JPH0321117B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to an electronic component mounting apparatus for mounting minute electronic components onto a circuit board such as a printed circuit board.

Conventional configurations and their problems Conventionally, when attaching leadless microelectronic components such as chip resistors and chip multilayer capacitors to electronic circuit boards, adhesive was applied to the necessary locations on the circuit board. A method is adopted in which the electronic components are first placed on the circuit board and then sequentially supplied and bonded to the circuit board. A circuit board to which electronic components are bonded is electrically connected using solder dips. Paste solder may be used instead of adhesive.

As a device for mounting such electronic components,
It has been proposed that a rotating frame that rotates intermittently is provided with a large number of gripping members such as suction pads so as to be movable up and down, and electronic components of a component supply device are sequentially carried and mounted on a circuit board. The gripping member is raised and lowered above the component supply device and the circuit board. If a position adjustment stand for electronic components is provided in the middle, it is also raised and lowered at that position.

However, since the gripping member is raised and lowered by a fixed cam as the rotating frame rotates, the height of the gripping member is determined by the rotation angle of the rotating frame, which makes inspection and adjustment difficult. It was hot. Furthermore, when the gripping member fails to grip the electronic component, there is a problem in that even if the gripping member is not lowered onto the circuit board and the electronic component is attempted to be canceled, such an operation cannot be performed. Furthermore, with fixed cams, the height of the gripping member is fixed at a constant level, so when electronic components of different heights are used, the pressing force cannot be adjusted, leading to problems such as cracks in the electronic components. .

In addition, conventionally, instead of the fixed cam, there has been a method that raises and lowers the grip using an air cylinder mounted on a fixed frame, or a method that lifts the gripping member with a spring and presses it down via a cam lever with an air cylinder that is rotated to a stop position. is proposed. However, even with these, it is difficult to adjust the pressing force, and there is a problem that cracks may occur when electronic components of different heights are mounted. Furthermore, in the case where the air cylinder is mounted on the rotating frame, there are problems in that the weight of the rotating part becomes heavy and the piping becomes complicated.

Purpose of the invention This invention allows electronic components to be raised and lowered regardless of the rotation angle of the rotating frame, making inspection and adjustment easy.
In addition, the present invention provides an electronic component mounting device that can stop mounting while maintaining the movement of the rotating frame in the event of poor gripping, and that can stably mount electronic components of different heights without causing cracks or the like. The purpose is to provide.

Structure of the Invention The electronic component mounting device of the present invention uses a linear motor to move up and down a gripping member that is attached to a rotary frame so as to be movable up and down and grips an electronic component.

In this way, since the linear motor is used, the gripping member can be raised and lowered at any rotation angle without being affected by the rotation of the rotating frame. Therefore, inspection and adjustment are easy. Furthermore, in the case of poor gripping, the mounting work can be carried out without lowering the gripping member while maintaining operation of the rotary frame. Furthermore, since a linear motor is used, it is possible to freely control the lifting speed and lifting stop position of the gripping member, and even if the height of the electronic component differs, it can be properly mounted.

DESCRIPTION OF THE EMBODIMENTS An embodiment of the present invention is shown in FIGS. 1 to 5. In the figure, reference numeral 1 denotes a rotating frame attached to a rotating main shaft 2, which is intermittently rotated horizontally at rotation angles of 90° by driving a motor 3 serving as a rotational drive device. Lifting shafts 4 are installed on the rotating frame 1 at four equal intervals in the circumferential direction, and a suction pad 5 serving as a gripping member is attached to the lower end of each lifting shaft 4. Each lifting shaft 4 is moved up and down by a linear motor 16 installed on the rotating frame 1. A suction path of the suction pad 5 is formed within the lifting shaft 4, and a suction device such as a suction fan is connected to the upper end of the lifting shaft 4 via a flexible tube (not shown). Corresponding to the stop position of the suction pad 5 at one location of the rotating frame 1, the component supply device 6
is installed, and a regulating table 7 and an XY table 9 for holding the circuit board 8 are arranged in order at each stop position on the downstream side in the rotational direction.

As shown in FIGS. 2 and 3, the rotating frame 1 consists of a lower disk 1a and an upper disk 1b. The rotating main shaft 2 is rotatably suspended from a head bracket 13 of a base 12 via a bearing 10 at its upper end.

The linear motor 16 includes an inner yoke 17, a guide shaft 18, and a coil bobbin 19 attached to the guide shaft 18.
a movable coil 19 that is supported in a vertically movable manner and loosely fitted around the outer periphery of the inner yoke 17; a pair of outer yokes 33 (not shown in FIGS. 1 to 3, but shown in FIGS. 4 and 5); Permanent magnet 34 on the inner surface of this outer yoke 33
It is made up of. The outer yoke 33 is integrated with the inner yoke 17 at both ends, and forms a magnetic circuit together with the permanent magnet 34. The upper and lower ends of the inner yoke 17, the outer yoke 33, and the guide shaft 18 are fixed to the upper disk 1b and the lower disk 1a of the forward/reverse rotation frame 1. Each lifting shaft 4 to which the suction pad 5 is attached passes through the bearings of the upper disk 1b and the lower disk 1a so as to be vertically movable, and is fixed to the coil bobbin 19a of the coil 19. The lead wire 35 of each coil 19 is inserted into the rotating main shaft and led out to the outside at a joint 36 that slides into contact with an annular contact piece 37 provided on the circumferential surface of the rotating main shaft 2.

