JP5257415B2 - ELECTRONIC COMPONENT MOUNTING APPARATUS AND SUBSTITUTE UNIT EXCHANGE METHOD IN ELECTRONIC COMPONENT MOUNTING APPARATUS - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a substrate positioned by a substrate transport path, and a method for replacing a receiving unit in the electronic component mounting apparatus.

  The electronic component mounting apparatus positions a substrate at a predetermined position by a substrate conveyance path provided horizontally on a base, and picks up an electronic component supplied from a component supply unit provided on the base by a mounting head. Mount on the substrate positioned by the substrate transport path. The substrate transport path includes a transport conveyor that transports the substrate and a lower receiving unit that can be moved up and down below the transport conveyor, and supports the substrate positioned by the transport conveyor from the lower side ( For example, Patent Document 1). The lower receiving unit includes a large number of pin members extending upward from the upper surface of the plate-shaped pedestal, and each pin member can support the substrate while avoiding electronic components mounted on the lower surface side of the substrate. Thus, the arrangement is changed for each type of substrate to be supported.

  The base unit can be exchanged for its lifting and lowering means. When changing the pin arrangement of the base unit, the operator extends the hand from the outside of the base and changes the pin arrangement. After that, install the receiving unit. At this time, in order to make it easy for the operator to remove and attach the lower receiving unit from the lifting means, the lower receiving unit is raised to a height higher than the height at which the substrate is supported.

JP 2009-267038 A

  By the way, in recent years, there are two board transfer paths provided in parallel to each other on the base, and it is possible to perform component mounting simultaneously on a plurality of boards positioned by each board transfer path. Electronic component mounting apparatuses made into practical use have been put into practical use. In such an electronic component mounting apparatus having two board transfer paths, the operator is on the side closer to the operator because one side of both side positions of the bases facing each other across the two board transfer paths is a normal work place. Replacing the lower unit of the substrate transport path on the (front side) can be easily performed because the distance between the receiver unit and the operator is short, but the substrate transport path on the side farther from the operator (back side) Replacing the lower support unit is not easy because the distance between the lower support unit and the operator is increased, and may interfere with the lower support unit when removing the lower support unit. There was a problem that workability was sometimes poor.

  Here, regarding the replacement of the base unit of the substrate transport path far from the operator, it is possible that the operator moves from the front side of the base where the normal operation is performed to the back side of the base, and performs the work. In an electronic component mounting apparatus provided with two board conveyance paths, a component supply unit is usually installed on each side of the base opposite to each other across the two board conveyance paths. When the parts supply unit to be installed is large and cannot be moved easily like a tray feeder, the operator must replace both the front and back side receiving units on the front side of the base. I have to do it.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus and a method for replacing a receiving unit in an electronic component mounting apparatus that can easily replace a lower support unit of a board conveyance path.

  The electronic component mounting apparatus according to claim 1 is provided with a base, two board transport paths that are horizontally and parallel to each other on the base, and each transports a board and positions the board at a predetermined position. A component supply unit provided at each of both side positions of the base opposite to each other across the path, and a mounting head for picking up an electronic component supplied from the component supply unit and mounting it on a substrate positioned by each substrate transport path Each substrate transport path includes a transport conveyor that transports the substrate and a replaceable receiving unit that supports the substrate positioned by the transport conveyor from below. A first operating means that is operated when replacing the receiving unit provided in the near substrate transport path, and a substrate transport path farther from the operator of the two substrate transport paths. When the substrate is supported by the second operating means that is operated when replacing the lower receiving unit, and when the first operating means is operated, the lower receiving unit provided in the substrate transport path closer to the operator. When the first lower receiving unit lifting / lowering means for raising the first height higher than the first height and the second operating means are operated, the lower receiving unit provided in the substrate transport path far from the operator is provided with the first receiving unit. And a second lower receiving unit raising / lowering means for raising the height to a second height higher than the first height.

