JP2002319800A - Board supporting jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a new board supporting jig which is free of damage even if it interferes with mounted electronic parts, is easy of removal of an needless support, is high in followability to model change, and is free of fear of occurrence of electrostatic breakage. SOLUTION: A plurality of supporting pins 2 are projected integrally at one surface of the plate part 1 consisting of foaming elastic material, for example, foaming urethane, and this jig is made by molding processing. Then, the foaming elastic material consisting of, for example, the foaming urethane has conductivity as a countermeasure to electricity, and has such hardness that the cutting off of the supporting pin 2 becomes easy, and also for each supporting pin 2, the tip face is made spherical so that it may damage the board or the electronic parts mounted thereon.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate support jig, and more particularly to a surface mounting apparatus for mounting electronic components and the like on a substrate or an inspection apparatus for inspecting a mounting substrate on which electronic components and the like are mounted. The present invention relates to a substrate supporting jig for keeping the mounting surface of the substrate flat when performing the above-mentioned operations.

[0002]

2. Description of the Related Art In general, surface mounting for mounting electronic components on a substrate is performed before a process using this apparatus for performing surface mounting.
The mounting substrate is transported, for example, one by one to the solder printing machine by the board supply device, and the solder printing machine performs solder printing on the land of the mounting board. Thereafter, if necessary, it is inspected by a solder printing state inspection machine for inspecting the printing state of the solder, and then is carried into the mounting machine (generally, a high-speed mounting machine and a general-purpose machine).

[0003] The mounting substrate carried into the mounting machine is positioned on a mounting stage (XY table or the like) in the mounting machine by positioning pins inserted into positioning holes of the substrate, with both ends of the substrate being sandwiched therebetween. Positioned with pins. After that, the board on which the pins for correcting the bending and warping of the board are placed rises from the lower side of the board, and the pins are used to support the board from below and maintain a flat surface without bending or warping. Hold. In this state, the electronic component is mounted on the upper surface of the board from above, and when a predetermined mounting sequence is completed, the board is carried out to the next mounting machine or the like.

[0004] The board, which has been mounted by a predetermined mounting machine, is then carried into a reflow furnace, and after the soldering of the electronic components there has been completed, it is transferred to an inspection machine and inspected. The inspection machine determines the position shift, missing parts, standing, etc. of parts by image processing using a camera, a laser, or the like,
Classify non-defective products and defective products, display defective parts, and then
Take it out. Then, the surface mounting is completed.
The application of the adhesive is different from the case of applying the solder only in that a coating machine is used instead of the above-described printing machine and a curing furnace is used instead of the reflow furnace. This is almost the same as in the case of

The mounting height of the electronic component mounted on the substrate is determined in advance by the thickness of the electronic component to be mounted and the height of the component pickup unit, and the surface of the substrate is set to the predetermined height. If it is properly positioned, it will be attached properly. However, at the time of mounting, the substrate warps downward. In this case, the electronic component does not reach the surface to which the solder (or the adhesive) has been applied, and therefore, the component to be mounted may be in a state as if released into the air. There is a problem that it cannot be secured on the street.

Further, even when a board on which electronic components are mounted is inspected by an inspection machine, if the board bends downward, the focus height of a camera of the inspection machine changes, so that image data is not accurately captured. There is a possibility that an erroneous determination is caused. Therefore, when applying solder or adhesive to the mounting board, when mounting the electronic component on the mounting board to which the solder or adhesive has been applied, and when inspecting the board on which the electronic component is mounted, When the inspection is performed according to the above, it is necessary to support the substrate so as to maintain a flat state from below.

As a first conventional example of supporting a substrate,
A plate a as shown in FIG. 2A, in which a large number of holes b are arranged in a grid, is prepared, and each of the holes b is provided with a supporting pin made of metal or resin as shown in FIG. 2B. c, and the substrate is supported from below by a large number of these supporting pins c. In some cases, a pin having a compression spring inside and a relief structure in the vertical direction may be used.

As a second conventional example, as shown in FIG. 3A, a plate d is formed of a magnetic material,
As shown in FIG. 3B, a support pin f having a magnetic body e embedded in a base is used, and the support pin f is held upward on a plate d by magnetic force. In some cases, the substrate is supported by supporting pins f.

As a third conventional example, as shown in FIG.
A block g made of a metal or resin such as aluminum having irregularities formed on the upper surface according to the shape of the lower surface of the mounting substrate, and the substrate is supported on the surface of the block g on which the irregularities are formed. There is.

As a fourth prior art example, a block-shaped foam mat having conductivity is prepared, and one surface thereof is cut in a lattice shape to a certain depth to arrange a plurality of projections h in a staggered manner. There is an i in which the substrate is supported by a plurality of projections h.

[0011]

However, each of the above-mentioned conventional substrate supporting jigs has a drawback. And the significance of the shortcomings is becoming increasingly insignificant. This is because progress in surface mounting technology is unavoidable and the mounting density, heightening, and precision are increasing, and mounting substrates are becoming thinner, and reflow and This is because warping and distortion are likely to occur due to heat during the curing process. Also, when applying solder cream or adhesive, mounting electronic components,
This is because the importance of high flatness and stability of the electronic component mounting surface of the board at the time of inspection is increasing.

Therefore, the disadvantages of the conventional example will be specifically described. In the first conventional example, when the mounting components are arranged on the lower surface of the substrate (particularly, the preceding mounting surface of the double-sided mounting substrate), the mounting is performed. The component placement position and component height are different depending on the model and specifications and are various. Each support pin c is restricted by the mounting position that it can be mounted only in the holes b arranged in a lattice, so that There is a drawback that a case where the support pin c cannot be arranged at a support position necessary for good support may occur.

Further, since the supporting pin c is hard and has no elasticity, when the supporting pin c interferes with a mounted component depending on its arrangement position, there is a possibility that the mounted component may be damaged or missing. In addition, at the time of position setting at the time of setup change, it is necessary to move the support pins c in accordance with the substrate each time the setup is changed, and the movement takes a considerable time, so that the setup takes time, and This is a major factor that hinders the reduction of time, and is disadvantageous in that it is not particularly suitable for multi-product production.

In the second conventional example, since the supporting pin f is held in a plate d shape by a magnetic force, the degree of freedom in setting the position is higher than that in the first conventional example. There is a drawback that, depending on the arrangement position of the pin f, the pin f may interfere with a mounted component, causing a problem such as breakage or dropout. The problem in setting the position at the time of setup change, that is, the need to move the support pins f in accordance with the substrate each time is the same as in the first conventional example.

In the third conventional example, it takes time and money to manufacture the block g for supporting the substrate, the versatility and the ability to follow the model change are low. There is a serious drawback that it is not suitable for small-lot, multi-product production, which is increasing in number.

The fourth conventional example is an improvement of the above-mentioned disadvantages of the conventional examples. The fourth conventional example cuts one surface of a block-shaped foam mat in accordance with the type of a substrate to be supported, and is optimal for the type. It is easy to place the support,
There is little cost for disposables. In that respect it can be said that it is excellent. However, there is a disadvantage in that cut chips and dust are generated during cutting, and the cut chips and dust remain, and when the substrate is supported, the cut chips and dust may adhere to the substrate. In addition, since a plate-like material having elasticity is used, there is also a problem that the shape is difficult to stabilize and causes a decrease in yield.

The present invention has been made in order to solve such a problem, and there is no damage even if it interferes with a mounted component, it is easy to remove an unnecessary support portion, and the follow-up property to a model change is improved. High, without the risk of electrostatic breakdown,
It is another object of the present invention to provide a novel substrate supporting jig having no variation in shape and dimensions.

[0018]

According to a first aspect of the present invention, there is provided a substrate supporting jig, wherein a plate portion made of a foamed elastic material and a plurality of support pins integrally formed on one main surface of the plate portion are integrally formed. Characterized by being formed by:

Therefore, according to the substrate supporting jig of the first aspect, since a plurality of supporting pins are formed on one main surface of the plate portion, the substrate is lowered by the plurality of supporting pins. And can be supported flat. Since the forming material is made of a foamed elastic material, even if, for example, the double-sided mounting board is supported on the preceding production surface, even if the electronic component on that surface interferes with (hits) the support pins, it is hit. Since the supporting pins can be elastically deformed by being compressed or tilted by their own elasticity, it is possible to support the substrate without damaging the interfering electronic components.

