JP3514151B2 - Apparatus and method for mounting conductive ball - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive ball mounting apparatus and method for mounting a conductive ball on a substrate (wafer) having a plurality of electronic components (semiconductor elements) formed thereon.

[0002]

2. Description of the Related Art In a process of forming bumps which are protruding electrodes on a semiconductor element, a bump forming material such as a conductive ball is mounted on an electrode of the semiconductor element. In recent years, a method of mounting conductive balls in a wafer state before a semiconductor element is cut into individual pieces has been used.

[0003]

However, when the conductive balls are directly mounted on the wafer, there have conventionally been the following problems. The wafer has a circular shape because it is cut out from a cylindrical material, and a large number of semiconductor elements are cut out from this wafer. Since the shape of each individual semiconductor element is generally rectangular, the outer periphery of the wafer does not match the cutting line of the semiconductor element. That is, the semiconductor elements are cut out in a stepwise cutting line in the vicinity of the outer periphery of the wafer. Therefore, when mounting the conductive balls, it is not possible to collectively group a plurality of semiconductor elements into blocks.

As a result, conventionally, when the conductive balls were directly mounted on the wafer, it was only selectable to mount the conductive balls individually or collectively on the entire wafer. However, the method of mounting all the components at once has a difficulty in ensuring proper mounting, and when mounting in individual units, many mounting operations are required, so mounting requires a long time. However, there was a problem that the production efficiency was low.

Therefore, an object of the present invention is to provide a conductive ball mounting apparatus and mounting method capable of efficiently mounting conductive balls on a substrate on which a plurality of electronic components are formed.

[0006]

According to another aspect of the present invention, there is provided a conductive ball mounting apparatus, wherein a conductive head is picked up from a conductive ball supply section by a mounting head and mounted on a substrate having a plurality of electronic components formed thereon. It is a conductive ball mounting device that can be moved up and down individually to the mounting head .
Equipped with multiple pick-up tools of different types .

A conductive ball mounting apparatus according to a second aspect is the conductive ball mounting apparatus according to the first aspect,
The plurality of pickup tools are mounted on one semiconductor device.
Pickup tool to pick up the conductive balls to be placed
And a pickup tool for picking up the conductive balls mounted on a predetermined number of semiconductor elements.

According to a third aspect of the present invention, there is provided a method for mounting a conductive ball, wherein the conductive ball mounting device according to the first aspect picks up the conductive ball and mounts it on a substrate on which a plurality of electronic components are formed. Mounting method, before
Pick up conductive ball supply portion by Kiko separately liftable said was kind of a plurality of pick-up tool,
When the conductive balls are mounted on the substrate , the conductive balls are individually mounted on a predetermined number of electronic components corresponding to the pick-up tools by each pick-up tool. The method of mounting the conductive balls according to claim 4.
Is a conductive ball mounting device according to claim 2.
The electronic ball is picked up to form multiple electronic components.
A method of mounting conductive balls on a substrate
Each semiconductor element can be electrically
2 or 4 in one loading operation
Mounting the conductive balls on the individual semiconductor elements.
Mu.

According to the present invention, the mounting head to mount the conductive balls, different to pick up the conductive ball mounting portion of the individually liftable electronic component of the respective predetermined number
By providing a plurality of different types of pickup tools, the conductive balls can be efficiently mounted on the plurality of electronic components on the substrate.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment 1) FIG. 1 is a perspective view of a conductive ball mounting apparatus according to Embodiment 1 of the present invention.
Is a front view of a transfer head of the same conductive ball mounting apparatus, FIGS. 3A, 3B and 3C are plan views of a pick-up tool of the same conductive ball mounting apparatus, and FIG. It is a top view of the wafer in which a ball is mounted.

First, the structure of the conductive ball mounting device will be described with reference to FIG. In FIG. 1, a transport path 2 is provided at the center of a base 1. The transport path 2 transports and positions the plate 3 holding the wafer 4. The wafer 4 is a substantially circular substrate, and a plurality of semiconductor elements, which are electronic components, are formed on the wafer 4. Two Y-axis tables 5 are arranged at both ends of the upper surface of the base 1. An X-axis table 6 is erected on the two Y-axis tables 5,
A mounting head 7 is mounted on the X-axis table 6.