  3. A method of replacing a receiving unit in an electronic component mounting apparatus according to claim 2, wherein the base unit and the two substrate transport paths are provided on the base horizontally and parallel to each other, and each transports a substrate and positions it at a predetermined position. And a component supply unit provided on each side of the base opposite to each other across the two substrate conveyance paths, and a substrate picked up by electronic components supplied from the component supply unit and positioned by each substrate conveyance path In the electronic component mounting apparatus, each substrate transport path includes a transport conveyor that transports the substrate and a replaceable lower support unit that supports the substrate positioned by the transport conveyor from below. A method for replacing a receiving unit, in which, when replacing a receiving unit provided in a substrate transport path closer to an operator, of two substrate transport paths, A step of raising the receiving unit provided in the substrate transport path closer to the first position to a first height higher than the height at which the substrate is supported, and transporting the substrate farther from the operator of the two substrate transport paths A step of raising the lower unit provided in the substrate transport path farther from the operator to a second height higher than the first height when exchanging the lower unit provided in the path.

  In the present invention, when the operator replaces the lower unit provided in the substrate transport path on the side closer to the operator (front side) of the two substrate transport paths, the lower support unit is supported at the height when the substrate is supported. When the operator replaces the lower unit provided in the substrate transfer path farther from the operator (the back side) of the two substrate transfer paths, the lower support unit is moved to the first height higher than the first height. The operator raises the second unit to a second height that is higher than the height of the lower unit (first height) when replacing the lower unit provided in the substrate transport path closer to the operator. In addition to the receiving unit provided in the substrate transfer path closer to the operator, it is possible to easily replace the receiving unit provided in the substrate transfer path farther from the operator. Kill. In addition, this makes it difficult for a situation such as interfering with the near side receiving unit when the back side receiving unit is taken out, thereby improving workability.

The perspective view of the electronic component mounting apparatus in one embodiment of this invention The perspective view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention (A) Perspective view of substrate transport path provided in electronic component mounting apparatus in one embodiment of the present invention (b) Side view of substrate transport path in one embodiment of the present invention (A) Perspective view of substrate transport path provided in electronic component mounting apparatus in one embodiment of the present invention (b) Side view of substrate transport path in one embodiment of the present invention The block diagram which shows the control system of the electronic component mounting apparatus in one embodiment of this invention (A) (b) The side view of the board | substrate conveyance path in one embodiment of this invention The flowchart which shows the execution procedure of the component mounting process which the electronic component mounting apparatus in one embodiment of this invention performs The side view of the electronic component mounting apparatus in one embodiment of this invention

  Embodiments of the present invention will be described below with reference to the drawings. The electronic component mounting apparatus 1 shown in FIGS. 1, 2, and 3 mounts a component (electronic component) 4 on an electrode 3 provided on the surface of the substrate 2 while conveying the substrate 2 in the horizontal plane direction. This is an apparatus, and is connected to other component mounting apparatuses such as a screen printing machine, an inspection machine, and a reflow furnace (not shown) to constitute a component mounting line for mounting board production. Hereinafter, for convenience of explanation, the conveyance direction of the substrate 2 in the electronic component mounting apparatus 1 (the direction of the arrow A in FIGS. 1 and 2, the direction perpendicular to the paper surface in FIG. 3) is orthogonal to the X-axis direction and the X-axis direction. The horizontal plane direction is the Y-axis direction, the vertical direction is the Z-axis direction, the Y-axis direction is the front-rear direction of the electronic component mounting apparatus 1, and the X-axis direction is the lateral direction of the electronic component mounting apparatus 1.

  1, 2, and 3, the electronic component mounting apparatus 1 according to the present embodiment is installed on a base 12 covered with a main body cover 11 that forms an outline of the electronic component mounting apparatus 1, and the base 12. The front and rear two substrate transport paths 13 (front substrate transport path 13a and rear substrate transport path 13b) as a substrate transport section for transporting and positioning the substrate 2 in the horizontal plane direction (X-axis direction), the base 2 A plurality of tape feeders 14 and tray feeders 15 serving as a component supply unit that supplies components 4 are picked up and components 4 supplied from the tape feeders 14 and tray feeders 15 are picked up and positioned by the respective substrate transport paths 13. Two mounting heads 16 mounted on the substrate 2 are provided. The two mounting heads 16 are moved independently of each other with respect to the substrates 2 positioned by the respective substrate transport paths 13 by a head moving mechanism 17 composed of an XY robot attached to the base 12.

