JP4402996B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus for mounting electronic components on a substrate.

  Conventionally, as an apparatus for mounting electronic components on a substrate, an electronic component in which a plurality of electronic components supplied by a component supply unit are sucked by a suction nozzle provided in a mounting head, transferred to a substrate, mounted, and mounted A mounting apparatus is known (for example, refer to Patent Document 1).

A conventional electronic component mounting apparatus 100 shown in FIG. 11 is provided on a base stage 20 and transports a substrate P along a predetermined direction on both sides of the substrate transport unit 30 and the substrate transport unit 30 therebetween. The component supply unit 40 for supplying electronic components, the two support beams 51 provided so as to straddle the board conveying means 30, and the two frames 52 spanned between the two support beams 51 are provided. And a mounting head 60 that is attached to each frame 52, sucks electronic components from the component supply unit 40, and mounts them on the substrate P.
In addition, the electronic component mounting apparatus 100 includes moving means for moving the mounting head 60 to an arbitrary position. The moving means includes an X-axis moving means for moving the mounting head 60 along the frame 52, and a Y-axis movement for moving the mounting head 60 along the support beam 51 by moving the frame 52 along the support beam 51. Means.

In the electronic component mounting apparatus 100, one mounting head 60 sucks an electronic component from one component supply unit 40 and mounts it on the substrate P on the substrate transport unit 30, while the other mounting head 60 has the other mounting head 60. The electronic component is sucked from the component supply unit 40 and mounted on the substrate P on the substrate transfer means 30.
Then, by programming the operations of the plurality of mounting heads 60 in advance, it becomes possible to mount and mount electronic components at arbitrary positions on the substrate P that is transported and positioned by the substrate transport means 30. ing.
Japanese Patent No. 2758158

  However, in the case of Patent Document 1, since each frame 52 is provided on a common support beam 51, the operation is restricted so that the frames 52 and the mounting heads 60 do not come into contact with each other. For example, while one mounting head 60 is sucking an electronic component from the component supply unit 40, it is necessary to mount the electronic component sucked by the other mounting head 60 on the substrate P. . In other words, it is necessary to limit the mounting heads 60 so that electronic components are not mounted on the substrate P at the same time.

  An object of the present invention is to efficiently mount an electronic component in an electronic component mounting apparatus.

  In order to solve the above-described problems, the invention according to claim 1 is an electronic component mounting apparatus in which a substrate transport means for transporting a substrate along a predetermined transport path and a component supply for supplying an electronic component to be mounted on the substrate And a pair of first frames provided so as to straddle the conveyance path, and a base end portion is provided in each first frame, and a tip portion thereof is separated from the first frame toward the other first frame. And a second frame provided so as to be movable along the first frame and a mounting head provided so as to be movable along each second frame. The electronic component to be supplied is held by a mounting head, and the electronic component is mounted on a substrate.

According to the first aspect of the present invention, in the electronic component mounting apparatus, the electronic component supplied from the component supply unit is held by the mounting head, and the electronic component is mounted on the substrate.
The mounting head can move along the second frame, and the second frame can move along the first frame. Therefore, the mounting head can also move along the first frame. In other words, the mounting head can move along the second frame and move along the first frame, so that the electronic component supplied by the component supply unit is held while moving in the two directions. The electronic component is mounted on a substrate.

Here, in the second frame, each first frame is provided with the base end portion of the second frame, and the front end portion of the second frame is spaced apart from the first frame toward the other first frame. When each second frame moves along the first frame, the second frame moves along one first frame and moves along the other first frame. The second frame is not brought into contact with each other.
That is, each second frame can move independently along each first frame straddling the conveyance path.
Thereby, the mounting head provided in the second frame arranged in each first frame can independently perform the movement along the first frame and the movement along the second frame.

As described above, the electronic component mounting apparatus is configured such that the mounting heads are not limited to the first frame and the second frame so that the mounting heads and the second frames including the mounting heads do not come into contact with each other. And can be moved independently along each other.
Therefore, since the degree of freedom regarding the movement of the mounting head is improved, the mounting head 6 can move and operate efficiently.
Therefore, it can be said that this electronic component mounting apparatus is an electronic component mounting apparatus that can efficiently mount and mount electronic components on a substrate.

Furthermore, in the invention described in claim 1, the mounting head protrudes from the tip end side of the second frame provided in one first frame, and is based on the tip end portion of the second frame provided in the other first frame. It is possible to move to a position on the end side.

As a result, the mounting head protrudes from the distal end side of the second frame provided in one first frame, and reaches a position closer to the proximal end side than the distal end portion of the second frame provided in the other first frame. Since it is movable, the mounting head provided in the second frame on one first frame side and the mounting head provided on the second frame on the other first frame 71 side are the axes of the second frame. It can move to a position that overlaps in the direction.
That is, the range in which the mounting head arranged on one first frame can mount the electronic component on the substrate, and the mounting head arranged on the other first frame mounts the electronic component on the substrate. The range that can be overlapped.
Further, since the range in which the mounting head moves along the second frame is widened, it is possible to hold electronic components from a wider range of component supply units.

  Therefore, the mounting head can hold more types of electronic components from a wider range of component supply units, and the overlapping electronic components on the board can be mounted so that each mounting head cooperates with each other. Electronic components can be mounted within the mountable range.

According to a second aspect of the present invention, in the electronic component mounting apparatus according to the first aspect, the board conveying means includes a first part mounting position for the mounting head to mount the electronic part on the board, and each first frame. The board can be transported so that the distance corresponding to the distance that is separated when the front ends of the second frames of the second frame face each other is switched from the first mounting position to the second component mounting position that is moved at least. It is characterized by becoming.

According to the second aspect of the present invention , the substrate carrying means has the first component mounting position for mounting the electronic component on the substrate, while exhibiting the same effect as the first aspect of the invention. The board position can be switched to the second component mounting position.
In particular, the second component mounting position is a position that is moved from the first mounting position by a distance corresponding to an interval that separates at least when the front end of each second frame provided in each first frame opposes. Therefore, even if the mounting head cannot move to a position where the tip of each second frame is opposed and separated, and the electronic component cannot be mounted on the range of the substrate corresponding to the position, the first head By moving the substrate from the mounting position to the second component mounting position, the range of the substrate on which the electronic component cannot be mounted can be moved to the component mounting position where the electronic component can be mounted.
Therefore, electronic components can be mounted on the entire range of the substrate.

According to a third aspect of the present invention, in the electronic component mounting apparatus according to the first aspect, the board transfer means includes a first component mounting position on the upstream side in the board transfer direction in the transfer path and a board transfer direction in the transfer path. A first detection member that detects a rear end portion of the substrate in order to align the substrate with the first component mounting position, and a second component mounting position. And a second detection member for detecting the tip of the substrate in order to align the substrate.

According to the invention described in claim 3, the same effect as that of the invention described in claim 1 is achieved, and the first detection member detects the rear end portion of the substrate at the first component mounting position, and the alignment is performed. Then, at the second component mounting position, the tip of the substrate can be detected and aligned by the second detection member. That is, the first detection member corresponding to the first component mounting position and the second detection member corresponding to the second component mounting position with respect to the substrate transport direction in the transport path are in the substrate transport direction. It is arranged in a symmetrical position.

Specifically, in the electronic component mounting apparatus, when the board conveyance direction is the positive direction, the first detection member detects and aligns the rear end of the board at the first component mounting position, and the second At the component mounting position, the second detection member can detect and align the tip of the substrate.
On the other hand, in the electronic component mounting apparatus, when the substrate transport direction is the reverse direction, the second detection member detects and aligns the rear end portion of the substrate at the second component mounting position, and the first component mounting is performed. At the position, the first detection member can detect and align the tip of the substrate.

  In other words, by arranging the first detection member corresponding to the first component mounting position and the second detection member corresponding to the second component mounting position in this manner, the substrate transport direction can be corrected correctly. Even if the direction and the reverse direction are switched, the same alignment can be performed in either the forward direction or the reverse direction. Therefore, it is possible to provide an electronic component mounting apparatus that can carry the substrate from either the left or right side.

According to a fourth aspect of the present invention, in the electronic component mounting apparatus according to any one of the first to third aspects of the present invention, the electronic component mounting apparatus further includes a substrate rotating unit that rotates the substrate about an axis perpendicular to the mounting surface of the substrate. It is characterized by.

According to the invention described in claim 4, the same effect as in the invention described in any one of claims 1 to 3 is achieved, and the substrate rotating means has an axis perpendicular to the mounting surface of the substrate. Since it can be rotated to the center, the orientation and arrangement of the substrate can be switched. For example, when the substrate rotating means operates so that the substrate is rotated by 180 °, the arrangement can be switched so that the front end portion and the rear end portion of the substrate transported on the transport path are switched.
That is, by switching the direction of the substrate, the range in which the mounting head disposed on one first frame can mount the electronic component on the substrate and the mounting head disposed on the other first frame are the substrate. On the other hand, the range in which electronic components can be mounted can correspond to the entire range of the substrate. The electronic component held by the mounting head arranged in one first frame from the component supply unit and the electronic component held by the mounting head arranged in the other first frame from the component supply unit in the entire range of the substrate. Components can be mounted.
Therefore, many kinds of electronic components can be mounted on the entire range of the substrate.

According to a fifth aspect of the present invention, in the electronic component mounting apparatus according to any one of the first to fourth aspects, a component supply unit is provided on both sides of the conveyance path.

According to the invention described in claim 5, the same effect as that of the invention described in any one of claims 1 to 4 is achieved, and since the component supply unit is provided on both sides of the conveyance path, The installation range of the component supply unit can be widened. A larger component supply unit can supply more types of electronic components.
In addition, since the mounting head that moves along the first frame can hold the electronic components from the component supply units on both sides of the conveyance path and mount them on the board, the variation of the mounting operation of the electronic components can be widened. it can.

According to a sixth aspect of the present invention, in the electronic component mounting apparatus according to the fifth aspect, a plurality of second frames and mounting heads are provided in each first frame so as to correspond to the component supply units provided on both sides of the conveyance path. It is provided.

According to the sixth aspect of the invention, the same effect as that of the fifth aspect of the invention can be obtained, and each first frame includes a plurality of second frames and mounting heads, so that one second frame and When the mounting head mounts an electronic component from one component supply unit sandwiching the transport path, the other second frame and the mounting head can mount the electronic component from the other component supply unit sandwiching the transport path.
In addition, when the electronic component is mounted from one component supply unit in which the second frame and the mounting head sandwich the conveyance path, the other second frame and the mounting head can mount the electronic component on the substrate.
As described above, it is possible to widen variations of operations related to the mounting head holding the electronic component from the component supply unit and the mounting head mounting the electronic component on the substrate.

According to the first aspect of the present invention, in the electronic component mounting apparatus, the electronic component supplied from the component supply unit is held by the mounting head, and the electronic component is mounted on the substrate. The mounting head can move along the second frame, and the second frame can move along the first frame. Therefore, the mounting head can also move along the first frame. In other words, the mounting head can move along the second frame and move along the first frame, so that the electronic component supplied by the component supply unit is held while moving in the two directions. The electronic component is mounted on a substrate.
Here, in the second frame, each first frame is provided with the base end portion of the second frame, and the front end portion of the second frame is spaced apart from the first frame toward the other first frame. When each second frame moves along the first frame, the second frame moves along one first frame and moves along the other first frame. The second frame is not brought into contact with each other. That is, each second frame can move independently along each first frame straddling the conveyance path. Thereby, the mounting head provided in the second frame arranged in each first frame can independently perform the movement along the first frame and the movement along the second frame.
As described above, the electronic component mounting apparatus is configured such that the mounting heads are connected to the first frame and the second frame without restricting the movement of the mounting heads and the second frames including the mounting heads so as not to contact each other. Each frame can be moved independently along the frame.
Therefore, since the degree of freedom regarding the movement of the mounting head is improved, the mounting head 6 can move and operate efficiently. Therefore, it can be said that this electronic component mounting apparatus is an electronic component mounting apparatus that can efficiently mount and mount electronic components on a substrate.

Further, according to the first aspect of the present invention, the mounting head protrudes from the tip end side of the second frame provided in one of the first frames, and the tip end portion of the second frame provided in the other first frame. Since it can move to a position closer to the base end side, the mounting head provided in the second frame on one first frame side and the mounting provided on the second frame on the other first frame 71 side are provided. The head can move to a position that overlaps the axial direction of the second frame. That is, the range in which the mounting head arranged on one first frame can mount the electronic component on the substrate, and the mounting head arranged on the other first frame mounts the electronic component on the substrate. The range that can be overlapped.
Further, since the range in which the mounting head moves along the second frame is widened, it is possible to hold electronic components from a wider range of component supply units.
Therefore, the mounting head can hold more types of electronic components from a wider range of component supply units, and the overlapping electronic components on the board can be mounted so that each mounting head cooperates with each other. Electronic components can be mounted within the mountable range.

According to the second aspect of the present invention, the substrate transfer means can switch the position of the substrate between the first component mounting position and the second component mounting position for the mounting head to mount the electronic component on the substrate. it can. In particular, the second component mounting position is a position that is moved from the first mounting position by a distance corresponding to an interval that separates at least when the front end of each second frame provided in each first frame opposes. Therefore, even if the mounting head cannot move to a position where the tip of each second frame is opposed and separated, and the electronic component cannot be mounted on the range of the substrate corresponding to the position, the first head By moving the substrate from the mounting position to the second component mounting position, the range of the substrate on which the electronic component cannot be mounted can be moved to the component mounting position where the electronic component can be mounted.
Therefore, electronic components can be mounted on the entire range of the substrate.

According to the third aspect of the present invention, the first detection member detects and aligns the rear end portion of the substrate at the first component mounting position, and the front end portion of the substrate is aligned at the second component mounting position. The second detection member can detect and align. That is, the first detection member corresponding to the first component mounting position and the second detection member corresponding to the second component mounting position with respect to the substrate transport direction in the transport path are in the substrate transport direction. It is arranged in a symmetrical position.
Specifically, in the electronic component mounting apparatus, when the board conveyance direction is the positive direction, the first detection member detects and aligns the rear end of the board at the first component mounting position, and the second At the component mounting position, the second detection member can detect and align the tip of the substrate. On the other hand, in the electronic component mounting apparatus, when the substrate transport direction is the reverse direction, the second detection member detects and aligns the rear end portion of the substrate at the second component mounting position, and the first component mounting is performed. At the position, the first detection member can detect and align the tip of the substrate.
In other words, by arranging the first detection member corresponding to the first component mounting position and the second detection member corresponding to the second component mounting position in this manner, the substrate transport direction can be corrected correctly. Even if the direction and the reverse direction are switched, the same alignment can be performed in either the forward direction or the reverse direction.
Therefore, it is possible to provide an electronic component mounting apparatus that can carry the substrate from either the left or right side.

According to the fourth aspect of the present invention, since the substrate rotating means can rotate the substrate around an axis perpendicular to the mounting surface of the substrate, the direction and arrangement of the substrate can be switched. For example, when the substrate rotating means operates so that the substrate is rotated by 180 °, the arrangement can be switched so that the front end portion and the rear end portion of the substrate transported on the transport path are switched. That is, by switching the direction of the substrate, the range in which the mounting head disposed on one first frame can mount the electronic component on the substrate and the mounting head disposed on the other first frame are the substrate. On the other hand, the range in which electronic components can be mounted can correspond to the entire range of the substrate. The electronic component held by the mounting head arranged in one first frame from the component supply unit and the electronic component held by the mounting head arranged in the other first frame from the component supply unit in the entire range of the substrate. Components can be mounted.
Therefore, many kinds of electronic components can be mounted on the entire range of the substrate.

According to the fifth aspect of the present invention, since the component supply units are provided on both sides of the conveyance path, the installation range of the component supply unit can be widened. A larger component supply unit can supply more types of electronic components.
In addition, since the mounting head that moves along the first frame can hold the electronic components from the component supply units on both sides of the conveyance path and mount them on the board, the variation of the mounting operation of the electronic components can be widened. it can.

According to the sixth aspect of the present invention, since each first frame includes a plurality of second frames and mounting heads, one of the second frames and the mounting heads from one component supply unit sandwiching the conveyance path from the electronic component. When mounting the electronic component, the other second frame and the mounting head can mount the electronic component from the other component supply unit sandwiching the conveyance path. In addition, when the electronic component is mounted from one component supply unit in which the second frame and the mounting head sandwich the conveyance path, the other second frame and the mounting head can mount the electronic component on the substrate.
As described above, it is possible to widen variations of operations related to the mounting head holding the electronic component from the component supply unit and the mounting head mounting the electronic component on the substrate.

The electronic component mounting apparatus according to the present invention is an apparatus for mounting and mounting an electronic component supplied by a component supply unit (electronic component feeder) at a predetermined position on a substrate.
Here, in the electronic component mounting apparatus, the direction in which the substrate P is conveyed from the previous process to the subsequent process is defined as the X-axis direction, and one direction orthogonal thereto is defined as the Y-axis direction. The direction orthogonal to is defined as the Z-axis direction.

(Embodiment 1)
FIG. 1 is a plan view of the electronic component mounting apparatus 1.
As shown in FIG. 1, the electronic component mounting apparatus 1 includes a base 2 on which each component is placed on the upper surface, and a substrate transport that transports the substrate P from the previous process to the subsequent process along the X-axis direction. Means 3, a component supply unit 4 for supplying electronic components, a mounting head 6 for mounting the electronic components supplied by the component supply unit 4 on the substrate P, and the mounting head 6 are moved in the X-axis and Y-axis directions. The head moving means 7 is provided.

The substrate transfer means 3 is provided in a transfer path 33 that extends in the X-axis direction.
The substrate transport unit 3 has a transport belt (not shown), and transports the substrate P along the transport path 33 in the X-axis direction from the pre-process side to the post-process side.
Further, the substrate transport means 3 stops the transport of the substrate P at a predetermined component mounting position and supports the substrate P in order to mount and mount the electronic component on the substrate P by the mounting head 6.
In particular, in the electronic component mounting apparatus 1 according to the first embodiment, the substrate P is stopped so that the center position of the substrate P matches the reference position with respect to the transport direction (X-axis direction) of the substrate P. . That is, regardless of the size of the board P, the center position of the board P (the center position with respect to the transport direction) matches the reference position in the electronic component mounting apparatus 1 and stops.

  The component supply unit 4 includes a plurality of electronic component feeders that convey electronic components arranged in a feeder bank on the upper surface of the base 2, and is provided on both sides of the conveyance path 33.

The mounting head 6 is provided on an X-axis frame 72 described later, and has a predetermined number (four in the first embodiment) of suction nozzles 6a protruding downward (in the Z-axis direction). The suction nozzle 6a is detachably provided so that it can be exchanged according to the size and shape of the electronic component to be sucked and held.
Further, the mounting head 6 is provided with a CCD camera (not shown) that images the reference mark attached to the substrate P from above. The CCD camera outputs image data relating to the captured reference mark to a control unit (not shown) of the electronic component mounting apparatus.

  The suction nozzle 6a is connected to, for example, an air suction means (not shown), and by passing vacuum air through a through hole (not shown) formed in the suction nozzle 6a, an electronic component is attached to the tip portion which is the lower end of the suction nozzle 6a. Can be adsorbed and held. Further, the air suction means is provided with an electromagnetic valve (not shown), and the ventilation of the vacuum air can be switched by the electromagnetic valve, and the air suction means is switched between the air suction state and the air release state. That is, when the air suction state is established, the vacuum air is passed through the through hole so that the electronic component can be adsorbed. When the air release state is established, the inside of the through hole of the suction nozzle 6a is set to the atmospheric pressure state, To release.

The mounting head 6 includes a Z-axis moving unit (not shown) that moves the suction nozzle 6a in the Z-axis direction and a Z-axis rotation unit (not shown) that rotates the suction nozzle 6a around the Z axis. .
The Z-axis moving means (not shown) is provided on the mounting head 6 and moves the suction nozzle 6a in the Z-axis direction. The suction nozzle 6a passes through the Z-axis moving means in the Z-axis direction. The mounting head 6 is provided so as to be freely movable. As the Z-axis moving means, for example, a combination of a servo motor and a belt, a combination of a servo motor and a ball screw, or the like can be applied.
The Z-axis rotating means (not shown) is a rotation driving means that is provided on the mounting head 6 and rotates the suction nozzle 6a. The suction nozzle 6a is centered on the Z-axis via the Z-axis rotating means. The mounting head 6 is rotatably provided. The Z-axis rotating means includes, for example, an angle adjustment motor and an encoder that detects the rotation angle amount of the angle adjustment motor.

  The head moving unit 7 includes an X-axis moving unit 7a that moves the mounting head 6 in the X-axis direction (left-right direction), and a Y-axis moving unit 7b that moves the mounting head 6 in the Y-axis direction (front-back direction). Has been.

