JP4697177B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component on a substrate.

An electronic component line for mounting electronic components on a substrate is generally configured by connecting a plurality of electronic component mounting apparatuses. In each electronic component mounting apparatus, an electronic component is picked up from a component supply unit and transferred and mounted on the substrate. The component mounting operation is repeatedly executed. As such an electronic component mounting apparatus, an electronic component mounting apparatus having a plurality of mounting heads is known (see Patent Document 1). By providing a plurality of mounting heads in this way, there is an advantage that the work efficiency of the component mounting work in each electronic component mounting apparatus can be improved.
JP 2004-253447 A

  However, the electronic component mounting apparatus equipped with the plurality of mounting heads described above has the following drawbacks. That is, in the electronic component mounting apparatus, it is likely that a malfunction of the mounting head having a plurality of suction nozzles for sucking and holding the electronic component, particularly a malfunction of the mounting head occurs during operation. Therefore, not only the electronic component mounting apparatus but also the entire electronic component mounting line must be stopped. As the number of electronic component mounting devices constituting the electronic component mounting line increases and the number of mounting heads installed in each electronic component mounting device increases, the probability that this device stop will occur increases. This was one of the factors that reduced the utilization rate.

  Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that can prevent the operation stop of the device due to a failure of the mounting head and improve the facility operation rate.

  The electronic component mounting apparatus according to the present invention targets each of the first mounting area and the second mounting area obtained by dividing the mounting area set in the transport path for transporting the substrate in the first direction into two in the first direction. An electronic component mounting apparatus having a configuration in which a first component mounting mechanism and a second component mounting mechanism for performing a component mounting operation are arranged to face each other in the first direction, wherein the first component mounting mechanism and the first component mounting mechanism The second component mounting mechanism includes a second direction moving mechanism disposed in a second direction orthogonal to the first direction, and a first moving in the second direction by being cantilevered by the second direction moving mechanism. And a mounting head that is detachably mounted on the first direction moving mechanism, moves in the first direction, takes out an electronic component from a component supply unit, and mounts the electronic component on the substrate. Mounting mechanism and second component mounting machine In each of the first direction moving mechanisms, the ends of the respective cantilever support structures are connected by aligning each other in the first direction so that the mounting head is connected between the two first direction moving mechanisms connected. Can be transferred to each other.

The electronic component mounting method of the present invention targets each of the first mounting area and the second mounting area obtained by dividing the mounting area set in the transport path for transporting the substrate in the first direction into two in the first direction. A first component mounting mechanism and a second component mounting mechanism for performing a component mounting operation are arranged opposite to each other in the first direction, and the first component mounting mechanism and the second component mounting mechanism are A second direction moving mechanism disposed in a second direction orthogonal to the one direction, a first direction moving mechanism that is cantilevered by the second direction moving mechanism and moves in the second direction, and the first direction A board in the mounting area is mounted by an electronic component mounting apparatus that includes a mounting head that is detachably mounted on a moving mechanism, moves in the first direction, takes out an electronic component from a component supply unit, and is mounted on the board. Mount electronic components on In the electronic component mounting method, the mounting head fails in either the first component mounting mechanism or the second component mounting mechanism during operation of the electronic component mounting apparatus, and the first mounting area or If the component mounting for the mounting area 2 becomes impossible, the first direction moving mechanism after removing the failed mounting head and the first direction moving mechanism of the opposing component mounting mechanism are mutually connected. Are aligned in the first direction to connect the end portions of the respective cantilever support structures, and the already mounted mounting heads mounted on the first direction moving mechanisms of the component mounting mechanisms facing each other are connected to the connected 2 The component mounting operation for the first mounting area and the second mounting area is continuously executed by the already mounted mounting head by transferring between the first direction moving mechanisms. That.

  According to the present invention, the first component mounting mechanism and the second component mounting mechanism that execute the component mounting operation for the first mounting area and the second mounting area, each of which divides the mounting area, are opposed to each other. If the mounting head fails during operation of the electronic component mounting apparatus, the first direction moving mechanism and the first direction of the component mounting mechanism that face each other are the first direction moving mechanism on which the mounting head is mounted. The mounting heads that have already been mounted are transferred between the two first-direction moving mechanisms, and the component mounting work for the entire range of the mounting area is continued with this mounting head. As a result, it is possible to prevent the operation of the apparatus from being stopped due to a problem with the mounting head and to improve the equipment operation rate.

