JP2023058214A - Component compression-bonding device and component compression-bonding method - Google Patents

Abstract

To provide a component compression-bonding device capable of enhancing a productivity.SOLUTION: A component compression-bonding device 1 comprises: an adhesion part 20 that supplies a substrate 3; a temporal compression-bonding part 30 that mounts a component 5 onto the supplied substrate 3; a main compression-bonding part 40 that thermally compression-bonds, onto the substrate 3, the component 5 mounted on the substrate 3; a housing body 7 that houses the adhesion part 20, the temporal compression-bonding part 30, and the main compression-bonding part 40; and a pressure adjustment mechanism 70. The pressure adjustment mechanism 70 adjusts a pressure in the housing body 7 so that a pressure in a first space where the temporal compression-bonding part 30 is arranged in the housing body 7 becomes higher than (i) a pressure in a second space where the adhesion part 20 is arranged in the housing body 7, and (ii) a pressure in a third space where the main compression-bonding part 40 is arranged in the housing 7.SELECTED DRAWING: Figure 5

Description

TECHNICAL FIELD The present disclosure relates to a component crimping device for crimping a component onto a substrate.

2. Description of the Related Art Conventionally, there has been provided a component crimping device for crimping an electronic component (hereinafter simply referred to as "component") to a panel such as a liquid crystal panel. Patent Literature 1 discloses such a component crimping device as a liquid crystal driver mounting machine. This component crimping device crimps a component to the end of a liquid crystal panel via an ACF (Anisotropic Conductive Film), which is an anisotropic conductive member. That is, the ACF is adhered as an adhesive member to the end portion of the liquid crystal panel. A component pressure bonding device mounts a component on the portion of the liquid crystal panel to which the ACF is adhered, and presses the component onto the liquid crystal panel.

JP 2005-317784 A

However, the component crimping device of Patent Literature 1 has a problem that productivity may decrease.

Therefore, the present disclosure provides a component crimping device and the like capable of improving productivity.

A component crimping apparatus according to an aspect of the present disclosure includes a substrate supply unit that supplies a substrate, a component placement unit that places a component on the supplied substrate, and the components placed on the substrate. A thermocompression bonding section that is thermocompression bonded to a substrate, a housing that accommodates the substrate supply section, the component placement section, and the thermocompression bonding section, and a first space in the housing in which the component placement section is arranged. is lower than (i) the pressure of a second space in the housing where the substrate supply section is arranged, and (ii) the pressure of a third space in the housing where the thermocompression bonding section is arranged. and an air pressure adjustment mechanism for adjusting the air pressure in the housing so that the air pressure becomes higher.

In addition, these general or specific aspects may be realized by a system, method, integrated circuit, computer program, or a recording medium such as a computer-readable CD-ROM. and any combination of recording media. Also, the recording medium may be a non-temporary recording medium.

The component crimping device of the present disclosure can improve productivity.

Further advantages and advantages of one aspect of the present disclosure are apparent from the specification and drawings. Such advantages and/or advantages are provided by the several embodiments and features described in the specification and drawings, respectively, but not necessarily all to obtain one or more of the same features. No need.

FIG. 1 is a diagram showing a schematic configuration of a component crimping device according to an embodiment. FIG. 2 is a plan view of the component crimping device according to the embodiment. FIG. 3 is a perspective view showing an example of the appearance of the component crimping device according to the embodiment. FIG. 4 is a diagram showing a specific arrangement example of the intake section and the exhaust section in the embodiment. FIG. 5 is a block diagram showing an example of the functional configuration of the component crimping device according to the embodiment. FIG. 6 is a diagram showing an example of air supply and discharge and an air pressure distribution within the housing according to the embodiment. FIG. 7 is a flow chart showing an example of the processing operation of the component crimping device according to the embodiment. FIG. 8 is a diagram illustrating an example of a housing according to Modification 1 of the embodiment. FIG. 9 is a diagram showing an example of attachment of the intake section and the exhaust section in Modification 2 of the embodiment.

(Findings on which this disclosure is based)
The inventors of the present invention have found that the component crimping device of Patent Document 1 described in the "Background Art" section has the following problems.

The component crimping apparatus of Patent Document 1 includes an ACF attaching apparatus that attaches an ACF to a substrate, a temporary crimping apparatus that temporarily crimps a component to the substrate via the ACF, and a component mounting device that performs final crimping of the temporarily crimped component. have a machine. Then, the component crimping device produces a mounted board in which one or more components are crimped to the board by the work of the ACF sticking device, the temporary crimping device and the component mounter. Here, the ACF sticking device, the temporary pressure bonding device and the component mounter are covered by the housing of the component pressure bonding device.

Therefore, even if particles such as dust drifting around the component crimping apparatus try to enter the inside of the housing, they are blocked by the housing. As a result, entry of particles into the housing is suppressed. As a result, it is possible to suppress the decrease in the yield of the mounting substrate due to the particles adhering to the bonding portion between the substrate and the component.

However, particles exist not only outside the housing of the component crimping apparatus, but also inside the housing. For example, particles may be blown up by the work of the ACF sticking device, the temporary pressure bonding device and the component mounter. Such particles may adhere to the joints between the board and the component. As a result, it is difficult to sufficiently suppress the decrease in the yield of mounting substrates due to particles with only the housing. In other words, there is a possibility that the productivity of the mounting board will decrease.

In order to solve such problems, a component crimping apparatus according to an aspect of the present disclosure includes a substrate supply unit that supplies a substrate, a component placement unit that places a component on the supplied substrate, the substrate a thermocompression bonding unit for thermocompression bonding the component placed on the substrate to the substrate; a housing that accommodates the substrate supply unit, the component placement unit, and the thermocompression bonding unit; The atmospheric pressure in the first space where the placing section is arranged is (i) the atmospheric pressure in the second space where the substrate supply section is arranged in the housing, and (ii) the thermocompression bonding section in the housing. an air pressure adjustment mechanism that adjusts the air pressure in the housing so that the air pressure in the housing is higher than the air pressure in the third space.

As a result, since the air pressure in the first space is higher than the air pressure in the second and third spaces, an air current is generated that flows from the first space to the second and third spaces. As a result, even if particles rise up in the second space and the third space due to the work in the substrate supply section and the thermocompression bonding section, it is possible to prevent the particles from drifting and entering the first space. In other words, it is possible to suppress the possibility of particles entering between the component and the substrate when the component placement portion arranged in the first space places the component on the substrate. Therefore, it is possible to suppress the decrease in the yield of the mounted substrate due to the particles adhering to the bonding portion between the substrate and the component, and improve the productivity of the mounted substrate. In other words, the cleanliness of the first space can be improved, and the quality of the mounting board can be improved.

The component supply unit may further include a component supply unit that supplies the component to the component placement unit, the housing further accommodates the component supply unit, and the air pressure adjustment mechanism may be configured such that the component supply unit is located within the housing. The air pressure in the housing may be adjusted so that the air pressure in the first space is higher than the air pressure in the fourth space.

As a result, since the air pressure in the first space is higher than that in the fourth space, an air current is generated that flows from the first space to the fourth space. As a result, even if particles are soaring in the fourth space due to work in the parts supply section, it is possible to prevent the particles from drifting and entering the first space. In other words, it is possible to suppress the possibility of particles entering between the component and the substrate when the component placement portion arranged in the first space places the component on the substrate. Therefore, it is possible to further suppress a decrease in the yield of the mounted substrate due to particles adhering to the bonding portion between the substrate and the component, and to further improve the productivity of the mounted substrate. In other words, the cleanliness of the first space can be further improved, and the quality of the mounting substrate can be further improved.

Further, the air pressure adjustment mechanism includes one or more intake units that purify air outside the housing and suck it into the housing, and discharge air inside the housing to the outside of the housing. and at least one of one or more vents.

This makes it possible to easily adjust the air pressure inside the housing.

Also, at least one of the one or more intake units may be arranged in contact with the first space.

As a result, the air pressure in the first space can be easily increased by the at least one air intake.

Further, the one or more air intake units are arranged in the housing such that the volume of air supplied to the first space is larger than the volume of air supplied to each of the second space and the third space. Air outside the body may be sucked into the interior of the enclosure.

Thereby, the air pressure in the first space can be easily and efficiently made higher than the air pressure in the second and third spaces.

In addition, the one or more exhaust units are arranged in the housing such that the volume of air discharged from the first space is smaller than the volume of air discharged from each of the second space and the third space. Air inside the body may be discharged to the outside of the housing.

Thereby, the air pressure in the first space can be easily and efficiently made higher than the air pressure in the second and third spaces.

In addition, the substrate moves along a movement path from the substrate supply section to the thermocompression bonding section via the component placement section, and the one or more air intake sections move along the movement path in the housing. The one or more exhaust units may be arranged in an upper portion, and the one or more exhaust units may be arranged in a portion below the movement path in the housing.

As a result, a downflow air current is generated in the housing from above the substrate to below, so that it is possible to suppress the particles below the substrate from rising upward. As a result, it is possible to prevent particles from adhering to the upper surface of the board on which the work is performed, thereby further improving the productivity of the mounting board.

Hereinafter, embodiments will be specifically described with reference to the drawings.

It should be noted that the embodiments described below are all comprehensive or specific examples. Numerical values, shapes, materials, components, arrangement positions and connection forms of components, steps, order of steps, and the like shown in the following embodiments are examples, and are not intended to limit the present disclosure. In addition, among the constituent elements in the following embodiments, constituent elements that are not described in independent claims representing the highest concept will be described as arbitrary constituent elements. Each figure is a schematic diagram and is not necessarily strictly illustrated. Moreover, in each figure, the same code|symbol is attached|subjected about the same component. In addition, expressions such as substantially parallel are used in the following embodiments. For example, "substantially parallel" means not only being completely parallel, but also being substantially the same, that is, including an error of, for example, several percent. Also, "substantially parallel" means "parallel" as long as the effects of the present disclosure can be achieved. The same applies to expressions using other "abbreviations".

(Embodiment)
[Schematic configuration of component crimping device]
FIG. 1 is a diagram showing a schematic configuration of a component crimping device according to the present embodiment.

A component crimping apparatus 1 according to the present embodiment is an apparatus for producing mounting substrates such as display panels as products by mounting components 5 on substrates 3 such as liquid crystal panels and organic EL (Electro-Luminescence) panels. Note that the component 5 is an electronic component such as a drive circuit, for example. Specifically, the component 5 is an IC (Integrated Circuit) chip, TCP (Tape Carrier Package), COF (Chip on Film), FPC (Flexible Printed Circuit), or the like.

As shown in FIG. 1, such a component pressure-bonding apparatus 1 has a bonding section 20, a temporary pressure-bonding section 30, a final pressure-bonding section 40, and a component supply section 50. As shown in FIG. The sticking section 20 , the temporary pressure-bonding section 30 and the final pressure-bonding section 40 are connected in this order, and the component supply section 50 is connected to the temporary pressure-bonding section 30 .

The adhering unit 20 receives, for example, a rectangular substrate 3 carried in from another device or the like, and adheres an adhesive member such as ACF to each of the plurality of electrode portions 4 on the periphery of the substrate 3 . Then, the sticking section 20 carries out the substrate 3 with the adhesive member stuck thereon to the temporary pressure-bonding section 30 . That is, the sticking section 20 in the present embodiment is configured as a substrate supply section that supplies the substrate 3 to the temporary pressure bonding section 30 . In addition, each of the plurality of electrode portions 4 is configured by, for example, a plurality of electrodes.

The component supply section 50 supplies the component 5 to the temporary crimping section 30 .

The temporary pressure-bonding unit 30 receives the substrate 3 carried out from the bonding unit 20, mounts the component 5 supplied from the component supply unit 50 on the portion of the substrate 3 to which the adhesive member is bonded, and performs temporary pressure-bonding. do. That is, the temporary pressure-bonding section 30 in the present embodiment is configured as a component mounting section for mounting the component 5 on the substrate 3 supplied from the bonding section 20, which is a substrate supply section. Then, the temporary pressure-bonding section 30 carries out the substrate 3 with the component 5 temporarily pressure-bonded thereon to the final pressure-bonding section 40 .

The final pressure-bonding section 40 receives the substrate 3 carried out from the temporary pressure-bonding section 30 and performs final pressure-bonding on the component 5 temporarily pressure-bonded to the substrate 3 . This final compression bonding is also called thermocompression bonding. That is, the main compression bonding portion 40 in the present embodiment is configured as a thermocompression bonding portion that thermocompression bonds the component 5 placed on the substrate 3 to the substrate 3 . Then, the final pressure-bonding unit 40 carries out the substrate 3 subjected to the final pressure-bonding to another device or the like.

In this manner, the component crimping apparatus 1 performs component mounting work for mounting the component 5 on each of the plurality of electrode portions 4 provided on the peripheral edge of the board 3 carried in, and the board 3 on which the component 5 is mounted. Carry out as a mounting board.

[Detailed configuration of component crimping device]
FIG. 2 is a plan view of the component crimping device 1 according to this embodiment. Specifically, FIG. 1 shows the configuration of the component crimping device 1 viewed from above. In this embodiment, the transport direction of the substrate 3, that is, the horizontal direction, is called the X-axis direction, the vertical direction, that is, the vertical direction is called the Z-axis direction, and the direction perpendicular to the X-axis direction and the Z-axis direction, that is, The depth direction is called the Y-axis direction. The negative and positive sides in the X-axis direction correspond to the upstream and downstream sides in the transport direction of the substrate 3, respectively, and the negative and positive sides in the Z-axis direction correspond to the lower and upper sides in the vertical direction, respectively. The negative side and positive side in the Y-axis direction respectively correspond to the front side and the back side or the front side and the rear side in the depth direction.

The sticking section 20 has a function of performing a sticking operation (in other words, a sticking process) of sticking the ACF, which is an adhesive member, to the electrode section 4 of the substrate 3 . The sticking section 20 also includes a substrate moving mechanism 21, a sticking mechanism 22, and a transport mechanism 62A, which are arranged on the base 1a.

The substrate moving mechanism 21 is a mechanism that moves the substrate 3 and has a stage 23 that holds the substrate 3 . The upper surface of the stage 23 is provided with a plurality of suction holes 23a. The substrate moving mechanism 21 holds the substrate 3 placed on the stage 23 by vacuum suction through the plurality of suction holes 23a. Then, the substrate moving mechanism 21 moves the stage 23 that sucks and holds the substrate 3 in a horizontal plane (specifically, in the X-axis direction and the Y-axis direction), moves it up and down in the vertical direction (that is, in the Z-axis direction), and moves it up and down in the Z-axis direction. Rotate around the axis.

The sticking mechanism 22 includes, for example, two sticking heads arranged in the X-axis direction above the base 1b. Each sticking head has a supply section for supplying ACF and a sticking tool for sticking the ACF to the substrate 3 . Each of the two sticking heads sticks the ACF to the position corresponding to the electrode part 4 on the substrate 3 .

The transport mechanism 62A is arranged on a moving base 61 extending in the X-axis direction across the base 1a. The transport mechanism 62A has a base 63 and two arm units 64 . The base 63 freely moves on the moving base 61 in the X-axis direction. The two arm units 64 are arranged side by side in the X-axis direction on the base portion 63 . The arm unit 64 vacuum-sucks the substrate 3 from above. The transport mechanism 62</b>A receives the substrate 3 placed on the stage 23 of the bonding section 20 and transfers it to the stage 37 of the temporary pressure bonding section 30 .

The component supply unit 50 is provided on the back side of the temporary crimping unit 30 (that is, on the positive side in the Y-axis direction). For example, the component supply section 50 includes a supply reel 51, a punching section 52, a movable stage 53, and a rail 54, which are arranged on the base 1b. A tape such as TCP is wound around the supply reel 51 . Such a component supply unit 50 punches out the components 5 from the tape, places the components 5 on the movable stage 53 , and sequentially supplies the components 5 to the temporary pressure bonding unit 30 .

The temporary pressure-bonding unit 30 performs a temporary pressure-bonding step of mounting the component 5 on the area (that is, the pressure-bonding target portion) of the substrate 3 to which the ACF is adhered and temporarily pressure-bonding the same. The temporary pressure bonding section 30 includes a substrate moving mechanism 31, a component mounting mechanism 32, a component transfer mechanism 35, and a transport mechanism 62B, which are arranged on the base 1a.

The substrate moving mechanism 31 has the same structure as the substrate moving mechanism 21 of the sticking section 20 . Specifically, the substrate moving mechanism 31 has a stage 37 that holds the substrate 3 . The upper surface of the stage 37 is provided with a plurality of suction holes 37a. The substrate moving mechanism 31 holds the substrate 3 placed on the stage 37 by vacuum suction through the plurality of suction holes 37a. Further, the substrate moving mechanism 31 has a function of moving a stage 37 for sucking and holding the substrate 3 in a horizontal plane, raising and lowering the stage 37 vertically, and rotating the stage 37 around the Z axis. The substrate moving mechanism 31 moves and rotates the stage 37 to position the ACF-adhered area of the substrate 3 held by suction above the backup stage 36 of the component mounting mechanism 32 .

The component transfer mechanism 35 moves the component 5 supplied from the component supply section 50 to the crimping tool 34 included in the component mounting mechanism 32 .

The component mounting mechanism 32 is provided on the base 1b and includes a crimping tool 34 and a backup stage 36. As shown in FIG.

The backup stage 36 supports the edge of the substrate 3 held by the stage 37 from below. Note that this edge portion includes a portion to be crimped to which the ACF is adhered on the substrate 3 .

A crimping tool 34 holds the component 5 and crimps the component 5 onto the top surface of the substrate 3 supported by the backup stage 36 . That is, the crimping tool 34 crimps the component 5 onto the crimping target portion of the substrate 3 . Specifically, the crimping tool 34 ascends and descends in the Z-axis direction and sucks (that is, picks up) the component 5 moved by the component transfer mechanism 35 from above. Then, the crimping tool 34 temporarily crimps the component 5 onto the substrate 3 by mounting the sucked component 5 on the ACF and pressing the component 5 together with the substrate 3 against the backup stage 36 .

The transport mechanism 62B has the same configuration as the transport mechanism 62A and is arranged on the moving base 61. As shown in FIG. Such a transport mechanism 62</b>B receives the substrate 3 placed on the stage 37 of the temporary pressure bonding section 30 and transfers it to the stage 49 of the final pressure bonding section 40 .

The final compression bonding section 40 performs a final compression bonding process (also referred to as a thermocompression bonding process) in which the component 5 temporarily bonded to the substrate 3 by the temporary compression bonding section 30 is finally bonded (that is, thermocompression bonded) to the substrate 3 . By doing so, the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF. Such a main pressure-bonding unit 40 includes a substrate moving mechanism 41 and a pressure-bonding mechanism 42 .

The substrate moving mechanism 41 has the same structure as the substrate moving mechanism 21 of the sticking section 20 . Specifically, the substrate moving mechanism 41 has a stage 49 . The upper surface of the stage 49 is provided with a plurality of suction holes 49a. The substrate moving mechanism 41 holds the substrate 3 placed on the stage 49 by vacuum suction through the plurality of suction holes 49a. Further, the substrate moving mechanism 41 has a function of moving a stage 49 for sucking and holding the substrate 3 in a horizontal plane, raising and lowering the stage 49 in the vertical direction, and rotating it around the Z axis. The substrate moving mechanism 41 moves and rotates the stage 49 to position the area where the part 5 of the substrate 3 held by suction is temporarily crimped above the crimping support portion 46 of the crimping mechanism 42 .

The crimping mechanism 42 includes a crimping tool 43 and a crimping support 46 , and the crimping tool 43 heated to about 200° C., for example, presses the component 5 of the substrate 3 toward the crimping support 46 . As a result, the component 5 is fully pressure-bonded, and the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF.

The transport mechanism 62C has the same configuration as the transport mechanism 62A and is arranged on the moving base 61. As shown in FIG. Such a transport mechanism 62</b>C receives the substrate 3 placed on the stage 49 of the main pressure bonding section 40 and transfers it to a device or the like outside the component pressure bonding apparatus 1 .

FIG. 3 is a perspective view showing an example of the appearance of the component crimping device 1. As shown in FIG.

The component crimping device 1 has a housing 7 . The housing 7 accommodates the sticking section 20, the temporary pressure bonding section 30, the main pressure bonding section 40, and the component supply section 50 shown in FIG. Moreover, a plurality of intake units 71 and a plurality of exhaust units 72 are attached to such a housing 7 . For example, the plurality of intake units 71 are attached to the top of the housing 7 and the plurality of exhaust units 72 are attached to the sides of the housing 7 . Specifically, the suction unit 71 is attached to a portion above each of the sticking unit 20 , the temporary pressure bonding unit 30 , the main pressure bonding unit 40 , and the component supply unit 50 in the housing 7 . Further, for example, the two exhaust units 72 are attached to respective side portions of the adhering unit 20 , the temporary pressure bonding unit 30 , the main pressure bonding unit 40 , and the component supply unit 50 in the housing 7 .

The intake unit 71 includes a motor, a fan rotated by the motor, and a filter such as a HEPA (High Efficiency Particulate Air) filter. A fan rotated by a motor supplies air around the component crimping device 1 , that is, outside the housing 7 to the inside of the housing 7 . At this time, the outside air passes through the filter and is sent into the housing 7 . As a result, particles such as dust contained in the outside air are removed by the filter. Therefore, the outside air is purified and supplied to the inside of the housing 7 as clean air.

Like the intake section 71, the exhaust section 72 includes a motor and a fan rotated by the motor. A fan rotated by a motor discharges the air inside the housing 7 to the outside of the housing 7 .

FIG. 4 is a diagram showing a specific arrangement example of the intake section 71 and the exhaust section 72. As shown in FIG. 4A shows the component crimping device 1 viewed from the negative side in the Y-axis direction, and FIG. 4B shows the component crimping device 1 viewed from the positive side in the Z-axis direction. FIG. 4(c) shows the component crimping device 1 viewed from the positive side in the X-axis direction.

