JP7011441B2 - Mounting device and mounting method - Google Patents

Description

The present invention relates to a mounting device and a mounting method for mounting components on a substrate.

Generally, a plurality of feeders are arranged side by side in a mounting device, and each feeder feeds parts toward a supply position with respect to the mounting head. When the feeder of the mounting device is replaced, the first component is sent out until it reaches the supply position, and the component is automatically cueed. Conventionally, as a mounting device of this type, a device in which a component is cueed by image recognition is known (see, for example, Patent Document 1). In the mounting device described in Patent Document 1, the camera is positioned at the supply position, and the parts are cueed out by feeding out the parts one pitch at a time until the parts are recognized by the camera.

Japanese Unexamined Patent Publication No. 2011-155051

However, in the cueing operation described in Patent Document 1, the camera must be moved to the supply position of each feeder, and it takes time to complete the cueing operation, causing tact down. Further, in the cueing operation by image recognition, the parts are limited to the parts within the image frame size that can be captured by the camera, and the parts size and the parts type that can be cueed are limited.

The present invention has been made in view of this point, and an object of the present invention is to provide a mounting device and a mounting method capable of suppressing tact down and performing a cueing operation regardless of a component size, a component type, or the like. Let it be one.

The mounting device of one aspect of the present invention is a mounting device that picks up a component supplied from a feeder with a mounting head and mounts it on a substrate, and has a detection unit that detects the component picked up by the mounting head and the detection. It is equipped with a first determination unit that determines the success or failure of the pickup according to the detection result of the unit, mounts the component on the board with the mounting head when the pickup is successful, and until the pickup succeeds when the pickup fails. When the parts are sent out repeatedly by the feeder and the pickup is successful, the cue information is set to cueed and the parts are mounted on the board by the mounting head, and the pickup fails during production. Is provided with a second determination unit that determines whether or not cueing has been completed based on the cueing information before the feeding operation. If not, the delivery operation of the component is performed .

The mounting method of one aspect of the present invention is a mounting method in which a component supplied from a feeder is picked up by a mounting head and mounted on a board, and is a step of detecting a component picked up by the mounting head and a detection step. The first determination step of determining the success or failure of the pickup according to the detection result of the knowledge unit, the step of mounting the component on the board with the mounting head when the pickup is successful, and the pickup are successful when the pickup fails. The step of repeating the parts feeding operation by the feeder, and the step of setting the cueing information to cueing and mounting the parts on the board with the mounting head when the pickup is successful, and the pickup during production If it fails, the second determination step of determining whether or not the cueing has been completed based on the cueing information before the feeding operation, and if the cueing has been completed, the out of parts is notified and the cueing is performed. If not completed, it is characterized by having a step of carrying out the delivery operation of the component.

According to these configurations, when the pickup of the component by the mounting head fails, the component is sent out by the feeder until the pickup is successful, and the component is cueed. That is, the cueing operation is performed by utilizing the parts feeding operation during the pickup operation. Since it is not necessary to move a device for recognizing parts such as a camera to the parts supply position, the movement time can be shortened and tact down can be suppressed. Further, since the cueing operation is performed depending on the success or failure of the pick-up of the parts, the parts capable of the cueing operation are not limited by the part size, the part type, and the like. In addition, it is possible to manage as cue information whether or not cueing has been completed according to the success or failure of the pickup. In addition, it is possible to distinguish whether the cause of the pickup failure is due to a part shortage or a non-cueing. Therefore, when the pickup fails due to the out of parts, the operator is notified of the out of parts and the parts are not repeatedly sent out.

In the above-mentioned mounting device, a recognition unit for recognizing a component sent to a supply position with respect to the mounting head is provided, and before the start of production, the component is sent out by the feeder until the component is recognized by the recognition unit. According to this configuration, before the start of production, the parts are sent out by the feeder until they are recognized by the recognition unit without picking up the parts, and the parts are cueed. Therefore, it is possible to prevent a malfunction caused by the pickup before the start of production.