(Embodiment 1)
FIG. 1 is a configuration explanatory diagram of an electronic component mounting line according to the first embodiment of the present invention, FIG. 2 is a plan view of the electronic component mounting apparatus according to the first embodiment of the present invention, and FIGS. FIG. 5, FIG. 6, FIG. 7 are operation explanatory views of the electronic component mounting apparatus according to the first embodiment of the present invention, and FIG. 8 is the electronic component according to the first embodiment of the present invention. It is a top view of a mounting apparatus.

  First, the configuration of the electronic component mounting line will be described with reference to FIG. This electronic component mounting line is configured by connecting a plurality of electronic component mounting devices MT1, MT2, MT3, MT4 (hereinafter collectively referred to as an electronic component mounting device MT) in series. These electronic component mounting apparatuses MT have the same structure, each having a transport unit 2 mounted on the base unit 1 (see FIGS. 3 and 4), and a component mounting mechanism described below disposed above the transport unit 2. The arrangement is arranged. The transport unit 2 includes transport paths 2a arranged in the X direction (first direction), and transports the substrate 3 to be mounted in the X direction by connecting the transport paths 2a of the electronic component mounting apparatuses MT. A transfer line is formed. In each electronic component mounting apparatus MT, a mounting stage S for mounting an electronic component on the substrate 3 is set in the transport path 2a, and the substrate 3 carried into each electronic component mounting apparatus MT along the transport line is set. On the other hand, an electronic component is mounted by a component mounting mechanism.

  Next, the configuration of each electronic component mounting apparatus MT will be described with reference to FIGS. In FIG. 2, only the electronic component mounting apparatus MT1 is described with reference numerals, but the other electronic component mounting apparatuses MT have the same structure. 3A, 3B, and 4 show the AA, BB, and CC sections in FIG. 2, respectively. As shown in FIG. 2, in each of the electronic component mounting apparatuses MT, a first component mounting mechanism M1 and a second component mounting mechanism M2 are arranged opposite to each other in the X direction, and the first component mounting is performed. The mechanism M1 and the second component mounting mechanism M2 execute a component mounting operation for each of the first mounting stage S1 and the second mounting stage S2 obtained by dividing the mounting stage S shown in FIG.

  As shown in FIG. 3 and FIG. 4, each electronic component mounting apparatus MT mounts each electronic component on a common base unit 1 with a transport unit 2 provided with a transport path 2a for transporting the substrate 3 in the X direction. The first component mounting mechanism M1 and the second component mounting mechanism M2 are arranged above the transport unit 2 and arranged for each apparatus MT. Although an example in which the transport unit 2 is associated with each electronic component mounting apparatus MT is shown here, the transport unit 2 is divided into transport units for each component mounting mechanism, and these transport units are arranged on the base unit 1. The structure arranged in parallel may be sufficient.

  The configurations of the first component mounting mechanism M1 and the second component mounting mechanism M2 will be described. As shown in FIGS. 2 and 3A, linear motor drive Y-axis moving tables 6A and 6B are arranged at both ends in the X direction of the electronic component mounting apparatus MT1, respectively. On the Y-axis moving tables 6A and 6B, cantilever beam-shaped X-axis moving tables 7A and 7B are cantilevered and extended to the first mounting stage S1 and second mounting stage S2. By driving the Y-axis movement tables 6A and 6B, the X-axis movement tables 7A and 7B move in the Y direction (second direction). The Y-axis moving tables 6A and 6B are second-direction moving mechanisms arranged in a second direction orthogonal to the first direction, and the X-axis moving tables 7A and 7B are separated from the second-direction moving mechanism. The first direction moving mechanism is supported and moved in the second direction.

