JPH11251793A - Electronic part mounter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize high speed mounting by containing a plurality of electronic parts while stacking on the passage at a part holding section and inserting the press rod of a rod moving mechanism into the upper end of the passage to drop the lowermost part from the lower end of the passage thereby shortening the mounting time per part. SOLUTION: A passage 1b for downward guidance is formed vertically through the central section of a magazine 1 in order to contain electronic parts, e.g. chips or integrated circuits, while stacking. A press rod 4c is insertable into the upper end of the passage 1b and a guide roller 4f is lowered along with the press rod 4c by turning the motor 4d1 in a ball screw mechanism 4d inorder to press an uppermost part P downward. The part P is discharged from the lower end of the passage 1b while resisting against the holding force of a protrusion 1e and falls down gravitationally onto a circuit board 7 placed on a table 6. Since an adhesive material is applied previously to the electrode, or the like, on the circuit board 7, the electronic part is mounted surely on the board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting various electronic components on an object such as a circuit board.

[0002]

2. Description of the Related Art Conventionally, this type of electronic component mounting apparatus includes a plurality of component feeders for supplying electronic components by type, and selectively takes out electronic components from the component feeder and mounts them on a circuit board. And a parts transporter.

[0003] As the component supply machine, there are used a device that arranges electronic components stored in bulk and supplies them to a take-out position, and a device that supplies taping components to a take-out position while peeling off a cover tape. On the other hand, a component transporter having a suction mechanism at a movable end of a transport mechanism having at least two degrees of freedom, a component having a plurality of vertically movable suction nozzles in a rotary head, and the like are used.

[0004]

In the above-mentioned conventional electronic component mounting apparatus, an electronic component to be mounted on a circuit board is selectively taken out from a plurality of component feeders by a component transporter and mounted on the circuit board. By repeating the steps to
The necessary electronic components are mounted on the circuit board.

[0005] In other words, considering the position at which component mounting is completed as a starting point, the process of picking up electronic components from the mounting completed position to the component feeder and moving the extracted electronic components to a position above the new mounting position on the circuit board. The sum of the time required for the moving process and the time required for mounting the electronic component on the circuit board from above the mounting position is required each time one electronic component is mounted on the circuit board.

In such a conventional apparatus, the only way to shorten the mounting time per component is to reduce the time required for each of the above steps as much as possible. As a result, the mounting time is naturally limited. Therefore, it is not possible to satisfy the recent demand for high-speed mounting satisfactorily.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic component mounting apparatus capable of shortening the mounting time per component and responding to a demand for high-speed mounting. is there.

[0008]

According to a first aspect of the present invention, there is provided an electronic component mounting apparatus, comprising: a passage for accommodating a plurality of electronic components; It is characterized in that it comprises a component holding portion for restricting the storage component from dropping, a pressing rod inserted into the upper end of the passage, and a rod moving mechanism. According to this device,
By simply inserting the pressing rod into the upper end of the passage by the rod moving mechanism, the lowest storage component in the passage can be discharged from the lower end of the passage against the holding force of the component holding portion and mounted on the object.

According to a fourth aspect of the present invention, there is provided an electronic component mounting apparatus according to a fourth aspect of the present invention, wherein a passage for accommodating a plurality of electronic components and a fall control unit for controlling a lowermost storage component to fall from the lower end of the passage. And a drop enforcement mechanism for applying power for dropping parts to the drop control unit. According to this device, the lowest electronic component in the passage can be discharged from the lower end of the passage and mounted on the target object only by applying the power for dropping the component to the drop control unit by the drop executing mechanism.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] FIGS. 1 to 7 relate to a first embodiment of the present invention, wherein 1 is a magazine, 2 is a base, 3 is a rack, 4 is a head, 5 is a magazine mounting arm, 6 is a table, and 7 is a circuit board.

