JP2013115337A - Electronic component attachment method and electronic component attachment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component attachment apparatus which inhibits an electronic component taken out from a tray from being incorrectly attached to a circuit board as much as possible.SOLUTION: When a production model of a printed circuit board P is changed, images of characters provided on a surface of an electronic component, which is used in the changed production module and is housed in a component housing part 41 placed in a tray 13, are captured by a board recognition camera 4 and recognized. The recognized image is compared to an image of data stored in advance. Whether or not the electronic component is correct is determined on the basis of the comparison result.

Description

  The present invention relates to an electronic component mounting method and an electronic component mounting apparatus that perform a recognition operation of supplied electronic components.

  An electronic component mounting apparatus that mounts an electronic component stored in a tray of a component supply apparatus on a printed circuit board that is a mounted member is disclosed in, for example, Patent Document 1 and the like. Then, whether or not the component set in the component supply device is correct is checked by attaching the electronic component to the tray in a grid pattern, for example, by attaching it to the bag in which the tray component is stored. In general, the barcode is read by a barcode reader and is checked by comparing with the data of the component type stored in the memory in advance.

JP 2011-85889 A

  However, when supplying electronic parts from tray parts, if the electronic parts are left over, and the tray is returned to the wrong bag, the tray part in the bag will be used again. The problem arises that even if the barcode attached to the bag is read, it cannot be checked.

  In addition, when the correct electronic component and the electronic component wrongly put in the bag have the same shape, there is a problem in that the electronic component cannot be checked even if the external shape is recognized by imaging with a camera.

  As a result, there is a possibility that an incorrect electronic component is mounted on the board when the type of board to be produced is changed.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component mounting method and an electronic component mounting device capable of avoiding erroneous mounting of wrong electronic components on a substrate as much as possible when the type of substrate to be produced is changed. .

Therefore, according to a first aspect of the present invention, there is provided an electronic component mounting method in which an electronic component stored in a component storage portion of a component supply member disposed in a component supply device is taken out and held and mounted on a mounted member.
Before starting the operation of taking out the electronic component from the mounting member, characters and figures provided on the surface of the electronic component stored in the component storage unit are captured and recognized by the camera, and the recognized image is displayed. Based on this, it is determined whether or not the electronic component is correct.

A second invention is an electronic component mounting method in which an electronic component stored in a component storage portion of a component supply member disposed in a component supply device is held by a holding member and mounted on a mounted member.
When the holding member moves above the component storage unit to hold the electronic component stored in the component storage unit, characters and figures provided on the surface of the electronic component to be held are imaged by the camera. And recognizing whether or not the electronic component is correct based on the recognized image.

A third invention is the electronic component mounting method according to claim 1 or 2,
Whether to perform a component difference confirmation operation for recognizing characters and figures provided on the surface of the electronic component to be held by imaging with a camera and determining whether the electronic component is correct based on the recognized image Whether or not is set in advance and stored, and when the component difference confirmation operation is performed, the component difference confirmation operation is performed only for the set electronic components.

A fourth invention is the electronic component mounting method according to claim 1 or 2,
When the production model of the mounted member is changed, the camera captures characters and figures provided on the surface of the electronic component that is stored in the component storage unit located in the component supply unit and used in the changed production model It is characterized by being recognized.

According to a fifth aspect of the present invention, there is provided an electronic component mounting apparatus in which a holding member takes out and holds an electronic component from a plurality of component storage portions of a component supply member arranged in the component supply device, and is mounted on a substrate.
A camera for imaging characters or figures provided on the surface of the electronic component;
When the production model of the mounted member is changed, the type of the electronic component is determined based on the image captured by moving the camera upward of the component storage unit and the image data stored in the memory. And a control device that controls the take-out member to take out the electronic component from the component storage section when it is determined that the electronic component is correct.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic component mounting method and electronic component mounting apparatus which can avoid erroneously mounting the wrong electronic component on a board | substrate as much as possible can be provided.

