JP2009218278A - Electronic component mounter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounter having two mounting heads, capable of preventing suction nozzle drive mechanisms in the mounting heads or a substrate recognition camera from being damaged when the two mounting heads collide with each other. <P>SOLUTION: The mounting heads 6 set in the electronic component mounter each cause a nozzle 5 to suck an electronic component from a component feeding apparatus and mount the electronic component on a printed board. In order to speed up the mounting of the electronic component, the two mounting heads 6 suck components and mount them on the printed board. A bumper 11 is attached around each of the mounting heads 6 to prevent a nozzle drive mechanism in each of the mounting heads 6 and the substrate recognition camera 8 from being damaged when the two mounting heads 6 collide with each other. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus that takes out an electronic component from an electronic component supply device and mounts the electronic component on a printed circuit board.

  Electronic devices are becoming multifunctional, and the number of electronic components required is also increasing. These electronic components are mounted on a printed circuit board and incorporated into an electronic device. Therefore, the number and type of components that can be mounted on the printed circuit board in a certain time greatly affects the cost of the electronic device.

  “Patent Document 1” describes an apparatus for picking up an electronic component from a component supply device by a mounting head having a plurality of nozzles and mounting the electronic component on a printed circuit board. The mounting head is attached to a mover that can move in the x direction to a beam extending in the x direction (hereinafter referred to as x beam), and the x beam can be moved in the y direction to a beam extending in the y direction (hereinafter referred to as y beam). It can be attached to a movable arm. Each mover is moved to a desired position by a linear motor or a pulse motor in accordance with a command from a CPU (Central Processing Unit), and performs an operation of sucking or mounting a component.

  Further, in “Patent Document 1”, component supply devices are arranged on both sides of a printed circuit board, and component mounting heads are arranged on both sides of the printed circuit board correspondingly to increase the speed of component mounting. In addition, it is described that parts that are frequently used are distributed and arranged in the parts supply unit in order to prevent a reduction in efficiency when a large number of specific parts are used.

  “Patent Document 2” describes that a plurality of heads are installed in the x beam to increase the speed of taking out an electronic component from the electronic component supply device and mounting it on a printed circuit board.

2006-286707 2004-47818

  In the technique described in “Patent Document 1”, it is described that parts that are frequently used are distributed in a part supply device to reduce the total mounting time. In this case, each of the mounting heads arranged on both sides of the printed circuit board mounts electronic components on one side of the printed circuit board. That is, each mounting head takes out an electronic component from a component supply device existing on one side of the electronic component mounting device, and mounts it on only one side of the printed circuit board. Then, electronic components are mounted on the entire surface of the printed board by two mounting heads arranged in opposite directions.

  In such an arrangement, the two mounting heads mount components on only one side of the printed circuit board and do not collide with each other. However, in this case, since each mounting head mounts an electronic component only on one side of the printed circuit board from a component supply device existing on one side, the degree of freedom is limited. Therefore, each of the two mounting heads is not only from one component supply device, but also from the other component supply device, and the electronic component is mounted on the other side of the printed circuit board. Can be considered. However, in this case, there is a risk that the two mounting heads interfere and collide.

  The removal of the component from the component supply device by the mounting head and the mounting on the printed circuit board are determined in advance by a program. Therefore, collision can be avoided when the mounting head is operated by a program. However, when performing maintenance of the component supply apparatus, etc., there is a risk that the two heads collide because a human moves the mounting head. Since the mounting head is provided with precision components such as a nozzle drive mechanism for adsorbing electronic components and a substrate recognition camera, these components are easily damaged by a collision.

  In the technique described in “Patent Document 2”, the component supply device is installed only on one side of the printed circuit board, and the mounting speed is increased by attaching a plurality of heads to the x beam. However, in this configuration, it may be difficult to secure a sufficient space for parts supply. There is also a risk that a plurality of heads installed on the x beam collide. In particular, there is a great risk of collision during maintenance, and the problem caused by the collision is the same as described in the problem of “Patent Document 1”.

  The problem of the present invention is that two mounting heads can take out electronic components from either of two component supply devices, and two mounting heads mount electronic components on overlapping areas of a printed circuit board. In a possible electronic component mounting apparatus, when two mounting heads collide, the nozzle drive mechanism in the mounting head, the substrate recognition camera, and the like are prevented from being damaged.

  The present invention solves the problems described above, and by forming a bumper around the mounting head, even when two mounting heads collide, a nozzle driving device in the mounting head and a substrate recognition camera are provided. To prevent the damage. Specific means are as follows.

