KR200330739Y1 - Component support device for component mounter - Google Patents

Abstract

The present invention provides a frame in which a drive motor is installed, a backup table mounted on the frame so as to move up and down, a cam means for elevating the backup table with respect to the frame, guide means for guiding the lifting of the backup table, and a backup table. Disclosed is a component mounting apparatus for a component mounter including a support block portion for simultaneously lifting and supporting a printed circuit board, and a sensing unit for sensing a displacement amount during a lifting movement of a backup table.

Description

Component support device for component mounter

The present invention relates to a component support device, and more particularly, to a component support device for a component mounter having an improved structure for supporting a printed circuit board transferred from the component transfer device.

In general, a component mounting device such as a flip chip mounter is a device for mounting a small electronic component such as a semiconductor chip on a printed circuit board. It picks up a component supplied through the component feeder by a pick-up tool movable on the X and Y-axis frames, and then mounts it on the printed circuit board transferred by the substrate transfer device. The pick-up tool is provided with a suction means such as a nozzle that can be vertically raised and lowered in the header portion so that the component can be sucked in a vacuum and mounted on the component mounting portion on the printed circuit board.

In this case, when the transfer is completed to the position to be mounted by the substrate transfer device, the printed circuit board is lifted and fixed to a point to be mounted by a back-up table supported by the lower portion thereof. Then, the pick-up tool moves to the point where the component is mounted in the X, Y axis orthogonal motion, and the nozzle is lowered to the printed circuit board side to mount the component.

By the way, in order to position the printed circuit board to the point where it is mounted, the conventional technique uses a pneumatic cylinder as the lifting means of the backup table. By the pneumatic pressure of this pneumatic cylinder can be transferred by one stroke. Therefore, the moving distance that the backup table moves up and down is always constant.

If the amount of displacement that is elevated is constant regardless of the shape of the printed circuit board, for example, the thickness change, an excessive load may be transmitted when the component adsorbed by the nozzle is mounted on the substrate. As a result, warpage of the printed circuit board occurs, and the alignment of the parts to be mounted can be shifted from the desired position of the component mounting portion.

The present invention was devised to solve the above problems, and improves the structure of the backup table for supporting the printed circuit board to be liftable to the point where the parts are mounted to provide a component mounting apparatus for a component mounter that takes less load. The purpose is.

1 is a perspective view showing a component mounter according to an embodiment of the present invention,

Figure 2 is a front view showing the component support device of Figure 1,

3 is a side view of FIG. 2;

<Brief description of symbols for the main parts of the drawings>

10. Component Mounter 11. Base

12. Flip Chip 13. Component Supply Device

14.X axis frame 15.Y axis frame

16. Pickup tool 17. Board feeder

20. Component Support 21. Backup Table

23. Guide part 24. Elastic bias means

25. Cam portion 26. Drive motor portion

27. Belt 28. Pulley

29. Cam Follower 100. Substrate

200. Detection unit 210. Support block unit

211.Vacuum generator 212. Heater section

220. Fixed part 221. Fixed pin

222. Fixed Cylinder

In order to achieve the above object, a component support apparatus of a component mounter according to an aspect of the present invention includes a frame in which a driving motor is installed; A backup table mounted on the frame to be capable of lifting and lowering; Cam means mounted to raise a backup table relative to the frame; Guide means for guiding the lifting and lowering of the backup table; A support block unit which simultaneously lifts and supports the printed circuit board; And a sensing unit installed at one side of the frame to sense the displacement amount during the lifting movement of the backup table.

The cam means may include a plurality of cam portions rotatably coupled to both ends of a plurality of rotation shafts installed in the frame, power transmission means coupled to the driving motor to transfer the rotational force to the cam portion, and the backup table. And a cam follower coupled to and in contact with the outer circumferential surface of the cam portion.

Further, the guide means includes an elastic bias means for both ends coupled to the frame and the backup table to be elastically deformed, and is inserted through a through hole of the frame, and one end is fixed to the backup table so that the amount of elastic displacement of the elastic bias means is increased. And a guide part for guiding the lifting and lowering of the backup table.

Hereinafter, with reference to the accompanying drawings will be described in detail the component support device of the component mounter according to an embodiment of the present invention.

1 illustrates a flip chip mounter 10 which is an embodiment of a component mounter according to the present invention.

Referring to the drawings, the flip chip mounter 10 places a flip chip on which solder bumps are formed on a printed circuit board on which solder bumps of the same pattern are formed, and the solder bumps are bonded at a corresponding position. It is a device to be mounted as possible.

The mounter 10 is provided with a base 11. On one side of the base 11, a component supply device 13 for supplying a flip chip 12, and a solvent applying device 18 for applying a flux to a solder bump formed on the bottom surface of the flip chip 12. And a vision system 19 for checking the alignment state of the flip chip 12 is provided.

A plurality of X-axis frames 14 are provided on the base 11 so as to face each other. On the X-axis frame 14, the Y-axis frame 15 is installed to be orthogonal to each other. An X-axis guide portion 14a is formed on the upper surface of the X-axis frame 14 to guide the Y-axis frame 15 to linearly move in the X-axis direction.

In addition, the pick-up tool 16 is coupled to the Y-axis frame 15 to be movable. On the side of the Y-axis frame 15, a Y-axis guide portion 15a is formed to guide the pick-up tool 16 to be transportable in the Y-axis direction. And the pick-up tool 16 is equipped with the header part 16a. The header portion 16a is provided with a nozzle 16b at an end thereof to adsorb the substrate 100 in a vacuum, and to move up and down in the Z axis perpendicular to the substrate 100. On the other hand, the substrate 100 is transferable by a substrate transfer device 17, for example, a conveyor installed on the base (11).

In the mounting apparatus 10 having such a structure, a process of mounting the flip chip 12 on the substrate 100 will be described below.

First, the Y-axis frame 15 moves in the X-axis direction with respect to the X-axis frame 14, and the pick-up tool 16 moves in the Y-axis direction with respect to the Y-axis frame 15, so that the component supply device 13 Located in Subsequently, the nozzle 16b provided in the pickup tool 16 moves up and down to vacuum suction the flip chip 12 supplied from the component supply device 13.

When the adsorption is completed, the pick-up tool 16 is moved to the solvent-packing device 18 by the linear reciprocating motion of the X, Y-axis frame 14, 15. The solvent coating device 18 stores a liquid solvent. Therefore, in order to apply the solvent to the solder bump formed on the lower surface of the flip chip 12, the nozzle portion 16b is lowered in the Z-axis direction, and thus the solvent is applied to the lower surface of the flip chip 12.

After the solvent is applied, the pick-up tool 16 is transferred to the vision system 19 to check the alignment of the flip chip 12 to detect the position and angle error. The correction value for the position according to the detection result of the vision system 19 is accurately transferred onto the component mounting portion to be mounted on the substrate 100.

On the other hand, the substrate 100 is transported by the substrate transfer device 17, the component support device 20 according to a feature of the present invention is raised to the point where the component is mounted without a position error. Accordingly, the flip chip 12 may be mounted on the substrate 100.

After the flip chip 12 is mounted on the substrate 100, the component support device 20 supporting the substrate 100 descends downward to return to the original position. The substrate 100 is a substrate transfer device ( 17) is transferred to the reflow process, which is the next process.

Here, looking at the structure of the component support device 20 according to the features of the present invention as shown in Figs.

2 is a front view of the component support apparatus 20 according to an embodiment of the present invention, Figure 3 is a side view of FIG.

Referring to the drawings, the component support apparatus 20 is provided with a back-up table 21 for supporting the printed circuit board 100 from the bottom. The backup table 21 is installed on the frame 22 spaced apart from each other by a lifting and lowering movement.

That is, a bracket 21a is installed on the lower surface of the backup table 21, and an elastic bias means 24, for example, a spring is coupled between the predetermined portion of the bracket 21a and the side surface of the frame 22. In addition, the frame 22 is provided with a guide portion 23 having one end fixed to the bracket 21a to guide the lifting movement of the backup table 21 by a distance corresponding to the amount of elastic displacement of the elastic bias means 24. Will be

In addition, a cam portion 25 is installed in the frame 22. The cam portions 25 are respectively coupled to both ends of the plurality of rotation shafts 22a provided in the frame 22. In addition, the driving motor 25 is provided on one side of the frame 22 to transmit the rotational force to the rotating shaft 22a. A belt 27 is coupled to the power take-off shaft of the drive motor 25, and the belt 27 is wound on a plurality of pulleys 28 to synchronize the rotation shaft 22a.

The cam follower 29 which contacts the outer peripheral surface of the cam part 25 to displace the rotational motion of the cam part 25 in linear motion is contacted. The cam follower 29 is screwed into the lower portion of the backup table 21 and presses the cam portion 25 by the elastic force of the elastic biasing means 24.

On the other hand, the frame 22 is provided with a detection unit 200 for detecting the amount of displacement of the backup table 21 to be moved up and down by the rotation of the cam unit 25.

