JP3355566B2 - Component mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for picking up a component placed on a component supply unit such as a tray with a suction nozzle and transferring the component to a desired position on a mounting portion such as a printed circuit board.
The present invention relates to a so-called mounter, and more particularly to a suction nozzle suitable for suctioning a coil portion of a component to be sucked such as an air-core coil.

[0002]

2. Description of the Related Art Conventionally, components to be transferred from a tray or the like to a desired position on a printed circuit board or the like with a component mounting apparatus are square, such as a semiconductor device or a capacitor, or round, such as a resistor or a diode. It was. Each of them is a solid body, and if it is placed in a correct position on a tray or the like, it can be reliably sucked into one component suction hole provided at the tip.

[0003] In recent years, the technology for electronic and miniaturization of electric equipment has been further advanced, and air-core coils have been mounted on printed circuit boards and the like.

The position of the mounter is controlled. If a suction position (supply source) on a tray and a mounting position (transfer destination) on a printed circuit board are designated, a mounting head unit having a suction nozzle is designated. The components can be transferred to a desired position on the printed circuit board by relative movement between the printed circuit board and a table fixing the printed circuit board or a board transfer conveyor.

[0005]

However, when a coil portion of a component to be sucked such as an air core coil is sucked by a suction nozzle of a mounter and is to be mounted on a printed circuit board,
Even if the air-core coil is placed in the correct position on the tray and the suction nozzle moves relative to the suction position of the specified tray accurately and sucks, and moves relative to the desired mounting position on the printed circuit board, It was confirmed that the substrate could not be accurately transferred to a desired mounting position on the substrate.

In particular, when the coil is an air-core compression spring having a coil wire diameter (diameter d) smaller than the coil pitch and having an even number of turns, the transfer accuracy is extremely reduced.

FIG. 7 shows a state where the air core coil Pc is sucked by the conventional suction nozzle 6. In the figure, reference numeral 6a denotes a communication hole connecting the component suction hole 6b provided at the tip of the suction nozzle 6 to the vacuum system to the vacuum system, and 6c denotes a hole for stably sucking the air-core coil Pc. This is a curved surface guide provided at the tip of the suction nozzle 6. Air core coil Pc
Is an odd number, the center of the component suction hole 6b coincides with the wire center of the air-core coil Pc. In such a case, the air-core coil Pc is positioned at a desired position on a printed circuit board (not shown). Can be transferred accurately.

However, the present inventors have studied and found that even if the same suction nozzle 6 as shown in FIG. 8 sucks an air-core coil Pc having an even number of coil turns as shown in FIG.
As shown in FIG. 9A, even if the center of the component suction hole 6b initially coincides with the center of the free height of the air-core coil Pc, at the time of transfer to a desired position on the printed circuit board, FIG. As shown in (), the air-core coil Pc is shifted by a half pitch along the curved surface guide 6c, so that the center of the component suction hole 6b and the wire center of the air-core coil Pc coincide. The displacement of the air-core coil Pc by a half pitch has reduced the mounting accuracy.

As a result of further study, as shown in FIG. 9 (b), the air stream flowing into the component suction hole 6b from the air core coil Pc side is formed along both sides of the element wire of the air core coil Pc. Had become. As a cause, imbalance occurs in the air flow due to slight displacement or vibration during suction,
The suction state as shown in FIG. 9A cannot be maintained, and the air-core coil Pc receives the thrust of the air flowing into the component suction hole 6b so as to form the streamline shown in FIG. Therefore, it is considered that the air-core coil Pc is shifted by a half pitch.

SUMMARY OF THE INVENTION An object of the present invention is to provide a component capable of adsorbing a coil part having a compression spring-like shape and having an even number of turns by a suction nozzle and accurately transferring the coil part to a desired position of a mounting portion. An object of the present invention is to provide a mounting device.

[0011]

A feature of the present invention to achieve the above object is to mount a component placed on a component supply section by a suction nozzle and to transfer the component to a desired position on a mounting section. In the device, the suction nozzle has at least two tips at the tip.
Even number of component suction holes are provided , and the component is wound.
The coil part with an even number of times is sucked by the suction nozzle.
Yes, the center spacing of the component suction holes and the winding of the coil part
The pitch is almost equal .

