JP4291393B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus that mounts a bare IC component and a surface mounting component on a substrate.

  Conventionally, in an electronic component mounting facility that mounts electronic components on a board, a plurality of electronic component mounting apparatuses are arranged in a line and combined to form a mounting line. A circuit board is manufactured by mounting components.

  As each electronic component mounting apparatus that mounts electronic components on a substrate, a plurality of mounting heads are arranged at intervals of the intermittent rotation angle on the outer periphery of a rotating body that rotates intermittently, and each mounting head has a supply position and a mounting position. The electronic component is moved to the supply position by moving the component supply unit to move the component supply unit, the predetermined mounting position of the substrate is positioned at the mounting position, and the electronic component is placed at the predetermined position on the substrate by the mounting head. Various methods such as mounting method, mounting and fixing the substrate, taking out a predetermined electronic component from the component supply unit with a mounting head movable in the XY direction, and moving to a predetermined mounting position on the substrate to mount A method is known.

  On the other hand, as an electronic component mounting apparatus for mounting a bare IC component in a state where a semiconductor wafer is diced on a substrate, one disclosed in, for example, Japanese Patent Application Laid-Open No. 2000-68327 is known. In the electronic component mounting apparatus, a bare IC chip is supplied onto an XY table in the state of a diced semiconductor wafer, a predetermined bare IC component is positioned at a first supply position on the XY table, and the reverse transfer means is used. The predetermined bear IC component is held at the first supply position, turned upside down and transferred to the second supply position, and held by the mounting head at the second supply position, while the substrate is held in the Y-direction table. The mounting head is mounted and fixed on a support table movable in the Y direction, and the mounting head is moved to the X direction position of the mounting position on the substrate by the X direction table, and the Y direction position of the mounting position on the substrate is Y of the mounting head. The board is moved by the Y-direction table so that it matches the direction position, and after positioning the mounting position of the bare IC component and the board, the bare IC component is mounted by the mounting head. There.

  The bare IC component is mounted on the substrate in a clean room or the like completely separate from the mounting process of the electronic component. This is because bare IC parts are highly integrated and miniaturized, so the number of electrodes and the fine pitch are remarkably high, and high-precision mounting is required, and the mounting environment is high to prevent poor bonding due to dust. This is because cleanliness is strongly required.

  Then, after the bare IC component is mounted on the substrate in this way to constitute the electronic component, the electronic component is supplied to the electronic component mounting facility together with other electronic components to manufacture the circuit board of the electronic device. It was.

  By the way, in recent years, as IC integration has further increased, the size of bare IC components has increased, and accordingly, the number of electronic components mounted on a single circuit board has been reduced. The circuit board has been downsized for mounting on portable devices and the like.

  However, mounting bare IC parts and other electronic parts in completely separate processes as in the above-mentioned conventional example, the man-hours and costs for wasteful manufacturing processes and parts management / transport are large, and circuit There is a problem that there is a limit to downsizing of the substrate, and it has been required to mount a bare IC component and another surface mounting component on a single substrate.

Therefore, an electronic component mounting facility that can mount all bare IC components and surface mounted components to be mounted on a substrate on a single mounting line, and both bare IC components and surface mounted components with one electronic component mounting device Development of electronic component mounting equipment that can be mounted in a mixed manner is required, but the cleanliness of the mounting environment is ensured without raising equipment costs, and the high-precision mounting required for mounting bare IC components is also required. There are problems such as difficulty in realization at high speed.
In view of such circumstances, the present invention provides an electronic component mounting apparatus capable of mounting a bare IC component and a surface mounting component in a mixed manner while ensuring a cleanness of a mounting environment without increasing equipment costs. For the purpose.

