CN112262621A

CN112262621A - Working machine

Info

Publication number: CN112262621A
Application number: CN201880094519.7A
Authority: CN
Inventors: 伊藤明伸
Original assignee: Fuji Corp
Current assignee: Fuji Corp
Priority date: 2018-06-15
Filing date: 2018-06-15
Publication date: 2021-01-22
Also published as: JPWO2019239573A1; WO2019239573A1

Abstract

The work machine is provided with: a work head having a holder; and an imaging device that images the electric component held by the holder, wherein the working machine performs calculation of information relating to the position of the electric component and determination of whether or not a foreign object is attached to the electric component, based on imaging data of the electric component imaged by the imaging device.

Description

Working machine

Technical Field

The present invention relates to a working machine including a working head having a holder and an imaging device for imaging an electric component held by the holder.

Background

The following patent documents disclose a working machine including a working head having a holder and an imaging device for imaging an electric component held by the holder.

Documents of the prior art

Patent document 1: japanese patent No. 4672537

Disclosure of Invention

Problems to be solved by the invention

The task is to provide a working machine which can properly execute the mounting work of an electric component based on the shooting data obtained by shooting of a shooting device.

Means for solving the problems

In order to solve the above problem, the present specification discloses a work machine including: a work head having a holder; and an imaging device that images the electric component held by the holder, wherein the work machine performs calculation of information relating to a position of the electric component and determination of whether or not a foreign object is attached to the electric component, based on imaging data of the electric component imaged by the imaging device.

Effects of the invention

According to the present disclosure, it is possible to calculate information on the position of the electrical component and determine whether or not a foreign object is attached to the electrical component based on the captured data. This enables the electric component to be mounted appropriately.

Drawings

FIG. 1 is a perspective view showing a component mounting machine

Fig. 2 is a side view showing the working head.

Fig. 3 is a perspective view showing the component mounting apparatus.

Fig. 4 is a block diagram showing the control device.

Fig. 5 is a diagrammatic view showing a radial pin element.

Fig. 6 is a side view showing the photographing apparatus.

Detailed Description

Hereinafter, examples of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

(A) First embodiment

Fig. 1 shows a component mounting machine 10. The component mounter 10 is an apparatus for performing mounting work of components on a circuit substrate 12. The component mounting apparatus 10 includes: a device main body 20, a substrate transport holding device 22, a component mounting device 24, a marking camera (see fig. 2)26, a side camera (see fig. 3)28, a component supply device 30, a scattered component supply device 32, and a control device (see fig. 4) 34. The circuit substrate 12 includes a circuit board, a three-dimensional substrate, and the like, and the circuit board includes a printed wiring board, a printed circuit board, and the like.

The apparatus main body 20 includes a frame portion 40 and a beam portion 42 that is bridged on the frame portion 40. The substrate transport and holding device 22 is disposed at the center of the frame portion 40 in the front-rear direction, and includes a transport device 50 and a clamp device 52. The conveying device 50 is a device for conveying the circuit substrate 12, and the holding device 52 is a device for holding the circuit substrate 12. Thereby, the base material transport holding device 22 transports the circuit base material 12, and fixedly holds the circuit base material 12 at a predetermined position. In the following description, the conveying direction of the circuit substrate 12 is referred to as the X direction, the horizontal direction perpendicular to the X direction is referred to as the Y direction, and the vertical direction is referred to as the Z direction. That is, the width direction of the component mounting machine 10 is the X direction, and the front-rear direction is the Y direction.

Component mounting apparatus 24 is disposed on beam portion 42, and includes two

work heads

60 and 62 and a work head moving device 64. As shown in fig. 2, the

work heads

60 and 62 include a rod-like attachment unit 66, and the attachment unit 66 is held by a head main body 67 of the

work heads

60 and 62 so as to be slidable in the vertical direction and rotatable about an axial center in a posture extending in the vertical direction. A lower end portion of the mounting unit 66 extends downward from a lower surface of the head main body 67, and a suction nozzle 68 is attached to a lower end portion of the mounting unit 66. Then, the component is sucked and held by the suction nozzle 68.