As shown in (a) and (c) of FIG. Air is supplied to the second space in which the sticking portion 20 is arranged. In this second space, the attaching part 20 attaches the ACF to the electrode part 4 of the substrate 3 . Further, among the plurality of air intake portions 71, the air intake portion 71b attached to the portion above the temporary pressure bonding portion 30 in the housing 7 is located in the first space in the housing 7 where the temporary pressure bonding portion 30 is arranged. supply air to In this first space, the crimping tool 34 of the temporary crimping section 30 temporarily crimps the component 5 to the electrode section 4 of the substrate 3 via the ACF. Among the plurality of air intake portions 71, the air intake portion 71c attached to the portion above the main pressure bonding portion 40 in the housing 7 is located in the third space in the housing 7 where the main pressure bonding portion 40 is arranged. supply air to In this third space, the crimping tool 43 of the final crimping section 40 performs the final crimping operation of the component 5 onto the board 3 . Among the plurality of air intake units 71, the air intake unit 71d attached to a portion above the component supply unit 50 in the housing 7 is located in the fourth space in the housing 7 where the component supply unit 50 is arranged. supply air to In the fourth space, the punching section 52 punches out the component 5 from the tape wound around the supply reel 51, places the component 5 on the movable stage 53, and supplies it to the temporary crimping section 30. will be

On the other hand, as shown in FIG. 4B, among the plurality of exhaust units 72, the four exhaust units 72a attached to the side portions of the sticking portion 20 in the housing 7 are the above-described first exhaust units. Air in two spaces is discharged to the outside of the housing 7 . Two of the four exhaust portions 72a are attached to a portion of the housing 7 on the front side of the sticking portion 20, and the remaining two exhaust portions 72a are attached to the housing. 7 is attached to a portion on the back side of the sticking portion 20 . Among the plurality of exhaust units 72, two exhaust units 72b attached to the side portions of the temporary crimping unit 30 in the housing 7 discharge the air in the first space to the outside of the housing 7. . The two exhaust portions 72b are attached to a portion of the housing 7 on the front side of the temporary crimping portion 30. As shown in FIG. Among the plurality of exhaust units 72, four exhaust units 72c attached to the side portions of the main crimping unit 40 in the housing 7 discharge the air in the third space to the outside of the housing 7. . Two of the four exhaust portions 72c are attached to the front side of the main crimping portion 40 in the housing 7, and the remaining two exhaust portions 72c are attached to the housing. 7 on the back side of the main crimping portion 40 . Among the plurality of exhaust units 72, two exhaust units 72d attached to a portion of the housing 7 on the side of the component supply unit 50 discharge the air in the fourth space to the outside of the housing 7. . The two exhaust units 72d are attached to a portion of the housing 7 on the back side of the component supply unit 50. As shown in FIG.

Here, the substrate 3 moves along the movement path from the sticking section 20 to the final pressure bonding section 40 via the temporary pressure bonding section 30 . This movement is performed by transport mechanisms 62A, 62B and 62C, for example. Also, the moving path is a path along the X-axis direction. In the present embodiment, the plurality of intake units 71 are arranged above the movement path in the housing 7, and the plurality of exhaust units 72 are arranged in the area below the movement path in the housing 7. placed in

As a result, in the first space, the second space, the third space, and the fourth space, a downflow air current is generated in which air flows downward from above the substrate 3 .

FIG. 5 is a block diagram showing an example of the functional configuration of the component crimping device 1. As shown in FIG.

The component crimping device 1 includes a control section 10 as shown in FIG. The control unit 10 is communicably connected to, for example, the adhering unit 20, the temporary pressure bonding unit 30, the main pressure bonding unit 40, and the component supply unit 50 by control lines, and controls these units. The component supply unit 50 includes a supply mechanism 50a including the supply reel 51, the punching unit 52, the movable stage 53, the rails 54, and the like, and is controlled by the control unit 10. The control unit 10 may be a computer. Also, the control unit 10 may be realized by a processor such as a CPU (Central Processing Unit) that executes a control program stored in a storage unit provided in the component crimping apparatus 1 . The storage unit may be a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), or may be an HDD (Hard Disk Drive).

Further, the control section 10 controls the intake section 71 a and the four exhaust sections 72 a arranged with respect to the sticking section 20 . Similarly, the control section 10 controls the intake section 71 b and the two exhaust sections 72 b arranged with respect to the temporary pressure bonding section 30 . Further, the control unit 10 controls the intake unit 71c and the four exhaust units 72c arranged for the main pressure bonding unit 40, and controls the intake unit 71d and the two exhaust units 72c arranged for the component supply unit 50. It controls the exhaust section 72d. Note that the control unit 10 may be housed in the housing 7 or may be arranged outside the housing 7 .

In this embodiment, the plurality of intake units 71 and the plurality of exhaust units 72 provided in the component crimping device 1 are configured as an air pressure adjustment mechanism 70 that adjusts the air pressure inside the housing 7 .

Such an air pressure adjustment mechanism 70 is configured such that the air pressure in the first space in which the temporary pressure bonding portion 30 is arranged in the housing 7 is adjusted by (i) the adhesion portion in the housing 7 by the supply and discharge of the air described above. 20 is arranged, and (ii) the pressure in the housing 7 is higher than the pressure in the third space where the main pressure-bonding part 40 is arranged. adjust. Further, the atmospheric pressure adjustment mechanism 70 is configured to make the atmospheric pressure in the first space higher than the atmospheric pressure in the fourth space where the component supply section 50 is arranged in the housing 7 by the supply and discharge of the air described above. First, the air pressure inside the housing 7 is adjusted.

[Air supply and discharge and atmospheric pressure distribution]
FIG. 6 is a diagram showing an example of air supply and discharge and an air pressure distribution within the housing 7. As shown in FIG. Incidentally, FIG. 6(a) shows an example of air supply and discharge when the component crimping device 1 is viewed from the negative side in the Y-axis direction, and FIG. 7 shows an example of air pressure distribution in . (c) of FIG. 6 shows an example of air supply and discharge when the component crimping device 1 is viewed from the positive side in the X-axis direction, and (d) of FIG. shows an example of atmospheric pressure distribution.