In the above mounting device, a pair of feeder banks in which a plurality of feeders are arranged side by side is provided, and when a component runs out in one of the feeder banks, the component is supplied to the feeder in the other feeder bank. If the pickup is successful during non-stop production where the tip is switched and one of the feeder banks can be replaced, the component is mounted on the board with the mounting head, and if the pickup fails, the pickup is successful. The feeding operation of the parts by the feeder is repeated until the operation is performed. According to this configuration, even if the cueing information of a plurality of feeders is reset by exchanging the feeder banks, the feeders that have already been cueed can be moved to the mounting operation without performing the component feeding operation. .. Therefore, the cueing operation is not performed for each feeder during non-stop production, and the tact loss can be significantly reduced.

According to the present invention, by utilizing the component feeding operation during the pickup operation, it is possible to perform the cueing operation regardless of the component size, component type, etc. while suppressing tact loss.

It is a schematic diagram which shows the whole mounting apparatus of this embodiment. It is a schematic diagram which shows the periphery of the mounting head of this embodiment. It is explanatory drawing which shows the change of the cue information of this embodiment. It is explanatory drawing of the cueing operation of the comparative example. It is a block diagram of the mounting apparatus of this embodiment. It is explanatory drawing of the delivery operation of this embodiment. It is a flowchart of the implementation method of the comparative example. It is a flowchart of the implementation method of this embodiment.

Hereinafter, the mounting device of the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a schematic view showing the entire mounting device of the present embodiment. FIG. 2 is a schematic view showing the periphery of the mounting head of the present embodiment. FIG. 3 is an explanatory diagram showing changes in cue information according to the present embodiment. FIG. 4 is an explanatory diagram of the cueing operation of the comparative example. The mounting device of this embodiment is only an example, and can be changed as appropriate.

As shown in FIG. 1, the mounting device 1 is configured to mount the component P (see FIG. 2) supplied by the feeder 13 at a predetermined position on the substrate W by the mounting head 30. The base 10 of the mounting apparatus 1 is provided with a substrate transport unit 11 that transports the substrate W in the X-axis direction. The board transfer unit 11 carries the board W before mounting the component from one end side in the X-axis direction under the mounting head 30 and positions the board W after mounting the component from the other end side in the X-axis direction to the outside of the device. I am carrying it out. Further, on both sides of the substrate transport portion 11 are separably connected feeder banks 12 in which a plurality of feeders 13 are arranged side by side in the X-axis direction.

A tape reel 14 is detachably attached to the feeder 13, and a carrier tape in which a large number of parts P are packaged is wound around the tape reel 14. The feeder 13 sequentially sends out the parts P toward the supply position picked up by the mounting head 30 by the rotation of the sprocket wheel in the apparatus. At the supply position of the mounting head 30, the cover tape on the surface is peeled off from the carrier tape, and the component P in the pocket of the carrier tape is exposed to the outside. In the present embodiment, the tape feeder is exemplified as the feeder 13, but other feeders may be provided.

A moving mechanism 20 for horizontally moving the pair of mounting heads 30 in the X-axis direction and the Y-axis direction is provided on the base 10. The moving mechanism 20 has a pair of Y-axis drive units 21 extending in the Y-axis direction and an X-axis drive unit 22 extending in the X-axis direction. The pair of Y-axis drive units 21 are supported by support units (not shown) erected at the four corners of the base 10, and the X-axis drive unit 22 can be moved to the pair of Y-axis drive units 21 in the Y-axis direction. is set up. Further, the mounting head 30 is movably installed on the X-axis drive unit 22 in the X-axis direction, and the mounting head 30 is horizontally moved by the X-axis drive unit 22 and the Y-axis drive unit 21 and picked up from the feeder 13. The component P is mounted at a desired position on the substrate W.

As shown in FIG. 2, the mounting head 30 is configured by providing a plurality of suction nozzles 32 (only one is shown in this embodiment) on a head main body 31 supported by an X-axis drive unit 22 (see FIG. 1). Has been done. Each suction nozzle 32 is supported by the head main body 31 via the nozzle drive unit 33, and is moved up and down in the Z-axis direction by the nozzle drive unit 33 and rotates around the Z-axis. Each suction nozzle 32 is connected to a suction source (not shown) and holds the component P by the suction force from the suction source. A coil spring is provided on the suction nozzle 32, and the component P sucked by the suction nozzle 32 is mounted on the substrate W while contracting the coil spring.

The head body 31 includes a height measurement sensor 34 (see FIG. 1) that detects the height from the substrate W, and a component detection unit 35 (also referred to as a detection unit) that recognizes the shape of the component and detects a suction error. It is provided. In the height measurement sensor 34 (also referred to as a recognition unit), the distance from the substrate W to the suction nozzle 32 is detected by the reflection of the inspection light, and the amount of movement of the suction nozzle 32 in the vertical direction is controlled based on the detection result. In the component detection unit 35, the light emitting unit 36 and the light receiving unit 37 are opposed to each other in the horizontal direction, and the component shape, adsorption error, etc. are inspected from the light shielding state in which the light from the light emitting unit 36 is shielded by the component P. The component detection unit 35 may emit LED light from the light emitting unit toward the light receiving unit, or may emit LED light from the light emitting unit toward the light receiving unit.

The head body 31 includes a substrate imaging unit 38 (see FIG. 1) that captures the BOC mark on the substrate W from directly above, and a component imaging unit 39 that captures the mounting operation of the component P by the suction nozzle 32 from diagonally above. It is provided. The substrate imaging unit 38 (also referred to as a recognition unit) recognizes the position, warpage, etc. of the substrate W based on the captured image of the BOC mark, and corrects the mounting position of the component P with respect to the substrate W based on these recognition results. .. The component image pickup unit 39 captures images before and after the component P is attracted to the feeder 13, and also captures images before and after the component P is mounted on the substrate W. These captured images are inspected for the presence or absence of suction of the component P by the suction nozzle 32 and the presence or absence of the component P mounted on the substrate W.

Further, the mounting device 1 is provided with a control device 40 that collectively controls each part of the device. The control device 40 is composed of a processor, a memory, and the like that execute various processes. The memory is composed of one or a plurality of storage media such as ROM (Read Only Memory) and RAM (Random Access Memory) depending on the intended use. In the memory, in addition to the control program for the entire mounting device 1, a program for causing the mounting device 1 to execute the mounting method described later is stored. In such a mounting device 1, the component P supplied from the feeder 13 is picked up by the mounting head 30 and transported to an arbitrary position on the substrate W for mounting.

By the way, as shown in FIG. 3A, in the mounting device 1 (see FIG. 1), a cueing operation is performed in which the component P (see FIG. 2) is sent out to the supply position with respect to the mounting head 30 when the feeder 13 is replaced. In this case, the cueing information is managed for each feeder 13 of the feeder bank 12, and it is determined whether or not the cueing has been completed based on the cueing information. When the feeder 13 is replaced due to a part shortage or the like, the cueing information is reset, and the head component P is automatically sent to the supply position by the replaced feeder 13 to be cueed. By the cueing operation of the component P, the component P is smoothly delivered from the feeder 13 to the mounting head 30.

Further, as shown in FIG. 3B, the mounting device 1 is provided with a pair of feeder banks 12 in which a plurality of feeders 13 are arranged side by side, and non-stop production is carried out by the pair of feeder banks 12. In non-stop production, when a component runs out in one of the feeders 13 in one feeder bank 12, the supply destination of the component P is switched to the feeder 13 in the other feeder bank 12, and one feeder is in production. Bank 12 is replaceable. That is, while the production is continued in the other feeder bank 12, the one feeder bank 12 is separated from the mounting device 1 and the replacement work of the feeder 13 out of parts is carried out.