The work heads 60 and 62 include a lifting device (not shown) for lifting the mounting unit 66 and a rotation device (not shown) for rotating the mounting unit 66 about the axial center. This allows the component held by the suction nozzle 68 to be moved in the vertical direction, and the posture of the component held by the suction nozzle 68 to be changed. The rotation device can adjust the rotation angle of the mounting unit 66 as desired, and can position the rotation angle of the component held by the suction nozzle 68.

As shown in fig. 3, the work head moving device 64 includes: an X-direction moving device 69, a Y-direction moving device 70, and a Z-direction moving device 72. The X-direction moving device 69 and the Y-direction moving device 70 move the two

work heads

60 and 62 integrally to an arbitrary position on the frame portion 40. The

work heads

60 and 62 are attached to the

sliders

74 and 76 so as to be attachable and detachable by a single operation, and the Z-direction moving device 72 moves the

sliders

74 and 76 independently in the vertical direction. That is, the

work heads

60 and 62 are moved independently in the up-down direction by the Z-direction moving device 72.

The mark camera 26 is attached to the slider 74 in a downward state, and moves in the X direction, the Y direction, and the Z direction together with the work head 60. Thereby, the marker camera 26 photographs an arbitrary position on the frame portion 40. As shown in fig. 2, the side camera 28 is attached to the

working heads

60, 62. Specifically, an arm 77 is fixed to an edge portion of the lower surface of the

work heads

60 and 62 so as to extend downward. One side camera 28 is fixed to a lower end of the arm 77 so as to face a component suction position of the suction nozzle 68. That is, the side camera 28 is moved in the X direction and the Y direction together with the suction nozzle 68 by the work head moving device 64. The elevating range of the mounting unit 66 by the elevating device is set so that the component held by the suction nozzle 68 enters the imaging range of the side camera 28. Thereby, the side camera 28 photographs the component held by the suction nozzle 68. Further, an arm 78 having the same shape as the arm 77 is fixed to the edge of the lower surface of the

work heads

60 and 62 so as to extend downward at a position symmetrical to the arm 77 with the suction nozzle 68 as the center. A lamp 80 is fixed to a lower end portion of the arm 78 so as to face a component suction position of the suction nozzle 68. That is, the side camera 28 and the lamp 80 are disposed at bisected positions in a state of sandwiching the suction nozzle 68, and the side camera 28 and the lamp 80 face each other. Therefore, the shooting range of the side camera 28 and the irradiation range of the lamp 80 overlap.

As shown in fig. 1, the component supply device 30 is disposed at one end in the front-rear direction of the frame portion 40. The component feeder 30 has a tray-type component feeder 86 and a feeder-type component feeder (refer to fig. 4) 88. The tray-type component feeder 86 is a device for feeding components in a state of being placed on a tray. The feeder-type component supply device 88 is a device that supplies components by using a radial feeder (not shown). Since the radial feeder is a well-known device, it is a device that cuts a radial pin component (see fig. 2)100 from a component tape (not shown) and supplies the radial pin component 100, which will be described briefly. The radial lead element 100 includes a body 102 and two leads 104 extending in the same direction from the bottom surface of the body 102, and in the element braid, the radial lead element 100 is braided with a carrier tape (not shown) at the leads 104. The radial feeder cuts the pins 104 of the tape carrier, and supplies the pins to the radial pin component 100.

The component feeder 32 is disposed at the other end of the frame portion 40 in the front-rear direction. The scattered component supply device 32 is a device that arranges a plurality of components scattered randomly and supplies the components in an aligned state. That is, the present invention is a device for aligning a plurality of elements in an arbitrary posture into a predetermined posture and supplying the elements in the predetermined posture. The components supplied by the component supply device 30 and the scattered component supply device 32 include electric components, components of solar cells, components of power modules, and the like. In addition, the electric elements include elements having leads such as the radial lead element 100, elements having no leads such as a square chip, and profiled electric elements.

As shown in fig. 4, the control device 34 includes: a controller 110, a plurality of driving circuits 112, and an image processing apparatus 114. The plurality of drive circuits 112 are connected to the conveying device 50, the gripping device 52, the work heads 60 and 62, the work head moving device 64, the tray-type component supplying device 86, the feeder-type component supplying device 88, and the scattered component supplying device 32. The controller 110 includes a CPU, a ROM, a RAM, and the like, and is mainly a computer and connected to a plurality of drive circuits 112. Thus, the operations of the substrate transport and holding device 22, the component mounting device 24, and the like are controlled by the controller 110. The controller 110 is also connected to the image processing apparatus 114. The image processing device 114 processes the image data obtained by the marker camera 26 and the side camera 28, and the controller 110 acquires various information from the image data.