For example, as shown in (a) of FIG. 6 , the air intake portion 71 a supplies air to the second space of the adhering portion 20 , and the air intake portion 71 b supplies air to the first space of the temporary pressure bonding portion 30 . , the intake portion 71 c supplies air to the third space of the main crimping portion 40 . At this time, the volume of air supplied by the intake portion 71b is greater than the volume of air supplied by the intake portion 71a and the volume of air supplied by the intake portion 71c. Further, the four exhaust units 72a exhaust air from the second space of the adhering unit 20 to the outside, the two exhaust units 72b exhaust air from the first space of the temporary pressure bonding unit 30 to the outside, The four exhaust portions 72c exhaust air from the third space of the main crimping portion 40 to the outside. At this time, the volume of air discharged by the exhaust portion 72b is smaller than the volume of air discharged by the exhaust portion 72a and the volume of air discharged by the exhaust portion 72c.

As a result, as shown in FIG. 6B, an air pressure distribution is formed in the housing 7 in which the air pressure in the first space is higher than the air pressure in the second and third spaces. In the graph shown in FIG. 6(b), the vertical axis indicates atmospheric pressure, and the horizontal axis indicates the position in the X-axis direction in the component crimping apparatus 1. As shown in FIG.

In other words, in the present embodiment, the plurality of intake units 71 are configured such that the volume of air supplied to the first space is greater than the volume of air supplied to each of the second space and the third space. Air outside the housing 7 is sucked into the housing 7 .

Further, in the present embodiment, the plurality of exhaust units 72 are arranged such that the volume of air discharged from the first space is smaller than the volume of air discharged from each of the second space and the third space. The air inside the housing 7 is discharged to the outside of the housing 7. - 特許庁

Thereby, the air pressure in the first space can be easily and efficiently made higher than the air pressure in the second and third spaces. Since the air pressure in the first space is higher than the air pressure in the second and third spaces, an air current flowing from the first space to the second and third spaces is generated inside the housing 7 . As a result, even if particles rise up in the second space and the third space due to the work in the sticking part 20 and the main pressure-bonding part 40, it is possible to prevent the particles from drifting and entering the first space. That is, when the temporary pressure-bonding portion 30 arranged in the first space places the component 5 on the substrate 3 , the possibility of the particles entering between the component 5 and the substrate 3 can be suppressed. Therefore, it is possible to suppress the decrease in the yield of the mounted substrate due to the particles adhering to the bonding portion between the substrate 3 and the component 5, and improve the productivity of the mounted substrate. In other words, the cleanliness of the first space can be improved, and the quality of the mounting board can be improved.

Further, for example, as shown in (c) of FIG. 6, the air intake portion 71b supplies air to the first space of the temporary pressure bonding portion 30, and the air intake portion 71d supplies air to the fourth space of the component supply portion 50. supply. At this time, the volume of air supplied by the intake portion 71b is greater than the volume of air supplied by the intake portion 71d. Further, the two exhaust portions 72b exhaust air from the first space of the temporary crimping portion 30 to the outside, and the two exhaust portions 72d exhaust air from the fourth space of the component supply portion 50 to the outside. At this time, the volume of air discharged by the exhaust portion 72b is smaller than the volume of air discharged by the exhaust portion 72d.

As a result, as shown in (d) of FIG. 6, an air pressure distribution is formed in the housing 7 in which the air pressure in the first space is higher than the air pressure in the fourth space. The vertical axis of the graph shown in (d) of FIG. 6 indicates atmospheric pressure, and the horizontal axis indicates the position in the component crimping apparatus 1 in the Y-axis direction.

In other words, in the present embodiment, the plurality of air intake units 71 are provided outside the housing 7 so that the volume of air supplied to the first space is greater than the volume of air supplied to the fourth space. Air is sucked into the housing 7 . Further, in the present embodiment, the plurality of exhaust units 72 are arranged inside the housing 7 so that the volume of air discharged from the first space is smaller than the volume of air discharged from the fourth space. Air is discharged outside the housing 7 .

Thereby, the air pressure in the first space can be easily and efficiently made higher than the air pressure in the fourth space. Since the air pressure in the first space is higher than that in the fourth space, an air current is generated within the housing 7 from the first space to the fourth space. As a result, even if particles are soaring in the fourth space due to work in the component supply section 50, it is possible to prevent the particles from floating and entering the first space. That is, when the temporary pressure-bonding portion 30 arranged in the first space places the component 5 on the substrate 3 , the possibility of the particles entering between the component 5 and the substrate 3 can be suppressed. Therefore, it is possible to further suppress the decrease in the yield of the mounted substrate due to the particles adhering to the bonding portion between the substrate 3 and the component 5, and to further improve the productivity of the mounted substrate.

[Processing operation]
FIG. 7 is a flow chart showing an example of the processing operation of the component crimping device 1 according to this embodiment.

First, the component pressure-bonding apparatus 1 performs an air pressure adjustment step of adjusting the air pressure inside the housing 7 using the air pressure adjustment mechanism 70 described above (step S1). That is, when the adhering portion 20, the temporary pressure-bonding portion 30, the main pressure-bonding portion 40, and the component supply portion 50 are accommodated in the housing 7, the temporary pressure-bonding portion 30 is arranged in the housing 7 in the atmospheric pressure adjustment process. (i) the pressure of the second space in which the adhering portion 20 is arranged in the housing 7; The atmospheric pressure adjustment mechanism 70 adjusts the atmospheric pressure in the housing 7 so that it is higher than the atmospheric pressure in the third space and (iii) the atmospheric pressure in the fourth space where the component supply unit 50 is arranged in the housing 7. do.

