JP6792635B2 - Wearing machine - Google Patents

Description

The present invention relates to a mounting machine that holds a supplied component at a supply position by a holder and mounts the component.

The mounting machine is usually provided with a supply device that supplies parts at the supply position and a mounting head that has a holder that holds the parts supplied by the supply device, and mounting of the parts held by the holder is executed. Ru. The following patent document describes an example of such a mounting machine.

Japanese Unexamined Patent Publication No. 2010-739777

In the mounting machine having the above structure, there is a possibility that the parts may fall around the supply position due to a mistake in holding the parts by the holder, and the dropped parts may come into contact with the mounting head. The present invention has been made in view of such circumstances, and an object of the present invention is to prevent a contact between a mounting head and a component that has fallen around a supply position.

In order to solve the above problems, the present specification includes a supply device that supplies parts at the supply position, a mounting head having a holder for holding the parts supplied by the supply position, and an upper part of the supply position. After the sensor capable of detecting foreign matter in a predetermined range and the holding tool hold the component at the supply position , and then mounting the held component is executed, the component is again at the supply position. Disclosed is a wearing machine including a control device having a determination unit for determining whether or not a foreign substance is present in the predetermined range based on the detection result of the sensor before being held by the holder .

According to the present disclosure, it is possible to confirm whether or not a component exists around the supply position and prevent the mounting head from coming into contact with the component that has fallen around the supply position.

It is a figure which shows the electronic component mounting machine. It is a figure which shows the mounting head. It is a figure which shows the supply device from the viewpoint from above. It is a figure which shows the supply device from the viewpoint from the side. It is a block diagram which shows the control device. It is a figure which shows the supply device from the viewpoint from the side. It is a figure which shows the supply device of the modified example from the viewpoint from above.

Hereinafter, examples of the present invention will be described in detail as embodiments for carrying out the present invention with reference to the drawings.

Configuration of Electronic Component Mounting Machine FIG. 1 shows an electronic component mounting machine 10 according to an embodiment of the present invention. The electronic component mounting machine 10 is a device for performing mounting work of electronic components on a circuit board. The electronic component mounting machine 10 includes a transport device 20, a mounting head moving device (hereinafter, may be abbreviated as “moving device”) 22, a mounting head 24, a pair of supply devices 25, 26, and a pair. It includes photoelectric sensors 27 and 28, a tool station 29, a nozzle station 30, a parts camera 31, and a mark camera 32.

The conveyor belt 20 has a pair of conveyor belts 40 and an electromagnetic motor (see FIG. 5) 42 that orbits the conveyor belts 40. The extending direction of the pair of conveyor belts 40 is described as the X direction, and the horizontal direction perpendicular to that direction is described as the Y direction. The circuit board 46 is supported by the pair of conveyor belts 40 and is conveyed in the X direction by the drive of the electromagnetic motor 42. Further, the transfer device 20 has a substrate holding device (see FIG. 5) 48. The substrate holding device 48 fixedly holds the circuit board 46 supported by the conveyor belt 40 at a predetermined position (the position where the circuit board 46 in FIG. 1 is shown).

The moving device 22 is composed of an X-direction slide mechanism 50 and a Y-direction slide mechanism 52. The X-direction slide mechanism 50 has an X-slider 56 provided on the base 54 so as to be movable in the X-direction. The X slider 56 moves to an arbitrary position in the X direction by driving an electromagnetic motor (see FIG. 5) 58. Further, the Y-direction slide mechanism 52 has a Y-slider 60 provided on the side surface of the X-slider 56 so as to be movable in the Y-direction. The Y slider 60 moves to an arbitrary position in the Y direction by driving an electromagnetic motor (see FIG. 5) 62. A mounting head 24 is attached to the Y slider 60. With such a structure, the mounting head 24 is moved to an arbitrary position on the base 54 by the moving device 22.

The mounting head 24 mounts an electronic component on a circuit board. As shown in FIG. 2, the mounting head 24 is composed of a main body portion 70 and a holding tool 72, and is attached to the Y slider 60 of the moving device 22 in the main body portion 70. The holding tool 72 holds one or more suction nozzles 76, and any one of the plurality of holding tools 72 is detachably attached to the lower surface side of the main body 70. In the electronic component mounting machine 10, three types of holding tools 72a, b, and c are prepared, and when distinguishing each of the three types of holding tools 72a, b, and c, the holding tool 72a is used as the first holding tool 72a. The holding tool 72b is referred to as a second holding tool 72b, and the holding tool 72c is referred to as a third holding tool 72c.

Each holding tool 72a, b, c has a mounting portion 78 and a unit holding portion 80, and is detachably mounted on the lower surface side of the main body portion 70 in the mounting portion 78. The unit holding portions 80 of the holding tools 72a, b, and c generally have a cylindrical shape and are held on the lower surface of the mounting portion 78. The unit holding portion 80 of the first holding tool 72a and the second holding tool 72b is rotatably held by the mounting portion 78 around its own axis, and is driven by an electromagnetic motor (see FIG. 5) 81. It rotates at a predetermined angle.

Further, the first holding tool 72a holds twelve mounting units 82, which are generally axial in shape, at an equal angle pitch on the outer peripheral portion. Further, the second holding tool 72b holds four mounting units 82 at an equal angle pitch on the outer peripheral portion. Further, the third holding tool 72c holds one mounting unit 82 in the central portion. Each mounting unit 82 is held in a state where the axial direction is vertical, and the lower end portion of each mounting unit 82 extends downward from the lower surface of each unit holding portion 80. Then, the suction nozzle 76 is detachably mounted on the lower end of each mounting unit 82.

Since the second holding tool 72b can hold more parts than the third holding tool 72c, the electronic parts held by the suction nozzle 76 of the second holding tool 72b are usually sucked by the third holding tool 72c. It is smaller than the electronic component held by the nozzle 76. Further, since the first holding tool 72a can hold more parts than the second holding tool 72b, the electronic parts held by the suction nozzle 76 of the first holding tool 72a are usually sucked by the second holding tool 72b. It is smaller than the electronic component held by the nozzle 76. That is, the size of the electronic component held by each of the holding tools 72a, b, and c decreases in the order of the third holding tool 72c, the second holding tool 72b, and the first holding tool 72a.

Further, the mounting head 24 has a positive / negative pressure supply device (see FIG. 5) 86 and a unit elevating device (see FIG. 5) 88. The positive / negative pressure supply device 86 supplies negative pressure air or positive pressure air to each suction nozzle 76 via the air passage. As a result, each suction nozzle 76 sucks and holds the electronic component by the negative pressure air, and separates the held electronic component by the positive pressure air. Further, the unit elevating device 88 is a predetermined one of the 12 mounting units 82 of the first holding tool 72a, or a predetermined one of the four mounting units 82 of the second holding tool 72b. One mounting unit 82 or one mounting unit 82 of the third holding tool 72c is moved up and down. As a result, the holding work and the mounting work of the electronic component are executed by the suction nozzle 76 mounted on the mounting unit 82 that is raised and lowered.

Further, as shown in FIG. 1, the pair of supply devices 25 and 26 are arranged on both sides of the base 54 in the Y direction so as to sandwich the transfer device 20. Each of the supply devices 25 and 26 is composed of a tape type supply device 90 and a tray type supply device 92.

The tape type feeder 90 has a plurality of tape feeders 96. The tape feeder 96 houses the taped parts in a wound state. The taped component is a taped electronic component. Then, the tape feeder 96 supplies the electronic components at the supply position 100 by feeding out the taped components by the feeding device (see FIG. 5) 98. The tape feeder 96 is removable from the base 54, and can be used for replacement of electronic components, shortage of electronic components, and the like.

Further, the tray type supply device 92 is composed of a support plate 102 and a slide device 104. The support plate 102 supports a plurality of component trays 106, and each component tray 106 accommodates a plurality of electronic components. The component tray 106 generally accommodates electronic components that are larger than the electronic components supplied by the tape feeder 96. Further, the slide device 104 has a pair of guide rails 108 extending in the Y direction, and the support plate 102 is slidably held in the Y direction by the pair of guide rails 108. Then, the support plate 102 is driven by the electromagnetic motor (see FIG. 5) 110 to provide a supply position (the position where the support plate 102 is shown by a solid line in FIG. 1) and a retract position (the support plate 102 is shown by a dotted line in FIG. 1). Move to and from the location). As a result, when the support plate 102 is moved to the retracted position, the component tray 106 is placed on the support plate 102, and the support plate 102 is moved to the supply position, so that the tray type supply device 92 can be moved. The parts housed in the parts tray 106 are supplied. The supply position of the tray type supply device 92 and the supply position 100 of the tape feeder 96 substantially coincide with each other in the X direction. That is, the supply position of the tray type supply device 92 and the supply position 100 of the tape feeder 96 are generally arranged on a line extending in the X direction.

Further, each of the pair of photoelectric sensors 27 and 28 is arranged corresponding to each of the pair of supply devices 25 and 26. Each of the photoelectric sensors 27 and 28 is composed of an irradiation unit 112 and a light receiving unit 114. The irradiation unit 112 irradiates light, and the light receiving unit 114 receives the light irradiated by the irradiation unit 112. Then, when no foreign matter is present between the irradiation unit 112 and the light receiving unit 114, the light receiving unit 114 receives the light irradiated by the irradiation unit 112, but between the irradiation unit 112 and the light receiving unit 114. When a foreign substance is present in the light emitting unit 112, the light emitted by the irradiation unit 112 is blocked by the foreign substance, so that the amount of light received by the light receiving unit 114 is reduced. With such a structure, the photoelectric sensors 27 and 28 sense between the irradiation unit 112 and the light receiving unit 114, and detect foreign matter between the irradiation unit 112 and the light receiving unit 114.

Further, the irradiation unit 112 of each of the photoelectric sensors 27 and 28 has a structure of irradiating light having a predetermined width (60 to 70 mm), and the light receiving unit 114 has a structure of receiving light of the predetermined width. ing. Then, as shown in FIG. 3, the light emitted from the irradiation unit 112 toward the light receiving unit 114 causes the parts to be supplied by the supply devices 25 and 26, that is, the supply position of the tray type supply device 92, and the supply position of the tray type supply device 92. A predetermined range (the range shown in gray in the figure) including the upper part of the supply position 100 of the tape feeder 96 is sensed.

Specifically, the irradiation unit 112 and the light receiving unit 114 are arranged on both sides of the supply devices 25 and 26 in the X direction so as to sandwich the supply positions of the parts by the supply devices 25 and 26. At this time, the irradiation unit 112 is arranged so that light having a predetermined width is horizontal in the width direction, and the light receiving unit 114 is arranged so as to be able to receive light having a predetermined width. Further, as shown in FIG. 4, the irradiation unit 112 and the light receiving unit 114 are arranged so that the light irradiated by the irradiation unit 112 passes through a position higher than the upper surface of the supply position 100 of the tape feeder 96 by a predetermined dimension. It is installed. As a result, a predetermined range including the upper part of the component supply position by the supply devices 25 and 26 is sensed by the photoelectric sensors 27 and 28.

As shown in FIG. 4, a lower light-shielding plate 120 for blocking light reception from below is provided on the lower surface side of the light-receiving unit 114, and light from above is provided on the upper surface side of the light-receiving unit 114. An upper light-shielding plate 122 is provided to block the light received from the light. As a result, it is possible to prevent the light receiving unit 114 from receiving light other than the light emitted from the irradiation unit 112, and appropriate sensing is ensured. On the other hand, on the lower surface side of the irradiation unit 112, a lower light-shielding plate 126 for blocking the downward diffusion of the irradiated light is arranged. This is because when the light emitted from the irradiation unit 112 is diffused downward, the diffused light may be reflected by the tape feeder 96 or the like and enter the light receiving unit 114. As a result, it is possible to prevent the light receiving unit 114 from receiving the light reflected by the tape feeder 96 or the like, and appropriate sensing is ensured. Even if the light emitted from the irradiation unit 112 is diffused upward, the member that reflects the diffused light is not arranged above the supply devices 25 and 26, so that the upper surface side of the irradiation unit 112 is , The light-shielding plate is not arranged.

Further, as shown in FIG. 1, the tool station 29 is arranged between the transfer device 20 and the supply device 26. A plurality of tool accommodating portions (not shown) are formed in the tool station 29, and holding tools 72a, b, and c are accommodated in each tool accommodating portion. In this tool station 29, the holding tools 72a, b, c mounted on the main body 70 of the mounting head 24 can be replaced with the holding tools 72a, b, c housed in the tool station 29, if necessary. Is done.

Further, the nozzle station 30 is arranged next to the tool station 29. A plurality of nozzle accommodating portions (not shown) are formed in the nozzle station 30, and each nozzle accommodating portion accommodates the suction nozzle 76. In the nozzle station 30, the suction nozzle 76 mounted on the mounting unit 82 of the mounting head 24 and the suction nozzle 76 housed in the nozzle station 30 are replaced as needed.

Further, the parts camera 31 is arranged between the transport device 20 and the supply device 25 in a state of facing upward. As a result, by moving the mounting head 24 above the parts camera 31, the parts camera 31 takes an image of the electronic component held by the suction nozzle 76. Further, the mark camera 32 is fixed to the Y slider 60 of the moving device 22 in a downward direction, and moves to an arbitrary position by the operation of the moving device 22. As a result, the mark camera 32 images an arbitrary position on the base 54.

Further, as shown in FIG. 5, the electronic component mounting machine 10 includes a control device 130. The control device 130 includes a controller 132 and a plurality of drive circuits 134. The plurality of drive circuits 134 are connected to the electromagnetic motors 42, 58, 62, 110, the substrate holding device 48, the positive / negative pressure supply device 86, the unit elevating device 88, and the feeding device 98. The controller 132 includes a CPU, ROM, RAM, etc., and is mainly a computer, and is connected to a plurality of drive circuits 134. As a result, the operation of the transport device 20, the moving device 22, and the like is controlled by the controller 132. The controller 132 is also connected to the image processing device 138. The image processing device 138 is a device for processing the image pickup data captured by the parts camera 31 and the mark camera 32. As a result, the controller 132 acquires various information from the imaging data. Further, the controller 132 is also connected to the photoelectric sensors 27 and 28, and acquires the detection value by the photoelectric sensors 27 and 28.

Mounting work by the electronic component mounting machine In the electronic component mounting machine 10, the mounting work is executed on the circuit board 46 transported by the transport device 20 according to the above-described configuration. At the time of mounting work on the circuit board 46, usually, the mounting work of small parts is executed first, and then the mounting work of large parts is executed in sequence.

Specifically, when the start button (not shown) is operated by the operator, the mounting head 24 is moved above the parts camera 31 by the command of the controller 132 after the mounting head 24 is calibrated. Then, the mounting head 24 is imaged by the parts camera 31. Then, based on the imaging data, the confirmation work of the holding tool 72 mounted on the main body 70 of the mounting head 24 is executed. That is, based on the imaging data, it is determined whether or not the holding tool 72 is mounted on the main body 70 of the mounting head 24. When the holding tool 72 is mounted on the main body 70, the type of the holding tool 72 mounted is confirmed.

Next, when the first holding tool 72a is not mounted on the main body 70 of the mounting head 24, the mounting head 24 moves above the tool station 29 by the command of the controller 132, and the tool station 29 moves. The first holding tool 72a is attached to the main body 70. Further, when the first holding tool 72a is mounted on the main body 70 of the mounting head 24, the work of mounting the first holding tool 72a on the main body 70 at the tool station 29 is skipped. Subsequently, the mounting head 24 moves above the nozzle station 30 according to the command of the controller 132, and the suction nozzle 76 is mounted on the mounting unit 82 of the first holding tool 72a at the nozzle station 30.

Further, in the transport device 20, the circuit board 46 is transported to the working position by the command of the controller 132, and the circuit board 46 is held by the board holding device 48 at that position. Next, the mark camera 32 moves above the circuit board 46 according to the command of the controller 132, and images the fiducial mark and the like written on the circuit board 46. As a result, information regarding the holding position of the circuit board 46 and the like can be obtained.

Further, during the mounting work using the first holding tool 72a, as described above, the mounting work of relatively small electronic components is executed, so that the tape feeder 96 sends out the taped components according to the command of the controller 132. The electronic component is supplied at the supply position 100. The electronic component mounting machine 10 is provided with a pair of supply devices 25 and 26, and the supply device 25 accommodates electronic components to be mounted on the circuit board to be the work target of the main mounting work. The supply device 26 accommodates a circuit board that is executed after the main mounting work, that is, an electronic component that is to be mounted on a circuit board of a type different from the circuit board that is the work target of the main mounting work. Therefore, in the main mounting work, the supply device 25 supplies the electronic components, and the supply device 26 does not supply the electronic components.

Subsequently, the mounting head 24 moves above the electronic component supply position 100 by the tape feeder 96 according to the command of the controller 132, and the electronic component is sucked and held by the suction nozzle 76. Subsequently, the mounting head 24 moves above the parts camera 31 according to the command of the controller 132, and the parts camera 31 takes an image of the electronic component held by the suction nozzle 76. As a result, information on the holding posture of the parts and the like can be obtained. Then, the mounting head 24 moves above the circuit board 46 according to the command of the controller 132, and mounts the holding electronic component on the circuit board 46.

Next, when the mounting work using the first holding tool 72a is completed, the mounting head 24 moves above the nozzle station 30, and the suction nozzle 76 mounted on the mounting unit 82 is returned to the nozzle station 30. .. Then, the mounting head 24 moves above the tool station 29, and at the tool station 29, the first holding tool 72a mounted on the main body 70 is removed, and the second holding tool 72b is mounted on the main body 70. To. Subsequently, the mounting head 24 moves above the nozzle station 30, and the suction nozzle 76 is mounted on the mounting unit 82 of the second holding tool 72b at the nozzle station 30.

Further, the electronic component during the mounting work using the second holding tool 72b is larger than the electronic component during the mounting work using the first holding tool 72a, but is not so large, so that it is supplied by the tape feeder 96. .. Therefore, the tape feeder 96 of the supply device 25 supplies the electronic components at the supply position 100. Subsequently, the mounting head 24 performs a holding operation of the electronic component at the supply position 100, and the held electronic component is imaged by the parts camera 31. Then, the electronic component is mounted on the circuit board 46 by the mounting head 24.

Next, when the mounting work using the second holding tool 72b is completed, the mounting head 24 moves above the nozzle station 30, and the suction nozzle 76 mounted on the mounting unit 82 is returned to the nozzle station 30. .. Then, the mounting head 24 moves above the tool station 29, and at the tool station 29, the second holding tool 72b mounted on the main body 70 is removed, and the third holding tool 72c is mounted on the main body 70. To. Subsequently, the mounting head 24 moves above the nozzle station 30, and the suction nozzle 76 is mounted on the mounting unit 82 of the third holding tool 72c at the nozzle station 30.

Further, since the electronic parts at the time of mounting work using the third holding tool 72c are relatively large, they are supplied by the tray type feeding device 92. Therefore, in the tray type supply device 92 of the supply device 25, the slide device 104 moves the support plate 102 from the retracted position to the supply position. Subsequently, the mounting head 24 holds an electronic component from the component tray 106 of the support plate 102 that has moved to the supply position, and the held electronic component is imaged by the parts camera 31. Then, the electronic component is mounted on the circuit board 46 by the mounting head 24.

Next, when the mounting operation using the third holding tool 72c is completed, the holding of the circuit board 46 by the board holding device 48 is released, and the circuit board 46 is carried out from the electronic component mounting machine 10. As a result, the circuit board 46 is manufactured in which small parts to large parts are sequentially mounted. Then, the new circuit board 46 is carried into the electronic component mounting machine 10 and held by the board holding device 48 at the working position.

When the mounting work using the third holding tool 72c is completed, the mounting head 24 moves above the nozzle station 30, and the suction nozzle 76 mounted on the mounting unit 82 is returned to the nozzle station 30. Then, in order to execute the mounting work on the new circuit board 46, the mounting head 24 moves above the tool station 29, and the third holding tool 72c mounted on the main body 70 at the tool station 29 It is removed and the first holding tool 72a is attached to the main body 70. Since the following procedure is the same as the procedure described above, the description thereof will be omitted.

Confirmation work of falling parts As described above, in the electronic component mounting machine 10, the electronic components supplied at the supply position of the tape feeder 96 or the tray type supply device 92 are held by the suction nozzle 76, and the held electrons are held. The components are mounted on the circuit board. However, the electronic component may fall around the supply position due to a mistake in holding the electronic component by the suction nozzle 76 or the like. In such a case, when the mounting head 24 moves above the suction position of the electronic component and the electronic component is held by the suction nozzle 76, the electronic component dropped around the suction position and the mounting head 24 There is a risk of contact. In view of this, in the electronic component mounting machine 10, a predetermined range including the upper part of the supply position of the electronic component is sensed by the photoelectric sensors 27 and 28, and the predetermined range including the upper part of the supply position of the electronic component is included. In addition, it is determined whether or not the electronic component exists.

Specifically, as described above, the irradiation unit 112 of the photoelectric sensors 27 and 28 irradiates light toward a predetermined range including the upper part of the supply position of the electronic component, and the irradiated light is the photoelectric sensor. The light is received by the light receiving unit 114 of 27 and 28. Therefore, when the electronic component falls within a predetermined range including between the irradiation unit 112 and the light receiving unit 114, that is, above the supply position of the electronic component, the light emitted by the irradiation unit 112 is emitted. Since it is blocked by electronic components, the amount of light received by the light receiving unit 114 is reduced. Therefore, whether the electronic component exists in the predetermined range including the upper part of the supply position of the electronic component by sensing the predetermined range including the upper part of the supply position of the electronic component by the photoelectric sensors 27 and 28. It is possible to confirm whether or not. Then, when the existence of the electronic component is confirmed, the operation of the electronic component mounting machine 10 is stopped and the electronic component is removed, so that the contact between the electronic component and the mounting head 24 can be prevented. .. The work of confirming whether or not an electronic component exists in a predetermined range including above the supply position of the electronic component by using the photoelectric sensors 27 and 28 may be described as a component confirmation work.

However, if the component confirmation work is executed when the suction nozzle 76 holds the electronic component from the supply position, the light emitted by the irradiation unit 112 is the electron held in the suction nozzle 76 or the suction nozzle 76. It is erroneously determined that the electronic component exists in the above-mentioned predetermined range because it is blocked by the component. Therefore, the component confirmation operation is performed at a timing other than the operation of holding the electronic component by the suction nozzle 76 at the supply position. Specifically, after the electronic component is held by the suction nozzle 76 at the supply position and then the mounting operation of the held electronic component is executed, the electronic component is held again by the suction nozzle 76 at the supply position. The component confirmation operation is executed until, that is, between the component holding operation and the component holding operation.

It should be noted that the parts confirmation work may be performed constantly between the parts holding work and the parts holding work, but by executing the parts confirmation work in association with the predetermined work, the time and effort required for programming the parts confirmation work can be reduced. It is possible to reduce it. Therefore, in the electronic component mounting machine 10, a program is created so that after the electronic component is held by the suction nozzle 76, the component confirmation operation is executed in association with the operation of photographing the electronic component with the parts camera 31. Will be done. That is, in the electronic component mounting machine 10, after the electronic component is held by the suction nozzle 76, the component confirmation operation is executed at the timing when the held electronic component is imaged by the parts camera 31. As a result, it is possible to reduce the labor required for programming and to confirm the presence of electronic components that have fallen during the holding operation by the suction nozzle 76 at an appropriate timing.

However, as described above, when the third holding tool 72c is mounted on the main body 70 of the mounting head 24, the mounting work of a relatively large electronic component is executed. Therefore, the electronic components used for the mounting work are supplied by the tray type supply device 92, but the electronic components supplied at the supply position of the tray type supply device 92 block the light emitted by the irradiation unit 112. There is a risk that sensing by the photoelectric sensors 27 and 28 cannot be performed properly.

Specifically, when the electronic component is supplied by the tray type supply device 92, the electronic component 140 is placed on the component tray 106 as shown in FIG. 6, and the component tray 106 is placed at the supply position. Will be moved. At this time, depending on the dimensions of the electronic component 140 placed on the component tray 106, that is, the electronic component 140 to be supplied, the light emitted by the irradiation unit 112 may be blocked by the electronic component 140. In such a case, it is constantly determined that the electronic component has fallen within the predetermined range, and therefore the sensing by the photoelectric sensors 27 and 28 cannot be performed properly. For this reason, an electronic component to be mounted during mounting work using the third holding tool 72c (hereinafter, may be referred to as "part for the third holding tool") is placed on the part tray 106, and the component is placed on the part tray 106. When the tray 106 is moved to the supply position, the component confirmation operation is not executed. That is, during the mounting work using the third holding tool 72c, the component confirmation work during the imaging work of the electronic component by the parts camera 31 is not executed.

If the component tray 106 on which the third holding tool component is placed is moved to the supply position, sensing by the photoelectric sensors 27 and 28 cannot be properly performed as described above. Therefore, during the mounting work using the first holding tool 72a and the mounting work using the second holding tool 72b, the parts tray 106 on which the third holding tool parts are placed is not moved to the supply position. , Maintained in the retracted position. That is, the movement of the parts tray 106 to the supply position is restricted until the mounting work using the second holding tool 72b is completed, and the parts tray 106 is supplied after the mounting work using the second holding tool 72b is completed. Moved to position. Then, the mounting work using the third holding tool 72c is executed, and after the mounting work using the third holding tool 72c is completed, the component tray 106 is returned to the retracted position. As a result, sensing by the photoelectric sensors 27 and 28 can be appropriately performed during the mounting work using the first holding tool 72a and the mounting work using the second holding tool 72b.

Further, in the electronic component mounting machine 10, by exchanging the holding tool 72 mounted on the main body 70 of the mounting head 24, electronic components having relatively different sizes, from small components to large components, can be mounted on the circuit board 46. It is possible to install it. However, if the electronic component falls around the supply position due to a mistake in holding the electronic component by the suction nozzle 76 or the like, there is a risk that the dropped electronic component and the mounting head 24 come into contact with each other as the holding tool 72 is replaced. There is.

Specifically, at the time of mounting work on one circuit board 46, mounting work using the first holding tool 72a, mounting work using the second holding tool 72b, and mounting work using the third holding tool 72c are sequentially performed. , Will be executed. Then, when the mounting work on the one circuit board 46 is completed, the mounting work on the next one circuit board 46 is executed in the same manner as the mounting work on the previous one circuit board 46. That is, the mounting work using the first holding tool 72a, the mounting work using the second holding tool 72b, and the mounting work using the third holding tool 72c are sequentially and repeatedly executed.

At this time, when the electronic component used in the mounting operation, that is, the component for the third holding tool falls around the suction position during the mounting work using the third holding tool 72c, as described above, the third holding tool Since the component confirmation operation is not executed during the mounting operation using the holding tool 72c, the dropped third holding tool component may be left unattended. Further, the parts for the third holding tool are considered to be relatively large parts. However, since the third holding tool 72c mounted on the main body 70 of the mounting head 24 is designed to hold a large size third holding tool component, it is used for the third holding tool around the suction position. Even if the component has fallen, it is unlikely that the third holding tool 72c will come into contact with the third holding tool component that has fallen around the suction position when the mounting head 24 is moved.

However, since the first holding tool 72a and the second holding tool 72b are designed to hold electronic parts having a size smaller than the parts for the third holding tool, the parts for the third holding tool fall around the suction position. In this case, if the first holding tool 72a or the second holding tool 72b is mounted on the main body 70 of the mounting head 24, the first holding tool 72a or the second holding tool 72b is used. It comes into contact with the third holding tool component.

In view of this, when the holding tool 72 mounted on the main body 70 of the mounting head 24 is replaced, the component confirmation work is executed. When the third holding tool 72c is attached to the main body 70, it is unlikely that the third holding tool 72c will come into contact with the electronic component that has fallen around the suction position. Therefore, the timing at which the holding tool 72 mounted on the main body 70 of the mounting head 24 is replaced with the first holding tool 72a or the second holding tool 72b, that is, on the main body 70 of the mounting head 24 Immediately after the 1-holding tool 72a or the 2nd holding tool 72b is attached, the parts confirmation work is executed. This makes it possible to prevent the mounting head 24 from coming into contact with the electronic component due to the replacement of the holding tool 72.

Further, in the electronic component mounting machine 10, the component confirmation work is executed even at the timing when the production of the circuit board is started, that is, at the timing when the start button is operated by the operator. This makes it possible to confirm the presence or absence of electronic components that have fallen during work such as the previous day. Further, at the timing when the mounting head 24 is imaged after the start button is operated and the confirmation work of the holding tool 72 mounted on the main body 70 of the mounting head 24 is executed based on the imaged data. Parts confirmation work is executed. This makes it possible to more reliably confirm the presence or absence of falling electronic components.

As described above, the electronic component mounting machine 10 is provided with a pair of supply devices 25 and 26, and during the mounting operation, the electronic component is supplied by the supply device 25, and the supply device 26 is used. Does not supply electronic components. Therefore, in the supply device 26, setup work such as replacement of the tape feeder 96 is performed. However, when the parts confirmation work is executed in the supply device 26, that is, when the parts confirmation work is executed using the photoelectric sensor 28 provided corresponding to the supply device 26, the tape feeder 96 is replaced. Therefore, it may be erroneously recognized that the component has fallen, and the operation of the electronic component mounting machine 10 may stop. In view of this, the component confirmation work during the mounting work is executed by using the photoelectric sensor 27 provided corresponding to the supply device 25, and the photoelectric component provided corresponding to the supply device 25 is used. The component confirmation work using the sensor 28 is not executed. As a result, when the mounting work is being executed, the supply device 26 can replace the tape feeder 96 and the like, which improves workability.

As shown in FIG. 5, the controller 132 has a determination unit 150. The determination unit 150 is a functional unit for executing component confirmation work using the photoelectric sensors 27 and 28, that is, a function for determining whether or not a component exists in a predetermined range including a component supply position. is there.

By the way, in the above embodiment, the electronic component mounting machine 10 is an example of the mounting machine. The transfer device 20 is an example of a transfer device. The mounting head 24 is an example of a mounting head. The feeders 25 and 26 are examples of the feeders. The photoelectric sensors 27 and 28 are examples of sensors. The tool station 29 is an example of an exchange device. The main body 70 is an example of the main body. The holding tool 72 is an example of a mounting portion. The suction nozzle 76 is an example of a holder. The irradiation unit 112 is an example of the irradiation unit. The light receiving unit 114 is an example of the light receiving unit. The lower light-shielding plate 126 is an example of a light-shielding portion. The control device 130 is an example of the control device. The determination unit 150 is an example of the determination unit.

The present invention is not limited to the above examples, and can be carried out in various embodiments with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, the photoelectric sensors 27 and 28 having a structure for irradiating a wide range of light are used to perform sensing in the predetermined range, but the light is irradiated with a narrow width. Sensing in the above-mentioned predetermined range may be performed by using a plurality of photoelectric sensors having a structure. Specifically, as shown in FIG. 7, a plurality of photoelectric sensors 164 composed of an irradiation unit 160 that irradiates a narrow light and a light receiving unit 162 that receives the light of the width are adopted, and a plurality of photoelectric sensors 164 are adopted. The irradiation unit 160 is arranged on one of both sides of the supply devices 25 and 26 in the X direction so as to irradiate the entire surface of the predetermined range with light. Further, a plurality of light receiving units 162 are arranged on the other side of the supply devices 25 and 26 on both sides in the X direction so as to receive the light emitted by the plurality of irradiation units 160. By arranging the plurality of photoelectric sensors 164 in this way, it is possible to appropriately sense the predetermined range.

Further, in the above embodiment, the parts confirmation work is executed when the electronic parts are imaged by the parts camera 31 and when the holding tool 72 is replaced, but if the timing is other than the holding work of the electronic parts by the suction nozzle 76, It is possible to execute the component confirmation work at various timings. Specifically, for example, the timing at which the electronic component held by the suction nozzle 76 is mounted on the circuit board 46, the timing at which the suction nozzle 76 is mounted on the holding tool 72, the timing at which the circuit board 46 is conveyed, and the like can be mentioned. Be done.

Further, in the above embodiment, the lower light-shielding plate 126 is arranged only on the lower surface side of the irradiation unit 112, but it is possible to dispose the light-shielding plate on the upper surface side and the lower surface side of the irradiation unit 112. ..

10: Electronic component mounting machine (mounting machine) 20: Conveying device 24: Mounting head 25: Supply device 26: Supply device 27: Photoelectric sensor (sensor) 28: Photoelectric sensor (sensor) 29: Tool station (replacement device) 70: Main body 72: Holding tool (mounting part) 76: Suction nozzle (holding tool) 112: Irradiating part 114: Light receiving part 126: Lower light-shielding plate (light-shielding part) 130: Control device 150: Judgment part

Claims (4)

A supply device that supplies parts at the supply position and
A mounting head having a holder for holding the parts supplied by the supply device, and
A sensor capable of detecting foreign matter in a predetermined range including above the supply position, and
After the part is held by the holder at the supply position, after the mounting operation of the held part is executed, and before the part is held by the holder again at the supply position, the said A mounting machine including a control device having a determination unit for determining whether or not a foreign substance is present in the predetermined range based on the detection result of the sensor. The mounting head
With the main body
A mounting portion having one or more of the holders is provided, and the mounting portion is detachably mounted on the main body portion.
The mounting machine
The other mounting portion that is different from the mounting portion mounted on the main body portion and has a number of the holders different from the number of the holders of the mounting portion mounted on the main body portion. It has an accommodating portion for accommodating a mounting portion, and includes an exchange device for exchanging the mounting portion mounted on the main body portion with the other mounting portion housed in the accommodating portion.
The judgment unit
After the mounting portion mounted on the main body portion and the other mounting portion housed in the housing portion are replaced by the switching device, the predetermined range is based on the detection result of the sensor. The mounting machine according to claim 1, wherein it is determined whether or not a foreign substance is present in the device. The mounting machine
A transport device that transports the board and
It is provided with a pair of the supply devices arranged so as to sandwich the transfer device.
The judgment unit
When the parts supplied from one of the pair of supply devices are held by the holder, it is determined whether or not a foreign substance is present in the predetermined range with respect to the one supply device. The mounting machine according to claim 1 or 2, wherein it does not determine whether or not a foreign substance is present in the predetermined range with respect to the other supply device of the pair of supply devices. The sensor
The irradiation part that irradiates light and
It has a light receiving part that receives the light emitted by the irradiation part.
The mounting machine according to any one of claims 1 to 3 , wherein a light-shielding unit that blocks the downward diffusion of light emitted by the irradiation unit is provided.

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