JP3576038B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for automatically mounting an electronic component at a predetermined coordinate position on a substrate.
[0002]
[Prior art]
The electronic component mounting apparatus picks up electronic components (hereinafter, referred to as “chips”) provided in a part feeder such as a tape feeder, a tube feeder, and a tray feeder by vacuum-sucking with a nozzle of a transfer head, and then picks up the transfer head. Is moved above a predetermined coordinate position of the substrate positioned by the positioning portion, and the nozzle is moved up and down there to mount the electronic component on the substrate.
[0003]
The substrate positioned by the positioning portion is easily bent downward by its own elasticity. If the substrate is bent, the stroke of the vertical movement of the nozzle of the transfer head will be disturbed, and the chip cannot be mounted correctly on the substrate.Therefore, a support section that supports the substrate of the positioning section from below and corrects the deflection is provided. Can be For example, as shown in JP-A-5-110297, the support portion has a large number of pins, and the pins support the substrate from below to prevent the substrate from bending.
[0004]
Board sizes vary in size, and conventionally, when the board size changes due to a change in the board type, an operator manually removes and inserts the pins and replenishes and reduces the pins accordingly.
[0005]
The substrate includes a double-sided mounting substrate (a substrate on which chips are mounted on both upper and lower surfaces). In the case of such a double-sided mounting substrate, first, after mounting a chip on one surface, the substrate is turned upside down and the chip is mounted on the other surface. In this case, since one surface on which the chip is mounted first becomes the lower surface, the pins must be prevented from hitting the chip mounted on the lower surface. Therefore, conventionally, an operator manually inserts and removes pins to rearrange the pins, and supports a position where no chip is present with the pins from below.
[0006]
[Problems to be solved by the invention]
However, the above-described conventional method has a problem that a large amount of time and labor is required because an operator has to manually insert and remove a large number of pins every time the type of board is changed. In recent years, in particular, many types of boards are small and many kinds of boards are often changed. Therefore, it is necessary to insert and remove the pins as described above each time, so that the arrangement of the pins is automatically changed and set up. The appearance of such devices has been strongly desired.
[0007]
SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component mounting apparatus provided with a board supporting portion capable of automatically and quickly rearranging pins in response to a change in board type.
[0008]
[Means for Solving the Problems]
An electronic component mounting apparatus according to claim 1, further comprising: a board positioning unit, an electronic component supply unit, a transfer head for transferring and mounting an electronic component provided in the supply unit to the substrate, and a transfer head. An electronic component mounting apparatus comprising: a moving table to be moved; and a support unit that supports the substrate from below by a pin unit in which a plurality of pins are disposed to be vertically movable, wherein the pin unit includes a block, A gas is provided which has a piston which is vertically movable in a plurality of pin holes formed in the block and which presses and discharges gas into and out of the pin holes. A vertical moving means for vertically moving the substrate relative to the pins of the supporting portion; a block having a flat plate shape; and a pin hole formed in the block. Rikusu like are opened in, together with further wherein the bore path and the lower communicating with the upper portion of the pin hole to form a hole path communicating with the block, connected to said gas pumping means these holes passage through passage, A valve for switching the passage is provided in this passage, and when the pin is lifted, the pin is pushed up by a push-up member in a state where air is sent from the high-pressure gas sending means to the hole communicating with the lower portion, and the lower surface of the piston is raised. By ascending above the hole, the desired pins are individually and individually raised to the top dead center one by one, and when the pins are lowered, the valve is switched to communicate with the upper part. All the pins are lowered to the bottom dead center by injecting air from the gas pressure feeding means into the hole .
[0009]
The electronic component mounting method according to claim 2, wherein the electronic component is mounted on a substrate that is positioned from below by a supporting portion that is positioned at a positioning portion of the substrate and has a plurality of pins that are vertically movable. An electronic component mounting method in which an electronic component provided in a supply unit is transferred and mounted by a transfer head, wherein the pins include a piston that is vertically movably mounted in a plurality of pin holes formed in a block of the pin unit. The block has a flat plate shape, the pin holes are formed in the block in a matrix, and the block further has a hole communicating with an upper portion of the pin hole and a hole communicating with a lower portion of the pin hole. formed, the pin by press-fitting and discharging the gas by the holes path and the gas pumping means to the pin hole through the valve for passage switching provided in the passage to these holes The Upon Ru to perform the vertical motion, when increase of the pin, said bore path above the lower surface of the piston push up pins by push-up member while pumping air from the high pressure of the gas pumping means to hole communicating with the lower portion By ascending above the road, the desired pins are individually raised one by one up to the top dead center one by one, and when the pins are lowered, the valve is switched to communicate with the upper part. All the pins are lowered to the bottom dead center by pressurizing air into the holes from the gas pressure feeding means , and the substrate is moved up and down relatively to the pins of the support.
