JP2000068687A - Chip mounting equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip mounting equipment of simple mechanism, capable of mounting many chips on a wiring board at a time, small in installation floor space, and can be markedly lessened in initial cost. SOLUTION: A mounting equipment is equipped with stick-like magazine cases 2 where a large number of chips of a kind are housed in layers. The magazine cases 2 are arranged upright on a magazine case holder 1 corresponding to a mounting pattern position of a wiring board 17, a nozzle head 12 equipped with a vacuum suction nozzle 14 is made to move between the magazine case holder 1 and the wiring board 17, and a chip inside the stick-like magazine case 2 is pushed up by a push pin 10 from below the magazine case holder 1. A chip transfer/feeder mechanism 7 is equipped with the nozzle head 12 provided with the suction nozzle 14 that sucks up and holds a chip.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component mounting apparatus which enables a plurality of micro chip components of different types to be mounted on a wiring board at one time. A plurality of stick-shaped magazine cases accommodated in the wiring board are arranged in an upright state corresponding to the mounting positions of the wiring board, respectively, and one chip component is simultaneously suctioned from each of the stick-shaped magazine cases by the nozzle to the wiring board. By being mounted at once, the mounting cost can be reduced together with the equipment cost of the apparatus, and the productivity can be improved.

[0002]

2. Description of the Related Art In recent years, the miniaturization of chip components has become increasingly possible, and accordingly, mounting devices for mounting ultra-small chip components on printed circuit boards with high density and high precision have been developed. It has been put into practical use, and the mounting speed has been increased.

FIG. 4 shows an outline of an example of this type of mounting apparatus.
Shown in The rotary head is indicated by reference numeral 30 and is rotatable clockwise about an axis 30a. A large number of nozzle heads 31 are arranged in a circle around the outer periphery of the rotary head 30, and each of the nozzle heads 31 has a plurality of nozzles (five in this example) having different nozzle sizes for sucking and holding chip components by vacuum. 3) is provided in a circle. Further, the nozzle head 31 is rotatable so that the suction nozzle 32 corresponding to the size of the chip component can be selected. In the rotary head 30 described above, the chip components are sucked when the nozzle head 31 is at the position A.

[0004] Behind the rotary head 30, there is a chip component supply unit 33. In the supply unit 33, for example, a large number of cassettes 34 in which chip components such as resistors, capacitors, and diodes are separated and accommodated for each rating are arranged. As an example, the cassette 34
The method is performed by a method in which chip components housed in a bulk case are arranged in a row by a chute and fed, or a method in which chip components housed in a tape-shaped magazine case are fed one chip at a time. The above-described supply unit 33 is movable in the left-right direction with respect to the rotary head 30.

On the other hand, on the front side of the rotary head 30, a mounting portion 3 for mounting chip components on a wiring board 35 is provided.
The mounting of the chip component on the wiring board 35 is performed when the nozzle head 31 is at the position B. Wiring board 3
Reference numeral 5 is movable on an XY table.

[0006] The mounting procedure of the chip component by the above-described mounting apparatus is performed as follows. The chip component supplied from the cassette 34 based on the program data in the supply unit 33 is sucked at the position A by the suction nozzle 32 of the nozzle head 31 selected based on the component data. The nozzle head 31 holding the chip component by suction is transferred by the rotary head 30, and the type, size, shape, and the like of the chip component are image-recognized and calculated at the C position. The movement of the wiring board 35 together with the XY table is controlled based on the image-recognized calculation value,
The mounting position where the chip component is to be mounted is made to correspond to the nozzle head 31 at the position B.
By releasing the vacuum of 2, the chip component can be mounted at the mounting position. The above-described series of operations from supply of chip components to mounting are performed at a high speed, and a large number of chip components having different types and sizes can be mounted on each mounting position of the wiring board in a few seconds.

[0007]

By the way, in the above-mentioned mounting device, the mechanism of the device is extremely precise,
Since the control system is complicated, maintenance is troublesome. In addition, the entire apparatus becomes very large, weighs as high as 1 to 4 tons, and is very expensive.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and can mount a large number of chip components on a wiring board at a time with a simple mechanism, and requires a small installation space. It is an object of the present invention to obtain a chip component mounting apparatus that can make the equipment cost very low.

[0009]

In order to achieve the above-mentioned object, a chip component mounting apparatus according to the present invention comprises a plurality of stick-shaped magazine cases in which a large number of chip components are stored in a stacked state for each type. The magazine case holder is arranged upright so as to correspond to the mounting pattern position of the wiring board, and the nozzle head with the suction nozzle by vacuum can be moved between the upper part of the magazine case holder and the wiring board. At the lower part of the holder, there is provided a feed mechanism for pushing up chip components in each stick-shaped magazine case one chip at a time and sucking and holding the chip components on a suction nozzle of a nozzle head.

In the chip component mounting apparatus thus configured, the suction nozzle of the nozzle head is set in a vacuum state and positioned near the upper end opening of each stick-shaped magazine case, and then the feeding mechanism is moved upward. The chip components in the stick-shaped magazine case are pushed up by the push pins, and the uppermost chip components are sucked and held by the suction nozzle. After that, the nozzle head holding the chip components by suction is moved onto the wiring board, and when the chip components come into contact with the mounting portion of the wiring board, the vacuum of the suction nozzle is stopped, so that the mounting of the chip components can be performed at once. I can do it.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a chip component mounting apparatus according to the present invention will be described below with reference to the drawings.

FIG. 1 is an external perspective view of the entire mounting device. Reference numeral 1 denotes a magazine case holder. The magazine case holder 1 holds a plurality of stick-shaped magazine cases 2 (hereinafter simply referred to as magazine cases 2) in an upright state. The magazine case 2 is a case in which chip components such as resistors, capacitors, and diodes, which are ultra-small electronic components, are housed. As shown in FIG. The chip components 3 are stored in a stacked state. If the chip component has front and back surfaces and polarities, the chip components are stored with their front and back surfaces aligned and the polarities aligned.

The magazine case 2 is held by inserting the lower end of the magazine case 2 into the hole 4a of the base portion 4 of the magazine case holder 1 and holding the magazine case 2 with the upper part of the magazine case 2 as shown in FIG. 1 is inserted into the hole 5a of the upper plate 5 and held upright (see FIG. 2). Therefore, the magazine case 2 can be inserted and removed from the upper portion of the magazine case holder 1.

The number and arrangement of the magazine cases 2 in the magazine case holder 1 correspond to the component mounting positions of the wiring board. Therefore, the holes of the base portion 4 for holding the magazine case 2 are provided. 4a and upper plate 5
The position of the hole 5a can be easily set from the CAD data of the wiring board.

Now, a feed mechanism 7 for feeding chip components in each magazine case 2 one chip at a time from the upper part of the case is provided. This feed mechanism 7 is provided at the lower part of the magazine case holder 1. I have. In the feeding mechanism 7, a pin holder 9 is horizontally fixed to a rod 8 of a cylinder (not shown), and a number of push pins 10 corresponding to the magazine case 2 are fixed on the pin holder 9 in a standing state. As the push pin 10, for example, a piano wire having a bow-like bending elasticity is used.

Each push pin 10 is inserted into the magazine case 2 through a hole 4b opened in the base plate 4, and the push pin 10
The chip components 3 can be received in a stacked state on a seat plate 11 attached to the upper end of the chip component 3.

On the other hand, a nozzle head 12 is arranged above the magazine case holder 1. Nozzle head 1
2, suction nozzles 14 are attached to a hollow box-shaped nozzle holder 13 so as to correspond to the upper end openings of the magazine cases 2 as shown in FIG. An air suction tube 15 is connected to the nozzle holder 13.

The nozzle holder 13 includes a guide arm 16
Can be moved between the magazine case holder 1 and the wiring board 17 along the axis, and can be moved up and down with respect to the magazine case holder 1 and the wiring board 17.

Incidentally, the positioning of the push pins 10 and the suction nozzles 14 can be easily set similarly from the cad data of the wiring board, whereby the magazine case 2 and the center of the push pins 10 and the suction nozzles 14 can be positioned. Position accuracy can be improved.

Next, the chip mounting operation of the mounting apparatus configured as described above will be described. First, the nozzle holder 13 is positioned above the magazine case holder 1, and the nozzle head 12 is lowered, and the tip of the suction nozzle 14 is stopped near the upper end of the magazine case 2. Thereafter, at the same time as the vacuum operation of the suction nozzle 14 is started, the feed mechanism 7 is driven, and each pin holder 9 is simultaneously moved upward. By the upward movement of the pin holder 9, the chip components 3 housed in a stacked state in the makadine case 14 are pushed up by the push pins 10, so that the uppermost chip component in each makadine case 14 becomes the suction nozzle 14. Is adsorbed. Here, it is confirmed by the vacuum sensor whether or not all the chip components have been sucked by each suction nozzle 14.

When all of the chip components are sucked by the suction nozzles 14, it can be confirmed that there is no air leakage in the air suction tube 15. For example, when the chip component is not sucked by some of the suction nozzles, air leakage occurs. In this case, the pin holder 9 is further moved upward to press the chip component against the suction nozzle 14.

Here, since the chip components housed in each magazine case 2 have different thicknesses as well as component sizes, different types of chip components are pushed up by the push pins 10 and pressed against the suction nozzles 14. In the case of a thick chip component, the push pin 10 is bent and deformed, so that an excessive pressing force against the suction nozzle 14 can be absorbed.

Thus, each of the chip components is attached to the suction nozzle 14.
When the suction is confirmed by the vacuum sensor, the pin holder 9 is lowered. After this operation, the nozzle holder 13 moves upward, moves along the guide arm 16 and is positioned above the wiring board 17. Thereafter, when the nozzle holder 13 descends and the chip component sucked by the suction nozzle 14 comes into contact with the component mounting position of the wiring board 17, the vacuum operation is stopped and, at the same time, air is fed into the nozzle holder 13 ( Vacuum break)
Then, the suction of the chip component from the suction nozzle 14 is released.
As a result, each chip component is fixed on the adhesive or cream solder that has been processed at the component mounting position of the wiring board 17 in the previous process.

After that, the wiring board 17 on which the chip parts are mounted is transferred to a step of mounting the chip parts in a reflow furnace, and at the same time, a new wiring board is positioned at the mounting position, and the nozzle holder 13 is moved. It moves to the magazine case holder 1 again, and the chip component suction operation is repeated.

As described above, the chip component mounting apparatus according to the present invention can simultaneously mount a large number of chip components on a wiring board with simple mechanical equipment and a control system.
As a result, the equipment cost can be extremely reduced, and the mounting cost can be reduced. Also,
Since the control of the production quantity is easy, it can be integrated with the assembling process, and a reduction in lead time or work in process can be expected.

The present invention is not limited to the embodiment described above and shown in the drawings, and various modifications can be made without departing from the scope of the invention.

In the present embodiment, the push pin 10 for pushing up the chip component is described as a case where a wire rod that bends and deforms in a bow shape is used. However, a pin member having a coil spring interposed so as to have spring properties in the axial direction is used. It may be used.

[0028]

As described above, in the chip component mounting apparatus according to the present invention, a plurality of stick-shaped magazine cases accommodating a large number of chip components in a stacked state for each type are mounted on the mounting pattern position of the wiring board. It is arranged upright on the magazine case holder so as to correspond, the nozzle head with the suction nozzle by vacuum can be moved between the upper part of the magazine case holder and the wiring board, and each stick-shaped at the bottom of the magazine case holder A chip component supply mechanism that pushes up the chip components in the magazine case one chip at a time and holds them on the suction nozzles of the nozzle head, so that a large number of chip components can be simultaneously mounted on the wiring board with simple mechanical equipment and a control system. And equipment costs can be very low, and Cost can also be cheaper.

Further, since the production quantity can be easily controlled, it can be integrated with the assembling process, and a reduction in lead time or in-process can be expected. In addition, since the mechanical equipment is simple, there is an effect that maintenance is easy.

[Brief description of the drawings]

FIG. 1 is an external perspective view of the entire mounting device according to the present invention.

FIG. 2 is a cross-sectional view of a magazine case and a feeding mechanism.

FIG. 3 is a sectional view of a nozzle head.

FIG. 4 is a schematic view of a mechanism of a conventional mounting device.

[Explanation of symbols]

Reference Signs List 1 Magazine case holder, 2 stick-shaped magazine case, 3 chip parts, 7 feeding mechanism, 9 pin holder, 10 push pin, 11 seat plate, 12 nozzle head, 13 nozzle holder, 14 suction nozzle, 15
Air suction hose, 16 guide arm, 17 wiring board

Claims (3)

[Claims] 1. A mounting device for mounting a plurality of chip components of different types on a wiring board at one time, comprising a plurality of sticks each containing a large number of chip components in a stacked state for each type. A magazine case holder in which magazine cases are arranged in an upright state corresponding to the mounting pattern positions of the wiring board, and movable between the upper part of the magazine case holder and the wiring board on which chip components are mounted. And a nozzle head having a suction nozzle by vacuum corresponding to the upper end opening of each of the stick-shaped magazine cases, and a chip component disposed in the lower part of the magazine case holder and having one chip in each of the stick-shaped magazine cases. Push the chip parts up from the upper end opening of the magazine case and A chip component mounting device, comprising: a feeding mechanism for sucking and holding the chip component. 2. The chip component mounting device according to claim 1, wherein each of the suction heads of the nozzle head is supported in communication with a hollow box-shaped nozzle holder, and a suction hose is connected to the nozzle holder. A mounting device for chip components, characterized in that: 3. The chip component mounting device according to claim 1, wherein the feeding mechanism is configured to stack the chip components on a flexible push pin inserted from a lower end opening of the stick-shaped magazine case. A chip component mounting device, wherein the chip component is stored and pushed up one chip at a time from the upper end opening of the stick-shaped magazine case by a cylinder operation of the push pin.