JP2006120846A - Electronic component mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus which can reduce damaging the window member of a light emitter and a light receiver for detecting an electronic component. <P>SOLUTION: The electronic component mounting apparatus 1 detects the posture of the electronic component D arranged in an optical path which goes from the light emitter 5a to the light receiver 5b of a laser recognition unit 5 by means of the laser recognition unit 5, and then mounts the electronic component D held by a suction nozzle 6a on a substrate P according to the detected posture of the electronic component D. The window members W arranged on the light emitting surface of the light emitter 5a and on the light receiving surface of the light receiver 5b are applied with protection members (for example, a cover member 8 and a guard member 9) for preventing something from coming into contact with the electronic component D held by the suction nozzle 6a. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component mounting apparatus.

Conventionally, as an apparatus for mounting electronic components on a substrate, an electronic component in which a plurality of electronic components supplied by a component supply unit are sucked by a suction nozzle provided in a mounting head, transferred to a substrate, mounted, and mounted A mounting device is known.
Such an electronic component mounting apparatus is known to include a laser recognition unit having a light emitting unit that emits laser light and a light receiving unit that receives laser light (see, for example, Patent Documents 1 and 2). .
In this electronic component mounting apparatus, as shown in FIG. 11, the suction nozzle 6a is in the optical path of laser light from the light emitting part 5a to the light receiving part 5b while the light emitting part 5a and the light receiving part 5b face each other. The electronic component D held by suction is arranged, and the suction posture of the electronic component D is detected based on detecting the shadow of the electronic component D while rotating the suction nozzle 6a around the nozzle axis. ing.
JP-A-7-183694 JP 2000-59099 A

However, in the case of the above-mentioned Patent Document 1, when the suction nozzle 6a that holds the electronic component D eccentrically rotates around the nozzle axis, as shown in FIG. The light emitting portion 5a and the light receiving portion 5b may come into contact with the window member W, and the window member W may be damaged. If the window member W is scratched, an optical problem may be caused to the laser light transmitted through the window member W, and the detection accuracy of the suction posture of the electronic component D is deteriorated. There was a problem.
In addition, since the laser recognition unit needs to be precise, it is necessary to prevent dust and the like from entering the inside thereof, so that there is a problem that the operation of replacing the window member W cannot be easily performed.

  The objective of this invention is providing the electronic component mounting apparatus which reduces that the window member of the light emission part for detecting an electronic component, or a light-receiving part gets damaged.

  In order to solve the above problems, an invention according to claim 1 includes a suction nozzle that holds an electronic component at a tip, a light emitting unit that irradiates predetermined light to the electronic component held by the suction nozzle, and the light emitting unit. An optical detection means for detecting the posture in which the electronic component is held by the suction nozzle, and a light receiving portion that receives the light emitted by the light emitting portion and is disposed at a position opposite to the suction nozzle. Nozzle moving means for moving the nozzle and placing an electronic component held by the suction nozzle in an optical path of light from the light emitting portion to the light receiving portion in the optical detecting means, and the electrons detected by the optical detecting means An electronic component mounting apparatus for mounting an electronic component held by a suction nozzle on a substrate in accordance with the orientation of the component, wherein the suction member is attached to a window member disposed on the light emitting surface of the light emitting unit and the light receiving surface of the light receiving unit. Retained Characterized in that it comprises a protective member so as not to contact the child component.

According to the first aspect of the present invention, the attitude of the electronic component disposed in the optical path of the light traveling from the light emitting unit to the light receiving unit of the optical detection unit is detected by the optical detection unit, and the detected electronic component is detected. In the electronic component mounting apparatus that mounts the electronic component held by the suction nozzle on the substrate according to the posture of the light, the suction nozzle holds the light emitting surface of the light emitting unit and the window member disposed on the light receiving surface of the light receiving unit. Since the protective member that prevents the electronic component from contacting is provided, the electronic component does not contact the window member and damage the window member.
Therefore, it can be said that the electronic component mounting apparatus provided with this protective member is an electronic component mounting apparatus that can reduce the damage to the window member of the light emitting unit and the light receiving unit for detecting the electronic component.

  According to a second aspect of the present invention, in the electronic component mounting apparatus according to the first aspect, the protective member is a cover member having light transmittance, which is detachably provided on the front surface of the window member.

According to the invention described in claim 2, the cover member having the same function as that of the invention described in claim 1 and having light permeability as the protection member is detachably provided on the front surface of the window member. Therefore, even if the electronic component held by the suction nozzle may come into contact with the light emitting surface of the light emitting portion of the optical detection means or the light receiving surface of the light receiving portion, the electronic component contacts the cover member. Therefore, the electronic component does not come into contact with the window member disposed in the light emitting unit or the light receiving unit.
That is, what is damaged when the electronic component comes into contact is a cover member, and the window member is not damaged.
Therefore, it can be said that the electronic component mounting apparatus provided with this cover member is an electronic component mounting apparatus that can reduce the damage to the window member of the light emitting unit and the light receiving unit for detecting the electronic component.