[0012] It is another aspect of the present invention,
The suction nozzle is provided with at least two even-numbered component suction holes at the tip of the component for which the coil portion is to be suctioned for an even number of coil turns, and the component for which the coil portion is to be suctioned is When the number of turns of the coil is odd, the coil is wound on the mounting head so that the component suction hole can be provided at the tip.

[0013]

Therefore, there is no displacement in the coil suction stage, and the coil can be accurately transferred onto the substrate.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the embodiments shown in the drawings. FIG. 1 shows a component mounting apparatus 10 according to one embodiment of the present invention. Reference numeral 20 denotes a printed circuit board 30 sent from an upstream printing machine or the like arranged below a mounting head section 50 as indicated by an arrow A. When the mounting head unit 50 transfers the air-core coil from the tray 40, which is a component supply unit, onto the printed circuit board 30, the mounting head unit 50 sends the air-core coil to a downstream side such as a reflow device. 6
Reference numeral 0 denotes a suction nozzle unit detachably provided on the mounting head unit 50, 70 denotes an operation panel unit, and 80 denotes a monitor.

The mounting head unit 50 moves in the X-axis direction indicated by an arrow A, the Y-axis direction orthogonal to the X-axis direction, the θ-axis direction rotating on a plane in each of the XY axes, and the Z-axis direction in the vertical direction. The moving distance and moving position can be input from a keyboard or the like attached to the monitor 80, and the input data is input to the front door 9 of the component mounting apparatus 10.
It is stored in the storage unit of the control device installed in the control unit 0.
The movement of the mounting head unit 50 in each of the X, Y, and Z axes, that is,
The air-core coil arranged on the tray 40 is transferred to a desired position on the printed circuit board 30 by the relative movement with respect to the printed circuit board 30.

The suction nozzle 60 of the mounting head 50 is
As shown in FIG. 2 to FIG. 4 in an enlarged manner, a fixing metal 61 and a transparent suction nozzle 63 fitted in the communication hole 61a, and a light diffusion plate 62 sandwiched between the fixing metal 61 and the suction nozzle 63.
It is composed of The communication hole 61a is provided in the mounting head 50.
Connected to the vacuum system via Therefore, an airflow is formed in the upward direction indicated by the arrow B. Reference numeral 61b denotes an engaging portion with which a hook (not shown) of the mounting head portion 50 is engaged. The suction nozzle unit 60 is detachably fixed to the mounting head unit 50 by the engagement of the hook. When light is irradiated from the radial direction indicated by arrow C, the light diffusion plate 62 diffuses the light in the downward direction indicated by arrow D. Further, since the suction nozzle 63 is a transparent body, light passes through the inside of the suction nozzle 63 downward, and irradiates the air-core coil Pc which is sucked to the lower end of the suction nozzle 63.

Although not shown in FIG. 1, an image recognition camera is provided so that the posture of the air-core coil Pc sucked from below the suction nozzle 63 can be image-recognized.

The air-core coil Pc has two ends P as shown in FIG.
The suction nozzle 63 sucks the coil-shaped portion so that both ends Pce are at desired positions on the printed circuit board 30 in FIG. 1. Transfer so that it touches. The air-core coil P
c is fixed to the wiring pads of the printed circuit board 30 by solder at both ends Pce.

The communication hole 63a of the suction nozzle 63 communicates with the communication hole 61a of the fixture 61.
Are provided with two component suction holes 63b.

The cross section of the suction nozzle 63 is rectangular, and the longitudinal direction of the curved surface guide 6c with respect to the air-core coil Pc coincides with the horizontal direction of the component suction hole 63b. Reference numeral 64 denotes a positioning pin when the suction nozzle unit 60 is attached to the mounting head unit 50 by a hook (not shown). The positioning is performed by inserting the positioning pins 64 into the holes of the mounting head unit 50.

The center pitch of the component suction holes 63b is substantially equal to the winding pitch of the compression spring-shaped air-core coil Pc having an even number of turns.

FIG. 5 shows a state where the compression spring-shaped air-core coil Pc having an even number of turns is attracted to the tip of the suction nozzle 63. Generally, in a mounter (component mounting device), the tip of the suction nozzle 63 is brought into contact with the center of the component due to the balance when the component is lifted.

Accordingly, when the suction nozzle 63 moves onto the tray 40 and is lowered further to suck the air-core coil Pc, the suction nozzle 63 is positioned at the center of the compression spring-shaped air-core coil Pc having an even number of turns. Are centered, the center of each component suction hole 63b coincides with the wire center of the air-core coil Pc.

