JPH1075095A - Electronic part automatic attaching device and method for sucking electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively utilize a space in the flat surface direction of a head by, after sucking each part of adjoining parts, so that the sides adjoining each other are almost parallel through moving the head, for attaching the part to a printed substrate. SOLUTION: A vacuum channel is formed for each sucking nozzle 41, and a switching valve is provided for each vacuum channel. Therefore, independent of the vertical movement of the nozzle 41, the vacuum channel is formed for each sucking nozzle 41, while a part 5 is sucked. Thus, a straight line passing through the position which is both a rotation center of a nozzle holder and the center of four nozzles 41 from the nozzle 41 is sucked at a position 45 deg. with respect to one side of the electronic part 5, and a corner part of each part 5 of four sucking nozzles 41 is aligned with the center position, with the sides of the adjoining parts 5 being parallel to each other, and the space of an attaching head is utilized effectively, for sucking an electronic part 5. At that time, the corner parts are not made exactly conformity each other, and the interval from the adjoining part 5 may be larger to some extent.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of picking up a plurality of rectangular electronic components from a component supply unit using a plurality of suction nozzles provided on the same head, and then simultaneously picking up the plurality of electronic components. The present invention relates to an electronic component automatic mounting apparatus for mounting the component on a printed circuit board by moving the head in a state, and a method for sucking an electronic component.

[0002]

2. Description of the Related Art Conventionally, in this kind of electronic component automatic mounting apparatus,
When a plurality of suction nozzles are mounted on the mounting head, as shown in FIG. 5, the straight line passing through the suction nozzle 91 from the center of rotation of the mounting head 90 and the supply direction of the electronic component of the component supply unit 92 are at right angles. Alternatively, unlike FIG. 5, suction is performed such that the straight line passing through the suction nozzle from the center of rotation of the mounting head 90 and the supply direction of the electronic component are parallel (coincident). That is, when the electronic component is rectangular (rectangular), one side thereof is stored in the storage tape so as to be parallel to the feeding direction. It is parallel or perpendicular to one side of the part.

When a plurality of suction nozzles mounted on a mounting head simultaneously suction a plurality of components when the components are suctioned as described above, if the shape of the components is square, the case shown in FIG. In this case, the largest component that does not interfere with the matching component can be picked up.

[0004]

However, the conventional technique has a drawback that the space at the center of the head is vacant as shown in FIG. 6 and that the space of the mounting head is not effectively used. Also, since the positions of the components are dispersed, when the
A wide field of view is required for collective recognition on the screen.

Accordingly, an object of the present invention is to effectively utilize the space in the plane direction of a head when electronic components are suctioned by a plurality of suction nozzles in the same head.

[0006]

According to the present invention, after a plurality of rectangular electronic components are suctioned from a component supply unit by a plurality of suction nozzles provided in the same head, the plurality of electronic components are sucked. At the same time, in the electronic component automatic mounting apparatus in which the head in the sucked state moves and mounts the component on a printed circuit board, the respective components are sucked such that adjacent sides of adjacent components are substantially parallel to each other. is there.

By doing so, a space between the sucked electronic components does not become vacant, and a plurality of large-sized components can be sucked.

Further, according to the present invention, after a plurality of rectangular electronic components are sucked from a component supply unit by a plurality of suction nozzles provided on the same head, the plurality of electronic components are simultaneously sucked. In an electronic component automatic mounting apparatus in which a head moves and mounts the component on a printed circuit board, control means for controlling a position of the mounting head is provided such that adjacent sides of adjacent components are suctioned substantially in parallel. is there.

According to the present invention, in the suction method of the first aspect, the corners of the plurality of electronic components are moved to the vicinity of the center of the image of the recognition camera for recognizing the position of the electronic component sucked by the suction nozzle. Thus, it is adsorbed.

In this manner, a plurality of electronic components adsorbed on the same head can be collectively recognized without increasing the field of view of the camera.

According to a second aspect of the present invention, there is provided an automatic electronic component mounting apparatus according to the second aspect, wherein the corners of the plurality of electronic components are recognized by a recognition camera for recognizing a position of the electronic component sucked by the suction nozzle. The suction is performed so as to approach the center.

Further, according to the present invention, after each of four suction nozzles provided at 90 ° intervals about a predetermined position of the same head sucks a rectangular electronic component from a component supply unit, the head moves. In the electronic component automatic mounting apparatus for mounting the component on a printed circuit board, a straight line passing through each suction nozzle from the center with respect to one side of the electronic component placed so as to be able to be supplied to the component supply unit is approximately 45 degrees. The electronic component is sucked at the position where the electronic component is formed.

