JP3296661B2 - Parts supply device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a component storage tape for encapsulating chip components, which is fed by a tape feeding means while peeling off a cover tape covering the upper surface of the tape to prevent the components from jumping out during tape feeding. The present invention relates to a component supply device that includes a shutter that can open and close a component extraction position and that feeds and supplies chip components to the component extraction position.

[0002]

2. Description of the Related Art In this kind of component supply apparatus, Japanese Patent Laid-Open No.
As disclosed in Japanese Patent No. 9326, the component storage tape is fed while the cover tape is peeled off from the component storage tape for storing the chip components, and the shutter is pressed by a shutter so that the chip components stored in the tape do not jump out during the feeding operation. Some are sent to the component removal position by the suction nozzle while being sucked.

[0003] However, when the cover tape is peeled off, static electricity may be generated and the chip components may be charged. As shown in FIG. 10, the chip components 5 aligned in the component storage recesses 21A of the component storage tape 21 are not shown in FIG. 12, the chip component 5 is pulled up and lifted by the opening operation of the shutter 40, and as shown in FIG. 12, the storage position is broken at the suction position by the suction nozzle 14, and the suction may not be performed well. .

The generation of static electricity when the cover tape is peeled off is also disclosed in Japanese Utility Model Publication No. Hei 4-15672. Further, Japanese Utility Model Application Laid-Open No. 5-57900 discloses a technique for removing static electricity charged on a carrier tape of an embossed tape when the cover tape is peeled off by bringing a conductive tool into contact with the carrier tape.

[0005] However, the embossed tape has poor conductivity, so that static electricity can be removed only in the vicinity of contact with the conductive tool, and even if the stored chip parts are charged, the chip parts cannot be discharged. Therefore, it is impossible to cope with the problem that the chip component is charged and the attitude in which the chip component is stored is lost due to the opening operation of the shutter as in the present application.

[0006]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to enable a chip component charged at the time of peeling off a cover tape to be pulled out by the opening operation of a shutter and to deliver the component without disturbing the posture.

[0007]

[0008]

Therefore, according to the present invention, a component accommodating tape for enclosing a chip component is fed by a tape sending means while peeling off a cover tape covering the upper surface of the tape, thereby preventing a component from jumping out during tape feeding. Department to do
In a component supply device that includes a shutter that can open and close the product take- out position and that feeds the chip component to the component take-out position, the chip component charged by static electricity generated when the cover tape is peeled off at least before the shutter. And a conductor for removing the static electricity by contact.

[0009]

According to the above construction, the conductor is brought into contact with the chip component charged by the static electricity generated when the cover tape is peeled off at least before the shutter, and the chip component is discharged.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings. Note that the same reference numerals are given to components equivalent to those in the conventional technology. 2 and 3, reference numeral 1 denotes an X table which moves in the X direction by rotation of the X-axis motor 2.
Is an XY table that moves in the X and Y directions by moving in the Y direction on the X table 1 by the rotation of the Y-axis motor 4. The chip electronic component 5 (hereinafter, referred to as a chip component or component) is moved. The printed board 6 to be mounted is fixed and mounted on fixing means (not shown).

Reference numeral 7 denotes a supply table on which a number of component supply devices 8 for supplying the chip components 5 are provided. Reference numeral 9 denotes a supply stand drive motor, which rotates the ball screw 10 so that the supply stand 7 is guided by the linear guide 12 through a nut 11 fitted with the ball screw 10 and fixed to the supply stand 7, and X Move in the direction. Reference numeral 13 denotes a rotary table which rotates intermittently. At the outer edge of the table 13, mounting heads 15 having six suction nozzles 14 as take-out nozzles are arranged at regular intervals in accordance with an intermittent pitch.

A stop position of the mounting head 15 where the suction nozzle 14 sucks and picks up the component 5 from the supply device 8 is a suction station, and the suction nozzle 14 sucks the component 5 at the suction station. Reference numeral 16 denotes a component recognition device for recognizing a positional shift of the component 5 to be sucked by the suction nozzle 14 by using a camera to image the lower surface of the component 5 within a predetermined visual field range and recognizing and processing the captured screen. The station at which the moving head 15 stops on the device 16 is the recognition station.

The position where the mounting head 15 next to the recognition station stops is the angle correction station, and mounting data (not shown) in which the angle amount for correcting the angular position deviation of the chip component 5 based on the recognition result of the recognition device 16 is predetermined. Head rotation device 1 by an angle amount that is added to the angle amount shown in FIG.
7 rotates the mounting head 15 in the θ direction. The next stop position after the angle correction station is a mounting station, on which the component 5 sucked by the suction nozzle 14 located at the station is mounted.

Next to the mounting station, the mounting head 1
The position where 5 stops is a nozzle selection station, in which the nozzle 15 is rotated by the nozzle selection device 19 and an arbitrary nozzle 14 is selected from a plurality of nozzles 14. Next, the component supply device 8 will be described with reference to FIGS. 1 and 3 to 8. At the suction station, the component 5 supplied by the component supply device 8 is sucked and taken out by the suction nozzle 14 descending. The components 5 stored at regular intervals in the component storage tape 21 wound on the tape reel 20 are fed at a predetermined pitch by swinging the swing lever 56 clockwise in FIG.

That is, by the swing of the lever 56 about the support shaft 58 as a fulcrum, the transmission lever 22 as a feed drive lever connected to the lever 56 as shown in FIG. A feed lever 23 serving as a tape sending means connected to the feed lever 23 swings, and a feed claw 24 pivotally attached to the feed lever 23 meshes with a feed gear 25 to rotate it, and is integrally attached to the gear 25. The sprocket 27 that rotates together is rotated by a predetermined angle. A tension spring 46 is stretched between a pin 44 protruding from the transmission lever 22 on the paper surface side in FIG. 4 and the like and a pin 45 protruding on the back side in the paper surface of the feed lever 23 in FIG. When the transmission lever 22 moves to the right side in FIG. 4 (left side in FIG. 7), the feed lever 23 is pulled by the spring 46 and swings for the tape feeding operation. By the rotation of the sprocket 27, the engaging pin 28 formed on the outer periphery of the sprocket 27
The tape 21 is sent out at a predetermined pitch by fitting into a feed hole (not shown) formed at a predetermined pitch on one side of the tape 1. The component storage recess 2 in which the component 5 is stored in the component storage tape 21 at the same pitch as the pitch of the feed holes.
1A is formed, and the pitch of the tape 21 sent by one swing of the swing lever 56 matches the pitch of the concave portion 21A. The concave portion 21A is sent to the component supply position, which is the pick-up position of the suction nozzle 14, and the component 5
Is sent. The pin 45 is loosely fitted in a long hole 47 which is formed in the transmission lever 22 and is long in the moving direction of the lever 22.
When 2 moves to the left side in FIG. 4, the right end face of the elongated hole 47 presses the pin 45 to return the feed lever 23 to the position in FIG.

Numeral 57 denotes an elevating bar which moves up and down to swing the swing lever 56. After the feeding device 8 reaches a position where it is sucked by the suction nozzle 14 of the suction station by the movement of the supply table 7, it stops. Then, the swing lever 56 is pushed down to perform the above-described tape feed, which is a component supply operation, and is raised. Reference numeral 59 (see FIG. 7) is a stopper when the swing lever 56 is rotated counterclockwise in FIG.

A cover tape 32 is adhered to the upper surface of the component storage tape 21 while being wound on the tape reel 20, and covers the chip component 5 in the component storage recess 21A on the base tape side made of paper. However, the cover tape 32 must be peeled off in order to take out the component 5 with the suction nozzle 14.
Reference numeral 3 denotes a peeling plate for pressing the upper surface of the component storage tape 21 at its wide end by the urging force of the torsion coil spring 38 and peeling the cover tape 32 around the front end as a fulcrum.
The peeling plate 33 is swingable about a support shaft 39 and is urged downward by a spring 38 to press the component storage tape 21.

Numeral 34 denotes a cover tape reel for winding up the cover tape 32 (see FIG. 3). The rotation of the swing lever 56 in the clockwise direction in FIG. The cover tape 32 is rotated in synchronism with the peeling plate 33 and the cover tape 32 peeled off at the position of the leading end of the peeling plate 33 is wound up. 3
5 covers and presses the component storage tape 21 after the cover tape 32 is peeled off to suppress the upward movement of the tape 21, and also causes the chip component 5 stored in the component storage recess 21 </ b> A of the component storage tape 21 to jump out. This is a suppressor that can be swung about a support shaft (not shown) as a fulcrum at a portion extended to the right side in FIG. The hook 37 is pulled downward by a spring that is not pressed to press downward. The suppressor 35 and the peeling plate 33 also have a function of pressing the tape 21 so that the tape 21 does not float upward before and after the position where the cover tape 32 is peeled. The support shaft 39 is provided on the suppressor 35, and the peeling plate 33 is swingably attached to the suppressor 35.

The upper surface of the suppressor 35 is formed with an opening 65 for taking out a part as shown in FIG.
Is a shutter that opens and closes a suction position where the suction nozzle 14 located in the opening 65 sucks the chip component 5 as a component take-out position, is slidably mounted on the suppressor 35, and serves as shutter driving means. When the shutter lever 41 swings, it moves in the left-right direction of FIG. 4 through the slide groove 64 of FIG. 8 and covers the suction position at the closed position shown in FIG.
6 is prevented, the suction position is opened at the opening position shown in FIG. 6, and the suction of the chip component 5 by the suction nozzle 14 is enabled.

As shown in FIG. 1, a convex portion 62 is provided at the lower side of the suppressor 35 at least on the front side where the shutter 40 opens and closes to contact the chip component 5 in the concave portion 21A. Accordingly, even if the chip component 5 is charged by static electricity generated when the cover tape is peeled off (FIG. 1 shows an example in which the device body side is positive and the chip component side is negatively charged, but the opposite case may be adopted. 1), the convex portion 62 of the suppressor 35 as a conductor for forced discharge comes in contact with the shutter 40 in front of the shutter 40.
As shown in FIG. 9, the chip component 5 is not charged in the shutter 40 portion, and as shown in FIG.
Even if the opening operation is performed, the chip component 5 is not pulled up by the shutter 40 and lifted up, so that the posture does not collapse at the time of suction by the suction nozzle 14.

The shutter lever 41 swings about a support shaft 42, and an engagement pin 43 provided at the tip of the lever 41 engages with the shutter 40 to move the shutter 40. A pin 48 is provided on the shutter lever 41 so as to protrude on the paper surface side of the drawing. The pin 48 is a long hole as a shutter driving unit that is formed in the transmission lever 22 and is long in the left-right direction that is the moving direction of the lever 22. 49, the left end surface of the elongated hole 59 is engaged with the pin 48, and the shutter lever 41 swings in a direction to open the shutter 40. Reference numeral 50 denotes a pressing spring for urging the shutter lever 41 to the left in FIG.

After the feed lever 23 reaches the feed limit position where the feed pawl 24 abuts on the regulating pin 51, the transmission lever 22 is further moved to the pin 48 of the shutter lever 41 at the position urged by the pressing spring 50. It is drilled so that its left end face engages when it moves to the right. In addition, slot 47
The length is set so that the left end surface of the transmission lever 22 does not come into contact with the pin 47 even when the transmission lever 22 moves to a position where the shutter 40 is completely opened.

Reference numeral 52 denotes a return preventing claw for preventing the feed gear 25 from returning. The operation of the above configuration will be described below. First, when the automatic operation of the electronic component automatic mounting device is started by the operation unit (not shown), the automatic operation of the suction operation of the chip component 5 from the component supply device 8 and the mounting operation to the printed circuit board 6 is performed according to the component mounting data (not shown). Is made.

That is, the component supply device 8 for supplying the desired type of chip component 5 is moved by the rotation of the motor 9 to the take-out position of the suction station 14 by the suction nozzle 14 by moving the supply table 7. During this movement, the shutter 40 covers the suction position as shown in FIGS.

Next, the elevating rod 57 is lowered to move the swing lever 5
4, the transmission lever 22 moves rightward from the state shown in FIG. 4, and the feed lever 23 rotates counterclockwise in FIG.
The tape 21 fed from the tape reel 20 via the sprocket 27 is stopped by the control pin 51 and stopped as shown in FIG. During this time, the cover tape reel 34 is rotated in synchronization with the tape feed by the swing of the swing lever 56, and the cover tape 32 is peeled off at the leading end of the peeling plate 33 as the tape 21 is fed. Is wound on the cover tape reel 34.

Even when static electricity is generated when the cover tape is peeled off and the chip component 5 is charged as shown in FIG. 1, for example, the convex portion 62 provided on the suppressor 35 before being positioned at the shutter 40 described later. The charged chip component 5 is discharged by contacting the chip component 5 in the concave portion 21A. Therefore, the chip component 5 is not pulled by the opening operation of the shutter 40 and does not lose its posture at the suction position.

Further, during this feeding operation, the shutter 40 covers the suction position to prevent the chip component 5 sent to the suction position from jumping out of the component storage recess. Next, when the transmission lever 22 further moves rightward from the state shown in FIG. 5, the left end surface of the long hole 49 presses the pin 48, and the shutter lever 41 swings clockwise about the support shaft 42 as a fulcrum. The shutter 40 is slid to the right in FIG. 5 and opened to the state in FIG. During this time, the tension spring 46 is extended, so that the feed lever 23 is moved to the regulating pin 51 by the feed claw 2.
The pin 45 moves in the elongated hole 47 while the transmission lever 22 is moving, while maintaining the stopped state at the feed limit in which the pin 4 is locked.

Next, the chip component 5 sent to the suction position is sucked and taken out by the lowering of the suction nozzle 14 due to the lowering of the mounting head 15. When the suction nozzle 14 moves up, the elevating bar 57 moves upward, the transmission lever 22 moves to the left from the state shown in FIG. 6, the shutter lever 41 swings counterclockwise by the pressing of the pressing spring 50, and the shutter 40 closes. 5 to reach the state shown in FIG. 5, and the tension spring 46 contracts. When the elevating bar 57 further moves upward and the transmission lever 22 moves to the left, the right end face of the elongated hole 47 presses the pin 45, and the feed lever 23 returns to the state shown in FIG.

Next, the mounting head 15 having the suction nozzle 14 is moved by the intermittent rotation of the rotary table 13, and when the mounting head 15 reaches the component recognition station, the chip for the suction nozzle 14 is recognized by the recognition device 16. When the positional deviation of the component 5 is recognized and the next angle correction station is reached, the head 15 is rotated in the θ direction so as to reach the angular position to be mounted based on the recognition result.

Next, when the head 15 reaches the mounting station, the head 15 is lowered and the chip component 5 sucked by the suction nozzle 14 is recognized at a predetermined position on the printed board 6 by the XY table 3. It is attached by the movement which added the correction based on the result. During the intermittent rotation of the head 15 until the mounting, the desired parts 5 are successively set at the suction station.
Is sucked by the head 15 that has moved to the suction station, and then mounted on the printed circuit board 6 in the same manner.

The mechanism for feeding the tape 21 is not limited to this embodiment, but can be variously changed. Further, the tape is not limited to a paper tape, but may be an embossed tape.

Further, the shutter 40 may be coated with, for example, a resin to form an insulator, thereby preventing the discharge of the chip component 5 at the shutter 40. Further, a shutter made of a synthetic resin may be used.

[0033]

As described above, according to the present invention, before the shutter position.
Since the conductor is brought into contact with the charged chip component and pre-discharged, the chip component is not pulled by the opening operation of the shutter and loses its posture, and the chip component is reliably sucked by the suction nozzle.

[Brief description of the drawings]

FIG. 1 is an enlarged view of a main part of a component supply device to which the present invention is applied.

FIG. 2 is a plan view of the electronic component automatic mounting apparatus.

FIG. 3 is a side view of the electronic component automatic mounting apparatus.

FIG. 4 is a side view of a main part of the component supply device.

FIG. 5 is a side view of a main part of the component supply device.

FIG. 6 is a side view of a main part of the component supply device.

FIG. 7 is a side view of a main part of the component supply device.

FIG. 8 is a plan view of a main part of the component supply device.

FIG. 9 is an enlarged view of a main part of the component supply device.

FIG. 10 is an enlarged view of a main part of a conventional component supply device.

FIG. 11 is an enlarged view of a main part of a conventional component supply device.

FIG. 12 is an enlarged view of a main part of a conventional component supply device.

[Explanation of symbols]

 Reference Signs List 5 chip-shaped electronic component (chip component) 8 component supply device 21 component storage tape 21A component storage recess 32 cover tape 33 release plate 35 suppressor 40 shutter 62 convex portion

──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-5-169326 (JP, A) JP-A-63-249399 (JP, A) JP-A-3-2066693 (JP, A) JP-A-2- 265300 (JP, A) JP-A-5-327279 (JP, A) JP-A-6-20259 (JP, U) JP-A-5-57900 (JP, U) JP-A 59-145038 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 13/02

Claims (1)

(57) [Claims] 1. A component storage tape for enclosing a chip component is fed by a tape sending means while peeling off a cover tape covering an upper surface of the tape, and can be opened / closed at a component take-out position to prevent a component from jumping out during tape feeding. A component supply device for supplying a chip component to the component take-out position, the chip component being charged by static electricity generated when the cover tape is peeled off.
Also contacts the front of the shutter to remove the static electricity
A component supply device comprising a conductor .