[0010]
According to the above configuration, the pin can be automatically moved up and down by injecting air pressure into the pin hole by the gas pressure feeding means, and the substrate can be moved up and down relatively with respect to the pin, so that the positioning section is formed. The substrate can be carried into and out of the apparatus without difficulty.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 2 is a front view of the same. Reference numeral 1 denotes a base on which the elements described below are arranged. 2a and 2b are a pair of left and right guide rails. These guide rails 2a and 2b are positioning portions for positioning the substrate 3 by clamping it from the left and right. The substrate 3 is carried between the guide rails 2a and 2b by a conveyor (not shown) (arrow N1). Then, a chip is mounted (mounted) on the upper surface thereof while being positioned between the guide rails 2a and 2b. When the mounting is completed, the substrate 3 is carried out to the next step by a conveyor (not shown) (arrow N2).
[0012]
A number of parts feeders 4 are juxtaposed beside one guide rail 2b. Each part feeder is provided with chips 5 of various types. That is, these parts feeders 4 are supply units for electronic components. A transfer head 6 has a nozzle 7. The transfer head 6 is held by the moving table 10 and horizontally moves in the X and Y directions. Further, the nozzle 7 is driven by a driving unit built in the transfer head 6 to perform an up / down operation. The transfer head 6 moves above the parts feeder 4, where the nozzle 7 moves up and down, and vacuum-adsorbs the chip 5 provided in the parts feeder 4 to the lower end of the nozzle 7 to pick it up. Next, the transfer head 6 moves above the substrate 3, where the nozzle 7 moves up and down again to mount the chip 5 vacuum-adsorbed on the nozzle 7 at a predetermined coordinate position on the substrate 3. The vertical movement stroke of the nozzle 7 is computer-programmed in advance based on chip data and the like.
[0013]
The guide rails 2a and 2b are supported by the support columns 8. A column 8 that supports one guide rail 2b is erected on a linear table 9. When the motor 9a of the linear table 9 is driven, the guide rail 2b approaches and separates from the other guide rail 2a, and adjusts the interval between the guide rails 2a, 2b according to the width of the substrate 3.
[0014]
Below the substrate 3, a support portion 11 for the substrate 3 is provided. The support section 11 includes a pin unit 12 and a push-up unit 13 provided below the pin unit 12. Hereinafter, the support portion 11 will be described. 3 is a perspective view of a push-up unit according to an embodiment of the present invention, FIGS. 4, 5, and 6 are partial cross-sectional views of the pin unit, and FIGS. 7A and 7B are cross-sectional views taken along line AA of FIG. It is a figure and BB sectional drawing.
[0015]
1, 2, and 4, the pin unit 12 mainly includes a flat block 14. A large number of pin holes 15 are formed in the block 14 in a matrix, and pins 16 are vertically inserted into the respective pin holes 15 as shown in FIG. A cylindrical piston 17 is integrally formed at the center of the pin 16, and the piston 17 is mounted in the pin hole 15 so as to be vertically movable.
[0016]
Inside the block 14, a hole 18 communicating with the upper part of the pin hole 15 and a hole 19 communicating with the lower part are formed (see also FIG. 7). In FIG. 4, the holes 18 and 19 are connected to an air source 22 as a gas pressure feeding means through passages 20 and 21. In the middle of the passages 20, 21, a passage switching valve 23 is provided. This valve 23 is an electromagnetic valve.
[0017]
Next, the push-up unit 13 will be described. 2 and 3, reference numeral 30 denotes a rectangular frame, in which an X-direction feed screw 31 and a Y-direction feed screw 32 are provided. Nuts 33 and 34 are screwed into the feed screws 31 and 32, respectively. Guide rods 36 and 37 are connected to the nuts 33 and 34. The guide rods 36 and 37 intersect in a cross shape, and a block 38 is slidably held along the guide rods 36 and 37 at the intersection.