As shown in FIG. 1 and FIG. 2, the magazine 1 has vertically continuous rectangular column portions having different cross-sectional shapes via a step 1a. It is formed from a transparent or translucent material so that it can be viewed. In the center of the magazine 1, a passage 1b for accommodating the electronic component P and guiding it downward is formed penetrating vertically. The cross-sectional shape of the passage 1b is similar to the bottom shape of the electronic component P and slightly larger than that of the electronic component P. In the passage 1b, the electronic components P having a prismatic shape are stored in a state of being stacked horizontally and vertically. (See FIG. 6).
Incidentally, the electronic component P here is, for example, a chip component such as a resistor, a capacitor or an inductor, a composite component such as an LC or a network, or an integrated circuit component such as a semiconductor element. Further, a recess 1c with which a ball 4b3 described later is engaged is formed on two opposing side surfaces of the lower prism portion of the magazine 1. Further, a slit 1d is formed at the lower end of the lower prismatic portion at two opposite sides, which is different from the above, to secure a component holding force by elasticity at the lower end, and a slit 1d at the inner surface of the lower end is formed. The holding projections 1e that press and hold both sides in the width direction of the storage component P are
(See FIG. 6). That is, the lowermost storage component P in the passage 1b is prevented from dropping by the elastic holding force of the holding protrusion 1e.

The base 2 is, as shown in FIGS. 1 and 6,
A flat portion on which the rack 3 is installed and a U-shaped support portion 2 a for supporting the head 4 are provided. The base 2 moves in a state in which a plurality of tables 6 move at intervals.
It is arranged along the substrate transport line in the direction.

As shown in FIG. 1, the rack 3 has a base plate 3a.
A plurality of columns 3b erected on the upper surface of the base plate 3a;
A holder plate 3c provided on the column 3b, a linear rail 3d provided in parallel with the lower surface of the base plate 3b, and a rail guide 3e for supporting the rail 3d so as to be able to linearly move in the Y direction;
A linear movement mechanism (not shown) connected to the base plate 3a, such as a cylinder or a ball screw mechanism, is provided. Also,
As shown in FIGS. 3A and 3B, the holder plate 3c has a pair of holder pieces 3f for elastically holding the outer surface of the lower prism portion of the magazine 1 in the Y direction according to the number of magazines held. They are provided at equal intervals. A chamfered portion 3 for facilitating insertion of the magazine 1 is provided on the inner surface of the tip of the pair of holder pieces 3f.
g is formed. The rack 3 moves in the Y direction along the rail guide 3e by the operation of the linear moving mechanism.

Incidentally, each of the plurality of magazines 1 held in the rack 3 basically stores different kinds of electronic components P, but the same electronic components are stored in one circuit board 7 by two. In a case where a plurality of magazines 1 are mounted, a plurality of magazines 1 containing electronic components P of the same type may be held in the rack 3.

The head 4 is, as shown in FIGS. 1 and 6,
A main body 4a having a substantially prismatic shape, a magazine mounting portion 4b provided at a lower portion of four sides of the main body 4a, and a magazine mounting portion 4b
, A ball screw mechanism 4 d for lifting and lowering the pressing rod, and a motor 4 for rotating the head.
e and a guide rod 4f. The main body 4a
The shaft portion 4a1 provided at the center of the lower surface is supported by the lower portion of the support portion 2a via a bearing 4a2, and the center of the upper surface is connected to the shaft 4e1 of the motor 4e to enable rotation in the θ direction.

FIGS. 4A and 4B show the magazine mounting portion 4b.
As shown in FIG. 2, the magazine 1 has a concave portion 4b1 which matches the outer shape of the upper prism portion and the lower prism portion, and is vertically continuous through a step 4b2. In the illustrated example, the concave portion 4b1
The upper portion has a vertical dimension larger than the upper prism portion of the magazine 1 and the lower portion of the concave portion 4b1 has a smaller vertical size than the lower prism portion of the magazine 1; The magazine 1 mounted in an appropriate orientation protrudes downward from the magazine mounting portion 4b. A spring-biased ball 4b3 that engages with the recess 1c of the magazine 1 is provided on two opposing side surfaces of the lower portion of the recess 4b1, and the magazine 1 mounted in the recess 4b1 is applied to the ball 4b3. The mounted state is maintained by the applied spring biasing force.

The pressing rod 4c has a cross-sectional shape that can be inserted into the upper end of the passage 1b of the magazine 1, and the upper end is connected to the guide rod 4f via a bearing 4f1.
The guide rod 4f is connected to the main body 4 via a bearing 4f2.
It is inserted through the upper end flange (a) (not shown) of (a), and enables movement in the Z direction together with the pressing rod 4c. Incidentally, the center of the pressing rod 4c coincides with the center of the passage 1b of the magazine 1 mounted on the recess 4b1 when viewed from above.

The ball screw mechanism 4d is for moving the pressing rod 4c up and down, and supports a motor 4d1 disposed in the main body 4, a ball screw 4d2 having one end connected to the motor 4d1, and the other end of the ball screw 4d2. Bearing 4d3 and a nut 4d4 screwed into a ball screw 4d2
Arm 4d5 connecting nut 4d4 and guide rod 4f through vertically long guide hole 4a3 of main body 4a.
Consisting of That is, when the ball screw 4d2 is rotated forward and reverse by the motor 4d1, the guide rod 4f moves in the Z direction together with the pressing rod 4c.

As shown in FIG. 1, the magazine mounting arm 5 is arranged on the rear side of the rack 3, and is capable of moving in the X direction by a linear moving mechanism (not shown), for example, a cylinder or a ball screw mechanism. The magazine mounting arm 5 mounts the magazine 1 from the rack 3 on the magazine mounting section 4b of the head 4 facing the rack 3 and takes out the magazine 1 from the magazine mounting section 4b to remove the magazine 3 from the rack 3.
Play the role of returning to. At the tip of the magazine mounting arm 5, two suction pads 5a for sucking the side surface of the lower prism portion of the magazine 1 are provided, and the suction pads 5a are connected to the air passages 5b (see FIG. 5) in the arm. Connected to an air circuit (not shown).

The table 6 is composed of a well-known XY table and, as shown in FIG. 1, can move in the X and Y directions at a component mounting position while supporting the circuit board 7. A large number of suction holes for sucking the circuit board 7 are provided on the upper surface of the table 6, and the suction holes are connected to an air circuit (not shown). Table 6 is Y
Transported along the substrate transport line in the direction.

The operation of the above-described electronic component mounting apparatus will be described below. In a state where the magazine 1 is not mounted on the head 4, first, the head 4 is rotated by the motor 4 e so that one magazine mounting portion 4 b faces the rack 3, and the magazine 1 to be mounted first is mounted on the magazine. The rack 3 is moved in the Y direction so as to face the arm 5. Then, the magazine mounting arm 5 is advanced toward the head 5 while applying a negative pressure to the suction pad 5a,
As shown in FIG. 5 (A), the magazine 1 to be mounted first is sucked and then removed from the rack 3. After the extraction, the magazine mounting arm 5 is further advanced toward the head 4 as shown in FIG. 5B, and the sucked magazine 1 is pushed into the concave portion 4b1 of the magazine mounting portion 4b. In this magazine mounting, the spring-biased ball 4b3 is
The process is completed when it is engaged with the recess 1c. After the mounting is completed, the negative pressure of the suction pad 5a is released, and the magazine mounting arm 5 is retracted and returned.

After the first magazine 1 is mounted, the head 4 is rotated by 90 degrees by the motor 4e so that the other magazine mounting portion 4b faces the rack 3 and the magazine to be mounted second is the same as described above. The rack 3 is moved in the Y direction so that 1 faces the magazine mounting arm 5, and the magazine mounting arm 5 is advanced toward the head 4 while applying a negative pressure to the suction pad 5a. 1 is pulled out of the rack 3 and pushed into the magazine mounting portion 4b of the head 4. After the mounting is completed, the negative pressure of the suction pad 5a is released, and the magazine mounting arm 5 is retracted and returned. In the same way, the third and fourth magazines 1
Is also mounted on the magazine mounting portion 4b of the head 4.

When the four magazines 1 are mounted on the head 4, basically four types of electronic components P can be selectively mounted on the circuit board 7.

When one of the four types of electronic components P is mounted on the circuit board 7, the table 6 must first be moved to the component mounting location, and the head 4 must be rotated and mounted as shown in FIG. The magazine 1 is opposed to the circuit board 7 and the table 6 is moved in the X and Y directions to adjust the component mounting position. As can be seen from FIG.
The gap G between the lower end of the magazine 1 mounted on the electronic component P and the circuit board 7 supported by the table 6 is slightly larger than the height (thickness) of the electronic component P to be mounted.