When the feeder bank 12 is separated from the mounting device 1 and banked down, the cue information of all the feeders 13 mounted on the feeder bank 12 is reset. Even if the feeder 13 in which the parts are cut off is replaced and banked up again, the cueing information of each feeder 13 is lost, so that the cueing operation is required for all the feeders 13. In this way, during non-stop production, even if a part of the feeder 13 is out of parts, the cueing information of a large number of feeders 13 that do not need to be cueed is lost due to bank down, so that each feeder 13 is individually cueed. You have to cue to the feeder 13.

As shown in the comparative examples of FIGS. 4A and 4B, in the general cueing operation, the cueing operation is performed by component recognition by the OCC camera 51 provided on the mounting head 50, the height measurement sensor (HMS) 52, or the like. Will be done. In this case, the OCC camera 51 or the like is positioned directly above the supply position of the feeder 53, and the feeding operation is repeated until the component P is recognized by the OCC camera 51 or the like. Since the OCC camera 51 and the like are separated from the suction nozzle 54 in the mounting head 50, the positions of the OCC camera 51 and the like and the position of the suction nozzle 54 are switched in order to pick up the component P from the feeder 53 after the cueing operation. The mounting head 50 must be moved in such a manner.

Although it does not result in a large tact down when the cueing operation of one feeder 53 is performed by the OCC camera 51 or the like, a large tact down occurs when cueing all the feeders 53 by the above-mentioned non-stop production bank down. become. Further, in the OCC camera 51 and the height measurement sensor 52, there is a limit to the part P that can be cueed depending on the part size and the part type. For example, the OCC camera 51 cannot accurately recognize the component P larger than the image frame size, and is limited to the component P within the image frame size that can be imaged. Further, since the height measuring sensor 52 measures the height by using the reflected light, it is not possible to detect a component having a high reflectance or a very small component.

Therefore, in the present embodiment, instead of recognizing the component P by the OCC camera or the height measurement sensor and performing the cueing operation, the component P is used by using the feeding operation at the time of picking up the component P by the mounting head 30. I try to cue it (see Fig. 6). It is possible to reduce the amount of movement of the mounting head 30 by eliminating the need for component recognition by an OCC camera or the like. In particular, even if the cue information of all the feeders 13 of the feeder bank 12 is lost due to the bank down, only the feeder 13 that fails to pick up the component P is cueed, and a large tact down can be prevented. Further, since the OCC camera or the like is not used for the sending operation, the component P is not limited by the component size, the component type, or the like as long as the component P can be picked up.

Hereinafter, the control configuration of the mounting device will be described with reference to FIGS. 5 and 6. FIG. 5 is a block diagram of the mounting device of the present embodiment. FIG. 6 is an explanatory diagram of the delivery operation of the present embodiment. Although the mounting device is described in a simplified manner in the block diagram of FIG. 5, it is assumed that the mounting device is provided with a configuration normally provided.

As shown in FIG. 5, a component detection unit 35 is connected to the control device 40, and the component P picked up by the mounting head 30 (see FIG. 1) is detected by the component detection unit 35 to pick up the component P. The component P is sent out by the feeder 13 according to the success or failure of. If the pickup is successful, the mounting operation of the component P is performed, and if the pickup fails, the component P is repeatedly sent out and cueed until the pickup of the component P is successful. The control device 40 is provided with a first determination unit 41, a storage unit 42, a mounting control unit 43, a second determination unit 44, a delivery control unit 45, and a notification unit 46.

In the component detection unit 35, the component P is positioned between the light emitting unit 36 and the light receiving unit 37 by the suction nozzle 32 while the component P is held by the suction nozzle 32. Then, light having high straightness is emitted from the light emitting unit 36 toward the component P, and the light not shielded by the component P is received by the light receiving unit 37. At this time, the outer shape of the component P picked up by the mounting head 30 is projected on the light receiving surface of the light receiving unit 37. If the component P is not projected on the light receiving surface of the light receiving unit 37, the component P is not detected, and if the component P is projected on the light receiving surface of the light receiving unit 37, the component P is detected.

The first determination unit 41 determines the success or failure of the pickup according to the detection result of the component detection unit 35. In this case, if the component P is detected by the component detection unit 35, the pickup is determined to be successful, and if the component P is not detected by the component detection unit 35, the pickup is determined to be unsuccessful. Further, the necessity of the cueing operation is indirectly determined according to the success or failure of the pickup. If the pickup is successful, it is determined that the cueing operation is unnecessary because the component P is delivered to the mounting head 30, and if the pickup fails, the component P is not delivered to the mounting head 30. It is determined that the ejection operation is necessary.

The cueing flag (cueing information) is stored in the storage unit 42 as cueing information for each feeder 13 (see FIG. 1). When the first determination unit 41 determines that the pickup is successful, the cue flag of the storage unit 42 is set to ON. By setting the cueing flag to ON, the cueing operation for the feeder 13 that has been successfully picked up is prevented. Further, when the first determination unit 41 determines that the pickup is successful, the mounting control unit 43 controls the mounting operation of the mounting head 30. In this case, the mounting head 30 is moved from the feeder 13 to the mounting position of the board W (see FIG. 1), and the component P held by the suction nozzle 32 is mounted on the board W.

The second determination unit 44 determines whether or not the heading has been completed when the pickup fails. In this case, the cueing information of the storage unit 42 is referred to before the feeding operation, and if the cueing flag is set to ON, it is determined that the cueing has been completed, and if the cueing flag is set to OFF, the cueing is performed. It is determined that it has not been completed. When the second determination unit 44 determines that the cueing has not been completed, the delivery control unit 45 controls the delivery operation of the component P by the feeder 13. In this case, the feeding operation of the component P by the feeder 13 is repeated until the pickup by the mounting head 30 is successful.

When the second determination unit 44 determines that the cueing has been completed, the notification unit 46 notifies that the feeder 13 is out of parts. In this way, when the pip-up operation fails and the cueing flag is set to ON, it is determined that the pickup fails due to the missing parts, not the pickup failure due to the non-cueing. .. Therefore, when the parts are out of stock, the sending operation of the parts P is not repeated. The notification unit 46 may notify the out of parts as long as it can notify, for example, voice notification, light emission notification, display notification, or a combination thereof.

As shown in FIG. 6A, when the pickup fails and the cueing flag is set to OFF, the feeder 13 executes the feeding operation of the component P. In this case, at the position where the pickup of the component P fails, the carrier tape is sent out by the feeder 13 by one pitch, and the pickup operation of the component P is retried by the suction nozzle 32. Then, the pickup operation of the mounting head 30 and the delivery operation of the feeder 13 are repeated until the component P picked up by the component detection unit 35 (see FIG. 5) is detected and the component P is successfully picked up by the suction nozzle 32. The part P is cueed.

Since the cueing of the component P is performed by using the feeding during the pickup operation, the cueing using the substrate imaging unit (OCC camera) 38 or the like is not required. Therefore, the positions of the substrate imaging unit 38 and the suction nozzle 32 are not exchanged, and the movement of the mounting head 30 when the component P is cueed can be minimized. In particular, even if the cueing information of all the feeders 13 is reset due to the bank down during non-stop production, the pickup fails and the cueing is performed only for the feeder 13 replaced due to the part shortage. For the remaining feeder 13, the pickup is successful and the mounting operation is started without cueing.

In this way, even if the cue information of all the feeders 13 is lost due to the bank down, the tact down does not occur in the feeder 13 in which the pickup is successful. Here, in the present embodiment, the cueing of the component P is performed by using the feeding during the pickup operation, but the number of repetitions of the feeding operation is different from that at the time of retrying the normal pickup operation. Normally, when the pickup fails, the pickup operation and the delivery operation are retried, but in the present embodiment, when the pickup fails, the pickup operation and the delivery operation exceed the specified number of times when the normal pickup operation is retried. Is repeated.

Further, the component P may be formed so as to be pickable by the mounting head 30, and the component size and components may be similar to the cueing operation using the substrate imaging unit (OCC camera) 38, the height measurement sensor (HMS) 34, and the like. The component P is not limited by the type. For example, a component larger than the image frame size that can be imaged by the substrate image pickup unit 38 may be used, or a component having a high reflectance or a very small component that cannot be detected by the height measurement sensor 34 may be used. It is preferable that the cueing of the component P by the pickup operation is performed during production. This is because it is necessary to return the picked-up component P to the pocket of the tape reel before the start of production, and it is difficult to accurately return the component P to the pocket.

Therefore, as shown in FIG. 6B, the cueing operation of the component P may be performed by the component recognition by the substrate imaging unit 38 or the height measurement sensor 34 before the start of production. In this case, cueing is performed by feeding out the component P by the feeder 13 until the component is recognized by the substrate image pickup unit 38 or the height measurement sensor 34. Since the position of the substrate image pickup unit 38 and the height measurement sensor 34 and the suction nozzle 32 are separated, it is necessary to move the mounting head 30, but since it is not necessary to pick up the component P, it depends on the pickup operation before the start of production. It is possible to prevent problems. As described above, it is preferable that the component P is cueed by the pickup operation during production, and the component P is cueed by component recognition by the substrate imaging unit 38 or the height measurement sensor 34 before the start of production.

A method of mounting components will be described with reference to FIGS. 7 and 8. FIG. 7 is a flowchart of the mounting method of the comparative example. FIG. 8 is a flowchart of the mounting method of the present embodiment. In the description of FIG. 7, the reference numerals of the comparative examples of FIG. 4 will be appropriately used for description, and in the description of FIG. 8, the reference numerals of FIGS. 6 and 5 will be appropriately used for description. Further, in FIGS. 7 and 8, errors in retrying normal pickup operation and cueing are omitted.

As shown in FIG. 7, when the mounting operation of the comparative example is started, the cueing information is confirmed and it is determined from ON / OFF of the cueing flag whether or not the cueing has been completed (step S01). When it is determined that the cueing flag is OFF and the cueing has not been completed (No in step S01), the mounting head 30 is moved and the OCC camera 51 is positioned at the supply position of the feeder 53 (step S02). The supply position of the feeder 53 is imaged by the OCC camera 51 and component recognition is performed (step S03), and the presence or absence of the component P at the supply position is determined based on the recognition result of the OCC camera 51 (step S04).

When there is no component P at the supply position of the feeder 53 (No in step S04), the tape reel is sent out by one pitch (step S05). The process of step S03 to step S05 is repeated until the component P reaches the supply position, and the component P is cueed. On the other hand, when the cueing flag is ON and it is determined that cueing has been completed (Yes in step S01), or when the component P is present at the supply position of the feeder 53 (Yes in step S04), the mounting head 50 is moved. The suction nozzle 54 is positioned at the supply position of the feeder 53 (step S06).

The pickup operation of the component P is performed by the mounting head 50 (step S07), and the success or failure of the pickup is determined depending on whether or not the component P is attracted to the suction nozzle 54 (step S08). If the pickup fails (No in step S08), the operator is notified of the out-of-parts (step S09). If the pickup is successful (Yes in step S08), the mounting head 50 is moved to the mounting position of the board W (step S10), and the component P is mounted at the mounting position (step S11). In the mounting operation of the comparative example, the mounting head 50 is moved unnecessarily due to the component recognition of the OCC camera 51, and tact down occurs.

On the other hand, as shown in FIG. 8, when the mounting operation of the present embodiment is started, the mounting head 30 is moved and the suction nozzle 32 is positioned at the supply position of the feeder 13 (step S21). The mounting head 30 performs a pickup operation of the component P (step S22), and the first determination unit 41 determines the success or failure of the pickup (step S23). In this case, the component detection unit 35 detects the component P held by the suction nozzle 32, so that the first determination unit 41 determines the success or failure of the pickup. The necessity of the cueing operation is indirectly determined by the success or failure of the pickup by the mounting head 30.

When the pickup fails (No in step S23), the cueing information of the storage unit 42 is confirmed, and it is determined from ON / OFF of the cueing flag whether or not the cueing has been completed (step S24). When the cueing flag is ON and it is determined that cueing has been completed (Yes in step S24), the notification unit 46 notifies the operator of the out of parts (step S25). When it is determined that the cueing flag is OFF and the cueing has not been completed (No in step S24), the tape reel is sent out by one pitch (step S26). The component P is cueed by repeating the processes from step S22 to step S26 until the pickup is successful.

On the other hand, when the pickup is successful (Yes in step S23), the cue flag stored in the storage unit 42 is set to ON (step S27). Then, the mounting head 30 is moved to the mounting position of the board W (step S28), and the component P is mounted at the mounting position (step S29). As described above, in the mounting operation of the present embodiment, since the cueing is performed by using the feeding of the component P during the pickup operation, the cueing operation as in the comparative example (see FIG. 7) wastes the mounting head 30. No significant movement occurs and no significant tact down occurs.

As described above, in the mounting device 1 of the present embodiment, when the pickup of the component P by the mounting head 30 fails, the component P is sent out by the feeder 13 until the pickup is successful, and the component P is cueed. .. That is, the cueing operation is performed by utilizing the sending operation of the component P at the time of the pickup operation. Since it is not necessary to move the substrate image pickup unit 38 for component recognition and the height measurement sensor 34 to the supply position of the component P, the travel time can be shortened and tact down can be suppressed. Further, since the cueing operation is performed depending on the success or failure of the pickup of the component P, the component P capable of the cueing operation is not limited by the component size, the component type, or the like.

In the present embodiment, the component detection unit in which the light emitting unit and the light receiving unit face each other is exemplified as the detection unit, but the present invention is not limited to this configuration. The detection unit may be a pressure sensor that can detect the parts picked up by the mounting head, and may be, for example, a pressure sensor that detects the parts picked up from the magnitude of the vacuum pressure of the suction nozzle.

Further, in the present embodiment, the cueing flag is exemplified as the cueing information, but the present invention is not limited to this configuration. The cueing information may be any discriminating information that can determine whether or not each feeder has been cueed.

Further, in the present embodiment, the suction nozzle is exemplified as the nozzle, but the present invention is not limited to this configuration. The nozzle may be a gripper nozzle as long as it can hold the component.

Further, in the present embodiment, the substrate imaging unit and the height measurement sensor are exemplified as the recognition unit, but the present invention is not limited to this configuration. The recognition unit may be able to recognize the parts sent to the supply position with respect to the mounting head.

Further, in the present embodiment, if the pickup fails, the sending operation is repeated until the picking is successful, but a limited number of times may be set for the number of repetitions of the sending operation. As a result, when the pickup fails due to a malfunction of the pickup operation or the like, the parts are not repeatedly sent out.

Further, in the present embodiment, the substrate may be any as long as it can mount various components, and is not limited to the printed circuit board, and may be a flexible substrate mounted on the jig substrate.

Further, the program of the present embodiment may be stored in a storage medium. The recording medium is not particularly limited, but may be a non-transient recording medium such as an optical disk, a magneto-optical disk, or a flash memory.