It is a top view of an electronic component mounting apparatus. It is a front view of a 2nd component supply apparatus. It is a front view of the state which removed the cover of the 2nd component supply device. It is a cross-sectional top view of the state which removed the cover body of the 2nd component supply apparatus. It is a longitudinal cross-sectional view of the state which removed the cover body of the 2nd component supply apparatus. It is a right view which shows a part of electronic component mounting apparatus. It is a front view of the state which removed the cover of the 2nd component supply device. It is a control block diagram. It is a figure of the library data containing the data of "part difference confirmation function". It is a top view of the electronic component which attached | subjected the character or the mark to the adsorption | suction surface. It is a figure of the data of the adsorption number for every tray. It is a figure of the data of the adsorption number for every feeder. It is a figure which shows the flowchart of the confirmation operation | movement of the parts difference at the time of the production start when the board | substrate model change is performed. It is a figure of the monitor of the screen which displayed generation | occurrence | production of the component difference abnormality, and the component confirmation instruction | indication. It is a figure of the monitor of the input screen of a work end. It is a figure which shows the flowchart of the confirmation operation | movement of the part difference in the electronic component mounting apparatus at the time of a production start. It is a figure of the monitor of the screen which displayed the switch part of the production start.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1, and first component supply devices 3A, 3B, 3C and second component supply are provided in four blocks on the front and rear parts of the electronic component mounting apparatus 1. A device 3D is also provided. Each of the first component supply devices 3A, 3B, and 3C includes a component supply unit 5 that stores electronic components at a predetermined interval on a plurality of, for example, tapes mounted side by side, and a tip portion on the component supply side is a member to be mounted. It is detachably disposed on the apparatus body 2 via a connector (not shown) so as to face the conveyance path of the printed circuit board P, and is provided on the lower surface when the connector is released and a handle (not shown) is pulled. The cart base can be moved by the casters.

  Note that the mounted member on which the electronic component is mounted is not limited to the printed board, and may be a flexible board, for example.

  Between the first component supply devices 3A and 3B, the first component supply device 3C, and the second component supply device 3D facing each other, a supply conveyor and a positioning unit 8 (having a conveyor) that constitute a substrate transfer mechanism. And a discharge conveyor. The supply conveyor conveys a plurality of printed circuit boards P received from an upstream device to the positioning unit 8, and after the electronic parts are mounted on the substrate P positioned by a positioning mechanism (not shown) in the positioning unit 8, the discharge is discharged. It is conveyed to the conveyor and then conveyed to the downstream device.

  The beam 10 is moved in the Y direction along the guide rail 9 by driving the Y-direction linear motor 61 (see FIG. 8), and each beam 10 is driven by the X-direction linear motor 62 (see FIG. 8). The mounting head 6 that moves in the X direction is provided. In addition, the mounting head 6 is provided with a suction nozzle 7 as a holding member that sucks out and holds an electronic component. The suction nozzle 7 can be moved up and down by a vertical axis motor 63 and a θ-axis motor 64 (see FIG. 8) and can be rotated. As the holding member, in addition to the suction nozzle 7, for example, a holding member having a mechanism for holding and taking out an electronic component may be used.

  Reference numeral 4 denotes a board recognition camera which is used when imaging a recognition mark for confirming the position of the printed board P, and is mounted on each mounting head 6. Reference numeral 12 denotes a component recognition camera provided in the apparatus main body 2 corresponding to the mounting head 6, and images the electronic component sucked and held by the suction nozzle 7 from the component supply device 3. The position of the electronic component with respect to the suction nozzle 7 is recognized.

  Next, the second component supply device 3D that is detachably attached to the electronic component mounting device 1 will be described in detail below with reference to FIGS.

  The second component supply device 3D includes a lid 20 having a door 19 that covers an opening having one side and that can open and close an opening for taking out the magazine 15 for replacement at upper, middle, and lower positions. And a tray 13 having a rectangular shape in plan view in which electronic components are arranged and arranged in a plurality of rectangular component storage portions 41 having a rectangular shape in plan view formed in the supply device body 21 at equal intervals in the vertical and horizontal directions. Two magazines 15 for storing the mounted pallets 14 in a plurality of stages, and a predetermined pallet 14 of any one of the magazines 15 at a drawer level position (a chute 16 provided in the electronic component mounting apparatus 1). Position) and an exchange mechanism for the magazine 15 in the vertical direction and the pallet 14 from the elevator mechanism 17 to the pickup area of the apparatus main body 2 horizontally. It consists pallet introducing mechanism 18 for conveying the direction.