The present invention relates to a substrate transport / positioning means for loading, positioning, and unloading a substrate in the X direction , and a bearer provided on one side of the substrate transport / positioning means in the Y direction (a direction perpendicular to the X direction). The IC component supply means, the surface mount component supply means provided on the other side of the substrate conveying / positioning means in the Y direction , and the bare IC component supplied from the bare IC component supply means are turned upside down. an inverting transport means for supplying the first component supply position, wherein the predetermined mounting position of the substrate holding surface mount components from the supply means of the first bare IC component or the surface mounting component of the component supply position In an electronic component mounting apparatus provided with a mounting means for mounting and mounting a bare IC component and the surface-mounted component together , a space in which the reverse transfer means, the substrate transport / positioning means, and the mounting means are disposed Close Together constituting between, carrying portions of the substrate transfer and positioning means, and the carry-out position, the substrate is transported, the cover having an opening to be carried out provided, and cleaned in the closed space in the upper central portion of the cover air Cleaning air introducing means is provided for opening and closing the opening through which the substrate of the cover is loaded and unloaded, and the opening is opened when the substrate is loaded and unloaded, and the shutter is closed during the mounting operation. to comprise, further characterized in that the dust in the closed space of the cover provided with the exhaust duct on the back of the cover of the supply means side by the Hare before Symbol surface mounting component is discharged along with air.

  According to the above invention, since the cleanliness of the substrate can be maintained until the bare IC component is mounted, the bare IC component can also be mounted with high reliability, and the bare IC component and other surface mount components are mixedly mounted. Thus, the mounted circuit board can be manufactured with high productivity. In addition, by introducing purified air into the closed space around the mounting portion, a clean atmosphere can be maintained, and mounting can be performed with high reliability even when mounting bare IC components. Moreover, since the exhaust means for discharging the dust in the closed space together with the air is provided, the cleanliness in the closed space can be reliably maintained higher. In addition, since the shutter is provided in the substrate loading / unloading opening formed in the cover that defines the closed space, opening the shutter only when loading / unloading the substrate prevents dust from entering the closed space and cleans it. High degree can be maintained.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

  In FIG. 1, reference numeral 1 denotes an electronic component mounting facility, which prints cream solder on a cleaning device 3 such as a plasma cleaning device or a UV cleaning device that removes dust adhering to a substrate, and a bonding electrode of a surface mounting component on the substrate. The screen printing device 4 to be applied, the electronic component mounting device 5 for mounting and mounting the bare IC component and the surface mounting component, the electronic component mounting device 6 for mounting the surface mounting component, and the cream solder for joining the surface mounting component are reflowed. Each mounting device is composed of a single mounting line 2 that is connected to the reflow device 7 in a line, and each of the mounting devices from the cleaning device 3 to the electronic component mounting device 5 that mounts the bare IC component, that is, The printing device 4 and the electronic component mounting device 5 are provided with a cleaning means 8 that forms a periphery of the mounting portion in a closed space and maintains the cleanliness of the closed space, so that the mounting portion is maintained in a cleaned atmosphere. There is a the clean area.

  In the electronic component mounting equipment 1 having the above configuration, when a substrate is carried into the starting end of the mounting line 2, dust on the substrate is cleaned and cleaned by the cleaning device 3, and then the substrate is cleaned 8. Is supplied to the screen printing device 4 in a clean atmosphere, and cream solder is printed on the bonding electrode portion of the surface mount component of the substrate, and then the electronic component mounting in which the substrate is also cleaned in the clean means 8 The device 5 is supplied and a bare IC component and a surface mount component are mixedly mounted on the substrate. The board after the mounting of the bare IC components is supplied to the electronic component mounting apparatus 6 not provided with the cleaning means 8 and the remaining surface mounted components are mounted, and then all the electronic components are mounted. The substrate is supplied to the reflow device 7, and the cream solder is reflowed to complete the bonding between the surface mount component and the substrate. In this way, the board on which mounting of the electronic components is completed is carried out from the end of the mounting line 2.

  If the bare IC component has insufficient heat resistance against the reflow temperature, a reflow device 7 that can perform local reflow for selectively reflowing the placement portion of the surface mount component is used.

  Thus, by maintaining the cleanliness of the substrate until the bare IC component is mounted on the mounting line 2, the bare IC component can also be mounted with high reliability, and the cleaning means 8 is provided only at a necessary portion of the mounting line 2. Therefore, the installation cost is not increased, and a circuit board on which a bare IC component and other surface mounting components are mixedly mounted can be manufactured with high productivity.

  Next, as a specific configuration example of the mounting apparatus provided with the cleaning means 8, a bare IC component, a chip component such as a capacitive element or a resistance element, or a leaded component in which a connection lead is provided in at least a part of the four circumferences, etc. An electronic component mounting apparatus 5 that mounts surface-mounted components mixedly mounted on a substrate will be described with reference to FIGS.

  The electronic component mounting apparatus 5 includes a main body portion 11 and component supply portions 12 and 13 disposed on both front and rear sides thereof. Each component supply part 12 and 13 is comprised as a unit couple | bonded with the main-body part 11 so that replacement | exchange is possible.

  The front-side component supply unit 12 includes a component magazine 16 containing a plurality of semiconductor wafers 15 formed on a plurality of bare IC components 14 arranged and diced into individual pieces and supported on an expanded sheet. The magazine lifter 17 positions the desired semiconductor wafer 15 at a predetermined supply height position.

  The rear-side component supply unit 13 moves a plurality of component supply cassettes 19 mounted with a tape-shaped component assembly containing a large number of surface-mounted components 18 on a component supply table 20 that can move left and right. The surface mount component 18 of an optional component supply cassette 19 is supplied to the second component supply position B as shown in FIG.

  At the front part of the main body 11, an expand base 21 is installed on an X-direction table 22 that can move in the X direction in the left-right direction so that it can be moved up and down by an upper and lower cylinder 23. The semiconductor wafer 15 is configured to be introduced from the component magazine 16 of the component supply unit 12 into the expanding table 21. The expanding sheet is expanded by the expanding table 21 to separate the bare IC components 14 at intervals. A desired bare IC component 14 is configured to be positioned at a predetermined position in the X direction.

  Reference numeral 24 denotes a recognition camera for recognizing the bare IC component 14 positioned at a predetermined X direction position on the expand base 21, and is arranged to be movable in the Y direction. As shown in FIG. 3, from the front part to the middle part of the main body part 11, there is a component supply region D corresponding to the size in the Y direction of the semiconductor wafer 15 on the expand base 21 positioned at a predetermined X direction position. An inversion transfer means 25 that adsorbs any of the bare IC components 14 and moves rearward in the Y direction, transfers to the first component supply position A, and reverses the adsorbed bare IC components 14 upward 180 degrees. It is arranged. In the state of the semiconductor wafer 15, the protruding electrodes of each bare IC component 14 are formed upward, and the reverse transfer means 25 sucks the protruding electrode arrangement surface of each bare IC component 14 and then turns upward 180 degrees. Thus, the protruding electrode arrangement surface of the bare IC component 14 is directed downward, and is transferred to the mounting means 26 at the first component supply position A in this state.

  The mounting means 26 includes a mounting head 27 that holds the bare IC component 14 or the surface mounting component 18 and mounts it on the substrate 30, and the mounting head 27 between the first component supply position A and the second component supply position B. And a Y-direction table 28 that moves and positions in the Y-direction.

  The position where the electronic component (the bare IC component 14 or the surface mounting component 18) should be mounted on the substrate 31 by moving the substrate 30 in the X direction below the moving path in the Y direction of the mounting head 27 at the rear portion of the main body 11. An X-direction table 29 for positioning at a mounting position in the X direction by the mounting head 27 is disposed, and a support base 30 for mounting and fixing the substrate 31 is provided on the X-direction table 29 so as to be movable up and down.

  By positioning the mounting head 27 with the Y-direction table 28 at a predetermined mounting position within the mounting range C corresponding to the Y-direction width of the substrate 31 positioned with the X-direction table 29 in this way, a predetermined electronic component is placed. The circuit board 31 is configured to be mounted at a predetermined mounting position.

  Further, the electronic component held on the mounting head 27 is recognized on the upper side between the mounting head 27 and the support base 30, and both positions where the electronic components on the substrate 31 are to be mounted can be recognized on the lower side. Simultaneous recognition means 32 is provided. The simultaneous recognition means 32 is supported so that it can be positioned at any position within the mounting range C in the Y direction and can be moved between a mounting position by the mounting head 27 and a position retracted from the mounting position in the X direction. .

  On one side in the X direction of the X direction table 29 (right side in the figure), a loading portion 33 for carrying the substrate 31 onto the support base 30 is located on the other side in the X direction of the X direction table 29 from above the support base 30. An unloading part 34 for unloading is disposed. A partial rail 35 that can be connected to a pair of rails of the carry-in portion 33 and the carry-out portion 34 and that can be raised and lowered is provided on both front and rear sides of the support base 30. After receiving the substrate 31 on the partial rail 35, the support base 30 is provided. It is configured to be mounted and fixed on the top.

  Next, the cleaning means 8 provided in the electronic component mounting apparatus 5 having the above configuration will be described with reference to FIGS. 2, 4, and 5. By covering the upper space of the main body 11 with the cover 36, the space in which the mounting part such as the expansion base 21, the reverse transfer means 25, the mounting means 26, the X-direction table 29 and the support base 30 is disposed is closed space 37. It is said. Then, in order to introduce the air purified to a predetermined cleanliness (for example, class 1000 to 10,000) into the closed space 37, the clean air introduced from the HEPA filter with a fan at the center of the upper surface of the cover 36 is introduced. Means 38 are provided. Further, an exhaust duct 39 connected to an exhaust fan (not shown) is connected to the back surface of the cover 36 so that dust generated in the closed space 37 is discharged together with air.

  An opening 40 for loading and unloading the substrate 31 is formed in a portion of the cover 36 that faces the loading portion 33 and the unloading portion 34, and a shutter 41 that opens and closes the opening 40 is provided. In addition, air injection means 42 for blowing air in a curtain shape obliquely from the inside to the outside is provided at the upper and lower portions of the opening 40.

  Further, as shown in FIG. 5, a maintenance opening 43 and an opening / closing door 44 for closing the opening are provided on the front surface of the cover 36 that defines the closed space 37. Air ejecting means 45 for blowing air in a curtain shape obliquely from the inside to the outside is provided.

  As shown in FIG. 6, the cleaning means 8 having the above configuration is collected by closing the shutter 41 and operating the cleaning air introduction means 38 and exhausting air from the exhaust duct 39 during the normal operation during the mounting operation. Dust suction is performed. On the other hand, when the substrate 31 is carried in and out, the exhaust fan (not shown) is stopped to stop the exhaust from the exhaust duct 39, the dust collection suction is turned off, the shutter 41 is opened, and the air injection means 42 is used. By closing the opening 41 with an air curtain formed by injecting air, and carrying in / out the substrate 31 in that state, it is carried into the closed space 37 while removing dust adhering to the substrate 31, When the loading / unloading is completed, the shutter 41 is closed and the normal operation is resumed. The same applies when opening the door 44 during maintenance.

  In the present embodiment, the semiconductor wafer 15 is supplied from the component supply unit 12 arranged outside the main body 11, and therefore an opening for loading and unloading the semiconductor wafer 15 is provided in the cover 36. Although not described in detail, a shutter 46 (see FIG. 2) and air injection means are provided as in the case of the opening 40 for carrying in and out the substrate. The tip of the component supply cassette 19 mounted on the component supply unit 13 is inserted into the cover 36 in order to supply the surface-mounted component 18 to the second component supply position B. A through opening (not shown) having a narrow width is formed, and air injection means similar to the above is provided.

  Next, an operation of mounting the bare IC component 14 and the surface mounting component 18 on the substrate 31 in the electronic component mounting apparatus 5 having the above configuration will be described. After the substrate 31 supplied by the carry-in unit 33 is transferred onto the partial rail 35 provided on the X-direction table 29, the partial rail 35 descends and is placed and fixed on the support base 30. Thereafter, the X direction table 29 is positioned so that the X direction position of the electronic component mounting position on the substrate 31 coincides with the X direction position of the mounting head 27.

  On the other hand, the semiconductor wafer 15 supplied by the component supply unit 12 and introduced onto the expansion table 21 is expanded by the expansion table 21 and the bare IC components 14 are separated, and then the X-direction table 22 is displayed. The bare IC component 14 to be mounted by being operated is positioned so as to be located immediately below the moving path of the reverse transfer means 25. Further, the recognition camera 24 is positioned immediately above the bare IC component 14 to be mounted, the suitability of the bare IC component 14 and its position are recognized with high accuracy, and the position correction of the X-direction table 22 is performed based on the recognition result. At the same time, the component suction position by the reverse transfer means 25 is obtained. Next, the reverse transfer means 25 is actuated, and the bear IC component 14 is sucked and held and lifted, and then moves in the Y direction toward the first component supply position A and is turned upside down to the first component supply position. A is supplied.

  At that time, the mounting head 27 of the mounting means 26 has moved to the first component supply position A. After the bare IC component 14 is held by the mounting head 27, the Y-direction table 28 is actuated to operate the mounting head 27. Is positioned at the Y-direction position of the mounting position on the substrate 31. At the same time, the simultaneous recognition means 32 is positioned at the mounting position of the substrate 31. In this state, the position mark provided at the mounting position of the substrate 31 is recognized, and the bare IC component 14 held by the mounting head 27 is The position is corrected by the Y direction table 28 and the X direction table 29 so as to be recognized and a predetermined positioning accuracy is ensured, and the position of the bare IC component 14 is positioned with high accuracy at the mounting position of the substrate 31. Thereafter, the bare IC component 14 is mounted by the mounting head 27.

  On the other hand, in the component supply unit 7, the component supply base 20 is operated to position the component supply cassette 19 containing the surface mount component 18 to be mounted on the substrate 31 at a position facing the second component supply position B. The surface-mounted component 18 is supplied to the second component supply position B, and then the surface-mounted component 18 is held by the mounting means 26 and moved in the Y direction. Implemented in position.

  The above mounting operation is repeated as appropriate, and the required number of bare IC components 14 and the surface mounting components 18 are mixedly mounted on the substrate 31. When the mounting is completed, the substrate 31 is directed to the next process in the carry-out portion 34. The next substrate 31 is carried in by the carry-in unit 33 and placed on the support table 30.

  As described above, in the electronic component mounting apparatus 5 of the present embodiment, the substrate 31 is positioned in the X direction by the X direction table 29, and the first component supply position A on the front side of the X direction table 29 on the Y direction side. The bare IC component 14 is supplied to the surface, the surface mounting component 18 is supplied to the second component supply position B on the rear side of the other side in the Y direction of the X direction table 29, and the mounting means 26 supplies the first or second component. Since the bare IC component 14 or the surface mounting component 18 is held at the supply positions A and B and mounted at a predetermined mounting position on the substrate 31, the bare IC component 14 and the surface mounting component 18 are combined into one electronic component. Since it can be mounted by the mounting apparatus and the mounting means 26 only needs to be linearly moved and positioned only in one direction in the Y direction, high-accuracy and high-speed mounting can be realized.

  Further, during the mounting operation described above, the mounting portion is covered with the cover 36, and the opening 40 for loading / unloading the substrate 31 is closed by the shutter 41 to form a closed space 37, and the closed space 37 is cleaned. Air that has been cleaned by the conditioned air introduction means 38 is introduced, and dust in the closed space 37 is discharged together with the air from the exhaust duct 39, so that the inside of the closed space 37 is maintained at a high level of cleanliness. The IC component 14 can be mounted with high reliability, and the substrate 31 on which the bare IC component 14 and the surface mount component 18 are mounted together can be manufactured with high productivity.

  Further, when the substrate is carried in and out, the exhaust from the exhaust duct 39 is stopped and the pressure in the closed space 37 is made higher than that in the external space to prevent the outside air from entering the closed space 37 and the shutter 41 is opened. By blowing out curtain-shaped air from the inside of the opening 40 toward the outside by the air ejecting means 42 so as to close the opening 40, dust enters the closed space 37 together with outside air or adheres to the substrate 31. Dust can be reliably prevented from entering, and the cleanliness can be kept high in the closed space 37 even when the substrate 31 is carried in and out.

  Further, even when the opening / closing door 44 is opened and the maintenance opening 43 is opened during maintenance of the electronic component mounting apparatus 5, the air in the closed space 37 is increased while operating the cleaning air introduction means 38 to increase the air pressure. Air is blown out in the form of a curtain that closes the opening 43 from the inside to the outside of the maintenance opening 43 by the ejecting means 45, so that a large amount of external dust enters the closed space 37 and is greatly contaminated. Therefore, the cleanliness in the closed space 37 can be ensured promptly after the maintenance, and the mounting in the cleaned atmosphere can be resumed promptly.

It is a schematic block diagram of one Embodiment of the electronic component mounting equipment of this invention. It is a see-through | perspective perspective view which shows the whole schematic structure of the electronic component mounting apparatus arrange | positioned in the electronic component mounting equipment of the embodiment, and mounting a bare IC component and a surface mounting component together. It is the perspective view which showed typically the mounting process in the same electronic component mounting apparatus. It is the schematic block diagram which showed the cleaning means in the same electronic component mounting apparatus longitudinally along the board conveyance direction. It is the schematic block diagram which showed the cleaning means in the same electronic component mounting apparatus longitudinally in the direction orthogonal to board | substrate conveyance. It is explanatory drawing of the control action of the cleaning means in the embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting equipment 2 Mounting line 3 Cleaning apparatus 5 Electronic component mounting apparatus 8 Cleaning means 14 Bare IC component 18 Surface mount component 19 Component supply cassette (Surface mount component supply means)
21 Expanding stand (means for supplying bare IC parts)
25 Reverse transfer means 26 Mounting means 29 X direction table (substrate positioning means)
31 Substrate 36 Cover 37 Closed space 38 Clean air introduction means 39 Exhaust duct (exhaust means)
40 Opening 41 Shutter 42 Air Injecting Means 43 Maintenance Opening 44 Opening / Closing Door 45 Air Injecting Means A First Component Supply Position B Second Component Supply Position

Claims (1)

Board transport / positioning means for loading, positioning, and unloading boards in the X direction , and supply of bare IC components provided on one side of the board transport / positioning means in the Y direction (direction perpendicular to the X direction) A first component by vertically inverting the bare IC component supplied from the supply means of the surface mounting component provided on the other side in the Y direction of the board conveying / positioning means, and the bare IC component supply means A reverse transfer means for supplying to the supply position; and a bare IC component at the first component supply position or a surface mount component from the supply means for the surface mount component to hold the bare IC component at a predetermined mounting position on the substrate ; in the electronic component mounting apparatus and a mounting means for mounting by mixed with said surface mount component, constituting said the inverting transfer means and said substrate conveying and positioning means and said mounting means is arranged spatially in a closed space Rutotomoni, carrying portions of the substrate transfer and positioning means, and the carry-out position, the substrate is transported, the cover having an opening to be carried out provided to introduce air and cleaned in the closed space in the upper central portion of the cover Provided with a cleaning air introduction means, further opens and closes an opening through which the substrate of the cover is carried in and out, opens the opening at the time of loading and unloading the substrate, and includes a shutter for closing the opening during the mounting operation. Furthermore the electronic component mounting apparatus characterized by comprising an exhaust duct on the back of the cover of the supply means side by the Hare before Symbol surface mount components to discharge the dust in the closed space of the cover with air.

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