JP3102297B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting apparatus for automatically mounting an electronic component at a predetermined coordinate position on a substrate.
It relates to a component mounting method .

[0002]

2. Description of the Related Art Electronic component mounting apparatuses include a tape feeder,
Electronic components (hereinafter, referred to as “chips”) provided in a part feeder such as a tube feeder and a tray feeder are vacuum-adsorbed and picked up by a nozzle of a transfer head, and then the transfer head is mounted on a substrate positioned at a positioning portion. The electronic component is mounted on a substrate by moving the nozzle upward and downward at a predetermined coordinate position, and causing the nozzle to perform an up / down operation.

[0003] The substrate positioned at the positioning portion is likely to bend downward due to its own elasticity. If the substrate is bent, the stroke of the vertical movement of the nozzle of the transfer head will be out of order, and the chip cannot be mounted correctly on the substrate.Therefore, a support section that supports the substrate of the positioning section from below and corrects the deflection is provided. Can be For example, as shown in JP-A-5-110297, the support portion has a large number of pins, and the pins support the substrate from below so that the substrate is not bent.

[0004] The board size varies in size and, conventionally, when the board size changes with the change of the board type,
In response to this, the worker manually inserted and removed the pins to replenish and reduce the pins.

[0005] The substrate includes a double-sided mounting substrate (a substrate on which chips are mounted on both upper and lower surfaces). In the case of such a double-sided mounting board, first, after mounting the chip on one side,
The chip is mounted on the other surface by turning the substrate upside down. In this case, since one surface on which the chip is mounted first becomes the lower surface, the pins must be prevented from hitting the chip mounted on the lower surface. Therefore, conventionally, an operator manually inserts and removes pins and rearranges the pins,
The position where the chip does not exist is supported from below by the pin.

[0006]

However, the above-mentioned conventional method requires a great deal of time and labor since an operator has to manually insert and remove a large number of pins every time the board type is changed. There was a point. Especially in recent years,
There are many types and small numbers of boards, and the type of boards is often changed.Therefore, it is necessary to insert and remove the pins each time as described above. It was strongly desired.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component mounting apparatus and an electronic component mounting method provided with a substrate supporting portion capable of automatically and quickly rearranging pins in response to a change in the type of substrate. I do.

[0008]

SUMMARY OF THE INVENTION To this end, the present invention provides a pin support in which a plurality of pins are disposed so as to be able to move up and down, and a pin is provided below the pin unit so that the pins can be moved downward. A push-up member that pushes up from above, a drive unit that causes the push-up member to perform up-down movement, and a moving device that moves the push-up member in the horizontal direction.

Further, the pin unit has a block, and a pin has a piston which is vertically movably mounted in a pin hole formed in the block, and gas is injected into upper and lower portions of the pin hole. A gas pressure feeding means for causing the pin to move up and down by discharging is provided. Further, a vertical movement means for vertically moving the substrate relative to the pins of the support portion is provided.

[0010]

According to the above arrangement, desired pins can be sequentially pushed up from below while moving the push-up member in the horizontal direction, and a desired position of the substrate can be supported by these pins.

Further, by injecting air pressure into the upper portion of the pin hole by the gas pressure feeding means, all the pins protruding upward can be instantaneously lowered and returned to the initial state.

By moving the substrate up and down relatively to the pins, it is possible to carry the substrate into and out of the positioning portion without difficulty.

[0013]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to one embodiment of the present invention, and FIG. 2 is a front view of the same. Reference numeral 1 denotes a base on which the elements described below are arranged. 2a,
2b is a pair of left and right guide rails. These guide rails 2a, 2b are positioning portions for positioning the substrate 3 by clamping it from the left and right. The substrate 3 is carried between the guide rails 2a and 2b by a conveyor (not shown) (arrow N1). Then, a chip is mounted (mounted) on the upper surface thereof while being positioned between the guide rails 2a and 2b. When the mounting is completed, the substrate 3 is carried out to the next step by a conveyor (not shown) (arrow N2).