Then, as shown in FIG. 7, the motor 4d1 of the ball screw mechanism 4d is rotated by a predetermined angle, and the guide rod 4f is moved together with the pressing rod 4c by a predetermined stroke (=
The distance between the lower end of the pressing rod 4c and the uppermost storage component P +
The electronic component P is lowered in the height (thickness dimension) Z direction, and the lower end of the pressing rod 4c is inserted into the upper end of the passage 1b of the magazine 1 to press the uppermost storage component P downward, and the entire storage component is pressed. Then, the lowermost storage component P is discharged from the lower end of the passage 1b against the elastic holding force of the holding protrusion 1e, and the electronic component P discharged by its own weight is mounted on the circuit board 7. The electrodes such as the lands of the circuit board 7 are coated in advance with a viscous bonding material such as cream solder, so that the electronic components P discharged from the lower end of the passage 1b can be removed without pressing the electronic components P against the circuit board 7. It can be accurately mounted on the circuit board 7.

When mounting another electronic component P of the four types of electronic components P on the circuit board 7, similarly to the above, the head 4 is rotated so that the magazine 1 to be mounted faces the circuit board 7. In addition, the table 6 may be moved in the X and Y directions to adjust the component mounting position, and then the pressing rod 4c may be lowered in the predetermined stroke Z direction by the ball screw mechanism 4d.

By the way, when the next component is mounted after the lower end of the pressing rod 4c is inserted into the upper end of the passage 1b of the magazine 1 (see FIG. 7), the second and subsequent electronic components are mounted in each of the magazines 1. The lowering stroke of the pressing rod 4c at this time may be the height (thickness) dimension of the electronic component P.

When the electronic component P stored in a magazine 1 different from the magazine 1 mounted on the head 4 is mounted on the circuit board 7, the motor 4 of the ball screw mechanism 4d is used.
By rotating d1 to return the pressing rod 4c to the initial position, the head 4 is rotated by the motor 4e so that the magazine 1 to be replaced faces the rack 3, and the holding position of the rack 3 of the magazine 1 is The rack 3 is moved in the Y direction so as to face directly. Then, the magazine mounting arm 5 is moved to the head 4 while applying a negative pressure to the suction pad 5a.
To suck the magazine 1 to be replaced, as shown in FIG. 5 (B). Fig. 5 (A) after adsorption
The magazine mounting arm 5 is retracted toward the rack 3 as shown in (1), the sucked magazine 1 is pushed into the rack 4, the negative pressure of the suction pad 5a is released, and the magazine mounting arm 5 is retracted and returned. Let it. Then, the rack 3 is moved in the Y direction so that the magazine 1 to be newly mounted faces the magazine mounting arm 5, and the magazine mounting arm 5 is moved to the head 5 while applying a negative pressure to the suction pad 5a.
The magazine 1 is pulled out of the rack 3 and pushed into the magazine mounting portion 4b of the head 4 in the same manner as described above.

After the necessary electronic components P are mounted on the circuit board 7 as described above, the table 6 supporting the circuit board 7 is transferred along the board transfer line, and another table 6 is transferred. Move to the component mounting location and perform the same mounting as above.

As described above, according to the electronic component mounting apparatus of the first embodiment, only the pressing rod 4c is inserted into the upper end of the passage 1b of the magazine 1 by the ball screw mechanism 4d. Can be discharged from the lower end of the passage 1b and mounted on the circuit board 9, so that the component mounting time per component can be greatly shortened, and the demand for high-speed mounting can be accurately met.

Also, since four magazines 1 containing a plurality of electronic components P are mounted on the head 4, the electronic components P stored in each magazine 1 are selectively repeated until the stored components P are exhausted. It can be mounted on the circuit board 7.