In the component mounter 10, the above-described configuration allows the circuit substrate 12 held by the substrate transport and holding device 22 to be mounted with components. Specifically, the circuit base material 12 is conveyed to the working position where it is fixedly held by the clamping device 52. Next, the mark camera 26 moves above the circuit substrate 12 to photograph the circuit substrate 12. At this time, the photographing data obtained by photographing by the mark camera 26 is transmitted to the controller 110, and the photographing data is analyzed by the controller 110. Thereby, information on the holding position of the circuit base material 12, the position of the pin insertion hole of the pin element provided in the circuit base material 12, and the like is calculated.

In addition, the component feeder 30 or the scattered component feeder 32 feeds components at a predetermined feeding position, but here, a case where the components are fed by the feeder-type component feeder 88 of the component feeder 30 will be described. That is, a case where the radial pin elements 100 are supplied from the radial feeder will be described. The radial feeder supplies the pins 104 in a state where the body 102 is directed upward and the two pins are directed downward. Then, work heads 60 and 62 move upward from the component supply position of the radial feeder, and as shown in fig. 2, radial pin component 100 is sucked and held on the upper surface of main body 102 by suction nozzle 68.

Next, in the working heads 60, 62 holding the radial pin element 100, the radial pin element 100 is photographed by one side camera 28. Specifically, in the work heads 60 and 62, the operation of the elevating device is controlled so that the pins 104 of the radial pin element 100 held by the suction nozzle 68 enter the imaging range of the side camera 28 and the irradiation range of the lamp 80, and the mounting unit 66 is elevated. The lamp 80 is turned on toward the pin 104 of the radial pin member 100, and the pin 104 is photographed by the side camera 28. That is, the light is irradiated from the side of the lead 104 toward the lead 104, and the shadow of the lead 104 generated at this time is captured by the side camera 28 to obtain a side image of the lead. In addition, at the time of shooting, the attachment unit 66 rotates by the operation of the rotation device. Therefore, the side camera 28 photographs the leads 104 a plurality of times along with the rotation of the mounting unit 66, that is, the rotation of the suction nozzle 68. Further, the rotation device is temporarily stopped to position the radial pin elements held by the suction nozzles at predetermined angles every time the mounting unit 66 is rotated to a plurality of predetermined rotation angles. When the side camera 28 stops, the side camera takes an image of the pin 104 positioned and stopped. Thus, the side camera 28 captures the pin 104 a plurality of times in a state where the posture of the pin 104 of the imaging target is changed, that is, in a state where the imaging conditions are changed. In other words, the side camera 28 captures the lead 104 a plurality of times and acquires a plurality of captured data in a state where the imaging position and the imaging angle of the lead 104 are changed. In the shooting of the side camera 28, the

heads

60 and 62 and the suction nozzle 68 are stopped. This can prevent shaking during shooting. Then, a plurality of pieces of imaging data obtained by a plurality of times of imaging by the side camera 28 are transmitted to the controller 110, and the plurality of pieces of imaging data are analyzed by the controller 110. Thus, the controller 110 calculates and acquires information on the position of the tip of the pin 104.

Next, based on the calculated holding position of the circuit board 12 and the tip position of the lead 104, the operation of the work head moving device 64 is controlled so that the through hole formed in the circuit board 12 and the tip of the lead 104 of the radial lead element 100 overlap in the vertical direction, and the radial lead element 100 held by the suction nozzle 68 is positioned. Then, by the mounting unit 66 being lowered by the operation of the elevating device, the pins 104 of the radial pin element 100 are inserted into the through holes of the circuit substrate 12, and the radial pin element 100 is mounted on the circuit substrate 12.