[0018]
The block 38 is provided with a cylinder 39. Reference numeral 40 denotes a rod of the cylinder 39, which is a push-up member that pushes up the pin 16 from below. Motors 41 and 42 rotate the feed screws 31 and 32. When the motors 41, 42 are driven to rotate the feed screws 31, 32, the nuts 33, 34 move along the feed screws 31, 32, and the guide rods 36, 37 connected to the nuts 33, 34 also move in the same direction. This causes the block 38 to move in the X and Y directions to position the rod 40 just below the desired pin 16. Then, the cylinder 39 is operated, and the rod 40 is raised to push up the pin 16. That is, the elements denoted by reference numerals 30 to 38, 41, and 42 are moving devices that horizontally move the cylinder 39, which is a driving unit that moves the rod 40 up and down.
[0019]
1 and 2, a cylinder 43 is provided on a side surface of the push-up unit 13. The rod 44 of the cylinder 43 is connected to the side surface of the pin unit 12. Guide shafts 45 are provided upright at four corners of the push-up unit 13, and the pin unit 12 is mounted on the guide shaft 45 so as to be vertically movable. Therefore, when the rod 44 moves up, the pin unit 12 moves up along the guide shaft 45, and when the rod 44 retracts, the pin unit 12 moves down along the guide shaft 45. That is, the cylinder 43 serves as a vertical moving unit that moves the pin unit 12 up and down with respect to the substrate 3.
[0020]
This electronic component mounting apparatus is configured as described above. Next, the overall operation will be described. 2, the block 38 is moved in the X and Y directions by driving the motors 41 and 42, and the rod 40 of the cylinder 39 is positioned directly below the desired pin 16. FIG. 4 shows the state at this time, and all the pins 16 of the pin unit 12 are at the bottom dead center.
[0021]
Next, in FIG. 4, the cylinder 39 is operated and the rod 40 is raised, and the pin 16 is pushed up to the position indicated by the dashed line. At this dashed line position, the lower surface a of the piston 17 of the pin 16 ascends above the lower hole 19 as shown, and the hole 19 communicates with the lower portion 12 of the pin hole 15. At this time, high-pressure air is pressure-fed from the air source 22 to the hole 19 through the passage 21, so that the high-pressure air is pressed into the lower portion of the pin hole 15, and the pressure causes the pin 16 to rise at a stroke to the top dead center. FIG. 5 shows this state. That is, this means moves the rod 40 of the cylinder 39 directly below the desired pin 16, and raises the rod 40 there, and slightly raises the lower surface a of the piston 17 of the pin 16 above the hole 19. As a result, high-pressure air is pressed into the lower portion of the pin hole 15 to raise the pin 16 to the top dead center. Thereafter, the desired pins 16 are individually raised one by one to the top dead center one after another by the same method.
[0022]
FIG. 2 shows a state where a plurality of desired pins 16 have been raised to the top dead center as described above. In this state, an air pressure is applied to the lower part of each pin hole 15 by the air source 23 in order to hold all the pins 16 at the top dead center. Next, when the rod 44 of the cylinder 43 is protruded, the pin unit 12 rises from the solid line position to the chain line position, and the substrate 3 is supported from below by the pins 16 (see the pins 16 indicated by the chain lines in FIG. 2). In this state, the transfer head 6 reciprocates between the parts feeder 4 and the substrate 3 repeatedly, and transfers and mounts the desired chips 5 provided on the parts feeder 4 at predetermined coordinate positions of the substrate 3 one after another.
[0023]
When all the chips 5 are mounted on the substrate 3, the rod 44 of the cylinder 43 is retracted, the pin unit 12 is lowered to the position shown by the solid line in FIG. Cancel. Then, the substrate 3 is carried out to the next step, and the next substrate 3 is carried in between the guide rails 2a and 2b, and the above operation is repeated.
[0024]
When changing the pins 16 projecting upward to change the type of board, first, all the pins 16 are lowered to the bottom dead center to be in the initial state. FIG. 6 shows the state at this time. In this case, first, the valve 23 is switched to the passage 20 side, and air is pressed into the pin hole 15 from the hole 18. Then, due to the air pressure, all the pins 16 descend to the bottom dead center. Therefore, according to this means, all the pins 16 can be simultaneously and instantaneously lowered to the bottom dead center to return to the initial state.
[0025]
The upward projecting operation of the pins 16 is performed every time the type of the board is changed. Which one of the many pins 16 is to be raised is determined based on the board data. When the substrate is a double-sided mounting substrate and a chip is already mounted on the lower surface side, the pins 16 that do not contact the chip are raised. Also in this case, which pin 16 is raised is determined based on the board data. The various controls described above are automatically performed by a computer.
[0026]
The present invention is not limited to the above embodiment. For example, in the above embodiment, although the pin unit 12 is moved up and down with respect to the substrate 3 by the cylinder 43, the guide rails 2a and 2b for holding the substrate 3 May be moved up and down with respect to the pin unit 12. In addition, the present invention can be applied to other types of electronic component mounting apparatuses such as a rotary head type electronic component mounting apparatus in which a transfer head is held by a rotary head and moves and mounts a chip while circularly moving between a parts feeder and a substrate. .
[0027]
【The invention's effect】
As described above, according to the present invention, the pins can be automatically raised and the board can be supported from below, so that the setup change accompanying the change of the board type can be quickly performed. In particular, when the electronic component is already mounted on the lower surface side of a double-sided mounting substrate, pins that do not contact the electronic component can be raised to support the substrate. Further, by moving the substrate up and down relatively to the pins, it is possible to easily carry the substrate into and out of the positioning portion.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention; FIG. 2 is a front view of an electronic component mounting apparatus according to an embodiment of the present invention; FIG. FIG. 4 is a perspective view of a push-up unit of the electronic component mounting apparatus. FIG. 4 is a partial cross-sectional view of a pin unit of the electronic component mounting apparatus according to one embodiment of the present invention. FIG. FIG. 6 is a partial cross-sectional view of a pin unit of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 7 (a) is a pin of an electronic component mounting apparatus according to an embodiment of the present invention. (B) Partial sectional view of a pin unit of an electronic component mounting apparatus according to an embodiment of the present invention.
2a, 2b Guide rail (positioning part)
3 Board 4 Parts feeder (supply section for electronic components)
5 chips (electronic components)
6 Transfer head 7 Nozzle 10 Moving table 11 Support section 12 Pin unit 13 Push-up unit 14 Block 15 Pin hole 16 Pin 17 Piston 18, 19 Hole 22 Air source (gas pressure feeding means)
23 Valve 31, 32 Feed screw 33, 34 Nut 38 Block 39 Cylinder (drive unit)
40 rod (thrust member)
41, 42 motor 43 cylinder (vertical movement means)

Claims (2)

A positioning unit for the substrate, a supply unit for the electronic component, a transfer head for transferring and mounting the electronic component provided on the supply unit to the substrate, a moving table for moving the transfer head, and a plurality of pins An electronic component mounting apparatus comprising: a support unit that supports the substrate from below with a pin unit that is vertically movable; wherein the pin unit includes a block, and a large number of holes are formed in the block. A gas pressure feeding means for vertically moving the pin by pressurizing and discharging gas into and out of the pin hole, and A vertical movement means for vertically moving the substrate relative to a pin, the block is a flat plate, and the pin holes are formed in the block in a matrix, The hole passage communicating with the hole path and a lower communicating with the upper portion of the pin holes in the block form, as well as connected to the gas pumping means these holes passage through passage, a valve passage switching provided in the passage, When the pin rises, the pin is pushed up by a push-up member in a state where air is fed from the high-pressure gas pumping means to the hole communicating with the lower portion, and the lower surface of the piston is raised above the hole. The desired pins are individually raised one by one up to the top dead center one by one, and when the pins are lowered, the valve is switched so that air is supplied from the gas pressure feeding means to the hole communicating with the upper part. Characterized in that all the pins are lowered to the bottom dead center by press-fitting . The electronic component provided in the electronic component supply unit is transferred to a substrate that is supported from below by a support unit that has a pin unit in which a plurality of pins are vertically movably positioned and positioned at a positioning unit of the substrate. An electronic component mounting method for transferring and mounting by a head, wherein the pin has a piston which is vertically movably mounted in a large number of pin holes formed in a block of the pin unit, and wherein the block is flat. , the pin hole is opened in a matrix in the block, to form a further hole passage communicating with the hole path and a lower communicating with the upper portion of the pin hole in the block, the holes path and the holes Upon Ru to perform the vertical movement to said pin by press-fitting and discharging the gas by the gas pumping means to the pin hole through the valve for passage switching provided in the path of the parts, pin When rising, the pin is pushed up by a push-up member in a state in which air is fed from the high-pressure gas pumping means to the hole communicating with the lower portion, and the lower surface of the piston is raised above the hole, The desired pins are raised one by one to the top dead center one by one, and when the pins are lowered, the valve is switched.
By pressing air from the gas pressure feeding means into the hole communicating with the upper part, all the pins are lowered to the bottom dead center , and the substrate is moved relative to the pins of the support part. Electronic component mounting method characterized by moving vertically.

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