KR20030057188A - pick up device of die bonder for manufacturing a semiconductor package - Google Patents

Abstract

PURPOSE: A pick up apparatus of a die bonder for manufacturing a semiconductor package is provided to be capable of improving productivity and reducing the abrasion of a shaft of a transfer arm by minimizing the operating distance of the transfer arm. CONSTITUTION: A pick up apparatus of a die bonder is provided with a cassette(2) installed for storing a plurality of wafers(10) having sawn semiconductor chips(20), a table(8) installed and spaced apart from the cassette for supporting and fixing each wafer, a rail(16) installed and met at about 45 degree angle with the table for being capable of passing an adhesive coated substrate(18), and a transfer arm(12) capable of rotating in the range of about 0-45 degree using a rotary shaft(14) as a center portion installed for picking each semiconductor chip up from the wafer loaded on the table and attaching the semiconductor chip on the surface of the substrate.

Description

Pick up device of die bonder for manufacturing a semiconductor package

The present invention relates to a pick-up device of a die bonder for manufacturing a semiconductor package, and more specifically, to a die packager for manufacturing a semiconductor package, which can improve productivity by minimizing the operating distance of the transfer arm and reduce rotational shaft wear of the transfer arm. Relates to a device.

The die bonder in the semiconductor package manufacturing apparatus refers to a device that picks up a plurality of semiconductor chips from a wafer bonded on an adhesive tape and bonds them to a substrate such as a lead frame or a printed circuit board. Of course, the wafer is already sawed on a surface of the adhesive tape with a single semiconductor chip, and the substrate is coated with an epoxy adhesive or the like.

1A and 1B show an example of an apparatus for picking up a single semiconductor chip 20 'from a wafer 10' of a die bonder for manufacturing a conventional semiconductor package. The structure and operation thereof will be briefly described as follows. .

First, referring to FIG. 1A, a rail 16 ′ is installed to pass through a substrate 18 ′ coated with an adhesive (not shown) on one side, and a rotating shaft 14 is provided on an upper portion of the rail 16 ′. A rotation arm 12 'is rotated about 90 DEG around the wafer 10' to bond the semiconductor chips 20 'to the surface of the substrate 18' on the wafer 10 '. Of course, a table (not shown) is provided on one side of the transfer arm 12 'to support and fix the wafer 10', and a cassette (not shown) is provided below the table.

In addition, referring to FIG. 1B, a rail 16 ′ is installed to pass through a substrate 18 ′ coated with an adhesive on one side thereof, and an upper portion of the rail 16 ′ is based on a central axis 14 a ′. Thus, a transfer arm 12 'is provided which can move in the forward and rearward directions and also move in the up and down direction together with the central axis 14a'. Of course, one side of the transfer arm 12 'is provided with a table 8' so as to support and fix the wafer 10 ', and one side of the table 8' (left or right on the drawing). The cassette is installed.

However, such a conventional die bonder has excessive time for picking up the semiconductor chip 20 'from the wafer 10' by operating the transfer arm 12 'by rotating it 90 degrees or moving it up, down, up and down. There is a disadvantage that it is consumed and the die bonding process is slowed down.

In addition, since the rotation angle or the operating distance of the transfer arm 12 'is excessively large, wear occurs on the rotating shaft 14' and the like, which shortens the life of the device.

Accordingly, the present invention has been made to solve the above-mentioned conventional problems, and the pickup device of the die bonder for manufacturing a semiconductor package which can improve the productivity by minimizing the operating distance of the transfer arm and reduce the axial wear of the transfer arm. To provide.

1A and 1B are schematic perspective views showing an example of a pickup apparatus of a die bonder for manufacturing a conventional semiconductor package.

Fig. 2 is a schematic perspective view showing a pickup device of a die bonder for producing a semiconductor package according to the present invention.