As described above, in the component mounter 10, the components supplied from the component supply device 30 and the like are held by the suction nozzle 68 and mounted on the circuit substrate 12. In this case, when the circuit substrate 12 is mounted with the element in a state where some foreign matter is attached, the circuit substrate 12 may become a defective product. In particular, in the radial pin element 100 supplied from the radial feeder, since the pin 104 is cut in the radial feeder and then the radial pin element 100 is supplied, a burr 120 may be adhered to the tip portion of the pin 104 as shown in fig. 5. In addition, chips generated by cutting and dross 122 carried by the tape may adhere to the leads 104. The foreign matter here means a special-shaped object different from a normal object, and the foreign matter is also included in the object integrated with the pin 104. That is, although the chips, the dross, the dust, and the like which are separate from the leads 104 are foreign substances, the burrs 120 of the leads 104 which are integrated with the leads 104 are also foreign substances.

Therefore, in the component mounting apparatus 10, when the side camera 28 images the lead 104 in order to calculate the position of the leading end of the lead 104, it is checked whether or not foreign matter is attached to the lead 104 together with the calculation of the position of the leading end of the lead 104. That is, in the component mounting work, after the radial pin component 100 is held by the suction nozzle 68 from the radial feeder as described above, the side camera 28 photographs the pins 104 of the radial pin component 100 held by the suction nozzle 68 in the work head 60. At this time, the mounting unit 66 rotates, the posture of the lead 104 of the radial lead element 100 held by the suction nozzle 68 is changed, and the side camera 28 captures the lead 104 a plurality of times. Then, a plurality of pieces of imaging data obtained by a plurality of times of imaging by the side camera 28 are transmitted to the controller 110, and the plurality of pieces of imaging data are analyzed by the controller 110. At this time, the controller 110 calculates information on the position of the pin 104 based on the plurality of pieces of imaging data, and determines whether or not foreign matter is attached to the pin 104 based on the plurality of pieces of imaging data. As a method of determining the presence or absence of foreign matter, when the size of the shadow of the lead 104 generated by the light projection of the lamp 80 is larger than the outer size of the lead 104 by a threshold or more, it is determined that foreign matter is present.

In this way, by determining the foreign matter based on the shadow of the lead 104 generated by the projected light from the side of the lead 104, as shown in fig. 5, the burr 120a formed so as to extend downward on the lower end surface of the lead 104 can be confirmed well. Further, the burr 120b formed so as to extend to the side of the lead 104 and the dross 122 attached to the side surface of the lead 104 can be also confirmed satisfactorily by changing the posture of the lead 104 by rotating the mounting unit 66 during imaging. When it is determined that some foreign matter adheres to the leads 104, the radial lead element 100 held by the suction nozzle 68 is discarded in a disposal box (not shown) without being mounted on the circuit substrate 12. This prevents foreign matter from being introduced into the circuit base material 12, and suppresses the occurrence of a defective substrate.

In the component mounting apparatus 10, the calculation of the position of the tip of the lead 104 and the determination of whether or not foreign matter is attached to the lead 104 are performed based on the imaging data of the side camera 28. That is, two different processes can be performed using the captured data of one side camera 28. This eliminates the need to arrange a plurality of cameras for each process or to re-capture the image for each process, and thus reduces the cost, reduces the imaging time, shortens the data processing time for parallel processing of the imaging data, and saves the space.

(B) Second embodiment

In the first embodiment, the calculation of the position of the component and the determination of the presence or absence of a foreign object are performed based on the imaging data captured at the angle of view from the side of the component, but in the second embodiment, the calculation of the position of the component and the determination of the presence or absence of a foreign object are performed based on the imaging data captured at the angle of view from the lower side of the component. In detail, in the component mounting apparatus 10 according to the second embodiment, the imaging device 150 shown in fig. 6 is used instead of the side camera 28. The imaging device 150 is a camera capable of acquiring a 3D image, and is a so-called 3D camera.

Specifically, the imaging device 150 includes: part camera 152, lens 154, and illumination device 156. The part camera 152 has an imaging element (not shown) and is disposed so that the light receiving surface faces upward. The lens 154 is fixed to the light receiving surface side of the component camera 152, that is, the upper surface side of the component camera 152, and an illumination device 156 is provided above the lens 154 via a box-shaped member 157. The lighting device 156 is composed of a housing 158 and four lamps (only two lamps are shown) 160. The housing 158 is formed in a substantially bowl shape, and has LEDs disposed throughout as a lighting device of an element on a surface thereof, and has openings on an upper surface and a lower surface. The plurality of LEDs can light up LEDs at an arbitrary number of positions according to the imaging conditions of the elements. The box-shaped member 157 is disposed at an upper end thereof with the larger diameter opening directed upward. The four lamps 160 are disposed at positions that bisect the edge of the opening at the upper end of the housing 158. The four lamps 160 are irradiated in a direction above the center of the opening of the housing 158. That is, the four lamps 160 irradiate light in a manner of converging toward a predetermined position located above the center of the case 158. In addition, the predetermined position is a shooting position of the component held by the suction nozzle 68 located within the range of the depth of field of the shooting device 150.

