KR100359865B1 - Pick and place module of semiconductor package manufacture apparatus - Google Patents

Abstract

The present invention relates to a pick-and-place module of a semiconductor package manufacturing equipment, the body having a shape of a substantially rectangular parallelepiped, so as to pick up a range of semiconductor package strips; Two rotary bars positioned parallel to each other along a long side of the body and coupled to rotate at an angle; One end is fixed to the center of each rotary rod, the other end is extended toward the upper center of the body, the other end is supported by a spring, the pressing plate for rotating the rotary rod at an angle when pressing the other end to the bottom; One end is fixed to both ends of each of the rotating rod, the other end is extended toward the lower portion of the body, and pressing the pressing plate from the top, including a plurality of sticks away from each other by the rotation of the rotating rod Characterized in that made.

Description

Pick and place module of semiconductor package manufacture apparatus

The present invention relates to a pick-and-place module of a semiconductor package manufacturing equipment, and more particularly, to a pick-and-place module of a semiconductor package manufacturing equipment capable of picking up strips for semiconductor packages of various sizes.

In general, a semiconductor package strip is a lead frame formed in a long rectangular shape to obtain a plurality of semiconductor packages at the same time through die bonding, wire bonding, molding, and marking processes. , Printed circuit board, circuit film, and the like. Such a strip typically has a form in which a plurality of units corresponding to one semiconductor package are connected in a row or arranged in a matrix form in which the units have rows and columns.

Meanwhile, most semiconductor package manufacturing equipment includes a loading unit for supplying strips stored in a magazine, a transfer unit for transferring strips to a predetermined destination, a work unit for performing die bonding, wire bonding, molding and marking, and a strip having completed work. It consists of an unloading part etc. which are accommodated in a magazine etc. again.

Here, a pick-and-place device is provided in the loading unit for supplying the strips, which picks up individual strips from a plurality of strips housed in a magazine and supplies them to the transfer unit.

Such devices are usually equipped with a pick-and-place module, which picks up a strip of a certain size and places the strip in a predetermined position.

The pick-and-place module typically uses a method of picking up and placing only a predetermined strip with a plurality of sticks or grippers, or a method of absorbing and placing only a predetermined strip by using suction means.

However, the pick-and-place using the plurality of grippers can only pick up strips of a predetermined size, and in the case of providing strips of different sizes, another pick-and-place module manufactured accordingly has a disadvantage.

In addition, the pick-and-place using the adsorption means may change the position of the strip at the time of picking up or during pick-up. If the position of the strip is changed in this way, it is difficult to place the strip in the correct position, thus causing not only pick and place defects but also the following stage of conveyance failure of the strip.

Such problems are causing a decrease in the yield of the semiconductor package by stopping the entire equipment, replacing the pick and place or removing the defective factors.

Accordingly, the present invention has been made to solve the above-mentioned conventional problems, and to provide a pick-and-place module of a semiconductor package manufacturing equipment capable of pick-and-place the strip for semiconductor packages of various sizes in the correct position.

1A to 1C are a plan view, a front view and a side view showing a pick-and-place module of a semiconductor package manufacturing apparatus according to the present invention.

Figure 2a and Figure 2b is a side view showing a state in which the pick and place according to the invention the semiconductor package manufacturing equipment.

-Description of the main symbols in the drawings-

100; Pick and place module of the semiconductor package manufacturing equipment according to the present invention

10; Body 11; Support block

12; Groove 13; Auxiliary Support Block

20; Rotating rod 30; Pressure plate

40; Stick 41; Stepped jaw

51; Frame 52; Motor

53; Pulley 54; Belt

55; Ball Screw 56; Connection block

57; Limit bearing 58; Support Shaft

59; Fixed block 60; Latch

61; Hanging jaw 62; Cylinder

In order to achieve the above object, a pick-and-place module of a semiconductor package manufacturing apparatus according to the present invention includes a body having an approximately rectangular parallelepiped shape; Two rotary bars positioned parallel to each other along a long side of the body and coupled to rotate at an angle; One end is fixed to the center of each rotary rod, the other end is extended toward the upper center of the body, the other end is supported by a spring, the pressing plate for rotating the rotary rod at an angle when pressing the other end to the bottom; One end is fixed to both ends of each of the rotating rod, the other end is extended toward the lower portion of the body, and pressing the pressing plate from the top, including a plurality of sticks away from each other by the rotation of the rotating rod Characterized in that made.

Here, it is preferable that a stepped jaw is further formed at the lower end of the stick so as to stably pick up the strip for semiconductor package.

According to the pick and place module for manufacturing a semiconductor package according to the present invention as described above, it is possible to pick up strips of various sizes to the correct position, it is possible not to change the position of the strip when picking up or place the strip.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art can easily implement the present invention.

1A to 1C are a plan view, a front view, and a side view illustrating a pick-and-place module 100 of a semiconductor package manufacturing apparatus according to the present invention.

As shown, the pick-and-place module 100 according to the present invention includes a body 10, two rotating rods 20, a plurality of pressing plates 30, and a plurality of sticks 40.

First, the body 10 has a substantially rectangular hexahedral shape, and both sides (both ends in the long side direction) of the upper portion are larger than the width (width of the short side) of the body 10 and the height is higher than the upper surface of the body 10. The support block 11 is formed. The outer surface of any one of the support block 11 is formed with a groove 12 of a predetermined depth. In addition, the auxiliary support block 13 is also formed in the upper center portion of the body 10 spaced apart a predetermined distance in the width direction (short side) of the body 10.

Two rotating rods 20 are coupled to both sides of the support block 11, and the rotating rods 20 pass through the auxiliary support block 13. The rotating rod 20 is rotatably installed on the support block 11 and the auxiliary support block 13.

A pressing plate 30 having a predetermined length toward the central portion of the upper surface of the body 10 is fixed to an area of the rotating rod 20 between the auxiliary supporting blocks 13. The pressing plate 30 is formed in a direction substantially perpendicular to the longitudinal direction of the rotary rod 20. The pressing plate 30 and the upper surface of the body 10 is not in contact with each other, the end of the pressing plate 30 is to be supported on the upper surface of the body 10 by a spring (not shown). Therefore, when the plurality of pressing plate 30 is pressed by a constant force to move downward, the rotating rod 20 is also rotated by a predetermined angle.

Subsequently, a plurality of sticks 40 extending toward the lower portion of the body 10 are fixed to both end portions of the rotating rod 20, that is, the region of the rotating rod 20 adjacent to the support block 11. Four sticks 40 are shown in the figure, but four or more may be installed. When the stick 40 is not provided with pressing force to the pressing plate 30, it is preferable to install so as to maintain a direction substantially perpendicular to the ground. Of course, when the pressing plate 30 is applied to the pressing plate 30, the distance between the special features is increased, the state is able to pick up the strip for semiconductor package. The stick 40 has a stepped jaw 41 formed on the side facing each other to enable a stable pick and place of a strip for semiconductor packages.

The pick-and-place module 100 may be provided with a plurality of pick-up strips. For example, if only three modules 100 capable of pick and place strips in the range of 20 to 34 mm, 35 to 53 mm, and 54 mm to 70 mm are provided, respectively, it is possible to pick and place almost all semiconductor package strips.

An example in which the pick-and-place module 100 is mounted is illustrated in FIGS. 2A and 2B.

As shown, a motor 52 (preferably a step motor 52) having a pulley 53 is installed on a frame 51 of a predetermined shape, and a belt (a belt) is attached to the pulley 53 of the motor 52. 54, the ball screw 55 is connected. A limit bearing 57 is coupled to the ball screw 55 through a connection block 56 of a predetermined form. A support shaft 58 is installed below the limit bearing 57, and a flat fixed block 59 is coupled to a lower end of the support shaft 58. A latch 60 is installed at one side of the fixed block 59 and a locking jaw 61 is formed at the other side.

The pick-and-place module 100 according to the present invention is fixed to the lower surface of the fixing block 59 through the latch 60 and the locking step 61. That is, the latch 60 is connected and fixed between the fixing block 59 and the support block 11, and the locking jaw 61 is defective in the groove 12 formed at the other side of the support block 11. As a result, the pick-and-place module 100 is coupled to the fixed block 59. The fixed block 59 is provided with a cylinder 62, and the cylinder 62 is capable of pressing the pressing plate 30 of the pick and place.

The operation of the mounting structure and the pick and place module 100 will be described briefly as follows.

First, the ball screw 55 is rotated by the operation of the motor 52, and then the support shaft 58 connected to the ball screw 55 by the connection block 56 is lowered.

When the support shaft 58, that is, the pick-and-place module 100 is positioned up to the top of the strip mounted in the magazine, the operation of the motor 52 is stopped.

Subsequently, the cylinder 62 positioned on the pick-and-place module 100 is operated, which presses the pressing plate 30 of the pick-and-place module 100. At this time, the cylinder 62 is also pressurized spring installed between the pressing plate 30 and the body 10. The lowering of the pick-and-place module 100 and the operation of the cylinder 62 are preferably performed at the same time. In addition, the cylinder 62 may be operated first, and then the motor 52 may be operated. Of course, when the cylinder 62 is operated so that the distance between the sticks 40 increases, the strips are positioned between the sticks 40.

Then, when the operation of the cylinder 62 is stopped, the pressing plate 30 is returned to its original position by the restoring force of the spring, and thus the distance between the sticks 40 is also returned to the original position. When the distance between the sticks 40 is win-positioned as described above, the individual strips are gripped, and the motor 52 is operated to ascend to a position where the strips can be sent to the next process. .

As described above, although the present invention has been described with reference to the above embodiments, the present invention is not limited thereto, and various modified embodiments may be possible without departing from the scope and spirit of the present invention.

Therefore, according to the pick-and-place module of the apparatus for manufacturing a semiconductor package according to the present invention, it is possible to accurately pick up a strip within a certain range, and there is no effect of changing the position of the strip when picking up or placing the strip.

In addition, having just a few pick-and-place modules that can pick up a range of strips will benefit from pick-and-place strips of almost any size.

In addition, the pick-and-place module can be easily detached by using a latch and a locking step in the semiconductor package manufacturing equipment, thereby reducing the replacement time of the module.

Claims (2)

(Correction) an approximately rectangular hexahedral body 10; Two rotating rods 20 disposed parallel to each other along a long side of the body 10 and rotatably coupled to an angle; One end is fixed to the center of each of the rotating rods 20 in a direction substantially perpendicular to the longitudinal direction of the rotating rod 20, the other end is extended toward the upper center of the body 10, the other end is supported by a spring When pressing the other end to the lower pressing plate 30 to rotate the rotary rod 20 by a predetermined angle; One end is fixed to both end portions of each of the rotating rods 20, and the other end thereof extends toward the lower portion of the body 10, and when the pressing plate 30 is pressed from the upper side, the body is rotated by the rotating rod 20. 10. The pick-and-place module of a semiconductor package manufacturing apparatus comprising a plurality of sticks 40 which are separated from each other to the outside and close to each other when the pressing plate 30 is released, thereby clamping only both ends of the strip for a semiconductor package. (Correction) The pick-and-place module of the semiconductor package manufacturing equipment according to claim 1, wherein a stepped jaw 41 is further formed at the lower end of the stick 40 so as to stably clamp the strip for semiconductor package. .