Next, the component crimping device 1 performs a substrate supply step (step S2). In this substrate supply step, the bonding section 20 affixes the ACF to the electrode section 4 of the substrate 3 and supplies the substrate 3 to the temporary pressure bonding section 30 . Next, the component pressure bonding apparatus 1 performs a component placement step (step S3). In this component mounting step, the temporary pressure bonding section 30 mounts the component 5 on the substrate 3 supplied from the bonding section 20 . In other words, the temporary pressure-bonding section 30 temporarily pressure-bonds the component 5 to the electrode section 4 of the substrate 3 via the ACF. Then, the component compression bonding apparatus 1 performs a thermocompression bonding process (step S4). In this thermocompression bonding process, the main compression bonding section 40 thermocompression bonds the component 5 placed on the substrate 3 to the substrate 3 . Note that the processing of steps S1 to S4 described above is realized by control by the control unit 10. FIG.

As described above, in the present embodiment, the air pressure in the first space in the housing is adjusted to be higher than the air pressures in the second, third, and fourth spaces. A decrease in yield can be suppressed, and the productivity of mounting substrates can be improved.

In addition, since the air pressure inside the housing 7 is adjusted by the plurality of intake units 71 and the plurality of exhaust units 72, the air pressure inside the housing 7 can be easily adjusted. Although the air pressure adjustment mechanism 70 in the present embodiment specifically includes four intake units 71 and 12 exhaust units 72, the air pressure adjustment mechanism 70 may include only one intake unit 71. Alternatively, only one vent 72 may be provided. Further, the number of intake units 71 provided in the atmospheric pressure adjustment mechanism 70 is not limited to four, and the number of exhaust units 72 provided in the atmospheric pressure adjustment mechanism 70 is not limited to twelve. In other words, the atmospheric pressure adjustment mechanism 70 in the present embodiment includes one or more intake units 71 that purify the air outside the housing 7 and suck it into the housing 7, and the air inside the housing 7. It has at least one of one or more exhaust parts 72 for discharging to the outside of 7 . Even in such a case, the air pressure inside the housing 7 can be easily adjusted. At least one air intake portion 71b of the one or more air intake portions 71 is arranged in contact with the first space as shown in FIG. That is, the intake part 71b supplies the air outside the housing 7 to the first space. The air pressure in the first space can be easily increased by the intake portion 71b.

Furthermore, inside the housing 7 in the present embodiment, a downflow airflow is generated that flows downward from above the substrate 3, so that particles below the substrate 3 can be suppressed from rising upward. As a result, it is possible to prevent particles from adhering to the upper surface of the substrate 3 on which the work is performed, thereby further improving the productivity of mounting substrates.

(Modification 1)
In the above embodiment, as shown in FIG. 4(c), the space between the first space and the fourth space is wide open, but only a portion is opened and the remaining portion is partitioned by the housing 7. may have been

FIG. 8 is a diagram showing an example of the housing 7 in Modification 1 of the above embodiment.

For example, the housing 7 may include a first housing 7a, a second housing 7b, and a duct 8. The first housing 7 a houses the sticking section 20 , the temporary pressure bonding section 30 and the final pressure bonding section 40 , and the second housing 7 b houses the component supply section 50 . The duct 8 is a passage for conveying the component 5 from the component supplying section 50 to the temporary crimping section 30, and connects the first housing 7a and the second housing 7b.

Even with such a housing 7 shown in FIG. 8, it is possible to achieve the same effects as those of the above-described embodiment.

(Modification 2)
In the above embodiment, one or more intake units 71 and one or more exhaust units 72 are provided for each of the first space, the second space, the third space, and the fourth space, but the present invention is not limited to this. .

FIG. 9 is a diagram showing an example of attachment of the intake section 71 and the exhaust section 72 in Modification 2 of the above-described embodiment. FIG. 9(a) shows a state in which the part of the component crimping device 1 excluding the component supply unit 50 is viewed from the negative side in the Y-axis direction, and FIG. The state where the part except the supply part 50 is seen from the positive side in the Z-axis direction is shown.

For example, the intake section 71 may supply air to the first space, the second space, and the third space inside the housing 7 via a pipe 73, as shown in FIG. 9(a). In this case, the opening of the pipe 73 contacting the first space is wider than the opening of the pipe 73 contacting the second space and the opening contacting the third space. Therefore, even in such a case, the volume of air supplied to the first space can be made larger than the volume of air supplied to each of the second space and the third space. In other words, the air pressure in the first space can be made higher than the air pressure in the second and third spaces, and effects similar to those of the above embodiment can be achieved.

Similarly, for example, as shown in FIG. good too. In this case, the opening of the pipe 74 contacting the first space is narrower than the opening of the pipe 74 contacting the second space and the opening contacting the third space. Therefore, even in such a case, the volume of air discharged from the first space can be made smaller than the volume of air discharged from each of the second space and the third space. That is, the air pressure in the first space can be made higher than the air pressure in the second and third spaces, and the same effects as those of the above-described embodiment can be achieved.

As described above, the component crimping device according to one or more aspects has been described based on the above embodiment and its modification, but the present disclosure is not limited to this embodiment and modification. As long as it does not deviate from the spirit of the present disclosure, various modifications that a person skilled in the art can think of are applied to the above embodiment and its modifications, and a form constructed by combining the components of the above embodiment and its modifications may be included within the scope of this disclosure.

For example, in the above embodiment and its modification, the substrate 3 is a liquid crystal panel, and the component 5 is temporarily pressure-bonded and permanently pressure-bonded to the liquid crystal panel, but the substrate 3 may be a substrate other than the liquid crystal panel. .

Further, the component supply unit 50 of the component pressure bonding apparatus 1 in the above embodiment and its modification supplies the components 5 punched out from a tape such as TCP to the temporary pressure bonding unit 30. may be supplied to the temporary crimping portion 30 .

