WO2016092649A1 - Component feeding apparatus - Google Patents

Component feeding apparatus Download PDF

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Publication number
WO2016092649A1
WO2016092649A1 PCT/JP2014/082677 JP2014082677W WO2016092649A1 WO 2016092649 A1 WO2016092649 A1 WO 2016092649A1 JP 2014082677 W JP2014082677 W JP 2014082677W WO 2016092649 A1 WO2016092649 A1 WO 2016092649A1
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WO
WIPO (PCT)
Prior art keywords
magazine
door
component
component supply
wafer
Prior art date
Application number
PCT/JP2014/082677
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French (fr)
Japanese (ja)
Inventor
中山 幸則
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to JP2016563337A priority Critical patent/JP6420847B2/en
Priority to PCT/JP2014/082677 priority patent/WO2016092649A1/en
Publication of WO2016092649A1 publication Critical patent/WO2016092649A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components

Definitions

  • the present invention relates to a component supply apparatus that pulls out a pallet accommodated in a plurality of slots of a magazine and supplies components placed on the pallet.
  • This component supply apparatus includes an upper door corresponding to the upper rack and a lower door corresponding to the lower rack, and the tray can be exchanged from the tray accommodating portion of the upper rack by opening the upper door.
  • the tray can be exchanged from the tray accommodating portion of the lower rack by opening the lower door.
  • the main object of the present invention is to enable pallet replacement work while supplying parts while miniaturizing and simplifying the apparatus.
  • the present invention adopts the following means in order to achieve the main object described above.
  • the present invention A component supply device for pulling out a pallet accommodated in a plurality of slots of a magazine and supplying a component placed on the pallet, A holding part capable of holding the magazine; A large door configured to be openable and closable and capable of placing the magazine on the holding portion and taking out the magazine from the holding portion in an open state; A first small door configured to be openable and closable and capable of taking out and storing the pallet with respect to a first slot group among the plurality of slots in the open state; The pallet can be taken out and stored in a second slot group that is different from the first slot group among the plurality of slots in the open state.
  • a second door It is a summary to provide.
  • a large door capable of placing the magazine on the holding portion and taking out the magazine from the holding portion in the open state, and the first of the plurality of slots in the magazine in the open state.
  • a first small door capable of taking out and storing the pallet with respect to the slot group, and a second small door capable of taking out and accommodating the pallet with respect to the second slot group among the plurality of slots in the opened state.
  • the first small door and the second small door are configured to be openable and closable independently of each other.
  • the first small door and the second small door may be provided on the large door.
  • the apparatus can be further downsized.
  • the magazine includes a partition plate that has an empty slot between the first slot group and the second slot group and is accommodated in the empty slot. You can also. In this way, it is possible to ensure safety during the pallet replacement operation.
  • first locking means for locking the first small door in the closed state
  • second locking means for locking the second small door in the closed state
  • a lock control means for locking a small door corresponding to a slot group supplying parts in the second slot group and releasing a lock of the small door corresponding to a slot group not supplying parts. It can also be. In this way, the safety at the time of pallet replacement work can be further enhanced.
  • FIG. 1 is a configuration diagram showing an outline of the configuration of a component mounting system 10.
  • FIG. 2 is an external view showing an external appearance of a component supply device 20.
  • FIG. 3 is an explanatory diagram showing an electrical connection relationship between a control device 40 of the component supply device 20 and a control device 60 of the component mounting device 50.
  • FIG. It is explanatory drawing which shows the mode of opening of the large door. It is explanatory drawing which shows the mode of opening of the small door.
  • 2 is an external view showing the external appearance of a magazine 30 and a pallet 34.
  • FIG. FIG. 4 is an explanatory diagram for explaining a relationship between each slot 32 of the magazine 30 and a wafer supply position. It is explanatory drawing explaining the relationship between the upper small door 23, the lower small door 24, and a wafer replenishment position. 4 is a flowchart illustrating an example of a component supply process executed by a CPU 41 of a control device 40.
  • FIG. 1 is a configuration diagram showing an outline of the configuration of a component mounting system 10
  • FIG. 2 is an external view showing an external appearance of a component supply apparatus 20 as an embodiment of the present invention
  • FIG. FIG. 4 is an explanatory view showing an electrical connection relationship between the control device 40 of the apparatus 20 and the control device 60 of the component mounting apparatus 50
  • FIG. 4 is an explanatory view showing a state of opening the large door 22
  • FIG. It is explanatory drawing which shows the mode of opening of the small door 23 of the upper stage.
  • the component mounting system 10 includes an electronic component (hereinafter referred to as “component”) P mounted on a circuit board (hereinafter referred to as “substrate”) S, and a component mounting apparatus 50. And a component supply device 20 as an embodiment of the present invention for supplying the component P to the device.
  • component electronic component
  • substrate circuit board
  • component supply device 20 as an embodiment of the present invention for supplying the component P to the device.
  • the component mounting apparatus 50 includes a substrate transfer device 52 that transfers the substrate S, a backup device 54 that backs up the transferred substrate S, and a component P that is supplied from the component supply device 20.
  • a head unit 56 that is picked up by 57 and mounted on the substrate S, an XY robot 58 that moves the head unit 56 in the XY directions, and a control device 60 (see FIG. 3) that controls the entire apparatus are provided.
  • the component mounting apparatus 50 also includes a part camera 59 for imaging the suction posture of the component P sucked by the suction nozzle 57 from below. Based on this, it is determined whether or not the component P is normally attracted to the suction nozzle 57.
  • the component supply apparatus 20 of the embodiment is configured as a wafer supply apparatus that supplies a wafer as the component P to the component mounting apparatus 50, and is mounted on the front side of the component mounting apparatus 50 as shown in FIG.
  • the component supply apparatus 20 holds a magazine 30 (see FIGS. 4 and 5) having a plurality of slots 32 that can accommodate circular wafers made up of a large number of chips diced in a lattice shape, and the magazine 30.
  • a magazine holding unit 26 (see FIG. 4) and a component supply robot 28 (see FIGS. 2 and 3) that draws a wafer designated from the component mounting apparatus 50 from one of the plurality of slots 32 and supplies it to the component mounting apparatus 50.
  • a casing 21 that houses the above-described constituent members.
  • the component supply device 20 is provided with a large door 22 and two small doors 23 and 24 at the top of the housing 21.
  • the large door 22 is configured to be openable by pulling the front surface upward.
  • the operator can place the magazine 30 on the magazine holding unit 26 or take out the magazine 30 placed on the magazine holding unit 26.
  • An upper small door 23 and a lower small door 24 are provided on the front surface of the large door 22.
  • each of the small doors 23 and 24 is a single door that can be opened by pulling a handle toward the front.
  • the operator can replenish wafers to the upper slot group among the plurality of slots 32 of the magazine 30 by opening the upper small door 23.
  • the wafers can be replenished to the lower slot group among the plurality of slots 32.
  • the magazine holder 26 is provided with a large door locking solenoid 22a for locking the large door 22 in the closed state.
  • the large door 22 has an upper small door locking solenoid 23a for locking the upper small door 23 in the closed state, and a lower small door locking solenoid 24a for locking the lower small door 24 in the closed state. And are provided.
  • FIG. 6 is an external view showing the external appearance of the magazine 30 and the pallet 34.
  • FIG. 7 is an explanatory view for explaining the relationship between each slot 32 of the magazine 30 and the wafer replenishment position.
  • FIG. It is explanatory drawing explaining the relationship between the door 23 and the small door 24 of a lower step, and a wafer replenishment position.
  • the magazine 30 has 25 stages of slots 32 that can accommodate the pallets 34 on which the wafers 36 are placed.
  • the first to twelfth stages from the top of the 25-stage slots 32 are upper wafer replenishment positions where the wafer 36 can be replenished by opening the upper small door 23.
  • the 14th to 25th stages are lower wafer replenishment positions where the wafer 36 can be replenished by opening the lower door 24.
  • the thirteenth stage is an unused slot that cannot be used for wafer replenishment (see FIG. 7), and accommodates a partition plate 38 (see FIG. 6) for separating the upper wafer replenishment position and the lower wafer replenishment position.
  • the partition plate 38 is a flat plate having the same outer shape as the pallet 34 so as to be accommodated in the slot 32 of the magazine 30.