The X-axis moving means 7a is a Y as a pair of first frames provided so as to straddle the transport path 33 provided with the substrate transport means 3 in a direction (Y-axis direction) perpendicular to the transport direction of the substrate P. A drive (not shown) for moving the X-axis frame 72 as a second frame supported by the shaft frames 71 and 71 and extending in the X-axis direction and the mounting head 6 supported by the X-axis frame 72 in the X-axis direction. Means. As this driving means, for example, a linear motor, a combination of a servo motor and a belt, a combination of a servo motor and a ball screw, or the like can be applied.
In the electronic component mounting apparatus 1 according to the first embodiment, two X-axis frames 72 are provided in each Y-axis frame 71.

The base end portion 72a of the X-axis frame 72 is provided in the Y-axis frame 71, and the tip end portion 72b extends in the X-axis direction from the Y-axis frame 71 side to the other Y-axis frame 71 side. Are arranged to be. The X-axis frame 72 provided in each Y-axis frame 71 is disposed so that the X-axis frame 72 provided in the other Y-axis frame 71 and the tip end portion 72b are spaced apart from each other.
In this X-axis moving means 7 a, the mounting head 6 can move along the X-axis frame 72. In particular, the mounting head 6 protrudes from the distal end portion 72 b side of the X-axis frame 72 provided in one Y-axis frame 71 and is proximal to the distal end portion 72 b of the X-axis frame 72 provided in the other Y-axis frame 71. It can move to the position on the 72a side.

Thus, the mounting head 6 provided on the X-axis frame 72 on the one Y-axis frame 71 side and the mounting head 6 provided on the X-axis frame 72 on the other Y-axis frame 71 side are arranged in the X-axis direction. It is possible to move to an overlapping position.
That is, in FIG. 1, the mounting head 6 disposed on the left Y-axis frame 71 in the drawing can mount an electronic component on the substrate P and the mounting disposed on the right Y-axis frame 71 in the drawing. The range in which the head 6 can mount electronic components on the substrate P overlaps.
Then, as shown in FIG. 2, the mounting head 6 disposed on the Y-axis frame 71 on the left side in the drawing may mount electronic components on the substrate P with respect to the substrate P disposed at a predetermined component mounting position. A range 66l, a range 66r in which the mounting head 6 disposed on the Y-axis frame 71 on the right side in the drawing can mount electronic components on the substrate P, and the Y-axis on the left or right side in the drawing overlap each other. A range 66 c in which electronic components can be mounted is also provided from the mounting head 6 disposed on the frame 71.

  In particular, in the electronic component mounting apparatus 1 according to the first embodiment, since the center position of the various substrates P is aligned with the reference position in the electronic component mounting apparatus 1, the electronic component mounting apparatus 1 is stopped. , (C), a range 66 l in which the mounting head 6 disposed on the left Y-axis frame 71 can mount an electronic component on the substrate P of any size, and a right Y An electronic component is mounted from the range 66r in which the mounting head 6 disposed on the shaft frame 71 can mount an electronic component, and the mounting head 6 disposed on the Y-axis frame 71 on either side of the left and right sides overlapping the range. The possible range 66c can be made to correspond.

  The Y-axis moving unit 7b includes a Y-axis frame 71 and a driving unit (not shown) that moves the X-axis frame 72 supported by a rail-like support member provided on the upper surface of the Y-axis frame 71 in the Y-axis direction. It has. As this driving means, for example, a linear motor, a combination of a servo motor and a belt, a combination of a servo motor and a ball screw, or the like can be applied.

The X-axis frame 72 is provided so that the upper surface of the Y-axis frame 71 can be moved in the Y-axis direction along the Y-axis frame 71 by the Y-axis moving means 7 b. It can move in the Y-axis direction.
Each Y-axis frame 71 is provided with two X-axis frames 72, and each X-axis frame 72 can perform independent operation and movement. Thus, in order for each X-axis frame 72 to move independently, a linear motor is preferable as the driving means of the Y-axis moving means 7b.

The electronic component mounting apparatus 1 includes a control unit (not shown).
The control unit (not shown) is composed of an arithmetic unit including a CPU, a ROM, a RAM, and the like, and a predetermined program is input to them, whereby the substrate transfer means 3, the mounting head 6, and the head moving means 7 (X Operation control for the axis moving means 7a, the Y-axis moving means 7b) and the like is performed.

For example, the control unit controls the operation of the head moving unit 7 based on the component suction control unit so that the mounting head 6 moves so that the suction nozzle 6a sucks and holds the electronic component supplied by the component supply unit 4. I do.
Further, since the control unit mounts the electronic component at a predetermined position on the substrate P, the mounting head 6 that holds the electronic component moves in the X-axis direction and the Y-axis direction in order to perform alignment according to the predetermined position. The operation of the head moving means 7 is controlled based on the component mounting control means so as to move.
Further, the control unit recognizes the size, position, and displacement of the substrate P based on the image data related to the reference mark of the substrate P imaged by the CCD camera (not shown) of the mounting head 6 and recognizes the recognized size of the substrate P. Depending on the state, control is performed to adjust the operation and movement of the substrate transport means 3, the mounting head 6, and the head moving means 7.
Note that the control processing in the control unit (not shown) of the electronic component mounting apparatus 1 is the same as that conventionally known and will not be described in detail here.

Next, the operation of mounting the electronic component on the substrate P in the electronic component mounting apparatus 1 having such a configuration will be described.
First, the substrate transport means 3 transports the substrate P from the previous process, and stops the substrate P at a predetermined component mounting position located substantially at the center of the transport path 33 of the electronic component mounting apparatus 1, thereby clamping (not shown) It supports by pinching.

Next, the Y-axis moving means 7b of the head moving means 7 moves each X-axis frame 72 to the component supply unit 4 side, and the X-axis moving means 7a of the head moving means 7 moves the mounting head 6 in the X-axis direction. In this manner, necessary electronic components are sucked and held from the component supply unit 4.
Here, since the mounting head 6 can protrude from the tip end portion 72b side of the X-axis frame 72, the mounting head 6 corresponds to the range in which the X-axis frame 72 protrudes toward the tip end portion 72b side from the range in which the X-axis frame 72 can move. The mounting range of each mounting head 6 can attract and hold electronic components from the component supply unit 4 in a wider range.

In FIG. 1, the upper X-axis frame 72 provided in each Y-axis frame 71 is directed to the upper part supply unit 4 side in the figure, and the lower X-axis frame 72 is lower in the figure. The mounting head 6 supported by each X-axis frame 72 holds electronic components from the component supply unit 4 by moving to the component supply unit 4 side.
Further, in FIG. 1, the mounting head 6 supported by the X-axis frame 72 provided in the Y-axis frame 71 on the left side in the drawing holds electronic components from the left-side range in each component supply unit 4, and on the right side in the drawing. The mounting head 6 supported by the X-axis frame 72 provided in the Y-axis frame 71 holds electronic components from the right-side range in each component supply unit 4.

When the mounting head 6 holds the electronic component, the head moving means 7 (X-axis moving means 7a, Y-axis moving means 7b) moves the mounting head 6 toward the substrate P supported at a predetermined component mounting position. The electronic component is mounted on the substrate P so that the electronic component is aligned with a predetermined mounting position on the substrate P.
The mounting head 6 that has finished mounting the electronic component moves to the component supply unit 4 side in order to suck and hold the next electronic component. Then, until all predetermined electronic components are mounted on the substrate P, the suction holding and mounting of the electronic components are repeated.

It should be noted that the component mounting position, which is substantially the center of the conveyance path 33 where the substrate P is stopped and supported, is located at the tip end portion 72b of the X-axis frame 72 provided in one Y-axis frame 71 and the other Y-axis frame. 71 corresponds to a position where the tip end portion 72b of the X-axis frame 72 provided in 71 faces, and a component mounting position is located below the tip end portion 72b.
In particular, the reference position at which the substrate P is stopped is determined by the tip 72b of the X-axis frame 72 provided in one Y-axis frame 71 and the tip 72b of the X-axis frame 72 provided in the other Y-axis frame 71. By setting the position corresponding to the intermediate position between them, the center position of the substrate P supported at the predetermined component mounting position is positioned between the front end portions 72b of the X-axis frames 72. Thereby, by aligning the center of the substrate P with the reference position, the substrate P of any size can be placed at a predetermined component mounting position as shown in FIGS. 2 (a), 2 (b), and 2 (c). In the range 66l in which the mounting head 6 disposed on the left Y-axis frame 71 in the drawing can mount electronic components on the substrate P and the right Y-axis frame 71 in the drawing. A range 66r in which the mounting head 6 to be mounted can mount electronic components on the substrate P, and an electronic component from the mounting head 6 disposed on the Y-axis frame 71 on either the left or right side in the drawing with the ranges overlapping. A range 66c that can be mounted can be provided.

In the electronic component mounting apparatus 1, when each mounting head 6 is moved, each X-axis frame 72 moves in the Y-axis direction along the Y-axis frame 71, but the X-axis provided in each Y-axis frame 71. Since the frame 72 is disposed so that the X-axis frame 72 provided in the other Y-axis frame 71 and the tip end portions 72b thereof are separated from each other, the mounting head 6 does not protrude from the tip end portion 72b. Thus, the X-axis frame 72 provided in one Y-axis frame 71 and the X-axis frame 72 provided in the other Y-axis frame 71 do not come into contact with each other.
That is, even when each X-axis frame 72 is moved to operate each mounting head 6 independently, the X-axis frame 72 provided in one Y-axis frame 71 and the other Y-axis frame 72 are moved. The X-axis frame 72 provided in the axis frame 71 is not in contact with each other, and can be moved and operated independently.

As described above, the electronic component mounting apparatus 1 according to the present invention includes the mounting head 6 that can be moved and operated independently by the head moving means 7 (X-axis moving means 7a and Y-axis moving means 7b). Therefore, electronic components can be efficiently mounted on the substrate P.
That is, each mounting head 6 moves and operates independently, so that each mounting head 6 can adsorb and hold electronic components from the component supply unit 4 at an arbitrary timing, and the mounting heads 6 come into contact with each other. By moving and operating so as not to be disturbed, each mounting head 6 can mount an electronic component on the substrate P at an arbitrary timing.

Therefore, in the conventional electronic component mounting apparatus 1, such an electronic component mounting apparatus 1 is compared to a case where the movement is limited so that the mounting head and the frames supporting the mounting head do not come into contact with each other. The mounting head 6 has a high degree of freedom of movement and operation, and the mounting head 6 can operate efficiently.
Therefore, it can be said that the electronic component mounting apparatus 1 is an electronic component mounting apparatus that can efficiently mount and mount electronic components on the substrate P.

(Embodiment 2)
Next, a second embodiment of the electronic component mounting apparatus according to the present invention will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the same part as Embodiment 1, and only a different part is demonstrated.

As shown in FIG. 3, the electronic component mounting apparatus 1a has a substrate P stopped and supported at a predetermined component mounting position located substantially in the center of the transport path 33, with an axis perpendicular to the mounting surface as a center. A substrate rotating means 31 for rotating is provided.
The substrate rotating unit 31 includes a substrate rotating table 31a on which the substrate P is placed at the component mounting position, and a rotation driving unit (not shown) that rotates the substrate rotating table 31a.

The substrate turntable 31a is a member having a circular shape in plan view having a placement surface parallel to the XY plane on which the substrate P is placed, and a substrate holding mechanism (not shown) that supports and holds the substrate P on the placement surface. It has.
A rotation driving means (not shown) is provided on the lower surface side of the substrate rotation table 31a.
The rotation driving means is a driving means for rotating the substrate rotation table 31a around an axis perpendicular to the mounting surface of the substrate rotation table 31a, particularly the plate surface of the substrate P mounted on the substrate rotation table 31a. A rotating shaft (not shown) that supports the table 31a and a driving means (not shown) for rotating the rotating shaft are included. As the driving means, for example, a servo motor can be applied.

The substrate rotation table 31a is pivotally supported by a rotation shaft (not shown) of the rotation driving unit and is rotatably provided at the component mounting position in the transport path 33. Therefore, the substrate rotation table 31a rotates according to the rotation driving of the rotation driving unit. As the table 31a rotates, the substrate P placed and held on the substrate rotation table 31a rotates together with the substrate rotation table 31a.
The substrate carrying means 3 can carry in the substrate P onto the substrate turntable 31a and carry out the substrate P from the substrate turntable 31a.

Next, the operation of mounting the electronic component on the board P in the electronic component mounting apparatus 1a will be described.
The substrate transport means 3 transports the substrate P from the previous process, and stops the substrate P on the substrate rotation table 31a at a predetermined component mounting position located substantially at the center of the transport path 33, thereby not shown a clamp (substrate It is sandwiched and supported by a holding mechanism.
Next, the mounting head 6 that is moved by the head moving means 7 (X-axis moving means 7a, Y-axis moving means 7b) holds electronic components from the component supply unit 4 and also mounts the electronic components on the substrate P in a predetermined manner. Mount and mount so as to align the location.

When the predetermined electronic components are mounted on the substrate P, as shown in FIG. 4, the substrate rotating means 31 performs a driving operation for rotating the substrate rotating table 31a by 180 °, and the substrate placed on the substrate rotating table 31a. The direction of P is switched by 180 °.
Similarly, the mounting head 6 moved by the head moving means 7 (X-axis moving means 7a, Y-axis moving means 7b) holds the electronic components from the component supply unit 4, and the electronic components are mounted on the substrate P. The operation of mounting and mounting so as to align with a predetermined mounting location is continued, and the suction holding and mounting of the electronic components are repeated until all the electronic components are mounted on the substrate P.

  Here, in the state where the board P is initially supported on the board turntable 31a at a predetermined component mounting position, as shown in FIG. 4A, the board P is arranged on the left Y-axis frame 71. The mounting head 6 can mount an electronic component, the range 66l, and the mounting head 6 disposed on the right Y-axis frame 71 can mount the electronic component 66r. A range 66c in which an electronic component can be mounted from the mounting head 6 disposed on the Y-axis frame 71 on either side corresponds to the range 66c.

  However, in FIG. 3, the mounting head 6 supported by the X-axis frame 72 provided in the Y-axis frame 71 on the left side in the drawing holds the electronic components from the left-side range in the component supply unit 4, and the Y on the right side in the drawing. Since the mounting head 6 supported by the X-axis frame 72 provided in the shaft frame 71 holds electronic components from the right-side range in the component supply unit 4, the component supply in the range 66l in the substrate P The electronic component supplied from the left side range in the unit 4 is mounted, and the electronic component supplied from the right side range in the component supply unit 4 cannot be mounted. Similarly, an electronic component supplied from the right side range in the component supply unit 4 is mounted on the range 66r in the board P, and an electronic component supplied from the left side range in the component supply unit 4 cannot be mounted.