Further, although the embodiments and modifications of the present invention have been described, other embodiments of the present invention may be a combination of the above embodiments and modifications in whole or in part.

Further, the embodiment of the present invention is not limited to the above-described embodiment and modification, and may be variously modified, replaced, or modified without departing from the spirit of the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in another way by the advancement of the technology or another technology derived from it, it may be carried out by the method. Therefore, the scope of claims covers all embodiments that may be included within the scope of the technical idea of the present invention.

Further, in the above embodiment, the mounting device picks up the parts supplied from the feeder by the mounting head and mounts them on the board, and the detection unit for detecting the parts picked up by the mounting head and the detection result of the detection unit. It is equipped with a first determination unit that determines the success or failure of the pickup accordingly, and if the pickup is successful, the component is mounted on the board with the mounting head, and if the pickup fails, the component is sent out by the feeder until the pickup is successful. It is characterized by repeating. According to this configuration, when the pickup of the component by the mounting head fails, the component is sent out by the feeder until the pickup is successful, and the component is cueed. That is, the cueing operation is performed by utilizing the parts feeding operation during the pickup operation. Since it is not necessary to move a device for recognizing parts such as a camera to the parts supply position, the movement time can be shortened and tact down can be suppressed. Further, since the cueing operation is performed depending on the success or failure of the pick-up of the parts, the parts capable of the cueing operation are not limited by the part size, the part type, and the like.

As described above, the present invention has the effect of suppressing tact down and performing a cueing operation regardless of the component size, component type, etc., and in particular, a mounting device for performing non-stop production. And useful for mounting methods.

1: Mounting device 12: Feeder bank 13: Feeder 30: Mounting head 34: Height measurement sensor (recognition unit)
35: Parts detection unit (detection unit)
38: Substrate imaging unit (recognition unit)
41: First determination unit 42: Storage unit 44: Second determination unit 46: Notification unit P: Component W: Substrate

Claims (4)

It is a mounting device that picks up the components supplied from the feeder with the mounting head and mounts them on the board.
A detector that detects the parts picked up by the mounting head,
It is provided with a first determination unit that determines the success or failure of the pickup according to the detection result of the detection unit.
If the pickup is successful, the component is mounted on the board by the mounting head, and if the pickup fails, the feeder sends out the component repeatedly until the pickup is successful.
If the pickup is successful, the cue information is set to cueed, and the component is mounted on the board with the mounting head.
If the pickup fails during production, a second determination unit for determining whether or not the cueing has been completed based on the cueing information is provided before the feeding operation.
A mounting device characterized in that, when it has been cueed, it is notified that a part has run out, and when it has not been cueed, the above-mentioned feeding operation of the part is performed. It is equipped with a recognition unit that recognizes the parts sent to the supply position with respect to the mounting head.
The mounting device according to claim 1, wherein the parts are sent out by the feeder until the parts are recognized by the recognition unit before the start of production. It has a pair of feeder banks with multiple feeders arranged side by side.
When one of the feeder banks runs out of parts, the supplier of the parts is switched to the feeder of the other feeder bank, and the pickup can be replaced during non-stop production. 1. Item 2. The mounting device according to item 2. It is a mounting method in which the components supplied from the feeder are picked up by the mounting head and mounted on the board.
A detection step for detecting a component picked up by the mounting head, and
The first determination step of determining the success or failure of the pickup according to the detection result of the detection unit,
When the pickup is successful, the step of mounting the component on the board with the mounting head, and
If the pickup fails, the step of repeating the parts feeding operation by the feeder until the pickup succeeds, and
If the pickup is successful, the step of setting the cueing information to cueing and mounting the component on the board with the mounting head, and
If the pickup fails during production, a second determination step of determining whether or not the cueing has been completed based on the cueing information before the feeding operation, and a second determination step.
A mounting method comprising: a step of notifying that a part has been cut off when the part has been cueed, and performing the feeding operation of the part when the part has not been cueed.

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