-Description of the main symbols in the drawings-

2; Cassette 4; Loader

6; Pusher 8; Table

10; Wafer 12; Transfer arm

14; Axis of rotation 16; Rail

18; Substrate 20; Semiconductor chip

Pick-up apparatus of die bonder for manufacturing a semiconductor package according to the present invention for achieving the above object; a cassette provided so that a plurality of wafers, each of which is a plurality of semiconductor chips are housed and supplied to one side; A table installed at a position spaced apart from the cassette at a predetermined distance to support and fix the individual wafers; An angle of about 45 ° with the table, the rail being installed to allow an adhesive coated substrate to pass therethrough; Picking up a single semiconductor chip from the wafer on the table and adhering it to the substrate surface on the rail, wherein the transfer arm rotates approximately 45 ° about an axis of rotation.

According to the pick-up apparatus of the die bonder for manufacturing a semiconductor package according to the present invention as described above, the rotation angle of the transfer arm is approximately 45 °, thereby reducing the operating distance of the transfer arm, improving productivity, and It also has the advantage of reducing wear.

(Example)

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art can easily implement the present invention.

Fig. 2 is a schematic perspective view showing a pickup device of a die bonder for producing a semiconductor package according to the present invention.

First, a cassette 2 is provided to accommodate a plurality of wafers 10 on which a plurality of semiconductor chips 20 are sawed and supplied to one side. Of course, the pusher 6 is installed in front of the cassette 2 so as to supply the wafer 10 to one side, and the loader 4 also allows the wafer 10 to be loaded into the cassette 2. It is installed.

In addition, a table 8 is installed at a position spaced apart from the cassette 2 so that a single wafer 10 can be fixed and supported, and an adhesive is formed at an area of approximately 45 ° with the table 8. The rail 16 is installed so that the coated substrate 18 can pass therethrough.

On the other hand, the individual semiconductor chips 20 are picked up from the wafer 10 on the table 8 and bonded to the substrate 18 on the rail 16, but only about 45 ° about the rotation axis 14. The transfer arm 12 is provided so that it may rotate. Of course, a vacuum suction pad (not shown) or the like is provided at the end of the transfer arm 12 to pick up the individual semiconductor chips 20 from the wafer 10.

Referring to the operation of the pickup device of the die bonder for manufacturing a semiconductor package according to the present invention.

First, the individual wafers 10 are supplied from the cassette 2 to the table 8. Here, the cassette 2 is a state in which a plurality of wafers 10 already sawed by a plurality of semiconductor chips 20 are accommodated, and each wafer 10 is pushed from the cassette 2 by the pusher 6. It is supplied to the table 8.

Then, the transfer arm 12 operates to pick up the individual semiconductor chips 20 from the wafer 10, and then rotate about 45 ° about the rotation axis 14.

Subsequently, the transfer arm 12 bonds the semiconductor chip 20 to the surface of the substrate 18 seated on the rail 16. At this time, the adhesive is already applied to the surface of the substrate 18.

After attaching one semiconductor chip 20 to the substrate 18 as described above, the transfer arm 12 is rotated again by -45 ° about the rotational axis 14 so that each semiconductor chip on the wafer 10 is rotated. Pick up 20 and repeat the above operation. Of course, the substrate 18 on the rail 16 continues to move by a predetermined distance so that the semiconductor chip 20 is bonded to all regions.

As described above, although the present invention has been described with reference to the above embodiments, the present invention is not limited thereto, and various modified embodiments may be possible without departing from the scope and spirit of the present invention.

Therefore, according to the pick-up apparatus of the die bonder for manufacturing a semiconductor package according to the present invention, the rotation angle of the transfer arm is approximately 45 °, thereby reducing the operating distance of the transfer arm, improving productivity, and reducing wear on the rotation axis of the transfer arm. It can be effective.

Claims (1)

A cassette installed so that a plurality of wafers on which a plurality of semiconductor chips are sawed is received and supplied to one side; A table installed at a position spaced apart from the cassette at a predetermined distance to support and fix the individual wafers; A rail at an angle of about 45 ° to the table, the rail being installed to allow an adhesive coated substrate to pass therethrough; And a transfer arm picking up a plurality of semiconductor chips from the wafer on the table and adhering to a substrate surface on the rail, wherein the transfer arm rotates approximately 45 ° about an axis of rotation.