Therefore, the substrate rotating means 31 rotates the substrate rotating table 31a to switch the direction of the substrate P placed on the substrate rotating table 31a by 180 °, thereby making the substrate as shown in FIG. With respect to P, a range 66l in which the mounting head 6 disposed on the left Y-axis frame 71 can mount electronic components, and the mounting head 6 disposed on the right Y-axis frame 71 mounts electronic components. The range 66r that can be switched can be switched.
Thereby, in the left and right regions of the substrate P, the range 66l in which the mounting head 6 disposed on the left Y-axis frame 71 can mount electronic components and the mounting head disposed on the right Y-axis frame 71, respectively. 6 can correspond to a range 66r in which electronic components can be mounted.
That is, in the electronic component mounting apparatus 1a, the component supply unit 4 supplies the substrate P supported at a predetermined component mounting position (substrate rotation table 31a) to any position of the substrate P. All kinds of electronic components can be mounted.

  The electronic component mounting apparatus 1a including the substrate rotating unit 31 can mount all kinds of electronic components supplied by the component supply unit 4 at any position on the substrate P, and can be mounted on the substrate P. On the other hand, it can be said that the electronic component mounting apparatus can efficiently mount and mount electronic components.

(Embodiment 3)
Next, a third embodiment of the electronic component mounting apparatus according to the present invention will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the same part as Embodiment 1, and only a different part is demonstrated.

As shown in FIG. 5, in the electronic component mounting apparatus 1 b, the board transport unit 3 transports the board P along the transport path 33 in the X-axis direction from the front process side to the back process side, and the mounting head 6 performs electronic processing. In order to mount and mount a component on the substrate P, the conveyance of the substrate P is stopped and the substrate P is supported at a predetermined component mounting position.
In particular, the electronic component mounting apparatus 1b according to the third embodiment has a first component mounting position 3a shown in FIG. 5A and a second component mounting position 3b shown in FIG. 5B. Yes.
In the first component mounting position 3a, as shown in FIG. 6A, the tip Pf in the transport direction of the substrate P is mounted on the Y-axis frame 71 on the right side in the drawing, and the mounting head 6 mounts electronic components. The second component mounting position 3b corresponds to the right end portion of the range 66r where the rear end portion Pb in the transport direction of the substrate P is located on the left side in the drawing, as shown in FIG. 6B. This is a place where the mounting head 6 arranged on the Y-axis frame 71 coincides with the left end portion of the range 66l in which electronic components can be mounted.

The X-axis moving unit 7 a of the head moving unit 7 can move the mounting head 6 along the X-axis frame 72. In particular, the mounting head 6 according to the third embodiment can move to the tip end portion 72 b of the X-axis frame 72, and does not protrude from the tip end portion 72 b of the X-axis frame 72.
In other words, the X-axis frame 72 provided in one Y-axis frame 71 and the X-axis frame 72 provided in the other Y-axis frame 71 are arranged so that the front ends 72b are spaced apart from each other. Therefore, the portion of the substrate P corresponding to the distance between the distal end portions 72b of the X-axis frame 72 is outside the movement range of the mounting head 6, so that an electronic component is mounted on that portion of the substrate P. Can not.

Next, the operation of mounting the electronic component on the board P in the electronic component mounting apparatus 1b will be described.
First, the substrate transport means 3 transports the substrate P from the previous process, stops the substrate P at the first component mounting position 3a in the transport path 33 of the electronic component mounting apparatus 1b, and holds it by a clamp (not shown). To support.
Next, the mounting head 6 that is moved by the head moving means 7 (X-axis moving means 7a, Y-axis moving means 7b) holds electronic components from the component supply unit 4 and also mounts the electronic components on the substrate P in a predetermined manner. Mount and mount so as to align the location.

  In the first component mounting position 3a, as shown in FIG. 6A, a range 66l in which the mounting head 6 arranged on the left Y-axis frame 71 can mount an electronic component and a right Y The electronic component is mounted on the region of the substrate P corresponding to the range 66r in which the mounting head 6 disposed on the shaft frame 71 can mount the electronic component. However, electronic parts are mounted at a position m corresponding to the range between the ranges 66l and 66r on the substrate P and a position n corresponding to the left side of the range 66l except for the area of the substrate P corresponding to the ranges 66l and 66r. It is not possible.

When the mounting of the predetermined electronic component is completed at the first component mounting position 3a, the board transport means 3 includes an X-axis frame 72 provided on one Y-axis frame 71, as shown in FIG. The substrate P is moved in the transport direction by a distance corresponding to the distance between the tip portions 72b of the other Y-axis frame 71 and the X-axis frame 72, and the substrate is moved to the second component mounting position 3b. P is stopped and supported by being clamped by a clamp (not shown).
Similarly, the mounting head 6 moved by the head moving means 7 (X-axis moving means 7a, Y-axis moving means 7b) holds the electronic components from the component supply unit 4, and the electronic components are mounted on the substrate P. The operation of mounting and mounting so as to align with a predetermined mounting location is continued, and the suction holding and mounting of the electronic components are repeated until all the electronic components are mounted on the substrate P.

Here, the substrate transfer means 3 corresponds to an interval at which the leading ends 72b of the X-axis frame 72 provided in one Y-axis frame 71 and the X-axis frame 72 provided in the other Y-axis frame 71 are separated from each other. The electronic component is mounted at the first component mounting position 3a by switching the substrate P from the first component mounting position 3a to the second component mounting position 3b. Since the position m corresponding to between the ranges 66l and 66r and the position n corresponding to the left side of the range 66l in the substrate P that could not be performed enter the range 66r and the range 66l, respectively. Electronic components can be mounted and mounted at the positions m and n.
Then, electronic components can be mounted on all areas of the substrate P.

As described above, the mounting head 6 in the electronic component mounting apparatus 1b does not protrude from the tip end portion 72b of the X-axis frame 72, and the corresponding substrate while the tip end portions 72b of the X-axis frame 72 are separated from each other. Since the portion P is outside the range of movement of the mounting head 6, an electronic component cannot be mounted on that portion of the substrate P, but this corresponds to the interval at which the tip portions 72 b are separated from the X-axis frame 72. By moving the substrate P in the transport direction by the distance to be transferred, the placement of the substrate P is switched between the first component mounting position 3a and the second component mounting position 3b, so that all regions of the substrate P Components can be mounted.
In particular, electronic components are mounted on the substrate P by the mounting heads 6 of the X-axis frame 72 provided in the left and right Y-axis frames 71 at both the first component mounting position 3a and the second component mounting position 3b. Can be implemented.
Therefore, it can be said that this electronic component mounting apparatus 1b is also an electronic component mounting apparatus that can efficiently mount and mount electronic components on the substrate P.

In the electronic component mounting apparatus 1b, the first component mounting position 3a and the second component mounting position 3b for switching the arrangement of the substrate P are not limited to the above arrangement.
For example, as shown in FIG. 7A, the first component mounting position 3a includes a range 66l in which the mounting head 6 arranged on the left Y-axis frame 71 can mount electronic components, and a right Y The board P is almost evenly placed in the range 66r where the mounting head 6 disposed on the shaft frame 71 can mount the electronic component, and the electronic component cannot be mounted corresponding to the range 66l and 66r. Assume that the position q of the substrate P is formed.
7B, the second component mounting position 3b includes an X-axis frame 72 provided in one Y-axis frame 71 and an X-axis frame 72 provided in the other Y-axis frame 71. The electronic component is mounted at the first component mounting position 3a by moving the substrate P from the first component mounting position 3a in the direction opposite to the transport direction by a distance corresponding to the distance between the front end portions 72b. The position q corresponding to between the ranges 66l and 66r on the substrate P that could not be set is arranged to be within the range 66l side.

Even at the first component mounting position 3a and the second component mounting position 3b, electronic components can be mounted in all regions of the substrate P.
Note that the second component mounting position 3b is the substrate P on which the electronic component could not be mounted at the first component mounting position 3a by moving the substrate P from the first component mounting position 3a in the transport direction. The position q corresponding to between the ranges 66l and 66r may be arranged so as to fall within the range 66r side.

(Embodiment 4)
Next, Embodiment 4 of the electronic component mounting apparatus according to the present invention will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the same part as Embodiment 1 and Embodiment 3, and only a different part is demonstrated.

As shown in FIG. 8, in the electronic component mounting apparatus 1c, the board transfer means 3 moves the board P along the transfer path 33 in the X-axis direction from the front process side (left side in the figure) to the rear process side (right side in the figure). In addition, in order to mount and mount an electronic component on the substrate P by the mounting head 6, the conveyance of the substrate P is stopped at a predetermined component mounting position and the substrate P is supported. In particular, in the electronic component mounting apparatus 1c according to the fourth embodiment, as illustrated in FIG. 8, the first component mounting position 3c on the upstream side in the transport direction of the substrate P in the transport path 33 and the substrate P in the transport path 33. And a second component mounting position 3d on the downstream side in the transport direction.
As shown in FIG. 9, in the first component mounting position 3c, the front end portion Pf of the board P and the front half side (right half side) of the board P are arranged on the Y-axis frame 71 on the left side in the drawing. As shown in FIG. 9, the second component mounting position 3 b is a portion included in a range 66 l in which the mounting head 6 can mount electronic components, as shown in FIG. 9. The rear half side (left half side) is a portion included in a range 66r in which the mounting head 6 arranged on the Y-axis frame 71 on the right side in the drawing can mount electronic components.
Note that a range 66c in which the electronic components can be mounted from the mounting head 6 disposed on the left and right Y-axis frames 71 is also formed by overlapping the range 66l and the range 66r.

The transport path 33 of the substrate transport means 3 includes a first sensor s1 that is a first detection member for positioning the substrate with respect to the first component mounting position 3c, and a second sensor for positioning the substrate with respect to the second component mounting position 3d. And a second sensor s2 that is a detection member.
As shown in FIGS. 9 to 11, the first sensor s <b> 1 detects the rear end portion Pb of the substrate P and serves as a reference position for aligning the rear end portion Pb. The board P is aligned with the first component mounting position 3c.
As shown in FIGS. 9 to 11, the second sensor s <b> 2 detects the front end portion Pf of the substrate P and serves as a reference position for aligning the front end portion Pf. The board P is aligned with the second component mounting position 3d.
Note that a non-contact sensor such as a photoelectric sensor can be applied to the first sensor s1 and the second sensor s2.

Next, the operation of mounting the electronic component on the substrate P in the electronic component mounting apparatus 1c will be described.
First, the substrate transport unit 3 transports the substrate P from the previous process, and based on the detection of the substrate P by the first sensor s1, the substrate P is placed at the first component mounting position 3c in the transport path 33 of the electronic component mounting apparatus 1c. It is stopped and supported by a clamp (not shown).
Next, the mounting head 6 that is moved by the head moving means 7 (X-axis moving means 7a, Y-axis moving means 7b) holds electronic components from the component supply unit 4 and also mounts the electronic components on the substrate P in a predetermined manner. Mount and mount so as to align the location.

  At the first component mounting position 3c, as shown in FIG. 9A, the mounting head 6 disposed on the left Y-axis frame 71 corresponds to a range 66l and a range 66c in which electronic components can be mounted. An electronic component is mounted on a region of the board P to be performed (particularly, the front half side of the board P). However, an electronic component cannot be mounted at the position i corresponding to the left side of the range 66l.

When the mounting of the predetermined electronic component is completed at the first component mounting position 3c, the board transfer means 3 moves the board P in the transfer direction as shown in FIG. 9 and the like, and the board P of the second sensor s2 is moved. Based on the detection, the substrate P is stopped at the second component mounting position 3d in the transport path 33 of the electronic component mounting apparatus 1c, and is supported by being clamped by a clamp (not shown).
Similarly, the mounting head 6 moved by the head moving means 7 (X-axis moving means 7a, Y-axis moving means 7b) holds the electronic components from the component supply unit 4, and the electronic components are mounted on the substrate P. The operation of mounting and mounting so as to align with a predetermined mounting location is continued, and the suction holding and mounting of the electronic components are repeated until all the electronic components are mounted on the substrate P.

  At the second component mounting position 3d, as shown in FIG. 9A, the mounting head 6 disposed on the right Y-axis frame 71 corresponds to a range 66r and a range 66c in which electronic components can be mounted. An electronic component is mounted on a region of the board P to be performed (particularly, the second half side of the board P). However, electronic components cannot be mounted at the position j corresponding to the right side of the range 66r.

Here, the substrate transfer means 3 moves the substrate P in the transfer direction, and the substrate P is detected by the first sensor s1 and the second sensor s2, and the substrate P is moved to the first component mounting position 3c and the second component mounting position. By switching to 3d, the position i corresponding to the left side of the range 66l in the substrate P where the electronic component could not be mounted at the first component mounting position 3c enters the range 66r. An electronic component can be mounted and mounted also at the position i of P. Note that the position j of the board P is within the range 66l at the first component mounting position 3c, and the electronic component is mounted.
Then, electronic components can be mounted on all areas of the substrate P.

As described above, the electronic component mounting apparatus 1c has the first component mounting position 3c that is a pre-process and the second component mounting position 3d that is a post-process, Can be done automatically.
Therefore, it can be said that this electronic component mounting apparatus 1c is also an electronic component mounting apparatus that can efficiently mount and mount electronic components on the substrate P.

  In particular, the first sensor s1 detects the rear end portion Pb of the substrate P, and aligns the rear end portion Pb with the reference position, whereby the substrate P can be aligned with the first component mounting position 3c. Similarly, the second sensor s2 can detect the leading end portion Pf of the substrate P and align the leading end portion Pf with the reference position, thereby aligning the substrate P with the second component mounting position 3d. it can. Then, at the first component mounting position 3c, an electronic component is mounted on the front half side of the board P, and at the second component mounting position 3d, an electronic component is mounted on the rear half side of the board P. can do.

In this way, by detecting and aligning the rear end portion Pb of the substrate P, the first half portion side of the substrate P is included in the range 66l at the first component mounting position 3c. The electronic component can be mounted, and by detecting and aligning the front end portion Pf of the board P, the second half side of the board P is included in the range 66r at the second component mounting position 3d. An electronic component can be mounted on the second half side.
That is, as shown in FIGS. 9A and 9B, the first sensor s1 detects the rear end portion Pb of the substrate P, and aligns the rear end portion Pb with the reference position. Alignment with the first component mounting position 3c, and the second sensor s2 detects the leading end portion Pf of the substrate P, and aligns the leading end portion Pf with the reference position so that the substrate P is in the second position. By aligning with the component mounting position 3d, the substrate P of any size is divided into the first half side and the second half side of the substrate P, and the first component mounting position 3c and the second component mounting position, respectively. In 3d, electronic components can be easily mounted.

The first sensor s1 detects and aligns the rear end Pb of the substrate P at the first component mounting position 3c, and the second sensor mounts the front end Pf of the substrate P at the second component mounting position 3d. The first sensor s1 corresponding to the first component mounting position 3c and the second sensor s2 corresponding to the second component mounting position 3d are in the substrate transport direction. They are arranged at symmetrical positions in the (X-axis direction).
Thereby, for example, in the electronic component mounting apparatus 1c, when the transport direction of the board P is reversed (in FIG. 8, when the board P is transported from the right side to the left side in the drawing), at the second component mounting position 3d. The second sensor s2 detects and aligns the rear end portion of the substrate P, and the first sensor s1 detects and aligns the front end portion of the substrate P at the first component mounting position 3c. . That is, by arranging the first sensor s1 corresponding to the first component mounting position 3c and the second sensor s2 corresponding to the second component mounting position 3d in this manner, Even if the forward direction and the reverse direction are switched, the same alignment can be performed in either the forward direction or the reverse direction. Therefore, it is possible to provide an electronic component mounting apparatus that can carry the substrate P from either the left or right side.
Further, compared to the case where a sensor is arranged between the first component mounting position 3c and the second component mounting position 3d, the boards P to be aligned with each component mounting position can be brought closer to each other, and the positioning position can be freely set. You can raise the degree.

  In the electronic component mounting apparatus 1c, the X-axis moving unit 7a of the head moving unit 7 can move the mounting head 6 along the X-axis frame 72. In particular, the mounting head 6 has one Y-axis frame 71. The X-axis frame 72 provided on the X-axis frame 72 protrudes from the distal end portion 72b side and is explained as being movable from the distal end portion 72b of the X-axis frame 72 provided on the other Y-axis frame 71 to a position closer to the proximal end portion 72a. However, the X-axis moving means 7 a of the head moving means 7 can move the mounting head 6 to the tip end portion 72 b of the X-axis frame 72 and does not protrude from the tip end portion 72 b of the X-axis frame 72. Good.

The application of the present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the spirit of the present invention.
For example, the number of the X-axis frame 72 and the mounting head 6 is arbitrary, and the Y-axis frame 71 may have one configuration each, or three or more configurations.

  In addition, it is needless to say that other specific detailed structures can be appropriately changed.

It is a top view which shows the electronic component mounting apparatus in Embodiment 1 which concerns on this invention. It is explanatory drawing which shows the electronic component mounting possible range with respect to the board | substrate in a component mounting position, and is an example of (a) big board | substrate, (b) middle board | substrate, (c) small board | substrate. It is a top view which shows the electronic component mounting apparatus in Embodiment 2 which concerns on this invention. It is explanatory drawing when the arrangement | positioning of the board | substrate in a component mounting position switches by rotation, (a) Before rotation, (b) After 180 degree rotation is shown. It is a top view which shows the electronic component mounting apparatus in Embodiment 3 which concerns on this invention, (a) 1st component mounting position, (b) 2nd component mounting position is shown. It is explanatory drawing which shows the electronic component mounting possible range with respect to the board | substrate in a component mounting position, (a) 1st component mounting position and (b) 2nd component mounting position are shown. It is explanatory drawing which shows the electronic component mounting possible range with respect to the board | substrate in a component mounting position, (a) 1st component mounting position and (b) 2nd component mounting position are shown. It is a top view which shows the electronic component mounting apparatus in Embodiment 4 which concerns on this invention. It is explanatory drawing which shows the electronic component mounting possible range with respect to the board | substrate in a component mounting position, and is an example of (a) big board | substrate and (b) small board | substrate. It is explanatory drawing which shows the sensor at the time of aligning a board | substrate to the 1st component mounting position and the 2nd component mounting position. It is a top view which shows the conventional electronic component mounting apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1a, 1b, 1c Electronic component mounting apparatus 3 Board | substrate conveyance means 33 Conveyance path 3a, 3c 1st component mounting position 3b, 3d 2nd component mounting position 4 Component supply part 6 Mounting head 6a Adsorption nozzle 66l Electronic component mounting Possible range 66r Electronic component mountable range 7 Head moving means 7a X-axis moving means 7b Y-axis moving means 71 Y-axis frame (first frame)
72 X-axis frame (second frame)
72a Base end 72b Front end P Substrate Pf Front end Pb Rear end s1 First sensor (first detection member)
s2 Second sensor (second detection member)

Claims (6)

Substrate transport means for transporting the substrate along a predetermined transport path;
A component supply unit for supplying electronic components to be mounted on the substrate;
A pair of first frames provided to straddle the conveyance path;
Each of the first frames is provided with a base end portion, and the tip end portion is disposed so as to be opposed to the first frame from the first frame toward the other first frame, and along the first frame. A second frame movably provided;
A mounting head provided movably along each second frame,
While the mounting head holds the electronic component supplied by the component supply unit, the electronic component is mounted on the substrate ,
The mounting head protrudes from the distal end side of the second frame provided in one first frame and moves to a position closer to the proximal end side than the distal end portion of the second frame provided in the other first frame. An electronic component mounting apparatus characterized by being made possible. When the mounting head faces the first component mounting position where the mounting head mounts the electronic component on the substrate, and the front end of each second frame provided in each first frame the distance corresponding to a distance spaced, the first to switch from the mounting position to the second component mounting position for at least moved to claim 1, characterized in that has become capable of transferring the substrate The electronic component mounting apparatus described. The substrate transport means has a first component mounting position on the upstream side in the transport direction of the substrate in the transport path, and a second component mounting position on the downstream side in the transport direction of the substrate in the transport path, A first detection member for detecting a rear end portion of the substrate for aligning the substrate with the first component mounting position; and the substrate for aligning the substrate with the second component mounting position. The electronic component mounting apparatus according to claim 1 , further comprising: a second detection member that detects a tip portion of the electronic component. 4. The electronic component mounting apparatus according to claim 1, further comprising a substrate rotating unit configured to rotate the substrate about an axis perpendicular to a mounting surface of the substrate. 5. 5. The electronic component mounting apparatus according to claim 1 , wherein the component supply unit is provided on both sides of the conveyance path. 6. The electronic component according to claim 5 , wherein a plurality of the second frame and the mounting head are provided in each first frame so as to correspond to the component supply units provided on both sides of the conveyance path. Mounting device.

Images