Further, since the plate portion and the support pins are integrally formed by molding, there is no possibility that cut chips and dust are generated as in the case where the support pins are formed by cutting, and the substrate is contaminated. There is no fear.
Furthermore, since the substrate support jig is formed by integral molding,
It can be manufactured easily without causing variations in shape and dimensions, and the manufacturing cost can be reduced.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention basically comprises a plate portion made of a foamed elastic material and a plurality of supporting pins of the same height integrally formed on one main surface of the plate portion. It is preferable to use, as the foamed elastic material, a material having a hardness that allows the support pin to be easily cut off. That is, if the interference of the support pins of the electronic component that occurs when the double-sided mounting board is supported on the preceding production side is too strong, for example, cut off the support pins appropriately to avoid the interference. Because it can be. An example of a foamed elastic material suitable for satisfying such conditions is urethane foam. This is because it is inexpensive and has good workability.

It is preferable to use a conductive material as the foamed elastic material. That is, when solder or adhesive is applied to the substrate, or when electronic components are mounted, electrification occurs due to friction, etc., and it is possible to prevent electrification that may cause electronic components to be destroyed by the discharge of the electrification. Because you can. The elastic modulus and compressibility of the foamed elastic material such as urethane foam can be changed according to the degree of foaming. A tool may be provided. Actually, it is possible to change the elastic modulus and the compressibility of the substrate support jig for each lot.

It is preferable that the tip of the support pin is formed in a spherical shape. This is because when the support pins are in contact with the lower surface of the substrate, damage to the lower surface can be further reduced.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the illustrated embodiments. 1 (A) to 1 (F) show a first embodiment of the substrate supporting jig of the present invention, wherein (A) is a plan view, (B) is a rear view, (C) is a front view, and (D). () Is a left side view, (E) is a right side view, and (F) is a bottom view. In the drawings, reference numeral 1 denotes a plate portion having a constant thickness (for example, 5 mm) and a rectangular shape (for example, 42 mm in length, 126 m in width).
m).

Reference numeral 2 denotes a support pin integrally formed on one main surface of the plate portion 1 and has a conical shape in which the diameter at the tip is slightly smaller than the diameter at the base (for example, 6 mm), and the top is spherical. (Dome shape), and the height from the surface of the plate portion 1 is, for example, 15
mm. The reason why the top is made spherical is to further reduce damage when the top hits the lower surface of the substrate.

A large number (for example, 39) of the support pins 2 are provided on one main surface of the plate portion 1, and the substrate is mounted on the lower surface thereof by the large number of support pins 2, 2,. Can be supported. The substrate support jig in which a large number of support pins 2, 2,... Are integrally formed on the surface of the plate portion 1 is formed by molding urethane foam having conductivity.

Such a substrate support jig has a lower surface (a surface opposite to the main surface of the plate portion 1 on which the support pins 2 are formed).
Can be easily joined to other plates and boards with adhesives, etc.
The height can be easily adjusted to match the equipment.
Further, by joining the side surface of one plate portion 1 to the side surface of the plate portion 1 of another substrate supporting jig, a plurality of substrate supporting jigs can be integrated to increase the size of the substrate supporting jig. The size of the supporting jig can be increased according to the substrate to be supported.

Since the substrate support jig is made of an integrally molded article of urethane foam, no processing waste or dust is generated. Therefore, there is no possibility that the supporting substrate is contaminated with processing waste and dust.

Since each of the support pins 2 has a spherical tip surface, electronic components are already mounted on the lower surface of the supporting substrate (the substrate is a double-sided mounting type and the electronic components are already mounted on one surface). When the substrate is to be supported on the surface on which the electronic component is mounted, with the surface facing down), even if interference occurs with the electronic component, there is little risk of damaging the electronic component. Further, even if the interference is slightly strong, each support pin 2 is made of urethane foam and has elasticity, so that it can support and support the substrate without being compressed and deformed by the elasticity to damage the electronic components. In this state, the substrate can be pushed up.

When the interference is too strong, for example, when the height of the electronic component mounted on the lower surface of the substrate is high, the support pins 2 related to the interference may be cut off.
The excision can be easily performed because the substrate support jig is made of urethane foam. Therefore, there is no need to restrict the arrangement of the support pins 2 when designing the mounting board, and even if there is an error in the arrangement of the support pins 2, a trouble of damage to the electronic component may occur or a troublesome repair work may be required. do not do. A foamed elastic material such as urethane foam is extremely inexpensive, and it is possible to prepare an appropriate number of arrangement numbers and arrangement patterns of a large number of support pins 2 and standardize them for use at low cost.

The softness of the substrate supporting jig supporting the substrate against the substrate and the ease with which the supporting pins 2 can be cut off are generally determined by the elastic modulus and compression ratio of the substrate supporting jig. It can be adjusted by the degree of foaming at the time of foaming. Therefore, the elastic modulus and the compressibility can be changed, for example, on a lot-by-lot basis, according to the type and state of the substrate to be supported. In addition, surface treatment can be performed at the time of foaming, and the surface treatment can enhance durability.

The urethane foam is made conductive by, for example, including a conductive powder material.
It is possible to prevent electrification due to friction between the substrate and the electronic components mounted thereon and the substrate support jig. Therefore, it is possible to eliminate the possibility that the electronic component is destroyed by the discharge caused by the charging.

In order to correct the warpage of the substrate to be supported by the substrate supporting jig, the shape of the support pin or the shape or material of the tip thereof may be changed according to the substrate to be supported. As an example, such as making the support pin into a quadrangular pyramid shape, changing the curvature of the curved surface of the tip surface,
Partly changing the degree of foaming, or partially changing the color so that a display, mark, division, or the like can be formed. It is also conceivable that a conventional support pin is added to the present substrate support jig and used together with the conventional pin method.

[0034]

According to the substrate supporting jig of the first aspect, since a plurality of supporting pins having the same height are formed on one main surface of the plate portion, a plurality of supporting pins having the same height are formed. The substrate can be flatly supported from below by the use pins. And, since the forming material is made of a foamed elastic material, if, for example, a double-sided mounting board is to be supported on the preceding production side,
Electronic components on the surface interfered (hit) the support pins
Even so, the support pins that have hit can be elastically deformed by being compressed or tilted by their own elasticity, so it is possible to support the board so as not to damage the interfering electronic components It is.

Further, since the plate portion and the support pins are integrally formed by molding, there is no possibility that cut chips and dust are generated as in the case where the support pins are formed by cutting, and the substrate is contaminated. There is no fear.
Further, since the substrate supporting jig is formed by molding, the manufacturing can be simplified and the manufacturing cost can be reduced.

According to the substrate supporting jig of the second aspect, since the foaming elastic material is made of a material having a hardness such that the supporting pins can be easily cut off, the supporting pins cause strong interference with the electronic components already mounted on the substrate. In such a case, the interference can be easily avoided by cutting off the support pins involved in the interference, and a misplacement of the support pins may cause a component damage trouble or require troublesome repair work. Or the likelihood of being lost. Therefore, the ability to follow up the setup change is enhanced.

According to the third aspect of the present invention, since the foamed elastic material is made of urethane foam, the urethane foam is inexpensive and the degree of foaming can be easily adjusted, so that the elastic modulus and hardness can be adjusted. Characteristics suitable for the model, state, and the like of the substrate to be supported can be obtained.

According to the fourth aspect of the present invention, since the foamed elastic material has conductivity, it is possible to prevent electrification due to friction between the substrate and the electronic components mounted thereon and the substrate supporting jig. Therefore, it is possible to eliminate the possibility that the electronic component is destroyed by the discharge caused by the charging.

According to the substrate supporting jig of the fifth aspect, since the tips of the supporting pins are formed in a spherical shape, it is possible to further reduce damage to the substrate or the electronic components mounted thereon.

[Brief description of the drawings]

1 (A) to 1 (F) show a first embodiment of a substrate supporting jig of the present invention, wherein (A) is a plan view, (B) is a rear view, (C) is a front view, (D) is a left side view, (E) is a right side view, and (F) is a bottom view.

FIGS. 2A and 2B show a first conventional example.
(A) is a perspective view of a substrate support jig, (B) is a perspective view showing a support pin.

FIGS. 3A and 3B show a second conventional example.
(A) is a perspective view of a substrate support jig, (B) is a perspective view of a support pin.

FIG. 4 is a perspective view showing a third conventional example.

FIG. 5 is a perspective view showing a fourth conventional example.

[Explanation of symbols]

 1 ... plate part, 2 ... support pin.

Claims (5)

[Claims] 1. A substrate supporting jig comprising: a plate portion made of a foamed elastic material; and a plurality of support pins integrally formed on one main surface of the plate portion by integral molding. . 2. The substrate supporting jig according to claim 1, wherein the foamed elastic material is made of a material having a hardness that allows the support pins to be easily cut off. 3. The substrate supporting jig according to claim 1, wherein said foamed elastic material is made of urethane foam. 4. The substrate supporting jig according to claim 1, wherein the foamed elastic material has conductivity. 5. The substrate supporting jig according to claim 1, wherein the supporting pin has a tip formed in a spherical shape.