KR100659770B1 - Exhaust system for reflow soldering apparatus - Google Patents

Abstract

An exhaust system of a reflow soldering device is provided to extend the lifetime of the exhaust system by effectively ejecting high-temperature air through a jet nozzle where an ejection hose is coupled. An exhaust system for a reflow soldering device is a box-shaped housing(10), coolers(30), and a fan(40). Plural heaters are arranged in a transfer direction of a conveyor, on which a printed circuit board is mounted, inside the housing. The coolers are arranged to be parallel to the heaters. The fan is penetrated into an upper center of the housing and includes a box-shaped distributor, a jet nozzle, and a ventilating hole. At least one air inlet hole is formed at one or both sides of the box-shaped distributor. The jet nozzle is mounted on the distributor and includes a compressed air spraying hose, which is coupled with a hose connecting unit. The ventilating hole is vertically coupled with an upper end of the jet nozzle.

Description

Flux gas exhaust system of reflow soldering machine {EXHAUST SYSTEM FOR REFLOW SOLDERING APPARATUS}

1 is a front view of a conventional reflow soldering machine.

Figure 2 is a side cross-sectional view of a conventional reflow soldering machine.

3 is a perspective view of a reflow soldering machine equipped with an exhaust device of the embodiment according to the present invention.

Figure 4 is a cut away perspective view of a part of the blower constituting the exhaust device of an embodiment according to the present invention.

Figure 5 is a cutaway perspective view of a portion of the jet nozzle is mounted on the exhaust device according to one embodiment of the present invention.

6 is a perspective view of an automatic soldering machine equipped with an exhaust device of another embodiment according to the present invention.

<Explanation of symbols for the main parts of the drawings>

20. Heater 30. Cooler

40. Blower 41. Jet nozzle

42. Dispenser 43. Spray hose

44. Vent 45. Filter

The present invention relates to a flux gas exhaust device of a reflow soldering machine for soldering a printed board. More particularly, the flux gas and hot air generated when soldering a printed circuit board through a plurality of heaters can be effectively discharged. A flux gas exhauster of a reflow soldering machine is provided.

The conventional reflow soldering apparatus used conventionally is soldered by temporarily attaching a chip component to a printed circuit board with solder paste or adhesive, and then melting the solder paste by irradiating air or remote infrared rays heated at 215 ° C or higher. After the completion of the soldering, the chip parts were mounted on the printed board by naturally cooling and solidifying. That is, the reflow soldering apparatus heats a heater in a heater while melting the solder paste while conveying the substrate on which the electronic component is mounted to the conveyor, and then cools and solidifies in the cooler to solder the electronic component onto the substrate. Device.

In this reflow soldering apparatus, a blower and a heater are provided to reflow solder the electronic components by hot air. As a reflow soldering apparatus of this type, it is described in Korean Patent Laid-Open Nos. 10-2004-0104737, 10-2002-0013712, and Patent No. 10-0432192, and the like shown in FIGS. 1 and 2. A brief look at the general structure and cooling method of a conventional reflow soldering machine is as follows.

1 is a front view of a conventional reflow soldering machine, and FIG. 2 is a side cross-sectional view of a conventional reflow soldering machine. As shown, the conventional reflow soldering machine has a plurality of heaters 1 and a cooler 5 inside a housing H. It has in turn along the conveyance line of a conveyor, and the heater 2 and the heat absorber 6 are installed in each heater 1 and the cooler 5, respectively. The heater (2) of the heater (1) is installed up and down with a conveyor in between, and the wind introduction means (blow) in which hot air heated through the heater (2) by a separate blower is installed in each heater (1). It is introduced as a guide means and is blown out by a plurality of nozzles 3 to heat and melt the solder paste on a printed board on which electronic components are mounted.

As such, the solder that is melt-bonded on the printed board is cured while passing through the cooler 5, and a plurality of electronic components are fixed on the printed board.

At this time, the printed board generates a flux gas by melting the solder paste while passing through the heater 1, and the hot air containing the flux gas is circulated inside the housing H and provided at both sides of the housing H. Through the exhaust device 7 is discharged to the outside of the housing (H).

The exhaust device 7 is an exhaust fan 8 which is exposed to the upper part of the housing H and is driven to rotate, a bellows connecting the exhaust port 8a and the lower part of the exhaust fan 8 and the upper nozzle of the heater. It consists of the exhaust pipe 9 of the form.

Flux gas in the housing (H) is sucked into the exhaust pipe (9) by the exhaust fan (8) which is rotationally driven in the upper portion of the housing (H) is discharged to the outside through the exhaust port (8a).

However, the conventional exhaust apparatus has a problem that the life of the exhaust fan is shortened as the exhaust fan 8 which rotates at high speed by the high temperature air containing the flux gas is easily overheated, and the flux gas of the exhaust fan 8 It is pointed out that the problem is that not only smooth rotation is difficult, but also the operation of the fan stops when the amount of cling is increased.

In addition, since the exhaust fan 8 itself must be mechanically operated by a separate motor drive, the exhaust fan 8 must be replaced periodically according to its life cycle, and it is not possible to adjust the exhaust amount of air circulated inside the heater of the reflow soldering machine. There is this.

Accordingly, the present invention has been devised to solve the above-mentioned disadvantages and problems in the exhaust device of the conventional reflow soldering machine, and solves the flux gas generated when the printed circuit board is soldered while passing through a plurality of heaters installed inside the housing. It is an object of the present invention to provide a flux gas exhaust device of a reflow soldering machine which enables a high temperature air including a compressed air injection hose to one side to be discharged to the outside of the housing smoothly.

The above object of the present invention is a reflow soldering machine in which a plurality of heaters and coolers are installed inside a housing along a conveying line of a conveyor on which a printed board is mounted, wherein a compressed air injection hose is coupled to one side and an exhaust hose is mounted on an upper portion thereof. A blower having a jet nozzle installed at an upper portion of the housing and a box-shaped distributor penetratingly coupled to the inside of the housing, and mounted at an upper portion of a heater at one side of the housing to facilitate exhaust of the blower. It is achieved by the exhaust of the reflow soldering machine consisting of nozzles.

The blower is mounted on the top of the central portion of the housing in which the heater and the cooler are installed in a line, and protrudes to the upper portion of the housing so that hot air circulated inside the housing is forcedly exhausted through a jet nozzle in which a compressed air injection hose is coupled to one side. do.

The blower is coupled to a circular jet nozzle on the top of the distributor having a plurality of intake vents on one surface thereof, and a bellows-shaped exhaust port is vertically mounted on the jet nozzle. At this time, the inner upper portion of the distributor, that is, the bottom coupling portion of the jet nozzle has a structure in which the filter is coupled to the same size as the upper surface of the distributor.

The hot air flowing inside the housing flows into the distributor through the inlet port, and the air introduced while the flux gas is contained is filtered by the flux gas on the filter, and only the hot air is vertically transferred to the exhaust port above the jet nozzle. The discharge is made to the outside of the housing.

In this case, the principle that the air in the housing can be forced out of the compressed air is injected through the injection hose coupled to one side of the jet nozzle as the compressed air to form a rising air flow under the bellows exhaust vent Therefore, the hot air introduced into the distributor can be discharged through the exhaust port along the rising air flow inside the nozzle.

In addition, a separate induction jet nozzle is mounted inside the housing on one side of the blower to direct the hot air circulating around the heater inside the housing to the center of the housing where the blower is mounted. As a result, the exhaust through the blower can be smoothly made.

Matters relating to the operational effects, including the technical configuration for the above object, of the exhaust device of the present invention employed in a reflow soldering machine having such a structure will be clearly understood by the following detailed description with reference to the drawings in which preferred embodiments of the present invention are shown. will be.

First, Figure 3 is a perspective view of a reflow soldering machine equipped with an exhaust device of the embodiment according to the present invention.

As shown, the reflow soldering machine combined with the exhaust device of the present embodiment is provided with a plurality of coolers 30 in parallel with the plurality of heaters 20 and 20 in the housing 10 of the enclosure type, In order to discharge the air in the housing 10 to the outside, a blower 40 having a compressed air injection hose 41 connected to one side thereof is vertically coupled to the upper center portion of the housing 10.

The heater 20 is installed in a plurality of rows in the upper and lower portions of the conveyor to which the printed board (P) is mounted and conveyed, and blows hot air toward the printed circuit board which is transported between the plurality of heaters (20). As a result, the solder paste on the surface of the printed board P is melted to perform soldering.

The printed circuit board P, which is soldered through the heater 20, is hardened while the molten paste on the surface passes through the cooler 30, and a plurality of electronic components are firmly attached to the printed board P.

At this time, the flux gas generated by melting the paste on the surface by the high temperature air sent out through the nozzles 21 of the heater 20 and the soldering of the printed board P is circulated and transported in the housing 10. And is discharged to the outside of the housing 10 through the blower 50 in the center of the housing 10.

The hot air circulated in the housing 10 is circulated to the center of the housing 10 in which the blower 40 is mounted by the induction jet nozzle 60 mounted on the heater 20 at any point. The induction jet nozzle 60 is a spray hose supplied with compressed air through the same compressor or a separate compressor as the compressed air injection hose 43 coupled to the blower 40 on one side (not shown). ) Is mounted.