In the first embodiment, the magazine 1
The electronic component P discharged from the lower end of the passage 1b of the magazine 1 is mounted on the circuit board 7 by utilizing the dropping action, but the electronic component P discharged from the lower end of the passage 1b of the magazine 1 is pressed against the circuit board 7. It can also be installed. Specifically, as shown in FIG. 8A, a gap G1 between the lower end of the magazine 1 mounted on the head 4 and the circuit board 7 supported on the table 6 is mounted on the electronic component P to be mounted. Is set smaller than the height (thickness) dimension of. And FIG.
As shown in FIG. 8B from the state of FIG. 8A, the lowermost electronic component P is pushed out from the lower end of the passage 1b by lowering the pressing rod 4c, and at the same time, the height (thickness) of the electronic component P The magazine 1 is raised by a distance obtained by reducing the gap G1. Thereby, the electronic component P discharged from the lower end of the passage 1b of the magazine 1 is pressed against the circuit board 7 and mounted. After the parts are mounted, the magazine 1 and the pressing rod 4c are moved from the state of FIG. 8B to the electronic parts P as shown in FIG. 8C.
Is increased by a distance larger than the height (thickness) dimension of the object. In order to realize such a component mounting method, a moving mechanism for moving the magazine 1 or the head 1 up and down, for example, a cylinder or a ball screw mechanism as described above is required. Component mounting can be performed more reliably than when component mounting is performed.

[Second Embodiment] FIGS. 9 to 13 relate to a second embodiment of the present invention. This embodiment differs from the first embodiment in the magazine configuration and the head configuration. The other configuration is the same as that of the first embodiment.

As shown in FIGS. 9 and 10 (A), the magazine 11 has prism portions having different cross-sectional shapes in a vertically continuous manner via the step 1a. Is formed of a transparent or translucent material so that it can be viewed from the outside. In the center of the magazine 11, a passage 1 for storing the electronic component P and guiding it downward.
1b is formed up and down, and at the lower end, a discharge port 11c for discharging the electronic component P downward is formed so as to be shifted in the length direction of the storage component P. Passage 11b and outlet 11c
Has a slightly larger cross-sectional shape similar to the shape of the bottom surface of the electronic component P, and the electronic components P having a prismatic shape are stored in the passage 11b in a laterally stacked state. Further, the lower part of the magazine 11 is provided with the passage 11b.
A guide hole 11d passing through a boundary between the guide hole 11d and the discharge port 11c is formed to be orthogonal to the passage 11b.
e is movably inserted and arranged. This drop control plate 1
The thickness of 1e is equal to the height (thickness) dimension of the storage component P, and a portion facing the passage 11b and the outlet 11c has an intake hole 11e1 having the same cross-sectional shape as the passage 11b and the outlet 11c. Are formed. In addition, the drop control plate 11e has a step 11e for regulating its own movement.
9 and 11e3. As shown in FIG. 9A, in the standby state, the step portion 11e2 on the left side in the figure comes into contact with the side surface of the magazine by the urging force of the coil spring 11f, and the intake hole 1 is formed.
1e1 is aligned with the outlet 11c. Further, a recess 11g with which a ball of a magazine mounting portion 12b described later is engaged is formed on two opposing side surfaces of the lower prism portion of the magazine 11.

In the above-described magazine configuration, as shown in FIG. 9B, the drop control plate 11e is moved to the left in the drawing against the urging force of the spring, and the step 11e3 on the right in the drawing is placed on the side of the magazine. The contact hole 11e1 is brought into contact with the passage 11
The lowermost storage component P can be taken into the intake hole 11e1 in alignment with b. Further, the pressing is released from the state shown in FIG. 9B, and as shown in FIG.
The electronic component P in the intake hole 11e1 can be discharged downward through the discharge port 11c by returning 1e to the right in the drawing by the spring urging force.

On the other hand, as shown in FIG. 11, the head 12 is provided corresponding to a main body 12a having a substantially prismatic shape, a magazine mounting portion 12b provided on four side surfaces of the main body 12a, and a magazine mounting portion 12b. A push mechanism 12c for driving the drop control plate and a motor 12d for rotating the head are provided. The main body 12a has an upper surface centered at a shaft 12d of a motor 12d.
1 to enable rotation in the θ direction.

As in the first embodiment, the magazine mounting portion 12b has a concave portion 12b1 corresponding to the outer shape of the upper prism portion and the lower prism portion of the magazine 11 continuously vertically through a step 12b2. ing. In the illustrated example, the upper portion of the concave portion 12b1 has a larger vertical dimension than the upper prism portion of the magazine 1, and the lower portion of the concave portion 4121 has a smaller vertical size than the lower prism portion of the magazine 1. The magazine 11 mounted vertically (in a direction parallel to the Z direction) has a lower portion projecting downward from the magazine mounting portion 12b. The lower part 2 of the recess 12b1
On the side surface, a spring-biased ball (not shown) that engages with the recess 11g of the magazine 11 is provided.
The magazine 11 mounted on 1 is maintained in the mounted state by the spring biasing force applied to the ball.

The pressing mechanism 12c is for applying power to the drop control plate 11e of the magazine 11 mounted on the head 12, and is configured to guide a cylinder 12c1 connected to an air circuit (not shown) and a lower surface of the head body 12a. It comprises a pressing rod 12c2 inserted into the hole 12a1, and a connecting plate 12c4 connecting the rod 12c3 of the cylinder 12c1 and the pressing rod 12c2. The pressing mechanism 12c is arranged such that the pressing rod 12c2 is parallel to the moving direction of the drop control plate 11e of the mounting magazine 11 and the tip thereof faces the end face of the drop control plate 11e.
When the pressing rod 12c2 is moved in the magazine direction by c1, the magazine 11 is moved by the pressing rod 12c2.
Can be pressed and driven.

The magazine 11 is held on the rack 3 as in the first embodiment, and is mounted on the magazine mounting portion 12b of the head 12 by the magazine mounting arm 5. The replacement of the mounting magazine 11 is performed in the same manner. When four magazines 11 are mounted on the head 12, the first
As in the embodiment, basically, four types of electronic components P can be selectively mounted on the circuit board 7.

When one of the four types of electronic components P is mounted on the circuit board 7, the table 6 must first be moved to the component mounting location, and the head 12 must be rotated and mounted as shown in FIG. The magazine 11 faces the circuit board 7 and the table 6 is moved in the X and Y directions to adjust the component mounting position. As can be seen from FIG.
The gap between the lower end of the magazine 11 mounted on the head 12 and the circuit board 7 supported by the table 6 is slightly larger than the height (thickness) dimension of the electronic component P to be mounted.

Then, as shown in FIG.
The rod 12c3 of the cylinder 12c1 of 2c is moved by a predetermined distance to move the pressing rod 12c2 to the left in the figure,
The drop control plate 1 of the magazine 11 is
1e is moved to the left in the figure, and the lowermost storage component P is taken into the intake hole 11e1 aligned with the passage 11b. Then, as shown in FIG. 13, the rod 1 of the cylinder 12c1
2c3 is returned, the pressing rod 12c2 is moved rightward in the drawing, the drop control plate 11e of the magazine 11 is returned rightward in the drawing by the biasing force of the spring, and the electronic component P in the intake hole 11e1 is discharged. It is discharged downward through 11c and mounted on the circuit board 7. The electrodes such as the lands of the circuit board 7 are coated in advance with a viscous bonding material such as cream solder, so that the electronic component P does not have to be pressed against the circuit board 7 without being pressed.
The electronic component P discharged by its own weight from the discharge port 11c can be accurately mounted on the circuit board 7.

The other electronic components P among the four types of electronic components P are mounted on the circuit board 7.
Is rotated so that the magazine 11 to be mounted faces the circuit board 7 and the table 6 is moved in the X and Y directions to position the component mounting position.
The pressing rod 12c2 may be reciprocated by c.

As described above, according to the electronic component mounting apparatus of the second embodiment, the lowermost storage in the passage 11b can be achieved only by reciprocating the drop control plate 11e of the magazine 11 by the dropping pressing mechanism 12c. Part P is discharged to outlet 11c
And the components can be mounted on the circuit board 9, so that the component mounting time per component can be greatly reduced, and the demand for high-speed mounting can be accurately met.

Also, since four magazines 11 containing a plurality of electronic components P are mounted on the head 12, the electronic components P stored in each magazine 11 are selectively repeated until the stored components P are exhausted. It can be mounted on the circuit board 7.

[0045]

As described above in detail, according to the first aspect of the present invention, the lowermost storage component in the passage is held by the component holding portion only by inserting the pressing rod into the upper end of the passage by the rod moving mechanism. Since it can be discharged from the lower end of the passage against the force and can be mounted on the object, the time for mounting each component can be greatly reduced, and the demand for high-speed mounting can be accurately met.

According to the fourth aspect of the present invention, the lowermost electronic component in the passage is discharged from the lower end of the passage by simply applying power for dropping the component to the fall control unit by the drop enforcement mechanism. Since it can be mounted on a product, the time for mounting each component can be greatly reduced, and the demand for high-speed mounting can be accurately met.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a magazine and electronic components according to the first embodiment.

FIG. 3 is a partial front view and a top view of a rack according to the first embodiment.

FIG. 4 is a front view and a top view of a magazine mounting unit according to the first embodiment.

FIG. 5 is an explanatory diagram of an operation of attaching and detaching a magazine to and from a rack and a magazine mounting portion according to the first embodiment;

FIG. 6 is a partial cross-sectional view of the head according to the first embodiment.

FIG. 7 is an explanatory diagram of a component mounting operation according to the first embodiment.

FIG. 8 is an explanatory diagram of a component mounting operation showing a modification of the first embodiment.

FIG. 9 is a perspective view of a magazine and electronic components according to a second embodiment of the present invention.

FIG. 10 is an explanatory diagram of a component discharging operation of the magazine according to the second embodiment.

FIG. 11 is a partial cross-sectional view of a head according to a second embodiment.

FIG. 12 is an explanatory diagram of a component mounting operation according to the second embodiment.

FIG. 13 is an explanatory diagram of a component mounting operation according to the second embodiment.

[Description of Signs] 1 ... magazine, 1b ... passage, P ... electronic parts, 2 ... base, 3 ... rack, 4 ... head, 4b ... magazine mounting part,
4c: pressing rod, 4d: ball screw mechanism for driving the pressing rod, 5: magazine mounting arm, 6: table, 7 ...
Circuit board, 11 magazine, 11b passage, P electronic component, 11c outlet, 11e drop control plate, 11e1
Intake hole, 12: Head, 12b: Magazine mounting part, 12
c: A pressing mechanism for driving the drop control plate.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masaru Aoki 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Electric Power Co., Inc. (72) Taro Yasuda Inventor 6-16-20 Ueno, Taito-ku, Tokyo Taiyo (72) Inventor Koji Saito Inside Taiyo Denki Co., Ltd. 6-16-20 Ueno, Taito-ku, Tokyo

Claims (6)

[Claims] A passage for accommodating a plurality of electronic components; a component holder for restricting a lowermost storage component from falling from a lower end of the passage; a pressing rod and a rod moving mechanism inserted into an upper end of the passage; By inserting the pressing rod into the upper end of the passage by the rod moving mechanism, the lowermost storage component in the passage is discharged from the lower end of the passage against the holding force of the component holding portion and mounted on the object. Electronic component mounting equipment. 2. The electronic component mounting apparatus according to claim 1, wherein the passage and the component holding unit are integrated as a magazine. 3. A head having a magazine mounting portion to which a plurality of magazines are removably mounted, wherein the pressing rod and its moving mechanism are provided corresponding to the number of magazine mounting portions on the head. The electronic component mounting apparatus according to claim 2, wherein: 4. A passage for accommodating a plurality of electronic components, a drop control unit for controlling a lowermost storage component to fall from a lower end of the passage, and a drop enforcement mechanism for applying power for component fall to the fall control unit. By applying power for dropping parts to the drop control unit by the drop execution mechanism, the lowest electronic component in the passage is discharged from the lower end of the passage and mounted on the object. Electronic component mounting equipment. 5. The electronic component mounting device according to claim 4, wherein the passage and the drop control unit are integrated as a magazine. 6. A head having a magazine mounting portion to which a plurality of magazines are detachably mounted, wherein said head is provided with said drop executing mechanism corresponding to the number of magazine mounting portions. The electronic component mounting device according to claim 5.