USD879046S1 - Material having edging - Google Patents
Material having edging Download PDFInfo
- Publication number
- USD879046S1 USD879046S1 US29/621,364 US201729621364F USD879046S US D879046 S1 USD879046 S1 US D879046S1 US 201729621364 F US201729621364 F US 201729621364F US D879046 S USD879046 S US D879046S
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- US
- United States
- Prior art keywords
- edging
- view
- side plan
- edging shown
- perspective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines in FIGS. 1-14 illustrate portions of the material having edging that form no part of the claimed design.
Claims (1)
- The ornamental design for a material having edging, as shown and described.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/621,364 USD879046S1 (en) | 2017-10-06 | 2017-10-06 | Material having edging |
US29/728,991 USD999405S1 (en) | 2017-10-06 | 2020-03-23 | Material having edging |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/621,364 USD879046S1 (en) | 2017-10-06 | 2017-10-06 | Material having edging |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/728,991 Continuation-In-Part USD999405S1 (en) | 2017-10-06 | 2020-03-23 | Material having edging |
Publications (1)
Publication Number | Publication Date |
---|---|
USD879046S1 true USD879046S1 (en) | 2020-03-24 |
Family
ID=69806999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/621,364 Active USD879046S1 (en) | 2017-10-06 | 2017-10-06 | Material having edging |
Country Status (1)
Country | Link |
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US (1) | USD879046S1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11731224B2 (en) | 2018-04-28 | 2023-08-22 | Laird Technologies, Inc. | Systems and methods of applying materials to components |
USD998827S1 (en) * | 2017-10-06 | 2023-09-12 | Laird Technologies, Inc. | Material having edge shape |
USD999405S1 (en) * | 2017-10-06 | 2023-09-19 | Laird Technologies, Inc. | Material having edging |
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KR100827725B1 (en) | 2007-05-02 | 2008-05-08 | 티티엠주식회사 | Pcm attachment method and automatic machine thereof |
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USD644757S1 (en) * | 2009-10-06 | 2011-09-06 | Elematic Group Oy | Chamfer strip |
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US8445102B2 (en) | 2007-11-05 | 2013-05-21 | Laird Technologies, Inc. | Thermal interface material with thin transfer film or metallization |
US8545987B2 (en) | 2007-11-05 | 2013-10-01 | Laird Technologies, Inc. | Thermal interface material with thin transfer film or metallization |
EP2814057A2 (en) | 2013-06-14 | 2014-12-17 | Laird Technologies, Inc. | Methods for establishing thermal joints between heat spreaders or lids and heat sources |
US8916419B2 (en) | 2012-03-29 | 2014-12-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lid attach process and apparatus for fabrication of semiconductor packages |
US8920919B2 (en) | 2012-09-24 | 2014-12-30 | Intel Corporation | Thermal interface material composition including polymeric matrix and carbon filler |
US9016629B1 (en) * | 2011-11-28 | 2015-04-28 | The Boeing Company | Combined pressure and thermal window system for space vehicles |
USD731078S1 (en) * | 2013-07-25 | 2015-06-02 | Chad Marcus Frenette | Transition strip |
USD734732S1 (en) * | 2013-07-10 | 2015-07-21 | Sumitomo Electric Fine Polymer, Inc. | Circuit board material |
US9257364B2 (en) | 2012-06-27 | 2016-02-09 | Intel Corporation | Integrated heat spreader that maximizes heat transfer from a multi-chip package |
US9316447B2 (en) | 2012-03-22 | 2016-04-19 | Koninklijke Philips N.V. | Thermal interface material |
US9330998B2 (en) | 2014-04-18 | 2016-05-03 | Laird Technologies, Inc. | Thermal interface material assemblies and related methods |
US20160160104A1 (en) | 2010-02-23 | 2016-06-09 | Laird Technologies, Inc. | Thermal interface materials including thermally reversible gels |
US20160185074A1 (en) | 2013-08-12 | 2016-06-30 | Seiji Kagawa | Heat-dissipating film, and its production method and apparatus |
US9418912B2 (en) | 2012-12-21 | 2016-08-16 | Intel Corporation | Methods of forming serpentine thermal interface material and structures formed thereby |
US9472485B2 (en) | 2012-08-29 | 2016-10-18 | Broadcom Corporation | Hybrid thermal interface material for IC packages with integrated heat spreader |
US20160315030A1 (en) | 2015-04-24 | 2016-10-27 | Laird Technologies, Inc. | Reusable thermoplastic thermal interface materials and methods for establishing thermal joints between heat sources and heat dissipating/removal structures |
US20160326419A1 (en) | 2013-12-31 | 2016-11-10 | The Regents Of The University Of California | Thermal interface materials with alligned fillers |
WO2016182996A1 (en) | 2015-05-11 | 2016-11-17 | Laird Technologies, Inc. | Board level shields with adjustable covers |
US20160355249A1 (en) * | 2015-06-05 | 2016-12-08 | Airbus Helicopters Deutschland GmbH | Jettisonable emergency exit for a vehicle |
US20160362169A1 (en) * | 2015-06-09 | 2016-12-15 | Gentex Corporation | Multi-piece bezel for electro-optic window assembly |
USD807531S1 (en) * | 2014-01-21 | 2018-01-09 | Yuseal Limited | Flexible seal |
USD862404S1 (en) * | 2016-10-25 | 2019-10-08 | Kokusai Electric Corporation | Sealing material ring for a semiconductor manufacturing apparatus |
-
2017
- 2017-10-06 US US29/621,364 patent/USD879046S1/en active Active
Patent Citations (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4199490A (en) | 1974-05-07 | 1980-04-22 | Asahi Kasei Kogyo Kabushiki Kaisha | Block copolymer latex composition |
US4058537A (en) | 1976-01-05 | 1977-11-15 | Ciba-Geigy Corporation | Esters of anhydride aromatic polycarboxylic acids with perfluoroalkyl alcohols |
US4678115A (en) | 1985-04-15 | 1987-07-07 | Ontario Technologies Corporation | Method for making layered foil structure |
US4863551A (en) | 1987-08-10 | 1989-09-05 | Yoshido Kogyo K.K. | Marking apparatus |
USD348387S (en) * | 1990-09-21 | 1994-07-05 | The Serco Corporation | Loading dock seal |
USD344489S (en) * | 1991-11-04 | 1994-02-22 | Texstar, Inc. | Fairing seal for aircraft canopy |
US5700340A (en) | 1993-10-22 | 1997-12-23 | Ykk Corporation | Method of manufacturing a tape having a succession of surface-type fastener pieces |
WO1997041599A1 (en) | 1996-04-29 | 1997-11-06 | Parker-Hannifin Corporation | Conformal thermal interface material for electronic components |
US5943557A (en) | 1996-09-25 | 1999-08-24 | Micron Technology, Inc. | Method and structure for attaching a semiconductor die to a lead frame |
US6391686B1 (en) | 1999-06-14 | 2002-05-21 | Seiko Epson Corporation | Adhesive material applying method and apparatus, interconnect substrate, semiconductor device and manufacturing method thereof, circuit board and electronic instrument |
US7004244B2 (en) | 2001-06-07 | 2006-02-28 | Henkel Corporation | Thermal interface wafer and method of making and using the same |
US20030037866A1 (en) | 2001-08-22 | 2003-02-27 | Shin-Etsu Chemical Co., Ltd. | Method of bonding a heat radiating sheet |
US20030234322A1 (en) * | 2002-06-25 | 2003-12-25 | Ralph Bladt | Aircraft windows and associated methods for installation |
US20040180474A1 (en) | 2003-03-10 | 2004-09-16 | Oman Todd P. | Electronic assembly having electrically-isolated heat-conductive structure and method therefor |
US20040188814A1 (en) | 2003-03-31 | 2004-09-30 | Intel Corporation | Heat sink with preattached thermal interface material and method of making same |