This embodiment of such a structure circulates around a plurality of heaters 20 installed inside the housing 10 and the hot air containing the flux gas to the central portion of the housing 10 in which the blower 40 is vertically installed. The conveying direction is guided by the jet nozzle 41 mounted at the top of the heater 20 of the heater 20, and is blown out of the housing 10 through the blower 40 equipped with the jet nozzle 41 in which compressed air is injected from one side. Hot air is exhausted.

Next, a detailed technical configuration of the blower 40 for forcibly evacuating high temperature air from the housing 10 will be described in more detail with reference to FIGS. 4 and 5 shown below.

4 is a cutaway perspective view of a part of the blower constituting the exhaust device according to an embodiment of the present invention cut away, and FIG. 5 is a cutaway perspective view of a portion of the jet nozzle mounted to the embodiment exhaust device according to the present invention cut away. .

As illustrated, the blower 40 mounted on the exhaust device of the present embodiment has a jet nozzle 41 having a compressed air injection hose 43 coupled to an upper portion of the distributor 42 having an inlet 42a. A bellows type exhaust port 44 is vertically coupled to the upper portion of the jet nozzle 41, and a plate-shaped filter 45 having a plurality of through-holes 45a formed therein is mounted inside the distributor 42. do.

The blower 40 is coupled to the distributor 10 at the lower end of the housing 10 of the reflow soldering machine so as to be located inside the housing 10, and an exhaust port coupled to the upper part of the jet nozzle 41 and the upper end thereof. 44 is mounted to be exposed out of the housing 10.

The distributor 42 has a quadrangular enclosure and has at least one inlet 42a for sucking high temperature air circulated in the housing 10 at one or both sides thereof.

In addition, the jet nozzle 41 coupled by the flange 47 so as to protrude to the upper portion of the distributor 42 has a hose connector (41a) is coupled to the compressed air injection hose 43 to any point on the outer peripheral surface protruding upwards An injection surface 46 is formed which extends and is provided with a plurality of injection holes 46a along its circumference on the inner circumferential surface, wherein the injection surface 46 is the upper portion of the jet nozzle 41 (the right side in FIG. 5). To).

The injection surface 46 is directed to the upper portion of the jet nozzle 41, when the high pressure compressed air is supplied through the compressor from the compressed air injection hose 43 coupled to the hose connecting hole 41a This is to form an upward air flow in the nozzle 46 while compressed air is injected toward the upper portion of the nozzle 46 through the injection hole 46a of the nozzle 46.

In addition, the filter 45 mounted on the upper end of the distributor 42 has a plurality of through holes 45a are densely arranged, and as the platinum coated surface is formed on the bottom thereof, hot air introduced into the distributor 42 is introduced. Flux gas contained therein is filtered by the catalytic action of the platinum coating surface and at the same time hot air is discharged to the upper through a plurality of through holes (45a), the flux gas is collected on the bottom filter ( 45 is replaced at a predetermined cycle of the dispenser (42).

The hot air inside the housing 10 introduced into the distributor 42 through the intake port 42a causes the filter 45 to be lifted by the rising air flow formed inside the jet nozzle 41 coupled to the distributor 42. Passed through the inside of the jet nozzle 41, the introduced air through the exhaust port 44 vertically coupled to the nozzle 41, the duct (not shown) coupled to the outside of the housing 10 or the top of the exhaust port 44 Is discharged through.

At this time, the injection pressure of the compressed air supplied through the compressed air injection hose 43 coupled to the jet nozzle 41 is preferably maintained at about 0.6 MPa.

Meanwhile, another induction jet nozzle 60 having the above structure is horizontally coupled to the top of the heater 20 on one side of the blower 40, so that hot air circulated in the housing 10 is directed toward the blower 40. The conveying direction is guided so that easy air can be discharged.

In addition, the induction jet nozzle 60 mounted on the heater 40 so that the compressed air is discharged toward the blower 40 is prevented from introducing hot air into the cooling chamber in which the plurality of coolers 30 are installed. This is to allow the cooling efficiency of the soldering machine to be doubled.

On the other hand, Figure 6 is a perspective view of an automatic soldering machine equipped with an exhaust device of another embodiment according to the present invention, as shown in the exhaust device of the present embodiment is provided with a nozzle unit 220 in the conveying direction of the printed board (P) A reducer 110 which is covered on an upper part of the solder tank 210 of the automatic soldering machine 200, a jet nozzle 100 coupled to an upper end of the reducer 110 and having a compressed air injection hose 101 mounted on an outer circumferential surface thereof; The jet nozzle 100 is vertically mounted and has a structure consisting of an exhaust port 120 having an exhaust port connecting plate 121 thereon.

The exhaust device of the present embodiment, when the printed circuit board P is transferred and soldered to the upper portion of the nozzle unit 220 installed in the lead tank 210, the flux gas generated from the molten solder on the printed circuit board P and high temperature Air is introduced through the reducer 110 and is discharged to the outside through the vertical exhaust port 120 by the rising air flow inside the jet nozzle 100.

At this time, the rise of the air flow in the jet nozzle 100 is the injection of compressed air supplied through the compressed air injection hose 101 coupled to the outer peripheral surface of the jet nozzle 100 is formed on the inner peripheral surface of the nozzle 100, as in the above-described embodiment As it is injected through a hole (not shown) is formed inside the nozzle to facilitate the external discharge of air introduced into the reducer 110.

The present invention is not limited to the above-described embodiments, but can be variously modified and changed by those skilled in the art, which should be regarded as included in the spirit and scope of the present invention as defined in the appended claims. something to do.

As described above, the flux gas exhaust device of the reflow soldering machine of the present invention may be outside the housing through a jet nozzle in which hot air including the flux gas generated when the printed circuit board is soldered is combined with a compressed air injection hose on one side. By being able to be discharged automatically, there is no mechanical device coupled to the jet nozzle itself, there is an advantage that can extend the life cycle of the exhaust device as a failure due to deterioration does not occur.

In addition, the present invention is equipped with a filter coated on the bottom surface of the platinum acting as a catalyst for the flux gas inside the distributor to which the jet nozzle is coupled, so that the air is discharged after first removing the flux gas in the hot air exhaust Since no flux is adsorbed on the inner peripheral surface of the jet nozzle, the exhaust efficiency can be prevented from being lowered.

In addition, the present invention may vary the generation amount of the flux gas according to the type of the printed board, by adjusting the supply pressure of the compressed air supplied through the compressed air injection hose to easily adjust the exhaust gas and the exhaust volume of the air inside the housing Possible effects can also be expected.

Claims (8)

Housing type; A plurality of heaters installed in a conveying direction of a conveyor on which a printed board is mounted in the housing and a plurality of coolers installed in parallel with each other; And A housing-type distributor coupled to the upper center portion of the housing and having at least one inlet on one or both sides thereof, a jet nozzle coupled to a compressed air injection hose on a hose connector mounted on the distributor and protruding on an outer circumferential surface thereof; And a blower comprising a bellows-type exhaust port vertically coupled to the top of the jet nozzle. Housing type; A plurality of heaters installed in a conveying direction of a conveyor on which a printed board is mounted in the housing and a plurality of coolers installed in parallel with each other; A housing-type distributor coupled to the upper center portion of the housing and having at least one inlet on one or both sides thereof, a jet nozzle coupled to a compressed air injection hose on a hose connector mounted on the distributor and protruding on an outer circumferential surface thereof; A blower comprising a bellows-type exhaust port vertically coupled to the top of the jet nozzle; And an induction jet nozzle horizontally coupled to an upper end of the cooler side heater to direct a conveying direction of air circulated inside the housing to the blower side. The method according to claim 1 or 2, Flux gas exhaust device of the reflow soldering machine, characterized in that the inside of the distributor 42 is equipped with a plurality of through-holes (45a) plate-like filter 45 is densely arranged over the entire surface. The method according to claim 1 or 2, Flux gas exhaust device of the reflow soldering machine, characterized in that the filter is formed on the bottom surface platinum coating surface. The method according to claim 1 or 2, And a jet pressure of the compressed air supplied to the jet nozzle through the compressed air injection hose is maintained at 0.6 MPa. The method of claim 1, The jet nozzle is a flux gas exhaust device of a reflow soldering machine, characterized in that the injection surface 46 is provided with a plurality of injection holes (46a) on the inner peripheral surface protruded toward the upper opening of the jet nozzle. The method of claim 2, The jet nozzle is a flux gas exhaust device of a reflow soldering machine, characterized in that the injection surface with a plurality of injection holes provided on the inner peripheral surface protruded toward the blower side opening of the jet nozzle. Soldering machine consisting of a solder tank equipped with a nozzle portion in the conveying direction of the printed board; And A blower comprising an reducer disposed on an upper portion of the lead tank, a jet nozzle coupled to an upper end of the reducer and equipped with a compressed air injection hose on an outer circumferential surface thereof, and an exhaust port coupled to the jet nozzle vertically and provided with an exhaust port connecting plate at an upper portion thereof; Flux gas exhaust device of the reflow soldering machine comprising a.

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