  4 (a) and 4 (b), the front and rear substrate transport paths 13 (the front substrate transport path 13a and the rear substrate transport path 13b) are provided horizontally and parallel to each other on the base 12, Each of the substrates 2 sent from other electronic component mounting apparatuses (not shown) on the upstream side is transported (carried in) and positioned at the center work position (position shown in FIG. 2) of the base 12, and the mounting head 16. The board 2 on which the component mounting process is performed is transported (unloaded) and sent to another electronic component mounting apparatus (not shown) on the downstream side.

  4 (a), 4 (b) and 5 (a), 5 (b), the substrate transport path 13 includes a pair of conveyor frames 21 provided on the base 12 so as to extend in the X-axis direction, and the pair. A pair of conveyors 22 that support both ends of the substrate 2 from below and convey the substrate 2, and a pair of conveyor frames 21 from the base 12 so as to sandwich the pair of conveyor frames 21 from both outsides. A lower receiving unit 24 that is provided below the pair of substrate end holding portions 23 provided upright and the pair of transport conveyors 22 and supports the substrate 2 positioned by the pair of transport conveyors 22 from below. It has.

  4 (a), 4 (b) and 5 (a), 5 (b), the substrate end holding portion 23 is provided outside the pair of transport conveyors 22 and is inward in the Y-axis direction (2 And a protruding portion 23a extending in the direction toward the middle portion of the two conveyors 22).

  4 (a) and 4 (b) and FIGS. 5 (a) and 5 (b), the receiving unit 24 supports the substrate 2 positioned by the pair of conveyors 22 from below, and has a plate-like shape. The lower end portions of the plurality of support pins 24b are inserted and attached to the upper surface of the pedestal portion 24a. Each of the lower receiving pins 24b is detachable from the pedestal portion 24a, and the mounting arrangement with respect to the pedestal portion 24a can be changed according to the type of the substrate 2 on which the component 4 is to be mounted.

  Two elevating mechanisms 26 (FIGS. 4A and 4B and FIGS. 5A and 5B) for elevating the respective receiving units 24 are provided on the upper portion of the base 12. Each elevating mechanism 26 includes an elevating cylinder 27 with the piston rod 27a facing upward, and a lower receiving unit mounting member 28 provided at the upper end of the piston rod 27a. The lower receiving unit mounting member 28 includes the lower receiving unit 24. It is attached detachably (changeable). For this reason, the entire lower receiving unit 24 can be moved up and down with respect to the base 12 by operating the elevating cylinder 27 with the lower receiving unit 24 attached to the lower receiving unit mounting member 28. Hereinafter, the lifting mechanism 26 provided in the front substrate transport path 13a is referred to as a front lifting mechanism 26a, and the lifting mechanism 26 provided in the rear substrate transport path 13b is referred to as a rear lifting mechanism 26b.

  4 (a) and 4 (b), when the lower receiving unit 24 is raised by the elevating cylinder 27, the upper ends of the plurality of lower receiving pins 24b provided on the pedestal portion 24a are placed on the lower surface of the substrate 2 from below. The both ends of the substrate 2 are clamped in the vertical direction by the protruding portions 23a of the pair of substrate end holding portions 23 and a plurality of lower receiving pins 24b, and are fixed to the substrate transport path 13, and the lower receiving pins 24b Thus, the lower surface is supported (FIGS. 5A and 5B).

  2 and 3, the head moving mechanism 17 includes a beam-shaped Y-axis table 17 a and a Y-axis table 17 a provided in the Y-axis direction so as to extend across the two front and rear substrate transport paths 13. And two front and rear beam-shaped X-axis tables 17b extending in the X-axis direction, and two front and rear plate-shaped moving stages 17c movably provided in the X-axis direction on each X-axis table 17b. Become. Each moving stage 17c is provided with the above-described mounting heads 16 each provided with a plurality of suction nozzles 16N extending downward and rotatable about a vertical axis (Z axis).

  2 and 3, each of the two front and rear moving stages 17c included in the head moving mechanism 17 is provided with a substrate camera 18 with the imaging field of view directed downward. A component camera 19 having an imaging field of view upward is provided in each of the regions on the base 12 facing each other.