A large number of parts feeders 4 are juxtaposed beside one guide rail 2b. Each part feeder is provided with chips 5 of various types.
That is, these parts feeders 4 are supply units for electronic components. A transfer head 6 has a nozzle 7. The transfer head 6 is held by the moving table 10 and horizontally moves in the X and Y directions. The nozzle 7 is
Driven by driving means incorporated in the transfer head 6, it performs up and down operations. The transfer head 6 moves above the parts feeder 4, where the nozzle 7 moves up and down, and vacuum picks up the chip 5 provided in the parts feeder 4 at the lower end of the nozzle 7 to pick it up. Next, the transfer head 6 moves above the substrate 3, where the nozzle 7 moves up and down again to mount the chip 5 vacuum-adsorbed on the nozzle 7 at a predetermined coordinate position on the substrate 3. The vertical movement stroke of the nozzle 7 is computer-programmed in advance based on chip data and the like.

The guide rails 2a and 2b are supported on a support post 8. A column 8 that supports one guide rail 2b is erected on a linear table 9. Linear table 9
When the motor 9a is driven, the guide rail 2b approaches and separates from the other guide rail 2a, and adjusts the interval between the guide rails 2a and 2b according to the width of the substrate 3.

Below the substrate 3, a support portion 11 for the substrate 3 is provided. The support unit 11 includes a pin unit 12
And a push-up unit 13 provided thereunder. Hereinafter, the support portion 11 will be described. FIG. 3 is a perspective view of the push-up unit according to one embodiment of the present invention, FIG.
5 and 6 are partial sectional views of the pin unit, and FIG.
(B) is an AA sectional view and a BB sectional view of FIG. 4.

In FIGS. 1, 2 and 4, the pin unit 12 is mainly composed of a flat block 14. The block 14 has a large number of pin holes 15 formed in a matrix, and pins 16 are vertically inserted into the respective pin holes 15 as shown in FIG. A cylindrical piston 17 is integrally formed at the center of the pin 16, and the piston 17 is mounted in the pin hole 15 so as to be vertically movable.

A hole 18 communicating with the upper part of the pin hole 15 and a hole 19 communicating with the lower part are formed inside the block 14 (see also FIG. 7). In FIG.
The hole 19 is connected to an air source 22 as a gas pressure feeding means through passages 20 and 21. Passages 20, 2
In the middle of 1, a passage switching valve 23 is provided. This valve 23 is an electromagnetic valve.

Next, the push-up unit 13 will be described. In FIGS. 2 and 3, reference numeral 30 denotes a rectangular frame, in which an X-direction feed screw 31 and a Y-direction feed screw 32 are provided. Nuts 33 and 34 are screwed into the feed screws 31 and 32, respectively. Nuts 33, 3
Guide rods 36 and 37 are connected to 4. The guide rods 36 and 37 intersect in a cross shape, and a block 38 is slidably held along the guide rods 36 and 37 at the intersection.

The block 38 is provided with a cylinder 39. Reference numeral 40 denotes a rod of the cylinder 39, which is a push-up member that pushes up the pin 16 from below.
Reference numerals 41 and 42 denote motors for rotating the feed screws 31 and 32. The motors 41 and 42 are driven and the feed screws 31 and 32
When the nut rotates, the nuts 33 and 34 become the feed screws 31 and 32, respectively.
, The guide rods 36 and 37 connected to the nuts 33 and 34 also move in the same direction, whereby the block 38 moves in the X and Y directions, and the rod 40 is moved directly below the desired pin 16. Position. Then, the cylinder 39 operates and the rod 40 rises, pushing up the pin 16. That is, the elements denoted by reference numerals 30 to 38, 41, and 42 are:
This is a moving device that horizontally moves a cylinder 39 that is a driving unit that moves the rod 40 up and down.

1 and 2, a cylinder 43 is provided on a side surface of the push-up unit 13. The rod 44 of the cylinder 43 is connected to the side surface of the pin unit 12. Guide shafts 45 are provided upright at four corners of the push-up unit 13, and the pin unit 12 is mounted on the guide shaft 45 so as to be vertically movable. Therefore, when the rod 44 rises, the pin unit 12 rises along the guide shaft 45, and when the rod 44 retracts, the pin unit 12 descends along the guide shaft 45. That is, the cylinder 43 serves as a vertical movement means for vertically moving the pin unit 12 with respect to the substrate 3.

This electronic component mounting apparatus is configured as described above. Next, the overall operation will be described. In FIG. 2, the block 3 is driven by driving the motors 41 and 42.
8 is moved in the X direction or the Y direction, and the rod 40 of the cylinder 39 is positioned immediately below the desired pin 16. FIG. 4 shows the state at this time, and all the pins 16 of the pin unit 12 are at the bottom dead center.

Next, in FIG. 4, the cylinder 39 is operated, the rod 40 is raised, and the pin 16 is pushed up to the position indicated by the dashed line. At this dashed line position, the lower surface a of the piston 17 of the pin 16 ascends above the lower hole 19 as shown in FIG.
The hole 19 communicates with the lower portion 12 of the pin hole 15. At this time, high-pressure air is being sent from the air source 22 to the hole 19 through the passage 21, so that the high-pressure air is
5 is pressed into the lower part of the pin 5, and the pressure causes the pin 16 to rise at a stroke to the top dead center. FIG. 5 shows this state. That is, this means moves the rod 40 of the cylinder 39 directly below the desired pin 16, and raises the rod 40 there, and slightly raises the lower surface a of the piston 17 of the pin 16 above the hole 19. Thus, high-pressure air is press-fitted into the lower portion of the pin hole 15 to raise the pin 16 to the top dead center. Hereinafter, the desired pins 16 are sequentially raised to the top dead center by the same method.

FIG. 2 shows a state in which a plurality of desired pins 16 have been raised to the top dead center as described above.
In this state, an air pressure is applied to the lower part of each pin hole 15 by the air source 23 in order to hold all the pins 16 at the top dead center. Next, when the rod 44 of the cylinder 43 is protruded, the pin unit 12 rises from the solid line position to the dashed line position, and the substrate 3 is supported from below by the pins 16 (see the pins 16 indicated by dashed lines in FIG. 2). In this state, the transfer head 6 reciprocates repeatedly between the parts feeder 4 and the substrate 3 to transfer and mount desired chips 5 provided on the parts feeder 4 to predetermined coordinate positions of the substrate 3 one after another.

When all the chips 5 are mounted on the substrate 3, the rod 44 of the cylinder 43 is retracted, the pin unit 12 is lowered to the position shown by the solid line in FIG. Release the support state of. Therefore, the substrate 3 is carried out to the next step, and the next substrate 3
Is carried between the guide rails 2a and 2b, and the above operation is repeated.

When changing the pins 16 projecting upward to change the type of board, first, all the pins 16
Is lowered to the bottom dead center to be in the initial state. FIG. 6 shows the state at this time. In this case, first, valve 2
3 is switched to the passage 20 side, and air is press-fitted into the upper part of the pin hole 15 from the hole 18. Then, due to the air pressure, all the pins 16 descend to the bottom dead center. Therefore, according to this means, all the pins 16 can be simultaneously and instantaneously lowered to the bottom dead center to return to the initial state.

The upward projecting operation of the pins 16 is performed every time the type of the board is changed. Which one of the many pins 16 is raised is determined based on the board data. . When the substrate is a double-sided mounting substrate and a chip is already mounted on the lower surface side, the pins 16 that do not contact the chip are raised. Again, which pin 1
Whether to raise 6 is determined based on the substrate data.
The various controls described above are automatically performed by a computer.

The present invention is not limited to the above embodiment. For example, in the above embodiment, the pin unit 12 is moved up and down with respect to the substrate 3 by the cylinder 43, but the guide rails 2a and 2 2b may be moved up and down with respect to the pin unit 12. Also, the present invention can be applied to other types of electronic component mounting apparatuses such as a rotary head type electronic component mounting apparatus that transfers and mounts a chip while a transfer head is held by a rotary head and moves circularly between a parts feeder and a substrate. .

[0029]

As described above, according to the present invention, a desired pin can be automatically raised according to a change in the type of board, and the board can be supported from below. The accompanying changeover can be performed quickly.

Further, by injecting air pressure into the upper portion of the pin hole by the gas pressure feeding means, the pins protruding upward can be instantaneously lowered and returned to the initial state, so that the setup change can be made quickly. I can do it. In addition, by moving the substrate up and down relatively to the pins, it is possible to easily carry the substrate into and out of the positioning portion.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a front view of the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 3 is a perspective view of a push-up unit of the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 4 is a partial sectional view of a pin unit of the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 5 is a partial sectional view of a pin unit of the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 6 is a partial sectional view of a pin unit of the electronic component mounting apparatus according to one embodiment of the present invention.

7A is a partial cross-sectional view of a pin unit of an electronic component mounting apparatus according to one embodiment of the present invention. FIG. 7B is a partial cross-sectional view of a pin unit of the electronic component mounting apparatus according to one embodiment of the present invention.

[Explanation of symbols]

 2a, 2b Guide rail (positioning part) 3 Substrate 4 Parts feeder (electronic part supply part) 5 Chip (electronic part) 6 Transfer head 7 Nozzle 10 Moving table 11 Support part 12 Pin unit 13 Push-up unit 14 Block 15 Pin hole 16 Pin 17 Piston 18, 19 Hole 22 Air source (gas pressure feeding means) 23 Valve 31, 32 Feed screw 33, 34 Nut 38 Block 39 Cylinder (drive unit) 40 Rod (thrust member) 41, 42 Motor 43 Cylinder (up and down) Moving means)

Continuation of the front page (56) References JP-A-5-335800 (JP, A) JP-A-1-155699 (JP, A) JP-A-5-110297 (JP, A) JP-A-5-243799 (JP) JP-A-2-170500 (JP, A) JP-A-6-85496 (JP, A) JP-A-4-40600 (JP, U) (58) Fields studied (Int. Cl. ⁷ , DB (Name) H05K 13/04

Claims (5)

(57) [Claims] A substrate positioning unit, an electronic component supply unit, a transfer head for transferring and mounting an electronic component provided on the supply unit to the substrate, a moving table for moving the transfer head, An electronic component mounting apparatus comprising: a support unit that supports the substrate from below, wherein the support unit is provided below a pin unit in which a plurality of pins are arranged to be vertically movable. An electronic component mounting apparatus, comprising: a push-up member for pushing up the pin from below; a drive unit for causing the push-up member to move up and down; and a moving device for moving the push-up member in a horizontal direction. 2. The apparatus according to claim 1, wherein said pin unit includes a block, and said pin has a piston mounted on a pin hole formed in said block so as to be movable up and down. 2. The electronic component mounting apparatus according to claim 1, further comprising a gas pressure feeding means for causing the pins to perform up and down operations by press-fitting and discharging the pins. 3. The electronic component mounting apparatus according to claim 1, further comprising: vertically moving means for vertically moving said substrate relative to said pins of said support portion. 4. A transfer head is provided in a supply section of an electronic component.
Electronic components picked up and provided in the positioning part of the board
Supported from below by the pins of the pin unit
Electronic component mounting method for mounting on a
Mounting the electronic component on the substrate by the transfer head.
Before mounting, a projection provided below the pin unit
Move the lifting member horizontally below the specified pin by the moving device.
And the drive unit moves the push-up member up and down.
To push up the pin from below.
Electronic component mounting method. 5. The pin according to claim 1, wherein said pin is formed in a pin hole formed in said block.
It has a piston mounted to be able to move up and down.
Gas is injected into and discharged from the upper and lower parts by gas
By moving the pin up and down
5. The electronic component mounting method according to claim 4, wherein: