JP4360327B2 - Electronic component mounting apparatus, board information applying apparatus, and board information applying method - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a board, and a board information applying apparatus and a board information applying method for applying board information for tracing the manufacturing history of the board retrospectively to the board in the electronic component mounting apparatus. It is about.

  In recent years, in the manufacturing industry, it has been required to ensure so-called traceability that enables individual product histories to be traced due to a requirement for product quality assurance. For example, in an electronic component mounting line that manufactures a mounting board on which electronic components are mounted in the electronic equipment manufacturing field, the defective board is identified by going back to the process so that the cause can be investigated if a defect is discovered after the post-process or product shipment. It is requested to do.

For this reason, in the electronic component mounting line, each board is identified by attaching a label written in advance using a barcode or the like on the board information indicating the product type, production lot number, production date, etc. • Identifying methods are commonly used. And in order to perform such a sticking operation | work efficiently, the apparatus which performs supply of a label and sticking to a board | substrate automatically is used (for example, refer patent document 1).
Japanese Patent Laid-Open No. 11-11446

  However, as shown in the above-mentioned patent document, the method of attaching a label on which substrate information has been written in advance to a substrate individually has the following disadvantages. First, in this method, since a label prepared and prepared in advance is peeled off from the sheet or tape and pasted, it is difficult to avoid an artificial mistake of attaching a wrong label due to a wrong label. Even when correct labels are used, if some labels are discarded due to mistakes in pasting work, some serial numbers previously assigned with serial numbers on multiple labels will be interrupted. Inconvenience is likely to occur when going back the product history in the process.

  Furthermore, when a single substrate is divided into a plurality of products, as in the case of a multi-planar substrate in which a plurality of substrates are formed on the same substrate, individual product numbers and manufacturing processes The correspondence relationship with the board number in the product becomes complicated, and it is difficult to easily manage the product history. As described above, the conventional electronic component mounting apparatus does not have a method for ensuring the quality by applying the board information for tracking the product history in a more flexible and simple method, and improvement is desired. It was.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus, a board information applying apparatus, and a board information applying method capable of applying board information for tracking a product history by a more flexible and simple method.

An electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus for mounting an electronic component on a substrate, and picks up the electronic component from a component mounting stage for mounting the substrate on which the electronic component is mounted, and a component supply unit. wherein comprising a mounting means for mounting the transfer to the component mounting stage placed on the substrate, and the substrate information applying means for applying the printed board information for retrospective track product history of the substrate to the substrate Te, the substrate The information applying means includes board information providing means for providing the board information, printing base forming means for forming a printing base as a base of printing on the board, and writing means for writing the board information on the printing base. The printing base forming unit includes a label supplying unit that supplies a label for writing, and a label attaching unit that attaches the label to the substrate .

The board information application device of the present invention is a board information application device for applying board information for printing the product history of the board to the board by printing in the electronic component mounting apparatus for mounting the electronic component on the board. Substrate information providing means for providing the substrate information, print base forming means for forming a print base serving as a base of printing on the substrate, and writing means for writing the substrate information to the print base. The forming means includes label supply means for supplying a label for writing, and label attaching means for attaching the label to the substrate .

The board information applying method of the present invention is a board information applying method for applying board information for tracing the product history of the board to the board by printing in the electronic component mounting apparatus for mounting the electronic component on the board. , seen including a circuit board information providing step of providing the substrate information, a print base forming step for forming a printing base underlying the printing on the substrate, and a writing step of writing the substrate information to the print base, In the printing base forming step, the writing label supplied by the label supplying means is attached to the substrate by the label attaching means .

  According to the present invention, the electronic component mounting apparatus for mounting the electronic component on the board includes the board information applying means for applying the board information for tracing the product history of the board to the board by printing. Can be applied in a more flexible and simple manner.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a diagram showing a configuration of a component mounting head of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. FIG. 4 is a partial sectional view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 5 is an electronic circuit according to an embodiment of the present invention. FIG. 6 is a block diagram showing a configuration of a control system of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 7 is a block diagram showing an embodiment of the present invention. FIG. 8 and FIG. 9 are diagrams for explaining the operation of the electronic component mounting apparatus according to the embodiment of the present invention.

  First, the structure of the electronic component mounting apparatus will be described with reference to FIG. The electronic component mounting apparatus shown in FIG. 1 is configured by connecting two unit mounting apparatuses M1 and M2. In the center of the base 1 of the unit mounting apparatus M1, a transport path 2 is disposed in the X direction. The transport path 2 transports the substrate 3 on which electronic components are mounted, and positions the substrate 3 on the component mounting stage set at the center position of the transport path 2.