  And even if the electronic component comes into contact with the cover member and the cover member may be damaged, the cover member is detachably provided on the front surface of the window member of the light emitting part or the light receiving part. The cover member can be easily replaced. In particular, the replacement work can be easily performed as compared with the replacement of the light emitting portion of the optical detection means and the window member of the light receiving portion.

  According to a third aspect of the present invention, in the electronic component mounting apparatus according to the second aspect, the protective member is formed by laminating a plurality of cover members.

  According to the invention described in claim 3, the same effect as that of the invention described in claim 2 is achieved, and the protective member is formed by stacking a plurality of cover members, so that the cover member damaged on the surface side is removed. Therefore, since it can be set as a new cover member, a cover member can be replaced | exchanged more easily.

  According to a fourth aspect of the present invention, in the electronic component mounting apparatus according to the first aspect, the protective member is spanned between the light emitting unit side and the light receiving unit side of the optical detection means, and the axial center of the suction nozzle Is a guard member formed with a circular opening having a diameter approximately equal to the distance between the window member of the light emitting unit and the window member of the light receiving unit facing each other, and is moved by the nozzle moving means. When the electronic component held by the suction nozzle is arranged in the optical path, the guard member is characterized in that the electronic component contacting the guard member does not pass through the opening.

According to the invention described in claim 4, while having the same effect as the invention described in claim 1, the protective member is stretched between the light emitting unit side and the light receiving unit side in the optical detection means, This is a guard member in which a circular opening having a diameter substantially equal to the distance between the window member of the light emitting unit and the window member of the light receiving unit is formed centering on a position corresponding to the axis center of the suction nozzle.
If the guard member has an opening having such a shape, the guard member contacts the guard member when the electronic component held by the suction nozzle moved by the nozzle moving means is placed in the optical path. It is possible to prevent the electronic component from passing through the opening.

Thus, the electronic component that contacts the guard member when passing through the opening of the guard member is in an arrangement that contacts the light emitting portion of the optical detection means or the window member of the light receiving portion. If the electronic component is removed from the suction nozzle before it is placed in the optical path of the light, the electronic component may come into contact with the window member of the light detecting unit or the light receiving unit of the optical detection means and damage the window member. Absent.
In addition, the electronic component that has passed through the opening of the guard member does not come into contact with the light emitting portion of the optical detection means or the window member of the light receiving portion, and the window member is not damaged.
Therefore, it can be said that the electronic component mounting apparatus including the guard member is an electronic component mounting apparatus that can reduce the damage to the window member of the light emitting unit and the light receiving unit for detecting the electronic component.

  According to a fifth aspect of the present invention, in the electronic component mounting apparatus according to the fourth aspect of the present invention, the guard member is formed with a plurality of circular openings corresponding to the plurality of suction nozzles, and a connection opening is formed to be integrated. It is characterized by being.

According to the fifth aspect of the present invention, the same effect as that of the fourth aspect of the invention can be obtained, and the guard member has a connection opening in which a plurality of circular openings corresponding to the plurality of suction nozzles are continuous and integrated. The part is formed. The connection opening is centered at a position corresponding to the axial center of the suction nozzle, and a circular opening having a diameter substantially equal to the distance between the window member of the light emitting unit and the window member of the light receiving unit is connected. Since it is an integrated opening, this guard member can prevent electronic components that are in contact with the light emitting part of the optical detection means or the window member of the light receiving part from being arranged in the optical path. .
Therefore, it can be said that the electronic component mounting apparatus including the guard member is an electronic component mounting apparatus that can reduce the damage to the window member of the light emitting unit and the light receiving unit for detecting the electronic component.

  According to a sixth aspect of the present invention, in the electronic component mounting apparatus according to the fourth or fifth aspect, a cover member having optical transparency is detachably provided on the front surface of the window member.

  According to the invention described in claim 6, an electronic component that has the same effect as that of the invention described in claim 4 or 5 and that is in contact with the light emitting part of the optical detection means or the window member of the light receiving part is provided. Is not disposed in the optical path between the light emitting unit and the light receiving unit, and the cover is provided on the front surface of the light emitting surface of the light emitting unit and the light receiving surface of the light receiving unit to cover the window member. By using the member together, it becomes difficult for the electronic component to come into contact with the light emitting part of the optical detection means or the window member of the light receiving part, and it is possible to further reduce the damage to the window member.

According to the first aspect of the present invention, the attitude of the electronic component disposed in the optical path of the light traveling from the light emitting unit to the light receiving unit of the optical detection unit is detected by the optical detection unit, and the detected electronic component is detected. In the electronic component mounting apparatus that mounts the electronic component held by the suction nozzle on the substrate according to the posture of the light, the suction nozzle holds the light emitting surface of the light emitting unit and the window member disposed on the light receiving surface of the light receiving unit. Since the protective member that prevents the electronic component from contacting is provided, the electronic component does not contact the window member and damage the window member.
Therefore, it can be said that the electronic component mounting apparatus provided with this protective member is an electronic component mounting apparatus that can reduce the damage to the window member of the light emitting unit and the light receiving unit for detecting the electronic component.

According to the second aspect of the present invention, since the cover member having light transmittance as the protective member is detachably provided on the front surface of the window member, the electronic component held by the suction nozzle is optically Even if the light-emitting surface of the light-emitting unit of the detection means or the light-receiving surface of the light-receiving unit may come in contact with the cover member, the electronic component is placed on the light-emitting unit or light-receiving unit. There is no contact with the installed window member. That is, what is damaged when the electronic component comes into contact is a cover member, and the window member is not damaged.
Therefore, it can be said that the electronic component mounting apparatus provided with this cover member is an electronic component mounting apparatus that can reduce the damage to the window member of the light emitting unit and the light receiving unit for detecting the electronic component.
And even if the electronic component comes into contact with the cover member and the cover member may be damaged, the cover member is detachably provided on the front surface of the window member of the light emitting part or the light receiving part. The cover member can be easily replaced. In particular, the replacement work can be easily performed as compared with the replacement of the light emitting portion of the optical detection means and the window member of the light receiving portion.

  According to the invention described in claim 3, since the cover member is formed by laminating a plurality of cover members, the cover member can be formed as a new cover member by removing the cover member damaged on the surface side. Can be replaced more easily.

According to the fourth aspect of the present invention, the protection member is spanned between the light emitting part side and the light receiving part side in the optical detection means, and is centered on a position corresponding to the axial center of the suction nozzle and emits light. This is a guard member in which a circular opening having a diameter substantially equal to the distance between the window member of the light receiving portion and the window member of the light receiving portion is formed. If the guard member has an opening having such a shape, the guard member contacts the guard member when the electronic component held by the suction nozzle moved by the nozzle moving means is placed in the optical path. It is possible to prevent the electronic component from passing through the opening.
Thus, the electronic component that contacts the guard member when passing through the opening of the guard member is in an arrangement that contacts the light emitting portion of the optical detection means or the window member of the light receiving portion. If the electronic component is removed from the suction nozzle before it is placed in the optical path of the light, the electronic component may come into contact with the window member of the light detecting unit or the light receiving unit of the optical detection means and damage the window member. Absent. In addition, the electronic component that has passed through the opening of the guard member does not come into contact with the light emitting portion of the optical detection means or the window member of the light receiving portion, and the window member is not damaged.
Therefore, it can be said that the electronic component mounting apparatus including the guard member is an electronic component mounting apparatus that can reduce the damage to the window member of the light emitting unit and the light receiving unit for detecting the electronic component.

According to the fifth aspect of the present invention, the guard member is formed with a connection opening portion in which a plurality of circular opening portions corresponding to the plurality of suction nozzles are connected and integrated. The connection opening is centered at a position corresponding to the axial center of the suction nozzle, and a circular opening having a diameter substantially equal to the distance between the window member of the light emitting unit and the window member of the light receiving unit is connected. Since it is an integrated opening, this guard member can prevent electronic components that are in contact with the light emitting part of the optical detection means or the window member of the light receiving part from being arranged in the optical path. .
Therefore, it can be said that the electronic component mounting apparatus including the guard member is an electronic component mounting apparatus that can reduce the damage to the window member of the light emitting unit and the light receiving unit for detecting the electronic component.

  According to the sixth aspect of the present invention, electronic components that are in contact with the light emitting portion of the optical detection means or the window member of the light receiving portion are not placed in the optical path between the light emitting portion and the light receiving portion. By using together the guard member to be used and the cover member that is provided on the front surface of the light emitting surface of the light emitting portion of the optical detecting means and the light receiving surface of the light receiving portion and covers the window member, the electronic component emits light from the optical detecting means. It becomes difficult to touch by the window member of a part and a light-receiving part, and it can further reduce that a window member is damaged.

Hereinafter, embodiments of the present invention will be described in detail.
An electronic component mounting apparatus according to the present invention is an apparatus for mounting an electronic component supplied by a component supply unit (electronic component feeder) at a predetermined position on a substrate.
Here, in the electronic component mounting apparatus, the direction in which the substrate P is conveyed from the previous process to the subsequent process is defined as the X-axis direction, and one direction orthogonal thereto is defined as the Y-axis direction, and both the X-axis direction and the Y-axis direction. The direction orthogonal to is defined as the Z-axis direction.

(Embodiment 1)
FIG. 1 is a perspective view of the electronic component mounting apparatus 1, and FIG. 2 is a block diagram showing a main part configuration of the electronic component mounting apparatus 1.
As shown in FIGS. 1 and 2, the electronic component mounting apparatus 1 transports a base 2 on which each component member is placed on the upper surface and a substrate P from the previous process to the subsequent process along the X-axis direction. Substrate transport means 3, component supply unit 4 for supplying electronic component D, mounting head 6 for mounting electronic component D supplied by component supply unit 4 on substrate P, and mounting head 6 for each of the X and Y axes Head moving means 7 that moves in the direction, an input unit 11 that inputs various data and operation instructions, a display unit 12 that displays various data and operation status of the apparatus, and a control unit that controls the operation of each of the above units 10 mag.

The substrate transport means 3 includes a transport belt (not shown) in the substrate transport path extending in the X-axis direction, and transports the substrate P along the substrate transport path from the pre-process side to the post-process side.
Moreover, since the board | substrate conveyance means 3 mounts the electronic component D on the board | substrate P with the mounting head 6, it stops conveyance of the board | substrate P in a predetermined component mounting position, and also supports the board | substrate P.
The substrate transport path is provided with a substrate detection sensor 3a for detecting the substrate P transported by the substrate transport means 3, and the detection signal detected by the substrate detection sensor 3a is the control unit 10 (CPU 10a). ) Is output.

  The component supply unit 4 includes a plurality of electronic component feeders that convey electronic components arranged in a feeder bank on the upper surface of the base 2, and is provided on the side of the substrate conveying means 3.

  The mounting head 6 is provided on a beam member 72 to be described later, and a predetermined number (in this embodiment, one) of suction nozzles 6a protruding downward (in the Z-axis direction) and a nozzle movement for moving the suction nozzle 6a. Means 6b and a laser recognition unit 5 as optical detection means for detecting the posture of the electronic component D held by the suction nozzle 6a.

The laser recognition unit 5 includes a light emitting unit 5a that outputs laser light, which is predetermined light, and a light receiving unit 5b that receives the laser light output from the light emitting unit 5a.
The light receiving unit 5b is configured by, for example, a CCD line sensor, and is disposed at a position facing the light emitting unit 5a with the suction nozzle 6a interposed therebetween so as to receive the laser beam output from the light emitting unit 5a. It has become.
The laser recognizing unit 5 irradiates the electronic component D arranged in the optical path of the laser beam from the light emitting unit 5a to the light receiving unit 5b with the light emitting unit 5a irradiating the laser beam, and the laser light reaching the light receiving unit 5b The posture of the electronic component D held by the suction nozzle 6a is detected by the light receiving unit 5b detecting the shadow of the laser beam blocked by the electronic component D.
Note that processing and operation when the laser recognition unit 5 detects the attitude of the electronic component D held by the suction nozzle 6a are well-known techniques and will not be described in detail here.

And as shown in FIG. 3, the cover member 8 which is a protection member is provided in the light emission surface of the light emission part 5a of the laser recognition unit 5, and the front surface of the window member W arrange | positioned at the light reception surface of the light-receiving part 5b. It has been.
The cover member 8 is a plate-like member made of a light transmissive material such as glass, acrylic resin, or plastic, and is detachably provided on the front surface of the window member W of the light emitting unit 5a or the light receiving unit 5b.
For example, the cover member 8 is provided by being attached to the front side of the window member W of the light emitting unit 5a or the light receiving unit 5b with a double-sided tape. At this time, a double-sided tape is attached to a surface other than the surface through which the laser beam is transmitted.

The suction nozzle 6a is connected to, for example, an air suction means (not shown), and by passing vacuum air through a through hole (not shown) formed in the suction nozzle 6a, an electronic component is attached to the tip portion which is the lower end of the suction nozzle 6a. D can be adsorbed and held. Further, the air suction means is provided with a solenoid valve (not shown), the vacuum air can be switched by the solenoid valve, and the air suction means can be switched between the air suction state and the air release state. . That is, when the air suction state is set, the vacuum component is allowed to pass through the through hole so that the electronic component D can be sucked, and when the air release state is set, the inside of the through hole of the suction nozzle 6a is set to the atmospheric pressure state. Release adsorption.
The suction nozzle 6a is detachably provided so that it can be exchanged according to the size, shape, and type of the electronic component D to be sucked and held.

The nozzle moving means 6b includes a Z-axis moving means (not shown) that moves the suction nozzle 6a in the Z-axis direction, and a θ-axis rotation means (not shown) that rotates the suction nozzle 6a around the nozzle axis. The nozzle axis has substantially the same axial direction as the Z axis.
The Z-axis moving means (not shown) is provided on the mounting head 6 and moves the suction nozzle 6a in the Z-axis direction. The suction nozzle 6a passes through the Z-axis moving means in the Z-axis direction. The mounting head 6 is provided so as to be freely movable. As the Z-axis moving means, for example, a combination of a servo motor and a belt, a combination of a servo motor and a ball screw, or the like can be applied.
The θ-axis rotating means (not shown) is a rotation driving means that is provided on the mounting head 6 and rotates the suction nozzle 6a around the nozzle axis. The suction nozzle 6a is a nozzle that passes through the θ-axis rotating means. The mounting head 6 is provided so as to be rotatable about an axis. The θ-axis rotating means includes, for example, an angle adjustment motor and an encoder that detects the amount of rotation angle of the angle adjustment motor.

Then, the suction nozzle 6a that sucks and holds the electronic component D is moved by the Z-axis moving means (not shown) of the nozzle moving means 6b, and the electronic component D held by the suction nozzle 6a is emitted by the laser recognition unit 5. The electronic component D is disposed in the optical path of the laser beam from the unit 5a toward the light receiving unit 5b, and the θ-axis rotating unit (not shown) of the nozzle moving unit 6b rotates the suction nozzle 6a around the nozzle axis. It is designed to rotate inside.
The laser recognition unit 5 detects the shadow of the electronic component D rotated in the optical path of the laser light and the laser light reaching the light receiving unit 5b, and outputs the detection data to the control unit 10 (CPU 10a). The processing and operation for the laser recognition unit 5 to detect the attitude of the electronic component D held by the suction nozzle 6a are well-known techniques and will not be described in detail here.

  The head moving unit 7 includes an X-axis moving unit 7a that moves the mounting head 6 in the X-axis direction (left-right direction), and a Y-axis moving unit 7b that moves the mounting head 6 in the Y-axis direction (front-back direction). Has been.

  The X-axis moving unit 7a is supported by guide members 71 and 71 provided on the substrate transfer path of the substrate transfer unit 3 so as to straddle the direction (Y-axis direction) perpendicular to the transfer direction of the substrate P. A rail-like support member provided on the beam member 72 extending in the direction and a driving means (not shown) for moving the mounting head 6 supported by the support member in the X-axis direction are provided. As this driving means, for example, a linear motor, a combination of a servo motor and a belt, a combination of a servo motor and a ball screw, or the like can be applied.

The Y-axis moving unit 7b includes a rail-like support member provided on the upper surfaces of the guide members 71 and 71 and a drive unit (not shown) that moves the beam member 72 supported by the support member in the Y-axis direction. ing. As this driving means, for example, a linear motor, a combination of a servo motor and a belt, a combination of a servo motor and a ball screw, or the like can be applied.
The beam member 72 is provided such that the upper surface of the guide members 71 and 71 can be moved in the Y-axis direction by the Y-axis moving means 7 b, and the mounting head 6 can be moved in the Y-axis direction via the beam member 72.

  The input unit 11 includes, for example, a keyboard and a mouse, and can input various data and operation instructions.

  The display unit 12 is configured by, for example, an LCD, and can display various data and the operation status of the apparatus.

As shown in FIG. 2, the control unit 10 includes a CPU 10a, a ROM 10b, and a RAM 10c.
The CPU 10a performs centralized control of the operation of each unit according to various control programs for the electronic component mounting apparatus stored in the ROM 10b in accordance with the start signal, operation signal, setting data value, and the like input from the input unit 11 and the like. The processing result is stored in the work area in the RAM 10c. Then, the CPU 10a controls driving of each part constituting the electronic component mounting apparatus 1.
In the ROM 10b, a control program, control data, reference data, and the like of the electronic component mounting apparatus 1 are written and stored.
The RAM 10c is provided with various work memories and counters, and is used as a work area during the electronic component mounting operation.

Then, the control unit 10 executes a predetermined control program and controls the operation of each unit of the apparatus, whereby the suction nozzle 6a provided in the mounting head 6 holds the posture and angle of the electronic component D held from the component supply unit 4. Is adjusted to function as a component mounting control means for mounting and mounting at a predetermined position of the substrate P supported at a predetermined component mounting position of the substrate transport path.
The control unit 10 performs control to recognize the position of the substrate P and stop at a predetermined component mounting position based on the detection signal detected by the substrate detection sensor 3a.
The control unit 10 also determines the posture of the electronic component D held by the suction nozzle 6a based on the shadow of the electronic component D detected by the laser recognition unit 5 (light receiving unit 5b) and the laser light reaching the light receiving unit 5b. Control to recognize the angle.
Further, the control unit 10 adjusts the posture of the electronic component D to be mounted on the substrate P according to the posture and angle of the electronic component D held by the recognized suction nozzle 6a, and moves the nozzle moving means 6b and the head. Control for operating the means 7 is performed.

  The electronic component mounting apparatus 1 can mount the electronic component D at a predetermined position on the board P.

  Thus, when the electronic component mounting apparatus 1 executes the predetermined control program, when the electronic component D is mounted on the substrate P, the laser recognition unit 5 detects the electronic component D held by the suction nozzle 6a. In order to recognize the posture and angle of the electronic component D, the Z-axis moving means (not shown) of the nozzle moving means 6b moves the suction nozzle 6a, and the electronic component D held by the suction nozzle 6a is moved to the laser. While being arranged in the optical path of the laser beam from the light emitting unit 5a of the recognition unit 5 to the light receiving unit 5b, the θ-axis rotating unit (not shown) of the nozzle moving unit 6b rotates the suction nozzle 6a around the nozzle axis, The electronic component D is rotated in the optical path.

And the cover member 8 is provided in the front surface of the window member W arrange | positioned at the light emission surface of the light emission part 5a of the laser recognition unit 5 of the electronic component mounting apparatus 1 which concerns on this invention, and the light-receiving surface of the light-receiving part 5b. Therefore, the electronic component D held by the suction nozzle 6a moved or rotated by the nozzle moving means 6b comes into contact with the light emitting surface of the light emitting portion 5a of the laser recognition unit 5 or the light receiving surface of the light receiving portion 5b. Even if this happens, the electronic component D contacts the cover member 8, and the electronic component D does not contact the window member W disposed in the light emitting portion 5a or the light receiving portion 5b. .
That is, what is damaged when the electronic component D comes into contact is the cover member 8, and the window member W is not damaged.
Therefore, the electronic component mounting apparatus 1 according to the present invention can reduce damage to the light emitting portion 5a of the laser recognition unit 5 for detecting the electronic component D and the window member W of the light receiving portion 5b from being damaged. It can be said that it is a component mounting apparatus.

  Even if the electronic component D comes into contact with the cover member 8 and the cover member 8 may be damaged, the cover member 8 can be attached to and detached from the front surface of the window member W of the light emitting unit 5a or the light receiving unit 5b. Can be easily replaced. For example, even in a work site such as a factory where the electronic component mounting apparatus 1 is provided, the cover member 8 can be replaced while maintaining the hermeticity inside the laser recognition unit 5. Compared with exchanging the window member W of the light emitting unit 5a and the light receiving unit 5b, the replacement work is easy.

Note that the cover member is not limited to the plate member 8 described above.
For example, like the cover member 8a shown in FIG. 4, while covering the light emission part 5a of the laser recognition unit 5 and the window member W and side surface of the front surface of the light-receiving part 5b, it is screwed to the side surface and can be attached or detached. The cover member 8a may be made of a light-transmitting material and has a substantially U-shape.

  Further, as shown in FIG. 5, along the guide part 5c provided on the front surface of the light emitting part 5a and the light receiving part 5b of the laser recognition unit 5, the front of the window member W of the light emitting part 5a and the light receiving part 5b can be moved forward and backward. It may be a cover member 8b made of a light transmissive material that is detachably attached to the cover member 8b.

  Further, as shown in FIG. 6, a cover member 8c formed by laminating a plurality of cover members that are light transmissive and self-adhesive films is used as a light emitting unit 5a or a light receiving unit 5b of the laser recognition unit 5. You may make it prepare in the front surface of the window member W. FIG. With such a cover member 8c, the cover member can be replaced more easily by peeling the damaged film one by one.

(Embodiment 2)
Next, a second embodiment of the electronic component mounting apparatus according to the present invention will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the component same as Embodiment 1, and description is abbreviate | omitted.

FIG. 7 is a perspective view of the electronic component mounting apparatus 1a.
As shown in FIG. 7, the electronic component mounting apparatus 1 a includes a base 2 on which each component is placed on the upper surface, and a substrate transport unit that transports the substrate P from the previous process to the subsequent process along the X-axis direction. 3, a component supply unit 4 that supplies the electronic component D, a mounting head 60 that mounts the electronic component D supplied by the component supply unit 4 on the substrate P, and the mounting head 60 is moved in each direction of the X and Y axes And a control unit (not shown) for controlling the operation of each unit.

  The mounting head 60 is provided on the beam member 72 and is held by the suction nozzle 6a, a predetermined number of suction nozzles 6a protruding downward (Z-axis direction), nozzle moving means 6b for moving the suction nozzle 6a, and the suction nozzle 6a. It has a laser recognition unit 5 that detects the attitude of the electronic component D, and a guard member 9 as a protective member provided in the laser recognition unit 5.

FIG. 8 is an explanatory view showing a state in which the guard member 8 provided in the laser recognition unit 5 is viewed from below, which is the tip side of the suction nozzle 6a.
As shown in FIGS. 7 and 8, the guard member 9 is between the light emitting unit 5 a side and the light receiving unit 5 b side of the laser recognition unit 5, and spans the tip side (lower side) of the suction nozzle 6 a. This is a member having a substantially U shape in side view.
The guard member 9 has a circular shape centered on a position corresponding to the axial center of the suction nozzle 6a and having a diameter substantially equal to the distance between the window member W of the light emitting portion 5a and the window member W of the light receiving portion 6b. An opening C is formed.
The diameter of the opening C may be a length equal to the distance between the window member W of the light emitting unit 5a and the window member W of the light receiving unit 6b arranged in parallel, and more preferably each window member. W is a length slightly shorter than the opposing distance.

When the electronic component mounting apparatus 1a mounts the electronic component D on the substrate P, the suction nozzle 6a is moved downward by the Z-axis moving means (not shown) of the nozzle moving means 6b, and the opening C of the guard member 9 is obtained. Through this, the electronic component D supplied by the component supply unit 4 is sucked and held.
Next, the suction nozzle 6a is moved upward by a Z-axis moving means (not shown) of the nozzle moving means 6b, and the electronic component D held by the suction nozzle 6a is transferred from the light emitting part 5a of the laser recognition unit 5 to the light receiving part 5b. It arrange | positions in the optical path of the laser beam to go. And the attitude | position of the electronic component D hold | maintained at the suction nozzle 6a is detected.

Then, the electronic component D held by the suction nozzle 6a moved by the nozzle moving means 6b (Z-axis moving means) of the electronic component mounting apparatus 1a is transferred from the light emitting portion 5a of the laser recognition unit 5 to the light receiving portion 5b. When trying to pass through the opening C of the guard member 9 for placement in the optical path, the electronic component D may come into contact with the lower surface of the guard member 9 as shown in FIG.
Since the suction nozzle 6a holds the electronic component D by the air suction force, when the suction nozzle 6a moves upward in a state where the electronic component D contacts and contacts the lower surface of the guard member 9, the electronic component D Is pulled away from the suction nozzle 6a and removed.
That is, the guard member 9 is an electron that contacts the guard member 9 when the electronic component D held by the suction nozzle 6a moved by the nozzle moving means 6b (Z-axis moving means) is arranged in the optical path of the laser beam. The component D is prevented from passing through the opening C.

Thus, the electronic component D that contacts the lower surface of the guard member 9 when passing through the opening C of the guard member 9 contacts the light emitting portion 5a of the laser recognition unit 5 and the window member W of the light receiving portion 5b. The electronic component D is removed from the suction nozzle 6a before the electronic component D is arranged in the optical path of the laser beam, so that the electronic component D is a window of the light emitting unit 5a or the light receiving unit 5b of the laser recognition unit 5. The window member W is not damaged by contacting the member W.
Even if the electronic component D that has passed through the opening C of the guard member 9 is rotated in the optical path of the laser beam by the θ-axis rotating unit (not shown) of the nozzle moving unit 6b, the light emitting unit of the laser recognition unit 5 is used. 5a and the window member W of the light-receiving part 5b are not contacted, and the window member W is not damaged.

  Therefore, in the electronic component mounting apparatus 1a having the laser recognition unit 5 to which the guard member 9 is attached, the light emitting portion 5a of the laser recognition unit 5 for detecting the electronic component D and the window member W of the light receiving portion 5b are damaged. It can be said that this is an electronic component mounting apparatus that can reduce the occurrence of such a problem.

In addition, a guard member is not restricted to the guard member 9 in which the above-mentioned circular opening part C was formed.
For example, in the case of the guard member 9a provided in the laser recognition unit 5 of the mounting head 66 of the electronic component mounting apparatus including the four suction nozzles 6a, a circular shape corresponding to the four suction nozzles 6a as shown in FIG. A connection opening H is formed in which a plurality of openings are connected and integrated. The circular opening corresponding to each suction nozzle 6a is centered at a position corresponding to the axial center of each suction nozzle 6a, and the diameter of the opening is that of the light emitting part 5a arranged in parallel. It is sufficient that the length is equal to the distance between the window member W and the window member W of the light receiving portion 6b. More preferably, the length is slightly shorter than the distance between the window members W.

The electronic component D that contacts the lower surface of the guard member 9a is pulled away from the suction nozzle 6a and removed, so that the window member W is not damaged.
However, the electronic component D that may come into contact with the window member W may pass through a portion where the circular openings are connected and integrated along the direction in which the four suction nozzles 6a are arranged. The cover member 8 is preferably detachably provided on the front surface of the light emitting portion 5a of the laser recognition unit 5 of the mounting head 66 and the window member W of the light receiving portion 5b.

  The guard member provided in the laser recognition unit of the mounting head of the electronic component mounting apparatus having such four suction nozzles 6a is centered on the position corresponding to the axial center of each suction nozzle 6a, and the light emitting unit 5a. Four openings C having a diameter substantially equal to the distance between the window member W of the light receiving portion and the window member W of the light receiving portion 6b may be formed.

Further, the lower surface of the guard member 9 or the guard member 9a is subjected to a matte surface treatment.
This is provided with various sensors such as a substrate detection sensor 3a below the mounting head in the electronic component mounting apparatus. When the sensor is an optical sensor, if the light output from the sensor is irregularly reflected on the lower surfaces of the guard members 9 and 9a, the sensor malfunctions. Therefore, it is preferable to perform a matte surface treatment on the lower surface of the guard member so as to prevent reflection of light.

  The guard member 9 and the guard member 9 a are not limited to being provided in the laser recognition unit 5, and may be a guard member that is integrated with the laser recognition unit 5.

  In the above embodiment, the laser recognition unit 5 is applied as the optical detection unit and the laser beam is output as the predetermined light. However, the present invention is not limited to this, and the optical detection unit is not limited to this. The light output from the target detection means is not limited to laser light, but may be other light.

  Further, the number of suction nozzles 6a provided in the mounting head is arbitrary.

  In addition, it is needless to say that other specific detailed structures can be appropriately changed.

It is a perspective view which shows the electronic component mounting apparatus which concerns on this invention. It is a block diagram which shows the principal part structure of the electronic component mounting apparatus which concerns on this invention. It is a perspective view which shows the cover member with which a laser recognition unit is mounted | worn, (a) before mounting | wearing of a cover member, and (b) after mounting | wearing of a cover member. It is a perspective view which shows the modification of the cover member with which a laser recognition unit is mounted | worn. It is a perspective view which shows the modification of the cover member with which a laser recognition unit is mounted | worn. It is a perspective view which shows the modification of the cover member with which a laser recognition unit is mounted | worn. It is a perspective view which shows the electronic component mounting apparatus in the implementation portable 2 of this invention. It is a bottom view which shows the guard member with which a laser recognition unit is mounted | worn. It is a side view which shows the guard member with which a laser recognition unit is mounted | worn. It is a bottom view which shows the modification of a guard member. It is a perspective view which shows the conventional laser recognition unit. It is explanatory drawing which shows the electronic component which contacts the light emission part of a laser recognition unit, or the window member of a light-receiving part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1a Electronic component mounting apparatus 3 Board | substrate conveyance means 4 Component supply part 5 Laser recognition unit (optical detection means)
5a Light emitting part 5b Light receiving part 6, 60, 66 Mounting head 6a Adsorption nozzle 6b Nozzle moving means 7 Head moving means 8, 8a, 8b, 8c Cover member (protective member)
9, 9a Guard member (protective member)
10 Control Unit D Electronic Component P Substrate W Window Member C Opening H Connection Opening

Claims (6)

A suction nozzle that holds electronic components at the tip;
A light emitting unit that emits predetermined light to the electronic component held by the suction nozzle, and a light receiving unit that receives the light emitted by the light emitting unit disposed at a position facing the light emitting unit with the suction nozzle interposed therebetween. An optical detection means for detecting a posture in which the electronic component is held by the suction nozzle;
Nozzle moving means for moving the suction nozzle and disposing the electronic component held by the suction nozzle in an optical path of light from the light emitting portion toward the light receiving portion in the optical detection means;
An electronic component mounting apparatus that mounts the electronic component held by the suction nozzle on a substrate according to the posture of the electronic component detected by the optical detection unit,
An electronic component mounting apparatus comprising: a protective member that prevents an electronic component held by the suction nozzle from contacting a light emitting surface of the light emitting portion and a window member disposed on the light receiving surface of the light receiving portion. .   The electronic component mounting apparatus according to claim 1, wherein the protection member is a light-transmissive cover member that is detachably provided on a front surface of the window member.   The electronic component mounting apparatus according to claim 2, wherein the protective member is formed by stacking a plurality of the cover members.   The protective member is spanned between the light emitting part side and the light receiving part side in the optical detection means, and is centered on a position corresponding to the axial center of the suction nozzle, and the window member of the light emitting part And a guard member in which a circular opening having a diameter substantially equal to the distance between the light receiving portion and the window member of the light receiving portion is formed, and the electronic component held by the suction nozzle moved by the nozzle moving means is 2. The electronic component mounting apparatus according to claim 1, wherein, when the electronic component is disposed in an optical path, the guard member prevents the electronic component contacting the guard member from passing through the opening.   5. The electronic component mounting apparatus according to claim 4, wherein the guard member is formed with a connection opening portion in which a plurality of circular opening portions corresponding to the plurality of suction nozzles are integrated.   The electronic component mounting apparatus according to claim 4, wherein a cover member having light permeability is detachably provided on a front surface of the window member.

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