One imaging device 150 having such a configuration is fixedly disposed between the component feeding device 30 and the substrate transport and holding device 22 at the upper surface of the frame portion 40 of the component mounting machine 10. After the components supplied from the component supply device 30 and the like are held by the suction nozzle 68, the operation of the work head moving device 64 is controlled so as to move the components to the predetermined position, that is, to the position where the light emitted from the four lamps 160 is focused. In addition, in the second embodiment, a case where a component (for example, a square chip 170) having no pin is held by the suction nozzle 68 will be described, unlike the first embodiment.

When the square chip 170 held by the suction nozzle 68 is moved to the predetermined position, the movement of the work heads 60 and 62 is stopped and stopped at the position. And, the first lamp 160 among the four lamps 160 is turned on. Thereby, the square chip 170 is irradiated with light from the direction in which the first lamp 160 of the four lamps 160 is arranged. Then, the square chip 170 is photographed by the part camera 152. Subsequently, the first lamp 160 is turned off, and the second lamp 160 is turned on. Thereby, light is irradiated to the square chip 170 from a direction different from the first lamp 160. Then, the square chip 170 is photographed by the part camera 152. Subsequently, the second lamp 160 is turned off, and the third lamp 160 is turned on. Thereby, light is irradiated to the square chip 170 from a direction different from the first and

second lamps

160 and 160. Then, the square chip 170 is photographed by the part camera 152. Further, the third lamp 160 is turned off, and the fourth lamp 160 is turned on. Thereby, light is irradiated to the square chip 170 from a direction different from the first to third lamps 160. Then, the component camera 152 images the square chip 170. Thereby, the square chip 170 is photographed at each irradiation in a state where light is irradiated from four different directions, respectively. That is, the imaging device 150 images the square chip 170 a plurality of times in a state where the irradiation position is changed, that is, in a state where the imaging condition is changed. In other words, the imaging device 150 images the square chip 170 a plurality of times by changing the irradiation angle and the irradiation direction of light to the square chip 170 in a state where the square chip, which is the element held by the holder, is fixedly positioned and stopped with respect to the imaging device. During the imaging by the parts camera 152, the work heads 60 and 62 are not moved, and the square chip 170 held by the suction nozzle 68 stays at the predetermined position. That is, at one shooting position, the square chip 170 performs shooting a plurality of times in a stopped state.

Then, a plurality of pieces of imaging data obtained by a plurality of times of imaging by the imaging device 150 are transmitted to the controller 110. The controller 110 analyzes the plurality of pieces of transmitted imaging data and calculates the holding position of the counter chip 170 by the nozzle 68. The controller 110 calculates information on the three-dimensional outline of the square chip 170, that is, the three-dimensional shape of the square chip 170 (hereinafter, referred to as "calculated three-dimensional shape"), based on the plurality of pieces of imaging data. The controller 110 stores an actual three-dimensional shape (hereinafter, referred to as "actual three-dimensional shape") of the square chip 170. In addition, the actual three-dimensional shape uses a product catalog value or the like. Then, it is determined whether or not the difference between the calculated three-dimensional shape and the actual three-dimensional shape is greater than or equal to a threshold value. At this time, the calculated three-dimensional shape is compared with the actual three-dimensional shape, and if the difference is equal to or greater than a threshold value, it is determined that a foreign object is present.