  1, 2, and 3, the plurality of tape feeders 14 are located in front areas (at the operator OP work) of both ends of the base 12 facing each other across the two front and rear substrate transport paths 13 in the Y-axis direction. Are arranged side by side in the X-axis direction, and the component 4 is continuously supplied to the component supply port 14a provided at the end portion of the base 12 on the center portion side (substrate conveyance path 13 side). To do. The plurality of tape feeders 14 are held by a carriage Cg that can be run on the floor surface by the operator OP operating the pair of handle portions HD. The operator OP couples the carriage Cg to the base 12. Thus, a plurality of tape feeders 14 can be collectively mounted on the base 12.

  1, 2, and 3, the tray feeder 15 is opposed to the other side (the tape feeder 14) of both end regions of the base 12 that face each other in the Y-axis direction across the two front and rear substrate transport paths 13. To the side). The tray feeder 15 moves up and down a base 31 having a plurality of casters 31 a at the bottom, a magazine rack 32 provided at the rear of the upper surface of the base 31, and a region on the side facing the base 12 above the base 31. A table-like elevating member 33 provided freely, and a pallet moving member 34 (FIG. 3) provided slidably on the elevating member 33 in the horizontal direction are provided. A pair of handles 35 are erected on the upper portion of the magazine rack portion 32, and the operator OP operates the pair of handles 35 to move the tray feeder 15 on the floor surface, thereby causing the base of the electronic component mounting apparatus 1. It can be coupled to the base 12.

  In FIG. 3, a plurality of tray mounting pallets 36 arranged side by side in the vertical direction are accommodated in the magazine rack portion 32 so as to be insertable / removable in the horizontal direction. As shown in FIG. One or more trays 37 are placed on the pallet 36. Each tray 37 accommodates a number of components 4.

  The supply of the component 4 by the tray feeder 15 is performed after the elevating member 33 is positioned at the position (height) of the tray mounting pallet 36 on which the tray 37 containing the component 4 to be supplied is mounted. The tray mounting pallet 36 is pulled out onto the elevating member 33 by the pallet moving member 34, and the elevating member 33 is raised to a predetermined component supply height. Further, the tray 37 (tray placement pallet 36) for which the supply of the parts 4 has been returned is returned to the magazine rack portion 32 at the position (height) of the magazine rack portion 32 where the tray placement pallet 36 was originally placed. After the elevating member 33 is lowered, the tray placing pallet 36 is pushed out from the elevating member 33 into the magazine rack portion 32 by the pallet moving member 34.

  The substrate 2 is transported and positioned by each substrate transport path 13 in the substrate transport path drive unit 41 (see FIG. 6) including an actuator or the like not shown in the work execution control unit 40a (FIG. 6) of the control device 40 included in the electronic component mounting apparatus 1. The control device 40 drives the elevating mechanism 26 (elevating cylinder 27) to fix and release the substrate 2 from the substrate transport path 13 by the elevating operation of the receiving unit 24. This is done by controlling the operation of the elevating cylinder drive unit 42 including an actuator (not shown).

  The supply operation of the component 4 to the component supply port 14a by each tape feeder 14 is performed by the work execution control unit 40a of the control device 40 performing operation control of the tape feeder drive unit 43 (FIG. 6) including an actuator (not shown). Made. Each tape feeder 14 is electrically connected to the control device 40 in a state where the carriage Cg is coupled to the base 12, and the operation control of each tape feeder 14 by the control device 40 becomes possible.

  The raising / lowering operation of the raising / lowering member 33 of the tray feeder 15 is performed when the work execution control part 40a of the control apparatus 40 performs operation control of the table member raising / lowering drive part 44 (FIG. 6) which consists of an actuator etc. which are not shown in figure. Note that the tray feeder 15 is electrically connected to the control device 40 in a state of being coupled to the base 12, and the operation of the tray feeder 15 can be controlled by the control device 40.

  Movement operation of the pallet moving member 34 on the elevating member 33 (drawing operation of the tray mounting pallet 36 on the elevating member 33 by the pallet moving member 34 and movement of the tray mounting pallet 36 from the elevating member 33 by the pallet moving member 34 The pushing operation) is performed when the work execution control unit 40a of the control device 40 controls the operation of the pallet moving member driving unit 45 (FIG. 6) including an actuator (not shown).

  The movement operation of each mounting head 16 in the horizontal plane direction by the head moving mechanism 17 is performed by controlling the operation of the head moving mechanism driving unit 46 (FIG. 6) including an actuator or the like (not shown) by the work execution control unit 40 a of the control device 40. The head of each suction nozzle 16N is mounted by performing movement control of each X-axis table 17b with respect to the axis table 17a in the Y-axis direction and movement control of each movement stage 17c with respect to each X-axis table 17b in the X-axis direction). The operation of the control device 40 is controlled by an operation control of a nozzle drive unit 47 (FIG. 6) including an actuator (not shown). Further, the suction and detachment operation of the component 4 by each suction nozzle 16N is performed by the work execution control unit 40a of the control device 40 by controlling the operation of the vacuum pressure supply unit 48 (FIG. 6) including an actuator (not shown). This is done by supplying the vacuum pressure inside and releasing the supply of the vacuum pressure into the suction nozzle 16N.

  The imaging operation by the board camera 18 and the component camera 19 is performed when the work execution control unit 40a of the control device 40 controls the operation of the board camera 18 and the component camera 19 (FIG. 6). Image data obtained by the imaging operations of the board camera 18 and the component camera 19 is captured and stored in the image storage unit 49 (FIG. 6), and is image-recognized by the image recognition unit 40b (FIG. 6) included in the control device 40. The

  As shown in FIG. 6, the electronic component mounting apparatus 1 includes a front lower unit replacement switch 51 and a rear lower unit replacement switch 52 connected to the control device 40, and the control device 40 replaces the front lower unit. When the switch 51 is operated, the front elevating mechanism 26a is actuated so that the lower receiving unit 24 included in the front substrate transport path 13a is higher than the height H0 when the substrate 2 is supported (FIG. 7A). The height is raised to a high first height H1 (FIG. 7B).

  On the other hand, when the rear support unit replacement switch 52 is operated, the control device 40 operates the rear elevating mechanism 26b so that the lower substrate transport path 13b includes the lower support unit 24 included in the rear substrate transport path 13a. It raises to 2nd height H2 (FIG.7 (b)) higher than the height (1st height H1) of the receiving unit 24 when replacing the provided receiving unit 24. FIG.

  Next, the procedure of the component mounting process on the board 2 executed by the electronic component mounting apparatus 1 in the present embodiment will be described. When the control device 40 of the electronic component mounting apparatus 1 detects that the substrate 2 sent from the other component mounting device (for example, a screen printing machine) on the upstream side is input to the substrate transfer path 13, the substrate transfer is performed. The substrate 13 is loaded by operating the path 13 (substrate loading step of step ST1 shown in FIG. 8). After positioning the substrate 2 to the working position, the support unit 24 is raised to Both ends are sandwiched between the protruding portions 23a of the pair of substrate end holding portions 23 and the lower surface of the substrate 2 is supported by the receiving pins 24b (the substrate holding in step ST2 shown in FIG. 8). Process).

  When the substrate 2 is in the holding state, the control device 40 moves the substrate camera 18 (the mounting head 16) above the substrate 2 and images a substrate mark (not shown) provided on the substrate 2. Then, by causing the image recognition unit 40b to recognize the obtained image, the positional deviation of the substrate 2 from the normal work position is obtained.

  After positioning the substrate 2, the control device 40 moves the mounting head 16 above the tape feeder 14, and makes the suction nozzle 16 </ b> N of the mounting head 16 contact the component 4 supplied to the component supply port 14 a of the tape feeder 14. At the same time, the vacuum pressure is supplied to the suction nozzle 16N by controlling the operation of the vacuum pressure supply unit 48, and the component 4 is picked up (sucked) by the suction nozzle 16N (pickup process of step ST3 shown in FIG. 8). .

  When the component 4 is picked up by the suction nozzle 16N, the control device 40 moves the mounting head 16 so that the picked-up component 4 passes above the component camera 19, and the component camera 19 images the component 4. Then, the obtained image is image-recognized by the image recognizing unit 40b to inspect for the presence or absence of abnormality (deformation, defect, etc.) of the component 4, and to determine the positional deviation (adsorption deviation) of the component 4 relative to the adsorption nozzle 16N ( Image recognition step in step ST4 shown in FIG.

  When the image recognition process of step ST4 is completed, the control device 40 controls the operation of the head moving mechanism driving unit 46, and moves the mounting head 16 so that the component 4 picked up by the suction nozzle 16N moves above the substrate 2. Let Then, the control device 40 controls the operation of the nozzle drive unit 47 to place the picked-up component 4 on the target mounting position on the substrate 2 (on the electrode 3 at the target mounting position, upstream of the electronic component mounting device 1). The solder is printed by a screen printing machine disposed on the side), and the vacuum pressure supply to the suction nozzle 16N is canceled by controlling the operation of the vacuum pressure supply unit 48, and the component 4 is mounted on the substrate. 2 (part mounting step of step ST5 shown in FIG. 8).

  Here, when mounting the component 4 on the substrate 2, the control device 40 detects the positional deviation of the substrate 2 obtained when the substrate 2 is positioned in step ST2 and the component 4 obtained during image recognition of the component 4 in step ST4. Position correction (including rotation correction) of the suction nozzle 16N with respect to the substrate 2 is performed so that the suction deviation is corrected.

  When the mounting of the component 4 on the substrate 2 is completed, the control device 40 determines whether or not the mounting of all the components 4 to be mounted on the substrate 2 is completed by the mounting head 16 (step shown in FIG. 8). ST6 wearing end determination step). As a result, when the mounting of all the components 4 to be mounted on the board 2 by the mounting head 16 has not been completed, the control device 40 repeats the steps ST3 to ST5 and mounts by the mounting head 16. When all the components 4 to be mounted on the board 2 have been mounted, the board transport path 13 is operated to carry the board 2 out of the electronic component mounting apparatus 1 (in step ST7 shown in FIG. 8). Substrate unloading process).

  When the board unloading process in step ST7 is completed, the control device 40 determines whether or not there is still a board 2 on which the component 4 is to be mounted (step ST8 presence determination process in step ST8 shown in FIG. 8). As a result, when there is a board 2 on which the component 4 is mounted, the control device 40 returns to step ST1 to carry in a new board 2 and when there is no board 2 on which the component 4 is mounted. A series of electronic component mounting processes are completed.

  In the electronic component mounting apparatus 1 having such a configuration, the substrate 2 on which the component 4 has been mounted is turned upside down (that is, the surface of the substrate 2 on which the component 4 is already mounted is directed downward). There is a case where the component 4 is carried in from the substrate conveyance path 13 (in the state of being turned over), and the component 4 is mounted using the surface on the upper side of the substrate 2 as the mounting surface of the new component 4. In such a case, the lower receiving unit 24 is placed under the lifting mechanism 26 so that the lower receiving pins 24b included in the lower receiving unit 24 do not come into contact with the component 4 mounted on the lower surface of the substrate 2. After removing from the receiving unit mounting member 28 and changing the arrangement of the lower receiving pins 24b in the pedestal portion 24a, it is necessary to replace the lower receiving unit 24 to be attached to the lower receiving unit mounting member 28 again. .

  In the replacement operation of the lower receiving unit 24, when the operator OP replaces the lower receiving unit 24 provided in the substrate transfer path 13 (front substrate transfer path 13a) on the side close to the operator OP, the above-described front lower portion is provided. The receiving unit exchange switch 51 is operated. When the control device 40 detects that the front receiving unit replacement switch 51 has been operated by the operator OP, the control device 40 operates the front elevating mechanism 26a so that the lower receiving unit 24 provided in the front substrate transfer path 13a is attached to the substrate 2. It raises to 1st height H1 higher than the height H0 when supporting (FIG.7 (b). Front lower receiving unit raising process). Thus, the operator OP is provided by raising the lower receiving unit 24 included in the front substrate transport path 13a to a height (first height H1) higher than the height H0 when the substrate 2 is supported. Can easily remove and reattach the lower receiving unit 24 provided in the front substrate transport path 13a on the front side (side closer to the operator OP).

  On the other hand, when the operator OP replaces the lower receiving unit 24 provided in the substrate transfer path 13 (rear substrate transfer path 13b) on the side far from the operator OP, the operator OP operates the rear lower unit replacement switch 52 described above. Do. When the control device 40 detects that the rear receiving unit replacement switch 52 has been operated by the operator OP, the control device 40 operates the rear elevating mechanism 26b so that the lower receiving unit 24 included in the rear substrate transport path 13b is moved to the front substrate. It raises to 2nd height H2 higher than the height (1st height H1) of the receiving unit 24 when replacing the receiving unit 24 with which the conveyance path 13a is equipped (FIG.7 (b). Back). Lowering unit raising process). In this way, the lower receiving unit 24 included in the rear substrate transport path 13b is higher than the height H0 when the substrate 2 is supported, and further, the lower receiving unit 24 included in the front substrate transport path 13a is replaced. When the operator OP is raised to a second height H2 that is higher than the height (first height H1) of the receiving unit 24 when performing, the operator OP is located behind the back side (the side far from the operator OP). It is possible to easily remove and reattach the receiving unit 24 provided in the substrate transfer path 13b.

  FIG. 9 shows a lower receiving unit included in the front substrate transport path 13a when the replacement of the lower support unit 24 included in the front substrate transport path 13a and the replacement of the lower support unit 24 included in the rear substrate transport path 13b are performed simultaneously. 24 shows a state in which the lower receiving unit 24 provided in the rear substrate transport path 13b is raised to the second height H2 while being raised to the first height H1. Note that the replacement of the lower receiving unit 24 included in the front substrate transport path 13a and the replacement of the lower receiving unit 24 included in the rear substrate transport path 13b are not necessarily performed simultaneously.

  As described above, the electronic component mounting apparatus 1 according to the present embodiment is configured to transport the board closer to the operator OP among the two board transport paths 13 (the front board transport path 13a and the rear board transport path 13b). A front receiving unit replacement switch 51 (first operating means) that is operated when exchanging the lower receiving unit 24 included in the path (front substrate transporting path 13 a) and an operator out of the two substrate transporting paths 13. A rear lower unit exchange switch 52 (second operating means) operated when replacing the lower receiving unit 24 provided in the substrate conveying path (back substrate conveying path 13b) far from the OP, and a front lower receiving When the unit exchange switch 51 is operated, the lower unit 24 provided in the substrate transport path 13 (front substrate transport path 13a) on the side close to the operator OP is mounted on the substrate 2. When the front elevating mechanism 26a (first lower receiving unit elevating means) for raising the first elevating mechanism 26a to the first height H1 higher than the holding height H0 and the rear lower receiving unit replacement switch 52 are operated, the operator OP The rear elevating mechanism 26b (the second lifting mechanism 26b) that raises the lower receiving unit 24 included in the substrate conveying path 13 (rear substrate conveying path 13b) far from the second height H2 higher than the first height H1. It is provided with a lowering unit elevating means).

  Moreover, the base unit replacement method in the present embodiment is a base unit replacement method in the electronic component mounting apparatus 1 in the present embodiment, and the board transport on the side closer to the operator OP in the two board transport paths. When the lower receiving unit 24 provided in the path 13 (front substrate transfer path 13a) is replaced, the lower unit 24 provided in the substrate transfer path 13 (front substrate transfer path 13a) on the side close to the operator OP is replaced with the substrate 2 And a substrate transport path 13 on the side farther from the operator OP out of the two substrate transport paths 13, a process of raising the first height H 1 higher than the height H 0 when supporting the substrate (a front receiving unit ascent process). When replacing the receiving unit 24 included in the (rear substrate transport path 13b), the substrate transport path 13 (the rear substrate transport path 13b on the side far from the operator OP) is replaced. And a lower receiving unit 24, so as including the step of raising high to a second height H2 than the first height H1 (rear lower receiving unit increasing step) provided in the.

  According to the electronic component mounting apparatus 1 and the receiving unit replacement method in the electronic component mounting apparatus 1 according to the present embodiment, the operator OP is provided with the board transfer path 13 (front board transfer path 13a) closer to the operator OP. Since not only the lower receiving unit 24 but also the lower receiving unit 24 included in the board transfer path 13 (the rear board transfer path 13b) on the side far from the operator OP can be easily replaced, the side far from the operator OP (back) Side) When the support unit 24 is taken out, a situation such as interference with the support unit 24 on the side close to the operator OP (near side) hardly occurs, and workability can be improved.

  In particular, in the case of the tray feeder 15 in which the component supply unit installed behind the base 12 is large and cannot be easily moved as in the case of the present embodiment, the operator OP is in front of the base 12. The effect is very great because work must be done from the side.

  Although the embodiment of the present invention has been described so far, the present invention is not limited to the above. For example, in the above-described embodiment, the component supply unit provided at each of the both side positions of the base 12 facing each other across the two substrate transport paths 13 is a combination of the tape feeder 14 and the tray feeder 15. The apparatus constituting the component supply unit is not limited to the tape feeder 14 and the tray feeder 15. In the above-described embodiment, the number of mounting heads 16 is two, but the number of mounting heads 16 is not particularly limited.

  Provided are an electronic component mounting apparatus and a method for replacing a receiving unit in an electronic component mounting apparatus that can easily replace a lower receiving unit of a board conveyance path.

1 Electronic component mounting device 2 Substrate 4 Component (electronic component)
12 base 13 substrate transport path 13a front substrate transport path (substrate transport path closer to the operator)
13b Rear substrate conveyance path (substrate conveyance path far from the operator)
14 Tape feeder (component supply unit)
15 Tray feeder (part supply unit)
Reference Signs List 16 Mounting head 22 Conveyor 24 Lower receiving unit 26a Front lifting mechanism (first lowering unit lifting means)
26b Rear elevating mechanism (second lowering unit elevating means)
51 Front lower unit replacement switch (first operation means)
52 Rear lower unit replacement switch (second operating means)
H0 Height when supporting the substrate H1 First height H2 Second height

Claims (2)

A base, two substrate transport paths that are horizontally and parallel to each other on the base, each transporting a substrate and positioning it at a predetermined position; Each of the substrate transport paths includes a component supply section and a mounting head that picks up electronic components supplied from the component supply section and mounts them on a substrate positioned by each substrate transport path. A transfer conveyor and a replaceable receiving unit that supports the substrate positioned by the transfer conveyor from below,
Of the two substrate transport paths, a first operating means that is operated when replacing the receiving unit provided in the substrate transport path closer to the operator;
Of the two substrate transport paths, a second operating means that is operated when replacing the receiving unit provided in the substrate transport path far from the operator;
When the first operating means is operated, the first lower receiving unit is moved up and down to raise the lower receiving unit provided in the substrate transport path closer to the operator to a first height higher than the height at which the substrate is supported. Means,
Second lower receiving unit raising / lowering means for raising the lower receiving unit provided in the substrate transport path far from the operator to a second height higher than the first height when the second operating means is operated; An electronic component mounting apparatus comprising: A base, two substrate transport paths that are horizontally and parallel to each other on the base, each transporting a substrate and positioning it at a predetermined position, and both positions on both sides of the base facing each other across the two substrate transport paths Each of the substrate transport paths includes a component supply section and a mounting head that picks up electronic components supplied from the component supply section and mounts them on a substrate positioned by each substrate transport path. A support unit replacement method in an electronic component mounting apparatus comprising a transport conveyor and a replaceable base unit that supports a substrate positioned by the transport conveyor from below,
Of the two substrate transport paths, when replacing the support unit provided in the substrate transport path closer to the operator, the height of the support unit provided in the substrate transport path closer to the operator is higher than the height when the substrate is supported. Increasing to a higher first height,
Of the two substrate transport paths, when replacing the base unit provided in the board transport path far from the operator, the base unit provided in the board transport path far from the operator is higher than the first height. A method of replacing the receiving unit in the electronic component mounting apparatus, comprising the step of raising the height to the second height.

Images