  • the control device 40 of the component supply device 20 is configured as a microprocessor centered on a CPU 41, and includes a ROM 42, a RAM 44, and an input / output interface 45 in addition to the CPU 41. These are electrically connected via a bus 46.
  • the control device 40 pulls out the pallet 34 on which the wafer 36 instructed to supply is loaded from the magazine 30 and supplies it to the component mounting device 50, or supplies the used pallet 34 to the original slot 32 of the magazine 30 or other empty space.
  • a drive signal to the component supply robot 28 for housing in the slot 32, a drive signal to the large door lock solenoid 22a, a drive signal to the upper small door lock solenoid 23a, to the lower small door lock solenoid 24a Are output via the input / output interface 45.
  • the control device 40 is communicably connected to the control device 60 of the component mounting device 50, and exchanges various control signals and data.
  • the control device 60 of the component mounting apparatus 50 is configured as a microprocessor centered on a CPU 61, and includes a ROM 62, an HDD 63, a RAM 64, and an input / output interface 65 in addition to the CPU 61. These are electrically connected via a bus 66.
  • An image signal or the like from the parts camera 59 is input to the control device 60 via the input / output interface 65.
  • a drive signal and the like are output from the control device 60 to the substrate transport device 52, the backup device 54, the head unit 56, and the XY robot 58 via the input / output interface 65.
  • the control device 60 is communicably connected to a management device (not shown), receives production data (production job) related to the production of the substrate S from the management device, and mounts the component P on the substrate S according to the received production data.
  • the production data defines which component P (wafer) is mounted on the substrate S in which order in the component mounting apparatus 50, and how many substrates S on which the component P is mounted are produced.
  • the production data also includes part data that defines how many parts P (wafers) necessary for mounting are located in which wafer replenishment position (slot 32) of the magazine 30. Production data (part data) is created by an operator.
  • the worker Prior to production, the worker selects in advance the supply mode of the parts P of the magazine 30 and creates part data corresponding to the selected supply mode.
  • a supply mode of the parts P the same parts are supplied to the upper stage (upper wafer supply position) and the lower stage (lower wafer supply position) of one magazine 30, and only one of them is normally used.
  • control device 60 of the component mounting device 50 is communicably connected to the control device 40 of the component supply device 20, and when starting production according to the production data, the component data included in the production data is included in the component data. Based on this, a control signal for instructing the supply of the necessary component P (wafer) is transmitted to the control device 40 of the component supply device 20.
  • the control device 60 of the component mounting device 50 moves the suction nozzle 57 to a position (component supply position) where the component P (wafer) is supplied by the component supply device 20 to suck the component P, and the sucked component P is a substrate.
  • the head unit 56 and the XY robot 58 are controlled to be mounted at the mounting position on S.
  • the control device 60 captures the suction posture of the sucked component P with the parts camera 59, and determines whether or not the component P is normally sucked based on the obtained image. .
  • the controller 60 performs the mounting operation of the sucked component P.
  • the control device 60 determines that the component P is not normally sucked, the component P is normally sucked. Until the determination is made, the recovery operation for re-sucking the new component P is performed. An error is output when the number of executions of the recovery operation reaches a predetermined number.
  • the control device 60 transmits an error signal to the control device 40 of the component supply device 20 to switch the wafer replenishment position to be used. Instruct.
  • FIG. 9 is a flowchart illustrating an example of a component supply process executed by the CPU 41 of the control device 40.
  • the CPU 41 of the control device 40 first determines whether it is in production (manufacturing the substrate S on which the component P is mounted) (S100), and determines that it is not in production.
  • the large door locking solenoid 22a, the upper small door locking solenoid 23a, and the lower small door locking solenoid 24a are driven so that all the locks of the large door 22, the upper small door 23, and the lower small door 24 are released.
  • Control is performed (S110 to S130), and the component supply process is terminated.
  • the large door 22 can be opened and the magazine 30 can be replaced, or a changeover can be performed in which a part P (wafer) necessary for the next production is accommodated in the magazine 30.
  • the CPU 41 determines whether or not the component supply mode selected by the operator is either mode A or mode B in which only one of the upper and lower wafer replenishment positions of the magazine 30 is used (S150). . If the CPU 41 determines that the component supply mode is either mode A or mode B, the CPU 41 determines whether the upper stage (upper wafer replenishment position) of the magazine 30 is in use (S160). The determinations in S150 and S160 can be made based on a component supply instruction transmitted from the control device 60 of the component mounting apparatus 50.
  • the CPU 41 determines that the component supply mode is either mode A or mode B and the upper stage of the magazine 30 is in use
  • the CPU 41 drives the upper stage door locking solenoid 23a so that the upper stage door 23 is locked.
  • the lower stage door lock solenoid 24a is driven and controlled so that the lower door 24 is unlocked (S180).
  • the CPU 41 drives and controls the component supply robot 28 so that the pallet 34 on which the necessary wafers 36 are placed is pulled out from the upper stage (upper wafer replenishment position) of the magazine 30 and supplied to the component mounting apparatus 50 (S190). Then, the component supply process is terminated.
  • the CPU 41 determines that the component supply mode is either mode A or mode B, and the upper stage (upper wafer supply position) of the magazine 30 is not in use, that is, the lower stage (lower wafer supply position) is in use. Is determined, the upper stage door lock solenoid 23a is driven and controlled so that the upper stage door 23 is unlocked (S200), and the lower stage door lock solenoid 24a is operated so that the lower stage door 24 is locked. Drive control is performed (S210). Thus, even during production, the operator can replenish the wafer 36 to the upper wafer replenishment position of the magazine 30 by opening the upper small door 23.
  • the CPU 41 drives and controls the component supply robot 28 so that the pallet 34 on which the necessary wafers 36 are placed is pulled out from the lower stage (lower wafer supply position) of the magazine 30 and is supplied to the component mounting apparatus 50 (S220). Then, the component supply process is terminated.
  • the CPU 41 determines that the component supply mode is neither mode A nor mode B, that is, determines that the component supply mode is mode C using both of the upper and lower wafer replenishment positions of the magazine 30,
  • the upper small door locking solenoid 23a and the lower small door locking solenoid 24a are driven and controlled so that the upper small door 23 and the lower small door 24 are locked together (S230, S240).
  • the operator cannot replenish the wafer 36 during production.
  • the CPU 41 pulls out the pallet 34 on which the necessary wafers 36 are placed from both the upper and lower stages of the magazine 30 (upper wafer replenishment position and lower wafer replenishment position) and supplies them to the component mounting apparatus 50. Is controlled (S250), and the component supply process is terminated.
  • the upper slot group of the magazine 30 is provided in addition to the large door 22 for placing the magazine 30 on the magazine holding unit 26 and taking it out of the magazine holding unit 26, the upper slot group of the magazine 30 is provided.
  • An upper small door 23 capable of replenishing a wafer (upper wafer replenishment position) and a lower small door 24 capable of replenishing a wafer in a lower slot group (lower wafer replenishment position) of the magazine 30 are provided.
  • the upper door 23 is unlocked. Since the lock is released and the lower door 24 is locked, it is possible to ensure safety when the wafer 36 is replenished during production. Further, a slot between the upper slot group and the lower slot group of the magazine 30 is set as an unused slot, and the partition plate 32 is accommodated therein. As a result, the operator cannot reach from the upper small door 23 to the lower slot group, and cannot reach from the lower small door 24 to the upper slot group. The safety when replenishing can be further improved. In addition, since the small doors 23 and 24 are provided on the front surface of the large door 22, the space can be used more effectively and the apparatus can be used more effectively than when the large door 22 and the small doors 23 and 24 are provided at different positions. It can be downsized.
  • the small doors 23 and 24 are provided on the front surface of the large door 22, but the present invention is not limited to this.
  • the large door 22 and the small doors 23 and 24 may be provided at different positions, such as a structure in which a door is provided on the front surface of the housing 21.
  • the present invention is not limited to this, and when the component supply mode is a mode C in which both of the upper and lower wafer replenishment positions of the magazine 30 are used, the intermediate slot is used for supplying wafers (components). It may be used.
  • the component supply mode when the component supply mode is the mode A or mode B in which only one of the upper and lower wafer supply positions of the magazine 30 is used, it corresponds to the unused wafer supply position.
