KR20060126204A - Pcb support apparatus for chip mounter - Google Patents

Abstract

A PCB support apparatus for a chip mounter is provided to exchange a backup member simply and rapidly to be matched to a size of a PCB(Printed Circuit Board). In a PCB support apparatus(100) for a chip mounter, a backup member(140) has a top surface to support the PCB(B). A conveyor has a first guide member(111) and a second guide member(112) arranged in parallel to transfer the PCB(B). A first fixing elevation mechanism(130) is fixed to the first guide member(111) and the second guide member(112) to guide the elevation of the backup member(140). And, a first moving elevation mechanism(130) is movably installed on the first guide member(111) and the second guide member(112) in a transfer direction of the PCB(B) to guide the elevation of the backup member(140).

Description

Substrate support device for component mounter {PCB support apparatus for chip mounter}

1 is a side view schematically showing a conventional substrate support apparatus for a component mounter.

2 is an exploded perspective view schematically showing a substrate support apparatus for a component mounter according to a preferred embodiment of the present invention.

3 is a front view of the substrate supporting apparatus of FIG. 2.

4 is a plan view of the substrate supporting apparatus of FIG. 2.

Explanation of symbols on the main parts of the drawings

100: substrate support device 110: conveyor

111: first guide portion 112: second guide portion

115: guide slot 121: drive motor

130: lifting mechanism 130_a: first fixed lifting mechanism

130_b: second fixed elevating mechanism 130_c: first movable elevating mechanism

130_d: second moving lifting mechanism 131: bracket

135: slide part 140: backup member

148: fixing groove B: printed circuit board

The present invention relates to a substrate support apparatus, and more particularly, to a substrate support apparatus for a component mounter having an improved structure for supporting a printed circuit board transferred from the substrate transfer apparatus.

The substrate support apparatus is a device that enables the component mounting operation by the suction nozzle by supporting the printed circuit board transferred along the conveyor belt at a predetermined position. The substrate supporting apparatus is provided on one side of the component mounting machine, for example, so that the component adsorption nozzle which performs the rectangular coordinate movement and the vertical movement by the operation of the robot is mounted on the printed circuit board supported by the apparatus for supporting the printed circuit board. To be able to mount

Conventionally, the substrate supporting apparatus has a back-up table. 1, which is disclosed in Korean Patent Registration No. 330739, a substrate supporting apparatus 10 using a backup table 21 is shown. Referring to Fig. 1, the backup table 21 maximizes its size so that it can be applied regardless of printed circuit boards B of all sizes. The backup table 21 is movable up and down by a drive motor (not shown), a pulley 28, a rotating shaft 22a, a cam portion 25, and a cam follower 29. That is, when the drive motor (not shown) rotates, the belt coupled to the power take-off shaft of the drive motor receives the rotational force. Subsequently, the plurality of rotation shafts 22a that can be synchronized by the pulley 28 are rotated, and the cam portions 25 coupled to both ends of the rotation shaft 22a are rotated simultaneously. When the cam portion 25 is rotated, the cam follower 29 in contact with the outer circumferential surface of the cam portion 25 is forcibly raised upward. That is, the cam follower 29 is pushed toward the cam portion 25 by the elastic bias means 24 having one end fixed to the backup table 21, and then rises upward by the rotation of the cam portion 25. Accordingly, the backup table 21 is moved up by the guide of the guide portion 23 inserted into the through hole of the frame 22.

In addition, when the backup table 21 moves up, the support block portion 30 coupled thereto is simultaneously raised, and the support block portion 30 is printed with the vacuum pressure supplied from the vacuum generator 31. The lower surface of the circuit board B is adsorbed. On the other hand, before the printed circuit board B is adsorbed by the support block part 30, the fixing pin 41 provided on the fixing part 40 provided on one side of the component transfer device 17 has a fixed part cylinder. Ascending by pneumatic pressure is inserted into the reference hole formed in the printed circuit board (B). Thus, the substrate B can be fixed.

By the way, in the board | substrate support apparatus 10, as mentioned above, the size is maximized so that the backup table 21 can be applicable irrespective of each printed circuit board B size. This results in an increase in the total size of the component mounter.

In addition, according to the size of the substrate, a separate support block portion 30 is required.

In addition, a large power is required to raise a large backup table, and accordingly, complex drive mechanisms such as a drive motor, a pulley 28, a rotating shaft 22a, a cam portion 25, and a cam follower 29 are required. Will be needed. This increases the manufacturing cost of the substrate supporting apparatus.

Conventionally, a substrate supporting apparatus having a different structure is also disclosed, but even in this case, the size of the backup table is large enough to be applicable to the size of all printed circuit boards.

The present invention has been made to solve various problems including the above problems, and an object thereof is to provide a substrate supporting apparatus having a structure capable of minimizing its size.

Another object of the present invention is to provide a substrate supporting apparatus having a structure whose size can be adjusted according to the size of a printed circuit board.

It is still another object of the present invention to provide a substrate supporting apparatus having a simple structure in which a lifting mechanism for raising a member supporting a printed circuit board is raised.

In order to achieve the above object, a substrate mounting apparatus for a component mounter according to a preferred embodiment of the present invention comprises: a backup member having an upper surface for supporting a printed circuit board; A conveyor having first and second guide parts spaced apart from each other to transfer the printed circuit board; First and second fixed lifting mechanisms fixed to the first and second guide parts to guide the lifting and lowering of the backup member; The first and second guides are provided to be movable in the conveying direction of the printed circuit board, and have first and second movable elevating mechanisms for cooperating with the fixed elevating mechanisms to guide the elevating of the backup member.

Fixing grooves are formed in each of the corners of the backup member, and each of the first and second movable lifting mechanisms and the first and second fixed lifting mechanisms includes a fixing part inserted into the fixing groove to fix the backup member. can do. In this case, guide slots formed in the moving direction of the substrate are formed on inner surfaces of each of the first and second guide parts, and the first and second movable lifting mechanisms include a slide part accommodated to be slidable in the guide slot. It further comprises a bracket portion, and a drive motor coupled to the bracket portion, wherein the fixing portion is connected to the drive motor is preferably moved in the vertical direction by the drive of the drive motor.

The first and second fixed lifting mechanisms may include: a bracket part having a slide part fixed to the guide slot and accommodated therein; And a driving motor coupled to the bracket part, wherein the fixing part is connected to the driving motor and moved upward and downward by driving of the driving motor.

On the other hand, the drive motor is preferably a voice coil motor.

Hereinafter, with reference to an embodiment shown in the accompanying drawings the present invention will be described in more detail. 2 is an exploded perspective view schematically illustrating a substrate support apparatus for a component mounter according to a preferred embodiment of the present invention, FIG. 3 is a front view of the substrate support apparatus of the present invention, and FIG. 4 is a plan view of the substrate support apparatus of the present invention. to be.

In this case, a component mounter is a device for mounting a small electronic component such as a semiconductor chip on a printed circuit board or the like. It picks up a component supplied through the component feeder by a pick-up tool movable on the X and Y-axis frames, and then mounts it on the printed circuit board transferred by the conveyor. The pick-up tool is provided with an adsorption means such as a component adsorption nozzle which is capable of vertically moving up and down in the header portion, so that the components are adsorbed by vacuum and mounted on the component mounting portion on the printed circuit board.

Here, when the transfer is completed to the position to be mounted by the conveyor, the printed circuit board is raised and fixed to the point to be mounted by the substrate support device. Then, the pick-up tool moves to the point where the component is mounted in the X, Y axis orthogonal motion, and the nozzle is lowered to the printed circuit board side to mount the component.

Referring to FIG. 2, the substrate support apparatus 100 according to an exemplary embodiment of the present invention includes a backup member 140, a conveyor 110, and elevating mechanisms 130. In this case, the elevating mechanism 130 includes a first fixed elevating mechanism 130_a, a second fixed elevating mechanism 130_b, a first movable elevating mechanism 130_c, and a second movable elevating mechanism 130_d.

The backup member 140 has an upper surface capable of supporting the printed circuit board B, and supports the printed circuit board B to be seated at a predetermined position.

