JPH1167795A - Semiconductor chip mounting device, method for mounting semiconductor chip and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a collet fixing thermosetting resin from sticking on the chip suction surface of the collet by providing resin deposit-preventing grooves at the chip suction face when mounting semiconductor chips having different outer sizes on the wiring board. SOLUTION: A collet 1 has resin deposit-preventing grooves 3 at its chip suction face 2 and the shape of the groove 3 is adaptive to semiconductor chips having different outer sizes to be mounted on a wiring board. When two square semiconductor chips different in size are mounted on the wiring board, using one collet, the shape of the chip suction face 2 of the collet 1 is determined by the shape of the larger square semiconductor chip between them, and the shape of the groove 3 formed into the chip suction face 2 of the collet 1 is determined by the outer size of the smaller semiconductor chip in the two square semiconductor chips to be mounted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip mounting technique, and more particularly to a semiconductor chip mounting apparatus, a semiconductor chip mounting method, and a semiconductor chip mounting method for mounting a semiconductor chip on a wiring board or the like. And a semiconductor device having a semiconductor chip obtained by the method.

[0002]

2. Description of the Related Art When a semiconductor chip is mounted on a wiring board, a semiconductor chip mounting apparatus is used, and one of its components is a jig called a collet which comes into direct contact with the semiconductor chip. The collet is used for mounting the semiconductor chip after adsorbing the semiconductor chip on the surface of the collet on which the semiconductor chip is adsorbed and transporting the semiconductor chip onto the semiconductor chip mounting portion of the wiring board. FIG. 6 shows an external view of an example of a conventional collet. Also, in FIG.
FIG. 6 is a longitudinal sectional view of the conventional collet shown in FIG. 6, and FIG. 7B is a plan view of a semiconductor chip suction surface of the collet. A chip suction hole 5 is formed in the center of the chip suction surface 2 of the collet 1, and a vacuum device (not shown) is connected to the chip suction hole 5.

FIG. 8A is a cross-sectional view showing a state where the mounting of the semiconductor chip in the semiconductor chip mounting step using the collet shown in FIGS. 6 and 7 is completed. An example of a process of mounting a semiconductor chip on a wiring board using a semiconductor chip mounting device including the collet will be described below. First, an appropriate amount of the thermosetting resin 7 is applied to the semiconductor chip mounting portion of the wiring board 6 in advance. Next, the semiconductor chip 4 is sucked to the chip suction surface 2 by the suction force of a vacuum device (not shown) connected to the chip suction hole 5 and transported together with the collet 1 onto the semiconductor chip mounting portion of the wiring board 6. I do. The mounting position of the sucked semiconductor chip 4 is accurately adjusted on the semiconductor chip mounting portion of the wiring board 6. Subsequently, the semiconductor chip mounting device is operated so that the distance between the semiconductor chip 4 and the wiring board 6 is reduced, and the semiconductor chip 4 adsorbed on the collet 1 is applied to the semiconductor chip mounting portion of the wiring board 6 in advance. The pads (electrodes) 8 and the bumps 9 are pressed against the thermosetting resin 7 for fixing the semiconductor chip 4 until they are electrically connected. Thereafter, the thermosetting resin 7 is heated and cured to fix the semiconductor chip 4 and the mounting is completed. The collet 1 is made of a member having high thermal conductivity, and when heating the thermosetting resin 7 to cure it, for example, heat generated by a separately provided heating means (not shown) is transferred to the collet 1. 1 and means for conduction through the semiconductor chip 4. The heat applied in this case is a temperature that can sufficiently cure the thermosetting resin 7 and does not adversely affect the reliability of the semiconductor chip 4.

Conventionally, the size of the chip attracting surface 2 of the collet 1 of this semiconductor chip mounting apparatus is slightly smaller than the outer size of the semiconductor chip 4 to be mounted, as shown in FIG. This is because when the aligned semiconductor chip 4 is pressed onto the thermosetting resin 7 previously applied to the semiconductor chip mounting portion of the wiring board 6, the thermosetting resin 7 that protrudes around the semiconductor chip 4 has a chip-adsorbing surface. This is in order not to adhere to 2. The protruding thermosetting resin 7 is called a fillet. Semiconductor chip 4
To securely fix the semiconductor chip 4 to the collet 1
Together with the thermosetting resin 7 protruding when pressed against the thermosetting resin 7 of the semiconductor chip mounting portion, 0.2 to 0.5 mm
The amount of the thermosetting resin 7 to be applied is adjusted in advance so that a fillet of approximately the same height is formed.

