JP3329533B2 - Anisotropic conductive film bonding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive film bonding apparatus used for bonding an anisotropic conductive film to an electrode formed on an electronic component.

[0002]

2. Description of the Related Art In the mounting technology of electronic parts, it is widely practiced to electrically connect an electrode formed on one electronic part to an electrode formed on another electronic part via an anisotropic conductive film. ing. FIG. 4 shows an example of this type of connection structure, in which an electrode 2 a formed on an electrode plate 2 of a liquid crystal cell 1 and an electrode 4 a formed on a flexible substrate 4 are sandwiched between an anisotropic conductive film 6. This shows the case of connection.

As shown in FIG. 6, the anisotropic conductive film 6 is formed by mixing conductive particles 6b such as synthetic resin particles obtained by applying conductive plating to a thermosetting adhesive 6a. 5 is formed in a tape shape, and is wound around a reel 9 as shown in FIG. 5 in a state where a separator 7 is peelably adhered to one surface.

In the step of connecting the electrodes 2a and 4a using the anisotropic conductive film 6 with a separator, first, the anisotropic conductive film 6 with a separator is bonded onto the electrode plate 2, and thereafter, Then, the separator 7 is peeled off, the electrode 4a of the flexible substrate 4 is positioned on the anisotropic conductive film 6, and the anisotropic conductive film 6 is heated and pressurized. Are bonded by an adhesive 6a, and the electrode 2a and the electrode 4a are electrically connected via the conductive particles 6b.

In the above connection step, the step of bonding the anisotropic conductive film 6 with a separator to the electrode plate 2 of the liquid crystal cell 1 is temporarily attached, and the flexible substrate 4 is placed on the liquid crystal cell 1 to apply heat and pressure. The step of adding and crimping is referred to as final attachment. In the temporary attachment step of these steps, a bonding apparatus as shown in FIG. 7 has been conventionally used.

[0006] A cylinder device 12 is provided in the device body 11 of the bonding device, and the pressurizing body 13 is moved up and down by the cylinder device 12. The pressure body 13 is formed of metal in a box shape, has the same length as the width L of the electrode plate 2 of the liquid crystal cell 1, and has a heater inside. The pressure of the cylinder device 12 can be adjusted with a knob 15 while watching the pressure gauge 14, and the temperature of the pressurizing body 13 can be adjusted with a temperature controller 16. Further, a slide device 17 is disposed below the pressure body 13, and the slide device 17 is provided with a holder 18 for holding the liquid crystal cell 1.
The holding device 18 can be positioned at a position directly below the pressure body 13 by the slide device 17 and can be kept away from the position. Reference numeral 19 denotes a start switch for driving the apparatus.

[0007] The temporary attaching step using the above-mentioned bonding apparatus is performed as follows. First, as shown in FIG. 8 and FIG.
The anisotropic conductive film 6 with a separator is cut so as to be longer by mm), placed on the electrode 2a, and lightly pressed by hand to adhere.

Next, when the liquid crystal cell 1 is mounted on the holder 18 and the start switch 19 is pressed, the holder 18 is moved by the slide device 17 to just below the pressurizing body 13.
Next, as shown in FIG. 10, the pressurizing body 13 is lowered by the cylinder device 12, and the anisotropic conductive film 6 is pressed against the electrode 2a. As a result, the anisotropic conductive film 6 is pressed and heated and adheres to the electrode 2 a of the liquid crystal cell 1. Note that this bonding step is a temporary attachment, and the pressure of the pressing body 13 is set to a value that does not crush the conductive particles 6 b of the anisotropic conductive film 6.

After that, the pressure body 1 is moved by the cylinder device 12.
3 rises, and the holder 18 returns to the original position by the slider device 17. Then, when the worker grips and lifts the anisotropic conductive film 6 with separators projecting from both sides of the liquid crystal cell 1 as shown in FIG. 11, the anisotropic conductive film 6 adheres to the electrode 2a of the liquid crystal cell 1. The separator 7 and the anisotropic conductive film 6 attached to both ends of the separator 7 are separated except for the portion of the conductive film 6. This completes the temporary attachment of the anisotropic conductive film.

According to this conventional bonding apparatus, an operator performs an operation of adhering the anisotropic conductive film 6 cut to a predetermined length to a predetermined position of the liquid crystal cell 1 and an operation of removing the separator 7 after the temporary attachment. Therefore, the work of the operator in the tacking process is complicated. In addition, an anisotropic conductive film 6 is wasted because a gripping margin for peeling the separator is required.

[0011]

As described above, in the above-described bonding apparatus, it is necessary for an operator to place an anisotropic conductive film on a predetermined position of a liquid crystal cell (substrate to be bonded) and to peel off the separator after the temporary attachment. Therefore, the work of the operator in the tacking process is complicated. In addition, an anisotropic conductive film is wasted because a gripping margin is required when the separator is peeled off.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional disadvantages, and an object of the present invention is to provide a bonding apparatus which can reduce the work of an operator in a temporary attaching step and can save anisotropic conductive film. With the goal.

[0013]

According to a first aspect of the present invention, there is provided an anisotropic conductive film provided with a separator having a separator adhered to one surface in a releasable manner, and the other surface adhered to an object to be adhered. In the bonding apparatus for an anisotropic conductive film described above, a first reel around which the anisotropic conductive film with a separator is wound, and a predetermined distance from the first reel are provided. A second reel for winding the separator after the anisotropic conductive film is adhered to the adherend and the anisotropic film between the first and second reels; Pressing the anisotropic conductive film with the separator on the adherend positioned opposite to the other surface of the conductive film to adhere the anisotropic conductive film to the adherend. And a portion of the anisotropic conductive film adhered to the object by separating the anisotropic conductive film with the separator from the object. Moving means for forming a gap between the separator and a portion of the anisotropic conductive film forming a gap between the separator at positions on both ends of the adherend; And a cutting means for cutting. According to a second invention, the cutting means in the first invention is constituted by a heating element for applying heat to the anisotropic conductive film for cutting.

[0014]

According to the first aspect of the present invention, the separation is performed by pressing the pressing body.
The other surface of the anisotropic conductive film with the adhesive is adhered to the adherend,
A gap is formed between the part of the anisotropic conductive film adhered to the adherend by the moving means and the separator, and the part of the anisotropic conductive film adhered to the adherend and another conductive material. The anisotropic conductive film adhered to the adherend is separated from the separator by cutting off the film portion by the cutting means, and the separated anisotropic conductive film is separated by the second reel. It is wound up.
According to a second aspect, in the first aspect, the anisotropic conductive film is heated and cut by a heating element as a cutting means.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to FIGS. Here, FIG. 1 is a schematic configuration diagram of a bonding apparatus, FIG. 2 is a view showing a state in which a gap is formed between an anisotropic conductive film bonded to a bonded body and a separator, and FIG. It is a figure which shows the separator from which the anisotropic conductive film adhered to the adhesive was separated. In these drawings, the same components as those of the conventional example are denoted by the same reference numerals.

The connecting device of this embodiment has the same structure as the connecting device shown in FIG. 7. In addition to this structure, as shown in FIG. 1, an anisotropic conductive film 6 with a separator is provided. The structure includes a wound supply reel (first reel) 9, a winding reel (second reel) 31 for winding the separator 7, a moving means and a cutting means. ing.

A cylinder device 32 is provided in the apparatus main body 11A, and the arm 3 is provided by the cylinder device 32.
3 is moved up and down in the direction of the arrow. A supply reel 9 is mounted on a rotary shaft 34 provided on the left end side of the arm 33, and a winding reel 31 is mounted on a rotary shaft 35 provided on the right end side. . The rotating shaft 35 is rotated in a direction indicated by an arrow by a drive motor (not shown). When the winding reel 31 is rotated in the direction indicated by an arrow, the anisotropic conductive film 6 with a separator is provided. The supply reel 9 rotates with the take-up reel 31 in a state where a predetermined tension is applied to the reel. A pair of left and right guide rollers 37 and 38 are rotatably provided at the lower end of the arm 33, and the anisotropic conductive film 6 with a separator is attached to the guide rollers 37 and 38. It is guided and moves to the winding reel 31 side.

At the intermediate position between the pair of guide rollers 37 and 38 and above the anisotropic conductive film 6 with a separator, a pressing body 13 similar to the conventional example and this pressing body 13 are provided. A lifting / lowering cylinder device 12 is provided. Although not shown, a slide device 17 is disposed below the pressure body 13 with the anisotropic conductive film 6 with a separator therebetween. Adhesive)
1 is provided. Therefore, the holder 18 can be positioned at a position directly below the pressure body 13 by the slide device 17 and can be kept away from the position.

Below the slider device 17, a pair of heating members 40 and 41 which are moved up and down by a cylinder device 39 are arranged. The heating elements 40 and 41 are formed of nichrome wires that generate heat when energized, and when raised by a cylinder device, are positioned close to the left and right end faces of the liquid crystal cell 1 positioned immediately below the pressure element 13. And the heating element 4 is located at a position where the tip projects from the upper surface of the liquid crystal cell 1.
0, 41 is positioned.

Next, a description will be given of a temporary attaching process using the above-mentioned connecting device. When the operator attaches the liquid crystal cell 1 to the holder 18 and presses the start switch, the holder 18 is moved to a position directly below the pressing body 13 by the slide device 17, and the electrode 2a of the liquid crystal cell 1 is anisotropic. It is positioned so as to face the conductive film 6. Then, the pressurized body 1 is
3 descends and presses the anisotropic conductive film 6 through the separator 7 against the electrode 2a. Thus, the anisotropic conductive film 6 is pressed and heated, and is adhered on the electrode 2a.

After the anisotropic conductive film 6 is pressurized and heated, the pressurizing body 13 is raised by the cylinder device 12, and then the arm 33 is raised by the cylinder device 32. As the arm 33 rises, the guide rollers 37 and 38 also rise, and the anisotropic conductive film 6 with the separator is moved upward.
As shown in FIG. 7, the separator 7 is peeled off from the portion 6a of the anisotropic conductive film 6 adhered to the liquid crystal cell 1, and the portion 6a is
A gap is formed between the first and second terminals. That is, the cylinder device 32, the arm 33, and the guide rollers 37 and 38 constitute moving means for separating the anisotropic conductive film 6 with the separator from the liquid crystal cell 1.

When the guide rollers 37, 38 are raised by a predetermined amount (about 3 mm in this example), the heating devices 40, 41 as cutting means are raised by a cylinder apparatus 39 by a predetermined amount (about 1.5 mm in this example). And both end faces 1a, 1a of the liquid crystal cell 1.
The anisotropic conductive film 6 is cut by heat at a position close to. As a result, as shown in FIG. 3, the anisotropic conductive film 6 adhered to the liquid crystal cell 1 is separated from the separator 7. The portion (1) is a portion where the anisotropic conductive film 6 adhered to the liquid crystal cell 1 is separated in the previous temporary attaching operation,
The portion (2) is a portion where the anisotropic conductive film 6 is separated in the temporary tacking operation two times before.

When the temporary attachment is completed by the above series of operations, the holding device 18 returns to the original position by the slider device 17, so that the operator removes the temporarily attached liquid crystal cell 1 and holds a new liquid crystal cell 1. Attach to the tool 18. The arm 33 and the heating elements 40 and 41 are also returned to their original positions by the cylinder devices 32 and 39, and the take-up reel 31 takes up the separator 7 by a predetermined amount and anisotropy with the separator is provided. The conductive film 6 is positioned directly below the pressure body 13.

As described above, in the bonding apparatus of the present embodiment, since the worker performs the temporary attachment only by attaching and detaching the liquid crystal cell 1 to and from the holder 18, the worker's work required for the temporary attachment step is performed. Can be reduced as compared with the conventional case. Also, since there is no need for an allowance for removing the separator 7, the anisotropic conductive film 6 can be used efficiently. By the way, in this example, as shown in FIG. 3, the remaining portion 6b of the anisotropic conductive film 6 of about 5 mm remains in the separator 7; Therefore, the waste of the anisotropic conductive film 6 is greatly reduced.

In this embodiment, the pressing and heating are performed by the pressing body 13 in order to adhere the anisotropic conductive film 6 to the liquid crystal cell 1. If the film 6 is adhered so as not to peel off from the liquid crystal cell 1,
Heating is not necessarily required.

[0026]

As described above, according to the bonding apparatus of the present invention, the worker can temporarily attach the anisotropic conductive film only by attaching and detaching the adherend to and from the apparatus. Work can be significantly reduced compared to conventional devices. Further, since the portion of the anisotropic conductive film which has been conventionally used as a gripping portion can be effectively used, waste of the anisotropic conductive film can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing a state in which a gap is formed between an anisotropic conductive film and a separator by the above device.

FIG. 3 is a view showing a separator from which an anisotropic conductive film has been separated by the above-mentioned apparatus.

FIG. 4 is a perspective view of a liquid crystal cell and a flexible substrate.

FIG. 5 is a perspective view of an anisotropic conductive film with a separator wound around a reel.

FIG. 6 is a cross-sectional view of an anisotropic conductive film with a separator.

FIG. 7 is a perspective view of a conventional bonding apparatus.

FIG. 8 is a view showing a tacking operation by a conventional device.

FIG. 9 is a view showing a tacking operation by a conventional device.

FIG. 10 is a diagram showing a tacking operation by a conventional device.

FIG. 11 is a diagram showing a tacking operation by a conventional device.

[Explanation of symbols]

1... Adhered body 6... Anisotropic conductive film 7... Separator 9.
Le 13 Press body 31 Second reel
Le 40, 41 ... heating body

──────────────────────────────────────────────────続 き Continuation of front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H01R 43/00 C09J 5/00 H05K 3/32

Claims (2)

(57) [Claims] 1. An anisotropic conductive film bonding apparatus for bonding an anisotropic conductive film with a separator having one side releasably bonded to one surface of the anisotropic conductive film and the other surface to an object to be bonded. A first reel around which the anisotropic conductive film with a separator is wound; and a first reel disposed at a predetermined distance from the first reel, the anisotropically conductive film having the anisotropic conductive film attached to the adherend. A second reel for winding the separator after the conductive film is adhered, and a second reel facing the other surface of the anisotropic conductive film between the first and second reels. A pressurizing body for pressing the anisotropic conductive film with the separator against the positioned adherend to adhere the anisotropic conductive film to the adherend; A gap between the separator and the portion of the anisotropic conductive film adhered to the adherend by separating the anisotropic conductive film with a separator. Moving means for forming and the separation
Cutting means for cutting portions of the anisotropic conductive film forming a gap between them at the positions on both end surfaces of the adherend. apparatus. 2. The bonding apparatus for an anisotropic conductive film according to claim 1, wherein the cutting means is a heating body that applies heat to the anisotropic conductive film to cut it.