In this way, by using the imaging device 150 having the 3D imaging function, the presence or absence of the foreign object can be appropriately determined. That is, in a camera having no 3D imaging function, only imaging data of an element irradiated with light only from a predetermined direction can be obtained without moving the element held by a holder, and therefore, it is not possible to calculate and acquire a three-dimensional composite image, that is, only a two-dimensional shape of the element, from the imaging data. Furthermore, since a blind spot may occur in the captured image of the element, the state of the element cannot be determined more accurately than the three-dimensional shape data. When light is irradiated to the element only from a predetermined direction, if the irradiated light is affected by the background of the element, it is not possible to appropriately determine a foreign object based on the imaging data. On the other hand, in the imaging device 150 having the 3D imaging function, since a plurality of pieces of imaging data of the elements irradiated from a plurality of directions can be obtained, a blind spot hardly occurs by calculating the three-dimensional shape of the element. Further, since the light is irradiated to the element from each of the plurality of directions without moving the angle or position of the element held by the holder with respect to the imaging device, even if one of the light irradiated from the plurality of directions is affected by the background of the element, the other light irradiated is not affected by the background of the element. Thus, by using the imaging device 150 having the 3D imaging function, it is possible to appropriately determine the foreign object based on the imaging data.

Further, the calculation of the holding position of the square chip 170 and the determination of whether or not foreign matter is attached to the square chip 170 are performed based on the imaging data of the imaging device 150. That is, two different processes can be executed in parallel based on the captured data of one imaging device 150. This eliminates the need to arrange a camera for each process, and enables cost reduction, reduction in processing time, space saving, and the like.

Incidentally, in the above-described embodiment, the component mounting machine 10 is an example of a working machine. The side camera 28 is an example of an imaging device. The work heads 60 and 62 are examples of work heads. The suction nozzle 68 is an example of a holder. Radial pin element 100 is an example of an electrical component. The imaging device 150 is an example of an imaging device. The square chip 170 is an example of an electric element.

The present invention is not limited to the above-described embodiments, and can be implemented in various modifications and improvements based on knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, the position of the light emitted to the component held by the nozzle 68 and the posture of the component held by the nozzle 68 are changed as the change of the imaging conditions, but other imaging conditions may be changed. Specifically, for example, the shutter speed (exposure time), contrast, resolution, light irradiation angle, light irradiation intensity, and the like of the imaging device may be changed.

In the above-described embodiment, the two processes of the calculation of the information on the position of the component and the determination of whether or not a foreign object is attached to the component are executed based on the imaging data of the side camera 28 or the imaging device 150, that is, the imaging data of one camera, but other processes may be further executed. For example, coplanarity inspection or the like may also be performed.

The present invention is applicable not only to the radial lead element 100 and the square chip element, but also to various special-shaped elements such as an axial lead element.

The work heads 60 and 62 are not limited to a single suction nozzle, and may have a plurality of component suction nozzles. In this case, since the component can be held by each of the nozzles, the component can be imaged, imaging data of the held components can be collectively calculated, position data of each component can be acquired, and whether or not foreign matter is adsorbed can be determined.

In the lighting device as the pin element, any position and number of LEDs among the plurality of LEDs disposed inside the housing 158 may be irradiated instead of the four lamps 160.

The holder is not limited to the nozzle, and a chuck or the like held by a plurality of claws or the like may be used.

Description of the reference numerals

10: component mounting machine (working machine) 28: side camera (photographing device) 60: the working head 62: the working head 68: suction nozzle (holder) 100: radial pin element (electrical element) 150: the photographing device 170: a square chip (electrical component).

Claims

1. A work machine is provided with:

a work head having a holder; and

a photographing device for photographing the electric element held by the holder,

the work machine calculates information relating to the position of the electrical component and determines whether or not a foreign object is attached to the electrical component, based on the image data of the electrical component captured by the image capture device.

2. The work machine of claim 1,

the photographing device photographs the electric component held by the holder a plurality of times,

the work machine calculates information relating to the position of the electrical component and determines whether or not foreign matter is attached to the electrical component, based on a plurality of pieces of imaging data obtained by a plurality of times of imaging by the imaging device.

3. The work machine of claim 2,

the plurality of imaging data are data obtained by imaging the electric component held by the holder by changing imaging conditions.

4. The work machine of claim 3,

the plurality of pieces of imaging data are data obtained by performing at least one of a change in position of light irradiated to the electrical component held by the holder and a change in posture of the electrical component held by the holder as a change in the imaging conditions.

5. The working machine according to any one of claims 1 to 4,

the photographing device has a 3D photographing function.