JP6687495B2 - Component mounting line - Google Patents

Description

  The technology disclosed in this specification relates to a component mounting line.

  Patent Document 1 discloses a component mounting apparatus that mounts electronic components on a substrate inside a housing via solder.

JP, 2016-157898, A

  In the component mounting apparatus, the temperature of the air inside the housing may increase due to the heat generated from each device in the apparatus. For example, when the component mounting apparatus includes an XY robot for moving the head, the temperature of the air inside the housing rises due to the heat generated when the XY robot operates. Further, for example, when the component mounting apparatus includes a linear motor as a drive mechanism for moving the head, the temperature of the air inside the housing rises due to the heat generated when the linear motor operates. Particularly in recent years, it has been required to move the head at high speed in order to quickly mount a large number of electronic components. However, if an attempt is made to move the head at high speed, the operation of the XY robot or the linear motor for moving the head becomes faster, and the amount of heat generated from them increases further. Then, the temperature of the air inside the housing becomes higher.

  Further, when the temperature of the air inside the housing becomes high, the humidity of the air inside the housing becomes low accordingly, and as a result, static electricity is easily generated inside the housing. The generation of static electricity inside the housing can cause electronic components to fail.

  Therefore, a method of exhausting the air inside the housing of the component mounting apparatus to the outside of the housing can be considered. For example, a method of exhausting air around the component mounting device can be considered. However, in this method, the worker who is around the component mounting apparatus may feel discomfort due to the exhausted high temperature air.

  Further, in a component mounting device that mounts electronic components inside the housing, the pressure inside the housing may be higher than the pressure outside. As a result, the inside of the housing has a positive pressure, and dust is suppressed from entering the inside of the housing from the outside of the housing. Therefore, the inside of the housing is maintained in a clean state. However, if the pressure inside the housing is made higher than the pressure outside, the air inside the housing may flow out to the outside of the housing. When the temperature of the air inside the housing is high and the air flows out of the housing, an operator around the component mounting apparatus may feel uncomfortable. Therefore, the present specification provides a technique capable of effectively utilizing the heat generated in the component mounting apparatus.

  The component mounting line disclosed in the present specification includes a component mounting apparatus that mounts an electronic component on a substrate via solder inside a first housing, and a substrate mounting device that mounts an electronic component on the substrate and then mounts the electronic component on the substrate. A reflow device for reflowing the solder interposed between the components inside the second housing, and the component mounting device and the reflow device, which are connected to the air inside the first housing of the component mounting device. A duct for feeding the inside of the second housing of the reflow device.

  In such a configuration, when the component mounting apparatus operates to mount electronic components on the board, heat generated by each device in the apparatus is sent to the reflow apparatus, so that the heat can be effectively used in the reflow apparatus. can do.

It is a block diagram of the component mounting line which concerns on an Example. It is a figure which shows the state in which the solder was printed on the board | substrate. It is a figure which shows schematic structure of a component mounting apparatus and a duct. It is a figure which shows schematic structure of a reflow apparatus and a duct. It is a figure which shows schematic structure of the component mounting apparatus and duct which concern on another Example.

  A component mounting line according to the embodiment will be described with reference to the drawings. As shown in FIG. 1, the component mounting line 1 according to the embodiment includes a printing device 90, a component mounting device 20, a reflow device 40, and a duct 60. The printing device 90, the component mounting device 20, and the reflow device 40 are arranged side by side. One end of the duct 60 is connected to the component mounting device 20, and the other end is connected to the reflow device 40. The duct 60 extends from the component mounting device 20 to the reflow device 40.

  As shown in FIG. 2, the printing device 90 is a device that prints the solder 300 on the substrate 100 on which the electronic component 200 is mounted. The printing device 90 screen-prints the paste-like solder 300 on the upper surface of the substrate 100. The printing device 90 is arranged on the upstream side of the component mounting device 20. The board 100 on which the solder 300 is printed by the printing apparatus 90 is sent from the printing apparatus 90 to the component mounting apparatus 20.

  As shown in FIG. 3, the component mounting apparatus 20 is an apparatus for mounting the electronic component 200 on the board 100. The component mounting apparatus 20 includes a base 21 and a housing 22 (an example of a first housing). The housing 22 is disposed on the base 21 and covers the base 21. The component mounting apparatus 20 mounts the electronic component 200 on the substrate 100 inside the housing 22. The electronic component 200 is mounted on the substrate 100 via the solder 300 printed on the substrate 100 by the printing device 90 described above.

  The component mounting apparatus 20 also includes a feeder 23 and a conveyor 24. The feeder 23 is configured to be attachable to and detachable from the housing 22. The feeder 23 is attached to the front part of the housing 22. The feeder 23, while being attached to the housing 22, supplies the plurality of electronic components 200 to the inside of the housing 22. The conveyor 24 is arranged on the base 21. The conveyor 24 is a device that conveys the board 100 on which the electronic component 200 is mounted. The conveyor 24 carries the substrate 100 into the housing 22, holds the substrate 100 inside the housing 22, and carries the substrate 100 out of the housing 22. The conveyor 24 holds the board 100 when the electronic component 200 is mounted on the board 100. An inlet / outlet port 39 for the substrate 100 is formed on a side surface of the housing 22. The substrate 100 is loaded or unloaded through the entrance / exit 39 of the substrate 100.

  Further, the component mounting apparatus 20 includes an XY robot 25 and a head 26. The XY robot 25 and the head 26 are arranged inside the housing 22. The XY robot 25 is a device that moves the head 26 above the feeder 23 and the conveyor 24 in the X and Y directions by driving a motor. As a drive mechanism for moving the head 26, for example, a linear motor is preferably used from the viewpoint of moving the head 26 at high speed. The head 26 reciprocates above the feeder 23 and the conveyor 24 between them. Further, the head 26 includes a nozzle 27 for holding the electronic component 200. The head 26 can move the nozzle 27 in the Z direction by driving a motor. The nozzle 27 adsorbs and holds the electronic component 200 supplied by the feeder 23. Further, the nozzle 27 releases the held electronic component 200 on the substrate 100 held by the conveyor 24 and mounts it on the substrate 100. The electronic component 200 is arranged on the solder 300 printed on the substrate 100.

  The component mounting apparatus 20 also includes an intake fan 28 and a filter 29. The intake fan 28 and the filter 29 are attached to the upper portion of the housing 22. The intake fan 28 is a device that sucks the air outside the housing 22 into the housing 22. The pressure inside the housing 22 becomes higher than the pressure outside because the intake fan 28 sucks the air outside the housing 22 into the inside. The intake fan 28 is an example of a pressure device that increases the pressure inside the housing 22. By making the pressure inside the housing 22 higher than the pressure outside, it is possible to prevent dust from entering the inside of the housing 22 from the outside through the gap of the housing 22. For example, dust is suppressed from entering the inside of the housing 22 through the gap between the base 21 and the housing 22 and the gap between the feeder 23 and the housing 22. The air taken in by the intake fan 28 passes through the filter 29. The filter 29 collects dust contained in the air sucked in from the outside of the housing 22. As the filter 29, for example, a HEPA (High Efficiency Particulate Air Filter) filter can be used.

  Further, the component mounting apparatus 20 includes an exhaust fan 31. A duct 60 is connected to the component mounting apparatus 20. The exhaust fan 31 is attached to the rear part of the housing 22. The duct 60 is fixed to the rear part of the housing 22 of the component mounting apparatus 20. The exhaust fan 31 is arranged so as to face the duct 60. The exhaust fan 31 is arranged in front of the opening of the duct 60. The exhaust fan 31 exhausts the air inside the housing 22 to the duct 60. When the component mounting apparatus 20 operates, heat may be generated from each component of the component mounting apparatus 20. For example, heat may be generated from the XY robot 25 when the XY robot 25 moves the head 26. Alternatively, when the head 26 moves the nozzle 27, heat may be generated from the nozzle 27. Thus, the temperature of the air inside the housing 22 may rise due to the heat generated from each component of the component mounting apparatus 20. The exhaust fan 31 exhausts the air inside the housing 22 whose temperature has risen.

