-mentioned theoretical model.
  • the processing method and state of the surface, further, the material, thickness, hardness, and longitudinal elastic modulus of the resin that is the base material of the FPC, and further the condition of the joining member such as the processing method and state of the surface In addition, based on the results of experiments so far, the limits of processing from the material of the ultrasonic horn and the characteristics of the materials, the number of wires, the thickness of the wires, the control limits of the load control device, etc. .5mm is required.
  • the thickness T of the tip of the ultrasonic horn is 0.001 to 0.5 mm.
  • the height H of the tip of the ultrasonic horn cannot be determined at all because the thickness of the FPC substrate 1a is as wide as several tens to several hundreds ⁇ m depending on the application.
  • the heat radiation and the radiant heat are very important, so the height H of the tip of the ultrasonic horn is as much as possible in consideration of the thickness and material of the FPC substrate 1a.
  • the thickness T of the ultrasonic horn tip can be determined. Even if the necessary load can be determined, the allowable stress of the PCB 3 may be exceeded depending on the conditions of the joining member. In this case, for example, the shape of the convex blade-shaped three-row ultrasonic horn 10g receives the reaction force from the “FPC” base material 3a rather than the shape of the convex blade-shaped three-row ultrasonic horn 10c. Since it is difficult, the load can be reduced. However, since the number of lines depends on the number of wires, it is actually 1 to several tens, not several, and sometimes several hundreds. The number of columns also depends on the allowable stress of the PCB. , In some cases, hundreds.
  • the shape of the convex blade-shaped three-row ultrasonic horn 10c is simpler than the shape of the convex blade-shaped three-row ultrasonic horn 10g.
  • the manufacturing cost of the ultrasonic horn 10 is reduced. As described above, since the number of columns and the number of strips cannot be uniquely determined, they are determined each time in the above conditions.
  • solid-phase metal bonding which is the core of the present invention, is an ultrasonic bonding apparatus having a load means, a vibration means, and a heating means.
  • This is an embodiment of the third aspect of the invention.
  • the example in the case of performing resin bonding together is the implementation in the case of aligning FPC and PCB in Example 5, Example 6, Example 7, Example 8, Example 9, and Example 10. Examples will be described in detail in Example 12, Example 13, and Example 14.
  • FIG. 22 is a perspective view showing an embodiment of the present invention, excerpted from FIG. 1.
  • 20 is an anvil having means for adsorbing and fixing PCB 3
  • 20 a is a PCB provided on the anvil 20.
  • Fixing suction hole 20b is an FPC fixing suction hole provided in the anvil 20, 21 is an anvil heater for heating the anvil, 1 is an FPC, 1a is an FPC base material made of an insulating material of the FPC 1, 2 Is an FPC electrode which is an electric circuit formed on the FPC substrate 1a, 6a is two pairs of FPC alignment holes provided in the FPC substrate 1a, 3 is a PCB, 3a is made of an insulating material of this PCB3
  • the PCB substrate 4 is a PCB electrode which is an electric circuit formed on the PCB substrate 3a, and 7a is two pairs of PCB alignment marks provided on the PCB substrate 3a.
  • FIG. 4B is a perspective view showing the shape, load direction, and vibration direction of the convex blade-shaped three-row ultrasonic horn as viewed from the bottom, and 10c is the convex blade-shaped three-row super horn of the present invention. It is a sonic horn. However, since the number of columns depends on the allowable stress of the PCB, it is actually not only 3 but 1 to several tens, and in some cases several hundreds.
  • FIG. 1 is a perspective view showing the configuration of the entire apparatus.
  • 10 is an ultrasonic horn that moves up and down along a vertical movement guide (not shown)
  • 13 is a vertical movement guide (not shown) that is fixed to the fixed point of the ultrasonic horn 10 with a screw or the like.
  • 11 is an ultrasonic horn heater fixed to the ultrasonic horn 10 with a screw or the like
  • 12 is an ultrasonic wave fixed to the ultrasonic horn 10 with a screw or the like. It is a vibrator.
  • 25 is a Y-axis stage fixed to the main body (not shown) with a screw
  • 24 is an X-axis stage fixed to the Y-axis stage with a screw
  • 23 is fixed to the X-axis stage with a screw.
  • a ⁇ -axis stage, 22 is a load sensor fixed to the ⁇ -axis stage with a screw or the like
  • 20 is an anvil fixed to the load sensor 22 with a screw or the like
  • 21 is fixed to the anvil 20 with a screw or the like.
  • a load control device 73a for controlling the load means 13 includes a temperature measuring body (not shown) such as a thermocouple in which the temperature of the ultrasonic horn 10 heated by the ultrasonic horn heater 11 is fixed to the ultrasonic horn with a screw or the like.
  • An ultrasonic horn temperature adjusting device 73b that performs feedback control using a temperature sensor (not shown) such as a thermocouple in which the temperature of the anvil 20 heated by the anvil heater 21 is fixed to the anvil with a screw or the like is fed back.
  • a temperature sensor not shown
  • An anvil temperature control device to be controlled.
  • 76a is an FPC adsorption sensor provided in the FPC holding / supplying unit 50, which is provided in a piping path to the negative pressure generator (not shown) for adsorbing and fixing the FPC1, and confirming the adsorption of the FPC1.
  • 76b is an FPC adsorption sensor provided in the anvil 20 for confirming the adsorption of the FPC 1 provided in the piping path from the adsorption fixing hole 20a in FIG. 22 for adsorbing and fixing the FPC 1 to the negative pressure generator (not shown).
  • a position control device 77 controls the moving speed and position of the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25.
  • the PCB electrode 4 of the PCB 3 is supplied onto the anvil 20 with the PCB electrode 4 facing upward.
  • the PCB 3 is suction-fixed to the anvil 20 with the PCB fixing suction hole 20a set to a negative pressure.
  • the FPC 1 is placed on the FPC 1 and the PCB 3 with the FPC electrode 2 facing downward by the FPC holding / supply means 50.
  • the FPC 1 is suctioned and fixed to the anvil 20 by making the FPC fixing suction hole 20 b negative pressure, the negative pressure of the FPC holding / supply means 50 is released, and the FPC 1 is supplied to the anvil 20. .
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are respectively moved by a command from the control device 70 to the position control device 77. That is, the anvil 20 and the FPC 1 and the PCB 3 that are adsorbed and fixed to the anvil 20 are moved directly below the ultrasonic horn 10c (hereinafter referred to as a joining position).
  • the control device 70 In response to the arrival completion signal from the position control device 77, the control device 70 lowers the ultrasonic horn 10c along the vertical movement guide (not shown) using the load means 13, and moves the FPC 1 and PCB 3 to the ultrasonic horn 10. Between the anvil 20 and the anvil 20 to apply pressure to the joint surface.
  • the load sensor 22 compares the load with a predetermined load and controls the load control device 72 so as to hold the predetermined load.
  • the ultrasonic transmitter 71 oscillates according to a command from the control device 70, and the ultrasonic horn 10 c is vibrated by the ultrasonic vibrator 12. Due to the oscillation of the ultrasonic horn 10c, the FPC electrode 2 and the PCB electrode 4 from which the resin has been discharged are solid-phase metal bonded.
  • the oscillation of the ultrasonic transmitter 71 is stopped by a command from the control device 70, and the vibration of the ultrasonic horn 10c by the ultrasonic vibrator 12 is stopped. After the vibration is stopped, the ultrasonic horn 10c is raised along the vertical movement guide (not shown) using the load means 13 in accordance with a command from the control device 70.
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are respectively moved by a command from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 sucked and fixed to the anvil 20 and this PCB 3 joined to is moved to the original position (hereinafter referred to as supply / removal position).
  • the control device 70 stops the adsorption of the anvil 20, and releases the fixation of the FPC 1 and the PCB 3 bonded thereto, thereby completing the solid-phase metal bonding step.
  • FIG. 22 is a perspective view showing an embodiment of the present invention, which is a part of FIG.
  • 20 is an anvil having means for adsorbing and fixing PCB3
  • 20a is an adsorbing hole for fixing PCB on the anvil
  • 20b is an adsorbing hole for fixing FPC on the anvil
  • 21 is for heating the anvil.
  • Anvil heater 1 is an FPC
  • 1a is an FPC base that is a base made of an insulating material of the FPC
  • 2 is an FPC electrode that is an electric circuit formed on the FPC base 1a
  • 6a is an FPC base 1a
  • 3 is a PCB
  • 3a is a PCB substrate made of an insulating material of this PCB3
  • 4 is an electric circuit formed on the PCB substrate 3a.
  • PCB electrodes 7a are two pairs of PCB alignment marks provided on the PCB substrate 3a.
  • FIG. 4 (e) is a perspective view showing the shape, load direction, and vibration direction of a convex blade-shaped single-row, three-row ultrasonic horn as seen from the bottom.
  • 10f is a convex blade shape 1 row 3 row ultrasonic horn among this invention.
  • the number of rows depends on the allowable stress of the PCB, it is actually 1 to several tens, not several, and several hundreds in some cases. Further, since the number of stripes also depends on the number of wirings to be connected, it is actually 1 to several tens instead of three, and sometimes several hundreds.
  • FIG. 9A is a front view showing the joining position before the relative movement of the convex blade-shaped ultrasonic horn
  • 10f is a convex blade-shaped one-row, three-row ultrasonic horn
  • 11 is a convex shape.
  • An ultrasonic horn heater that heats the blade-shaped single-row, three-row ultrasonic horn 10f, and 12 is a vibrator that vibrates the convex blade-shaped single-row, three-row ultrasonic horn 10f.
  • FIG. 9B is a front view showing a position where the convex blade-shaped ultrasonic horn is relatively moved, and the next joining position in FIG. 9A.
  • FIG. It is a side view which shows the position which has joined before performing relative movement of a sound wave horn.
  • FIG. 10B is a side view showing a position where the convex blade-shaped ultrasonic horn is relatively moved and next to FIG. 10A.
  • FIG. 1 is a perspective view showing the configuration of the entire apparatus.
  • 10 is an ultrasonic horn that moves up and down along a vertical movement guide (not shown)
  • 13 is a vertical movement guide (not shown) that is fixed to the fixed point of the ultrasonic horn 10 with a screw or the like.
  • 11 is an ultrasonic horn heater fixed to the ultrasonic horn 10 with a screw or the like
  • 12 is an ultrasonic wave fixed to the ultrasonic horn 10 with a screw or the like. It is a vibrator.
  • a ⁇ -axis stage 22 is a load sensor fixed to the ⁇ -axis stage with a screw or the like
  • 20 is an anvil fixed to the load sensor 20 with a screw or the like.
  • An anvil heater 21 is fixed to the anvil with a screw or the like.
  • 70 is a control device
  • 71 is an ultrasonic transmitter that vibrates the ultrasonic horn 10c by the ultrasonic vibrator 12
  • 72 is compared with a predetermined ultimate load by the load sensor 22, and holds a predetermined load.
  • 73a is an ultrasonic horn temperature adjustment in which the temperature of the ultrasonic horn 10 heated by the ultrasonic horn heater 11 is feedback-controlled using a thermometer (not shown) such as a thermocouple fixed to the ultrasonic horn with a screw or the like.
  • a device 73b is an anvil temperature adjusting device that feedback-controls the temperature of the anvil 20 heated by the anvil heater 21 using a temperature measuring body (not shown) such as a thermocouple fixed to the anvil with a screw or the like.
  • 76b is an FPC adsorption sensor provided in the anvil 20 for confirming the adsorption of the FPC 1 provided in the piping path from the adsorption fixing hole 20a in FIG. 22 for adsorbing and fixing the FPC 1 to the negative pressure generator (not shown).
  • Reference numeral 76c denotes a PCB adsorption sensor provided in the anvil 20 for confirming the adsorption of the PCB provided in the piping path from the PCB adsorption fixing hole 20a for adsorbing and fixing the PCB 3 to the negative pressure generator (not shown).
  • a position control device 77 controls the moving speed and position of the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25.
  • the PCB electrode 4 of the PCB 3 is supplied onto the anvil 20 with the PCB electrode 4 facing upward.
  • the PCB 3 is suction-fixed to the anvil 20 with the PCB fixing suction hole 20a set to a negative pressure.
  • the FPC 1 and the PCB 3 are overlapped with the FPC electrode 2 facing downward.
  • the FPC 1 is sucked and fixed to the anvil 20 with the FPC fixing suction hole 20b set to a negative pressure.
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved by the command from the control device 70 to the position control device 77, that is, The anvil 20 and the FPC 1 and PCB 3 adsorbed and fixed to the anvil 20 are moved directly below the ultrasonic horn 10c.
  • the control device 70 In response to the arrival completion signal from the position control device 77, the control device 70 lowers the ultrasonic horn 10c along the vertical movement guide (not shown) using the load means 13, and moves the FPC 1 and PCB 3 to the ultrasonic horn 10. Between the anvil 20 and the anvil 20 to apply pressure to the joint surface.
  • the load sensor 22 compares the load with a predetermined load and controls the load control device 72 so as to hold the predetermined load.
  • FIG. 9A is a front view showing this state
  • FIG. 10A is a side view showing this state.
  • the ultrasonic transmitter 71 oscillates according to a command from the control device 70, and the ultrasonic horn 10 c is vibrated by the ultrasonic vibrator 12. Due to the oscillation of the ultrasonic horn 10c, the FPC electrode 2 and the PCB electrode 4 from which the resin has been discharged are solid-phase metal bonded.
  • the oscillation of the ultrasonic transmitter 71 is stopped by a command from the control device 70, and the vibration of the ultrasonic horn 10c by the ultrasonic vibrator 12 is stopped. After the vibration is stopped, the ultrasonic horn 10c is raised along the vertical movement guide (not shown) using the load means 13 in accordance with a command from the control device 70.
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are respectively moved by a command from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 sucked and fixed to the anvil 20 and this Is moved to the next bonding position in the Y direction.
  • FIG. 9A is a front view showing this state
  • FIG. 10B is a side view showing this state.
  • the above pressurization and heating to vibration are performed, and then the ultrasonic horn 10c is raised.
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are respectively moved by a command from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 sucked and fixed to the anvil 20 and this PCB3 joined to is moved to the next joining position in the X direction.
  • FIG. 9B is a front view showing this state
  • FIG. 10A is a side view showing this state.
  • the above-described pressurization and heating to vibration are performed, and then the ultrasonic horn 10c is raised.
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are respectively moved by a command from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 sucked and fixed to the anvil 20 and this Is moved to the next bonding position in the -Y direction.
  • FIG. 9B is a front view showing this state
  • FIG. 10B is a side view showing this state.
  • the above relative movement is repeated a predetermined number of times, and when the final joining position is reached, the above pressurization and heating to vibration are performed, and then the ultrasonic horn 10c is raised.
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are respectively moved by a command from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 sucked and fixed to the anvil 20 and this And move the PCB 3 joined to the original position.
  • the control device 70 stops the adsorption on the anvil 20, and releases the fixation of the FPC 1 and the PCB 3 bonded thereto, thereby completing the solid-phase metal bonding step.
  • the productivity, the load received by the PCB, and the manufacturing cost of the ultrasonic horn 10 are compared as follows.
  • the productivity is highest for the convex blade shape three-row ultrasonic horn 10c and the convex blade shape three-row ultrasonic horn 10g.
  • the order is as follows.
  • Convex blade shape 3 row ultrasonic horn 10c> Convex blade shape 3 row 3 ultrasonic horn 10g> Convex blade shape 1 row ultrasonic horn 10b> Convex blade shape 3 row 1 ultrasonic horn 10e convex type Blade shape 1 row 1 row ultrasonic horn 10f> Convex blade shape 1 row 1 row ultrasonic horn 10d Furthermore, when the manufacturing cost of the ultrasonic horn 10 is compared, the convex blade shape single-row ultrasonic horn 10b is the smallest. In summary, the order is as follows.
  • Convex blade shape 1 row ultrasonic horn 10b> Convex blade shape 1 row 1 ultrasonic horn 10d> Convex blade shape 3 row ultrasonic horn 10c> Convex blade shape 3 row 1 ultrasonic horn 10e convex type Blade shape 1 row 3 row ultrasonic horn 10f> Convex blade shape 3 row 3 row ultrasonic horn 10g
  • the number of columns and the number of lines there is no unique rule for the combination of the number of columns and the number of lines, and the actual number of lines depends on the number of wirings, so it is actually 1 to several tens instead of 3, and sometimes several hundreds. Since the number of columns also depends on the allowable stress of the PCB, it is actually 1 to several tens instead of three, and sometimes several hundreds. Therefore, since the number of columns and the number of strips cannot be determined uniquely, they are determined each time in the above conditions.
  • the resin in carrying out claims 1, 2, and 4, is preliminarily disposed on the entire surface of the joining surface with a certain thickness on the FPC 1, and the electrodes of the FPC 1 and the PCB 3 are overlapped.
  • the resin is heated by applying a load to the bonding surface with the pressure of, the resin is discharged from the bonding surface, and the electrode of the bonding surface from which the resin has been discharged by vibrating is subjected to solid-phase metal bonding, and further heated.
  • the molten resin is melt-flowed between the electrodes, and as a result, the gap is filled and the FPC 1 and the PCB 3 are bonded.
  • This method of placing the resin between the FPC 1 and the PCB before bonding and bonding and bonding is a known method.
  • FIG. 1 is a perspective view showing the configuration of the entire apparatus.
  • 10 is an ultrasonic horn that moves up and down along a vertical movement guide (not shown)
  • 13 is a vertical movement guide (not shown) that is fixed to the fixed point of the ultrasonic horn 10 with a screw or the like.
  • 11 is an ultrasonic horn heater fixed to the ultrasonic horn 10 with a screw or the like
  • 12 is an ultrasonic wave fixed to the ultrasonic horn 10 with a screw or the like. It is a vibrator.
  • 25 is a Y-axis stage fixed to the main body (not shown) with a screw
  • 24 is an X-axis stage fixed to the Y-axis stage with a screw
  • 23 is fixed to the X-axis stage with a screw.