Further, the atmospheric pressure adjustment mechanism 70 in the above-described embodiment and its modification forms an atmospheric pressure distribution within the housing 7 as shown in FIG. Air may be supplied and exhausted so as to maintain positive pressures in the 3rd space and the 4th space. Thus, even if the cover attached to the housing 7 is opened, the positive pressure inside the housing 7 makes it difficult for particles outside the housing 7 to enter the housing 7 .

Further, in the above-described embodiment and its modified example, each of the intake section 71 and the exhaust section 72 has a fan, but one of them may not have a fan. For example, when the intake section 71 does not have a fan, the intake section 71 is configured as an intake hole in which a HEPA filter is arranged, for example. In this case, the air outside the housing 7 is forced into the housing 7 through the air intake holes and the HEPA filter by actively discharging air to the outside of the housing 7 by the fans of one or more exhaust units 72. supplied. Further, when the exhaust portion 72 does not have a fan, the exhaust portion 72 is configured as an exhaust hole. In this case, the air in the housing 7 is discharged to the outside of the housing 7 through the exhaust holes by positively supplying air into the housing 7 by the fans of one or more intake units 71. .

In addition, in the above-described embodiment and its modification, partition plates are not arranged between the first space, the second space, and the third space, except for the movement path for moving the substrate 3. A partition plate may be arranged in the range.

Also, the control unit 10 may be composed of one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit. One or more electronic circuits may include, for example, a semiconductor device, an IC (Integrated Circuit), or an LSI (Large Scale Integration). An IC or LSI may be integrated on one chip or may be integrated on a plurality of chips. Although they are called ICs or LSIs here, they may be called system LSIs, VLSIs (Very Large Scale Integrations), or ULSIs (Ultra Large Scale Integrations) depending on the degree of integration. An FPGA (Field Programmable Gate Array) that is programmed after the LSI is manufactured can also be used for the same purpose.

INDUSTRIAL APPLICABILITY The present disclosure can be used, for example, in a component crimping device for producing liquid crystal displays and the like.

1 component crimping device 3 substrate 4 electrode unit 5 component 7 housing 7a first housing 7b second housing 8 duct 10 control unit 20 pasting unit (substrate supply unit)
21 Substrate moving mechanism 22 Sticking mechanism 23 Stage 23a Suction hole 30 Temporary pressure bonding section (component mounting section)
31 substrate moving mechanism 32 component mounting mechanism 34 pressure bonding tool 35 component transfer mechanism 36 backup stage 37 stage 37a suction hole 40 main pressure bonding portion (thermal compression bonding portion)
41 substrate moving mechanism 42 crimping mechanism 43 crimping tool 46 crimping support portion 49 stage 49a suction hole 50 component supply portion 50a supply mechanism 51 supply reel 52 punching portion 53 movable stage 54 rail 61 movement base 62A transfer mechanism 62B transfer mechanism 62C transfer mechanism 63 Base 64 Arm unit 70 Atmospheric pressure adjustment mechanisms 71, 71a, 71b, 71c, 71d Intake units 72, 72a, 72b, 72c, 72d Exhaust units 73, 74 Piping

Claims (8)

a substrate supply unit that supplies substrates;
a component placement section for placing a component on the supplied substrate;
a thermocompression bonding unit for thermocompression bonding the component placed on the substrate to the substrate;
a housing that accommodates the substrate supply unit, the component placement unit, and the thermocompression bonding unit;
(i) the air pressure of a second space in the housing where the substrate supply section is arranged; and (ii) the housing. an air pressure adjustment mechanism that adjusts the air pressure in the housing so as to be higher than the air pressure in the third space where the thermocompression bonding part is arranged in the body;
A component crimping device comprising: further comprising a component supply unit that supplies the component to the component placement unit;
The housing further accommodates the component supply unit,
The atmospheric pressure adjustment mechanism is
Adjusting the air pressure in the housing so that the air pressure in the first space is higher than the air pressure in the fourth space where the component supply unit is arranged in the housing;
The component crimping device according to claim 1. The atmospheric pressure adjustment mechanism includes one or more suction units that purify air outside the housing and suck it into the housing, and one or more that discharge the air inside the housing to the outside of the housing. and at least one of
The component crimping device according to claim 1 or 2. At least one of the one or more air intake units is arranged in contact with the first space,
The component crimping device according to claim 3. The one or more intake units are arranged in the housing such that the volume of air supplied to the first space is greater than the volume of air supplied to each of the second space and the third space. sucking external air into the interior of the housing;
5. The component crimping device according to claim 3 or 4. The one or more exhaust units are arranged in the housing such that the volume of air discharged from the first space is smaller than the volume of air discharged from each of the second space and the third space. discharging internal air to the outside of the housing;
The component crimping device according to any one of claims 3 to 5. the substrate moves along a moving path from the substrate supply unit to the thermocompression bonding unit via the component placement unit;
The one or more intake units are arranged at a portion above the movement path in the housing,
The one or more exhaust units are arranged at a portion below the movement path in the housing,
The component crimping device according to any one of claims 3 to 6. When the substrate supply unit, the component placement unit, and the thermocompression bonding unit are housed in a housing, the air pressure in the first space where the component placement unit is arranged in the housing is (i) the housing. (ii) pressure in a third space in the body where the thermocompression bonding part is arranged; An atmospheric pressure adjustment step of adjusting the atmospheric pressure in
a substrate supply step in which the substrate supply unit supplies the substrate to the component mounting unit;
a component placement step in which the component placement unit places a component on the substrate supplied from the substrate supply unit;
a thermocompression bonding step of thermocompression bonding the component placed on the substrate to the substrate by the thermocompression bonding unit;
including parts crimping method.

Images