  As shown in FIG. 4, the reflow device 40 is a device for reflowing the solder 300 between the substrate 100 and the electronic component 200. The reflow device 40 is a device for soldering the board 100 and the electronic component 200. The reflow device 40 heats and melts the solder 300 interposed between the board 100 and the electronic component 200, and cools and solidifies the melted solder 300 to solder the board 100 and the electronic component 200.

  The reflow device 40 includes a preheating zone 401, a heating zone 402, and a cooling zone 403. The preheating zone 401, the heating zone 402, and the cooling zone 403 are arranged side by side in the transport direction of the substrate 100. The preheating zone 401 is arranged on the upstream side in the transport direction of the substrate 100. The preheating zone 401 is arranged upstream of the heating zone 402. The heating zone 402 is arranged between the preheating zone 401 and the cooling zone 403. The heating zone 402 is arranged upstream of the cooling zone 403. The cooling zone 403 is arranged on the downstream side in the transport direction of the substrate 100. In the preheating zone 401, the solder 300 between the substrate 100 and the electronic component 200 is preheated. In the heating zone 402, the solder 300 between the substrate 100 and the electronic component 200 is heated. In the cooling zone 403, the solder 300 between the substrate 100 and the electronic component 200 is cooled.

  The reflow device 40 includes a conveyor 41 and a housing 42 (an example of a second housing). The conveyor 41 is arranged inside the housing 42. The conveyor 41 extends from an inlet 426 of the housing 42 to an outlet 424. The conveyor 41 is a device that conveys the substrate 100 from the inlet 426 to the outlet 424 of the housing 42. The substrate 100 is loaded into the housing 42 through the inlet 426 of the housing 42. Further, the substrate 100 is carried out of the housing 42 from the outlet 424 of the housing 42.

  The housing 42 includes a plurality (two) of partition walls 43. The plurality of partition walls 43 are arranged in the transport direction of the substrate 100. The plurality of partition walls 43 partition the space inside the housing 42 in the transport direction of the substrate 100. The space inside the housing 42 is partitioned by the plurality of partition walls 43 to form a preheating zone 401, a heating zone 402, and a cooling zone 403.

  The preheating zone 401 is formed on the inlet 426 side of the housing 42. Inside the housing 42 in the preheating zone 401, a plurality (two) of preheating heaters 411 and a plurality (two) of preheating fans 412 are arranged. A preheating heater 411 and a preheating fan 412 are arranged on the upper side and the lower side of the conveyor 41, respectively. Each preheater 411 heats the substrate 100 conveyed by the conveyor 41. Each preheating heater 411 heats the substrate 100 at a lower temperature than each heating heater 421 described later. Each preheating fan 412 blows air toward the substrate 100. The heat of each preheating heater 411 is sent to the substrate 100 by the blowing of each preheating fan 412.

  The heating zone 402 is formed closer to the outlet 424 side of the housing 42 than the preheating zone 401. Inside the housing 42 in the heating zone 402, a plurality (two) of heating heaters 421 and a plurality (two) of heating fans 422 are arranged. A heater 421 and a heating fan 422 are arranged on the upper side and the lower side of the conveyor 41, respectively. Each heater 421 heats the substrate 100 conveyed by the conveyor 41. Each heating heater 421 heats the substrate 100 at a higher temperature than each preheating heater 411 described above. Each heating fan 422 blows air toward the substrate 100. The air of each heating fan 422 sends the heat of each heater 421 to the substrate 100.

  The cooling zone 403 is formed closer to the outlet 424 side of the housing 42 than the heating zone 402. Inside the housing 42 in the cooling zone 403, a plurality (two) of coolers 431 and a plurality (two) of cooling fans 432 are arranged. A cooler 431 and a cooling fan 432 are arranged on the upper side and the lower side of the conveyor 41, respectively. Each cooler 431 cools the substrate 100 conveyed by the conveyor 41. Each cooling fan 432 blows air toward the substrate 100. By blowing air from each cooling fan 432, the cool air of each cooler 431 is sent to the substrate 100.

  A duct 60 is connected to the reflow device 40. The duct 60 is connected to the preheating zone 401 of the reflow device 40. The duct 60 is fixed to the front portion of the housing 42 in the preheating zone 401. The duct 60 sends the air inside the housing 22 of the component mounting apparatus 20 to the inside of the housing 42 of the reflow apparatus 40.

  As is apparent from the above description, the component mounting line 1 according to the embodiment includes the component mounting device 20 that mounts the electronic component 200 on the substrate 100 via the solder 300 inside the housing 22, and the component mounting device 20. After the electronic component 200 is mounted on the substrate 100 by the component mounting device 20 and the intake fan 28 that makes the pressure inside the housing 22 higher than the external pressure, the component is interposed between the substrate 100 and the electronic component 200. The reflow device 40 for reflowing the solder 300 inside the housing 42 is connected to the component mounting device 20 and the reflow device 40, and the air inside the housing 22 of the component mounting device 20 is transferred to the inside of the housing 42 of the reflow device 40. And a duct 60 for sending to.

  In such a configuration, when the component mounting apparatus 20 operates to mount the electronic component 200 on the substrate 100, the temperature of the air inside the housing 22 of the component mounting apparatus 20 is generated by the heat generated from each device of the component mounting apparatus 20. Can be high. For example, when the XY robot 25 moves the head 26, heat may be generated from the XY robot 25, and the heat may raise the temperature of the air inside the housing 22. Further, in the above configuration, the pressure inside the housing 22 is made higher than the pressure outside by the intake fan 28, so that the air inside the housing 22 easily flows out through the gap of the housing 22 to the outside. For example, the air inside the housing 22 easily flows out through the gap between the base 21 and the housing 22 and the gap between the feeder 23 and the housing 22. Therefore, if left as it is, the high temperature air inside the housing 22 may flow out to the outside, and the high temperature air that has flowed out may cause discomfort for workers around the component mounting apparatus 20. Therefore, in the above configuration, the air inside the housing 22 of the component mounting apparatus 20 is sent to the inside of the housing 42 of the reflow apparatus 40 by the duct 60. Inside the housing 42 of the reflow device 40, the solder 300 between the substrate 100 and the electronic component 200 is reflowed. The reflow device 40 reflows the solder 300 at a high temperature. Therefore, by sending the hot air generated in the component mounting apparatus 20 to the reflow device 40 through the duct 60, the hot air can be effectively used in the reflow device 40.

  In the component mounting line 1 described above, an inlet 426 and an outlet 424 are formed in the housing 42 of the reflow device 40. The board 100 after the electronic component 200 is mounted is carried into the housing 42 through the entrance 426. Further, the substrate 100 after the solder 300 is reflowed is carried out from the outlet 424. The duct 60 is connected to the housing 42 of the reflow device 40 at a position closer to the inlet 426 than the outlet 424.

  With such a configuration, high temperature air can be sent to a portion of the housing 42 of the reflow device 40 near the inlet 426. For example, hot air can be delivered inside the housing 42 in the preheat zone 401. Therefore, high-temperature air can be sent to a portion of the housing 42 of the reflow device 40 having a relatively low temperature, so that the heat generated in the component mounting device 20 can be used more effectively.

  Further, when a linear motor is used as a drive mechanism for moving the head 26, heat is likely to be generated by high-speed operation, so the above configuration is particularly effective.

  In the component mounting line 1 described above, the board 100 on which the electronic component 200 is mounted by the component mounting apparatus 20 is sent to the reflow apparatus 40. According to such a configuration, the substrate 100 and the air sent to the reflow device 40 originate from the same component mounting device 20. As a result, when mounting the electronic component 200 on the substrate 100, the component mounting apparatus 20 for sending air to the reflow device 40 operates reliably, so that high-temperature air can be reliably sent to the reflow device 40. Further, since the component mounting device 20 and the reflow device 40 are connected to each other, the configuration of the component mounting line 1 can be simplified.

  Although one embodiment has been described above, the specific mode is not limited to the above embodiment. In the following description, the same components as those in the above description will be designated by the same reference numerals and description thereof will be omitted.

  The component mounting line 1 according to another embodiment may include an air supply fan 61, as shown in FIG. The air supply fan 61 is arranged inside the duct 60. The air supply fan 61 sends the air flowing inside the duct 60 from the component mounting apparatus 20 side to the reflow apparatus 40 side. The air volume of the air supply fan 61 is adjusted so that the inside of the housing 22 of the component mounting apparatus 20 is maintained at a positive pressure.

  Since the solder 300 is reflowed in the reflow device 40, its temperature may be higher than that of the component mounting device 20. Therefore, hot air may flow backward from the reflow device 40 side to the component mounting device 20 side. Therefore, by arranging the air supply fan 61 inside the duct 60, the air is made to flow from the component mounting apparatus 20 side to the reflow apparatus 40 side so that the air does not flow backward. As a result, high temperature air can be reliably sent from the component mounting apparatus 20 to the reflow apparatus 40.

  Further, in the above-described embodiment, after the electronic component 200 is mounted on the board 100 by the component mounting apparatus 20 via the solder 300, the board 100 is sent to the reflow apparatus 40, and the solder 300 is transferred by the reflow apparatus 40. While being reflowed, the component mounting apparatus 20 and the reflow apparatus 40 are connected by the duct 60, and the air inside the housing 22 of the component mounting apparatus 20 is sent to the inside of the housing 42 of the reflow apparatus 40. . That is, the substrate 100 and the air sent to the reflow device 40 are derived from the same component mounting device 20. However, the configuration is not limited to this. In another embodiment, the substrate 100 and the air sent to the reflow device 40 may be derived from different component mounting devices. For example, after the electronic component 200 is mounted on the substrate 100 by the component mounting apparatus 20 via the solder 300, the substrate 100 is sent to the reflow device 40, and the air inside the housing of another component mounting apparatus is removed. It may be sent inside the housing 42 of the reflow device 40. Alternatively, after the electronic component 200 is mounted on the substrate 100 via the solder 300 by another component mounting device, the substrate 100 is sent to the reflow device 40, and the air inside the housing 22 of the component mounting device 20 is sent. May be sent inside the housing 42 of the reflow device 40. Also with such a configuration, the heat generated in the component mounting apparatus can be effectively used. Further, the intake fan 28 (an example of a pressure device) may be omitted.

  Specific examples of the present invention have been described above in detail, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. The technical elements described in the present specification or the drawings exert technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technique illustrated in the present specification or the drawings can simultaneously achieve a plurality of objects, and achieving the one object among them has technical utility.

1: Component mounting line 20: Component mounting device 21: Base 22: Housing 23: Feeder 24: Conveyor 25: XY robot 26: Head 27: Nozzle 28: Intake fan 29: Filter 31: Exhaust fan 39: Inlet / outlet 40: Reflow device 41: conveyor 42: housing 43: partition wall 60: duct 61: air supply fan 90: printing device 100: substrate 200: electronic component 300: solder 401: preheating zone 402: heating zone 403: cooling zone 411: preheating heater 412: Preheating fan 421: Heating heater 422: Heating fan 424: Outlet 426: Inlet 431: Cooler 432: Cooling fan

Claims (5)

A component mounting apparatus for mounting an electronic component on a substrate via solder inside the first housing;
A reflow device that reflows the solder, which is interposed between the board and the electronic component, inside the second housing after the electronic component is mounted on the board;
A component mounting line that is connected to the component mounting apparatus and the reflow apparatus, and includes a duct that sends air inside the first housing of the component mounting apparatus to the inside of the second housing of the reflow apparatus. .   The component mounting line according to claim 1, further comprising a pressure device that makes a pressure inside the first housing of the component mounting device higher than an outside pressure.   The component mounting line according to claim 1, wherein the board on which the electronic component is mounted by the component mounting apparatus is sent to the reflow apparatus.   The component mounting according to any one of claims 1 to 3, wherein an air supply fan that sends air inside the duct from the component mounting device side to the reflow device side is arranged inside the duct. line. The second housing of the reflow device is provided with an inlet for loading a substrate on which electronic components are mounted and an outlet for unloading a substrate on which solder has been reflowed.
The component mounting line according to any one of claims 1 to 4, wherein the duct is connected to a position closer to the inlet than the outlet of the second housing of the reflow device.

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