The component supply device 6 sequentially feeds out a reel-wound tape 21 holding chip-shaped electronic components 20. A tape reel (not shown) and its feeding device are configured as parts cassettes 22, and a large number of parts cassettes 22 each containing different types of electronic components 20 are arranged in horizontal rows on a slide table 24 and are detachably installed. . Each parts cassette 22 has a tape feeding lever 25 (FIG. 2), and the tape feeding lever 25 is rotated by a feed cylinder 26 on the lower surface of the forward/reverse rotation frame 1. In addition, the tape feeding lever 2
5 may be rotated by other driving means.

The adjustment stand 7 is for adjusting the position of the electronic component 20 and adjusting the angle at an arbitrary angle, and is rotatably supported by the position adjustment bracket 27 of the base 12, and has four adjustment claws 28 on the upper surface. The regulation claw 28 is
They move forward and backward facing each other to sandwich the electronic component 20, and are driven by a cylinder or a motor through a link mechanism or the like. The regulation table 7 is rotated by a motor 30 via a timing belt 29.

The XY table 9 holds the circuit board 8 and moves in the X-axis direction (left and right) and the Y-axis direction (front and back). The XY table 9 has an X table 9b that moves in the X direction on a Y table 9a that moves in the Y direction, and each is driven by a ball screw, a pulse motor, etc.

The operation of the above configuration will be explained. Each suction pad 5 of the rotating frame 1 descends above the component supply device 6 to suck the electronic component 20 on the component supply device 6, and after rising, moves above the regulating table 7 by the rotation of the rotating frame 1. do. Here, the suction pad 5 descends and places the electronic component 20 on the regulating table 7. The regulation stand 7 has a regulation claw 28
The position of the electronic component 20 is adjusted by the rotation of the electronic component 20, and the angle of the electronic component 20 is adjusted by rotating as necessary. When the adjustment is completed, the suction pad 5 suctions the electronic component 20 again and rises. Note that the electronic component 20 may remain suctioned to the suction pad 5 during the adjustment. When the suction pad 5 rises, the rotation frame 1
further rotates, and the suction pad 5 that has suctioned the regulated electronic component 20 reaches above the circuit board 8. At this point, the suction pad 5 descends and presses the electronic component 20 against the circuit board 8 to mount it. After attachment, the suction pad 5 rises.

In this way, the electronic component 20 is mounted,
Since the suction pad 5 is raised and lowered by the linear motor 16 on the rotary frame 1, the following advantages can be obtained. That is, the suction pad 5 can be raised and lowered at any rotation angle without being affected by the rotation of the rotary frame 1. Therefore, inspection and adjustment are easy. Furthermore, if the suction pad 5 fails to suction the electronic component 20, it is necessary to cancel the mounting without lowering the suction pad 5 above the circuit board 8 in order to avoid defective mounting on the circuit board 8. However, unlike conventional fixed cams, the suction pad 5 can be freely stopped from descending in this way. In this case, the rotating frame 1 can be operated normally. The parts of the circuit board 8 where the electronic components 20 were not mounted will be mounted later.
Further, since the linear motor 16 is used, the lifting speed and lifting stop position of the suction pad 5 can be freely controlled. For example, when the pressure force that presses the electronic component 20 against the circuit board 8 becomes constant, it is possible to control the electronic component 20 to escape upward, and even if the electronic component 20 has various heights, it can always be mounted with the same pressure force. It is possible. In addition, the descending speed of the suction pad 5 is set to
When the speed approaches 0, the electronic component 2 is lowered to a low speed.
It is also possible to prevent damage to zero. moreover,
The linear motor 16 has a fast start-up speed, can be controlled with high precision, and can be lightweight and space-saving.

In the embodiment described above, four suction pads 5 were attached to the rotary frame 1 and a regulating table 7 was used, but the regulating table 7 does not necessarily need to be provided. Further, four or more suction pads 5 may be provided on the rotating frame 1, and suction state detection means or the like may be provided at each stop position from the component supply device 6 to the circuit board 8. Further, instead of the suction pad 5, a gripping claw or the like may be used as the gripping member.

Effects of the Invention The electronic component mounting device of the present invention is capable of raising and lowering the gripping member of the electronic component regardless of the rotation angle of the rotating frame, making inspection and adjustment easy, and stopping mounting of the electronic component in the case of poor gripping. This has the advantage that it can be carried out while maintaining the operation of the device, and that even electronic components of different heights can be stably mounted without causing cracks or the like.

[Brief explanation of the drawing]

FIG. 1 is a schematic perspective view of the main parts of an embodiment of the present invention, FIG. 2 is a side view thereof, FIG. 3 is a front view thereof, FIG. 4 is a longitudinal sectional view of the linear motor, and FIG. The figure is also a cross-sectional view of the linear motor. 1... Rotation frame, 3... Motor (rotation drive device),
4... Lifting shaft, 5... Suction pad (gripping member),
6...Component supply device, 8...Circuit board, 9...
XY table, 16... linear motor, 20...
electronic components.

Claims (1)

[Claims] 1. A freely rotatable rotating frame, and a plurality of electronic components that can hold electronic components that are arranged on the rotating frame at equal intervals in the circumferential direction around the rotational axis and are each supported so as to be movable up and down in the direction along the rotational axis. a gripping member, a rotation drive device that intermittently rotates the rotating frame at the arrangement pitch of the gripping member, a plurality of linear motors that are installed on the rotating frame and move each of the holding members up and down, An electronic component mounting device comprising a component supply device that sequentially supplies electronic components to one of the gripping member stopping positions, and a table that holds a circuit board at another gripping member stopping position.