  • a ⁇ -axis stage, 22 is a load sensor fixed to the ⁇ -axis stage with a screw or the like
  • 20 is an anvil fixed to the load sensor 20 with a screw or the like
  • 77 is a ⁇ -axis stage 23 and an X-axis stage 24.
  • a position control device for controlling the moving speed and position of the Y-axis stage 25.
  • FIG. 4 (b) is a perspective view showing the shape, load direction, and vibration direction of the convex blade-shaped three-row ultrasonic horn, as seen from the bottom, and 10c is a convex blade-shaped three-row supersonic horn. It is a sonic horn.
  • FIG. 11A is a front view showing a state before resin is preliminarily disposed on the entire surface of the PCB of this embodiment and bonded and bonded
  • FIG. 11B is a front view showing the middle of bonding and bonding
  • FIG. 11 (c) is a front view showing the state after bonding and joining.
  • 1a is an FPC substrate
  • 2 is an FPC electrode formed in advance on the FPC substrate 1a
  • 3a is a PCB substrate
  • 4 is a PCB electrode formed in advance on the PCB electrode
  • 5 is an FPC1 and PCB3. A resin to be bonded.
  • the resin 5 is placed in advance on the entire bonding surface of the PCB 3 with a certain thickness before bonding, and then the PCB electrode 4 of the PCB 3 is supplied onto the anvil 20 with the PCB electrode 4 facing upward.
  • the PCB 3 is suction-fixed to the anvil 20 with the PCB fixing suction hole 20a set to a negative pressure. Adsorbed and fixed to the anvil 20.
  • the FPC 1 and the PCB 3 are overlapped with the FPC electrode 2 facing downward. Under the control of the control device 70, the FPC 1 is sucked and fixed to the anvil 20 with the FPC fixing suction hole 20b set to a negative pressure.
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved in accordance with commands from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 and PCB 3 that are attracted and fixed to the anvil 20. Is moved directly below the ultrasonic horn 10c. This is the state of FIG. 11A, but the figure illustrates the state in which the resin is arranged on the PCB 3 in advance. However, the anvil 20 is omitted. In addition, the FPC electrode 2 and the resin 5 are actually in contact with each other, but are not in contact with each other for explanation.
  • the control device 70 In response to the arrival completion signal from the position control device 77, the control device 70 lowers the ultrasonic horn 10c along the vertical movement guide (not shown) using the load means 13, and moves the FPC 1 and PCB 3 to the ultrasonic horn 10c. Between the anvil 20 and the anvil 20 to apply pressure to the joint surface.
  • the load sensor 22 compares the load with a predetermined load and controls the load control device 72 so as to hold the predetermined load. This is the state of FIG.
  • the resin is melted by heat transfer and radiant heat of the ultrasonic horn heater 11c heated by the ultrasonic horn heater 11, and the resin is discharged from between the FPC electrode 1 and the PCB electrode 4 by the bonding pressure.
  • the discharged resins are FPC1 and PCB3. Through the gap formed by the FPC electrode 2 and the PCB electrode 4 and discharged from both end faces of the FPC 1 and the PCB 3. This is the state of FIG.
  • the ultrasonic transmitter 71 oscillates according to a command from the control device 70, and the ultrasonic horn 10 c is vibrated by the ultrasonic vibrator 12. Due to the oscillation of the ultrasonic horn 10c, the FPC electrode 2 and the PCB electrode 4 from which the resin has been discharged are solid-phase metal bonded.
  • the oscillation of the ultrasonic transmitter 71 is stopped by a command from the control device 70, and the vibration of the ultrasonic horn 10c by the ultrasonic vibrator 12 is stopped. After the vibration is stopped, the ultrasonic horn 10c is raised along the vertical movement guide (not shown) using the load means 13 in accordance with a command from the control device 70.
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are respectively moved by a command from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 sucked and fixed to the anvil 20 and this And move the PCB 3 joined to the original position.
  • the control device 70 stops the suction of the anvil 20, and releases the fixation of the FPC 1 and the PCB 3 joined thereto, thereby completing the bonding / joining process.
  • the resin is arranged in advance by printing and applying the resin to the FPC 1 or PCB 3a, or by attaching a film-like resin before joining, or by discharging the resin immediately before joining. There is a method of applying.
  • the method of lowering the ultrasonic horn 10 and the method of raising the anvil 20 are the same in terms of the joining effect.
  • the resin is applied to the joint surface of the FPC 1 at a length which is 1 ⁇ 2 of the joint length, and the FPC electrode 2 and the PCB at the joint portion.
  • An amount sufficient to fill the gap formed by the electrode 4 is placed in advance near the center of the joining length, and the FPC and the circuit electrode are overlapped, and then a load is applied in a direction perpendicular to the joining surface with a predetermined pressure.
  • FIG. 1 is a perspective view showing the configuration of the entire apparatus.
  • 10 is an ultrasonic horn that moves up and down along a vertical movement guide (not shown)
  • 13 is a vertical movement guide (not shown) that is fixed to the fixed point of the ultrasonic horn 10 with a screw or the like.
  • 11 is an ultrasonic horn heater fixed to the ultrasonic horn 10 with a screw or the like
  • 12 is an ultrasonic wave fixed to the ultrasonic horn 10 with a screw or the like. It is a vibrator.
  • 25 is a Y-axis stage fixed to the main body (not shown) with a screw
  • 24 is an X-axis stage fixed to the Y-axis stage with a screw
  • 23 is fixed to the X-axis stage with a screw.
  • a ⁇ -axis stage, 22 is a load sensor fixed to the ⁇ -axis stage with a screw or the like
  • 20 is an anvil fixed to the load sensor 20 with a screw or the like
  • 77 is a ⁇ -axis stage 23 and an X-axis stage 24.
  • a position control device for controlling the moving speed and position of the Y-axis stage 25.
  • FIG. 4 (b) is a perspective view showing the shape, load direction, and vibration direction of the convex blade-shaped three-row ultrasonic horn, as seen from the bottom, and 10c is a convex blade-shaped three-row supersonic horn. It is a sonic horn.
  • FIG. 12A is a front view showing the state before bonding / bonding a resin having a half area to the PCB of this embodiment, which is arranged near the center of the bonding portion
  • FIG. FIG. 12C is a front view showing the state after bonding and joining.
  • 1a is an FPC substrate
  • 2 is an FPC electrode formed in advance on the FPC substrate 1a
  • 3a is a PCB substrate
  • 4 is a PCB electrode formed in advance on the PCB electrode
  • 5 is an FPC1 and PCB3.
  • the resin 5 having a length of about 1 ⁇ 2 of the joining length is arranged in advance near the center of the joint portion of the joint surface of the PCB 3.
  • the PCB electrode 4 of the PCB 3 is supplied onto the anvil 20 with the PCB electrode 4 facing upward.
  • the PCB 3 is suction-fixed to the anvil 20 with the PCB fixing suction hole 20a set to a negative pressure.
  • the FPC 1 and the PCB 3 are overlapped with the FPC electrode 2 facing downward. Under the control of the control device 70, the FPC 1 is sucked and fixed to the anvil 20 with the FPC fixing suction hole 20b set to a negative pressure.
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved in accordance with commands from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 and PCB 3 that are attracted and fixed to the anvil 20. Is moved directly below the ultrasonic horn 10c. This is the state of FIG. 12A, but the figure illustrates the state in which the resin 5 is disposed on the PCB 3 in advance. However, the anvil 20 is omitted. In addition, the FPC electrode 2 and the resin 5 are actually in contact with each other, but are not in contact with each other for explanation.
  • the control device 70 In response to the arrival completion signal from the position control device 77, the control device 70 lowers the ultrasonic horn 10c along the vertical movement guide (not shown) using the load means 13, and moves the FPC 1 and PCB 3 to the ultrasonic horn 10c. Between the anvil 20 and the anvil 20 to apply pressure to the joint surface.
  • the load sensor 22 compares the load with a predetermined load and controls the load control device 72 so as to hold the predetermined load. This is the state of FIG.
  • the resin is melted by heat transfer and radiant heat of the ultrasonic horn heater 11c heated by the ultrasonic horn heater 11, and the resin is discharged from between the FPC electrode 1 and the PCB electrode 4 by the bonding pressure.
  • the discharged resins are FPC1 and PCB3. Through the gap formed by the FPC electrode 2 and the PCB electrode 4 and discharged from both end faces of the FPC 1 and the PCB 3. This is the state of FIG.
  • the ultrasonic transmitter 71 oscillates according to a command from the control device 70, and the ultrasonic horn 10 c is vibrated by the ultrasonic vibrator 12. Due to the oscillation of the ultrasonic horn 10c, the FPC electrode 2 and the PCB electrode 4 from which the resin has been discharged are solid-phase metal bonded.
  • the oscillation of the ultrasonic transmitter 71 is stopped by a command from the control device 70, and the vibration of the ultrasonic horn 10c by the ultrasonic vibrator 12 is stopped. After the vibration is stopped, the ultrasonic horn 10c is raised along the vertical movement guide (not shown) using the load means 13 in accordance with a command from the control device 70.
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are respectively moved by a command from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 sucked and fixed to the anvil 20 and this And move the PCB 3 joined to the original position.
  • the control device 70 stops the suction of the anvil 20, and releases the fixation of the FPC 1 and the PCB 3 joined thereto, thereby completing the bonding / joining process.
  • the resin is arranged in advance by printing and applying the resin to the FPC 1 or PCB 3a, or by attaching a film-like resin before joining, or by discharging the resin immediately before joining. There is a method of applying.
  • the method of lowering the ultrasonic horn 10 and the method of raising the anvil 20 are the same in terms of the joining effect.
  • the load sensor 22 since the load sensor only controls the timing of starting the oscillation of the ultrasonic wave, the load sensor 22 is not an indispensable condition if a timing device such as a timer is combined with the load means 13 capable of holding a constant load. .
  • the resin is applied to the joint surface of the FPC 1 at a length which is 1 ⁇ 2 of the joint length, and the FPC electrode 2 and the PCB at the joint portion.
  • An amount sufficient to fill the gap formed by the electrode 4 is placed in advance near the center of the joining length, and the FPC and the circuit electrode are overlapped, and then a load is applied in a direction perpendicular to the joining surface with a predetermined pressure.
  • FIG. 1 is a perspective view showing the configuration of the entire apparatus.
  • 10 is an ultrasonic horn that moves up and down along a vertical movement guide (not shown)
  • 13 is a vertical movement guide (not shown) that is fixed to the fixed point of the ultrasonic horn 10 with a screw or the like.
  • 11 is an ultrasonic horn heater fixed to the ultrasonic horn 10 with a screw or the like
  • 12 is an ultrasonic wave fixed to the ultrasonic horn 10 with a screw or the like. It is a vibrator.
  • 25 is a Y-axis stage fixed to the main body (not shown) with a screw
  • 24 is an X-axis stage fixed to the Y-axis stage with a screw
  • 23 is fixed to the X-axis stage with a screw.
  • a ⁇ -axis stage, 22 is a load sensor fixed to the ⁇ -axis stage with a screw or the like
  • 20 is an anvil fixed to the load sensor 20 with a screw or the like
  • 77 is a ⁇ -axis stage 23 and an X-axis stage 24.
  • a position control device for controlling the moving speed and position of the Y-axis stage 25.
  • FIG. 4A is a perspective view showing the shape, load direction, and vibration direction of the convex blade-shaped single-row ultrasonic horn as viewed from the bottom, and 10b is a convex blade-shaped single row. It is a sonic horn.
  • FIG. 13A is a front view showing a state before joining, in which a resin having a half area is arranged in the vicinity of the center of the joint on the PCB of this embodiment, and FIG. 13B is a first stage of joining / bonding.
  • FIG. 13C is a front view showing a stage in the middle of joining / bonding, and
  • FIG. 13D is a front view showing the last stage of joining / bonding.
  • 1a is an FPC substrate
  • 2 is an FPC electrode formed in advance on the FPC substrate 1a
  • 3a is a PCB substrate
  • 4 is a PCB electrode formed in advance on the PCB electrode
  • 5 is an FPC1 and PCB3.
  • the resin 5 is arranged in advance near the center of the joint portion of the joint surface of the PCB 3 before joining.
  • the PCB electrode 4 of the PCB 3 is supplied onto the anvil 20 with the PCB electrode 4 facing upward.
  • the PCB 3 is suction-fixed to the anvil 20 with the PCB fixing suction hole 20a set to a negative pressure. Adsorbed and fixed to the anvil 20.
  • the FPC 1 and the PCB 3 are overlapped with the FPC electrode 2 facing downward. Under the control of the control device 70, the FPC 1 is sucked and fixed to the anvil 20 with the FPC fixing suction hole 20b set to a negative pressure.
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved in accordance with commands from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 and PCB 3 that are attracted and fixed to the anvil 20. Is moved to the first joining position directly below the ultrasonic horn 10b.
  • This is the state of FIG. 13A, but the figure illustrates the state where the resin is arranged on the PCB 3 in advance. However, the anvil 20 is omitted.
  • the FPC electrode 2 and the resin 5 are actually in contact with each other, but are not in contact with each other for explanation.
  • the control device 70 In response to the arrival completion signal from the position control device 77, the control device 70 lowers the ultrasonic horn 10b along the vertical movement guide (not shown) using the load means 13, and moves the FPC1 and PCB3 to the ultrasonic horn 10b. Between the anvil 20 and the anvil 20 to apply pressure to the joint surface.
  • the load sensor 22 compares the load with a predetermined load and controls the load control device 72 so as to hold the predetermined load.
  • the ultrasonic transmitter 71 oscillates according to a command from the control device 70, and the ultrasonic horn 10 b is vibrated by the ultrasonic vibrator 12.
  • the FPC electrode 2 and the PCB electrode 4 are solid-phase metal bonded. This is the state of FIG.
  • the oscillation of the ultrasonic transmitter 71 is stopped by the instruction of the control device 70, and the excitation of the ultrasonic horn 10b by the ultrasonic vibrator 12 is stopped.
  • the ultrasonic horn 10b is raised along the vertical movement guide (not shown) using the load means 13 according to the command of the control device 70 after the vibration is stopped, and the first joining process is completed.
  • the FPC 1 and the PCB 3 bonded thereto are moved to the next bonding position.
  • the ultrasonic horn 10b is lowered in the same manner as described above, and a load is applied to the bonding surface to apply pressure. Further, the ultrasonic horn 10b is oscillated. By the oscillation of the ultrasonic horn 10b, the FPC electrode 2 and the PCB electrode 4 are solid-phase metal bonded. This is the state of FIG.
  • the vibration is performed for a predetermined time, and after the vibration of the ultrasonic horn 10b is stopped, the ultrasonic horn 10b is raised, and the joining process in the middle is completed.
  • the FPC 1 and the PCB 3 bonded thereto are moved to the final bonding position.
  • the ultrasonic horn 10b is lowered in the same manner as described above, and a pressure is applied to the joint surface while applying a load.
  • the resin is melted by heat transfer and radiation heat of the ultrasonic horn 10b heated by the ultrasonic horn heater 11, and the resin is discharged from between the FPC electrode 1 and the PCB electrode 4 by the bonding pressure.
  • the discharged resins are FPC1 and PCB3.
  • the gap between the FPC 1 and the PCB 3 is filled through the gap formed by the FPC electrode 2 and the PCB electrode 4. This is the state of FIG.
  • the ultrasonic horn 10b After pressurizing and heating for a predetermined time, the ultrasonic horn 10b is vibrated. Due to the oscillation of the ultrasonic horn 10b, the FPC electrode 2 and the PCB electrode 4 from which the resin has been discharged are solid-phase metal bonded. After performing the vibration for a predetermined time, the ultrasonic horn 10b is raised, and the final joining process is completed. Next, the FPC 1 and the PCB 3 joined thereto are moved to their original positions. In response to the movement completion signal from the position control device 77, the control device 70 stops the suction of the anvil 20, and releases the fixation of the FPC 1 and the PCB 3 joined thereto, thereby completing the bonding / joining process.
  • the resin is arranged in advance by printing and applying the resin to the FPC 1 or PCB 3a, or by attaching a film-like resin before joining, or by discharging the resin immediately before joining. There is a method of applying. Moreover, in the said Example, the method of lowering the ultrasonic horn 10 and the method of raising the anvil 20 conversely are the same in the effect of joining.
  • the load sensor 22 since the load sensor only controls the timing of starting the oscillation of the ultrasonic wave, the load sensor 22 is not an indispensable condition if a timing device such as a timer is combined with the load means 13 capable of holding a constant load. .
  • the resin is applied to the joint surface of the FPC 1 with a length of 1/3 of the joint length, and the FPC electrode 2 and the PCB at the joint portion.
  • FIG. 1 is a perspective view showing the configuration of the entire apparatus.
  • 10 is an ultrasonic horn that moves up and down along a vertical movement guide (not shown)
  • 13 is a vertical movement guide (not shown) that is fixed to the fixed point of the ultrasonic horn 10 with a screw or the like.
  • 11 is an ultrasonic horn heater fixed to the ultrasonic horn 10 with a screw or the like
  • 12 is an ultrasonic wave fixed to the ultrasonic horn 10 with a screw or the like. It is a vibrator.
  • 25 is a Y-axis stage fixed to the main body (not shown) with a screw
  • 24 is an X-axis stage fixed to the Y-axis stage with a screw
  • 23 is fixed to the X-axis stage with a screw.
  • a ⁇ -axis stage, 22 is a load sensor fixed to the ⁇ -axis stage with a screw or the like
  • 20 is an anvil fixed to the load sensor 20 with a screw or the like
  • 77 is a ⁇ -axis stage 23 and an X-axis stage 24.
  • a position control device for controlling the moving speed and position of the Y-axis stage 25.
  • FIG. 4 (b) is a perspective view showing the shape, load direction, and vibration direction of the convex blade-shaped three-row ultrasonic horn, as seen from the bottom, and 10c is a convex blade-shaped three-row supersonic horn. It is a sonic horn.
  • FIG. 14A is a front view showing a state before joining, in which a resin having a length of 1/3 of the joining length is disposed in the vicinity of the end face of the PCB on the joining surface of the PCB of the present embodiment.
  • FIG. 14B is a front view showing the middle of bonding / bonding
  • FIG. 14C is a front view showing the state after bonding / bonding.
  • 1a is an FPC substrate
  • 2 is an FPC electrode formed in advance on the FPC substrate 1a
  • 3a is a PCB substrate
  • 4 is a PCB electrode formed in advance on the PCB electrode
  • 5 is an FPC1 and PCB3.
  • a resin to be bonded is an FPC substrate.
  • FIG. 1 the resin 5 having about 1/3 of the joining length is placed in advance on the joining surface of the PCB 3 and in the vicinity of the end surface before joining.
  • the PCB electrode 4 of the PCB 3 is supplied onto the anvil 20 with the PCB electrode 4 facing upward.
  • the PCB 3 is suction-fixed to the anvil 20 with the PCB fixing suction hole 20a set to a negative pressure. Adsorbed and fixed to the anvil 20.
  • the FPC 1 and the PCB 3 are overlapped with the FPC electrode 2 facing downward. Under the control of the control device 70, the FPC 1 is sucked and fixed to the anvil 20 with the FPC fixing suction hole 20b set to a negative pressure.
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved in accordance with commands from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 and PCB 3 that are attracted and fixed to the anvil 20. Is moved to the first joining position directly below the ultrasonic horn 10b.
  • This is the state of FIG. 14A, but the figure illustrates the state in which the resin is arranged on the PCB 3 in advance. However, the anvil 20 is omitted.
  • the FPC electrode 2 and the resin 5 are actually in contact with each other, but are not in contact with each other for explanation.
  • the control device 70 In response to the arrival completion signal from the position control device 77, the control device 70 lowers the ultrasonic horn 10b along the vertical movement guide (not shown) using the load means 13, and moves the FPC1 and PCB3 to the ultrasonic horn 10b. Between the anvil 20 and the anvil 20 to apply pressure to the joint surface.
  • the load sensor 22 compares the load with a predetermined load and controls the load control device 72 so as to hold the predetermined load. This is the state of FIG.
  • the resin is melted by heat transfer and radiant heat of the ultrasonic horn 10b heated by the ultrasonic horn heater 11, and the resin is discharged from between the FPC electrode 1 and the PCB electrode 4 by the bonding pressure.
  • the discharged resins are FPC1 and PCB3. And fills the gap between the FPC 1 and the PCB 3 through the gap formed by the FPC electrode 2 and the PCB electrode 4 and is discharged from the end face side of the PCB 3 to form a fillet. This is the state of FIG.
  • the ultrasonic transmitter 71 oscillates according to a command from the control device 70, and the ultrasonic horn 10 c is vibrated by the ultrasonic vibrator 12. Due to the oscillation of the ultrasonic horn 10c, the FPC electrode 2 and the PCB electrode 4 from which the resin has been discharged are solid-phase metal bonded.
  • the oscillation of the ultrasonic transmitter 71 is stopped by a command from the control device 70, and the vibration of the ultrasonic horn 10c by the ultrasonic vibrator 12 is stopped. After the vibration is stopped, the ultrasonic horn 10c is raised along the vertical movement guide (not shown) using the load means 13 in accordance with a command from the control device 70.
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are respectively moved by a command from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 sucked and fixed to the anvil 20 and this And move the PCB 3 joined to the original position.
  • the control device 70 stops the suction of the anvil 20, and releases the fixation of the FPC 1 and the PCB 3 joined thereto, thereby completing the bonding / joining process.
  • the resin is arranged in advance by printing and applying the resin to the FPC 1 or PCB 3a, or by attaching a film-like resin before joining, or by discharging the resin immediately before joining. There is a method of applying. Moreover, in the said Example, the method of lowering the ultrasonic horn 10 and the method of raising the anvil 20 conversely are the same in the effect of joining.
  • the load sensor 22 since the load sensor only controls the timing of starting the oscillation of the ultrasonic wave, the load sensor 22 is not an indispensable condition if a timing device such as a timer is combined with the load means 13 capable of holding a constant load. .
  • the resin is applied to the joint surface of the FPC 1 with a length of 1/3 of the joint length, and the FPC electrode 2 and the PCB at the joint portion.
  • FIG. 1 is a perspective view showing the configuration of the entire apparatus.
  • 10 is an ultrasonic horn that moves up and down along a vertical movement guide (not shown)
  • 13 is a vertical movement guide (not shown) that is fixed to the fixed point of the ultrasonic horn 10 with a screw or the like.
  • 11 is an ultrasonic horn heater fixed to the ultrasonic horn 10 with a screw or the like
  • 12 is an ultrasonic wave fixed to the ultrasonic horn 10 with a screw or the like. It is a vibrator.
  • 25 is a Y-axis stage fixed to the main body (not shown) with a screw
  • 24 is an X-axis stage fixed to the Y-axis stage with a screw
  • 23 is fixed to the X-axis stage with a screw.
  • a ⁇ -axis stage, 22 is a load sensor fixed to the ⁇ -axis stage with a screw or the like
  • 20 is an anvil fixed to the load sensor 20 with a screw or the like
  • 77 is a ⁇ -axis stage 23 and an X-axis stage 24.
  • a position control device for controlling the moving speed and position of the Y-axis stage 25.
  • FIG. 4A is a perspective view showing the shape, load direction, and vibration direction of the convex blade-shaped single-row ultrasonic horn as viewed from the bottom, and 10b is a convex blade-shaped single row. It is a sonic horn.
  • FIG. 15A is a front view showing the state before joining, in which a resin having a length of about 1/3 of the joining surface is arranged in the vicinity of the end surface of the PCB
  • FIG. 15C is a front view showing a first stage of joining / bonding
  • FIG. 15C is a front view showing a stage in the middle of joining / bonding
  • FIG. 15D is a front view showing the last stage of joining / bonding.
  • 1a is an FPC substrate
  • 2 is an FPC electrode formed in advance on the FPC substrate 1a
  • 3a is a PCB substrate
  • 4 is a PCB electrode formed in advance on the PCB electrode
  • 5 is an FPC1 and PCB3.
  • the resin 5 is arranged in advance on the bonding surface of the PCB 3 before bonding and in the vicinity of the end surface.
  • the PCB electrode 4 of the PCB 3 is supplied onto the anvil 20 with the PCB electrode 4 facing upward.
  • the PCB 3 is suction-fixed to the anvil 20 with the PCB fixing suction hole 20a set to a negative pressure. Adsorbed and fixed to the anvil 20.
  • the FPC 1 and the PCB 3 are overlapped with the FPC electrode 2 facing downward. Under the control of the control device 70, the FPC 1 is sucked and fixed to the anvil 20 with the FPC fixing suction hole 20b set to a negative pressure.
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved in accordance with commands from the control device 70 to the position control device 77, that is, the anvil 20 and the FPC 1 and PCB 3 that are attracted and fixed to the anvil 20. Is moved to the first joining position directly below the ultrasonic horn 10b.
  • This is the state of FIG. 15A, but the figure illustrates the state in which the resin is arranged on the PCB 3 in advance. However, the anvil 20 is omitted.
  • the FPC electrode 2 and the resin 5 are actually in contact with each other, but are not in contact with each other for explanation.
  • the control device 70 In response to the arrival completion signal from the position control device 77, the control device 70 lowers the ultrasonic horn 10b along the vertical movement guide (not shown) using the load means 13, and moves the FPC1 and PCB3 to the ultrasonic horn 10b. Between the anvil 20 and the anvil 20 to apply pressure to the joint surface.
  • the load sensor 22 compares the load with a predetermined load and controls the load control device 72 so as to hold the predetermined load.
  • the ultrasonic transmitter 71 oscillates according to a command from the control device 70, and the ultrasonic horn 10 b is vibrated by the ultrasonic vibrator 12.
  • the FPC electrode 2 and the PCB electrode 4 are solid-phase metal bonded. This is the state of FIG.
  • the oscillation of the ultrasonic transmitter 71 is stopped by an instruction from the control device 70, and the excitation of the ultrasonic horn 10b by the ultrasonic vibrator 12 is stopped.
  • the ultrasonic horn 10b is raised along the vertical movement guide (not shown) using the load means 13 according to the command of the control device 70 after the vibration is stopped, and the first joining process is completed.
  • the FPC 1 and the PCB 3 bonded thereto are moved to the next bonding position.
  • the ultrasonic horn 10b is lowered in the same manner as described above, and a load is applied to the bonding surface to apply pressure. Further, the ultrasonic horn 10b is oscillated. By the oscillation of the ultrasonic horn 10b, the FPC electrode 2 and the PCB electrode 4 are solid-phase metal bonded. This is the state of FIG.
  • the vibration is performed for a predetermined time, and after the vibration of the ultrasonic horn 10b is stopped, the ultrasonic horn 10b is raised, and the joining process in the middle is completed. Next, the FPC 1 and the PCB 3 bonded thereto are moved to the final bonding position. When this movement is completed, the ultrasonic horn 10b is lowered in the same manner as described above, and a pressure is applied to the joint surface while applying a load.
  • the resin is melted by heat transfer and radiation heat of the ultrasonic horn 10b heated by the ultrasonic horn heater 11, and the resin is discharged from between the FPC electrode 1 and the PCB electrode 4 by the bonding pressure.
  • the discharged resin passes through a gap formed by the FPC1, PCB3, FPC electrode 2 and PCB electrode 4, fills the gap between the FPC1 and PCB3, and is discharged from the end face side of the PCB3 to form a fillet. This is the state of FIG.
  • the ultrasonic horn 10b After pressurizing and heating for a predetermined time, the ultrasonic horn 10b is vibrated. Due to the oscillation of the ultrasonic horn 10b, the FPC electrode 2 and the PCB electrode 4 from which the resin has been discharged are solid-phase metal bonded. After performing the vibration for a predetermined time, the ultrasonic horn 10b is raised, and the final joining process is completed. Next, the FPC 1 and the PCB 3 joined thereto are moved to their original positions. In response to the movement completion signal from the position control device 77, the control device 70 stops the suction of the anvil 20, and releases the fixation of the FPC 1 and the PCB 3 joined thereto, thereby completing the bonding / joining process.
  • the resin is arranged in advance by printing and applying the resin to the FPC 1 or PCB 3a, or by attaching a film-like resin before joining, or by discharging the resin immediately before joining. There is a method of applying. Moreover, in the said Example, the method of lowering the ultrasonic horn 10 and the method of raising the anvil 20 conversely are the same in the effect of joining.
  • the load sensor 22 since the load sensor only controls the timing of starting the oscillation of the ultrasonic wave, the load sensor 22 is not an indispensable condition if a timing device such as a timer is combined with the load means 13 capable of holding a constant load. .
  • FIG. 16 is a perspective view illustrating a state in which a resin is being applied after the FPC 1 and the PCB 3 are joined.
  • 1a is an FPC substrate
  • 2 is an FPC electrode
  • 3a is a PCB substrate
  • 4 is a PCB electrode
  • 5 is a liquid resin.
  • 25 is a Y-axis stage fixed to the main body (not shown) with screws
  • 24 is an X-axis stage fixed to the Y-axis stage with screws
  • 23 is screwed to the X-axis stage.
  • a fixed ⁇ -axis stage, 22 is a load sensor fixed to the ⁇ -axis stage with screws or the like
  • 20 is an anvil fixed to the load sensor 20 with screws or the like
  • 77 denotes a ⁇ -axis stage 23.
  • This is a position control device that controls the moving speed and position of the X-axis stage 24 and the Y-axis stage 25.
  • a syringe 31 is fixed to the syringe holding / up-and-down means 32 with a screw or the like, and a needle 30 is fixed to the syringe 31 with a screw or the like.
  • the tip of the needle 31 does not hinder the movement of the FPC 1 or PCB 3 on the anvil 20 or the anvil 20 in the movement region formed by the movement of the anvil 20 with the ⁇ -axis stage 23, the X-axis stage 24 and the Y-axis stage 25.
  • the ultrasonic horn 10 is disposed at a position that does not interfere with the joining and positioning / supply / removal steps.
  • 74 is a resin discharge control device that controls the amount of liquid discharged from the tip of the needle 32 by the liquid resin stored in the syringe 31.
  • the FPC 1 and PCB 3 after bonding which are adsorbed and fixed on the anvil 20 and moved together with the anvil 20, are the end faces of the FPC 1 provided in advance under the needle 30.
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved to a predetermined position (hereinafter referred to as a resin discharge start position) by the control of the position control device 77 according to a command from the control device 70.
  • a resin discharge start position a predetermined position
  • Position control device 77 sends a positioning completion signal to control device 70, and based on this signal, control device 70 lowers syringe holding / up and down means 32, syringe 31, and needle 30. However, at this time, the needle 30 is separated from the end face of the FPC 1 and the upper surface of the PCB 3 by a distance (0.1 mm or more) that does not prevent relative movement in the horizontal plane. Does not come into contact with FPC1 or PCB3.
  • the control device 70 sends a command to the resin discharge control device 74 and starts discharging the liquid resin stored in the syringe 31 from the tip of the needle 32. Further, when the discharge is started, a resin discharge in-process signal from the resin discharge control device 74 is sent to the control device 70. Based on this signal, the control device 70 is opposite to the resin discharge start position of the FPC 1 from the resin discharge start position.
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved to a predetermined position on the side (hereinafter referred to as a resin discharge end position) at a predetermined speed by the speed control of the position control device 77, and resin discharge is performed. When the end position is reached, the position control device 77 stops moving.
  • a positioning completion signal is sent to the control device 70, and based on this signal, the control device 70 sends a command to the resin discharge control device 74 and the liquid resin stored in the syringe 31 of the needle 32. Stops resin discharge from the tip.
  • a resin discharge stop completion signal is sent from the resin discharge control device 74 to the control device 70, and the control device 70 raises the syringe holding / up-and-down means 32 to a predetermined position.
  • the resin application process is completed.
  • the PCB electrode 4 of the PCB 3 faces up and is fixed to the anvil 20. If it is this apparatus configuration, it can be realized without adding a control device or a moving means if it is applied between the supply of the FPC 1 or after the positioning of the FPC 1 and the PCB 3. Moreover, in the said Example, the method of lowering the ultrasonic horn 10 and the method of raising the anvil 20 conversely are the same in the effect of joining.
  • the load sensor 22 since the load sensor only controls the timing of starting the oscillation of the ultrasonic wave, the load sensor 22 is not an indispensable condition if a timing device such as a timer is combined with the load means 13 capable of holding a constant load. .
  • the ultrasonic horn is worn or a resin or the like is attached to the ultrasonic horn. If it becomes dirty, it is applied to a polishing grindstone, a paper file, a wrap film or the like during the joining standby time, and the ultrasonic horn is vibrated to perform planar polishing or cleaning.
  • FIG.17 is a side view showing the position of the polishing grindstone immediately before and after the FPC 1 and PCB 3 are joined, that is, at the “joining position”.
  • FIG. 18 is a side view showing the position of the polishing wheel at the FPC 1 take-out / supply position, that is, the “standby position”.
  • 1 is an FPC
  • 2 is an FPC electrode
  • 3 is a PCB
  • 4 is a PCB electrode
  • 10 is an ultrasonic horn
  • 13 is a load means
  • 72 is a load control that controls the speed and load of the load means 13.
  • the apparatus, 20 is an anvil
  • 22 is a load sensor
  • 23 is a ⁇ -axis stage
  • 24 is an X-axis stage
  • 25 is a Y-axis stage
  • 77 is a position control device for controlling the moving speed and position thereof.
  • Reference numeral 50 is an FPC supply / holding means having means for adsorbing and fixing the FPC 1 and means for supplying the FPC 1 to the anvil 20, and is fixed to the main body (not shown) independent of the movement of the anvil 20 with a screw or the like.
  • Reference numeral 61 denotes a grinding wheel holding means that is fixed to the X-axis stage 24 with a screw or the like and moves together with the X-axis stage 24.
  • the polishing wheel holding means 61 is provided with a polishing load sensor (not shown), and the load is fed back to the load control device 70 during polishing.
  • Reference numeral 60 denotes a polishing wheel fixed to the polishing wheel holding means 61 with a screw or an adhesive.
  • the ultrasonic horn 10 After the ultrasonic horn 10 is lowered by the load means 13 during the above period, the ultrasonic horn 10 comes into contact with the grinding wheel 60, and it is detected that the grinding wheel load sensor (not shown) has reached a predetermined pressure.
  • the ultrasonic wave horn 10 is vibrated by oscillating the ultrasonic vibrator 12 while the load means 13 continues to apply a load under the control of the load control device 72 that maintains the load. After vibrating for a predetermined time, the oscillation of the ultrasonic vibrator 12 is stopped, the load of the load means 13 is removed, the ultrasonic horn 10 is raised to the original position, and the planar polishing is completed.
  • This polishing method according to the present invention can be completed within a series of time from take-out / supply / positioning, that is, “standby time”, so that productivity is not lowered.
  • the method of lowering the ultrasonic horn 10 and the method of raising the polishing wheel 60 by providing means for moving the polishing wheel holding means 61 in the vertical direction are the same in terms of the bonding effect. .
  • a method of changing the polishing position every time or several times by providing the polishing wheel holding means 61 with a moving means that moves in a horizontal plane is also conceivable. It is the same even if a paper file or a wrap film is used instead of the polishing grindstone 60. Further, a method of polishing the tip of the ultrasonic horn 10 by vibrating the moving means moving on the horizontal surface to the polishing grindstone holding means 61 without oscillating the ultrasonic horn 10 is also conceivable.
  • a tape-shaped paper file or wrap film is unwound and sent using a bobbin and a take-up bobbin each time on the grinding wheel holding means 61 at a constant pitch, and ultrasonic waves are sent to the sent paper file or wrap film.
  • a method of pressing the horn and then oscillating it can be considered.
  • the polishing amount is proportional to the polishing time. Therefore, if a timing device such as a timer is combined with a polishing wheel holding means 61 that can hold a constant load, a polishing wheel load sensor ( (No figure) is not an essential condition.
  • This embodiment is an embodiment according to claim 11 and claim 12 in which the FPC and the PCB are simply positioned in carrying out claims 1, 2, and 4.
  • this method uses the ⁇ -axis stage 23, the X-axis stage 24, the Y-axis stage 25 of FIG. 1 and their positioning control devices 77, the lens 40 of FIG. Since 41 and these image positioning control devices 75 are provided, the device configuration and control configuration are complicated.
  • the present invention is a non-contact system, there is no deformation due to the external force of the FPC 1, so positioning with high accuracy is possible. It can be performed.
  • this invention is a method suitable for the apparatus for automatic work which does not depend on an operator by manual work.
  • FIG. 1 is an FPC
  • 3 is a PCB
  • 25 is a Y-axis stage fixed to the main body (not shown) with screws
  • 24 is an X-axis stage fixed to the Y-axis stage with screws
  • 23 Is a ⁇ axis stage fixed to the X axis stage with screws
  • 22 is a load sensor fixed to the ⁇ axis stage with screws
  • 20 is an anvil fixed to the load sensor 20 with screws.
  • 77 is a position control device for controlling the moving speed and position of the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25.
  • FIG. 19 is a plan view of the FPC.
  • 1 is an FPC
  • 1a is an FPC substrate which is a substrate made of an insulating material of the FPC
  • 2 is an FPC electrode which is an electric circuit formed on the FPC substrate 1a
  • 6a is an FPC substrate.
  • FIG. 20 is a plan view of the PCB.
  • 3 is a PCB
  • 3a is a PCB substrate which is a substrate made of this PCB3 insulating material
  • 4 is a PCB electrode which is an electric circuit formed on the PCB substrate 3a
  • 7a is a PCB substrate.
  • FIG. 21 is a plan view showing a state in which the FPC 1 is overlaid on the PCB 3.
  • FIG. 22 is a perspective view showing an embodiment of the present invention, which is a part of FIG.
  • 20 is an anvil having means for adsorbing and fixing PCB3
  • 20a is an adsorbing hole for fixing PCB on the anvil
  • 20b is an adsorbing hole for fixing FPC on the anvil
  • 21 is for heating the anvil.
  • Anvil heater 1 is an FPC
  • 1a is an FPC base that is a base made of the insulating material of this FPC
  • 2 is an FPC electrode that is an electric circuit formed on the FPC base 1a
  • 6a is an FPC base 1a
  • 3 is a PCB
  • 3a is a PCB substrate made of an insulating material of this PCB3
  • 4 is an electric circuit formed on the PCB substrate 3a.
  • PCB electrodes 7a are two pairs of PCB alignment marks provided on the PCB substrate 3a.
  • 41a is a means for observing the PCB alignment mark 7a through the FPC alignment hole 6a.
  • a CCD camera 40a fixed to the main body (not shown) with a screw or the like independent of the movement of the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 in FIG.
  • 41b is a means for observing another PCB alignment mark 7a through another FPC alignment hole 6a, and is a CCD fixed to the main body (not shown) with a screw or the like.
  • a camera 40b is a lens fixed to the CCD camera 41b with a screw or the like.
  • Reference numeral 50 denotes an FPC supply / holding means having means for adsorbing and fixing the FPC 1 and means for supplying the FPC 1 to the anvil 20, and is fixed to the main body (not shown) with screws or the like.
  • the process at the time of implementing this invention is demonstrated using FIG. 1 and FIG.
  • the PCB 3 is suction-fixed to the anvil 20 with the PCB electrode 4 facing upward and the PCB 3 suction hole 20 a under a negative pressure under the control of the control device 70.
  • the FPC 1 is attracted and fixed to the FPC supply / holding means 50 with the FPC electrode 2 facing downward.
  • the FPC supply / holding means 50 moves to a predetermined position where the joint portion of the FPC 1 overlaps the joint portion of the PCB 3.
  • the PCB 3 and the FPC 1 are separated by a distance (about 0.1 mm) that does not hinder the relative movement in the horizontal plane, and the FPC 1 and the PCB 3 are not brought into contact by the relative movement in the horizontal plane.
  • FIG. 22 shows this state.
  • the image positioning control device 75 in FIG. 1 uses the CCD camera 41a to measure the mutual positional error between the FPC alignment hole 6a and the PCB alignment mark 7a from the upper surface of the FPC 1 through the lens 40a and through the FPC alignment hole 6a.
  • the CCD camera 41b is used to measure the mutual positional error of the PCB alignment mark 6a through the lens 40b and another FPC alignment hole 6a from the upper surface of the FPC 1 and also through the other FPC alignment hole 6a.
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved by the command of the position control device 78 of FIG. 1 so that these errors are within a predetermined error range, that is, the anvil 20 and its The PCB 3 that is sucked and fixed to the anvil 20 is moved for alignment.
  • the FPC holding / supplying unit 50 is lowered, and when the FPC holding / supplying unit 50 is lowered to a position where the FPC 1 and the PCB 3 come into contact with each other, the FPC 1 comes into contact with the step provided on the anvil 20 and The provided FPC fixing suction hole 20 is closed.
  • This embodiment is an embodiment according to claim 11 and claim 12 in which the FPC and the PCB are simply positioned in carrying out claims 1, 2, and 4.
  • this method is used for positioning the ⁇ -axis stage 23, the X-axis stage 24, the Y-axis stage 25 and their positioning control device 77 in FIG. 1, the lens 40, and the CCD camera 41 in FIG.
  • the image positioning control device 75 since it is necessary to provide the image positioning control device 75, the device configuration and the control configuration are complicated.
  • the apparatus configuration is further complicated as compared to the twelfth embodiment.
  • the lens 40 and the CCD camera 41 since there is no dimensional restriction by the lens 40 and the CCD camera 41, there is no restriction between the pitches of the FPC alignment holes 6a and the PCB alignment marks 7a.
  • the following embodiment 14 is a system in which the FPC positioning hole 6b and the positioning pin 20c are brought into contact with each other, since the present invention is a non-contact system, there is no deformation due to the external force of the FPC 1, so positioning can be performed with high accuracy. It can be carried out.
  • this invention is a method suitable for the apparatus for automatic work which does not depend on an operator by manual work.
  • FIG. 1 is an FPC
  • 3 is a PCB
  • 25 is a Y-axis stage fixed to the main body (not shown) with screws
  • 24 is an X-axis stage fixed to the Y-axis stage with screws
  • 23 Is a ⁇ axis stage fixed to the X axis stage with screws
  • 22 is a load sensor fixed to the ⁇ axis stage with screws
  • 20 is an anvil fixed to the load sensor 20 with screws.
  • 77 is a position control device for controlling the moving speed and position of the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25.
  • FIG. 19 is a plan view of the FPC.
  • 1 is an FPC substrate
  • 1a is an FPC substrate made of an insulating material of the FPC 1
  • 2 is an electric circuit formed on the FPC substrate 1a.
  • FPC electrodes 6a which are circuits are two pairs of FPC alignment holes provided in the FPC base material 1a.
  • 20 is a plan view of the PCB.
  • 3 is a PCB
  • 3a is a PCB substrate made of an insulating material of the PCB 3
  • 4 is an electric circuit formed on the PCB substrate 3a.
  • the PCB electrodes 7a are two pairs of PCB alignment marks provided on the PCB substrate 3a.
  • FIG. 21 is a plan view showing a state in which the FPC 1 is overlaid on the PCB 3.
  • FIG. 23 is a perspective view showing an embodiment of the present invention, excerpted from a part of FIG.
  • 20 is an anvil having means for adsorbing and fixing PCB 3
  • 20 b is an FPC fixing adsorbing hole provided in the anvil 20.
  • the CCD camera 40 having means (not shown) for moving between two pairs of alignment marks formed by the FPC alignment hole 6a and the PCB alignment mark 7a is fixed to the CCD camera 41 with screws or the like.
  • Reference numeral 50 denotes an FPC supply / holding means having means for adsorbing and fixing the FPC 1 and means for supplying the FPC 1 to the anvil 20, and is fixed to the main body (not shown) with screws or the like.
  • the process at the time of implementing this invention is demonstrated using FIG. 1 and FIG.
  • the PCB 3 is suction-fixed to the anvil 20 with the PCB electrode 4 facing upward and the PCB 3 suction hole 20 a under a negative pressure under the control of the control device 70.
  • the FPC 1 is attracted and fixed to the FPC supply / holding means 50 with the FPC electrode 2 facing downward.
  • the FPC supply / holding means 50 moves to a predetermined position where the joint portion of the FPC 1 overlaps the joint portion of the PCB 3.
  • FIG. 23 shows this state.
  • the image positioning control device 75 in FIG. 1 uses the CCD camera 41 to measure the mutual positional error between the FPC alignment hole 6a and the PCB alignment mark 7a from the upper surface of the FPC 1 through the lens 40 and through the FPC alignment hole 6a. To do. Next, the CCD camera 41 and the lens 40 fixed to the CCD camera 41 are moved to another FPC alignment hole 6a and a position for measuring the mutual position error of the PCB alignment mark 7a through the FPC alignment hole 6a. Measure.
  • the ⁇ -axis stage 23, the X-axis stage 24, and the Y-axis stage 25 are moved by the command of the position control device 78 of FIG. 1 so that these errors are within a predetermined error range, that is, the anvil 20 and its The PCB 3 that is sucked and fixed to the anvil 20 is moved for alignment.
  • the FPC holding / supplying unit 50 is lowered, and when the FPC holding / supplying unit 50 is lowered to a position where the FPC 1 and the PCB 3 come into contact with each other, the FPC 1 comes into contact with the step provided on the anvil 20 and The provided FPC fixing suction hole 20 is closed.
  • Suction is started from the FPC suction hole 20b provided in the anvil 20, and when the FPC suction sensor 76b confirms the suction of the FPC 1, the FPC 1 is fixed by the FPC holding / supplying means 50 and the FPC holding / supplying means 50 is raised. In addition, the CCD camera 41 and the lens 4 fixed thereto are returned to their original positions, and the positioning process is completed. After joining, since the FPC1 and PCB3 are joined and integrated, the suction of the FPC suction hole 20b provided in the anvil 20 is released simultaneously with the release of the PCB suction, and the suction fixing of the FPC1 and the PCB3 is released. This completes the removal process. A method of observing the alignment mark of the FPC 1 through the lens 40 provided on the anvil side from the PCB alignment hole provided in the PCB 3 with the CCD 41 is also conceivable.
  • This embodiment is an embodiment different from the above-described embodiments of claim 13 and claim 14 in which the FPC and the PCB are simply positioned when carrying out claims 1, 2, and 4.
  • the ⁇ -axis stage 23, the X-axis stage 24, the Y-axis stage 25 in FIG. 1 and the lenses 40 in FIG. 22 and FIG. Since it is not necessary to provide the CCD camera 41, the apparatus configuration is simplified and the cost of the apparatus is reduced.
  • FIG. 24 is a plan view of the FPC.
  • 1 is an FPC
  • 1a is an FPC base material which is a base material made of an insulating material of the FPC
  • 2 is an FPC electrode which is an electric circuit formed on the FPC base material 1a
  • 6b is an FPC base material.
  • FIG. 26 is a perspective view showing an embodiment of the present invention, which is a part extracted from FIG.
  • reference numeral 20 denotes an anvil
  • 20c denotes two pairs of positioning pins that are press-fitted and fixed to the anvil 20.
  • the PCB positioning hole 7b is inserted into the positioning pin 20c fixed to the anvil 20 with the PCB 3 facing the PCB electrode 4 upward.
  • the positioning step is completed by inserting the FPC 1 with the FPC electrode 2 facing down and the FPC positioning hole 6b into the positioning pin 20c fixed to the anvil 20 so that the joint portion overlaps the PCB 3. .
  • the FPC positioning hole 6b and the PCB positioning hole 7b are simultaneously removed from the positioning pin 20c, thereby completing the taking out process.
  • the present invention can be easily positioned, and is suitable for manual work by an operator.
  • the FPC positioning hole 7b is deformed by the positioning pin 20c when the FPC 1 is inserted, there is a risk that the positioning accuracy is lowered. Therefore, the FPC having an electrode pitch of about 0.3 mm is joined. This is a suitable method.
  • the number of FPC positioning holes 6b, PCB positioning holes 7b, and positioning pins 20c may be increased.
  • the positioning pin 20c may have a cylindrical shape or a prismatic shape.
  • a stepped pin having two or more different diameter portions, a thin diameter portion and a thick diameter portion, may be used.
  • the fixing method can be other than press-fitting, and may be fixed with a screw or the like instead of press-fitting.
  • means for moving the positioning pin 20c up and down relative to the anvil 20 is provided and the positioning pin 20c is submerged below the surface of the anvil 20, the joined PCB 3 and FPC 1 can be easily pulled out of the pin. Can do.
  • the FPC base material does not need to be a heat-resistant resin such as polyimide, and therefore a cheap resin such as PET can be used as the base material.
  • the electrode since the load is low, for example, if the electrode can be coated with gold, silver, aluminum or the like, it can be used for bonding to a film liquid crystal panel or touch panel whose base material is PET. Also, it can be used for bonding to a liquid crystal panel, plasma display, or organic EL whose base material is glass if the electrode can be coated with gold, silver, aluminum, or the like.
  • there is no three-dimensional part such as a connector at the joint it can be considered that it contributes to the realization of a wearable computer or the like in combination with the film liquid crystal, RFC, sheet switch or the like.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Alors que le poids, l'épaisseur et la taille d'un dispositif électronique portable sont réduits, un procédé classique pour lier une FPC à une carte de circuit au moyen d'un connecteur et/ou d'une soudure, ACF, NCF, etc., n'est pas raisonnable parce que le coût du composant est élevé, le nombre de processus de montage est grand, le temps de montage est long, la température de montage est élevée, la poussée de liaison est élevée, la résistance de liaison est grande, et la propriété de réparation est faible dans le procédé classique. L'opération de liaison pour un petit dispositif électronique mince et léger peut être réalisée à faible coût, avec un petit nombre de processus, en une courte période de temps, à faible température, à faible charge, à faible résistance, et avec une propriété de réparation élevée, parce qu'un cornet à ultrasons de chauffage d'une forme similaire à une pale projetée ayant une extrémité perpendiculaire à la direction de vibration et une section perpendiculaire à la surface de pression, est disposé de sorte que le cornet à ultrasons de chauffage soit mis en vibration dans une direction parallèle à la surface de liaison et à la direction d'électrode ; les électrodes de la FPC et le circuit sont liés au moyen d'un métal en recouvrant les électrodes avant de chauffer et de faire vibrer les électrodes tandis qu'une pression prédéterminée est appliquée verticalement à la surface de liaison ; et la FPC et la PCB sont liées au moyen d'une résine.
PCT/JP2010/051061 2010-01-27 2010-01-27 Procédé de liaison par ultrasons et dispositif de liaison par ultrasons WO2011092809A1 (fr)

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Cited By (6)

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Publication number Priority date Publication date Assignee Title
US20150136839A1 (en) * 2012-08-03 2015-05-21 Murata Manufacturing Co., Ltd. Method for manufacturing electronic device
TWI628023B (zh) * 2016-08-04 2018-07-01 日商東芝三菱電機產業系統股份有限公司 超音波接合用工具及超音波接合裝置
US10090223B2 (en) 2016-04-27 2018-10-02 Fuji Electric Co., Ltd. Semiconductor device and method of manufacturing same
CN108668464A (zh) * 2018-04-08 2018-10-16 深圳市比亚迪电子部品件有限公司 一种超薄软板与金属端子超声波焊接的方法及制品结构
JP2019005776A (ja) * 2017-06-22 2019-01-17 イーグル工業株式会社 超音波接合方法、超音波接合冶具及び接合構造
JP2019013959A (ja) * 2017-07-06 2019-01-31 イーグル工業株式会社 超音波接合治具、接合構造及び接合方法

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JP2001127425A (ja) * 1999-10-28 2001-05-11 Seiko Epson Corp 配線基板及びその接合方法、実装部品の実装及び接合方法、電子部品、回路基板並びに電子機器
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JP2006024590A (ja) * 2004-07-06 2006-01-26 Fujikura Ltd フレキシブル配線基板の端子部の超音波接合方法
WO2008018160A1 (fr) * 2006-08-07 2008-02-14 Nippon Avionics Co., Ltd. Procédé et appareil permettant de connecter des cartes de circuit imprimé
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JPS58215268A (ja) * 1982-06-09 1983-12-14 Hitachi Ltd 超音波半田付装置
JPH11121894A (ja) * 1997-08-12 1999-04-30 Optrex Corp 回路基板の接続構造
JP2001127425A (ja) * 1999-10-28 2001-05-11 Seiko Epson Corp 配線基板及びその接合方法、実装部品の実装及び接合方法、電子部品、回路基板並びに電子機器
JP2005072232A (ja) * 2003-08-25 2005-03-17 D D K Ltd フレキシブルプリント基板とハード基板との接続構造及び該接続構造に使用する押圧治具
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WO2008018160A1 (fr) * 2006-08-07 2008-02-14 Nippon Avionics Co., Ltd. Procédé et appareil permettant de connecter des cartes de circuit imprimé
JP2008066458A (ja) * 2006-09-06 2008-03-21 Fujikura Ltd 配線基板の接続構造

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150136839A1 (en) * 2012-08-03 2015-05-21 Murata Manufacturing Co., Ltd. Method for manufacturing electronic device
US10005150B2 (en) * 2012-08-03 2018-06-26 Murata Manufacturing Co., Ltd. Method for manufacturing electronic device
US10090223B2 (en) 2016-04-27 2018-10-02 Fuji Electric Co., Ltd. Semiconductor device and method of manufacturing same
TWI628023B (zh) * 2016-08-04 2018-07-01 日商東芝三菱電機產業系統股份有限公司 超音波接合用工具及超音波接合裝置
JP2019005776A (ja) * 2017-06-22 2019-01-17 イーグル工業株式会社 超音波接合方法、超音波接合冶具及び接合構造
JP2019013959A (ja) * 2017-07-06 2019-01-31 イーグル工業株式会社 超音波接合治具、接合構造及び接合方法
CN108668464A (zh) * 2018-04-08 2018-10-16 深圳市比亚迪电子部品件有限公司 一种超薄软板与金属端子超声波焊接的方法及制品结构

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