JP5334843B2 - 電子部品装着装置および電子部品装着方法 - Google Patents
電子部品装着装置および電子部品装着方法 Download PDFInfo
- Publication number
- JP5334843B2 JP5334843B2 JP2009513976A JP2009513976A JP5334843B2 JP 5334843 B2 JP5334843 B2 JP 5334843B2 JP 2009513976 A JP2009513976 A JP 2009513976A JP 2009513976 A JP2009513976 A JP 2009513976A JP 5334843 B2 JP5334843 B2 JP 5334843B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- ultrasonic
- tool
- wiring board
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Description
図1〜図10は本発明の実施の形態を示す。
さらに、上記の実施の形態1に示した何れかのツール3に加えて超音波ホーン2を図11または図12のように構成して電子部品4に作用する超音波振動の大きさを変更することもできる。
Claims (5)
- 超音波ホーンの長手方向の一端部に配置した超音波振動子から発生した超音波振動を、前記超音波ホーンおよび前記超音波ホーンに配置したツールを介して配線基板上の電子部品に伝達し、前記電子部品と前記配線基板とを接合させる電子部品装着装置において、
前記超音波振動子の中心軸を通り、かつ前記電子部品との接触面に対して垂直方向の前記ツールにおける中央部の断面の断面積が前記ツールの端部の断面積よりも大きくなるように設定し、前記超音波振動子の中心軸に対して平行な方向の前記接触面の中央部の長さが、前記ツールにおける前記電子部品との接触面の端部の長さより大きくなるように設定し、前記超音波振動子の中心軸方向に対して垂直な方向における超音波振動の差が、無くなるか、あるいは小さくなるようにした
電子部品装着装置。 - 前記ツールが前記超音波ホーンに対し着脱可能に取付けられる構造とした
請求項1に記載の電子部品装着装置。 - 前記超音波ホーンのノーダル部にて、前記超音波ホーンを支持する支持部材を有する
請求項1または請求項2に記載の電子部品装着装置。 - 前記配線基板を保持する配線基板保持部を有する
請求項1から請求項3の何れかに記載の電子部品装着装置。 - 請求項1〜4の何れかに記載の電子部品装着装置を用いて超音波を利用して電子部品を配線基板に装着する電子部品装着方法であって、
前記ツールに保持した前記電子部品に前記超音波振動子から超音波振動を付与する工程と、
前記ツールを介して、前記電子部品を前記配線基板に押圧する工程とを備えた
電子部品装着方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009513976A JP5334843B2 (ja) | 2007-04-27 | 2008-02-28 | 電子部品装着装置および電子部品装着方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007118211 | 2007-04-27 | ||
JP2007118211 | 2007-04-27 | ||
JP2009513976A JP5334843B2 (ja) | 2007-04-27 | 2008-02-28 | 電子部品装着装置および電子部品装着方法 |
PCT/JP2008/000374 WO2008139668A1 (ja) | 2007-04-27 | 2008-02-28 | 電子部品装着装置および電子部品装着方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2008139668A1 JPWO2008139668A1 (ja) | 2010-07-29 |
JP5334843B2 true JP5334843B2 (ja) | 2013-11-06 |
Family
ID=40001894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009513976A Expired - Fee Related JP5334843B2 (ja) | 2007-04-27 | 2008-02-28 | 電子部品装着装置および電子部品装着方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7850056B2 (ja) |
JP (1) | JP5334843B2 (ja) |
KR (1) | KR20100014316A (ja) |
CN (1) | CN101652845B (ja) |
TW (1) | TW200843574A (ja) |
WO (1) | WO2008139668A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5281550B2 (ja) | 2008-12-08 | 2013-09-04 | パナソニック株式会社 | ボンディングツール、電子部品装着装置、および電子部品装着方法 |
JP5491081B2 (ja) * | 2009-06-22 | 2014-05-14 | 株式会社アルテクス | 超音波振動金属接合用共振器 |
US8011559B2 (en) * | 2009-11-09 | 2011-09-06 | GM Global Technology Operations LLC | Active material-augmented vibration welding system and method of use |
KR101385803B1 (ko) * | 2010-05-20 | 2014-04-16 | 파나소닉 주식회사 | 본딩 툴, 전자부품 장착장치 및 본딩 툴의 제조방법 |
KR101613196B1 (ko) * | 2010-11-17 | 2016-04-19 | 한화테크윈 주식회사 | 플립칩 장착 방법 및 플립칩 장착기 |
US9074927B2 (en) * | 2012-10-16 | 2015-07-07 | Honeywell International Inc. | Methods for non-destructively evaluating a joined component |
WO2017141827A1 (ja) * | 2016-02-15 | 2017-08-24 | 本田技研工業株式会社 | 挟持装置及び溶接装置 |
US11517977B2 (en) * | 2017-09-15 | 2022-12-06 | Tech-Sonic, Inc. | Dual cam servo weld splicer |
JP2019102762A (ja) * | 2017-12-08 | 2019-06-24 | パナソニックIpマネジメント株式会社 | 接合装置、接合ツール及び接合ツールの製造方法 |
CN111566804B (zh) * | 2018-01-09 | 2023-10-24 | 库利克和索夫工业公司 | 包括夹持系统的焊线机的操作系统及方法 |
JP7214991B2 (ja) * | 2018-06-28 | 2023-01-31 | Tdk株式会社 | 超音波接合ヘッド、超音波接合装置および超音波接合方法 |
JP7177867B2 (ja) * | 2021-01-19 | 2022-11-24 | 本田技研工業株式会社 | 振動溶着装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60161775A (ja) * | 1984-02-01 | 1985-08-23 | 島田理化工業株式会社 | 共振体 |
JP2002141374A (ja) * | 2000-10-31 | 2002-05-17 | Matsushita Electric Ind Co Ltd | 電子部品のボンディング装置およびボンディングツール |
JP2004349655A (ja) * | 2003-05-26 | 2004-12-09 | Kaijo Corp | ボンディングヘッドおよびこれを備えたボンディング装置 |
JP2005311103A (ja) * | 2004-04-22 | 2005-11-04 | Matsushita Electric Ind Co Ltd | 部品接合装置および部品接合ツール |
JP2005322716A (ja) * | 2004-05-07 | 2005-11-17 | Matsushita Electric Ind Co Ltd | 部品接合装置および部品接合ツールならびに部品接合方法 |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3750926A (en) * | 1971-03-02 | 1973-08-07 | Hitachi Ltd | Vibration element for supersonic bonding |
US4131505A (en) * | 1977-12-12 | 1978-12-26 | Dukane Corporation | Ultra-sonic horn |
US4374697A (en) * | 1979-12-26 | 1983-02-22 | Toppan Printing Co., Ltd. | Container, and method and device for manufacturing the same |
US5096532A (en) * | 1990-01-10 | 1992-03-17 | Kimberly-Clark Corporation | Ultrasonic rotary horn |
US5057182A (en) * | 1990-01-19 | 1991-10-15 | Sonokinetics Group | Ultrasonic comb horn and methods for using same |
US5110403A (en) * | 1990-05-18 | 1992-05-05 | Kimberly-Clark Corporation | High efficiency ultrasonic rotary horn |
CA2122122A1 (en) * | 1991-10-28 | 1993-05-13 | Hrishikesh Choudhury | An ultrasonically welded plastic ribbon and apparatus and process for forming same |
US5606791A (en) * | 1993-09-17 | 1997-03-04 | Fougere; Richard J. | Method of making a slotless electric motor or transducer |
JPH091065A (ja) * | 1995-04-19 | 1997-01-07 | Ngk Spark Plug Co Ltd | 超音波ホーン |
US5868301A (en) * | 1996-04-10 | 1999-02-09 | Tessera, Inc. | Semiconductor inner lead bonding tool |
JPH1174315A (ja) | 1997-06-27 | 1999-03-16 | Toshiba Corp | ボンディング装置及びボンディング方法 |