US7821126B2 (en) | 2003-03-31 | 2010-10-26 | Intel Corporation | Heat sink with preattached thermal interface material and method of making same |
US7229683B2 (en) | 2003-05-30 | 2007-06-12 | 3M Innovative Properties Company | Thermal interface materials and method of making thermal interface materials |
US20040262743A1 (en) | 2003-06-26 | 2004-12-30 | Intel Corporation | Thermal interface structure with integrated liquid cooling and methods |
US20040262372A1 (en) | 2003-06-26 | 2004-12-30 | Intel Corporation | Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same |
US6987671B2 (en) | 2003-06-26 | 2006-01-17 | Intel Corporation | Composite thermal interface devices and methods for integrated circuit heat transfer |
US20040261980A1 (en) | 2003-06-30 | 2004-12-30 | Dani Ashay A. | Heat dissipating device with preselected designed interface for thermal interface materials |
JP2005327923A (en) | 2004-05-14 | 2005-11-24 | Alps Electric Co Ltd | Method and device of sticking conductive joint film |
US20070193672A1 (en) | 2006-02-22 | 2007-08-23 | Nitto Denko Corporation | Method for affixing adhesive tape to semiconductor wafer, and apparatus using the same |
KR100827725B1 (en) | 2007-05-02 | 2008-05-08 | 티티엠주식회사 | Pcm attachment method and automatic machine thereof |
US8445102B2 (en) | 2007-11-05 | 2013-05-21 | Laird Technologies, Inc. | Thermal interface material with thin transfer film or metallization |
US8545987B2 (en) | 2007-11-05 | 2013-10-01 | Laird Technologies, Inc. | Thermal interface material with thin transfer film or metallization |
US7906845B1 (en) | 2008-04-23 | 2011-03-15 | Amkor Technology, Inc. | Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor |
USD644757S1 (en) * | 2009-10-06 | 2011-09-06 | Elematic Group Oy | Chamfer strip |
US20160160104A1 (en) | 2010-02-23 | 2016-06-09 | Laird Technologies, Inc. | Thermal interface materials including thermally reversible gels |
JP2012084688A (en) | 2010-10-12 | 2012-04-26 | Nitto Denko Corp | Method of pasting double-sided adhesive tape, and device of pasting double-sided adhesive tape |
US9016629B1 (en) * | 2011-11-28 | 2015-04-28 | The Boeing Company | Combined pressure and thermal window system for space vehicles |
US9316447B2 (en) | 2012-03-22 | 2016-04-19 | Koninklijke Philips N.V. | Thermal interface material |
US8916419B2 (en) | 2012-03-29 | 2014-12-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lid attach process and apparatus for fabrication of semiconductor packages |
US9257364B2 (en) | 2012-06-27 | 2016-02-09 | Intel Corporation | Integrated heat spreader that maximizes heat transfer from a multi-chip package |
US9472485B2 (en) | 2012-08-29 | 2016-10-18 | Broadcom Corporation | Hybrid thermal interface material for IC packages with integrated heat spreader |
US8920919B2 (en) | 2012-09-24 | 2014-12-30 | Intel Corporation | Thermal interface material composition including polymeric matrix and carbon filler |
US9418912B2 (en) | 2012-12-21 | 2016-08-16 | Intel Corporation | Methods of forming serpentine thermal interface material and structures formed thereby |
EP2814057A2 (en) | 2013-06-14 | 2014-12-17 | Laird Technologies, Inc. | Methods for establishing thermal joints between heat spreaders or lids and heat sources |
US20140367847A1 (en) | 2013-06-14 | 2014-12-18 | Laird Technologies, Inc. | Methods for establishing thermal joints between heat spreaders or lids and heat sources |
USD734732S1 (en) * | 2013-07-10 | 2015-07-21 | Sumitomo Electric Fine Polymer, Inc. | Circuit board material |
USD731078S1 (en) * | 2013-07-25 | 2015-06-02 | Chad Marcus Frenette | Transition strip |
US20160185074A1 (en) | 2013-08-12 | 2016-06-30 | Seiji Kagawa | Heat-dissipating film, and its production method and apparatus |
US20160326419A1 (en) | 2013-12-31 | 2016-11-10 | The Regents Of The University Of California | Thermal interface materials with alligned fillers |