By doing so, each component can be sucked so that no space is left between the electronic components, and a plurality of large-sized components can be sucked.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to the drawings.

As shown in FIG. 1, an electronic component mounting apparatus 1 comprises a base 2, a conveyor 3 extending to the center of the base 2, and a component supply unit 4 provided at the left end and the right end of the base 2. And first and second XY tables 7 and 8 provided on the left and right sides of the base 2, respectively.

On the first XY table 7, there is mounted a first head unit 9 for sucking the electronic component 5 and mounting it on the printed circuit board 6 placed on the conveyor 3, and the second XY table.
The table 8 also has a second head unit 10 mounted thereon. On the base 2, component recognition cameras 11, 11 are arranged on the left and right sides of the conveyor 3. The left and right component recognition cameras 11 and 11 correspond to the first and second head units 9 and 10, respectively, and recognize the electronic components 5 adsorbed by the respective units 9 and 10, and capture images of a predetermined visual field. The recognition process is performed to recognize a position shift (including an angle shift) of the component 5.

The component supply unit 4 includes a plurality of tape feeders 18 for positioning the electronic components 5 sealed in the tape at predetermined intervals at predetermined intervals by sending the tape intermittently at the intervals. And the tray 21
Electronic components 5 arranged in a matrix in the X and Y directions
Are provided. Most of the electronic components 5 are rectangular (rectangular) when viewed from above, and have a rectangular parallelepiped shape. Some are square when viewed from above. These components 5 are supplied such that the direction of one side of the tape feeder 18 coincides with the feed direction of the tape feeder 18, and the feed direction is a direction orthogonal to the transport direction of the conveyor 3 (the direction of the arrow in FIG. 1). It is. Tray 2
One side of the rectangular part 5 placed on the conveyor 1
In the transport direction. The shape of the electronic component 5 is generally rectangular, and among those having a relatively large size, there is a case in which many lead wires protrude in the horizontal direction.

The first and second XY tables 7, 8 are guided by a pair of guide rails 23 provided at the front and rear ends of the base 2, and move in the left-right direction (X-axis direction). 24, 24, respectively. The X movement block 24 of the first XY table 7 is screwed to the ball screw 25 on the front side, and reciprocates in the X direction by the rotation of the motor 26. Similarly, the X motion block 24 of the second XY table 8 is screwed into the ball screw 27 on the rear side, and reciprocates in the X direction by the rotation of the motor 28.

The first and second head units 9 and 10 are mounted on X-movement blocks 24 and 24, respectively, and are moved in the longitudinal direction of the blocks 24 and 24, ie, in the Y-direction by a drive mechanism (not shown).

The head units 9 and 10 include the mounting head 3
1 are attached respectively.

The structure of the mounting head 31 will be described with reference to FIG.

Each mounting head 31 is provided with four suction nozzles 41 (only two suction nozzles are shown in the drawing) at equal angular intervals in the circumferential direction (ie, at 90 ° intervals) and is mounted so as to be able to protrude and retract downward. A housing 43 provided to surround the holder 42, four engagement hooks 44 that can be engaged with each suction nozzle 41, and a hook holder 45 that supports the hooks 44.
And an engagement release mechanism 61 for releasing the engagement of the engagement hook 44.
It is composed of

The nozzle holder 42 includes a holder main body 46 and a spline shaft 47 integrally extending upward from the holder main body 46.
It is composed of

On the other hand, a pulse motor 60 having the nozzle holder 42 as a stator is configured. Therefore, the nozzle holder 42 rotates by a predetermined angle with respect to the housing 43, and the suction nozzle 41 can be positioned at an arbitrary angular position.

The suction nozzle 41 is disposed on a concentric circle centered on a vertical axis which is the center of rotation of the nozzle holder 42. Each time the nozzle holder 42 rotates by 90 degrees, the suction nozzle 41 has the same position with respect to the mounting head 31. The nozzle 41 is positioned at the position.

Each suction nozzle 41 has a nozzle body 49,
A hook receiving member 50 provided at the upper end of the nozzle body 49. A guide rod 51 extending downward from a rod holder 62 fixed to the spline shaft 47 is passed through the hook receiving member 50. A coil spring 52 is attached between the hook receiving member 50 and the rod holder 62 so as to be wound around the guide rod 51.
Thus, the lowering of the suction nozzle 41 with respect to the holder body 46 is restricted.

Also, at the upper end of the hook receiving member 50,
An outwardly protruding engaging portion 50a is formed, and the above-described engaging hook 44 is engaged with each engaging portion 50a. The engaging hook 44 is rotatably attached to the hook holder 45 and is urged toward the hook receiving member 50 by a spring 53 provided between the engaging hook 44 and the hook holder 45.