The mounting head 7 has three pickup heads 8. X-axis table 6 and Y-axis table 5
The mounting head 7 moves horizontally by driving. A ball supply unit 9 is arranged in front of the transport path 2, and a large number of conductive balls 10 are stored in the ball supply unit 9. The pickup head 8 picks up the conductive ball 10 by moving the pickup head 8 up and down with the mounting head 7 positioned above the ball supply unit 9. Then, the mounting head 7 is positioned on the positioned wafer 4 and the pickup head 8 is moved up and down again to mount the conductive balls 10 held by the pickup head 8 on the wafer 4.

Next, the mounting head 7 will be described with reference to FIGS. In FIG. 2, the mounting head 7 is configured by disposing three pickup heads 8 on a plate member 7a that is mounted on the X-axis table 6 and moves horizontally. Each of the three pickup heads 8 is mounted on a Z-axis table 11 equipped with a Z-axis motor 11a. Three different types of pickup tools 12A, 12B and 12C are mounted on the lower end of the pickup head 8. Therefore, the pickup tools 12A, 12
B and 12C can be raised and lowered individually.

Pickup tools 12A, 12B, 12
On the lower surface of C, as shown in FIGS. 3A, 3B, and 3C, suction holes 13 for vacuum-sucking the conductive balls are provided. Pickup tool 12A suction hole 1
3 are arranged corresponding to the arrangement pattern of the conductive balls mounted on one semiconductor element formed on the wafer 4. The pick-up tools 12B and 12C each have an array of suction holes 13 in which two or four pick-up tools 12A are coupled to each other, so that two semiconductor elements or four semiconductor elements on the wafer 4 are simultaneously conductive. The sex ball 10 can be mounted. That is, each pickup tool picks up the conductive balls mounted on a predetermined number of semiconductor elements. The pick-up tool may be one that picks up conductive balls by vacuum suction instead of picking up conductive balls by vacuum suction.

The device for mounting the conductive balls is constructed as described above, and hereinafter, the conductive balls 10 on the wafer 4 will be described.
The mounting of will be described. FIG. 4 shows the arrangement of the semiconductor elements 14 formed on the wafer 4. In FIG. 4, the sections 15A, 15B and 15C on the semiconductor element 14 are respectively the pickup tools 12A, 12B and 12C.
Indicates a section of the semiconductor element 14 on which the conductive balls 10 are mounted. That is, the conductive balls are individually mounted on each of the semiconductor elements in the partition 15A by one mounting operation, and each of the semiconductor elements in the partitions 15B and 15C is mounted by one mounting operation. The conductive balls 10 are mounted on individual objects.
In the example shown in FIG. 4, the partition 15 for one wafer 4
The numbers of A, 15B and 15C are 8, 8 and 7, respectively.

In the actual mounting operation, first, the mounting head 7 is positioned on the ball supply unit 9 shown in FIG. 1, and the three pickup heads 8 are lowered with respect to the ball supply unit 9. And pick-up tools 12A, 12B, 12
The conductive balls 10 are adsorbed on C, respectively. After this,
The pickup heads 8 are raised to move the mounting head 7 onto the wafer 4 in the transfer path 2. Then, the pickup head 8 is sequentially lowered with respect to the wafer 4 to release the suction state, so that the conductive ball 10 is mounted on each semiconductor element 14.

At this time, the mounting head 7 is mounted on the ball supply unit 9
In one reciprocating motion of moving between the wafer 4 and the wafer 4, since the conductive balls 10 can be simultaneously adsorbed to the pickup tools 12A, 12B and 12C and mounted on the wafer 4, the number of the partitions 15A, 15B and 15C can be reduced. The mounting head 7 may be reciprocated the number of times corresponding to the maximum number. That is, in the example shown in FIG. 4, the wafer 4 is moved by causing the mounting head 7 to reciprocate eight times.
The conductive balls 10 can be mounted on all of the semiconductor elements 14. Therefore, according to the conventional method of mounting individual semiconductor elements in units, in comparison with the example shown in the present embodiment, which requires a large number of reciprocating operations of 52 times, which is equal to the total number of semiconductor elements 14, The mounting work efficiency can be remarkably improved.