  As shown in FIG. 3A, on the X-axis moving tables 7A and 7B, mounting heads 8A and 8B each provided with a nozzle (not shown) for attracting and holding an electronic component at the lower end are movable in the X direction. It is attached to. The X-axis movement tables 7A and 7B are linear motor driven, and the mounting heads 8A and 8B are slidable along the linear guide rails arranged in the X direction on the X-axis movement tables 7A and 7B. . Due to the interaction between the stator arranged in the X direction on the X-axis moving tables 7A and 7B and the mover provided on the moving plate (not shown) to which the mounting heads 8A and 8B are fixed, the mounting head 8A, 8B moves in the X direction together with the moving plate.

  Here, the X-axis moving tables 7A and 7B are cantilevered and extended from the Y-axis moving tables 6A and 6B so that the end portions can approach each other through a fine gap. By aligning the positions of 7A and 7B in the Y direction and aligning them in the X direction, the mounting heads 8A and 8B can be transferred between the X-axis moving tables 7A and 7B as described later. It is like that.

  On one side of the transport path 2a, component supply units 4A and 4B are arranged corresponding to the first mounting stage S1 and the second mounting stage S2, and each of the component supply units 4A and 4B includes a plurality of components. A tape feeder 5 is provided in parallel. The tape feeder 5 stores a carrier tape holding an electronic component to be mounted. By pitch feeding the carrier tape, the tape feeder 5 is moved to a component pickup position in the first component mounting mechanism M1 and the second component mounting mechanism M2. Supply electronic components. In the component pick-up operation, the mounting heads 8A and 8B are first moved to the component supply units 4A and 4B by the Y-axis movement table 6A, the X-axis movement table 7A, the Y-axis movement table 6B, and the X-axis movement table 7B, respectively. Then, the suction nozzles provided in the mounting heads 8A and 8B are moved up and down to take out the electronic components from the tape feeder 5.

  Component recognition cameras 9A and 9B are arranged in a path along which the mounting heads 8A and 8B that have taken out electronic components from the component supply units 4A and 4B move to the first mounting stage S1 and the second mounting stage S2. When the mounting heads 8A and 8B holding electronic components move above the component recognition cameras 9A and 9B, the component recognition cameras 9A and 9B image the electronic components held by the mounting heads 8A and 8B from below. By recognizing the imaging result, the position of the electronic component in the state held by the mounting heads 8A and 8B is detected.

  When the mounting heads 8A and 8B are moved to the first mounting stage S1 and the second mounting stage S2 to mount electronic components on the board 3, the position detection result is taken into consideration when the electronic components are mounted. Correction is performed. The mounting heads 8A and 8B are detachably mounted on X-axis moving tables 7A and 7B, which are first-direction moving mechanisms, move in the X direction, take out electronic components from the component supply units 4A and 4B, and mount them on the substrate 3. To do.

  That is, the first component mounting mechanism M1 and the second component mounting mechanism M2 provided in the electronic component mounting apparatus MT are arranged in the Y direction (second direction) orthogonal to the X direction (first direction). Y-axis moving tables 6A and 6B, X-axis moving tables 7A and 7B that are cantilevered by Y-axis moving tables 6A and 6B and move in the Y direction, and X-axis moving tables 7A and 7B are detachably mounted. It is configured to include mounting heads 8A and 8B that move in the X direction, take out electronic components from the component supply units 4A and 4B, and mount them on the substrate 3.

  At the moving end of one side (upper side in FIG. 2) of the Y-axis moving tables 6A and 6B, spare X-axis moving tables 10A and 10B having the same configuration as the X-axis moving tables 7A and 7B are movable in the Y direction. It is installed. The structures of the X-axis movement tables 7A and 7B and the spare X-axis movement tables 10A and 10B are symmetric with respect to the X direction. As a result, the linear guide rails and linear motor stators arranged on the X-axis moving tables 7A and 7B are aligned in the X direction, and their ends are connected to each other so that they can be attached to either. The slider to which the mounting head 8A and the mounting head 8B that have been combined can be fitted to the mating linear guide rail.