JP3176580B2 (ja) * | 1998-04-09 | 2001-06-18 | 太陽誘電株式会社 | 電子部品の実装方法及び実装装置 |
JP3290632B2 (ja) * | 1999-01-06 | 2002-06-10 | 株式会社アルテクス | 超音波振動接合装置 |
US6651864B2 (en) * | 1999-02-25 | 2003-11-25 | Steven Frederick Reiber | Dissipative ceramic bonding tool tip |
JP2001034187A (ja) * | 1999-07-22 | 2001-02-09 | Nec Corp | 熱圧着装置および熱圧着方法 |
TW460345B (en) * | 1999-08-02 | 2001-10-21 | Arutekusu Kk | Joining device by ultrasonic vibration |
JP3373810B2 (ja) | 1999-08-02 | 2003-02-04 | 株式会社アルテクス | 超音波振動接合用超音波ホーン |
JP3487264B2 (ja) * | 2000-07-06 | 2004-01-13 | 松下電器産業株式会社 | 電子部品のボンディング装置 |
ATE328721T1 (de) * | 2001-04-21 | 2006-06-15 | Dynamit Nobel Kunststoff Gmbh | Sonotrode für eine ultraschall-schweissanlage |
US6523732B1 (en) * | 2001-10-10 | 2003-02-25 | Ford Global Technologies, Inc. | Ultrasonic welding apparatus |
SE524231C2 (sv) * | 2002-02-12 | 2004-07-13 | Tetra Laval Holdings & Finance | Ultraljudshorn |
JP3952959B2 (ja) * | 2002-02-25 | 2007-08-01 | 株式会社村田製作所 | 超音波ホーンおよびこの超音波ホーンを用いた超音波接合装置 |
US6840424B2 (en) * | 2002-10-08 | 2005-01-11 | Chien-Min Sung | Compression bonding tools and associated bonding methods |
JP3966217B2 (ja) * | 2003-04-23 | 2007-08-29 | 松下電器産業株式会社 | ボンディング装置およびボンディングツール |
JP3848637B2 (ja) | 2003-05-06 | 2006-11-22 | Esb株式会社 | 超音波接合装置 |
JP2005121350A (ja) * | 2003-05-29 | 2005-05-12 | Denso Corp | 熱交換器およびその製造方法 |
DE102004009048A1 (de) * | 2004-02-23 | 2005-09-08 | Schunk Ultraschalltechnik Gmbh | Werkzeug |
US7344620B2 (en) * | 2004-05-10 | 2008-03-18 | Bandelin Electronic Gmbh & Co. Kg | Ultrasonic sonotrode |
JP4264388B2 (ja) * | 2004-07-01 | 2009-05-13 | 富士通株式会社 | 半導体チップの接合方法および接合装置 |
US7377416B2 (en) * | 2004-10-01 | 2008-05-27 | Xerox Corporation | Ultrasonic welding horn for welding a seam in an imaging receptor belt |
JP4423166B2 (ja) * | 2004-10-29 | 2010-03-03 | 富士通株式会社 | 電子部品の超音波実装方法および超音波実装装置 |
JP2006135249A (ja) * | 2004-11-09 | 2006-05-25 | Fujitsu Ltd | 超音波実装方法およびこれに用いる超音波実装装置 |
JP4303673B2 (ja) * | 2004-11-30 | 2009-07-29 | 富士通株式会社 | 共振器、超音波ヘッド及びそれを用いた超音波接合装置 |
US20060163315A1 (en) * | 2005-01-27 | 2006-07-27 | Delsman Mark A | Ribbon bonding tool and process |
JP4583190B2 (ja) * | 2005-01-28 | 2010-11-17 | 富士通株式会社 | 共振器、超音波接合ヘッド及び超音波接合装置 |
US7757926B2 (en) * | 2006-02-28 | 2010-07-20 | Asm Assembly Automation Ltd | Transducer assembly for a bonding apparatus |
FR2904257B1 (fr) * | 2006-07-25 | 2010-04-02 | Sonimat | Dispositif de soudage a ultrasons |
-
2008
- 2008-02-28 WO PCT/JP2008/000374 patent/WO2008139668A1/ja active Application Filing
- 2008-02-28 JP JP2009513976A patent/JP5334843B2/ja not_active Expired - Fee Related
- 2008-02-28 US US12/532,741 patent/US7850056B2/en not_active Expired - Fee Related
- 2008-02-28 KR KR1020097014797A patent/KR20100014316A/ko active IP Right Grant
- 2008-02-28 CN CN2008800102544A patent/CN101652845B/zh not_active Expired - Fee Related
- 2008-04-25 TW TW097115170A patent/TW200843574A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60161775A (ja) * | 1984-02-01 | 1985-08-23 | 島田理化工業株式会社 | 共振体 |
JP2002141374A (ja) * | 2000-10-31 | 2002-05-17 | Matsushita Electric Ind Co Ltd | 電子部品のボンディング装置およびボンディングツール |
JP2004349655A (ja) * | 2003-05-26 | 2004-12-09 | Kaijo Corp | ボンディングヘッドおよびこれを備えたボンディング装置 |
JP2005311103A (ja) * | 2004-04-22 | 2005-11-04 | Matsushita Electric Ind Co Ltd | 部品接合装置および部品接合ツール |
JP2005322716A (ja) * | 2004-05-07 | 2005-11-17 | Matsushita Electric Ind Co Ltd | 部品接合装置および部品接合ツールならびに部品接合方法 |
Also Published As
Publication number | Publication date |
---|---|
TW200843574A (en) | 2008-11-01 |
KR20100014316A (ko) | 2010-02-10 |
CN101652845A (zh) | 2010-02-17 |
US20100065613A1 (en) | 2010-03-18 |
WO2008139668A1 (ja) | 2008-11-20 |
JPWO2008139668A1 (ja) | 2010-07-29 |
CN101652845B (zh) | 2012-02-01 |
US7850056B2 (en) | 2010-12-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5334843B2 (ja) | 電子部品装着装置および電子部品装着方法 | |
JP5313751B2 (ja) | 電子部品装着装置 | |
TWI548012B (zh) | 接合半導體元件的系統及方法 | |
JP2004134445A (ja) | 上部電極、パワーモジュール、および上部電極のはんだ付け方法 | |
JP3438711B2 (ja) | 圧電デバイス及びその製造方法 | |
JP2008085149A (ja) | 半導体装置およびその配線接合方法,摩擦攪拌接合装置 | |
JP4210269B2 (ja) | 超音波フリップチップ実装装置 | |
JP4917957B2 (ja) | 超音波接合装置および電子部品の接合方法 | |
JP5506899B1 (ja) | 超音波接合方法及び超音波接合装置 | |
JP4491321B2 (ja) | 超音波実装方法およびこれに用いる超音波実装装置 | |
JP2006128487A (ja) | 電子部品の超音波実装方法および超音波実装装置 | |
JP2009302326A (ja) | 部品の接合装置及び接合方法 | |
JP2005230845A (ja) | 超音波接合装置および電子デバイスの製造方法 | |
JP4337042B2 (ja) | 接合方法 | |
JP3560584B2 (ja) | 超音波接合装置 | |
JPH07183339A (ja) | 電子部品実装基板および電子部品実装方法 | |
JP2006286796A (ja) | 実装方法 | |
JP2010161159A (ja) | ベアチップのダイボンド方法及びベアチップ実装部品 | |
JP3374853B2 (ja) | 電子部品のボンディングツール | |
JP3374854B2 (ja) | 電子部品のボンディングツール | |
JP2006269539A (ja) | 電子部品の製造方法および電子部品の製造装置 | |
JP2002368409A (ja) | 部品リワーク方法 | |
JP2004303952A (ja) | 接合方法および接合装置 | |
JP2004207589A (ja) | 電子部品実装方法と基板及び回路基板 | |
JPH09283568A (ja) | 電子部品の接続方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20101124 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130508 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130604 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130702 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130730 |
|
LAPS | Cancellation because of no payment of annual fees |