(1) A transport device that transports a printed circuit board in a first direction, and a component supply device installed outside the transport device in a second direction perpendicular to the first direction, the second direction The first y beam and the second y beam extending in the direction are arranged with a space therebetween, and extend in the first direction by bridging the first y beam and the second y beam. There is a first x-beam and a second x-beam;
A first mounting head is installed on the first x beam, a second mounting head is installed on the second x beam, and the first mounting head and the second mounting head are electronic components. The first mounting head and the second mounting head can take out electronic components from the same component supply device, and the first mounting head and the second mounting head An electronic component mounting apparatus, wherein the head includes a bumper.

  (2) The electronic component mounting apparatus according to (1), wherein the bumper is made of metal.

  (3) The electronic component mounting apparatus according to (1), wherein the bumper is made of Al.

  (4) The electronic component mounting apparatus according to (1), wherein the base material of the bumper is made of metal, and a buffer member is installed around the base material.

  (6) The electronic component mounting apparatus according to (1), wherein the bumper is hollow.

  (7) The electronic component mounting apparatus according to (1), wherein a cover is formed on the mounting head, and the bumper is formed around the cover of the mounting head.

  (8) A transport device that transports a printed circuit board in a first direction, and a first component mounting device and a second component supply on both sides of the transport device in a second direction perpendicular to the first direction. An apparatus is installed, and a first y beam and a second y beam extending in the second direction are spaced apart from each other, and bridge the first y beam and the second y beam. There are a first x beam and a second x beam extending in the first direction, a first mounting head is installed in the first x beam, and the second x beam is in the second x beam. A second mounting head is installed, and the first mounting head and the second mounting head include a nozzle that sucks an electronic component, and the first mounting head and the second mounting head are the first mounting head. The electronic component can be adsorbed from both the component supply device and the second component supply device. It is possible, the first mounting head and the second mounting head, the electronic component mounting apparatus characterized by comprising a bumper.

  (9) The electronic component mounting apparatus according to (8), wherein the bumper is made of Al.

  (10) The electronic component mounting apparatus according to (8), wherein the bumper is made of urethane resin or acrylic resin.

  (11) A transport device that transports a printed circuit board in a first direction, and a component supply device that is installed outside the transport device in a second direction perpendicular to the first direction, the second direction The first y beam and the second y beam extending in the direction are spaced from each other, the first x beam extends from the first y beam in the first direction, and the second y beam The second x beam extends in the direction opposite to the first direction from the y beam, the first mounting head is installed in the first x beam, and the second x beam is in the second x beam. A second mounting head is installed, and the first mounting head and the second mounting head include a nozzle for sucking an electronic component, and the first mounting head and the second mounting head are the same An electronic component can be taken out from the component supply device, and the first mounting head and the front The second mounting head, the electronic component mounting apparatus characterized by comprising a bumper.

  (12) A conveyance device that conveys a printed circuit board in a first direction, and a first component mounting device and a second component supply on both sides in a second direction perpendicular to the first direction with respect to the conveyance device An apparatus is installed, and a first y beam and a second y beam extending in the second direction are spaced apart from each other, and a first x beam from the first y beam is the first x beam. From the second y beam, a second x beam extends in a direction opposite to the first direction, and a first mounting head is installed on the first x beam. The second x beam is provided with a second mounting head, and the first mounting head and the second mounting head include a nozzle that sucks an electronic component, and the first mounting head The second mounting head is provided between the first component supply device and the second component supply device. Also it can suck the electronic component from Les, the first mounting head and the second mounting head, the electronic component mounting apparatus characterized by comprising a bumper.

  According to the present invention, the two heads of the electronic component mounting apparatus attract the electronic components from any of the component supply apparatuses installed on both sides of the electronic component mounting apparatus, and the printed circuit board is not related to the area of the printed circuit board. Since electronic components can be mounted, the speed of the electronic component mounting apparatus on the printed circuit board can be increased.

  When the two mounting devices operate in the overlapping area, the two heads collide with each other. This can be avoided by optimizing the algorithm of the operation program while the mounting device is operating. . However, there is an opportunity for two mounting heads to collide during maintenance of the electronic component mounting apparatus.

  In the present invention, since the bumpers are formed on the two mounting heads, even if the two mounting heads collide, the nozzle drive mechanism, the substrate recognition camera, and the like in the mounting head are not damaged.

  The detailed contents of the present invention will be disclosed according to the embodiments.

  FIG. 1 is a plan view of an electronic component mounting apparatus 1 according to the present invention. In FIG. 1, a printed circuit board P is placed on a rail-shaped printed circuit board conveyor 7, supplied to the electronic component mounting apparatus 1 from the left direction, and positioned at the center of the electronic component mounting apparatus 1. The printed circuit board transport device 2 includes a printed circuit board conveyor 7, a drive device, and a positioning device. When the mounting of the electronic component on the printed circuit board P is completed, the printed circuit board P is discharged in the right direction.