  Therefore, the mounting heads 8A and 8B can be transferred to the connected X-axis moving tables 7A and 7B. The transfer of the mounting heads 8A and 8B is not only between the X-axis movement table 7A and the X-axis movement table 7B but also between the X-axis movement tables 7A and 7B and the spare X-axis movement tables 10A and 10B. This is also possible between a pair of X-axis moving tables that can be aligned in a row. The paired X-axis movement tables after being connected always move synchronously in the movement in the Y direction by the Y-axis movement tables 6A and 6B, and operate as one X-axis movement table.

  That is, the first component mounting mechanism M1 and the second component mounting mechanism M2 respectively include spare X-axis movement tables 10A and 10B having the same configuration as the X-axis movement tables 7A and 7B. The X-axis moving tables 7A of M1 and the second component mounting mechanism M2 are connected to each other in the cantilever support structure by aligning each other in the X direction, and the mounting heads 8A and 8B are connected. It is possible to transfer between the two X-axis moving tables 7A.

  The mounting head storage portions 11A and 11B are located above the component supply portions 4A and 4B at positions corresponding to the moving ends on the other side (lower side in FIG. 2) of the Y-axis moving tables 6A and 6B. Has been. As shown in FIG. 3B, the mounting head storage portions 11A and 11B place the mounting heads 8A and 8B removed from the X-axis movement tables 7A and 7B, and store and hold them in a freely removable manner. When the mounting heads 8A and 8B are remounted on the X axis movement tables 7A and 7B, the X axis movement tables 7A and 7B are reaccessed to the mounting head storage portions 11A and 11B to perform the head mounting operation. The mounting heads 8A and 8B can be remounted on the X-axis moving tables 7A and 7B.

In other words, the electronic component mounting apparatus MT includes mounting head storage portions 11A and 11B for storing and holding the mounting heads 8A and 8B attached to and detached from the X-axis moving tables 7A and 7B. The mounting heads 8A and 8B can be attached and detached automatically by providing a tool change function in the mounting head storage portions 11A and 11B or the X-axis movement tables 7A and 7B, or manually by an operator. May be.

  Next, an electronic component mounting method by each electronic component mounting apparatus MT constituting the electronic component mounting line will be described with reference to FIGS. Although only the component mounting operation in the electronic component mounting apparatus MT1 has been described here, the same applies to other electronic component mounting apparatuses MT. In the component mounting operation by the electronic component mounting apparatus MT1, both the first component mounting mechanism M1 and the second component mounting mechanism M2 are in an operating state, and the X axis movement table 7A, The electronic components are taken out by the mounting heads 8A and 8B mounted on 7B and transferred and mounted on the substrate 3. At this time, for the ranges included in the first mounting stage S1 and the second mounting stage S2 of the substrate 3, component mounting operations are individually performed by the mounting heads 8A and 8B.

  In the process of continuously executing such component mounting work, one of the mounting heads 8A and 8B may fail for some reason, and the component mounting work by the mounting head may not be continued. FIG. 5A shows a state in which the mounting head 8B of the second component mounting mechanism M2 has failed (see mounting head 8B * painted in black) and cannot be used. In such a case, as shown in FIG. 5B, the X-axis moving table 7B is accessed to the mounting head storage section 11B, and the failed mounting head 8B * is mounted and stored in the mounting head storage section 11B. Hold.

  Next, as shown in FIG. 6A, the X-axis moving table 7B after the mounting head 8B * is placed on the mounting head storage portion 11B and stored and held is returned to the mounting stage to move the X-axis. The end portions of the cantilever support structures of the X-axis moving table 7A and the X-axis moving table 7B are connected with the table 7A. Next, as shown in FIG. 6B, the already mounted mounting head 8A mounted on the X-axis moving table 7A of the first component mounting mechanism M1 facing each other is connected to two X-axis moving tables 7A connected to each other. , 7B between each other. Then, by the mounting head 8A, the component mounting operation is continuously executed for both the first mounting stage S1 and the second mounting stage S2 on the substrate 3.