  Component supply units 4A and 4B are arranged on both sides of the conveyance path 2, a plurality of tape feeders 5 are arranged in parallel in the component supply unit 4A, and a plurality of tape feeders 5 and 1 are arranged in the component supply unit 4B. Two label supply units 6 are juxtaposed. The tape feeder 5 accommodates electronic components held on the tape, and supplies the electronic components by pitch feeding the tape. As will be described later, the label supply unit 6 has a function of supplying a label for applying information relating to the product history of the substrate 3.

  Y axis tables 7A and 7B are disposed on both ends of the upper surface of the base 1, and two X axis tables 8A and 8B are installed on the Y axis tables 7A and 7B. By driving the Y-axis table 7A, the X-axis table 8A moves horizontally in the Y direction, and by driving the Y-axis table 7B, the X-axis table 8B moves horizontally in the Y direction. A component transfer head 9 is mounted on the X-axis table 8A, and a print head 10 is mounted on the X-axis table 8B. The Y-axis table 7A, the X-axis table 8A, the Y-axis table 7B, and the X-axis table 8B constitute a head moving mechanism that moves the component transfer head 9 and the print head 10, respectively.

As shown in FIG. 2, the component transfer head 9 is of a multi-type, and includes a plurality of unit transfer heads 9a. Each of these unit transfer heads 9a is provided with a suction nozzle 12 that sucks and holds an electronic component at its lower end, and is individually lifted and lowered by a built-in nozzle lifting mechanism. These suction nozzles 12 can be rotated around the nozzle axis by a θ-axis motor 13 provided in common. By driving the head moving mechanism described above, the component transfer head 9 moves horizontally, takes out the electronic component from the tape feeder 5 of the component supply unit 4A, and moves to the substrate 3 positioned on the component mounting stage of the conveyance path 2. Mount electronic components.

  A line camera 11 is disposed between the component supply units 4 </ b> A and 4 </ b> B and the conveyance path 2. When the component transfer head 9 holding an electronic component passes above the line camera 11, the electronic component held by the suction nozzle 15a is imaged by the line camera 11, and the position of the electronic component is recognized. The component transfer head 9 includes a camera 14 that moves integrally. When the component transfer head 9 moves onto the substrate 3, the camera 14 captures and recognizes the substrate 3. In the above configuration, the head moving mechanism and the component transfer head 9 including the Y-axis table 7A and the X-axis table 8A are mounted to pick up an electronic component from the component supply unit and transfer and mount it on the substrate mounted on the mounting stage. It is a means.

  As shown in FIG. 3, the print head 10 includes a label sticking head 15 and a marking head 16. The label applying head 15 is provided with a suction nozzle 15a for holding a barcode printing label at its lower end, and the marking head 16 is provided with a barcode marker laser marker 16a at its lower end. By driving the head moving mechanism described above, the print head 10 moves horizontally, and the label sticking head 15 takes out the label 23 for printing barcodes (see FIG. 5) from the label supply unit 6 to provide components of the transport path 2. Affixed to the substrate 3 positioned on the mounting stage. The label 23 is a plain sheet that can be printed and provided with an adhesive layer for application to the substrate 3, and a heat-resistant sheet material such as polyimide is used so that it can withstand the heat during reflow in the subsequent process. It is done.

  As shown in FIG. 4, the label supply unit 6 provided in the component supply unit 4 </ b> B has a configuration in which a label feeder 18 is mounted on a feeder base 19 common to the tape feeder 5, and a feeder mounting carriage 20. Are arranged in the component supply unit 4B together with the supply reel 21 for supplying labels. As shown in FIG. 5, a base tape 22 with a label 23 attached and held is wound and stored on the supply reel 21, and the base tape 22 is pulled out by a tape feeding mechanism 18 a built in the label feeder 18 and pitch-fed. As a result, the labels 23 are sequentially sent to the take-out position by the label applying head 15.

  In the above configuration, the label supply unit 6 and the label sticking head 15 serve as a print base forming unit that forms a print base serving as a base for printing on the substrate 3. The label supply unit 6 serves as a label supply unit that supplies a label 23 for writing. As the printing base forming means, a method of directly forming a printing film on the surface of the substrate 3 by a method such as resin coating may be used instead of attaching the label 23 as shown here to the substrate 3.

  Then, by positioning the marking head 16 on the label 23 affixed to the substrate 3 and operating the laser marker 16a, substrate information to be described later is printed on the label 23 by a barcode. The marking head 16 serves as writing means for writing substrate information on the print base. The print head 10 includes a camera 17 that moves integrally. The camera 17 can capture and recognize the substrate 3 when the print head 10 moves onto the substrate 3.