  In some cases, the electronic component mounting apparatus 1 shown in FIG. 1 is installed in parallel, and mounting of the electronic component on the printed circuit board P may be completed by two or more electronic component mounting apparatuses. In this case, for example, half of the components are mounted on the printed circuit board P by the first electronic component mounting apparatus, and then the printed circuit board P is placed on the printed circuit board conveyor 7 and moves to the right in the drawing. Then, the printed circuit board P is transported to and installed in a second electronic component mounting device provided downstream of the first electronic component mounting device, and the remaining electronic components are set in the same manner as the first electronic component mounting device. Installed.

  In FIG. 1, component supply devices 3 are arranged on both upper and lower sides of the paper surface of the electronic component mounting device 1. The component supply device 3 includes a feeder base 3A and a component supply unit 3B. The feeder base 3 </ b> A is attached to the main body of the electronic component mounting apparatus 1. The component supply unit 3B is composed of many tapes on which electronic components are installed. When the component placed on the tape is taken out by the suction nozzle 5 of the mounting head 6, the tape is fed and the next electronic component can be taken out.

On both sides of the electronic component mounting apparatus 1, y beams 1A and 1B extending in the y direction are formed. Y movers 9 are installed on the left and right y beams 1A and 1B.
Here, a stator is installed in the y beam 1A and the y beam 1B, and the stator and the y mover 9 form a linear motor. Therefore, by this linear motor, the y movable element 9 can freely move the y beams 1A and 1B in the y direction. The left and right y movers 9 are provided with ends of x beams 4A and 4B extending in the x direction. An x mover 15 is installed in the x beams 4A and 4B. The x beam 4A and the x beam 4B are provided with a stator, and the stator and the x mover 15 form a linear motor. Therefore, by this linear motor, the x mover 15 can freely move on the x beams 4A and 4B. The mounting head 6 is attached to the x mover 15.

  The y mover 9 moves on the y beams 1A and 1B by a linear motor in response to a command from the CPU. The x mover 15 moves on the x beams 4A and 4B by a linear motor in response to a command from the CPU. A linear encoder is attached to the y movable element 9 and the x movable element 15, and position information of each movable element is fed back to the servo system.

  A suction nozzle 5 for sucking parts is attached to the mounting head 6 in a circumferential shape. In this embodiment, as shown in FIG. 5, twelve suction nozzles 5 are arranged in a circumferential shape. These nozzles are rotated by a nozzle rotation motor 52 and suck the target electronic component to each nozzle.

  A substrate recognition camera 8 is installed in the mounting head 6 to recognize a reference point of the printed circuit board P when the mounting head 6 later moves above the substrate, and an electronic component is based on the reference point of the printed circuit board P. Is mounted on the printed circuit board P. These components of the mounting head 6 are covered with a head cover 12, and a bumper 11 described later is installed outside the head cover 12, although not shown in FIG.

  FIG. 1 is a diagram in which two mounting heads 6 adsorb electronic components from the upper component supply unit 3B and the lower component supply unit 3A, respectively. In this state, the mounting head 6 can suck 12 parts by rotating the nozzle.

  A component recognition camera 10 is installed between the component supply device 3 and the printed circuit board P. The imaging unit of the component recognition camera 10 is installed on the lower side of the sheet, and recognizes the state of the electronic component sucked by the suction nozzle 5. The component recognition camera 10 can recognize the state of the electronic component sucked by 12 nozzles at a time. If the electronic component is mounted on the printed circuit board P while there is an abnormality in the suction state of the electronic component, a mounting failure occurs. Therefore, when a component adsorption abnormality is discovered by the component recognition camera 10, the problematic component is dropped in the discharge box 16. The discharge box 16 is installed on the side of the component recognition camera 10. Two component recognition cameras 10 are installed on both sides of the printed circuit board P. This is for more quickly recognizing the suction state of the electronic component.

  In FIG. 1, the y mover 9 is integrated, but when divided into an inner mover 9B and an outer mover 9A, the inner mover 9B is shorter than the outer mover 9A. This is when the two mounting heads 6 take out components from the same component supply device 3, or when the two mounting heads 6 mount electronic components on the printed circuit board P in an overlapping area in the y direction. This is to prevent the y mover 9 from becoming a stopper. Conversely, since the y mover 9 does not act as a stopper, there is a risk that the two mounting heads 6 collide. The present invention prevents the nozzle drive device in the mounting head 6, the substrate recognition camera 8, and the like from being damaged when two mounting heads 6 collide during maintenance or the like.