USD807531S1 (en) * | 2014-01-21 | 2018-01-09 | Yuseal Limited | Flexible seal |
US9330998B2 (en) | 2014-04-18 | 2016-05-03 | Laird Technologies, Inc. | Thermal interface material assemblies and related methods |
US20160315030A1 (en) | 2015-04-24 | 2016-10-27 | Laird Technologies, Inc. | Reusable thermoplastic thermal interface materials and methods for establishing thermal joints between heat sources and heat dissipating/removal structures |
WO2016182996A1 (en) | 2015-05-11 | 2016-11-17 | Laird Technologies, Inc. | Board level shields with adjustable covers |
US20160355249A1 (en) * | 2015-06-05 | 2016-12-08 | Airbus Helicopters Deutschland GmbH | Jettisonable emergency exit for a vehicle |
US20160362169A1 (en) * | 2015-06-09 | 2016-12-15 | Gentex Corporation | Multi-piece bezel for electro-optic window assembly |
USD862404S1 (en) * | 2016-10-25 | 2019-10-08 | Kokusai Electric Corporation | Sealing material ring for a semiconductor manufacturing apparatus |
Non-Patent Citations (11)
Title |
---|
Basics of Processing for Fabricated Films and Pads-Dow Corning; Thermal Interface-Wet Dispensed; http://www.dowcorning.com/content/etronics/etronicswet/newtim_tutoria113.asp> accessed Jul. 11, 2016; 1 page. |
Basics of Processing for Fabricated Films and Pads—Dow Corning; Thermal Interface—Wet Dispensed; http://www.dowcorning.com/content/etronics/etronicswet/newtim_tutoria113.asp> accessed Jul. 11, 2016; 1 page. |
European Search Report for EP17178138.8 filed Jun. 27, 2017 which names 2 of the same inventors but is not related through a priority claim, dated Dec. 13, 2017, 6 pages. |
Final Office Action for U.S. Appl. No. 15/207,444, filed Jul. 11, 2016 which names two of the same inventors, and the same assignee, but is not related through a priority claim, dated Apr. 19, 2019, 13 pages. |
Hirschi, David; Dow Corning Case Study; Understanding Differences Between Thermal Interface Materials: Improve your ability to specify the optimum TIM; Copyright 2008, 4 pages. |
Korean Office Action dated Oct. 22, 2018 issued in Application No. 10-2017-0085269 which has an inventor and assignee in common with the instant application but is not related through a priority claim, 15 pages. An English language translation of the Korean Office Action is not available at this time. |
Non-Final Office Action dated Sep. 24, 2018 issued by the United States Patent and Trademark Office for U.S. Appl. No. 15/207,444 which has an inventor and assignee in common with the instant application but is not related through a priority claim, 12 pages. |
Packaging and Storage Considerations-Dow Corning; <http://www.dowcorning.com/content/etronics/etronicswet/newtim_tutorial14.asp> accessed Jul. 11, 2016. |
Packaging and Storage Considerations—Dow Corning; <http://www.dowcorning.com/content/etronics/etronicswet/newtim_tutorial14.asp> accessed Jul. 11, 2016. |
Types of Fabricated Films and Pad Thermal Interface Materials-Dow Corning; Thermal Interface-Wet Dispensed; <http://www.dowcorning.com/content/etronics/etronicswet/newtim_tutorial5.asp>; accessed Jul. 11, 2016. |
Types of Fabricated Films and Pad Thermal Interface Materials—Dow Corning; Thermal Interface—Wet Dispensed; <http://www.dowcorning.com/content/etronics/etronicswet/newtim_tutorial5.asp>; accessed Jul. 11, 2016. |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD998827S1 (en) * | 2017-10-06 | 2023-09-12 | Laird Technologies, Inc. | Material having edge shape |
USD999405S1 (en) * | 2017-10-06 | 2023-09-19 | Laird Technologies, Inc. | Material having edging |
US11731224B2 (en) | 2018-04-28 | 2023-08-22 | Laird Technologies, Inc. | Systems and methods of applying materials to components |
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |