JP2000228418A - Device and method for mounting conductive balls - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently mount conductive balls on a wafer. SOLUTION: In this method, conductive balls are picked up by a mounting head 7 and mounted on a wafer on which a plurality of semiconductor elements are formed. The conductive balls are picked up by a plurality of pickup tools 12A, 12B, 12C, each capable of elevating individually, for picking up the conductive balls to be mounted onto a predetermined number of semiconductor elements. Each pickup tool individually mounts the conductive balls onto the predetermined number of semiconductor elements on the wafer depending on the pickup tools. Consequently, the number of the both-way operations of the mounting head 7 is reduced so that the conductive balls can be efficiently mounted on the semiconductor elements in a wafer state.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a conductive ball mounting apparatus and method for mounting conductive balls on a substrate (wafer) on which a plurality of electronic components (semiconductor elements) are formed.

[0002]

2. Description of the Related Art In a process of forming a bump as a protruding electrode on a semiconductor element, a bump forming material such as a conductive ball is mounted on an electrode of the semiconductor element. In recent years, a method of mounting conductive balls in a state of a wafer before a semiconductor element is cut into individual pieces has been used.

[0003]

However, when conductive balls are directly mounted on a wafer, there have been the following problems. Since the wafer is cut from a cylindrical material, the wafer has a circular shape, and a large number of semiconductor elements are cut from the wafer. Since the shape of each semiconductor element is generally rectangular, the outer periphery of the wafer does not match the cutout line of the semiconductor element. That is, in the vicinity of the outer periphery of the wafer, the semiconductor elements are cut by step-shaped cutout lines, so that a plurality of semiconductor elements cannot be bundled together in blocks when the conductive balls are mounted.

As a result, when the conductive balls are directly mounted on the wafer in the past, the only option is to mount the conductive balls individually or individually on the entire wafer. However, in the method of mounting the whole unit at once, it is difficult to ensure the normal mounting, and when mounting in individual units, many mounting operations are required, and it takes a long time to mount. However, there is a problem that production efficiency is low.

Accordingly, an object of the present invention is to provide a conductive ball mounting apparatus and a mounting method capable of efficiently mounting conductive balls on a substrate on which a plurality of electronic components are formed.

[0006]

According to a first aspect of the present invention, there is provided an apparatus for mounting a conductive ball, wherein the conductive head is picked up by a mounting head from a conductive ball supply unit and mounted on a substrate on which a plurality of electronic components are formed. And a plurality of pickup tools that can be individually raised and lowered on the mounting head.

According to a second aspect of the present invention, there is provided a conductive ball mounting apparatus according to the first aspect.
The plurality of pick-up tools pick up the conductive balls for mounting on a predetermined number of semiconductor elements.

According to a third aspect of the present invention, there is provided a method of mounting a conductive ball, wherein the conductive ball is picked up by a mounting head from a conductive ball supply unit and mounted on a substrate on which a plurality of electronic components are formed. Picking up the conductive balls of the supply unit by a plurality of pick-up tools provided on the mounting head that can be individually raised and lowered and pick up the conductive balls to be mounted on a predetermined number of electronic components, respectively, When the balls are mounted on the wafer, the conductive balls are individually mounted on a predetermined number of electronic components according to the respective pickup tools.

According to the present invention, the mounting head on which the conductive balls are mounted is provided with a pickup tool which can be individually moved up and down and picks up the conductive balls mounted on a predetermined number of electronic components. The conductive balls can be efficiently mounted on the plurality of electronic components.

[0010]

(Embodiment 1) FIG. 1 is a perspective view of a conductive ball mounting apparatus according to Embodiment 1 of the present invention, and FIG.
Is a front view of a transfer head of the conductive ball mounting device, FIGS. 3A, 3B, and 3C are plan views of a pickup tool of the conductive ball mounting device, and FIG. It is a top view of the wafer in which a ball is mounted.

First, the structure of the conductive ball mounting device will be described with reference to FIG. In FIG. 1, a transport path 2 is provided at the center of a base 1. The transfer path 2 transfers and positions the plate 3 holding the wafer 4. The wafer 4 is a substantially circular substrate, on which a plurality of semiconductor elements as electronic components are formed. Two Y-axis tables 5 are arranged at both ends of the upper surface of the base 1. An X-axis table 6 is installed on the two Y-axis tables 5,
A mounting head 7 is mounted on the X-axis table 6.

The mounting head 7 has three pickup heads 8. X axis table 6 and Y axis table 5
, The mounting head 7 moves horizontally. A ball supply unit 9 is provided in front of the transport path 2, and a large number of conductive balls 10 are stored in the ball supply unit 9. The pickup head 8 picks up the conductive balls 10 by moving the pickup head 8 up and down with the mounting head 7 positioned above the ball supply unit 9. Then, by positioning the mounting head 7 on the positioned wafer 4 and moving the pickup head 8 up and down again, the conductive balls 10 held by the pickup head 8 are mounted on the wafer 4.

Next, the mounting head 7 will be described with reference to FIGS. In FIG. 2, the mounting head 7 is configured by arranging three pickup heads 8 on a plate member 7a mounted on the X-axis table 6 and moving horizontally. Each of the three pickup heads 8 is mounted on a Z-axis table 11 having a Z-axis motor 11a. At the lower end of the pickup head 8, three different types of pickup tools 12A, 12B, and 12C are mounted. Therefore, the pickup tools 12A, 12A
B and 12C can be individually raised and lowered.

Pickup tools 12A, 12B, 12
As shown in FIGS. 3 (a), 3 (b) and 3 (c), suction holes 13 for vacuum suction of the conductive balls are provided on the lower surface of C. Suction hole 1 of pickup tool 12A
Numerals 3 are arranged corresponding to the arrangement pattern of the conductive balls mounted on one semiconductor element formed on the wafer 4. Each of the pick-up tools 12B and 12C has an array of suction holes 13 in which two or four pick-up tools 12A are connected to each other, so that two or four semiconductor elements on the wafer 4 are simultaneously conductive. The sex ball 10 can be mounted. That is, each pick-up tool picks up a predetermined number of conductive balls mounted on a semiconductor element. It should be noted that the pick-up tool may be a tool that sucks the conductive ball by electrostatic suction instead of sucking the conductive ball by vacuum suction.

The apparatus for mounting the conductive balls is configured as described above.
The mounting of will be described. FIG. 4 shows an arrangement of the semiconductor elements 14 formed on the wafer 4. In FIG. 4, the sections 15A, 15B and 15C on the semiconductor element 14 correspond to pickup tools 12A, 12B and 12C, respectively.
Indicates the section of the semiconductor element 14 on which the conductive ball 10 is mounted. That is, the conductive balls are individually mounted on each of the semiconductor elements in the section 15A by one mounting operation, and two or four semiconductor elements are respectively mounted on the sections 15B and 15C by one mounting operation. The conductive balls 10 are mounted on the individual objects.
In the example shown in FIG. 4, the section 15 for one wafer 4
The numbers of A, 15B and 15C are 8, 8, and 7, respectively.

In the actual mounting operation, the mounting head 7 is first positioned on the ball supply unit 9 shown in FIG. 1, and the three pickup heads 8 are lowered with respect to the ball supply unit 9. And the pickup tools 12A, 12B, 12
The conductive balls 10 are respectively adsorbed to C. After this,
Each pickup head 8 is raised to move the mounting head 7 onto the wafer 4 in the transfer path 2. Then, the pickup head 8 is sequentially lowered with respect to the wafer 4 to release the suction state, so that the conductive balls 10 are mounted on the respective semiconductor elements 14.

At this time, the mounting head 7 is
In one reciprocating operation of moving between the wafer and the wafer 4, the conductive balls 10 can be simultaneously attracted to the respective pickup tools 12A, 12B and 12C and mounted on the wafer 4, so that the number of the sections 15A, 15B and 15C can be reduced. The mounting head 7 may be reciprocated the number of times corresponding to the maximum number. That is, in the example shown in FIG. 4, the mounting head 7 performs the reciprocating operation eight times so that the wafer 4
The conductive balls 10 can be mounted on all of the semiconductor elements 14. Therefore, according to the conventional method of mounting the semiconductor elements in units of individual pieces, the example shown in the present embodiment requires a large number of reciprocating operations as many as 52 times equal to the total number of the semiconductor elements 14, The mounting work efficiency can be remarkably improved.

(Embodiment 2) FIG. 5A is a front view of a pickup head according to Embodiment 2 of the present invention, and FIG.
FIG. 2 is a plan view of the lower surface of the pickup head. FIG.
In (a), the pickup head 20 is mounted on a Z-axis table 21 provided with a Z-axis motor 21a. Z
The axis table 21 is provided alone or in plural on the mounting head 7 in the first embodiment. Pickup head 20
Is provided with a plurality of (four in the present embodiment) pickup tools 24 that are guided in the up-down direction by the guide portions 22. As shown in FIG. A suction hole 13 similar to the pickup tool 12A in the first embodiment is provided. Each of the pick-up tools 24 is connected to an individual vertical movement mechanism 23, and thus each of the pick-up tools 24 can be individually raised and lowered.

A pickup head 20 having the above-described structure.
By mounting the conductive ball 10 on the wafer 4, the same pickup head 20 can be used to mount each of the sections 15A, 15B and 15C on the wafer 4 shown in the first embodiment. Thus, it is possible to mount the conductive balls 10 more efficiently. In the first and second embodiments, the example in which the conductive balls are mounted on the electrodes of the semiconductor elements formed on the wafer has been described. However, the present invention is not limited to this, and a plurality of electronic components can be formed on one sheet. The present invention can be applied to the case where conductive balls are mounted on the embedded substrate.

[0020]

According to the present invention, since the conductive balls for a predetermined number of semiconductor elements are respectively picked up on the mounting head for mounting the conductive balls, and the pick-up tools which can be individually raised and lowered are provided. Conductive balls can be efficiently mounted on a plurality of electronic components formed on a single substrate.

[Brief description of the drawings]

FIG. 1 is a perspective view of a conductive ball mounting device according to a first embodiment of the present invention.

FIG. 2 is a front view of a transfer head of the conductive ball mounting apparatus according to the first embodiment of the present invention.

FIG. 3A is a plan view of a pickup tool of the conductive ball mounting apparatus according to the first embodiment of the present invention. FIG. 3B is a plan view of a pickup tool of the conductive ball mounting apparatus of the first embodiment of the present invention. (C) A plan view of a pickup tool of the conductive ball mounting device according to the first embodiment of the present invention.

FIG. 4 is a plan view of a wafer on which the conductive balls according to the first embodiment of the present invention are mounted.

5A is a front view of a pickup head according to a second embodiment of the present invention. FIG. 5B is a plan view of a lower surface of the pickup head according to the second embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 4 wafer 7 mounting head 8 pickup head 9 supply unit 10 conductive ball 12A, 12B, 12C pickup tool 13 suction hole 14 semiconductor element

Claims (3)

[Claims] 1. A conductive ball mounting apparatus for picking up conductive balls from a conductive ball supply section by a mounting head and mounting the conductive balls on a substrate on which a plurality of electronic components are formed. A conductive ball mounting device, comprising: a plurality of vertically movable pickup tools. 2. The conductive ball mounting apparatus according to claim 1, wherein each of the plurality of pickup tools picks up conductive balls mounted on a predetermined number of semiconductor elements. 3. A method for mounting a conductive ball, wherein the conductive ball is picked up by a mounting head from a conductive ball supply unit and mounted on a substrate on which a plurality of electronic components are formed. When picking up the conductive balls of the supply part by a plurality of pick-up tools which can individually pick up and lower the conductive balls for mounting on a predetermined number of electronic components, when mounting the conductive balls on the wafer, A conductive ball is individually mounted on a predetermined number of electronic components according to the pick-up tool.