USD999405S1 - Material having edging - Google Patents
Material having edging Download PDFInfo
- Publication number
- USD999405S1 USD999405S1 US29/728,991 US202029728991F USD999405S US D999405 S1 USD999405 S1 US D999405S1 US 202029728991 F US202029728991 F US 202029728991F US D999405 S USD999405 S US D999405S
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- US
- United States
- Prior art keywords
- edging
- view
- design
- side plan
- break
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The evenly spaced broken lines in FIGS. 1 through 7 represent portions of the material having edging and form no part of the claimed design. The material having edging is shown with a symbolic break in its length and width. The appearance of any portion of the material having edging between the break lines forms no part of the claimed design.
Claims (1)
- The ornamental design for a material having edging, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/728,991 USD999405S1 (en) | 2017-10-06 | 2020-03-23 | Material having edging |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/621,364 USD879046S1 (en) | 2017-10-06 | 2017-10-06 | Material having edging |
US29/728,991 USD999405S1 (en) | 2017-10-06 | 2020-03-23 | Material having edging |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/621,364 Continuation-In-Part USD879046S1 (en) | 2017-10-06 | 2017-10-06 | Material having edging |
Publications (1)
Publication Number | Publication Date |
---|---|
USD999405S1 true USD999405S1 (en) | 2023-09-19 |
Family
ID=87975875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/728,991 Active USD999405S1 (en) | 2017-10-06 | 2020-03-23 | Material having edging |
Country Status (1)
Country | Link |
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US (1) | USD999405S1 (en) |
Citations (66)
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USD344489S (en) | 1991-11-04 | 1994-02-22 | Texstar, Inc. | Fairing seal for aircraft canopy |
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US20040261980A1 (en) | 2003-06-30 | 2004-12-30 | Dani Ashay A. | Heat dissipating device with preselected designed interface for thermal interface materials |
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US7229683B2 (en) | 2003-05-30 | 2007-06-12 | 3M Innovative Properties Company | Thermal interface materials and method of making thermal interface materials |
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US20090223638A1 (en) | 2005-07-07 | 2009-09-10 | Hideaki Nonaka | Sheet sticking apparatus |
US20090229732A1 (en) | 2008-03-14 | 2009-09-17 | 3M Innovative Properties Company | Stretch releasable adhesive |
US20090263938A1 (en) | 2008-04-18 | 2009-10-22 | Oki Semiconductor Co., Ltd. | Method for manufacturing semiconductor device |
JP2009277935A (en) | 2008-04-16 | 2009-11-26 | Sealex Corp | Metal image formation method and metal image formation film |
US20100252191A1 (en) | 2007-12-20 | 2010-10-07 | Lintec Corporation | Sheet sticking apparatus and sheet sticking method |
US7892882B2 (en) | 2006-06-09 | 2011-02-22 | Freescale Semiconductor, Inc. | Methods and apparatus for a semiconductor device package with improved thermal performance |
US7906845B1 (en) | 2008-04-23 | 2011-03-15 | Amkor Technology, Inc. | Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor |
US20110117706A1 (en) | 2008-10-16 | 2011-05-19 | Nishio Akinori | Protective tape joining method and protective tape joining apparatus |
US20110135911A1 (en) | 2008-08-07 | 2011-06-09 | Hiroshi Maenaka | Insulating sheet and multilayer structure |
USD644757S1 (en) | 2009-10-06 | 2011-09-06 | Elematic Group Oy | Chamfer strip |
US8445102B2 (en) | 2007-11-05 | 2013-05-21 | Laird Technologies, Inc. | Thermal interface material with thin transfer film or metallization |
US8545987B2 (en) | 2007-11-05 | 2013-10-01 | Laird Technologies, Inc. | Thermal interface material with thin transfer film or metallization |
US20140199790A1 (en) | 2012-02-16 | 2014-07-17 | Panasonic Corporation | Resin coating device, and resin coating method |
US20140367847A1 (en) | 2013-06-14 | 2014-12-18 | Laird Technologies, Inc. | Methods for establishing thermal joints between heat spreaders or lids and heat sources |
US8916419B2 (en) | 2012-03-29 | 2014-12-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lid attach process and apparatus for fabrication of semiconductor packages |