  As shown in FIGS. 4 and 5, the elevator mechanism 17 includes two guide rails 22, two sliders 23 that can move up and down along the guide rails 22, and two magazines on which the magazine 15 is placed. A magazine base 24 having an L-shaped cross section, one ball screw 26 fixed to the upper and lower fixing blocks 25 between the two guide rails 22, and two lift drive motors 27 with an encoder function capable of forward and reverse rotation. A belt 29 stretched between the output shaft of each elevating drive motor 27 and a pulley 28 that can be rotated by the ball screw 26, and a nut 30 that moves along the ball screw 26 when the belt 29 rotates together with the belt 29. In addition to the slider 23, an elevating drive motor 27 is also fixed to the magazine base 24, and a bearing is provided between the magazine base 24 and the nut 30. (Not shown) is provided.

  Therefore, when the elevating drive motor 27 is driven forward and backward, the pulley 28 and the nut 30 are rotated around the ball screw 26 via the belt 29, and the magazine base 24 is not rotated by the bearing body (not shown). It moves up and down along the guide rail 22 via the slider 23.

  In the raising / lowering operation by the elevator mechanism 17 configured as described above, the level position of the desired pallet 14 of the upper and lower magazines 15 and the level position of the chute 16 are matched, and the tray 13 of the pallet 14 is moved by the pallet introduction mechanism 18. It is introduced into the pickup area and can be taken out by the suction nozzle 7.

  The pallet introducing mechanism 18 includes a chute 16 disposed in the apparatus main body 2, a locking arm 31 that moves forward and backward along the chute 16, and a drive mechanism 32 that moves the locking arm 31 forward and backward. A hook that engages with and disengages from the pallet 14 is provided at the front end of the locking arm 31. The locking arm 31 is advanced by the drive mechanism 32, and the hook is attached to the front end of the pallet 14 accommodated in the magazine 15. Next, the locking arm 31 is retracted, and the pallet 14 is introduced along the chute 16 into the pickup area.

  The upper door body 19 is provided with an operation switch 35 for raising the upper magazine 15, and the middle door body 19 is provided with operation switches 36 and 37 for raising and lowering the upper or lower magazine 15, and the lower door body. 19, an operation switch 38 for lowering the lower magazine 15 is provided. Each door body 19 is similarly provided with a handle 19A and a transparent or translucent window 19B.

  When the electronic component mounting apparatus is stopped when the magazine 15 is replaced for the replacement of the printed circuit board P, or when a large number of pallets 14 for mounting the tray 13 for storing predetermined components are replaced. When any one of the operation switches 35, 36, 37, 38 is operated, the CPU 50 (see FIG. 8), which is a control device that comprehensively controls the electronic component mounting device, moves the corresponding magazine 15 up and down. 27 is driven to move to a position corresponding to the door body 19, and along with this movement stop, a drive source of a lock mechanism (not shown) of the door body 19 is driven to release the lock.

  That is, when the operation switch 35 is operated, the upper magazine 15 is moved to a position corresponding to the upper door 19 by driving the upper lifting drive motor 27, and when the operation switch 36 is operated, the upper lifting drive motor 27 is driven. When the upper magazine 15 is moved to a position corresponding to the middle door body 19 and the operation switch 37 is operated, the lower magazine 15 is moved to a position corresponding to the middle door body 19 by driving the lower elevating drive motor 27. When the operation switch 38 is operated, the CPU 50 controls so that the lower magazine 15 is moved to a position corresponding to the lower door body 19 by driving the lower lifting drive motor 27.

  Next, the control block diagram of FIG. 8 will be described. The electronic component mounting device 1 is connected to a CPU (Central Processing Unit) 50 as a control device (also serving as a determination device) that performs overall control of the mounting device 1 and to the CPU 50 via a bus line. A RAM (Random Access Memory) 51 and a ROM (Read Only Memory) 52 are provided. Based on the data stored in the RAM 51, the CPU 50 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 52. That is, the CPU 50 controls driving of the Y-direction linear motor 61, the X-direction linear motor 62, the vertical axis motor 63, the θ-axis motor 64, and the like through the interface 54 and the drive circuit 57 and also controls each component supply unit 5. .

  The RAM 51 stores mounting data (hereinafter referred to as pattern program data) for each type of printed circuit board P related to component mounting. This pattern program data includes information on the X direction (indicated by X), the Y direction (indicated by Y), and the angle (indicated by Z) for each mounting position on the printed circuit board P for each electronic component mounting order (step number) And arrangement number information of each component supply unit 5 and the like.

  Further, in the RAM 51, the component supply unit arrangement number (lane number) of each component supply unit 5 and the arrangement number (stage number) of the tray 13 in any one of the upper and lower magazines 15 are stored for each type of printed circuit board P. ) Is stored, that is, component placement information, which component supply unit 5 is mounted at which position (lane) on the cart table. Data on which tray 13 is placed at which position (stage) in which magazine 15.

  The RAM 51 stores component library data relating to the dimensions, shape, features, etc. of each electronic component shown in FIG. 9, for example, for each component ID (or component type). As one of the part library data for each ID (or part type), data of a function of “part difference confirmation” is stored. Whether the data of the “part difference check” function is to check whether the electronic components mounted on the tray 13 are correct at a timing such as the start of production immediately after the production model of a printed circuit board to be described later is switched. This is data indicating whether or not to be performed. There are “not performed” and “performed (perform confirmation processing)”, and either one is selected by the operation of the monitor 55 described later by the operator.

  Further, in the RAM 51, “Yes (confirmation process)” is set in the data of at least the “part difference confirmation function” described above among the electronic parts supplied from the first component supply device 3C and the second component supply device 3D. Image data of the suction surface for each electronic component (electronic components of different types (including the same shape but different characteristics or performance)) is stored as one of the component library data. The image data stored in the RAM 51 is, for example, characters or marks provided by, for example, engraving or printing on the suction surface (upper surface) of the electronic component as shown in FIG. 10, or a manufacturer's logo. Is each data about the electronic component supplied from the some component supply unit 5 or the tray 13, (a) of FIG. 10 is the character 73, 74 of the adsorption surface of the electronic components 71 and 72 is the characteristic of an electronic component. Or it is an example which changes with performance, (b) of FIG. 10 has shown the example from which the figure (mark shape) of an adsorption | suction surface changes with the characteristics or performance of an electronic component.

  Further, the RAM 51 stores the number of picked-up data, which is the number of times the parts have been taken out for each feeder number, which is the number of the tray 13 and the number of the parts supply unit, as shown in FIGS.

  A recognition processing device 53 is connected to the CPU 50 via the interface 54. The recognition processing device 53 performs recognition processing of an image captured by the component recognition camera 12, and the CPU 50 receives the processing result. Is sent out. That is, the CPU 50 outputs an instruction to the recognition processing device 53 so as to perform recognition processing (calculation of misalignment amount) on the image captured by the component recognition camera 12 and receives a recognition processing result from the recognition processing device 53. It is.

  Reference numeral 55 denotes a monitor which is a display device such as a part image or a screen for setting various data. The monitor 55 is provided with various touch panel switches 56 as input means, and the operator operates the touch panel switch 56. Various settings can be made.

  Hereinafter, confirmation of component differences in the electronic component mounting apparatus at the start of production when the type of substrate to be produced is switched during production operation will be described based on the flowchart of FIG.

  When the electronic component mounting apparatus 1 is operated and component mounting on the last printed board P of the model that has been produced is completed, and the board P is unloaded from the electronic component mounting apparatus 1, model switching is performed (step S1). ). That is, the width of the supply conveyor, the positioning unit 8 (having the conveyor) and the discharge conveyor corresponding to the printed board of the model to be produced is changed, the model switching operation is completed, and the operator is displayed on the monitor 55. When the start switch section (not shown) is operated, the electronic component mounting apparatus 1 starts production according to the pattern program data of the switched model stored in the RAM 51 (step S2).

  Then, the component suction operation starts (step S3). First, the X-direction linear motor 62 and the Y-direction linear motor 61 are driven, and the mounting head 6 corresponding to the second component supply device 3D faces the second component supply device 3D. Start moving in the horizontal direction. Further, the CPU 50 determines whether or not to check the difference between components, and whether or not the component suction operation is the first time (step S4).

  For example, “check parts difference” is set in the component library data for the electronic component that is the target of the suction operation, and the target electronic component suction operation is still from the tray 13 in which the electronic component is stored after switching the model. When the number of times the data shown in FIG. 11 is taken out is zero, the CPU 50 determines that the suction operation is the first time, and the mounting head 6 is placed in the tray 13 as shown in FIG. For example, the board recognition camera 4 captures an image of the surface of the electronic component that is stored and moved upward, for example, first picked up and taken out (step S5).

  Note that when “not to check the difference between parts” is set in the part library data in step 4, or when the suction operation of the target electronic component is not the first suction operation after the model switching, step 8 described later. Proceed to adsorption operation.

  The captured image is recognized by the recognition processing device 53 and sent to the CPU 5 to check the part difference (51). That is, for example, characters (see FIG. 10A) of the recognized image are compared with characters on the surface of the electronic component that is first taken out from the tray in the production model fetched from the RAM. As a result of component difference confirmation, when the captured and recognized character is equal to the character captured from the RAM, it is determined that the confirmation result is normal, and when the character is different, it is determined that the character is not normal (step S7). ).

  When the component confirmation result is normal, the motor is driven based on the signal from the CPU and the mounting head 6 is lowered, and the lowered suction nozzle sucks the confirmed electronic component (step S8). The electronic component is picked up, that is, the mounting head 6 holding the electronic component is moved upward and horizontally moved above the component recognition camera, and the electronic component moved to above the component recognition camera is imaged and recognized. If the orientation of the held electronic component is normal as a result of the component recognition, the mounting head 6 moves to the mounting position on the substrate according to the pattern program data, and descends to mount the electronic component on the substrate. (Step S9).

  When a plurality of electronic components of the same type are taken out from the same tray in step S8, the components are recognized for the plurality of electronic components held by the mounting head 6, and the normal electronic components are mounted on the substrate. Is done.

  When the mounting operation is completed, the mounting head 6 moves above the tray 13 and similarly starts the component suction operation. However, the same type of electronic component is extracted from the same tray 1 from which the electronic component was extracted in the previous suction operation. In some cases, even if it is set to “confirm component difference”, the electronic component of that kind is not picked up for the first time, so the board recognition camera 4 does not take an image, and the operation immediately moves to the component picking operation.

  Further, when the result of checking the component difference in step S7 is not normal, that is, the shape of the recognized electronic component and the correct electronic component stored in the RAM are the same, but the characteristic or performance is different, and the recognized electronic component If the character of the part (for example, see (a) in FIG. 10) and the character taken in from the RAM (for example, see (b) in FIG. 10) are different, as shown in FIG. “Part difference abnormality” is displayed on the switch unit 551 of the monitor 55 (step S10), and “Instructing component confirmation” is displayed on the switch unit 552 of the monitor 55 (step S11).

Then, when the operator confirms the monitor 55 and presses the switch unit 551 or the switch unit 552, the monitor 55 is switched to a display for inputting the work end as shown in FIG. That is, the monitor 55 displays a switch part 553 for “parts confirmation completed” and a switch part 554 for “parts replacement completed”. After that, when the operator replaces the tray with the correct type of parts and presses the switch parts 553 and 554,
Also, when the component mounting is finished and the component suction operation is started again, the tray 13 storing the electronic component suctioned last time is automatically replaced with the tray 13 storing the electronic component to be supplied next. When the electronic component suction operation is started for the first time, and the electronic component suction operation set to “Confirm component difference” is started, the mounting head 6 is first picked up and taken out by the determination in step S4. The board recognition camera 4 images the surface of the electronic component (step S5). Thereafter, component difference confirmation is executed in the same manner, and based on the result, component adsorption, component recognition and component mounting operations, or component difference abnormality and component confirmation instructions are displayed.

  As described above, when the electronic component mounting device is in operation, at the start of production immediately after the type of board to be produced is switched, the difference in components is confirmed immediately before the first time the electronic component to be checked for component differences is picked up. When the board model is switched, it is possible to avoid mounting an erroneous electronic component on the board and to avoid producing a defective board.

  Furthermore, when checking the difference between parts, the characters of the image of the electronic component to be picked up are compared with the characters on the surface of the electronic component captured from the RAM, so that the correct electronic component and the wrong electronic component have the same shape. Even if it exists, the difference in parts can be confirmed more reliably.

  Next, confirmation of component differences in the electronic component mounting apparatus at the start of production will be described based on the flowchart of FIG. When the determination and operation in the flowchart of FIG. 16 are the same as the determination and operation in the flowchart shown in FIG. 13, the same step numbers as in FIG. 13 are given.

  When the electronic component mounting apparatus 1 that has stopped production is turned on and the operator presses the production start switch 555 displayed on the monitor 55 shown in FIG. 17, the first printed circuit board is positioned. The electronic component mounting apparatus 1 starts production according to the pattern program data of the type of printed circuit board to be produced (step S12). Then, the part difference check is started (step S13).

  That is, the CPU 50 extracts component library data of electronic components used for the production model described in the pattern program data of the model of the printed circuit board to be produced (step S14). Then, based on the extracted component library data of the electronic component, it is determined whether or not the electronic component is to “check whether or not to check for a component difference” (step S15). As in the operation from step S5 to step S7 in the flowchart of FIG. 13, the mounting head 6 moves above the electronic components housed in the tray 13 drawn out to the component suction position as shown in FIG. Then, the board recognition camera 4 images the surface of the electronic component (step S5).

  The captured image is recognized by the recognition processing device 53 and sent to the CPU 5 to check for component differences (step S6). That is, for example, characters (see FIG. 10A) of the recognized image are compared with characters on the surface of the electronic component taken out from the tray in the production model fetched from the RAM 51. As a result of component difference confirmation, when the captured and recognized character is equal to the character captured from the RAM, it is determined that the confirmation result is normal, and when the character is different, it is determined that the character is not normal (step S7). ).

  If the part confirmation result is normal, it is determined whether or not all parts used in the current production model have been checked (step S16). Here, when all of the components are not checked, the component library data of the electronic components used for the model of the board to be produced is extracted again, excluding the electronic components checked earlier (step S14). Then, based on the extracted electronic component library data, it is determined whether or not “part difference confirmation is to be performed” (step S15), and if the part difference confirmation is set to “perform”, the mounting head 6 is set to the tray 13. The board recognition camera 4 picks up an image of the surface of the electronic component that is housed in the storage area (step S5).

  The captured image is recognized by the recognition processing device 53 and sent to the CPU 5 to check for component differences (step S6). That is, for example, characters (see FIG. 10A) of the recognized image are compared with characters on the surface of the electronic component taken out from the tray in the production model fetched from the RAM 51. As a result of component difference confirmation, when the captured and recognized character is equal to the character captured from the RAM, it is determined that the confirmation result is normal, and when the character is different, it is determined that the character is not normal (step S7). ).

  Here, when the result of checking the component difference in step S7 is not normal, that is, the recognized character of the electronic component (see, for example, FIG. 10A) and the character captured from the RAM (for example, FIG. 10 (see (b)), as shown in FIG. 12, it is displayed on the monitor 55 that there is a component difference abnormality (step S10), and further, a component confirmation instruction is displayed on the monitor 55. It is displayed (step S11).

  The operator confirms the display on the monitor 55, replaces the tray 13 subject to component mistake with the tray 13 containing the correct electronic component, and switches the switch 552 for “confirm component difference” displayed on, for example, the monitor 55 in FIG. 14. When is pressed, the part difference confirmation from step S5 to step 7 is executed again.

  If it is determined in step S7 that the part difference confirmation is normal, the process proceeds to step S16, and it is determined whether or not all parts used in the current production model have been checked (step S16).

  If not all are checked, the process returns to step S14, the already checked electronic components are removed, and the component library data of the electronic components used for the type of board to be produced is extracted again (step S14). Then, based on the extracted component library data of the electronic component, it is determined whether or not “part difference confirmation is to be performed” (step S15). The tray 13 in which the electronic component to be checked is moved moves above the electronic component, and the substrate recognition camera 4 images the surface of the electronic component (step S5).

  In addition, before the mounting head 6 moves above the tray 13, the tray 13 storing the electronic component confirmed before and the tray 13 storing the electronic component confirmed this time are automatically switched.

  Thereafter, the operations from step S14 to step S16 are repeated in the same manner until all electronic components used for the production model are checked.

  Returning to step S14, the electronic component parts library data used for the type of board to be produced is extracted again, excluding the already checked electronic parts (step S14). Then, “whether or not to check for component differences” is determined from the component library data of the extracted electronic components (step S15). The component difference confirmation is set to “Yes”, and the electronic component to be checked is a component. In the case of the supply unit 5, the mounting head 6 moves above the electronic component at the electronic component extraction position of the component supply unit 5, and the board recognition camera 4 images the surface of the electronic component (step S5).

  If it is determined in step s16 that all electronic components used for the production model have been checked, the component difference check is terminated and normal production is started according to the pattern program data (step S17).

  In this way, when the production of the electronic component mounting apparatus is started, since all the electronic components used for the board to be produced are checked for differences in the parts, the wrong electronic parts are present on the board to be produced. It is possible to avoid mounting and to prevent the production of defective substrates.

  Furthermore, when checking the difference between parts, the characters of the image of the electronic component to be picked up are compared with the characters on the surface of the electronic component captured from the RAM, so that the correct electronic component and the wrong electronic component have the same shape. Even if it exists, the difference in parts can be confirmed more reliably.

  In the above-described embodiment, in order to determine the difference in characteristics or performance of the electronic component, different characters are attached to the upper surface (suction surface) of the electronic component as shown in FIGS. 10 (a) and 10 (b). However, as shown in (c) and (d) of FIG. 10, marks 77 and 78 having different shapes are attached to the electronic parts 75 and 76 having different characteristics or performance, and based on the difference between the marks. The difference in parts may be determined. Further, the difference in the characteristics or performance of the electronic component may be determined based on different logos of component manufacturers attached to the upper surface (suction surface) of the electronic component.

  Furthermore, “the operation for confirming the difference in components at the start of production when the model of the board to be produced is switched” shown in FIG. 13 and the “the operation for confirming the difference in components in the electronic component mounting apparatus at the start of production” shown in FIG. Both the “operation” and the “operation” may be performed by the electronic component mounting apparatus, or either one may be performed by the electronic component mounting apparatus, and the operator may appropriately select.

  While the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. , Including modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3A, 3B, 3C 1st component supply apparatus 3D 2nd component supply apparatus 4 Board | substrate recognition camera 7 Suction nozzle 13 Tray 41 Component storage part 43 Chamfering 50 CPU
51 RAM
55 Monitor 56 Touch panel switch

Claims (5)

In the electronic component mounting method of taking out and holding the electronic component stored in the component storage part of the component supply member arranged in the component supply device, and mounting it on the mounted member,
Before starting the operation of taking out the electronic component from the mounting member, characters and figures provided on the surface of the electronic component stored in the component storage unit are captured and recognized by the camera, and the recognized image is displayed. And determining whether or not the electronic component is correct based on the electronic component mounting method. In an electronic component mounting method in which an electronic component stored in a component storage portion of a component supply member arranged in a component supply device is held by a holding member and mounted on a mounted member.
When the holding member moves above the component storage unit to hold the electronic component stored in the component storage unit, characters and figures provided on the surface of the electronic component to be held are imaged by the camera. And determining whether or not the electronic component is correct based on the recognized image. Whether to perform a component difference confirmation operation for recognizing characters and figures provided on the surface of the electronic component to be held by imaging with a camera and determining whether the electronic component is correct based on the recognized image 3. The electronic component mounting method according to claim 1, wherein when the component difference confirmation operation is performed, the component difference confirmation operation is performed only for the set electronic component. When the production model of the mounted member is changed, the camera captures characters and figures provided on the surface of the electronic component that is stored in the component storage unit located in the component supply unit and used in the changed production model The electronic component mounting method according to claim 1, wherein the electronic component mounting method is recognized. In an electronic component mounting apparatus in which a holding member takes out and holds an electronic component from a plurality of component storage portions of a component supply member arranged in the component supply device, and is mounted on a substrate.
A camera for imaging characters or figures provided on the surface of the electronic component;
When the production model of the mounted member is changed, the type of the electronic component is determined based on the image captured by moving the camera upward of the component storage unit and the image data stored in the memory. An electronic component mounting apparatus comprising: a control device that controls the take-out member to take out the electronic component from the component storage unit when it is determined that the electronic component is correct.

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