An adsorbent 64 made of a magnetic material such as iron is attached to the outer surface of the hook 44.
The plurality of electromagnets 63 provided so as to surround the outside of the engagement hook 44 form an engagement release mechanism 61. When the electromagnet 63 at a predetermined angular position is excited, the attraction body 64 at a position opposing the electromagnet 63 is attracted by magnetic force,
The hook 44 rotates toward the electromagnet 63 and the hook receiving member 5
The engagement with the 0 engaging portion 50a is released. It is sufficient that the number of electromagnets is larger than the number of suction nozzles 41 so as to surround the outer surface of the hook 44 with almost no gap. Since there are four suction nozzles 41, at least five electromagnets 63 are sufficient.

The operation will be described below.

First, the first XY table 7 is moved by a command from a control device (not shown), and the mounting head 31 mounted on the first head unit 9 is supplied with the position where the electronic component 5 to be taken out, that is, for example, the component The tape feeder 18 of the supply unit 4 is positioned at a position where the electronic component 5 enclosed in the tape is fed and supplied. Therefore, the tape feeder 1
The direction of one side of the electronic component 5 coincides with the feed direction 8 (X direction).

Next, as shown in FIG. 1, the suction nozzle 14 mounted on the mounting head 31 (painted black).
Is rotated by the pulse motor 60 so that a straight line connecting the midpoint of the suction nozzle 14 and the center of rotation of the mounting head 31 forms an angle of 45 degrees with the direction in which the tape feeders 18 are arranged in the Y direction. Positioned.

Next, the suction nozzle 41 at the position painted out in black in FIG. 1 is brought into contact with the suction body 64 by the excitation of the electromagnet 63 at the position where the engaging hook 44 corresponding to the nozzle 41 opposes it.
Is disengaged from the engaging portion 50a.

As a result, the suction nozzle 14 is lowered by the urging force of the coil spring 52 and protrudes from the mounting head 31.

In this state, the mounting head 31 is lowered from the head unit 9 by the driving of a lifting mechanism (not shown), and the suction nozzle 41 suctions the center of the component 5 and
As a result, the part 5 is taken out.

Next, the nozzle holder 42 is connected to the hook holder 4
5, the hook receiving member 50 is
Rises along the guide rod 51 against the engaging portion 50
a reaches a position where the hook 44 can be engaged.

Next, the hook 44 engages with the engaging portion 50 a of the hook receiving member 50 of the nozzle 41 that has sucked the electronic component 5 by the demagnetization of the electromagnet 63 by the bias of the spring 53.

Next, the nozzle 41 not adsorbing the component 5
For example, the pulse motor 6 is moved so that the nozzle 41 adjacent to the nozzle 41 that is being sucked is located in a blackened position in FIG.
0 rotates around a 90-degree vertical axis.

Next, the nozzle holder 42 is connected to the hook holder 4.
5, the electromagnet 63 corresponding to the nozzle 41 is excited at any timing during or after the lowering, and the engaging portion 50a of the hook 44 is
Is disengaged, and the nozzle 41 is protruded from the mounting head 31.

Next, in the same manner as described above, the mounting head 31
The parts 5 to be sucked are sucked and taken out by the whole descent.

By repeating this operation for each of the four suction nozzles 41 of the same head 31, the electronic component 5 is sucked by all the suction nozzles 41 as shown in FIG.

In this suction operation, the suction nozzle 41
A vacuum path (not shown) is formed for each suction path, and a switching valve (not shown) is provided for each vacuum path. Is formed.

As described above, the nozzle 41 is moved from the nozzle 41 to the nozzle holder 4.
2, a straight line passing through a position that is the center of the four nozzles 41 is sucked at a position of 45 degrees with respect to one side of the electronic component 5, and the components 5 of the four suction nozzles 41 Are aligned with the center position, the sides of the adjacent components 5 are made parallel (substantially coincident in FIG. 2), and the space of the mounting head 31 is effectively used to form the electronic components 5. Adsorbing.

Even if the mounting head 31 is the same, the size of one side is "A" when sucked as shown in FIG. It can be adsorbed.

At this time, in consideration of the angular shift and the positional shift of the electronic component 5 at the time of suction, the corners may not be exactly coincident with each other, and the interval between the adjacent components 5 may be increased to some extent.

FIG. 2 shows a case where the electronic component 5 having the maximum size when the center (center of gravity) of the electronic component 5 is attracted is attracted. There is a gap, and it is adsorbed. Even if it is a small part 5, by sucking the outside of the part 5,
The component 5 can be sucked in such a manner as to be closer to the center of the mounting head 31, and even if the electronic component 5 is larger than the dimension "B", it will be sucked inside the component 5 as shown in FIG. If the position is sucked, the component 5 can be sucked such that the corners are aligned with substantially one point so that there is no gap between them (that is, as shown in FIG. 2).

Next, the mounting head 3 to which the electronic component 5 has been sucked
Reference numeral 1 denotes the position of the center of the head 31 (that is, the center of the arc where the four nozzles 41 are located) on the component recognition camera 11 due to the movement of the first head unit 9 in the XY directions by the first XY table 7. Is stopped so as to coincide with the center of the image to be imaged, and the images of the four electronic components 5 are collectively imaged.

Next, the mounting head 31 moves to the printed circuit board 6 and firstly moves to the mounting position indicated by data (not shown) stored in the storage unit (not shown).
Is mounted.

In this mounting, as described above, first, only the suction nozzle 41 that has suctioned the component 5 to be mounted is projected.

Next, the nozzle 41 is positioned and corrected based on the recognition result so that the component 5 is at the angular position indicated by the data by the rotation of the pulse motor 60, and the first X
By driving the Y table 7, the recognition result is similarly corrected and positioned at the position indicated by the data, and the component is mounted by lowering the mounting head 31.

Next, when the mounting head 31 is lifted, the nozzle 41 is stored in the head 31 in the same manner as described above, and then the suction nozzle 41 for sucking the component 5 to be mounted.
The electronic component 5 is mounted at the position indicated by the data by similarly correcting the recognition result.

After all the four electronic components 5 have been mounted in this way, the mounting head 31 moves to the component supply unit 4 that supplies the next component 5 to attract the next component 5.

In this embodiment, 4 of the same head 31 is used.
Although the case where the electronic component 5 is sucked by all of the suction nozzles 41 has been described, three or two suction nozzles 41 are used.
If the component 5 is sucked at the same position as when four components are sucked, the space of the mounting head can be prevented from being wasted.

[0053]

As described above, according to the present invention, when a plurality of electronic components are suctioned by a plurality of suction nozzles provided on the same head, a space between the electronic components can be prevented from being vacant. Space can be used effectively.

[Brief description of the drawings]

FIG. 1 is a plan view showing a state in which a suction nozzle provided in a mounting head sucks an electronic component from a component supply unit.

FIG. 2 is a plan view showing a state in which suction nozzles provided in the mounting head are respectively sucking electronic components.

FIG. 3 is a plan view showing the electronic component automatic mounting apparatus.

FIG. 4 is a side view showing the mounting head with a part thereof cut away.

FIG. 5 is a plan view showing a state in which a suction nozzle provided in a mounting head in the related art sucks an electronic component from a component supply unit.

FIG. 6 is a plan view showing a state in which a suction nozzle provided in a mounting head according to the related art sucks an electronic component.

[Explanation of symbols]

 4 Component Supply Section 5 Electronic Component 6 Printed Circuit Board 11 Component Recognition Camera 31 Mounting Head 41 Suction Nozzle

Claims (5)

[Claims] 1. After a plurality of rectangular electronic components are sucked from a component supply unit by a plurality of suction nozzles provided on the same head, the head in a state where the plurality of electronic components are simultaneously sucked moves. An electronic component automatic mounting apparatus for mounting the component on a printed circuit board, wherein the component is sucked such that adjacent sides of the adjacent component are substantially parallel to each other. 2. After a plurality of rectangular electronic components are sucked from a component supply unit by a plurality of suction nozzles provided in the same head, the head in a state where the plurality of electronic components are simultaneously sucked moves. And an electronic component automatic mounting apparatus for mounting the component on a printed circuit board, wherein control means for controlling the position of the mounting head is provided such that adjacent sides of adjacent components are sucked substantially in parallel. Electronic component automatic mounting device. 3. The method according to claim 1, wherein corners of the plurality of electronic components are attracted so as to be close to a center of an image of a recognition camera for recognizing a position of the electronic component attracted by the suction nozzle. Item 4. The method for adsorbing an electronic component according to Item 1. 4. The method according to claim 1, wherein corners of the plurality of electronic components are attracted so as to be close to a center of an image of a recognition camera for recognizing a position of the electronic component attracted to the suction nozzle. Item 3. An electronic component automatic mounting device according to Item 2. 5. After each of four suction nozzles provided at 90 ° intervals around a predetermined position of the same head sucks a rectangular electronic component from a component supply unit, the head moves to print a printed circuit board. In the electronic component automatic mounting apparatus for mounting the component at a position, a straight line passing through each suction nozzle from the center forms an angle of approximately 45 degrees with respect to one side of the electronic component placed so as to be supplied to the component supply unit. The electronic component suction method that sucks electronic components.