(Second Embodiment) FIG. 5 (a) is a front view of a pickup head according to a second embodiment of the present invention, and FIG. 5 (b).
FIG. 4 is a plan view of the lower surface of the pickup head. Figure 5
In (a), the pickup head 20 is mounted on a Z-axis table 21 having a Z-axis motor 21a. Z
The shaft table 21 is arranged alone or in plural in the mounting head 7 in the first embodiment. Pickup head 20
Is provided with a plurality of (four in the present embodiment) pickup tools 24 that are vertically guided by the guide portion 22, and as shown in FIG. The same suction hole 13 as that of the pickup tool 12A in the first embodiment is provided. Each pickup tool 24 is connected to an individual vertical movement mechanism 23, so that each pickup tool 24 can be raised and lowered individually.

Pickup head 20 having the above structure
By including the conductive balls 10 on the wafer 4, the same pickup head 20 can be mounted on each of the sections 15A, 15B and 15C on the wafer 4 described in the first embodiment. Therefore, it becomes possible to mount the conductive balls 10 more efficiently. In the first and second embodiments, the example in which the conductive balls are mounted on the electrodes of the semiconductor element formed on the wafer has been described, but the present invention is not limited to this, and a plurality of electronic components are manufactured on one sheet. The present invention can be applied to the case where the conductive balls are mounted on the embedded substrate.

[0020]

According to the present invention, each of the mounting head to mount the conductive balls picked up semiconductor element content of the conductive ball of a predetermined number were Tsu different elevatable independently species
Since a plurality of kinds of pickup tools are provided, it is possible to efficiently mount the conductive balls on a plurality of electronic components built in one substrate.

[Brief description of drawings]

FIG. 1 is a perspective view of a conductive ball mounting device according to a first embodiment of the present invention.

FIG. 2 is a front view of a transfer head of the conductive ball mounting apparatus according to the first embodiment of the present invention.

3A is a plan view of a pick-up tool of the conductive ball mounting apparatus according to the first embodiment of the present invention. FIG. 3B is a plan view of a pick-up tool of the conductive ball mounting apparatus according to the first embodiment of the present invention. (C) A plan view of a pickup tool of the conductive ball mounting apparatus according to the first embodiment of the present invention.

FIG. 4 is a plan view of a wafer on which the conductive balls according to the first embodiment of the present invention are mounted.

5A is a front view of a pickup head according to a second embodiment of the present invention, and FIG. 5B is a plan view of a lower surface of a pickup head according to a second embodiment of the present invention.

[Explanation of symbols]

4 wafers 7 mounted head 8 pickup heads 9 Supply department 10 conductive balls 12A, 12B, 12C Pickup tool 13 Adsorption hole 14 Semiconductor element

Claims (4)

(57) [Claims] 1. A conductive ball mounting device for picking up a conductive ball from a conductive ball supply section by a mounting head and mounting the conductive ball on a substrate on which a plurality of electronic components are formed. An electro-conductive ball mounting device comprising a plurality of different types of pick-up tools that can be raised and lowered. 2. The plurality of pickup tools are semiconductors.
Pick up a conductive ball mounted on one device.
Click-up tool and the pickup tool for picking up a conductive ball mounting portion of the semiconductor element of a predetermined number
2. The conductive ball mounting device according to claim 1 , further comprising: 3. A method of mounting a conductive ball according to claim 1, wherein the conductive ball is picked up and mounted on a substrate on which a plurality of electronic components are formed. pick up conductive ball supply portion by the front Kiko separate types of a plurality of pick-up tool Tsu different possible elevation, corresponding to the pickup tool by the conductive balls when mounting on the substrate, each of the pick-up tool A method of mounting conductive balls, characterized in that conductive balls are individually mounted on a predetermined number of electronic components. 4. A device for mounting a conductive ball according to claim 2.
Therefore, the conductive ball is picked up and multiple electronic parts are
It is a method of mounting conductive balls to be mounted on the formed substrate.
Therefore, each semiconductor element can be individually mounted by one mounting operation.
Two operations for mounting conductive balls and one mounting operation
Or operation of mounting conductive balls on four semiconductor elements
A method of mounting a conductive ball, comprising: