JP4211564B2 - Substrate transport tray, substrate transport device, and electronic component mounting device - Google Patents

Description

  The present invention relates to a technology for holding and transporting a substrate and a technology for mounting electronic components on the substrate.

  In recent years, with the miniaturization of cellular phones, PDAs, etc., flexible printed wiring boards (hereinafter referred to as “FPC”) are used for internal electric circuits, and further, ICs (FPCs) are used in FPCs. A bare chip (hereinafter referred to as an “IC chip”) of an integrated circuit is directly mounted. When an IC chip is mounted on an FPC, equipment (hereinafter referred to as an “IC chip mounting device”) in which devices for performing various processes are arranged in a line shape is used. As described above, a technique for fixing and transporting an FPC on a pallet using a dedicated fixing jig or an adhesive layer is being used.

In Patent Document 2, a substrate before being bonded to an IC chip is held by electrostatic adsorption in a chamber supplied with a processing gas after the substrate is taken out from the substrate loading slider, and plasma is generated to generate organic substances on the surface of the substrate. A technique for improving the reliability of an electric circuit by removing the surface or activating the surface is disclosed.
JP 2002-232197 A JP 2003-124612 A

  By the way, when a fixing jig is used when fixing an FPC on a pallet in an IC chip mounting apparatus, a dedicated product corresponding to the shape of the FPC must be manufactured, resulting in an increase in cost. Further, when an adhesive layer is provided on the pallet, the adhesive layer deteriorates relatively quickly depending on the processing performed in the IC chip mounting apparatus, the adhesive performance is lowered, and the FPC may be peeled off during conveyance.

  The present invention has been made in view of the above problems, and has as its main object to provide a technique for transporting a substrate while stably holding it.

According to one aspect of the present invention, a substrate carrying tray, an insulating first surface for placing a substrate, said insulating one surface and the opposite side of the insulating dihedral is in configuration to that plate-like insulating portion When a conductor one surface in contact with the insulating second surface of said insulating portion, and the conductor a second surface opposite to the conductor one surface, in a plate-shaped conductive plate constituting a conductor 2 side of the conductor plate contact A plate-like base portion constituted by a base 1 surface and a base 2 surface opposite to the base 1 surface are electrically connected to the conductor plate and applied with a voltage in contact with an external terminal. a contact terminal provided with, a substrate on the insulating first surface, outside of the area projected on the base 2 side, the contact terminals, place.

Invention of Claim 2 is a tray for board | substrate conveyance of Claim 1, Comprising: In a part of area | region in which the board | substrate on the said insulation 1 surface is mounted, the said insulation part, the said conductor board, and the said An opening penetrating the base portion is provided.

Invention of Claim 3 is a board | substrate conveyance apparatus which conveys a board | substrate, Comprising: The conveyance mechanism in which the board | substrate conveyance tray in any one of Claim 1 thru | or 2 is conveyed, and the conveyance way of the said board | substrate conveyance tray And a voltage applying unit including an external terminal for applying a voltage in contact with the contact terminal.

According to a fourth aspect of the present invention, there is provided the substrate transfer apparatus according to the third aspect , wherein another voltage disposed at a position away from the voltage applying unit by a predetermined distance in the transfer path by the transfer mechanism. A provision part is further provided.

Invention of Claim 5 is a board | substrate conveyance apparatus of Claim 3 or 4 , Comprising: The electric potential measurement part which measures the surface potential of the said insulation part is further provided, The said voltage provision part is the said electric potential measurement part The necessity of voltage application is determined based on the surface potential of the insulating part measured by the above.

Invention of Claim 6 is a board | substrate conveyance apparatus of Claim 5 , Comprising: The said voltage provision part is a surface of the said insulation part in the said external terminal before the said external terminal and the said contact terminal contact. A voltage near the potential is applied.

The invention according to claim 7 is the substrate transfer apparatus according to claim 3 or 4 , further comprising a potential measuring unit that measures a surface potential of the insulating unit, wherein the voltage applying unit is connected to the external terminal. Before the contact terminal comes into contact, a voltage in the vicinity of the surface potential of the insulating portion is applied to the external terminal.

The invention according to claim 8 is an electronic component mounting apparatus for mounting an electronic component on a substrate, and the substrate transfer apparatus according to any one of claims 3 to 7 and the substrate transfer in the process of being transferred by the substrate transfer apparatus. And a mounting mechanism for mounting electronic components on a substrate placed on the tray.

  According to the present invention, it is possible to stably transport a substrate while holding it on the substrate transport tray using electrostatic force, and it is also possible to mount electronic components on the substrate on the substrate transport tray.

FIG. 1 is a longitudinal sectional view showing a substrate carrying tray 8 according to one embodiment of the present invention, and FIG. 2 is a plan view. FIG. 1 shows an enlarged cross section at the position of the arrow AA in FIG. As shown in FIG. 1, the substrate transfer tray 8 has a rectangular plate-like insulating portion 81 formed of alumina (Al 2 O 3), and the upper surface (insulating one surface) 811 of the insulating portion 81 is flexible. A printed wiring board (hereinafter, referred to as “substrate”) 9 having the above is placed. Two conductive plates 82 made of, for example, copper foil are provided side by side without overlapping each other on a surface (insulating two surfaces) 812 opposite to the upper surface 811 of the insulating portion 81. Further, on the surface (conductor 2 surface) 821 opposite to the conductor 1 surface that contacts the insulating portion 81 of the conductor plate 82, a plate-like base portion 83 formed of alumina is further provided. The base portion 83 is formed substantially integrally. In addition, the thickness of the board | substrate conveyance tray 8 shall be 10 mm, for example.

The substrate transfer tray 8 further includes two contact terminals 84 that are electrically connected to the two conductor plates 82, respectively. The contact terminals 84 are opposite to the base 1 surface that contacts the conductor plate 82 of the base portion 83. A side surface (hereinafter also referred to as “lower surface (conductor 2 surface) ”) 831 is provided at an outer edge portion. Each contact terminal 84 is connected to an external terminal to be described later. A positive voltage is applied to one conductor plate 82 via the contact terminal 84, and a negative voltage is applied to the other conductor plate 82. A voltage is applied. As a result, the insulating portion 81 is charged (precisely, it is charged with different polarities on one conductor plate 82 side and the other conductor plate 82 side), and electrostatic force is generated, so that the substrate 9 is placed on the insulating portion 81. Retained. Further, since the contact terminal 84 is disposed outside the region directly below the substrate 9 on the lower surface 831, it is possible to prevent the insulating portion 81 from being excessively bent when an external terminal is connected.

  As shown in FIGS. 1 and 2, an opening 85 penetrating the insulating portion 81, the conductor plate 82 and the base portion 83 is provided in a part of the region on the insulating portion 81 where the substrate 9 is placed. Thereby, at the position of the opening 85, it is possible to access the lower surface of the substrate 9 from below the substrate carrying tray 8 (that is, from the surface 831 side). The insulating portion 81 may be formed of an insulator other than alumina (for example, other insulating ceramics or polyimide resin). In addition, the conductor plate 82 may be a plate-like conductor other than the copper foil, and the base portion 83 may use various materials depending on the structure of the substrate carrying tray 8.

  Next, an IC chip mounting apparatus for mounting an IC chip on the substrate 9 while transporting the substrate 9 using the substrate transport tray 8 will be described.

  FIG. 3 is a diagram showing a configuration of the IC chip mounting apparatus 2. The IC chip mounting device 2 has a structure in which device elements are arranged in a line in order, and the substrate transport tray 8 holding the substrate 9 (not shown in FIG. 3) is taken out of the storage rack 91 and mounted on the IC chip. A loader 11 for sending to the processing unit side of the apparatus 2, a cleaning unit 3 for dry cleaning the substrate 9 together with the substrate transfer tray 8 in the chamber, and a mounting unit 4 for mounting an IC chip on the substrate 9 on the substrate transfer tray 8. And an unloader 14 for sequentially storing the processed substrate 9 in the other storage rack 92 together with the substrate transfer tray 8. Note that the substrate carrying tray 8 is preliminarily applied with voltage to the conductor plate 82 via the contact terminal 84 in an external device, and is arranged on the insulating portion 81 in a direction perpendicular to the arrangement direction of the conductor plates 82. The storage rack 91 of the loader 11 is prepared while holding the substrate 9.

  The loader 11 has a mechanism for sequentially raising the height of the storage rack 91 that stores the plurality of substrate transfer trays 8, and the transfer arm 111 takes out the substrate transfer tray 8 from the storage rack 91 and removes it from the cleaning unit 3. Transfer onto the protruding conveyor 12.

  The cleaning unit 3 performs dry cleaning on the substrate 9 loaded together with the substrate transporting tray 8, and the transfer of the substrate transporting tray 8 transported on the conveyor 12 into the chamber 31. A robot 32 is included. The upper part of the cleaning unit 3 is covered with a cover 33, and a gas supply pipe 34 for supplying nitrogen gas is connected to the cover 33.

  The mounting unit 4 includes a conveyor 13 that receives and conveys the substrate transfer tray 8 from the conveyor 12 of the cleaning unit 3, and includes conductive fine particles with respect to the substrate 9 on the substrate transfer tray 8 that is moved by the conveyor 13. An application unit 41 for applying an adhesive material, a mounting unit 42 for mounting an IC chip on the applied adhesive material, and a heating unit 43 for pressing and heating the IC chip toward the substrate 9 are sequentially provided. The conductive fine particles contained in the adhesive material are crushed between the electrode of the IC chip and the wiring on the substrate 9 by pressurization by the heating unit 43, and the IC chip and the wiring are electrically joined, and the adhesive material is cured by heating. Then, the IC chip is fixed on the substrate 9. The upper part of the mounting part 4 is also covered with a cover 44, and a gas supply pipe 45 for supplying nitrogen gas is connected to the cover 44.

  Further, in the course of transporting the substrate transport tray 8 in the cover 44, the substrate transport is performed between the applying unit 41 and the mounting unit 42, between the mounting unit 42 and the heating unit 43, and immediately after the heating unit 43. Potential measuring units 15a, 15b, and 15c for measuring the surface potential of the tray 8 are respectively attached, and the substrate conveying tray 8 is provided below the potential measuring units 15a to 15c (hereinafter also collectively referred to as “potential measuring unit 15”). Voltage application portions 16a, 16b, and 16c each having two external terminals that apply a voltage in contact with the contact terminal 84 are provided.

  The unloader 14 has a mechanism for sequentially lowering the height of the storage rack 92, and the transfer arm 141 takes out the substrate transfer tray 8 on the conveyor 13 extending from the mounting portion 4 and stores it in the storage rack 92. As described above, in the IC chip mounting apparatus 2, the transport path of the substrate transport tray 8 is configured by the loader 11, the conveyors 12 and 13, and the unloader 14.

  In the IC chip mounting apparatus 2, the cover 33 of the cleaning unit 3 and the cover 44 of the mounting unit 4 are further connected by a duct 51, between the loader 11 and the cleaning unit 3, and between the mounting unit 4 and the unloader 14. Are fitted with outside air blocking mechanisms (so-called air curtains) 52 and 53 using a nitrogen gas flow. Thereby, the inside of the cover 33 and the cover 44 is made an atmosphere of nitrogen gas.

  FIG. 4 is a plan view showing the configuration of the cleaning unit 3. The substrate transport tray 8 that has been transported on the conveyor 12 while holding the two substrates 9 is held by the mechanical chuck 321 of the transfer robot 32, lifted slightly, and then transported toward the chamber 31. . A gate member 311 is provided at the entrance / exit of the chamber 31, and the substrate transfer tray 8 is placed on the stage 312 in the chamber 31 after the gate member 311 moves. Note that the portion of the mechanical chuck 321 of the transfer robot 32 that contacts the insulating portion 81 of the substrate transfer tray 8 is formed of an insulator (for example, ceramics such as alumina, or resin such as polyimide or fluorine-based resin). .

  Thereafter, the carry-in / out opening is closed by the gate member 311, and the substrate 9 is subjected to low-pressure dry cleaning using plasma in the chamber 31. When the cleaning is completed, the gate member 311 moves to open the carry-in / out entrance, and the mechanical chuck 321 takes out the substrate 9 together with the substrate transfer tray 8 and returns it to the conveyor 12. The substrate transport tray 8 is transported to the mounting unit 4 by the conveyor 12.

  FIG. 5 is a diagram showing the configuration of the chamber 31 in the cleaning unit 3. The stage 312 on which the substrate transfer tray 8 is placed is an electrode plate formed of metal, and an electrode plate 313 facing the stage 312 is provided in the upper portion of the chamber 31. A high-frequency AC power source 314 is connected to the stage 312, and a plasma generating mechanism for generating plasma in the chamber 31 is configured by the stage 312, the electrode plate 313, and the AC power source 314.

  Two external terminals 161 are provided on the stage 312, and each external terminal 161 is connected to the power supply unit 162 via the voltage application cable 162 a, and one voltage application unit 16 d is provided by the two external terminals 161 and the two power supply units 162. Is configured. In addition, a shield 312b formed of an insulator such as alumina is provided around the external terminal 161 and the voltage application cable 162a in the stage 312, and the space between the external terminal 161 and the voltage application cable 162a and the stage 312 is provided. Insulated. Furthermore, each voltage applying cable 162a is provided with a noise filter 162b between the stage 312 and the power supply unit 162, and high-frequency noise caused by the AC power supply 314 is guided to the power supply unit 162 via the voltage applying cable 162a. Is prevented.

  On the other hand, a gas introduction pipe 315 for introducing gas and an exhaust pipe 316 for exhausting the internal gas are connected to the chamber 31, and the gas introduction pipe 315 supplies a processing gas for cleaning the substrate 9. A supply unit 317 and a nitrogen gas supply unit 318 for supplying nitrogen gas are connected. The gas in the chamber 31 is forcibly exhausted from the exhaust pipe 316, and the atmospheric pressure in the chamber 31 can be adjusted.

  FIG. 6 is an enlarged view showing the vicinity of one external terminal 161. As shown in FIG. 6, the upper surface 312a of the stage 312 is a support surface that comes into contact with the lower surface 831 of the substrate transport tray 8, and a recess 163 is formed on the upper surface 312a. The external terminal 161 is provided in the recess 163 and is urged upward by an elastic body 164 such as a spring. When the substrate transfer tray 8 is not placed on the stage 312, the external terminal 161 The upper part protrudes from the upper surface 312a. Therefore, when the substrate transfer tray 8 is placed on the stage 312, the external terminal 161 comes into contact with the contact terminal 84 of the substrate transfer tray 8 and descends, and the external terminal 161 and the contact terminal 84 are surely electrically connected. Connected.

  The voltage application units 16a to 16c provided in the mounting unit 4 (see FIG. 3) are also configured in the same manner as the voltage application unit 16d in FIG. 6, and two external terminals 161 connected to the power supply unit 162 are provided. Stage. However, since the AC power source 314 is not connected to this stage, the noise filter 162b is unnecessary. Each of the voltage applying units 16a to 16c further includes an applied voltage control unit 165 to which a signal from the corresponding potential measuring unit 15 is input, and the applied voltage control unit 165 is connected to two power supply units 162 (see FIG. 6, the potential measuring unit 15 and the applied voltage control unit 165, which are configurations related to the voltage applying units 16a to 16c, are indicated by broken lines. In the voltage application units 16 a to 16 c, the two power supply units 162 are controlled by the application voltage control unit 165 based on the surface potential of the substrate transport tray 8 acquired, and a voltage is applied to the contact terminal 84. In addition, when the stage which the voltage provision parts 16a-16c have is formed with an insulator, the shield part 312b shown in FIG. 6 becomes unnecessary.

  FIG. 7 is a diagram showing a flow of operations in which the IC chip mounting apparatus 2 mounts the IC chip on the substrate 9. In the IC chip mounting apparatus 2, first, the substrate transport tray 8 is taken out from the storage rack 91 by the loader 11 and transferred onto the conveyor 12 (step S <b> 11).

  The substrate transfer tray 8 is carried into the cleaning section 3 by the conveyor 12, and the transfer robot 32 places the substrate 9 together with the substrate transfer tray 8 on the stage 312 in the chamber 31 shown in FIG. 5 (step S12). ). At this time, the two contact terminals 84 of the substrate transfer tray 8 are in contact with the two external terminals 161 of the stage 312, respectively, and the power supply unit 162 is turned on, whereby the two contact terminals 84 are positive and negative respectively. The voltage is applied while being increased from 0 V to a predetermined magnitude (for example, ± 2 kV), and then is made constant. As a result, the substrate 9 is reliably held by the electrostatic force on the substrate carrying tray 8.

  Subsequently, the gate member 311 closes the carry-in / out entrance, and the chamber 31 is sealed. A processing gas (for example, carbon tetrafluoride (CF 4) added with oxygen gas (O 2)) is introduced into the chamber 31 from a processing gas supply unit 317 via a gas introduction pipe 315, and further, an exhaust pipe 316. As the gas is exhausted from the chamber, the inside of the chamber 31 is depressurized to a predetermined pressure by a predetermined processing gas.

  When the atmosphere in the chamber 31 is adjusted, a high-frequency voltage is applied between the stage 312 and the electrode plate 313, and the processing gas is turned into plasma by high-frequency discharge. When plasma is generated in the processing gas in the chamber 31, the substrate 9 is cleaned by radicals and ions generated by the plasma (step S13). Thereby, activation of the surface of the substrate 9 and removal of organic substances adhering to the wiring pattern on the substrate 9 are performed.

  FIG. 8 is a diagram showing how organic substances on the substrate 9 are removed by oxygen radicals and various ions. In FIG. 8, * indicates a radical. The left side of FIG. 8 shows how organic substances on the substrate 9 are decomposed by oxygen radicals into oxygen, hydrogen, water, carbon dioxide, carbon monoxide, etc., and are gasified and removed. The right side shows a state in which organic substances are removed by a sputtering action in which ions collide with organic substances. Although only oxygen ions are illustrated in FIG. 8, other ions also contribute to organic matter removal. Further, the surface of the substrate 9 is activated by oxygen radicals or the like. Thus, in the chamber 31, organic substances are removed by chemical reaction and physical reaction, and activation of the surface of the substrate 9 is also realized.

  When the cleaning is completed, the introduction of the processing gas is stopped, the nitrogen gas is introduced into the chamber 31 from the nitrogen gas supply unit 318 through the gas introduction pipe 315, and the exhaust from the exhaust pipe 316 is performed. The atmosphere is replaced with an atmosphere of nitrogen gas. Thereafter, the power supply unit 162 is turned off, the application of voltage to the contact terminal 84 is stopped, the gate member 311 opens the loading / unloading port, and the substrate 9 is unloaded by the transfer robot 32 together with the substrate transfer tray 8. (Step S14).

  Subsequently, the substrate 9 is transported from the cleaning unit 3 to the mounting unit 4. Gas supply pipes 34 and 45 for supplying nitrogen gas are connected in the cover 33 of the cleaning unit 3 and the cover 44 of the mounting unit 4, and the transport path when the substrate 9 is unloaded from the chamber 31 is the cover 33. , 44, the substrate 9 is transported in a nitrogen gas atmosphere (step S15). Thereby, the board | substrate 9 is conveyed to the mounting part 4 without receiving the influence by active gas.

  FIGS. 9 and 10A to 10C are views for explaining a state in which the IC chip 96 (see FIG. 10C) is mounted on the substrate 9, and the substrate carrying tray 8 is illustrated. Only a part of is shown. As described above, an opening 85 is provided in a part of the surface of the substrate transfer tray 8, and the substrate 9 is configured to cover the opening 85 as shown by a two-dot chain line in FIG. 9. 8 is held on. An area on the substrate 9 that is in contact with the opening 85 is an area where an IC chip is mounted. In the following description, this area is referred to as a “mounting area”. Further, in the vicinity of the mounting portion 4, the conveyor 13 is configured to support and transport only the outer edge portion along the transport direction of the substrate transport tray 8.

  In the mounting portion 4, the substrate transport tray 8 stops below the applying portion 41, and as shown in FIG. 10A, a support base (hereinafter, “ This is called “backup”.) 411 is raised, and the mounting area of the substrate 9 is supported from the lower surface. Then, the adhesive material 95 containing conductive fine particles is applied to the mounting region on the substrate 9 by the nozzle head of the applying unit 41 (step S16).

  When the adhesive material 95 is applied, the backup 411 descends and the substrate transport tray 8 moves below the potential measuring unit 15a, and the conductor plate 82 (see FIG. 1) according to the surface potential of the substrate transport tray 8. ) Is applied (step S17).

  FIG. 11 is a diagram showing an operation flow of the IC chip mounting apparatus 2 in the voltage applying process in step S17 (and steps S19 and S21 described later) in FIG. In the IC chip mounting apparatus 2, the potential measurement unit 15 a is supported by the advance / retreat mechanism so as to be able to advance and retract, and when the substrate transfer tray 8 is positioned below, the potential measurement unit 15 a is moved to the substrate transfer tray. The surface potential on the positive electrode side is measured by approaching the surface of the eight insulating portions 81 to a predetermined distance (for example, 5 mm) (step S31).

  The measurement result is input to the applied voltage control unit 165 shown in FIG. 6, and the necessity of voltage application is determined based on the surface potential of the insulating unit 81. For example, when the surface potential of the position directly above the conductor plate 82 to which a positive voltage is applied on the surface of the insulating portion 81 is (+500) V and is smaller than a predetermined reference value (step S32), the voltage is applied. The stage having two external terminals 161 is raised from below the substrate transport tray 8 by the lifting mechanism of the part 16a, and the two external terminals 161 abut against the two contact terminals 84 of the substrate transport tray 8, respectively. A voltage is applied by the unit 162 (step S33).

  At this time, the voltage applied from the power supply unit 162 to the positive external terminal 161 under the control of the applied voltage control unit 165 is near the surface potential of the insulating unit 81 (for example, a voltage within a range of ± 20% with respect to the surface potential). In this case, (+ 500 ± 100) V), and the voltage applied to the external terminal 161 on the negative electrode side is also in the vicinity of (−500) V, and then the stage is raised so that the external terminal 161 is a contact terminal. 84, the voltage of the external terminal 161 is increased to (+2) kV and (−2) kV, respectively.

  That is, in the voltage application unit 16a, a voltage near the surface potential of the insulating unit 81 is applied to the external terminal 161 before the external terminal 161 and the contact terminal 84 contact each other, and the voltage is increased to a predetermined level after the contact. Thereby, when the external terminal 161 and the contact terminal 84 contact, it is suppressed that the discharge (what is called spark) resulting from the big potential difference between the contact terminal 84 and the external terminal 161 arises. The surface potentials at two locations on the insulating portion 81 corresponding to the positive electrode side and negative electrode side conductor plates 82 are measured, and the application of voltage to each contact terminal 84 is independently controlled based on the measured values. May be.

  When the magnitude of the voltage applied to each contact terminal 84 reaches 2 kV, voltage application from the power supply unit 162 is stopped, the stage is lowered, and the external terminal 161 is separated from the contact terminal 84. If the surface potential is equal to or higher than a predetermined value in step S32, no voltage is applied to the contact terminal 84.

  As described above, when a voltage is applied to the contact terminal 84 (or when the surface potential is determined to be equal to or higher than a predetermined value), the substrate transfer tray 8 moves below the mounting portion 42. Then, as shown in FIG. 10B, the backup 421 is raised and the mounting area of the substrate 9 is supported from below, and the IC chip 96 is positioned on the adhesive material 95 by the head of the mounting portion 42 holding the IC chip 96. (FIG. 7: Step S18).

  Subsequently, after the backup 421 is lowered, the substrate carrying tray 8 is moved below the next potential measuring unit 15b, and the voltage application process of FIG. 7 is similarly performed (step S19). The substrate carrying tray 8 after the voltage application process moves to the heating unit 43.

  The heating unit 43 includes a head 432 heated by a heater as shown in FIGS. 9 and 10C, and the backup 431 reaches the substrate 9 through the opening 85 and the head 432 contacts the IC chip 96. By sandwiching the IC chip 96 (that is, pressing the IC chip 96 toward the substrate 9), the conductive fine particles in the adhesive material 95 are crushed between the IC chip 96 and the wiring on the substrate 9 to electrically Joining is performed. At this time, while the substrate 9 and the IC chip 96 are appropriately supported by the head 432 and the backup 431, the adhesive material 95 is cured by receiving heat from the head 432, and the IC chip 96 is fixed on the substrate 9 ( Step S20).

  After the head 432 and the backup 431 are separated from each other, the substrate transfer tray 8 moves to the lower side of the next potential measurement unit 15c to perform voltage application processing (step S21). Then, the substrate 9 is carried out from the nitrogen atmosphere to the atmosphere by the conveyor 13 via the outside air blocking mechanism 53 shown in FIG. 3, and taken out from the conveyor 13 together with the substrate carrying tray 8 by the unloader 14 and stored in the storage rack 92. (Step S22).

  As described above, in the substrate transport tray 8 shown in FIG. 1, the conductive plate 82 electrically connected to the contact terminal 84 is provided on the opposite side of the insulating portion 81 on which the substrate 9 is placed from the substrate 9, A voltage is applied to the conductor plate 82 via the contact terminal 84. Thereby, the board | substrate conveyance tray 8 which can hold | maintain the board | substrate 9 by electrostatic adsorption | suction, without always providing a voltage is implement | achieved.

  Further, in the process of transporting the substrate transport tray 8 in the IC chip mounting apparatus 2, insulation is provided by providing another voltage applying unit at a position away from the voltage applying unit for applying a voltage to the conductor plate 82 by a predetermined distance. Even when the charge amount of the portion 81 is attenuated, a voltage is applied to the conductor plate 82 to charge the insulating portion 81, and the substrate 9 can be stably held and transported while maintaining the electrostatic force. Furthermore, the voltage can be efficiently applied by measuring the surface potential of the insulating portion 81 before applying the voltage and determining whether or not the voltage applying portion needs to be applied based on the measurement result.

  3 prevents the substrate 9 from being peeled off from the substrate transfer tray 8 during the transfer of the substrate transfer tray 8 to cause problems in mounting the IC chip 96. Thus, the IC chip 96 can be stably mounted on the substrate 9. Further, one type of substrate carrying tray 8 can cope with substrates 9 having various shapes, and the cost for mounting IC chips can be reduced.

  In addition, in the voltage applying units 16a to 16d of the IC chip mounting apparatus 2, a power supply unit that is turned off and the external terminal 161 is electrically grounded may be used as necessary.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications are possible.

  In the above embodiment, the bipolar substrate transport tray 8 having the two conductor plates 82 is used, but the substrate transport tray is a monopolar method in which the voltages applied to all the conductor plates 82 have the same polarity. The bipolar method or the monopolar method is appropriately selected according to the area of the conductor pattern in the substrate 9, the type of treatment applied to the substrate 9, and the like. Further, the number of conductor plates 82 may be one or three or more.

  Further, the substrate transfer tray can have various structures. For example, in the substrate transfer tray 8a of FIG. 12 in which the base portion is formed of a conductor (for example, SUS), an insulating property is provided on the plate-like base portion 83a. The conductive plate 82 is fixed by applying the adhesive 86, and an insulating portion 81 on which the substrate 9 is placed is provided on the conductive plate 82. The base portion 83 a is provided with a cylindrical portion 832 formed of an insulator, and the contact terminal 84 is inserted into the cylindrical portion 832 and connected to the conductor plate 82.

  As described above, in order to suppress the distortion of the substrate carrying tray 8 at the time of applying a voltage, the contact terminal 84 is a region corresponding to a region of the lower surface 831 corresponding to the region on which the substrate 9 on the insulating portion 81 is placed ( In other words, it is preferable to be disposed in a region other than the region immediately below the substrate 9. However, for example, if the substrate 9 has a small mounting area, the contact terminal 84 is the bottom surface of the base portion 83 when there is no problem in processing the substrate 9 even if the outer edge portion of the substrate 9 is slightly bent. 831 may be disposed in a region directly below the substrate 9. Depending on the design of the substrate transport tray and the IC chip mounting apparatus, the contact terminals 84 may be provided on the upper surface or the side surface of the substrate transport tray 8.

  In the above embodiment, the voltage applying unit is provided in the chamber 31 of the cleaning unit 3, between the applying unit 41 and the mounting unit 42 of the mounting unit 4, between the mounting unit 42 and the heating unit 43, and the heating unit. Although provided immediately after 43, the arrangement of the voltage applying unit can be variously changed according to the configuration of the IC chip mounting apparatus 2 and the processing applied to the substrate 9.

  Further, in order to reduce the manufacturing cost of the IC chip mounting apparatus, it is possible to omit the potential measuring unit. In this case, a voltage is applied to the contact terminal 84 every time the substrate transport tray 8 reaches the voltage applying unit. Is done.

  The IC chip mounting apparatus 2 may be used for a purpose of mounting electronic components other than the IC chip on the substrate 9 (for example, mounting of a resistor or a capacitor using solder). Moreover, the board | substrate hold | maintained at the board | substrate conveyance tray 8 does not necessarily need to be a printed wiring board which has flexibility, For example, a semiconductor substrate and a glass substrate may be sufficient. Any number of substrates may be held on the substrate transport tray 8.

  Further, the substrate transfer tray 8 may be a transfer target by a transfer mechanism provided in an apparatus other than an apparatus for mounting electronic components.

Longitudinal cross section showing substrate transfer tray Plan view showing the substrate transfer tray The figure which shows the constitution of the IC chip mounting device Plan view showing the configuration of the cleaning section The figure which shows the structure of the chamber in a washing | cleaning part Enlarged view showing the vicinity of external terminals The figure which shows the flow of operation which mounts an IC chip on a substrate The figure which shows a mode that the organic substance on a board | substrate is removed The figure for demonstrating a mode that an IC chip is mounted on a substrate (A) A diagram for explaining how an IC chip is mounted on a substrate. (B) A diagram for explaining how an IC chip is mounted on a substrate. (C) An IC chip is mounted on a substrate. Illustration for explaining the situation Diagram showing the flow of voltage application processing Longitudinal sectional view showing another example of substrate transfer tray

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 IC chip mounting apparatus 4 Mounting part 8,8a Substrate conveyance tray 9 Substrate 11 Loader 12, 13 Conveyor 14 Unloader 15, 15a-15c Potential measurement part 16a-16d Voltage provision part 81 Insulation part 82 Conductor plate 83, 83a Base part 84 Contact terminal 85 Opening 96 IC chip 161 External terminal 312a, 811, 812, 821, 831 surface

Claims (8)

A substrate carrying tray,
An insulating one surface for mounting a substrate, the opposite side of the insulating dihedral and the insulating first surface, in a to that plate-shaped insulating part configuration,
A plate-like conductor plate composed of a conductor 1 surface in contact with the insulating 2 surface of the insulating portion and a conductor 2 surface opposite to the conductor 1 surface ;
A plate-like base portion constituted by a base 1 surface contacting the conductor 2 surface of the conductor plate and a base 2 surface opposite to the base 1 surface ;
A contact terminal electrically connected to the conductor plate and applied with a voltage in contact with the external terminal;
Equipped with a,
Wherein the substrate on the insulating first surface, outside of the area projected on the base 2 side, the substrate carrying tray, characterized in Rukoto the contact terminal, arranged to. The tray for transporting a substrate according to claim 1 ,
A substrate transfer tray, wherein an opening penetrating the insulating portion, the conductive plate, and the base portion is provided in a part of a region on which the substrate on the insulating surface is placed. A substrate transfer device for transferring a substrate,
A transport mechanism for transporting the substrate carrying tray according to any one of claims 1 to 2,
A voltage applying unit including an external terminal for applying a voltage in contact with the contact terminal during the transfer of the substrate transfer tray;
The board | substrate conveyance apparatus characterized by the above-mentioned. It is a board | substrate conveyance apparatus of Claim 3 , Comprising:
The substrate transfer apparatus further comprising another voltage applying unit disposed at a position separated from the voltage applying unit by a predetermined distance in the transfer path by the transfer mechanism. It is a board | substrate conveyance apparatus of Claim 3 or 4 , Comprising:
A potential measuring unit for measuring the surface potential of the insulating unit;
The substrate transfer apparatus, wherein the voltage applying unit determines whether or not to apply a voltage based on a surface potential of the insulating unit measured by the potential measuring unit. It is a board | substrate conveyance apparatus of Claim 5 , Comprising:
The substrate transfer apparatus, wherein the voltage applying unit applies a voltage in the vicinity of a surface potential of the insulating unit to the external terminal before the external terminal and the contact terminal come into contact with each other. It is a board | substrate conveyance apparatus of Claim 3 or 4 , Comprising:
A potential measuring unit for measuring the surface potential of the insulating unit;
The substrate transfer apparatus, wherein the voltage applying unit applies a voltage in the vicinity of a surface potential of the insulating unit to the external terminal before the external terminal and the contact terminal come into contact with each other. An electronic component mounting apparatus for mounting electronic components on a substrate,
A substrate transfer device according to any one of claims 3 to 7 ,
A mounting mechanism for mounting electronic components on a substrate placed on a substrate transport tray in the middle of transport by the substrate transport device;
An electronic component mounting apparatus comprising:

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