At this time, the stream of air flowing into each component suction hole 63b flows along both sides of the coil wire as shown in FIG. 6, and the air flows stably. Therefore, the air-core coil Pc does not receive a propulsive force from the air flowing into each of the component suction holes 63b during the transfer from the suction to the transfer, and the position is not shifted while being sucked. Can be transferred. Further, the air-core coil Pc is not deformed by the propulsive force of the air flowing into the component suction holes 63b.

If the number of turns of the compression spring-shaped air-core coil Pc is an even number, the number of the component suction holes 63b is preferably an even number. When it becomes necessary to transfer the compression-spring-shaped air-core coil Pc having an odd number of windings, the hook (not shown) mounts the mounting head 50.
The conventional suction nozzle 6 shown in FIG.

According to the present invention, for the compression spring-shaped air-core coil Pc having an odd number of turns, the number of the component suction holes 63b is preferably an odd number of 3 or more.

It should be noted that the suction nozzle 63 sucks a round part at all. Further, an air-core coil whose winding pitch matches the coil wire diameter, such as a tension spring, may be suction-transferred. In these components, the component suction holes 63b are almost closed on the component surface, and the problem of positional displacement does not occur.

[0029]

As described above, according to the component mounting apparatus of the present invention, a component to which a coil portion having a compression spring-like shape and an even number of turns is sucked is sucked by a suction nozzle and accurately positioned at a desired position of a portion to be mounted. Can be transferred to

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a longitudinal sectional view showing a suction nozzle of the component mounting apparatus shown in FIG.

FIG. 3 is a longitudinal sectional view of the suction nozzle when the suction nozzle shown in FIG. 2 is rotated by 90 degrees.

FIG. 4 is a plan view of the suction nozzle shown in FIG. 2;

FIG. 5 is a plan view of the tip of the suction nozzle showing a state where the air-core coil is sucked by the suction nozzle shown in FIG. 2;

FIG. 6 is a longitudinal sectional view of the tip of the suction nozzle showing a state where the air-core coil is sucked by the suction nozzle shown in FIG. 2;

FIG. 7 is a plan view of the tip of a suction nozzle showing a state where an odd number of turns of an air-core coil are sucked by a conventional suction nozzle.

FIG. 8 is a plan view of the tip of the suction nozzle showing a state where an air core coil having an even number of turns is sucked by a conventional suction nozzle.

FIG. 9 is a vertical cross-sectional view of the tip of the suction nozzle showing a state in which an air core coil having an even number of turns is sucked by the conventional suction nozzle.

[Description of Signs] 10… Component mounting device 20…
Conveyor 30 ... Printed circuit board 40 ...
Tray 50… Mounting head 60…
Suction nozzle part 61 ... Fixing bracket 61a ...
Communication hole 61b ... engagement part 62 ...
Light diffusion plate 63 ... suction nozzle 63a ...
Communication hole 63b… Component suction hole 63c…
Curved surface guide 64 Locating pin 70
Operation panel 80 Monitor Pc
Air core coil

──────────────────────────────────────────────────続 き Continuation of the front page (72) Koji Hironaka, Inventor 5-2-2 Koyodai, Ryugasaki, Ibaraki Pref. Hitachi Techno Engineering Co., Ltd. (56) References JP-A-63-289898 (JP, A) JP-A Sho 64-89443 (JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 13/04

Claims (2)

(57) [Claims] 1. A component mounting apparatus for picking up a component placed in a component supply unit with a suction nozzle and transferring the component to a desired position of a mounted portion, wherein the suction nozzle has at least two even-numbered component suction holes at a tip thereof. Is provided, wherein the component has a coil portion having an even number of turns wound by a suction nozzle, and a center pitch of the component suction holes and a winding pitch of the coil portion are substantially equal to each other. Component mounting device. 2. The component mounting apparatus according to claim 1, wherein
The suction nozzle is provided with at least two tips at the tip when the number of turns of the coil of the component to which the coil portion is sucked is even.
It is assumed that an even number of component suction holes are provided, and an odd number of component suction holes is provided at a tip end of a component to which the coil portion is sucked when the number of coil turns is odd. A component mounting apparatus characterized in that the component mounting apparatus is interchangeably mounted on a mounting head so as to be able to perform the mounting.