US8920919B2 (en) | 2012-09-24 | 2014-12-30 | Intel Corporation | Thermal interface material composition including polymeric matrix and carbon filler |
US9016629B1 (en) | 2011-11-28 | 2015-04-28 | The Boeing Company | Combined pressure and thermal window system for space vehicles |
USD731078S1 (en) | 2013-07-25 | 2015-06-02 | Chad Marcus Frenette | Transition strip |
USD734732S1 (en) * | 2013-07-10 | 2015-07-21 | Sumitomo Electric Fine Polymer, Inc. | Circuit board material |
US9257364B2 (en) | 2012-06-27 | 2016-02-09 | Intel Corporation | Integrated heat spreader that maximizes heat transfer from a multi-chip package |
US9316447B2 (en) | 2012-03-22 | 2016-04-19 | Koninklijke Philips N.V. | Thermal interface material |
US9330998B2 (en) | 2014-04-18 | 2016-05-03 | Laird Technologies, Inc. | Thermal interface material assemblies and related methods |
US20160160104A1 (en) | 2010-02-23 | 2016-06-09 | Laird Technologies, Inc. | Thermal interface materials including thermally reversible gels |
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US9418912B2 (en) | 2012-12-21 | 2016-08-16 | Intel Corporation | Methods of forming serpentine thermal interface material and structures formed thereby |
US9472485B2 (en) | 2012-08-29 | 2016-10-18 | Broadcom Corporation | Hybrid thermal interface material for IC packages with integrated heat spreader |
US20160315030A1 (en) | 2015-04-24 | 2016-10-27 | Laird Technologies, Inc. | Reusable thermoplastic thermal interface materials and methods for establishing thermal joints between heat sources and heat dissipating/removal structures |
US20160326419A1 (en) | 2013-12-31 | 2016-11-10 | The Regents Of The University Of California | Thermal interface materials with alligned fillers |
US20160355249A1 (en) | 2015-06-05 | 2016-12-08 | Airbus Helicopters Deutschland GmbH | Jettisonable emergency exit for a vehicle |
US20160362169A1 (en) | 2015-06-09 | 2016-12-15 | Gentex Corporation | Multi-piece bezel for electro-optic window assembly |
USD779997S1 (en) * | 2015-11-16 | 2017-02-28 | ClearSite, LLC | Bracelet |
USD807531S1 (en) | 2014-01-21 | 2018-01-09 | Yuseal Limited | Flexible seal |
USD862404S1 (en) * | 2016-10-25 | 2019-10-08 | Kokusai Electric Corporation | Sealing material ring for a semiconductor manufacturing apparatus |
USD879046S1 (en) * | 2017-10-06 | 2020-03-24 | Laird Technologies, Inc. | Material having edging |
USD881822S1 (en) * | 2017-10-06 | 2020-04-21 | Laird Technologies, Inc. | Material having an edge shape |
USD895623S1 (en) * | 2018-10-05 | 2020-09-08 | Laird Technologies, Inc. | Frame for shielding assembly |
USD909322S1 (en) * | 2018-10-12 | 2021-02-02 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
USD917028S1 (en) * | 2018-07-10 | 2021-04-20 | Valqua, Ltd. | Seal |
-
2020
- 2020-03-23 US US29/728,991 patent/USD999405S1/en active Active
Patent Citations (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3707762A (en) | 1970-10-29 | 1973-01-02 | North American Rockwell | Methods of using fluxes in joining metal surfaces |
US4199490A (en) | 1974-05-07 | 1980-04-22 | Asahi Kasei Kogyo Kabushiki Kaisha | Block copolymer latex composition |
US4058537A (en) | 1976-01-05 | 1977-11-15 | Ciba-Geigy Corporation | Esters of anhydride aromatic polycarboxylic acids with perfluoroalkyl alcohols |
US4678115A (en) | 1985-04-15 | 1987-07-07 | Ontario Technologies Corporation | Method for making layered foil structure |
US4732631A (en) | 1985-07-19 | 1988-03-22 | Yoshida Kogyo K.K. | Method of manufacturing a tape having a series of surface-type fastener pieces |
US4863551A (en) | 1987-08-10 | 1989-09-05 | Yoshido Kogyo K.K. | Marking apparatus |
US4872258A (en) | 1988-09-22 | 1989-10-10 | Universal Instruments Corporation | Pick and place method and apparatus |
USD348387S (en) | 1990-09-21 | 1994-07-05 | The Serco Corporation | Loading dock seal |
USD344489S (en) | 1991-11-04 | 1994-02-22 | Texstar, Inc. | Fairing seal for aircraft canopy |
US5700340A (en) | 1993-10-22 | 1997-12-23 | Ykk Corporation | Method of manufacturing a tape having a succession of surface-type fastener pieces |
US5943557A (en) | 1996-09-25 | 1999-08-24 | Micron Technology, Inc. | Method and structure for attaching a semiconductor die to a lead frame |
US6294729B1 (en) * | 1997-10-31 | 2001-09-25 | Laird Technologies | Clad polymer EMI shield |
US6566763B2 (en) | 1999-06-14 | 2003-05-20 | Seiko Epson Corporation | Interconnect substrate, apparatus of applying adhesive material, semiconductor device, circuit board and electronic instrument |
US6391686B1 (en) | 1999-06-14 | 2002-05-21 | Seiko Epson Corporation | Adhesive material applying method and apparatus, interconnect substrate, semiconductor device and manufacturing method thereof, circuit board and electronic instrument |
US7004244B2 (en) | 2001-06-07 | 2006-02-28 | Henkel Corporation | Thermal interface wafer and method of making and using the same |
US20030037866A1 (en) | 2001-08-22 | 2003-02-27 | Shin-Etsu Chemical Co., Ltd. | Method of bonding a heat radiating sheet |
US20030234322A1 (en) | 2002-06-25 | 2003-12-25 | Ralph Bladt | Aircraft windows and associated methods for installation |
US20040180474A1 (en) | 2003-03-10 | 2004-09-16 | Oman Todd P. | Electronic assembly having electrically-isolated heat-conductive structure and method therefor |
US20040188814A1 (en) | 2003-03-31 | 2004-09-30 | Intel Corporation | Heat sink with preattached thermal interface material and method of making same |
US7821126B2 (en) | 2003-03-31 | 2010-10-26 | Intel Corporation | Heat sink with preattached thermal interface material and method of making same |
US7229683B2 (en) | 2003-05-30 | 2007-06-12 | 3M Innovative Properties Company | Thermal interface materials and method of making thermal interface materials |
US20040262743A1 (en) | 2003-06-26 | 2004-12-30 | Intel Corporation | Thermal interface structure with integrated liquid cooling and methods |
US6987671B2 (en) | 2003-06-26 | 2006-01-17 | Intel Corporation | Composite thermal interface devices and methods for integrated circuit heat transfer |
US20040262372A1 (en) | 2003-06-26 | 2004-12-30 | Intel Corporation | Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same |
US20040261980A1 (en) | 2003-06-30 | 2004-12-30 | Dani Ashay A. | Heat dissipating device with preselected designed interface for thermal interface materials |
US20050236107A1 (en) | 2004-04-21 | 2005-10-27 | Nitto Denko Corporation | Method of thermal adherend release and apparatus for thermal adherend release |
US20050264677A1 (en) | 2004-06-01 | 2005-12-01 | Sharp Kabushiki Kaisha | Solid-state imaging device, semiconductor wafer and camera module |
US20060021710A1 (en) | 2004-07-29 | 2006-02-02 | Towa Corporation | Die bonding apparatus |
US20090223638A1 (en) | 2005-07-07 | 2009-09-10 | Hideaki Nonaka | Sheet sticking apparatus |
US20070193672A1 (en) | 2006-02-22 | 2007-08-23 | Nitto Denko Corporation | Method for affixing adhesive tape to semiconductor wafer, and apparatus using the same |
US7892882B2 (en) | 2006-06-09 | 2011-02-22 | Freescale Semiconductor, Inc. | Methods and apparatus for a semiconductor device package with improved thermal performance |
US8545987B2 (en) | 2007-11-05 | 2013-10-01 | Laird Technologies, Inc. | Thermal interface material with thin transfer film or metallization |
US8445102B2 (en) | 2007-11-05 | 2013-05-21 | Laird Technologies, Inc. | Thermal interface material with thin transfer film or metallization |
US20100252191A1 (en) | 2007-12-20 | 2010-10-07 | Lintec Corporation | Sheet sticking apparatus and sheet sticking method |
US20090207579A1 (en) * | 2008-02-15 | 2009-08-20 | Laird Technologies, Inc. | Emi shielding assemblies and related methods of retaining components thereof together |
US20090229732A1 (en) | 2008-03-14 | 2009-09-17 | 3M Innovative Properties Company | Stretch releasable adhesive |
JP2009277935A (en) | 2008-04-16 | 2009-11-26 | Sealex Corp | Metal image formation method and metal image formation film |
US20090263938A1 (en) | 2008-04-18 | 2009-10-22 | Oki Semiconductor Co., Ltd. | Method for manufacturing semiconductor device |
US7906845B1 (en) | 2008-04-23 | 2011-03-15 | Amkor Technology, Inc. | Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor |
US20110135911A1 (en) | 2008-08-07 | 2011-06-09 | Hiroshi Maenaka | Insulating sheet and multilayer structure |
US20110117706A1 (en) | 2008-10-16 | 2011-05-19 | Nishio Akinori | Protective tape joining method and protective tape joining apparatus |
USD644757S1 (en) | 2009-10-06 | 2011-09-06 | Elematic Group Oy | Chamfer strip |
US20160160104A1 (en) | 2010-02-23 | 2016-06-09 | Laird Technologies, Inc. | Thermal interface materials including thermally reversible gels |
US9016629B1 (en) | 2011-11-28 | 2015-04-28 | The Boeing Company | Combined pressure and thermal window system for space vehicles |
US20140199790A1 (en) | 2012-02-16 | 2014-07-17 | Panasonic Corporation | Resin coating device, and resin coating method |
US9316447B2 (en) | 2012-03-22 | 2016-04-19 | Koninklijke Philips N.V. | Thermal interface material |
US8916419B2 (en) | 2012-03-29 | 2014-12-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lid attach process and apparatus for fabrication of semiconductor packages |
US9257364B2 (en) | 2012-06-27 | 2016-02-09 | Intel Corporation | Integrated heat spreader that maximizes heat transfer from a multi-chip package |
US9472485B2 (en) | 2012-08-29 | 2016-10-18 | Broadcom Corporation | Hybrid thermal interface material for IC packages with integrated heat spreader |
US8920919B2 (en) | 2012-09-24 | 2014-12-30 | Intel Corporation | Thermal interface material composition including polymeric matrix and carbon filler |
US9418912B2 (en) | 2012-12-21 | 2016-08-16 | Intel Corporation | Methods of forming serpentine thermal interface material and structures formed thereby |
US20140367847A1 (en) | 2013-06-14 | 2014-12-18 | Laird Technologies, Inc. | Methods for establishing thermal joints between heat spreaders or lids and heat sources |
USD734732S1 (en) * | 2013-07-10 | 2015-07-21 | Sumitomo Electric Fine Polymer, Inc. | Circuit board material |
USD731078S1 (en) | 2013-07-25 | 2015-06-02 | Chad Marcus Frenette | Transition strip |
US20160185074A1 (en) | 2013-08-12 | 2016-06-30 | Seiji Kagawa | Heat-dissipating film, and its production method and apparatus |
US20160326419A1 (en) | 2013-12-31 | 2016-11-10 | The Regents Of The University Of California | Thermal interface materials with alligned fillers |
USD807531S1 (en) | 2014-01-21 | 2018-01-09 | Yuseal Limited | Flexible seal |
US9330998B2 (en) | 2014-04-18 | 2016-05-03 | Laird Technologies, Inc. | Thermal interface material assemblies and related methods |
US20160315030A1 (en) | 2015-04-24 | 2016-10-27 | Laird Technologies, Inc. | Reusable thermoplastic thermal interface materials and methods for establishing thermal joints between heat sources and heat dissipating/removal structures |
US20160355249A1 (en) | 2015-06-05 | 2016-12-08 | Airbus Helicopters Deutschland GmbH | Jettisonable emergency exit for a vehicle |
US20160362169A1 (en) | 2015-06-09 | 2016-12-15 | Gentex Corporation | Multi-piece bezel for electro-optic window assembly |
USD779997S1 (en) * | 2015-11-16 | 2017-02-28 | ClearSite, LLC | Bracelet |
USD862404S1 (en) * | 2016-10-25 | 2019-10-08 | Kokusai Electric Corporation | Sealing material ring for a semiconductor manufacturing apparatus |
USD879046S1 (en) * | 2017-10-06 | 2020-03-24 | Laird Technologies, Inc. | Material having edging |
USD881822S1 (en) * | 2017-10-06 | 2020-04-21 | Laird Technologies, Inc. | Material having an edge shape |
USD917028S1 (en) * | 2018-07-10 | 2021-04-20 | Valqua, Ltd. | Seal |
USD895623S1 (en) * | 2018-10-05 | 2020-09-08 | Laird Technologies, Inc. | Frame for shielding assembly |
USD919626S1 (en) * | 2018-10-05 | 2021-05-18 | Laird Technologies, Inc. | Frame for a shielding assembly |
USD909322S1 (en) * | 2018-10-12 | 2021-02-02 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
Non-Patent Citations (6)
Title |
---|
Final Office Action for U.S. Appl. No. 15/207,444 which names to of the same inventors and same assignee but is not related through a priority claim; dated Mar. 13, 2020, 17 pages. |
Final Office Action for U.S. Appl. No. 15/207,444 which names two of the same inventors and same assignee but is not related through a priority claim; dated Mar. 13, 2020, 17 pages. |
Final Office Action for U.S. Appl. No. 16/114,687 which names two of the same inventors and same assignee but is not related through a priority claim; dated May 14, 2020, 13 pages. |
Nguyen et al, "An Investigation of the Ink-Transfer Mechanism During the Printing Phase of High-Resolution Roll-to-Roll Gravure Prnting," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 5, No. 10, pp. 1516-1524, Oct. 2015. (Year: 2015). |
Non-final Office Action for U.S. Appl. No. 15/207,444 which names two of the same inventors and assignee but is not related through a priority claim; dated Sep. 21, 2020; 13 pages. |
USPTO Nonfinal Office Action for U.S. Appl. No. 16/988,919, filed Aug. 10, 2020 that names 5 of the same inventors and the same assignee, but is not related through a priority claim.; dated Apr. 12, 2023; 14 pages. |
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