The conveyor 110 functions to transfer the printed circuit board B to the substrate supporting apparatus 100. In this case, the conveyor 110 includes first and second guide parts 111 and 112. The first and second guide parts 111 and 112 are disposed to face each other in parallel with a transport direction of the printed circuit board B and an x direction in the drawing so that both side surfaces of the printed circuit board B are placed thereon.

The first fixed elevating mechanism 130_a is installed to be fixed to the first guide portion 111 and functions to support the first edge portion 141 of the backup member 140. The second fixed elevating mechanism 130_b is disposed at the same position as the first fixed elevating mechanism 130_a in the transport direction of the printed circuit board. That is, the second fixed elevating mechanism 130_b is disposed in parallel with the first fixed elevating mechanism 130_a and functions to support the second edge portion 142 of the backup member 140.

The first movable elevating mechanism 130_c is installed to be movable in the first guide portion 111 and functions to support the third edge portion 143 of the backup member 140. The second movable elevating mechanism 130_d is installed to be movable on the second guide portion 112 and functions to support the fourth edge portion 144 of the backup member. The first and second movable elevating mechanisms 130_c and 130_d move in the conveying direction or the opposite of the conveying direction of the printed circuit board B according to the size of the printed circuit board B. The interval from 130_a and 130_b may be adjusted.

In this case, a fixing groove 148 is formed in each corner of the backup member 140, and the first and second movable lifting mechanisms 130_a and 130_b and the first and second fixed lifting mechanisms 130_c and 130_d are formed. And a fixing part 122 inserted into each of the fixing grooves 148 to fix the backup member 140. In this case, the first and second movable elevating mechanisms 130_a and 130_b and the first and second fixed elevating mechanisms 130_c and 130_d may further include a support part 124, which supports the backup member 140. Support while touching the bottom of the.

Referring to FIGS. 2 to 4, which illustrate one example for allowing the first and second movable lifting mechanisms to move along the first and second guide parts, the printing may be performed on the inner surface of the first guide part 111. The guide slot 115 is formed in the moving direction of the circuit board B.

In this case, the first and second movable lifting mechanisms 130_c and 130_d may further include a bracket 131 and a driving motor 121. The bracket 131 has a slide portion 135 that is fitted to the guide slot 115 so as to be slidable. In addition, the drive motor 121 is formed to be coupled to the bracket 131, the fixing portion 122 is connected to the drive motor 121 can be moved up and down.

For example, the bracket 131 may include a guide counterpart 134 and a motor counterpart 132. The guide counterpart 134 is positioned to be parallel to the first and second guide parts 111 and 112, and the slide part 135 protrudes. The motor counterpart 132 is bent from the guide counterpart 134 and disposed in the horizontal direction. A hole 133 is formed in the motor counterpart 132, and a part of the driving motor 121 may be coupled by a fixing member such as a bolt in a state in which the driving motor 121 is inserted into the hole 133. For this reason, the driving motor may be disposed to face upward.

However, the present invention is not limited thereto, and the first and second movable lifting mechanisms 130_c and 130_d can be moved along the first and second guide portions through straight movement mechanisms such as LM guide devices and ball screws.

In addition, the first and second fixed lifting mechanisms 130_a and 130_b may further include a bracket 131 and a driving motor 121. In this case, the bracket 131 may be fitted to be fixed to the end of the guide slot 115, and the driving motor 121 may be formed to be coupled to the bracket 131.

The fixing part 122 is connected to the driving motor 121 to move up and down by driving the driving motor 121. In this case, the driving motor 121 is a voice coil motor. It is preferable that the top part 122 is coupled to the driving motor and moved up and down in accordance with the driving of the voice coil motor. Meanwhile, the interval between the first guide part 111 and the second guide part 112 of the conveyor 110 is It is provided to be changeable according to the width of the printed circuit board (B).

In addition, although not shown, the substrate support device may be provided with a fixed pin that can be elevated to support the printed circuit board. That is, the fixing pin may be raised by the pneumatic pressure of the fixing cylinder to be inserted into the reference hole formed in the printed circuit board B, thereby fixing the printed circuit board B.

Hereinafter, the operation of the substrate support apparatus 100 for a component mounter having the above structure will be described. When the printed circuit board B to be seated and transported on the conveyor 110 is determined, a backup member 140 suitable for the size of the printed circuit board B is prepared, and a fixing groove ( The first and second movable lifting mechanisms 130_c and 130_d are moved along the guide slot 115 so as to fit in the 148. Thereafter, the backup member 140 is mounted on the first and second fixed elevating mechanisms 130_a and 130_b and the first and second movable elevating mechanisms 130_c and 130_d. In this case, the heights of the first and second fixed elevating mechanisms 130_a and 130_b and the first and second movable elevating mechanisms 130_c and 130_d are fixed to the fixing grooves 148 formed at the corners of the backup member 140. The government 122 may be fitted, and the support 124 may support and fix the rear surface of the backup member 140.

After that, when the printed circuit board B arrives on the backup member 140, the fixing part 122 rises according to the driving of the driving motor, and thus the backup member 140 moves on the printed circuit board. (B) is raised to a predetermined position, and in this state, the component adsorption nozzle carries out work for mounting a component on the printed circuit board (B). Thereafter, the fixing part 122 descends according to the driving of the driving motor 121, and accordingly, the backup member 140 also descends.

On the other hand, when the component is mounted on a printed circuit board having a different size, prepare a backup member for the printed circuit board, and adjust the position of the first and second transfer lifting mechanism according to the size of the backup member as described above The operation can be performed to simply support the substrate.

That is, the size of the substrate supporting apparatus for supporting the printed circuit board is substantially the same as the size of the printed circuit board transferred by the conveyor. This can significantly reduce the size of the conventional substrate support device as compared with the installation to support the printed circuit board of the maximum size.

As a result, a part feeder such as a tray feeder may be installed in the reduced space, and as a result, the overall size of the part mounter is reduced.

As described above, the present invention has the following effects.

First, by minimizing the size of the substrate supporting apparatus, the total size of the component mounter is reduced.

Second, the backup member can be replaced in a simple and quick time according to the size of the printed circuit board.

Third, the structure for elevating the backup table is simple, so that the total weight is reduced and the manufacturing cost is reduced.

Fourth, the substrate supporting apparatus is formed in accordance with the size of each printed circuit board, so that the distance between the conveyor belt and the substrate supporting apparatus can be minimized, so that the printed circuit board is supported by the substrate supporting apparatus. This reduces time, resulting in faster component mounting.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and any person skilled in the art to which the present invention pertains may have various modifications and equivalent other embodiments. Will understand. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (5)

A backup member having an upper surface for supporting the printed circuit board; A conveyor having first and second guide parts spaced apart from each other to transfer the printed circuit board; First and second fixed lifting mechanisms fixed to the first and second guide parts to guide the lifting and lowering of the backup member; And The first and second guides are provided to be movable in the conveying direction of the printed circuit board, and the first and second movable elevating mechanisms for guiding the elevating of the backup member in conjunction with the fixed elevating mechanism are provided. Substrate support device for component mounter. The method of claim 1, Fixing grooves are formed in each of the corners of the backup member, And each of the first and second movable elevating mechanisms and the first and second fixed elevating mechanisms includes a fixing portion inserted into the fixing groove to fix the backup member. The method of claim 2, Guide slots formed in the moving direction of the substrate are formed on inner surfaces of the first and second guide parts, The first and second movable lifting mechanisms further include a bracket portion having a slide portion slidably accommodated in the guide slot, and a driving motor coupled to the bracket portion. The fixing unit is connected to the drive motor, the substrate support device for a component mounter, characterized in that it moves in the vertical direction by the drive of the drive motor. The method of claim 3, wherein The first and second fixed lifting mechanism is: A bracket part having a slide part fixed to the guide slot and accommodated therein; And Further provided with a drive motor coupled to the bracket portion, The fixing unit is connected to the drive motor, the substrate support device for a component mounter, characterized in that it moves in the vertical direction by the drive of the drive motor. The method according to claim 3 or 4, And said drive motor is a voice coil motor.

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