  • the lock of the small door (the lower door 24 when the upper wafer supply position is in use and the upper door 23 when the lower wafer supply position is in use) is released.
  • the small door may be unlocked on condition that the partition plate 38 is installed in the unused slot of the magazine 30.
  • a sensor for detecting whether or not the partition plate 38 is installed in the unused slot of the magazine 30 may be provided.
  • the two small doors 23 and 24 that can replenish the wafer 36 are provided in the upper slot group and the lower slot group of the magazine 30 respectively.
  • the present invention is not limited to this.
  • the slot group of the magazine 30 is divided into an upper stage, a middle stage, and a lower stage, and the upper slot group, the middle slot group, and the lower slot group are each provided with three small doors that can replenish wafers.
  • the number of small doors is not limited as long as it is two or more.
  • the wafer 36 placed on the pallet 34 is configured as a wafer supply apparatus that supplies the component mounting apparatus 50.
  • the present invention is not limited to this. It is used for supplying any other parts, such as storing trays with multiple chip parts arranged in multiple slots and pulling out trays with specified chip parts from one of the slots. Also good.
  • the magazine holder 26 corresponds to the “holder”
  • the large door 22 corresponds to the “large door”
  • the upper small door 23 corresponds to the “first small door”
  • the lower small door 24 Corresponds to “second door”.
  • the upper small door locking solenoid 23a corresponds to “first locking means”
  • the lower small door locking solenoid 24a corresponds to “second locking means”
  • S100 to S180, S200 of the component supply processing of FIG. , S210, S230 and S240, the CPU 41 of the control device 40 corresponds to the “lock control means”.
  • this invention is not limited to the Example mentioned above at all, and as long as it belongs to the technical scope of this invention, it cannot be overemphasized that it can implement with a various aspect.
  • the present invention can be used in the parts supply device manufacturing industry.
  • 10 component mounting system 20 component supply device, 21 housing, 22 large door, 22a large door locking solenoid, 23, 24 small door, 23a upper small door locking solenoid, 24a lower small door locking solenoid, 26 magazine holding Part, 28 parts supply robot, 30 magazines, 32 slots, 34 pallets, 36 wafers, 38 partition plates, 40 control devices, 41 CPU, 42 ROM, 44 RAM, 45 I / O interface, 46 buses, 50 component mounting devices, 52 Substrate transport device, 54 backup device, 56 head unit, 57 suction nozzle, 58 XY robot, 60 control device, 61 CPU, 62 ROM, 63 HDD, 64 RAM, 65 I / O interface, 66 bus.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

A large door 22 for mounting a magazine 30 in a magazine holding part 26 or removing the magazine from the magazine holding part 26 is provided with an upper small door 23 with which it is possible to resupply wafers into an upper slot group (upper wafer resupply position) in the magazine 30, and a lower small door 24 with which it is possible to resupply wafers into a lower slot group (lower wafer resupply position) in the magazine 30. It is thereby possible, while feeding a component P (wafer) from pallets accommodated in some of the slots 32 of one magazine 30, to resupply the component P into other slots 32.

Description

部品供給装置Parts supply device
 本発明は、マガジンが有する複数段のスロットに収容されたパレットを引き出して該パレットに載せられた部品を供給する部品供給装置に関する。 The present invention relates to a component supply apparatus that pulls out a pallet accommodated in a plurality of slots of a magazine and supplies components placed on the pallet.
 従来、この種の部品供給装置としては、チップ部品が配列されたトレーを収容するトレー収容部(スロット)を有するラック(マガジン)を、上下にそれぞれ設けたものが提案されている(例えば、特許文献1参照)。この部品供給装置では、上段のラックに対応する上部ドアと、下段のラックに対応する下部ドアとを備え、上部ドアを開くことで上段のラックのトレー収容部からトレーの交換作業を行うことができ、下部ドアを開くことで下段のラックのトレー収容部からトレーの交換作業を行うことができる。これにより、両ラックのうち一方に属するトレーの交換が行われている間にも、他方のラックのトレーを対象として自動運転による部品供給を行うことができるとしている。
特開平6-216574号公報
2. Description of the Related Art Conventionally, as this type of component supply device, a device in which racks (magazines) having tray accommodating portions (slots) for accommodating trays in which chip components are arranged is provided on the upper and lower sides (for example, patents). Reference 1). This component supply apparatus includes an upper door corresponding to the upper rack and a lower door corresponding to the lower rack, and the tray can be exchanged from the tray accommodating portion of the upper rack by opening the upper door. The tray can be exchanged from the tray accommodating portion of the lower rack by opening the lower door. As a result, even when the tray belonging to one of the racks is being replaced, the parts can be supplied by the automatic operation for the tray of the other rack.
JP-A-6-216574
 しかしながら、上述した部品供給装置では、2つのラック(マガジン)を搭載するから、これらの設置スペースを必要とする結果、装置全体が大型化してしまう。また、ラックからトレーを引き出すための機構やトレー(パレット)に載せられた部品を供給するための機構も2つのラックに対応しなければならず、装置が複雑化する場合がある。 However, since the above-described component supply apparatus is equipped with two racks (magazines), as a result of requiring these installation spaces, the entire apparatus becomes large. In addition, a mechanism for pulling out the tray from the rack and a mechanism for supplying the components placed on the tray (pallet) must correspond to the two racks, which may complicate the apparatus.
 本発明は、装置の小型化や簡素化を図りつつ、部品の供給を行っている間のパレット交換作業を可能とすることを主目的とする。 The main object of the present invention is to enable pallet replacement work while supplying parts while miniaturizing and simplifying the apparatus.
 本発明は、上述の主目的を達成するために以下の手段を採った。 The present invention adopts the following means in order to achieve the main object described above.
 本発明は、
 マガジンが有する複数段のスロットに収容されたパレットを引き出して該パレットに載せられた部品を供給する部品供給装置であって、
 前記マガジンを保持可能な保持部と、
 開閉可能に構成され、開放状態で前記保持部への前記マガジンの載置と該保持部からの該マガジンの取り出しとが可能な大扉と、
 開閉可能に構成され、開放状態で前記複数段のスロットのうち第1スロット群に対して前記パレットの取り出しと収容とが可能な第1小扉と、
 前記第1小扉と独立して開閉可能に構成され、開放状態で前記複数段のスロットのうち前記第1スロット群とは異なる第2スロット群に対して前記パレットの取り出しと収容とが可能な第2小扉と、
 を備えることを要旨とする。
The present invention
A component supply device for pulling out a pallet accommodated in a plurality of slots of a magazine and supplying a component placed on the pallet,
A holding part capable of holding the magazine;
A large door configured to be openable and closable and capable of placing the magazine on the holding portion and taking out the magazine from the holding portion in an open state;
A first small door configured to be openable and closable and capable of taking out and storing the pallet with respect to a first slot group among the plurality of slots in the open state;
The pallet can be taken out and stored in a second slot group that is different from the first slot group among the plurality of slots in the open state. A second door,
It is a summary to provide.
 この本発明の部品供給装置では、開放状態で保持部へのマガジンの載置と保持部からのマガジンの取り出しとが可能な大扉と、開放状態でマガジンが有する複数段のスロットのうち第1スロット群に対してパレットの取り出しと収容とが可能な第1小扉と、開放状態で複数段のスロットのうち第2スロット群に対してパレットの取り出しと収容とが可能な第2小扉とを設ける。第1小扉と第2小扉とは、互いに独立して開閉可能に構成する。これにより、1つのマガジンにおいて、複数段のスロットのうち一部のスロットに収容されているパレットにより部品を供給している間、他のスロットに対してパレットの交換作業を行うことが可能となる。これにより、装置の小型化や簡素化を図りつつ、部品の供給を行っている間のパレット交換作業を可能とすることができる。 In the component supply device according to the present invention, a large door capable of placing the magazine on the holding portion and taking out the magazine from the holding portion in the open state, and the first of the plurality of slots in the magazine in the open state. A first small door capable of taking out and storing the pallet with respect to the slot group, and a second small door capable of taking out and accommodating the pallet with respect to the second slot group among the plurality of slots in the opened state. Is provided. The first small door and the second small door are configured to be openable and closable independently of each other. As a result, in one magazine, it is possible to perform a pallet exchange operation for another slot while supplying parts by a pallet accommodated in a part of the plurality of slots. . Thereby, it is possible to perform a pallet replacement operation while supplying parts while reducing the size and simplifying the apparatus.
 こうした本発明の部品供給装置において、前記第1小扉と前記第2小扉は、前記大扉に設けられているものとすることもできる。こうすれば、第1小扉と第2小扉とを設けるためのスペースを別途必要としないから、装置をより小型化することができる。 In such a component supply apparatus of the present invention, the first small door and the second small door may be provided on the large door. In this case, since a space for providing the first small door and the second small door is not required, the apparatus can be further downsized.
 また、本発明の部品供給装置において、前記マガジンは、前記第1スロット群と前記第2スロット群との間に空きスロットを有し、前記空きスロットに収容される仕切り板を備えるものとすることもできる。こうすれば、パレットの交換作業時の安全性を確保することができる。 Moreover, in the component supply apparatus of the present invention, the magazine includes a partition plate that has an empty slot between the first slot group and the second slot group and is accommodated in the empty slot. You can also. In this way, it is possible to ensure safety during the pallet replacement operation.
 さらに、本発明の部品供給装置において、閉鎖状態で前記第1小扉をロックする第1ロック手段と、閉鎖状態で前記第2小扉をロックする第2ロック手段と、前記第1スロット群および前記第2スロット群のうち部品を供給しているスロット群に対応する小扉をロックすると共に部品を供給していないスロット群に対応する小扉のロックを解除するロック制御手段と、を備えるものとすることもできる。こうすれば、パレットの交換作業時の安全性をより高めることができる。 Furthermore, in the component supply apparatus of the present invention, first locking means for locking the first small door in the closed state, second locking means for locking the second small door in the closed state, the first slot group, A lock control means for locking a small door corresponding to a slot group supplying parts in the second slot group and releasing a lock of the small door corresponding to a slot group not supplying parts. It can also be. In this way, the safety at the time of pallet replacement work can be further enhanced.
部品実装システム10の構成の概略を示す構成図である。1 is a configuration diagram showing an outline of the configuration of a component mounting system 10. FIG. 部品供給装置20の外観を示す外観図である。2 is an external view showing an external appearance of a component supply device 20. FIG. 部品供給装置20の制御装置40と部品実装装置50の制御装置60との電気的な接続関係を示す説明図である。3 is an explanatory diagram showing an electrical connection relationship between a control device 40 of the component supply device 20 and a control device 60 of the component mounting device 50. FIG. 大扉22の開放の様子を示す説明図である。It is explanatory drawing which shows the mode of opening of the large door. 小扉23の開放の様子を示す説明図である。It is explanatory drawing which shows the mode of opening of the small door. マガジン30とパレット34の外観を示す外観図である。2 is an external view showing the external appearance of a magazine 30 and a pallet 34. FIG. マガジン30の各スロット32とウエハ補給位置との関係を説明する説明図である。FIG. 4 is an explanatory diagram for explaining a relationship between each slot 32 of the magazine 30 and a wafer supply position. 上段の小扉23および下段の小扉24とウエハ補給位置との関係を説明する説明図である。It is explanatory drawing explaining the relationship between the upper small door 23, the lower small door 24, and a wafer replenishment position. 制御装置40のCPU41により実行される部品供給処理の一例を示すフローチャートである。4 is a flowchart illustrating an example of a component supply process executed by a CPU 41 of a control device 40.
 次に、本発明を実施するための形態について実施例を用いて説明する。 Next, a mode for carrying out the present invention will be described using examples.
 図1は、部品実装システム10の構成の概略を示す構成図であり、図2は、本発明の一実施例としての部品供給装置20の外観を示す外観図であり、図3は、部品供給装置20の制御装置40と部品実装装置50の制御装置60との電気的な接続関係を示す説明図であり、図4は、大扉22の開放の様子を示す説明図であり、図5は、上段の小扉23の開放の様子を示す説明図である。 FIG. 1 is a configuration diagram showing an outline of the configuration of a component mounting system 10, FIG. 2 is an external view showing an external appearance of a component supply apparatus 20 as an embodiment of the present invention, and FIG. FIG. 4 is an explanatory view showing an electrical connection relationship between the control device 40 of the apparatus 20 and the control device 60 of the component mounting apparatus 50, FIG. 4 is an explanatory view showing a state of opening the large door 22, and FIG. It is explanatory drawing which shows the mode of opening of the small door 23 of the upper stage.
 部品実装システム10は、図1に示すように、電子部品(以下、「部品」という)Pを回路基板(以下、「基板」という)S上に実装する部品実装装置50と、部品実装装置50に部品Pを供給する本発明の一実施例としての部品供給装置20とを備える。 As shown in FIG. 1, the component mounting system 10 includes an electronic component (hereinafter referred to as “component”) P mounted on a circuit board (hereinafter referred to as “substrate”) S, and a component mounting apparatus 50. And a component supply device 20 as an embodiment of the present invention for supplying the component P to the device.
 部品実装装置50は、図1に示すように、基板Sを搬送する基板搬送装置52と、搬送された基板Sをバックアップするバックアップ装置54と、部品供給装置20から供給された部品Pを吸着ノズル57でピックアップして基板S上に装着するヘッドユニット56と、ヘッドユニット56をXY方向に移動させるXYロボット58と、装置全体を制御する制御装置60(図3参照)とを備える。また、部品実装装置50は、この他に、吸着ノズル57に吸着された部品Pの吸着姿勢を下方から撮像するためのパーツカメラ59も備えており、パーツカメラ59の撮像により得られた画像に基づいて吸着ノズル57に部品Pが正常に吸着されているか否かの判定を行う。 As shown in FIG. 1, the component mounting apparatus 50 includes a substrate transfer device 52 that transfers the substrate S, a backup device 54 that backs up the transferred substrate S, and a component P that is supplied from the component supply device 20. A head unit 56 that is picked up by 57 and mounted on the substrate S, an XY robot 58 that moves the head unit 56 in the XY directions, and a control device 60 (see FIG. 3) that controls the entire apparatus are provided. In addition to this, the component mounting apparatus 50 also includes a part camera 59 for imaging the suction posture of the component P sucked by the suction nozzle 57 from below. Based on this, it is determined whether or not the component P is normally attracted to the suction nozzle 57.
 実施例の部品供給装置20は、部品Pとしてウエハを部品実装装置50に供給するウエハ供給装置として構成されており、図1に示すように、部品実装装置50の前方側に装着される。この部品供給装置20は、格子状にダイシングされた多数のチップからなる円形状のウエハを収容可能な複数段のスロット32を有するマガジン30(図4,図5参照)と、マガジン30を保持するマガジン保持部26(図4参照)と、部品実装装置50から指定されたウエハを複数段のスロット32のいずれかから引き出して部品実装装置50に供給する部品供給ロボット28(図2,図3参照)と、上述の構成部材を収容する筐体21と、を備える。 The component supply apparatus 20 of the embodiment is configured as a wafer supply apparatus that supplies a wafer as the component P to the component mounting apparatus 50, and is mounted on the front side of the component mounting apparatus 50 as shown in FIG. The component supply apparatus 20 holds a magazine 30 (see FIGS. 4 and 5) having a plurality of slots 32 that can accommodate circular wafers made up of a large number of chips diced in a lattice shape, and the magazine 30. A magazine holding unit 26 (see FIG. 4) and a component supply robot 28 (see FIGS. 2 and 3) that draws a wafer designated from the component mounting apparatus 50 from one of the plurality of slots 32 and supplies it to the component mounting apparatus 50. ) And a casing 21 that houses the above-described constituent members.
 また、部品供給装置20は、筐体21の上部に、大扉22と、2つの小扉23,24が設けられている。大扉22は、図4に示すように、前面を上方へ引き上げることで開放可能に構成されている。作業者は、大扉22を開放することで、マガジン30をマガジン保持部26に載置したり、マガジン保持部26に載置されているマガジン30を取り出したりすることができる。大扉22の前面には、上段の小扉23と、下段の小扉24とが設けられている。小扉23,24は、図5に示すように、何れも、取っ手を手前に引くことで開放可能な片開き戸である。これにより、作業者は、大扉22が閉鎖状態であっても、上段の小扉23を開放することで、マガジン30の複数段のスロット32のうち上段のスロット群にウエハを補給することができ、下段の小扉24を開放することで、複数段のスロット32のうち下段のスロット群にウエハを補給することができる。 Also, the component supply device 20 is provided with a large door 22 and two small doors 23 and 24 at the top of the housing 21. As shown in FIG. 4, the large door 22 is configured to be openable by pulling the front surface upward. By opening the large door 22, the operator can place the magazine 30 on the magazine holding unit 26 or take out the magazine 30 placed on the magazine holding unit 26. An upper small door 23 and a lower small door 24 are provided on the front surface of the large door 22. As shown in FIG. 5, each of the small doors 23 and 24 is a single door that can be opened by pulling a handle toward the front. Thus, even when the large door 22 is closed, the operator can replenish wafers to the upper slot group among the plurality of slots 32 of the magazine 30 by opening the upper small door 23. In addition, by opening the lower door 24, the wafers can be replenished to the lower slot group among the plurality of slots 32.
 また、図5に示すように、マガジン保持部26には、大扉22を閉鎖状態でロックするための大扉ロック用ソレノイド22aが設けられている。また、大扉22には、上段の小扉23を閉鎖状態でロックするための上段小扉ロック用ソレノイド23aと、下段の小扉24を閉鎖状態でロックするための下段小扉ロック用ソレノイド24aとが設けられている。 Further, as shown in FIG. 5, the magazine holder 26 is provided with a large door locking solenoid 22a for locking the large door 22 in the closed state. The large door 22 has an upper small door locking solenoid 23a for locking the upper small door 23 in the closed state, and a lower small door locking solenoid 24a for locking the lower small door 24 in the closed state. And are provided.
 図6は、マガジン30とパレット34の外観を示す外観図であり、図7は、マガジン30の各スロット32とウエハ補給位置との関係を説明する説明図であり、図8は、上段の小扉23および下段の小扉24とウエハ補給位置との関係を説明する説明図である。マガジン30は、図6または図7に示すように、本実施例では、ウエハ36が載せられたパレット34を収容可能な25段のスロット32を有している。また、図8に示すように、25段のスロット32のうち上から1段目から12段目までは、上段の小扉23を開放することによりウエハ36を補給可能な上段ウエハ補給位置であり、14段目から25段目までは、下段の小扉24を開放することによりウエハ36を補給可能な下段ウエハ補給位置である。また、13段目は、ウエハ補給に使用できない不使用スロットであり(図7参照)、上段ウエハ補給位置と下段ウエハ補給位置とを仕切るための仕切り板38(図6参照)が収容される。なお、仕切り板38は、図6に示すように、マガジン30のスロット32に収容可能に、パレット34と同一の外形を有する平板である。不使用スロットに仕切り板38が挿入されると、作業者は、上段の小扉23から下段ウエハ補給位置に手をのばしたり、下段の小扉24から上段ウエハ補給位置に手をのばしたりすることができない。 6 is an external view showing the external appearance of the magazine 30 and the pallet 34. FIG. 7 is an explanatory view for explaining the relationship between each slot 32 of the magazine 30 and the wafer replenishment position. FIG. It is explanatory drawing explaining the relationship between the door 23 and the small door 24 of a lower step, and a wafer replenishment position. As shown in FIG. 6 or 7, the magazine 30 has 25 stages of slots 32 that can accommodate the pallets 34 on which the wafers 36 are placed. As shown in FIG. 8, the first to twelfth stages from the top of the 25-stage slots 32 are upper wafer replenishment positions where the wafer 36 can be replenished by opening the upper small door 23. The 14th to 25th stages are lower wafer replenishment positions where the wafer 36 can be replenished by opening the lower door 24. The thirteenth stage is an unused slot that cannot be used for wafer replenishment (see FIG. 7), and accommodates a partition plate 38 (see FIG. 6) for separating the upper wafer replenishment position and the lower wafer replenishment position. As shown in FIG. 6, the partition plate 38 is a flat plate having the same outer shape as the pallet 34 so as to be accommodated in the slot 32 of the magazine 30. When the partition plate 38 is inserted into the unused slot, the operator extends his hand from the upper small door 23 to the lower wafer replenishment position, or extends his hand from the lower small door 24 to the upper wafer replenishment position. I can't.
 部品供給装置20の制御装置40は、図3に示すように、CPU41を中心とするマイクロプロセッサとして構成されており、CPU41の他に、ROM42やRAM44,入出力インタフェース45を備える。これらは、バス46を介して電気的に接続されている。制御装置40は、供給が指示されているウエハ36が載せられたパレット34をマガジン30から引き出して部品実装装置50に供給したり使用済みのパレット34をマガジン30の元のスロット32或いは他の空きスロット32に収容したりするための部品供給ロボット28への駆動信号や、大扉ロック用ソレノイド22aへの駆動信号、上段小扉ロック用ソレノイド23aへの駆動信号、下段小扉ロック用ソレノイド24aへの駆動信号などが入出力インタフェース45を介して出力されている。制御装置40は、部品実装装置50の制御装置60と通信可能に接続されており、各種制御信号やデータのやり取りを行う。 As shown in FIG. 3, the control device 40 of the component supply device 20 is configured as a microprocessor centered on a CPU 41, and includes a ROM 42, a RAM 44, and an input / output interface 45 in addition to the CPU 41. These are electrically connected via a bus 46. The control device 40 pulls out the pallet 34 on which the wafer 36 instructed to supply is loaded from the magazine 30 and supplies it to the component mounting device 50, or supplies the used pallet 34 to the original slot 32 of the magazine 30 or other empty space. A drive signal to the component supply robot 28 for housing in the slot 32, a drive signal to the large door lock solenoid 22a, a drive signal to the upper small door lock solenoid 23a, to the lower small door lock solenoid 24a Are output via the input / output interface 45. The control device 40 is communicably connected to the control device 60 of the component mounting device 50, and exchanges various control signals and data.
 部品実装装置50の制御装置60は、図3に示すように、CPU61を中心とするマイクロプロセッサとして構成されており、CPU61の他に、ROM62やHDD63,RAM64,入出力インタフェース65を備える。これらは、バス66を介して電気的に接続されている。制御装置60には、パーツカメラ59からの画像信号などが入出力インタフェース65を介して入力されている。また、制御装置60からは、基板搬送装置52やバックアップ装置54、ヘッドユニット56、XYロボット58へ駆動信号などが入出力インタフェース65を介して出力されている。制御装置60は、図示しない管理装置と通信可能に接続されており、管理装置から基板Sの生産に関する生産データ(生産ジョブ)を受信し、受信した生産データに従って基板Sへの部品Pの実装処理を行う。ここで、生産データは、部品実装装置50においてどの部品P(ウエハ)をどの順番で基板Sへ実装するか、また、そのように部品Pを実装した基板Sを何枚作製するかなどを定めたデータである。また、生産データは、実装に必要な部品P(ウエハ)がマガジン30のどのウエハ補給位置(スロット32)にどれだけあるのかを定めた部品データも含まれている。生産データ(部品データ)は、作業者によって作成される。作業者は、生産に先立って、マガジン30の部品Pの供給態様を予め選択し、選択した供給態様に応じた部品データを作成する。ここで、部品Pの供給態様としては、1つのマガジン30の上段(上段ウエハ補給位置)と下段(下段ウエハ補給位置)とにそれぞれ同じ部品を補給しておき、通常時には一方のみを使用して部品Pの供給を行い部品切れやエラーが発生したときに他方の使用に切り替えて部品Pの供給を行う態様Aや、1つのマガジン30の上段(上段ウエハ補給位置)と下段(下段ウエハ補給位置)との一方を使用して部品Pを供給し次の生産に必要な部品Pを他方のウエハ補給位置に補給する態様B、マガジン30の上段(上段ウエハ補給位置)と下段(下段ウエハ補給位置)の両方を使用して部品Pの供給を行う態様Cなどがある。 As shown in FIG. 3, the control device 60 of the component mounting apparatus 50 is configured as a microprocessor centered on a CPU 61, and includes a ROM 62, an HDD 63, a RAM 64, and an input / output interface 65 in addition to the CPU 61. These are electrically connected via a bus 66. An image signal or the like from the parts camera 59 is input to the control device 60 via the input / output interface 65. Further, a drive signal and the like are output from the control device 60 to the substrate transport device 52, the backup device 54, the head unit 56, and the XY robot 58 via the input / output interface 65. The control device 60 is communicably connected to a management device (not shown), receives production data (production job) related to the production of the substrate S from the management device, and mounts the component P on the substrate S according to the received production data. I do. Here, the production data defines which component P (wafer) is mounted on the substrate S in which order in the component mounting apparatus 50, and how many substrates S on which the component P is mounted are produced. Data. The production data also includes part data that defines how many parts P (wafers) necessary for mounting are located in which wafer replenishment position (slot 32) of the magazine 30. Production data (part data) is created by an operator. Prior to production, the worker selects in advance the supply mode of the parts P of the magazine 30 and creates part data corresponding to the selected supply mode. Here, as a supply mode of the parts P, the same parts are supplied to the upper stage (upper wafer supply position) and the lower stage (lower wafer supply position) of one magazine 30, and only one of them is normally used. A mode in which parts P are supplied and parts P are supplied by switching to the other use when parts run out or an error occurs, and upper (upper wafer replenishment position) and lower (lower wafer replenishment positions) of one magazine 30 ) To supply the part P and supply the part P necessary for the next production to the other wafer supply position, the upper stage (upper wafer supply position) and the lower stage (lower wafer supply position) of the magazine 30. ) And the like are used to supply the component P.
 部品実装装置50の制御装置60は、前述したように、部品供給装置20の制御装置40と通信可能に接続されており、生産データに従って生産を開始する際に、生産データに含まれる部品データに基づいて必要な部品P(ウエハ)の供給を指示する制御信号を部品供給装置20の制御装置40に送信する。 As described above, the control device 60 of the component mounting device 50 is communicably connected to the control device 40 of the component supply device 20, and when starting production according to the production data, the component data included in the production data is included in the component data. Based on this, a control signal for instructing the supply of the necessary component P (wafer) is transmitted to the control device 40 of the component supply device 20.
 部品実装装置50の制御装置60は、部品供給装置20により部品P(ウエハ)が供給される位置(部品供給位置)まで吸着ノズル57を移動させて部品Pを吸着し、吸着した部品Pを基板S上の実装位置に実装するようヘッドユニット56とXYロボット58とを制御する。制御装置60は、部品Pの実装に先立って、吸着した部品Pの吸着姿勢をパーツカメラ59で撮像し、得られた画像に基づいて部品Pが正常に吸着されいているか否かの判定を行う。制御装置60は、部品Pが正常に吸着されていると判定すると、吸着した部品Pの実装動作を行い、部品Pが正常に吸着されていないと判定すると、部品Pが正常に吸着されていると判定するまで、新たな部品Pを吸着し直すリカバリ動作を行う。なお、リカバリ動作の実行回数が所定回数に達すると、エラーを出力する。制御装置60は、部品供給装置20の部品Pの供給態様として態様Aが選択されている場合、部品供給装置20の制御装置40にエラー信号を送信することで、使用するウエハ補給位置の切り替えを指示する。 The control device 60 of the component mounting device 50 moves the suction nozzle 57 to a position (component supply position) where the component P (wafer) is supplied by the component supply device 20 to suck the component P, and the sucked component P is a substrate. The head unit 56 and the XY robot 58 are controlled to be mounted at the mounting position on S. Prior to mounting the component P, the control device 60 captures the suction posture of the sucked component P with the parts camera 59, and determines whether or not the component P is normally sucked based on the obtained image. . When the control device 60 determines that the component P is normally sucked, the controller 60 performs the mounting operation of the sucked component P. When the control device 60 determines that the component P is not normally sucked, the component P is normally sucked. Until the determination is made, the recovery operation for re-sucking the new component P is performed. An error is output when the number of executions of the recovery operation reaches a predetermined number. When the aspect A is selected as the supply mode of the component P of the component supply device 20, the control device 60 transmits an error signal to the control device 40 of the component supply device 20 to switch the wafer replenishment position to be used. Instruct.
 次に、実施例の部品供給装置20の動作について説明する。図9は、制御装置40のCPU41により実行される部品供給処理の一例を示すフローチャートである。 Next, the operation of the component supply apparatus 20 according to the embodiment will be described. FIG. 9 is a flowchart illustrating an example of a component supply process executed by the CPU 41 of the control device 40.
 部品供給処理が実行されると、制御装置40のCPU41は、まず、生産中(部品Pを実装した基板Sを作製中)であるか否かを判定し(S100)、生産中でないと判定すると、大扉22と上段の小扉23と下段の小扉24の全てのロックが解除されるよう大扉ロック用ソレノイド22aと上段小扉ロック用ソレノイド23aと下段小扉ロック用ソレノイド24aとを駆動制御して(S110~S130)、部品供給処理を終了する。これにより、大扉22を開放してマガジン30を取り替えたり、次の生産に必要な部品P(ウエハ)をマガジン30に収容する段取り替えを行うことができる。 When the component supply process is executed, the CPU 41 of the control device 40 first determines whether it is in production (manufacturing the substrate S on which the component P is mounted) (S100), and determines that it is not in production. The large door locking solenoid 22a, the upper small door locking solenoid 23a, and the lower small door locking solenoid 24a are driven so that all the locks of the large door 22, the upper small door 23, and the lower small door 24 are released. Control is performed (S110 to S130), and the component supply process is terminated. As a result, the large door 22 can be opened and the magazine 30 can be replaced, or a changeover can be performed in which a part P (wafer) necessary for the next production is accommodated in the magazine 30.
 CPU41は、生産中であると判定すると、閉鎖状態で大扉22がロックされるよう大扉ロック用ソレノイド24aを駆動制御する(S140)。これにより、作業者は、大扉22を開放できないため、マガジン30を取り出すことはできない。そして、CPU41は、作業者により選択された部品供給態様がマガジン30の上下段のウエハ補給位置のうち片方のみを使用する態様Aまたは態様Bのいずれかであるか否かを判定する(S150)。CPU41は、部品供給態様が態様Aおよび態様Bのいずれかであると判定すると、マガジン30の上段(上段ウエハ補給位置)を使用中であるか否かを判定する(S160)。S150,S160の判定は、部品実装装置50の制御装置60から送信される部品供給指示に基づいて行うことができる。CPU41は、部品供給態様が態様Aおよび態様Bのいずれかであり、マガジン30の上段を使用中であると判定すると、上段の小扉23がロックされるよう上段小扉ロック用ソレノイド23aを駆動制御すると共に(S170)、下段の小扉24のロックが解除されるよう下段小扉ロック用ソレノイド24aを駆動制御する(S180)。これにより、作業者は、生産中であっても、下段の小扉24を開くことで、マガジン30の下段ウエハ補給位置にウエハ36を補給することができる。そして、CPU41は、マガジン30の上段(上段ウエハ補給位置)から必要なウエハ36が載せられたパレット34を引き出して部品実装装置50に供給されるよう部品供給ロボット28を駆動制御して(S190)、部品供給処理を終了する。 When the CPU 41 determines that the large door 22 is in production, the CPU 41 drives and controls the large door locking solenoid 24a so that the large door 22 is locked (S140). Thus, the operator cannot open the large door 22 and cannot take out the magazine 30. Then, the CPU 41 determines whether or not the component supply mode selected by the operator is either mode A or mode B in which only one of the upper and lower wafer replenishment positions of the magazine 30 is used (S150). . If the CPU 41 determines that the component supply mode is either mode A or mode B, the CPU 41 determines whether the upper stage (upper wafer replenishment position) of the magazine 30 is in use (S160). The determinations in S150 and S160 can be made based on a component supply instruction transmitted from the control device 60 of the component mounting apparatus 50. When the CPU 41 determines that the component supply mode is either mode A or mode B and the upper stage of the magazine 30 is in use, the CPU 41 drives the upper stage door locking solenoid 23a so that the upper stage door 23 is locked. While controlling (S170), the lower stage door lock solenoid 24a is driven and controlled so that the lower door 24 is unlocked (S180). Thus, even during production, the operator can replenish the wafer 36 to the lower wafer replenishment position of the magazine 30 by opening the lower door 24. Then, the CPU 41 drives and controls the component supply robot 28 so that the pallet 34 on which the necessary wafers 36 are placed is pulled out from the upper stage (upper wafer replenishment position) of the magazine 30 and supplied to the component mounting apparatus 50 (S190). Then, the component supply process is terminated.