The unit mounting apparatus M2 has a basic structure similar to that of the unit mounting apparatus M1, and includes component supply units 4C and 4D arranged on both sides of the transport path 2, respectively. A plurality of tape feeders 5 are arranged in parallel in each of the component supply units 4C and 4D, and a component transfer head 9 is mounted on each of the two head moving mechanisms provided in the unit mounting apparatus M2. . In the unit mounting apparatus M2, a component mounting operation is performed on the substrate 3 after the electronic components are mounted by the unit mounting apparatus M1.

  Next, a control system of the electronic component mounting apparatus will be described with reference to FIG. FIG. 6 shows only the board information application function for attaching the label 23 to the board 3 by the print head 10 and printing the board information on the label 23 by a bar code among the control functions of the electronic component mounting apparatus. The control unit 25 is a CPU, and controls the head driving unit 27 and the label supply unit 28 based on the substrate information data stored in the substrate information data storage unit 26. When the control unit 25 controls the head driving unit 27, the label applying head 15 and the laser marker 16a provided in the print head 10 are operated. The control unit 25 controls the label supply unit 28 so that the label 23 is supplied by the label feeder 18.

  Here, substrate information applied as a barcode will be described. The board information is information for retroactively tracking the product history of each board carried out from the electronic component mounting apparatus to a downstream downstream process. The board information includes product information indicating the type and specification of the board as a product (namely, model number, product type, manufacturer name, etc.) and production management information (manufacturing lot number, serial number for each lot, date and time of manufacture, manufacturing) Line number). When actual board information is created, necessary items are appropriately selected from the above information.

  In the present embodiment, this board information is created in advance for each board scheduled for mounting work and stored in the board information data storage unit 26. In the mounting operation, board information corresponding to the board type is read from the board information data storage unit 26, and the marking head 16 is operated in accordance with the board information to label the board information as a bar code or a character code. 23. That is, here, the board information data storage unit 26 is board information providing means for providing board information.

  In the configuration described above, the control element and the print head 10 shown in FIG. 6 include substrate information application means (substrate information application device) that applies the substrate information for tracing the information related to the product history of the substrate to the substrate 3 by printing. Constitute. The substrate information applying unit includes a substrate information data storage unit 26 as a substrate information providing unit, a print base forming unit that forms a print base serving as a base for printing on the substrate, and a writing unit that writes the substrate information on the print base. It is the composition provided with. Further, the print base forming means includes a label supply means for supplying the writing label 23 and a label attaching means for attaching the label 23 to the substrate 3.

  As the substrate information providing means, various configurations can be adopted in addition to the method of storing the substrate information created for each substrate in advance. For example, a method using a configuration in which board information is provided online from a management computer of an electronic component mounting line to which the electronic component mounting apparatus belongs may be employed. The electronic component mounting apparatus may have a board information creation function.

  That is, the electronic component mounting apparatus itself has already stored data for specifying the manufacturing line to which the self apparatus belongs, and the mounting data stored in each electronic component mounting apparatus includes data related to the board type necessary as board information. include. Therefore, by providing a data editing function to the control device of the electronic component mounting apparatus, board information including product information and production management information can be created in real time from existing data. As described above, by providing the electronic component mounting apparatus with the board information creation function, the board information can be automatically applied without separately inputting board information from the outside.

  Next, in the component mounting operation by the above-described electronic component mounting apparatus, a printing operation for applying, by printing, board information for retrospectively tracking information related to the product history of the board to the board, along the flow of FIG. This will be described with reference to each figure. When starting the mounting operation, first, as shown in FIGS. 8A and 9A, the board 3 is carried into the transport path 2 from the upstream side and positioned on the component mounting stage (ST1).

  Next, as shown in FIG. 8B, the plain label 23 is attached to a predetermined position of the substrate 3 (ST2). As shown in FIG. 9B, this label sticking is performed by moving the print head 10 and taking out the label 23 from the label feeder 18 by the label sticking head 15 and transferring it to the substrate 3. This is performed by performing an up-and-down pressing operation, whereby a print base serving as a base for printing is formed on the substrate 3.

  Next, the board information of the board | substrate 3 carried in is read from the board | substrate information data storage part 26 (ST3). Thereby, board | substrate information is provided with respect to the laser marker 16a. Based on the read substrate information, the laser marker 16a is operated as shown in FIG. 9C to write the barcode on the label 23 (ST4). As a result, as shown in FIG. 8C, the barcode mark 30 corresponding to the board information is printed on the label 23, and the application of the board information is completed. Thereafter, the mounting work is started (ST5). That is, as shown in FIGS. 8D and 9D, the electronic component 31 is mounted on the substrate 3 by the unit transfer head 9 a of the component transfer head 9.

  The above-described substrate information application operation includes a substrate information providing step for providing substrate information, a print base forming step for forming a print base as a base for printing on the substrate, and a writing step for writing the substrate information on the print base. It is a form to include. In the printing base formation step, the writing label 23 supplied by the label supply unit 6 as the label supply means is attached to the substrate by the label application head 15 as the label application means.

  By adopting the method as described above as a method of applying the board information for retroactively pursuing the product history in the electronic component mounting line, compared with the conventional method of attaching a label on which the board information has been written in advance to the board, The following excellent effects can be obtained.

  In the present embodiment, the board information is directly written on a printing base such as a label formed on the board when the board is carried into the component mounting stage. For this reason, an artificial mistake that cannot be avoided in the conventional method, that is, a mistake of attaching a wrong label due to a wrong label does not occur, and a wrong product history is not given. Further, since printing on the label 23 is performed for each component mounting operation, a consistent serial number is accurately given to the boards that are continuously produced together with correct date / time data. As a result, when going back to the product history in the subsequent process, individual substrates can be specified very accurately, and a highly accurate quality control system is realized.

  Furthermore, even when a single board is divided into a plurality of products, such as when a multi-planar board in which a plurality of boards are formed on the same board is targeted, each board is subjected to a component mounting operation. Since it is possible to easily apply the substrate information to each of the labels by attaching a label to each of the labels, it is possible to correctly correspond each divided product number to the number of the substrate in the manufacturing process.

As described above, by employing the substrate information applying apparatus shown in the present embodiment, it is possible to apply the substrate information for tracking the product history by a more flexible and simple method and to ensure traceability.

  The electronic component mounting apparatus and board information application device of the present invention have the advantage that board information for tracking product history can be applied in a more flexible and simple manner, and mount electronic components on a board. This is useful in the field of electronic component mounting for manufacturing a mounting board.

The top view of the electronic component mounting apparatus of one embodiment of this invention The figure which shows the structure of the component mounting head of the electronic component mounting apparatus of one embodiment of this invention The figure which shows the structure of the print head of the electronic component mounting apparatus of one embodiment of this invention The fragmentary sectional view of the electronic component mounting device of one embodiment of the present invention Structure explanatory drawing of the label supply feeder used for the electronic component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the electronic component mounting apparatus of one embodiment of this invention The flowchart of the board | substrate information application operation | movement by the electronic component mounting apparatus of one embodiment of this invention Operation | movement explanatory drawing of the electronic component mounting apparatus of one embodiment of this invention Operation | movement explanatory drawing of the electronic component mounting apparatus of one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 Board | substrate 4A, 4B Component supply part 5 Tape feeder 6 Label supply unit 9 Component transfer head 10 Print head 15 Label sticking head 16 Marking head 18 Label feeder 23 Label 30 Barcode mark 31 Electronic component

Claims (3)

An electronic component mounting apparatus for mounting an electronic component on a substrate, the component mounting stage for mounting the substrate on which the electronic component is mounted, and the electronic component picked up from a component supply unit and mounted on the component mounting stage Mounting means for transporting and mounting on the substrate, and substrate information application means for applying the substrate information for tracing the product history of the substrate to the substrate by printing,
The substrate information applying unit includes a substrate information providing unit that provides the substrate information, a print base forming unit that forms a print base serving as a base for printing on the substrate, and a writing unit that writes the substrate information on the print base. With
The printing base forming means, features and to that electronic component mounting apparatus that includes a label supply means for supplying a label for writing, and a label sticking means to paste the label to the substrate. An electronic component mounting apparatus for mounting an electronic component on a board, wherein the board information is applied to the board by applying board information for tracing the product history of the board to the board by printing, and the board information for providing the board information is provided. Providing means, printing base forming means for forming a printing base as a base of printing on the substrate, and writing means for writing the substrate information on the printing base,
The printing base forming means, board information applying unit you comprising a label supply means for supplying a label for writing, and a label sticking means to paste the label to the substrate. In an electronic component mounting apparatus for mounting an electronic component on a board, a board information application method for applying board information for printing and tracing product history of the board to the board by printing, the board information providing the board information A providing step, a printing base forming step for forming a printing base as a base of printing on the substrate, and a writing step for writing the substrate information on the printing base,
In the print base forming step, label the label for writing supplied by the supply means, board information applied how to, wherein the paste on the substrate by the labeling means.

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