JPH0524075A - Mold press device of electronic parts - Google Patents

Abstract

PURPOSE:To fit easily a matter to be fitted to the tip and bottom of a molded body. CONSTITUTION:The present device is provided with a top and bottom forces 1, 2 and a mover 3 which is carried by moving devices 8, 28, 29, moved forward between the top and bottom forces 1, 2, and moved backward through a space between them. Matters to be fitted 5, 6 which are fitted to the top and bottom of a mold body M are fitted to the top and bottom of the mover 3 and suction devices sucking the matter to be fitted 5, 6 are provided on the top and bottom of the top force 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold press apparatus for electronic parts, and more particularly to an apparatus for mounting an object to be mounted on the upper surface and the lower surface of a mold body for mold pressing.

[0002]

2. Description of the Related Art A mold press machine for forming electronic parts such as ICs and LSIs sets a substrate on which a chip is mounted between an upper mold and a lower mold, joins the upper mold and the lower mold, and synthesizes them. A resin is press-fitted to mold a mold body for molding this chip.

By the way, as an electronic component, one shown in FIG. 4 is known. The electronic component P is formed by mounting a heat sink 5 for heat dissipation and a substrate 6 on the upper surface and the lower surface of the molded body M. C is a chip mounted on the substrate 6.

As described above, when the heat sink 5 and the substrate 6 to be mounted are mounted on the upper surface and the lower surface of the mold body M, the substrate 6 can be easily set on the upper surface of the lower mold, but conventionally, the heat sink 5 is mounted on the upper surface. Since there is no device that can be easily set on the lower surface of the mold, an operator manually sets the heat sink 5 on the lower surface of the upper mold when manufacturing such an electronic component P.

[0005]

However, the manual work of the operator does not increase the work efficiency and is also dangerous in terms of security.

Therefore, an object of the present invention is to provide a mold press device capable of easily setting an object to be mounted on the upper surface and the lower surface of a mold body.

[0007]

To this end, according to the present invention, there is provided a moving element which is conveyed by moving means to advance between an upper die and a lower die and to retreat from between the upper die and the lower die. To the upper surface and the lower surface of the mold body to be mounted, and to the lower surface of the upper mold and the upper surface of the lower mold,
Adsorption means for adsorbing this mounted object is provided.

[0008]

In the above structure, when performing the mold pressing, with the upper die and the lower die open, the mover is advanced between them, and the objects to be attached mounted on the upper and lower surfaces of the mover are moved upward. Adsorb to the lower surface of the mold and the upper surface of the lower mold.

Next, the mover is retracted from between the upper mold and the lower mold, the upper mold and the lower mold are joined, and a synthetic resin is press-fitted to mold the mold body.

[0010]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a perspective view of a mold press machine. Reference numeral 1 is an upper die, 2 is a lower die, and a moving element 3 is located between them. The outer shape of the moving element 3 is a long box shape, and the long plate-shaped jig 4 is supported on the upper surface thereof. A large number of heat sinks 5 are mounted on the jig 4. A large number of substrates 6 are located below the mover 3.

The mover 3 is held by an arm 67 connected to a bracket 66. This arm 67
When the ball screw 8 rotates, the ball screw 8 moves in the length direction of the ball screw 8, and the mover 3 advances between the upper die 1 and the lower die 2 and retreats from between them. Reference numeral 60 denotes a holding frame of the arm 67, which is attached to the guide pin 65 to which the coil spring 64 is attached. Reference numeral 61 is a cylinder provided above the holding frame 60, and when the rod 62 of the cylinder projects, the holding frame 60 is pushed down by this and the mover 3 moves down. 9 is a guide rail for guiding forward and backward movements, 1
0 is a slider.

FIG. 2 is a sectional view of the mold press machine. On the upper surface of the mover 3, the cylinder 1 as a projecting and retracting means
1 and 12 are mounted. The rod 11 a of one cylinder 11 is connected to the jig 4. Upper mold 1
An adsorption hole 13 is formed in the. Therefore, when the rod 11 a projects, the jig 4 rises, and the heat sink 5 on the jig 4 is adsorbed to the lower surface of the upper mold 1.

The substrate 6 is attracted to the lower end of a nozzle 14 provided inside the moving element 3. Also cylinder 12
The rod 12a penetrates the moving element 3, and a plate-shaped pressing element 15 is attached to the lower end portion thereof. When the rod 62 of the cylinder 61 projects, the mover 3 descends,
The lower end of the pin 6a of the board 6 is slightly fitted into the hole 2a of the lower mold 2. Next, when the rod 12a of the cylinder 12 projects, the pressing element 15 descends and presses the substrate 6 downward to forcibly drop it from the nozzle 14 and land it on the upper surface of the lower mold 2. A suction hole 17 is formed in the lower mold 2, and the dropped substrate 6 is sucked and fixed. Reference numeral 16 is a lifting guide shaft.

In FIG. 1, reference numeral 18 denotes a tablet supply unit provided on a side portion of the moving element 3, which has a hole 19
Is opened, and a tablet which is a raw material resin of the mold body is supplied to the hole 19 by means not shown. The supply unit 18 is held by the bracket 66, and moves forward and backward together with the mover 3 between the upper die 1 and the lower die 2.

FIG. 3 is an explanatory diagram of the entire operation. In the figure, reference numeral 21 is a magazine that stores a jig 30 that holds the heat sink 5. The jigs 30 are stacked and stored in the magazine 21. The magazine 21 is vertically movable by a nut 22, a ball screw 23, and a motor 24.
A cylinder 25 is provided behind the magazine 21. Move the magazine 21 up and down to move the jig 30
Is positioned in front of the rod 25a of the cylinder 25, and when the rod 25a projects, the jig 30 is pushed onto the conveyor 26.

Reference numeral 27 denotes a transfer head provided on the conveyor 26, and the jig 3 extruded on the conveyor 26.
The heat sink 5 of 0 is picked up and transferred onto the jig 4 on the moving element 3 which stands by at the left end of the ball screw 8. 28 is a motor for driving the ball screw 8; 29
Is a nut screwed onto the ball screw 8.

Reference numeral 31 is a magazine provided below the magazine 21, and accommodates a plate-shaped carrier 40 on which the substrate 6 is placed. This magazine 31
Also moves up and down by the nut 32, the ball screw 33, and the motor 34, and the rod 3 of the cylinder 35 provided behind it.
When 5a projects, the carrier 40 is pushed onto the conveyor 36. Carrier 4 extruded on conveyor 36
The substrate 6 above 0 is picked up by the transfer head 37 and transferred onto the pedestal 41. The empty carrier 40 from which the substrate 6 has been picked up is returned to the magazine 31 by means such as a cylinder (not shown).

The pedestal 41 is the rod 4 of the cylinder 42.
It is supported by 2a. When the rod 42a projects, the pedestal 41 moves up, and the substrate 6 on the pedestal 41 moves to the moving element 3
Is adsorbed by the nozzle 14 (see the chain line in FIG. 3). Note that in FIG. 3, the number of heat sinks 5 on the jig 4 and the number of substrates 6 on the carrier 40 are smaller than those in FIG. 1 for convenience of drawing.

In FIG. 3, A indicates that the heat sink 5 is placed on the jig 4 on the upper surface of the moving element 3 as described above.
Further, the state where the substrate 6 is adsorbed by the nozzle 14 on the lower surface of the moving element 3 is shown.

Next, when the motor 28 is driven, the mover 3
Moves forward along the ball screw 8. Further, the tablet is inserted into the supply unit 18 by means not shown, and the heat sink 5, the substrate 6, and the tablet 3 are simultaneously moved to the upper mold 1.
And the lower mold 2 (see FIG. 3B).

Next, as described with reference to FIG. 2, the rod 11a of the cylinder 11 projects so that the heat sink 5 on the jig 4 is adsorbed to the lower surface of the upper die 1 and the rod 12a of the cylinder 12 also. The substrate 6 adsorbed by the nozzle 14 of the moving element 3 lands on the lower mold 2 due to the protrusion of (see FIG. 3C).

Next, the rod 11 of the cylinders 11 and 12
When the a and 12a are pulled in and the motor 28 is rotated in the reverse direction, the mover 3 escapes from between the upper die 1 and the lower die 2 (see FIG. 3D). Next, the upper mold 1 and the lower mold 2 are joined together, and the synthetic resin in which the tablet has been melted is press-fitted between the heat sink 5 and the substrate 6 to form a molded body (see FIG. 3E).
Next, the upper mold 1 and the lower mold 2 are opened, and the molding target is taken out to obtain the electronic component P shown in FIG.

[0024]

As described above, the present invention is provided with the upper die and the lower die, and the mover which is conveyed to the moving means and advances between the upper die and the lower die, and retreats from between them. And a suction means for mounting the objects to be mounted on the upper surface and the lower surface of the mold body on the upper surface and the lower surface of the mover, and for adsorbing the objects to be mounted on the lower surface of the upper mold and the upper surface of the lower mold. Since the object to be mounted is easily set on the lower surface of the upper mold and the upper surface of the lower mold, it is possible to manufacture an electronic component having the object to be mounted on the upper surface and the lower surface of the mold body with good workability. ..

[Brief description of drawings]

FIG. 1 is a perspective view of a mold pressing apparatus according to the present invention.

FIG. 2 is a cross-sectional view of a mold press device according to the present invention.

FIG. 3 is a process drawing of a mold press according to the present invention.

FIG. 4 is a sectional view of an electronic component according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Upper mold 2 Lower mold 3 Moving element 5 Attached object 6 Attached object 8 Moving means 13 Adsorbing means 17 Adsorbing means 28 Moving means 29 Moving means M Molded body

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Claims (1)

Claims: 1. An upper mold, a lower mold, and a moving means,
It comprises a mover that moves forward between the upper mold and the lower mold, and is retracted from this interval, and the upper and lower surfaces of the mover are fitted with the objects to be fitted on the upper and lower surfaces of the mold body, A mold press device for electronic parts, wherein suction means for sucking the object to be mounted is provided on the lower surface of the upper mold and the upper surface of the lower mold.