  FIG. 11 is a plan view of a conventional electronic component mounting apparatus 1. Compared with FIG. 1 which is the present invention, the outer movable element 9A and the inner movable element 9B of the y movable element 9 attached to the y beams 1A and 1B have substantially the same length. A stopper 91 is attached to the tip of the inner movable element 9B. The tip of the stopper 91 is flush with the tip of the mounting head 6 or protrudes more. Due to the presence of the stopper 91, the mounting heads 6 above and below the paper do not collide. However, in the configuration of FIG. 11, since the stopper 91 exists, for example, the mounting head 6 on the lower side of the paper cannot suck the electronic component from the component supply device 3 on the upper side of the paper.

  FIG. 2 is a diagram in which the mounting head 6 takes out the electronic component from the component supply unit 3B of the component supply device 3 on the upper side of the drawing in the electronic component mounting apparatus 1 of the present invention. That is, the lower x-beams 4A and 4B attached to the y mover 9 move on the y-beams 1A and 1B, and the lower mounting head 6 moves on the upper part component supply unit 3B. is doing. Therefore, in FIG. 2, the components are taken out from the component supply unit 3 </ b> B on the upper side by the two mounting heads 6. As described with reference to FIG. 1, the inner movable element 9 </ b> B of the y movable element 9 does not serve as a stopper, and thus such an interference operation between the two mounting heads 6 is possible. Accordingly, the self-tolerance of electronic component mounting increases. On the other hand, in FIG. 2, since the mounting heads 6 overlap in the y direction, there is a risk that the two mounting heads 6 will collide when the mounting head 6 moves in the x direction.

  FIG. 3 is a plan view showing a state in which the electronic components are mounted on the printed circuit board P after the two mounting heads 6 suck the electronic components from the component supply unit 3B on the upper side of the drawing. In FIG. 3, the two suction heads are separated in the x direction of FIG. 3, but overlap each other in the y direction of FIG. This is possible because the inner movable element 9B of the y movable element 9 in FIG. 3 does not serve as a stopper. As described above, since the electronic components can be mounted on the printed circuit board P by the two heads in the overlapping area in the y direction, the degree of mounting freedom can be increased. This has the advantage that the mounting speed of electronic components on the printed circuit board P can be increased, particularly when more electronic components are mounted on one side of the printed circuit board P.

  FIG. 12 is a plan view showing a state in which the electronic component is mounted on the printed circuit board P in the conventional electronic component mounting apparatus 1. FIG. 12 is a diagram illustrating a state where both the upper mounting head 6 and the lower mounting head 6 are mounting electronic components on the printed circuit board P. FIG. In FIG. 12, the mounting head 6 on the upper side of the paper mounts electronic components only on the upper side of the printed circuit board P, and the mounting head 6 on the lower side of the paper mounts electronic components only on the lower side of the printed circuit board P. To do.

  Further, in the apparatus shown in FIG. 12, the mounting head 6 on the upper side of the paper has a structure in which electronic components cannot be sucked from the component supply unit 3B on the lower side of the paper. Therefore, in the apparatus shown in FIG. 12, the upper side and the lower side of the printed circuit board P are independent. That is, when the number of electronic components mounted on the upper side and the lower side of the printed circuit board P is significantly different, even if one side of the printed circuit board P finishes the mounting operation, the other of the printed circuit boards P, that is, It is necessary to wait for the work with the larger number of electronic components to be completed, resulting in time loss.

  On the other hand, in the apparatus of FIG. 12, the upper mounting head 6 does not enter below the center line of the printed circuit board P, and the lower mounting head 6 is above the center line of the printed circuit board P. Does not invade. A stopper 91 is formed at the tip of the inner movable element 9B of the y movable element 9. Therefore, there is no danger of collision between the upper head and the lower head even during maintenance.

  In FIG. 1, FIG. 2, FIG. 3, etc., the x beams 4A, 4B are supported by two y beams 1A, 1B. However, the x beams 4A and 4B do not have to be supported by two y beams, and the x beam can be supported by only one of the y beams if the intensity of the x beam permits. For example, the x beam 4A may be supported only by the y beam 1A, and the x beam 4B may be supported only by the y beam 1B.

  FIG. 4 is a schematic view of the mounting head 6 in the electronic component mounting apparatus 1 according to the present invention. The main function of the mounting head 6 is to pick up electronic components from the component supply unit 3B shown in FIG. In FIG. 4, nozzles for adsorbing electronic components are arranged on the circumference downward. In order to pick up electronic components by each nozzle, it is necessary to draw a vacuum in the nozzle to create a negative pressure. For this purpose, each nozzle is provided with a cylinder 51 to control suction by the nozzle.

  FIG. 5 is a view of the suction nozzle 5 seen from the direction A in FIG. In FIG. 5, twelve nozzles are arranged on the circumference. When the electronic component is large, the nozzles arranged on the circumference are also large, and therefore the number of nozzles arranged is small. The type of the suction nozzle 5 can be changed depending on the type of the printed circuit board P on which the electronic component is mounted.

  Which electronic component is attracted to the nozzles arranged on the circumference is determined by the CPU reading the mounting data. That is, in accordance with a command from the CPU, the x beams 4A and 4B on which the mounting head 6 is installed move on the y beams 1A and 1B, and the mounting head 6 moves on the x beams 4A and 4B. It moves onto the component supply unit 3B where the component exists.

  The target electronic component needs to be adsorbed to the corresponding nozzle. The nozzle rotation motor 52 rotates the nozzle as shown by θ in FIG. 5 and installs the corresponding nozzle on the target electronic component. Thereafter, the nozzle is lowered by the nozzle selection cylinder 51 to suck the target electronic component. When the target electronic component is picked up, the nozzle is raised. The same operation is performed for all 12 nozzles. Therefore, 12 components are adsorbed at a time by moving the mounting head 6 to the component supply unit 3B.

  In FIG. 4, a substrate recognition camera 8 is installed in front of the suction nozzle 5. The board recognition camera 8 serves to detect the reference position of the printed board P when the mounting head 6 moves onto the printed board P. Based on the reference position on the printed circuit board P, the mounting position of each electronic component on the printed circuit board P is determined.

  When the mounting head 6 moves to a corresponding location on the printed circuit board P, the nozzle to which the target electronic component is attracted rotates and moves onto the corresponding location on the printed circuit board P. Thereafter, the nozzle is lowered and the target electronic component is mounted at a corresponding place on the printed circuit board P.

  In FIG. 4, the suction nozzle driving mechanism, the substrate recognition camera 8, and the like are installed on a head substrate (not shown), and the head substrate is attached to the head base 13. The head base 13 is attached to the x mover 15 shown in FIG. 1, and the mounting head 6 can move on the x beams 4A and 4B by a command from the CPU. Actually, a linear motor is installed on the x mover 15 and the mounting head 6 is moved by the linear motor. Further, a linear encoder (not shown) is attached to the x mover 15 so that the actual position of the mounting head 6 is recognized by the CPU.

  In FIG. 4, the suction nozzle 5, the nozzle selection cylinder 51, the substrate recognition camera 8, etc. are covered with a head cover 12. The head cover 12 is merely a cover, and has no effect of protecting internal components against external impacts. That is, if the mounting heads 6 collide with each other only with the cover, the drive mechanism of the suction nozzle 5, the substrate recognition camera 8, and the like may be damaged.

  In the present invention, as shown in FIG. 4, a bumper 11 is attached to the outside of the head cover 12, and when the head covers 12 collide with each other, the internal suction nozzle drive mechanism, the substrate recognition camera 8, and the like are protected. In order to provide the bumper 11 with a protective function, the bumper 11 needs to have a certain degree of strength. On the other hand, the mounting head 6 needs to move at a high speed of about 2 m / sec. If the weight of the bumper 11 is large, it is difficult to move the mounting head 6 at high speed. The shape, material, etc. of the bumper 11 must be determined in consideration of the above points.

  Since the bumper 11 protects the internal suction nozzle mechanism and the like when the two mounting heads 6 collide, the bumpers 11 need to collide with each other when the two mounting heads 6 collide. is there. Therefore, it is desirable that the vertical positions of the bumpers 11 attached to the two mounting heads 6 are substantially the same. However, the positions of the bumpers 11 of the two mounting heads 6 do not necessarily coincide with each other. For example, even if the vertical positions of the bumpers 11 of the two mounting heads 6 are deviated, the two mounting heads 6 are mounted. Any configuration in which the bumper 11 collides when the head 6 collides may be used.

  FIG. 6 is a perspective view in which only the bumper 11 in FIG. 4 is taken out. In FIG. 6, the material of the bumper 11 is made of Al having a small specific gravity. The bumper 11 has a height H of 20 mm and a thickness T of 10 mm. The height H of the bumper is 1/5 or less of the height of the head cover 12.