[0005]

As described above, the shape and size of the chip suction surface of the collet used in the semiconductor chip mounting apparatus are determined according to the outer size of the semiconductor chip. By the way, in many cases, a plurality of semiconductor chips are mounted on one wiring board, and generally, each semiconductor chip has a different outer size. Therefore, when a semiconductor chip is mounted on a wiring board using the conventional semiconductor chip mounting apparatus, the following problems have occurred.

FIG. 8B is a cross-sectional view of a semiconductor chip mounting process when a semiconductor chip smaller in size than the suction surface of the collet is sucked. The collet in this case is shown in FIG.
This is the same as that shown in FIG. As described above, when the mounting of the semiconductor chip 4 ″ is continued while using the collet 1 having the chip suction surface 2 that does not correspond to the size of the semiconductor chip 4 ″, the protruding thermosetting resin 7 becomes as illustrated. It does not form a fillet and adheres to the chip suction surface 2. When the thermosetting resin 7 adheres to the chip adsorption surface 2, there is a possibility that the adsorbed semiconductor chip 4 ″ may not be properly detached.

While the collet 1 is repeatedly used, the thermosetting resin 7 attached to the chip suction surface 2 is cured and remains, and the chip suction surface 2 is not flat. When the collet 1 whose chip suction surface 2 is not flat is used, the parallelism between the semiconductor chip 4 "adsorbed on the collet 1 and the wiring board 6 cannot be maintained in the mounting process of the semiconductor chip 4", and the electrical The connection may not be reliably performed, and the reliability of the wiring board 6 on which the semiconductor chip 4 ″ is mounted is reduced.

Further, a gap is formed between the chip suction surface 2 of the collet 1 and the sucked semiconductor chip 4 ″ based on the thermosetting resin 7 that has been adhered and hardened. The chip 4 ″ cannot be stably held. As a result, it is impossible to accurately perform positioning on the semiconductor chip mounting portion of the wiring board 6.

Alternatively, in the step of heating and curing the thermosetting resin 7, the heat transfer from the collet 1 is not sufficiently and uniformly performed, and the semiconductor chip 4 ″ is not fixed to the wiring board 6 satisfactorily.

[0010] In order to avoid the above-mentioned problem, it is conceivable to reduce the amount of the applied thermosetting resin so that the thermosetting resin does not protrude around the semiconductor chip. However, when the amount of the thermosetting resin is reduced, no fillet is formed, and the resin cannot be fixed sufficiently.

Therefore, in order to solve these problems,
When mounting multiple semiconductor chips with different external sizes on one wiring board in succession, prepare multiple collets according to the external size of the different semiconductor chips, and collet each time a semiconductor chip with a different external size is mounted. Had been replaced. The chip suction surface of each of these collets is slightly smaller than the external size of each of a plurality of different semiconductor chips as in the above-described example. However, in this conventional method, the mounting time required for mounting the semiconductor chip increases due to the time required for exchanging the collet, and the manufacturing cost increases accordingly.

The problem to be solved by the present invention is that it is not necessary to replace the collet even when various semiconductor chips are mounted in the semiconductor chip mounting process, and the thermosetting resin for fixing the collet to the wiring board is a collet. Provided is a semiconductor chip mounting device, a semiconductor chip mounting method, and a semiconductor device which can prevent the semiconductor chips having different external sizes from being attached to a chip suction surface of the semiconductor chip and mount a plurality of semiconductor chips having different external sizes with a single collet. It is.

[0013]

SUMMARY OF THE INVENTION The present invention relates to a semiconductor chip mounting apparatus, a semiconductor chip mounting method, and a semiconductor device having a semiconductor chip mounted by the semiconductor chip mounting method. It is configured as follows. That is, the semiconductor chip mounting device of the present invention has a small chip suction region and a large chip suction region including the small chip suction region on the chip suction surface of the collet of the semiconductor chip mounting device, and the small chip suction region is small. The outer periphery of the small chip chucking region has a similar outer shape to the outer shape of the smaller semiconductor chip, and the outer periphery of the smaller semiconductor chip has a groove having an outer edge substantially similar to the outer shape of the smaller semiconductor chip. The region is characterized in that it has a groove having an outer edge that is substantially similar to the outer shape of a large semiconductor chip and has a small outer edge.

Further, the semiconductor chip mounting apparatus of the present invention comprises:
The chip suction area of the collet of the semiconductor chip mounting apparatus has a chip suction area on the chip suction face, and the Nth (N is an integer of 2 or more) largest chip suction area is included in the (N-1) th largest chip suction area. The chip suction region having the second largest chip has an outer shape that is substantially similar to the outer shape of the N-th largest semiconductor chip, and has an outer edge around the outer periphery that is substantially similar to the outer shape of the N-th largest semiconductor chip. And has an outer shape that is substantially similar to and smaller than the outer shape of the semiconductor chip having the largest chip suction surface.

The semiconductor chip mounting device of the present invention comprises the above-mentioned essential components. However, this is true even when the constituent elements are specifically as follows. The specific element is a distance from the outer edge of the semiconductor chip to the inner edge or outer edge of the groove, based on the outer edge of the N-th largest semiconductor chip in which the N-th largest groove is sucked into the N-th largest chip suction area. But 0.2 mm to 1.5
It is characterized by being formed so as to be within the range of mm.

Further, in the semiconductor chip mounting apparatus of the present invention, the outer size of the first largest chip suction area is 0.2 mm to 1.5 m larger than the outer edge of the corresponding semiconductor chip.
It is characterized in that it is small and substantially similar within the range of m.

Another essential component of the present invention is that the chip suction surface of the collet of the semiconductor chip mounting device has a plurality of suction region surfaces divided by grooves and is constituted by a single or a plurality of suction region surfaces. The chip suction area has an external shape that is substantially similar to and smaller than the external shape of the semiconductor chip to be adsorbed. It is characterized by having a groove having a similar outer edge.

In the semiconductor chip mounting apparatus of the present invention, the distance between the outer edge of the semiconductor chip and the inner edge or outer edge of the groove is 0.2 mm with respect to the outer edge of the semiconductor chip adsorbed on the chip suction area. ~ 1.5m
It is characterized by being formed to be within the range of m.

Further, in the semiconductor chip mounting apparatus of the present invention, the outer shape of the chip suction surface of the collet is the maximum shape of a polygon obtained by aligning the suction directions and positions on the chip suction surface of the collet of each semiconductor chip to be sucked. It is formed corresponding to the outer contour, and the outer size of the chip suction surface is smaller than the outermost edge of the outermost polygon within a range of 0.2 mm to 1.5 mm.

Further, the depth of the groove is 0.5 mm or more.

As described above, the semiconductor chip mounting apparatus of the present invention having such a configuration has a groove on the chip suction surface of the collet. The groove is formed so as to be substantially similar to and smaller than the outer shape of the semiconductor chip when the semiconductor chip sucked on the chip suction surface is smaller than the outer shape of the chip suction surface. That is, the groove is provided in the range of the groove provided on the chip suction surface of the collet so that the outer edge of the semiconductor chip to be sucked is always accommodated. That is, assuming a state where the semiconductor chip is placed on the chip suction surface of the collet, having a predetermined depth and width around the semiconductor chip,
It will have an outer moat-shaped recess surrounding the semiconductor chip. This groove prevents the thermosetting resin protruding from the periphery of the semiconductor chip from adhering to the chip suction surface thereof when pressed against the thermosetting resin previously applied to the semiconductor chip mounting portion in the semiconductor chip mounting step. The thermosetting resin after the thermosetting can appropriately form a fillet around the semiconductor chip.

It is possible to provide a groove for preventing thermosetting resin from adhering to the chip suction surface for two or more semiconductor chips to be sucked to the chip suction surface of the collet. However, it can be limited by the dimensions of the groove to be formed. The shape of the groove to be formed can be nested (concentric) according to the shape of the semiconductor chip, as well as the case where the nest cannot be formed. If the grooves cannot be formed in a nested manner, the chip suction surface is divided into a plurality by the grooves, and a single or a plurality of divided suction region surfaces including the groove portions become suction surfaces of the respective semiconductor chips. With the semiconductor chip adsorbed on the chip suction surface of the collet,
As in the case described above, a groove is provided within the groove provided in the chip suction surface portion of the collet so that the outer edge of the semiconductor chip to be sucked is always accommodated.

The width of the groove to be provided should be a distance from the outer edge of the semiconductor chip to the inner edge or outer edge of the groove of ± 0.2 to ± 0.2 with respect to the outer edge of the semiconductor chip sucked in the chip suction surface area.
It is provided so that it has a range of 1.5 mm. The depth of the groove is 0.5 mm or more. If grooves cannot be formed in a nested manner, within the chip suction surface area,
A groove similar in shape to the outer edge portion of the semiconductor chip is provided in the above-mentioned outer size.

The outer shape of the chip suction surface is formed corresponding to one semiconductor chip capable of maximizing the area of the chip suction surface, and the outer size is 0.2 mm to 1 mm larger than the outer edge of the corresponding semiconductor chip. It is small and approximately similar in the range of 0.5 mm.

Alternatively, in the case where a part of the semiconductor chip projects from the chip suction surface when the semiconductor chip is sucked to the chip suction surface as described above, one semiconductor chip having the largest chip suction surface area can be used. It is also possible to focus on chips. In this case, the mounting directions and positions of a plurality of semiconductor chips having different outer sizes to be mounted are aligned, and the semiconductor chips are formed corresponding to the outermost outline of a polygon obtained by superimposing the outlines of the semiconductor chips. Also in this case, the outer size of the chip suction surface is set to be smaller than the outermost outer edge of the polygon formed by the corresponding plurality of semiconductor chips by 0.2.
It is small and almost similar in the range of mm to 1.5 mm.

According to the semiconductor chip mounting method of the present invention, in a method of mounting a semiconductor chip on a wiring board by curing a thermosetting resin, the thermosetting resin protruding from the periphery of the semiconductor chip is adsorbed by a collet chip. It is characterized by being retracted into a groove provided on the surface.

A semiconductor device according to the present invention comprises a semiconductor chip obtained by a method of mounting a semiconductor chip on a wiring board by curing a thermosetting resin. A semiconductor device comprising a semiconductor chip obtained by a method of mounting a semiconductor chip in which a protruding thermosetting resin is retracted into a groove provided on a chip suction surface of a collet.

The method of mounting a semiconductor chip according to the present invention, as described above, uses a chip-adhering surface of a collet so that a thermosetting resin protruding from the periphery of the semiconductor chip during the semiconductor-chip mounting step is not adhered to the chip-adhering surface of the collet. To the groove provided in Further, a semiconductor device of the present invention has a semiconductor chip mounted on a wiring board by the semiconductor chip mounting method. With this semiconductor chip mounting method,
Without adhering thermosetting resin as foreign matter to the chip adsorption surface,
Productivity is improved. Further, the semiconductor device obtained by this semiconductor chip mounting method is a semiconductor device on which a semiconductor chip is mounted reliably and which has high yield and high reliability.

[0029]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a semiconductor chip mounting apparatus, a semiconductor chip mounting method and a semiconductor device according to the present invention will be described below with reference to the drawings. FIG. 2 shows an external view of a collet used in the semiconductor chip mounting device of the present invention.
FIG. 3A is a cross-sectional view of the collet of the present invention shown in FIG. 2, and FIG. 3B is a plan view of a chip suction surface of the collet. As shown in FIGS. 2 and 3,
On the chip suction surface 2 of the collet 1, a resin adhesion preventing groove 3 is formed. The shape of the resin adhesion preventing groove 3 corresponds to a plurality of semiconductor chips having different external sizes mounted on the wiring board.

The collet and its chip suction surface when two square semiconductor chips of different sizes are mounted on a wiring board with one collet will be described below. The size of the chip suction surface 2 of the collet 1 itself is determined by the outer size of the larger semiconductor chip of the two square semiconductor chips to be mounted. In this case, as compared with the size of the largest semiconductor chip like the conventional collet, FIG.
The collet dimension c in (a) is slightly reduced.

The shape of the resin adhesion preventing groove 3 formed on the chip suction surface 2 of the collet 1 is determined by the outer size of a small semiconductor chip out of two square semiconductor chips to be mounted. In this case, the small semiconductor chip is smaller than the outer shape of the chip suction surface 2 of the collet 1. The dimension a in FIG. 3A is smaller than the small semiconductor chip and the dimension b
To be large. When the chip suction hole is provided at the center of the chip suction surface, the semiconductor chip is also positioned at the center of the chip suction surface and suction is performed accordingly. Provide. With such a configuration, the chip fits within the groove.

In the process of mounting a semiconductor chip using the collet 1, when a small semiconductor chip is mounted, when the semiconductor chip is pressed against the thermosetting resin, the thermosetting resin that protrudes around the semiconductor chip becomes resin. The groove is retracted into the adhesion preventing groove 3 and a fillet is formed satisfactorily. In this way, it is possible to prevent the thermosetting resin from adhering to the chip suction surface 2. When a semiconductor chip larger than the chip suction surface 2 of the collet 1 is mounted, the outer size of the chip suction surface 2 is slightly smaller than the semiconductor chip.
A fillet is formed on the outer periphery of the collet.

The shapes and outer sizes of the two semiconductor chips to be mounted do not have to be similar to each other as in the case of the square. Generally, the shape of a semiconductor chip mounted on a wiring board is a square or a rectangle having a size of several mm to several tens mm. For this reason, the semiconductor chips to be mounted are not necessarily all constituted by only similar ones. FIG.
FIG. 3A is a plan view of a chip suction surface of a collet different from that shown in FIG. In this case, the semiconductor chips to be mounted are those in which a large semiconductor chip is square and a small semiconductor chip is rectangular. As shown, the resin adhesion preventing groove to be formed is formed corresponding to the shape of each semiconductor chip. As in the case of the square semiconductor chip described above, the outer edge of the groove to be formed is larger than the outer edge of the semiconductor chip adsorbed to the chip suction surface, and the inner edge of the groove to be formed is adsorbed to the chip suction surface. Smaller than the chip outline. Further, the outer size of the entire chip suction surface is substantially similar to the outer shape of the large semiconductor chip, and is slightly smaller.

Further, three or more semiconductor chips may be mounted. FIG. 4B is a plan view of a tip suction surface of still another collet. In this case, they are nested. The chip suction area (outermost hatched area) provided corresponding to the first largest semiconductor chip includes the suction areas of the second largest semiconductor chip and the third largest semiconductor chip (that is, the smallest semiconductor chip). I do. The grooves existing at the boundaries of the suction regions are nested, and the outer size of the inner and outer edges of each groove is substantially similar to the outer shape of the corresponding semiconductor chip.
The outer size of the entire chip suction surface is substantially similar to the outer shape of the first largest semiconductor chip, and is slightly smaller. Thus, even when semiconductor chips having different shapes and outer sizes are all mounted, corresponding resin adhesion preventing grooves can be provided.

Further, depending on the shape of the semiconductor chip to be mounted, the resin adhesion preventing groove is not necessarily formed in a shape closed in the chip suction surface area. FIG. 5 shows an embodiment in which the shape and the outer size are different and a nested resin adhesion preventing groove cannot be formed. FIG. 5A is a plan view of three semiconductor chips having different shapes and outer sizes. In each case, the semiconductor chip 10a is a square, and the semiconductor chip 10b is a semiconductor chip 10a.
a semiconductor chip 1 having the same vertical width as a but a small horizontal width
0c is a rectangle having a smaller horizontal width and a larger vertical width than the semiconductor chip 10a. In this case, the resin adhesion preventing groove formed on the chip suction surface of the collet cannot form a nested groove as shown in FIGS.

FIG. 5B shows a chip suction surface of a collet for sucking two of the semiconductor chips 10a and 10b shown in FIG. 5A. The outline of the semiconductor chip at the time of suction is shown by a dotted line. In this case, the chip suction surface of the collet is a square having an outer size slightly smaller than that of the semiconductor chip 10a. The resin adhesion preventing groove 3 is formed corresponding to the outer edge portion of the semiconductor chip existing in the chip suction surface area of the rectangular semiconductor chip 10b.

FIG. 5C shows a chip suction surface of a collet for sucking two of the semiconductor chips 10a and 10c shown in FIG. 5A. In this case, it becomes a cross-shaped chip suction surface. The determination of the chip suction surface is as follows. First, the mounting directions of the different semiconductor chips 10a and 10b on the wiring board are aligned, and the center of each semiconductor chip is also adjusted to obtain a polygon formed by the contours of these two semiconductor chips. Next, a collet having a slightly smaller size based on the outermost contour of the polygon and having a chip suction surface having a substantially similar shape is formed. The groove formed on the chip suction surface is formed corresponding to the outer edge portion of the semiconductor chip existing in the chip suction surface area. As described above, if the area of the chip suction surface that comes into contact with the chip is larger than the area of the chip suction hole, suction is performed well.

The shape of the groove does not necessarily need to be exactly similar to the outer edge of the semiconductor chip overlapping the chip suction surface area of the semiconductor chip. Since the area of the chip suction surface is limited, the width of a groove to be formed may be limited. Therefore, it is sufficient if a groove having a width large enough to allow the thermosetting resin protruding from the periphery of the semiconductor chip to escape is formed, and is substantially similar to the outer edge of the semiconductor chip overlapping the chip suction surface area of the semiconductor chip. Should be fine.

[0039]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method of mounting a semiconductor chip on a wiring board using the semiconductor chip mounting apparatus of the present invention and a semiconductor device having a semiconductor chip obtained by the method of mounting a semiconductor chip will be described. In this embodiment, a case will be described in which two semiconductor chips to be mounted have the same square shape and different external sizes. FIG. 1 is a sectional view of a collet portion in a semiconductor chip mounting step using the semiconductor chip mounting apparatus of the present invention. The collet is formed of a material such as metal or ceramics that can conduct heat applied to cure the thermosetting resin.

First, an embodiment in which a semiconductor chip having an outer size smaller than the outer shape of the collet is mounted on a wiring board will be described. FIG. 1A is a sectional view of a collet portion in a process of mounting a small semiconductor chip on a wiring board. First, the center of the collet 1 and the center of the semiconductor chip 4 are aligned with each other, and the surface of the chip suction surface 2 shown in FIG. And the semiconductor chip 4 is sucked by suction using a vacuum device (not shown) connected to the chip suction hole 5. At this time, the dimension a of the hatched portion a of the chip suction surface 2 in FIGS. 3A and 3B is formed to be smaller than the outer shape of the semiconductor chip 4 by about 0.2 to 1.5 mm. The dimension b of the resin adhesion preventing groove 3 is
It is formed to be 0.2 to 1.5 mm larger than the outer shape of the semiconductor chip 4.

There are various types of thermosetting resins, each having a different viscosity and thermosetting temperature. Appropriate amounts of these various thermosetting resins were applied, and a semiconductor chip pressing experiment was performed. From the amount of the thermosetting resin protruding around the semiconductor chip and the height of the fillet, at least the outer size ± 0. It was found that a space having a width of 2 mm or more, that is, a resin adhesion preventing groove was required. More preferably, the outer size of the semiconductor chip ± 0.
It is desirable that the groove is a resin adhesion preventing groove having a width of 5 mm or more. In addition, if a proper amount of thermosetting resin is applied, a groove having a width exceeding ± 1.5 mm is unnecessary, and a plurality of resin adhesion preventing grooves are particularly provided on a chip suction surface having a limited area. When necessary, it can be performed well. The depth of the resin adhesion preventing groove is required to be at least 0.5 mm or more from the result of the height of the formed fillet obtained by the same experiment as described above.

After the semiconductor chip 4 is sucked onto the chip suction surface 2, the semiconductor chip 4 is transported to the semiconductor chip mounting portion on the wiring board 6, and the semiconductor chip mounting portion and the semiconductor chip 4 are accurately positioned. At this stage, the semiconductor chip 4 and the wiring board 6 are not in contact. After the alignment, the semiconductor chip 4 adsorbed on the chip adsorbing surface 2 of the collet 1 is pressed against the thermosetting resin 7 previously applied to the chip mounting portion of the wiring board 6 and heated to perform thermosetting. The resin 7 is cured. At this time, the thermosetting resin 7 protruding from the periphery of the semiconductor chip 4 is retracted into the resin adhesion preventing groove 3 to form a fillet satisfactorily. Further, the thermosetting resin 7 does not adhere to the chip suction surface 2. Thermosetting resin 7 by heating
Is hardened, the semiconductor chip 4 is fixed to the wiring board 6, and the connection between the pads (electrodes) 8 of the wiring board 6 and the bumps 9 previously formed on the semiconductor chip is completed.

Next, an embodiment in which a semiconductor chip having an outer size larger than the outer shape of the collet is mounted on a wiring board will be described. FIG. 1B is a sectional view of a collet portion in a process of mounting a large semiconductor chip on a wiring board. The collet portion is the same as that shown in FIG. As in the case of mounting a small semiconductor chip, first, the center of the collet 1 and the center of the semiconductor chip 4 'are aligned. Next, the back surface of the semiconductor chip 4 ′ is brought into contact with the hatched portions A and B shown in FIG. 3B, and the semiconductor chip is sucked by a vacuum device (not shown) connected to the chip suction hole 5. Adsorb 4 '. At this time, the outer dimension c of the chip suction surface 2 in FIG. 3B is set to be smaller by 0.2 to 1.5 mm than the size of the semiconductor chip. The range limitation of 0.2 to 1.5 mm is based on the same reason as in the case of the resin adhesion preventing groove.

Subsequently, in the same manner as in the step of mounting the small semiconductor chip, the semiconductor chip 4 'adsorbed on the chip suction surface 2 is transported to the semiconductor chip mounting portion on the wiring board 6, and the semiconductor chip mounting portion and the semiconductor chip 4 are transferred. 'And exactly align. After the alignment, the semiconductor chip 4 ′ adsorbed on the chip adsorption surface 2 of the collet 1 is pressed against the thermosetting resin 7 previously applied to the chip mounting portion of the wiring board 6, and heat is applied. The conductive resin 7 is cured. At this time, the thermosetting resin 7 protruding from the periphery of the semiconductor chip 4 is retracted to the outside of the chip suction surface 2 and forms a good fillet. Further, the thermosetting resin 7 does not adhere to the chip suction surface 2. The thermosetting resin 7 is cured by heating, and the semiconductor chip 4 ′ is fixed to the wiring board 6, and the connection between the pads (electrodes) 8 of the wiring board 6 and the bumps 9 formed in advance on the semiconductor chip is made. Is completed.

According to the present invention, when the thermosetting resin is cured and the semiconductor chip is mounted on the wiring board, the thermosetting resin protruding from the periphery of the semiconductor chip is retracted into the groove provided on the chip suction surface of the collet. By doing so, the thermosetting resin does not adhere to the chip adsorption surface. Therefore, the semiconductor device having the semiconductor chip mounted on the wiring board is not reliable because the semiconductor chip mounting failure caused by the thermosetting resin adhering to the chip suction surface does not occur. It will be expensive.

Further, in order to prevent the thermosetting resin from adhering, conventionally, after mounting a large semiconductor chip, when mounting a small semiconductor chip, it is replaced with a collet corresponding to the external size of each semiconductor chip. What has to be done does not need to be replaced or the number of replacements can be minimized, and the semiconductor chip can be mounted with one or a smaller number of collets as compared with the conventional one. As described above, the mounting tact time for mounting the semiconductor chip in the manufacturing process can be shortened, and the cost of manufacturing a semiconductor device having the semiconductor chip decreases.

In the case where the shape and the outer size of the semiconductor chip are different as described above and the case where three or more semiconductor chips are mounted, an appropriate resin adhesion preventing groove should be provided on the chip suction surface of the collet. Can obtain the same effect.

[0048]

Since the present invention is configured as described above, it has the following excellent effects. In the semiconductor chip mounting device of the present invention, when mounting a plurality of semiconductor chips having different external sizes on the wiring board, the thermosetting resin is evacuated by the resin adhesion preventing groove provided on the chip suction surface and the semiconductor chip mounting surface is moved to the chip suction surface. Adhesion can be prevented. In the past, it was necessary to change the size of the chip suction surface for each semiconductor chip of different external size to be mounted so that the thermosetting resin did not adhere to the chip suction surface, and the collet was replaced to realize that The object can be mounted with one or a smaller number of collets as compared with the conventional one. Therefore, it is possible to reduce the time required for collet replacement required when mounting a plurality of semiconductor chips having different external sizes on the wiring board, and it is possible to significantly shorten the mounting tact time.

[Brief description of the drawings]

FIG. 1 shows a semiconductor chip mounting apparatus according to the present invention.
It is a figure showing the section of the collet part of a semiconductor chip mounting process.

FIG. 2 is a view showing the appearance of a collet used in the semiconductor chip mounting device of the present invention.

3A and 3B are views showing a collet used in the semiconductor chip mounting apparatus of the present invention. FIG. 3A is a cross-sectional view of the collet of the present invention shown in FIG. 2, and FIG. The plan views of the chip suction surface of FIG.

FIG. 4 is a plan view of a chip suction surface of a collet.

5A and 5B are diagrams for explaining a case where shapes and external sizes are different and a nested resin adhesion preventing groove cannot be formed; FIG. 5A shows three different shapes and external sizes; 1 shows a plan view of a semiconductor chip. Also,
FIGS. 5B and 5C show the chip suction surfaces of a collet for sucking two different semiconductor chips selected from the three semiconductor chips shown in FIG. 5A, respectively.

FIG. 6 is a view showing an external appearance of an example of a conventional collet.

FIG. 7 is a view showing a conventional collet, and FIG.
FIG. 7 is a longitudinal sectional view of the conventional collet shown in FIG.
(B) is a plan view of the semiconductor chip suction surface of the collet.

FIG. 8 is a view showing a cross section of a semiconductor chip mounting step using the collet shown in FIGS. 6 and 7;

[Description of Signs] 1 Collet 2 Chip suction surface 3 Resin adhesion prevention groove 4, 4 ', 4 "Semiconductor chip 5 Chip suction hole 6 Wiring board 7 Thermosetting resin 8 Pad 9 Projection bump 10a, 10b, 10c Semiconductor chip

Claims (10)

[Claims] A small chip suction area and a large chip suction area including the small chip suction area are provided on a chip suction surface of a collet of a semiconductor chip mounting apparatus, and the small chip suction area has an outer shape of a small semiconductor chip. A semiconductor chip having a substantially similar shape and a small outer shape, and having an outer peripheral groove having a shape substantially similar to the outer shape of the small semiconductor chip on the outer periphery of the small chip suction region, and a large suction region being a large semiconductor chip A semiconductor chip mounting device having a groove having an outer edge substantially similar in shape to the outer shape of the semiconductor chip. 2. A chip suction area on a chip suction surface of a collet of a semiconductor chip mounting apparatus, wherein an Nth (N is an integer of 2 or more) largest chip suction area is an (N-1) th largest chip suction area. And the N-th largest chip suction region has an outer shape that is substantially similar to and smaller than the outer shape of the N-th largest semiconductor chip, and its outer periphery is substantially similar to the outer shape of the N-th largest semiconductor chip. A semiconductor chip mounting apparatus comprising: an N-th groove having a large outer edge; and an outer shape that is substantially similar to and smaller than the outer shape of the semiconductor chip having the largest chip suction surface. 3. The distance from the outer edge of the semiconductor chip to the inner edge or outer edge of the groove, based on the outer edge of the Nth largest semiconductor chip, in which the Nth largest groove is sucked into the Nth largest chip suction area, 0.2 mm-1.
3. The semiconductor chip mounting device according to claim 2, wherein the device is formed so as to be within a range of 5 mm. 4. The outer size of the first largest chip suction area is 0.2 mm larger than the outer edge of the corresponding semiconductor chip.
4. The semiconductor chip mounting device according to claim 2, wherein the semiconductor chip mounting device is small and substantially similar within a range of 1.5 mm. 5. A semiconductor chip having a plurality of suction area surfaces divided by grooves on a chip suction surface of a collet of a semiconductor chip mounting device, wherein a chip suction area constituted by a single or a plurality of suction area surfaces sucks. The outer shape of the semiconductor chip to be sucked has an outer edge almost similar to the outer shape portion existing in the chip suction surface area at the outer periphery of the chip suction area. A semiconductor chip mounting device, comprising: 6. The distance between the outer edge of the semiconductor chip and the inner edge or outer edge of the groove is 0.2 mm with respect to the outer edge of the semiconductor chip which is attracted to the chip attracting area.
6. The semiconductor chip mounting device according to claim 5, wherein the device is formed so as to be within a range of 1.5 mm. 7. The outer shape of the chip suction surface of the collet is formed corresponding to the outermost shape of a polygon obtained by aligning the suction directions and positions of the collets of the semiconductor chips to be suctioned on the chip suction surface of the collets. The semiconductor chip mounting device according to claim 5, wherein the external size of the suction surface is smaller than the outermost edge of the polygon within a range of 0.2 mm to 1.5 mm. 8. The semiconductor chip mounting device according to claim 2, wherein the depth of the groove is 0.5 mm or more. 9. A method of mounting a semiconductor chip on a wiring board by curing a thermosetting resin, wherein the thermosetting resin protruding from the periphery of the semiconductor chip is retracted into a groove provided on a chip suction surface of a collet. A method of mounting a semiconductor chip. 10. A semiconductor device having a semiconductor chip obtained by a method of mounting a semiconductor chip on a wiring board by curing a thermosetting resin, wherein the thermosetting resin protrudes from the periphery of the semiconductor chip. A semiconductor chip obtained by a semiconductor chip mounting method of retracting a groove into a groove provided on a chip suction surface of a collet.