 一方、CPU41は、部品供給態様が態様Aおよび態様Bのいずれかであり、マガジン30の上段(上段ウエハ補給位置)を使用中でないと判定、即ち下段(下段ウエハ補給位置)を使用中であると判定すると、上段の小扉23のロックが解除されるよう上段小扉ロック用ソレノイド23aを駆動制御すると共に(S200)、下段の小扉24がロックされるよう下段小扉ロック用ソレノイド24aを駆動制御する(S210)。これにより、作業者は、生産中であっても、上段の小扉23を開くことで、マガジン30の上段ウエハ補給位置にウエハ36を補給することができる。そして、CPU41は、マガジン30の下段(下段ウエハ補給位置)から必要なウエハ36が載せられたパレット34を引き出して部品実装装置50に供給されるよう部品供給ロボット28を駆動制御して(S220)、部品供給処理を終了する。 On the other hand, the CPU 41 determines that the component supply mode is either mode A or mode B, and the upper stage (upper wafer supply position) of the magazine 30 is not in use, that is, the lower stage (lower wafer supply position) is in use. Is determined, the upper stage door lock solenoid 23a is driven and controlled so that the upper stage door 23 is unlocked (S200), and the lower stage door lock solenoid 24a is operated so that the lower stage door 24 is locked. Drive control is performed (S210). Thus, even during production, the operator can replenish the wafer 36 to the upper wafer replenishment position of the magazine 30 by opening the upper small door 23. Then, the CPU 41 drives and controls the component supply robot 28 so that the pallet 34 on which the necessary wafers 36 are placed is pulled out from the lower stage (lower wafer supply position) of the magazine 30 and is supplied to the component mounting apparatus 50 (S220). Then, the component supply process is terminated.
 また、CPU41は、部品供給態様が態様Aおよび態様Bのいずれでもないと判定、即ち、部品供給態様がマガジン30の上下段のウエハ補給位置のうち両方を使用する態様Cであると判定すると、上段の小扉23および下段の小扉24が共にロックされるよう上段小扉ロック用ソレノイド23aおよび下段小扉ロック用ソレノイド24aを駆動制御する(S230,S240)。これにより、作業者は、生産中にウエハ36を補給することができない。そして、CPU41は、マガジン30の上下段の両方(上段ウエハ補給位置および下段ウエハ補給位置)から必要なウエハ36が載せられたパレット34を引き出して部品実装装置50に供給されるよう部品供給ロボット28を駆動制御して(S250)、部品供給処理を終了する。 When the CPU 41 determines that the component supply mode is neither mode A nor mode B, that is, determines that the component supply mode is mode C using both of the upper and lower wafer replenishment positions of the magazine 30, The upper small door locking solenoid 23a and the lower small door locking solenoid 24a are driven and controlled so that the upper small door 23 and the lower small door 24 are locked together (S230, S240). As a result, the operator cannot replenish the wafer 36 during production. Then, the CPU 41 pulls out the pallet 34 on which the necessary wafers 36 are placed from both the upper and lower stages of the magazine 30 (upper wafer replenishment position and lower wafer replenishment position) and supplies them to the component mounting apparatus 50. Is controlled (S250), and the component supply process is terminated.
 以上説明した実施例の部品供給装置20によれば、マガジン30をマガジン保持部26に載置したりマガジン保持部26から取り出したりするための大扉22に加えて、マガジン30の上段のスロット群(上段ウエハ補給位置)にウエハを補給可能な上段の小扉23と、マガジン30の下段のスロット群(下段ウエハ補給位置)にウエハを補給可能な下段の小扉24とを設ける。これにより、1つのマガジン30の一部のスロット32に収容されているパレット36により部品P(ウエハ)を供給している間、他のスロット32に対して部品Pの補給を行うことができる。また、マガジン30の上段を使用中の場合には上段の小扉23をロックすると共に下段の小扉24のロックを解除し、マガジン30の下段を使用中の場合には上段の小扉23のロックを解除すると共に下段の小扉24をロックするから、生産中にウエハ36を補給する際の安全性を確保することができる。さらに、マガジン30の上段のスロット群と下段のスロット群との間のスロットを不使用スロットとし、そこに仕切り板32を収容する。これにより、作業者は、上段の小扉23から下段のスロット群に手をのばすことができず、下段の小扉24から上段のスロット群に手をのばすことができないため、生産中にウエハ36を補給する際の安全性をより高めることができる。また、小扉23,24は、大扉22の前面に設けたから、大扉22と小扉23,24とを別々の位置に設けるものに比して、スペースを有効利用して、装置をより小型化することができる。 According to the component supply device 20 of the embodiment described above, in addition to the large door 22 for placing the magazine 30 on the magazine holding unit 26 and taking it out of the magazine holding unit 26, the upper slot group of the magazine 30 is provided. An upper small door 23 capable of replenishing a wafer (upper wafer replenishment position) and a lower small door 24 capable of replenishing a wafer in a lower slot group (lower wafer replenishment position) of the magazine 30 are provided. As a result, while the component P (wafer) is being supplied by the pallet 36 accommodated in a part of the slots 32 of one magazine 30, the component P can be replenished to the other slots 32. When the upper stage of the magazine 30 is in use, the upper door 23 is locked and the lower door 24 is unlocked. When the lower part of the magazine 30 is in use, the upper door 23 is unlocked. Since the lock is released and the lower door 24 is locked, it is possible to ensure safety when the wafer 36 is replenished during production. Further, a slot between the upper slot group and the lower slot group of the magazine 30 is set as an unused slot, and the partition plate 32 is accommodated therein. As a result, the operator cannot reach from the upper small door 23 to the lower slot group, and cannot reach from the lower small door 24 to the upper slot group. The safety when replenishing can be further improved. In addition, since the small doors 23 and 24 are provided on the front surface of the large door 22, the space can be used more effectively and the apparatus can be used more effectively than when the large door 22 and the small doors 23 and 24 are provided at different positions. It can be downsized.
 実施例の部品供給装置20では、小扉23,24を大扉22の前面に設けるものとしたが、これに限定されるものではなく、例えば、大扉を筐体21の上面に設け、小扉を筐体21の前面に設ける構成とする等、大扉22と小扉23,24とをそれぞれ異なる位置に設けるものとしてもよい。 In the component supply device 20 of the embodiment, the small doors 23 and 24 are provided on the front surface of the large door 22, but the present invention is not limited to this. The large door 22 and the small doors 23 and 24 may be provided at different positions, such as a structure in which a door is provided on the front surface of the housing 21.
 実施例の部品供給装置20では、マガジン30の上段スロット群(上段ウエハ補給位置)と下段スロット群(下段ウエハ補給位置)との間の中間スロットをウエハ(部品)の供給に使用できない不使用スロットとしたが、これに限定されるものではなく、部品供給態様がマガジン30の上下段のウエハ補給位置のうち両方を使用する態様Cである場合には、中間スロットをウエハ(部品)の供給に使用するものとしてもよい。 In the component supply apparatus 20 of the embodiment, an unused slot in which an intermediate slot between the upper slot group (upper wafer supply position) and the lower slot group (lower wafer supply position) of the magazine 30 cannot be used for supplying wafers (components). However, the present invention is not limited to this, and when the component supply mode is a mode C in which both of the upper and lower wafer replenishment positions of the magazine 30 are used, the intermediate slot is used for supplying wafers (components). It may be used.
 実施例の部品供給装置20では、部品供給態様がマガジン30の上下段のウエハ補給位置のうち片方のみを使用する態様Aまたは態様Bの場合には、使用していない方のウエハ補給位置に対応する小扉(上段のウエハ補給位置を使用中の場合には下段の小扉24であり下段のウエハ補給位置を使用中の場合には上段の小扉23)のロックを解除するものとしたが、マガジン30の不使用スロットに仕切り板38が設置されていることを条件に小扉のロックを解除するものとしてもよい。この場合、マガジン30の不使用スロットに仕切り板38が設置されているか否かを検知するセンサを設けるものとすればよい。 In the component supply apparatus 20 of the embodiment, when the component supply mode is the mode A or mode B in which only one of the upper and lower wafer supply positions of the magazine 30 is used, it corresponds to the unused wafer supply position. The lock of the small door (the lower door 24 when the upper wafer supply position is in use and the upper door 23 when the lower wafer supply position is in use) is released. The small door may be unlocked on condition that the partition plate 38 is installed in the unused slot of the magazine 30. In this case, a sensor for detecting whether or not the partition plate 38 is installed in the unused slot of the magazine 30 may be provided.
