USD999405S1 - Material having edging - Google Patents

Material having edging Download PDF

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Publication number
USD999405S1
USD999405S1 US29/728,991 US202029728991F USD999405S US D999405 S1 USD999405 S1 US D999405S1 US 202029728991 F US202029728991 F US 202029728991F US D999405 S USD999405 S US D999405S
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US
United States
Prior art keywords
edging
view
design
side plan
break
Prior art date
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Active
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US29/728,991
Inventor
Michael S. WLADYKA
Keith David JOHNSON
Jason L. Strader
Mark D. Kittel
Jingting YANG
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Laird Technologies Inc
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Laird Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US29/621,364 external-priority patent/USD879046S1/en
Application filed by Laird Technologies Inc filed Critical Laird Technologies Inc
Priority to US29/728,991 priority Critical patent/USD999405S1/en
Assigned to LAIRD TECHNOLOGIES, INC. reassignment LAIRD TECHNOLOGIES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: STRADER, JASON L., KITTEL, MARK D., YANG, JINGTING, JOHNSON, KEITH DAVID, WLADYKA, MICHAEL S.
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FIG. 1 is a perspective view of a material having edging showing our new design;
FIG. 2 is a cross-sectional perspective view of the material having edging, taken along lines 2-2 in FIG. 1 ;
FIG. 3 is a top plan view of the material having edging shown in FIG. 1 ;
FIG. 4 is a front elevation view of the material having edging shown in FIG. 1 ;
FIG. 5 is a rear elevation view of the material having edging shown in FIG. 1 ;
FIG. 6 is a right side plan view of the material having edging shown in FIG. 1 ; and,
FIG. 7 is a left side plan view of the material having edging shown in FIG. 1 .
The evenly spaced broken lines in FIGS. 1 through 7 represent portions of the material having edging and form no part of the claimed design. The material having edging is shown with a symbolic break in its length and width. The appearance of any portion of the material having edging between the break lines forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a material having edging, as shown and described.
US29/728,991 2017-10-06 2020-03-23 Material having edging Active USD999405S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/728,991 USD999405S1 (en) 2017-10-06 2020-03-23 Material having edging

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/621,364 USD879046S1 (en) 2017-10-06 2017-10-06 Material having edging
US29/728,991 USD999405S1 (en) 2017-10-06 2020-03-23 Material having edging

Related Parent Applications (1)

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US29/621,364 Continuation-In-Part USD879046S1 (en) 2017-10-06 2017-10-06 Material having edging

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USD999405S1 true USD999405S1 (en) 2023-09-19

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US29/728,991 Active USD999405S1 (en) 2017-10-06 2020-03-23 Material having edging

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Citations (66)

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US20050236107A1 (en) 2004-04-21 2005-10-27 Nitto Denko Corporation Method of thermal adherend release and apparatus for thermal adherend release
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US20060021710A1 (en) 2004-07-29 2006-02-02 Towa Corporation Die bonding apparatus
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US7229683B2 (en) 2003-05-30 2007-06-12 3M Innovative Properties Company Thermal interface materials and method of making thermal interface materials
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JP2009277935A (en) 2008-04-16 2009-11-26 Sealex Corp Metal image formation method and metal image formation film
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US9016629B1 (en) 2011-11-28 2015-04-28 The Boeing Company Combined pressure and thermal window system for space vehicles
USD731078S1 (en) 2013-07-25 2015-06-02 Chad Marcus Frenette Transition strip
USD734732S1 (en) * 2013-07-10 2015-07-21 Sumitomo Electric Fine Polymer, Inc. Circuit board material
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US20160326419A1 (en) 2013-12-31 2016-11-10 The Regents Of The University Of California Thermal interface materials with alligned fillers
US20160355249A1 (en) 2015-06-05 2016-12-08 Airbus Helicopters Deutschland GmbH Jettisonable emergency exit for a vehicle
US20160362169A1 (en) 2015-06-09 2016-12-15 Gentex Corporation Multi-piece bezel for electro-optic window assembly
USD779997S1 (en) * 2015-11-16 2017-02-28 ClearSite, LLC Bracelet
USD807531S1 (en) 2014-01-21 2018-01-09 Yuseal Limited Flexible seal
USD862404S1 (en) * 2016-10-25 2019-10-08 Kokusai Electric Corporation Sealing material ring for a semiconductor manufacturing apparatus
USD879046S1 (en) * 2017-10-06 2020-03-24 Laird Technologies, Inc. Material having edging
USD881822S1 (en) * 2017-10-06 2020-04-21 Laird Technologies, Inc. Material having an edge shape
USD895623S1 (en) * 2018-10-05 2020-09-08 Laird Technologies, Inc. Frame for shielding assembly
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD917028S1 (en) * 2018-07-10 2021-04-20 Valqua, Ltd. Seal

Patent Citations (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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US4199490A (en) 1974-05-07 1980-04-22 Asahi Kasei Kogyo Kabushiki Kaisha Block copolymer latex composition
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US4732631A (en) 1985-07-19 1988-03-22 Yoshida Kogyo K.K. Method of manufacturing a tape having a series of surface-type fastener pieces
US4863551A (en) 1987-08-10 1989-09-05 Yoshido Kogyo K.K. Marking apparatus
US4872258A (en) 1988-09-22 1989-10-10 Universal Instruments Corporation Pick and place method and apparatus
USD348387S (en) 1990-09-21 1994-07-05 The Serco Corporation Loading dock seal
USD344489S (en) 1991-11-04 1994-02-22 Texstar, Inc. Fairing seal for aircraft canopy
US5700340A (en) 1993-10-22 1997-12-23 Ykk Corporation Method of manufacturing a tape having a succession of surface-type fastener pieces
US5943557A (en) 1996-09-25 1999-08-24 Micron Technology, Inc. Method and structure for attaching a semiconductor die to a lead frame
US6294729B1 (en) * 1997-10-31 2001-09-25 Laird Technologies Clad polymer EMI shield
US6566763B2 (en) 1999-06-14 2003-05-20 Seiko Epson Corporation Interconnect substrate, apparatus of applying adhesive material, semiconductor device, circuit board and electronic instrument
US6391686B1 (en) 1999-06-14 2002-05-21 Seiko Epson Corporation Adhesive material applying method and apparatus, interconnect substrate, semiconductor device and manufacturing method thereof, circuit board and electronic instrument
US7004244B2 (en) 2001-06-07 2006-02-28 Henkel Corporation Thermal interface wafer and method of making and using the same
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US20030234322A1 (en) 2002-06-25 2003-12-25 Ralph Bladt Aircraft windows and associated methods for installation
US20040180474A1 (en) 2003-03-10 2004-09-16 Oman Todd P. Electronic assembly having electrically-isolated heat-conductive structure and method therefor
US20040188814A1 (en) 2003-03-31 2004-09-30 Intel Corporation Heat sink with preattached thermal interface material and method of making same
US7821126B2 (en) 2003-03-31 2010-10-26 Intel Corporation Heat sink with preattached thermal interface material and method of making same
US7229683B2 (en) 2003-05-30 2007-06-12 3M Innovative Properties Company Thermal interface materials and method of making thermal interface materials
US20040262743A1 (en) 2003-06-26 2004-12-30 Intel Corporation Thermal interface structure with integrated liquid cooling and methods
US6987671B2 (en) 2003-06-26 2006-01-17 Intel Corporation Composite thermal interface devices and methods for integrated circuit heat transfer
US20040262372A1 (en) 2003-06-26 2004-12-30 Intel Corporation Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
US20040261980A1 (en) 2003-06-30 2004-12-30 Dani Ashay A. Heat dissipating device with preselected designed interface for thermal interface materials
US20050236107A1 (en) 2004-04-21 2005-10-27 Nitto Denko Corporation Method of thermal adherend release and apparatus for thermal adherend release
US20050264677A1 (en) 2004-06-01 2005-12-01 Sharp Kabushiki Kaisha Solid-state imaging device, semiconductor wafer and camera module
US20060021710A1 (en) 2004-07-29 2006-02-02 Towa Corporation Die bonding apparatus
US20090223638A1 (en) 2005-07-07 2009-09-10 Hideaki Nonaka Sheet sticking apparatus
US20070193672A1 (en) 2006-02-22 2007-08-23 Nitto Denko Corporation Method for affixing adhesive tape to semiconductor wafer, and apparatus using the same
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JP2009277935A (en) 2008-04-16 2009-11-26 Sealex Corp Metal image formation method and metal image formation film
US20090263938A1 (en) 2008-04-18 2009-10-22 Oki Semiconductor Co., Ltd. Method for manufacturing semiconductor device
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US20110135911A1 (en) 2008-08-07 2011-06-09 Hiroshi Maenaka Insulating sheet and multilayer structure
US20110117706A1 (en) 2008-10-16 2011-05-19 Nishio Akinori Protective tape joining method and protective tape joining apparatus
USD644757S1 (en) 2009-10-06 2011-09-06 Elematic Group Oy Chamfer strip
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US9257364B2 (en) 2012-06-27 2016-02-09 Intel Corporation Integrated heat spreader that maximizes heat transfer from a multi-chip package
US9472485B2 (en) 2012-08-29 2016-10-18 Broadcom Corporation Hybrid thermal interface material for IC packages with integrated heat spreader
US8920919B2 (en) 2012-09-24 2014-12-30 Intel Corporation Thermal interface material composition including polymeric matrix and carbon filler
US9418912B2 (en) 2012-12-21 2016-08-16 Intel Corporation Methods of forming serpentine thermal interface material and structures formed thereby
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USD734732S1 (en) * 2013-07-10 2015-07-21 Sumitomo Electric Fine Polymer, Inc. Circuit board material
USD731078S1 (en) 2013-07-25 2015-06-02 Chad Marcus Frenette Transition strip
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USD807531S1 (en) 2014-01-21 2018-01-09 Yuseal Limited Flexible seal
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US20160355249A1 (en) 2015-06-05 2016-12-08 Airbus Helicopters Deutschland GmbH Jettisonable emergency exit for a vehicle
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USD779997S1 (en) * 2015-11-16 2017-02-28 ClearSite, LLC Bracelet
USD862404S1 (en) * 2016-10-25 2019-10-08 Kokusai Electric Corporation Sealing material ring for a semiconductor manufacturing apparatus
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USD881822S1 (en) * 2017-10-06 2020-04-21 Laird Technologies, Inc. Material having an edge shape
USD917028S1 (en) * 2018-07-10 2021-04-20 Valqua, Ltd. Seal
USD895623S1 (en) * 2018-10-05 2020-09-08 Laird Technologies, Inc. Frame for shielding assembly
USD919626S1 (en) * 2018-10-05 2021-05-18 Laird Technologies, Inc. Frame for a shielding assembly
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Final Office Action for U.S. Appl. No. 15/207,444 which names two of the same inventors and same assignee but is not related through a priority claim; dated Mar. 13, 2020, 17 pages.
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Nguyen et al, "An Investigation of the Ink-Transfer Mechanism During the Printing Phase of High-Resolution Roll-to-Roll Gravure Prnting," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 5, No. 10, pp. 1516-1524, Oct. 2015. (Year: 2015).
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