  In such a case, spare X-axis movement tables 10A and 10B may be used instead of the usual X-axis movement tables 7A and 7B. That is, as shown in FIG. 7 (a), the standby X-axis movement table 10B on standby at one end of the Y-axis movement table 6B is moved above the substrate 3 and is at a position opposite to the X-axis movement table 7B. The X-axis moving table 7A and the spare X-axis moving table 10B are aligned with each other in the X direction, and the ends of the cantilever support structures of the X-axis moving table 7A and the spare X-axis moving table 10B are connected.

  Then, as shown in FIG. 7B, the already mounted mounting head 8A mounted on the X-axis moving table 7A of the first component mounting mechanism M1 is connected to two X-axis moving tables 7A connected to each other and a spare X. Transfer between the axis movement tables 10B. Similarly, the component mounting operation is continuously performed on the substrate 3 for both the first mounting stage S1 and the second mounting stage S2 by the mounting head 8A.

That is, in the electronic component mounting method shown in the present embodiment, the mounting head fails in either the first component mounting mechanism M1 or the second component mounting mechanism M2 while the electronic component mounting apparatus MT is in operation. If component mounting for the first mounting area S1 or the second mounting area S2 becomes impossible, component mounting opposite to the X-axis moving tables 7A and 7B after removing the failed mounting head The X-axis moving tables 7A and 7B of the mechanism are aligned with each other in the X direction to connect the end portions of the respective cantilever support structures. Then, the already mounted mounting heads mounted on the X-axis moving tables 7A and 7B of the component mounting mechanisms facing each other are connected to the connected 2
By transferring between the two X-axis moving tables, the component mounting work for the first mounting area S1 and the second mounting area S2 is continuously executed by the already mounted mounting head. I am doing so.

  Furthermore, if the first component mounting mechanism M1 and the second component mounting mechanism M2 have the spare X-axis movement tables 10A and 10B having the same configuration as the X-axis movement tables 7A and 7B, respectively, the failure has occurred. In place of the X-axis moving tables 7A and 7B on which the mounting heads are mounted, the spare X-axis moving tables 10A and 10B are aligned in the X direction with the X-axis moving tables 7A and 7B of the component mounting mechanism facing each other. Between the two X-axis moving tables connected to the already mounted mounting heads, and mounting the components for the first mounting area S1 and the second mounting area S2 with the already mounted mounting heads. Continue work.

  The electronic component mounting apparatus MT shown in the present embodiment can be applied to various mounting forms. For example, as shown in FIG. 8, both electronic component mounting apparatuses MT2 have the component supply units 4A and 4B. One component supply tray 12 can be mounted and used across the component supply unit. That is, in the case of the tray system, the mounting head for taking out the electronic component from the tray requires a head moving mechanism that includes the entire range of the tray in the range to be taken out by the mounting head. The first component mounting mechanism M1 and the second component mounting mechanism M2 originally provided in the MT2 can move the mounting head only within the range of the component supply units 4A and 4B provided corresponding to each. .

  In such a case, as shown in FIG. 8, the X-axis moving table 7A of the first component mounting mechanism M1 and the spare X-axis moving table 10B of the second component mounting mechanism M2 are aligned, and the mounting head 8A. Is moved between the X-axis moving table 7A and the spare X-axis moving table 10B, the moving range of the mounting head 8A can be expanded to a range that covers both the component supply units 4A and 4B. . Therefore, even when the large component supply tray 12 is used, the entire range of the component supply tray 12 can be included in the extraction target range by the mounting head 8A.

(Embodiment 2)
FIG. 9 is a plan view of the electronic component mounting apparatus according to the second embodiment of the present invention. The electronic component mounting apparatuses MT1A and MT2A shown in FIG. 9 are configured by removing the mounting head storage portions 11A and 11B from the electronic component mounting apparatuses MT1 and MT2 shown in FIG. This embodiment has the most basic and simple configuration, and does not have a function of mounting and holding the mounting head 8A and the mounting head 8B in the mounting head storage portions 11A and 11B, but an electronic component mounting apparatus. Similar to MT1 and electronic component mounting apparatus MT2, when necessary, spare X-axis movement tables 10A and 10B can be moved from the standby position and connected to X-axis movement table 7A or X-axis movement table 7B. Thereby, the same effect as in the first embodiment is obtained.

(Embodiment 3)
FIG. 10 is a plan view of the electronic component mounting apparatus according to the third embodiment of the present invention. The electronic component mounting devices MT1B and MT2B shown in FIG. 10 remove the mounting head storage portions 11A and 11B and place the component supply portions 4A and 4B on both sides of the transport path 2a in the electronic component mounting devices MT1 and MT2 shown in FIG. And two X-axis movement tables 7A and 7B are provided for each of the component supply units 4A and 4B. As a result, the mounting capability can be doubled as compared with the electronic component mounting apparatus MT1 and the electronic component mounting apparatus MT2, and when either of the two mounting heads 8A or 8B fails, the mounting head is The held X-axis movement tables 7A and 7B can be connected to the opposed X-axis movement tables 7A and 7B. Thereby, the same effect as in the first embodiment is obtained.

(Embodiment 4)
FIG. 11 is a plan view of the electronic component mounting apparatus according to the fourth embodiment of the present invention. The electronic component mounting apparatus MT1C shown in FIG. 11 is the same as the electronic component mounting apparatus MT1 shown in FIG. 2 except that the component supply units 4A and 4B are provided on both sides of the transport path 2a. Two moving tables 7A and 7B are provided, and mounting head storage portions 11A and 11B for storing mounting heads 8A and 8B mounted on these X-axis moving tables 7A and 7B are provided on both sides of the transport path 2a. It is in the form provided.

  Further, the electronic component mounting apparatus MT2C shows an example in which one component supply tray 12 is mounted and used in the component supply sections 4A and 4B on one side in the electronic component mounting apparatus MT1C as in the example shown in FIG. Yes. Also in this case, the X-axis moving table 7A of the first component mounting mechanism M1C and the spare X-axis moving table 10B of the second component mounting mechanism M2C are aligned, and the mounting head 8A is aligned with the X-axis moving table 7A. By moving to and from the X-axis movement table 10B, the movement range of the mounting head 8A is expanded to a range that covers both the component supply units 4A and 4B.

  As described above, in the electronic component mounting apparatus and the electronic component mounting method described in each embodiment, component mounting is performed for each of the first mounting area S1 and the second mounting area S2 obtained by dividing the mounting area S into two. If the first component mounting mechanism M1 and the second component mounting mechanism M2 that perform the work are arranged to face each other and the mounting head fails during operation of the electronic component mounting apparatus, the mounting head is mounted. The X-axis moving table is aligned with the opposing X-axis moving table and connected to each other, and the already mounted mounting heads are transferred between the two X-axis moving tables so that the mounting area The component mounting work for the entire range is continuously executed.

  As a result, in the electronic component mounting line configured by connecting a plurality of electronic component mounting apparatuses each having a plurality of mounting heads, even if a problem occurs in any of a large number of mounting heads, It is possible to execute a component mounting operation that should be originally performed by a mounting head that has caused a problem with the mounting head. Therefore, it is possible to prevent the apparatus from being stopped due to the trouble of the mounting head and improve the equipment operation rate.

  The electronic component mounting apparatus and the electronic component mounting method according to the present invention have an effect of preventing the stoppage of the operation of the apparatus due to the trouble of the mounting head and improving the facility operation rate, and mounting the electronic component on the substrate. It can be used in the field of manufacturing mounting boards.

Structure explanatory drawing of the electronic component mounting line of Embodiment 1 of this invention The top view of the electronic component mounting apparatus of Embodiment 1 of this invention Sectional drawing of the electronic component mounting apparatus of Embodiment 1 of this invention Sectional drawing of the electronic component mounting apparatus of Embodiment 1 of this invention Operation | movement explanatory drawing of the electronic component mounting apparatus of Embodiment 1 of this invention Operation | movement explanatory drawing of the electronic component mounting apparatus of Embodiment 1 of this invention Operation | movement explanatory drawing of the electronic component mounting apparatus of Embodiment 1 of this invention The top view of the electronic component mounting apparatus of Embodiment 1 of this invention The top view of the electronic component mounting apparatus of Embodiment 2 of this invention The top view of the electronic component mounting apparatus of Embodiment 3 of this invention The top view of the electronic component mounting apparatus of Embodiment 4 of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base unit 2 Conveyance unit 2a Conveyance path 3 Board | substrate 4A, 4B Component supply part 5 Tape feeder 6A, 6B Y-axis movement table 7A, 7B X-axis movement table 8A, 8B Mount head 10A, 10B Reserve X-axis movement table 11A, 11B Mounted head storage section MT1, MT2, MT3, MT4 Electronic component mounting apparatus MT1A, MT2A, MT1B, MT2B, MT1C, MT2C Electronic component mounting apparatus M1, M1A, M1B, M1C First component mounting mechanism M2, M2A, M2B, M2C Second component mounting mechanism S1 First mounting stage S2 Second mounting stage

Claims (6)

A component mounting operation is performed for each of a first mounting area and a second mounting area obtained by dividing the mounting area set in the transport path for transporting the substrate in the first direction into two in the first direction. An electronic component mounting apparatus having a configuration in which a component mounting mechanism and a second component mounting mechanism are arranged to face each other in the first direction,
The first component mounting mechanism and the second component mounting mechanism are cantilevered by a second direction moving mechanism disposed in a second direction orthogonal to the first direction and the second direction moving mechanism. A first direction moving mechanism that moves in the second direction, and a mounting head that is detachably attached to the first direction moving mechanism, moves in the first direction, takes out an electronic component from a component supply unit, and is mounted on the substrate And
Each of the first direction moving mechanisms of the first component mounting mechanism and the second component mounting mechanism aligns each other in the first direction so that ends of the respective cantilever support structures are connected to each other so that the mounting head The electronic component mounting apparatus can be transferred between the two connected first direction moving mechanisms.   2. The electronic component mounting according to claim 1, wherein each of the first component mounting mechanism and the second component mounting mechanism includes a spare first direction moving mechanism having the same configuration as the first direction moving mechanism. apparatus.   3. The electronic component mounting apparatus according to claim 1, further comprising a mounting head storage portion that detachably stores and holds the mounting head attached to and detached from the first direction moving mechanism. A component mounting operation is performed for each of a first mounting area and a second mounting area obtained by dividing the mounting area set in the transport path for transporting the substrate in the first direction into two in the first direction. The component mounting mechanism and the second component mounting mechanism are arranged facing each other in the first direction,
The first component mounting mechanism and the second component mounting mechanism are cantilevered by a second direction moving mechanism disposed in a second direction orthogonal to the first direction and the second direction moving mechanism. A first direction moving mechanism that moves in the second direction, and a mounting head that is detachably attached to the first direction moving mechanism, moves in the first direction, takes out an electronic component from a component supply unit, and is mounted on the substrate An electronic component mounting method for mounting an electronic component on a substrate in the mounting area by an electronic component mounting apparatus having a configuration each comprising:
A component targeting the first mounting area or the second mounting area due to a failure of a mounting head in either the first component mounting mechanism or the second component mounting mechanism during operation of the electronic component mounting apparatus. If mounting becomes impossible, the first direction moving mechanism after removing the failed mounting head and the first direction moving mechanism of the component mounting mechanism opposite to each other are aligned with each other in the first direction. The end portions of the cantilever support structure are connected, and the already mounted mounting head mounted on the first direction moving mechanism of the component mounting mechanism facing each other is connected between the two connected first direction moving mechanisms. The component mounting operation for the first mounting area and the second mounting area is continuously executed by the already mounted mounting heads by being transferred to each other. Method.   Each of the first component mounting mechanism and the second component mounting mechanism includes a spare first direction moving mechanism having the same configuration as the first direction moving mechanism, and the first direction in which the failed mounting head is mounted. 5. The electronic component mounting method according to claim 4, wherein the spare first direction moving mechanism is aligned with the first direction moving mechanism of the opposing component mounting mechanism in the first direction instead of the moving mechanism. 5. A mounting head storage portion that detachably stores and holds the mounting head that is attached to and detached from the first direction moving mechanism, and the failed mounting head is placed in the mounting head storage portion. Or the electronic component mounting method of 5.

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