  FIG. 7 is a detailed view of the bumper 11 shown in FIG. 7A is a plan view of the bumper 11, FIG. 7B is a front view, and FIG. 7C is a cross-sectional view taken along line AA in FIG. 7A. In FIG. 7A, the bumper 11 has a width W of 120 mm and a depth L of 150 mm. In FIG. 7C, the larger the thickness T of the bumper 11, the greater the protection effect at the time of collision can be increased. However, when the bumper 11 is thicker, the distance between the two mounting heads 6 cannot be reduced. That is, in order to avoid a collision while the two mounting heads 6 are operating, it is necessary to maintain an interval between the two mounting heads 6 so that the collision can be avoided even if acceleration is taken into consideration. is there. When the thickness T of the bumper 11 is large, the interval between the two mounting heads 6 becomes large, and the degree of freedom is lost accordingly.

  On the other hand, in order to reduce the impact when the two mounting heads 6 collide, it is better to increase the height of the bumper 11. However, if the height of the bumper 11 is increased, the weight increases, which hinders the mounting head 6 from moving at high speed. From this point, in the present embodiment, the height H is set to 20 mm to suppress an increase in the weight of the mounting head 6.

  In this embodiment, the thickness T of the bumper 11 is 10 mm, and the height H of the bumper 11 is 20 mm. However, this is an example, and it is not necessary to limit to this dimension. However, the relationship between the height H and the thickness T of the bumper 11 is preferably maintained as H> T. In this embodiment, Al is used as the material of the bumper 11. However, it is needless to say that the bumper 11 need not be limited to Al if the strength and weight of the bumper 11 are within an allowable range.

  As a material for the bumper 11, a synthetic resin can be used. In particular, the urethane resin is suitable as a material for the bumper 11 of the present invention because it can realize various types of resins having a high elastic modulus to a low elastic modulus. Moreover, not only urethane resin but also acrylic resin can be used as the bumper 11 of the present invention.

  FIG. 8 shows another example of the bumper 11 used in the present invention. FIG. 8A is a plan view of the bumper 11 according to the present embodiment, FIG. 8B is a front view of the bumper 11 according to the present embodiment, and FIG. 8C is a cross-sectional view taken along line AA in FIG. is there. In FIG. 8, the outer shape of the bumper 11 is the same as that in FIG. FIG. 8 differs from FIG. 7 in that the outside of the bumper 11 is covered with a buffer member 111 formed of rubber. When the metal bumpers 11 collide with each other, since both are hard materials, it is difficult to absorb the impact of the collision. In the present embodiment, the impact force at the time of collision is weakened by covering the outside of the bumper 11 with rubber.

  In the present embodiment, the height H of the bumper 11 is 20 mm, and the thickness T is 10 mm. Of the thickness of the bumper 11, the rubber portion has a thickness T2 of 3 mm, and the base material 112 has a thickness T1 of 7 mm. Also in this embodiment, a resin such as urethane or acrylic can be used as the bumper base 112 instead of Al.

  Thus, in this embodiment, when two mounting heads 6 collide, the impact due to the collision can be reduced, and the protection effect of the components in the mounting head 6 is great.

  FIG. 9 shows still another example of the bumper 11 used in the present invention. FIG. 9A is a plan view of the bumper 11 according to the present embodiment, FIG. 9B is a front view of the bumper 11 according to the present embodiment, and FIG. 9C is a cross-sectional view taken along line AA in FIG. is there. In FIG. 9, the outer shape of the bumper 11 is the same as that in FIG. 9 differs from FIG. 7 in that the bumper 11 has a U-shaped cross section and is hollow inside. The material of this example is Al.

  The advantage of this embodiment is that the weight of the bumper 11 can be reduced without significantly reducing the strength of the bumper 11. In the present embodiment, the height H of the bumper 11 is 20 mm, and the thickness T of the bumper 11 is 10 mm, which is the same as in the first embodiment. Therefore, the strength of the bumper 11 is not significantly reduced as compared with the first embodiment. On the other hand, since the weight can be greatly reduced, the mounting head 6 can be moved at a high speed. Further, the relationship between the height H of the bumper 11 and the thickness T of the bumper 11 maintains a relationship of H> T.

  FIG. 9D shows another form of the bumper 11 in this embodiment. In the form shown in FIG. 9D, the bumper 11 has a hollow square pipe in cross section. By setting it as such a shape, the intensity | strength of the bumper 11 can be enlarged compared with the case of FIG.9 (c). On the other hand, since it is hollow, the weight can be reduced accordingly.

  In the above description, Al is assumed as the material of the bumper 11 in the present embodiment, but the material of the bumper 11 is not limited to this, and urethane resin, acrylic resin, or the like can also be used.

  FIG. 10 shows still another example of the bumper 11 used in the present invention. FIG. 10A is a plan view of the bumper 11 according to the present embodiment, FIG. 10B is a front view of the bumper 11 according to the present embodiment, and FIG. 10C is a cross-sectional view taken along the line AA in FIG. is there. In FIG. 9, the outer shape of the bumper 11 is the same as that in FIG. 9 is different from FIG. 7 in that the bumper 11 has a semicircular cross section and a hollow inside. The material of this example is Al.

  The advantage of the present embodiment is that, as in the third embodiment, the weight of the bumper 11 can be reduced without significantly reducing the strength of the bumper 11. On the other hand, the feature of the present embodiment is that the bumper 11 can be easily processed because the cross section is a semicircle compared to the third embodiment. Also, the mechanical strength against impact is excellent. The height H of the bumper 11 is 20 mm, and the thickness T of the bumper 11 is 10 mm, which is the same as in the first embodiment. Therefore, the strength of the bumper 11 is not significantly reduced as compared with the first embodiment. On the other hand, since the weight can be greatly reduced, the mounting head 6 can be moved at a high speed. Further, the relationship between the height H of the bumper 11 and the thickness T of the bumper 11 maintains a relationship of H> T.

  The material of the bumper 11 can be Al as a metal, but is not limited to this, and a resin such as urethane or acrylic can also be used.

  In the first to fourth embodiments, as shown in FIG. 4, a head cover 12 is installed on the mounting head 6, and a bumper 11 having a lower height is installed around the head cover 12. By the way, the head cover 12 is provided only for design requirements, and does not have a protection role for the suction nozzle driving mechanism, the substrate recognition camera 8 and the like in the mounting head 6.

  Therefore, even if the head cover 12 is not installed, it can operate as the electronic component mounting apparatus 1. When the head cover 12 of the mounting head 6 is not installed, the bumper 11 is directly installed on the head base 13 shown in FIG. 4 or a head substrate (not shown). Even with such a configuration, the electronic component mounting apparatus 1 can function without problems. In addition, even if the two heads come into contact with each other during maintenance due to the presence of the bumper 11, the nozzle driving device, the substrate recognition camera 8, and the like in the mounting head 6 are not damaged.

  In the above Examples 1 to 5, it has been described that Al is used as the metal as the material of the bumper 11. This is because Al has a small specific gravity, is relatively easy to process, and can reduce the weight of the bumper 11. On the other hand, materials other than Al, such as iron and stainless steel, can be used within a range where the weight is acceptable. That is, since iron or the like has a higher strength than Al, the material of the bumper 11 can be made thinner than that of Al.

  In the first to fifth embodiments, in the component supply device 3, the nozzle of the mounting head 6 of the electronic component mounting device 1 absorbs the electronic component from the component supply unit 3B in which the electronic component is installed on the tape. As explained. In the component supply device 3 according to the present invention, the nozzle of the mounting head 6 sucks the electronic component from a so-called tray feeder in which the component is installed on the tray as well as the type in which the electronic component is installed on the tape. Needless to say, the present invention can also be applied to a type of apparatus.

  In the first to fifth embodiments, the component supply device 3 is described as being installed on both sides of the electronic component mounting device 1 as illustrated in FIGS. 1 to 3. However, the present invention can also be applied to the case where the component supply device 3 is installed only on one side of the electronic component mounting device 1. That is, when the component supply device 3 is installed only on one side of the electronic component mounting device 1, the two mounting heads 6 absorb the electronic components from the component supply device 3 and the electrons on the printed circuit board P. If the component can be mounted, the electronic component mounting speed on the printed circuit board P is greatly improved as compared with the case where only one mounting head 6 is used. In this case as well, as described in the first to fifth embodiments, it is the same that the collision of the two mounting heads 6 becomes a problem. Therefore, it goes without saying that the present invention works effectively.

  As described above, by using the present invention, the two mounting heads 6 are moved to a position where they interfere with each other, and the electronic component is sucked from the component supply unit 3B and mounted on the printed circuit board P. In the electronic component mounting apparatus 1 configured at a high speed, even when two mounting heads 6 collide due to apparatus maintenance or the like, damage to the suction nozzle driving mechanism, the substrate recognition camera 8 and the like in the mounting head 6 is prevented. I can do it.

It is a top view of the electronic component mounting apparatus by this invention. In the top view of the electronic component mounting apparatus by this invention, it is a figure which two mounting heads adsorb | suck an electronic component from the same component supply unit. In the top view of the electronic component mounting apparatus by this invention, it is a figure which two mounting heads have mounted the electronic component on the printed circuit board. It is an external view of the mounting head by this invention. FIG. 4 is a layout diagram of nozzles in the mounting head according to the present invention. It is an external view of a bumper. It is a figure which shows the bumper of Example 1. FIG. It is a figure which shows the bumper of Example 2. FIG. It is a figure which shows the bumper of Example 3. FIG. It is a figure which shows the bumper of Example 4. FIG. In the top view of the electronic component mounting apparatus of a prior art example, it is a figure in which two mounting heads adsorb | suck the electronic component from a component supply unit. In the top view of the electronic component mounting apparatus of a prior art example, it is a figure in which two mounting heads have mounted the electronic component on the printed circuit board.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Electronic component mounting apparatus, 1A, 1B ... y beam, 2 ... Conveyor device, 3 ... Component supply apparatus, 3A ... Feeder base, 3B ... Component supply unit, 4A, 4B ... X beam, 5 ... Suction nozzle, 6 ... Mounting head, 7 ... Printed circuit board conveyor, 8 ... Board recognition camera, 9 ... y mover, 9A ... Outer mover, 9B ... Inner mover, 10 ... Component recognition camera, 11 ... Bumper, 12 ... Head cover, 13 ... Head Base 15, x mover 16, discharge box 51, nozzle selection cylinder 52, nozzle rotation motor 91, stopper 111, buffer member 112, bumper base material P, printed circuit board

Claims (11)

A conveying device that conveys the printed circuit board in a first direction, and a component supply device installed outside the second direction perpendicular to the first direction with respect to the conveying device;
A first y beam and a second y beam extending in the second direction are arranged with a gap therebetween, and the first y beam and the second y beam are bridged to form the first y beam. There is a first x-beam and a second x-beam extending in the direction,
A first mounting head is installed on the first x beam, a second mounting head is installed on the second x beam,
The first mounting head and the second mounting head each include a nozzle that sucks an electronic component, and the first mounting head and the second mounting head take out the electronic component from the same component supply device. Can
The electronic component mounting apparatus, wherein the first mounting head and the second mounting head include a bumper.   The electronic component mounting apparatus according to claim 1, wherein the bumper is made of metal.   The electronic component mounting apparatus according to claim 1, wherein the bumper is made of Al.   The electronic component mounting apparatus according to claim 1, wherein a base material of the bumper is formed of metal, and a buffer member is provided around the base material.   The electronic component mounting apparatus according to claim 1, wherein the bumper is hollow.   The electronic component mounting apparatus according to claim 1, wherein a cover is formed on the mounting head, and the bumper is formed around the cover of the mounting head. A conveying device that conveys a printed circuit board in a first direction, and a first component mounting device and a second component supply device are installed on both sides in a second direction perpendicular to the first direction with respect to the conveying device. And
A first y beam and a second y beam extending in the second direction are arranged with a gap therebetween, and the first y beam and the second y beam are bridged to form the first y beam. There is a first x-beam and a second x-beam extending in the direction,
A first mounting head is installed on the first x beam, a second mounting head is installed on the second x beam,
The first mounting head and the second mounting head each include a nozzle that sucks an electronic component, and the first mounting head and the second mounting head include the first component supply device and the second component. Electronic components can be adsorbed from any of the component supply devices,
The electronic component mounting apparatus, wherein the first mounting head and the second mounting head include a bumper.   The electronic component mounting apparatus according to claim 8, wherein the bumper is made of Al.   The electronic component mounting apparatus according to claim 8, wherein the bumper is made of urethane resin or acrylic resin. A conveying device that conveys the printed circuit board in a first direction, and a component supply device installed outside the second direction perpendicular to the first direction with respect to the conveying device;
A first y-beam and a second y-beam extending in the second direction are arranged with an interval, and a first x-beam extends in the first direction from the first y-beam. And from the second y beam, a second x beam extends in a direction opposite to the first direction,
A first mounting head is installed on the first x beam, a second mounting head is installed on the second x beam,
The first mounting head and the second mounting head each include a nozzle that sucks an electronic component, and the first mounting head and the second mounting head take out the electronic component from the same component supply device. Can
The electronic component mounting apparatus, wherein the first mounting head and the second mounting head include a bumper. A conveying device that conveys a printed circuit board in a first direction, and a first component mounting device and a second component supply device are installed on both sides in a second direction perpendicular to the first direction with respect to the conveying device. And
A first y-beam and a second y-beam extending in the second direction are arranged with an interval, and a first x-beam extends in the first direction from the first y-beam. And from the second y beam, a second x beam extends in a direction opposite to the first direction,
A first mounting head is installed on the first x beam, a second mounting head is installed on the second x beam,
The first mounting head and the second mounting head each include a nozzle that sucks an electronic component, and the first mounting head and the second mounting head include the first component supply device and the second component. Electronic components can be adsorbed from any of the component supply devices,
The electronic component mounting apparatus, wherein the first mounting head and the second mounting head include a bumper.

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