 実施例の部品供給装置20では、マガジン30の上段スロット群と下段スロット群とにそれぞれウエハ36を補給可能な2つの小扉23,24を備えるものとしたが、これに限定されるものではなく、例えば、マガジン30のスロット群を上段と中段と下段とに区画し、上段のスロット群と中段のスロット群と下段のスロット群とにそれぞれウエハを補給可能な3つの小扉を備える等、備える小扉の数は2つ以上であれば、幾つであっても構わない。 In the component supply apparatus 20 of the embodiment, the two small doors 23 and 24 that can replenish the wafer 36 are provided in the upper slot group and the lower slot group of the magazine 30 respectively. However, the present invention is not limited to this. For example, the slot group of the magazine 30 is divided into an upper stage, a middle stage, and a lower stage, and the upper slot group, the middle slot group, and the lower slot group are each provided with three small doors that can replenish wafers. The number of small doors is not limited as long as it is two or more.
 実施例の部品供給装置20では、パレット34に載せられたウエハ36を部品実装装置50に供給するウエハ供給装置として構成するものとしたが、これに限定されるものではなく、例えば、マガジン30の複数段のスロットにそれぞれ複数のチップ部品を並べたトレーを収容し、指定されたチップ部品が載せられたトレーをいずれかのスロットから引き出して供給する等、他の如何なる部品の供給に用いるものとしてもよい。 In the component supply apparatus 20 according to the embodiment, the wafer 36 placed on the pallet 34 is configured as a wafer supply apparatus that supplies the component mounting apparatus 50. However, the present invention is not limited to this. It is used for supplying any other parts, such as storing trays with multiple chip parts arranged in multiple slots and pulling out trays with specified chip parts from one of the slots. Also good.
 ここで、本実施例の主要な要素と発明の開示の欄に記載した発明の主要な要素との対応関係について説明する。即ち、マガジン保持部26が「保持部」に相当し、大扉22が「大扉」に相当し、上段の小扉23が「第1小扉」に相当し、下段の小扉24が「第2小扉」に相当する。また、上段小扉ロック用ソレノイド23aが「第1ロック手段」に相当し、下段小扉ロック用ソレノイド24aが「第2ロック手段」に相当し、図9の部品供給処理のS100~S180,S200,S210,S230,S240の処理を実行する制御装置40のCPU41が「ロック制御手段」に相当する。 Here, the correspondence between the main elements of the present embodiment and the main elements of the invention described in the disclosure section of the invention will be described. That is, the magazine holder 26 corresponds to the “holder”, the large door 22 corresponds to the “large door”, the upper small door 23 corresponds to the “first small door”, and the lower small door 24 “ Corresponds to “second door”. Further, the upper small door locking solenoid 23a corresponds to “first locking means”, and the lower small door locking solenoid 24a corresponds to “second locking means”, and S100 to S180, S200 of the component supply processing of FIG. , S210, S230 and S240, the CPU 41 of the control device 40 corresponds to the “lock control means”.
 なお、本発明は上述した実施例に何ら限定されることはなく、本発明の技術的範囲に属する限り種々の態様で実施し得ることはいうまでもない。 In addition, this invention is not limited to the Example mentioned above at all, and as long as it belongs to the technical scope of this invention, it cannot be overemphasized that it can implement with a various aspect.
 本発明は、部品供給装置の製造産業などに利用可能である。 The present invention can be used in the parts supply device manufacturing industry.
 10 部品実装システム、20 部品供給装置、21 筐体、22 大扉、22a 大扉ロック用ソレノイド、23,24 小扉、23a 上段小扉ロック用ソレノイド、24a 下段小扉ロック用ソレノイド、26 マガジン保持部、28 部品供給ロボット、30 マガジン、32 スロット、34 パレット、36 ウエハ、38 仕切り板、40 制御装置、41 CPU、42 ROM、44 RAM、45 入出力インタフェース、46 バス、50 部品実装装置、52 基板搬送装置、54 バックアップ装置、56 ヘッドユニット、57 吸着ノズル、58 XYロボット、60 制御装置、61 CPU、62 ROM、63 HDD、64 RAM、65 入出力インタフェース、66 バス。 10 component mounting system, 20 component supply device, 21 housing, 22 large door, 22a large door locking solenoid, 23, 24 small door, 23a upper small door locking solenoid, 24a lower small door locking solenoid, 26 magazine holding Part, 28 parts supply robot, 30 magazines, 32 slots, 34 pallets, 36 wafers, 38 partition plates, 40 control devices, 41 CPU, 42 ROM, 44 RAM, 45 I / O interface, 46 buses, 50 component mounting devices, 52 Substrate transport device, 54 backup device, 56 head unit, 57 suction nozzle, 58 XY robot, 60 control device, 61 CPU, 62 ROM, 63 HDD, 64 RAM, 65 I / O interface, 66 bus.

Claims (4)

  1.  マガジンが有する複数段のスロットに収容されたパレットを引き出して該パレットに載せられた部品を供給する部品供給装置であって、
     前記マガジンを保持可能な保持部と、
     開閉可能に構成され、開放状態で前記保持部への前記マガジンの載置と該保持部からの該マガジンの取り出しとが可能な大扉と、
     開閉可能に構成され、開放状態で前記複数段のスロットのうち第1スロット群に対して前記パレットの取り出しと収容とが可能な第1小扉と、
     前記第1小扉と独立して開閉可能に構成され、開放状態で前記複数段のスロットのうち前記第1スロット群とは異なる第2スロット群に対して前記パレットの取り出しと収容とが可能な第2小扉と、
     を備えることを特徴とする部品供給装置。
    A component supply device for pulling out a pallet accommodated in a plurality of slots of a magazine and supplying a component placed on the pallet,
    A holding part capable of holding the magazine;
    A large door configured to be openable and closable and capable of placing the magazine on the holding portion and taking out the magazine from the holding portion in an open state;
    A first small door configured to be openable and closable and capable of taking out and storing the pallet with respect to a first slot group among the plurality of slots in the open state;
    The pallet can be taken out and stored in a second slot group that is different from the first slot group among the plurality of slots in the open state. A second door,
    A component supply apparatus comprising:
  2.  請求項1記載の部品供給装置であって、
     前記第1小扉と前記第2小扉は、前記大扉に設けられている
     ことを特徴とする部品供給装置。
    The component supply device according to claim 1,
    The first small door and the second small door are provided on the large door.
  3.  請求項1または2記載の部品供給装置であって、
     前記マガジンは、前記第1スロット群と前記第2スロット群との間に空きスロットを有し、
     前記空きスロットに収容される仕切り板を備える
     ことを特徴とする部品供給装置。
    The component supply device according to claim 1 or 2,
    The magazine has an empty slot between the first slot group and the second slot group,
    A component supply device comprising a partition plate accommodated in the empty slot.
  4.  請求項1ないし3いずれか1項に記載の部品供給装置であって、
     閉鎖状態で前記第1小扉をロックする第1ロック手段と、
     閉鎖状態で前記第2小扉をロックする第2ロック手段と、
     前記第1スロット群および前記第2スロット群のうち部品を供給しているスロット群に対応する小扉をロックすると共に部品を供給していないスロット群に対応する小扉のロックを解除するロック制御手段と、
     を備えることを特徴とする部品供給装置。
    The component supply device according to any one of claims 1 to 3,
    First locking means for locking the first small door in a closed state;
    Second locking means for locking the second small door in a closed state;
    Lock control for locking a small door corresponding to a slot group supplying parts among the first slot group and the second slot group and releasing a lock corresponding to a slot group not supplying parts. Means,
    A component supply apparatus comprising:
PCT/JP2014/082677 2014-12-10 2014-12-10 Component feeding apparatus WO2016092649A1 (en)

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