In addition, a support block 210 for adsorbing the printed circuit board 100 is mounted on an upper surface of the backup table 21. The support block unit 210 is provided with a vacuum generator 211 for adsorbing the substrate 100 in a vacuum. In addition, a heater 212 may be installed to maintain the support block 210 itself at a high temperature.

In addition, the fixing unit 220 is coupled to one side of the substrate transfer device 17. The fixing part 220 is provided with a fixing pin 221 inserted into the reference hole of the substrate 100 to fix it. The fixing pin 221 is capable of lifting and lowering by the pneumatic pressure of the fixing cylinder (222).

Meanwhile, a stopper 230 is installed at one side of the frame 22. The stopper 230 stops when it reaches the position where the printed circuit board 100 to be transferred from the substrate transfer device 17 is mounted. The stopper 230 may be lifted and lowered by the stopper cylinder 231.

Looking at the operation of the component support device 20 according to the present invention having such a structure as follows.

First, when the driving motor 26 is rotated, the belt 27 coupled to the power take-off shaft of the motor 26 receives the rotational force. Subsequently, the plurality of rotation shafts 22a that can be synchronized by the pulley 28 are rotated, and the cam portions 25 coupled to both ends of the rotation shaft 22a are rotated simultaneously.

When the cam portion 25 is rotated, the cam follower 29 in contact with the outer circumferential surface of the cam portion 25 is forcibly raised upward. That is, the cam follower 29 is pushed toward the cam portion 25 by the elastic bias means 24 having one end fixed to the backup table 21, and then rises upward by the rotation of the cam portion 25. Accordingly, the backup table 21 is moved up by the guide of the guide portion 23 inserted into the through hole of the frame 22.

When the backup table 21 moves up, the support block 210 coupled thereto is raised at the same time, the support block 210 is a substrate 100 by the vacuum pressure supplied from the vacuum generator 211 It will adsorb the bottom of).

On the other hand, before the printed circuit board 100 is adsorbed by the support block 210, the fixing pin 221 is provided on the fixing portion 220 provided on one side of the component transfer device 17 is fixed cylinder ( Ascending by the pneumatic pressure of the 222 is fitted to the reference hole formed in the substrate 100. Therefore, the substrate 100 can be fixed without being separated from the home position.

When the printed circuit board 100 reaches the point at which the component is mounted, the pick-up tool 16 moved in the linear reciprocating motion of the X- and Y-axis frames 14 and 15 is flipped from the vision system 19. After checking the alignment state of the chip 12, the nozzle 16b is lowered at the correct position by using the compensation value and mounted.

The mounted substrate 100 is mounted on the substrate transfer device 17 after the cam part 25 is reversely rotated and the backup table 21 is lowered in order to be transferred to another process such as a reflow process. . At this time, the sensing unit 200 installed in the frame 22 detects the movement distance during the lifting movement of the backup table 21 and measures the displacement amount that the cam unit 25 should rotate.

As described above, the component supporter for a component mounter of the present invention can obtain the following effects.

First, when mounting a component such as a semiconductor chip on a printed circuit board transferred by the substrate transfer device, the component support device for supporting the printed circuit board at the bottom can be transferred to the point where the component is mounted by the rotation of the cam portion. The amount of displacement transferred can be arbitrarily adjusted in accordance with a change in shape, such as thickness.

Second, due to the component support device, it is easy to maintain the flatness of the substrate due to less load transmitted from the pick-up tool to the support block portion that rises at the same time as the lifting table.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention should be defined by the technical spirit of the appended claims.

Claims (3)

A frame in which a drive motor is installed; A backup table mounted on the frame to be capable of lifting and lowering; Cam means mounted to raise a backup table relative to the frame; Guide means for guiding the lifting and lowering of the backup table; A support block unit which simultaneously lifts and supports the printed circuit board; And And a sensing unit installed at one side of the frame to sense a displacement amount during a lifting movement of the backup table. The method of claim 1, The cam means is coupled to both ends of the plurality of rotation shafts installed on the frame, respectively, rotatable cam portion, power transmission means coupled to the drive motor to transfer the rotational force to the cam portion, coupled to the backup table And a cam follower in contact with the outer circumferential surface of the cam part. The method of claim 1, The guide means includes an elastic bias means for elastically deforming with both ends coupled to the frame and the backup table, and is inserted through a through hole of the frame, and has one end fixed to the backup table so that the backup table has an elastic displacement of the elastic bias means. Component support device for component mounting apparatus, characterized in that it comprises a guide for guiding the lifting of the.