JP2011228327A - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus and an electronic component mounting method capable of mounting electronic components supplied by a tray feeder on a board simultaneously in parallel using two mounting heads.SOLUTION: The electronic component mounting apparatus comprises a board transport conveyor 13 which transports a board 2 and positions the board 2 in place; a tray feeder 15 which supplies a front tray 33a and a rear tray 33b, both containing an electronic component 4; a front mounting head 16a which picks up the electronic component 4 from inside the front tray 33a supplied by the tray feeder 15 and mounts the electronic component 4 on the board 2 positioned in place by the board transport conveyor 13; a rear mounting head 16b which picks up the electronic component 4 from inside the rear tray 33b supplied by the tray feeder 15 and mounts the electronic component 4 on the board 2 positioned in place by the board transport conveyor 13.

Description

  The present invention relates to an electronic component mounting machine and an electronic component mounting method for picking up an electronic component supplied from a tray and mounting it on a substrate.

  The electronic component mounting machine transports and positions the substrate by the substrate transport unit provided on the base, picks up the electronic component supplied from the electronic component supply unit by the mounting head, and places the picked-up electronic component on the substrate. Mount the electronic component on the board. Here, as an electronic component supply unit, a tray feeder is known in addition to a tape feeder and a bulk feeder (for example, Patent Document 1). The tray feeder is usually attached at a position opposite to the side on which the operator of the base is working, a storage unit for storing a plurality of pallets on which trays storing electronic components are placed, and a storage unit for the pallets And a lift part for positioning the drawer part at a predetermined position (height). Some electronic component mounting machines are provided with two mounting heads, and the mounting heads perform operations from picking up electronic components to mounting on a substrate independently of each other.

JP 2009-152252 A

  Conventionally, however, the tray feeder is configured to supply only a tray containing electronic components to be supplied to one mounting head via a pallet, so that the mounting operation of electronic components by two mounting heads in parallel is performed. There is a problem that the substrate productivity cannot be improved.

  Accordingly, the present invention provides an electronic component mounting machine and an electronic component mounting method that allow electronic components supplied from a tray feeder to be mounted on a substrate simultaneously by two mounting heads. With the goal.

  The electronic component mounting machine according to claim 1 is installed on a base, and includes a substrate transport unit that transports and positions the substrate in a horizontal plane direction, a first tray that is installed on the base and stores electronic components, and A tray feeder that supplies the second tray at the same time, a first mounting head that picks up an electronic component in the first tray supplied by the tray feeder and mounts the electronic component on the substrate positioned by the substrate transport unit, and the tray feeder And a second mounting head for picking up the electronic components in the second tray supplied by the above and mounting the electronic components on the substrate positioned by the substrate transport unit.

  The electronic component mounting machine according to claim 2 is the electronic component mounting machine according to claim 1, wherein the tray feeder sandwiches the substrate transport unit in a horizontal plane direction orthogonal to the substrate transport direction by the substrate transport unit. The second mounting head is installed on one side of both ends of the opposing base, and the second mounting head moves in a region closer to the tray feeder than the first mounting head, and the first tray and the second tray Is supplied by the tray feeder in a state in which the first tray is positioned closer to the substrate transport unit than the second tray.

  The electronic component mounter according to claim 3 is the electronic component mounter according to claim 1 or 2, wherein the substrate transport unit transports and positions two substrates simultaneously in parallel and performs first mounting. The head mounts the picked-up electronic component in the first tray on one of the two substrates positioned by the substrate transport unit, and the second mounting head transports the picked-up electronic component in the second tray to the substrate. It is attached to the other of the two substrates positioned by the part.

  The electronic component mounting machine according to claim 4 is the electronic component mounting machine according to any one of claims 1 to 3, wherein the electronic components stored in the first tray and the second tray are different from each other. belongs to.

  The electronic component mounting method according to claim 5, wherein the electronic component is stored by the step of transporting and positioning the substrate in a horizontal plane direction by the substrate transport unit installed on the base, and the tray feeder installed on the base A step of supplying the first tray and the second tray simultaneously, and an electronic component in the first tray supplied by the tray feeder is picked up by the first mounting head and mounted on the substrate positioned by the substrate transport unit. And a step of picking up an electronic component in the second tray supplied by the tray feeder by the second mounting head and mounting the electronic component on the substrate positioned by the substrate transport unit.

  The electronic component mounting method according to claim 6 is the electronic component mounting method according to claim 5, wherein the tray feeder is sandwiched in a horizontal plane direction perpendicular to the substrate transport direction by the substrate transport unit. The first and second trays are installed on one side of the opposite ends of the opposing base, and the second mounting head is moved in a region closer to the tray feeder than the first mounting head. Are supplied by the tray feeder in a state where the first tray is positioned closer to the substrate transport unit than the second tray.

  The electronic component mounting method according to claim 7 is the electronic component mounting method according to claim 5 or 6, wherein two substrates are simultaneously transported and positioned by the substrate transport unit, and supplied by the tray feeder. In the step of picking up the electronic components in the first tray by the first mounting head and mounting the electronic components on the substrate positioned by the substrate transport unit, the electronic components in the first tray picked up by the first mounting head A process of mounting on one of the two substrates positioned by the transport unit, picking up an electronic component in the second tray supplied by the tray feeder by the second mounting head, and mounting the electronic component on the substrate positioned by the substrate transport unit 2, the two substrates in which the electronic components in the second tray picked up by the second mounting head are positioned by the substrate transport unit The other out to be mounted.

  The electronic component mounting method according to claim 8 is the electronic component mounting method according to any one of claims 5 to 7, wherein the electronic components stored in the first tray and the second tray are of different types. belongs to.

  In the present invention, the tray feeder supplies two trays (first tray and second tray) containing electronic components at the same time, and two mounting heads (first mounting head and second tray) are supplied. One of the mounting heads) picks up an electronic component from one of the two trays and mounts it on the substrate, and the other of the two mounting heads picks up an electronic component from the other of the two trays and mounts it on the substrate. Thus, the mounting operation of the electronic components on the substrate in parallel by the two mounting heads can be performed, and the substrate productivity can be improved.

The perspective view of the electronic component mounting machine in one embodiment of this invention The perspective view of the electronic component mounting machine in one embodiment of this invention The side view of the electronic component mounting machine in one embodiment of this invention (A) (b) The perspective view of the tray feeder with which the electronic component mounting machine in one embodiment of this invention is provided (A) (b) The perspective view in the magazine of the tray feeder with which the electronic component mounting machine in one embodiment of this invention is provided (A) (b) Operation | movement explanatory drawing of the tray feeder with which the electronic component mounting machine in one embodiment of this invention is provided (A) (b) Operation | movement explanatory drawing of the tray feeder with which the electronic component mounting machine in one embodiment of this invention is provided The block diagram which shows the control system of the electronic component mounting machine in one embodiment of this invention The flowchart of the main routine which shows the flow of the electronic component mounting process which the electronic component mounting machine in one embodiment of this invention performs The subroutine flowchart which shows the flow of the electronic component mounting process which the electronic component mounting machine in one embodiment of this invention performs (A) (b) (c) Operation | movement explanatory drawing of the mounting head with which the electronic component mounting machine in one embodiment of this invention is provided

  Embodiments of the present invention will be described below with reference to the drawings. An electronic component mounting machine 1 shown in FIGS. 1, 2 and 3 is a kind of electronic component mounting apparatus constituting an electronic component mounting line for mounting substrate production, and is used for mounting other electronic components upstream (not shown). An electronic component mounting operation is performed in which the substrate 2 sent from an apparatus (for example, a screen printing machine or another electronic component mounting machine 1) is carried in and the electronic component 4 is mounted on the electrode 3 provided on the surface of the substrate 2. After that, the operation of carrying out the substrate 2 to another electronic component mounting apparatus (for example, another electronic component mounting machine 1 or a reflow furnace) on the downstream side (not shown) is continuously executed. Hereinafter, for convenience of explanation, the transport direction of the substrate 2 in the electronic component mounting machine 1 (the direction in which the arrow A is directed in FIGS. 1 and 2 and the direction perpendicular to the paper in FIG. 3) is the X-axis direction and the X-axis direction. The horizontal plane direction orthogonal to the Y-axis direction is the Y-axis direction (the left-right direction in FIG. 3), and the vertical direction is the Z-axis direction. The Y-axis direction is the front-rear direction of the electronic component mounting machine 1 and the X-axis direction is the lateral (left-right) direction of the electronic component mounting machine 1. Further, in the front-rear direction, the side on which the operator OP (FIG. 1) of the electronic component mounting machine 1 operates the electronic component mounting machine 1 is the front side of the electronic component mounting machine 1, and the opposite side is the electronic component mounting machine 1. Behind.

  1, 2, and 3, the electronic component mounting machine 1 according to the present embodiment is installed on a base 12 covered with a main body cover 11 that forms an outline of the electronic component mounting machine 1, and the base 12. The front and rear two substrate transfer conveyors 13 (the front substrate transfer conveyor 13a and the rear substrate transfer conveyor 13b) as the substrate transfer unit for transferring and positioning the substrate 2 in the horizontal plane direction (X-axis direction), the base 2 And a plurality of tape feeders 14 as an electronic component supply unit that supplies the electronic components 4, a tray feeder 15, and two mounting heads 16 as electronic component mounting units. The two mounting heads 16 are moved independently of each other with respect to the substrates 2 positioned by the respective substrate transport conveyors 13 by a head moving mechanism 17 formed of an XY robot attached to the base 12.

  Each substrate transport conveyor 13 extends in the X-axis direction so as to pass through a substrate carry-in port 11 a (FIG. 1) and a substrate carry-out port (not shown) provided at positions facing the X-axis direction of the main body cover 11. Then, the board 2 received from the other electronic component mounting apparatus (not shown) on the upstream side is carried in, positioned at the center work position of the base 12 (position shown in FIGS. 2 and 3), and the mounting head 16 with respect to the board 2 After the component mounting operation is executed, the board 2 is carried out to another electronic component mounting apparatus (not shown) on the downstream side.

  2 and 3, the head moving mechanism 17 extends in the Y-axis direction on the beam-shaped Y-axis table 17 a and the Y-axis table 17 a provided extending in the Y-axis direction so as to straddle the front and rear substrate transport conveyors 13. It comprises two front and rear beam-like X-axis tables 17b extending in the X-axis direction provided movably, and two front and rear plate-like movement stages 17c provided on each X-axis table 17b so as to be movable in the X-axis direction. The front mounting head 16a is attached to the front moving stage 17c, and the rear mounting head 16b is attached to the rear moving stage 17c. Each mounting head 16 is provided with a plurality of suction nozzles 16 </ b> N extending downward so as to be able to move up and down and rotate about an up and down axis (Z axis).

  Here, since the two front and rear X-axis tables 17b are mounted on the common Y-axis table 17a, the mounting head 16 (hereinafter referred to as “front mounting”) mounted on the X-axis table 17b positioned relatively forward. The movable area of the head 16a "is located in front of the current position of the mounting head 16 (hereinafter referred to as" rear mounting head 16b ") attached to the relatively rear X-axis table 17b. The region in which the rear mounting head 16b is movable is limited to the region behind the current position of the front mounting head 16a. That is, the rear mounting head 16b is always positioned behind the front mounting head 16a, and the front mounting head 16a is always positioned ahead of the rear mounting head 16b.

  Thus, the movable region of the front mounting head 16a and the movable region of the rear mounting head 16b are not fixed to the base 12, but the movable region of the front mounting head 16a is the rear mounting. It changes depending on the current position of the head 16b, and the movable area of the rear mounting head 16b is an area that changes depending on the current position of the front mounting head 16a.

  2 and 3, each of the two front and rear moving stages 17 c included in the head moving mechanism 17 is provided with a substrate camera 18 whose imaging field of view is directed downward. A component camera 19 having an imaging field of view upward is provided in each of the regions on the base 12 facing each other.

  1, 2, and 3, the plurality of tape feeders 14 are opposed to each other with the front and rear substrate transport conveyors 13 interposed therebetween in a horizontal plane direction (Y-axis direction) orthogonal to the transport direction of the substrate 2 by the substrate transport conveyor 13. Installed side by side in the X-axis direction in the front area (the area on which the operator OP is working) of the both ends of the base 12, respectively, the ends on the central part side (substrate transport conveyor 13 side) of the base 12 The electronic component 4 is continuously supplied to the component supply port 14a provided in the section. The plurality of tape feeders 14 are held by a carriage Cg that can be run on the floor surface by the operator OP operating the pair of handle portions H, and the operator OP couples the carriage Cg to the base 12. As a result, a plurality of tape feeders 14 can be collectively mounted on the base 12.

  The tray feeder 15 is a rear region of both ends of the base 12 facing each other across the front and rear substrate transport conveyors 13 in a horizontal plane direction (Y-axis direction) orthogonal to the transport direction of the substrates 2 by the substrate transport conveyor 13. (A region on the side opposite to the side on which the operator OP works). Therefore, the rear mounting head 16b moves in a region closer to the tray feeder 15 than the front mounting head 16a.

  4A and 4B, the tray feeder 15 includes a base portion 21 having a plurality of casters 21a at the bottom, a storage portion 22 provided at the rear of the upper surface of the base portion 21, and a front surface of the upper surface of the base portion 21. And a drawer portion 24 supported by the lift portion 23 and moved up and down. A pair of handles 25 are erected on the upper portion of the storage unit 22, and the operator OP moves the tray feeder 15 on the floor surface by operating these pairs of handles 25, so that the electronic component mounting machine 1 can be operated. It can be coupled to the base 12.

  4A and 4B, the storage unit 22 includes a magazine rack 22a provided on the base 21 and a plurality of (here, two) magazines 22b detachably stored in the magazine rack 22a. In FIG. 4A, a plurality (two in this case) of storage spaces 22c are arranged in the vertical direction in the internal space of the magazine rack 22a, and each magazine 22b is stored separately in each storage space 22c. Yes.

  In each storage space 22c of the magazine rack 22a, the wall surface of the rear surface of the tray feeder 15 (the surface opposite to the side facing the base 12 when coupled to the base 12; the left side in FIG. 4). It can access from the opening part 22k provided in. The opening 22k can be opened and closed by a door 22d attached to the rear surface of the magazine rack 22a via a hinge (not shown).

  5A and 5B, a plurality of pallets 31 arranged side by side in each magazine 22b are accommodated in the magazine 22b so as to be freely drawn out (inserted / removed) in the horizontal direction. A pair of locked members 32 facing in the X-axis direction are provided at the front end of each pallet 31 (the end located on the front side in the state accommodated in the tray feeder 15). Above, two trays 33 having a plurality of pockets 33p each storing electronic components 4 to be mounted on the substrate 2 are in the front-rear direction (in the Y-axis direction and also in the direction in which the pallet 31 is pulled out by the drawer portion 24). Are placed in line. Hereinafter, the tray 33 placed in the front area on the pallet 31 is referred to as “front tray 33a”, and the tray 33 placed in the rear area on the pallet 31 is referred to as “rear tray 33b”. Called.

  As described above, in the present embodiment, the tray feeder 15 is installed on the base 12, and the two trays 33 (the front tray 33 a and the rear tray 33 b) containing the electronic components 4 are simultaneously connected via the pallet 31. To supply. Only the electronic component 4 mounted on the substrate 2 by the front mounting head 16a is stored in the front tray 33a, and mounted on the substrate 2 by the rear mounting head 16b in the rear tray 33b. Only the electronic component 4 is accommodated. The electronic component 4 accommodated in the front tray 33a and the electronic component 4 accommodated in the rear tray 33b may be of the same type or different types.

  4 (a) and 4 (b), the lift portion 23 has a portal frame 41 provided upright from the base 21, and upper and lower end portions thereof are rotatable by the portal frame 41 and the base 21. A ball screw 42 supported by the ball screw 42, a table member 43 having a screwing portion 43a screwed to the ball screw 42, and a ball screw drive motor 44 for rotating the ball screw 42 about the vertical axis. When the motor 44 is driven and the ball screw 42 rotates about the vertical axis, the table member 43 moves up and down with respect to the base portion 21 (arrow B shown in FIG. 4B).

  4 (a) and 4 (b), the lead-out portion 24 extends in the X-axis direction with the main body portion 47 supported by the table member 43 of the lift portion 23, and the upper surface of the main body portion 47 extends in the horizontal plane direction (Y-axis direction). ) Is freely movable (arrow C shown in FIG. 4B and FIG. 5B).

  The locked members 32 provided in each of the plurality of pallets 31 accommodated in the magazine 22b are in a state of being vertically aligned in the magazine rack 22a. It is possible to move between the plurality of locked members 32 arranged above and below.

  When the electronic component 4 is supplied by the tray feeder 15, first, the ball screw drive motor 44 is operated to raise and lower the table member 43, and between the locked members 32 of the plurality of pallets 31 arranged in the vertical direction. The locking rod 48 is moved in the vertical direction, and is positioned at the position (height) of the pallet 31 on which the two trays 33 storing the electronic components 4 to be supplied are placed. Then, the locking rod 48 is moved to the front of the main body 47 (arrow C1 shown in FIG. 6A), and both ends of the locking rod 48 are provided in the grooves 32a of the pair of locked members 32 provided in the pallet 31. (FIG. 5), the table member 43 is pulled out onto the table member 43 (FIG. 6A), and then the table member 43 is raised to a predetermined position (height) at which the electronic component 4 can be adsorbed by the mounting head 16. (FIG. 6B. Arrow B1 shown in the figure). Accordingly, the front tray 33a and the rear tray 33b are supplied by the tray feeder 15 in a state where the front tray 33a is positioned closer to the substrate transport conveyor 13 than the rear tray 33b. By supplying the two trays 33, the electronic component 4 can be adsorbed by the mounting head 16.

  On the other hand, when the pallet 31 drawn to the upper surface of the main body 47 is discharged from the table member 43 and returned (accommodated) into the magazine 22b, the table member 43 is lowered (arrow B2 shown in FIG. 7A). ), The table member 43 is positioned at the position (height) where the pallet 31 placed on the table member 43 was accommodated in the magazine 22b (FIG. 7A). Then, the locking rod 48 is moved rearward of the main body 47 (arrow C2 shown in FIG. 7B), and the pallet 31 on the table member 43 is accommodated in the magazine 22b (FIG. 7B). .

  The pallet 31 can be exchanged by combining the pulling and discharging of the pallet 31. Such replacement of the pallet 31 is not only when the type of the electronic component 4 to be mounted on the substrate 2 is changed, but also when the electronic component 4 in the tray 33 on the pallet 31 is exhausted (of the two trays 33 before and after, When at least one of the electronic components 4 is lost).

  In the electronic component mounting machine 1 according to the present embodiment, the front mounting head 16a and the rear mounting head 16b are separately operated, and the two front and rear trays on the pallet 31 drawn on the table member 43 of the tray feeder 15 are used. Electronic components 4 are picked up from 33 (front tray 33a and rear tray 33b) and mounted on the substrate 2. At this time, the front mounting head 16a picks up the electronic component 4 in the front tray 33a and mounts it on the substrate 2 positioned by the substrate transport conveyor 13, and the rear mounting head 16b has the electronic component 4 in the rear tray 33b. Is picked up and mounted on the substrate 2 positioned by the substrate transfer conveyor 13. When there is an electronic component 4 supplied from the tape feeder 14, the electronic component 4 is picked up by the front mounting head 16 a and mounted on the substrate 2.

  Substrate transporting and positioning operations of the substrate 2 by the substrate transporting conveyor 13 are performed by a substrate transporting conveyor driving unit 51 (FIG. 8) in which the work execution control unit 50 a (FIG. 8) of the control device 50 provided in the electronic component mounting machine 1 includes an actuator (not shown). The operation of controlling the electronic component 4 to the component supply port 14a by each tape feeder 14 is performed by the work execution control unit 50a of the control device 50. The tape feeder driving unit 52 includes an actuator (not shown). This is done by performing the operation control of (FIG. 8). Each tape feeder 14 is electrically connected to the control device 50 in a state where the carriage Cg is coupled to the base 12, and the operation control of each tape feeder 14 by the control device 50 is possible.

  The raising / lowering operation of the table member 43 of the tray feeder 15 is performed by rotating the ball screw 42 around the vertical axis by controlling the operation of the above-described ball screw driving motor 44, and pulling the pallet 31 onto the table member 43. The discharging operation from the table member 43 is performed by controlling the operation of a locking rod drive unit 53 (FIG. 8) including an actuator (not shown) to move the locking rod 48 in the front-rear direction (Y-axis direction) of the tray feeder 15. Made by letting. Note that the tray feeder 15 is electrically connected to the control device 50 in a state of being coupled to the base 12, and the operation of the tray feeder 15 can be controlled by the control device 50.

  The movement operation of the mounting heads 16 in the horizontal plane by the head moving mechanism 17 is performed by the operation control (Y axis) of the head moving mechanism driving unit 54 (FIG. 8) including an actuator (not shown). The movement of each X-axis table 17b in the Y-axis direction with respect to the table 17a and the movement control in the X-axis direction of each movement stage 17c with respect to each X-axis table 17b) are performed. The vertical movement and the rotation around the vertical axis are performed by the work execution control unit 50a of the control device 50 controlling the operation of the nozzle drive unit 55 (FIG. 8) including an actuator (not shown). In addition, the suction and detachment operation of the electronic component 4 by each suction nozzle 16N is performed by the operation execution control unit 50a of the control device 50 performing operation control of a vacuum pressure supply unit 56 (FIG. 8) including an actuator (not shown). The vacuum pressure is supplied to 16N and the supply of the vacuum pressure is released.

  The imaging operation by the board camera 18 and the component camera 19 is performed when the work execution control unit 50a of the control device 50 controls the operation of the board camera 18 and the component camera 19 (FIG. 8). Image data obtained by the imaging operations of the board camera 18 and the component camera 19 is captured and stored in the storage unit 57 (FIG. 8), and the image recognition unit 50 b (FIG. 8) included in the control device 50 recognizes the image.

  Next, an operation procedure of the electronic component mounting machine 1 will be described with reference to FIGS. 9, 10, and 11. Here, the control device 50 picks up the electronic component 4 from the front tray 33a by the front mounting head 16a and is positioned by the front substrate transfer conveyor 13a (hereinafter referred to as the front substrate, FIG. 11). And the substrate 2 (hereinafter referred to as the rear substrate) that is positioned by the rear substrate transport conveyor 13b by picking up the electronic component 4 from the rear tray 33b by the rear mounting head 16b. The operation | movement to which it mounts and is shown simultaneously in FIG. 11 by the code | symbol 2b is shown simultaneously. Here, the electronic component 4 is not supplied from the tape feeder 14 but is supplied only from the tray feeder 15.

  As shown in the flowchart of the main routine in FIG. 9, the control device 50 of the electronic component mounting machine 1 first transports the board from another electronic component mounting device upstream of the electronic component mounting machine 1 by a detection unit (not shown). When it is detected that the board 2 is loaded on the conveyor 13, the board transport conveyor 13 is operated to carry the board 2 into the electronic component mounting machine 1 (board loading process of step ST1 shown in FIG. 9). When the detection means detects that the substrate 2 carried by the substrate transfer conveyor 13 has reached a predetermined work position, the operation of the substrate transfer conveyor 13 is stopped and the substrate 2 is positioned (step ST2 shown in FIG. 9). Substrate positioning step). Thus, the two substrates 2 are simultaneously conveyed and positioned by the front and rear substrate conveying conveyors 13.

  When the positioning of each substrate 2 is completed, the control device 50 controls the operation of the head moving mechanism drive unit 54 to move the substrate camera 18 (the front and rear mounting heads 16) above each substrate 2 and to move each substrate 2. An image of a substrate mark (not shown) provided on is taken. Then, by causing the image recognition unit 50b to recognize the obtained image, a positional deviation from the normal work position of each substrate 2 is obtained.

  When the above-described substrate positioning process is completed, the control device 50 controls the operation of the ball screw drive motor 44 and the locking rod drive unit 53 to operate the tray feeder 15, so that the two trays 33 ( By pulling the pallet 31 on which the front tray 33a and the rear tray 33b) are placed on the table member 43 and raising them to a predetermined position, these two trays 33 are supplied simultaneously (to step ST3 in FIG. 9). Electronic component supply process shown).

  When the electronic component supply process is completed, the control device 50 simultaneously mounts the electronic components 4 on the two substrates 2 positioned by the two front and rear substrate conveyors 13 by the two front and rear mounting heads 16. The electronic component mounting process by the front mounting head 16a shown in step ST4 of FIG. 9 and the electronic component mounting process by the rear mounting head 16b shown in step ST5 of FIG. 9 are performed.

  In the electronic component mounting process by the mounting head 16a in front of step ST4 and the electronic component mounting process by the mounting head 16b in the rear of step ST5, as shown in the flowchart of the subroutine in FIG. It is determined whether or not the electronic component 4 is present in the tray 33 corresponding to the mounting head 16 on the control target side among the two front and rear trays 33 supplied by the control unit 15 (not shown). Component presence / absence determination step shown in step ST11 of FIG. Specifically, the control device 50 determines whether or not there is an electronic component 4 in the front tray 33a for the front mounting head 16a, and electronic components in the rear tray 33b for the rear mounting head 16b. It is determined whether there is 4 or not. This determination is made based on, for example, the relationship between the number of electronic components 4 in the tray 33 and the number of electronic components 4 picked up by the mounting head 16 so far.

  In the part presence / absence determination process in step ST11, the control device 50 selects the tray 33 (the control target) corresponding to the mounting head 16 on the control target side among the two trays 33 currently supplied by the tray feeder 15. When the mounting head 16 on the side is the front mounting head 16a, the electronic component is placed in the front tray 33a, and when the mounting head 16 on the side to be controlled is the rear mounting head 16b) If there is no 4, the pallet 31 is replaced (the current pallet 31 is discharged into the magazine 22b and the new pallet 31 is pulled out from the magazine 22b) as described above (in step ST12 of FIG. 10). Pallet changing process shown).

  On the other hand, in the component presence / absence determination process in step ST11, the control device 50 has an electronic component in the tray 33 corresponding to the mounting head 16 on the side to be controlled among the two trays 33 currently supplied by the tray feeder 15. If there is 4, it is determined whether or not the tray feeder 15 is currently exchanging the pallet 31 (pallet replacement determination step shown in step ST13 of FIG. 10). If the tray feeder 15 is in the process of exchanging the pallet 31, the operation of the mounting head 16 on the side currently being controlled is stopped and waited until the exchange of the pallet 31 by the tray feeder 15 is completed (see FIG. 10 pallet replacement standby process shown in step ST14).

  The pallet replacement standby process in step ST14 is performed for the mounting head 16 on the side opposite to the control target side (for example, for the rear mounting head 16b if the control target is the front mounting head 16a). As a result of executing ST11, when there is no electronic component 4 in the tray 33 and the pallet 31 of the tray feeder 15 is to be replaced, the replacement operation of the pallet 31 is completed and the electronic component 4 is picked up. This is a process of waiting for the above to become possible.

  When the pallet replacement process in step ST12 or the pallet replacement standby process in step ST14 is completed, the control device 50 picks up the electronic component 4 by each suction nozzle 16N provided in the mounting head 16 (the pickup process shown in step ST15 in FIG. 10). ).

  In this pick-up process, the control device 50 first controls the operation of the head moving mechanism drive unit 54, and moves the mounting head 16 on the side to be controlled above the tray 33 corresponding to the mounting head 16 (at the front). The mounting head 16a is moved above the front tray 33a, and the rear mounting head 16b is moved above the rear tray 33b. Here, when the front mounting head 16a and the rear mounting head 16b are moved simultaneously in parallel, the front and rear mounting heads 16 are moved by an operation procedure in which the front mounting head 16a and the rear mounting head 16b do not interfere with each other.

  When the control device 50 moves the mounting head 16 on the side to be controlled above the tray 33 corresponding to the mounting head 16, the control device 50 controls the operation of the nozzle drive unit 55, and each of the mounting heads 16 includes. The suction head 16N is lowered and the operation of the vacuum pressure supply unit 56 is controlled to supply the vacuum pressure into each suction nozzle 16N, whereby the electronic component 4 is sucked and picked up by each suction nozzle 16N (FIG. 11). (A)).

  When the pick-up process in step ST15 is completed, the control device 50 performs image recognition for each picked-up electronic component 4 (image recognition process shown in step ST16 in FIG. 10).

  In this image recognition process, the control device 50 first controls the operation of the head moving mechanism drive unit 54, and the electronic components 4 picked up by the suction nozzles 16N of the mounting head 16 on the control target side are component cameras. The mounting head 16 is moved so as to pass over 19, and each electronic component 4 is imaged by the component camera 19 (FIG. 11B). Then, by causing the image recognition unit 50b to recognize the obtained image, the electronic component 4 is inspected for abnormalities (deformation, defect, etc.). Here, as shown in FIG. 11 (b), the electronic component 4 picked up by the front mounting head 16a is image-recognized by a component camera 19 (indicated by reference numeral 19a in FIG. 11) located at the front, and the rear mounting is performed. The electronic component 4 picked up by the head 16b performs image recognition by a component camera 19 (indicated by reference numeral 19b in FIG. 11) located at the rear. In this image recognition process, the control device 50 obtains a positional deviation (adsorption deviation) of each electronic component 4 with respect to the adsorption nozzle 16N based on the obtained image.

  When the image recognition process of step ST16 is completed, the control device 50 mounts the electronic component 4 sucked by each suction nozzle 16N of the mounting head 16 on the control target side on the substrate 2 (in step ST17 of FIG. 10). Electronic component mounting process shown).

  In this electronic component mounting process, the control device 50 first controls the operation of the head moving mechanism driving unit 54 to move the mounting head 16 on the side to be controlled above the substrate 2. Then, the electronic component 4 sucked by each suction nozzle 16N of the mounting head 16 on the control target side is placed on the target mounting position on the substrate 2 (on the electrode 3 at the target mounting position, the electronic component mounting machine 1 The electronic component 4 is mounted on the substrate 2 by making contact with a screen printing machine arranged on the upstream side and releasing the supply of vacuum pressure to each suction nozzle 16N (FIG. 11 ( c)). When the electronic component 4 is mounted on the substrate 2, the positional deviation of the substrate 2 obtained during the execution of the substrate positioning process in step ST2 and the adsorption deviation of the electronic component 4 obtained during the execution of the image recognition process in step ST16 are corrected. As described above, the position correction (including rotation correction) of the suction nozzle 16N with respect to the substrate 2 is performed.

  When the electronic component mounting process in step ST17 is completed, the control device 50 determines whether or not the mounting of the electronic component 4 to be mounted on the substrate 2 by the mounting head 16 on the control target side is completed (FIG. 10). Mounting end determination step shown in step ST18). As a result, if all the electronic components 4 to be mounted have not been mounted on the substrate 2, the process returns to step ST <b> 11, and if all the electronic components 4 to be mounted have been mounted on the substrate 2. Determines whether or not the mounting of the electronic component 4 to be mounted on the substrate 2 by the mounting head 16 on the side opposite to the control target side has been completed (the opposite to step ST19 in FIG. 10). Side head mounting end determination process).

  The control device 50 does not complete the mounting of the electronic component 4 to be mounted on the substrate 2 by the mounting head 16 on the side opposite to the control target side in the opposite head mounting end determination step of step ST19. If this happens, the process waits until the mounting of the electronic component 4 to be mounted on the substrate 2 by the mounting head 16 on the opposite side is completed (mounting end waiting step shown in step ST20 of FIG. 10). On the other hand, when the mounting of the electronic component 4 to be mounted on the substrate 2 by the mounting head 16 on the side opposite to the control target side has been completed in the opposite head mounting end determination step in step ST19. This subroutine is terminated and the process returns to the main routine.

  When both the control of the subroutine of FIG. 10 for controlling the front mounting head 16a in step ST4 and the control of the subroutine of FIG. 10 for controlling the rear mounting head 16b in step ST5 are completed, the control device 50 The board | substrate 2 is carried out of the electronic component mounting machine 1 by the board | substrate conveyance conveyor 13 before and behind (board | substrate carrying-out process shown to step ST6 of FIG. 9). And the control apparatus 50 will judge whether there exists another board | substrate 2 which should perform electronic component mounting after the board | substrate carrying-out process of step ST6 is complete | finished (board | substrate presence determination process shown to step ST7 of FIG. 9). As a result, if there is another board 2 on which electronic components are mounted, the process returns to step ST1 to carry in a new board 2, and if there is no other board 2 on which electronic components are mounted, a series of electronic Finish the component mounting work.

  As described above, the electronic component mounting machine 1 according to the present embodiment is installed on the base 12, the board transport conveyor 13 serving as the board transport section for transporting and positioning the board 2 in the horizontal plane direction, and the base 12, a tray feeder 15 that simultaneously supplies a front tray 33 a (first tray) and a rear tray 33 b (second tray) containing electronic components 4, and a front feeder supplied by the tray feeder 15. The front mounting head 16a (first mounting head) for picking up the electronic component 4 in the tray 33a and mounting it on the substrate 2 positioned by the substrate transport conveyor 13, and the rear tray 33b supplied by the tray feeder 15 The rear mounting head 16b (first step) for picking up the electronic component 4 and mounting it on the substrate 2 positioned by the substrate transfer conveyor 13 Of it has become a thing with a mounting head).

  Further, the electronic component mounting method according to the present embodiment is a step of transporting and positioning the substrate 2 in the horizontal plane direction by the substrate transport conveyor 13 as a substrate transport unit installed on the base 12 (substrate transport step of step ST1). And the step of positioning the substrate in step ST2) and the step of simultaneously supplying the front tray 33a and the rear tray 33b containing the electronic components 4 by the tray feeder 15 installed on the base 12 (electronic component supplying step in step ST3). And a step of picking up the electronic components 4 in the front tray 33a supplied by the tray feeder 15 by the front mounting head 16a and mounting them on the substrate 2 positioned by the substrate transport conveyor 13 (front mounting head 16a in step ST4) Electronic component mounting step) and the back fed by the tray feeder 15 It includes a step of picking up the electronic component 4 in the tray 33b by the rear mounting head 16b and mounting it on the substrate 2 positioned by the substrate transport conveyor 13 (electronic component mounting step by the rear mounting head 16b in step ST5). ing.

  In the electronic component mounting machine 1 (electronic component mounting method) in the present embodiment, the tray feeder 15 supplies two trays 33 (the front tray 33a and the rear tray 33b) in which the electronic components 4 are stored at the same time. One of the two mounting heads 16 (the front mounting head 16a and the rear mounting head 16b) picks up the electronic component 4 from one of the two trays 33 and mounts the electronic component 4 on the substrate 2. Since the other of the two trays 16 picks up the electronic component 4 from the other of the two trays 33 and mounts it on the substrate 2, the two mounting heads 16 simultaneously apply the electronic component 4 to the substrate 2. The mounting operation can be performed, and the substrate productivity can be improved.

  In the electronic component mounting machine 1 according to the present embodiment, the tray feeder 15 is a base that faces the substrate transport conveyor 13 in the horizontal plane direction (Y-axis direction) orthogonal to the transport direction of the substrate 2 by the substrate transport conveyor 13. Installed on one side of both ends of the base 12, the rear mounting head 16b moves in a region closer to the tray feeder 15 than the front mounting head 16a, and the front tray 33a and the rear tray 33b are The tray 33a is supplied by the tray feeder 15 in a state where the front tray 33a is positioned closer to the substrate transport conveyor 13 than the rear tray 33b.

  Further, in the electronic component mounting method according to the present embodiment, the tray feeder 15 is opposed to the substrate transport conveyor 13 in the horizontal plane direction (Y-axis direction) orthogonal to the transport direction of the substrate 2 by the substrate transport conveyor 13. 12 is installed on one side of both ends, the rear mounting head 16b is moved in a region closer to the tray feeder 15 than the front mounting head 16a, and the front tray 33a and the rear tray 33b are moved. The front tray 33a is supplied by the tray feeder 15 in a state where the front tray 33a is positioned closer to the substrate transport conveyor 13 than the rear tray 33b.

  For this reason, in the electronic component mounting machine 1 (electronic component mounting method) in the present embodiment, even when the tray feeder 15 is installed only on one side of the base 12, the moving stroke of the front mounting head 16a is reduced. It can be minimized and productivity can be improved.

  In the electronic component mounting machine 1 according to the present embodiment, the front and rear substrate transport conveyors 13 transport and position the two substrates 2 simultaneously in parallel, and the front mounting head 16a is in the front tray 33a picked up. The electronic component 4 is mounted on one of the two substrates 2 positioned by the front and rear substrate conveyors 13 (the substrate 2 positioned in front), and the rear mounting head 16b is picked up by the electronic components in the rear tray 33b. 4 is mounted on the other of the two substrates 2 positioned by the front and rear substrate conveyors 13 (substrate 2 located rearward).

  Further, in the electronic component mounting method according to the present embodiment, the two substrates 2 are transported and positioned simultaneously by the front and rear substrate transport conveyors 13 (the substrate loading process in step ST1 and the substrate positioning process in step ST2). In step ST4, the electronic component 4 in the front tray 33a supplied by the tray feeder 15 is picked up by the front mounting head 16a and mounted on the substrate 2 positioned by the substrate transfer conveyor 13. In step ST4, the electronic component 4 is picked up by the front mounting head 16a. The electronic component 4 in the front tray 33a is mounted on one of the two substrates 2 positioned by the front and rear substrate transport conveyors 13 (the substrate 2 positioned in front), and the rear tray 33b supplied by the tray feeder 15 is supplied. The electronic component 4 is picked up by the rear mounting head 16b. In the step ST5 of mounting and mounting on the substrate 2 positioned by the substrate transport conveyor 13, the two electronic components 4 in the rear tray 33b picked up by the rear mounting head 16b are positioned by the front and rear substrate transport conveyors 13. It is designed to be mounted on the other of the substrates 2 (substrate 2 located behind).

  For this reason, in the electronic component mounting machine 1 (electronic component mounting method) according to the present embodiment, the mounting of the electronic component 4 on the two substrates 2 positioned in parallel can be executed in parallel.

  Furthermore, in the electronic component mounting machine 1 (electronic component mounting method) in the present embodiment, if the electronic components 4 housed in the front tray 33a and the rear tray 33b are of different types, Different types of electronic components 4 can be mounted on the substrate 2 in parallel.

  Although the embodiments of the present invention have been described so far, the present invention is not limited to those shown in the above-described embodiments. For example, the configuration of the tray feeder 15 shown in the above-described embodiment is an example, and the configuration of the tray feeder 15 is not limited as long as the two trays 33 storing the electronic components 4 are supplied simultaneously. .

  Provided are an electronic component mounting machine and an electronic component mounting method capable of performing simultaneous mounting operations on a substrate by two mounting heads for electronic components supplied from a tray feeder.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting machine 2 Board | substrate 4 Electronic component 12 Base 13 Board | substrate conveyance conveyor (board | substrate conveyance part)
15 Tray feeder 16a Front mounting head (first mounting head)
16b Rear mounting head (second mounting head)
33a Front tray (first tray)
33b Rear tray (second tray)

Claims (8)

A substrate transport unit installed on the base and configured to transport and position the substrate in a horizontal plane direction;
A tray feeder installed on the base and simultaneously supplying a first tray and a second tray containing electronic components;
A first mounting head for picking up an electronic component in the first tray supplied by the tray feeder and mounting the electronic component on the substrate positioned by the substrate transport unit;
An electronic component mounting machine comprising: a second mounting head that picks up an electronic component in a second tray supplied by a tray feeder and mounts the electronic component on a substrate positioned by a substrate transport unit.   The tray feeder is installed on one side of both ends of the base that are opposed to each other with the substrate transport unit in the horizontal plane direction orthogonal to the substrate transport direction by the substrate transport unit, and the second mounting head is more than the first mounting head. The first tray and the second tray are positioned closer to the substrate transport unit than the second tray. The electronic component mounting machine according to claim 1, wherein the electronic component mounting machine is supplied by a tray feeder.   The substrate transport unit transports and positions two substrates simultaneously in parallel, and the first mounting head places the picked-up electronic component in the first tray on one of the two substrates positioned by the substrate transport unit. 3. The mounting device according to claim 1, wherein the second mounting head mounts the picked-up electronic component in the second tray on the other of the two substrates positioned by the substrate transport unit. Electronic component mounting machine.   4. The electronic component mounting machine according to claim 1, wherein electronic components stored in the first tray and the second tray are of different types. A step of transporting and positioning a substrate in a horizontal plane direction by a substrate transport unit installed on the base; and
A step of simultaneously supplying a first tray and a second tray storing electronic components by a tray feeder installed on a base;
A step of picking up an electronic component in the first tray supplied by the tray feeder by the first mounting head and mounting the electronic component on the substrate positioned by the substrate transport unit;
And a step of picking up an electronic component in the second tray supplied by the tray feeder by the second mounting head and mounting the electronic component on the substrate positioned by the substrate transport unit.   The tray feeder is installed on one side of both ends of the base that are opposed to each other with the substrate transport unit in the horizontal plane direction orthogonal to the substrate transport direction by the substrate transport unit, and the second mounting head is more than the first mounting head. The first tray and the second tray are moved in a region relatively closer to the tray feeder, and the first tray is positioned closer to the substrate transport unit than the second tray. The electronic component mounting method according to claim 5, wherein the electronic component is supplied by a tray feeder.   Two substrates are simultaneously transported and positioned by the substrate transport unit, and the electronic components in the first tray supplied by the tray feeder are picked up by the first mounting head and mounted on the substrate positioned by the substrate transport unit. In this step, the electronic components in the first tray picked up by the first mounting head are mounted on one of the two substrates positioned by the substrate transport unit, and the electrons in the second tray supplied by the tray feeder are mounted. In the step of picking up the component by the second mounting head and mounting it on the substrate positioned by the substrate transport unit, two substrates in which the electronic components in the second tray picked up by the second mounting head are positioned by the substrate transport unit The electronic component mounting method according to claim 5, wherein the electronic component mounting method is mounted on the other of the two.   8. The electronic component mounting method according to claim 5, wherein electronic components stored in the first tray and the second tray are of different types.

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